WO2024021438A1 - Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus - Google Patents

Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus Download PDF

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Publication number
WO2024021438A1
WO2024021438A1 PCT/CN2022/138334 CN2022138334W WO2024021438A1 WO 2024021438 A1 WO2024021438 A1 WO 2024021438A1 CN 2022138334 W CN2022138334 W CN 2022138334W WO 2024021438 A1 WO2024021438 A1 WO 2024021438A1
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WIPO (PCT)
Prior art keywords
opening
laser
materials
film
foil
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PCT/CN2022/138334
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French (fr)
Chinese (zh)
Inventor
胡宏宇
屈元鹏
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德中（天津）技术发展股份有限公司
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Publication of WO2024021438A1 publication Critical patent/WO2024021438A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Definitions

  • the present invention relates to the technical field of electronic circuit processing, specifically to a method, software and equipment for using laser to manufacture circuit boards made of opening transfer materials.
  • circuit board which is the electrical connection channel between various components and determines their respective electrical parameters and electrical logic relationships.
  • the process of producing circuit boards revolves around making conductive patterns, making metallized holes, making solder mask patterns and surface treatment of welding areas, most of which are completed by indirect wet methods. That is, first deposit an initial conductive layer on the hole wall, and then electroplating copper metal to thicken the conductive layer on the hole wall to the required thickness, so that the copper foil covering both sides of the insulating material passes through the copper metal added to the hole wall. That is, metallized holes achieve electrical connection. After the holes are metallized, the in-process circuit board enters the pattern transfer process. After applying photosensitive film, exposure, and development, the pattern transfer is completed.
  • the copper foil areas and holes that need to be retained in the circuit area are covered with a masking film, and the non-line areas that need to be removed are The copper foil is exposed.
  • the etching liquid sprayed on the surface of the board reacts with the exposed copper foil, causing the metallic copper to dissolve in the etching liquid and be removed from the surface of the board, while the copper in the circuit area and hole wall is masked , remaining on the surface of the insulating board to produce a double-sided circuit board.
  • One feature of the above process is that it requires the use of special chemical solutions such as electroless plating, electroplating, development, etching, and film removal, which imposes a heavy environmental burden; another feature is that it must first be laminated with copper foil on the insulating material, and then undergo pattern transfer and etching.
  • the complex manufacturing process involves removing unnecessary copper foil, which is a material reduction process and an indirect manufacturing process with long process, poor precision, and high material and manufacturing costs.
  • the object of the present invention is to overcome the shortcomings of the existing technology and provide a method, software and equipment for using laser to manufacture circuit boards made of openings and transferred materials.
  • the circuit boards processed by the process do not contain structural wires inside the openings, and the materials pass through them. It has good performance and high precision, effectively reduces costs and improves batch processing efficiency.
  • the method of using laser to manufacture circuit boards made of opening transfer materials of the present invention includes the following steps:
  • the foil and film materials include metal foil, polymer film, paper, etc.; the foil and film materials are divided into a working surface and an adhesive surface, the working surface is smooth, and the adhesive surface is coated with a peelable adhesive. , including pressure-sensitive adhesive; foil and film materials are adhered to the surface of another release film material; before performing step (1), separate the foil and film materials as the masking film from the release material; before performing step (1) In (1), the bonding surface of the foil or film material is bonded to the workpiece to complete lamination.
  • step (1) includes the following implementations: a. directly using insulating materials pre-compounded with masking foil and film materials; b. laminating two or more layers of the same type in steps. Or different types of foil and film materials; c. Foil and film materials composed of two layers of materials.
  • step (1) a direct brushing method is used to apply paint on the surface of the workpiece, and the paint is directly used as a masking film; or step (1) is skipped and the surface of the workpiece is directly used as a masking film.
  • step (3) includes the following embodiments:
  • step (3) an adhesive roller is used to press and adhere, and the foil and film materials cut into isolated pieces and isolated small pieces in the opening are removed.
  • the material to be transferred is distributed to any position on the surface of the masking film, and the material is repeatedly scraped and squeezed in different directions multiple times, and over the entire width of the masking film, so that the material enters the opening of the masking film.
  • the material to be transferred is distributed to any position on the surface of the masking film, and the material is repeatedly scraped and squeezed in different directions multiple times, and over the entire width of the masking film, so that the material enters the opening of the masking film.
  • step (5) includes the following embodiments:
  • transferring materials includes transferring paste-like materials, slurry-like materials, and powder-like materials; and transferring materials with conductive functions, materials with magnetic conductive functions, materials with thermal conductive functions, and materials with light-guiding functions.
  • a software used in a method of using laser to manufacture circuit boards made of openings and transferred materials is a CAM software used for data processing.
  • the CAM software designs or selects the types of foils and films according to the requirements of the materials that need to be transferred and formed.
  • the CAM software is used to design or select a processing path that separates foil and film materials into isolated small pieces within the opening; can design or select The processing path is used to vaporize and remove the foil and film materials line by line and layer by layer in the opening area; finally, the CAM software is used to design or select the processing path to vaporize and remove the workpiece material line by line and layer by layer in the opening area; the operating steps of the CAM software for:
  • the processing path is designed and generated.
  • steps (3), (4) and (5) use CAM software to check the design rules and manufacturing rules on the imported data, generated data, and processing paths, and generate openings for manufacturing and materials for transfer. Perform a visual inspection of the data.
  • An equipment used in a method for manufacturing circuit boards made of opening transfer materials using lasers The processing optical path of the equipment is designed as follows: the laser beam emitted from the laser is distributed and positioned by a dynamically deflected reflector, then enters the focusing mirror, and finally Project to the material being processed; the processing head of the equipment is designed such that while projecting the laser, the processing head inhales air in the area being processed to form a negative pressure environment for exhausting dust and collecting dust.
  • This technology is used to cover the insulating material with a masking film and directly use laser to create the material transfer opening. It replaces the traditional technology of first making a masking plate and then printing. The opening does not contain structural wires and the material has good permeability;
  • the manufacturing process is simple, fast, flexible, environmentally friendly, easy to operate, materials and equipment are easily available, and the cost is low;
  • Figure 1 is a schematic diagram of the original data structure in the CAM software of the present invention
  • Figure 2 is a schematic diagram of the original material application and masking layered structure in the present invention.
  • Figure 3 is a schematic diagram of the completed state of laser drilling of 2*3 panels in the present invention.
  • Figure 4 is a schematic diagram of the laser opening path generation structure in the present invention.
  • Figure 5 is an enlarged view of the detail at point A in Figure 4.
  • Figure 6 is a schematic diagram of a single assembly after laser drilling and opening in the present invention.
  • Figure 7 is a schematic diagram of the state in which the silver paste is leak-printed and solidified and the appearance processing is completed in the present invention.
  • Figure 8 is a top and bottom graphic structure diagram of original data in the present invention.
  • Figure 9 is a schematic diagram of the completed structure of mechanical drilling in the present invention.
  • Figure 10 is a schematic diagram of the completed state of the laser top surface opening in the present invention.
  • Figure 11 is a schematic diagram of the completed state of laser bottom opening in the present invention.
  • Figure 12 is a schematic diagram of the final product of the present invention.
  • PET insulation layer 1 adhesive layer 2; PE masking layer 3; contour processing path 4; internal processing path 5; completed laser drilling 6; shielding film area 7; opening area 8; metalized holes 9; Conductive lines 10; Non-metallized holes 11; Top graphics 12 (60 degree hatching); Bottom graphics 13 (135 degree hatching); Outline lines 14; Completed mechanical drilling 15.
  • the method, software and equipment of the present invention use laser to manufacture circuit boards made of opening transfer materials.
  • the masking film for transferring conductive materials is directly covered on the surface of the insulating material, holes are drilled and the masking film material is removed by laser to create a circuit board without structural wires inside. Transfer the opening, distribute the paste conductive material to one end of the masking film surface in a straight line, and scrape and squeeze the conductive material toward the other end at the same time, so that the conductive material enters the hole and the opening of the masking film to solidify the conductive material.
  • the present invention uses a CAM software for data processing, which can design or select the type and thickness of foil and film according to the requirements of the materials that need to be transferred and formed; and can design or select the path for processing the foil and film materials along the contour line of the opening. ; You can design or choose a processing path that separates foil and film materials into isolated small pieces in the opening; you can design or choose a processing path that vaporizes and removes foil and film materials line by line and layer by layer in the opening area; you can design or choose a processing path that removes foil and film materials by vaporization in the opening area; A processing path that vaporizes and removes workpiece material line by line and layer by layer in the opening area.
  • the equipment of the present invention adopts an optical path design in which the laser beam emitted from the laser is distributed and positioned by a dynamically deflected mirror, then enters the focusing mirror, and is projected to the material to be processed; the laser beam is projected while inhaling air in the area to be processed.
  • the processing head design creates a negative pressure environment for exhaust and dust collection.
  • the specific steps of the present invention are: covering the masking film ⁇ drilling ⁇ direct laser opening ⁇ material transfer ⁇ solidification.
