WO2023273757A1 - Printed circuit board and electronic device - Google Patents

Abstract

Disclosed in the present application are a printed circuit board and an electronic device. The printed circuit board comprises a connector plugging area, wherein a plurality of rows of crimping holes are provided in the connector plugging area; each row of crimping holes comprises at least two pairs of signal crimping holes arranged at intervals; each pair of signal crimping holes comprises two signal crimping holes; the row arrangement direction of the crimping holes is a first direction; one grounding hole group is provided, in the first direction, on each of the two sides of each pair of signal crimping holes; the grounding hole group comprises a grounding crimping hole and a ground hole located on at least one side of the ground crimping hole; at least one shielding hole is further provided between the two signal crimping holes in each pair of signal crimping holes; and the grounding crimping holes, the ground holes and the shielding holes are all grounded and jointly surround the signal crimping holes. Therefore, an electromagnetic field of one pair of signal crimping holes is limited within a certain range, thereby reducing signal crosstalk between each pair of signal crimping holes, such that a high-speed signal can meet a corresponding transmission requirement when being transmitted in the printed circuit board.

Description

印刷电路板和电子设备Printed Circuit Boards and Electronics

本申请要求在2021年6月29日提交中国国家知识产权局、申请号为202121465962.6、申请名称为“印刷电路板和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to a Chinese patent application with application number 202121465962.6 and application title "Printed Circuit Boards and Electronic Devices" filed with the State Intellectual Property Office of China on June 29, 2021, the entire contents of which are hereby incorporated by reference into this application middle.

技术领域technical field

本申请实施例涉及电路板技术领域，尤其涉及一种印刷电路板和电子设备。The embodiments of the present application relate to the technical field of circuit boards, and in particular to a printed circuit board and electronic equipment.

背景技术Background technique

随着通信技术的发展，对于信号传输的速率要求越来越高，信号传输的速率逐渐由56G向112G进行演进，且未来存在继续演进到224G可能。高速信号在电子设备内进行传输时会经过印刷电路板以及印刷电路板上的连接器，印刷电路板上设有多对信号压接孔，用于与连接器的信号压接针相配合，从而实现相应信号传输功能。然而，在进行高速信号的传输时，传统印刷电路板上的各对信号压接孔之间容易产生较为严重的信号串扰问题，从而无法满足高速信号的传输要求。With the development of communication technology, the requirements for the rate of signal transmission are getting higher and higher, and the rate of signal transmission is gradually evolving from 56G to 112G, and there is a possibility of continuing to evolve to 224G in the future. When the high-speed signal is transmitted in the electronic equipment, it will pass through the printed circuit board and the connector on the printed circuit board. There are many pairs of signal crimping holes on the printed circuit board, which are used to match the signal crimping pins of the connector, so that Realize the corresponding signal transmission function. However, when performing high-speed signal transmission, serious signal crosstalk is likely to occur between pairs of signal crimping holes on a traditional printed circuit board, thus failing to meet high-speed signal transmission requirements.

发明内容Contents of the invention

本申请的目的是提供一种印刷电路板和电子设备，能够将各对信号压接孔之间的电磁场进行屏蔽，以降低高速信号在各对信号压接孔之间的信号串扰，从而使得高速信号能够满足相应传输要求。The purpose of this application is to provide a printed circuit board and electronic equipment, which can shield the electromagnetic field between each pair of signal crimping holes, so as to reduce the signal crosstalk of high-speed signals between each pair of signal crimping holes, so that high-speed The signal can meet the corresponding transmission requirements.

为实现本申请的目的，提供了如下的技术方案：For realizing the purpose of this application, provide following technical scheme:

第一方面，本申请提供一种印刷电路板，印刷电路板包括连接器插接区，所述连接器插接区内设置有多行压接孔，每行压接孔包括间隔设置的至少两对信号压接孔，每对所述信号压接孔包括两个所述信号压接孔；压接孔的行排列方向为第一方向，沿所述第一方向，每对所述信号压接孔的两侧各设置有一个接地孔组，所述接地孔组包括接地压接孔和位于所述接地压接孔至少一侧的地孔，每对所述信号压接孔中的两个信号压接孔之间还设有至少一个屏蔽孔，所述接地压接孔、所述地孔和所述屏蔽孔均接地；所述接地压接孔、所述地孔和所述屏蔽孔共同包围所述信号压接孔。可以理解的是，印刷电路板可以为双面板，也可以为多层板，当印刷电路板为多层板时，其包括多层导电层和多层介电层，多层导电层和多层介电层交替堆叠设置，在此不对印刷电路板的层数进行具体的限定。其中，导电层一般由铜箔制成，用于构成印刷电路板中的信号出线；介电层一般由树脂或玻璃纤维等制成，用于电性隔离相邻的两层导电层。In a first aspect, the present application provides a printed circuit board. The printed circuit board includes a connector insertion area, and multiple rows of crimping holes are arranged in the connector insertion area, and each row of crimping holes includes at least two For the signal crimping holes, each pair of the signal crimping holes includes two of the signal crimping holes; the row arrangement direction of the crimping holes is the first direction, and along the first direction, each pair of the signal crimping holes A ground hole group is provided on both sides of the hole, and the ground hole group includes a ground crimp hole and a ground hole located at least one side of the ground crimp hole, and two signal crimp holes in each pair of signal crimp holes At least one shielding hole is also provided between the crimping holes, and the grounding crimping hole, the ground hole and the shielding hole are all grounded; the grounding crimping hole, the ground hole and the shielding hole jointly surround The signal crimp holes. It can be understood that the printed circuit board can be a double-sided board or a multi-layer board. When the printed circuit board is a multi-layer board, it includes a multi-layer conductive layer and a multi-layer dielectric layer, a multi-layer conductive layer and a multi-layer The dielectric layers are alternately stacked, and the number of layers of the printed circuit board is not specifically limited here. Among them, the conductive layer is generally made of copper foil, which is used to form the signal outlet in the printed circuit board; the dielectric layer is generally made of resin or glass fiber, etc., and is used to electrically isolate two adjacent conductive layers.

还可以理解的是，连接器插接区用于与连接器相配合，连接器插接区在印刷电路板中的位置不限，示例性的，连接器插接区可以位于印刷电路板的四角区域，也可以位于中部区域。并且，连接器插接区内的压接孔的行数，以及每行压接孔内信号压接孔的数量均可根据相应使用要求来进行设置，在此不进行具体的限定。It can also be understood that the connector insertion area is used to cooperate with the connector, and the position of the connector insertion area in the printed circuit board is not limited. Exemplarily, the connector insertion area can be located at the four corners of the printed circuit board region, and can also be located in the central region. Moreover, the number of rows of crimping holes in the connector insertion area and the number of signal crimping holes in each row of crimping holes can be set according to the corresponding use requirements, and are not specifically limited here.

接地压接孔用于与连接器的接地压接针相配合，接地压接孔的形状与连接器中的接地压接针的形状相同或相似，以使连接器中的接地压接针可插装于接地压接孔。地孔设于接地压接孔的至少一侧，且地孔和接地压接孔均连接于印刷电路板的导电层，以实现接地，在同一行压接孔中，通过在每相邻的两对信号压接孔之间均设置接地压接孔和地孔，能够将相邻的两对信号压接孔隔开，从而对相邻的两对信号压接孔之间的电磁场进行屏蔽，以有效降低同 一行的两对信号压接孔之间的信号串扰。The ground crimping hole is used to match the grounding crimping pin of the connector, and the shape of the grounding crimping hole is the same or similar to that of the grounding crimping pin in the connector, so that the grounding crimping pin in the connector can be inserted Mounted in the ground crimp hole. The ground hole is set on at least one side of the ground crimping hole, and both the ground hole and the grounding crimping hole are connected to the conductive layer of the printed circuit board to achieve grounding. In the same row of crimping holes, through each adjacent two Grounding crimping holes and ground holes are arranged between the signal crimping holes, which can separate two adjacent pairs of signal crimping holes, thereby shielding the electromagnetic field between two adjacent pairs of signal crimping holes, so as to Effectively reduce signal crosstalk between two pairs of signal crimping holes in the same row.

屏蔽孔同样连接于导电层，以实现接地。通过设置屏蔽孔，使得接地压接孔、地孔和屏蔽孔能够共同包围信号压接孔。可以理解的是，接地压接孔、地孔和屏蔽孔围合形成一个屏蔽区域，一对信号压接孔的电磁场被限制在上述屏蔽区域内，从而不仅减少了同一行内各对信号压接孔之间的信号串扰，还减少了不同行间各对信号压接孔之间的信号串扰，使得高速信号在本申请实施例提供的印刷电路板中进行传输时，能够满足相应传输要求。The shielding hole is also connected to the conductive layer for grounding. By setting the shielding hole, the ground crimping hole, the ground hole and the shielding hole can jointly surround the signal crimping hole. It can be understood that the ground crimping holes, ground holes and shielding holes form a shielding area, and the electromagnetic field of a pair of signal crimping holes is limited in the above shielding area, which not only reduces the number of signal crimping holes in the same row. The signal crosstalk between them also reduces the signal crosstalk between each pair of signal crimping holes between different rows, so that when high-speed signals are transmitted in the printed circuit board provided by the embodiment of the present application, the corresponding transmission requirements can be met.

本申请提供的印刷电路板，通过在每对信号压接孔的两侧各设置一个接地孔组，接地孔组包括接地压接孔和位于接地压接孔至少一侧的地孔，并在每对信号压接孔中的两个信号压接孔之间还设有至少一个屏蔽孔，接地压接孔、地孔和屏蔽孔均接地，且共同包围信号压接孔，从而将一对信号压接孔的电磁场限制在一定范围内，减少了同一行内各对信号压接孔之间的信号串扰以及不同行间各对信号压接孔之间的信号串扰，使得高速信号在该印刷电路板中进行传输时能够满足相应传输要求。In the printed circuit board provided by the present application, a grounding hole group is provided on both sides of each pair of signal crimping holes, and the grounding hole group includes grounding crimping holes and ground holes on at least one side of the grounding crimping holes, There is also at least one shielding hole between the two signal crimping holes in the signal crimping hole, the grounding crimping hole, the ground hole and the shielding hole are all grounded, and they surround the signal crimping hole together, so that a pair of signal crimping holes The electromagnetic field of the connection hole is limited within a certain range, which reduces the signal crosstalk between each pair of signal crimping holes in the same row and the signal crosstalk between each pair of signal crimping holes in different rows, so that the high-speed signal is in the printed circuit board. The transmission can meet the corresponding transmission requirements.

