WO2023279550A1 - 一种零件加工控制方法、控制器、***和设备 - Google Patents

一种零件加工控制方法、控制器、***和设备 Download PDF

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Publication number
WO2023279550A1
WO2023279550A1 PCT/CN2021/121523 CN2021121523W WO2023279550A1 WO 2023279550 A1 WO2023279550 A1 WO 2023279550A1 CN 2021121523 W CN2021121523 W CN 2021121523W WO 2023279550 A1 WO2023279550 A1 WO 2023279550A1
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Prior art keywords
block
processing
sub
processed
moving distance
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PCT/CN2021/121523
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English (en)
French (fr)
Inventor
高健
周志伟
张揽宇
罗于恒
陈云
陈新
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广东工业大学
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Publication of WO2023279550A1 publication Critical patent/WO2023279550A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path

Definitions

  • the present application relates to the technical field of parts processing, and in particular to a method, controller, system and equipment for controlling part processing.
  • the laser head is usually controlled to rotate and translate to keep the laser head and the part to be processed in a constant position, and the laser is controlled to focus on the part to be processed.
  • This processing method has disadvantages such as low processing efficiency and low precision, and the laser head is heavy, which affects the stability and dynamics of the processing device when it moves at multiple angles.
  • This application provides a part processing control method, controller, system and equipment, which are used to improve the existing technology.
  • the processing efficiency is low.
  • Low precision, and the laser head is heavy, which affects the technical problems of the stability and dynamics of the processing device.
  • the first aspect of the present application provides a part processing control method applied to a controller, including:
  • the next sub-block of the part to be processed is used as the current sub-block, and returns to the Describe the step of determining the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and controlling the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer until the entire to-be-processed The processed parts are processed.
  • the acquisition process of the machining track is:
  • the host computer determines the machining track of the sub-block according to the machining starting point of the part to be machined and the contour information of the sub-block.
  • the host computer performs graphic block processing on the three-dimensional surface model of the part to be processed input by the user to obtain several sub-blocks, including:
  • the three-dimensional surface model of the part to be processed is calculated by the host computer according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional surface model.
  • the surface model is divided into graphic blocks to obtain several sub-blocks;
  • each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector direction of any position on each of the sub-blocks is the same.
  • the controlling CCD component detects the relative distance between the focusing mirror in the dynamic focusing component and the current sub-block, and controls the dynamic focusing component to perform automatic focusing based on the relative distance, including:
  • control the Z-axis of the five-axis motion platform to move so that the relative distance between the focus mirror and the current sub-block become smaller, and return to the step of controlling the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block.
  • the process of judging whether the next sub-block of the part to be processed meets the preset processing conditions is as follows:
  • the method also includes:
  • the moving distance acquires a first target moving distance, and controls the X-axis, Y-axis and the scanning galvanometer of the five-axis motion platform to move according to the first target moving distance;
  • the dynamic focus component exceeds the corresponding maximum moving distance when processing the next sub-block, according to the maximum moving distance of the dynamic focus component and the current sub-block during processing
  • the moving distance of the dynamic focusing component acquires a second target moving distance, and the dynamic focusing component and the Z-axis of the five-axis motion platform are controlled to move according to the second target moving distance.
  • the second aspect of the present application provides a controller, including:
  • the first control unit is used to determine the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;
  • the second control unit is used to control the CCD assembly to detect the relative distance between the focus lens in the dynamic focus assembly and the current sub-block, and control the dynamic focus assembly to perform automatic focusing based on the relative distance;
  • a third control unit configured to control the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;
  • a trigger unit configured to use the next sub-block of the part to be processed as the current A sub-block, triggering the first control unit until the entire part to be processed is processed.
  • the third aspect of the present application provides a part processing control system, including: a host computer, a dynamic focus assembly, a scanning galvanometer, a CCD assembly, a laser, a five-axis motion platform, and the controller described in the second aspect;
  • the host computer, the dynamic focus assembly, the scanning galvanometer, the CCD assembly, the laser, and the five-axis motion platform are respectively connected to the controller in communication.
  • it also includes: a power module
  • the power supply module is used to supply power to the upper computer, the dynamic focus assembly, the scanning galvanometer, the CCD assembly, the laser, the five-axis motion platform and the controller.
  • the fourth aspect of the present application provides a part processing control device, the device includes a processor and a memory;
  • the memory is used to store program codes and transmit the program codes to the processor
  • the processor is configured to execute any one of the component processing control methods described in the first aspect according to instructions in the program code.
  • the present application has the following advantages:
  • the application provides a part processing control method, which is applied to the controller, including: determining the processing trajectory of the current sub-block according to the obtained processing trajectory of each sub-block of the part to be processed, and controlling the five-axis motion platform to move the current sub-block to Within the processing range of the scanning galvanometer; control the CCD component to detect the relative distance between the focusing mirror in the dynamic focus component and the current sub-block, and control the dynamic focus component to automatically focus based on the relative distance; control the scanning galvanometer according to the current sub-block
  • the processing trajectory of the current sub-block is processed from the processing starting point of the current sub-block; after the current sub-block is processed and it is judged that the next sub-block of the part to be processed meets the preset processing conditions, the next sub-block of the part to be processed is A sub-block is used as the current sub-block, return to the step of determining the processing trajectory of the current sub-block according to the acquired processing trajectories of each sub-block of the part to be processed, and controlling
  • the controller controls the five-axis motion platform to move the current sub-block of the part to be processed to the processing range of the scanning galvanometer according to the processing track of the current sub-block of the part to be processed
  • the dynamic focus component obtained by the CCD component
  • the relative distance between the focusing mirror and the current sub-block is controlled by the dynamic focusing component for real-time auto-focusing, which helps to improve processing efficiency and processing accuracy; Processing does not need to be processed by moving the laser head, which avoids the problem of affecting the stability and dynamics of the processing device when the laser head moves at multiple angles, and improves the existing technology by controlling the laser head to rotate and translate.
  • the laser head and the parts to be processed maintain a constant posture, which has the technical problems of low processing efficiency, low precision, and heavy laser head, which affects the stability and dynamics of the processing device.
  • Fig. 1 is a schematic flow chart of a part processing control method provided by the embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a controller provided in an embodiment of the present application.
  • Fig. 3 is a schematic structural diagram of a part processing control system provided by an embodiment of the present application.
  • This application provides a part processing control method, controller, system and equipment, which are used to improve the existing technology.
  • the processing efficiency is low.
  • Low precision, and the laser head is heavy, which affects the technical problems of the stability and dynamics of the processing device.
  • a part processing control method provided by the embodiment of the present application is applied to the controller, including:
  • Step 101 Determine the processing trajectory of the current sub-block according to the acquired processing trajectories of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block within the processing range of the scanning galvanometer.
  • the acquisition process of the processing track in the embodiment of the present application is as follows: through the host computer, the three-dimensional surface model of the part to be processed is processed by the graphic block processing to obtain several sub-blocks; The contour information determines the machining trajectory of the sub-block.
