WO2024113603A1 - Mems扬声器制备工艺及mems扬声器 - Google Patents
Mems扬声器制备工艺及mems扬声器 Download PDFInfo
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- WO2024113603A1 WO2024113603A1 PCT/CN2023/087082 CN2023087082W WO2024113603A1 WO 2024113603 A1 WO2024113603 A1 WO 2024113603A1 CN 2023087082 W CN2023087082 W CN 2023087082W WO 2024113603 A1 WO2024113603 A1 WO 2024113603A1
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- mems
- mems chip
- pcb board
- pcb
- speaker
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 50
- 230000001681 protective effect Effects 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000003292 glue Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 5
- 238000010923 batch production Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
Definitions
- the present invention belongs to the technical field of sound generating devices, and in particular relates to a MEMS speaker preparation process and a MEMS speaker.
- a speaker is a device used to convert electrical signals into sound signals and is widely used in mobile terminals such as mobile phones and computers.
- MEMS speakers are micro-electromechanical system speakers. Compared with traditional voice coil speakers, they have advantages such as good consistency, low power consumption, small size, and low price.
- the MEMS speaker of the related art includes a circuit board, a housing connected to the circuit board to form a receiving space, and a MEMS speaker chip placed in the receiving space and bonded to the circuit board through wires.
- the sensitivity parameter (SPL/unit package area) of the MEMS speaker in the related technology is not high, which is not conducive to the application of the product in scenarios with limited space and strict power consumption requirements.
- the object of the present invention is to provide a MEMS speaker preparation process and a MEMS speaker, which can improve the sensitivity parameters of the MEMS speaker so as to be suitable for scenarios with narrow space and strict power consumption requirements.
- a MEMS speaker preparation process comprising the steps of:
- the PCB plate Positioning a PCB plate, wherein the PCB plate is provided with a first groove located on one side thereof and a sound outlet hole penetrating through the other side thereof and connected to the first groove;
- the MEMS chip is inverted and electrically connected to the side of the PCB plate where the first groove is opened, the projection of the diaphragm of the MEMS chip in the thickness direction falls into the first groove, and there is a gap between the MEMS chip and the PCB plate;
- a polymer protective material is filled in the gap between the MEMS chip and the PCB board and cured, so that the MEMS chip and the PCB board are integrated into one.
- the positioning of the PCB plate includes:
- the posture of the PCB plate is adjusted so that the PCB plate remains horizontal and the first groove faces upward.
- the method further comprises the following steps:
- a first mesh is pasted on the PCB board so that the first mesh covers the sound outlet hole.
- the MEMS chip is inverted and electrically connected to the side of the PCB board where the first groove is formed, comprising:
- the conductive material is cured to form a conductive member electrically connected between the MEMS chip and the PCB board.
- the step of filling a polymer protective material in the gap between the MEMS chip and the PCB board and curing the material comprises:
- a sealing jig is arranged on the outer peripheral sides of the MEMS chip and the PCB board, and a glue injection port communicating with the gap is formed between the peripheral side of the MEMS chip and the inner side of the sealing jig;
- the polymer protection material is cured to form a polymer protection member in the gap and around the MEMS chip.
- the height of the gap is between 1um and 300um.
- the side of the MEMS chip facing away from the PCB board has a second groove located on one side of the diaphragm, and before or after the high polymer protective material is filled in the gap between the MEMS chip and the PCB board and cured, the method further includes:
- a second mesh sheet covering the opening of the second groove is pasted on a side of the MEMS chip facing away from the PCB board.
- the method further includes:
- the MEMS chip and the PCB board combined as one are cut along a preset cutting track to form at least two speaker units, and the preset cutting track is located between two adjacent first grooves.
- a MEMS speaker which is made by the preparation process as described in any of the above items, and the MEMS speaker includes a PCB board, a MEMS chip located on one side of the PCB board, a conductive part electrically connected between the PCB board and the MEMS chip, and a polymer protective part combined between the PCB board and the MEMS chip and covering the conductive part, the PCB board and the MEMS chip enclose a first sound cavity, and a sound outlet hole connected to the first sound cavity is opened on the side of the PCB board facing away from the MEMS chip.
- the MEMS speaker also includes a first mesh sheet attached to the PCB plate and covering the sound outlet, and a second mesh sheet attached to a side of the MEMS chip away from the PCB plate and enclosing the MEMS chip to form a second sound cavity.
