WO2022104943A1 - Printed circuit board and preparation method therefor - Google Patents

Printed circuit board and preparation method therefor Download PDF

Info

Publication number
WO2022104943A1
WO2022104943A1 PCT/CN2020/134691 CN2020134691W WO2022104943A1 WO 2022104943 A1 WO2022104943 A1 WO 2022104943A1 CN 2020134691 W CN2020134691 W CN 2020134691W WO 2022104943 A1 WO2022104943 A1 WO 2022104943A1
Authority
WO
WIPO (PCT)
Prior art keywords
boss
plate
opposite sides
processed
printed circuit
Prior art date
Application number
PCT/CN2020/134691
Other languages
French (fr)
Chinese (zh)
Inventor
唐昌胜
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Publication of WO2022104943A1 publication Critical patent/WO2022104943A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the invention is applied to the technical field of processing printed circuit boards, in particular to a printed circuit board and a preparation method thereof.
  • PCB printed Circuit Board
  • PCB printed Circuit Board
  • PCB printed Circuit Board
  • the heat dissipation schemes of high-density interconnected printed circuit boards include: 1. Embed metal bases in the layers or positions where heat dissipation is required in the printed circuit boards; Blind hole array.
  • the metal base needs to be customized separately; at the same time, the position of the metal base cannot be wired, which occupies the wiring space; the metal base is embedded in the printed circuit board, and the alignment accuracy is low; the metal base has thickness and size restrictions; 2 , The blind hole array position cannot be wired, and the wiring space is occupied.
  • the invention provides a printed circuit board and a preparation method thereof, so as to improve the heat dissipation efficiency of the printed circuit board.
  • the present invention provides a method for preparing a printed circuit board, which includes: obtaining a plate to be processed; setting a first boss and a second boss respectively on opposite sides of the plate to be processed , wherein the first boss and the second boss are partially overlapped; the plate to be processed is pressed to obtain a first pressed plate, and the opposite sides of the first pressed plate Grinding until the first boss and the second boss are exposed; respectively disposing conductive layers on opposite sides of the first lamination plate, so as to add layers to the first lamination plate; The pattern transfer is respectively performed on the opposite sides of the first pressing board member to form a conductive circuit on the first pressing board member to obtain a printed circuit board.
  • the plate to be processed is pressed to obtain a first pressed plate, and the opposite sides of the first pressed plate are ground until the first boss and the second
  • the step of exposing the boss includes: obtaining two first boards, the first boards comprising a copper layer or a release film; respectively connecting the two first boards with the to-be-to-be-received through two first dielectric layers. Pressing the opposite sides of the processing plate to obtain a first pressing plate; removing the first plate on the opposite sides of the first pressing plate; grinding the opposite sides of the first pressing plate, in order to remove part of the first dielectric layer, until the first bosses and the second bosses on the opposite sides of the first pressing board are exposed.
  • the step of grinding the opposite sides of the first pressing plate member includes: grinding the first pressing plate member by means of leveling, brushing, laser ablation, ion cutting, ion polishing or water jet.
  • the opposite sides of the surface are ground.
  • the step of disposing conductive layers respectively on opposite sides of the first pressing plate member so as to add layers to the first pressing plate member includes: respectively applying conductive layers to the opposite two sides of the first pressing plate member. Roughening treatment is performed on the sides; a conductive layer is respectively provided on the opposite sides of the first laminated board by deposition or electroplating, so as to add layers to the first laminated board.
  • the step of obtaining the plate to be processed includes: obtaining a copper clad plate; forming at least one hole on the copper clad plate by drilling, wherein the hole includes a through hole and a micro-blind hole; The holes are subjected to hole treatment to obtain the plate to be processed.
  • the hole forming treatment includes copper immersion treatment, black hole treatment or shadow treatment.
  • the step of disposing the first boss and the second boss respectively on the opposite sides of the plate to be processed includes: sticking a first photosensitive film on the surfaces of the opposite sides of the plate to be processed, and expose the first preset position of the plate to be processed; wherein, the first preset position includes the hole and the peripheral position of the hole of the hole; Filling and electroplating are performed at the first preset position to form the first boss and the second boss respectively on opposite sides of the plate to be processed; remove the first boss on the plate to be processed.
  • a photosensitive film is a photosensitive film.
  • the step includes: pasting on second preset positions on opposite sides of the plate to be processed
  • the second photosensitive film is etched on opposite sides of the to-be-processed board to form conductive lines on the to-be-processed board; the second photosensitive film on the to-be-processed board is removed.
  • the step includes: respectively placing two opposite sides of the first pressing plate member on the opposite sides of the first pressing plate member. Electroplating is performed at the third preset position on the side to form a third boss and a fourth boss at the third preset position; the first pressing plate is pressed to obtain a second pressing plate, and Grinding the second pressing plate piece until the third boss and the fourth boss are exposed; disposing the conductive layers on opposite sides of the second pressing plate piece, so as to prevent the second pressing plate Laminate laminates.
  • the present invention also provides a printed circuit board prepared by any one of the above-mentioned methods for preparing a printed circuit board.
  • the printed circuit board of the present invention obtains the plate to be processed; the first boss and the second boss are respectively provided on opposite sides of the plate to be processed, Wherein, the first boss and the second boss are partially overlapped; the plate to be processed is pressed to obtain a first pressed plate, and the opposite sides of the first pressed plate are ground until the first boss and the second The two bosses are exposed; the conductive layers are respectively arranged on the opposite sides of the first pressing plate to add layers to the first pressing; A conductive circuit is formed on a laminated board to obtain a printed circuit board.
  • first bosses and second bosses are respectively provided on opposite sides of the plate to be processed, wherein the first bosses and the second bosses partially overlap.
  • a conductive layer is respectively arranged on the side of the first pressing plate that exposes the first boss and the second boss, so as to add layers to the first pressing plate, so as to rely on the dislocation.
  • the provided first boss and second boss increase the heat dissipation surface area and efficiency of the board between the board to be processed and the conductive layer, and improve the quality and reliability of the printed circuit board.
  • the heat dissipation between the boards in this embodiment does not require embedding a metal base or setting a micro-blind hole array in the finished printed circuit board, which reduces the impact on the wiring space and avoids the preparation of the metal base. question.
  • FIG. 1 is a schematic flowchart of an embodiment of a method for preparing a printed circuit board provided by the present invention
  • FIG. 2 is a schematic flowchart of another embodiment of a method for preparing a printed circuit board provided by the present invention
  • 3a is a schematic structural diagram of an embodiment of the plate to be processed in step S21;
  • 3b is a schematic structural diagram of an embodiment of the plate to be processed after the first photosensitive film is pasted in step S22;
  • 3c is a schematic structural diagram of an embodiment of the plate to be processed after removing the first photosensitive film in step S22;
  • 3d is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is pasted in step S23;
  • 3e is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is removed in step S23;
  • FIG. 3f is a schematic structural diagram of an embodiment of the first pressing plate member.
  • the first board member is a single-layer copper layer for lamination as an example for description;
  • 3g is a schematic structural diagram of an embodiment after the surface grinding treatment of the first pressing plate member
  • FIG. 3h is a schematic structural diagram of an embodiment after the first laminated board is layered
  • FIG. 4 is a schematic flowchart of an embodiment of a method for preparing a printed circuit board after step S27 in this embodiment
  • FIG. 4a is a schematic structural diagram of the first lamination plate in this embodiment after removing the first photosensitive film
  • FIG. 4b is a schematic structural diagram of the first lamination plate part after pattern etching in this embodiment.
  • FIG. 4c is a schematic structural diagram of the second pressing plate piece of the present embodiment after grinding
  • FIG. 4d is a schematic structural diagram of the second laminated plate member of the present embodiment after adding layers
  • FIG. 5 is a schematic structural diagram of an embodiment of the printed circuit board of the present invention.
  • FIG. 1 is a schematic flowchart of an embodiment of a method for preparing a printed circuit board provided by the present invention.
  • the printed circuit board in this embodiment is a multi-layer circuit board, wherein the multi-layer circuit board in this embodiment is Including two-layer circuit boards and circuit boards with more than two layers.
  • Step S11 Obtain the plate to be processed.
  • the plate to be processed can be a copper clad laminate, or a multi-layer circuit board that has been pressed during processing but still needs to be added.
  • copper clad laminate (Copper Clad Laminate, CCL) refers to an original plate-like material made by dipping electronic glass fiber cloth or other reinforcing materials with resin, coating one or both sides with copper foil and hot pressing.
  • the copper clad laminate is a plate-like material with copper foils attached to both sides.
  • Step S12 Disposing a first boss and a second boss on opposite sides of the plate to be processed, wherein the first boss and the second boss are partially overlapped.
  • the copper layer is thickened at preset positions on opposite sides of the plate to be processed, so as to form a first boss and a second boss on the opposite sides of the plate to be processed, wherein the first boss and the second boss are
  • the platforms are respectively arranged on opposite sides of the plate to be processed, and the first boss and the second boss are partially overlapped, thereby expanding the surface area between the first boss and the second boss, thereby increasing the finished product
  • the heat dissipation area of the printed circuit board improves the heat dissipation efficiency.
  • the copper-containing electroplating solution can be applied to the preset positions on the opposite sides of the plate to be processed, and the preset positions can be electroplated, so that the copper layer can be thickened at the preset positions to form the first A boss and a second boss.
  • copper immersion can also be performed at preset positions on opposite sides of the plate to be processed, so as to thicken the copper layer at the preset positions to form the first boss and the second boss.
  • Step S13 Pressing the plate to be processed to obtain a first pressing plate, and grinding opposite sides of the first pressing plate until the first boss and the second boss are exposed.
  • the plate to be processed is subjected to high temperature lamination to obtain a first lamination plate.
  • the opposite sides of the plate to be processed and the conductive layer may be pressed together at high temperature through the prepreg, respectively, to obtain the first pressed plate.
  • the release film and the opposite sides of the plate to be processed can also be pressed together at high temperature through resin sheets to obtain the first pressed plate. This is not limited.
  • the opposite sides of the pressed first pressing plate are ground until the first bosses and the second bosses on the opposite sides of the first pressing plate are exposed.
  • the opposite sides of the first pressing plate are ground until the first boss and the second boss are exposed.
  • the first pressing plate is provided with the side of the first boss. The surface is flush, and the surface of the side provided with the second boss is flush. That is, one side surface of the first pressing plate is at the same height as the surface of the first boss, and the other side surface of the first pressing plate is at the same height as the surface of the second boss, so that the subsequent Attachment settings of conductive layers.
  • Step S14 Disposing conductive layers on opposite sides of the first laminated board respectively, so as to add layers to the first laminated board.
  • Conductive layers are respectively arranged on the sides, so as to perform double-sided build-up on the first laminated board.
  • the conductive layers on both sides are communicated with the first boss and the second boss, so that the first boss and the second boss can dissipate heat between the conductive layer and the first laminated board, thereby improving the performance of the printed circuit board. life and reliability.
  • Step S15 performing pattern transfer on the opposite sides of the first pressing board member respectively, so as to form conductive lines on the first pressing board member to obtain a printed circuit board.
  • the pattern transfer is performed on the opposite sides of the laminated first laminated board to form conductive lines on the opposite sides of the first laminated board, so as to realize the circuit function of the board and obtain a printed circuit board.
  • the pattern transfer refers to pasting or coating a layer of photosensitive film on the treated copper surface.
  • the circuit pattern on the film negative is transferred to the copper surface to form a resist mask pattern, and the unnecessary copper foil not protected by the resist mask pattern will be used in the follow-up During the chemical etching process, it is etched away. After the etching process, the resist photosensitive film is removed to obtain the required conductive lines.
  • steps S12 to S15 can be repeatedly performed on the multi-layer circuit board after step S15 until the thickness or specifications of the printed circuit board meet the requirements. Preparation requirements.
  • first bosses and second bosses are respectively provided on opposite sides of the board to be processed, wherein the first bosses and the second bosses partially overlap.
  • a conductive layer is respectively arranged on the side of the first pressed plate that exposes the first boss and the second boss, so as to add layers to the first pressed plate, thereby increasing the number of layers to be pressed. Process the heat dissipation surface area and efficiency of the board between the board and the conductive layer, and improve the quality and reliability of the printed circuit board.
  • the heat dissipation between the boards in this embodiment does not require embedding a metal base or setting a micro-blind hole array in the finished printed circuit board, which reduces the impact on the wiring space and avoids the preparation of the metal base. question.
  • FIG. 2 is a schematic flowchart of another embodiment of the method for preparing a printed circuit board provided by the present invention.
  • the printed circuit board in this embodiment is a multi-layer circuit board.
  • the board includes a two-layer circuit board and a circuit board with more than two layers.
  • Step S21 obtaining a copper clad plate; forming at least one hole on the copper clad plate by drilling, wherein the hole includes a through hole and a micro-blind hole; performing hole processing on the at least one hole to obtain a plate to be processed.
  • the copper clad laminate includes a dielectric layer and a copper layer, and the dielectric layer can cover the copper layer on one side or cover the copper layer on both sides.
  • the double-sided copper cladding layer of the dielectric layer of the copper clad laminate will be taken as an example, and the double-sided buildup of the copper clad laminate will be described.
  • the method for single-sided build-up of the copper clad laminate is similar to the method for double-sided build-up, and reference may be made to the preparation method of the printed circuit board in this embodiment.
  • the copper clad laminate is drilled to drill at least one hole in the copper clad laminate.
  • the copper clad laminate may be drilled through mechanical drilling to drill at least one hole in the copper clad laminate.
  • the copper clad laminate can also be drilled by laser drilling to drill at least one hole in the copper clad laminate.
  • the holes in this step need to penetrate through the dielectric layer of the copper clad laminate, so that in the subsequent preparation process, the upper and lower sides of the dielectric layer can be connected to each other.
  • the holes include through holes and micro-blind holes.
  • a through hole refers to a hole that penetrates two or more layers and penetrates up and down;
  • a micro-blind hole refers to a via hole that connects two adjacent layers without passing through.
  • the through-holes and micro-blind vias on the CCL penetrate the dielectric layer of the CCL, the through-holes penetrate the entire CCL, and the micro-blind vias penetrate the copper layer on one side of the CCL and the middle dielectric layer, and do not penetrate through the CCL
  • the copper layer on the other side of the copper plate is used to conduct the copper on both sides of the dielectric layer of the copper clad laminate to diffuse heat.
  • the copper clad laminate is drilled to drill at least one hole in the copper clad laminate.
  • multiple through holes or micro-blind holes can be drilled on the CCL, for example: 3, 5, 10, and the specific number of holes can be determined according to the heat dissipation requirements of the printed circuit board. Settings, which are not limited here.
  • the holes on the copper clad plate are subjected to hole treatment to obtain the plate to be processed in this embodiment.
  • the hole forming treatment includes copper immersion treatment, black hole treatment or shadow treatment.
  • the hole on the copper clad plate is subjected to hole treatment, so that a layer of conductive material is covered on the hole wall or/and the hole bottom, which is convenient for subsequent hole filling and electroplating.
  • black hole treatment refers to that fine graphite or carbon black paint (black hole liquid) is dip-coated on the hole wall or/and the hole bottom to form a conductive layer
  • black shadow treatment refers to the composition containing unique additives and The black shadow liquid of the conductive colloidal substance is dip-coated on the hole wall or/and the hole bottom of the hole, so that a conductive layer is formed on the hole wall or/and the hole bottom
  • the copper immersion treatment refers to the chemical method on the hole wall of the hole. Or/and a thin layer of chemical copper is deposited on the bottom of the hole as a base for electroplating.
  • FIG. 3a is a schematic structural diagram of an embodiment of the plate to be processed in step S21.
  • the board to be processed 100 in this embodiment includes an upper copper layer 1021 , a dielectric layer 101 and a lower copper layer 1022 .
  • the upper layer copper layer 1021 , the dielectric layer 101 and the lower layer copper layer 1022 are stacked in sequence and arranged in a bonded manner.
  • Micro blind holes 103 and through holes 104 are provided on the plate 100 to be processed.
  • the micro blind via 103 penetrates the upper copper layer 1021 and the dielectric layer 101
  • the bottom of the micro blind via 103 is formed by the lower copper layer 1022
  • the through hole 104 penetrates the upper copper layer 1021 , the dielectric layer 101 and the lower copper layer 1022 .
  • This embodiment only shows the structures of through holes and micro-blind holes, and does not limit the number and structure of holes on the plate to be processed in the actual production process.
  • Step S22 pasting a first photosensitive film on the surfaces on opposite sides of the board to be processed, and exposing the first preset position of the board to be processed, wherein the first preset position includes the hole and the periphery of the hole of the hole position, the first preset positions on the opposite sides of the plate to be processed are filled and electroplated to form a first boss and a second boss on the opposite sides of the plate to be processed, and the first and second bosses on the plate to be processed are removed.
  • a photosensitive film is pasting a first photosensitive film on the surfaces on opposite sides of the board to be processed, and exposing the first preset position of the board to be processed, wherein the first preset position includes the hole and the periphery of the hole of the hole position, the first preset positions on the opposite sides of the plate to be processed are filled and electroplated to form a first boss and a second boss on the opposite sides of the plate to be processed, and the first and second bosses on the plate to be processed are removed.
  • a first photosensitive film is pasted on the surfaces on opposite sides of the plate to be processed, and the first preset position on the upper surface and the first preset position on the lower surface are exposed; wherein, the first preset position includes holes and holes peripheral location of the mouth.
  • the first preset position may also only include the position of the hole. The first preset position of the upper surface and the first preset position of the lower surface corresponding to the same hole partially overlap.
  • the first photosensitive film can be a photosensitive coating or other photosensitive films, wherein the photosensitive coating is a polymer compound, which can generate a polymerization reaction (by the irradiation of a specific light source) The reaction process of monomer synthesis of polymer) forms a stable substance attached to the board surface, so as to achieve the function of blocking electroplating.
  • the photosensitive coating is a polymer compound, which can generate a polymerization reaction (by the irradiation of a specific light source) The reaction process of monomer synthesis of polymer) forms a stable substance attached to the board surface, so as to achieve the function of blocking electroplating.
  • Filling and electroplating are performed on the first preset positions on the opposite sides of the plate to be processed, so as to form a first boss and a second boss on the opposite sides of the plate to be processed, and remove the first photosensitive plate on the plate to be processed. membrane.
  • the first boss is connected to the metallized hole
  • the metallized hole is connected to the second boss to form a copper column penetrating through the plate to be processed for heat dissipation.
  • FIG. 3b is a schematic structural diagram of an embodiment of the plate to be processed after the first photosensitive film is pasted in step S22.
  • the plate to be processed 200 in this embodiment includes an upper first photosensitive film 2051 , an upper copper layer 2021 , a dielectric layer 201 , a lower copper layer 2022 , and a lower first photosensitive film 2052 .
  • the upper first photosensitive film 2051 , the upper copper layer 2021 , the dielectric layer 201 , the lower copper layer 2022 , and the lower first photosensitive film 2052 are sequentially stacked and laminated.
  • Micro blind holes 203 and through holes 204 are provided on the plate 200 to be processed.
  • the upper first photosensitive film 2051 and the lower first photosensitive film 2052 do not overlap with the micro blind holes 203 and the through holes 204 .
  • the upper first photosensitive film 2051 and the lower first photosensitive film 2052 do not cover the peripheral positions of the micro blind holes 203 and the through holes 204 on the upper copper layer 2021 and the lower copper layer 2022, so that the first preset position 2061 of the upper surface layer is not covered. and the first preset position 2062 of the lower layer is exposed.
  • the first preset position 2061 of the upper surface layer and the first preset position 2062 of the lower surface layer refer to all the holes on the plate 200 to be processed and the peripheral positions of the holes.
  • the first preset position 2061 on the upper surface and the first preset position 2062 on the lower surface only partially overlap.
  • peripheral positions of the micro blind holes 203 and the through holes 204 refer to the positions around the periphery of the orifices.
  • the specific range of the periphery of the orifice may be determined according to the heat dissipation requirement of the top area of the first boss in actual production, which is not limited herein.
  • Fill plating is performed on the first preset position 2061 on the upper surface and the first preset position 2062 on the lower surface of the plate 200 to be processed, so as to perform hole metallization on the micro blind holes 203 and the through holes 204, and at the same time increase the number of holes on the upper surface.
  • the second boss (not shown in the figure) after the hole filling and electroplating are completed, the upper first photosensitive film 2051 and the lower first photosensitive film 2052 on the board to be processed 200 are removed.
  • the holes on the to-be-processed plate and the periphery of the orifice are filled and electroplated to metalize the holes.
  • a certain thickness of copper is plated on the periphery of the orifice, thereby forming a partially overlapping first boss and a second boss (the boss is also called copper column, copper base).
  • the first boss, the metallized hole, and the second boss form a copper column penetrating through the plate to be processed, so as to dissipate heat.
  • the drilling and hole-filling electroplating in this step is only performed on the plate to be processed, that is, the single-layer copper clad laminate, rather than the entire multi-layer circuit board. Therefore, the drilling process and the hole-filling electroplating process in this step There is no problem that the thickness of the dielectric layer is too thick to affect the blind hole type, the difficulty of electroplating is difficult to fill blind holes, the alignment between layers, the difficulty of filling copper through holes, and the selection of multiple specified layers for connection.
  • the conductive copper pillars formed by the first boss and the second boss in this step have good conduction performance and high heat dissipation performance.
  • FIG. 3c is a schematic structural diagram of an embodiment of the plate to be processed after the first photosensitive film is removed in step S22.
  • the plate to be processed 300 in this embodiment includes: a first boss 307 , an upper copper layer 3021 , a dielectric layer 301 , a lower copper layer 3022 , and a second boss 308 .
  • the upper layer copper layer 3021 , the dielectric layer 301 and the lower layer copper layer 3022 are stacked in sequence and are arranged by lamination.
  • the first boss 307 is disposed on the side of the upper copper layer 3021 away from the dielectric layer 301 .
  • a second boss 308 is disposed on the side of the lower copper layer 3022 away from the dielectric layer 301 .
  • the first bosses 307 on the upper copper layer 3021 are in one-to-one correspondence with the second bosses 308 on the lower copper layer 3022, but partially overlap to conduct the upper and lower sides of the dielectric layer 301 for heat dissipation.