  • the user inputs the three-dimensional surface model of the part to be processed into the host computer, and through the host computer, the three-dimensional surface model of the part to be processed is divided into graphic blocks to obtain several sub-blocks.
  • the three-dimensional surface model of the part to be processed is divided into graphic blocks according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional surface model processing to obtain several sub-blocks; wherein, the size of each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the direction of the normal vector at any position on each sub-block is the same.
  • the normal vector directions of different sub-blocks can be the same or different; when the size of the part to be processed in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and any position of the part to be processed When the direction of the normal vector is the same, the number of sub-blocks obtained at this time is 1.
  • the shape and pattern of the part to be processed are known, that is, the processing trajectory of the part to be processed can be directly obtained according to the shape and pattern to be processed, and the processing trajectory includes the processing starting point and the processing end point, that is, according to the processing
  • the trajectory can obtain the processing starting point of the entire part to be processed, and the controller can determine the position of the processing starting point (that is, the position of the processing starting point of the first sub-block) by controlling the CCD component and using the positioning algorithm.
  • the contour information of the sub-block and the processing starting point can determine the processing track of the sub-block (that is, the processing track of the first sub-block), wherein the processing end point of the sub-block is the processing starting point of the next sub-block, and the host computer according The processing starting point and contour information of the next sub-block can determine the processing track of the next sub-block.
  • the controller controls the X-axis, Y-axis, Z-axis, A-axis and C-axis of the five-axis motion platform to move the current sub-block
  • the embodiment of the present application keeps the laser head still, controls the movement of the five-axis motion platform, so that the current position of the part to be processed on the five-axis motion platform
  • the sub-block moves to the processing range of the scanning galvanometer to avoid moving the heavy laser head, which may affect the stability of the processing device.
  • Step 102 Control the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block, and control the dynamic focus component to perform automatic focusing based on the relative distance.
  • the dynamic focusing assembly in the embodiment of this application is composed of a dynamic focusing mirror, a beam expander and a reflector, etc.
  • the dynamic focusing mirror can be driven by an American SMAC voice coil motor to achieve precise fine-tuning of the focus in a small range, so that the laser spot Focus on the parts to be processed in real time, and the SMAC voice coil motor has a high resolution of 0.1um, which makes the focus precise;
  • the beam expander has the effect of expanding and collimating the laser beam; the mirror is used to change the direction of the laser beam .
  • the controller controls the laser to emit the laser beam, and controls the CCD component to detect the relative distance between the focusing mirror in the dynamic focusing component and the current sub-block; when the relative distance does not exceed the dynamic
  • control the movement of the voice coil motor in the focusing component control the movement of the voice coil motor to realize the automatic focusing function of the dynamic focusing component; when the relative distance exceeds the moving range of the voice coil motor in the dynamic focusing component, control the five-axis
  • the Z-axis of the motion platform moves to make the relative distance between the focusing lens and the current sub-block smaller, and returns to the step of controlling the CCD component to detect the relative distance between the focusing lens in the dynamic focusing component and the current sub-block.
  • the CCD component automatically recognizes the relative distance between the focusing mirror and the current sub-block based on the high-speed visual image information of the laser spot size. If the CCD component recognizes that the relative distance does not exceed the movement range of the voice coil motor in the dynamic focus component, that is, the relative distance is less than or equal to the maximum moving distance of the voice coil motor in the dynamic focus component, the controller controls the voice coil motor in the dynamic focus component The coil motor performs precise micro-motion to realize the automatic focus function; if the CCD component recognizes that the relative distance exceeds the range of motion of the voice coil motor in the dynamic focus component, that is, the relative distance is greater than the maximum moving distance of the voice coil motor in the dynamic focus component, then The controller first controls the Z-axis of the five-axis motion platform to move in a large range, so that the relative distance between the focusing mirror and the current sub-block becomes smaller. When the relative distance is equal to the maximum moving distance of the voice coil motor of the dynamic focusing component, then control The voice coil motor of the dynamic focus component
  • the embodiment of the present application combines the five-axis motion
  • the large-range movement of the Z-axis of the platform and the small-scale precision fine-tuning of the voice coil motor of the dynamic focus component realize real-time automatic focus, which is not affected by the focus range of the dynamic focus component, and the focusing effect is good, which helps to improve processing efficiency and machining accuracy.
  • Step 103 controlling the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block.
  • the controller controls the scanning galvanometer to process the current sub-block from the processing starting point along the X and Y directions of the plane according to the processing track of the current sub-block.
  • the controller controls the CCD component to locate the processing starting point of the first sub-block, and then controls the scanning vibrating mirror to start from the processing starting point along the processing track of the first sub-block.
  • the first sub-block is processed in the X and Y directions of the plane.
  • the controller controls the X-axis, Y-axis, Z-axis, A-axis and C-axis of the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer, which can realize variable normal vector processing; and, because The direction of the normal vector at any position of each sub-block after division is the same. Therefore, the scanning galvanometer processes each sub-block with a fixed normal vector, that is, the scanning galvanometer does not process each sub-block. If the normal vector needs to be changed, only when the next sub-block is processed, it is necessary to consider whether to change the normal vector, which improves the processing efficiency.
  • Step 104 After the current sub-block is processed, and it is judged that the next sub-block of the part to be processed meets the preset processing conditions, the next sub-block of the part to be processed is used as the current sub-block, and returns to step 101 until the entire part to be processed The processed parts are processed.
  • the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer and whether the dynamic focusing component will exceed the maximum moving distance of the dynamic focusing component when processing the next sub-block; If it is judged that the scanning galvanometer and/or the dynamic focus assembly will exceed the corresponding maximum moving distance when processing the next sub-block, it is determined that the next sub-block of the part to be processed does not meet the preset processing conditions; When the scanning galvanometer and the dynamic focusing assembly will not exceed the corresponding maximum moving distance when the next sub-block is processed, it is determined that the next sub-block of the part to be processed meets the preset processing conditions.
  • the first target moving distance is obtained according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer during processing of the current sub-block , and control the X-axis, Y-axis and scanning mirror of the five-axis motion platform to move according to the first target moving distance; and/or, when the next sub-block is processed, the dynamic focus component will exceed the corresponding maximum moving distance , obtain the second target moving distance according to the maximum moving distance of the dynamic focusing component and the moving distance of the dynamic focusing component during processing of the current sub-block, and control the dynamic focusing component and the Z-axis of the five-axis motion platform to move according to the second target moving distance .
  • the controller obtains the maximum stroke of the scanning galvanometer (that is, the maximum moving distance D 1 of the scanning galvanometer moving along the X and Y directions of the plane) and its zero point The relative distance between the positions (that is, half of the maximum moving distance D 1 /2 of the scanning galvanometer), and the moving distance D 2 of the scanning galvanometer along the X and Y directions of the plane during processing of the current sub-block (moving distance D 2 is Scanning the distance from the moving start point to the moving end point of the galvanometer during the processing of the current sub-block), and comparing the relative distance D 1 /2 with the moving distance D 2 .