一种实施方式中，所述印刷电路板包括第一表面，在垂直于所述第一表面的方向上，所述地孔、所述屏蔽孔和所述接地压接孔构成包围孔组，所述包围孔组在垂直于所述第一表面的方向上的延伸的尺寸大于或等于所述信号压接孔的在垂直于所述第一表面的方向上的延伸的尺寸。可以理解的是，所述地孔、所述屏蔽孔和所述接地压接孔的深度均应大于或等于所述信号压接孔的深度。在上述结构下，接地压接孔、地孔和屏蔽孔可在印刷电路板的厚度方向对相邻的各对信号压接孔之间的电磁场进行屏蔽，以降低各对信号压接孔之间的信号串扰。In one embodiment, the printed circuit board includes a first surface, and in a direction perpendicular to the first surface, the ground hole, the shielding hole, and the ground crimping hole form a surrounding hole group, and the The dimension of the surrounding hole group extending in the direction perpendicular to the first surface is greater than or equal to the dimension of the signal crimping holes extending in the direction perpendicular to the first surface. It can be understood that the depths of the ground hole, the shielding hole and the ground crimping hole should be greater than or equal to the depth of the signal crimping hole. Under the above structure, the ground crimping hole, ground hole and shielding hole can shield the electromagnetic field between adjacent pairs of signal crimping holes in the thickness direction of the printed circuit board, so as to reduce the gap between each pair of signal crimping holes. signal crosstalk.

一种实施方式中，每个所述接地孔组均包括多个所述地孔，且多个所述地孔在第二方向上的最大连线长度，大于或等于所述信号压接孔在所述第二方向上的长度；所述第二方向在所述第一表面上且垂直于所述第一方向。可以理解的是，当地孔的数量为多个时，多个地孔可覆盖更大的区域，从而能够对信号压接孔的电磁场进行更加全面的屏蔽。并且，当多个地孔在第二方向上的最大连线长度，大于或等于信号压接孔在第二方向上的长度时，多个地孔和接地压接孔组成的接地孔组能够有效分隔同一行内的相邻两对信号压接孔，以阻隔相邻两对信号压接孔之间的电磁场，从而减少了同一行内各对信号压接孔之间的信号串扰。需要说明的是，最大连线长度指的是孔与孔之间的连线长度的最大值。In one embodiment, each of the ground hole groups includes a plurality of ground holes, and the maximum connection length of the plurality of ground holes in the second direction is greater than or equal to the signal crimping hole in the second direction. Length in the second direction; the second direction is on the first surface and is perpendicular to the first direction. It can be understood that when there are multiple ground holes, the multiple ground holes can cover a larger area, so that the electromagnetic fields of the signal crimping holes can be shielded more comprehensively. Moreover, when the maximum connection length of the plurality of ground holes in the second direction is greater than or equal to the length of the signal crimping hole in the second direction, the ground hole group composed of the plurality of ground holes and the ground crimping hole can effectively Two adjacent pairs of signal crimping holes in the same row are separated to block the electromagnetic field between two adjacent pairs of signal crimping holes, thereby reducing signal crosstalk between pairs of signal crimping holes in the same row. It should be noted that the maximum connection length refers to the maximum value of the connection length between holes.

一种实施方式中，每个所述接地孔组均包括两对所述地孔，且沿所述第一方向，两对所述地孔分别位于所述接地压接孔的两侧，每对所述地孔均包括两个沿所述第二方向间隔排布的所述地孔。可以理解的是，通常情况下，同一行的相邻两对信号压接孔之间的间隔空间较小，因此，二者之间不具备足够的空间来设置数量较多的地孔。在本实施例中，仅通过设置两对地孔包围接地压接孔以形成接地孔组，使得相邻两对信号压接孔之间的间隔空间能够有效容纳上述接地孔组，并且，一个接地压接孔与两对地孔相组合即可起到足够的电磁场屏蔽效果，以有效减少同一行的相邻两对信号压接孔之间的信号串扰。In one embodiment, each of the ground hole groups includes two pairs of the ground holes, and along the first direction, the two pairs of the ground holes are respectively located on both sides of the ground crimping hole, each pair Each of the ground holes includes two ground holes arranged at intervals along the second direction. It can be understood that, generally, the space between two adjacent pairs of signal crimping holes in the same row is relatively small, so there is not enough space between them to arrange a large number of ground holes. In this embodiment, only two pairs of ground holes surround the ground crimping holes to form a ground hole group, so that the space between two adjacent pairs of signal crimping holes can effectively accommodate the above-mentioned ground hole groups, and one ground hole The combination of the crimping holes and the two pairs of ground holes can achieve sufficient electromagnetic field shielding effect, so as to effectively reduce signal crosstalk between two adjacent pairs of signal crimping holes in the same row.

一种实施方式中，所述接地压接孔与所述地孔相连通，以形成一体式结构。可以理解的是，根据不同的使用要求，可将接地压接孔与地孔之间部分重叠，以形成一体式的梅花孔结构，在上述结构下，接地压接孔和地孔所占用的空间更小，且能够起到足够的电磁场屏蔽效果，以有效减少同一行的相邻两对信号压接孔之间的信号串扰。In one embodiment, the ground crimping hole communicates with the ground hole to form an integrated structure. It can be understood that, according to different application requirements, the ground crimping hole and the ground hole can be partially overlapped to form an integrated plum blossom hole structure. Under the above structure, the space occupied by the ground crimping hole and the ground hole Smaller and capable of sufficient electromagnetic field shielding effect to effectively reduce signal crosstalk between two adjacent pairs of signal crimping holes in the same row.

一种实施方式中，每对所述信号压接孔中的两个信号压接孔之间设有多个屏蔽孔，多个所述屏蔽孔至少包括相间隔的第一屏蔽孔和第二屏蔽孔，所述第一屏蔽孔设于所述信号压接孔朝向所述第二方向的一侧，所述第二屏蔽孔设于所述信号压接孔背离所述第二方向的一侧。需要说明的是，即使将位于相邻两行内的信号压接孔进行错位设置，在传输高速信号时，不 同行的信号压接孔之间同样会存在较为严重的信号串扰的问题。本实施例通过设置第一屏蔽孔和第二屏蔽孔，且第一屏蔽孔设于信号压接孔朝向第二方向的一侧，第二屏蔽孔设于信号压接孔背离第二方向的一侧，即，在第二方向上，第一屏蔽孔设于本行的信号压接孔与上一行的信号压接孔之间，第二屏蔽孔设于本行的信号压接孔与下一行的信号压接孔之间，从而第一屏蔽孔和第二屏蔽孔可将不同行间的信号压接孔进行分隔，以有效减少不同行间的各对信号压接孔之间的信号串扰。In one embodiment, a plurality of shielding holes are provided between two signal crimping holes in each pair of signal crimping holes, and the plurality of shielding holes at least include a first shielding hole and a second shielding hole spaced apart from each other. The first shielding hole is provided on a side of the signal crimping hole facing the second direction, and the second shielding hole is provided on a side of the signal crimping hole facing away from the second direction. It should be noted that even if the signal crimping holes located in two adjacent rows are misplaced, there will also be serious signal crosstalk between signal crimping holes in different rows when transmitting high-speed signals. In this embodiment, the first shielding hole and the second shielding hole are provided, and the first shielding hole is set on the side of the signal crimping hole facing the second direction, and the second shielding hole is set on the side of the signal crimping hole facing away from the second direction. side, that is, in the second direction, the first shielding hole is set between the signal crimping hole of this row and the signal crimping hole of the previous row, and the second shielding hole is set between the signal crimping hole of this row and the next row Between the signal crimping holes, the first shielding hole and the second shielding hole can separate the signal crimping holes in different rows, so as to effectively reduce the signal crosstalk between the pairs of signal crimping holes in different rows.

一种实施方式中，所述第一屏蔽孔的数量为多个，且多个所述第一屏蔽孔沿所述第一方向依次排列；多个所述第一屏蔽孔之间间隔设置；或，多个所述第一屏蔽孔相连通，以形成一体式结构。在上述结构下，多个第一屏蔽孔能够覆盖相邻两行信号压接孔之间更大的区域，从而达到更佳的电磁场屏蔽效果，以有效减少不同行间各对信号压接孔之间的信号串扰。In one embodiment, the number of the first shielding holes is multiple, and the multiple first shielding holes are arranged in sequence along the first direction; the multiple first shielding holes are arranged at intervals; or , a plurality of the first shielding holes are connected to form an integrated structure. Under the above structure, a plurality of first shielding holes can cover a larger area between two adjacent rows of signal crimping holes, thereby achieving a better electromagnetic field shielding effect and effectively reducing the distance between each pair of signal crimping holes between different rows. crosstalk between signals.

一种实施方式中，所述第二屏蔽孔的数量为多个，且多个所述第二屏蔽孔沿所述第一方向依次排列；多个所述第二屏蔽孔之间间隔设置；或，多个所述第二屏蔽孔相连通，以形成一体式结构。在上述结构下，多个第二屏蔽孔能够覆盖相邻两行信号压接孔之间更大的区域，从而达到更佳的电磁场屏蔽效果，以有效减少不同行间各对信号压接孔之间的信号串扰。In one embodiment, the number of the second shielding holes is multiple, and the multiple second shielding holes are arranged in sequence along the first direction; the multiple second shielding holes are arranged at intervals; or , a plurality of the second shielding holes are connected to form an integrated structure. Under the above structure, a plurality of second shielding holes can cover a larger area between two adjacent rows of signal crimping holes, so as to achieve a better electromagnetic field shielding effect and effectively reduce the distance between each pair of signal crimping holes between different rows. crosstalk between signals.

一种实施方式中，每个所述接地孔组均包括多个所述接地压接孔，且多个所述接地压接孔沿所述第二方向间隔排布。可以理解的是，当印刷电路板与不同型号的连接器相匹配时，由于不同型号的连接器中接地压接针的数量的不同，相对应的，每个接地孔组可包括多个接地压接孔，且多个接地压接孔沿第二方向间隔排布。需要说明的是，当接地压接孔的数量为多个，且沿第二方向间隔排布时，多个接地压接孔的存在还可有效阻隔电磁场，从而有效减少同一行的相邻两对信号压接孔之间的信号串扰。In one embodiment, each of the ground hole groups includes a plurality of ground crimping holes, and the plurality of ground crimping holes are arranged at intervals along the second direction. It can be understood that when the printed circuit board is matched with different types of connectors, due to the difference in the number of grounding crimping pins in different types of connectors, correspondingly, each grounding hole group can include a plurality of grounding crimping pins. contact holes, and a plurality of ground crimping holes are arranged at intervals along the second direction. It should be noted that when the number of ground crimping holes is multiple and arranged at intervals along the second direction, the existence of multiple ground crimping holes can also effectively block the electromagnetic field, thereby effectively reducing the number of adjacent pairs of the same row. Signal crosstalk between signal crimp holes.