  • Step (1) laminating the masking film, that is, pressing the foil and film materials on the surface of the insulating material.
  • Foil and film materials here include metal foil, polymer film, paper, etc.; foil and film materials are divided into working surface and bonding surface.
  • the working surface surface is smooth, and the bonding surface is coated with peelable adhesive, including pressure-sensitive adhesive; foil , the film material is attached to the surface of another release film material; before performing step (1), first separate the foil and film material as the masking film from the release material; during step (1), use the foil , the bonding surface of the membrane material is attached to the workpiece to complete the lamination.
  • the foil and film materials here also include situations where paint is directly applied to the surface of the workpiece by spraying or brushing, and the paint is directly used as a masking film.
  • foil and film materials here also include foils and film materials of the same or different types that are successively laminated with two or more layers, foils and film materials compounded by two layers of materials, and the use of pre-composited foils and film materials. Insulating materials for masking foil and film materials.
  • Step (2) Drill the insulating material covered with a masking film using machinery or laser to form a transparent hole.
  • the drilling here can be done with a mechanical drill or laser drilling.
  • the method of mechanical drilling is to use the original hole layer data and process it with CircuitCAM software data, such as fine-tuning the size, milling or row milling of large holes or odd-shaped holes, and drilling small holes first and then drilling them. After processing and generating mechanical drilling data, drill holes on the drilling machine.
  • CircuitCAM software data such as fine-tuning the size, milling or row milling of large holes or odd-shaped holes, and drilling small holes first and then drilling them. After processing and generating mechanical drilling data, drill holes on the drilling machine.
  • Laser drilling methods can usually be divided into contour cutting modes, overall punching modes, contour cutting + internal filling of other paths (such as concentric circles, involutes, etc.), and different combination modes of the above three basic modes. Whether it is the three basic modes or the combined mode, all are based on the original drilling size and after making certain size adjustments, select the appropriate drilling mode, automatically generate it with CircuitCAM software, and then use the laser drilling machine to complete the drilling. processing.
  • Step (3) direct laser opening, that is, using the opening processing path generated in the CAM software to drive the equipment to create the opening through laser cutting and removal.
  • the laser opening here, also called laser windowing, simply means to cut and remove the upper masking film without damaging the underlying substrate, or the degree of damage is within an acceptable range.
  • the laser opening may also be some special design requirements. For example, in order to increase the bonding force between the printing paste and the substrate, the underlying substrate needs to be removed to a certain depth to form a groove structure.
  • Laser opening processing usually adopts a processing head design with exhaust, dust collection and negative pressure environment.
  • Step (4) material transfer, first distribute the paste-like conductive material in a straight line to one end of the masking film surface and scrape it, then use the scraper to scrape and squeeze the material to the other end at the same time, so that the material enters the hole and the masking film inside the opening.
  • the material transfer here requires repeated scraping and squeezing of the material in different directions multiple times, and throughout the entire width of the masking film, so that the material enters the holes and openings of the masking film.
  • the adsorption platform can be selectively used, especially for circuit boards with soft materials.
  • Step (5) Curing, light-setting or thermosetting conductive material to form holes and wires for electrical conduction on both sides.
  • the masking film is usually removed, that is, after the masking film on the surface of the original insulating material is removed, the transferred conductive material is subsequently processed. It is also possible that the transferred material is subjected to subsequent processing first, and then the surface of the original insulating material is removed. masking film, or leave the masking film permanently on the workpiece.
  • the materials transferred here may be paste-like materials, slurry-like materials, or powder-like materials in terms of state; in terms of function, they may be electrically conductive materials, magnetically conductive materials, thermally conductive materials, or light-conducting materials. materials, and materials with other functions.
  • a method of using a laser to make a circuit board made of opening transfer materials is a single-sided flexible circuit board.
  • the base material is PET and the thickness is 0.2mm.
  • the materials are not easy to obtain using conventional circuit board factory processes, and the process flow is long.
  • the method of this patent is fast and convenient, and its processing steps are:
  • Step 1 First perform data processing and import the original data into CircuitCAM.
  • the original data is shown in Figure 1.
  • Laser drilling data and laser opening data are generated respectively from the original data.
  • Step 2 Prepare a piece of PET sheet with a size of 200mm*200mm and a thickness of 0.2mm. After the surface is cleaned and dried, apply a low-viscosity PE film of the same size flatly. The total thickness of the PE film (including adhesive layer) is 50 ⁇ m.
  • the application method can use a professional laminating machine, a simple laminating machine, or a manual roller. The Z-direction cross-section diagram of the product after applying the PE film is shown in Figure 2.
  • Step 3 Drill holes, here use laser drilling. Laser the holes that require inserts. The parameters of laser drilling are:
  • wavelength pulse width Spot diameter power frequency Processing speed Processing passes 355nm 20ns 20 ⁇ m 15w 40KHz 200mm/s 15 times
  • Step 4 Direct laser opening. That is, laser is used to remove the masking layer of the conductive structure.
  • the roller bonding method is usually also possible, but the product in this example requires high precision, so the laser is used to remove it point by point and line by line to reduce manual contact.
  • the data of laser opening are calculated by CircuitCAM software, and the calculated data are shown in Figure 4 and Figure 5.
  • the parameters of the laser opening contour are:
  • wavelength pulse width Spot diameter power frequency Processing speed Processing passes 355nm 20ns 20 ⁇ m 15w 40KHz 300mm/s 3 times
  • the parameters of the laser opening internal line are:
  • wavelength pulse width Spot diameter power frequency Processing speed Processing passes 355nm 20ns 20 ⁇ m 20w 40KHz 400mm/s 2 times
  • Step 5 After the laser opening is completed, place the product in progress on the adsorption platform, pour a certain amount of silver paste on the upper end, open the adsorption platform, suck the product flat and fix it well, and use a rubber scraper to remove the silver paste from top to bottom. Whole-board printing, the excess silver paste in the holes during the printing process is automatically sucked into the collection cavity inside the adsorption platform.
  • the silver paste model used in this embodiment is Morita CAPITON-801sa low-temperature silver paste, which is specially used for FPC and has a solid content of 78-85%.
  • Step 6 After the silver paste is printed, in this embodiment, the non-circuit part of the masking film is first removed, and then according to the silver paste curing requirements, first bake at 60°C for 30 minutes, and then bake at 150°C for 1 hour to complete the production of the conductive structure. Then follow the normal processing flow for non-metalized holes and shape processing. The final completed 2*3 panel is shown in Figure 7 (the shape has been milled and not separated).
  • a method of using laser to manufacture a circuit board made of opening transfer materials is a double-sided rigid circuit board.
  • the base material is an epoxy resin board containing glass fiber.
  • the thickness is 3.5mm.
  • the function is a power board of a certain product. The processing The steps are:
  • Step 1 Import the original data into CircuitCAM. After checking the design rules, generate and export the mechanical drilling data. The original data is shown in Figure 8.
  • Step 2 Use a black and white film with a thickness of 60 microns and made of PET as a shielding film, and use a film laminating machine to evenly and flatly press it on the epoxy resin board.
  • the pressure of the laminating machine is 12kg/cm2, the temperature is 70°C, and the laminating speed is 200mm/minute.
  • Film can be applied to both sides at the same time, or the top and bottom surfaces can be applied separately.
  • the film application machine used in this embodiment can fix the upper and lower rolls of the black and white film to the upper and lower film loading rollers of the film application machine respectively, so the film can be applied to the upper and lower surfaces at the same time.
  • Step 3 Drilling.
  • mechanical drilling is used.
  • the equipment model is DM500H of Dezhong Company, and the spindle speed is 100,000 rpm.
  • the schematic diagram of the work-in-progress after drilling is completed is shown in Figure 9.
  • Step 4 Laser top surface opening.
  • the laser opening in this embodiment not only removes the shielding film, but also removes about 30 microns of the epoxy resin base material. Therefore, the opening process in this embodiment is divided into three steps. First, use a laser contour to cut the shielding film, then use a low-viscosity manual roller to adhere the shielding film on the circuit, and finally use a laser with a larger energy density to incise the epoxy resin point by point. Grooving line by line.
  • the parameters of laser processing contour lines are:
  • wavelength pulse width Spot diameter power frequency Processing speed Processing passes 355nm 20ns 20 ⁇ m 15w 40KHz 250mm/s 2 times
  • the parameters of laser trenching are:
  • wavelength pulse width Spot diameter power frequency Processing speed Processing passes 355nm 20ns 20 ⁇ m 20w 40KHz 100mm/s 5 times
  • Step 5 Use the same method as step 4 to complete the laser opening on the bottom surface.
  • the schematic diagram of the bottom surface after laser opening is shown in Figure 10-1.
  • Step 6 Place the product in progress on the adsorption platform with the top side facing up, print conductive silver paste, and suck the excess paste in the holes into the collection cavity in the middle of the adsorption platform. Turn the work-in-progress over with the bottom side facing up, and use the same method to complete the printing and hole filling of the silver paste on the bottom side.
  • the silver paste model used in this embodiment is Dezhong SP220 low-temperature silver paste, with a curing temperature of 220°C and a solid content of 86-90%.