  • Step S23 A second photosensitive film is pasted on the second preset positions on the opposite sides of the plate to be processed, and the opposite sides of the plate to be processed are etched to form conductive lines on the plate to be processed, and the to-be-processed plate is removed. Process the second photosensitive film on the plate.
  • a second photosensitive film is pasted on the surfaces of the upper copper layer and the lower copper layer of the plate to be processed, that is, the second photosensitive film is pasted on the second preset positions on opposite sides of the plate to be processed.
  • Two photosensitive films and perform pattern etching on the board to be processed to form conductive lines on the upper copper layer and the lower copper layer of the board to be processed, so as to realize the circuit conduction function of the board to be processed. After the pattern etching is completed, the second photosensitive films on opposite sides of the plate to be processed are removed.
  • the second photosensitive film can be a photosensitive resist film
  • the photosensitive resist film is a polymer compound, which can produce a polymerization reaction (the reaction process of synthesizing a polymer from a monomer) after being irradiated by a specific light source.
  • a stable substance adheres to the surface of the board, thereby achieving the function of blocking etching.
  • the second preset position is a position on opposite sides of the plate to be processed where no conductive lines need to be made.
  • FIG. 3d is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is pasted in step S23.
  • the plate to be processed 400 in this embodiment includes a second photosensitive film 409 , an upper copper layer 4021 , a first boss 407 , a dielectric layer 401 , a lower copper layer 4022 and a second boss 408 .
  • the second photosensitive film 409 , the first bosses 407 , the upper copper layer 4021 , the dielectric layer 401 , the lower copper layer 4022 , the second bosses 408 , and the second photosensitive film 409 are stacked in sequence and attached to each other.
  • a plurality of second photosensitive films 409 and a plurality of first bosses 407 are disposed on the side of the upper copper layer 4021 away from the dielectric layer 401 .
  • a plurality of second photosensitive films 409 and a plurality of second bosses 408 are disposed on the side of the lower copper layer 4022 away from the dielectric layer 401 .
  • the surface of each first boss 407 on the side away from the dielectric layer 401 is covered with a second photosensitive film 409 to protect the first boss 407; each second boss 408 is far from the dielectric layer 401
  • the side surfaces are covered with a second photosensitive film 409 to protect the second bosses 408 .
  • the upper layer copper layer 4021 and the lower layer copper layer 4022 are far from the side of the dielectric layer 401, and the position where the second photosensitive film 409 is not covered is the position where conductive lines need to be fabricated.
  • the plate to be processed 400 is etched to etch conductive lines on the upper copper layer 4021 and the lower copper layer 4022 . After the etching is completed, the second photosensitive film 409 on the plate to be processed 400 is removed.
  • FIG. 3e is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is removed in step S23.
  • the plate to be processed 500 in this embodiment includes an upper copper layer 5021 , a dielectric layer 501 , and a lower copper layer 5022 .
  • the upper layer copper layer 5021 and the lower layer copper layer 5022 form conductive lines on the plate 500 to be processed after pattern etching.
  • the plate to be processed 500 further includes copper pillars 507 .
  • the copper pillars 507 are formed by connecting the first bosses 5072 , the metallized holes 5073 and the second bosses 5072 in sequence.
  • the plate 500 to be processed is dissipated by the copper pillars 507 .
  • Step S24 Obtain two first plates, the first plates include a copper layer or a release film, and press the two first plates to the opposite sides of the plate to be processed through the two first dielectric layers respectively , to obtain the first laminated plate.
  • the first boards include a copper layer or a release film.
  • the release film refers to a film that can be distinguished on the surface of the film.
  • the release film is not sticky or slightly sticky after contacting with a specific material under limited conditions.
  • a single-layer copper layer can be obtained as the first plate, and the single-layer copper layer and the opposite sides of the plate to be processed can be pressed through two first dielectric layers respectively to obtain the first plate. Laminated panels.
  • a first pressed board piece is obtained.
  • the first plate and the opposite sides of the plate to be processed are pressed together at high temperature through the first medium layer, and the dielectric material of the first medium layer is filled at each position on the opposite sides of the plate to be processed by pressing.
  • the board to be processed and the first board are pressed into a multi-layer circuit board to obtain a first pressed board.
  • the dielectric materials of the first dielectric layer may be: epoxy resin, polyimide, BT (bismaleimide-triazine resin), ABF, and ceramic-based Materials, the selection of specific media materials can be determined based on actual needs, which is not limited here.
  • FIG. 3f is a schematic structural diagram of an embodiment of the first pressing plate member.
  • the first board member is a single-layer copper layer for lamination as an example for description.
  • the first press-bonded plate member 600 in this embodiment includes a first plate member 610 , a to-be-processed plate member 620 , and a first plate member 610 .
  • the first board member 610 , the to-be-processed board member 620 and the first board member 610 are stacked in sequence through the first dielectric layer 611 .
  • the first board 610 and the to-be-processed board 620 are filled with the first dielectric layer 611 , and the tops of the first and second bosses 601 and 602 on the to-be-processed board 620 are also covered by the first dielectric layer 611 . Therefore, during the high temperature process, the first dielectric layer 611 is pressed against the flat first plate member 610 to fill the uneven plate member 620 to be processed.
  • Step S25 Remove the first plates on the opposite sides of the first pressing plate, grind the opposite sides of the first pressing plate to remove part of the first dielectric layer, until the first pressing plate is on the opposite sides of the first pressing plate. The first boss and the second boss are exposed.
  • the first board is a single-layer copper layer
  • the single-layer copper layers on opposite sides of the first laminated board are removed by etching or grinding.
  • the first plate is a single-layer release film
  • the release films on opposite sides of the first lamination plate are directly torn off.
  • surface grinding treatment can be performed on the opposite sides of the first pressing plate by means of leveling, brushing, laser ablation, ion cutting, ion polishing, and water jetting until the first The surfaces of the bosses and the second bosses are completely exposed, wherein, in practical applications, the specific grinding method may be determined based on actual operating conditions, which is not limited herein.
  • FIG. 3g is a schematic structural diagram of an embodiment after the surface of the first pressing plate is ground.
  • the first laminated board member 700 in this embodiment includes a dielectric layer 701 , a copper layer 702 and a first dielectric layer 703 .
  • the first dielectric layer 703 , the copper layer 702 , the dielectric layer 701 , and the copper layer 702 The first dielectric layer 703 is stacked and arranged.
  • the first pressing plate member 700 further includes a first copper column 704 , and the first copper column 704 is disposed through the first pressing plate member 700 .
  • the two side surfaces of the first copper pillar 704 are flush with the first dielectric layer 703 on the two side surfaces of the first lamination plate 700 , that is, on the same plane, so as to facilitate the attachment of subsequent build-up materials.
  • Step S26 Roughening treatment is performed on the opposite sides of the first pressing plate piece respectively, and a conductive layer is respectively provided on the opposite sides of the first pressing plate piece by deposition or electroplating, so as to increase the strength of the first pressing plate piece. layer.
  • the entire side surface of the first boss is exposed to the first pressing plate and the entire surface of the second boss is exposed to the first pressing plate.
  • the side surfaces are roughened, so as to improve the bonding force of the two outer surfaces of the first pressing plate member.
  • a conductive layer is provided on the opposite sides of the first laminated board by deposition or electroplating respectively, so as to perform double-sided build-up on the first laminated board.
  • black shadow treatment or black hole treatment may be performed on the upper surface and the lower surface of the first pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the first pressing plate respectively.
  • the carbide is used as a conductive layer to build up the first laminate.
  • copper immersion treatment may be performed on the upper surface and the lower surface of the first laminated board respectively, so as to deposit a thicker copper layer on the upper surface and the lower surface of the first laminated board respectively,
  • the copper layer is used as a conductive layer to build up the first laminate part.
  • copper immersion treatment may be performed on the upper surface and the lower surface of the first laminated board respectively, so as to deposit a thin layer of copper immersion on the upper surface and the lower surface of the first laminated board respectively.
  • layer, and a thicker copper layer is electroplated on top of the copper sink layer, and the copper layer is used as a conductive layer to build up the first laminate.
  • black shadow treatment or black hole treatment may be performed on the upper surface and the lower surface of the first pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the first pressing plate respectively. , and then electroplating a layer of copper on the carbide, using the copper layer as a conductive layer, so as to add layers to the first laminate.
  • FIG. 3h is a schematic structural diagram of an embodiment after the first laminated board is laminated.
  • the first laminated board member 800 includes a dielectric layer 801 and a copper layer 802 .
  • the outermost side of the dielectric layer 801 of the first lamination plate 800 is provided with a first conductive layer 803 , wherein the first conductive layer 803 is connected to the first copper column 804 and is conductive.
  • the first copper pillars 804 are connected to the first conductive layer 803 and the copper layer 802 on the upper and lower sides of the first laminated board member 800 , so as to conduct conduction and interconnection between the above-mentioned copper layers.
  • the above-mentioned copper layers can also dissipate heat through the first copper pillars 804 .
  • pattern etching may be performed on the newly added conductive layers on opposite sides of the first laminate to form on the conductive layers Conductive circuit to realize the function of printed circuit board.
  • the manufacturing method of the printed circuit board of this embodiment is to prepare the first boss and the second boss on the to-be-processed board first, and then use the first dielectric layer to prepare the to-be-processed board and the first board. Pressed to fill and level the plate to be processed. After removing the first plate and exposing the surface of the first boss, the entire surface of the plate is roughened, so that the subsequent conductive layer can be stably attached to the plate, so as to realize the layer-by-layer increase of the plate to be processed. layer.
  • the board interconnection in this embodiment can realize the interconnection between any layers, with good flexibility and degree of freedom. High, thereby further improving the reliability of the printed circuit board.
  • the first laminated board member may also be layered. Please refer to FIG. 4 .
  • FIG. 4 is a schematic flowchart of an embodiment of a method for manufacturing a printed circuit board after step S27 in this embodiment.
  • Step S31 performing electroplating on the third preset positions on opposite sides of the first pressing plate member respectively, so as to form the third boss and the fourth boss at the third preset position.
  • a first photosensitive film is pasted on the surfaces on opposite sides of the first pressing plate, and a third preset position is reserved for not pasting the first photosensitive film.
  • the positions where the first photosensitive film is pasted on the surfaces on the opposite sides of the first pressing plate member are positions where electroplating is not required to form the bosses.
  • electroplating is performed on the third preset position on the opposite sides of the first pressing plate, so as to directionally thicken the third preset position to form a third boss and a fourth boss tower.
  • the first pressing plate member when the first pressing plate member includes a plurality of first bosses and a plurality of second bosses.
  • the third and fourth bosses that need to be electroplated and formed of the first press-bonded plate do not necessarily need to completely correspond to the numbers of the first and second bosses.
  • a third boss is formed at a third preset position corresponding to the first boss to extend the copper column.
  • the third boss is not provided on the third preset position corresponding to the position of the first boss.
  • the second boss is the same as the fourth boss.
  • the position of the third boss can be completely overlapped with the first boss to realize interconnection between boards.
  • the position of the third boss can also partially overlap with the first boss, so as to realize the interconnection between the boards and the heat dissipation of the boards, and at the same time improve the wiring space of the board, thereby improving the wiring efficiency of the board. degrees of freedom to achieve high-density wiring of printed circuit boards.
  • the copper column only needs to increase the heat dissipation area due to the partial overlap of the first boss and the second boss, which can improve the heat dissipation efficiency of the printed circuit board.
  • the third boss may completely overlap with the first boss, or may partially overlap with the first boss, so as to further improve the heat dissipation area of the copper column.
  • the second boss is the same as the fourth boss.
  • the first photosensitive film is removed.
  • FIG. 4a is a schematic structural diagram of the first pressing plate member after removing the first photosensitive film in this embodiment.
  • the first pressing plate member 800 in this embodiment is provided with a first copper column 803 .
  • the first copper pillar 803 is formed by connecting the third boss 8033, the first boss 8031, the metallization hole (not marked in the figure), the second boss 8032 and the fourth boss 8034 in sequence, so as to press the first The plywood member 800 dissipates heat.
  • first boss 8031 and the second boss 8032 partially overlap, the first boss 8031 and the third boss 8033 completely overlap, and the second boss 8032 and the fourth boss 8034 partially overlap. Therefore, heat dissipation between the copper layers 802 is realized through dislocation conduction, and the wiring space of the first pressing board member 800 is increased, thereby further improving the wiring freedom of the first pressing board member 800 .
  • the first photosensitive film is pasted on the fourth preset positions on the opposite sides of the first pressing plate, and Pattern etching is performed on the opposite sides of the first pressing plate member to form conductive lines on the conductive layers on the opposite sides of the first pressing plate member, so as to realize the conduction function of the conductive layer.
  • the fourth preset position is a position on the conductive layer of the first laminated board member where no conductive lines need to be prepared.
  • FIG. 4b is a schematic structural diagram of the first lamination plate part after pattern etching in this embodiment.
  • conductive lines 901 are formed on both sides of the first pressing plate member 900 to realize the circuit function of the conductive layer 902 .
  • the first copper pillar 904 and the second copper pillar 903 in this embodiment are connected to each copper layer (not marked in the figure), so as to realize the board interconnection between the copper layers and the interconnection between the copper layers. Plate heat dissipation.
  • the structures shown in the drawings only describe the etched structures of the conductive lines, and do not limit the specific structures of the copper pillars.
  • Step S32 Pressing the first pressing plate to obtain a second pressing plate, and grinding the second pressing plate until the third boss and the fourth boss are exposed.
  • Two second boards are obtained, wherein the second boards include a copper layer or a release film.
  • a single-layer copper layer may be obtained as the second board member, and the single-layer copper layer and the first laminate member may be pressed through the second dielectric layer to obtain the second laminate member.
  • the two layers of second plates and the opposite sides of the first pressing plate are pressed together at high temperature through the second medium layer respectively, and the dielectric material of the second medium layer is pressed to complete the pressing on the opposite sides of the first pressing plate. Filling at various positions on the surface, so as to press the opposite sides of the first laminated board piece and the two second board pieces into a multi-layer circuit board to obtain a second laminated board piece.
  • the dielectric materials of the second dielectric layer may be: epoxy resin, polyimide, BT (bismaleimide-triazine resin), ABF, and ceramic-based Materials, the selection of specific media materials can be determined based on actual needs, which is not limited here.
  • the second plates on opposite sides of the second pressing plate are removed, and the opposite sides of the second pressing plate are ground to remove part of the second medium layer until the second pressing plate is The third and fourth bosses are exposed.
  • the entire side of the second pressing plate with the third boss is flush with the top of the third boss, and the second pressing plate is provided with a fourth The entire surface of one side of the boss is flush with the top end of the fourth boss, so as to facilitate the attachment of subsequent build-up layers.
  • FIG. 4c is a schematic structural diagram of the second pressing plate member after grinding in this embodiment.
  • the upper surface 1001 of the second laminated board member 1000 in this embodiment is flush with the upper surfaces (not marked in the figure) of the first copper pillar 1003 and the second copper pillar 1004 .
  • the lower surface 1002 of the second laminated board 1000 is flush with the lower surfaces (not marked in the figure) of the first copper pillars 1003 and the second copper pillars 1004 , so as to facilitate the attachment of subsequent conductive layers.
  • Step S33 Disposing conductive layers on opposite sides of the second laminated board member to build up the second laminated board member.
  • conductive layers are newly added on opposite sides of the second pressing plate member, so as to add layers to the second pressing plate member.
  • black shadow treatment or black hole treatment can be performed on the upper surface and the lower surface of the second pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the second pressing plate respectively. , using carbide as a conductive layer to build up the second laminate.
  • copper immersion treatment can be performed on the upper surface and the lower surface of the second laminated board respectively, so as to deposit a thicker copper layer on the upper surface and the lower surface of the second laminated board respectively, The copper layer was used as a conductive layer to build up the second laminate.
  • copper immersion treatment can be performed on the upper surface and the lower surface of the second laminated board respectively, so as to deposit a thin layer of copper immersion on the upper surface and the lower surface of the second laminated board respectively.
  • layer, and a thicker copper layer is plated on top of the copper sink layer, and the copper layer is used as a conductive layer to build up the second laminate.
  • black shadow treatment or black hole treatment can be performed on the upper surface and the lower surface of the second pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the second pressing plate respectively. , and then electroplating a layer of copper layer on the carbide respectively, using the copper layer as a conductive layer, so as to add layers to the second laminate.
  • FIG. 4d is a schematic diagram of the structure of the second laminated plate member after adding layers in this embodiment.
  • An upper conductive layer 1101 and a lower conductive layer 1102 are respectively provided on the upper and lower side surfaces of the second laminated board member 1100 in this embodiment, wherein the upper conductive layer 1101 and the lower conductive layer 1102 and the first copper pillars 1103 and the second copper pillars The 1104 connection is turned on.
  • pattern etching can be performed on the newly added conductive layer of the second pressing plate member to form conductive lines on the newly added conductive layers on opposite sides of the second pressing plate member, so as to realize function of the printed circuit board.
  • the steps of pattern etching include film sticking ⁇ exposure ⁇ development ⁇ etching ⁇ film stripping.
  • step S31-step S33 is repeatedly executed in a cycle until the thickness of the laminated board or The specifications meet the preparation requirements.
  • the preparation method of the printed circuit board of the present embodiment implements the conduction and heat dissipation of the printed circuit board layer by layer by performing single-layer buildup on the copper clad plate for many times, so as to avoid the preparation and installation of the metal base itself. Limits as well as avoids blind via array setups. Improve the wiring freedom, flexibility and degree of freedom of the circuit conduction of each layer of the printed circuit board.
  • a partially overlapping first boss and a second boss are formed by plating and thickening the plate to be processed, and the plate to be processed is pressed to fill and level the surface of the plate to be processed. .
  • a conductive layer is added on the surface of the plate to be processed by electroplating or copper immersion.
  • the conductive layer improves the heat dissipation area between the conductive layer and the copper clad laminate through the first boss and the second boss.
  • the steps of electroplating bosses ⁇ roughening and grinding ⁇ electroplating or copper sinking conductive layer can be performed cyclically to add layers to the board until the specifications of the board meet the preparation requirements.
  • the conduction between any board parts can be realized, and the board parts of each layer can be dissipated by setting the boss or not setting the boss in the single-layer build-up layer.
  • the copper pillars finally formed in this embodiment can improve the wiring freedom of the printed circuit board by virtue of the partially overlapping bosses.
  • high-density wiring is achieved while high-efficiency heat dissipation is achieved without occupying the wiring space.
  • the conduction position of the device can also achieve directional heat dissipation, and the thickened position of the copper layer can be directional design and control combined with the size of the connection pad, which does not affect the wiring space and is not limited by the shape.
  • the heat dissipation efficiency of this embodiment is high, and the heat dissipation position can be directly designed. at the position of the power device connection pad.
  • the high-density wiring of the printed circuit board and the overall conduction of the interconnection positions of each layer can be realized by changing the position between the bosses of each layer.
  • the conduction between the layers of the printed circuit board in this embodiment is not limited by the thickness of the dielectric layer, and has certain flexibility and freedom.
  • FIG. 5 is a schematic structural diagram of an embodiment of the printed circuit board of the present invention.
  • the printed circuit board 2000 of this embodiment includes a multi-layer copper layer 2001 , a dielectric layer 2002 , a first copper pillar 2003 and a second copper pillar 2004 .
  • the multi-layer copper layers 2001 are stacked in sequence through the dielectric layers 2002 to form a multi-layer circuit board.
  • the first copper pillar 2003 runs through the entire printed circuit board 2000 , and both ends of the first copper pillar 2003 protrude from the printed circuit board 2000 to dissipate heat from the printed circuit board 2000 .
  • Both ends of the second copper pillars 2004 also protrude from the printed circuit board 2000 to dissipate heat from the printed circuit board 2000 .
  • the copper layer 2001 connected to the first copper pillar 2003 and the second copper pillar 2004 of the printed circuit board 2000 in this embodiment is fixed, but in the actual production process, the first copper pillar 2003 and the second copper pillar 2003
  • the copper layer 2001 to which the pillars 2004 are connected may be determined based on actual requirements, and the first copper pillars 2003 and the second copper pillars 2004 may be connected to all the copper layers 2001 or part of the copper layers 2001 . This is not limited.
  • the copper pillars in the printed circuit board are arranged in a single dislocation, but in other embodiments, a structure with multiple dislocations can be formed through the arrangement of each boss based on the heat dissipation requirements, so as to improve the heat dissipation of the copper pillars area, thereby increasing the heat dissipation requirements of the copper pillars.
  • the printed circuit board of this embodiment can realize high-density interconnection and high-density wiring between each copper layer, and the printed circuit board of this embodiment can improve the heat dissipation area of the printed circuit board by dislocating copper pillars , thereby improving the heat dissipation efficiency of the printed circuit board and enhancing the reliability of the printed circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A printed circuit board and a preparation method therefor. The preparation method for the printed circuit board comprises: acquiring a board to be processed (S11); respectively providing a first protrusion and a second protrusion on two opposite sides of the board, wherein the first protrusion partially overlaps with the second protrusion (S12); performing lamination processing on the board to obtain a first laminated board, and grinding two opposite sides of the first laminated board until the first protrusion and the second protrusion are exposed (S13); respectively providing electrically-conductive layers on the two opposite sides of the first laminated board, so as to perform buildup processing on the first laminated board (S14); and respectively performing pattern transfer processing on the two opposite sides of the first laminated board, and forming electrically-conductive wires on the first laminated board, so as to obtain a printed circuit board (S15). The method can improve the heat dissipation efficiency of printed circuit boards and achieve efficient heat dissipation, thereby improving the reliability of printed circuit boards.

