WO2024116568A1 - Procédé de fabrication de puces stratifiées et appareil de fabrication de puces stratifiées - Google Patents

Procédé de fabrication de puces stratifiées et appareil de fabrication de puces stratifiées Download PDF

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Publication number
WO2024116568A1
WO2024116568A1 PCT/JP2023/034241 JP2023034241W WO2024116568A1 WO 2024116568 A1 WO2024116568 A1 WO 2024116568A1 JP 2023034241 W JP2023034241 W JP 2023034241W WO 2024116568 A1 WO2024116568 A1 WO 2024116568A1
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WO
WIPO (PCT)
Prior art keywords
cutting device
carrier sheet
laminate
film
cutting
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Application number
PCT/JP2023/034241
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English (en)
Japanese (ja)
Inventor
誠剛 臼井
大悟 鈴木
そら 道下
総司 森永
Original Assignee
日東電工株式会社
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Filing date
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Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2024116568A1 publication Critical patent/WO2024116568A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00—Combinations of several similar cutting apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation

Definitions

  • the present invention relates to a method for manufacturing laminated chips and an apparatus for manufacturing laminated chips.
  • Laminate chips having a laminate structure according to the application are widely used in various industrial products. Such laminate chips are manufactured, for example, by cutting a long laminate sheet into a product part having a desired outer shape and an unnecessary part outside the product, and then removing the unnecessary part (see Patent Document 1). In recent years, the shape and structure required for the laminate chip have become more complex in accordance with the diversification of applications. Therefore, after cutting the laminate sheet using a cutting device, the laminate chip may be manufactured through various processes. In such a manufacturing method of the laminate chip, it is difficult to completely synchronize the operation of the cutting device with the process downstream of the cutting device.
  • the sheet feed of the cutting device is generally an intermittent operation. Therefore, if the unnecessary part is removed immediately after cutting the laminate sheet, there is a concern that the laminate sheet will stop at an unintended place, and usually, the unnecessary part is continuously removed after cutting the laminate sheet and bending the carrier sheet.
  • the laminate sheet contains an adhesive layer
  • sagging the carrier sheet may cause the adhesive layer contained in the product portion to re-adhere to the adhesive layer contained in the unnecessary portion, which may result in glue pulling (stringiness) when the unnecessary portion is removed.
  • the main object of the present invention is to provide a method and apparatus for manufacturing laminated chips that can smoothly remove unnecessary portions and stably produce laminated chips that include an adhesive layer.
  • a method for manufacturing a laminate chip includes the steps of: placing a laminate having a first film, an adhesive layer, and a second film, in that order, on a carrier sheet that is movable so as to pass through a cutting device; cutting at least a portion of the laminate in the stacking direction in the cutting device to separate it into a product portion and an unnecessary portion; separating the unnecessary portion from the product portion without sagging the carrier sheet after passing through the cutting device; and allowing the carrier sheet to sag after separating the unnecessary portion.
  • the cutting device may form a cutting line between the product portion and the unnecessary portion, extending in a direction intersecting the movement direction of the carrier sheet.
  • the carrier sheet may be movable to pass through the cutting device and another cutting device located away from the cutting device in sequence. In this case, the carrier sheet may be slackened between the cutting device and the other cutting device.
  • the manufacturing method of the laminated chip described in [3] above may further include a step of attaching a surface protective film to the product portion after slackening the carrier sheet between the cutting device and the another cutting device.
  • the method for producing a laminated chip according to [3] or [4] above may further include a step of processing the outer shape of the product portion in the separate cutting device.
  • the cutting device may half-cut the laminate in the stacking direction to cut the adhesive layer and the second film into the product portion and the unnecessary portion. In this case, in the step of separating the unnecessary portion from the product portion, the unnecessary portion may be peeled off from the first film.
  • the adhesive layer may be made of an adhesive having a storage modulus at 23° C. of 6.0 ⁇ 10 4 (Pa) or less.
