WO2024108747A1 - Porous ceramic atomization device, and atomization core and preparation method therefor - Google Patents

Porous ceramic atomization device, and atomization core and preparation method therefor Download PDF

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WO2024108747A1
WO2024108747A1 PCT/CN2023/070840 CN2023070840W WO2024108747A1 WO 2024108747 A1 WO2024108747 A1 WO 2024108747A1 CN 2023070840 W CN2023070840 W CN 2023070840W WO 2024108747 A1 WO2024108747 A1 WO 2024108747A1
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porous
heating element
atomization core
porous substrate
electronic atomization
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PCT/CN2023/070840
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French (fr)
Chinese (zh)
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陈二伟
肖小朋
聂革
赵波洋
赵贯云
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深圳市爱斯强科技有限公司
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Publication of WO2024108747A1 publication Critical patent/WO2024108747A1/en

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/70—Manufacture

Definitions

  • the present invention relates to the field of electronic atomizers, and in particular to a porous ceramic atomizer device, an atomizer core and a preparation method thereof.
  • the porous ceramic atomizer is a common electronic atomizer.
  • the electronic atomizer core is an important part of the porous ceramic atomizer. During atomization, the atomized liquid is conducted by the capillary action of the porous matrix. After passing through the heating element on the porous matrix, the heat atomizes it.
  • the current electronic atomizer core is composed of a porous matrix and a heating element, and the heating element is combined with the surface of the porous matrix.
  • the power circuit of the atomizer core is controlled by the negative pressure generated by the suction. With each puff, the power circuit of the atomizer core will be turned on and off once. When puffing multiple times, the heating element works in a "power on-off" cycle, and alternating hot and cold will occur, which makes the heating element of the atomizer core prone to warping or loosening, making the service life of the atomizer core generally only between 200-500 puffs.
  • the surface of the heating element of the atomizer core is prone to carbon deposition and fracture, which easily causes the atomizer core to become sticky, making the service life of the atomizer core also short.
  • the purpose of the present invention is to provide a porous ceramic atomization device, an atomization core and a preparation method thereof, so as to solve the technical problem of short service life of the electronic atomization core in the prior art.
  • a technical solution adopted by the present invention is: to provide an electronic atomization core, the electronic atomization core includes a porous substrate, a heating element and a porous covering film, the heating element is combined with a part of the surface of the porous substrate, the porous covering film covers the surface of the heating element and is combined with the porous substrate, so that the heating element is wrapped by the porous covering film on the inner side of the porous covering film.
  • the thickness of the porous covering film is 1 ⁇ m-500 ⁇ m thicker than that of the heating element.
  • the porosity of the porous covering membrane is 30%-70%, and the pore size of the porous covering membrane is 25 ⁇ m-60 ⁇ m.
  • Another technical solution adopted by the present invention is: a method for preparing an electronic atomization core, the preparation method comprising: preparing a porous substrate; forming a heating element on the surface of the porous substrate; and forming a porous covering film on the surface of the heating element away from the porous substrate and at least part of the free area of the surface of the porous substrate.
  • the step of preparing the porous matrix includes: forming a green body of the porous matrix by an injection molding process or a dry pressing process using a raw material for forming the porous matrix.
  • the step of preparing the porous matrix includes or does not include: degreasing and sintering the green body of the porous matrix.
  • the step of forming the heating element on the surface of the porous substrate includes: forming the heating element by a vacuum sputtering coating process, a printing process or a spraying process.
  • forming the heating element on the surface of the porous substrate includes or does not include: degreasing and sintering the porous substrate on which the heating element is formed.
  • the step of forming a porous covering film on the surface of the heating element away from the porous substrate and at least a partial free area of the surface of the porous substrate includes: making a slurry with raw materials for forming the porous covering film; forming a ceramic membrane on the surface of the heating element away from the porous substrate and at least a partial free area of the surface of the porous substrate by a casting process or a dry pressing process; and transforming the ceramic membrane into a porous covering film and combining it with the porous substrate and the heating element through a degreasing and sintering process.
  • a porous ceramic atomization device which includes a liquid storage chamber for storing atomized liquid and the above-mentioned electronic atomization core, and part or all of the electronic atomization core is arranged in the liquid storage chamber.
  • the present invention has at least the following beneficial effects:
  • the present invention combines a porous covering film on the surface of the heating element away from the porous matrix and at least part of the free area of the surface of the porous matrix, so that the heating element is internalized.
  • the bonding degree between the heating element and the porous ceramic is improved, so the heating element is not prone to warping and loosening;
  • the contact area between the heating element and the porous ceramic is significantly increased, which accelerates the transfer of heat from the heating element to the porous ceramic, making the heating uniformity of the atomizer core better, thereby greatly reducing the carbon deposition and breakage of the atomizer core heating element.
  • FIG1 is a schematic cross-sectional view of an electronic atomizer core in some embodiments.
  • FIG2 is a flow chart of a method for preparing an electronic atomization core according to some embodiments.
  • FIG. 3 is a schematic diagram of a process flow corresponding to a preparation process of an electronic atomization core according to an embodiment.
  • FIG1 schematically shows the cross-sectional structure of the electronic atomization core 100 of some embodiments.
  • the electronic atomization core 100 of this embodiment includes a porous substrate 10, a heating element 20 and a porous covering film 30, wherein the heating element 20 is combined with a partial surface 11 of the porous substrate 10, the porous covering film 30 is combined with a surface 21 of the heating element 20 away from the porous substrate 10, and the porous covering film 30 is also combined with at least a partial free area 12 of the surface 11 of the porous substrate 10, so that the heating element 20 is wrapped by the porous substrate 10 and the porous covering film 30.
  • the empty area 12 of the surface 11 refers to an area of the surface 11 without a heating element.
  • a porous covering film 30 is combined with the surface 11 of the heating element 20 away from the porous matrix 10 and at least part of the free area 12 of the surface 11 of the porous matrix 10, so that the heating element 20 is internalized.
  • the bonding degree between the heating element 20 and the porous ceramic (the porous ceramic here refers to the porous ceramic constituting the atomization core, including the porous matrix 10 and the porous covering film 30) is improved, so the heating element 20 is not prone to warping or loosening;
  • the contact area between the heating element 20 and the porous ceramic (the porous ceramic here refers to the porous ceramic constituting the atomization core, including the porous matrix 10 and the porous covering film 30) is significantly increased, which accelerates the transfer of heat from the heating element 20 to the porous ceramic, so that the heating uniformity of the atomization core
  • the porous substrate 10 is porous ceramics, and the material used to form the porous ceramics may be diatomaceous earth, quartz sand, aluminum oxide, etc.
  • the porous substrate 10 is porous glass.
  • sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents are also included.
  • Plasticizers and binders are used to keep the green body from deformation and reduce ceramic defects caused by thermal stress.
  • the binder can be paraffin wax, etc.
  • the plasticizer can be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc.
  • the sintering aid is used to reduce the sintering temperature and promote the densification of the ceramic green body.
  • the sintering aid can be glass powder, clay, etc.
  • the dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity.
  • the dispersant can be stearic acid, etc.
  • the pore-forming agent is used to control the pore size and porosity of the porous matrix to obtain a pore structure that penetrates each other in the porous matrix.
  • the pore-forming agent can be graphite powder, PMMA (polymethyl methacrylate), etc.
  • the material used to form the heating element 20 may be Ti, Ag, Cr, Ni, Fe, Al metal or alloy materials thereof.
  • the shape of the heating element may be a heating film, a heating wire, etc., which is not specifically limited in this embodiment.