- the beneficial effect of the present invention is that: in this solution, since the polymer protection member formed by the polymer protection material is integrated between the PCB board and the MEMS chip, and the polymer protection member covers the conductive member, the overall package size of the MEMS speaker can be basically consistent with the size of the MEMS chip (the chip size/package size can be greater than or equal to 95%, such as the chip is ⁇ 4.8mm, the package size can be only ⁇ 5mm or even smaller), so that the sensitivity parameter of the MEMS speaker can be significantly improved, and the sensitivity parameter is SPL/unit package plane area, and the conductive member is sealed and will not contact the outside air, so the reliability is higher, so it is suitable for scenes with small space and strict power consumption requirements.
- FIG1 is a schematic diagram of the structure of a MEMS speaker in a first implementation manner
- FIG2 is a schematic diagram of the structure of a MEMS speaker in a second implementation manner
- FIG3 is a schematic diagram of the structure of a MEMS speaker in a third implementation manner
- FIG. 4 is a schematic flow chart of steps S100 and S200 in a MEMS speaker manufacturing process according to an embodiment of the present invention
- FIG5 is a flow chart of a first implementation of step S300 in a MEMS speaker manufacturing process according to an embodiment of the present invention
- FIG6 is a flow chart of a second implementation of step S300 in a MEMS speaker manufacturing process according to an embodiment of the present invention.
- FIG. 7 is a schematic flow chart of a MEMS speaker manufacturing process according to another embodiment of the present invention.
- a MEMS speaker including a PCB board 1, a MEMS chip 2 located on one side of the PCB board 1, a conductive part 3 electrically connected between the PCB board 1 and the MEMS chip 2, and a polymer protective part 4 combined between the PCB board 1 and the MEMS chip 2 and covering the conductive part 3.
- the PCB board 1 and the MEMS chip 2 enclose a first sound cavity 100, and a sound outlet hole 11 connected to the first sound cavity 100 is opened on the side of the PCB board 1 facing away from the MEMS chip 2.
- the overall package size of the MEMS speaker can be basically consistent with the size of the MEMS chip 2 (the chip size/package size can be greater than or equal to 95%, such as the chip is ⁇ 4.8mm, the package size can be only ⁇ 5mm or even smaller).
- the sensitivity parameter of the MEMS speaker can be significantly improved, and the sensitivity parameter is SPL/unit package plane area.
- the conductive member 3 is sealed and will not contact the outside air, so the reliability is higher, and it is suitable for scenarios with small space and strict power consumption requirements.
- the MEMS speaker also includes a first mesh 51 attached to the PCB board 1 and covering the sound outlet 11 , and a second mesh 52 attached to the side of the MEMS chip 2 away from the PCB board 1 and enclosing the MEMS chip 2 to form a second sound cavity 200 .
- the first mesh 51 and the second mesh 52 can be made of porous mesh material 5, such as damping mesh or metal porous mesh, so that on the one hand, it can have better THD (total harmonic distortion) performance, and on the other hand, it can prevent dust from entering the first sound cavity 100 and the second sound cavity 200 and directly contacting the MEMS chip 2, and the reliability is better.
- porous mesh material 5 such as damping mesh or metal porous mesh
- the first mesh 51 can be attached to the side of the PCB board 1 facing the first sound cavity 100, that is, the first mesh 51 is located in the first sound cavity 100; in combination with Figure 3, the first mesh 51 can also be attached to the side of the PCB board 1 away from the MEMS chip 2, and the sound outlet 11 can be the opening of the first sound cavity 100, that is, the first mesh 51 directly covers the opening of the first sound cavity 100.
- the MEMS chip 2 has a diaphragm 21 located between the first sound cavity 100 and the second sound cavity 200.
- the projection of the diaphragm 21 in the thickness direction falls into the projection of the first sound cavity 100. Therefore, during the vibration of the diaphragm 21, it will not be affected by the side wall of the first sound cavity 100, and the acoustic performance is better.
- the polymer protective member 4 is also coated on the outside of the MEMS chip 2 and the PCB board 1, thereby isolating the MEMS chip 2 from the outside air to improve the reliability of the MEMS speaker.
- the polymer protective member 4 can also cover the outside of the second mesh 52, so that the outer peripheral surface of the MEMS chip 2 will not directly contact the air and is not easily exposed to dust and other impurities in the air, thereby ensuring the reliability of the MEMS chip 2.
- the polymer protective member 4 can also be set to cover the outside of the first mesh 51 at the same time, further improving the reliability of the MEMS speaker.