  • a laminate chip manufacturing apparatus includes a cutting device; a carrier sheet conveying section that moves a carrier sheet so as to pass through the cutting device; a laminate supply section that is located upstream of the first cutting device in the moving direction of the carrier sheet and supplies a laminate including a first film, an adhesive layer, and a second film in this order onto the carrier sheet; and a separation section that is located on the opposite side of the laminate supply section with respect to the first cutting device in the moving direction of the carrier sheet.
  • the first cutting device is capable of cutting at least a part of the laminate in the stacking direction into a product portion and an unnecessary portion.
  • the separation section is capable of separating the unnecessary portion from the product portion without causing the carrier sheet that has passed through the first cutting device to sag.
  • unnecessary portions can be smoothly removed, and laminate chips including an adhesive layer can be stably manufactured.
  • FIG. 1 is a schematic diagram for explaining a method for manufacturing a stacked chip according to one embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the laminate and carrier sheet shown in FIG.
  • FIG. 3 is a schematic cross-sectional view for illustrating a step of half-cutting the laminate shown in FIG.
  • FIG. 4 is a schematic perspective view for illustrating the step of peeling off the unnecessary portion shown in FIG. 3 from the release liner.
  • FIG. 5 is a schematic cross-sectional view for illustrating the step of peeling off the unnecessary portion shown in FIG. 3 from the release liner.
  • FIG. 6 is a schematic cross-sectional view of the stacked chip shown in FIG.
  • FIG. 1 is a schematic diagram for explaining a manufacturing method of a laminated chip according to one embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of the laminate and carrier sheet shown in FIG.
  • a manufacturing method for a laminate chip includes, in this order, a step of arranging a laminate 4 having a first film 45, an adhesive layer 46, and a second film 47 on a carrier sheet 3 that is movable to pass through a first cutting device 1 as an example of a cutting device (arrangement step); a step of cutting at least a portion of the laminate 4 in the stacking direction in the first cutting device 1 to cut it into a product portion 41 and an unnecessary portion 42 (first cutting step); a step of separating the unnecessary portion 42 from the product portion 41 without sagging the carrier sheet 3 after passing through the first cutting device 1 (separation step); and a step of sagging the carrier sheet 3 after the separation step (tact difference absorbing step).
  • the unnecessary part is separated from the product part after passing through the first cutting device and before the carrier sheet is slackened, so that the adhesive layer of the product part and the adhesive layer of the unnecessary part can be prevented from adhering to each other. Therefore, it is possible to prevent glue pulling (stringing) from occurring when the unnecessary part is separated, and the unnecessary part can be smoothly removed.
  • the carrier sheet is slackened after the unnecessary part is separated, the tact time difference between the first cutting device and the process after the first cutting device can be absorbed. As a result, the laminate chip including the adhesive layer can be stably manufactured.
  • the entire laminate 4 may be cut in the lamination direction to cut the first film 45, the adhesive layer 46, and the second film 47 into the product portion 41 and the unnecessary portion 42, or the laminate 4 may be half-cut in the lamination direction to cut the adhesive layer 46 and the second film 47 into the product portion 41 and the unnecessary portion 42.
  • Figures 3 to 5 show an embodiment in which the laminate 4 is half-cut as an example of the first cutting step.
  • the unnecessary portion 42 is peeled off from the first film 45 and separated from the product portion 41.
  • the first cutting device 1 forms a cutting line 43 between the product portion 41 and the unnecessary portion 42, extending in a direction intersecting the moving direction of the carrier sheet 3.
  • the first cutting device 1 cuts out the product portion 41 in a rectangular shape when viewed from the stacking direction of the laminate 4. Therefore, the product portion 41 is surrounded by the cutting line 43 extending in a direction substantially perpendicular to the moving direction of the carrier sheet 3 and the cutting line extending in the moving direction of the carrier sheet 3.
  • a cutting line extending in a direction intersecting the moving direction of the carrier sheet is formed between the product portion and the unnecessary portion, the adhesive layer included in the product portion and the adhesive layer included in the unnecessary portion are likely to reattach to each other.