  • the porous covering membrane 30 is a ceramic membrane or other heat-resistant membrane, and the covering membrane is configured as a porous structure.
  • the material used to form the porous covering film 30 may be diatomaceous earth, quartz sand, alumina, etc. Similar to the porous substrate 10, when forming the porous covering film 30, in addition to materials such as diatomaceous earth, quartz sand, and alumina, sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents are also included. Plasticizers and binders are used to keep the ceramic film from deforming and reduce ceramic defects caused by thermal stress.
  • the binder may be paraffin, etc.
  • the plasticizer may be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc.
  • the sintering aid is used to reduce the sintering temperature and promote ceramic densification.
  • the sintering aid may be glass powder, clay, etc.
  • the dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity.
  • the dispersant may be stearic acid, etc.
  • the pore former is used to control the pore size and porosity of the porous covering membrane 30 to obtain a pore structure that penetrates each other in the porous covering membrane 30.
  • the pore former can be graphite powder, PMMA (polymethyl methacrylate) or the like.
  • the thickness of the porous covering film 30 is 1 ⁇ m-500 ⁇ m greater than the thickness of the heating element 20.
  • the thickness of the porous covering film 30 refers to the length of the porous covering film 30 in a direction perpendicular to the surface 11 of the porous substrate 10, the starting point of which is the surface 11 of the porous substrate 10, and the length is represented as h2 in FIG1 .
  • the atomization path of the electronic atomization core 100 of this embodiment is that the atomized liquid enters from the lower surface of the porous matrix 10 in Figure 1, and after being heated and atomized, the generated aerosol flows out from the upper surface of the porous covering film 30 in Figure 1, so the thickness of the porous covering film 30 will affect the smoothness of the aerosol output; on the other hand, since the porous covering film 30 plays the role of wrapping and clamping the heating element 20, and increasing the heating uniformity of the electronic atomization core 100, the thickness of the porous covering film 30 will also affect the bonding degree and thermal conductivity of the heating element 20 and the porous ceramic (the porous ceramic here refers to the porous ceramic constituting the atomization core, including the porous matrix 10 and the porous covering film 30).
  • the thickness of the porous covering film 30 is effectively taken into account by designing the thickness of the porous covering film 30 to be 1 ⁇ m-500 ⁇ m larger than the thickness of the heating element 20.
  • the thickness difference between the porous covering film 30 and the heating element 20 can be any value of 1 ⁇ m-500 ⁇ m, for example, 5 ⁇ m, 10 ⁇ m, 20 ⁇ m, 40 ⁇ m, 60 ⁇ m, 100 ⁇ m, 200 ⁇ m, 400 ⁇ m, 450 ⁇ m, which is not specifically limited in this embodiment.
  • the porosity of the porous covering membrane 30 is 30%-70%, and the pore size of the porous covering membrane 30 is 25-60 ⁇ m.
  • the aerosol generated by atomization flows out through the porous covering membrane 30, so the porosity and pore size of the porous covering membrane 30 directly affect the smoothness of the aerosol output.
  • the porosity of the porous covering membrane 30 is 30%-70% and the pore size of the porous covering membrane 30 to 25-60 ⁇ m, the aerosol generated by atomization can be smoothly output through the porous covering membrane 30.
  • the porosity of the porous covering membrane 30 can be any percentage value between 30% and 70%, for example, 35%, 40%, 45%, 50%, 55%, 60%, 65%, and the pore size of the porous covering membrane 30 can be any data between 25 ⁇ m and 60 ⁇ m, for example, 30 ⁇ m, 35 ⁇ m, 40 ⁇ m, 45 ⁇ m, 50 ⁇ m, 55 ⁇ m, which is not specifically limited in this embodiment.
  • the present invention further provides a method for preparing an electronic atomization core, by which the electronic atomization core 100 of the above embodiment can be obtained.
  • FIG2 shows the process of the method for preparing the electronic atomization core 100.
  • FIG3 shows the process flow corresponding to the preparation process of the electronic atomization core of an embodiment.
  • the method for preparing the electronic atomization core 100 includes the following steps:
  • Step S101 preparing a porous substrate 10 .
  • the raw materials used to form the porous matrix 10 are made into the body of the porous matrix 10.
  • the raw materials used to form the porous matrix 10 can be diatomaceous earth, quartz sand and alumina, etc., in addition to sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents.
  • Plasticizers and binders are used to keep the ceramic body from deformation and reduce ceramic defects caused by thermal stress.
  • the binder can be paraffin, etc.
  • the plasticizer can be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc.
  • the sintering aid is used to reduce the sintering temperature and promote the densification of the ceramic body.
  • the sintering aid can be glass powder, clay, etc., and the dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity.
  • the dispersant can be stearic acid, etc.
  • the pore-forming agent is used to control the pore size and porosity of the porous matrix to obtain a pore structure that penetrates each other in the porous matrix.
  • the pore-forming agent can be graphite powder, PMMA (polymethyl methacrylate), etc.
  • the specific method is: after mixing the raw materials with the sintering aids, the raw materials are fed into a mold for forming the porous matrix 10 to obtain a green body of the porous matrix 10.
  • the green body can be obtained by injection molding or dry pressing.
  • the plasticizer, dispersant, pore-forming agent and other additives in the green body are removed through a degreasing process, and then a porous matrix 10 is obtained through a sintering process.
  • Step S102 forming a heating element 20 on the surface 11 of the porous substrate 10 .
  • the raw material for forming the heating element 20 is made into slurry.
  • the raw material for forming the heating element 20 can be Ti, Ag, Cr, Ni, Fe, Al metal or alloy materials thereof.
  • the heating element 20 is formed on the surface 11 of the porous substrate 10 by a printing process or a spraying process, and the heating element 20 and the porous substrate 10 are combined into one by a sintering process.
  • the heating element 20 can be formed on the surface 11 of the porous substrate 10 by a vacuum sputtering coating process.
  • the heating element 20 can be effectively combined with the porous substrate 10 after the coating is completed, and sintering is not required.
  • Step S103 forming a porous covering film 30 on the surface 21 of the heating element 20 away from the porous substrate 10 and on at least a portion of the vacant area 12 of the surface 11 of the porous substrate 10 .
  • the raw materials used to form the porous covering film 30 are made into a slurry.
  • the raw materials used to form the porous covering film 30 can be diatomaceous earth, quartz sand and alumina, etc., in addition to sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents.
  • Plasticizers and binders are used to keep the ceramic film from deforming and reduce ceramic defects caused by thermal stress.
  • the binder can be paraffin, etc.
  • the plasticizer can be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc.
  • the sintering aid is used to reduce the sintering temperature and promote ceramic densification.
  • the sintering aid can be glass powder, clay, etc.
  • the dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity.
  • the dispersant can be stearic acid, etc.
  • the pore-forming agent is used to control the pore size and porosity of the porous covering film to obtain a pore structure that penetrates each other in the porous covering film.
  • the pore-forming agent can be graphite powder, PMMA (polymethyl methacrylate), etc.
  • the ceramic membrane is formed by a casting process or a dry pressing process.
  • the ceramic membrane is specifically formed on the surface 21 of the heating element 20 away from the porous matrix 10 and at least a part of the vacant area 12 of the surface of the porous matrix 10 .
  • additives such as plasticizers, dispersants and pore-forming agents in the ceramic membrane are removed through degreasing and sintering processes, and then sintered to obtain a porous covering membrane 30, and the porous covering membrane 30 is reliably combined with the surface 21 of the heating element 20 away from the porous matrix 10 and at least part of the free area 12 of the surface 11 of the porous matrix 10.