  • Step 7 After the silver paste is printed, in this embodiment, the non-circuit part of the masking film is first removed, and then according to the silver paste curing requirements, first bake at 80°C for 30 minutes, then bake at 150°C for 1 hour, and then bake at 220°C for 1.5 Hours later, the conductive structures on the top and bottom sides are completed, and then the shape is milled according to the normal processing flow.
  • the final schematic diagram of the product is shown in Figure 102.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

Disclosed in the present invention are a method for manufacturing a circuit board by means of transferring material through an opening made by a laser, and software and an apparatus. The method comprises the following steps: (1) coating a mask film: coating a surface of an insulating material with the mask film, which is used for transferring an electrically conductive material; (2) drilling: using a machine or laser to drill into the insulating material coated with the mask film, so as to form a through hole; (3) directly making an opening by means of a laser, that is, using an opening processing path generated in CAM software to drive an apparatus, and by means of laser cutting and removal, manufacturing a transfer opening without structural threads inside; (4) performing material transfer: first, distributing the paste electrically conductive material in the shape of the Chinese character "一" to an end of a surface of the mask film for scraping and printing, and then using a scraper to simultaneously scape and press the material towards the other end, so that the material enters the hole and the opening in the mask film; and (5) performing curing: photocuring or thermocuring the electrically conductive material, so as to form a hole and a wire for two-side electrical conduction. In a circuit board processed by means of the present invention, an opening contains no structural threads therein, and is high in terms of precision, such that the costs can be effectively reduced, and the batch processing efficiency can be improved.

Description

用激光制造开口转移物料制电路板的方法、软件及设备Method, software and equipment for using laser to create circuit boards made of opening transfer materials 技术领域Technical field
本发明涉及电子电路加工技术领域，具体为用激光制造开口转移物料制电路板的方法、软件及设备。The present invention relates to the technical field of electronic circuit processing, specifically to a method, software and equipment for using laser to manufacture circuit boards made of opening transfer materials.
背景技术Background technique
当今世界，电子产品无所不在。电子产品最重要的部件之一就是电路板，它是各个元器件之间的电气连接通道，决定着各自的电气参数和电气逻辑关系。In today’s world, electronic products are everywhere. One of the most important components of electronic products is the circuit board, which is the electrical connection channel between various components and determines their respective electrical parameters and electrical logic relationships.
目前，生产电路板的过程围绕制导电图案、制金属化孔、制阻焊图案及对焊接区进行表面处理，大都采用间接的湿法完成。即先往孔壁上沉积初始导电层，再电镀用铜金属加厚孔壁导电层至需要的厚度，从而，使覆合在绝缘材料两面的铜箔，通过加在孔壁上的铜金属，即金属化孔实现电气连通。孔金属化后的在制电路板，进入图形转移工序，经过贴光敏膜、曝光、显影完成图形转移，将线路区需要保留的铜箔区域和孔用掩蔽膜遮挡，将非线路区域需要去除的铜箔裸露出来。在蚀刻工序，喷射到在制板表面上的蚀刻液与裸露的铜箔发生反应，使金属铜溶解在蚀刻液中被从在制板表面去除，而线路区和孔壁上的铜由于被掩蔽，留在了绝缘板表面，制得双面电路板。At present, the process of producing circuit boards revolves around making conductive patterns, making metallized holes, making solder mask patterns and surface treatment of welding areas, most of which are completed by indirect wet methods. That is, first deposit an initial conductive layer on the hole wall, and then electroplating copper metal to thicken the conductive layer on the hole wall to the required thickness, so that the copper foil covering both sides of the insulating material passes through the copper metal added to the hole wall. That is, metallized holes achieve electrical connection. After the holes are metallized, the in-process circuit board enters the pattern transfer process. After applying photosensitive film, exposure, and development, the pattern transfer is completed. The copper foil areas and holes that need to be retained in the circuit area are covered with a masking film, and the non-line areas that need to be removed are The copper foil is exposed. In the etching process, the etching liquid sprayed on the surface of the board reacts with the exposed copper foil, causing the metallic copper to dissolve in the etching liquid and be removed from the surface of the board, while the copper in the circuit area and hole wall is masked , remaining on the surface of the insulating board to produce a double-sided circuit board.
上述过程的一个特点是要使用化学镀、电镀、显影、蚀刻、去膜等专用的化学药液，环境负担大；另外一个特点是要先在绝缘材料上覆合铜箔，经过图形转移、蚀刻等等复杂的制造过程将不需要的铜箔去除，是个减材的过程，也是个间接制造过程，流程长、精度差、材料和制造成本高。One feature of the above process is that it requires the use of special chemical solutions such as electroless plating, electroplating, development, etching, and film removal, which imposes a heavy environmental burden; another feature is that it must first be laminated with copper foil on the insulating material, and then undergo pattern transfer and etching. The complex manufacturing process involves removing unnecessary copper foil, which is a material reduction process and an indirect manufacturing process with long process, poor precision, and high material and manufacturing costs.
上述传统技术的不足，促使本发明致力于一种直接用激光制造开口转移物料的方法、软件和设备，用物理手段完成孔金属化、制出线路，解决间接制造中的减材方法步骤多、中间过程浪费资源问题，也解决湿法制造环境负担大的问题。The above-mentioned shortcomings of traditional technology prompted the present invention to devote itself to a method, software and equipment for directly using laser to create openings to transfer materials, using physical means to complete hole metallization and production of circuits, and to solve the problem of many steps of material reduction methods in indirect manufacturing. The problem of waste of resources in the intermediate process also solves the problem of high environmental burden of wet manufacturing.
发明内容Contents of the invention
本发明的目的在于克服现有技术的不足之处，提供一种用激光制造开口转移物料制电路板的方法、软件及设备，其加工出的电路板，开口内部不含结构丝，物料透过性好，且精度高，有效降低成本并提高批量加工效率。The object of the present invention is to overcome the shortcomings of the existing technology and provide a method, software and equipment for using laser to manufacture circuit boards made of openings and transferred materials. The circuit boards processed by the process do not contain structural wires inside the openings, and the materials pass through them. It has good performance and high precision, effectively reduces costs and improves batch processing efficiency.
本发明的用激光制造开口转移物料制电路板的方法，包括以下步骤：The method of using laser to manufacture circuit boards made of opening transfer materials of the present invention includes the following steps:
(1)覆合掩蔽膜，将转移导电材料用的掩蔽膜覆合在绝缘材料表面上，即将箔、膜材料 压合在绝缘材料表面上；(1) Covering the masking film, covering the masking film used to transfer the conductive material on the surface of the insulating material, that is, laminating the foil and film materials on the surface of the insulating material;
(2)钻孔，用机械或激光钻覆有掩蔽膜的绝缘材料，形成通透的孔；(2) Drilling, using machinery or laser to drill the insulating material covered with a masking film to form a transparent hole;
(3)直接激光开口，即用在CAM软件中生成的开口加工路径驱动设备，通过激光切割、去除的手段，制造内部不含结构丝的转移开口；(3) Direct laser opening, that is, using the opening processing path generated in the CAM software to drive the equipment, and using laser cutting and removal to create a transfer opening that does not contain structural wires inside;
(4)物料转移，先将膏状导电材料呈一字型分配到掩蔽膜表面的一端刮印，再用刮板同时向另一端刮动和挤压物料，使物料进入孔和掩蔽膜的开口内；(4) Material transfer, first distribute the paste-like conductive material in a straight line to one end of the masking film surface and scrape it, then use the scraper to scrape and squeeze the material to the other end at the same time, so that the material enters the hole and the opening of the masking film Inside;
(5)固化，光固或热固导电材料，形成两面电气导通的孔和导线。(5) Curing, photosetting or thermosetting conductive material to form holes and wires for electrical conduction on both sides.
优选的，步骤(1)中，箔、膜材料包括金属箔、高分子薄膜、纸等；箔、膜材料分工作面和粘接面，工作面表面光滑，粘接面涂覆有可剥离胶粘剂，包括压敏胶粘剂；箔、膜材料贴合在另一种离型膜材料表面；在进行步骤(1)前，先将作为掩蔽膜的箔、膜材料与离型材料分离开；在进行步骤(1)中，用箔、膜材料的粘接面与工件贴合，完成覆合。Preferably, in step (1), the foil and film materials include metal foil, polymer film, paper, etc.; the foil and film materials are divided into a working surface and an adhesive surface, the working surface is smooth, and the adhesive surface is coated with a peelable adhesive. , including pressure-sensitive adhesive; foil and film materials are adhered to the surface of another release film material; before performing step (1), separate the foil and film materials as the masking film from the release material; before performing step (1) In (1), the bonding surface of the foil or film material is bonded to the workpiece to complete lamination.
优选的，步骤(1)中，包括以下几种实施方式：a、直接使用预先复合有掩蔽用箔、膜材料的绝缘材料；b、分步骤先后覆合两层或两层以上的同品种的或不同品种的箔、膜材料；c、覆合两层材料复合的箔、膜材料。Preferably, step (1) includes the following implementations: a. directly using insulating materials pre-compounded with masking foil and film materials; b. laminating two or more layers of the same type in steps. Or different types of foil and film materials; c. Foil and film materials composed of two layers of materials.