Description

一种印制线路板及其制备方法A kind of printed circuit board and preparation method thereof 【技术领域】【Technical field】
本发明应用于加工印制线路板的技术领域，特别是一种印制线路板及其制备方法。The invention is applied to the technical field of processing printed circuit boards, in particular to a printed circuit board and a preparation method thereof.
【背景技术】【Background technique】
PCB(Printed Circuit Board)，又被称为印刷线路板或印制电路板，是应用广泛的重要电子部件，是电子元器件的支撑体，同样也是电子元器件电气连接的载体。目前，高密度互联的印制线路板在行业中的应用越来越广泛，而行业内对高密度互联的印制线路板的散热要求也越来越高。PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board, is an important electronic component with a wide range of applications, a support for electronic components, and a carrier for electrical connection of electronic components. At present, high-density interconnected printed circuit boards are more and more widely used in the industry, and the heat dissipation requirements of high-density interconnected printed circuit boards in the industry are also getting higher and higher.
目前高密度互联印制电路板的散热方案有：1、在印制电路板中需要散热的层次或位置嵌入金属基；2、在印制电路板中需要散热的层次或位置布设大面积的微盲孔阵列。At present, the heat dissipation schemes of high-density interconnected printed circuit boards include: 1. Embed metal bases in the layers or positions where heat dissipation is required in the printed circuit boards; Blind hole array.
但上述方案存在以下问题：1、金属基需要单独定制；同时金属基位置无法进行布线，占用布线空间；金属基嵌入印制电路板中，对位精度低；金属基有厚度和尺寸限制；2、盲孔阵列位置无法进行布线，占用布线空间。However, the above solutions have the following problems: 1. The metal base needs to be customized separately; at the same time, the position of the metal base cannot be wired, which occupies the wiring space; the metal base is embedded in the printed circuit board, and the alignment accuracy is low; the metal base has thickness and size restrictions; 2 , The blind hole array position cannot be wired, and the wiring space is occupied.
【发明内容】[Content of the invention]
本发明提供了一种印制线路板及其制备方法，以提高印制线路板的散热效率。The invention provides a printed circuit board and a preparation method thereof, so as to improve the heat dissipation efficiency of the printed circuit board.
为解决上述技术问题，本发明提供了一种印制线路板的制备方法，包括：获取待加工板件；在所述待加工板件的相对两侧分别设置第一凸台和第二凸台，其中，所述第一凸台与所述第二凸台部分重叠；对所述待加工板件进行压合，得到第一压合板件，并对所述第一压合板件的相对两侧进行研磨，直至所述第一凸台与所述第二凸台裸露；分别在所述第一压合板件的相对两侧上设置导电层，以对所述第一压合板件进行增层；分别对所述第一压合板件的相对两侧进行图形转移，以在所述第一压合板件上形成导电线路，得到印制线路板。In order to solve the above technical problems, the present invention provides a method for preparing a printed circuit board, which includes: obtaining a plate to be processed; setting a first boss and a second boss respectively on opposite sides of the plate to be processed , wherein the first boss and the second boss are partially overlapped; the plate to be processed is pressed to obtain a first pressed plate, and the opposite sides of the first pressed plate Grinding until the first boss and the second boss are exposed; respectively disposing conductive layers on opposite sides of the first lamination plate, so as to add layers to the first lamination plate; The pattern transfer is respectively performed on the opposite sides of the first pressing board member to form a conductive circuit on the first pressing board member to obtain a printed circuit board.
其中，所述对所述待加工板件进行压合，得到第一压合板件，并对所述第一压合板件的相对两侧进行研磨，直至所述第一凸台与所述第二凸台裸露的步骤包括：获取两个第一板件，所述第一板件包括铜层或离型膜；分别通过两层第一介质层将两个所述第一板件与所述待加工板件的相对两侧进行压合，得到第一压合板件；去除所述第一压合板件相对两侧的第一板件；对所述第一压合板件的相对两侧进行研磨，以去除部分所述第一介质层，直至所述第一压合板件相对两侧的第一凸台和第二凸台裸露。Wherein, the plate to be processed is pressed to obtain a first pressed plate, and the opposite sides of the first pressed plate are ground until the first boss and the second The step of exposing the boss includes: obtaining two first boards, the first boards comprising a copper layer or a release film; respectively connecting the two first boards with the to-be-to-be-received through two first dielectric layers. Pressing the opposite sides of the processing plate to obtain a first pressing plate; removing the first plate on the opposite sides of the first pressing plate; grinding the opposite sides of the first pressing plate, in order to remove part of the first dielectric layer, until the first bosses and the second bosses on the opposite sides of the first pressing board are exposed.
其中，所述对所述第一压合板件的相对两侧进行研磨的步骤包括：通过铲 平、刷板、激光烧蚀、离子切割、离子抛光或水刀方式对所述第一压合板件的相对两侧进行表面研磨处理。Wherein, the step of grinding the opposite sides of the first pressing plate member includes: grinding the first pressing plate member by means of leveling, brushing, laser ablation, ion cutting, ion polishing or water jet. The opposite sides of the surface are ground.
其中，所述分别在所述第一压合板件的相对两侧上设置导电层，以对所述第一压合板件进行增层的步骤包括：分别对所述第一压合板件的相对两侧进行粗化处理；通过沉积或电镀在所述第一压合板件的相对两侧上分别设置一层导电层，以对所述第一压合板件进行增层。Wherein, the step of disposing conductive layers respectively on opposite sides of the first pressing plate member so as to add layers to the first pressing plate member includes: respectively applying conductive layers to the opposite two sides of the first pressing plate member. Roughening treatment is performed on the sides; a conductive layer is respectively provided on the opposite sides of the first laminated board by deposition or electroplating, so as to add layers to the first laminated board.
其中，所述获取待加工板件的步骤包括：获取到覆铜板；通过钻孔在所述覆铜板上形成至少一个孔，其中，所述孔包括通孔和微盲孔；对至少一个所述孔进行孔化处理，得到所述待加工板件。Wherein, the step of obtaining the plate to be processed includes: obtaining a copper clad plate; forming at least one hole on the copper clad plate by drilling, wherein the hole includes a through hole and a micro-blind hole; The holes are subjected to hole treatment to obtain the plate to be processed.
其中，所述孔化处理包括沉铜处理、黑孔处理或黑影处理。Wherein, the hole forming treatment includes copper immersion treatment, black hole treatment or shadow treatment.
其中，所述在所述待加工板件的相对两侧分别设置第一凸台和第二凸台的步骤包括：在所述待加工板件相对两侧的表面上贴覆第一感光膜，并使所述待加工板件的第一预设位置裸露；其中，所述第一预设位置包括所述孔以及所述孔的孔口***位置；对所述待加工板件相对两侧的所述第一预设位置进行填孔电镀，以在所述待加工板件的相对两侧分别形成所述第一凸台和所述第二凸台；去除所述待加工板件上的第一感光膜。Wherein, the step of disposing the first boss and the second boss respectively on the opposite sides of the plate to be processed includes: sticking a first photosensitive film on the surfaces of the opposite sides of the plate to be processed, and expose the first preset position of the plate to be processed; wherein, the first preset position includes the hole and the peripheral position of the hole of the hole; Filling and electroplating are performed at the first preset position to form the first boss and the second boss respectively on opposite sides of the plate to be processed; remove the first boss on the plate to be processed. A photosensitive film.
其中，所述在所述待加工板件的相对两侧分别设置第一凸台和第二凸台的步骤之后包括：在所述待加工板件相对两侧的第二预设位置上贴覆第二感光膜，并对所述待加工板件的相对两侧进行蚀刻，以在所述待加工板件上形成导电线路；去除所述待加工板件上的所述第二感光膜。Wherein, after the step of disposing a first boss and a second boss respectively on opposite sides of the plate to be processed, the step includes: pasting on second preset positions on opposite sides of the plate to be processed The second photosensitive film is etched on opposite sides of the to-be-processed board to form conductive lines on the to-be-processed board; the second photosensitive film on the to-be-processed board is removed.
其中，所述分别对所述第一压合板件的相对两侧进行图形转移，以在所述第一压合板件上形成导电线路的步骤之后包括：分别在所述第一压合板件相对两侧的第三预设位置进行电镀，以在所述第三预设位置形成第三凸台和第四凸台；对所述第一压合板件进行压合，得到第二压合板件，并对所述第二压合板件进行研磨，直至所述第三凸台和第四凸台裸露；在所述第二压合板件的相对两侧上设置所述导电层，以对所述第二压合板件进行增层。Wherein, after the step of performing pattern transfer on opposite sides of the first pressing plate member respectively to form conductive lines on the first pressing plate member, the step includes: respectively placing two opposite sides of the first pressing plate member on the opposite sides of the first pressing plate member. Electroplating is performed at the third preset position on the side to form a third boss and a fourth boss at the third preset position; the first pressing plate is pressed to obtain a second pressing plate, and Grinding the second pressing plate piece until the third boss and the fourth boss are exposed; disposing the conductive layers on opposite sides of the second pressing plate piece, so as to prevent the second pressing plate Laminate laminates.
为解决上述技术问题，本发明还提供了一种印制线路板，该印制线路板由上述任一项的印制线路板的制备方法制备而成。In order to solve the above technical problems, the present invention also provides a printed circuit board prepared by any one of the above-mentioned methods for preparing a printed circuit board.
本发明的有益效果是；区别于现有技术的情况，本发明的印制线路板通过获取待加工板件；在待加工板件的相对两侧分别设置第一凸台和第二凸台，其中，第一凸台与第二凸台部分重叠；对待加工板件进行压合，得到第一压合板件，并对第一压合板件的相对两侧进行研磨，直至第一凸台与第二凸台裸露；分别在第一压合板件的相对两侧上设置导电层，以对第一压合板件进行增层；分别对第一压合板件的相对两侧进行图形转移，以在第一压合板件上形成导电线路，得到印制线路板。本发明在待加工板件的相对两侧分别设置第一凸台和第二凸台，其中，第一凸台和第二凸台部分重叠。并在对待加工板件进行压合 后，分别在第一压合板件裸露第一凸台和第二凸台的一侧上设置导电层，以对第一压合板件进行增层，从而依靠错位设置的第一凸台和第二凸台增加待加工板件与导电层之间的板件散热表面积和效率，提高印制线路板的品质和可靠性。另外，本实施例板件之间的板件散热并不需要在成品印制线路板中嵌入金属基或设置微盲孔阵列，减少对布线空间的影响和避免了制备金属基所来带的制备问题。The beneficial effects of the present invention are: different from the situation in the prior art, the printed circuit board of the present invention obtains the plate to be processed; the first boss and the second boss are respectively provided on opposite sides of the plate to be processed, Wherein, the first boss and the second boss are partially overlapped; the plate to be processed is pressed to obtain a first pressed plate, and the opposite sides of the first pressed plate are ground until the first boss and the second The two bosses are exposed; the conductive layers are respectively arranged on the opposite sides of the first pressing plate to add layers to the first pressing; A conductive circuit is formed on a laminated board to obtain a printed circuit board. In the present invention, first bosses and second bosses are respectively provided on opposite sides of the plate to be processed, wherein the first bosses and the second bosses partially overlap. And after the plate to be processed is pressed, a conductive layer is respectively arranged on the side of the first pressing plate that exposes the first boss and the second boss, so as to add layers to the first pressing plate, so as to rely on the dislocation. The provided first boss and second boss increase the heat dissipation surface area and efficiency of the board between the board to be processed and the conductive layer, and improve the quality and reliability of the printed circuit board. In addition, the heat dissipation between the boards in this embodiment does not require embedding a metal base or setting a micro-blind hole array in the finished printed circuit board, which reduces the impact on the wiring space and avoids the preparation of the metal base. question.
【附图说明】【Description of drawings】
图1是本发明提供的印制线路板的制备方法一实施例的流程示意图；1 is a schematic flowchart of an embodiment of a method for preparing a printed circuit board provided by the present invention;
图2是本发明提供的印制线路板的制备方法另一实施例的流程示意图；2 is a schematic flowchart of another embodiment of a method for preparing a printed circuit board provided by the present invention;
图3a是步骤S21中待加工板件一实施例的结构示意图；3a is a schematic structural diagram of an embodiment of the plate to be processed in step S21;
图3b是步骤S22中贴覆第一感光膜后的待加工板件一实施例的结构示意图；3b is a schematic structural diagram of an embodiment of the plate to be processed after the first photosensitive film is pasted in step S22;
图3c是步骤S22中去除第一感光膜后的待加工板件一实施例的结构示意图；3c is a schematic structural diagram of an embodiment of the plate to be processed after removing the first photosensitive film in step S22;
图3d是步骤S23中贴覆第二感光膜后的待加工板件一实施例的结构示意图；3d is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is pasted in step S23;
图3e是步骤S23中去除第二感光膜后的待加工板件一实施例的结构示意图；3e is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is removed in step S23;
图3f是第一压合板件一实施例的结构示意图。本实施例中将以第一板件为单层铜层进行压合为例进行说明；FIG. 3f is a schematic structural diagram of an embodiment of the first pressing plate member. In this embodiment, the first board member is a single-layer copper layer for lamination as an example for description;
图3g是第一压合板件表面研磨处理后一实施例的结构示意图；3g is a schematic structural diagram of an embodiment after the surface grinding treatment of the first pressing plate member;
图3h是第一压合板件增层后一实施例的结构示意图；FIG. 3h is a schematic structural diagram of an embodiment after the first laminated board is layered;
图4是本实施例步骤S27之后的印制线路板的制备方法一实施例的流程示意图；4 is a schematic flowchart of an embodiment of a method for preparing a printed circuit board after step S27 in this embodiment;
图4a是本实施例第一压合板件去除第一感光膜后的结构示意图；FIG. 4a is a schematic structural diagram of the first lamination plate in this embodiment after removing the first photosensitive film;
图4b是本实施例第一压合板件图形蚀刻后的结构示意图；FIG. 4b is a schematic structural diagram of the first lamination plate part after pattern etching in this embodiment;
图4c是本实施例第二压合板件研磨后的结构示意图；FIG. 4c is a schematic structural diagram of the second pressing plate piece of the present embodiment after grinding;
图4d是本实施例第二压合板件增层后的结构示意图；FIG. 4d is a schematic structural diagram of the second laminated plate member of the present embodiment after adding layers;
图5是本发明印制线路板一实施例的结构示意图。FIG. 5 is a schematic structural diagram of an embodiment of the printed circuit board of the present invention.
【具体实施方式】【Detailed ways】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。It should be noted that if there are directional indications (such as up, down, left, right, front, back, etc.) involved in the embodiments of the present invention, the directional indications are only used to explain a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.
另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for the purpose of description, and should not be construed as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.
请参阅图1，图1是本发明提供的印制线路板的制备方法一实施例的流程示意图，本实施例的印制线路板为多层线路板，其中，本实施例的多层线路板包括两层线路板以及两层以上的线路板。Please refer to FIG. 1. FIG. 1 is a schematic flowchart of an embodiment of a method for preparing a printed circuit board provided by the present invention. The printed circuit board in this embodiment is a multi-layer circuit board, wherein the multi-layer circuit board in this embodiment is Including two-layer circuit boards and circuit boards with more than two layers.
步骤S11：获取待加工板件。Step S11: Obtain the plate to be processed.
在一个具体的应用场景中，待加工板件可以为覆铜板，也可以为加工过程中已被压合，但仍需增层的多层线路板。其中，覆铜板(Copper Clad Laminate，CCL)是指将电子玻纤布或其它增强材料浸以树脂，一面或双面覆以铜箔并经热压而制成的一种原始板状材料。In a specific application scenario, the plate to be processed can be a copper clad laminate, or a multi-layer circuit board that has been pressed during processing but still needs to be added. Among them, copper clad laminate (Copper Clad Laminate, CCL) refers to an original plate-like material made by dipping electronic glass fiber cloth or other reinforcing materials with resin, coating one or both sides with copper foil and hot pressing.
在本实施例中，覆铜板为双面附有铜箔的板状材料。In this embodiment, the copper clad laminate is a plate-like material with copper foils attached to both sides.
步骤S12：在待加工板件的相对两侧分别设置第一凸台和第二凸台，其中，第一凸台与第二凸台部分重叠。Step S12: Disposing a first boss and a second boss on opposite sides of the plate to be processed, wherein the first boss and the second boss are partially overlapped.
分别在待加工板件相对两侧的预设位置进行铜层增厚，以在待加工板件的相对两侧形成第一凸台和第二凸台，其中，第一凸台和第二凸台分别设置在待加工板件的相对两侧，且第一凸台与第二凸台之间且部分重叠，从而扩大了第一凸台与第二凸台之间的表面积，从而增大成品印制线路板的散热面积，提高散热效率。The copper layer is thickened at preset positions on opposite sides of the plate to be processed, so as to form a first boss and a second boss on the opposite sides of the plate to be processed, wherein the first boss and the second boss are The platforms are respectively arranged on opposite sides of the plate to be processed, and the first boss and the second boss are partially overlapped, thereby expanding the surface area between the first boss and the second boss, thereby increasing the finished product The heat dissipation area of the printed circuit board improves the heat dissipation efficiency.
在一个具体的应用场景中，可以通过在待加工板件相对两侧的预设位置涂覆含铜电镀液，并对预设位置进行电镀，从而对预设位置进行铜层增厚，形成第一凸台和第二凸台。在一个具体的应用场景中，也可以通过在待加工板件相对两侧的预设位置进行沉铜，从而对预设位置进行铜层增厚，形成第一凸台和第二凸台。In a specific application scenario, the copper-containing electroplating solution can be applied to the preset positions on the opposite sides of the plate to be processed, and the preset positions can be electroplated, so that the copper layer can be thickened at the preset positions to form the first A boss and a second boss. In a specific application scenario, copper immersion can also be performed at preset positions on opposite sides of the plate to be processed, so as to thicken the copper layer at the preset positions to form the first boss and the second boss.
步骤S13：对待加工板件进行压合，得到第一压合板件，并对第一压合板件的相对两侧进行研磨，直至第一凸台与第二凸台裸露。Step S13: Pressing the plate to be processed to obtain a first pressing plate, and grinding opposite sides of the first pressing plate until the first boss and the second boss are exposed.
对待加工板件进行高温压合，得到第一压合板件。在一个具体的应用场景中，可以分别通过半固化片将待加工板件的相对两侧和导电层进行高温压合， 得到第一压合板件。在一个具体的应用场景中，也可以分别通过树脂片将离型膜和待加工板件的相对两侧进行高温压合，得到第一压合板件。在此不做限定。The plate to be processed is subjected to high temperature lamination to obtain a first lamination plate. In a specific application scenario, the opposite sides of the plate to be processed and the conductive layer may be pressed together at high temperature through the prepreg, respectively, to obtain the first pressed plate. In a specific application scenario, the release film and the opposite sides of the plate to be processed can also be pressed together at high temperature through resin sheets to obtain the first pressed plate. This is not limited.
将压合后的第一压合板件的相对两侧进行研磨，直至第一压合板件上相对两侧的第一凸台和第二凸台裸露出来。在一个具体的应用场景中，对第一压合板件的相对两侧进行研磨，直至第一凸台和第二凸台裸露，此时，第一压合板件设置有第一凸台的一侧表面平齐，设置有第二凸台的一侧表面平齐。也就是第一压合板件的一侧表面与第一凸台的表面高度平齐，第一压合板件的另一侧表面与第二凸台的表面高度平齐，以便于后续相对两侧的导电层的附着设置。The opposite sides of the pressed first pressing plate are ground until the first bosses and the second bosses on the opposite sides of the first pressing plate are exposed. In a specific application scenario, the opposite sides of the first pressing plate are ground until the first boss and the second boss are exposed. At this time, the first pressing plate is provided with the side of the first boss. The surface is flush, and the surface of the side provided with the second boss is flush. That is, one side surface of the first pressing plate is at the same height as the surface of the first boss, and the other side surface of the first pressing plate is at the same height as the surface of the second boss, so that the subsequent Attachment settings of conductive layers.
步骤S14：分别在第一压合板件的相对两侧上设置导电层，以对第一压合板件进行增层。Step S14: Disposing conductive layers on opposite sides of the first laminated board respectively, so as to add layers to the first laminated board.
对第一压合板件的相对两侧进行研磨，直至第一凸台和第二凸台裸露后，在第一压合板件裸露第一凸台的一侧上和裸露第二凸台的另一侧上分别设置导电层，以对第一压合板件进行双面增层。其中，两侧导电层与第一凸台和第二凸台连通，以使第一凸台和第二凸台能够在导电层与第一压合板件之间进行散热，从而提高印制线路板的寿命和可靠性。Grinding the opposite sides of the first pressing plate until the first boss and the second boss are exposed, on the side of the first pressing plate with the exposed first boss and on the other side where the second boss is exposed Conductive layers are respectively arranged on the sides, so as to perform double-sided build-up on the first laminated board. Wherein, the conductive layers on both sides are communicated with the first boss and the second boss, so that the first boss and the second boss can dissipate heat between the conductive layer and the first laminated board, thereby improving the performance of the printed circuit board. life and reliability.
步骤S15：分别对第一压合板件的相对两侧进行图形转移，以在第一压合板件上形成导电线路，得到印制线路板。Step S15 : performing pattern transfer on the opposite sides of the first pressing board member respectively, so as to form conductive lines on the first pressing board member to obtain a printed circuit board.