  • the controller takes the relative distance D 1 /2 as the first target moving distance; when the relative distance D 1 /2 is greater than the moving distance D 2 , the controller The controller takes the moving distance D2 as the first target moving distance, and according to the first target moving distance, controls the X-axis, Y-axis and scanning galvanometer of the five-axis motion platform to move in the X and Y directions of the plane. At the same time, the controller acquires the relative distance between the maximum stroke of the dynamic focus assembly (i.e. the maximum moving distance D3 of the voice coil motor in the dynamic focus assembly) and its zero position (i.e.
  • moving distance D 4 is the distance from the moving start point to the moving end point of the dynamic focus component during processing of the current sub-block
  • the controller takes the relative distance D 3 /2 as the second target moving distance; when the relative distance D 3 /2 is greater than the moving distance D 4 , the controller The controller takes the moving distance D4 as the second target moving distance, and according to the second target moving distance, controls the dynamic focus assembly and the Z-axis of the five-axis motion platform to move so that the next sub-block meets the preset processing conditions.
  • the controller controls the X-axis and Y-axis of the five-axis motion platform and the scanning galvanometer to move in the X and Y directions of the plane according to the moving distance of the first target, and the focusing component and the Z-axis of the five-axis motion platform do not move, so that the next The sub-blocks meet the preset processing conditions.
  • the controller controls the dynamic focus component and the Z-axis of the five-axis motion platform to move according to the moving distance of the second target, and the X-axis, Y-axis and scanning galvanometer of the five-axis motion platform do not move, so that the next sub-block meets the preset Processing conditions.
  • the processing range of the part to be processed is not limited by the motion range of the scanning galvanometer and the dynamic focus assembly, which improves the operable space for part processing, and has high flexibility and practicability.
  • the dynamic The relative distance between the focusing lens in the focusing component and the current sub-block, and the control of the dynamic focusing component for real-time automatic focusing helps to improve processing efficiency and processing accuracy; Blocks are processed without moving the laser head, which avoids the problem of affecting the stability and dynamics of the processing device when the laser head moves at multiple angles, and improves the existing technology by controlling the laser head to rotate and translate. This method keeps the laser head and the parts to be processed in a constant position, which has the technical problems of low processing efficiency, low precision, and heavy laser head, which affects the stability and dynamics of the processing device.
  • a controller provided in the embodiment of the present application, including:
  • the first control unit 201 is used to determine the processing trajectory of the current sub-block according to the obtained processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;
  • the second control unit 202 is used to control the CCD assembly to detect the relative distance between the focus lens in the dynamic focus assembly and the current sub-block, and control the dynamic focus assembly to perform automatic focusing based on the relative distance;
  • the third control unit 203 is used to control the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;
  • the triggering unit 204 is configured to use the next sub-block of the part to be processed as the current sub-block to trigger the first control after the current sub-block is processed and it is determined that the next sub-block of the part to be processed meets the preset processing conditions. unit until the entire part to be machined is finished.
  • the acquisition process of the machining trajectory is:
  • the three-dimensional surface model of the part to be processed input by the user is divided into graphic blocks to obtain several sub-blocks;
  • the processing trajectory of the sub-block is determined by the host computer according to the processing starting point of the part to be processed and the contour information of the sub-block.
  • the three-dimensional surface model of the part to be processed input by the user is divided into graphic blocks, and several sub-blocks are obtained, including:
  • the upper computer After the user inputs the 3D surface model of the part to be processed, the upper computer performs graphic block processing on the 3D surface model of the part to be processed according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the 3D surface model. a number of sub-blocks;
  • each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the direction of the normal vector at any position on each sub-block is the same.
  • the second control unit 202 specifically includes:
  • the CCD component control subunit is used to control the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block;
  • the voice coil motor control subunit is used to control the voice coil motor to move when the relative distance does not exceed the movement range of the voice coil motor in the dynamic focus component, so as to realize the automatic focusing function of the dynamic focus component;
  • the five-axis motion platform control subunit is used to control the Z-axis of the five-axis motion platform to move when the relative distance exceeds the range of motion of the voice coil motor in the dynamic focus assembly, so that the relative distance between the focus mirror and the current sub-block becomes smaller, and triggers the CCD component to control the subunit.
  • the process of judging whether the next sub-block of the part to be processed meets the preset processing conditions is:
  • the controller also includes: a fourth control unit, used for:
  • the first target moving distance is obtained according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer during processing of the current sub-block, and Control the X-axis, Y-axis and scanning galvanometer of the five-axis motion platform to move according to the moving distance of the first target;
  • the dynamic The relative distance between the focusing lens in the focusing component and the current sub-block, and the control of the dynamic focusing component for real-time automatic focusing helps to improve processing efficiency and processing accuracy; Blocks are processed without moving the laser head, which avoids the problem of affecting the stability and dynamics of the processing device when the laser head moves at multiple angles, and improves the existing technology by controlling the laser head to rotate and translate. This method keeps the laser head and the parts to be processed in a constant position, which has the technical problems of low processing efficiency, low precision, and heavy laser head, which affects the stability and dynamics of the processing device.
  • a part processing control system provided by the embodiment of the present application, including: a host computer, a dynamic focus component, a scanning galvanometer, a CCD component, a laser, a five-axis motion platform and the controller in the aforementioned controller embodiment ;
  • the host computer, dynamic focus component, scanning galvanometer, CCD component, laser, and five-axis motion platform are respectively connected to the controller by communication.
  • the upper computer in the embodiment of this application is composed of industrial computer, which is used to send instructions, data processing, graphic display, fault alarm, etc. After the user inputs the three-dimensional curved surface model of the part to be processed, the upper computer is used for the three-dimensional curved surface of the part to be processed
  • the model performs data processing such as block division, trajectory path planning, and process parameter selection.
  • the controller is composed of Power PMAC motion controller, which can be used for motor control, mathematical logic operations and other operations, such as controlling the switch of the laser, the movement of the five-axis motion platform, the focusing of the dynamic focus component, and the XY plane processing of the scanning galvanometer. .
  • the laser is used to receive the laser switch command output by the controller to realize the emission of the laser beam.
  • the dynamic focusing component is composed of a dynamic focusing mirror, a beam expander mirror and a reflecting mirror, among which the focusing mirror is driven by an American SMAC voice coil motor to achieve precise fine-tuning of the focus within a small range, so that the laser spot can be focused on the part to be processed in real time , and the SMAC voice coil motor has a high resolution of 0.1um for precise focusing; the beam expander has the effect of expanding and collimating the laser beam; the mirror is used to change the direction of the laser beam.
  • the scanning galvanometer is used to control the movement of the laser beam in the X and Y directions of the plane; the CCD component is used to detect the spatial position relationship between the scanning galvanometer and the part to be processed. Based on the high-speed visual image information of the laser spot, the automatically recognized scanning galvanometer and The relative position information of the parts to be processed is fed back to the controller and used to locate the starting point of the parts to be processed.
  • the five-axis motion platform is composed of platforms in five directions: X-axis, Y-axis, Z-axis, A-axis and C-axis.
