WO2023233966A1 - Coil component, and filter circuit including same - Google Patents

Coil component, and filter circuit including same Download PDF

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Publication number
WO2023233966A1
WO2023233966A1 PCT/JP2023/017872 JP2023017872W WO2023233966A1 WO 2023233966 A1 WO2023233966 A1 WO 2023233966A1 JP 2023017872 W JP2023017872 W JP 2023017872W WO 2023233966 A1 WO2023233966 A1 WO 2023233966A1
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Prior art keywords
conductor
coil
conductors
laminated
laminate
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PCT/JP2023/017872
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French (fr)
Japanese (ja)
Inventor
隆梓 宮本
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株式会社村田製作所
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Publication of WO2023233966A1 publication Critical patent/WO2023233966A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/09—Filters comprising mutual inductance

Definitions

  • the present disclosure relates to a coil component and a filter circuit including the same.
  • noise countermeasures are taken using filter circuits that include coil components.
  • a filter circuit uses a capacitor, which is a capacitance element, so that the noise suppression effect is reduced by the equivalent series inductance (ESL), which is the parasitic inductance of the capacitor.
  • ESL equivalent series inductance
  • Patent Document 1 JP 2020-31118 A discloses a first coil consisting of a first spiral conductor and a second spiral conductor, and a second coil consisting of a third spiral conductor and a fourth spiral conductor. A common mode noise filter is disclosed.
  • a second coil is sandwiched between a first spiral conductor and a second spiral conductor that constitute the first coil, and a third spiral conductor that constitutes the second coil. and the fourth spiral conductor is smaller than the interval between the first spiral conductor and the third spiral conductor and the interval between the second spiral conductor and the fourth spiral conductor.
  • An object of the present disclosure is to provide a coil component that can improve the magnetic coupling force between a first coil and a second coil while reducing parasitic capacitance, and a filter circuit including the same. .
  • a coil component includes an insulator having a pair of principal surfaces facing each other, two or more first conductors forming a first coil, and three or more first conductors forming a second coil. 2 conductors, the first conductor and the second conductor are laminated in parallel to the pair of main surfaces of the insulator, and the first coil and the second coil are wound with a winding axis normal to the pair of main surfaces. are arranged so that the openings of the first coil and the second coil face at least a portion of each other, the insulator includes a first laminated portion and a second laminated portion, and the first laminated portion faces the first laminated portion.
  • the second laminated portion includes a portion where two or more second conductors are laminated adjacent to each other in the lamination direction with respect to one conductor, and the second laminated portion is a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction.
  • the first conductor and second conductor included in the first laminated part the conductor disposed in the layer on the second laminated part side, and the first conductor and the second conductor included in the second laminated part.
  • the distance between the conductors arranged in the layer on the side of the first laminated portion is greater than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion.
  • a filter circuit includes the above-described coil component and a capacitor connected to the coil component.
  • a coil component capable of reducing parasitic capacitance while improving magnetic coupling force between a first coil and a second coil, and a filter circuit including the same. be able to.
  • FIG. 2 is a transparent perspective view of a coil component according to the present embodiment.
  • FIG. 2 is a transparent plan view of a coil component according to the present embodiment.
  • FIG. 2 is a perspective view for explaining the wiring pattern of the coil component according to the present embodiment.
  • FIG. 3 is a plan view of a coil included in the coil component according to the present embodiment.
  • FIG. 2 is a transparent side view of a coil component according to the present embodiment.
  • FIG. 2 is a conceptual diagram for explaining the order in which conductors are laminated in a laminate.
  • FIG. 2 is a circuit diagram of a filter circuit including a coil component according to the present embodiment. It is a conceptual diagram which shows the modification 1 regarding the lamination order of a conductor in a laminated body.
  • FIG. 7 is a conceptual diagram showing a fourth modification regarding the order of stacking conductors in a laminate.
  • FIG. 1 is a transparent perspective view of a coil component 100 according to the present embodiment.
  • FIG. 2 is a transparent plan view of the coil component 100 according to this embodiment.
  • FIG. 3 is a perspective view for explaining the wiring pattern of the coil component 100 according to this embodiment.
  • FIG. 4 is a plan view of coils L1 and L2 included in coil component 100 according to this embodiment.