  • a sintering process is included, that is, three sinterings are performed in the entire preparation process.
  • it may include only one sintering, specifically, after the green body of the porous substrate 10 is obtained, the heating element is directly formed on the green body, and then the ceramic membrane is formed, and finally a degreasing and sintering are performed to obtain the electronic atomization core 100.
  • it may include two sinterings, specifically, after the green body of the porous substrate 10 is obtained, the heating element is directly formed on the green body, and then a degreasing and sintering are performed, and then a ceramic membrane is formed, and then a secondary degreasing and sintering are performed to obtain the electronic atomization core 100.
  • it may include two sintering steps. Specifically, after the porous substrate 10 is prepared, degreasing and sintering are performed once. Then, a vacuum sputtering coating process is used to form a heating element 20 on the surface of the porous substrate 10. Next, a ceramic film is formed. Then, a second degreasing and sintering step is performed to obtain the electronic atomization core 100.
  • the present invention also provides a porous ceramic atomization device, which includes a liquid storage chamber for storing atomized liquid and the above-mentioned electronic atomization core, and part or all of the electronic atomization core is arranged in the liquid storage chamber.
  • a porous ceramic atomization device which includes a liquid storage chamber for storing atomized liquid and the above-mentioned electronic atomization core, and part or all of the electronic atomization core is arranged in the liquid storage chamber.
  • the structure of the electronic atomization core in this embodiment is the same as the structure of the electronic atomization core in the above-mentioned embodiment, and will not be repeated here.

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Abstract

A porous ceramic atomization device, and an atomization core and a preparation method therefor. The atomization core (100) comprises: a porous substrate (10), a heating element (20) and a porous cover film (30), wherein the heating element (20) is bonded to part of a surface of the porous substrate (10), and the porous cover film (30) covers a surface of the heating element (20) and is bonded to the porous substrate (10), so that the heating element (20) is wrapped by the porous cover film (30) on an inner side of the porous cover film (30). The atomization device comprises a liquid storage cavity and the atomization core (100). The preparation method comprises: preparing a porous substrate (10); forming a heating element (20) on a surface of the porous substrate (10); and forming a porous cover film (30) on the surface of the heating element (20) away from the porous substrate (10) and on at least part of a vacant area of the surface of the porous substrate (10). By bonding the porous cover film (30) to the surface of the heating element (20) away from the porous substrate (10) and to at least part of the vacant area of the surface of the porous substrate (10), the heating element (20) is not prone to warping and getting loose, and the phenomena of carbon deposition and breakage are reduced.

Description

多孔陶瓷雾化装置、雾化芯及其制备方法Porous ceramic atomization device, atomization core and preparation method thereof 技术领域Technical Field
本发明涉及电子雾化器领域，具体是一种多孔陶瓷雾化装置、雾化芯及其制备方法。The present invention relates to the field of electronic atomizers, and in particular to a porous ceramic atomizer device, an atomizer core and a preparation method thereof.
背景技术Background technique
多孔陶瓷雾化装置是一种常见的电子雾化器，电子雾化芯是多孔陶瓷雾化装置的重要部件，雾化时，雾化液借助多孔基体的毛细作用传导，经过多孔基体上的发热件后，热量将其雾化。目前的电子雾化芯由多孔基体及发热件构成，发热件结合在多孔基体的表面。The porous ceramic atomizer is a common electronic atomizer. The electronic atomizer core is an important part of the porous ceramic atomizer. During atomization, the atomized liquid is conducted by the capillary action of the porous matrix. After passing through the heating element on the porous matrix, the heat atomizes it. The current electronic atomizer core is composed of a porous matrix and a heating element, and the heating element is combined with the surface of the porous matrix.
但是发热件结合在多孔基体的表面的电子雾化芯在使用时，雾化芯的电源回路受抽吸产生的负压控制，每抽吸一口，雾化芯的电源回路会通断一次，多次抽吸时使得发热件工作在“通电-断电”的循环状态，会发生冷热交替，这导致雾化芯的发热件容易出现起翘或者松动现象，使得雾化芯的使用寿命一般只有200-500口之间。并且，雾化芯的发热件表面容易出现积碳和断裂现象，容易导致雾化芯糊芯，使得雾化芯的使用寿命也短。However, when the electronic atomizer core with the heating element combined with the surface of the porous matrix is in use, the power circuit of the atomizer core is controlled by the negative pressure generated by the suction. With each puff, the power circuit of the atomizer core will be turned on and off once. When puffing multiple times, the heating element works in a "power on-off" cycle, and alternating hot and cold will occur, which makes the heating element of the atomizer core prone to warping or loosening, making the service life of the atomizer core generally only between 200-500 puffs. In addition, the surface of the heating element of the atomizer core is prone to carbon deposition and fracture, which easily causes the atomizer core to become sticky, making the service life of the atomizer core also short.
发明内容Summary of the invention
本发明的目的是提供一种多孔陶瓷雾化装置、雾化芯及其制备方法，以解决现有技术中电子雾化芯使用寿命短的技术问题。The purpose of the present invention is to provide a porous ceramic atomization device, an atomization core and a preparation method thereof, so as to solve the technical problem of short service life of the electronic atomization core in the prior art.
为解决上述技术问题，本发明采用的一个技术方案是：提供一种电子雾化芯，所述电子雾化芯包括多孔基体、发热件及多孔覆盖膜，所述发热件结合于所述多孔基体的部分表面，所述多孔覆盖膜覆盖于所述发热件的表面并与所述多孔基体结合，以使得所述发热件被所述多孔覆盖膜包裹在所述多孔覆盖膜的内侧。In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an electronic atomization core, the electronic atomization core includes a porous substrate, a heating element and a porous covering film, the heating element is combined with a part of the surface of the porous substrate, the porous covering film covers the surface of the heating element and is combined with the porous substrate, so that the heating element is wrapped by the porous covering film on the inner side of the porous covering film.
可选地，所述多孔覆盖膜的厚度比发热件的厚度厚1μm-500μm。Optionally, the thickness of the porous covering film is 1 μm-500 μm thicker than that of the heating element.
可选地，所述多孔覆盖膜的孔隙率为30％-70％，所述多孔覆盖膜的孔径为25μm-60μm。Optionally, the porosity of the porous covering membrane is 30%-70%, and the pore size of the porous covering membrane is 25 μm-60 μm.
本发明采用的另一个技术方案是：一种电子雾化芯的制备方法，所述制备方法包括：制备多孔基体；在所述多孔基体的表面形成发热件；以及在所述发热件的远离所述多孔基体的表面及多孔基体的所述表面的至少部分空余区域形成多孔覆盖膜。Another technical solution adopted by the present invention is: a method for preparing an electronic atomization core, the preparation method comprising: preparing a porous substrate; forming a heating element on the surface of the porous substrate; and forming a porous covering film on the surface of the heating element away from the porous substrate and at least part of the free area of the surface of the porous substrate.
可选地，所述制备多孔基体的步骤包括：将用于形成所述多孔基体的原材料通过注塑工艺或者干压工艺制成所述多孔基体的坯体。Optionally, the step of preparing the porous matrix includes: forming a green body of the porous matrix by an injection molding process or a dry pressing process using a raw material for forming the porous matrix.
可选地，所述制备多孔基体的步骤包括或不包括：将所述多孔基体的坯体进行脱脂及烧结。Optionally, the step of preparing the porous matrix includes or does not include: degreasing and sintering the green body of the porous matrix.