- the polymer protective member 4 may also be coated on the outside of the MEMS chip 2 without coating the outside of the PCB board 1. At this time, the outer peripheral surface of the polymer protective member 4 is flush with the outer peripheral surface of the PCB board 1. In this way, the amount of polymer protective material used can be reduced and the cost can be reduced.
- a MEMS speaker manufacturing process is provided, which is used to manufacture the above MEMS speaker, and includes the following steps:
- the position of the PCB board 1 can be adjusted so that the PCB board 1 remains horizontal with the first groove 12 facing upward.
- a positioning fixture can be used to position the PCB board 1.
- a positioning groove can be set on the top side of the positioning fixture. The PCB board 1 is placed in the positioning groove of the positioning fixture manually or with automated equipment, so that the PCB board 1 remains horizontal with the first groove 12 facing upward.
- the first mesh 51 When the first mesh 51 is set in the first sound cavity 100, after positioning the PCB board 1, the first mesh 51 can be pasted on the bottom side of the first groove 12 and cover the sound hole 11. In this way, when the MEMS chip 2 is subsequently connected to the PCB board 1, the first mesh 51 is located in the first sound cavity 100.
- the first mesh sheet 51 When the first mesh sheet 51 is disposed outside the first sound cavity 100, the first mesh sheet 51 can be pasted on the side of the PCB board 1 away from the first groove 12 and cover the sound outlet 11 before positioning the PCB board 1.
- the first mesh sheet 51 and the PCB board 1 can also be pasted and fixed at the end.
- a conductive material is applied to the pad on the top side of the PCB board 1, wherein the conductive material may be a solid-liquid mixed material such as silver glue and solder paste;
- the conductive material is solidified to form a conductive member 3 electrically connected between the MEMS chip 2 and the PCB board 1.
- the conductive material can be solidified by reflow soldering or hot pressing. In this way, the conductive member 3 formed can fix and electrically connect the MEMS chip 2 and the PCB board 1, and maintain the connection stability between the MEMS chip 2 and the PCB board 1.
- a sealing jig 10 can be provided on the outer periphery of the MEMS chip 2 and the PCB board 1, and a glue injection port communicating with the gap is formed between the peripheral side of the MEMS chip 2 and the inner side of the sealing jig 10. If it is necessary to also cover the outer side of the PCB board 1 with a polymer protective member 4, the glue injection port is extended in the thickness direction to be flush with the bottom side of the PCB board 1.
- the side of the MEMS chip 2 facing away from the PCB board 1 has a second groove 22 located on one side of the diaphragm 21.
- the second mesh 52 fills the gap between the MEMS chip 2 and the PCB board 1 with a polymer protective material and solidify it.
- it also includes: pasting the second mesh 52 covering the opening of the second groove 22 on the side of the MEMS chip 2 facing away from the PCB board 1.
- the peripheral side of the MEMS chip 2 and the peripheral side of the second mesh 52 form a glue filling port connecting the gap with the inner side of the sealing jig 10; if the outer side of the second mesh 52 does not need to be covered with a polymer protective component 4, then after filling the gap between the MEMS chip 2 and the PCB board 1 with a polymer protective material and solidifying it, the second mesh 52 covering the opening of the second groove 22 is pasted on the side of the MEMS chip 2 facing away from the PCB board 1.
- the liquid polymer protective material is dotted onto the glue filling port until the gap and the glue filling port are filled, wherein the polymer protective material can be a plastic insulating material such as polyethylene terephthalate, polycarbonate, or polyallylate film; in this solution, the projection of the diaphragm 21 of the MEMS chip 2 in the thickness direction falls into the first groove 12, that is, the side wall of the first groove 12 is flush with the edge of the diaphragm 21 or is located outside the edge of the diaphragm 21, so that when the polymer protective material is filled, it will not flow to the surface of the diaphragm 21 to affect the acoustic performance, and the reliability is higher.
- the polymer protective material can be a plastic insulating material such as polyethylene terephthalate, polycarbonate, or polyallylate film
- a limiting edge surrounding the first groove 12 can be provided on one side of the MEMS chip 2 close to the PCB board 1 or on one side of the PCB board 1 close to the MEMS chip 2, and the limiting edge seals the gap toward the first groove 12, thereby preventing the polymer protective material from flowing to the diaphragm 21, and when the polymer protective material is filled, it will not flow to the surface of the diaphragm 21 to affect the acoustic performance, thereby ensuring the acoustic performance of the speaker.
- the polymer protective material is cured to form a polymer protective member 4 in the gap and on the periphery of the MEMS chip 2, and then the MEMS speaker can be demoulded from the sealing jig 10.