优选的，步骤(1)中，采用直接、刷涂方法在工件表面涂覆涂料，直接使用涂料作为掩蔽膜；或跳过步骤(1)直接以工件表面作为掩蔽膜。Preferably, in step (1), a direct brushing method is used to apply paint on the surface of the workpiece, and the paint is directly used as a masking film; or step (1) is skipped and the surface of the workpiece is directly used as a masking film.
优选的，步骤(3)中，包括以下几种实施方式：Preferably, step (3) includes the following embodiments:
a.包括用激光束只沿开口的轮廓线切割透掩蔽膜直至工件表面，再成块剥离去掉开口内的孤立的掩蔽膜块，形成以原绝缘材料表面为底面的开口；a. Including using a laser beam to cut the transparent masking film only along the contour line of the opening to the surface of the workpiece, and then peeling off the isolated masking film blocks in the opening to form an opening with the original insulating material surface as the bottom surface;
b.包括用激光束沿开口的轮廓线、开口内分小块用的切割线切割透掩蔽膜直至工件表面，再成小块剥离去掉开口内的孤立的掩蔽膜块，形成以原绝缘材料表面为底面的开口；b. Including using a laser beam to cut the transparent masking film along the contour line of the opening and the cutting lines in the opening into small pieces until the surface of the workpiece, and then peeling off the isolated masking film blocks in the opening into small pieces to form the surface of the original insulating material. is the opening on the bottom surface;
c.包括用激光束逐线，逐层汽化去除开口区域内所有的掩蔽膜，直至工件表面，形成以工件材料表面为底面的开口；c. Including using a laser beam to vaporize and remove all the masking films in the opening area line by line, layer by layer, until the surface of the workpiece, forming an opening with the surface of the workpiece material as the bottom surface;
d.包括用激光束逐点、逐线、逐层汽化去除开口区域内所有的掩蔽膜，并在开口区域用激光束逐点、逐线、逐层汽化去除原绝缘材料，形成包括嵌入原绝缘材料一定深度的凹槽的开口；d. Including using a laser beam to vaporize and remove all the masking films in the opening area point by point, line by line, and layer by layer, and using a laser beam to vaporize and remove the original insulation material in the opening area point by point, line by line, and layer by layer, forming a process including embedding the original insulation. An opening in a groove of a certain depth in a material;
e.包括用激光束逐点、逐线、逐层汽化去除开口区域去除原掩蔽膜，形成嵌入原绝缘材料一定深度的凹槽的开口。e. Including using a laser beam to vaporize the opening area point by point, line by line, and layer by layer to remove the original masking film and form an opening embedded in a groove of a certain depth in the original insulating material.
优选的，步骤(3)中，采用粘辊压粘，揭除开口内被切割成孤立块、孤立小块的箔、膜材料。Preferably, in step (3), an adhesive roller is used to press and adhere, and the foil and film materials cut into isolated pieces and isolated small pieces in the opening are removed.
优选的，步骤(4)中，将需要转移的物料分配到掩蔽膜表面的任何位置，多次沿不同方向反复刮动和挤压物料，并遍及掩蔽膜全幅面，使物料进入掩蔽膜的开口内。Preferably, in step (4), the material to be transferred is distributed to any position on the surface of the masking film, and the material is repeatedly scraped and squeezed in different directions multiple times, and over the entire width of the masking film, so that the material enters the opening of the masking film. Inside.
优选的，步骤(5)中，包括以下几种实施方式：Preferably, step (5) includes the following embodiments:
a.包括去除掩蔽膜，即揭掉原绝缘材料表面的掩蔽膜后，再对转移的导电材料进行后续处理；a. Including removal of the masking film, that is, after removing the masking film on the surface of the original insulating material, the transferred conductive material is subsequently processed;
b.包括先对转移的材料进行后续处理，再揭掉原绝缘材料表面的掩蔽膜；b. Including first performing subsequent processing on the transferred material, and then removing the masking film on the surface of the original insulating material;
c.包括将掩蔽膜保留在工件上。c. Including leaving the masking film on the workpiece.
优选的，转移物料包括转移膏状的物料、浆态的物料、粉末状态的物料；以及转移有导电功能的物料、导磁功能的物料、导热功能的物料、导光功能的物料。Preferably, transferring materials includes transferring paste-like materials, slurry-like materials, and powder-like materials; and transferring materials with conductive functions, materials with magnetic conductive functions, materials with thermal conductive functions, and materials with light-guiding functions.
一种用激光制造开口转移物料制电路板的方法中采用的软件，该软件为一种用于数据处理的CAM软件，该CAM软件根据需要转移和成型的物料要求设计或选择箔、膜的品种和厚度；并设计或选择沿开口的轮廓线对箔、膜材料加工的路径；该CAM软件用于设计或选择在开口内将箔、膜材料分隔成孤立小块的加工路径；可以设计或选择在开口区域内逐线，逐层汽化去除箔、膜材料的加工路径；最后CAM软件用于设计或选择在开口区域内逐线，逐层汽化去除工件材料的加工路径；该CAM软件的操作步骤为：A software used in a method of using laser to manufacture circuit boards made of openings and transferred materials. The software is a CAM software used for data processing. The CAM software designs or selects the types of foils and films according to the requirements of the materials that need to be transferred and formed. and thickness; and design or select a processing path for foil and film materials along the contour line of the opening; the CAM software is used to design or select a processing path that separates foil and film materials into isolated small pieces within the opening; can design or select The processing path is used to vaporize and remove the foil and film materials line by line and layer by layer in the opening area; finally, the CAM software is used to design or select the processing path to vaporize and remove the workpiece material line by line and layer by layer in the opening area; the operating steps of the CAM software for:
(1)导入设备参数，导入设计要求和图案数据，根据设计要求或需要转移、成型的图案厚度，选择箔、膜的材质和厚度；(1) Import equipment parameters, import design requirements and pattern data, and select the material and thickness of foil and film according to the design requirements or the thickness of the pattern that needs to be transferred and formed;
(2)根据设备参数中的光束直径、加工头加工范围及其接续的参数，根据设计要求或需要转移、成型的图案厚度，设计和生成加工路径。(2) According to the beam diameter, processing range of the processing head and its subsequent parameters in the equipment parameters, and according to the design requirements or the thickness of the pattern that needs to be transferred and formed, the processing path is designed and generated.
优选的，步骤(3)、(4)及(5)中，用CAM软件对导入的数据，生成的数据、加工路径进行设计规则、制造规则检查，并生成对制造的开口和对转移的物料进行视觉检查数据。Preferably, in steps (3), (4) and (5), use CAM software to check the design rules and manufacturing rules on the imported data, generated data, and processing paths, and generate openings for manufacturing and materials for transfer. Perform a visual inspection of the data.
一种用激光制造开口转移物料制电路板的方法中采用的设备，该设备的加工光路设计为：从激光器中发射出的激光光束经动态偏转的反射镜分配和定位，再进入聚焦镜，最后投射向被加工材料；设备的加工头设计为：该加工头边投照激光边在被加工区域吸气形成抽风集尘负压环境。An equipment used in a method for manufacturing circuit boards made of opening transfer materials using lasers. The processing optical path of the equipment is designed as follows: the laser beam emitted from the laser is distributed and positioned by a dynamically deflected reflector, then enters the focusing mirror, and finally Project to the material being processed; the processing head of the equipment is designed such that while projecting the laser, the processing head inhales air in the area being processed to form a negative pressure environment for exhausting dust and collecting dust.
本发明的用激光制造开口转移物料制电路板的方法、软件及设备，其优点和技术效果主要包括以下几点：The advantages and technical effects of the method, software and equipment for using laser to manufacture circuit boards made of opening transfer materials according to the present invention mainly include the following points:
1、用在绝缘材料上覆合掩蔽膜，直接用激光制造物料转移开口的技术，替代传统技术先制造漏印版，再漏印的方法，开口内部不含结构丝，物料透过性好；1. This technology is used to cover the insulating material with a masking film and directly use laser to create the material transfer opening. It replaces the traditional technology of first making a masking plate and then printing. The opening does not contain structural wires and the material has good permeability;
2、开口精度、质量高；2. Opening precision and high quality;
3、制造的流程简单、快捷、柔性大，环境友好，操作容易，材料、设备易得，成本低；3. The manufacturing process is simple, fast, flexible, environmentally friendly, easy to operate, materials and equipment are easily available, and the cost is low;
4、直接在绝缘材料表面上刮印，不需要专门的漏印设备，物料转移、印刷的精度更高，生产方便易行。4. Scratch printing directly on the surface of insulating materials without the need for special printing equipment. The accuracy of material transfer and printing is higher, and production is convenient and easy.