对增层后的第一压合板件的相对两侧进行图形转移，以在第一压合板件的相对两侧上形成导电线路，从而实现板件的电路功能，得到印制线路板。The pattern transfer is performed on the opposite sides of the laminated first laminated board to form conductive lines on the opposite sides of the first laminated board, so as to realize the circuit function of the board and obtain a printed circuit board.
其中，图形转移是指在处理过的铜面上贴覆或涂覆一层感光膜。在紫外线的照射下，将菲林底片上的线路图形转移到铜面上，形成一种抗蚀的掩模图形，而未被抗蚀的掩模图形保护的不被需要的铜箔，将在后续化学蚀刻工艺中，被蚀刻掉。经过蚀刻工艺后再褪去抗蚀感光膜，得到所需要的导电线路。Among them, the pattern transfer refers to pasting or coating a layer of photosensitive film on the treated copper surface. Under the irradiation of ultraviolet rays, the circuit pattern on the film negative is transferred to the copper surface to form a resist mask pattern, and the unnecessary copper foil not protected by the resist mask pattern will be used in the follow-up During the chemical etching process, it is etched away. After the etching process, the resist photosensitive film is removed to obtain the required conductive lines.
在一个具体的应用场景中，当需要对多层线路板继续进行增层时，可以在步骤S15之后对多层线路板重复循环执行步骤S12-步骤S15，直至印制线路板的厚度或规格满足制备需求。In a specific application scenario, when it is necessary to continue to add layers to the multi-layer circuit board, steps S12 to S15 can be repeatedly performed on the multi-layer circuit board after step S15 until the thickness or specifications of the printed circuit board meet the requirements. Preparation requirements.
通过上述方式，本实施例的印制线路板通过在待加工板件的相对两侧分别设置第一凸台和第二凸台，其中，第一凸台和第二凸台部分重叠。并在对待加工板件进行压合后，分别在第一压合板件裸露第一凸台和第二凸台的一侧上设置导电层，以对第一压合板件进行增层，从而增加待加工板件与导电层之间的板件散热表面积和效率，提高印制线路板的品质和可靠性。另外，本实施例板件之间的板件散热并不需要在成品印制线路板中嵌入金属基或设置微盲孔阵列，减少对布线空间的影响和避免了制备金属基所来带的制备问题。In the above manner, in the printed circuit board of this embodiment, first bosses and second bosses are respectively provided on opposite sides of the board to be processed, wherein the first bosses and the second bosses partially overlap. And after the plate to be processed is pressed, a conductive layer is respectively arranged on the side of the first pressed plate that exposes the first boss and the second boss, so as to add layers to the first pressed plate, thereby increasing the number of layers to be pressed. Process the heat dissipation surface area and efficiency of the board between the board and the conductive layer, and improve the quality and reliability of the printed circuit board. In addition, the heat dissipation between the boards in this embodiment does not require embedding a metal base or setting a micro-blind hole array in the finished printed circuit board, which reduces the impact on the wiring space and avoids the preparation of the metal base. question.
请参阅图2，图2是本发明提供的印制线路板的制备方法另一实施例的流程示意图，本实施例的印制线路板为多层线路板，其中，本实施例的多层线路板包括两层线路板以及两层以上的线路板。Please refer to FIG. 2. FIG. 2 is a schematic flowchart of another embodiment of the method for preparing a printed circuit board provided by the present invention. The printed circuit board in this embodiment is a multi-layer circuit board. The board includes a two-layer circuit board and a circuit board with more than two layers.
步骤S21：获取到覆铜板；通过钻孔在覆铜板上形成至少一个孔，其中，孔包括通孔和微盲孔；对至少一个孔进行孔化处理，得到待加工板件。Step S21 : obtaining a copper clad plate; forming at least one hole on the copper clad plate by drilling, wherein the hole includes a through hole and a micro-blind hole; performing hole processing on the at least one hole to obtain a plate to be processed.
获取到覆铜板。覆铜板包括介质层和铜层，其介质层可以一面覆盖铜层，也可以双面覆盖铜层。在本实施例中，将以覆铜板的介质层的双面覆盖铜层为例，且对覆铜板进行双面增层进行说明。其中，覆铜板进行单面增层的方法与双面增层的方法类似，可对本实施例的印制线路板的制备方法进行参考。Obtain the copper clad laminate. The copper clad laminate includes a dielectric layer and a copper layer, and the dielectric layer can cover the copper layer on one side or cover the copper layer on both sides. In this embodiment, the double-sided copper cladding layer of the dielectric layer of the copper clad laminate will be taken as an example, and the double-sided buildup of the copper clad laminate will be described. Wherein, the method for single-sided build-up of the copper clad laminate is similar to the method for double-sided build-up, and reference may be made to the preparation method of the printed circuit board in this embodiment.
对覆铜板进行钻孔，以在覆铜板上钻出至少一个孔。在一个具体的应用场景中，可以通过机械钻孔对覆铜板进行钻孔，以在覆铜板上钻出至少一个孔。在一个具体的应用场景中，也可以通过激光钻孔对覆铜板进行钻孔，以在覆铜板上钻出至少一个孔。The copper clad laminate is drilled to drill at least one hole in the copper clad laminate. In a specific application scenario, the copper clad laminate may be drilled through mechanical drilling to drill at least one hole in the copper clad laminate. In a specific application scenario, the copper clad laminate can also be drilled by laser drilling to drill at least one hole in the copper clad laminate.
本步骤中的孔需要贯穿覆铜板的介质层，以使后续制备过程中，介质层上下两面能够导通互联。其中，孔包括通孔和微盲孔。其中，通孔是指贯通两层或多层，上下贯通的孔；微盲孔是指连接相邻两层而不贯通的导通孔。在本步骤中，覆铜板上的通孔和微盲孔都贯穿覆铜板的介质层，通孔贯穿整个覆铜板，微盲孔贯穿覆铜板一侧的铜层和中间的介质层，不贯穿覆铜板另一侧的铜层，从而用于导通覆铜板介质层两侧的铜，对热量进行扩散。The holes in this step need to penetrate through the dielectric layer of the copper clad laminate, so that in the subsequent preparation process, the upper and lower sides of the dielectric layer can be connected to each other. Among them, the holes include through holes and micro-blind holes. Wherein, a through hole refers to a hole that penetrates two or more layers and penetrates up and down; a micro-blind hole refers to a via hole that connects two adjacent layers without passing through. In this step, the through-holes and micro-blind vias on the CCL penetrate the dielectric layer of the CCL, the through-holes penetrate the entire CCL, and the micro-blind vias penetrate the copper layer on one side of the CCL and the middle dielectric layer, and do not penetrate through the CCL The copper layer on the other side of the copper plate is used to conduct the copper on both sides of the dielectric layer of the copper clad laminate to diffuse heat.
对覆铜板进行钻孔，以在覆铜板上钻出至少一个孔。在一个具体的的应用场景中，可以在覆铜板上钻出多个通孔或微盲孔，例如：3个、5个、10个，孔的具体数量可以根据印制线路板的散热需求而设置，在此不做限定。在一个具体的应用场景中，当对覆铜板进行激光钻孔或机械钻孔，并在覆铜板上钻出至少一个孔后，覆铜板上的孔内可能残留树脂渣、铜渣等钻污，因此，本步骤中还需对覆铜板上的孔进行去钻污处理，以对覆铜板上的孔进行清洁。The copper clad laminate is drilled to drill at least one hole in the copper clad laminate. In a specific application scenario, multiple through holes or micro-blind holes can be drilled on the CCL, for example: 3, 5, 10, and the specific number of holes can be determined according to the heat dissipation requirements of the printed circuit board. Settings, which are not limited here. In a specific application scenario, after laser drilling or mechanical drilling is performed on the CCL, and at least one hole is drilled on the CCL, there may be residual resin slag, copper slag and other drilling contamination in the holes on the CCL. Therefore, in this step, the holes on the copper clad plate also need to be de-drilled to clean the holes on the copper clad plate.
对覆铜板上的孔进行孔化处理，得到本实施例的待加工板件。其中，孔化处理包括沉铜处理、黑孔处理或黑影处理。通过对覆铜板上的孔进行孔化处理，以在孔的孔壁或/和孔底上覆盖一层导电材质，便于后续对其填孔电镀。其中，黑孔处理是指是将精细的石墨或炭黑涂料(黑孔液)浸涂在孔的孔壁或/和孔底上形成导电层；黑影处理是指将成份含有独特的添加剂及导电胶状物质的黑影液浸涂在孔的孔壁或/和孔底上，使孔壁或/和孔底上形成导电层；而沉铜处理是指用化学的方法在孔的孔壁或/和孔底沉积上一层薄薄的化学铜，以作为电镀的基底。The holes on the copper clad plate are subjected to hole treatment to obtain the plate to be processed in this embodiment. Wherein, the hole forming treatment includes copper immersion treatment, black hole treatment or shadow treatment. The hole on the copper clad plate is subjected to hole treatment, so that a layer of conductive material is covered on the hole wall or/and the hole bottom, which is convenient for subsequent hole filling and electroplating. Among them, black hole treatment refers to that fine graphite or carbon black paint (black hole liquid) is dip-coated on the hole wall or/and the hole bottom to form a conductive layer; black shadow treatment refers to the composition containing unique additives and The black shadow liquid of the conductive colloidal substance is dip-coated on the hole wall or/and the hole bottom of the hole, so that a conductive layer is formed on the hole wall or/and the hole bottom; while the copper immersion treatment refers to the chemical method on the hole wall of the hole. Or/and a thin layer of chemical copper is deposited on the bottom of the hole as a base for electroplating.
请参阅图3a，图3a是步骤S21中待加工板件一实施例的结构示意图。Please refer to FIG. 3a. FIG. 3a is a schematic structural diagram of an embodiment of the plate to be processed in step S21.
本实施例的待加工板件100包括上层铜层1021、介质层101和下层铜层1022。上层铜层1021、介质层101和下层铜层1022依次层叠且贴合设置。待加工板件100上设置有微盲孔103和通孔104。其中，微盲孔103贯穿上层铜层1021和介质层101，微盲孔103的孔底由下层铜层1022构成，通孔104整个贯穿上层铜层1021、介质层101和下层铜层1022。The board to be processed 100 in this embodiment includes an upper copper layer 1021 , a dielectric layer 101 and a lower copper layer 1022 . The upper layer copper layer 1021 , the dielectric layer 101 and the lower layer copper layer 1022 are stacked in sequence and arranged in a bonded manner. Micro blind holes 103 and through holes 104 are provided on the plate 100 to be processed. The micro blind via 103 penetrates the upper copper layer 1021 and the dielectric layer 101 , the bottom of the micro blind via 103 is formed by the lower copper layer 1022 , and the through hole 104 penetrates the upper copper layer 1021 , the dielectric layer 101 and the lower copper layer 1022 .
本实施例只对通孔和微盲孔的结构进行展示，并不对实际生产过程中待加工板件上的孔的数量和结构进行限定。This embodiment only shows the structures of through holes and micro-blind holes, and does not limit the number and structure of holes on the plate to be processed in the actual production process.
步骤S22：在待加工板件相对两侧的表面上贴覆第一感光膜，并使待加工板件的第一预设位置裸露，其中，第一预设位置包括孔以及孔的孔口***位置，对待加工板件相对两侧的第一预设位置进行填孔电镀，以在待加工板件的相对两侧分别形成第一凸台和第二凸台，去除待加工板件上的第一感光膜。Step S22 : pasting a first photosensitive film on the surfaces on opposite sides of the board to be processed, and exposing the first preset position of the board to be processed, wherein the first preset position includes the hole and the periphery of the hole of the hole position, the first preset positions on the opposite sides of the plate to be processed are filled and electroplated to form a first boss and a second boss on the opposite sides of the plate to be processed, and the first and second bosses on the plate to be processed are removed. A photosensitive film.
在待加工板件相对两侧的表面上贴覆第一感光膜，并使上表面的第一预设位置和下表面的第一预设位置裸露；其中，第一预设位置包括孔以及孔口的***位置。在一个具体的应用场景中，第一预设位置也可以只包括孔的位置。而同一个孔对应的上表面的第一预设位置和下表面的第一预设位置部分重叠。A first photosensitive film is pasted on the surfaces on opposite sides of the plate to be processed, and the first preset position on the upper surface and the first preset position on the lower surface are exposed; wherein, the first preset position includes holes and holes peripheral location of the mouth. In a specific application scenario, the first preset position may also only include the position of the hole. The first preset position of the upper surface and the first preset position of the lower surface corresponding to the same hole partially overlap.
在一个具体的应用场景中，第一感光膜可以是感光抗镀膜或其他感光膜，其中，感光抗镀膜是一种高分子的化合物，它通过特定光源的照射后能够产生一种聚合反应(由单体合成聚合物的反应过程)形成一种稳定的物质附着于板面上，从而达到阻挡电镀的功能。In a specific application scenario, the first photosensitive film can be a photosensitive coating or other photosensitive films, wherein the photosensitive coating is a polymer compound, which can generate a polymerization reaction (by the irradiation of a specific light source) The reaction process of monomer synthesis of polymer) forms a stable substance attached to the board surface, so as to achieve the function of blocking electroplating.
对待加工板件相对两侧的第一预设位置进行填孔电镀，以在待加工板件的相对两侧分别形成第一凸台和第二凸台，去除待加工板件上的第一感光膜。其中，在填孔电镀过程中，第一凸台连接金属化孔，金属化孔连接第二凸台，以形成贯穿待加工板件的铜柱，进行散热。Filling and electroplating are performed on the first preset positions on the opposite sides of the plate to be processed, so as to form a first boss and a second boss on the opposite sides of the plate to be processed, and remove the first photosensitive plate on the plate to be processed. membrane. Wherein, in the process of hole filling and electroplating, the first boss is connected to the metallized hole, and the metallized hole is connected to the second boss to form a copper column penetrating through the plate to be processed for heat dissipation.
请参阅图3b，图3b是步骤S22中贴覆第一感光膜后的待加工板件一实施例的结构示意图。Please refer to FIG. 3b. FIG. 3b is a schematic structural diagram of an embodiment of the plate to be processed after the first photosensitive film is pasted in step S22.
本实施例的待加工板件200包括上层第一感光膜2051、上层铜层2021、介质层201、下层铜层2022以及下层第一感光膜2052。其中，上层第一感光膜2051、上层铜层2021、介质层201、下层铜层2022以及下层第一感光膜2052依次层叠且贴合设置。待加工板件200上设置有微盲孔203和通孔204。上层第一感光膜2051和下层第一感光膜2052不与微盲孔203和通孔204重叠。且上层第一感光膜2051和下层第一感光膜2052不覆盖上层铜层2021和下层铜层2022上微盲孔203和通孔204的孔口***位置，以将上表层第一预设位置2061和下表层第一预设位置2062裸露出来。其中，上表层第一预设位置2061和下表层第一预设位置2062是指待加工板件200上所有孔以及孔口***位置。且上表面第一预设位置2061和下表面第一预设位置2062只部分重叠。The plate to be processed 200 in this embodiment includes an upper first photosensitive film 2051 , an upper copper layer 2021 , a dielectric layer 201 , a lower copper layer 2022 , and a lower first photosensitive film 2052 . The upper first photosensitive film 2051 , the upper copper layer 2021 , the dielectric layer 201 , the lower copper layer 2022 , and the lower first photosensitive film 2052 are sequentially stacked and laminated. Micro blind holes 203 and through holes 204 are provided on the plate 200 to be processed. The upper first photosensitive film 2051 and the lower first photosensitive film 2052 do not overlap with the micro blind holes 203 and the through holes 204 . And the upper first photosensitive film 2051 and the lower first photosensitive film 2052 do not cover the peripheral positions of the micro blind holes 203 and the through holes 204 on the upper copper layer 2021 and the lower copper layer 2022, so that the first preset position 2061 of the upper surface layer is not covered. and the first preset position 2062 of the lower layer is exposed. Wherein, the first preset position 2061 of the upper surface layer and the first preset position 2062 of the lower surface layer refer to all the holes on the plate 200 to be processed and the peripheral positions of the holes. And the first preset position 2061 on the upper surface and the first preset position 2062 on the lower surface only partially overlap.
其中，微盲孔203和通孔204的孔口***位置是指沿孔口的边沿线周围一圈的位置。其中，孔口***的具体范围可以依据实际生产中第一凸台的顶端面积的散热需求而定，在此不做限定。Wherein, the peripheral positions of the micro blind holes 203 and the through holes 204 refer to the positions around the periphery of the orifices. The specific range of the periphery of the orifice may be determined according to the heat dissipation requirement of the top area of the first boss in actual production, which is not limited herein.
对待加工板件200的上表面第一预设位置2061和下表面第一预设位置2062进行填孔电镀，以对微盲孔203和通孔204进行孔金属化，并同时定向增加上表面第一预设位置2061和下表面第一预设位置2062的铜厚，以在上表面第一 预设位置2061形成第一凸台(图中未示出)和在下表面第一预设位置2062形成第二凸台(图中未示出)，填孔电镀完成后，去除待加工板件200上的上层第一感光膜2051和下层第一感光膜2052。Fill plating is performed on the first preset position 2061 on the upper surface and the first preset position 2062 on the lower surface of the plate 200 to be processed, so as to perform hole metallization on the micro blind holes 203 and the through holes 204, and at the same time increase the number of holes on the upper surface. A predetermined position 2061 and a copper thickness of the first predetermined position 2062 on the lower surface to form a first boss (not shown in the figure) on the first predetermined position 2061 on the upper surface and the first predetermined position 2062 on the lower surface For the second boss (not shown in the figure), after the hole filling and electroplating are completed, the upper first photosensitive film 2051 and the lower first photosensitive film 2052 on the board to be processed 200 are removed.
本步骤中，在待加工板件的相对两侧的表面上贴覆第一感光膜后，对待加工板件上的孔和孔口***进行填孔电镀，以对孔进行金属化，并在孔和孔口***镀出一定铜厚，从而形成部分重叠的第一凸台和第二凸台(凸台又称铜柱、铜基)。第一凸台、金属化孔和第二凸台形成贯穿待加工板件的铜柱，以进行散热。填孔电镀结束后，去除待加工板件上的第一感光膜。其中，本步骤中的钻孔和填孔电镀仅是针对待加工板件也就是单层覆铜板进行操作，而不是整个多层线路板，因此，本步骤中的钻孔工艺和填孔电镀工艺并不存在介质层厚度过厚影响盲孔孔型、电镀难度高难以填平盲孔、层间对位、通孔填铜难度高以及选择多个指定层次进行连通的问题。In this step, after the first photosensitive film is pasted on the surfaces of the opposite sides of the plate to be processed, the holes on the to-be-processed plate and the periphery of the orifice are filled and electroplated to metalize the holes. A certain thickness of copper is plated on the periphery of the orifice, thereby forming a partially overlapping first boss and a second boss (the boss is also called copper column, copper base). The first boss, the metallized hole, and the second boss form a copper column penetrating through the plate to be processed, so as to dissipate heat. After the hole filling and electroplating is completed, the first photosensitive film on the plate to be processed is removed. The drilling and hole-filling electroplating in this step is only performed on the plate to be processed, that is, the single-layer copper clad laminate, rather than the entire multi-layer circuit board. Therefore, the drilling process and the hole-filling electroplating process in this step There is no problem that the thickness of the dielectric layer is too thick to affect the blind hole type, the difficulty of electroplating is difficult to fill blind holes, the alignment between layers, the difficulty of filling copper through holes, and the selection of multiple specified layers for connection.
且由于本步骤的第一凸台和第二凸台是针对孔以及孔口***位置进行铜层增厚所形成的，因此，第一凸台和第二凸台的表面面积大于孔口面积，从而本实施例的第一凸台与第二凸台所形成的导通铜柱的导通性能好，散热性能高。And since the first boss and the second boss in this step are formed by thickening the copper layer for the hole and the peripheral position of the orifice, the surface area of the first boss and the second boss is larger than the area of the orifice, Therefore, the conductive copper pillars formed by the first boss and the second boss in this embodiment have good conduction performance and high heat dissipation performance.
请参阅图3c，图3c是步骤S22中去除第一感光膜后的待加工板件一实施例的结构示意图。Please refer to FIG. 3c. FIG. 3c is a schematic structural diagram of an embodiment of the plate to be processed after the first photosensitive film is removed in step S22.
本实施例的待加工板件300包括：第一凸台307、上层铜层3021、介质层301、下层铜层3022以及第二凸台308。上层铜层3021、介质层301以及下层铜层3022依次层叠且贴合设置。其中，上层铜层3021远离介质层301的一侧上设置有第一凸台307。下层铜层3022远离介质层301的一侧上设置有第二凸台308。上层铜层3021上的第一凸台307与下层铜层3022上的第二凸台308一一对应，但部分重叠，以导通介质层301的上下两侧，进行散热。The plate to be processed 300 in this embodiment includes: a first boss 307 , an upper copper layer 3021 , a dielectric layer 301 , a lower copper layer 3022 , and a second boss 308 . The upper layer copper layer 3021 , the dielectric layer 301 and the lower layer copper layer 3022 are stacked in sequence and are arranged by lamination. The first boss 307 is disposed on the side of the upper copper layer 3021 away from the dielectric layer 301 . A second boss 308 is disposed on the side of the lower copper layer 3022 away from the dielectric layer 301 . The first bosses 307 on the upper copper layer 3021 are in one-to-one correspondence with the second bosses 308 on the lower copper layer 3022, but partially overlap to conduct the upper and lower sides of the dielectric layer 301 for heat dissipation.
步骤S23：在待加工板件相对两侧的第二预设位置上贴覆第二感光膜，并对待加工板件的相对两侧进行蚀刻，以在待加工板件上形成导电线路，去除待加工板件上的第二感光膜。Step S23: A second photosensitive film is pasted on the second preset positions on the opposite sides of the plate to be processed, and the opposite sides of the plate to be processed are etched to form conductive lines on the plate to be processed, and the to-be-processed plate is removed. Process the second photosensitive film on the plate.