- the polymer protective member 4 can tightly combine the MEMS chip 2 and the PCB board 1, and can cover the conductive member 3 and the outer side of the MEMS chip 2, and can significantly improve the sensitivity parameters of the MEMS speaker under the condition of realizing reliable packaging of the MEMS chip 2.
- each first groove 12 is preferably arranged in a rectangular array, that is, multiple MEMS speaker units can be formed simultaneously on a PCB board 1.
- a polymer protective material is filled in the gap between the MEMS chip 2 and the PCB board 1 and cured, and then the process further includes:
- the cutting method can be laser cutting or mechanical cutting, and the preset cutting track is located between two adjacent first grooves 12.
- the use of a batch production process can reduce the steps of positioning and clamping operations, and significantly improve the processing efficiency of the MEMS speaker.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
本发明提供了MEMS扬声器制备工艺及MEMS扬声器。本发明的MEMS扬声器制备工艺包括步骤：定位PCB板材；将MEMS芯片倒置并电连接于PCB板材的开设第一凹槽的一侧；在MEMS芯片和PCB板材的间隙内填充高聚物保护材料并固化，使MEMS芯片和PCB板材结合为一体。由于PCB板材和MEMS芯片之间采用高聚物保护材料形成的高聚物保护件结合为一体，并且高聚物保护件包覆导电件，可以使得MEMS扬声器的整体封装尺寸基本和MEMS芯片尺寸一致，如此，能够显著提升MEMS扬声器的灵敏参数，灵敏参数为SPL/单位封装体平面面积，并且导电件被密封而不会接触外部空气，可靠性更高，从而适用于空间狭小、功耗要求严格的场景中。
Description
本发明属于发声器件技术领域，尤其涉及MEMS扬声器制备工艺及MEMS扬声器。
扬声器是一种用于将电信号转换成声音信号的器件，广泛应用于手机、电脑等移动终端中。
MEMS扬声器(Micro-Electro-Mechanical System)，即微机电***扬声器，其相对传统的音圈式扬声器具有一致性好、功耗低、尺寸小、价格低等优势。相关技术的MEMS扬声器包括线路板、与线路板盖接形成收容空间的外壳以及置于收容空间中并与线路板通过引线键合的MEMS扬声器芯片。
然而相关技术中的MEMS扬声器灵敏参数（SPL/单位封装体平面面积）不高，不利于产品应用在空间狭小、功耗要求严格的场景中。
本发明的目的在于提供一种MEMS扬声器制备工艺及MEMS扬声器，能够提升MEMS扬声器的灵敏参数，以适用于空间狭小、功耗要求严格的场景中。
本发明的技术方案如下：提供一种MEMS扬声器制备工艺，包括步骤：
定位PCB板材，所述PCB板材设有位于其一侧的第一凹槽以及贯通其另一侧且连通所述第一凹槽的出声孔；
将MEMS芯片倒置并电连接于所述PCB板材的开设所述第一凹槽的一侧，所述MEMS芯片的振膜在厚度方向的投影落入所述第一凹槽内，所述MEMS芯片和所述PCB板材之间具有间隙；
在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，使所述MEMS芯片和所述PCB板材结合为一体。
进一步地，所述定位PCB板材，包括：
调整所述PCB板材的位姿，使所述PCB板材保持水平且所述第一凹槽朝上。
