TW201526392A

TW201526392A - Connector

Info

Publication number: TW201526392A
Application number: TW102149312A
Authority: TW
Inventors: Hsin-Hsien Li; Min-Lin Lee; Tzu-Min Lin; Chi-Hua Yu
Original assignee: Ind Tech Res Inst
Priority date: 2013-12-31
Filing date: 2013-12-31
Publication date: 2015-07-01
Also published as: CN104752904B; TWI563738B; CN104752904A

Abstract

A connector used for electrically connecting to an electronic device is provided. The connector includes an insulating body, a plurality of first conducting members, and a plurality of second conducting members, wherein the first conducting members and the second conducting members are disposed in the insulating body, and there exists at least one second conducting member adjacent to the first conducting.

Description

連接器 Connector

本發明是有關於一種連接器，且特別是有關於一種用於積體電路封裝的連接器。 This invention relates to a connector, and more particularly to a connector for an integrated circuit package.

為增加電子系統的可靠度，通常是將電子模組利用連接器(Connector)以連接彼此間的訊號傳遞，進而形成一個電子系統。這種作法有助於提升整個電子系統生產時的良率，且可對電子系統後續的維修保養或次系統的升級及更新提供便利性。 In order to increase the reliability of the electronic system, the electronic module is usually connected to each other by means of a connector to form an electronic system. This approach helps to increase the yield of the entire electronic system and facilitates subsequent maintenance or upgrades and updates of the electronic system.

用來連接積體電路封裝(IC Package)模組與電路板(PCB)的連接器(Connector)又稱為插座(Socket)。一般而言，插座的用途可分為三類：(1)作為IC封裝的「預燒」(Burn-In)測試用；(2)作為IC封的電路「測試」(Testing)用；(3)作為IC封裝終端「產品」(Production)的「插座」。 A connector (Connector) for connecting an IC package module to a circuit board (PCB) is also called a socket. In general, the use of sockets can be divided into three categories: (1) as a "burn-in" test for IC packages; (2) as a test circuit for IC packages; (3) ) As the "socket" of the IC packaging terminal "Production".

以作為IC封裝終端產品的插座為例說明，IC封裝用的插座通常用於傳送高速數位訊號，且隨著傳送的數位訊號量需求愈來愈大(即傳輸頻率>10GHz)，因此對插座的高速傳輸品質要求也更為嚴格。伴隨著電子零組件尺寸愈趨小型化的設計趨勢下，使得IC封裝的插座內的各訊號端子的設置距離更為接近(例如端子間距<0.4mm)，而訊號端子的距離過於接近使得各訊號通路的雜訊干擾更嚴重，影響高速訊號傳遞的完整性。為提升日益微型化的IC封裝終端產品性能及連接器的傳輸能力，「串音」(Crosstalk)的抑制有其必要性。 Taking a socket as an IC package terminal product as an example, a socket for an IC package is generally used for transmitting a high-speed digital signal, and as the number of transmitted digital signals is increasing (ie, a transmission frequency of >10 GHz), the socket is High-speed transmission quality requirements are also more stringent. With the design trend of smaller and smaller electronic components, The distance between the signal terminals in the socket of the IC package is closer (for example, the terminal spacing is <0.4 mm), and the distance between the signal terminals is too close, so that the noise interference of each signal path is more serious, which affects the integrity of high-speed signal transmission. . In order to improve the performance of the increasingly miniaturized IC package terminal products and the transmission capability of the connector, the suppression of "crosstalk" (Crosstalk) is necessary.

本發明提供一種連接器，其用以減少串音干擾。 The present invention provides a connector for reducing crosstalk interference.

本發明的連接器，適於電性連接電子元件。連接器包括絕緣體、第一導體與第二導體。絕緣體具有多個凹槽。第一導體陣列配置在絕緣體內且對應配置在至少部分凹槽的側壁上，第二導體陣列配置在絕緣體內且配置在相鄰的該些凹槽之間，其中相鄰的二第一導體之間存在至少一第二導體，第一導體可作為連接端子以與該電子元件電性連接。 The connector of the present invention is adapted to electrically connect electronic components. The connector includes an insulator, a first conductor, and a second conductor. The insulator has a plurality of grooves. The first conductor array is disposed in the insulator and correspondingly disposed on the sidewall of the at least part of the recess, the second conductor array is disposed in the insulator and disposed between the adjacent recesses, wherein the adjacent two first conductors There is at least one second conductor therebetween, and the first conductor can serve as a connection terminal to be electrically connected to the electronic component.

本發明的連接器，適於電性連接電子元件。連接器包括基板、至少一絕緣體、多個第一導體以及多個第二導體。基板具有至少一接地層。絕緣體配置在基板的至少一表面上，且具有多個凹槽。第一導體陣列配置在絕緣體內且對應配置在至少部分凹槽的側壁上，第二導體陣列配置在絕緣體內且配置在相鄰的該些凹槽之間，其中相鄰的二第一導體之間存在至少一第二導體，第一導體作為連接端子以與該電子元件電性連接，且第二導體電性連接接地層。 The connector of the present invention is adapted to electrically connect electronic components. The connector includes a substrate, at least one insulator, a plurality of first conductors, and a plurality of second conductors. The substrate has at least one ground layer. The insulator is disposed on at least one surface of the substrate and has a plurality of grooves. The first conductor array is disposed in the insulator and correspondingly disposed on the sidewall of the at least part of the recess, the second conductor array is disposed in the insulator and disposed between the adjacent recesses, wherein the adjacent two first conductors There is at least one second conductor between the first conductor as a connection terminal to be electrically connected to the electronic component, and the second conductor is electrically connected to the ground layer.

基於上述，在本揭露的上述實施例中，藉由將第一導體與第二導體配置在絕緣體內，且讓每個第一導體旁均存在至少一第二導體，因此在連接器與電子元件對接，並以第一導體進行高速訊號傳輸時，第二導體能對不同通道處的第一導體形成屏蔽效果，以阻擋其串音干擾。 Based on the above, in the above embodiment of the present disclosure, the connector and the electronic component are disposed by disposing the first conductor and the second conductor in the insulator and having at least one second conductor adjacent to each of the first conductors. When docking and performing high-speed signal transmission with the first conductor, the second conductor can shield the first conductor at different channels to block crosstalk interference.

為讓本揭露的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.