可选地，所述在所述多孔基体的表面形成发热件的步骤包括：通过真空溅射镀膜工艺、印刷工艺或者喷涂工艺形成所述发热件。Optionally, the step of forming the heating element on the surface of the porous substrate includes: forming the heating element by a vacuum sputtering coating process, a printing process or a spraying process.
可选地，所述在所述多孔基体的表面形成发热件包括或不包括：将形成有发热件的所述多孔基体进行脱脂及烧结。Optionally, forming the heating element on the surface of the porous substrate includes or does not include: degreasing and sintering the porous substrate on which the heating element is formed.
可选地，所述在所述发热件的远离所述多孔基体的表面及多孔基体的所述表面的至少部分空余区域形成多孔覆盖膜的步骤包括：将用于形成所述多孔覆盖膜的原材料制成浆料；通过流延工艺或干压工艺在所述发热件的远离所述多孔基体的表面及多孔基体的所述表面的至少部分空余区域制成陶瓷膜；以及通过脱脂及烧结工艺使所述陶瓷膜变为多孔覆盖膜且与所述多孔基体及发热件结合为一体。Optionally, the step of forming a porous covering film on the surface of the heating element away from the porous substrate and at least a partial free area of the surface of the porous substrate includes: making a slurry with raw materials for forming the porous covering film; forming a ceramic membrane on the surface of the heating element away from the porous substrate and at least a partial free area of the surface of the porous substrate by a casting process or a dry pressing process; and transforming the ceramic membrane into a porous covering film and combining it with the porous substrate and the heating element through a degreasing and sintering process.
本发明采用的再一个技术方案是：一种多孔陶瓷雾化装置，所述多孔陶瓷雾化装置包括用于存储雾化液的储液腔以及上述的电子雾化芯，所述电子雾化芯的部分或全部设置于所述储液腔内。Another technical solution adopted by the present invention is: a porous ceramic atomization device, which includes a liquid storage chamber for storing atomized liquid and the above-mentioned electronic atomization core, and part or all of the electronic atomization core is arranged in the liquid storage chamber.
与现有技术相比，本发明至少具有以下有益效果：Compared with the prior art, the present invention has at least the following beneficial effects:
本发明通过在发热件的远离所述多孔基体的表面及多孔基体的所述表面的 至少部分空余区域结合一多孔覆盖膜，使得发热件内化，一方面，由于多孔覆盖膜与多孔基体对发热件的包裹及夹持作用，使得发热件与多孔陶瓷的结合度提高，所以发热件不易出现起翘、松动现象；另一方面，由于发热件内化使得发热件与多孔陶瓷的接触面积显著增大，加快了热量从发热件到多孔陶瓷的传递，使得雾化芯的发热均匀性更好，所以大大降低了雾化芯发热件的积碳现象及断裂现象。The present invention combines a porous covering film on the surface of the heating element away from the porous matrix and at least part of the free area of the surface of the porous matrix, so that the heating element is internalized. On the one hand, due to the wrapping and clamping effect of the porous covering film and the porous matrix on the heating element, the bonding degree between the heating element and the porous ceramic is improved, so the heating element is not prone to warping and loosening; on the other hand, due to the internalization of the heating element, the contact area between the heating element and the porous ceramic is significantly increased, which accelerates the transfer of heat from the heating element to the porous ceramic, making the heating uniformity of the atomizer core better, thereby greatly reducing the carbon deposition and breakage of the atomizer core heating element.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为一些实施例电子雾化芯的剖视结构示意图；FIG1 is a schematic cross-sectional view of an electronic atomizer core in some embodiments;
图2为一些实施例电子雾化芯的制备方法的流程图；FIG2 is a flow chart of a method for preparing an electronic atomization core according to some embodiments;
图3为一个实施例电子雾化芯的制备流程对应的工艺流程示意图。FIG. 3 is a schematic diagram of a process flow corresponding to a preparation process of an electronic atomization core according to an embodiment.
具体实施方式Detailed ways
下面结合附图和实施例对本发明进一步说明。The present invention is further described below in conjunction with the accompanying drawings and embodiments.
图1示意性表示了一些实施例电子雾化芯100的剖视结构。参照图1，本实施例电子雾化芯100包括多孔基体10、发热件20及多孔覆盖膜30，所述发热件20结合于所述多孔基体10的部分表面11，所述多孔覆盖膜30结合于所述发热件20的远离所述多孔基体10的表面21，所述多孔覆盖膜30还与多孔基体10的所述表面11的至少部分空余区域12结合，使得所述发热件20被所述多孔基体10及多孔覆盖膜30包裹。FIG1 schematically shows the cross-sectional structure of the electronic atomization core 100 of some embodiments. Referring to FIG1 , the electronic atomization core 100 of this embodiment includes a porous substrate 10, a heating element 20 and a porous covering film 30, wherein the heating element 20 is combined with a partial surface 11 of the porous substrate 10, the porous covering film 30 is combined with a surface 21 of the heating element 20 away from the porous substrate 10, and the porous covering film 30 is also combined with at least a partial free area 12 of the surface 11 of the porous substrate 10, so that the heating element 20 is wrapped by the porous substrate 10 and the porous covering film 30.
其中，表面11的空余区域12是指该表面11的没有发热件的区域。The empty area 12 of the surface 11 refers to an area of the surface 11 without a heating element.
本实施例通过在发热件20的远离所述多孔基体10的表面11及多孔基体10的所述表面11的至少部分空余区域12结合一多孔覆盖膜30，使得发热件20内化，一方面，由于多孔覆盖膜30与多孔基体10对发热件20的包裹及夹持作用，使得发热件20与多孔陶瓷(这里的多孔陶瓷指构成该雾化芯的多孔陶瓷，包括多孔基体10和多孔覆盖膜30)的结合度提高，所以发热件20不易出现起翘、松动现象；另一方面，由于发热件20内化使得发热件20与多孔陶瓷 (这里的多孔陶瓷指构成该雾化芯的多孔陶瓷，包括多孔基体10和多孔覆盖膜30)的接触面积显著增大，加快了热量从发热件20到多孔陶瓷的传递，使得雾化芯的发热均匀性更好，所以大大降低了雾化芯发热件的积碳现象及断裂现象。In this embodiment, a porous covering film 30 is combined with the surface 11 of the heating element 20 away from the porous matrix 10 and at least part of the free area 12 of the surface 11 of the porous matrix 10, so that the heating element 20 is internalized. On the one hand, due to the wrapping and clamping effect of the porous covering film 30 and the porous matrix 10 on the heating element 20, the bonding degree between the heating element 20 and the porous ceramic (the porous ceramic here refers to the porous ceramic constituting the atomization core, including the porous matrix 10 and the porous covering film 30) is improved, so the heating element 20 is not prone to warping or loosening; on the other hand, due to the internalization of the heating element 20, the contact area between the heating element 20 and the porous ceramic (the porous ceramic here refers to the porous ceramic constituting the atomization core, including the porous matrix 10 and the porous covering film 30) is significantly increased, which accelerates the transfer of heat from the heating element 20 to the porous ceramic, so that the heating uniformity of the atomization core is better, thereby greatly reducing the carbon deposition and breakage of the atomization core heating element.
可选地，多孔基体10为多孔陶瓷，用于形成多孔陶瓷的材料可以是硅藻土、石英砂和氧化铝等。可选地，多孔基体10为多孔玻璃。Optionally, the porous substrate 10 is porous ceramics, and the material used to form the porous ceramics may be diatomaceous earth, quartz sand, aluminum oxide, etc. Optionally, the porous substrate 10 is porous glass.