  • the unnecessary portion is separated from the product portion before the carrier sheet is slackened, so that even if a cutting line extending in a direction intersecting the moving direction of the carrier sheet is formed, the adhesive layer included in the product portion and the adhesive layer included in the unnecessary portion can be stably suppressed from reattaching to each other.
  • the adhesive layer 46 is composed of an adhesive having a storage modulus of 8.0 ⁇ 10 4 (Pa) or less at 23° C.
  • the storage modulus of the adhesive constituting the adhesive layer 46 at 23° C. is preferably 6.0 ⁇ 10 4 (Pa) or less, more preferably 5.0 ⁇ 10 4 (Pa) or less.
  • the storage modulus of the adhesive can be measured by a nanoindenter (hereinafter the same). If the storage modulus of the adhesive is equal to or less than the upper limit, the stress applied to the adhesive when the product is folded can be absorbed and alleviated.
  • the adhesive layer is composed of such an adhesive
  • the adhesive layer of the product portion and the adhesive layer of the unnecessary portion are more likely to adhere to each other than when the storage modulus of the adhesive exceeds the upper limit.
  • the unnecessary portion is separated from the product portion without sagging the carrier sheet after passing through the first cutting device, so that even if the adhesive layer is composed of an adhesive having a storage modulus equal to or less than the upper limit, the adhesive layer of the product portion and the adhesive layer of the unnecessary portion can be prevented from adhering to each other.
  • the lower limit of the storage modulus at 23° C. of the adhesive constituting the adhesive layer 46 is typically 2.0 ⁇ 10 4 (Pa) or more.
  • the carrier sheet 3 can be moved to pass through a first cutting device 1 and then a second cutting device 2 located away from the first cutting device 1.
  • the second cutting device 2 is an example of another cutting device.
  • the carrier sheet 3 is slackened between the first cutting device 1 and the second cutting device 2.
  • the method for manufacturing the laminate chip further includes a step (attaching step) of attaching a surface protective film 5 to the product portion 41 after slackening the carrier sheet 3 between the first cutting device 1 and the second cutting device 2.
  • the product portion (the second film and the adhesive layer in the illustrated example) can be protected by the surface protective film.
  • the method for manufacturing the laminated chip further includes a step (second cutting step) of processing the outer shape of the product portion 41 in the second cutting device 2.
  • a laminated chip having a desired outer shape can be manufactured with excellent dimensional accuracy.
  • the first film 45 and/or the surface protection film 5 may be cut in addition to processing the outer shape of the product portion 41. This allows the product portion (the second film and the adhesive layer in the illustrated example) and the first film and/or the surface protection film to be collectively formed into a desired outer shape.
  • the laminate 4 is placed on the carrier sheet 3 as described above.
  • the long carrier sheet 3 can move from the CS pay-out roller 71 toward the CS take-up roller 72.
  • the carrier sheet 3 passes through a first cutting device 1 and a second cutting device 2 located away from the first cutting device 1 in that order.
  • the carrier sheet 3 may be transported to pass through another device in addition to the first cutting device 1 and the second cutting device 2.
  • the other device may be disposed downstream of the second cutting device 2 or upstream of the first cutting device 1 in the moving direction of the carrier sheet.
  • the laminate 4 is placed on the carrier sheet 3 upstream of the first cutting device 1 in the direction of travel of the carrier sheet.
  • the long laminate 4 is fed from a laminate feed roller 91 and supplied to the carrier sheet 3.
  • the laminate 4 before each of the above-mentioned processes is wound into a roll.
  • the carrier sheet 3 conveying the laminate 4 passes between opposing pinch rollers 76 as necessary. This allows the laminate 4 to be in close contact with the carrier sheet 3, and each process can be stably performed on the laminate 4.
  • the carrier sheet 3 is slackened. This makes it possible to absorb the difference in tact time between the placing step and the first cutting step, and to stably supply the laminate to the first cutting device at an appropriate timing.