100、400、500、600‧‧‧連接器 100, 400, 500, 600‧‧‧ connectors

110、410‧‧‧第一導體 110, 410‧‧‧ first conductor

110A‧‧‧第一訊號端子 110A‧‧‧First signal terminal

110B‧‧‧第一接地端子 110B‧‧‧First grounding terminal

112‧‧‧第一部件 112‧‧‧ first part

114‧‧‧第二部件 114‧‧‧ second part

120、420‧‧‧第二導體 120, 420‧‧‧ second conductor

130、430‧‧‧絕緣體 130, 430‧‧‧ insulator

132‧‧‧凹槽 132‧‧‧ Groove

140、340‧‧‧導體片 140, 340‧‧‧ conductor pieces

142、342‧‧‧開口 142, 342‧‧‧ openings

142A、342A‧‧‧第一開口 142A, 342A‧‧‧ first opening

142B、342B‧‧‧第二開口 142B, 342B‧‧‧ second opening

200、200A、200B‧‧‧電子元件 200, 200A, 200B‧‧‧ electronic components

210‧‧‧連接端子 210‧‧‧Connecting terminal

210A‧‧‧第二訊號端子 210A‧‧‧second signal terminal

210B‧‧‧第二接地端子 210B‧‧‧Second ground terminal

300‧‧‧電路板 300‧‧‧ boards

440‧‧‧基板 440‧‧‧Substrate

441‧‧‧通孔 441‧‧‧through hole

441A‧‧‧第一通孔 441A‧‧‧ first through hole

441A1‧‧‧訊號通孔 441A1‧‧‧ signal through hole

441A2‧‧‧接地通孔 441A2‧‧‧ grounding through hole

441B‧‧‧第二通孔 441B‧‧‧Second through hole

442‧‧‧接地層 442‧‧‧ Grounding layer

443、444‧‧‧導電層 443, 444‧‧‧ conductive layer

443A‧‧‧第一導電層 443A‧‧‧First conductive layer

443B‧‧‧第二導電層 443B‧‧‧Second conductive layer

445‧‧‧絕緣層 445‧‧‧Insulation

530A‧‧‧第一絕緣體 530A‧‧‧First insulator

530B‧‧‧第二絕緣體 530B‧‧‧Second insulator

A1‧‧‧第一陣列 A1‧‧‧ first array

A2‧‧‧第二陣列 A2‧‧‧ second array

A3‧‧‧第三陣列 A3‧‧‧ third array

A4‧‧‧第四陣列 A4‧‧‧ fourth array

P1、P2、P3、P4‧‧‧連接線 P1, P2, P3, P4‧‧‧ connection lines

S1、S2、S3、S4‧‧‧表面 S1, S2, S3, S4‧‧‧ surface

T1‧‧‧孔組 T1‧‧‧ hole group

V1‧‧‧內孔 V1‧‧‧ hole

V2‧‧‧外孔 V2‧‧‧ outer hole

W1‧‧‧翼部 W1‧‧‧ wing

圖1是依照本揭露一實施例的一種連接器電連接於電子元件及電路板之間的側視圖。 1 is a side view of a connector electrically connected between an electronic component and a circuit board in accordance with an embodiment of the present disclosure.

圖2是以立體視角繪示圖1的電子元件、電路板與連接器的局部示意圖。 2 is a partial schematic view showing the electronic component, the circuit board and the connector of FIG. 1 in a perspective view.

圖3是圖2的電子元件、電路板與連接器的局部剖面圖。 3 is a partial cross-sectional view of the electronic component, circuit board, and connector of FIG. 2.

圖4與圖5分別繪示串音現象的示意圖。 FIG. 4 and FIG. 5 respectively show schematic diagrams of a crosstalk phenomenon.

圖6是本揭露另一實施例的一種連接器連接於電子元件與電路板之間的示意圖。 FIG. 6 is a schematic diagram of a connector connected between an electronic component and a circuit board according to another embodiment of the disclosure.

圖7繪示圖6的連接器的串音示意圖。 FIG. 7 is a schematic cross-sectional view of the connector of FIG. 6. FIG.

圖8是本揭露另一實施例的一種導體片的俯視圖。 FIG. 8 is a top plan view of a conductor piece according to another embodiment of the present disclosure.

圖9與圖10分別繪示不同的電子元件。 9 and 10 respectively show different electronic components.

圖11是本揭露又一實施例的一種連接器的局部剖面圖。 11 is a partial cross-sectional view of a connector in accordance with still another embodiment of the present disclosure.

圖12是圖11的連接器的局部俯視圖。 Figure 12 is a partial plan view of the connector of Figure 11 .

圖13是本揭露另一實施例的一種連接器局部剖面圖。 Figure 13 is a partial cross-sectional view showing a connector of another embodiment of the present disclosure.

圖14是圖13的連接器的局部俯視圖。 Figure 14 is a partial plan view of the connector of Figure 13;

圖15是本揭露另一實施例的一種連接器的局部剖面圖。 Figure 15 is a partial cross-sectional view showing a connector of another embodiment of the present disclosure.

圖1是依照本揭露一實施例的一種連接器電連接於電子元件及電路板之間的側視圖。圖2是以立體視角繪示圖1的電子元件、電路板與連接器的局部示意圖。圖3是圖2的電子元件、電路板與連接器的局部剖面圖。在此同時提供一直角座標系以便於描述相關構件，其中圖2所述構件是座落在X-Y平面上，圖3是沿Y-Z平面進行剖視。另，在圖2與圖3中，部分構件予以虛線輪廓繪製以利於構件的辨識。後續圖式中亦會以類似手法將部分構件予以透視，對應地示出或省略相關構件，且多個相同構件僅標示其中之一，以能夠清楚地表現本案的特徵需求。 1 is a side view of a connector electrically connected between an electronic component and a circuit board in accordance with an embodiment of the present disclosure. 2 is a partial schematic view showing the electronic component, the circuit board and the connector of FIG. 1 in a perspective view. 3 is a partial cross-sectional view of the electronic component, circuit board, and connector of FIG. 2. At the same time, a right-angle coordinate system is provided to facilitate the description of the relevant members, wherein the member of Fig. 2 is seated on the X-Y plane, and Fig. 3 is a cross-sectional view along the Y-Z plane. In addition, in FIGS. 2 and 3, some of the members are drawn with a dotted outline to facilitate the identification of the members. In the following figures, some components will also be seen in a similar manner, correspondingly showing or omitting related components, and a plurality of identical components are only indicated one of them, so as to be able to clearly express the characteristic requirements of the present case.

請同時參考圖1至圖3，在本實施例中，連接器100適於電性連接於電子元件200與電路板300之間，如前所述，連接器100例如是配置在電路板300上的插座(socket)，而電子元件200例如是積體電路封裝(IC package)，以藉由插設於插座上而與電路板300達到電性連接的效果。 Referring to FIG. 1 to FIG. 3 simultaneously, in the embodiment, the connector 100 is adapted to be electrically connected between the electronic component 200 and the circuit board 300. As described above, the connector 100 is disposed on the circuit board 300, for example. The socket 200, and the electronic component 200 is, for example, an IC package to electrically connect to the circuit board 300 by being inserted into the socket.