基于图形转移的需求，在待加工板件的上层铜层与下层铜层的表面上贴覆第二感光膜，也就是，在待加工板件相对两侧的第二预设位置上贴覆第二感光膜，并对待加工板件进行图形蚀刻，以在待加工板件的上层铜层与下层铜层上形成导电线路，以实现待加工板件的电路导通功能。图形蚀刻完成后，去除待加工板件上相对两侧的第二感光膜。其中，第二感光膜可以是感光抗蚀膜，感光抗蚀膜是一种高分子的化合物，它通过特定光源的照射后能够产生一种聚合反应(由单体合成聚合物的反应过程)形成一种稳定的物质附着于板面，从而达到阻挡蚀刻的功能。第二预设位置为待加工板件相对两侧的不需要制作导电线路的位置。Based on the requirements of pattern transfer, a second photosensitive film is pasted on the surfaces of the upper copper layer and the lower copper layer of the plate to be processed, that is, the second photosensitive film is pasted on the second preset positions on opposite sides of the plate to be processed. Two photosensitive films, and perform pattern etching on the board to be processed to form conductive lines on the upper copper layer and the lower copper layer of the board to be processed, so as to realize the circuit conduction function of the board to be processed. After the pattern etching is completed, the second photosensitive films on opposite sides of the plate to be processed are removed. Among them, the second photosensitive film can be a photosensitive resist film, and the photosensitive resist film is a polymer compound, which can produce a polymerization reaction (the reaction process of synthesizing a polymer from a monomer) after being irradiated by a specific light source. A stable substance adheres to the surface of the board, thereby achieving the function of blocking etching. The second preset position is a position on opposite sides of the plate to be processed where no conductive lines need to be made.
请参阅图3d，图3d是步骤S23中贴覆第二感光膜后的待加工板件一实施例 的结构示意图。Please refer to FIG. 3d. FIG. 3d is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is pasted in step S23.
本实施例的待加工板件400包括第二感光膜409、上层铜层4021、第一凸台407、介质层401、下层铜层4022以及第二凸台408。第二感光膜409、第一凸台407、上层铜层4021、介质层401、下层铜层4022、第二凸台408以及第二感光膜409依次层叠且贴合设置。其中，上层铜层4021远离介质层401的一侧设置有多个第二感光膜409和多个第一凸台407。下层铜层4022远离介质层401的一侧设置有多个第二感光膜409和多个第二凸台408。其中，每个第一凸台407远离介质层401一侧的表面上都贴覆有第二感光膜409，以对第一凸台407进行保护；每个第二凸台408远离介质层401一侧的表面上都贴覆有第二感光膜409，以对第二凸台408进行保护。上层铜层4021和下层铜层4022远离介质层401的一侧，且没有覆盖第二感光膜409的位置为需要制作出导电线路的位置。The plate to be processed 400 in this embodiment includes a second photosensitive film 409 , an upper copper layer 4021 , a first boss 407 , a dielectric layer 401 , a lower copper layer 4022 and a second boss 408 . The second photosensitive film 409 , the first bosses 407 , the upper copper layer 4021 , the dielectric layer 401 , the lower copper layer 4022 , the second bosses 408 , and the second photosensitive film 409 are stacked in sequence and attached to each other. A plurality of second photosensitive films 409 and a plurality of first bosses 407 are disposed on the side of the upper copper layer 4021 away from the dielectric layer 401 . A plurality of second photosensitive films 409 and a plurality of second bosses 408 are disposed on the side of the lower copper layer 4022 away from the dielectric layer 401 . Wherein, the surface of each first boss 407 on the side away from the dielectric layer 401 is covered with a second photosensitive film 409 to protect the first boss 407; each second boss 408 is far from the dielectric layer 401 The side surfaces are covered with a second photosensitive film 409 to protect the second bosses 408 . The upper layer copper layer 4021 and the lower layer copper layer 4022 are far from the side of the dielectric layer 401, and the position where the second photosensitive film 409 is not covered is the position where conductive lines need to be fabricated.
对待加工板件400进行蚀刻，以在上层铜层4021和下层铜层4022上蚀刻出导电线路。蚀刻完成后，去除待加工板件400上的第二感光膜409。The plate to be processed 400 is etched to etch conductive lines on the upper copper layer 4021 and the lower copper layer 4022 . After the etching is completed, the second photosensitive film 409 on the plate to be processed 400 is removed.
请参阅图3e，图3e是步骤S23中去除第二感光膜后的待加工板件一实施例的结构示意图。Please refer to FIG. 3e. FIG. 3e is a schematic structural diagram of an embodiment of the plate to be processed after the second photosensitive film is removed in step S23.
本实施例的待加工板件500包括上层铜层5021、介质层501、下层铜层5022。上层铜层5021和下层铜层5022经过图形蚀刻后构成了待加工板件500上的导电线路。待加工板件500还包括铜柱507，铜柱507由第一凸台5072、金属化孔5073以及第二凸台5072依次连接形成。待加工板件500通过铜柱507进行板件散热。The plate to be processed 500 in this embodiment includes an upper copper layer 5021 , a dielectric layer 501 , and a lower copper layer 5022 . The upper layer copper layer 5021 and the lower layer copper layer 5022 form conductive lines on the plate 500 to be processed after pattern etching. The plate to be processed 500 further includes copper pillars 507 . The copper pillars 507 are formed by connecting the first bosses 5072 , the metallized holes 5073 and the second bosses 5072 in sequence. The plate 500 to be processed is dissipated by the copper pillars 507 .
步骤S24：获取两个第一板件，第一板件包括铜层或离型膜，分别通过两层第一介质层将两个第一板件与待加工板件的相对两侧进行压合，得到第一压合板件。Step S24: Obtain two first plates, the first plates include a copper layer or a release film, and press the two first plates to the opposite sides of the plate to be processed through the two first dielectric layers respectively , to obtain the first laminated plate.
获取到两个第一板件，其中，第一板件包括铜层或离型膜。离型膜是指薄膜表面能有区分的薄膜，离型膜与特定的材料在有限的条件下接触后不具有粘性，或轻微的粘性。在一个具体的应用场景中，可以获取单层铜层作为第一板件，并分别通过两层第一介质层将单层铜层与待加工板件的相对两侧进行压合，得到第一压合板件。在一个具体的应用场景中，也可以获取单层离型膜作为第一板件，并分别通过两层第一介质层将单层离型膜与待加工板件的相对两侧进行压合，得到第一压合板件。Two first boards are obtained, wherein the first boards include a copper layer or a release film. The release film refers to a film that can be distinguished on the surface of the film. The release film is not sticky or slightly sticky after contacting with a specific material under limited conditions. In a specific application scenario, a single-layer copper layer can be obtained as the first plate, and the single-layer copper layer and the opposite sides of the plate to be processed can be pressed through two first dielectric layers respectively to obtain the first plate. Laminated panels. In a specific application scenario, it is also possible to obtain a single-layer release film as the first plate, and press the single-layer release film to the opposite sides of the plate to be processed through two first dielectric layers, respectively. A first pressed board piece is obtained.
分别通过第一介质层将第一板件与待加工板件的相对两侧进行高温压合，通过压合使第一介质层的介质材料完成对待加工板件相对两侧表面各位置的填充，以将待加工板件和第一板件压合成多层线路板，得到第一压合板件。The first plate and the opposite sides of the plate to be processed are pressed together at high temperature through the first medium layer, and the dielectric material of the first medium layer is filled at each position on the opposite sides of the plate to be processed by pressing. The board to be processed and the first board are pressed into a multi-layer circuit board to obtain a first pressed board.
在一个具体的应用场景中，第一介质层的介质材料可以为：环氧树脂类、聚酰亚胺类、BT类(双马来酰亚胺-三嗪树脂)、ABF类以及陶瓷基类材料，具 体介质材料的选择可以基于实际需求而定，在此不做限定。In a specific application scenario, the dielectric materials of the first dielectric layer may be: epoxy resin, polyimide, BT (bismaleimide-triazine resin), ABF, and ceramic-based Materials, the selection of specific media materials can be determined based on actual needs, which is not limited here.
请参阅图3f，图3f是第一压合板件一实施例的结构示意图。本实施例中将以第一板件为单层铜层进行压合为例进行说明。Please refer to FIG. 3f. FIG. 3f is a schematic structural diagram of an embodiment of the first pressing plate member. In this embodiment, the first board member is a single-layer copper layer for lamination as an example for description.
本实施例的第一压合板件600包括第一板件610、待加工板件620以及第一板件610。其中第一板件610、待加工板件620以及第一板件610通过第一介质层611依次层叠设置。第一板件610和待加工板件620被第一介质层611填充满，待加工板件620上的第一凸台601和第二凸台602的顶端也被第一介质层611覆盖。从而在高温过程中，通过平整的第一板件610压合第一介质层611，以填充满凹凸不平的待加工板件620。The first press-bonded plate member 600 in this embodiment includes a first plate member 610 , a to-be-processed plate member 620 , and a first plate member 610 . The first board member 610 , the to-be-processed board member 620 and the first board member 610 are stacked in sequence through the first dielectric layer 611 . The first board 610 and the to-be-processed board 620 are filled with the first dielectric layer 611 , and the tops of the first and second bosses 601 and 602 on the to-be-processed board 620 are also covered by the first dielectric layer 611 . Therefore, during the high temperature process, the first dielectric layer 611 is pressed against the flat first plate member 610 to fill the uneven plate member 620 to be processed.
步骤S25：去除第一压合板件相对两侧的第一板件，对第一压合板件的相对两侧进行研磨，以去除部分第一介质层，直至第一压合板件相对两侧的第一凸台和第二凸台裸露。Step S25: Remove the first plates on the opposite sides of the first pressing plate, grind the opposite sides of the first pressing plate to remove part of the first dielectric layer, until the first pressing plate is on the opposite sides of the first pressing plate. The first boss and the second boss are exposed.
在一个具体的应用场景中，当第一板件为单层铜层时，获得第一压合板件后，通过蚀刻或磨刷去掉第一压合板件上相对两侧的单层铜层。在一个具体的应用场景中，当第一板件为单层离型膜时，获得第一压合板件后，直接撕除第一压合板件相对两侧的离型膜。In a specific application scenario, when the first board is a single-layer copper layer, after the first laminated board is obtained, the single-layer copper layers on opposite sides of the first laminated board are removed by etching or grinding. In a specific application scenario, when the first plate is a single-layer release film, after the first lamination plate is obtained, the release films on opposite sides of the first lamination plate are directly torn off.
去除掉第一压合板件上相对两侧的第一板件后，对第一压合板件相对两侧进行研磨，以去除部分第一介质层，直至第一压合板件的第一凸台和第二凸台裸露。其中，第一压合板件的第一凸台和第二凸台裸露时，第一压合板件设置有第一凸台的一侧整面与第一凸台的顶端平齐，第一压合板件设置有第二凸台的另一侧整面与第二凸台的顶端平齐，以利于后续增层着附。After removing the first plates on opposite sides of the first pressing plate, grinding the opposite sides of the first pressing plate to remove part of the first dielectric layer, until the first boss of the first pressing plate and the The second boss is exposed. Wherein, when the first boss and the second boss of the first pressing plate are exposed, the entire surface of one side of the first pressing plate with the first boss is flush with the top of the first boss, and the first pressing plate is flush with the top of the first boss. The whole surface of the other side of the part provided with the second boss is flush with the top end of the second boss, so as to facilitate the attachment of subsequent build-up layers.
在一个具体的应用场景中，可以通过铲平、刷板、激光烧蚀、离子切割、离子抛光以及水刀等方式对第一压合板件的相对两侧进行表面研磨处理，直到研磨到第一凸台和第二凸台表面完整露出为止，其中，在实际应用中，具体的研磨方式可以基于实际操作条件而定，在此不做限定。In a specific application scenario, surface grinding treatment can be performed on the opposite sides of the first pressing plate by means of leveling, brushing, laser ablation, ion cutting, ion polishing, and water jetting until the first The surfaces of the bosses and the second bosses are completely exposed, wherein, in practical applications, the specific grinding method may be determined based on actual operating conditions, which is not limited herein.
请参阅图3g，图3g是第一压合板件表面研磨处理后一实施例的结构示意图。Please refer to FIG. 3g. FIG. 3g is a schematic structural diagram of an embodiment after the surface of the first pressing plate is ground.
本实施例的第一压合板件700包括介质层701、铜层702以及第一介质层703。第一介质层703、铜层702、介质层701、铜层702第一介质层703层叠设置。第一压合板件700中还包括第一铜柱704，第一铜柱704贯穿第一压合板件700设置。其中，第一铜柱704的两侧表面与第一压合板件700两侧表面的第一介质层703平齐，也就是处于同一平面上，以利于后续增层材料的附着。The first laminated board member 700 in this embodiment includes a dielectric layer 701 , a copper layer 702 and a first dielectric layer 703 . The first dielectric layer 703 , the copper layer 702 , the dielectric layer 701 , and the copper layer 702 The first dielectric layer 703 is stacked and arranged. The first pressing plate member 700 further includes a first copper column 704 , and the first copper column 704 is disposed through the first pressing plate member 700 . Wherein, the two side surfaces of the first copper pillar 704 are flush with the first dielectric layer 703 on the two side surfaces of the first lamination plate 700 , that is, on the same plane, so as to facilitate the attachment of subsequent build-up materials.
步骤S26：分别对第一压合板件的相对两侧进行粗化处理，通过沉积或电镀在第一压合板件的相对两侧上分别设置一层导电层，以对第一压合板件进行增层。Step S26: Roughening treatment is performed on the opposite sides of the first pressing plate piece respectively, and a conductive layer is respectively provided on the opposite sides of the first pressing plate piece by deposition or electroplating, so as to increase the strength of the first pressing plate piece. layer.
研磨完成后，通过激光烧蚀、等离子粗化、高锰酸钾粗化等方式，对第一压合板件露出第一凸台的整侧表面和第一压合板件露出第二凸台的整侧表面进 行粗化处理，以提高第一压合板件两外侧表面的结合力。After the grinding is completed, by means of laser ablation, plasma roughening, potassium permanganate roughening, etc., the entire side surface of the first boss is exposed to the first pressing plate and the entire surface of the second boss is exposed to the first pressing plate. The side surfaces are roughened, so as to improve the bonding force of the two outer surfaces of the first pressing plate member.
分别通过沉积或电镀在第一压合板件相对两侧上设置一层导电层，以对第一压合板件进行双面增层。在一个具体的应用场景中，可以对第一压合板件的上表面和下表面分别进行黑影处理或黑孔处理，分别在第一压合板件的上表面和下表面上形成一层碳化物，将碳化物作为导电层，以对第一压合板件进行增层。A conductive layer is provided on the opposite sides of the first laminated board by deposition or electroplating respectively, so as to perform double-sided build-up on the first laminated board. In a specific application scenario, black shadow treatment or black hole treatment may be performed on the upper surface and the lower surface of the first pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the first pressing plate respectively. , the carbide is used as a conductive layer to build up the first laminate.
在一个具体的应用场景中，可以分别对第一压合板件的上表面和下表面进行沉铜处理，以分别在第一压合板件的上表面和下表面上沉积一层较厚铜层，将铜层作为导电层，以对第一压合板件进行增层。In a specific application scenario, copper immersion treatment may be performed on the upper surface and the lower surface of the first laminated board respectively, so as to deposit a thicker copper layer on the upper surface and the lower surface of the first laminated board respectively, The copper layer is used as a conductive layer to build up the first laminate part.
在一个具体的应用场景中，可以分别对第一压合板件的上表面和下表面进行沉铜处理，以分别在第一压合板件的上表面和下表面上沉积一层较薄的沉铜层，并在沉铜层之上再电镀一层较厚铜层，将铜层作为导电层，以对第一压合板件进行增层。In a specific application scenario, copper immersion treatment may be performed on the upper surface and the lower surface of the first laminated board respectively, so as to deposit a thin layer of copper immersion on the upper surface and the lower surface of the first laminated board respectively. layer, and a thicker copper layer is electroplated on top of the copper sink layer, and the copper layer is used as a conductive layer to build up the first laminate.
在一个具体的应用场景中，可以分别对第一压合板件的上表面和下表面进行黑影处理或黑孔处理，分别在第一压合板件的上表面和下表面上形成一层碳化物，再在碳化物上电镀一层铜层，将铜层作为导电层，以对第一压合板件进行增层。In a specific application scenario, black shadow treatment or black hole treatment may be performed on the upper surface and the lower surface of the first pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the first pressing plate respectively. , and then electroplating a layer of copper on the carbide, using the copper layer as a conductive layer, so as to add layers to the first laminate.
请参阅图3h，图3h是第一压合板件增层后一实施例的结构示意图。Please refer to FIG. 3h. FIG. 3h is a schematic structural diagram of an embodiment after the first laminated board is laminated.
第一压合板件800包括介质层801和铜层802。其中，第一压合板件800的介质层801的最外侧贴合设置有第一导电层803，其中，第一导电层803与第一铜柱804连接且导通。在本实施例中，第一铜柱804连通第一压合板件800的上下两侧的第一导电层803和铜层802，以对上述铜层进行导通互联。同时，上述各铜层也能够通过第一铜柱804进行散热。The first laminated board member 800 includes a dielectric layer 801 and a copper layer 802 . Wherein, the outermost side of the dielectric layer 801 of the first lamination plate 800 is provided with a first conductive layer 803 , wherein the first conductive layer 803 is connected to the first copper column 804 and is conductive. In this embodiment, the first copper pillars 804 are connected to the first conductive layer 803 and the copper layer 802 on the upper and lower sides of the first laminated board member 800 , so as to conduct conduction and interconnection between the above-mentioned copper layers. At the same time, the above-mentioned copper layers can also dissipate heat through the first copper pillars 804 .
在一个具体的应用场景中，对第一压合板件的相对两侧进行新增导电层后，可以对第一压合板件相对两侧的新增导电层进行图形蚀刻，以在导电层上形成导电线路，实现印制线路板的功能。In a specific application scenario, after adding conductive layers on opposite sides of the first laminate, pattern etching may be performed on the newly added conductive layers on opposite sides of the first laminate to form on the conductive layers Conductive circuit to realize the function of printed circuit board.
通过上述方式，本实施例的印制线路板的制备方法通过先在待加工板件上制备第一凸台和第二凸台，并通过第一介质层对待加工板件和第一板件进行压合，以对待加工板件进行填充整平。去除第一板件并裸露第一凸台的表面后，对板件的整板表面进行粗化，以使后续导电层能够稳定地依附在板件上，从而实现对待加工板件的逐层增层。通过上述方法，本实施例能够在逐层增层的同时，通过逐层设置部分重叠凸台结构对板件各层之间进行导通互联，并增加待加工板件与导电层之间的板件散热面积，提高印制线路板的散热效率，由于本实施例的增层以单层为单位，因此，本实施例的板件互联能够实现任意层之间的互联，灵活性好且自由度高，从而进一步提高印制线路板的可靠性高。In the above manner, the manufacturing method of the printed circuit board of this embodiment is to prepare the first boss and the second boss on the to-be-processed board first, and then use the first dielectric layer to prepare the to-be-processed board and the first board. Pressed to fill and level the plate to be processed. After removing the first plate and exposing the surface of the first boss, the entire surface of the plate is roughened, so that the subsequent conductive layer can be stably attached to the plate, so as to realize the layer-by-layer increase of the plate to be processed. layer. Through the above method, in this embodiment, while adding layers layer by layer, by setting up a partially overlapping boss structure layer by layer, conduction and interconnection between the layers of the board can be performed, and the number of boards between the to-be-processed board and the conductive layer can be increased. Since the build-up layer in this embodiment is based on a single layer, the board interconnection in this embodiment can realize the interconnection between any layers, with good flexibility and degree of freedom. High, thereby further improving the reliability of the printed circuit board.
在一个具体的应用场景中，在步骤S27之后，还可以对第一压合板件进行 增层。请参阅图4，图4是本实施例步骤S27之后的印制线路板的制备方法一实施例的流程示意图。In a specific application scenario, after step S27, the first laminated board member may also be layered. Please refer to FIG. 4 . FIG. 4 is a schematic flowchart of an embodiment of a method for manufacturing a printed circuit board after step S27 in this embodiment.
步骤S31：分别在第一压合板件相对两侧的第三预设位置进行电镀，以在第三预设位置形成第三凸台和第四凸台。Step S31 : performing electroplating on the third preset positions on opposite sides of the first pressing plate member respectively, so as to form the third boss and the fourth boss at the third preset position.
在第一压合板件相对两侧的表面上贴覆第一感光膜，并预留出第三预设位置不贴覆第一感光膜。其中，第一压合板件相对两侧的表面上贴覆第一感光膜的位置为不需要进行电镀形成凸台的位置。在预留出第三预设位置后，在第一压合板件相对两侧的第三预设位置进行电镀，以对第三预设位置进行定向增厚，形成第三凸台和第四凸台。A first photosensitive film is pasted on the surfaces on opposite sides of the first pressing plate, and a third preset position is reserved for not pasting the first photosensitive film. Wherein, the positions where the first photosensitive film is pasted on the surfaces on the opposite sides of the first pressing plate member are positions where electroplating is not required to form the bosses. After the third preset position is reserved, electroplating is performed on the third preset position on the opposite sides of the first pressing plate, so as to directionally thicken the third preset position to form a third boss and a fourth boss tower.
在一个具体的应用场景中，当第一压合板件内包含多个第一凸台和多个第二凸台时。第一压合板件的需要电镀形成的第三凸台和第四凸台，并不一定需要与第一凸台和第二凸台的数量完全对应。当第一压合板件的第一凸台所形成的铜柱需要连接新的导电层进行散热时，在第一凸台上对应位置的第三预设位置形成第三凸台，以延长铜柱。当第一压合板件的第一凸台所形成的铜柱不需要连接新的导电层进行散热时，不在第一凸台上对应位置的第三预设位置上设置第三凸台。第二凸台与第四凸台同理。In a specific application scenario, when the first pressing plate member includes a plurality of first bosses and a plurality of second bosses. The third and fourth bosses that need to be electroplated and formed of the first press-bonded plate do not necessarily need to completely correspond to the numbers of the first and second bosses. When the copper column formed by the first boss of the first lamination plate needs to be connected to a new conductive layer for heat dissipation, a third boss is formed at a third preset position corresponding to the first boss to extend the copper column. When the copper column formed by the first boss of the first pressing plate does not need to be connected to a new conductive layer for heat dissipation, the third boss is not provided on the third preset position corresponding to the position of the first boss. The second boss is the same as the fourth boss.