本领域技术人员应当理解，在形成多孔基体时，除了硅藻土、石英砂和氧化铝等材料外，还包括粘结剂、塑化剂、助烧剂、分散剂、造孔剂等烧结助剂。塑化剂和粘结剂用于保持坯体不变形，减小热应力产生的陶瓷缺陷，可选地，粘结剂可以是石蜡等，塑化剂可以是PE(聚乙烯)、PVC(聚氯乙烯)、PVA(聚乙烯醇)等。助烧剂用于降低烧结温度，促进陶瓷坯体致密化，可选地，助烧剂可以是玻璃粉、粘土等。分散剂起到使粉体充分混合分散，维持均匀性的作用，可选地，分散剂可以是硬脂酸等。造孔剂用于控制多孔基体的孔径及孔隙率，得到多孔基体中互相贯穿的孔道结构，可选地，造孔剂可以是石墨粉、PMMA(聚甲基丙烯酸甲酯)等。Those skilled in the art will appreciate that, when forming a porous matrix, in addition to materials such as diatomite, quartz sand and alumina, sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents are also included. Plasticizers and binders are used to keep the green body from deformation and reduce ceramic defects caused by thermal stress. Optionally, the binder can be paraffin wax, etc., and the plasticizer can be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc. The sintering aid is used to reduce the sintering temperature and promote the densification of the ceramic green body. Optionally, the sintering aid can be glass powder, clay, etc. The dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity. Optionally, the dispersant can be stearic acid, etc. The pore-forming agent is used to control the pore size and porosity of the porous matrix to obtain a pore structure that penetrates each other in the porous matrix. Optionally, the pore-forming agent can be graphite powder, PMMA (polymethyl methacrylate), etc.
可选地，用于形成发热件20的材料可以是Ti、Ag、Cr、Ni、Fe、Al金属或者其合金材料。发热件的形状可以为发热膜、发热丝等形状，本实施例对此不做具体限定。Optionally, the material used to form the heating element 20 may be Ti, Ag, Cr, Ni, Fe, Al metal or alloy materials thereof. The shape of the heating element may be a heating film, a heating wire, etc., which is not specifically limited in this embodiment.
可选地，多孔覆盖膜30为陶瓷材质膜或其它耐热材质膜，覆盖膜设置为多孔结构。Optionally, the porous covering membrane 30 is a ceramic membrane or other heat-resistant membrane, and the covering membrane is configured as a porous structure.
可选地，用于形成多孔覆盖膜30的材料可以是硅藻土、石英砂和氧化铝等。与多孔基体10相同，在形成多孔覆盖膜30时，除了硅藻土、石英砂和氧化铝等材料外，还包括粘结剂、塑化剂、助烧剂、分散剂、造孔剂等烧结助剂。塑化剂和粘结剂用于保持陶瓷膜不变形，减小热应力产生的陶瓷缺陷，可选地，粘结剂可以是石蜡等，塑化剂可以是PE(聚乙烯)、PVC(聚氯乙烯)、PVA(聚乙烯醇)等。助烧剂用于降低烧结温度，促进陶瓷致密化，可选地，助烧剂可以是 玻璃粉、粘土等，分散剂起到使粉体充分混合分散，维持均匀性的作用，可选地，分散剂可以是硬脂酸等。造孔剂用于控制多孔覆盖膜30的孔径及孔隙率，得到多孔覆盖膜30中互相贯穿的孔道结构，可选地，造孔剂可以是石墨粉、PMMA(聚甲基丙烯酸甲酯)等。Optionally, the material used to form the porous covering film 30 may be diatomaceous earth, quartz sand, alumina, etc. Similar to the porous substrate 10, when forming the porous covering film 30, in addition to materials such as diatomaceous earth, quartz sand, and alumina, sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents are also included. Plasticizers and binders are used to keep the ceramic film from deforming and reduce ceramic defects caused by thermal stress. Optionally, the binder may be paraffin, etc., and the plasticizer may be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc. The sintering aid is used to reduce the sintering temperature and promote ceramic densification. Optionally, the sintering aid may be glass powder, clay, etc. The dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity. Optionally, the dispersant may be stearic acid, etc. The pore former is used to control the pore size and porosity of the porous covering membrane 30 to obtain a pore structure that penetrates each other in the porous covering membrane 30. Optionally, the pore former can be graphite powder, PMMA (polymethyl methacrylate) or the like.
可选地，所述多孔覆盖膜30的厚度比发热件20的厚度大1μm-500μm。多孔覆盖膜30的厚度是指多孔覆盖膜30在垂直于多孔基体10的表面11的方向上的长度，该长度的起点为多孔基体10的表面11，该长度在图1中表示为h2。发热件20的厚度是指发热件20在垂直于多孔基体10的表面11的方向上的长度，该长度在图1中表示为h1，h2-h1＝1μm-500μm。一方面，由于本实施例电子雾化芯100的雾化路径为雾化液从图1中的多孔基体10的下表面进入，被加热雾化后，产生的气雾从图1中多孔覆盖膜30的上表面流出，所以多孔覆盖膜30的厚度会对气雾输出的顺畅度产生影响；另一方面，由于多孔覆盖膜30起到包裹夹持发热件20，以及增大电子雾化芯100的发热均匀性的作用，所以多孔覆盖膜30的厚度还会对发热件20与多孔陶瓷(这里的多孔陶瓷指构成该雾化芯的多孔陶瓷，包括多孔基体10和多孔覆盖膜30)的结合度及导热等性能产生影响，通过将多孔覆盖膜30的厚度设计得比发热件20的厚度大1μm-500μm有效兼顾了该两方面的性能。具体地，多孔覆盖膜30与发热件20厚度差可以是1μm-500μm的任一数值，例如，5μm，10μm，20μm，40μm，60μm，100μm，200μm，400μm，450μm，本实施例对此不做具体限定。Optionally, the thickness of the porous covering film 30 is 1 μm-500 μm greater than the thickness of the heating element 20. The thickness of the porous covering film 30 refers to the length of the porous covering film 30 in a direction perpendicular to the surface 11 of the porous substrate 10, the starting point of which is the surface 11 of the porous substrate 10, and the length is represented as h2 in FIG1 . The thickness of the heating element 20 refers to the length of the heating element 20 in a direction perpendicular to the surface 11 of the porous substrate 10, and the length is represented as h1 in FIG1 , h2-h1=1 μm-500 μm. On the one hand, since the atomization path of the electronic atomization core 100 of this embodiment is that the atomized liquid enters from the lower surface of the porous matrix 10 in Figure 1, and after being heated and atomized, the generated aerosol flows out from the upper surface of the porous covering film 30 in Figure 1, so the thickness of the porous covering film 30 will affect the smoothness of the aerosol output; on the other hand, since the porous covering film 30 plays the role of wrapping and clamping the heating element 20, and increasing the heating uniformity of the electronic atomization core 100, the thickness of the porous covering film 30 will also affect the bonding degree and thermal conductivity of the heating element 20 and the porous ceramic (the porous ceramic here refers to the porous ceramic constituting the atomization core, including the porous matrix 10 and the porous covering film 30). The performance of these two aspects is effectively taken into account by designing the thickness of the porous covering film 30 to be 1μm-500μm larger than the thickness of the heating element 20. Specifically, the thickness difference between the porous covering film 30 and the heating element 20 can be any value of 1μm-500μm, for example, 5μm, 10μm, 20μm, 40μm, 60μm, 100μm, 200μm, 400μm, 450μm, which is not specifically limited in this embodiment.