附图说明Description of drawings
图1为本发明中CAM软件中的原始数据结构示意图；Figure 1 is a schematic diagram of the original data structure in the CAM software of the present invention;
图2为本发明中原始材料贴敷掩蔽层状结构示意图；Figure 2 is a schematic diagram of the original material application and masking layered structure in the present invention;
图3为本发明中2*3拼板激光打孔完成状态示意图；Figure 3 is a schematic diagram of the completed state of laser drilling of 2*3 panels in the present invention;
图4为本发明中激光开口路径生成结构示意图；Figure 4 is a schematic diagram of the laser opening path generation structure in the present invention;
图5为图4中A处的细节放大图；Figure 5 is an enlarged view of the detail at point A in Figure 4;
图6为本发明中激光打孔和开口后的单拼示意图；Figure 6 is a schematic diagram of a single assembly after laser drilling and opening in the present invention;
图7为本发明中银浆漏印固化且外形加工完成状态示意图；Figure 7 is a schematic diagram of the state in which the silver paste is leak-printed and solidified and the appearance processing is completed in the present invention;
图8为本发明中原始数据的顶底面图形结构图；Figure 8 is a top and bottom graphic structure diagram of original data in the present invention;
图9为本发明中机械钻孔完成结构示意图；Figure 9 is a schematic diagram of the completed structure of mechanical drilling in the present invention;
图10为本发明中激光顶面开口完成状态示意图；Figure 10 is a schematic diagram of the completed state of the laser top surface opening in the present invention;
图11为本发明中激光底面开口完成状态示意图；Figure 11 is a schematic diagram of the completed state of laser bottom opening in the present invention;
图12为本发明的最终完成品示意图。Figure 12 is a schematic diagram of the final product of the present invention.
具体实施方式Detailed ways
为能进一步了解本发明的内容、特点及功效，兹例举以下实施例，并配合附图详细说明如下。需要说明的是，本实施例是描述性的，不是限定性的，不能由此限定本发明的保护范围。In order to further understand the content, characteristics and effects of the present invention, the following examples are given and described in detail below with reference to the accompanying drawings. It should be noted that this embodiment is descriptive and not restrictive, and the scope of protection of the present invention cannot be limited thereby.
附图中：PET绝缘层1；胶黏剂层2；PE掩蔽层3；轮廓加工路径4；内部加工路径5；已完成的激光打孔6；屏蔽膜区域7；开口区域8；金属化孔9；导电线路10；非金属化孔11；顶面图形12(60度阴影线)；底面图形13(135度阴影线)；外形线14；已完成的机械钻孔15。In the figure: PET insulation layer 1; adhesive layer 2; PE masking layer 3; contour processing path 4; internal processing path 5; completed laser drilling 6; shielding film area 7; opening area 8; metalized holes 9; Conductive lines 10; Non-metallized holes 11; Top graphics 12 (60 degree hatching); Bottom graphics 13 (135 degree hatching); Outline lines 14; Completed mechanical drilling 15.
本发明用激光制造开口转移物料制电路板的方法、软件和设备，直接把转移导电材料用的掩蔽膜覆合在绝缘材料表面上，钻孔并用激光去除掩蔽膜材料制造内部不含结构丝的转移开口，将膏状导电材料一字型分配到掩蔽膜表面的一端，同时向另一端刮动和挤压导电材料，使导电物料进入孔和掩蔽膜的开口内，固化导电材料。The method, software and equipment of the present invention use laser to manufacture circuit boards made of opening transfer materials. The masking film for transferring conductive materials is directly covered on the surface of the insulating material, holes are drilled and the masking film material is removed by laser to create a circuit board without structural wires inside. Transfer the opening, distribute the paste conductive material to one end of the masking film surface in a straight line, and scrape and squeeze the conductive material toward the other end at the same time, so that the conductive material enters the hole and the opening of the masking film to solidify the conductive material.
本发明使用一种用于数据处理的CAM软件，可以根据需要转移和成型的物料要求设计或选择箔、膜的品种和厚度；可以设计或选择沿开口的轮廓线对箔、膜材料加工的路径；可 以设计或选择在开口内将箔、膜材料分隔成孤立小块的加工路径；可以设计或选择在开口区域内逐线，逐层汽化去除箔、膜材料的加工路径；可以设计或选择在开口区域内逐线，逐层汽化去除工件材料的加工路径。The present invention uses a CAM software for data processing, which can design or select the type and thickness of foil and film according to the requirements of the materials that need to be transferred and formed; and can design or select the path for processing the foil and film materials along the contour line of the opening. ; You can design or choose a processing path that separates foil and film materials into isolated small pieces in the opening; you can design or choose a processing path that vaporizes and removes foil and film materials line by line and layer by layer in the opening area; you can design or choose a processing path that removes foil and film materials by vaporization in the opening area; A processing path that vaporizes and removes workpiece material line by line and layer by layer in the opening area.
本发明的设备采用从激光器中发射出的激光光束经动态偏转的反射镜分配和定位，再进入聚焦镜，再投射向被加工材料的光路设计；采用边投照激光边在被加工区域吸气形成抽风集尘负压环境的加工头设计。The equipment of the present invention adopts an optical path design in which the laser beam emitted from the laser is distributed and positioned by a dynamically deflected mirror, then enters the focusing mirror, and is projected to the material to be processed; the laser beam is projected while inhaling air in the area to be processed. The processing head design creates a negative pressure environment for exhaust and dust collection.
本发明具体步骤为：覆合掩蔽膜→钻孔→直接激光开口→物料转移→固化。The specific steps of the present invention are: covering the masking film → drilling → direct laser opening → material transfer → solidification.
步骤(1)，覆合掩蔽膜，即将箔、膜材料压合在绝缘材料表面上。Step (1), laminating the masking film, that is, pressing the foil and film materials on the surface of the insulating material.
这里的箔、膜材料包括金属箔、高分子薄膜、纸等；箔、膜材料分工作面和粘接面，工作面表面光滑，粘接面涂覆有可剥离胶粘剂，包括压敏胶粘剂；箔、膜材料贴合在另一种离型膜材料表面；在进行步骤(1)前，先将作为掩蔽膜的箔、膜材料与离型材料分离开；在进行步骤(1)中，用箔、膜材料的粘接面与工件贴合，完成覆合。Foil and film materials here include metal foil, polymer film, paper, etc.; foil and film materials are divided into working surface and bonding surface. The working surface surface is smooth, and the bonding surface is coated with peelable adhesive, including pressure-sensitive adhesive; foil , the film material is attached to the surface of another release film material; before performing step (1), first separate the foil and film material as the masking film from the release material; during step (1), use the foil , the bonding surface of the membrane material is attached to the workpiece to complete the lamination.
这里的箔、膜材料也包括直接用喷涂、刷涂方法在工件表面涂覆涂料，直接使用涂料作为掩蔽膜的场景。The foil and film materials here also include situations where paint is directly applied to the surface of the workpiece by spraying or brushing, and the paint is directly used as a masking film.
还有，这里的箔、膜材料也包括先后覆合两层或两层以上的同品种的或不同品种的箔、膜材料、两层材料复合而成的箔、膜材料，以及使用预先复合有掩蔽用箔、膜材料的绝缘材料。In addition, the foil and film materials here also include foils and film materials of the same or different types that are successively laminated with two or more layers, foils and film materials compounded by two layers of materials, and the use of pre-composited foils and film materials. Insulating materials for masking foil and film materials.
步骤(2)，钻孔，用机械或激光钻覆有掩蔽膜的绝缘材料，形成通透的孔。Step (2): Drill the insulating material covered with a masking film using machinery or laser to form a transparent hole.
这里的钻孔，可以用机械钻机的方法，也可以用激光钻孔。The drilling here can be done with a mechanical drill or laser drilling.
机械钻机的方法，就是利用原始的孔层数据，经CircuitCAM软件数据处理，比如尺寸的微调、比如大孔或异性孔的用铣或排孔铣、比如小孔先打定位窝再钻孔，全部处理生成机械钻孔数据后上钻机打孔。The method of mechanical drilling is to use the original hole layer data and process it with CircuitCAM software data, such as fine-tuning the size, milling or row milling of large holes or odd-shaped holes, and drilling small holes first and then drilling them. After processing and generating mechanical drilling data, drill holes on the drilling machine.
激光钻孔的方法，通常可以分为轮廓削的模式、整体冲的模式、轮廓削+内部填充其它路径(比如同心圆，渐开线等)，以及上述三种基本模式的不同组合模式。无论是三种基本模式还是组合模式，都是根据原有的钻孔尺寸，并进行一定的尺寸调整后，选择合适的钻孔模式，用CircuitCAM软件自动生成，然后上激光钻孔机完成钻孔加工。Laser drilling methods can usually be divided into contour cutting modes, overall punching modes, contour cutting + internal filling of other paths (such as concentric circles, involutes, etc.), and different combination modes of the above three basic modes. Whether it is the three basic modes or the combined mode, all are based on the original drilling size and after making certain size adjustments, select the appropriate drilling mode, automatically generate it with CircuitCAM software, and then use the laser drilling machine to complete the drilling. processing.