在一个具体的应用场景中，第三凸台的位置可以和第一凸台完全重叠，以实现板间互联。在一个具体的应用场景中，第三凸台的位置也可以和第一凸台部分重叠，以在实现板间互联和板件散热的同时，提升板件的布线空间，从而提高板件布线的自由度，以实现印制线路板的高密度布线。In a specific application scenario, the position of the third boss can be completely overlapped with the first boss to realize interconnection between boards. In a specific application scenario, the position of the third boss can also partially overlap with the first boss, so as to realize the interconnection between the boards and the heat dissipation of the boards, and at the same time improve the wiring space of the board, thereby improving the wiring efficiency of the board. degrees of freedom to achieve high-density wiring of printed circuit boards.
在成品印制线路板中，铜柱只需因第一凸台和第二凸台的部分重叠而增大散热面积，既能提高印制线路板的散热效率。在一个具体的应用场景中，第三凸台可以与第一凸台完全重叠，也可以与第一凸台部分重叠，以进一步提高铜柱的散热面积。第二凸台与第四凸台同理。In the finished printed circuit board, the copper column only needs to increase the heat dissipation area due to the partial overlap of the first boss and the second boss, which can improve the heat dissipation efficiency of the printed circuit board. In a specific application scenario, the third boss may completely overlap with the first boss, or may partially overlap with the first boss, so as to further improve the heat dissipation area of the copper column. The second boss is the same as the fourth boss.
在第一压合板件上电镀形成第三凸台和第四凸台后，去除掉第一感光膜。After the third boss and the fourth boss are formed by electroplating on the first pressing plate, the first photosensitive film is removed.
请参阅图4a，图4a是本实施例第一压合板件去除第一感光膜后的结构示意图。Please refer to FIG. 4a. FIG. 4a is a schematic structural diagram of the first pressing plate member after removing the first photosensitive film in this embodiment.
本实施例的第一压合板件800设置有第一铜柱803。其中，第一铜柱803由第三凸台8033、第一凸台8031、金属化孔(图中未标注)、第二凸台8032以及第四凸台8034依次连接形成，以对第一压合板件800进行散热。The first pressing plate member 800 in this embodiment is provided with a first copper column 803 . The first copper pillar 803 is formed by connecting the third boss 8033, the first boss 8031, the metallization hole (not marked in the figure), the second boss 8032 and the fourth boss 8034 in sequence, so as to press the first The plywood member 800 dissipates heat.
在本实施例中，第一凸台8031与第二凸台8032部分重叠，第一凸台8031与第三凸台8033完全重叠，第二凸台8032与第四凸台8034部分重叠。从而通过错位导通来实现各层铜层802之间的散热，并提高第一压合板件800的布线空间，从而进一步提高第一压合板件800的布线自由度。In this embodiment, the first boss 8031 and the second boss 8032 partially overlap, the first boss 8031 and the third boss 8033 completely overlap, and the second boss 8032 and the fourth boss 8034 partially overlap. Therefore, heat dissipation between the copper layers 802 is realized through dislocation conduction, and the wiring space of the first pressing board member 800 is increased, thereby further improving the wiring freedom of the first pressing board member 800 .
在第一压合板件上电镀形成第三凸台和第四凸台并去除掉第一感光膜后，在第一压合板件相对两侧的第四预设位置贴覆第一感光膜，并对第一压合板件 的相对两侧进行图形蚀刻，以在第一压合板件相对两侧的导电层上形成导电线路，从而实现导电层的导通功能。其中，第四预设位置为第一压合板件的导电层上不需要制备导电线路的位置。After the third boss and the fourth boss are formed by electroplating on the first pressing plate and the first photosensitive film is removed, the first photosensitive film is pasted on the fourth preset positions on the opposite sides of the first pressing plate, and Pattern etching is performed on the opposite sides of the first pressing plate member to form conductive lines on the conductive layers on the opposite sides of the first pressing plate member, so as to realize the conduction function of the conductive layer. Wherein, the fourth preset position is a position on the conductive layer of the first laminated board member where no conductive lines need to be prepared.
请参阅图4b，图4b是本实施例第一压合板件图形蚀刻后的结构示意图。Please refer to FIG. 4b. FIG. 4b is a schematic structural diagram of the first lamination plate part after pattern etching in this embodiment.
本实施例的第一压合板件900的导电层902经过图形蚀刻后，在第一压合板件900两侧的表面上形成了导电线路901，以实现导电层902的电路功能。其中，本实施例的第一铜柱904与第二铜柱903与每层铜层(图中未标注)都导通，以实现各铜层之间的板件互联和各铜层之间的板件散热。附图中所展示的结构仅描述导电线路的蚀刻结构，并不铜柱具体结构对此进行限定。After the conductive layer 902 of the first pressing plate member 900 in this embodiment is pattern-etched, conductive lines 901 are formed on both sides of the first pressing plate member 900 to realize the circuit function of the conductive layer 902 . Among them, the first copper pillar 904 and the second copper pillar 903 in this embodiment are connected to each copper layer (not marked in the figure), so as to realize the board interconnection between the copper layers and the interconnection between the copper layers. Plate heat dissipation. The structures shown in the drawings only describe the etched structures of the conductive lines, and do not limit the specific structures of the copper pillars.
步骤S32：对第一压合板件进行压合，得到第二压合板件，并对第二压合板件进行研磨，直至第三凸台和第四凸台裸露。Step S32: Pressing the first pressing plate to obtain a second pressing plate, and grinding the second pressing plate until the third boss and the fourth boss are exposed.
获取到两个第二板件，其中，第二板件包括铜层或离型膜。在一个具体的应用场景中，可以获取单层铜层作为第二板件，并通过第二介质层将单层铜层与第一压合板件进行压合，得到第二压合板件。在一个具体的应用场景中，也可以获取单层离型膜作为第二板件，并通过第二介质层将单层离型膜与第一压合板件进行压合，得到第二压合板件。Two second boards are obtained, wherein the second boards include a copper layer or a release film. In a specific application scenario, a single-layer copper layer may be obtained as the second board member, and the single-layer copper layer and the first laminate member may be pressed through the second dielectric layer to obtain the second laminate member. In a specific application scenario, it is also possible to obtain a single-layer release film as the second plate, and press the single-layer release film and the first lamination plate through the second dielectric layer to obtain a second lamination plate .
分别通过第二介质层将两层第二板件与第一压合板件的相对两侧进行高温压合，通过压合使第二介质层的介质材料完成对第一压合板件相对两侧的表面各位置的填充，以将第一压合板件的相对两侧和两个第二板件压合成多层线路板，得到第二压合板件。The two layers of second plates and the opposite sides of the first pressing plate are pressed together at high temperature through the second medium layer respectively, and the dielectric material of the second medium layer is pressed to complete the pressing on the opposite sides of the first pressing plate. Filling at various positions on the surface, so as to press the opposite sides of the first laminated board piece and the two second board pieces into a multi-layer circuit board to obtain a second laminated board piece.
在一个具体的应用场景中，第二介质层的介质材料可以为：环氧树脂类、聚酰亚胺类、BT类(双马来酰亚胺-三嗪树脂)、ABF类以及陶瓷基类材料，具体介质材料的选择可以基于实际需求而定，在此不做限定。In a specific application scenario, the dielectric materials of the second dielectric layer may be: epoxy resin, polyimide, BT (bismaleimide-triazine resin), ABF, and ceramic-based Materials, the selection of specific media materials can be determined based on actual needs, which is not limited here.
得到第二压合板件后，去除第二压合板件相对两侧的第二板件，对第二压合板件的相对两侧进行研磨，以去除部分第二介质层，直至第二压合板件的第三凸台和第四凸台裸露。其中，第二压合板件的第三凸台裸露时，第二压合板件设置有第三凸台的一侧整面与第三凸台的顶端平齐，第二压合板件设置有第四凸台的一侧整面与第四凸台的顶端平齐，以利于后续增层着附。After the second pressing plate is obtained, the second plates on opposite sides of the second pressing plate are removed, and the opposite sides of the second pressing plate are ground to remove part of the second medium layer until the second pressing plate is The third and fourth bosses are exposed. Wherein, when the third boss of the second pressing plate is exposed, the entire side of the second pressing plate with the third boss is flush with the top of the third boss, and the second pressing plate is provided with a fourth The entire surface of one side of the boss is flush with the top end of the fourth boss, so as to facilitate the attachment of subsequent build-up layers.
请参阅图4c，图4c是本实施例第二压合板件研磨后的结构示意图。Please refer to FIG. 4c. FIG. 4c is a schematic structural diagram of the second pressing plate member after grinding in this embodiment.
本实施例的第二压合板件1000的上表面1001与第一铜柱1003和第二铜柱1004的上表面(图中未标注)平齐。第二压合板件1000的下表面1002与第一铜柱1003和第二铜柱1004的下表面(图中未标注)平齐，以利于后续导电层的附着。The upper surface 1001 of the second laminated board member 1000 in this embodiment is flush with the upper surfaces (not marked in the figure) of the first copper pillar 1003 and the second copper pillar 1004 . The lower surface 1002 of the second laminated board 1000 is flush with the lower surfaces (not marked in the figure) of the first copper pillars 1003 and the second copper pillars 1004 , so as to facilitate the attachment of subsequent conductive layers.
步骤S33：在第二压合板件的相对两侧上设置导电层，以对第二压合板件进行增层。Step S33: Disposing conductive layers on opposite sides of the second laminated board member to build up the second laminated board member.
对第二压合板件相对两侧的研磨完成后，通过激光烧蚀、等离子粗化、高 锰酸钾粗化等方式，对第二压合板件露出第三凸台的整侧表面和第四凸台的整侧表面进行粗化处理。After the grinding of the opposite sides of the second pressing plate is completed, the entire side surface of the third boss and the fourth The entire side surface of the boss is roughened.
通过沉积或电镀在第二压合板件的相对两侧新增导电层，以对第二压合板件进行增层。在一个具体的应用场景中，可以分别对第二压合板件的上表面和下表面进行黑影处理或黑孔处理，分别在第二压合板件的上表面和下表面上形成一层碳化物，将碳化物作为导电层，以对第二压合板件进行增层。By depositing or electroplating, conductive layers are newly added on opposite sides of the second pressing plate member, so as to add layers to the second pressing plate member. In a specific application scenario, black shadow treatment or black hole treatment can be performed on the upper surface and the lower surface of the second pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the second pressing plate respectively. , using carbide as a conductive layer to build up the second laminate.
在一个具体的应用场景中，可以分别对第二压合板件的上表面和下表面进行沉铜处理，以分别在第二压合板件的上表面和下表面上沉积一层较厚铜层，将铜层作为导电层，以对第二压合板件进行增层。In a specific application scenario, copper immersion treatment can be performed on the upper surface and the lower surface of the second laminated board respectively, so as to deposit a thicker copper layer on the upper surface and the lower surface of the second laminated board respectively, The copper layer was used as a conductive layer to build up the second laminate.
在一个具体的应用场景中，可以分别对第二压合板件的上表面和下表面进行沉铜处理，以分别在第二压合板件的上表面和下表面上沉积一层较薄的沉铜层，并在沉铜层之上再电镀一层较厚铜层，将铜层作为导电层，以对第二压合板件进行增层。In a specific application scenario, copper immersion treatment can be performed on the upper surface and the lower surface of the second laminated board respectively, so as to deposit a thin layer of copper immersion on the upper surface and the lower surface of the second laminated board respectively. layer, and a thicker copper layer is plated on top of the copper sink layer, and the copper layer is used as a conductive layer to build up the second laminate.
在一个具体的应用场景中，可以分别对第二压合板件的上表面和下表面进行黑影处理或黑孔处理，分别在第二压合板件的上表面和下表面上形成一层碳化物，再分别在碳化物上电镀一层铜层，将铜层作为导电层，以对第二压合板件进行增层。In a specific application scenario, black shadow treatment or black hole treatment can be performed on the upper surface and the lower surface of the second pressing plate, respectively, to form a layer of carbide on the upper surface and the lower surface of the second pressing plate respectively. , and then electroplating a layer of copper layer on the carbide respectively, using the copper layer as a conductive layer, so as to add layers to the second laminate.
请参阅图4d，图4d是本实施例第二压合板件增层后的结构示意图。Please refer to FIG. 4d. FIG. 4d is a schematic diagram of the structure of the second laminated plate member after adding layers in this embodiment.
本实施例的第二压合板件1100的上下两侧表面分别设置了上层导电层1101和下层导电层1102，其中，上层导电层1101和下层导电层1102与第一铜柱1103和第二铜柱1104连接导通。An upper conductive layer 1101 and a lower conductive layer 1102 are respectively provided on the upper and lower side surfaces of the second laminated board member 1100 in this embodiment, wherein the upper conductive layer 1101 and the lower conductive layer 1102 and the first copper pillars 1103 and the second copper pillars The 1104 connection is turned on.
对第二压合板件进行新增导电层后，可以对第二压合板件的新增导电层进行图形蚀刻，以在第二压合板件相对两侧的新增导电层上形成导电线路，实现印制线路板的功能。其中，图形蚀刻的步骤包括贴膜→曝光→显影→蚀刻→退膜。After the new conductive layer is added to the second pressing plate member, pattern etching can be performed on the newly added conductive layer of the second pressing plate member to form conductive lines on the newly added conductive layers on opposite sides of the second pressing plate member, so as to realize function of the printed circuit board. The steps of pattern etching include film sticking→exposure→development→etching→film stripping.
在一个具体的应用场景中，若第二压合板件在本次增层后，已满足高密度互联的制备需求，则对第二压合板件的第二铜层进行图形蚀刻，在第二铜层上形成导电线路后，得到印制线路板。在一个具体的应用场景中，若需要对第一压合板件进行进一步增层，实现更多层的高密度互联和散热需求，则重复循环执行步骤S31-步骤S33，直至压合板件的厚度或规格满足制备需求，具体增层过程请参阅前文，在此不做赘述。In a specific application scenario, if the second laminate has met the preparation requirements for high-density interconnection after this build-up, pattern etching is performed on the second copper layer of the second laminate. After the conductive lines are formed on the layers, a printed wiring board is obtained. In a specific application scenario, if it is necessary to further increase the layers of the first laminated board to meet the requirements of high-density interconnection and heat dissipation of more layers, step S31-step S33 is repeatedly executed in a cycle until the thickness of the laminated board or The specifications meet the preparation requirements. For the specific layer-adding process, please refer to the previous article, which will not be repeated here.
通过上述方式，本实施例的印制线路板的制备方法通过在覆铜板上多次进行单层增层，从而逐层实现印制线路板的导通散热，以避免制备和安装金属基本身的限制以及比避免盲孔阵列的设置。提高印制线路板各层电路导通的布线自由、灵活性和自由度。具体地，本实施例通过在待加工板件上进行电镀加厚形成部分重叠的第一凸台和第二凸台，对待加工板件进行压合，以对待加工板 件的表面进行填充整平。将待加工板件的表面进行整板粗化且研磨后，通过电镀或沉铜在待加工板件的表面新增一层导电层。导电层通过第一凸台和第二凸台提高与覆铜板之间的散热面积。本实施例还可以循环执行电镀凸台→粗化研磨→电镀或沉铜导电层的步骤对板件进行增层，直至板件的规格满足制备需求。In the above-mentioned manner, the preparation method of the printed circuit board of the present embodiment implements the conduction and heat dissipation of the printed circuit board layer by layer by performing single-layer buildup on the copper clad plate for many times, so as to avoid the preparation and installation of the metal base itself. Limits as well as avoids blind via array setups. Improve the wiring freedom, flexibility and degree of freedom of the circuit conduction of each layer of the printed circuit board. Specifically, in this embodiment, a partially overlapping first boss and a second boss are formed by plating and thickening the plate to be processed, and the plate to be processed is pressed to fill and level the surface of the plate to be processed. . After roughening and grinding the surface of the plate to be processed, a conductive layer is added on the surface of the plate to be processed by electroplating or copper immersion. The conductive layer improves the heat dissipation area between the conductive layer and the copper clad laminate through the first boss and the second boss. In this embodiment, the steps of electroplating bosses→roughening and grinding→electroplating or copper sinking conductive layer can be performed cyclically to add layers to the board until the specifications of the board meet the preparation requirements.
本实施例在印制线路板的压合过程中能够实现任意板件之间的导通，并通过在单层增层中，设置凸台或不设置凸台来对各层板件进行散热，本实施例最后所形成的铜柱能够依靠部分重叠的凸台提高印制线路板的布线自由。本实施例在不占用布线空间的情况下，实现高密度布线的同时实现高效散热。器件导通位置也可以实现定向散热，且铜层加厚位置可以结合连接盘尺寸进行定向设计管控，不影响布线空间，不受外形限制，且本实施例的散热效率高，散热位置可以直接设计在功率器件连接盘的位置。且本实施例还能够通过改变各层凸台之间的位置来从而实现印制线路板的高密度布线和各层互联位置的整体导通。且本实施例的印制线路板各层之间的导通不受介质层厚度限制，具备一定的灵活性和自由度。In this embodiment, during the pressing process of the printed circuit board, the conduction between any board parts can be realized, and the board parts of each layer can be dissipated by setting the boss or not setting the boss in the single-layer build-up layer. The copper pillars finally formed in this embodiment can improve the wiring freedom of the printed circuit board by virtue of the partially overlapping bosses. In the present embodiment, high-density wiring is achieved while high-efficiency heat dissipation is achieved without occupying the wiring space. The conduction position of the device can also achieve directional heat dissipation, and the thickened position of the copper layer can be directional design and control combined with the size of the connection pad, which does not affect the wiring space and is not limited by the shape. Moreover, the heat dissipation efficiency of this embodiment is high, and the heat dissipation position can be directly designed. at the position of the power device connection pad. In addition, in this embodiment, the high-density wiring of the printed circuit board and the overall conduction of the interconnection positions of each layer can be realized by changing the position between the bosses of each layer. In addition, the conduction between the layers of the printed circuit board in this embodiment is not limited by the thickness of the dielectric layer, and has certain flexibility and freedom.
请参阅图5，图5是本发明印制线路板一实施例的结构示意图。Please refer to FIG. 5 , which is a schematic structural diagram of an embodiment of the printed circuit board of the present invention.
本实施例的印制线路板2000包括多层铜层2001、介质层2002、第一铜柱2003和第二铜柱2004。多层铜层2001通过介质层2002依次层叠设置，以构成多层线路板。第一铜柱2003贯穿整个印制线路板2000，且第一铜柱2003的两端凸出于印制线路板2000，以对印制线路板2000进行散热。第二铜柱2004的两端也凸出于印制线路板2000，以对印制线路板2000进行散热。The printed circuit board 2000 of this embodiment includes a multi-layer copper layer 2001 , a dielectric layer 2002 , a first copper pillar 2003 and a second copper pillar 2004 . The multi-layer copper layers 2001 are stacked in sequence through the dielectric layers 2002 to form a multi-layer circuit board. The first copper pillar 2003 runs through the entire printed circuit board 2000 , and both ends of the first copper pillar 2003 protrude from the printed circuit board 2000 to dissipate heat from the printed circuit board 2000 . Both ends of the second copper pillars 2004 also protrude from the printed circuit board 2000 to dissipate heat from the printed circuit board 2000 .
其中，本实施例的印制线路板2000的第一铜柱2003和第二铜柱2004所连通的铜层2001是固定的，但在实际的生产过程中，第一铜柱2003和第二铜柱2004所连通的铜层2001可以基于实际需求而定，第一铜柱2003和第二铜柱2004可以连通所有铜层2001或部分铜层2001。在此不做限定。Wherein, the copper layer 2001 connected to the first copper pillar 2003 and the second copper pillar 2004 of the printed circuit board 2000 in this embodiment is fixed, but in the actual production process, the first copper pillar 2003 and the second copper pillar 2003 The copper layer 2001 to which the pillars 2004 are connected may be determined based on actual requirements, and the first copper pillars 2003 and the second copper pillars 2004 may be connected to all the copper layers 2001 or part of the copper layers 2001 . This is not limited.
在本实施例中，印制线路板中的铜柱为单次错位设置，但在其他实施例中，可以基于散热需求通过各凸台的设置形成多次错位的结构，以提高铜柱的散热面积，进而提高铜柱的散热需求。In this embodiment, the copper pillars in the printed circuit board are arranged in a single dislocation, but in other embodiments, a structure with multiple dislocations can be formed through the arrangement of each boss based on the heat dissipation requirements, so as to improve the heat dissipation of the copper pillars area, thereby increasing the heat dissipation requirements of the copper pillars.
本实施例的印制线路板能够实现各铜层的之间的高密度互联和高密度布线，且本实施例的印制线路板能够通过错位设置的铜柱，提高印制线路板的散热面积，从而提高印制线路板的散热效率，增强印制线路板的可靠性。The printed circuit board of this embodiment can realize high-density interconnection and high-density wiring between each copper layer, and the printed circuit board of this embodiment can improve the heat dissipation area of the printed circuit board by dislocating copper pillars , thereby improving the heat dissipation efficiency of the printed circuit board and enhancing the reliability of the printed circuit board.
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies Fields are similarly included in the scope of patent protection of the present invention.