可选地，所述多孔覆盖膜30的孔隙率为30％-70％，所述多孔覆盖膜30的孔径为25-60μm。如前一段落中所述，雾化产生的气雾经多孔覆盖膜30流出，因此多孔覆盖膜30的孔隙率及孔径直接影响气雾输出的顺畅度。通过将多孔覆盖膜30的孔隙率设置为30％-70％，多孔覆盖膜30的孔径设置为25-60μm，使得雾化产生的气雾可以经多孔覆盖膜30顺畅的输出。具体地，多孔覆盖膜 30的孔隙率可以为30％-70％之间的任一百分比值，例如35％，40％，45％，50％，55％，60％，65％，多孔覆盖膜30的孔径可以为25μm-60μm之间的任一数据，例如30μm，35μm，40μm，45μm，50μm，55μm，本实施例对此不做具体限定。Optionally, the porosity of the porous covering membrane 30 is 30%-70%, and the pore size of the porous covering membrane 30 is 25-60 μm. As described in the previous paragraph, the aerosol generated by atomization flows out through the porous covering membrane 30, so the porosity and pore size of the porous covering membrane 30 directly affect the smoothness of the aerosol output. By setting the porosity of the porous covering membrane 30 to 30%-70% and the pore size of the porous covering membrane 30 to 25-60 μm, the aerosol generated by atomization can be smoothly output through the porous covering membrane 30. Specifically, the porosity of the porous covering membrane 30 can be any percentage value between 30% and 70%, for example, 35%, 40%, 45%, 50%, 55%, 60%, 65%, and the pore size of the porous covering membrane 30 can be any data between 25μm and 60μm, for example, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, which is not specifically limited in this embodiment.
本发明进一步还提供了一种电子雾化芯的制备方法，通过该制备方法可以获得上述实施例的电子雾化芯100。图2中示出了本电子雾化芯100的制备方法的流程。图3示出了一个实施例电子雾化芯的制备流程对应的工艺流程。The present invention further provides a method for preparing an electronic atomization core, by which the electronic atomization core 100 of the above embodiment can be obtained. FIG2 shows the process of the method for preparing the electronic atomization core 100. FIG3 shows the process flow corresponding to the preparation process of the electronic atomization core of an embodiment.
参照图2及图3，该电子雾化芯100的制备方法包括以下步骤：2 and 3 , the method for preparing the electronic atomization core 100 includes the following steps:
步骤S101、制备多孔基体10。Step S101 : preparing a porous substrate 10 .
首先，将用于形成多孔基体10的原材料制成多孔基体10的坯体。其中，用于形成多孔基体10的原材料可以是硅藻土、石英砂和氧化铝等，除此之外还包括粘结剂、塑化剂、助烧剂、分散剂、造孔剂等烧结助剂。塑化剂和粘结剂用于保持陶瓷坯体不变形，减小热应力产生的陶瓷缺陷，可选地，粘结剂可以是石蜡等，塑化剂可以是PE(聚乙烯)、PVC(聚氯乙烯)、PVA(聚乙烯醇)等。助烧剂用于降低烧结温度，促进陶瓷坯体致密化，可选地，助烧剂可以是玻璃粉、粘土等，分散剂起到使粉体充分混合分散，维持均匀性的作用，可选地，分散剂可以是硬脂酸等。造孔剂用于控制多孔基体的孔径及孔隙率，得到多孔基体中互相贯穿的孔道结构，可选地，造孔剂可以是石墨粉、PMMA(聚甲基丙烯酸甲酯)等。具体的方法为：将原材料与各烧结助剂混合后，送入用于成形多孔基体10的模具，制得多孔基体10的坯体。其中，可以采用注塑工艺或干压工艺制得坯体。First, the raw materials used to form the porous matrix 10 are made into the body of the porous matrix 10. Among them, the raw materials used to form the porous matrix 10 can be diatomaceous earth, quartz sand and alumina, etc., in addition to sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents. Plasticizers and binders are used to keep the ceramic body from deformation and reduce ceramic defects caused by thermal stress. Optionally, the binder can be paraffin, etc., and the plasticizer can be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc. The sintering aid is used to reduce the sintering temperature and promote the densification of the ceramic body. Optionally, the sintering aid can be glass powder, clay, etc., and the dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity. Optionally, the dispersant can be stearic acid, etc. The pore-forming agent is used to control the pore size and porosity of the porous matrix to obtain a pore structure that penetrates each other in the porous matrix. Optionally, the pore-forming agent can be graphite powder, PMMA (polymethyl methacrylate), etc. The specific method is: after mixing the raw materials with the sintering aids, the raw materials are fed into a mold for forming the porous matrix 10 to obtain a green body of the porous matrix 10. The green body can be obtained by injection molding or dry pressing.
然后，通过脱脂工艺去除坯体中的塑化剂、分散剂及造孔剂等添加物，再通过烧结工艺后，即制得多孔基体10。Then, the plasticizer, dispersant, pore-forming agent and other additives in the green body are removed through a degreasing process, and then a porous matrix 10 is obtained through a sintering process.
步骤S102、在多孔基体10的表面11形成发热件20。Step S102 , forming a heating element 20 on the surface 11 of the porous substrate 10 .
首先，将用于形成发热件20的原材料制成浆料。其中，用于形成发热件 20的原材料可以是Ti、Ag、Cr、Ni、Fe、Al金属或者其合金材料。First, the raw material for forming the heating element 20 is made into slurry. The raw material for forming the heating element 20 can be Ti, Ag, Cr, Ni, Fe, Al metal or alloy materials thereof.
然后，通过印刷工艺或者喷涂工艺在多孔基体10的表面11形成发热件20，再次通过烧结工艺使发热件20与多孔基体10结合为一体。Then, the heating element 20 is formed on the surface 11 of the porous substrate 10 by a printing process or a spraying process, and the heating element 20 and the porous substrate 10 are combined into one by a sintering process.
作为另一种实施例，可以通过真空溅射镀膜工艺在多孔基体10的表面11形成发热件20。当采用真空溅射镀膜工艺在多孔基体10的表面11形成发热件20时，镀膜结束后发热件20即可与多孔基体10有效结合，不需要再进行烧结。As another embodiment, the heating element 20 can be formed on the surface 11 of the porous substrate 10 by a vacuum sputtering coating process. When the heating element 20 is formed on the surface 11 of the porous substrate 10 by a vacuum sputtering coating process, the heating element 20 can be effectively combined with the porous substrate 10 after the coating is completed, and sintering is not required.
步骤S103、在发热件20的远离多孔基体10的表面21及多孔基体10的所述表面11的至少部分空余区域12形成多孔覆盖膜30。Step S103 : forming a porous covering film 30 on the surface 21 of the heating element 20 away from the porous substrate 10 and on at least a portion of the vacant area 12 of the surface 11 of the porous substrate 10 .