步骤(3)，直接激光开口，即用在CAM软件中生成的开口加工路径驱动设备，通过激光切割、去除的手段，制造开口。Step (3), direct laser opening, that is, using the opening processing path generated in the CAM software to drive the equipment to create the opening through laser cutting and removal.
这里的激光开口，也称作激光开窗，简单说就是把上层的掩蔽膜切开去除同时不损伤下层基材，或损伤的程度在可接受的范围内。也有可能某些特殊设计需求，比如为增加印膏和 基材的结合力，下层的基材需要去除一定深度，形成凹槽结构。The laser opening here, also called laser windowing, simply means to cut and remove the upper masking film without damaging the underlying substrate, or the degree of damage is within an acceptable range. There may also be some special design requirements. For example, in order to increase the bonding force between the printing paste and the substrate, the underlying substrate needs to be removed to a certain depth to form a groove structure.
去除掩蔽膜的方法有多种，比如先把轮廓分开，然后再手工，或粘棍粘接，或激光分割成小块剥离，或激光逐点逐线扫描去除。There are many ways to remove the masking film, such as separating the outline first and then manually, or bonding with a stick, or laser cutting into small pieces and peeling off, or laser scanning and removing point by point and line by line.
激光开口加工通常采用抽风集尘负压环境的加工头设计Laser opening processing usually adopts a processing head design with exhaust, dust collection and negative pressure environment.
步骤(4)，物料转移，先将膏状导电材料呈一字型分配到掩蔽膜表面的一端刮印，再用刮板同时向另一端刮动和挤压物料，使物料进入孔和掩蔽膜的开口内。Step (4), material transfer, first distribute the paste-like conductive material in a straight line to one end of the masking film surface and scrape it, then use the scraper to scrape and squeeze the material to the other end at the same time, so that the material enters the hole and the masking film inside the opening.
这里的物料转移，需要多次沿不同方向反复刮动和挤压物料，并遍及掩蔽膜全幅面，使物料进入孔内和掩蔽膜的开口内。The material transfer here requires repeated scraping and squeezing of the material in different directions multiple times, and throughout the entire width of the masking film, so that the material enters the holes and openings of the masking film.
转移的过程，可以选择性地使用吸附平台，尤其是材质柔软的电路板。During the transfer process, the adsorption platform can be selectively used, especially for circuit boards with soft materials.
步骤(5)，固化，光固或热固导电材料，形成两面电气导通的孔和导线。Step (5): Curing, light-setting or thermosetting conductive material to form holes and wires for electrical conduction on both sides.
物料转移后，通常是去除掩蔽膜，即揭掉原绝缘材料表面的掩蔽膜后，再对转移的导电材料进行后续处理，也有可能先对转移的材料进行后续处理，再揭掉原绝缘材料表面的掩蔽膜，或者将掩蔽膜永久地保留在工件上。After the material is transferred, the masking film is usually removed, that is, after the masking film on the surface of the original insulating material is removed, the transferred conductive material is subsequently processed. It is also possible that the transferred material is subjected to subsequent processing first, and then the surface of the original insulating material is removed. masking film, or leave the masking film permanently on the workpiece.
这里转移的物料从状态而言可能是膏状的物料、浆态的物料、粉末状态的物料；从功能而言可能导电功能的物料、导磁功能的物料、导热功能的物料、导光功能的物料，以及具有其它功能的物料。The materials transferred here may be paste-like materials, slurry-like materials, or powder-like materials in terms of state; in terms of function, they may be electrically conductive materials, magnetically conductive materials, thermally conductive materials, or light-conducting materials. materials, and materials with other functions.
为了更清楚地描述本发明的具体实施方式，下面提供几种实施例：In order to describe the specific implementation of the present invention more clearly, several examples are provided below:
实施例1：Example 1:
用激光制造开口转移物料制电路板的方法，本实施例为单面挠性电路板，其基材为PET，厚度0.2mm，采用常规的电路板厂工艺材料不易获得，且工艺流程长，用本专利的方法，快捷方便，其加工步骤为：A method of using a laser to make a circuit board made of opening transfer materials. This embodiment is a single-sided flexible circuit board. The base material is PET and the thickness is 0.2mm. The materials are not easy to obtain using conventional circuit board factory processes, and the process flow is long. The method of this patent is fast and convenient, and its processing steps are:
步骤一，首先进行数据处理，把原始数据导入到CircuitCAM中。原始数据如图1所示。由原始数据分别生成激光钻孔数据和激光开口数据。Step 1: First perform data processing and import the original data into CircuitCAM. The original data is shown in Figure 1. Laser drilling data and laser opening data are generated respectively from the original data.
步骤二，准备一块尺寸为200mm*200mm厚度为0.2mm的PET片料，表面清理干净并干燥后，平整贴敷同样尺寸的低粘度PE膜，PE膜(含胶黏层)的总厚度为50μm，贴敷的方法可以用专业的贴膜机，也可以用简易的覆膜机，或者手动滚轮。贴敷PE膜后的在制品Z向截面示意图如图2所示。Step 2: Prepare a piece of PET sheet with a size of 200mm*200mm and a thickness of 0.2mm. After the surface is cleaned and dried, apply a low-viscosity PE film of the same size flatly. The total thickness of the PE film (including adhesive layer) is 50μm. , the application method can use a professional laminating machine, a simple laminating machine, or a manual roller. The Z-direction cross-section diagram of the product after applying the PE film is shown in Figure 2.
步骤三，钻孔，这里用激光钻孔。对需要插件的孔进行激光加工。激光钻孔的参数为：Step 3: Drill holes, here use laser drilling. Laser the holes that require inserts. The parameters of laser drilling are:
波长wavelength 脉宽pulse width 光斑直径Spot diameter 功率power 频率frequency 加工速度Processing speed 加工遍数Processing passes
355nm355nm 20ns20ns 20μm20μm 15w15w 40KHz40KHz 200mm/s200mm/s 15遍15 times
因为本实例加工的是2*3的6拼板，所以拼板打孔后的图形如图3所示。Because this example is processing a 2*3 6-piece panel, the pattern after punching the holes is shown in Figure 3.
步骤四，直接激光开口。也就是用激光的手段把导电结构部分的掩蔽层去除。这里采用先切开外轮廓，再逐点逐线去除内部填充的掩蔽层。用滚轮粘接的方法通常也可以，但本实例的产品精度要求较高，所以用激光逐点逐线全部去除，减少人工接触。Step 4: Direct laser opening. That is, laser is used to remove the masking layer of the conductive structure. Here, we first cut the outer contour, and then remove the internal filling masking layer point by point and line by line. The roller bonding method is usually also possible, but the product in this example requires high precision, so the laser is used to remove it point by point and line by line to reduce manual contact.
激光开口的数据由CircuitCAM软件计算得出，计算出的数据如图4和图5所示。The data of laser opening are calculated by CircuitCAM software, and the calculated data are shown in Figure 4 and Figure 5.
激光开口后的在制品如图6所示。The WIP after laser opening is shown in Figure 6.
激光开口轮廓线的参数为：The parameters of the laser opening contour are:
波长wavelength 脉宽pulse width 光斑直径Spot diameter 功率power 频率frequency 加工速度Processing speed 加工遍数Processing passes
355nm355nm 20ns20ns 20μm20μm 15w15w 40KHz40KHz 300mm/s300mm/s 3遍3 times
激光开口内部线的参数为：The parameters of the laser opening internal line are:
波长wavelength 脉宽pulse width 光斑直径Spot diameter 功率power 频率frequency 加工速度Processing speed 加工遍数Processing passes
355nm355nm 20ns20ns 20μm20μm 20w20w 40KHz40KHz 400mm/s400mm/s 2遍2 times
步骤五，激光开口完成后，将在制品放置在吸附平台上，在上端倒上一定量的银浆，开启吸附平台，将产品吸平并固定良好，用橡胶刮板把银浆从上到下整板印刷，印刷过程孔内多余的银浆自动被吸到吸附平台内部的收集腔内。Step 5: After the laser opening is completed, place the product in progress on the adsorption platform, pour a certain amount of silver paste on the upper end, open the adsorption platform, suck the product flat and fix it well, and use a rubber scraper to remove the silver paste from top to bottom. Whole-board printing, the excess silver paste in the holes during the printing process is automatically sucked into the collection cavity inside the adsorption platform.
本实施例所用的银浆型号为盛田CAPITON-801sa低温银浆，FPC专用，固含量78-85％。The silver paste model used in this embodiment is Morita CAPITON-801sa low-temperature silver paste, which is specially used for FPC and has a solid content of 78-85%.
步骤六，银浆印刷后，本实施例先去除掩蔽膜的非线路部分，然后按照银浆固化的要求，先60℃烘烤30分钟，然后150℃烘烤1小时，完成导电结构的制作，然后按照正常加工流程进行非金属化孔和外形加工。最终完成的2*3拼板如图7所示(外形已铣开，未分离)。Step 6: After the silver paste is printed, in this embodiment, the non-circuit part of the masking film is first removed, and then according to the silver paste curing requirements, first bake at 60°C for 30 minutes, and then bake at 150°C for 1 hour to complete the production of the conductive structure. Then follow the normal processing flow for non-metalized holes and shape processing. The final completed 2*3 panel is shown in Figure 7 (the shape has been milled and not separated).