一种实施方式中，相邻的两行压接孔中，沿所述第二方向，位于上一行中的任意一对所述信号压接孔与位于下一行中的任意一对所述信号压接孔错位设置。可以理解的是，当位于不同行的两对信号压接孔正对设置时，两对信号压接孔之间的电磁场更容易产生相互影响，从而造成严重的信号串扰问题。而在本实施例中，通过将位于相邻两行内的信号压接孔进行错位设置，以有效减少不同行间的各对信号压接孔之间的信号串扰，使得高速信号在印刷电路板中进行传输时能够满足相应传输要求。In one embodiment, in two adjacent rows of crimping holes, along the second direction, any pair of signal crimping holes in the upper row and any pair of signal crimping holes in the next row Misaligned socket settings. It can be understood that when two pairs of signal crimping holes located in different rows face each other, the electromagnetic fields between the two pairs of signal crimping holes are more likely to interact with each other, thus causing serious signal crosstalk. In this embodiment, the signal crimping holes located in two adjacent rows are misplaced to effectively reduce the signal crosstalk between pairs of signal crimping holes in different rows, so that the high-speed signal is The transmission can meet the corresponding transmission requirements.

一种实施方式中，每个所述信号压接孔均包围有反焊盘，且所述反焊盘的***轮廓呈圆形。可以理解的是，反焊盘的存在可减小印刷电路板上的介质电容，更有利于信号的完整性与信号的阻抗匹配。然而，位于不同导电层上的信号出线之间的电磁场，可穿过反焊盘并进行相互干扰，从而导致在不同导电层上的信号出线之间产生信号串扰。基于此，在本实施例中，通过将反焊盘的***轮廓设计为圆形，以替代传统的矩形反焊盘，从而有效缩小反焊盘的尺寸，进而减小不同导电层上的信号出线之间的信号串扰，使得高速信号在印刷电路板中进行传输时能够满足相应传输要求。In one implementation manner, each of the signal crimping holes is surrounded by an anti-pad, and the outer contour of the anti-pad is circular. It can be understood that the existence of the anti-pad can reduce the dielectric capacitance on the printed circuit board, which is more conducive to the integrity of the signal and the impedance matching of the signal. However, the electromagnetic field between the signal outlets on different conductive layers can pass through the anti-pad and interfere with each other, resulting in signal crosstalk between the signal outlets on different conductive layers. Based on this, in this embodiment, the outer contour of the anti-pad is designed as a circle to replace the traditional rectangular anti-pad, so as to effectively reduce the size of the anti-pad, thereby reducing the signal outlets on different conductive layers The signal crosstalk between them enables the high-speed signal to meet the corresponding transmission requirements when it is transmitted in the printed circuit board.

一种实施方式中，所述信号压接孔的内侧面设置有第一金属镀层，所述接地压接孔的内侧面设置有第二金属镀层；所述地孔的内侧面设有第一导电镀层，所述屏蔽孔的内侧面设有第二导电镀层，所述第一导电镀层和所述第二导电镀层的材料为导电金属或导电非金属；所述印刷电路板包括交替堆叠设置的导电层和介电层，所述第一金属镀层、所述第二金属镀层、所述第一导电镀层和所述第二导电镀层均与所述导电层电连接；至少一个所述导电层上形成有信号出线，所述接地压接孔、所述地孔和所述屏蔽孔均与所述信号出线相间隔，且所述信号出线与所述信号压接孔内的所述第一金属镀层电连接。需要说明的是，第一金属镀层可以通过电镀、蒸镀、溅射、化学镀或气相沉积的方式形成，并且，第一金属镀层可以为铜、铝、 银等金属材料或者其他合金材料制成，在此不对第一金属镀层的材质以及形成工艺进行具体的限定。还可以理解的是，通过在接地压接孔的内侧面设置第二金属镀层，第二金属镀层与导电层电连接，以将印刷电路板中的各导电层电性连接，当连接器的接地压接针***接地压接孔中后，可以使得接地压接针的侧面可与各导电层同时接触，以提高接地效果，并且，第二金属镀层的存在还可以提高接地压接孔的电磁场屏蔽效果，从而减小信号压接孔之间的信号串扰。需要说明的是，第二金属镀层与第一金属镀层的材质以及形成工艺均可相同，在此不加以赘述。可以理解的是，通过在地孔的内侧面设置第一导电镀层，且在屏蔽孔的内侧面设置第二导电镀层，不仅可以提高对相邻的两对信号压接孔之间的电磁场屏蔽效果，同时可以提高印刷电路板中各导电层的接地效果。需要说明的是，当第一导电镀层和第二导电镀层由导电金属制成时，第一导电镀层、第二导电镀层、第一金属镀层和第二金属镀层的材质以及形成工艺均可相同，在此不加以赘述；当第一导电镀层和第二导电镀层由导电非金属制成时，同样可以起到相同的接地及电磁场屏蔽功能。在一种具体的实施例中，第一导电镀层和第二导电镀层的材质为导电树脂。还可以理解的是，通过在至少一个导电层上形成信号出线，并将信号出线与第一金属镀层电连接，从而有效实现信号传输功能。并且，将接地压接孔与信号出线相间隔，以有效避免二者之间的位置重叠。In one embodiment, the inner surface of the signal crimping hole is provided with a first metal plating layer, the inner surface of the grounding crimping hole is provided with a second metal plating layer; the inner surface of the ground hole is provided with a first conductive Plating, the inner surface of the shielding hole is provided with a second conductive coating, the material of the first conductive coating and the second conductive coating is conductive metal or conductive non-metal; the printed circuit board includes alternately stacked conductive layer and a dielectric layer, the first metal coating, the second metal coating, the first conductive coating and the second conductive coating are all electrically connected to the conductive layer; at least one of the conductive layers is formed There is a signal outlet, the ground crimping hole, the ground hole and the shielding hole are all spaced apart from the signal outlet, and the signal outlet is electrically connected to the first metal plating layer in the signal crimping hole connect. It should be noted that the first metal coating can be formed by electroplating, vapor deposition, sputtering, chemical plating or vapor deposition, and the first metal coating can be made of metal materials such as copper, aluminum, silver or other alloy materials , the material and formation process of the first metal plating layer are not specifically limited here. It can also be understood that, by providing the second metal plating layer on the inner surface of the grounding crimping hole, the second metal plating layer is electrically connected to the conductive layer, so as to electrically connect each conductive layer in the printed circuit board, when the grounding of the connector After the crimping pin is inserted into the grounding crimping hole, the sides of the grounding crimping pin can be in contact with each conductive layer at the same time to improve the grounding effect, and the presence of the second metal plating layer can also improve the electromagnetic field shielding of the grounding crimping hole effect, thereby reducing signal crosstalk between signal crimping holes. It should be noted that, the material and formation process of the second metal coating layer and the first metal coating layer may be the same, which will not be repeated here. It can be understood that by arranging the first conductive plating layer on the inner surface of the ground hole and the second conductive plating layer on the inner surface of the shielding hole, not only the electromagnetic field shielding effect between two adjacent pairs of signal crimping holes can be improved , At the same time, it can improve the grounding effect of each conductive layer in the printed circuit board. It should be noted that when the first conductive coating and the second conductive coating are made of conductive metal, the materials and forming processes of the first conductive coating, the second conductive coating, the first metal coating and the second metal coating can be the same, No need to go into details here; when the first conductive plating layer and the second conductive plating layer are made of conductive non-metal, they can also have the same grounding and electromagnetic field shielding functions. In a specific embodiment, the material of the first conductive plating layer and the second conductive plating layer is conductive resin. It can also be understood that the signal transmission function can be effectively realized by forming the signal outgoing line on at least one conductive layer and electrically connecting the signal outgoing line with the first metal plating layer. In addition, the ground crimping hole is spaced from the signal outlet to effectively avoid overlapping positions between the two.

一种实施方式中，在同一个所述导电层上，连接于同一对信号压接孔的两个所述信号出线关于沿第二方向延伸的对称轴呈轴对称分布；所述第二方向垂直于所述第一方向。可以理解的是，当连接于同一对信号压接孔的两个信号出线之间呈对称分布时，能够达到更优的信号偏斜(skew)补偿效果，以利于高速信号的传输。需要说明的是，在上述结构下，信号出线容易与部分屏蔽孔的位置重叠，因此，可省略部分屏蔽孔，以达到信号偏斜补偿效果。In one embodiment, on the same conductive layer, the two signal outlets connected to the same pair of signal crimping holes are distributed axisymmetrically with respect to the axis of symmetry extending along the second direction; the second direction is perpendicular to in the first direction. It can be understood that when the two signal outlets connected to the same pair of signal crimping holes are distributed symmetrically, a better signal skew compensation effect can be achieved to facilitate high-speed signal transmission. It should be noted that, under the above-mentioned structure, the position of the signal outgoing line is likely to overlap with part of the shielding hole, therefore, part of the shielding hole can be omitted to achieve the effect of signal skew compensation.

一种实施方式中，所述信号压接孔、所述接地压接孔、所述地孔和所述屏蔽孔为通孔、盲孔或背钻孔中的任意一种。需要说明的是，信号压接孔可以沿印刷电路板的厚度方向贯穿印刷电路板，即信号压接孔为通孔，信号压接孔的深度与印刷电路板的厚度相同；但并不限于此，信号压接孔也可以沿印刷电路板的厚度方向不贯穿印刷电路板，即信号压接孔为盲孔，信号压接孔的深度小于印刷电路板的厚度；信号压接孔还可以是通过背钻工艺形成的背钻孔。可以理解的是，信号压接孔的结构由实际使用要求来决定，在此不对信号压接孔的结构进行具体的限定。还需要说明的是，接地压接孔、地孔和屏蔽孔同样可以为通孔、盲孔或背钻孔中的任意一种，在此不对接地压接孔、地孔和屏蔽孔的结构进行具体的限定，只需保证接地压接孔、地孔和屏蔽孔的深度大于或等于信号压接孔的深度即可。In one embodiment, the signal crimping hole, the grounding crimping hole, the ground hole and the shielding hole are any one of through holes, blind holes or back-drilled holes. It should be noted that the signal crimping hole can penetrate the printed circuit board along the thickness direction of the printed circuit board, that is, the signal crimping hole is a through hole, and the depth of the signal crimping hole is the same as the thickness of the printed circuit board; but it is not limited to this , the signal crimping hole can also not penetrate the printed circuit board along the thickness direction of the printed circuit board, that is, the signal crimping hole is a blind hole, and the depth of the signal crimping hole is smaller than the thickness of the printed circuit board; the signal crimping hole can also be through Back-drilled holes formed by the back-drilling process. It can be understood that the structure of the signal crimping hole is determined by actual use requirements, and the structure of the signal crimping hole is not specifically limited here. It should also be noted that the ground crimping holes, ground holes and shielding holes can also be any of through holes, blind holes or back-drilled holes, and the structures of the ground crimping holes, ground holes and shielding holes are not discussed here. For specific limitations, it is only necessary to ensure that the depths of the ground crimping hole, ground hole and shielding hole are greater than or equal to the depth of the signal crimping hole.