  • the carrier sheet 3 sags between the first cutting device 1 and a pinch roller 76 that is located upstream of the first cutting device 1 in the moving direction of the carrier sheet and closest to the first cutting device 1.
  • the length of the carrier sheet 3 located between the pinch roller 76 and the first cutting device 1 is longer than the linear distance between the pinch roller 76 and the first cutting device 1 in the horizontal direction.
  • the laminate 4 includes a first film 45, an adhesive layer 46, and a second film 47, in this order.
  • the first film 45, the adhesive layer 46, and the second film 47 are arranged in this order from the carrier sheet 3 side.
  • the first film 45 is in direct contact with the carrier sheet 3.
  • the first film 45 is a release liner 45a.
  • the release liner 45a typically includes a resin substrate and a release layer provided on the surface of the resin substrate.
  • the resin substrate may be made of any suitable resin material.
  • resin materials include polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); olefin-based resins such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), and ethylene-propylene copolymers; fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; amide-based resins such as polyamide (nylon) and fully aromatic polyamide (aramid); polyimide-based resins; polyvinyl chloride (PVC)-based resins; vinyl acetate-based resins; polycarbonate (PC)
  • the thickness of the resin substrate is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and even more preferably 35 ⁇ m or more, and is, for example, 300 ⁇ m or less, preferably 200 ⁇ m or less, more preferably 150 ⁇ m or less, even more preferably 100 ⁇ m or less, and particularly preferably 80 ⁇ m or less.
  • the release layer is composed of any suitable release agent.
  • the release agent include silicone-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, and fatty acid amide-based release agents.
  • the release agents can be used alone or in combination.
  • silicone-based release agents are preferred.
  • the thickness of the release layer is, for example, 10 nm or more, and, for example, 2000 nm or less, preferably 1500 nm or less, more preferably 1000 nm or less, and even more preferably 500 nm or less.
  • the adhesive layer 46 is provided directly on the surface of the first film 45 (release liner 45a). More specifically, the adhesive layer 46 is laminated directly on the release layer of the release liner 45a.
  • the adhesive layer 46 is made of any appropriate adhesive.
  • the adhesive constituting the adhesive layer 46 preferably has a storage modulus at 23° C. not more than the above upper limit.
  • examples of the adhesive include (meth)acrylic adhesives, urethane adhesives, and silicone adhesives, and preferably (meth)acrylic adhesives.
  • (meth)acrylic includes acrylic and methacrylic.
  • the thickness of the adhesive layer 46 is, for example, 15 ⁇ m or more, preferably 20 ⁇ m or more, more preferably 100 ⁇ m or more, and even more preferably 200 ⁇ m or more. If the thickness of the adhesive layer 46 is equal to or greater than the above lower limit, it is possible to improve the shock absorption and step absorption properties.
  • the upper limit of the thickness of the adhesive layer 46 is, for example, 500 ⁇ m or less, and preferably 300 ⁇ m or less.
  • the second film 47 is located on the opposite side of the adhesive layer 46 from the first film 45 and is laminated directly to the adhesive layer 46.
  • the second film 47 includes a resin base material 47a.
  • the resin substrate 47a is made of any suitable resin material. Examples of the resin material of the resin substrate 47a include the same resin material as the resin substrate of the release liner 45a described above.
  • the resin materials of the resin substrate 47a can be used alone or in combination. Among the resin materials of the resin substrate 47a, polyester-based resins are preferred, and PET is more preferred.
  • the thickness of the resin substrate 47a is, for example, 10 ⁇ m or more, preferably 20 ⁇ m or more, more preferably 30 ⁇ m or more, and, for example, 500 ⁇ m or less, preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, even more preferably 100 ⁇ m or less, and particularly preferably 80 ⁇ m or less.
  • the second film 47 may further include a functional layer in addition to the resin substrate 47a.