  • the system also includes: a power module;
  • the power supply module is used to supply power to the host computer, dynamic focus components, scanning galvanometers, CCD components, lasers, five-axis motion platforms and controllers.
  • the embodiment of the present application also provides a part processing control device, the device includes a processor and a memory;
  • the memory is used to store the program code and transmit the program code to the processor
  • the processor is configured to execute the part processing control method in the aforementioned method embodiments according to the instructions in the program code.
  • the embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium is used to store program codes, and the program codes are used to execute the part processing control method in the foregoing method embodiments.
  • the disclosed devices and methods may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
  • the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium.
  • the technical solution of the present application is essentially or part of the contribution to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions for executing all or part of the steps of the methods described in the various embodiments of the present application through a computer device (which may be a personal computer, a server, or a network device, etc.).
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (English full name: Read-Only Memory, English abbreviation: ROM), random access memory (English full name: Random Access Memory, English abbreviation: RAM), magnetic Various media that can store program codes such as discs or optical discs.

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Abstract

一种零件加工控制方法、控制器、***和设备，控制器根据当前子块的加工轨迹控制五轴运动平台将当前子块移动到扫描振镜的加工范围内；控制CCD组件检测动态聚焦组件中聚焦镜与当前子块之间的相对距离，并基于相对距离控制动态聚焦组件进行自动调焦；控制扫描振镜根据当前子块的加工轨迹，从当前子块的加工起点对当前子块进行加工；在当前子块加工完后，判断下一子块满足预置加工条件时，重复上述步骤对下一子块加工，不满足条件时，调整条件对下一子块加工，直至整个待加工零件加工完毕。改善了现有技术通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，存在加工效率低、精度低，且激光头较重，影响加工装置的稳定性和动态性的技术问题。

Description

一种零件加工控制方法、控制器、***和设备 技术领域
本申请涉及零件加工技术领域，尤其涉及一种零件加工控制方法、控制器、***和设备。
背景技术
近年来，超快激光精密加工技术高速发展，由于具备非热熔加工技术的特性，消除了传统加工中热效应带来的负面影响，因此对玻璃、陶瓷、硬质合金及晶体硅等硬脆材料的加工具有独特的优势。硬脆材料具有抗腐蚀、耐高温、硬度高、脆性大等方面的性能，在光伏发电、航空航天、消费电子、半导体等领域具有不可替代性。为了提高性能，必须采用激光加工出复杂微结构，如发动机叶片、高精度气膜孔及陶瓷基板表面的微结构阵列，且硬脆材料中的微结构直接决定着元器件的性能。
随着精密制造技术快速发展，微结构等复杂三维曲面零件加工需求越来越广泛。目前，针对复杂三维曲面零件的精密加工，通常通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，控制激光一直聚焦到待加工零件上。这种加工方式存在加工效率低、精度低等缺点，且激光头较重，在其多角度运动时影响加工装置的稳定性和动态性。
发明内容
本申请提供了一种零件加工控制方法、控制器、***和设备，用于改善现有技术通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，存在加工效率低、精度低，且激光头较重，影响加工装置的稳定性和动态性的技术问题。
有鉴于此，本申请第一方面提供了一种零件加工控制方法，应用于控制器，包括：
根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将所述当前子块移动到扫描振镜的加工范围内；
控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离，并基于所述相对距离控制所述动态聚焦组件进行自动调焦；
控制所述扫描振镜根据所述当前子块的加工轨迹，从所述当前子块的加工起点对所述当前子块进行加工；
在所述当前子块加工完后，且判断到所述待加工零件的下一子块满足预置加工条件时，将所述待加工零件的下一子块作为所述当前子块，返回所述根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将所述当前子块移动到扫描振镜的加工范围内的步骤，直至整个所述待加工零件加工完毕。
可选的，所述加工轨迹的获取过程为：
通过上位机对用户输入的所述待加工零件的三维曲面模型进行图形分块处理，得到若干子块；
通过所述上位机根据所述待加工零件的加工起点和所述子块的轮廓信息确定所述子块的加工轨迹。
可选的，所述通过上位机对用户输入的所述待加工零件的三维曲面模型进行图形分块处理，得到若干子块，包括：