連接器100包括絕緣體130、多個第一導體110與多個第二導體120，其中第一導體110與第二導體120分別以第一陣列 A1與第二陣列A2配置在絕緣體130內，且所述第一陣列A1與第二陣列A2均位在X-Y平面上(或平行X-Y平面的平面上)，而各第一導體110旁存在至少一第二導體120。詳細來說，第一陣列A1與第二陣列A2係為交錯穿插設置。在本實施例中，絕緣體130例如是彈性體，第一導體110與第二導體120可以嵌入式注射成型於彈性體內，其中第一導體110可作為連接器100的連接端子，而藉以與電子元件200的多個連接端子210電性連接(此處連接端子210即為上述IC package的連接腳位)，同時藉由彈性體提供電子元件200與連接器100對接時，電接觸介面的接觸正向力。第二導體120配置在第一導體110旁以作為第一導體110的屏蔽元件，藉以防止如前述的串音干擾。進一步地說，任意相鄰的兩個第一導體110之間會存在至少一第二導體120，以達到所述屏蔽效果。 The connector 100 includes an insulator 130, a plurality of first conductors 110 and a plurality of second conductors 120, wherein the first conductors 110 and the second conductors 120 are respectively in a first array A1 and the second array A2 are disposed in the insulator 130, and the first array A1 and the second array A2 are both positioned on the XY plane (or a plane parallel to the XY plane), and at least one of the first conductors 110 is present. Second conductor 120. In detail, the first array A1 and the second array A2 are interleaved and interposed. In this embodiment, the insulator 130 is, for example, an elastic body, and the first conductor 110 and the second conductor 120 can be embedded and injection molded into the elastic body, wherein the first conductor 110 can serve as a connection terminal of the connector 100, thereby being used with the electronic component. The plurality of connection terminals 210 of the 200 are electrically connected (here, the connection terminal 210 is the connection pin of the IC package), and when the electronic component 200 is connected to the connector 100 by the elastic body, the contact of the electrical contact interface is positive. force. The second conductor 120 is disposed beside the first conductor 110 as a shielding element of the first conductor 110 to prevent crosstalk interference as previously described. Further, at least one second conductor 120 may exist between any two adjacent first conductors 110 to achieve the shielding effect.

請再參考圖2與圖3，在本實施例中，第一導體110的外型為至少局部的錐體，第二導體120則為柱體，且絕緣體130具有多個凹槽132(在此僅標示於圖3)，以代表絕緣體130的多個凹槽132中嵌置有第一導體110。在本實施例中，第一導體110對應配置在至少部分凹槽132的側壁上，而第二導體120則配置在第一導體110所在的相鄰的凹槽132之間。進一步地說，第一導體110包括彼此分離的第一部件112與第二部件114，其形成一錐體的至少局部，且所述錐體是朝向電子元件200呈漸開狀。據此，當電子元件200以其多個連接端子210對接至連接器100時，連接端子210適於分別被夾持在對應的第一部件112與第二部件114之間而與連接器100電性連接。在此並未限制第一導體110、第二導體120的外形，於另一未繪示的實施例中，第一導體與第二導體亦可為片狀或其他合適的形狀。 Referring to FIG. 2 and FIG. 3 again, in the embodiment, the first conductor 110 has a shape of at least a partial cone, the second conductor 120 is a cylinder, and the insulator 130 has a plurality of grooves 132 (here Only shown in FIG. 3), the first conductor 110 is embedded in the plurality of grooves 132 representing the insulator 130. In the present embodiment, the first conductor 110 is correspondingly disposed on the sidewall of at least a portion of the recess 132, and the second conductor 120 is disposed between the adjacent recesses 132 where the first conductor 110 is located. Further, the first conductor 110 includes a first component 112 and a second component 114 that are separated from one another, forming at least a portion of a cone, and the cone is flared toward the electronic component 200. Accordingly, when the electronic component 200 is docked to the connector 100 with its plurality of connection terminals 210, The terminal 210 is adapted to be clamped between the corresponding first component 112 and the second component 114 to be electrically connected to the connector 100. The outer shape of the first conductor 110 and the second conductor 120 are not limited herein. In another embodiment not shown, the first conductor and the second conductor may also be in the form of a sheet or other suitable shape.

此外，在任意相鄰的兩行第一導體110之間或任意相鄰的兩列第一導體110之間，第二導體120形成阻隔其間的柵狀結構(如圖2所示)，因而在第一導體110與電子元件200電性連接時所形成高速訊號傳輸通道(即一行第一導體110或一列第一導體110)之間，以將第一導體110在高速訊號傳輸時所產生的電磁場拘束在第二導體120附近，進而降低串音干擾的情形。 In addition, between any two adjacent rows of first conductors 110 or between any two adjacent columns of first conductors 110, the second conductor 120 forms a grid-like structure (as shown in FIG. 2) therebetween, thereby The electromagnetic field generated when the first conductor 110 is electrically connected to the electronic component 200 to form a high-speed signal transmission channel (ie, a row of the first conductor 110 or a column of the first conductor 110) to transmit the first conductor 110 during high-speed signal transmission It is restrained in the vicinity of the second conductor 120, thereby reducing the situation of crosstalk interference.

圖4與圖5分別繪示串音現象的示意圖，其中圖5是採用本揭露所述的連接器，而圖4則未採用本揭露所述的連接器以作為對照。由此能明顯得知，本揭露之連接器100可以較習知的連接器確實地減少串音，進而達到高速且正確地傳遞訊號的效果。在此，從圖4未採用本揭露所述的連接器，其串音量範圍在17%~-6%之間，反觀圖5採用本揭露的連接器100，則其串音量範圍介於2.9%~-0.4%之間。換句話說，採用本案連接器100後的串音量能因此改善80%。 FIG. 4 and FIG. 5 respectively illustrate schematic diagrams of a crosstalk phenomenon, wherein FIG. 5 is a connector according to the present disclosure, and FIG. 4 does not use the connector described in the present disclosure as a control. It can be clearly seen that the connector 100 of the present disclosure can reliably reduce crosstalk by a conventional connector, thereby achieving the effect of transmitting signals at high speed and correctly. Here, the connector of the present disclosure is not used in FIG. 4, and the serial volume range is between 17% and 6%. In contrast, the connector 100 of the present disclosure is used in FIG. 5, and the serial volume range is 2.9%. ~-0.4%. In other words, the string volume after the connector 100 of the present invention can be improved by 80%.

再者，如圖2所示，第一陣列A1與第二陣列A2呈彼此交錯的配置，但本揭露並不以此為限。圖6是本揭露另一實施例的一種連接器連接於電子元件與電路板之間的示意圖。圖7繪示圖6的連接器的串音示意圖。請同時參考圖6與圖7，在本實施例中，第一導體110是以第三陣列A3配置在絕緣體130內，第二導體120是以第四陣列A4配置在絕緣體130內，而第三陣列A3與第四陣列A4彼此一致且被第四陣列A4所涵蓋。詳細來說，以圖2的第一陣列A1與第二陣列A2的排列方式，每一個第一導體110周圍分布有4個第二導體120以包圍住第一導體110，而在圖6的實施例中，每一個第一導體110周圍分布有8個第二導體120以包圍住第一導體110，因此其所測得的串音情形便如圖7所示，相較於圖4未採用本揭露的連接器的串音情形，本實施例能明顯看出有明顯改善98%。要說的是，第一導體110與第二導體120陣列形式的排列方式，可視需求來調整，因此每一第一導體110周圍分布第二導體120的數量可調整變動，並不以所列舉者為限。 Moreover, as shown in FIG. 2, the first array A1 and the second array A2 are arranged in a staggered manner, but the disclosure is not limited thereto. FIG. 6 is a schematic diagram of a connector connected between an electronic component and a circuit board according to another embodiment of the disclosure. FIG. 7 is a schematic cross-sectional view of the connector of FIG. 6. FIG. Please refer to FIG. 6 and FIG. 7 at the same time, in this embodiment. The first conductors 110 are disposed in the insulator 130 in a third array A3, the second conductors 120 are disposed in the insulator 130 in a fourth array A4, and the third array A3 and the fourth array A4 are identical to each other and are fourth. Covered by array A4. In detail, in the arrangement of the first array A1 and the second array A2 of FIG. 2, four second conductors 120 are distributed around each of the first conductors 110 to surround the first conductor 110, and the implementation in FIG. In the example, eight second conductors 120 are distributed around each of the first conductors 110 to surround the first conductor 110. Therefore, the measured crosstalk condition is as shown in FIG. 7, which is not used in FIG. In the case of the crosstalk of the disclosed connector, it is apparent that this embodiment has a significant improvement of 98%. It should be noted that the arrangement of the first conductor 110 and the second conductor 120 in an array form can be adjusted according to requirements, so that the number of the second conductors 120 distributed around each of the first conductors 110 can be adjusted and changed, not by the enumerated ones. Limited.