  • the functional layer is typically disposed between the adhesive layer 46 and the resin substrate 47a and/or on the surface of the resin substrate 47a opposite the adhesive layer 46.
  • Examples of the functional layer include a conductive layer and an antistatic layer.
  • the first cutting device 1 is typically capable of intermittent operation, repeating a process in which the cutting blade cuts at least a portion of the laminate 4 (in the illustrated example, half-cuts the second film 47 and the adhesive layer 46) and a process in which the cutting blade moves away from the laminate 4 and stops. Therefore, after the laminate 4 has been cut, when the cutting blade moves away from the laminate and stops, the carrier sheet 3 moves a predetermined distance to bring the part of the laminate 4 to be cut next into opposition to the cutting blade. The carrier sheet 3 then stops until the next cut is completed. In other words, the carrier sheet 3 repeats movement and stopping in response to the intermittent operation of the first cutting device 1.
  • the first cutting device 1 is a punching device.
  • the product portion 41 is typically formed by a punching press.
  • the unnecessary portion 42 is a peripheral portion that surrounds the periphery of the product portion 41 and is continuous in the longitudinal direction of the laminate.
  • the product portion 41 has any appropriate shape when viewed from the stacking direction of the laminate 4.
  • Examples of the shape of the product portion 41 include a polygonal shape such as a rectangle, a circle, and an ellipse, and a rectangle is preferable.
  • product portion 41 has a rectangular shape when viewed from the stacking direction of laminate 4. More specifically, the long side of product portion 41 is approximately parallel to a direction perpendicular to the moving direction of carrier sheet 3, and the short side of product portion 41 is approximately parallel to the moving direction of carrier sheet 3.
  • the dimension of the long side of product portion 41 is, for example, 20 mm or more and 450 mm or less.
  • the dimension of the short side of product portion 41 is, for example, 20 mm or more and 250 mm or less.
  • the unnecessary portion 42 cut by the first cutting device 1 is separated from the product portion 41 without causing the carrier sheet 3 to sag after passing through the first cutting device 1.
  • the unnecessary portion 42 is peeled off from the first film 45 (see Fig. 5).
  • the unnecessary portion 42 is peeled off from the first film 45 immediately after the carrier sheet 3 moves and is discharged from the first cutting device 1.
  • the peeled off unnecessary portion 42 is taken up by the first take-up roller 61.
  • the first take-up roller 61 takes up only the peeled off unnecessary portion 42 when the unnecessary portion 42 is peeled off with the movement of the carrier sheet 3, and stops taking up the peeled off portion when the carrier sheet 3 stops. Therefore, it is possible to suppress the torque of the first take-up roller from affecting the peeling off of the unnecessary portion, and the separation process can be stably carried out.
  • the unnecessary portion 42 is separated from the product portion 41 by a separation bar 62, which is an example of a separation means.
  • the separation bar 62 is a peeling bar 62.
  • the unnecessary portion 42 is peeled off from the first film 45 by the separation bar 62.
  • the peeling bar 62 peels off the unnecessary portion 42 from the first film 45 when the laminate 4 moves together with the carrier sheet 3.
  • the peeling bar 62 is disposed at any suitable position between the adhesive layer 46 of the product portion 41 and the adhesive layer 46 of the unnecessary portion 42 where no glue pulling (stringing) occurs (see FIG. 5).
  • the peel angle of the unnecessary portion 42 relative to the carrier sheet 3 is, for example, 30° or more, preferably 45° or more, and, for example, 90° or less, preferably 80° or less.
  • the carrier sheet 3 is slackened between the first cutting device 1 and the second cutting device 2. This makes it possible to absorb the takt time difference between the first cutting process and the second cutting process, and to stably carry out the first cutting process and the second cutting process.
  • the carrier sheet 3 transporting the laminate 4 including the product portion 41 sags and then passes between the opposing pinch rollers 76. In the separation process, the laminate is pulled, and the laminate may partially float off the carrier sheet.
  • the laminate and the carrier sheet pass between the opposing pinch rollers after the separation process, so that the laminate can be stably adhered to the carrier sheet.