在用户输入待加工零件的三维曲面模型后，通过所述上位机根据所述扫描振镜在水平方向的最大移动距离和所述三维曲面模型各位置的法矢方向对所述待加工零件的三维曲面模型进行图形分块处理，得到若干子块；
其中，每个所述子块在X轴方向和Y轴方向的大小小于或等于所述扫描振镜在水平方向的最大移动距离，且每个所述子块上任意位置的法矢方向相同。
可选的，所述控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离，并基于所述相对距离控制所述动态聚焦组件进行自动调焦，包括：
控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离；
当所述相对距离未超出所述动态聚焦组件中的音圈电机的运动范围时，控制所述音圈电机进行运动，以实现所述动态聚焦组件的自动调焦功能；
当所述相对距离超出所述动态聚焦组件中的音圈电机的运动范围时，控制所述五轴运动平台的Z轴进行运动，使得所述聚焦镜与所述当前子块之间的相对距离变小，并返回所述控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离的步骤。
可选的，判断所述待加工零件的下一子块是否满足预置加工条件的过程为：
根据所述待加工零件的下一子块的加工轨迹，判断对所述下一子块进行加工时所述扫描振镜是否会超出所述扫描振镜的最大移动距离以及所述动态聚焦组件是否会超出所述动态聚焦组件的最大移动距离；
若判断到对所述下一子块进行加工时所述扫描振镜和/或所述动态聚焦组件会超出对应的最大移动距离时，则判定所述待加工零件的下一子块不满足预置加工条件；
若判断到对所述下一子块进行加工时所述扫描振镜和所述动态聚焦组件均不会超出对应的最大移动距离时，则判定所述待加工零件的下一子块满足预置加工条件。
可选的，所述方法还包括：
当对所述下一子块进行加工时所述扫描振镜会超出对应的最大移动距离时，根据所述扫描振镜的最大移动距离和所述当前子块在加工时所述扫描振镜的移动距离获取第一目标移动距离，并根据所述第一目标移动距离控制所述五轴运动平台的X轴、Y轴和所述扫描振镜进行运动；
和/或，当对所述下一子块进行加工时所述动态聚焦组件会超出对应的最大移动距离时，根据所述动态聚焦组件的最大移动距离和所述当前子块在加工时所述动态聚焦组件的移动距离获取第二目标移动距离，并根据所述第二目标移动距离控制所述动态聚焦组件和所述五轴运动平台的Z轴进行运动。
本申请第二方面提供了一种控制器，包括：
第一控制单元，用于根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将所述当前子块移动到扫描振镜的加工范围内；
第二控制单元，用于控制CCD组件检测动态聚焦组件中的聚焦镜与所述 当前子块之间的相对距离，并基于所述相对距离控制所述动态聚焦组件进行自动调焦；
第三控制单元，用于控制所述扫描振镜根据所述当前子块的加工轨迹，从所述当前子块的加工起点对所述当前子块进行加工；
触发单元，用于在所述当前子块加工完后，且判断到所述待加工零件的下一子块满足预置加工条件时，将所述待加工零件的下一子块作为所述当前子块，触发所述第一控制单元，直至整个所述待加工零件加工完毕。
本申请第三方面提供了一种零件加工控制***，包括：上位机、动态聚焦组件、扫描振镜、CCD组件、激光器、五轴运动平台和第二方面所述的控制器；
所述上位机、所述动态聚焦组件、所述扫描振镜、所述CCD组件、所述激光器、和所述五轴运动平台分别与所述控制器通信连接。
可选的，还包括：电源模块；
所述电源模块，用于给所述上位机、所述动态聚焦组件、所述扫描振镜、所述CCD组件、所述激光器、所述五轴运动平台和所述控制器供电。
本申请第四方面提供了一种零件加工控制设备，所述设备包括处理器以及存储器；
所述存储器用于存储程序代码，并将所述程序代码传输给所述处理器；
所述处理器用于根据所述程序代码中的指令执行第一方面任一种所述的零件加工控制方法。
从以上技术方案可以看出，本申请具有以下优点：
本申请提供了一种零件加工控制方法，应用于控制器，包括：根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将当前子块移动到扫描振镜的加工范围内；控制CCD组件检测动态聚焦组件中的聚焦镜与当前子块之间的相对距离，并基于相对距离控制动态聚焦组件进行自动调焦；控制扫描振镜根据当前子块的加工轨迹，从当前子块的加工起点对当前子块进行加工；在当前子块加工完后，且判断到待加工零件的下一子块满足预置加工条件时，将待加工零件的下一子块作为当前子块，返回根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹， 控制五轴运动平台将当前子块移动到扫描振镜的加工范围内的步骤，直至整个待加工零件加工完毕。
本申请中，控制器在根据待加工零件的当前子块的加工轨迹，控制五轴运动平台将待加工零件的当前子块移动到扫描振镜的加工范围后，通过CCD组件获取的动态聚焦组件中聚焦镜与当前子块之间的相对距离，控制动态聚焦组件进行实时自动调焦，有助于提高加工效率和加工精度；并且本申请通过控制重量较轻的扫描振镜对各子块进行加工，不需要通过移动激光头的方式来进行加工，避免了激光头多角度运动时影响加工装置的稳定性和动态性的问题，改善了现有技术通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，存在加工效率低、精度低，且激光头较重，影响加工装置的稳定性和动态性的技术问题。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。
图1为本申请实施例提供的一种零件加工控制方法的一个流程示意图；
图2为本申请实施例提供的一种控制器的一个结构示意图；
图3为本申请实施例提供的一种零件加工控制***的一个结构示意图。
具体实施方式
本申请提供了一种零件加工控制方法、控制器、***和设备，用于改善现有技术通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，存在加工效率低、精度低，且激光头较重，影响加工装置的稳定性和动态性的技术问题。
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申 请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
为了便于理解，请参阅图1，本申请实施例提供的一种零件加工控制方法，应用于控制器，包括：
步骤101、根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将当前子块移动到扫描振镜的加工范围内。
本申请实施例中加工轨迹的获取过程为：通过上位机对用户输入的待加工零件的三维曲面模型进行图形分块处理，得到若干子块；通过上位机根据待加工零件的加工起点和子块的轮廓信息确定子块的加工轨迹。
用户将待加工零件的三维曲面模型输入到上位机，通过上位机对待加工零件的三维曲面模型进行图形分块处理，得到若干子块。具体的，在用户输入待加工零件的三维曲面模型后，通过上位机根据扫描振镜在水平方向的最大移动距离和三维曲面模型各位置的法矢方向对待加工零件的三维曲面模型进行图形分块处理，得到若干子块；其中，每个子块在X轴方向和Y轴方向的大小小于或等于扫描振镜在水平方向的最大移动距离，且每个子块上任意位置的法矢方向相同。不同子块的法矢方向可以相同，也可以不相同；当待加工零件在X轴方向和Y轴方向的大小小于或等于扫描振镜在水平方向的最大移动距离，且待加工零件任意位置的法矢方向相同时，此时得到的子块数量为1个。