請再參考圖2與圖3，在本實施例中，連接器100還包括導體片140，配置在絕緣體130上，所述導體片140具有呈陣列排列的多個開口142，以對應絕緣體130的凹槽132。如圖3所示，第二導體120沿Z軸延伸貫穿絕緣體130以暴露出來，而與導體片140接觸並電性導通，亦即第二導體120在X-Y平面上的正投影均位在導體片140在X-Y平面上的正投影的區域範圍內，而電子元件200的多個連接端子210分別穿過開口142而與至少部分第一導體110電性連接。 Referring to FIG. 2 and FIG. 3 again, in the embodiment, the connector 100 further includes a conductor piece 140 disposed on the insulator 130. The conductor piece 140 has a plurality of openings 142 arranged in an array to correspond to the insulator 130. Groove 132. As shown in FIG. 3, the second conductor 120 extends through the insulator 130 along the Z axis to be exposed, and is in contact with and electrically connected to the conductor piece 140, that is, the orthographic projection of the second conductor 120 on the XY plane is on the conductor piece. 140 is in the region of the orthographic projection on the XY plane, and the plurality of connection terminals 210 of the electronic component 200 are electrically connected to at least a portion of the first conductor 110 through the opening 142, respectively.

詳細而言，本實施例的第一導體110包含多個第一訊號端子110A與多個第一接地端子110B，多個開口142對應於第一導體110，且包含多個第一開口142A與多個第二開口142B，而第一訊號端子110A所對應的第一開口142A大於各第一接地端子110B所對應的第二開口142B，亦即第一訊號端子110A在X-Y平面上的正投影是位在第一開口142A在X-Y平面上的正投影的範圍之內且不與導體片140在X-Y平面上的正投影的範圍重疊，因此第一訊號端子110A會延伸貫穿絕緣體130至對應的第一開口142A，而不與導體片140接觸，即第一訊號端子110A與導體片140之間保持斷路狀態。另一方面，在一實施例中，與第一接地端子110B對應的第二開口142B，其尺寸會約略等於凹槽132的開口尺寸，亦即第一接地端子110B在X-Y平面上的正投影是位在第二開口142B在X-Y平面上的正投影範圍內且呈至少局部重疊，因此第一接地端子110B會延伸貫穿絕緣體130而接觸並電性導通導體片140。 In detail, the first conductor 110 of the embodiment includes a plurality of first signal terminals 110A and a plurality of first ground terminals 110B, and the plurality of openings 142 correspond to the first conductor 110 and includes a plurality of first openings 142A and more Second opening 142B, and The first opening 142A corresponding to the signal terminal 110A is larger than the second opening 142B corresponding to each of the first ground terminals 110B, that is, the orthographic projection of the first signal terminal 110A on the XY plane is at the first opening 142A in the XY plane. Within the range of the orthographic projection on the upper surface and not overlapping with the range of the orthographic projection of the conductor piece 140 on the XY plane, the first signal terminal 110A extends through the insulator 130 to the corresponding first opening 142A without the conductor piece 140 The contact, that is, the first signal terminal 110A and the conductor piece 140 are kept in an open state. On the other hand, in an embodiment, the second opening 142B corresponding to the first ground terminal 110B has a size approximately equal to the opening size of the recess 132, that is, the orthographic projection of the first ground terminal 110B on the XY plane is The second opening 142B is in the orthographic projection range on the XY plane and at least partially overlaps, so the first ground terminal 110B extends through the insulator 130 to contact and electrically conduct the conductor piece 140.

對應而言，電子元件200的連接端子210亦包含多個第二訊號端子210A與多個第二接地端子210B。當電子元件200對接至連接器100時，第二訊號端子210A會穿過第一開口142A而電性抵接於第一訊號端子110A，而第二接地端子210B則穿過第二開口142B而電性抵接於第一接地端子110B。據此，第二接地端子210B便能與第一接地端子110B、導體片140和第二導體120形成接地迴路。 Correspondingly, the connection terminal 210 of the electronic component 200 also includes a plurality of second signal terminals 210A and a plurality of second ground terminals 210B. When the electronic component 200 is docked to the connector 100, the second signal terminal 210A is electrically connected to the first signal terminal 110A through the first opening 142A, and the second ground terminal 210B is electrically connected to the second opening 142B. The first contact is connected to the first ground terminal 110B. Accordingly, the second ground terminal 210B can form a ground loop with the first ground terminal 110B, the conductor piece 140, and the second conductor 120.

惟，本揭露並未限定連接器的接地方式。圖8是本揭露另一實施例的一種導體片的俯視圖。請參考圖8，本實施例的導體片340同樣配置在絕緣體130上(在此，本實施例中未繪示的相關構件，均請參考圖3之實施例所繪示者，且其中未予以標示的元件均可參考前述圖3的實施例)，其中部分第一開口342A亦如同前述第一開口142A，其尺寸大於凹槽132的開口尺寸而讓第一訊號端子110A、部分絕緣體130及第一開口342A暴露出。惟，與前述實施例不同的是，導體片340的部分第二開口342B同樣具有大於所對應凹槽132於開口處的尺寸，但第二開口342B另分別具有翼部W1，且這些翼部W1是從第二開口342B的邊緣朝向第二開口342B中央處延伸，而讓電子元件200對接至連接器時，第二接地端子210B得以電性抵接至這些翼部W1，而讓第二接地端子210B經由翼部W1而與導體片340、第二導體120形成接地迴路。換句話說，本實施例的連接器可不需要前述實施例的第一接地端子110B，而改以翼部W1達到所需的接地效果。 However, this disclosure does not limit the way the connector is grounded. FIG. 8 is a top plan view of a conductor piece according to another embodiment of the present disclosure. Referring to FIG. 8, the conductor piece 340 of the embodiment is also disposed on the insulator 130 (here, the phase not shown in this embodiment) For the components, refer to the embodiment of FIG. 3, and the components that are not labeled may refer to the foregoing embodiment of FIG. 3, wherein a portion of the first opening 342A is also like the first opening 142A. The first signal terminal 110A, the partial insulator 130, and the first opening 342A are exposed to be larger than the opening size of the recess 132. However, unlike the foregoing embodiment, part of the second opening 342B of the conductor piece 340 also has a larger size than the corresponding groove 132 at the opening, but the second opening 342B has a wing W1, respectively, and the wings W1 Extending from the edge of the second opening 342B toward the center of the second opening 342B, when the electronic component 200 is docked to the connector, the second ground terminal 210B is electrically abutted to the wing portions W1, and the second ground terminal is allowed to be 210B forms a ground loop with the conductor piece 340 and the second conductor 120 via the wing portion W1. In other words, the connector of the present embodiment can eliminate the need for the first ground terminal 110B of the foregoing embodiment, and the wing portion W1 can be used to achieve the desired grounding effect.