进一步地，所述定位PCB板材后，还包括步骤：
在所述PCB板材上粘贴第一网片，使所述第一网片覆盖所述出声孔。
进一步地，将MEMS芯片倒置并电连接于所述PCB板材的开设所述第一凹槽的一侧，包括：
在所述PCB板材顶侧的焊盘点涂导电材料；
调整所述MEMS芯片的位姿，使所述MEMS芯片倒置并对准所述PCB板材，将所述MEMS芯片叠置于所述PCB板材；
固化所述导电材料，形成电连接于所述MEMS芯片和所述PCB板材之间的导电件。
进一步地，所述在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，包括：
在所述MEMS芯片和所述PCB板材的外周侧设置封胶治具，所述MEMS芯片的周侧和所述封胶治具的内侧之间形成连通所述间隙的灌胶口；
将液态的高聚物保护材料点涂至所述灌胶口，直至填充所述间隙和所述灌胶口；
固化所述高聚物保护材料，在所述间隙内和所述MEMS芯片的外周形成高聚物保护件。
进一步地，所述间隙的高度在1um~300um之间。
进一步地，所述MEMS芯片的背离所述PCB板材的一侧具有位于所述振膜的一侧的第二凹槽，所述在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，之前或之后，还包括：
在所述MEMS芯片的背离所述PCB板材的一侧粘贴覆盖所述第二凹槽的开口的第二网片。
进一步地，所述PCB板材上设有至少两个所述第一凹槽，在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，之后，还包括：
沿预设切割轨迹，将结合为一体的所述MEMS芯片和所述PCB板材切割形成至少两个扬声器单体，所述预设切割轨迹位于相邻的两个所述第一凹槽之间。
进一步地，提供一种MEMS扬声器，由如上任一项所述的制备工艺制成，所述MEMS扬声器包括PCB板材、位于所述PCB板材的一侧的MEMS芯片、电连接于所述PCB板材和所述MEMS芯片之间的导电件、以及结合于所述PCB板材和所述MEMS芯片之间且包覆所述导电件的高聚物保护件，所述PCB板材和所述MEMS芯片围合形成第一音腔，所述PCB板材的背离所述MEMS芯片的一侧开设连通所述第一音腔的出声孔。
进一步地，所述MEMS扬声器还包括贴设于所述PCB板材且覆盖所述出声孔的第一网片、以及贴设于所述MEMS芯片的背离所述PCB板材的一侧并与所述MEMS芯片围合形成第二音腔的第二网片。
本发明的有益效果在于：在本方案中，由于PCB板材和MEMS芯片之间采用高聚物保护材料形成的高聚物保护件结合为一体，并且高聚物保护件包覆导电件，可以使得MEMS扬声器的整体封装尺寸基本和MEMS芯片尺寸一致（芯片尺寸/封装尺寸可以大于等于95%，如芯片是Φ4.8mm，封装尺寸可以仅为Φ5mm甚至更小），如此，能够显著提升MEMS扬声器的灵敏参数，灵敏参数为SPL/单位封装体平面面积，并且导电件被密封而不会接触外部空气，可靠性更高，从而适用于空间狭小、功耗要求严格的场景中。
图1为第一种实现方式的MEMS扬声器的结构示意图；
图2为第二种实现方式的MEMS扬声器的结构示意图；
图3为第三种实现方式的MEMS扬声器的结构示意图；
图4为本发明一个实施例的MEMS扬声器制备工艺中步骤S100和步骤S200的流程示意图；
图5为本发明一个实施例的MEMS扬声器制备工艺中步骤S300第一种实现方式的流程示意图；
图6为本发明一个实施例的MEMS扬声器制备工艺中步骤S300第二种实现方式的流程示意图；
图7为本发明另一个实施例的MEMS扬声器制备工艺的流程示意图。
下面结合附图和实施方式对本发明作进一步说明。
结合图1-3，提供一种MEMS扬声器，包括PCB板材1、位于PCB板材1的一侧的MEMS芯片2、电连接于PCB板材1和MEMS芯片2之间的导电件3、以及结合于PCB板材1和MEMS芯片2之间且包覆导电件3的高聚物保护件4，PCB板材1和MEMS芯片2围合形成第一音腔100，PCB板材1的背离MEMS芯片2的一侧开设连通第一音腔100的出声孔11。
在本方案中，由于PCB板材1和MEMS芯片2之间采用高聚物保护件4结合为一体，并且高聚物保护件4包覆导电件3，可以使得MEMS扬声器的整体封装尺寸基本和MEMS芯片2尺寸一致（芯片尺寸/封装尺寸可以大于等于95%，如芯片是Φ4.8mm，封装尺寸可以仅为Φ5mm甚至更小），如此，能够显著提升MEMS扬声器的灵敏参数，灵敏参数为SPL/单位封装体平面面积，并且导电件3被密封而不会接触外部空气，可靠性更高，从而适用于空间狭小、功耗要求严格的场景中。