第二方面，本申请提供一种电子设备，该电子设备包括第一方面任一实施方式所述的印刷电路板，以及与所述印刷电路板相配合的连接器，所述连接器的信号压接针插设于所述信号压接孔内，所述连接器的接地压接针插设于所述接地压接孔内。本申请提供的电子设备，通过安装本申请提供的印刷电路板，以有效解决信号串扰的问题，使得高速信号在该电子设备中进行传输时能够满足相应传输要求。In a second aspect, the present application provides an electronic device, which includes the printed circuit board described in any one of the implementation manners of the first aspect, and a connector matched with the printed circuit board, the signal voltage of the connector The contact pin is inserted in the signal crimping hole, and the grounding crimping pin of the connector is inserted in the grounding crimping hole. The electronic equipment provided by this application can effectively solve the problem of signal crosstalk by installing the printed circuit board provided by this application, so that high-speed signals can meet the corresponding transmission requirements when transmitting in the electronic equipment.

附图说明Description of drawings

图1是相关设计中多个印刷电路板互连的示意图；Figure 1 is a schematic diagram of the interconnection of multiple printed circuit boards in a related design;

图2是本申请实施例提供的印刷电路板的立体图；Fig. 2 is a perspective view of a printed circuit board provided by an embodiment of the present application;

图3是一种实施例的印刷电路板中连接器插接区的结构示意图；Fig. 3 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment;

图4是根据图3所示连接器插接区进行仿真获得的近端串扰和远端串扰的示意图；Fig. 4 is a schematic diagram of near-end crosstalk and far-end crosstalk obtained by simulating the connector insertion area shown in Fig. 3;

图5是一种实施例的印刷电路板中连接器插接区的结构示意图；Fig. 5 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment;

图6是一种实施例的印刷电路板中连接器插接区的部分结构示意图；Fig. 6 is a partial structural schematic diagram of the connector insertion area in the printed circuit board of an embodiment;

图7是一种实施例的印刷电路板中连接器插接区的结构示意图；Fig. 7 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment;

图8是一种实施例的印刷电路板中连接器插接区的结构示意图；Fig. 8 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment;

图9是一种实施例的印刷电路板中连接器插接区的结构示意图；Fig. 9 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment;

图10是一种实施例的印刷电路板中连接器插接区的结构示意图；Fig. 10 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment;

图11是一种实施例的印刷电路板中连接器插接区的部分结构示意图；Fig. 11 is a partial structural schematic diagram of the connector insertion area in the printed circuit board of an embodiment;

图12是一种实施例的印刷电路板中连接器插接区的部分结构示意图。Fig. 12 is a partial structural schematic diagram of the connector insertion area in the printed circuit board of an embodiment.

具体实施方式detailed description

下面结合本申请实施例中的附图对本申请实施例进行描述。Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

首先请参阅图1，印刷电路板100(Printed Circuit Board，PCB)是电子设备中重要的电子部件，是电子元器件的电气连接的载体，例如，在电子通信设备中，通常需要设置多个互连的印刷电路板。在一种常见的多个印刷电路板互连方式中，如图1所示，将其中一个印刷电路板作为背板110，其余印刷电路板作为子板120，背板110和子板120之间通过连接器200连接。背板110和子板120均设有与连接器200连接的信号压接孔和接地压接孔，连接器200中信号压接针插装在在信号压接孔内，接地压接针插装在接地压接孔内，通过连接器200可将背板110和子板120互连，以实现信号传输功能。Please refer to Fig. 1 first, the printed circuit board 100 (Printed Circuit Board, PCB) is an important electronic component in electronic equipment, and is the carrier of the electrical connection of electronic components and parts, for example, in electronic communication equipment, usually need to set up a plurality of interconnection connected printed circuit board. In a common way of interconnecting multiple printed circuit boards, as shown in FIG. Connector 200 is connected. Both the backplane 110 and the sub-board 120 are provided with a signal crimping hole and a grounding crimping hole connected to the connector 200, the signal crimping pin of the connector 200 is inserted in the signal crimping hole, and the grounding crimping pin is inserted in the In the ground crimping hole, the backplane 110 and the sub-board 120 can be interconnected through the connector 200 to realize the signal transmission function.

请一并参阅图2和图3，本申请实施例提供一种印刷电路板100，该印刷电路板100可以为双面板，也可以为多层板。例如，如图2所示，印刷电路板100为多层板，其包括多层导电层11和多层介电层12，多层导电层11和多层介电层12交替堆叠设置，在此不对印刷电路板100的层数进行具体的限定。其中，导电层11一般由铜箔制成，用于构成印刷电路板100中的信号出线；介电层12一般由树脂或玻璃纤维等制成，用于电性隔离相邻的两层导电层11。Please refer to FIG. 2 and FIG. 3 together. The embodiment of the present application provides a printed circuit board 100 . The printed circuit board 100 may be a double-sided board or a multi-layer board. For example, as shown in FIG. 2 , the printed circuit board 100 is a multilayer board, which includes a multilayer conductive layer 11 and a multilayer dielectric layer 12, and the multilayer conductive layer 11 and the multilayer dielectric layer 12 are alternately stacked. The number of layers of the printed circuit board 100 is not specifically limited. Among them, the conductive layer 11 is generally made of copper foil, which is used to form the signal outlet in the printed circuit board 100; the dielectric layer 12 is generally made of resin or glass fiber, etc., and is used to electrically isolate two adjacent conductive layers. 11.

可以理解的是，为了实现印刷电路板100之间的互连，印刷电路板100上通常设置有连接器插接区101，以用于与连接器200相配合，连接器插接区101在印刷电路板100中的位置不限，示例性的，连接器插接区101可以位于印刷电路板100的四角区域，也可以位于中部区域。It can be understood that, in order to realize the interconnection between the printed circuit boards 100, the printed circuit board 100 is usually provided with a connector inserting area 101 for matching with the connector 200, and the connector inserting area 101 is on the printed circuit board 100. The location of the circuit board 100 is not limited, for example, the connector inserting area 101 may be located in the four corners of the printed circuit board 100 , or may be located in the middle area.

如图3所示，连接器插接区101内设置有多行压接孔，每行压接孔包括间隔设置的至少两对信号压接孔10，每对信号压接孔10包括两个信号压接孔10，信号压接孔10用于与连接器200的信号压接针相配合，以实现相应信号的传输功能。在一种具体的实施例中，连接器插接区101内设置有三行压接孔，每行压接孔包括两对信号压接孔10。需要说明的是，连接器插接区101内的压接孔的行数，以及每行压接孔内信号压接孔10的数量均可根据相应使用要求来进行设置，在此不进行具体的限定。As shown in Figure 3, there are multiple rows of crimping holes in the connector insertion area 101, each row of crimping holes includes at least two pairs of signal crimping holes 10 arranged at intervals, and each pair of signal crimping holes 10 includes two signal crimping holes. The crimping hole 10, the signal crimping hole 10 is used to cooperate with the signal crimping pin of the connector 200, so as to realize the corresponding signal transmission function. In a specific embodiment, three rows of crimping holes are arranged in the connector insertion area 101 , and each row of crimping holes includes two pairs of signal crimping holes 10 . It should be noted that the number of rows of crimping holes in the connector insertion area 101 and the number of signal crimping holes 10 in each row of crimping holes can be set according to the corresponding use requirements, and no specific details are given here. limited.

压接孔的行排列方向为第一方向901，在沿第一方向901上，每对信号压接孔10的两侧各设置有一个接地孔组20，接地孔组20包括接地压接孔21和位于接地压接孔21至少一侧的地孔22。其中，接地压接孔21用于与连接器200的接地压接针相配合，接地压接孔21的形状与连接器200中的接地压接针的形状相同或相似，以使连接器200中的接地压接针可插装于接地压接孔21。示例性的，接地压接针的形状一般为圆形、椭圆形或扁圆形，相应的，接地压接孔21可以为圆孔、椭圆孔或扁圆孔，在本实施例中，接地压接孔21为圆孔，采用圆形的接地压接孔21设计，制作简单，成本低，且对接地压接针的限位精度高。The row arrangement direction of the crimping holes is the first direction 901, along the first direction 901, each pair of signal crimping holes 10 is provided with a grounding hole group 20 on both sides, and the grounding hole group 20 includes grounding crimping holes 21 and a ground hole 22 located on at least one side of the ground crimping hole 21 . Wherein, the grounding crimping hole 21 is used to cooperate with the grounding crimping pin of the connector 200, and the shape of the grounding crimping hole 21 is the same as or similar to the shape of the grounding crimping pin in the connector 200, so that the connector 200 The grounding crimping pin can be inserted into the grounding crimping hole 21 . Exemplarily, the shape of the grounding crimping pin is generally circular, elliptical or oblate. Correspondingly, the grounding crimping hole 21 can be a round hole, an oval hole or an oblate hole. The connecting hole 21 is a round hole, which is designed as a circular grounding crimping hole 21 , which is simple to manufacture, low in cost, and has high positioning precision for the grounding crimping pin.

地孔22设于接地压接孔21的至少一侧，且地孔22和接地压接孔21均连接于印刷电路板100的导电层11，以实现接地，在同一行压接孔中，通过在每相邻的两对信号压接孔10之间均设置接地压接孔21和地孔22，能够将相邻的两对信号压接孔10隔开，从而对相邻的两对信号压接孔10之间的电磁场进行屏蔽，以有效降低同一行的两对信号压接孔10之间的信号串扰。The ground hole 22 is arranged on at least one side of the ground crimping hole 21, and both the ground hole 22 and the grounding crimping hole 21 are connected to the conductive layer 11 of the printed circuit board 100 to realize grounding. In the same row of crimping holes, through A grounding crimping hole 21 and a ground hole 22 are provided between every two adjacent pairs of signal crimping holes 10, which can separate two adjacent pairs of signal crimping holes 10, so that two adjacent pairs of signal crimping holes 10 can be separated. The electromagnetic field between the contact holes 10 is shielded to effectively reduce signal crosstalk between two pairs of signal crimping holes 10 in the same row.

每对信号压接孔10中的两个信号压接孔10之间还设有至少一个屏蔽孔30。屏蔽孔30同样连接于导电层11，以实现接地。在本申请实施例提供的印刷电路板100中，通过设置屏蔽孔30，使得接地压接孔21、地孔22和屏蔽孔30能够共同包围信号压接孔10。可以理解的是，接地压接孔21、地孔22和屏蔽孔30围合形成一个屏蔽区域102，一对信号压接孔10的电磁场被限制在上述屏蔽区域102内，从而不仅减少了同一行内各对信号压接孔10之间的信号串扰，还减少了不同行间各对信号压接孔10之间的信号串扰，使得高速信号在本申请实施例提供的印刷电路板100中进行传输时，能够满足相应传输要求。At least one shielding hole 30 is further provided between two signal crimping holes 10 in each pair of signal crimping holes 10 . The shielding hole 30 is also connected to the conductive layer 11 for grounding. In the printed circuit board 100 provided in the embodiment of the present application, by setting the shielding hole 30 , the ground crimping hole 21 , the ground hole 22 and the shielding hole 30 can jointly surround the signal crimping hole 10 . It can be understood that the ground crimping hole 21, the ground hole 22 and the shielding hole 30 enclose a shielding area 102, and the electromagnetic field of a pair of signal crimping holes 10 is limited in the above-mentioned shielding area 102, thereby not only reducing the The signal crosstalk between each pair of signal crimping holes 10 also reduces the signal crosstalk between each pair of signal crimping holes 10 in different rows, so that when high-speed signals are transmitted in the printed circuit board 100 provided by the embodiment of the present application , which can meet the corresponding transmission requirements.