  • the long side direction of the coil component 100 is the X direction
  • the short side direction is the Y direction
  • the height direction is the Z direction.
  • the coil component 100 includes a coil L1 and a coil L2.
  • the coil component 100 is composed of a laminate (insulator) 3 of ceramic layers.
  • a substrate ceramic green sheet
  • a wiring pattern of a coil L1 (first coil) and a coil L2 (second coil) is formed is laminated on the laminate 3.
  • the stacking direction of the ceramic layers is the Z direction, and the direction of the arrow indicates the upper layer direction.
  • the laminate 3 has a pair of main surfaces facing each other and a plurality of side surfaces connecting the pair of main surfaces.
  • first principal surface the top surface of the laminate 3
  • second principal surface the bottom surface
  • principal surface Sometimes referred to as the "principal surface.”
  • an electrode 4a (first electrode) is provided on one side (first side), and an electrode 4b (second electrode) is provided on the other side (second side). electrodes) are provided. Of the two side surfaces on the short side, an electrode 4c (third electrode) is provided on one side (third side), and an electrode 4d (fourth electrode) is provided on the other side (fourth side). It is being As shown in FIGS. 1 and 2, the electrodes 4a to 4d are provided so as to extend from the side surface of the stacked body 3 to the first main surface and the second main surface.
  • the coil L1 and the coil L2 are arranged so that the winding axes are oriented in the normal direction to the main surface of the laminate 3, and the openings of the coil L1 and the coil L2 are mutually arranged. They overlap and are magnetically coupled.
  • the coil L1 is composed of conductors 10a to 10c laminated in the Z-axis direction in the laminate 3.
  • the coil L2 is composed of conductors 20a to 20c laminated in the Z-axis direction in the laminate 3. In this way, the coil L1 and the coil L2 are composed of a plurality of conductors 10a to 10c and 20a to 20c laminated in parallel to the main surface of the laminate 3.
  • the conductors 10a, 10b, 10c forming the coil L1 may be referred to as the conductor 10
  • the conductors 20a, 20b, 20c forming the coil L2 may be referred to as the conductor 20.
  • the conductors 10 and 20 may be collectively referred to as a conductor (10, 20).
  • conductors 20a and 20b of the conductors 20a to 20c forming the coil L2 are stacked between the conductor 10a and the conductor 10b forming the coil L1.
  • the conductor 20c constituting the coil L2 is stacked adjacent to the conductor 10c.
  • the wiring pattern of the coils L1 and L2 will be explained with reference to FIG. 3.
  • the coils L1 and L2 are formed of conductors 10 and 20 formed on six layers of ceramic green sheets in the laminate 3.
  • FIG. 3 shows the wiring patterns of the conductors 10 and 20 included in each of the six layers.
  • Each wiring pattern is formed, for example, by printing conductive paste (Ni paste) on a ceramic green sheet, which is a substrate, by a screen printing method.
  • the laminate 3 is thus formed by laminating multiple layers of ceramic green sheets, which are substrates. Each layer constituting the laminate 3 is made of the same material. In this way, each layer of the laminate 3 is made of the same material, so after the lamination process of the laminate 3 is completed, during the batch firing process, the laminate 3 may peel or crack due to the difference in thermal expansion coefficient. This can prevent the possibility of this occurring.
  • the coil L1 is composed of a conductor 10a placed in the first layer, a conductor 10b placed in the fourth layer, and a conductor 10c placed in the fifth layer.
  • the coil L2 includes a conductor 20a placed in the second layer, a conductor 20b placed in the third layer, and a conductor 20c placed in the sixth layer.
  • the connecting portion 63a of the conductor 10b and the connecting portion 63b of the conductor 10c are connected by a via conductor 53.
  • the connecting portion 64a of the conductor 10b and the connecting portion 64b of the conductor 10c are connected by the via conductor 54.
  • the connecting portion 61a of the conductor 20a and the connecting portion 61b of the conductor 20b are connected by a via conductor 51.
  • the connecting portion 62a of the conductor 20a and the connecting portion 62b of the conductor 20b are connected by the via conductor 52.