Claims (10)

  1. 一种印制线路板的制备方法，其特征在于，所述印制线路板的制备方法包括：A preparation method of a printed circuit board, characterized in that the preparation method of the printed circuit board comprises:
    获取待加工板件；Get the plate to be processed;
    在所述待加工板件的相对两侧分别设置第一凸台和第二凸台，其中，所述第一凸台与所述第二凸台部分重叠；A first boss and a second boss are respectively provided on opposite sides of the plate to be processed, wherein the first boss and the second boss are partially overlapped;
    对所述待加工板件进行压合，得到第一压合板件，并对所述第一压合板件的相对两侧进行研磨，直至所述第一凸台与所述第二凸台裸露；Pressing the plate to be processed to obtain a first pressing plate, and grinding opposite sides of the first pressing plate until the first boss and the second boss are exposed;
    分别在所述第一压合板件的相对两侧上设置导电层，以对所述第一压合板件进行增层；respectively disposing conductive layers on opposite sides of the first pressing plate member, so as to add layers to the first pressing plate member;
    分别对所述第一压合板件的相对两侧进行图形转移，以在所述第一压合板件上形成导电线路，得到印制线路板。The pattern transfer is respectively performed on the opposite sides of the first pressing board member to form a conductive circuit on the first pressing board member to obtain a printed circuit board.
  2. 根据权利要求1所述的印制线路板的制备方法，其特征在于，所述对所述待加工板件进行压合，得到第一压合板件，并对所述第一压合板件的相对两侧进行研磨，直至所述第一凸台与所述第二凸台裸露的步骤包括：The method for preparing a printed circuit board according to claim 1, wherein the plate to be processed is pressed to obtain a first pressed plate, and the relative The steps of grinding both sides until the first boss and the second boss are exposed include:
    获取两个第一板件，所述第一板件包括铜层或离型膜；Obtain two first boards, the first boards include a copper layer or a release film;
    分别通过两层第一介质层将两个所述第一板件与所述待加工板件的相对两侧进行压合，得到第一压合板件；Pressing the two first plates and the opposite sides of the to-be-processed plate through two first medium layers respectively to obtain a first pressing plate;
    去除所述第一压合板件相对两侧的第一板件；removing the first plates on opposite sides of the first pressing plate;
    对所述第一压合板件的相对两侧进行研磨，以去除部分所述第一介质层，直至所述第一压合板件相对两侧的第一凸台和第二凸台裸露。The opposite sides of the first pressing plate are ground to remove part of the first dielectric layer, until the first bosses and the second bosses on the opposite sides of the first pressing plate are exposed.
  3. 根据权利要求2所述的印制线路板的制备方法，其特征在于，所述对所述第一压合板件的相对两侧进行研磨的步骤包括：The method for preparing a printed circuit board according to claim 2, wherein the step of grinding the opposite sides of the first laminated board member comprises:
    通过铲平、刷板、激光烧蚀、离子切割、离子抛光或水刀方式对所述第一压合板件的相对两侧进行表面研磨处理。Surface grinding treatment is performed on the opposite sides of the first pressing plate piece by means of leveling, brushing, laser ablation, ion cutting, ion polishing or water jet.
  4. 根据权利要求1所述的印制线路板的制备方法，其特征在于，所述分别在所述第一压合板件的相对两侧上设置导电层，以对所述第一压合板件进行增层的步骤包括：The method for manufacturing a printed circuit board according to claim 1, wherein the conducting layers are respectively provided on opposite sides of the first pressing board member to increase the strength of the first pressing board member. Layer steps include:
    分别对所述第一压合板件的相对两侧进行粗化处理；respectively roughening the opposite sides of the first pressing plate;
    通过沉积或电镀在所述第一压合板件的相对两侧上分别设置一层导电层，以对所述第一压合板件进行增层。A conductive layer is respectively provided on the opposite sides of the first laminated board member by deposition or electroplating, so as to perform build-up on the first laminated board member.
  5. 根据权利要求1所述的印制线路板的制备方法，其特征在于，所述获取待加工板件的步骤包括：The method for preparing a printed circuit board according to claim 1, wherein the step of obtaining the board to be processed comprises:
    获取到覆铜板；Obtain the copper clad laminate;
    通过钻孔在所述覆铜板上形成至少一个孔，其中，所述孔包括通孔和微盲 孔；At least one hole is formed on the copper clad plate by drilling, wherein the hole includes a through hole and a micro-blind hole;
    对至少一个所述孔进行孔化处理，得到所述待加工板件。At least one of the holes is subjected to hole treatment to obtain the plate to be processed.
  6. 根据权利要求5所述的印制线路板的制备方法，其特征在于，The method for preparing a printed wiring board according to claim 5, wherein,
    所述孔化处理包括沉铜处理、黑孔处理或黑影处理。The hole treatment includes copper immersion treatment, black hole treatment or shadow treatment.
  7. 根据权利要求5所述的印制线路板的制备方法，其特征在于，所述在所述待加工板件的相对两侧分别设置第一凸台和第二凸台的步骤包括：The method for preparing a printed circuit board according to claim 5, wherein the step of disposing a first boss and a second boss respectively on opposite sides of the board to be processed comprises:
    在所述待加工板件相对两侧的表面上贴覆第一感光膜，并使所述待加工板件的第一预设位置裸露；其中，所述第一预设位置包括所述孔以及所述孔的孔口***位置；A first photosensitive film is pasted on the surfaces of the opposite sides of the board to be processed, and a first preset position of the board to be processed is exposed; wherein, the first preset position includes the hole and the peripheral position of the orifice of the hole;
    对所述待加工板件相对两侧的所述第一预设位置进行填孔电镀，以在所述待加工板件的相对两侧分别形成所述第一凸台和所述第二凸台；Filling and electroplating the first preset positions on the opposite sides of the plate to be processed, so as to form the first boss and the second boss respectively on the opposite sides of the plate to be processed ;
    去除所述待加工板件上的第一感光膜。The first photosensitive film on the plate to be processed is removed.
  8. 根据权利要求1所述的印制线路板的制备方法，其特征在于，所述在所述待加工板件的相对两侧分别设置第一凸台和第二凸台的步骤之后包括：The method for preparing a printed circuit board according to claim 1, wherein after the step of disposing a first boss and a second boss on opposite sides of the board to be processed, the step includes:
    在所述待加工板件相对两侧的第二预设位置上贴覆第二感光膜，并对所述待加工板件的相对两侧进行蚀刻，以在所述待加工板件上形成导电线路；A second photosensitive film is pasted on the second preset positions on the opposite sides of the plate to be processed, and the opposite sides of the plate to be processed are etched to form conductive layers on the plate to be processed line;
    去除所述待加工板件上的所述第二感光膜。The second photosensitive film on the plate to be processed is removed.
  9. 根据权利要求1所述的印制线路板的制备方法，其特征在于，所述分别对所述第一压合板件的相对两侧进行图形转移，以在所述第一压合板件上形成导电线路的步骤之后包括：The manufacturing method of a printed circuit board according to claim 1, wherein the pattern transfer is performed on the opposite sides of the first pressing board respectively, so as to form a conductive layer on the first pressing board The steps of the line are followed by:
    分别在所述第一压合板件相对两侧的第三预设位置进行电镀，以在所述第三预设位置形成第三凸台和第四凸台；performing electroplating at third preset positions on opposite sides of the first pressing plate member respectively, so as to form a third boss and a fourth boss at the third preset position;
    对所述第一压合板件进行压合，得到第二压合板件，并对所述第二压合板件进行研磨，直至所述第三凸台和第四凸台裸露；Pressing the first pressing plate to obtain a second pressing plate, and grinding the second pressing plate until the third boss and the fourth boss are exposed;
    在所述第二压合板件的相对两侧上设置所述导电层，以对所述第二压合板件进行增层。The conductive layers are provided on opposite sides of the second laminate to build up the second laminate.
  10. 一种印制线路板，其特征在于，所述印制线路板由如权利要求1-9任一项所述的印制线路板的制备方法制作而成。A printed circuit board, characterized in that the printed circuit board is manufactured by the method for preparing a printed circuit board according to any one of claims 1-9.
PCT/CN2020/134691 2020-11-18 2020-12-08 Printed circuit board and preparation method therefor WO2022104943A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011295603.0A CN114521070B (en) 2020-11-18 2020-11-18 Printed wiring board and preparation method thereof
CN202011295603.0 2020-11-18