本申请实施例提供的印刷电路板100，通过在每对信号压接孔10的两侧各设置一个接地孔组20，接地孔组20包括接地压接孔21和位于接地压接孔21至少一侧的地孔22，并在每对信号压接孔10中的两个信号压接孔10之间还设有至少一个屏蔽孔30，接地压接孔21、地孔22和屏蔽孔30均接地，且共同包围信号压接孔10，从而将一对信号压接孔10的电磁场限制在一定范围内，减少了同一行内各对信号压接孔10之间的信号串扰以及不同行间各对信号压接孔10之间的信号串扰，使得高速信号在该印刷电路板100中进行传输时能够满足相应传输要求。In the printed circuit board 100 provided in the embodiment of the present application, a grounding hole group 20 is provided on both sides of each pair of signal crimping holes 10, and the grounding hole group 20 includes a grounding crimping hole 21 and at least one ground hole 21 located in the grounding crimping hole 21. The ground hole 22 on the side, and at least one shielding hole 30 is provided between the two signal crimping holes 10 in each pair of signal crimping holes 10, and the grounding crimping hole 21, the ground hole 22 and the shielding hole 30 are all grounded , and together surround the signal crimping holes 10, thereby limiting the electromagnetic field of a pair of signal crimping holes 10 within a certain range, reducing the signal crosstalk between each pair of signal crimping holes 10 in the same row and the signal crosstalk between each pair of signal crimping holes 10 in different rows. Signal crosstalk between the crimping holes 10 enables high-speed signals to meet corresponding transmission requirements when being transmitted in the printed circuit board 100 .

需要说明的是，在本申请实施例提供的印刷电路板100中，信号压接孔10可以沿印刷电路板100的厚度方向贯穿印刷电路板100，即信号压接孔10为通孔，信号压接孔10的深度与印刷电路板100的厚度相同；但并不限于此，信号压接孔10也可以沿印刷电路板100的厚度方向不贯穿印刷电路板100，即信号压接孔10为盲孔，信号压接孔10的深度小于印刷电路板100的厚度；信号压接孔10还可以是通过背钻工艺形成的背钻孔。可以理解的是，信号压接孔10的结构由实际使用要求来决定，在此不对信号压接孔10的结构进行具体的限定。It should be noted that, in the printed circuit board 100 provided in the embodiment of the present application, the signal crimping hole 10 can penetrate the printed circuit board 100 along the thickness direction of the printed circuit board 100, that is, the signal crimping hole 10 is a through hole, and the signal crimping hole 10 is a through hole. The depth of the connection hole 10 is the same as the thickness of the printed circuit board 100; but it is not limited thereto, the signal crimping hole 10 may not penetrate the printed circuit board 100 along the thickness direction of the printed circuit board 100, that is, the signal crimping hole 10 is blind The depth of the signal crimping hole 10 is smaller than the thickness of the printed circuit board 100; the signal crimping hole 10 may also be a back-drilling hole formed by a back-drilling process. It can be understood that the structure of the signal crimping hole 10 is determined by actual use requirements, and the structure of the signal crimping hole 10 is not specifically limited here.

一种可能的实施例中，印刷电路板100包括第一表面103，在垂直于第一表面103的方向上，地孔22、屏蔽孔30和接地压接孔21构成包围孔组80，包围孔组80在垂直于第一表面103的方向上的延伸的尺寸大于或等于信号压接孔10的在垂直于第一表面103的方向上的延伸的尺寸。其中，地孔22、屏蔽孔30、接地压接孔21和信号压接孔10均贯穿于第一表面103。可以理解的是，接地压接孔21、地孔22和屏蔽孔30同样可以为通孔、盲孔或背钻孔中的任意一种，在此不对接地压接孔21、地孔22和屏蔽孔30的结构进行具体的限定，只需保证接地压接孔21、地孔22和屏蔽孔30的深度大于或等于信号压接孔10的深度即可。可以理解的是，在上述结构下，接地压接孔21、地孔22和屏蔽孔30构成的包围孔组80可在印刷电路板100的厚度方向对相邻的各对信号压接孔10之间的电磁场进行屏蔽，以降低各对信号压接孔10之间的信号串扰。In a possible embodiment, the printed circuit board 100 includes a first surface 103, and in a direction perpendicular to the first surface 103, the ground hole 22, the shielding hole 30 and the ground crimping hole 21 form a surrounding hole group 80, and the surrounding holes The dimension extending in the direction perpendicular to the first surface 103 of the group 80 is greater than or equal to the dimension extending in the direction perpendicular to the first surface 103 of the signal crimping holes 10 . Wherein, the ground hole 22 , the shielding hole 30 , the ground crimping hole 21 and the signal crimping hole 10 all penetrate the first surface 103 . It can be understood that the ground crimping hole 21, the ground hole 22 and the shielding hole 30 can also be any one of through holes, blind holes or back-drilled holes, and the ground crimping hole 21, the ground hole 22 and the shielding The structure of the hole 30 is specifically defined, and it is only necessary to ensure that the depths of the ground crimping hole 21 , the ground hole 22 and the shielding hole 30 are greater than or equal to the depth of the signal crimping hole 10 . It can be understood that, under the above structure, the surrounding hole group 80 formed by the ground crimping hole 21 , the ground hole 22 and the shielding hole 30 can be arranged between adjacent pairs of signal crimping holes 10 in the thickness direction of the printed circuit board 100 . The electromagnetic field between them is shielded to reduce the signal crosstalk between each pair of signal crimping holes 10 .

一种可能的实施例中，相邻的两行压接孔中，沿第二方向902，位于上一行中的任意一对信号压接孔10与位于下一行中的任意一对信号压接孔10错位设置，其中，第二方向902在第一表面103上且垂直于第一方向901。可以理解的是，当位于不同行的两对信号压接孔10正对设置时，两对信号压接孔10之间的电磁场更容易产生相互影响，从而造成严重的信号串扰问题。而在本实施例中，通过将位于相邻两行内的信号压接孔10进行错位设置，以有效减少不同行间的各对信号压接孔10之间的信号串扰，使得高速信号在印刷电路板100中进 行传输时能够满足相应传输要求。In a possible embodiment, in two adjacent rows of crimping holes, along the second direction 902, any pair of signal crimping holes 10 in the upper row and any pair of signal crimping holes in the next row 10 dislocation arrangement, wherein the second direction 902 is on the first surface 103 and is perpendicular to the first direction 901 . It can be understood that, when two pairs of signal crimping holes 10 in different rows are arranged facing each other, the electromagnetic fields between the two pairs of signal crimping holes 10 are more likely to interact with each other, thus causing serious signal crosstalk. In this embodiment, the signal crimping holes 10 located in two adjacent rows are misplaced to effectively reduce the signal crosstalk between each pair of signal crimping holes 10 in different rows, so that the high-speed signal can be transmitted through the printed circuit. The transmission in the board 100 can meet the corresponding transmission requirements.

一种可能的实施例中，每个接地孔组20均包括多个地孔22，且多个地孔22在第二方向902上的最大连线长度，大于或等于信号压接孔10在第二方向902上的长度。可以理解的是，当地孔22的数量为多个时，多个地孔22可覆盖更大的区域，从而能够对信号压接孔10的电磁场进行更加全面的屏蔽。并且，当多个地孔22在第二方向902上的最大连线长度，大于或等于信号压接孔10在第二方向902上的长度时，多个地孔22和接地压接孔21组成的接地孔组20能够有效分隔同一行内的相邻两对信号压接孔10，以阻隔相邻两对信号压接孔10之间的电磁场，从而减少了同一行内各对信号压接孔10之间的信号串扰。需要说明的是，最大连线长度指的是孔与孔之间的连线长度的最大值。In a possible embodiment, each ground hole group 20 includes a plurality of ground holes 22, and the maximum connection length of the plurality of ground holes 22 in the second direction 902 is greater than or equal to the signal crimping hole 10 in the second direction. The length in two directions 902 . It can be understood that when there are multiple ground holes 22 , the multiple ground holes 22 can cover a larger area, so that the electromagnetic field of the signal crimping hole 10 can be shielded more comprehensively. Moreover, when the maximum connection length of the plurality of ground holes 22 in the second direction 902 is greater than or equal to the length of the signal crimping hole 10 in the second direction 902, the plurality of ground holes 22 and the ground crimping hole 21 form a The ground hole group 20 can effectively separate two adjacent pairs of signal crimping holes 10 in the same row, so as to block the electromagnetic field between two adjacent pairs of signal crimping holes 10, thereby reducing the distance between each pair of signal crimping holes 10 in the same row. crosstalk between signals. It should be noted that the maximum connection length refers to the maximum value of the connection length between holes.

一种可能的实施例中，每个接地孔组20均包括两对地孔22，且沿第一方向901，两对地孔22分别位于接地压接孔21的两侧，每对地孔22均包括两个沿第二方向902间隔排布的地孔22。可以理解的是，通常情况下，同一行的相邻两对信号压接孔10之间的间隔空间较小，因此，二者之间不具备足够的空间来设置数量较多的地孔22。在本实施例中，仅通过设置两对地孔22包围接地压接孔21以形成接地孔组20，使得相邻两对信号压接孔10之间的间隔空间能够有效容纳上述接地孔组20，并且，一个接地压接孔21与两对地孔22相组合即可起到足够的电磁场屏蔽效果，以有效减少同一行的相邻两对信号压接孔10之间的信号串扰。需要说明的是，在接地压接孔21沿第一方向901的一侧的一对地孔22中，两个地孔22之间的最大连线长度应大于或等于信号压接孔10在第二方向902上的长度，从而有效分隔两对信号压接孔10，以达到较佳的电磁场屏蔽效果。In a possible embodiment, each ground hole group 20 includes two pairs of ground holes 22, and along the first direction 901, the two pairs of ground holes 22 are respectively located on both sides of the ground crimping hole 21, and each pair of ground holes 22 Each includes two ground holes 22 arranged at intervals along the second direction 902 . It can be understood that, generally, the space between two adjacent pairs of signal crimping holes 10 in the same row is relatively small, therefore, there is not enough space between them to arrange a large number of ground holes 22 . In this embodiment, the ground hole group 20 is only formed by setting two pairs of ground holes 22 surrounding the ground crimping hole 21, so that the space between two adjacent pairs of signal crimping holes 10 can effectively accommodate the ground hole group 20 , and the combination of one ground crimping hole 21 and two pairs of ground holes 22 can achieve sufficient electromagnetic field shielding effect, so as to effectively reduce the signal crosstalk between two adjacent pairs of signal crimping holes 10 in the same row. It should be noted that, in a pair of ground holes 22 on one side of the ground crimping hole 21 along the first direction 901, the maximum connection length between the two ground holes 22 should be greater than or equal to the signal crimping hole 10 The lengths in the two directions 902 effectively separate the two pairs of signal crimping holes 10 to achieve a better electromagnetic field shielding effect.