  • the carrier sheet 3 sags between the separation bar 62 and the pinch roller 76, which is located between the first cutting device 1 and the second cutting device 2 and is closest to the separation bar 62.
  • the length of the carrier sheet 3 located between the separation bar 62 and the pinch roller 76 is longer than the linear distance between the separation bar 62 and the pinch roller 76 in the horizontal direction.
  • the surface protection film 5 is bonded to the product portion 41 between the first cutting device 1 and the second cutting device 2.
  • the long surface protection film 5 is unwound from the SPV unwinding roller 74 and supplied to the product section 41. On the SPV unwinding roller 74, the long surface protection film 5 is wound in a roll shape.
  • the carrier sheet 3 transporting the product portion 41 to which the surface protection film 5 is attached passes between the opposing pinch rollers 76 as necessary. This allows the surface protection film to be stably attached to the product portion.
  • the carrier sheet 3 is slackened before the laminate 4 reaches the second cutting device 2. This makes it possible to absorb the difference in tact time between the attachment step and the second cutting step, and to stably supply the laminate to the second cutting device at an appropriate time.
  • the carrier sheet 3 is slackened between the pinch roller 76, which is located between the first cutting device 1 and the second cutting device 2 and is closest to the second cutting device 2, and the second cutting device 2.
  • the length of the carrier sheet 3 located between the pinch roller 76 and the second cutting device 2 is longer than the linear distance between the pinch roller 76 and the second cutting device 2 in the horizontal direction.
  • the surface protection film 5 is attached to the second film 47 of the product portion 41.
  • the surface protection film 5 may be a film that is temporarily attached and peeled off before the product portion 41 is used (used as a processing material), or it may be a film that is used while still attached to the surface of the product portion 41 (intended for permanent adhesion).
  • the surface protection film 5 typically includes a substrate 51 and an adhesive layer 52.
  • Examples of materials for the substrate include the same resin material as the resin substrate 47a, preferably a polyester resin, and more preferably PET.
  • the thickness of the substrate 51 is, for example, 10 ⁇ m or more, preferably 20 ⁇ m or more, more preferably 30 ⁇ m or more, and, for example, 500 ⁇ m or less, preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, even more preferably 100 ⁇ m or less, and particularly preferably 80 ⁇ m or less.
  • the adhesive layer 52 is located between the substrate 51 and the second film 47.
  • the adhesive layer 52 is composed of any suitable adhesive. Examples of the adhesive that constitutes the adhesive layer 52 include the same adhesive as the adhesive layer 46 described above.
  • the second cutting device 2 is typically capable of intermittent operation in the same manner as the first cutting device 1, and repeats a process in which the cutting blade cuts the peripheral edge of the product portion to process the outer shape, and a process in which the cutting blade moves away from the product portion and stops. Therefore, after the outer shape of the product portion is processed, when the cutting blade moves away from the product portion and stops, the carrier sheet 3 moves a predetermined distance to bring the product portion 41 to be next processed into a position opposite the cutting blade. The carrier sheet 3 then stops until the next outer shape processing is completed. In other words, the carrier sheet 3 repeats movement and stopping in response to the intermittent operation of the second cutting device 2.
  • the second cutting device 2 cuts the peripheral edge of the product portion 41 to process the outer shape of the product portion 41.
  • the second cutting device 2 may also cut the first film 45 while processing the outer shape of the product portion 41.
  • the second cutting device 2 may cut the surface protection film 5 while processing the outer shape of the product portion 41. This allows the product portion (the second film and the adhesive layer in the illustrated example) and the first film and/or the surface protection film to be formed into a desired outer shape all at once. As a result, the laminate chip 8 and a portion outside the laminate chip 8 (outside product waste) are formed.