实施例2Example 2
用激光制造开口转移物料制电路板的方法，本实施例为双面刚性电路板，其基材为含玻纤的环氧树脂板，厚度3.5mm，功能为某种产品的电源板，其加工步骤为：A method of using laser to manufacture a circuit board made of opening transfer materials. This embodiment is a double-sided rigid circuit board. The base material is an epoxy resin board containing glass fiber. The thickness is 3.5mm. The function is a power board of a certain product. The processing The steps are:
步骤一，把原始数据导入到CircuitCAM中，设计规则检查后，生成并导出机械钻孔加工数据。原始数据如图8所示。Step 1: Import the original data into CircuitCAM. After checking the design rules, generate and export the mechanical drilling data. The original data is shown in Figure 8.
步骤二，用厚度为60微米、PET材质的黑白膜作为屏蔽膜，用贴膜机均匀平整贴压在环氧树脂板上。贴膜机的压力为12kg/cm2，温度70℃，贴膜速度200mm/分钟。可以两面同时贴膜，也可以分别贴顶面和底面，本实施例用的贴膜机可以把黑白膜的上下卷分别固定到贴膜机的上下装膜滚轴上，所以上下面同时贴膜。Step 2: Use a black and white film with a thickness of 60 microns and made of PET as a shielding film, and use a film laminating machine to evenly and flatly press it on the epoxy resin board. The pressure of the laminating machine is 12kg/cm2, the temperature is 70℃, and the laminating speed is 200mm/minute. Film can be applied to both sides at the same time, or the top and bottom surfaces can be applied separately. The film application machine used in this embodiment can fix the upper and lower rolls of the black and white film to the upper and lower film loading rollers of the film application machine respectively, so the film can be applied to the upper and lower surfaces at the same time.
步骤三，钻孔，本实施例用机械钻孔，设备型号为德中公司的DM500H，主轴转速10万转。钻孔完成后的在制品示意图如图9所示。Step 3: Drilling. In this embodiment, mechanical drilling is used. The equipment model is DM500H of Dezhong Company, and the spindle speed is 100,000 rpm. The schematic diagram of the work-in-progress after drilling is completed is shown in Figure 9.
步骤四，激光顶面开口，为保证漏印线路的厚度，以及和基材的结合力，本实施例的激光开口不仅仅把屏蔽膜去除，同时还把环氧树脂基材去除约30微米。因此本实施例的开口过程分为三步，首先用激光轮廓线切开屏蔽膜，然后用黏度低手动滚轮粘离线路上屏蔽膜，最后是用较大能量密度的激光在环氧树脂上逐点逐线挖槽。Step 4: Laser top surface opening. In order to ensure the thickness of the printed circuit and the bonding force with the base material, the laser opening in this embodiment not only removes the shielding film, but also removes about 30 microns of the epoxy resin base material. Therefore, the opening process in this embodiment is divided into three steps. First, use a laser contour to cut the shielding film, then use a low-viscosity manual roller to adhere the shielding film on the circuit, and finally use a laser with a larger energy density to incise the epoxy resin point by point. Grooving line by line.
激光加工轮廓线的参数为：The parameters of laser processing contour lines are:
波长wavelength 脉宽pulse width 光斑直径Spot diameter 功率power 频率frequency 加工速度Processing speed 加工遍数Processing passes
355nm355nm 20ns20ns 20μm20μm 15w15w 40KHz40KHz 250mm/s250mm/s 2遍2 times
激光挖槽的参数为：The parameters of laser trenching are:
波长wavelength 脉宽pulse width 光斑直径Spot diameter 功率power 频率frequency 加工速度Processing speed 加工遍数Processing passes
355nm355nm 20ns20ns 20μm20μm 20w20w 40KHz40KHz 100mm/s100mm/s 5遍5 times
顶面激光开口后的示意图如图10所示。The schematic diagram of the top surface after laser opening is shown in Figure 10.
步骤五，用步骤四相同的方法完成底面的激光开口。底面激光开口后的示意图如图10一所示。Step 5: Use the same method as step 4 to complete the laser opening on the bottom surface. The schematic diagram of the bottom surface after laser opening is shown in Figure 10-1.
步骤六，将在制品放置在吸附台上，顶面向上，印刷导电银浆，孔内多余的浆料吸入吸附平台中间的收集腔内。翻转在制品，底面向上，同样手段完成底面银浆的印刷和灌孔。Step 6: Place the product in progress on the adsorption platform with the top side facing up, print conductive silver paste, and suck the excess paste in the holes into the collection cavity in the middle of the adsorption platform. Turn the work-in-progress over with the bottom side facing up, and use the same method to complete the printing and hole filling of the silver paste on the bottom side.
本实施例所用的银浆型号为德中SP220低温银浆，固化温度220℃，固含量86-90％。The silver paste model used in this embodiment is Dezhong SP220 low-temperature silver paste, with a curing temperature of 220°C and a solid content of 86-90%.
步骤七，银浆印刷后，本实施例先去除掩蔽膜的非线路部分，然后按照银浆固化的要求，先80℃烘烤30分钟，然后150℃烘烤1小时，再220℃烘烤1.5小时，完成顶底两面导电结构的制作，然后按照正常加工流程进行铣外形加工。最终完成的产品示意图如图10二所示。Step 7: After the silver paste is printed, in this embodiment, the non-circuit part of the masking film is first removed, and then according to the silver paste curing requirements, first bake at 80°C for 30 minutes, then bake at 150°C for 1 hour, and then bake at 220°C for 1.5 Hours later, the conductive structures on the top and bottom sides are completed, and then the shape is milled according to the normal processing flow. The final schematic diagram of the product is shown in Figure 102.
最后，本发明的未述之处均采用现有技术中的成熟产品及成熟技术手段。Finally, mature products and mature technical means in the prior art are adopted for the parts not described in the present invention.
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the protection scope of the appended claims of the present invention.

Claims (12)

  1. 用激光制造开口转移物料制电路板的方法，其特征在于，包括以下步骤：A method for manufacturing circuit boards made of opening transfer material using laser, which is characterized by including the following steps:
    (1)覆合掩蔽膜，将转移导电材料用的掩蔽膜覆合在绝缘材料表面上，即将箔、膜材料压合在绝缘材料表面上；(1) Covering the masking film, covering the masking film used to transfer the conductive material on the surface of the insulating material, that is, laminating the foil and film materials on the surface of the insulating material;
    (2)钻孔，用机械或激光钻覆有掩蔽膜的绝缘材料，形成通透的孔；(2) Drilling, using machinery or laser to drill the insulating material covered with a masking film to form a transparent hole;
    (3)直接激光开口，即用在CAM软件中生成的开口加工路径驱动设备，通过激光切割、去除的手段，制造内部不含结构丝的转移开口；(3) Direct laser opening, that is, using the opening processing path generated in the CAM software to drive the equipment, and using laser cutting and removal to create a transfer opening that does not contain structural wires inside;
    (4)物料转移，先将膏状导电材料呈一字型分配到掩蔽膜表面的一端刮印，再用刮板同时向另一端刮动和挤压物料，使物料进入孔和掩蔽膜的开口内；(4) Material transfer, first distribute the paste-like conductive material in a straight line to one end of the masking film surface and scrape it, then use the scraper to scrape and squeeze the material to the other end at the same time, so that the material enters the hole and the opening of the masking film Inside;
    (5)固化，光固或热固导电材料，形成两面电气导通的孔和导线。(5) Curing, photosetting or thermosetting conductive material to form holes and wires for electrical conduction on both sides.
  2. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(1)中，箔、膜材料包括金属箔、高分子薄膜、纸等；箔、膜材料分工作面和粘接面，工作面表面光滑，粘接面涂覆有可剥离胶粘剂，包括压敏胶粘剂；箔、膜材料贴合在另一种离型膜材料表面；在进行步骤(1)前，先将作为掩蔽膜的箔、膜材料与离型材料分离开；在进行步骤(1)中，用箔、膜材料的粘接面与工件贴合，完成覆合。The method of using laser to manufacture circuit boards made of opening transfer materials according to claim 1, characterized in that: in the step (1), foil and film materials include metal foil, polymer film, paper, etc.; foil and film materials It is divided into a working surface and an adhesive surface. The surface of the working surface is smooth, and the adhesive surface is coated with a peelable adhesive, including a pressure-sensitive adhesive; the foil and film materials are bonded to the surface of another release film material; in step (1) Before step (1), the foil and film materials used as the masking film are separated from the release material; in step (1), the bonding surfaces of the foil and film materials are bonded to the workpiece to complete the lamination.
  3. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(1)中，包括以下几种实施方式：a、直接使用预先复合有掩蔽用箔、膜材料的绝缘材料；b、分步骤先后覆合两层或两层以上的同品种的或不同品种的箔、膜材料；c、覆合两层材料复合的箔、膜材料。The method of using laser to manufacture circuit boards made of opening transfer materials according to claim 1, characterized in that: in step (1), the following implementation methods are included: a. Directly using pre-composited masking foils and films The insulating material of the material; b. Laminating two or more layers of the same or different types of foil and membrane materials step by step; c. Laminating two layers of composite foil and membrane materials.