  • Conductors 20a and 20b, which constitute a part of the coil L2 are sandwiched between the conductor 10a and the conductor 10b, which constitute a part of the coil L1. Further, conductors 10b and 10c, which constitute a part of the coil L1, are sandwiched between conductors 20b and 20c, which constitute a part of the coil L2. In this way, in the laminate 3, the conductor 20 forming part of the coil L2 is sandwiched between the plurality of conductors 10 forming part of the coil L1, and the conductor 20 forming part of the coil L2 is sandwiched between the plurality of conductors 10 forming part of the coil L1. A conductor 10, which constitutes a part of the coil L1, is sandwiched between the conductors 20 of the coil L1.
  • the wiring pattern of the conductor 10a and the conductor 10b is common.
  • the wiring pattern of the conductor 20b and the conductor 20c is common.
  • the wiring pattern of the conductor 20b and the conductor 20c is a pattern obtained by inverting the wiring pattern of the conductor 10a and the conductor 10b.
  • the wiring pattern of the conductor 20a is a pattern obtained by turning the conductor 10c upside down.
  • the conductors 10a to 10c and the conductors 20a to 20c are stacked in the laminate 3 so that the virtual lines V1 and V1 shown in FIG. 3 penetrate through the centers of the openings of the coils L1 and L2. Therefore, the coil L1 and the coil L2 are arranged so that the openings thereof face in the normal direction to the main surface of the laminate 3. Further, as shown in FIG. 2, when the laminate 3 is viewed from the normal direction to the main surface, the opening pattern of the coil L1 and the opening pattern of the coil L2 are common.
  • each of the coil L1 and the coil L2 has a single-loop coil shape.
  • each of the conductors 10a to 10c has a single loop coil shape of the coil L1
  • each of the conductors 20a to 20c has a coil shape of a single loop.
  • Each has a single loop coil shape of coil L2.
  • an end 91a of the conductor 10a and an end 91b of the conductor 10b are connected to the electrode 4a.
  • An end 93a of the conductor 10a and an end 93c of the conductor 10b are connected to the electrode 4c.
  • An end 92a of the conductor 20b and an end 92b of the conductor 20c are connected to the electrode 4b.
  • An end 93b of the conductor 20b and an end 93d of the conductor 20c are connected to the electrode 4c.
  • the coil L1 includes a conductor 10b formed by a first wiring pattern and a conductor 10c formed by a second wiring pattern.
  • Coil L2 includes a conductor 20b formed by a third wiring pattern and a conductor 20a formed by a fourth wiring pattern.
  • the conductor 10b formed by the first wiring pattern is connected to the electrode 4a at an end 91b, and connected to the electrode 4c at an end 93b.
  • the conductor 10c formed by the second wiring pattern is connected to the conductor 10b formed by the first wiring pattern through via conductors 53 and 54.
  • the conductor 20b formed by the third wiring pattern is connected to the electrode 4b at an end 92a, and connected to the electrode 4c at an end 93b.
  • the conductor 20a formed by the fourth wiring pattern is connected to the conductor 20b formed by the third wiring pattern through via conductors 51 and 52.
  • the end 91a of the conductor 10a and the end 91b of the conductor 10b constitute a first end of the coil L1.
  • the end 93a of the conductor 10a and the end 93c of the conductor 10b constitute a second end of the coil L1.
  • the end 92a of the conductor 20b and the end 92b of the conductor 20c constitute a first end of the coil L2.
  • the end 93b of the conductor 20b and the end 93d of the conductor 20c constitute a second end of the coil L2.
  • connection point between the coil L1 and the coil L2 exists at the electrode 4c.
  • the distance from the connection point between coil L1 and coil L2 to electrode 4c is zero.
  • the connection point between the coil L1 and the coil L2 will also be referred to as an "intermediate connection point.”
  • the ends 93a, 93c of the coil L1 and the ends 93b, 93d of the coil L2 are located at positions where they overlap with each other. It is located in
  • the electrode 4c includes an intermediate connection point between the coil L1 and the coil L2. As shown in FIG. 4, when applying a voltage to the electrode 4a, the current flowing from the electrode 4a (In) flows from the ends 91a, 91b of the coil L1 to the ends 93a, 93c, and reaches the electrode 4c. It flows into the ends 93b and 93d of the coil L1 via the electrode 4c. The current that has flowed into the ends 93b, 93d of the coil L2 flows to the ends 92a, 92b of the coil L2, and reaches the electrode 4b (Out). In this case, the electrode 4a functions as an In terminal, the electrode 4b functions as an Out terminal, and the electrode 4c functions as an intermediate connection terminal.