进一步地，MEMS扬声器还包括贴设于PCB板材1且覆盖出声孔11的第一网片51、以及贴设于MEMS芯片2的背离PCB板材1的一侧并与MEMS芯片2围合形成第二音腔200的第二网片52。
具体的，第一网片51和第二网片52可以采用多孔网状材料5，例如阻尼网布或者金属多孔网，如此，一方面可以具有较优的THD（总谐波失真）性能，另一方面可以防止灰尘进入到第一音腔100和第二音腔200内直接和MEMS芯片2接触，可靠性更好。其中，结合图1和图2，第一网片51可以贴附在PCB板材1的朝向第一音腔100的一侧，即第一网片51位于第一音腔100内；结合图3，第一网片51也可以贴附在PCB板材1的背离MEMS芯片2的一侧，此时出声孔11可以为第一音腔100的开口，即第一网片51直接覆盖第一音腔100的开口。
进一步地，MEMS芯片2具有位于第一音腔100和第二音腔200之间的振膜21，振膜21在厚度方向上的投影落入到第一音腔100的投影内，因此，在振膜21振动的过程中不会受到第一音腔100的侧壁的影响，声学性能更佳。
进一步地，高聚物保护件4还包覆于MEMS芯片2和PCB板材1的外侧，从而将MEMS芯片2和外界空气隔绝，以提升MEMS扬声器的可靠性。优选的，高聚物保护件4还可以包覆第二网片52的外侧，如此，MEMS芯片2的外周面均不会直接和空气接触，不容易接触空气中的灰尘等杂质，从而保证MEMS芯片2的可靠性。当第一网片51贴设在PCB板材1的背离MEMS芯片2的一侧时，高聚物保护件4也可以设置为同时包覆于第一网片51的外侧，进一步提升MEMS扬声器的可靠性。
在一些实施例中，高聚物保护件4也可以包覆于MEMS芯片2的外侧而未包覆PCB板材1的外侧，此时，高聚物保护件4的外周面和PCB板材1的外周面平齐，如此，可以减少高聚物保护材料的用量，降低成本。
进一步地，结合图4-7，提供一种MEMS扬声器制备工艺，用于制备如上的MEMS扬声器，包括如下步骤：
S100、定位PCB板材1，PCB板材1设有位于其一侧的第一凹槽12以及贯通其另一侧且连通第一凹槽12的出声孔11；
可以通过调整PCB板材1的位姿，使PCB板材1保持水平且第一凹槽12朝上，具体的，定位PCB板材1时可以采用定位夹具，定位夹具的顶侧可以设置定位槽，通过人工或者自动化设备将PCB板材1放置于定位夹具的定位槽内，从而使PCB板材1保持水平且第一凹槽12朝上。
当第一网片51设置在第一音腔100内时，定位PCB板材1后，可以将第一网片51粘贴在第一凹槽12的底侧并覆盖出声孔11，如此，在后续将MEMS芯片2连接于PCB板材1上时，第一网片51即位于第一音腔100内。
当第一网片51设置在第一音腔100外时，可以在定位PCB板材1前，将第一网片51粘贴在PCB板材1的背离第一凹槽12的一侧并覆盖出声孔11。当然，在一些实施例中，也可以在最后将第一网片51和PCB板材1粘贴固定。
S200、将MEMS芯片2倒置并电连接于PCB板材1的开设第一凹槽12的一侧，MEMS芯片2的振膜21在厚度方向的投影落入第一凹槽12内，MEMS芯片2和PCB板材1之间具有间隙。300
具体的，在本步骤中，在PCB板材1顶侧的焊盘点涂导电材料，其中导电材料可以为银胶、锡膏等固液混合材料；
调整MEMS芯片2的位姿，使MEMS芯片2倒置并对准PCB板材1，将MEMS芯片2叠置于PCB板材1；从而使MEMS的触点和点涂的导电材料相接触，此时，MEMS芯片2和PCB板材1之间形成间隙，间隙的高度在1um~300um之间，以便于后续高聚物保护材料流入并填充间隙。300
固化导电材料，形成电连接于MEMS芯片2和PCB板材1之间的导电件3。固化导电材料的方式可以采用回流焊或热压焊等方式实现，如此，形成的导电件3可以将MEMS芯片2和PCB板材1固定并电连接，保持MEMS芯片2和PCB板材1的连接稳定性。
S300、在MEMS芯片2和PCB板材1的间隙内填充高聚物保护材料并固化，使MEMS芯片2和PCB板材1结合为一体。
结合图5和图6，本步骤可以在MEMS芯片2和PCB板材1的外周侧设置封胶治具10，MEMS芯片2的周侧和封胶治具10的内侧之间形成连通间隙的灌胶口。如果需要在PCB板材1的外侧也包覆高聚物保护件4，则灌胶口在厚度方向上延伸至和PCB板材1的底侧平齐。MEMS芯片2的背离PCB板材1的一侧具有位于振膜21的一侧的第二凹槽22，如果需要在第二网片52的外侧也包覆高聚物保护件4，则在MEMS芯片2和PCB板材1的间隙内填充高聚物保护材料并固化，之前还包括：在MEMS芯片2的背离PCB板材1的一侧粘贴覆盖第二凹槽22的开口的第二网片52，此时，MEMS芯片2的周侧、第二网片52的周侧共同和封胶治具10的内侧形成连通间隙的灌胶口；如果第二网片52的外侧不需要包覆高聚物保护件4，则在MEMS芯片2和PCB板材1的间隙内填充高聚物保护材料并固化之后，在MEMS芯片2的背离PCB板材1的一侧粘贴覆盖第二凹槽22的开口的第二网片52。