请参阅图4，可以理解的是，相邻的两对信号压接孔10之间的信号串扰一般包括近端串扰(Near End Crosstalk，简称为NEXT)和远端串扰(Far End Crosstalk，简称为FEXT)，其中，近端串扰是指当一对信号压接孔10发射信号后，在另一对信号压接孔10的信号输入端(近端)接收到此信号，此时称为近端串扰。远端串扰是指当一对信号压接孔10发射信号后，在另一对信号压接孔10的信号输出端(远端)接收到此信号，此时称为远端串扰。下面将通过仿真分析，获得采用上述实施例可以降低信号串扰的效果。通过对图3所示结构进行信号串扰仿真分析，可分别获得近端串扰和远端串扰的仿真曲线，如图4所示。由图4可知，本申请实施例提供的印刷电路板100中，28G隔离度达到47.5dB@Next，44.2dB@Fext；42Ghz隔离度达到37.8dB@Next，40.5dB@Fext。与传统的印刷电路板相对比，对比结果具体见表1。Referring to FIG. 4, it can be understood that the signal crosstalk between two adjacent pairs of signal crimping holes 10 generally includes near-end crosstalk (Near End Crosstalk, referred to as NEXT) and far-end crosstalk (Far End Crosstalk, referred to as FEXT), wherein, near-end crosstalk means that after a pair of signal crimping holes 10 transmit a signal, the signal is received at the signal input end (near end) of another pair of signal crimping holes 10, which is called near-end crosstalk. Far-end crosstalk means that after a pair of signal crimping holes 10 transmit a signal, the signal is received at the signal output end (far end) of another pair of signal crimping holes 10 , which is called far-end crosstalk. Next, through simulation analysis, the effect of reducing signal crosstalk by adopting the above-mentioned embodiments will be obtained. By performing signal crosstalk simulation analysis on the structure shown in Figure 3, the simulation curves of near-end crosstalk and far-end crosstalk can be obtained, as shown in Figure 4. It can be seen from FIG. 4 that in the printed circuit board 100 provided by the embodiment of the present application, the 28G isolation reaches 47.5dB@Next, 44.2dB@Fext; the 42Ghz isolation reaches 37.8dB@Next, 40.5dB@Fext. Compared with the traditional printed circuit board, the comparison results are shown in Table 1.

表1 本实施例提供的印刷电路板与传统印刷电路板的仿真结果对比Table 1 Comparison of simulation results between the printed circuit board provided in this embodiment and the traditional printed circuit board

由表1可知，本实施例提供的印刷电路板100，相较于传统的印刷电路板，可有效减少信号的近端串扰和远端串扰，使得高速信号在本申请实施例提供的印刷电路板100中进行传输时，能够满足相应传输要求。It can be seen from Table 1 that the printed circuit board 100 provided by this embodiment can effectively reduce the near-end crosstalk and far-end crosstalk of the signal compared with the traditional printed circuit board, so that the high-speed signal can be used in the printed circuit board provided by the embodiment of the application When transmitting in 100, the corresponding transmission requirements can be met.

请参阅图5，一种可能的实施例中，接地压接孔21与地孔22相连通，以形成一体式结 构。可以理解的是，根据不同的使用要求，可将接地压接孔21与地孔22之间部分重叠，以形成一体式的梅花孔结构，在上述结构下，接地压接孔21和地孔22所占用的空间更小，且能够起到足够的电磁场屏蔽效果，以有效减少同一行的相邻两对信号压接孔10之间的信号串扰。Please refer to FIG. 5 , in a possible embodiment, the ground crimping hole 21 communicates with the ground hole 22 to form an integrated structure. It can be understood that, according to different application requirements, the ground crimping hole 21 and the ground hole 22 can be partially overlapped to form an integrated plum blossom hole structure. Under the above structure, the ground crimping hole 21 and the ground hole 22 The occupied space is smaller, and sufficient electromagnetic field shielding effect can be achieved to effectively reduce the signal crosstalk between two adjacent pairs of signal crimping holes 10 in the same row.

请参阅图6，一种可能的实施例中，每个接地孔组20均包括多个接地压接孔21，且多个接地压接孔21沿第二方向902间隔排布。可以理解的是，当印刷电路板100与不同型号的连接器200相匹配时，由于不同型号的连接器200中接地压接针的数量的不同，相对应的，每个接地孔组20可包括多个接地压接孔21，且多个接地压接孔21沿第二方向902间隔排布。需要说明的是，当接地压接孔21的数量为多个，且沿第二方向902间隔排布时，多个接地压接孔21的存在还可有效阻隔电磁场，从而有效减少同一行的相邻两对信号压接孔10之间的信号串扰。如图5，在一种具体的实施例中，每个接地孔组20包括两个接地压接孔21，且两个接地压接孔21沿第二方向902间隔排布。Referring to FIG. 6 , in a possible embodiment, each ground hole group 20 includes a plurality of ground crimping holes 21 , and the plurality of ground crimping holes 21 are arranged at intervals along the second direction 902 . It can be understood that when the printed circuit board 100 is matched with different types of connectors 200, due to the difference in the number of ground crimping pins in different types of connectors 200, correspondingly, each ground hole group 20 may include A plurality of ground crimping holes 21 , and the plurality of ground crimping holes 21 are arranged at intervals along the second direction 902 . It should be noted that when there are multiple ground crimping holes 21 and they are arranged at intervals along the second direction 902, the existence of multiple ground crimping holes 21 can also effectively block the electromagnetic field, thereby effectively reducing the phase difference in the same row. Signal crosstalk between two adjacent pairs of signal crimping holes 10 . As shown in FIG. 5 , in a specific embodiment, each ground hole group 20 includes two ground crimping holes 21 , and the two ground crimping holes 21 are arranged at intervals along the second direction 902 .

请再次参阅图3，一种可能的实施例中，每对信号压接孔10中的两个信号压接孔10之间设有多个屏蔽孔30，多个屏蔽孔30至少包括相间隔的第一屏蔽孔31和第二屏蔽孔32，第一屏蔽孔31设于信号压接孔10朝向第二方向902的一侧，第二屏蔽孔32设于信号压接孔10背离第二方向902的一侧。需要说明的是，即使将位于相邻两行内的信号压接孔10进行错位设置，在传输高速信号时，不同行的信号压接孔10之间同样会存在较为严重的信号串扰的问题。本实施例通过设置第一屏蔽孔31和第二屏蔽孔32，且第一屏蔽孔31设于信号压接孔10朝向第二方向902的一侧，第二屏蔽孔32设于信号压接孔10背离第二方向902的一侧，即，在第二方向902上，第一屏蔽孔31设于本行的信号压接孔10与上一行的信号压接孔10之间，第二屏蔽孔32设于本行的信号压接孔10与下一行的信号压接孔10之间，从而第一屏蔽孔31和第二屏蔽孔32可将不同行间的信号压接孔10进行分隔，以有效减少不同行间的各对信号压接孔10之间的信号串扰。Please refer to FIG. 3 again. In a possible embodiment, a plurality of shielding holes 30 are arranged between two signal crimping holes 10 in each pair of signal crimping holes 10, and the plurality of shielding holes 30 include at least spaced The first shielding hole 31 and the second shielding hole 32, the first shielding hole 31 is arranged on the side of the signal crimping hole 10 facing the second direction 902, and the second shielding hole 32 is arranged on the side of the signal crimping hole 10 facing away from the second direction 902 side. It should be noted that, even if the signal crimping holes 10 located in two adjacent rows are misaligned, there will also be serious signal crosstalk between the signal crimping holes 10 in different rows when transmitting high-speed signals. In this embodiment, the first shielding hole 31 and the second shielding hole 32 are provided, and the first shielding hole 31 is set on the side of the signal crimping hole 10 facing the second direction 902, and the second shielding hole 32 is set on the signal crimping hole 10 away from the side of the second direction 902, that is, in the second direction 902, the first shielding hole 31 is arranged between the signal crimping hole 10 of this row and the signal crimping hole 10 of the previous row, and the second shielding hole 32 is set between the signal crimping hole 10 of the row and the signal crimping hole 10 of the next row, so that the first shielding hole 31 and the second shielding hole 32 can separate the signal crimping holes 10 between different rows, so as to Signal crosstalk between pairs of signal crimping holes 10 between different rows is effectively reduced.

可以理解的是，在本实施例中，第一屏蔽孔31、第二屏蔽孔32、地孔22和接地压接孔21共同包围一对信号压接孔10，信号压接孔10的电磁场被屏蔽在包围空间内，从而不仅减少了同一行内各对信号压接孔10之间的信号串扰，还减少了不同行间各对信号压接孔10之间的信号串扰，使得高速信号在本申请实施例提供的印刷电路板100中进行传输时，能够满足相应传输要求。It can be understood that, in this embodiment, the first shielding hole 31, the second shielding hole 32, the ground hole 22 and the grounding crimping hole 21 together surround a pair of signal crimping holes 10, and the electromagnetic field of the signal crimping holes 10 is Shielding in the surrounding space not only reduces the signal crosstalk between each pair of signal crimping holes 10 in the same row, but also reduces the signal crosstalk between each pair of signal crimping holes 10 in different rows, so that high-speed signals can be used in this application When transmission is performed in the printed circuit board 100 provided by the embodiment, corresponding transmission requirements can be met.

请参阅图7，一种可能的实施例中，第一屏蔽孔31的数量为多个，多个第一屏蔽孔31沿第一方向901依次排列，且多个第一屏蔽孔31之间间隔设置。在上述结构下，多个第一屏蔽孔31能够覆盖相邻两行信号压接孔10之间更大的区域，从而达到更佳的电磁场屏蔽效果，以有效减少不同行间各对信号压接孔10之间的信号串扰。如图6，在一种具体的实施例中，第一屏蔽孔31的数量为两个，两个第一屏蔽孔31沿第一方向901间隔设置。Please refer to FIG. 7 , in a possible embodiment, the number of first shielding holes 31 is multiple, and the plurality of first shielding holes 31 are arranged in sequence along the first direction 901, and the intervals between the plurality of first shielding holes 31 are set up. Under the above structure, a plurality of first shielding holes 31 can cover a larger area between two adjacent rows of signal crimping holes 10, so as to achieve a better electromagnetic field shielding effect and effectively reduce the number of pairs of signal crimping between different rows. Signal crosstalk between holes 10. As shown in FIG. 6 , in a specific embodiment, the number of the first shielding holes 31 is two, and the two first shielding holes 31 are arranged at intervals along the first direction 901 .