待加工零件需要加工的形状、图案是已知的，即待加工零件的加工轨迹是可以根据加工的形状、图案直接获取到的，加工轨迹包括加工起点和加工终点，即根据待加工零件的加工轨迹可以获取到整个待加工零件的加工起点，控制器通过控制CCD组件采用定位算法可以确定该加工起点的位置(即第一个子块的加工起点的位置)，上位机根据该加工起点所在的子块的轮廓信息和该加工起点就可以确定该子块的加工轨迹(即第一个子块的加工轨迹)，其中，该子块的加工终点为下一子块的加工起点，上位机根据下一子块的加工起点和轮廓信息就可以确定下一子块的加工轨迹。
在获取到待加工零件的各子块的加工轨迹后，根据当前子块的加工轨迹，控制器控制五轴运动平台的X轴、Y轴、Z轴、A轴和C轴将当前子块移动 到扫描振镜的加工范围，其中，扫描振镜是安装在激光头内的，本申请实施例保持激光头静止，控制五轴运动平台运动，以将五轴运动平台上的待加工零件的当前子块移动到扫描振镜的加工范围内，避免移动较重的激光头，导致影响加工装置的稳定性问题。
步骤102、控制CCD组件检测动态聚焦组件中的聚焦镜与当前子块之间的相对距离，并基于相对距离控制动态聚焦组件进行自动调焦。
本申请实施例中的动态聚焦组件由动态的聚焦镜、扩束镜及反射镜等组成，动态的聚焦镜可以采用美国SMAC型音圈电机驱动实现焦点在小范围内精密微调节，使激光光斑实时聚焦到待加工零件上，且SMAC型音圈电机具有0.1um高分辨率，使得调焦精准；扩束镜对于激光束具有扩束和准直的作用；反射镜用于改变激光束的方向。
在当前子块移动到扫描振镜的加工范围后，控制器控制激光器发射激光束，并控制CCD组件检测动态聚焦组件中的聚焦镜与当前子块之间的相对距离；当相对距离未超出动态聚焦组件中的音圈电机的运动范围时，控制音圈电机进行运动，以实现动态聚焦组件的自动调焦功能；当相对距离超出动态聚焦组件中的音圈电机的运动范围时，控制五轴运动平台的Z轴进行运动，使得聚焦镜与当前子块之间的相对距离变小，并返回控制CCD组件检测动态聚焦组件中的聚焦镜与当前子块之间的相对距离的步骤。
具体的，CCD组件基于激光光斑大小的高速视觉图像信息来自动识别聚焦镜和当前子块之间的相对距离。如果CCD组件识别到相对距离未超出动态聚焦组件中的音圈电机的运动范围时，即相对距离小于或等于动态聚焦组件的音圈电机的最大移动距离，则控制器控制动态聚焦组件中的音圈电机进行精密微运动实现自动调焦功能；如果CCD组件识别到相对距离超出动态聚焦组件中的音圈电机的运动范围时，即相对距离大于动态聚焦组件的音圈电机的最大移动距离，则控制器先控制五轴运动平台的Z轴进行大范围运动，使得聚焦镜与当前子块之间的相对距离变小，当相对距离等于动态聚焦组件的音圈电机的最大移动距离时，再控制动态聚焦组件的音圈电机进行精密微运动。
现有技术中在对扫描振镜进行调焦时，容易受到装置的运动范围的影响， 调焦范围有限，调焦效果较差，影响加工效率和加工精度，本申请实施例通过结合五轴运动平台的Z轴的大范围运动和动态聚焦组件的音圈电机进行小范围的精密微调，实现实时自动调焦，不受动态聚焦组件的调焦范围影响，调焦效果好，有助于提高加工效率和加工精度。
步骤103、控制扫描振镜根据当前子块的加工轨迹，从当前子块的加工起点对当前子块进行加工。
控制器在控制动态聚焦组件调焦好后，根据当前子块的加工轨迹，控制扫描振镜从加工起点沿平面X方向、Y方向对当前子块进行加工。当当前子块为第一个子块时，控制器通过控制CCD组件对第一个子块的加工起点进行定位，然后根据第一个子块的加工轨迹，控制扫描振镜从该加工起点沿平面X方向、Y方向对第一个子块进行加工。在当前子块不是第一个子块时，就不需要再通过CCD组件进行加工起点的定位。
本申请实施例中，控制器控制五轴运动平台的X轴、Y轴、Z轴、A轴和C轴将当前子块移动到扫描振镜的加工范围，可以实现变法矢加工；并且，由于分块后的各子块任意位置的法矢方向相同，因此，扫描振镜在对每个子块进行加工时是固定法矢加工的，即扫描振镜在对每个子块进行加工时，是不需要改变法矢的，只有对下一子块进行加工时，才需要考虑是否改变法矢，提高了加工效率。
步骤104、在当前子块加工完后，且判断到待加工零件的下一子块满足预置加工条件时，将待加工零件的下一子块作为当前子块，返回步骤101，直至整个待加工零件加工完毕。
在当前子块加工完后，为待加工零件的下一子块做准备，需要根据下一子块的加工轨迹预先判断下一子块是否满足预置加工条件。具体的，
根据待加工零件的下一子块的加工轨迹，判断对下一子块进行加工时扫描振镜是否会超出扫描振镜的最大移动距离以及动态聚焦组件是否会超出动态聚焦组件的最大移动距离；若判断到对下一子块进行加工时扫描振镜和/或动态聚焦组件会超出对应的最大移动距离时，则判定待加工零件的下一子块不满足预置加工条件；若判断到对下一子块进行加工时扫描振镜和动态聚焦组件均不会超出对应的最大移动距离时，则判定待加工零件的下一子块满足 预置加工条件。
进一步，当对下一子块进行加工时扫描振镜会超出对应的最大移动距离时，根据扫描振镜的最大移动距离和当前子块在加工时扫描振镜的移动距离获取第一目标移动距离，并根据第一目标移动距离控制五轴运动平台的X轴、Y轴和扫描振镜进行运动；和/或，当对下一子块进行加工时动态聚焦组件会超出对应的最大移动距离时，根据动态聚焦组件的最大移动距离和当前子块在加工时动态聚焦组件的移动距离获取第二目标移动距离，并根据第二目标移动距离控制动态聚焦组件和五轴运动平台的Z轴进行运动。
具体的，当判断到对下一子块进行加工时扫描振镜会超出扫描振镜的最大移动距离，以及判断到对下一子块进行加工时动态聚焦组件会超出动态聚焦组件的最大移动距离时，此时扫描振镜和动态聚焦组件无法同向运动，则控制器获取扫描振镜的最大行程处(即扫描振镜沿平面X、Y方向移动的最大移动距离D 1处)和其零点位置之间的相对距离(即扫描振镜的最大移动距离的一半D 1/2)，以及当前子块在加工时扫描振镜沿平面X、Y方向的移动距离D 2(移动距离D 2为当前子块加工时扫描振镜的移动起点到移动终点的距离)，并比较该相对距离D 1/2与该移动距离D 2的大小。当该相对距离D 1/2小于或等于移动距离D 2时，控制器将该相对距离D 1/2作为第一目标移动距离；当该相对距离D 1/2大于移动距离D 2时，控制器将该移动距离D 2作为第一目标移动距离，并根据该第一目标移动距离，控制五轴运动平台的X轴、Y轴和扫描振镜在平面X、Y方向进行运动。同时，控制器获取动态聚焦组件的最大行程处(即动态聚焦组件中音圈电机的最大移动距离D 3处)和其零点位置之间的相对距离(即动态聚焦组件中音圈电机的最大移动距离的一半D 3/2)，以及当前子块在加工时动态聚焦组件的移动距离D 4(移动距离D 4为当前子块加工时动态聚焦组件的移动起点到移动终点的距离)，并比较该相对距离与该移动距离D 4的大小。当该相对距离D 3/2小于或等于移动距离D 4时，控制器将该相对距离D 3/2作为第二目标移动距离；当该相对距离D 3/2大于移动距离D 4时，控制器将该移动距离D 4作为第二目标移动距离，并根据该第二目标移动距离，控制动态聚焦组件和五轴运动平台的Z轴进行运动，使得下一子块满足预置加工条件。
当判断到对下一子块进行加工时扫描振镜会超出扫描振镜的最大移动距离，以及判断到对下一子块进行加工时动态聚焦组件不会超出动态聚焦组件的最大移动距离时，则控制器根据第一目标移动距离，控制五轴运动平台的X轴、Y轴和扫描振镜在平面X、Y方向进行运动，聚焦组件和五轴运动平台的Z轴不运动，使得下一子块满足预置加工条件。
当判断到对下一子块进行加工时扫描振镜不会超出扫描振镜的最大移动距离，以及判断到对下一子块进行加工时动态聚焦组件会超出动态聚焦组件的最大移动距离时，则控制器根据第二目标移动距离，控制动态聚焦组件和五轴运动平台的Z轴进行运动，五轴运动平台的X轴、Y轴和扫描振镜不运动，使得下一子块满足预置加工条件。