  • the carrier sheet 3 is slackened downstream in the moving direction of the carrier sheet 3 relative to the second cutting device 2. Then, in the illustrated example, the carrier sheet 3 transporting the laminate chips 8 and the extra-product waste passes between the opposing pinch rollers 76, and the extra-product waste is wound up by the second winding roller 75. In this manner, the laminate chip 8 and the product waste are separated to obtain the laminate chip 8.
  • the laminate chip 8 includes at least the product portion 41 (in the illustrated example, the second film 47 and the adhesive layer 46). In one embodiment, the laminate chip 8 includes the first film 45, the adhesive layer 46, the second film 47, and the surface protection film 5 in this order.
  • the laminate chips 8 are peeled off from the carrier sheet 3 and collected. Therefore, it is preferable that the manufacturing method for laminate chips is carried out continuously to prevent poor peeling of the laminate chips 8 from the carrier sheet 3 (the laminate chips reaching the CS take-up roller without being peeled off from the carrier sheet).
  • Such a laminate chip 8 can be used in various applications, and is particularly suitable for optical applications. More specifically, after the first film 45 (release liner 45a) is peeled off from the adhesive layer 46, the laminate chip is attached to an optical member by the adhesive layer 46 and applied to optical applications.
  • optical members include a liquid crystal display panel and an organic EL display panel, and preferably an organic EL display panel.
  • Such an optical member may be a foldable member or a rollable member.
  • the laminated chip manufacturing apparatus 100 is capable of continuously carrying out the above-mentioned laminated chip manufacturing method.
  • the laminated chip manufacturing apparatus 100 includes the above-mentioned first cutting device 1, the above-mentioned second cutting device 2, a carrier sheet conveying unit 7, a laminate supply unit 9, and a separation unit 6.
  • the carrier sheet transport unit 7 moves the carrier sheet 3 so that it passes through the first cutting device 1 and the second cutting device 2 in that order.
  • the carrier sheet transport unit 7 includes the CS payout roller 71 and the CS take-up roller 72 described above.
  • the laminate supply unit 9 is located upstream of the first cutting device 1 in the moving direction of the carrier sheet. In the illustrated example, the laminate supply unit 9 is located on the opposite side of the first cutting device 1 from the second cutting device 2 in the moving direction of the carrier sheet.
  • the laminate supply unit 9 can supply the above-mentioned laminate 4 onto the carrier sheet 3. In the illustrated example, the laminate supply unit 9 is the above-mentioned laminate pay-out roller 91.
  • the separation unit 6 is located on the opposite side of the laminate supply unit 9 with respect to the first cutting device 1 in the moving direction of the carrier sheet. In the illustrated example, the separation unit 6 is disposed between the first cutting device 1 and the second cutting device 2. The separation unit 6 can separate the unnecessary portion 42 from the product portion 41 without causing sagging of the carrier sheet 3 that has passed through the first cutting device 1. In the illustrated example, the separation unit 6 is a peeling unit 6, and can peel the unnecessary portion 42 from the first film 45. In the illustrated example, the separation unit 6 includes the first winding roller 61 and the separation bar 62 (peeling bar 62) described above.
  • laminated chip manufacturing apparatus 100 further includes the above-mentioned SPV payout roller 74 and the above-mentioned second winding roller 75. Furthermore, in laminated chip manufacturing apparatus 100, pinch roller 76 may be provided at any appropriate position. According to such laminated chip manufacturing apparatus 100, the above-described laminated chip manufacturing method can be stably carried out, and laminated chips 8 can be manufactured efficiently.
  • the first cutting device 1 is an example of a cutting device in the claims, and the separation process is performed after passing through the first cutting device 1, and the tact difference absorption process is performed between the first cutting device 1 and the second cutting device 2 after the separation process, but the present invention is not limited to this.
  • One embodiment of the present invention also includes a case where the second cutting device 2 is an example of a cutting device in the claims. In this case, the separation process is performed after passing through the second cutting device 2, and the tact difference absorbing process can be performed between the second cutting device 2 and the CS winding roller 72 after the separation process.