将液态的高聚物保护材料点涂至灌胶口，直至填充间隙和灌胶口，其中，高聚物保护材料可以是聚对苯二甲酸乙二醇酯、聚碳酸酯、聚烯丙基酯膜(polyallylate film)等塑料绝缘材料；在本方案中，MEMS芯片2的振膜21在厚度方向的投影落入第一凹槽12内，即第一凹槽12的侧壁和振膜21的边缘平齐或者位于振膜21的边缘外侧，如此，填充高聚物保护材料时不会流到振膜21面影响声学性能，可靠性更高。在一些实施例中，MEMS芯片2的靠近PCB板材1的一侧或者PCB板材1靠近MEMS芯片2的的一侧可以设置环绕第一凹槽12的限位缘，限位缘将间隙的朝向第一凹槽12侧密封，从而阻挡高聚物保护材料流向振膜21，填充高聚物保护材料时不会流到振膜21面影响声学性能，从而保证扬声器的声学性能。
固化高聚物保护材料，在间隙内和MEMS芯片2的外周形成高聚物保护件4，之后使MEMS扬声器从封胶治具10中脱模即可。高聚物保护件4一方面可以将MEMS芯片2和PCB板材1结合紧密，另一方面可以包覆导电件3以及MEMS芯片2的外侧，可以在实现对MEMS芯片2可靠封装的条件下，显著提升MEMS扬声器的灵敏参数。
进一步地，为了提升MEMS扬声器的生产效率，可以采用批量生产的方式，此时PCB板材1上设有至少两个第一凹槽12，各第一凹槽12优选为矩形阵列排布，即可以在一块PCB板材1上同步形成多个MEMS扬声器单元。
结合图7，采用批量生产的方式时，在S100中，仅需将一整块PCB板材1定位至水平，并使第一凹槽12朝上，在S200中，可以分别在PCB板材1的和第一凹槽12对应位置处倒装焊接固定一一对应的MEMS芯片2，在S300中，仅需将一整块装配好MEMS芯片2的PCB板材1放置在封胶治具10内，如此，MEMS芯片2的外侧和封胶治具10的内侧之间、相邻的MEMS芯片2之间均形成了相互连通的灌胶口，并且灌胶口和MEMS芯片2与PCB板材1之间的间隙连通，如此，将液态的高聚物保护材料点涂至灌胶口，即可将所有的MEMS芯片2均牢靠地结合在PCB板材1上。应当理解，在批量生产时，每一个MEMS扬声器单元的具体工艺流程可以参考S100-S300中的步骤，在此不再赘述。
进一步地，对于批量生产的工艺，在MEMS芯片2和PCB板材1的间隙内填充高聚物保护材料并固化，之后，还包括：
S400、沿预设切割轨迹，将结合为一体的MEMS芯片2和PCB板材1切割形成至少两个扬声器单体，切割方式可以采用激光切割或者机械切割等方式，预设切割轨迹位于相邻的两个第一凹槽12之间。采用批量生产的工艺可以减少定位夹紧的操作步骤，显著提升MEMS扬声器的加工效率。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。
Claims (10)
- 一种MEMS扬声器制备工艺，其特征在于，包括步骤：定位PCB板材，所述PCB板材设有位于其一侧的第一凹槽以及贯通其另一侧且连通所述第一凹槽的出声孔；将MEMS芯片倒置并电连接于所述PCB板材的开设所述第一凹槽的一侧，所述MEMS芯片的振膜在厚度方向的投影落入所述第一凹槽内，所述MEMS芯片和所述PCB板材之间具有间隙；在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，使所述MEMS芯片和所述PCB板材结合为一体。
- 根据权利要求1所述的MEMS扬声器制备工艺，其特征在于，所述定位PCB板材，包括：调整所述PCB板材的位姿，使所述PCB板材保持水平且所述第一凹槽朝上。
- 根据权利要求1所述的MEMS扬声器制备工艺，其特征在于，所述定位PCB板材后，还包括步骤：在所述PCB板材上粘贴第一网片，使所述第一网片覆盖所述出声孔。
- 根据权利要求1所述的MEMS扬声器制备工艺，其特征在于，将MEMS芯片倒置并电连接于所述PCB板材的开设所述第一凹槽的一侧，包括：在所述PCB板材顶侧的焊盘点涂导电材料；调整所述MEMS芯片的位姿，使所述MEMS芯片倒置并对准所述PCB板材，将所述MEMS芯片叠置于所述PCB板材；固化所述导电材料，形成电连接于所述MEMS芯片和所述PCB板材之间的导电件。