  4. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(1)中，采用直接、刷涂方法在工件表面涂覆涂料，直接使用涂料作为掩蔽膜；或跳过步骤(1)直接以工件表面作为掩蔽膜。The method of using laser to manufacture circuit boards made of opening transfer materials according to claim 1, characterized in that: in the step (1), a direct or brushing method is used to apply paint on the surface of the workpiece, and the paint is directly used as a masking film ; Or skip step (1) and directly use the workpiece surface as the masking film.
  5. 根据权利要求1或3或4所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(3)中，包括以下几种实施方式：The method of using laser to manufacture circuit boards made of opening transfer materials according to claim 1 or 3 or 4, characterized in that the step (3) includes the following implementation modes:
    a.包括用激光束只沿开口的轮廓线切割透掩蔽膜直至工件表面，再成块剥离去掉开口内的孤立的掩蔽膜块，形成以原绝缘材料表面为底面的开口；a. Including using a laser beam to cut the transparent masking film only along the contour line of the opening to the surface of the workpiece, and then peeling off the isolated masking film blocks in the opening to form an opening with the original insulating material surface as the bottom surface;
    b.包括用激光束沿开口的轮廓线、开口内分小块用的切割线切割透掩蔽膜直至工件表面，再成小块剥离去掉开口内的孤立的掩蔽膜块，形成以原绝缘材料表面为底面的开口；b. Including using a laser beam to cut the transparent masking film along the contour line of the opening and the cutting lines in the opening into small pieces until the surface of the workpiece, and then peeling off the isolated masking film blocks in the opening into small pieces to form the surface of the original insulating material. is the opening on the bottom surface;
    c.包括用激光束逐线，逐层汽化去除开口区域内所有的掩蔽膜，直至工件表面，形成以工件材料表面为底面的开口；c. Including using a laser beam to vaporize and remove all the masking films in the opening area line by line, layer by layer, until the surface of the workpiece, forming an opening with the surface of the workpiece material as the bottom surface;
    d.包括用激光束逐点、逐线、逐层汽化去除开口区域内所有的掩蔽膜，并在开口区域用激光束逐点、逐线、逐层汽化去除原绝缘材料，形成包括嵌入原绝缘材料一定深度的凹槽的开口；d. Including using a laser beam to vaporize and remove all the masking films in the opening area point by point, line by line, and layer by layer, and using a laser beam to vaporize and remove the original insulation material in the opening area point by point, line by line, and layer by layer, forming a process including embedding the original insulation. An opening in a groove of a certain depth in a material;
    e.包括用激光束逐点、逐线、逐层汽化去除开口区域去除原掩蔽膜，形成嵌入原绝缘材料一定深度的凹槽的开口。e. Including using a laser beam to vaporize the opening area point by point, line by line, and layer by layer to remove the original masking film and form an opening embedded in a groove of a certain depth in the original insulating material.
  6. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(3)中，采用粘辊压粘，揭除开口内被切割成孤立块、孤立小块的箔、膜材料。The method for manufacturing circuit boards using laser opening transfer material according to claim 1, characterized in that: in the step (3), a sticky roller is used to press and stick, and the parts cut into the opening are cut into isolated pieces and small isolated pieces. Foil and film materials.
  7. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(4)中，将需要转移的物料分配到掩蔽膜表面的任何位置，多次沿不同方向反复刮动和挤压物料，并遍及掩蔽膜全幅面，使物料进入掩蔽膜的开口内。The method of using laser to manufacture circuit boards made of opening transfer materials according to claim 1, characterized in that in the step (4), the materials to be transferred are distributed to any position on the surface of the masking film, multiple times in different directions. Repeatedly scrape and squeeze the material across the entire width of the masking film so that the material enters the opening of the masking film.
  8. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述步骤(5)中，包括以下几种实施方式：The method of using laser to manufacture circuit boards made of opening transfer materials according to claim 1, characterized in that the step (5) includes the following implementation modes:
    a.包括去除掩蔽膜，即揭掉原绝缘材料表面的掩蔽膜后，再对转移的导电材料进行后续处理；a. Including removal of the masking film, that is, after removing the masking film on the surface of the original insulating material, the transferred conductive material is subsequently processed;
    b.包括先对转移的材料进行后续处理，再揭掉原绝缘材料表面的掩蔽膜；b. Including first performing subsequent processing on the transferred material, and then removing the masking film on the surface of the original insulating material;
    c.包括将掩蔽膜保留在工件上。c. Including leaving the masking film on the workpiece.
  9. 根据权利要求1所述的用激光制造开口转移物料制电路板的方法，其特征在于：所述转移物料包括转移膏状的物料、浆态的物料、粉末状态的物料；以及转移有导电功能的物料、导磁功能的物料、导热功能的物料、导光功能的物料。The method of using laser to manufacture circuit boards made of open transfer materials according to claim 1, characterized in that: the transfer materials include transfer of paste-like materials, slurry-like materials, and powder-like materials; and transfer of conductive functions. Materials, materials with magnetic conductivity, materials with thermal conductivity, and materials with light conductivity.
  10. 一种如权利要求1所述的用激光制造开口转移物料制电路板的方法中采用的软件，其特征在于：所述软件为一种用于数据处理的CAM软件，该CAM软件根据需要转移和成型的物料要求设计或选择箔、膜的品种和厚度；并设计或选择沿开口的轮廓线对箔、膜材料加工的路径；该CAM软件用于设计或选择在开口内将箔、膜材料分隔成孤立小块的加工路径；可以设计或选择在开口区域内逐线，逐层汽化去除箔、膜材料的加工路径；最后CAM软件用于设计或选择在开口区域内逐线，逐层汽化去除工件材料的加工路径；该CAM软件的操作步骤为：A kind of software used in the method of using laser to manufacture circuit boards made of opening transfer materials as claimed in claim 1, characterized in that: the software is a CAM software for data processing, and the CAM software transfers and The molded materials require the design or selection of the type and thickness of the foil and film; and the design or selection of the processing path for the foil and film materials along the contour line of the opening; the CAM software is used to design or select the separation of the foil and film materials within the opening. Processing path into isolated small pieces; you can design or select a processing path to vaporize and remove foil and film materials line by line and layer by layer in the opening area; finally, CAM software is used to design or select line by line and layer by layer vaporization removal in the opening area The processing path of the workpiece material; the operating steps of the CAM software are:
    (1)导入设备参数，导入设计要求和图案数据，根据设计要求或需要转移、成型的图案厚度，选择箔、膜的材质和厚度；(1) Import equipment parameters, import design requirements and pattern data, and select the material and thickness of foil and film according to the design requirements or the thickness of the pattern that needs to be transferred and formed;
    (2)根据设备参数中的光束直径、加工头加工范围及其接续的参数，根据设计要求或需要转移、成型的图案厚度，设计和生成加工路径。(2) According to the beam diameter, processing range of the processing head and its subsequent parameters in the equipment parameters, and according to the design requirements or the thickness of the pattern that needs to be transferred and formed, the processing path is designed and generated.
  11. 根据权利要求10所述的用激光制造开口转移物料制电路板的方法中采用的软件，其特征在于：所述步骤(3)、(4)及(5)中，用CAM软件对导入的数据，生成的数据、加工路径进行设计规则、制造规则检查，并生成对制造的开口和对转移的物料进行视觉检查数据。The software used in the method of using laser to manufacture circuit boards made of opening transfer materials according to claim 10, characterized in that: in the steps (3), (4) and (5), CAM software is used to process the imported data. , the generated data and processing paths are checked for design rules and manufacturing rules, and visual inspection data for manufacturing openings and transferred materials are generated.
  12. 一种如权利要求1所述的用激光制造开口转移物料制电路板的方法中采用的设备，其特征在于：所述设备的加工光路设计为：从激光器中发射出的激光光束经动态偏转的反射镜分配和定位，再进入聚焦镜，最后投射向被加工材料；所述设备的加工头设计为：该加工头边投照激光边在被加工区域吸气形成抽风集尘负压环境。An equipment used in the method of using laser to manufacture circuit boards made of opening transfer materials as claimed in claim 1, characterized in that: the processing optical path of the equipment is designed such that the laser beam emitted from the laser is dynamically deflected. The reflector is distributed and positioned, then enters the focusing mirror, and is finally projected to the material to be processed; the processing head of the equipment is designed such that while projecting the laser, the processing head inhales air in the area being processed to form a negative pressure environment for exhausting dust and collecting dust.
PCT/CN2022/138334 2022-07-26 2022-12-12 Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus WO2024021438A1 (en)

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CN115460773A (en) * 2022-07-26 2022-12-09 德中（天津）技术发展股份有限公司 Method, software and equipment for manufacturing circuit board by laser manufacturing opening transfer material

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JP2011233625A (en) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd Wiring board and manufacturing method thereof
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