  • the second cutting device 2 cuts the laminate 4 so as to form a cutting line 43 extending in a direction intersecting the moving direction of the carrier sheet 3 between the product portion 41 and the unnecessary portion 42. After passing through the second cutting device 2, the unnecessary portion 42 is separated from the product portion 41 without sagging the carrier sheet 3, and then the carrier sheet 3 is sagged.
  • the above-mentioned separation unit 6 is located on the opposite side of the second cutting device 2 to the first cutting device 1 in the moving direction of the carrier sheet. This also makes it possible to prevent the adhesive layer of the product portion from adhering to the adhesive layer of the unnecessary portion, and enables stable production of laminate chips including an adhesive layer.
  • the laminated chip manufacturing method and manufacturing apparatus according to the embodiment of the present invention can be suitably used to manufacture laminated chips that are applied to various industrial products.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Details Of Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

L'invention concerne un procédé de fabrication de puces stratifiées et un appareil de fabrication de puces stratifiées, qui permettent l'élimination aisée d'une partie indésirable et une fabrication stable de puces stratifiées qui comprennent chacune une couche adhésive autocollante. Le procédé de fabrication de puces stratifiées selon un mode de réalisation de la présente invention comprend : une étape consistant à placer, sur une feuille de support (3) pouvant se déplacer de façon à passer à travers un premier dispositif de coupe (1), un stratifié (4) comprenant un premier film (45), une couche adhésive autocollante (46), et un second film, dans l'ordre indiqué ; une étape consistant à couper, au niveau du premier dispositif de coupe (1), le stratifié (4) pour former une partie produit (41) et une partie indésirable (42) par la découpe d'au moins une partie dudit stratifié (4) dans la direction de stratification ; une étape consistant à séparer la partie indésirable (42) de la partie produit (41) sans relâchement de la feuille de support (3) après que celle-ci a traversé le premier dispositif de coupe (1) ; et une étape consistant à relâcher la feuille de support (3) après la séparation de la partie indésirable (42).
PCT/JP2023/034241 2022-11-28 2023-09-21 Procédé de fabrication de puces stratifiées et appareil de fabrication de puces stratifiées WO2024116568A1 (fr)

Applications Claiming Priority (2)

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JP2022-189195 2022-11-28
JP2022189195A JP2024077234A (ja) 2022-11-28 2022-11-28 積層体チップの製造方法および積層体チップの製造装置

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WO2024116568A1 true WO2024116568A1 (fr) 2024-06-06

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02305751A (ja) * 1989-05-22 1990-12-19 Hitachi Cable Ltd ループ量制御装置
JP2016055358A (ja) * 2014-09-05 2016-04-21 グラフテック株式会社 切断装置及び切断方法
JP2017032739A (ja) * 2015-07-31 2017-02-09 株式会社日立製作所 光学フィルム貼付装置、及び、光学フィルム貼付システム
CN112589913A (zh) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 柔性电路板圆刀裁切工艺及其加工装置
JP2021146426A (ja) * 2020-03-17 2021-09-27 日東電工株式会社 光学フィルムの打ち抜き装置、及び、フィルム製品の製造方法
JP7340653B1 (ja) * 2022-05-16 2023-09-07 日東電工株式会社 枚葉フィルムの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02305751A (ja) * 1989-05-22 1990-12-19 Hitachi Cable Ltd ループ量制御装置
JP2016055358A (ja) * 2014-09-05 2016-04-21 グラフテック株式会社 切断装置及び切断方法
JP2017032739A (ja) * 2015-07-31 2017-02-09 株式会社日立製作所 光学フィルム貼付装置、及び、光学フィルム貼付システム
JP2021146426A (ja) * 2020-03-17 2021-09-27 日東電工株式会社 光学フィルムの打ち抜き装置、及び、フィルム製品の製造方法
CN112589913A (zh) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 柔性电路板圆刀裁切工艺及其加工装置
JP7340653B1 (ja) * 2022-05-16 2023-09-07 日東電工株式会社 枚葉フィルムの製造方法

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