  • the coil component 100 In the coil component 100, current flows in parallel circuits in the conductors 10a to 10c and the conductors 20a to 20c laminated in multiple layers. Therefore, the coil component 100 can handle large currents.
  • the conductor 10b and the conductor 10c are connected by the via conductors 53, 54, so that the conductor 10c and the electrodes 4a, 4c are electrically connected via the via conductors 53, 54 and the conductor 10b. (See Figures 1 and 3). Thereby, in order to establish conduction between the conductor 10c and the electrodes 4a, 4c, there is no need to draw out both ends of the conductor 10c and connect them to the electrodes 4a, 4c like the conductor 10b.
  • conductor 20a and electrodes 4b, 4c are electrically connected via via conductors 51, 52 and conductor 20b by connecting conductor 20a and conductor 20b with via conductors 51, 52. (See Figures 1 and 3).
  • Both ends of the conductor 10c may be drawn out and connected to the electrodes 4a, 4c.
  • both ends of the conductor 20a may be drawn out and connected to the electrodes 4a, 4c.
  • via conductors 51 to 54 are unnecessary.
  • the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c increases.
  • the ends are may become close to each other, and peeling may easily occur in the laminate 3.
  • conductor 10b and conductor 10c are connected by via conductors 53 and 54, and conductor 20a and conductor 20b are connected by via conductors 51 and 52.
  • peeling of the laminate 3 can be prevented during the manufacturing process of the laminate 3.
  • both ends of the conductor 10c may be connected to the electrodes 4a, 4c, and both ends of the conductor 20a may be connected to the electrodes 4a, 4c.
  • FIG. 5 is a transparent side view of the coil component 100 according to the present embodiment.
  • FIG. 6 is a conceptual diagram for explaining the lamination order of the conductors 10 and 20 in the laminate 3. As shown in FIG.
  • FIG. 6 is a simplified side view of the side view shown in FIG. 5 from the viewpoint of conceptually explaining the lamination order of the conductors 10 and 20 in the laminate 3. Therefore, in FIG. 5, the connection points of the conductors 10 and 20 to the electrodes 4c and 4d and the via conductors 51 to 54 are not shown.
  • the laminated portion 11 includes a conductor 10a that constitutes a part of the coil L1, and conductors 20a and 20b that constitute a part of the coil L2.
  • the laminated portion 21 includes conductors 10b and 10c that constitute a part of the coil L1, and a conductor 20c that constitutes a part of the coil L2.
  • the laminate 3 includes the laminate section 11 (first laminate section) and the laminate section 21 (second laminate section) in which two or more conductors (10, 20) are stacked.
  • the conductor 20a and the conductor 20b are connected by via conductors 51 and 52.
  • the conductor 10b and the conductor 10c are connected by via conductors 53 and 54.
  • the laminated portion 11 and the laminated portion 21 both include conductors (10, 20) laminated in three layers.
  • the conductors 10 and 20 are arranged in each of the laminated portion 11 and the laminated portion 21 so that the conductor 10 forming part of the coil L1 and the conductor 20 forming part of the coil L2 are included.
  • the mutual inductance coupling force between the coil L1 and the coil L2 can be strengthened.
  • the conductor 10a forming part of the coil L1 is arranged in the uppermost layer of the laminated part 11, and the conductor 20c forming part of the coil L2 is arranged in the lowermost layer of the laminated part 21. It is located.
  • the laminated portion 11 includes a portion in which two or more conductors 20 (20a, 20b) are laminated adjacent to the conductor 10 (10a) in the lamination direction, and the laminated portion 21 includes the conductor 10 (10c) and the conductor 20. (20c) are stacked adjacent to each other in the stacking direction.
  • the stacked portion 21 includes a portion where three conductors (10b, 10c, 20c) including the conductor 10 and the conductor 20 are stacked adjacent to each other in the stacking direction.
  • the conductor 20b is arranged in the layer on the laminated part 21 side, and the conductor 20b is arranged in the layer on the laminated part 11 side among the conductors 10 and 20 included in the laminated part 21.
  • the distance d1 between the conductors 10b and the conductor 10b is greater than the distance d2 between the adjacent conductors (10, 20) in the laminated portion 11 and the distance d2 between the adjacent conductors (10, 20) in the laminated portion 21.