首先，将用于形成多孔覆盖膜30的原材料制成浆料。其中，用于形成多孔覆盖膜30的原材料可以是硅藻土、石英砂和氧化铝等，除此之外还包括粘结剂、塑化剂、助烧剂、分散剂、造孔剂等烧结助剂。塑化剂和粘结剂用于保持陶瓷膜不变形，减小热应力产生的陶瓷缺陷，可选地，粘结剂可以是石蜡等，塑化剂可以是PE(聚乙烯)、PVC(聚氯乙烯)、PVA(聚乙烯醇)等。助烧剂用于降低烧结温度，促进陶瓷致密化，可选地，助烧剂可以是玻璃粉、粘土等，分散剂起到使粉体充分混合分散，维持均匀性的作用，可选地，分散剂可以是硬脂酸等。造孔剂用于控制多孔覆盖膜的孔径及孔隙率，得到多孔覆盖膜中互相贯穿的孔道结构，可选地，造孔剂可以是石墨粉、PMMA(聚甲基丙烯酸甲酯)等。First, the raw materials used to form the porous covering film 30 are made into a slurry. Among them, the raw materials used to form the porous covering film 30 can be diatomaceous earth, quartz sand and alumina, etc., in addition to sintering aids such as binders, plasticizers, sintering aids, dispersants, and pore-forming agents. Plasticizers and binders are used to keep the ceramic film from deforming and reduce ceramic defects caused by thermal stress. Optionally, the binder can be paraffin, etc., and the plasticizer can be PE (polyethylene), PVC (polyvinyl chloride), PVA (polyvinyl alcohol), etc. The sintering aid is used to reduce the sintering temperature and promote ceramic densification. Optionally, the sintering aid can be glass powder, clay, etc., and the dispersant plays a role in fully mixing and dispersing the powder and maintaining uniformity. Optionally, the dispersant can be stearic acid, etc. The pore-forming agent is used to control the pore size and porosity of the porous covering film to obtain a pore structure that penetrates each other in the porous covering film. Optionally, the pore-forming agent can be graphite powder, PMMA (polymethyl methacrylate), etc.
然后，通过流延工艺或干压工艺制成陶瓷膜。其中，陶瓷膜具体成形在在发热件20的远离多孔基体10的表面21及多孔基体10的所述表面的至少部分空余区域12。Then, the ceramic membrane is formed by a casting process or a dry pressing process. The ceramic membrane is specifically formed on the surface 21 of the heating element 20 away from the porous matrix 10 and at least a part of the vacant area 12 of the surface of the porous matrix 10 .
最后，通过脱脂及烧结工艺去除陶瓷膜内的塑化剂、分散剂及造孔剂等添加物，再烧结，即获得多孔覆盖膜30，并且多孔覆盖膜30与发热件20的远离多孔基体10的表面21及多孔基体10的所述表面11的至少部分空余区域12可靠结合。Finally, additives such as plasticizers, dispersants and pore-forming agents in the ceramic membrane are removed through degreasing and sintering processes, and then sintered to obtain a porous covering membrane 30, and the porous covering membrane 30 is reliably combined with the surface 21 of the heating element 20 away from the porous matrix 10 and at least part of the free area 12 of the surface 11 of the porous matrix 10.
在上述实施例中，在制备多孔基体10的步骤中，在多孔基体10的表面11 形成发热件20的步骤中，以及在发热件20的远离多孔基体10的表面21及多孔基体10的所述表面11的至少部分空余区域12形成多孔覆盖膜30的步骤中，均包括了烧结工艺，即整个制备流程中经过了三次烧结。作为另一个实施例，可以只包含一次烧结，具体是在制得多孔基体10的坯体后，直接在该坯体上形成发热件，然后再形成陶瓷膜，最后进行一次脱脂及烧结获得电子雾化芯100。作为再一个实施例，可以包含两次烧结，具体是在制得多孔基体10的坯体后，直接在该坯体上形成发热件，然后进行一次脱脂及烧结，接下来形成陶瓷膜，然后进行二次脱脂及烧结获得电子雾化芯100。作为又一个实施例，可以包含两次烧结，具体是在制得多孔基体10的坯体后，先进行一次脱脂及烧结，然后采用真空溅射镀膜工艺在多孔基体10的表面形成发热件20，接下来形成陶瓷膜，然后进行二次脱脂及烧结获得电子雾化芯100。In the above embodiment, in the step of preparing the porous substrate 10, in the step of forming the heating element 20 on the surface 11 of the porous substrate 10, and in the step of forming the porous covering membrane 30 on the surface 21 of the heating element 20 away from the porous substrate 10 and at least part of the free area 12 of the surface 11 of the porous substrate 10, a sintering process is included, that is, three sinterings are performed in the entire preparation process. As another embodiment, it may include only one sintering, specifically, after the green body of the porous substrate 10 is obtained, the heating element is directly formed on the green body, and then the ceramic membrane is formed, and finally a degreasing and sintering are performed to obtain the electronic atomization core 100. As another embodiment, it may include two sinterings, specifically, after the green body of the porous substrate 10 is obtained, the heating element is directly formed on the green body, and then a degreasing and sintering are performed, and then a ceramic membrane is formed, and then a secondary degreasing and sintering are performed to obtain the electronic atomization core 100. As another embodiment, it may include two sintering steps. Specifically, after the porous substrate 10 is prepared, degreasing and sintering are performed once. Then, a vacuum sputtering coating process is used to form a heating element 20 on the surface of the porous substrate 10. Next, a ceramic film is formed. Then, a second degreasing and sintering step is performed to obtain the electronic atomization core 100.
本发明还提供了一种多孔陶瓷雾化装置，所述多孔陶瓷雾化装置包括用于存储雾化液的储液腔以及上述的电子雾化芯，所述电子雾化芯的部分或全部设置于所述储液腔内。其中，本实施例中的电子雾化芯的结构与上述实施例中的电子雾化芯的结构相同，此处不再赘述。The present invention also provides a porous ceramic atomization device, which includes a liquid storage chamber for storing atomized liquid and the above-mentioned electronic atomization core, and part or all of the electronic atomization core is arranged in the liquid storage chamber. Among them, the structure of the electronic atomization core in this embodiment is the same as the structure of the electronic atomization core in the above-mentioned embodiment, and will not be repeated here.
上述通过具体实施例对本发明进行了详细的说明，这些详细的说明仅仅限于帮助本领域技术人员理解本发明的内容，并不能理解为对本发明保护范围的限制。本领域技术人员在本发明构思下对上述方案进行的各种润饰、等效变换等均应包含在本发明的保护范围内。The present invention is described in detail above through specific embodiments, and these detailed descriptions are only limited to helping those skilled in the art understand the content of the present invention, and cannot be understood as limiting the scope of protection of the present invention. Various modifications, equivalent transformations, etc. made by those skilled in the art to the above scheme under the conception of the present invention should be included in the scope of protection of the present invention.

Claims (20)

  1. 一种电子雾化芯，其特征在于，包括多孔基体、发热件及多孔覆盖膜，所述发热件结合于所述多孔基体的部分表面，所述多孔覆盖膜覆盖于所述发热件的表面并与所述多孔基体结合，以使得所述发热件被所述多孔覆盖膜包裹在所述多孔覆盖膜的内侧。An electronic atomization core, characterized in that it includes a porous substrate, a heating element and a porous covering film, wherein the heating element is combined with a portion of the surface of the porous substrate, and the porous covering film covers the surface of the heating element and is combined with the porous substrate, so that the heating element is wrapped by the porous covering film on the inner side of the porous covering film.
  2. 根据权利要求1所述的电子雾化芯，其特征在于：所述多孔覆盖膜的厚度比所述发热件的厚度厚1μm-500μm。The electronic atomization core according to claim 1 is characterized in that the thickness of the porous covering film is 1 μm-500 μm thicker than the thickness of the heating element.
  3. 根据权利要求1所述的电子雾化芯，其特征在于：所述多孔覆盖膜的孔隙率为30％-70％。The electronic atomization core according to claim 1 is characterized in that the porosity of the porous covering film is 30%-70%.
  4. 根据权利要求3所述的电子雾化芯，其特征在于：所述多孔覆盖膜的孔径为25μm-60μm。The electronic atomization core according to claim 3 is characterized in that the pore size of the porous covering membrane is 25 μm-60 μm.
  5. 根据权利要求1所述的电子雾化芯，其特征在于：所述多孔覆盖膜为陶瓷材质膜。The electronic atomization core according to claim 1 is characterized in that the porous covering membrane is a ceramic membrane.