在待加工零件的下一子块满足预置加工条件时，将待加工零件的下一子块作为当前子块，返回步骤101，直至整个待加工零件加工完毕。本申请实施例中，在对待加工零件进行加工时的加工范围不受扫描振镜、动态聚焦组件的运动范围的限制，提高了零件加工的可操作空间，灵活性和实用性较高。
本申请实施例中，控制器在根据待加工零件的当前子块的加工轨迹，控制五轴运动平台将待加工零件的当前子块移动到扫描振镜的加工范围后，通过CCD组件获取的动态聚焦组件中聚焦镜与当前子块之间的相对距离，控制动态聚焦组件进行实时自动调焦，有助于提高加工效率和加工精度；并且本申请通过控制重量较轻的扫描振镜对各子块进行加工，不需要通过移动激光头的方式来进行加工，避免了激光头多角度运动时影响加工装置的稳定性和动态性的问题，改善了现有技术通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，存在加工效率低、精度低，且激光头较重，影响加工装置的稳定性和动态性的技术问题。
以上为本申请提供的一种零件加工控制方法的一个实施例，以下为本申请提供的一种控制器的一个实施例。
请参考图2，本申请实施例提供的一种控制器，包括：
第一控制单元201，用于根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将当前子块移动到扫描振镜的加工范围内；
第二控制单元202，用于控制CCD组件检测动态聚焦组件中的聚焦镜与当前子块之间的相对距离，并基于相对距离控制动态聚焦组件进行自动调焦；
第三控制单元203，用于控制扫描振镜根据当前子块的加工轨迹，从当前子块的加工起点对当前子块进行加工；
触发单元204，用于在当前子块加工完后，且判断到待加工零件的下一子块满足预置加工条件时，将待加工零件的下一子块作为当前子块，触发第一控制单元，直至整个待加工零件加工完毕。
作为进一步地改进，加工轨迹的获取过程为：
通过上位机对用户输入的待加工零件的三维曲面模型进行图形分块处理，得到若干子块；
通过上位机根据待加工零件的加工起点和子块的轮廓信息确定子块的加工轨迹。
作为进一步地改进，通过上位机对用户输入的待加工零件的三维曲面模型进行图形分块处理，得到若干子块，包括：
在用户输入待加工零件的三维曲面模型后，通过上位机根据扫描振镜在水平方向的最大移动距离和三维曲面模型各位置的法矢方向对待加工零件的三维曲面模型进行图形分块处理，得到若干子块；
其中，每个子块在X轴方向和Y轴方向的大小小于或等于扫描振镜在水平方向的最大移动距离，且每个子块上任意位置的法矢方向相同。
作为进一步地改进，第二控制单元202具体包括：
CCD组件控制子单元，用于控制CCD组件检测动态聚焦组件中的聚焦镜与当前子块之间的相对距离；
音圈电机控制子单元，用于当相对距离未超出动态聚焦组件中的音圈电机的运动范围时，控制音圈电机进行运动，以实现动态聚焦组件的自动调焦功能；
五轴运动平台控制子单元，用于当相对距离超出动态聚焦组件中的音圈电机的运动范围时，控制五轴运动平台的Z轴进行运动，使得聚焦镜与当前子块之间的相对距离变小，并触发CCD组件控制子单元。
作为进一步地改进，判断待加工零件的下一子块是否满足预置加工条件 的过程为：
根据待加工零件的下一子块的加工轨迹，判断对下一子块进行加工时扫描振镜是否会超出扫描振镜的最大移动距离以及动态聚焦组件是否会超出动态聚焦组件的最大移动距离；
若判断到对下一子块进行加工时扫描振镜和/或动态聚焦组件会超出对应的最大移动距离时，则判定待加工零件的下一子块不满足预置加工条件；
若判断到对下一子块进行加工时扫描振镜和动态聚焦组件均不会超出对应的最大移动距离时，则判定待加工零件的下一子块满足预置加工条件。
作为进一步地改进，控制器还包括：第四控制单元，用于：
当对下一子块进行加工时扫描振镜会超出对应的最大移动距离时，根据扫描振镜的最大移动距离和当前子块在加工时扫描振镜的移动距离获取第一目标移动距离，并根据第一目标移动距离控制五轴运动平台的X轴、Y轴和扫描振镜进行运动；
和/或，当对下一子块进行加工时动态聚焦组件会超出对应的最大移动距离时，根据动态聚焦组件的最大移动距离和当前子块在加工时动态聚焦组件的移动距离获取第二目标移动距离，并根据第二目标移动距离控制动态聚焦组件和五轴运动平台的Z轴进行运动。
本申请实施例中，控制器在根据待加工零件的当前子块的加工轨迹，控制五轴运动平台将待加工零件的当前子块移动到扫描振镜的加工范围后，通过CCD组件获取的动态聚焦组件中聚焦镜与当前子块之间的相对距离，控制动态聚焦组件进行实时自动调焦，有助于提高加工效率和加工精度；并且本申请通过控制重量较轻的扫描振镜对各子块进行加工，不需要通过移动激光头的方式来进行加工，避免了激光头多角度运动时影响加工装置的稳定性和动态性的问题，改善了现有技术通过控制激光头以旋转和平移的方式使激光头和待加工零件保持恒定位姿，存在加工效率低、精度低，且激光头较重，影响加工装置的稳定性和动态性的技术问题。
以上为本申请提供的一种控制器的一个实施例，以下为本申请提供的一种零件加工控制***的一个实施例。
请参考图3，本申请实施例提供的一种零件加工控制***，包括：上位机、 动态聚焦组件、扫描振镜、CCD组件、激光器、五轴运动平台和前述控制器实施例中的控制器；
上位机、动态聚焦组件、扫描振镜、CCD组件、激光器、和五轴运动平台分别与控制器通信连接。
本申请实施例中的上位机由工控机组成，用于发送指令、数据处理、图形显示、故障报警等，用户在输入待加工零件的三维曲面模型后，上位机用于对待加工零件的三维曲面模型进行分块、轨迹路径的规划、工艺参数的选择等数据处理。
控制器由Power PMAC运动控制器组成，可用于电机控制、数学逻辑运算等操作，如控制激光器的开关、五轴运动平台的运动、动态聚焦组件的调焦、扫描振镜的XY平面加工等操作。激光器用于接收控制器输出的激光开关指令，实现激光束的发射。动态聚焦组件由动态的聚焦镜、扩束镜及反射镜等组成，其中，聚焦镜采用美国SMAC型音圈电机驱动实现焦点在小范围内精密微调节，使激光光斑实时聚焦到待加工零件上，且SMAC型音圈电机具有0.1um高分辨率使调焦精准；扩束镜对于激光束具有扩束和准直的作用；反射镜用于改变激光束的方向。
扫描振镜用于在平面X、Y方向控制激光束运动；CCD组件用于检测扫描振镜与待加工零件的空间位置关系，基于激光光斑的高速视觉图像信息，将自动识别的扫描振镜和待加工零件的相对位置信息反馈给控制器，并用来对待加工零件的加工起点进行定位。
五轴运动平台由X轴、Y轴、Z轴、A轴及C轴五个方向的平台组成，通过带动待加工零件沿X轴方向、Y轴方向、Z轴方向的直线运动和绕X轴方向和Z轴方向的旋转运动实现待加工零件的大范围、多法矢、高精度的加工。
作为进一步地改进，***还包括：电源模块；
电源模块，用于给上位机、动态聚焦组件、扫描振镜、CCD组件、激光器、五轴运动平台和控制器供电。
本申请实施例还提供了一种零件加工控制设备，设备包括处理器以及存储器；
存储器用于存储程序代码，并将程序代码传输给处理器；
处理器用于根据程序代码中的指令执行前述方法实施例中的零件加工控制方法。
本申请实施例还提供了一种计算机可读存储介质，计算机可读存储介质用于存储程序代码，程序代码用于执行前述方法实施例中的零件加工控制方法。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的***，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个***，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以通过一台计算机设备(可以是个人计算机， 服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(英文全称：Read-Only Memory，英文缩写：ROM)、随机存取存储器(英文全称：Random Access Memory，英文缩写：RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (8)