Publications (1)

Publication Number Publication Date
WO2022104943A1 true WO2022104943A1 (en) 2022-05-27

Family

ID=81594856

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/134691 WO2022104943A1 (en) 2020-11-18 2020-12-08 Printed circuit board and preparation method therefor

Country Status (2)

Country Link
CN (1) CN114521070B (en)
WO (1) WO2022104943A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130126215A1 (en) * 2011-11-22 2013-05-23 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
CN104284533A (en) * 2008-09-28 2015-01-14 华为技术有限公司 Multilayer circuit board, manufacturing method of multilayer circuit board and communication device
CN104349609A (en) * 2013-08-08 2015-02-11 北大方正集团有限公司 Printed circuit board and manufacturing method thereof
US20170094773A1 (en) * 2015-09-25 2017-03-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
CN108430173A (en) * 2018-03-08 2018-08-21 皆利士多层线路版(中山)有限公司 Wiring board and preparation method thereof
CN110876225A (en) * 2018-08-30 2020-03-10 苏州旭创科技有限公司 Circuit board, preparation method of circuit board and optical module with circuit board
CN110996503A (en) * 2019-12-31 2020-04-10 四会富仕电子科技股份有限公司 Manufacturing method of high-heat-dissipation metal substrate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104284533A (en) * 2008-09-28 2015-01-14 华为技术有限公司 Multilayer circuit board, manufacturing method of multilayer circuit board and communication device
US20130126215A1 (en) * 2011-11-22 2013-05-23 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
CN104349609A (en) * 2013-08-08 2015-02-11 北大方正集团有限公司 Printed circuit board and manufacturing method thereof
US20170094773A1 (en) * 2015-09-25 2017-03-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
CN108430173A (en) * 2018-03-08 2018-08-21 皆利士多层线路版(中山)有限公司 Wiring board and preparation method thereof
CN110876225A (en) * 2018-08-30 2020-03-10 苏州旭创科技有限公司 Circuit board, preparation method of circuit board and optical module with circuit board
CN110996503A (en) * 2019-12-31 2020-04-10 四会富仕电子科技股份有限公司 Manufacturing method of high-heat-dissipation metal substrate

Also Published As

Publication number Publication date
CN114521070B (en) 2024-04-05
CN114521070A (en) 2022-05-20

Similar Documents

Publication Publication Date Title
TWI621388B (en) Method for manufacturing multilayer printed wiring board and multilayer printed wiring board
JP4955763B2 (en) Multilayer wiring board and manufacturing method thereof
EP2647267B1 (en) Method for manufacturing printed circuit board
JP2007142403A (en) Printed board and manufacturing method of same
US20080098597A1 (en) Method of manufacturing circuit board
JP5313202B2 (en) Build-up type multilayer printed wiring board and manufacturing method thereof
TW200810657A (en) Method for manufacturing multilayer printed wiring board
CN114222445B (en) Circuit board manufacturing method and circuit board
US20080251494A1 (en) Method for manufacturing circuit board
TWI487451B (en) Manufacturing method of multilayer printed wiring board
WO2022104943A1 (en) Printed circuit board and preparation method therefor
KR20040085374A (en) Method for making through-hole of multi-layer flexible printed circuit board
CN114521057B (en) Printed wiring board and preparation method thereof
JP3596374B2 (en) Manufacturing method of multilayer printed wiring board
CN114521060B (en) Printed wiring board and preparation method thereof
KR101089923B1 (en) Manufacturing method of printed circuit board
KR100796981B1 (en) Method for manufacturing printed circuit board
JP2007335631A (en) Manufacturing method of laminated wiring board
WO2022246708A1 (en) Circuit board preparation method and circuit board
TWI519224B (en) Manufacturing method of multilayer flexible circuit structure
CN110602871B (en) Graphene heat-conducting PCB and preparation method thereof
TW200829116A (en) Multilayer printed-wiring board and method of manufacturing the same
KR20080100111A (en) Method of manufacturing high-density package substrate
CN117769113A (en) Double-sided electroplating blind groove module printed circuit board and preparation method thereof
CN115551232A (en) Circuit board processing method for improving electroplating hole filling cavity and circuit board

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20962234

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20962234

Country of ref document: EP

Kind code of ref document: A1