  6. 根据权利要求5所述的电子雾化芯，其特征在于：所述陶瓷材质膜包括硅藻土、石英砂和氧化铝构成的物质组中的至少一种物质，所述陶瓷材质膜的前驱体中包括粘结剂、塑化剂、助烧剂、分散剂和造孔剂。The electronic atomization core according to claim 5 is characterized in that: the ceramic material film includes at least one substance selected from the group consisting of diatomaceous earth, quartz sand and alumina, and the precursor of the ceramic material film includes a binder, a plasticizer, a sintering aid, a dispersant and a pore-forming agent.
  7. 根据权利要求1所述的电子雾化芯，其特征在于：所述发热件包括发热膜或发热丝。The electronic atomizer core according to claim 1 is characterized in that the heating element comprises a heating film or a heating wire.
  8. 根据权利要求1所述的电子雾化芯，其特征在于：所述发热件包括金属或合金，所述金属选自Ti、Ag、Cr、Ni、Fe和Al组成的物质组，所述合金选自Ti合金、Ag合金、Cr合金、Ni合金、Fe合金和Al合金组成的物质组。The electronic atomization core according to claim 1 is characterized in that: the heating element comprises a metal or an alloy, the metal is selected from the group consisting of Ti, Ag, Cr, Ni, Fe and Al, and the alloy is selected from the group consisting of Ti alloy, Ag alloy, Cr alloy, Ni alloy, Fe alloy and Al alloy.
  9. 根据权利要求1所述的电子雾化芯，其特征在于：所述多孔基体为多孔陶瓷。The electronic atomization core according to claim 1 is characterized in that the porous matrix is porous ceramic.
  10. 根据权利要求9所述的电子雾化芯，其特征在于：所述多孔陶瓷包括硅藻土、石英砂和氧化铝构成的物质组中的至少一种物质，所述多孔基体的前 驱体中包括粘结剂、塑化剂、助烧剂、分散剂和造孔剂。The electronic atomization core according to claim 9 is characterized in that: the porous ceramic includes at least one substance in the group consisting of diatomaceous earth, quartz sand and alumina, and the precursor of the porous matrix includes a binder, a plasticizer, a sintering aid, a dispersant and a pore-forming agent.
  11. 根据权利要求1所述的电子雾化芯，其特征在于：所述多孔基体为多孔玻璃。The electronic atomization core according to claim 1 is characterized in that the porous substrate is porous glass.
  12. 一种电子雾化芯的制备方法，其特征在于，包括以下步骤：A method for preparing an electronic atomization core, characterized in that it comprises the following steps:
    制备多孔基体；preparing a porous matrix;
    在所述多孔基体的表面形成发热件；forming a heating element on the surface of the porous substrate;
    在所述发热件的远离所述多孔基体的表面及所述多孔基体的表面的至少部分空余区域形成多孔覆盖膜。A porous covering film is formed on the surface of the heat generating element away from the porous substrate and on at least a portion of the vacant area of the surface of the porous substrate.
  13. 根据权利要求12所述的电子雾化芯的制备方法，其特征在于，所述制备多孔基体的步骤包括将用于形成所述多孔基体的原材料通过注塑工艺或者干压工艺制成所述多孔基体的坯体。The method for preparing an electronic atomization core according to claim 12 is characterized in that the step of preparing the porous matrix comprises forming a green body of the porous matrix by an injection molding process or a dry pressing process using the raw materials used to form the porous matrix.
  14. 根据权利要求13所述的电子雾化芯的制备方法，其特征在于，所述制备多孔基体的步骤包括将所述多孔基体的坯体进行脱脂及烧结。The method for preparing an electronic atomization core according to claim 13 is characterized in that the step of preparing the porous matrix includes degreasing and sintering the green body of the porous matrix.
  15. 根据权利要求13所述的电子雾化芯的制备方法，其特征在于，所述制备多孔基体的步骤不对所述多孔基体的坯体进行脱脂及烧结。The method for preparing an electronic atomization core according to claim 13 is characterized in that the step of preparing the porous matrix does not involve degreasing and sintering the green body of the porous matrix.
  16. 根据权利要求12所述的电子雾化芯的制备方法，其特征在于，所述在所述多孔基体的表面形成发热件的步骤包括通过真空溅射镀膜工艺、印刷工艺或者喷涂工艺形成所述发热件。The method for preparing an electronic atomization core according to claim 12 is characterized in that the step of forming a heating element on the surface of the porous substrate comprises forming the heating element by a vacuum sputtering coating process, a printing process or a spraying process.
  17. 根据权利要求12所述的电子雾化芯的制备方法，其特征在于，所述在所述多孔基体的表面形成发热件的步骤包括或不包括将形成有发热件的所述多孔基体进行脱脂及烧结。The method for preparing an electronic atomization core according to claim 12 is characterized in that the step of forming a heating element on the surface of the porous substrate includes or does not include degreasing and sintering the porous substrate on which the heating element is formed.
  18. 根据权利要求12所述的电子雾化芯的制备方法，其特征在于，所述在所述发热件的远离所述多孔基体的表面及所述多孔基体的表面的至少部分空余区域形成多孔覆盖膜的步骤包括：The method for preparing an electronic atomizer core according to claim 12 is characterized in that the step of forming a porous covering film on the surface of the heating element away from the porous substrate and at least a portion of the free area on the surface of the porous substrate comprises:
    将用于形成所述多孔覆盖膜的原材料制成浆料；preparing a slurry of raw materials for forming the porous covering film;
    通过流延工艺或干压工艺在所述发热件的远离所述多孔基体的表面及多孔基体的所述表面的至少部分空余区域制成陶瓷膜；以及Forming a ceramic membrane on the surface of the heat generating element away from the porous substrate and at least a portion of the free area of the surface of the porous substrate by a tape casting process or a dry pressing process; and
    通过脱脂及烧结工艺使所述陶瓷膜变为多孔覆盖膜且与所述多孔基体及发热件结合为一体。The ceramic membrane is transformed into a porous covering membrane through degreasing and sintering processes and is integrated with the porous substrate and the heating element.
  19. 一种多孔陶瓷雾化装置，其特征在于，包括用于存储雾化液的储液腔以及电子雾化芯，所述电子雾化芯的部分或全部设置于所述储液腔内，所述电子雾化芯包括多孔基体、发热件及多孔覆盖膜，所述发热件结合于所述多孔基体的部分表面，所述多孔覆盖膜覆盖于所述发热件的表面并与所述多孔基体结合，以使得所述发热件被所述多孔覆盖膜包裹在所述多孔覆盖膜的内侧。A porous ceramic atomization device, characterized in that it includes a liquid storage chamber for storing atomized liquid and an electronic atomization core, wherein part or all of the electronic atomization core is arranged in the liquid storage chamber, and the electronic atomization core includes a porous substrate, a heating element and a porous covering film, wherein the heating element is combined with a part of the surface of the porous substrate, and the porous covering film covers the surface of the heating element and is combined with the porous substrate, so that the heating element is wrapped by the porous covering film on the inner side of the porous covering film.
  20. 根据权利要求19所述的多孔陶瓷雾化装置，其特征在于，所述多孔覆盖膜的厚度比所述发热件的厚度厚1μm-500μm。The porous ceramic atomization device according to claim 19 is characterized in that the thickness of the porous covering film is 1 μm-500 μm thicker than the thickness of the heating element.
PCT/CN2023/070840 2022-11-23 2023-01-06 Porous ceramic atomization device, and atomization core and preparation method therefor WO2024108747A1 (en)

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