  • the distance between the laminated portions 11 and 21 is widened so that d1 is wider than d2. More specifically, the distance (d2) between the conductors (10, 20) is made as narrow as possible, while the distance (d1) between the laminated portions 11 and 21 is made as narrow as possible while taking into account the magnetic coupling force. ).
  • This provides a coil component 100 that can improve the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that may occur between the laminated part 11 and the laminated part 21. be able to.
  • the laminated body 3 is used in which the distance between adjacent conductors (10, 20) in the laminated portion 11 and the distance between adjacent conductors (10, 20) in the laminated portion 21 are both adjusted to d2. I gave an example.
  • the distance between the adjacent conductors (10, 20) in the laminated portion 11 and the distance between the adjacent conductors (10, 20) in the laminated portion 21 are shorter than d1
  • the distance between the adjacent conductors (10, 20) in the laminated portion 11 is shorter than d1.
  • the spacing between the conductors (10, 20) and the spacing between adjacent conductors (10, 20) in the laminated portion 21 may be different.
  • the spacing between adjacent conductors (10, 20) within the layer section 11 does not have to be the same.
  • the distance between the conductor 10a and the conductor 20a may be different from the distance between the conductor 20a and the conductor 20b.
  • the distance between the conductor 10b and the conductor 10c and the distance between the conductor 10c and the conductor 20c may be made different.
  • the magnetic coupling force between the coils L1 and L2 can be finely adjusted. For example, when the distance between the two conductors 10b and 10c is shortened, the magnetic coupling force between the conductors 10b and 10c increases. As a result, the self-inductance of the coil L1 can be increased.
  • a part of the coil L1 and the coil L2 is By stacking the layers and forming two sets, it is possible to reduce the parasitic capacitance that occurs when obtaining the same M.
  • FIG. 7 is a circuit diagram of filter circuit 1 including coil component 100 according to this embodiment.
  • the filter circuit 1 is, for example, an EMI removal filter, and is a third-order T-type LC filter circuit.
  • a coil component 100 is used in this filter circuit 1.
  • a third-order T-type LC filter circuit is used as the configuration of the filter circuit 1, but a fifth-order T-type LC filter circuit or a higher-order T-type LC filter circuit may be used.
  • the coil component 100 having a similar configuration can also be applied to the above.
  • the filter circuit 1 to which the coil component 100 is applied includes a capacitor C1.
  • the coil component 100 includes a capacitor C due to parasitic capacitance generated in the coil L1 and the coil L2, which are connected in parallel to the coil L1 and the coil L2. If a capacitor C is placed in parallel with such a coil L1 and a coil L2, noise in a high frequency band that is originally intended to be removed through the capacitor C1 described later passes through the capacitor C, resulting in insufficient noise removal. Therefore, it is desirable to suppress such a capacitor C as much as possible.
  • the capacitor C1 is connected to the coil component 100.
  • the capacitor C1 has one end connected to an electrode 4c that constitutes an intermediate connection point between the coil L1 and the coil L2, and the other end connected to the GND wiring.
  • the capacitor C1 is constituted by, for example, a multilayer ceramic capacitor mainly composed of BaTiO3 (barium titanate).
  • a multilayer ceramic capacitor mainly composed of other materials may be used.
  • other types of capacitors such as an aluminum electrolytic capacitor may be used as the capacitor C1.
  • the capacitor C1 has an inductor L3 as a parasitic inductance (equivalent series inductance (ESL)). As shown in FIG. 7, capacitor C1 is represented by a circuit configuration in which inductor L3 is connected in series with capacitor C1a. Note that the capacitor C1 may be configured so that the parasitic resistance (equivalent series resistance (ESR)) is equivalent to a circuit configuration in which the inductor L3 and the capacitor C1a are connected in series.
  • ESR Equivalent series resistance
  • the coil L1 and the coil L2 are magnetically coupled, producing a negative inductance component (-M) in series with the capacitor C1.
  • This negative inductance component is shown as an inductor of -M in FIG.
  • This negative inductance component can cancel the parasitic inductance (inductor L3) of the capacitor C1.
  • the parasitic inductance component of the capacitor C1 can be made smaller in appearance.