基於上述的實施例，使用者可依據電子元件的連接需求而改變連接器的訊號端子與接地端子的位置與數量。舉例來說，圖9與圖10分別繪示不同的電子元件200A、200B，其各自具有不同配置方式的第二訊號端子210A與第二接地端子210B，基於上述實施例，使用者可搭配不同的導體片在同一個絕緣體上，亦可進一步在絕緣體內配置對應位置的第一訊號端子與第二訊號端子，藉由更換不同第二訊號端子201A與第二接地端子210B的配置導體片140來搭配不同訊號腳位與接地腳位配置的IC而達成變換連接器型式的效果。 Based on the above embodiments, the user can change the position and number of the signal terminals and the ground terminals of the connector according to the connection requirements of the electronic components. For example, FIG. 9 and FIG. 10 respectively illustrate different electronic components 200A and 200B, which respectively have a second signal terminal 210A and a second ground terminal 210B in different configurations. According to the above embodiment, the user can match different The conductor piece is on the same insulator, and the first signal terminal and the second signal terminal corresponding to the position are further disposed in the insulator, and are matched by replacing the arrangement conductor piece 140 of the second signal terminal 201A and the second ground terminal 210B. Different types of signal pins and ICs with ground pins are used to achieve the effect of changing the connector type.

圖11是本揭露又一實施例的一種連接器局部剖面圖。圖 12是圖11的連接器的局部俯視圖。請同時參考圖11與圖12，在本實施例中，連接器400包括基板440、至少一絕緣體430、多個第一導體410以及多個第二導體420。基板440例如是印刷電路板(PCB)或其他相關元件製作成的板體構件，其具有至少一接地層442，而絕緣體430配置在基板440的至少一表面S1或S2上(在此繪示於表面S1為例)，第一導體410與第二導體420分別陣列配置絕緣體430內，其中各第一導體410旁存在至少一第二導體420，且第二導體420電性連接接地層442。由於第一導體410、第二導體420與絕緣層430之間的相對關係已能從上述實施例得知，在此便不再贅述。 11 is a partial cross-sectional view of a connector according to still another embodiment of the present disclosure. Figure 12 is a partial plan view of the connector of FIG. Referring to FIG. 11 and FIG. 12 simultaneously, in the embodiment, the connector 400 includes a substrate 440, at least one insulator 430, a plurality of first conductors 410, and a plurality of second conductors 420. The substrate 440 is, for example, a board member made of a printed circuit board (PCB) or other related components, having at least one ground layer 442, and the insulator 430 is disposed on at least one surface S1 or S2 of the substrate 440 (shown here) The surface of the first conductor 410 and the second conductor 420 are respectively arranged in an array of insulators 430. At least one second conductor 420 is disposed adjacent to each of the first conductors 410, and the second conductor 420 is electrically connected to the ground layer 442. Since the relative relationship between the first conductor 410, the second conductor 420 and the insulating layer 430 can be known from the above embodiments, it will not be described herein.

在本實施例中，基板440包括多個通孔441、多個導電層443、444以及彼此層疊的多個絕緣層445與多個接地層442，在此以相同的剖面線代表具有相同結構的構件，其中部分絕緣層445形成基板440的相對兩表面S1、S2，且接地層442夾層在絕緣層445之間。詳細來說，絕緣層445的上下表面設置有接地層442，而在接地層442相對於與絕緣層445連接的表面再設有絕緣層445，也就是接地層442被絕緣層778夾層以形成三明治結構。通孔441貫穿絕緣層445與接地層442，導電層443配置在通孔441的側壁並延伸至基板440的表面S1或S2。如圖12所示，這些通孔441區分為多個孔組(在此僅繪示孔組T1作為代表)，各孔組T1的通孔包含第一通孔441A與環繞第一通孔441A的多個第二通孔441B(在此僅各標示其一作為代表)，而如圖11所示，呈錐體的第二導體420能經由位於第二通孔441B處的第二導電層443B而電性連接至接地層442。 In the present embodiment, the substrate 440 includes a plurality of vias 441, a plurality of conductive layers 443, 444, and a plurality of insulating layers 445 and a plurality of ground layers 442 stacked on each other, where the same hatching represents the same structure. A member in which a portion of the insulating layer 445 forms opposite surfaces S1, S2 of the substrate 440, and a ground layer 442 is sandwiched between the insulating layers 445. In detail, the upper and lower surfaces of the insulating layer 445 are provided with a ground layer 442, and the ground layer 442 is further provided with an insulating layer 445 with respect to the surface connected to the insulating layer 445, that is, the ground layer 442 is sandwiched by the insulating layer 778 to form a sandwich. structure. The via 441 penetrates the insulating layer 445 and the ground layer 442, and the conductive layer 443 is disposed on the sidewall of the via 441 and extends to the surface S1 or S2 of the substrate 440. As shown in FIG. 12, the through holes 441 are divided into a plurality of hole groups (only the hole group T1 is shown as a representative), and the through holes of each hole group T1 include a first through hole 441A and a surrounding first through hole 441A. a plurality of second through holes 441B (only one of which is denoted here as a representative), and as shown in FIG. The second conductor 420 can be electrically connected to the ground layer 442 via the second conductive layer 443B located at the second via 441B.

進一步地說，在圖11繪示的連接器400的結構中，第一通孔441A包含多個訊號通孔441A1與多個接地通孔441A2，其中訊號通孔441A1具有同軸通孔的特徵，即訊號通孔441A1能進一步地包含彼此同軸心但電性斷路的內孔V1與外孔V2，且導電層443包含第一導電層443A與第二導電層4443B，其中藉由配置在內孔V1孔壁的第一導電層443A而與配置在絕緣體430內的訊號端子410A電性導通，以作為訊號傳輸之用，如圖12所繪示連接至不同連接埠的連接線P1至P4。 Further, in the structure of the connector 400 shown in FIG. 11, the first through hole 441A includes a plurality of signal through holes 441A1 and a plurality of ground through holes 441A2, wherein the signal through holes 441A1 have the characteristics of coaxial through holes, that is, The signal via 441A1 can further include the inner hole V1 and the outer hole V2 which are concentric but electrically disconnected from each other, and the conductive layer 443 includes the first conductive layer 443A and the second conductive layer 4443B, wherein the hole is disposed in the inner hole V1 The first conductive layer 443A of the wall is electrically connected to the signal terminal 410A disposed in the insulator 430 for signal transmission. As shown in FIG. 12, the connection lines P1 to P4 connected to different ports are connected.