请参阅图8，一种可能的实施例中，第一屏蔽孔31的数量为多个，多个第一屏蔽孔31沿第一方向901依次排列，且多个第一屏蔽孔31相连通，以形成一体式结构。需要说明的是，通常情况下，一对信号压接孔10中的两个信号压接孔10之间的间隔距离较小，可能不足以容纳间隔设置的多个第一屏蔽孔31。因此，在本实施例中，通过将沿第一方向901排布的多个第一屏蔽孔31进行部分重叠，以形成一体式结构，该一体式结构可视为一个沿第一方向901的开口尺寸较大的孔状结构，从而将不同行间的信号压接孔10进行有效分隔，以有效减少不同行间的各对信号压接孔10之间的信号串扰。Please refer to FIG. 8 , in a possible embodiment, there are multiple first shielding holes 31 , the multiple first shielding holes 31 are arranged in sequence along the first direction 901 , and the multiple first shielding holes 31 are connected, to form a one-piece structure. It should be noted that, generally, the distance between two signal crimping holes 10 in a pair of signal crimping holes 10 is relatively small, which may not be enough to accommodate a plurality of first shielding holes 31 arranged at intervals. Therefore, in this embodiment, a plurality of first shielding holes 31 arranged along the first direction 901 are partially overlapped to form an integrated structure, which can be regarded as an opening along the first direction 901 The hole-like structure with a larger size effectively separates the signal crimping holes 10 between different rows, so as to effectively reduce the signal crosstalk between each pair of signal crimping holes 10 between different rows.

请一并参阅图9和图10，同样的，第二屏蔽孔32的数量也可以为多个，多个第二屏蔽 孔32沿第一方向901依次排列，如图8，在一种可能的实施例中，多个第二屏蔽孔32之间间隔设置；如图9，在另一种可能的实施例中，多个第二屏蔽孔32相连通，以形成一体式结构。在此不对加以赘述。Please refer to FIG. 9 and FIG. 10 together. Similarly, the number of second shielding holes 32 can also be multiple, and multiple second shielding holes 32 are arranged in sequence along the first direction 901, as shown in FIG. 8 , in a possible In the embodiment, the plurality of second shielding holes 32 are arranged at intervals; as shown in FIG. 9 , in another possible embodiment, the plurality of second shielding holes 32 are connected to form an integrated structure. I won't go into details here.

请参阅图11，一种可能的实施例中，信号压接孔10的内侧面设置有第一金属镀层41，接地压接孔21的内侧面设置有第二金属镀层42。可以理解的是，通过在信号压接孔10的内侧面设置第一金属镀层41，以对应完成连接器200中信号压接针的压接功能。需要说明的是，第一金属镀层41可以通过电镀、蒸镀、溅射、化学镀或气相沉积的方式形成，并且，第一金属镀层41可以为铜、铝、银等金属材料或者其他合金材料制成，在此不对第一金属镀层41的材质以及形成工艺进行具体的限定。还可以理解的是，通过在接地压接孔21的内侧面设置第二金属镀层42，第二金属镀层42与导电层11电连接，以将印刷电路板100中的各导电层11电性连接，当连接器200的接地压接针***接地压接孔21中后，可以使得接地压接针的侧面可与各导电层11同时接触，以提高接地效果，并且，第二金属镀层42的存在还可以提高接地压接孔21的电磁场屏蔽效果，从而减小信号压接孔10之间的信号串扰。需要说明的是，第二金属镀层42与第一金属镀层41的材质以及形成工艺均可相同，在此不加以赘述。Referring to FIG. 11 , in a possible embodiment, the inner surface of the signal crimping hole 10 is provided with a first metal plating layer 41 , and the inner surface of the grounding crimping hole 21 is provided with a second metal plating layer 42 . It can be understood that, by disposing the first metal plating layer 41 on the inner surface of the signal crimping hole 10 , the crimping function of the signal crimping pins in the connector 200 is correspondingly completed. It should be noted that the first metal coating 41 can be formed by electroplating, vapor deposition, sputtering, chemical plating or vapor deposition, and the first metal coating 41 can be copper, aluminum, silver and other metal materials or other alloy materials The material and forming process of the first metal plating layer 41 are not specifically limited here. It can also be understood that, by providing the second metal plating layer 42 on the inner surface of the grounding crimping hole 21, the second metal plating layer 42 is electrically connected to the conductive layer 11, so as to electrically connect the conductive layers 11 in the printed circuit board 100 , when the grounding crimping pin of the connector 200 is inserted into the grounding crimping hole 21, the sides of the grounding crimping pin can contact with each conductive layer 11 at the same time, so as to improve the grounding effect, and the presence of the second metal plating layer 42 The electromagnetic field shielding effect of the ground crimping hole 21 can also be improved, thereby reducing the signal crosstalk between the signal crimping holes 10 . It should be noted that the material and formation process of the second metal coating layer 42 and the first metal coating layer 41 may be the same, and details are not described here.

一种可能的实施例中，至少一个导电层11上形成有信号出线60，接地压接孔21与信号出线60相间隔，且信号出线60与信号压接孔10内的第一金属镀层41电连接。可以理解的是，通过在至少一个导电层11上形成信号出线60，并将信号出线60与第一金属镀层41电连接，从而有效实现信号传输功能。并且，将接地压接孔21与信号出线60相间隔，以有效避免二者之间的位置重叠。In a possible embodiment, at least one conductive layer 11 is formed with a signal outlet 60, the ground crimping hole 21 is spaced from the signal outlet 60, and the signal outlet 60 is electrically connected to the first metal plating layer 41 in the signal crimping hole 10. connect. It can be understood that the signal transmission function is effectively realized by forming the signal outgoing line 60 on at least one conductive layer 11 and electrically connecting the signal outgoing line 60 with the first metal plating layer 41 . Moreover, the ground crimping hole 21 is spaced from the signal outgoing line 60 to effectively avoid overlapping positions between the two.

一种可能的实施例中，地孔22的内侧面设有第一导电镀层51，屏蔽孔30的内侧面设有第二导电镀层52，第一导电镀层51和第二导电镀层52的材料为导电金属或导电非金属。可以理解的是，通过在地孔22的内侧面设置第一导电镀层51，且在屏蔽孔30的内侧面设置第二导电镀层52，不仅可以提高对相邻的两对信号压接孔10之间的电磁场屏蔽效果，同时可以提高印刷电路板100中各导电层11的接地效果。需要说明的是，当第一导电镀层51和第二导电镀层52由导电金属制成时，第一导电镀层51、第二导电镀层52、第一金属镀层41和第二金属镀层42的材质以及形成工艺均可相同，在此不加以赘述；当第一导电镀层51和第二导电镀层52由导电非金属制成时，同样可以起到相同的接地及电磁场屏蔽功能。在一种具体的实施例中，第一导电镀层51和第二导电镀层52的材质为导电树脂。还需要说明的是，应将地孔22和屏蔽孔30均与信号出线60间隔设置，以避免三者之间的位置重叠。In a possible embodiment, the inner surface of the ground hole 22 is provided with a first conductive coating 51, and the inner surface of the shielding hole 30 is provided with a second conductive coating 52, and the materials of the first conductive coating 51 and the second conductive coating 52 are Conductive metal or conductive non-metal. It can be understood that by arranging the first conductive plating layer 51 on the inner surface of the ground hole 22 and the second conductive plating layer 52 on the inner surface of the shielding hole 30, not only can the connection between two adjacent pairs of signal crimping holes 10 be improved, The electromagnetic field shielding effect among them can be improved, and the grounding effect of each conductive layer 11 in the printed circuit board 100 can be improved at the same time. It should be noted that when the first conductive coating 51 and the second conductive coating 52 are made of conductive metal, the materials of the first conductive coating 51, the second conductive coating 52, the first metal coating 41 and the second metal coating 42 and The formation process can be the same, and will not be repeated here; when the first conductive plating layer 51 and the second conductive plating layer 52 are made of conductive non-metal, they can also play the same grounding and electromagnetic field shielding functions. In a specific embodiment, the material of the first conductive plating layer 51 and the second conductive plating layer 52 is conductive resin. It should also be noted that both the ground hole 22 and the shielding hole 30 should be spaced apart from the signal outlet 60 to avoid overlapping positions among the three.

一种可能的实施例中，每个信号压接孔10均包围有反焊盘70，且所述反焊盘70的***轮廓呈圆形。可以理解的是，反焊盘70的存在可减小印刷电路板100上的介质电容，更有利于信号的完整性与信号的阻抗匹配。然而，位于不同导电层11上的信号出线60之间的电磁场，可穿过反焊盘70并进行相互干扰，从而导致在不同导电层11上的信号出线60之间产生信号串扰。基于此，在本实施例中，通过将反焊盘70设计为圆形，以替代传统的矩形反焊盘，从而有效缩小反焊盘70的尺寸，进而减小不同导电层11上的信号出线60之间的信号串扰，使得高速信号在印刷电路板100中进行传输时能够满足相应传输要求。In a possible embodiment, each signal crimping hole 10 is surrounded by an anti-pad 70 , and the outer contour of the anti-pad 70 is circular. It can be understood that the presence of the anti-pad 70 can reduce the dielectric capacitance on the printed circuit board 100 , which is more conducive to signal integrity and signal impedance matching. However, the electromagnetic field between the signal outlets 60 on different conductive layers 11 may pass through the anti-pad 70 and interfere with each other, resulting in signal crosstalk between the signal outlets 60 on different conductive layers 11 . Based on this, in this embodiment, the anti-pad 70 is designed to be circular to replace the traditional rectangular anti-pad, so as to effectively reduce the size of the anti-pad 70, thereby reducing the number of outgoing signals on different conductive layers 11. 60 , so that high-speed signals can meet corresponding transmission requirements when being transmitted in the printed circuit board 100 .