  • a filter circuit 1 composed of a capacitor C1, a coil L1, and a coil L2 cancels out the parasitic inductance of the capacitor C1 with a negative inductance component due to the mutual inductance between the coil L1 and the coil L2, thereby reducing the noise damping effect in the high frequency band. can be improved.
  • the intermediate connection point between the coil L1 and the coil L2 is present at the electrode 4c.
  • neither the coil L1 nor the coil L2 is provided with a wiring pattern extending from the intermediate connection point between the coil L1 and the coil L2 to the electrode 4c. Therefore, compared to the conventional configuration in which a wiring pattern is provided from the intermediate connection point between the coil L1 and the coil L2 to the electrode 4c, the distance of the wiring pattern does not change due to manufacturing variations, so the parasitic inductance It is possible to prevent variations in the size of the components. Since the coil component 100 according to the present embodiment is not provided with an extra wiring pattern that causes variations in the magnitude of the parasitic inductance component, there is no parasitic inductance component that depends on the wiring pattern.
  • the coil component 100 it is possible to reduce the effort and cost required to maximize accuracy in order to suppress such variations. Therefore, according to the present embodiment, it is possible to provide a coil component that can prevent variations in the size of parasitic inductor components and a filter circuit including the coil component.
  • the coil component 100 when used as a component for removing noise from a power line and current is caused to flow from the electrode 4a to the electrode 4b, the current flowing inside the laminate 3 passes through the electrode 4c outside the laminate 3. At this time, compared to the conventional pattern in which the current continues to flow inside the laminate 3, the electrode 4c exhibits a heat dissipation function, and the heat generated by the current is dissipated in the electrode 4c. Therefore, the heat dissipation effect of the coil component 100 can be improved.
  • the coil component 100 has the effect of simplifying the procedure for testing continuity of the electrodes 4a to 4c and the coils L1 and L2.
  • a conventional coil component in which a wiring pattern is provided from the intermediate connection point between coil L1 and coil L2 to electrode 4c, it is not possible to test the continuity between coil L1 and coil L2 by simply testing the continuity between electrode 4a and electrode 4b. It is not possible to confirm that there is no problem in conduction between the intermediate connection point and the electrode 4c. Since another wire is inserted between the intermediate connection point between the coil L1 and the coil L2 and the electrode 4c, it is necessary to inspect the disconnection state of this other wire and the connection state between this other wire and the electrode 4c. .
  • the electrode 4c corresponding to the intermediate connection terminal functions as a conduction line that connects the coil L1 and the coil L2. Therefore, in the coil component 100, by testing the continuity between the electrodes 4a and 4b, it is possible to complete the continuity test of the electrodes 4a to 4c and the coils L1 and L2.
  • the electrodes 4a and 4b function as mounting terminals connected in series to the power line. That is, the electrode 4a and the electrode 4b are constituted by mounting terminals.
  • the size of the mounting terminals can be made larger compared to the case where the electrodes 4a and 4b are provided on the short sides of the laminate 3. can do.
  • the heat generated in the mounting portion can be sufficiently dissipated by the width of the electrode.
  • the ends 91a and 91b of the coil L1 are arranged on the electrode 4a, which is wide on the long side of the laminate 3, and the width on the long side of the laminate 3 is wide.
  • the ends 92a and 92b of the coil L2 are arranged on the wide electrode 4b, it is also possible to form a coil with a large opening by taking advantage of the distance from one end of the long side to the other end.
  • the coil component 100 is not limited to this, and may have a square shape without long sides or short sides, or may have a circular or elliptical shape instead of a substantially rectangular parallelepiped. Good too. By making the coil circular, there are no locally high current density areas within the conductor forming the coil, so failures due to heat generation are less likely to occur even in applications where large currents flow.
  • FIG. 8 is a conceptual diagram showing a first modification regarding the stacking order of the conductors 10 and 20 in the stacked body 301.
  • the laminate 301 according to Modification 1 corresponds to an example in which one conductor 10 is added to the uppermost layer of the laminate part 11 of the laminate 3 and one conductor 10 is removed from the laminate part 21 of the laminate 3.
  • the laminate section 11 is composed of four layers of conductors 10 and 20, and the laminate section 21 is composed of two layers of conductors 10 and 20.