  1. 一种零件加工控制方法，其特征在于，应用于控制器，所述方法包括：
    根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将所述当前子块移动到扫描振镜的加工范围内；
    控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离，并基于所述相对距离控制所述动态聚焦组件进行自动调焦；
    控制所述扫描振镜根据所述当前子块的加工轨迹，从所述当前子块的加工起点对所述当前子块进行加工；
    在所述当前子块加工完后，且判断到所述待加工零件的下一子块满足预置加工条件时，将所述待加工零件的下一子块作为所述当前子块，返回所述根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将所述当前子块移动到扫描振镜的加工范围内的步骤，直至整个所述待加工零件加工完毕；
    判断所述待加工零件的下一子块是否满足预置加工条件的过程为：
    根据所述待加工零件的下一子块的加工轨迹，判断对所述下一子块进行加工时所述扫描振镜是否会超出所述扫描振镜的最大移动距离以及所述动态聚焦组件是否会超出所述动态聚焦组件的最大移动距离；
    若判断到对所述下一子块进行加工时所述扫描振镜和/或所述动态聚焦组件会超出对应的最大移动距离时，则判定所述待加工零件的下一子块不满足预置加工条件；
    若判断到对所述下一子块进行加工时所述扫描振镜和所述动态聚焦组件均不会超出对应的最大移动距离时，则判定所述待加工零件的下一子块满足预置加工条件；
    所述方法还包括：
    当对所述下一子块进行加工时所述扫描振镜会超出对应的最大移动距离时，根据所述扫描振镜的最大移动距离和所述当前子块在加工时所述扫描振镜的移动距离获取第一目标移动距离，并根据所述第一目标移动距离控制所述五轴运动平台的X轴、Y轴和所述扫描振镜进行运动；
    和/或，当对所述下一子块进行加工时所述动态聚焦组件会超出对应的最大移动距离时，根据所述动态聚焦组件的最大移动距离和所述当前子块在加 工时所述动态聚焦组件的移动距离获取第二目标移动距离，并根据所述第二目标移动距离控制所述动态聚焦组件和所述五轴运动平台的Z轴进行运动。
  2. 根据权利要求1所述的零件加工控制方法，其特征在于，所述加工轨迹的获取过程为：
    通过上位机对用户输入的所述待加工零件的三维曲面模型进行图形分块处理，得到若干子块；
    通过所述上位机根据所述待加工零件的加工起点和所述子块的轮廓信息确定所述子块的加工轨迹。
  3. 根据权利要求2所述的零件加工控制方法，其特征在于，所述通过上位机对用户输入的所述待加工零件的三维曲面模型进行图形分块处理，得到若干子块，包括：
    在用户输入待加工零件的三维曲面模型后，通过所述上位机根据所述扫描振镜在水平方向的最大移动距离和所述三维曲面模型各位置的法矢方向对所述待加工零件的三维曲面模型进行图形分块处理，得到若干子块；
    其中，每个所述子块在X轴方向和Y轴方向的大小小于或等于所述扫描振镜在水平方向的最大移动距离，且每个所述子块上任意位置的法矢方向相同。
  4. 根据权利要求1所述的零件加工控制方法，其特征在于，所述控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离，并基于所述相对距离控制所述动态聚焦组件进行自动调焦，包括：
    控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离；
    当所述相对距离未超出所述动态聚焦组件中的音圈电机的运动范围时，控制所述音圈电机进行运动，以实现所述动态聚焦组件的自动调焦功能；
    当所述相对距离超出所述动态聚焦组件中的音圈电机的运动范围时，控制所述五轴运动平台的Z轴进行运动，使得所述聚焦镜与所述当前子块之间的相对距离变小，并返回所述控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离的步骤。
  5. 一种控制器，其特征在于，包括：
    第一控制单元，用于根据获取的待加工零件的各子块的加工轨迹确定当前子块的加工轨迹，控制五轴运动平台将所述当前子块移动到扫描振镜的加工范围内；
    第二控制单元，用于控制CCD组件检测动态聚焦组件中的聚焦镜与所述当前子块之间的相对距离，并基于所述相对距离控制所述动态聚焦组件进行自动调焦；
    第三控制单元，用于控制所述扫描振镜根据所述当前子块的加工轨迹，从所述当前子块的加工起点对所述当前子块进行加工；
    触发单元，用于在所述当前子块加工完后，且判断到所述待加工零件的下一子块满足预置加工条件时，将所述待加工零件的下一子块作为所述当前子块，触发所述第一控制单元，直至整个所述待加工零件加工完毕；
    判断所述待加工零件的下一子块是否满足预置加工条件的过程为：
    根据所述待加工零件的下一子块的加工轨迹，判断对所述下一子块进行加工时所述扫描振镜是否会超出所述扫描振镜的最大移动距离以及所述动态聚焦组件是否会超出所述动态聚焦组件的最大移动距离；
    若判断到对所述下一子块进行加工时所述扫描振镜和/或所述动态聚焦组件会超出对应的最大移动距离时，则判定所述待加工零件的下一子块不满足预置加工条件；
    若判断到对所述下一子块进行加工时所述扫描振镜和所述动态聚焦组件均不会超出对应的最大移动距离时，则判定所述待加工零件的下一子块满足预置加工条件；
    所述控制器还包括：第四控制单元，用于：
    当对所述下一子块进行加工时所述扫描振镜会超出对应的最大移动距离时，根据所述扫描振镜的最大移动距离和所述当前子块在加工时所述扫描振镜的移动距离获取第一目标移动距离，并根据所述第一目标移动距离控制所述五轴运动平台的X轴、Y轴和所述扫描振镜进行运动；
    和/或，当对所述下一子块进行加工时所述动态聚焦组件会超出对应的最大移动距离时，根据所述动态聚焦组件的最大移动距离和所述当前子块在加工时所述动态聚焦组件的移动距离获取第二目标移动距离，并根据所述第二 目标移动距离控制所述动态聚焦组件和所述五轴运动平台的Z轴进行运动。
  6. 一种零件加工控制***，其特征在于，包括：上位机、动态聚焦组件、扫描振镜、CCD组件、激光器、五轴运动平台和权利要求5所述的控制器；
    所述上位机、所述动态聚焦组件、所述扫描振镜、所述CCD组件、所述激光器、和所述五轴运动平台分别与所述控制器通信连接。
  7. 根据权利要求6所述的零件加工控制***，其特征在于，还包括：电源模块；
    所述电源模块，用于给所述上位机、所述动态聚焦组件、所述扫描振镜、所述CCD组件、所述激光器、所述五轴运动平台和所述控制器供电。
  8. 一种零件加工控制设备，其特征在于，所述设备包括处理器以及存储器；
    所述存储器用于存储程序代码，并将所述程序代码传输给所述处理器；所述处理器用于根据所述程序代码中的指令执行权利要求1-4任一项所述的零件加工控制方法。
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