请参阅图12，一种可能的实施例中，在同一个导电层11上，连接于同一对信号压接孔10的两个信号出线60关于沿第二方向902延伸的对称轴呈轴对称分布。可以理解的是，当连接于同一对信号压接孔10的两个信号出线60之间呈对称分布时，能够达到更优的信号偏斜(skew)补偿效果，以利于高速信号的传输。需要说明的是，在上述结构下，信号出线60容易与部分屏蔽孔30的位置重叠，因此，可省略部分屏蔽孔30，以达到信号偏斜补偿效果。Please refer to FIG. 12 , in a possible embodiment, on the same conductive layer 11 , the two signal outgoing lines 60 connected to the same pair of signal crimping holes 10 are distributed axisymmetrically with respect to the axis of symmetry extending along the second direction 902 . It can be understood that when the two signal outlet wires 60 connected to the same pair of signal crimping holes 10 are distributed symmetrically, a better signal skew compensation effect can be achieved to facilitate high-speed signal transmission. It should be noted that, under the above structure, the position of the signal outgoing line 60 is likely to overlap with part of the shielding hole 30 , therefore, part of the shielding hole 30 can be omitted to achieve the effect of signal skew compensation.

本申请实施例还提供一种电子设备，包括上述各实施例的印刷电路板100，以及印刷电路板100配合的连接器200，连接器200的信号压接针插设于印刷电路板100的信号压接孔10内，连接器200的接地压接针插设于接地压接孔21内。在该电子设备，由于其采用上述各实施例的印刷电路板100，因此，该电子设备具有上述印刷电路板100所具有的优点，具体可参考上面相关描述，在此不再赘述。The embodiment of the present application also provides an electronic device, including the printed circuit board 100 of the above-mentioned embodiments, and the connector 200 matched with the printed circuit board 100. The signal crimping pins of the connector 200 are inserted into the signal terminals of the printed circuit board 100. In the crimping hole 10 , the grounding crimping pin of the connector 200 is inserted into the grounding crimping hole 21 . In this electronic device, since it adopts the printed circuit board 100 of the above-mentioned embodiments, the electronic device has the advantages of the above-mentioned printed circuit board 100 , and details can be referred to above related descriptions, which will not be repeated here.

以上描述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。因此，本申请的保护范围应以权利要求的保护范围为准。The above description is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application, and should It falls within the protection scope of the present application; in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (14)

1. 一种印刷电路板，其特征在于，包括连接器插接区，所述连接器插接区内设置有多行压接孔，每行压接孔包括间隔设置的至少两对信号压接孔；A printed circuit board, characterized in that it includes a connector insertion area, and the connector insertion area is provided with multiple rows of crimping holes, and each row of crimping holes includes at least two pairs of signal crimping holes arranged at intervals;

   压接孔的行排列方向为第一方向，沿所述第一方向，每对所述信号压接孔的两侧各设置有一个接地孔组，所述接地孔组包括接地压接孔和位于所述接地压接孔至少一侧的地孔，每对所述信号压接孔中的两个信号压接孔之间还设有至少一个屏蔽孔，所述接地压接孔、所述地孔和所述屏蔽孔均接地；The row arrangement direction of the crimping holes is the first direction. Along the first direction, a grounding hole group is provided on both sides of each pair of the signal crimping holes, and the grounding hole group includes the grounding crimping holes and the The ground hole on at least one side of the ground crimping hole, at least one shielding hole is provided between the two signal crimping holes in each pair of the signal crimping holes, the ground crimping hole, the ground hole and the shielding hole are grounded;

   所述接地压接孔、所述地孔和所述屏蔽孔共同包围所述信号压接孔。The ground crimping hole, the ground hole and the shielding hole together surround the signal crimping hole.
2. 根据权利要求1所述的印刷电路板，其特征在于，所述印刷电路板包括第一表面，在垂直于所述第一表面的方向上，所述地孔、所述屏蔽孔和所述接地压接孔构成包围孔组，所述包围孔组在垂直于所述第一表面的方向上的延伸的尺寸大于或等于所述信号压接孔的在垂直于所述第一表面的方向上的延伸的尺寸。The printed circuit board according to claim 1, wherein the printed circuit board comprises a first surface, and in a direction perpendicular to the first surface, the ground hole, the shielding hole and the ground The crimping hole constitutes a group of surrounding holes, and the size of the group of surrounding holes extending in the direction perpendicular to the first surface is greater than or equal to that of the signal crimping hole in the direction perpendicular to the first surface. Extended dimensions.
3. 根据权利要求2所述的印刷电路板，其特征在于，每个所述接地孔组均包括多个所述地孔，且多个所述地孔在第二方向上的最大连线长度，大于或等于所述信号压接孔在所述第二方向上的长度；The printed circuit board according to claim 2, wherein each of the ground hole groups includes a plurality of ground holes, and the maximum connection length of the plurality of ground holes in the second direction is greater than or equal to the length of the signal crimping hole in the second direction;

   所述第二方向在所述第一表面上且垂直于所述第一方向。The second direction is on the first surface and is perpendicular to the first direction.
4. 根据权利要求3所述的印刷电路板，其特征在于，每个所述接地孔组均包括两对所述地孔，且沿所述第一方向，两对所述地孔分别位于所述接地压接孔的两侧，每对所述地孔均包括两个沿所述第二方向间隔排布的所述地孔。The printed circuit board according to claim 3, wherein each of the ground hole groups includes two pairs of the ground holes, and along the first direction, the two pairs of the ground holes are respectively located on the ground On both sides of the crimping hole, each pair of ground holes includes two ground holes arranged at intervals along the second direction.
5. 根据权利要求3所述的印刷电路板，其特征在于，所述接地压接孔与所述地孔相连通，以形成一体式结构。The printed circuit board according to claim 3, wherein the ground crimping hole communicates with the ground hole to form an integrated structure.
6. 根据权利要求3所述的印刷电路板，其特征在于，每对所述信号压接孔中的两个信号压接孔之间设有多个屏蔽孔，多个所述屏蔽孔至少包括相间隔的第一屏蔽孔和第二屏蔽孔，所述第一屏蔽孔设于所述信号压接孔朝向所述第二方向的一侧，所述第二屏蔽孔设于所述信号压接孔背离所述第二方向的一侧。The printed circuit board according to claim 3, wherein a plurality of shielding holes are arranged between two signal crimping holes in each pair of the signal crimping holes, and the plurality of shielding holes at least include The first shielding hole and the second shielding hole, the first shielding hole is set on the side of the signal crimping hole facing the second direction, the second shielding hole is set on the signal crimping hole away from one side of the second direction.
7. 根据权利要求6所述的印刷电路板，其特征在于，所述第一屏蔽孔的数量为多个，且多个所述第一屏蔽孔沿所述第一方向依次排列；The printed circuit board according to claim 6, wherein the number of the first shielding holes is multiple, and the multiple first shielding holes are arranged in sequence along the first direction;

   多个所述第一屏蔽孔之间间隔设置；或，A plurality of the first shielding holes are arranged at intervals; or,

   多个所述第一屏蔽孔相连通，以形成一体式结构。A plurality of the first shielding holes are connected to form an integrated structure.
8. 根据权利要求7所述的印刷电路板，其特征在于，所述第二屏蔽孔的数量为多个，且多个所述第二屏蔽孔沿所述第一方向依次排列；The printed circuit board according to claim 7, wherein the number of the second shielding holes is multiple, and the plurality of second shielding holes are arranged in sequence along the first direction;

   多个所述第二屏蔽孔之间间隔设置；或，A plurality of the second shielding holes are arranged at intervals; or,

   多个所述第二屏蔽孔相连通，以形成一体式结构。A plurality of the second shielding holes are connected to form an integrated structure.
9. 根据权利要求3所述的印刷电路板，其特征在于，每个所述接地孔组均包括多个所述接地压接孔，且多个所述接地压接孔沿所述第二方向间隔排布。The printed circuit board according to claim 3, wherein each of the ground hole groups includes a plurality of the ground crimping holes, and the plurality of the ground crimping holes are spaced apart along the second direction. cloth.
10. 根据权利要求3所述的印刷电路板，其特征在于，相邻的两行压接孔中，沿所述第二方向，位于上一行中的任意一对所述信号压接孔与位于下一行中的任意一对所述信号压接孔错位设置。The printed circuit board according to claim 3, characterized in that, in two adjacent rows of crimping holes, along the second direction, any pair of signal crimping holes in the upper row and the next row Any pair of the signal crimping holes are misaligned.
11. 根据权利要求1所述的印刷电路板，其特征在于，每个所述信号压接孔均包围有反焊盘，且所述反焊盘的***轮廓呈圆形。The printed circuit board according to claim 1, wherein each of the signal crimping holes is surrounded by an anti-pad, and an outer contour of the anti-pad is circular.
12. 根据权利要求2所述的印刷电路板，其特征在于，所述信号压接孔的内侧面设置有第一金属镀层，所述接地压接孔的内侧面设置有第二金属镀层；The printed circuit board according to claim 2, wherein the inner surface of the signal crimping hole is provided with a first metal coating, and the inner surface of the grounding crimping hole is provided with a second metal coating;

    所述地孔的内侧面设有第一导电镀层，所述屏蔽孔的内侧面设有第二导电镀层，所述第一导电镀层和所述第二导电镀层的材料为导电金属或导电非金属；The inner surface of the ground hole is provided with a first conductive coating, the inner surface of the shielding hole is provided with a second conductive coating, and the materials of the first conductive coating and the second conductive coating are conductive metal or conductive non-metal ;

    所述印刷电路板包括交替堆叠设置的导电层和介电层，所述第一金属镀层、所述第二金属镀层、所述第一导电镀层和所述第二导电镀层均与所述导电层电连接；至少一个所述导电层上形成有信号出线，所述接地压接孔、所述地孔和所述屏蔽孔均与所述信号出线相间隔，且所述信号出线与所述信号压接孔内的所述第一金属镀层电连接。The printed circuit board includes conductive layers and dielectric layers alternately stacked, and the first metal coating, the second metal coating, the first conductive coating and the second conductive coating are all connected to the conductive layer Electrical connection; at least one of the conductive layers is formed with a signal outlet, the ground crimping hole, the ground hole and the shielding hole are all spaced from the signal outlet, and the signal outlet is connected to the signal voltage The first metal plating layer in the contact hole is electrically connected.
13. 根据权利要求12所述的印刷电路板，其特征在于，在同一个所述导电层上，连接于同一对信号压接孔的两个所述信号出线关于沿第二方向延伸的对称轴呈轴对称分布；The printed circuit board according to claim 12, characterized in that, on the same conductive layer, the two signal outgoing lines connected to the same pair of signal crimping holes are aligned with the axis of symmetry extending along the second direction. symmetrical distribution;

    所述第二方向在所述第一表面上且垂直于所述第一方向。The second direction is on the first surface and is perpendicular to the first direction.
14. 一种电子设备，其特征在于，包括如权利要求1至13任一项所述的印刷电路板，以及与所述印刷电路板相配合的连接器，所述连接器的信号压接针插设于所述信号压接孔内，所述连接器的接地压接针插设于所述接地压接孔内。An electronic device, characterized in that it comprises the printed circuit board according to any one of claims 1 to 13, and a connector matched with the printed circuit board, the signal crimping pins of the connector are inserted into In the signal crimping hole, the grounding crimping pin of the connector is inserted into the grounding crimping hole.

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