此外，訊號通孔441A1係與相鄰的第二通孔441B電性斷路，另一方面，訊號通孔441A1還能藉由配置在外孔V2孔壁的導電層444來與接地層442、第二導體420電性導通，以作為接地之用，而再與電子元件200的第二接地端子210B對接時形成接地迴路。簡而言之，訊號端子410A電性連接至訊號通孔441A1處的導電層443A，接地端子410B經由接地通孔441A2處的導電層443而電性連接至接地層442。導電層444配置於外孔V2的孔壁而電性導通於接地層442，第一導電層443A配置於內孔V1的孔壁而電性導通於訊號端子410A，而接地端子410B經由另一部分第一通孔處的導電層443而電性連接至接地層442。另外，內孔V1與外孔V2之間則是配置以絕緣材料，例如填孔膠或其它相關的結構而使內孔V1與外孔V2之間形成斷路。據此得以形成「同軸電纜」(coaxial cable)的結構，而得以進行阻抗控制並與連接器做阻抗匹配連接。 In addition, the signal via 441A1 is electrically disconnected from the adjacent second via 441B. On the other hand, the signal via 441A1 can also be connected to the ground layer 442 and the second layer by the conductive layer 444 disposed on the hole wall of the outer hole V2. The conductor 420 is electrically connected to ground for connection to the second ground terminal 210B of the electronic component 200 to form a ground loop. In short, the signal terminal 410A is electrically connected to the conductive layer 443A at the signal via 441A1, and the ground terminal 410B is electrically connected to the ground layer 442 via the conductive layer 443 at the ground via 441A2. The conductive layer 444 is disposed on the hole wall of the outer hole V2 and electrically connected to the ground layer 442. The first conductive layer 443A is disposed on the hole wall of the inner hole V1 and electrically connected to the signal terminal 410A, and the ground terminal 410B is further connected to the signal terminal 410B. The conductive layer 443 at a via is electrically connected to the ground layer 442. In addition, between the inner hole V1 and the outer hole V2, an insulating material such as a hole-filling glue or other related structure is disposed to form an open circuit between the inner hole V1 and the outer hole V2. According to this, it was formed The structure of the coaxial cable allows for impedance control and impedance matching with the connector.

圖13是本揭露另一實施例的一種連接器局部剖面圖。圖14是圖13的連接器的局部俯視圖。與上述實施例不同的是，本實施例的連接器600並不具有位在外孔V2的導電層444，但其仍能藉由隔離孔(Anti-pad)結構而在第一導電層443A與接地層442之間形成電性斷路，並於他處(例如：接地通孔441A2、第二通孔441B或第二導體420)電性導通而達到與上述相同的接地效果。換句話說，本實施例是以多個第二通孔441B相對於第一通孔441A而形成同軸孔組T1。 Figure 13 is a partial cross-sectional view showing a connector of another embodiment of the present disclosure. Figure 14 is a partial plan view of the connector of Figure 13; Different from the above embodiment, the connector 600 of the present embodiment does not have the conductive layer 444 located in the outer hole V2, but it can still be connected to the first conductive layer 443A by an anti-pad structure. An electrical disconnection is formed between the formations 442, and is electrically conducted at other places (for example, the ground via 441A2, the second via 441B, or the second conductor 420) to achieve the same grounding effect as described above. In other words, in the present embodiment, the coaxial hole group T1 is formed with respect to the first through hole 441A by the plurality of second through holes 441B.

基於上述，從圖11至圖14所述實施例可知，本揭露所述的連接器，其可藉由搭配不同結構的基板而達到所欲之效果。 Based on the above, it can be seen from the embodiment shown in FIG. 11 to FIG. 14 that the connector of the present disclosure can achieve the desired effect by combining substrates of different structures.

圖15是本揭露另一實施例的一種連接器的局部剖面圖。本實施例的連接器500包括第一絕緣體530A與第二絕緣體530B，分別配置在基板440的相對兩表面S3、S4，而第一導體410分別陣列配置在第一絕緣體530A內與第二絕緣體530B內，且第二導體420也分別陣列配置在第一絕緣體530A內與第二絕緣體530B內，其中第二導體420電性連接至接地層442，其餘結構均已揭露於圖11，在此便不再贅述，僅就不同處予以說明。 Figure 15 is a partial cross-sectional view showing a connector of another embodiment of the present disclosure. The connector 500 of the present embodiment includes a first insulator 530A and a second insulator 530B disposed on opposite surfaces S3 and S4 of the substrate 440, respectively, and the first conductors 410 are respectively arranged in the first insulator 530A and the second insulator 530B. The second conductors 420 are also respectively disposed in the first insulator 530A and the second insulator 530B, wherein the second conductor 420 is electrically connected to the ground layer 442, and the rest of the structure is disclosed in FIG. Again, only the differences are explained.

與前述圖11的實施例不同的是，導電層配置於通孔的側壁並延伸至基板440的相對兩表面S3、S4，位於第一絕緣體530A內的部分第一導體410經由通孔及其上的導電層而電性連接至位於第二絕緣體530B內的第一導體410，而位於第一絕緣體530A內與第二絕緣體530B內的另一部分第一導體410電性連接至接地層442。即在於本實施例是以第一、第二絕緣體530A、530B同時配置在基板440的不同表面，且配置在第一、第二絕緣體530A、530B中的第一導體410與第二導體420均能藉由基板440的結構特徵作為電性導通的介面。換句話說，本實施例的連接器500具有不同位置(即不同表面S3、S4)的連接介面，以讓不同電子元件能以表面S3處的連接介面或表面S4處的連接介面與連接器500電性連接，並以連接器500作為橋樑而讓不同電子元件進行訊號傳輸及共用接地迴路，亦即本實施例的連接器存在轉接的效果。 Different from the foregoing embodiment of FIG. 11, the conductive layer is disposed on the sidewall of the through hole and extends to the opposite surfaces S3, S4 of the substrate 440, and a portion of the first conductor 410 located in the first insulator 530A passes through the through hole and thereon. Conductive layer and electrically connected in place The first conductor 410 in the second insulator 530B is electrically connected to the ground layer 442 in the first insulator 530A and another portion of the first conductor 410 in the second insulator 530B. That is, in this embodiment, the first and second insulators 530A, 530B are simultaneously disposed on different surfaces of the substrate 440, and the first conductor 410 and the second conductor 420 disposed in the first and second insulators 530A, 530B can The structural features of the substrate 440 serve as an electrically conductive interface. In other words, the connector 500 of the present embodiment has connection interfaces at different positions (ie, different surfaces S3, S4) to allow different electronic components to interface with the interface at the surface S3 or the interface S4 at the surface S4 and the connector 500. Electrically connected, and the connector 500 is used as a bridge to allow different electronic components to transmit signals and share a ground loop, that is, the connector of the embodiment has the effect of switching.

綜上所述，在本揭露的上述實施例中，藉由將第一導體與第二導體配置在絕緣體內，且讓每個第一導體旁均存在至少一第二導體，因此在連接器與電子元件對接，並以第一導體進行高速訊號傳輸時，第二導體能對不同通道處的第一導體形成屏蔽效果，以阻擋其串音干擾。 In summary, in the above embodiment of the present disclosure, the first conductor and the second conductor are disposed in the insulator, and at least one second conductor is disposed adjacent to each of the first conductors, thereby When the electronic components are docked and the high-speed signal is transmitted by the first conductor, the second conductor can shield the first conductor at different channels to block the crosstalk interference.