- 根据权利要求1所述的MEMS扬声器制备工艺，其特征在于，所述在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，包括：在所述MEMS芯片和所述PCB板材的外周侧设置封胶治具，所述MEMS芯片的周侧和所述封胶治具的内侧之间形成连通所述间隙的灌胶口；将液态的高聚物保护材料点涂至所述灌胶口，直至填充所述间隙和所述灌胶口；固化所述高聚物保护材料，在所述间隙内和所述MEMS芯片的外周形成高聚物保护件。
- 根据权利要求5所述的MEMS扬声器制备工艺，其特征在于，所述间隙的高度在1um~300um之间。
- 根据权利要求5所述的MEMS扬声器制备工艺，其特征在于，所述MEMS芯片的背离所述PCB板材的一侧具有位于所述振膜的一侧的第二凹槽，所述在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，之前或之后，还包括：在所述MEMS芯片的背离所述PCB板材的一侧粘贴覆盖所述第二凹槽的开口的第二网片。
- 根据权利要求1-7任一项所述的MEMS扬声器制备工艺，其特征在于，所述PCB板材上设有至少两个所述第一凹槽，在所述MEMS芯片和所述PCB板材的间隙内填充高聚物保护材料并固化，之后，还包括：沿预设切割轨迹，将结合为一体的所述MEMS芯片和所述PCB板材切割形成至少两个扬声器单体，所述预设切割轨迹位于相邻的两个所述第一凹槽之间。
- 一种MEMS扬声器，其特征在于，由如权利要求1-8任一项所述的制备工艺制成，所述MEMS扬声器包括PCB板材、位于所述PCB板材的一侧的MEMS芯片、电连接于所述PCB板材和所述MEMS芯片之间的导电件、以及结合于所述PCB板材和所述MEMS芯片之间且包覆所述导电件的高聚物保护件，所述PCB板材和所述MEMS芯片围合形成第一音腔，所述PCB板材的背离所述MEMS芯片的一侧开设连通所述第一音腔的出声孔。
- 根据权利要求9所述的MEMS扬声器，其特征在于，所述MEMS扬声器还包括贴设于所述PCB板材且覆盖所述出声孔的第一网片、以及贴设于所述MEMS芯片的背离所述PCB板材的一侧并与所述MEMS芯片围合形成第二音腔的第二网片。
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| CN102685657A (zh) * | 2011-03-17 | 2012-09-19 | 罗伯特·博世有限公司 | 部件 |
| US20170048624A1 (en) * | 2014-04-24 | 2017-02-16 | USound GmbH | Loud Speaker Arrangement with Circuit-Board-Integrated ASIC |
| CN110382565A (zh) * | 2017-03-07 | 2019-10-25 | 松下知识产权经营株式会社 | 用作底部填充材料的热固性组合物和半导体装置 |
| CN217116397U (zh) * | 2022-03-03 | 2022-08-02 | 瑞声开泰科技(武汉)有限公司 | Mems扬声器 |
| CN115767404A (zh) * | 2022-11-29 | 2023-03-07 | 瑞声开泰科技(武汉)有限公司 | Mems扬声器制备工艺及mems扬声器 |
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| CN102685657A (zh) * | 2011-03-17 | 2012-09-19 | 罗伯特·博世有限公司 | 部件 |
| US20170048624A1 (en) * | 2014-04-24 | 2017-02-16 | USound GmbH | Loud Speaker Arrangement with Circuit-Board-Integrated ASIC |
| CN110382565A (zh) * | 2017-03-07 | 2019-10-25 | 松下知识产权经营株式会社 | 用作底部填充材料的热固性组合物和半导体装置 |
| CN217116397U (zh) * | 2022-03-03 | 2022-08-02 | 瑞声开泰科技(武汉)有限公司 | Mems扬声器 |
| CN115767404A (zh) * | 2022-11-29 | 2023-03-07 | 瑞声开泰科技(武汉)有限公司 | Mems扬声器制备工艺及mems扬声器 |
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