再者，藉由導體片配置在絕緣體上，而讓部分第一導體、第二導體與導體片電性導通而形成接地迴路，藉以提高連接器的接地效果，其中絕緣體的凹槽與導體片的開口可依據電子元件的接地端子與訊號端子的配置位置而對應設置，而更可藉由在導體片的開口處形成翼部而與電子元件的接地端子相互抵接以達到所需的接地效果。 Furthermore, by disposing the conductor piece on the insulator, a part of the first conductor and the second conductor are electrically connected to the conductor piece to form a ground loop, thereby improving the grounding effect of the connector, wherein the groove of the insulator and the conductor piece are The opening may be correspondingly arranged according to the grounding terminal of the electronic component and the position of the signal terminal, and may be abutted with the grounding terminal of the electronic component by forming a wing at the opening of the conductor piece to achieve a desired grounding effect.

另外，連接器藉由基板所具有的接地層而能達到另一種接地效果，並據此讓絕緣體配置在基板的至少一表面上，而得以提高連接器的適用範圍。 In addition, the connector can achieve another type by the ground layer of the substrate. The grounding effect, and accordingly, the insulator is disposed on at least one surface of the substrate, thereby improving the range of application of the connector.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧連接器 100‧‧‧Connector

110‧‧‧第一導體 110‧‧‧First conductor

110A‧‧‧第一訊號端子 110A‧‧‧First signal terminal

110B‧‧‧第一接地端子 110B‧‧‧First grounding terminal

112‧‧‧第一部件 112‧‧‧ first part

114‧‧‧第二部件 114‧‧‧ second part

120‧‧‧第二導體 120‧‧‧second conductor

130‧‧‧絕緣體 130‧‧‧Insulator

132‧‧‧凹槽 132‧‧‧ Groove

140‧‧‧導體片 140‧‧‧Conductor

142‧‧‧開口 142‧‧‧ openings

142A‧‧‧第一開口 142A‧‧‧first opening

142B‧‧‧第二開口 142B‧‧‧ second opening

200‧‧‧電子元件 200‧‧‧Electronic components

210‧‧‧連接端子 210‧‧‧Connecting terminal

210A‧‧‧第二訊號端子 210A‧‧‧second signal terminal

210B‧‧‧第二接地端子 210B‧‧‧Second ground terminal

300‧‧‧電路板 300‧‧‧ boards

Claims

一種連接器，適於電性連接一電子元件，該連接器包括：一絕緣體，該絕緣體具有多個凹槽；多個第一導體，陣列配置在該絕緣體內，該些第一導體對應配置在至少部分該些凹槽的側壁上；以及多個第二導體，陣列配置在該絕緣體內，該些第二導體配置在相鄰的該些凹槽之間，其中相鄰的二該第一導體之間存在至少一該第二導體；其中該些第一導體作為連接端子以與該電子元件電性連接。 A connector for electrically connecting an electronic component, the connector comprising: an insulator having a plurality of grooves; a plurality of first conductors, the array being disposed in the insulator, the first conductors being correspondingly disposed At least a portion of the sidewalls of the recesses; and a plurality of second conductors disposed in the insulator, the second conductors being disposed between adjacent ones of the recesses, wherein adjacent ones of the first conductors There is at least one second conductor between the two; wherein the first conductors serve as connection terminals to be electrically connected to the electronic component.

如申請專利範圍第1項所述的連接器，其中該些第一導體以一第一陣列配置在該絕緣體內，該些第二導體以一第二陣列配置在該絕緣體內，且該第一陣列與該第二陣列彼此交錯穿插設置。 The connector of claim 1, wherein the first conductors are disposed in the insulator in a first array, and the second conductors are disposed in the insulator in a second array, and the first The array and the second array are interleaved with each other.

如申請專利範圍第1項所述的連接器，其中該些第一導體以一第三陣列配置在該絕緣體內，該些第二導體以一第四陣列配置在該絕緣體內，且該第三陣列與該第四陣列一致且被該第四陣列所涵蓋。 The connector of claim 1, wherein the first conductors are disposed in the insulator in a third array, the second conductors are disposed in the insulator in a fourth array, and the third The array is consistent with and encompassed by the fourth array.

如申請專利範圍第1項所述的連接器，其中在任意相鄰之兩行或任意相鄰兩列的該些第一導體之間，該些第二導體形成一柵狀結構。 The connector of claim 1, wherein the second conductors form a grid structure between the adjacent conductors of any two adjacent rows or any two adjacent columns.

如申請專利範圍第1項所述的連接器，其中各該第一導體包括彼此分離的一第一部件與一第二部件，該電子元件的多個端子適於分別被夾持在對應的該第一部件與該第二部件之間而與該連接器電性連接。 The connector of claim 1, wherein each of the first conductors comprises a first component and a second component separated from each other, the plurality of terminals of the electronic component being adapted to be respectively clamped in the corresponding one Between the first component and the second component The connector is electrically connected.

如申請專利範圍第5項所述的連接器，其中該第一部件與該第二部件形成一錐體的至少局部，且該錐體朝向該電子元件呈漸開狀。 The connector of claim 5, wherein the first member and the second member form at least a portion of a cone, and the cone is flared toward the electronic component.

如申請專利範圍第1項所述的連接器，還包括：一導體片，配置在該絕緣體上，該導體片具有多個開口以分別對應該些凹槽，該些第二導體延伸貫穿該絕緣體以暴露出來，而與該導體片接觸並電性導通，該電子元件的多個端子分別穿過該些開口而與至少部分該些第一導體電性連接。 The connector of claim 1, further comprising: a conductor piece disposed on the insulator, the conductor piece having a plurality of openings respectively corresponding to the grooves, the second conductor extending through the insulator The plurality of terminals of the electronic component are electrically connected to the at least a portion of the first conductors through the openings.

如申請專利範圍第7項所述的連接器，其中該些第一導體包含多個第一訊號端子與多個第一接地端子，該些開口包含多個第一開口與多個第二開口，各該第一訊號端子所對應的該第一開口大於各該第一接地端子所對應的該第二開口，以使各該第一接地端子延伸貫穿該絕緣體而接觸並電性導通該導體片，且各該第一訊號端子延伸貫穿該絕緣體至對應的該第一開口。 The connector of claim 7, wherein the first conductor comprises a plurality of first signal terminals and a plurality of first ground terminals, the openings comprising a plurality of first openings and a plurality of second openings, The first opening corresponding to each of the first signal terminals is larger than the second opening corresponding to each of the first ground terminals, so that the first ground terminals extend through the insulator to contact and electrically conduct the conductive piece. And each of the first signal terminals extends through the insulator to the corresponding first opening.

如申請專利範圍第7項所述的連接器，其中該導體片還具有多個翼部，該些翼部分別從該些開口的邊緣朝向該些開口的中心延伸，而該電子元件包括多個第二接地端子，在該電子元件電性連接該連接器時，該些第二接地端子電性抵接於該些翼部。 The connector of claim 7, wherein the conductor piece further has a plurality of wings, the wings extending from the edges of the openings toward the centers of the openings, and the electronic component comprises a plurality of The second ground terminal electrically abuts the wing portions when the electronic component is electrically connected to the connector.

一種連接器，適於電性連接一電子元件，包括：一基板，具有至少一接地層；至少一絕緣體，配置在該基板的至少一表面上，該絕緣體具有多個凹槽；多個第一導體，陣列配置在該絕緣體內，該些第一導體對應配置在至少部分該些凹槽的側壁上；以及多個第二導體，陣列配置在該絕緣體內，該些第二導體配置在相鄰的該些凹槽之間，其中相鄰的二該第一導體之間存在至少一該第二導體；其中該些第一導體作為連接端子以與該電子元件電性連接，且該些第二導體電性連接該接地層。 A connector for electrically connecting an electronic component, comprising: a substrate having at least one ground layer; at least one insulator disposed on at least one surface of the substrate, the insulator a plurality of recesses; a plurality of first conductors disposed in the insulator, the first conductors correspondingly disposed on at least a portion of the sidewalls of the recesses; and a plurality of second conductors disposed in the insulator The second conductors are disposed between the adjacent ones of the plurality of recesses, wherein at least one of the second conductors is present between the adjacent two of the first conductors; wherein the first conductors serve as connection terminals to The components are electrically connected, and the second conductors are electrically connected to the ground layer.

如申請專利範圍第10項所述的連接器，其中該基板包括多個通孔、多個導電層，以及彼此層疊的多個絕緣層與多個接地層，部分絕緣層形成該基板的相對兩表面，該些接地層夾層於該些絕緣層之間，該些通孔貫穿該些絕緣層與該些接地層，該些導電層配置於該些通孔的側壁並延伸至該基板的該表面。 The connector of claim 10, wherein the substrate comprises a plurality of through holes, a plurality of conductive layers, and a plurality of insulating layers and a plurality of ground layers stacked on each other, and the partial insulating layers form opposite sides of the substrate The grounding layer is interposed between the insulating layers, the through holes penetrating the insulating layer and the grounding layers, and the conductive layers are disposed on the sidewalls of the through holes and extend to the surface of the substrate .

如申請專利範圍第11項所述的連接器，其中該些通孔包含一第一通孔與環繞該第一通孔的多個第二通孔，該些第二導體經由位於該些第二通孔處的該些導電層而電性連接至該接地層。 The connector of claim 11, wherein the through holes comprise a first through hole and a plurality of second through holes surrounding the first through hole, and the second conductors are located at the second The conductive layers at the vias are electrically connected to the ground layer.

如申請專利範圍第12項所述的連接器，其中該些第一導體包含為多個訊號端子與多個接地端子，而該些第一通孔包含多個訊號通孔與多個接地通孔，且各訊號通孔與相鄰的該些第二通孔電性斷路，該些訊號端子電性連接至該些訊號通孔處的該些導電層，該些接地端子經由該些接地通孔處的該些導電層而電性連接至該些接地層。 The connector of claim 12, wherein the first conductors comprise a plurality of signal terminals and a plurality of ground terminals, and the first through holes comprise a plurality of signal vias and a plurality of ground vias And each of the signal vias is electrically disconnected from the adjacent second vias, and the signal terminals are electrically connected to the conductive layers at the signal vias, and the ground terminals pass through the ground vias The conductive layers are electrically connected to the ground layers.

如申請專利範圍第12項所述的連接器，其中該些第一導體包含為多個訊號端子與多個接地端子，而該些第一通孔包含多個訊號通孔與多個接地通孔，各該訊號通孔包含彼此同軸但電性斷路的一外孔與一內孔，部分導電層配置於該外孔的孔壁而電性導通於該些接地層，部分導電層配置於該內孔的孔壁而電性導通於該些訊號端子，而該些接地端子經由另一部分該些第一通孔處的該些導電層而電性連接至該些接地層。 The connector of claim 12, wherein the first conductors comprise a plurality of signal terminals and a plurality of ground terminals, and the first through holes comprise a plurality of signal vias and a plurality of ground vias Each of the signal vias includes an outer hole and an inner hole that are coaxial but electrically disconnected from each other, and a portion of the conductive layer is disposed on the hole wall of the outer hole and electrically connected to the ground layer, and a portion of the conductive layer is disposed therein The hole walls of the holes are electrically connected to the signal terminals, and the ground terminals are electrically connected to the ground layers via the conductive layers at the other portions of the first through holes.

如申請專利範圍第10項所述的連接器，包括一第一絕緣體與一第二絕緣體，分別配置在該基板的相對兩表面，該些第一導體分別陣列地配置在該第一絕緣體內與該第二絕緣體內，該些第二導體分別陣列地配置在該第一絕緣體內與該第二絕緣體內，其中該些第二導體電性連接該接地層。 The connector of claim 10, comprising a first insulator and a second insulator respectively disposed on opposite surfaces of the substrate, wherein the first conductors are respectively arrayed in the first insulator and In the second insulator, the second conductors are respectively arranged in the first insulator and the second insulator, and the second conductors are electrically connected to the ground layer.

如申請專利範圍第15項所述的連接器，其中該基板具有多個通孔與多個導電層，該些導電層配置於該些通孔的側壁並延伸至該基板的相對兩表面，位於該第一絕緣體內的部分該些第一導體經由部分該些通孔及其上的該些導電層而電性連接至位於該第二絕緣體內的部分該些第一導體，而位於該第一絕緣體內與該第二絕緣體內的另一部分該些第一導體電性連接至該接地層。 The connector of claim 15 , wherein the substrate has a plurality of through holes and a plurality of conductive layers disposed on sidewalls of the through holes and extending to opposite surfaces of the substrate a portion of the first conductor in the first insulator is electrically connected to the portion of the first conductor located in the second insulator via a portion of the through holes and the conductive layers thereon, and is located at the first The first conductors are electrically connected to the ground layer in another portion of the second insulator.

如申請專利範圍第10項所述的連接器，其中該些第一導體以一第一陣列配置在該絕緣體內，該些第二導體以一第二陣列配置在該絕緣體內，且該第一陣列與該第二陣列彼此交錯穿插設置。 The connector of claim 10, wherein the first conductors are disposed in the insulator in a first array, and the second conductors are disposed in the insulator in a second array, and the first The array and the second array are interleaved with each other.

如申請專利範圍第10項所述的連接器，其中該些第一導體以一第三陣列配置在該絕緣體內，該些第二導體以一第四陣列配置在該絕緣體內，且該第三陣列與該第四陣列一致且被該第四陣列所涵蓋。 The connector of claim 10, wherein the first conductors are disposed in the insulator in a third array, the second conductors are disposed in the insulator in a fourth array, and the third The array is consistent with and encompassed by the fourth array.

如申請專利範圍第10項所述的連接器，其中在任意相鄰之兩行或任意相鄰兩列的該些第一導體之間，該些第二導體形成一柵狀結構。 The connector of claim 10, wherein the second conductors form a grid structure between the adjacent ones of any two adjacent rows or any two adjacent columns.

如申請專利範圍第10項所述的連接器，其中各該第一導體包括彼此分離的一第一部件與一第二部件，該電子元件的多個端子適於分別被夾持在對應的該第一部件與該第二部件之間而與該連接器電性連接。 The connector of claim 10, wherein each of the first conductors comprises a first component and a second component separated from each other, the plurality of terminals of the electronic component being adapted to be respectively clamped in the corresponding one The first component and the second component are electrically connected to the connector.

如申請專利範圍第20項所述的連接器，其中該第一部件與該第二部件形成一錐體的至少局部。且該錐體朝向該電子元件呈漸開狀。 The connector of claim 20, wherein the first component and the second component form at least a portion of a cone. And the cone is in an open shape toward the electronic component.