  • each of the laminate portion 11 and the laminate portion 21 includes a conductor 10 constituting a part of the coil L1 and a conductor 20 constituting a part of the coil L2.
  • Conductors 10 and 20 are arranged.
  • the conductor 10a forming part of the coil L1 is arranged in the uppermost layer of the laminated part 11, and the conductor 10a forming part of the coil L2 is arranged in the lowermost layer of the laminated part 21.
  • a conductor 20c is arranged.
  • the interval between the laminate portions 11 and 21 is widened so that d1 is wider than d2.
  • Modification 1 it is possible to reduce the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21, and to improve the magnetic coupling force between the coil L1 and the coil L2. be.
  • the number of layers in the laminate portion 11 and the number of layers in the laminate portion 21 are different. In this way, by making the number of layers of the laminated portion 11 and the number of layers of the laminated portion 21 different, it is possible to finely adjust the value of the self-inductance of each of the coils L1 and L2. As a result, it is also possible to finely adjust the mutual inductance of the coils L1 and L2.
  • FIG. 9 is a conceptual diagram showing a second modification regarding the stacking order of the conductors 10 and 20 in the stacked body 302.
  • the laminate 302 according to Modification 2 corresponds to an example in which one conductor 10 is removed from the laminate portion 21 of the laminate 3.
  • the configuration of the laminated portion 11 of the laminated body 302 is the same as the configuration of the laminated portion 11 of the laminated body 3.
  • the laminate section 11 is composed of three layers of conductors 10 and 20
  • the laminate section 21 is composed of two layers of conductors 10 and 20.
  • the laminated portion 11 and the laminated portion 21 each include the conductor 10 constituting a part of the coil L1 and the conductor 20 constituting a part of the coil L2.
  • Conductors 10 and 20 are arranged.
  • a conductor 10a constituting a part of the coil L1 is arranged in the uppermost layer of the laminated part 11, and a part of the coil L2 is arranged in the lowermost layer of the laminated part 21.
  • a constituting conductor 20c is arranged.
  • the interval between the laminate portions 11 and 21 is widened so that d1 is wider than d2.
  • Modification 2 it is possible to improve the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21. be.
  • the number of layers in the laminate section 11 and the number of layers in the laminate section 21 are different.
  • the number of layers of the laminated portion 11 and the number of layers of the laminated portion 21 are different.
  • FIG. 10 is a conceptual diagram showing a third modification regarding the stacking order of the conductors 10 and 20 in the stacked body 303.
  • a laminate 303 according to Modification 3 includes a laminate section 11, a laminate section 21, and a laminate section 31 including a combination of conductors 10 and 20.
  • the distance between the laminated portion 11 and the laminated portion 21 and the distance between the laminated portion 21 and the laminated portion 31 are each d1.
  • the laminated structure of the laminated body 303 according to the third modification corresponds to a structure in which a laminated part is added between the laminated part 11 and the laminated part 21 in the laminated body 3 of FIG. 6 described as the present embodiment.
  • the two conductors 20 (20a, 20b) are laminated next to the conductor 10 (10a) in the laminated part 11, and the conductor 10 (10c) is laminated in the laminated part 21.
  • the conductor 20 (20c) and the conductor 20 (20c) are stacked adjacent to each other.
  • the distance d1 between the laminated portion 11 and the laminated portion 21 is greater than the distance d2 between adjacent conductors (10, 20) in the laminated portion 11 and the distance d2 between adjacent conductors (10, 20) in the laminated portion 21.
  • the two conductors 20 (20c, 20d) are stacked next to the conductor 10 (10c) in the stacked part 21, and the conductor 10 (10e) is stacked in the stacked part 31.
  • the conductor 20 (20e) and the conductor 20 (20e) are stacked adjacent to each other.
  • the distance d1 between the laminated portion 21 and the laminated portion 31 is greater than the distance d2 between adjacent conductors (10, 20) in the laminated portion 11 and the distance d2 between adjacent conductors (10, 20) in the laminated portion 21.
  • the laminated part may be composed of conductors (10, 20) laminated in four or more layers.
  • the distance between adjacent conductors (10, 20) in the laminated portion 11, the distance between adjacent conductors (10, 20) in the laminated portion 21, and the distance between adjacent conductors (10, 20) in the laminated portion 31. may be designed at any interval as long as it is shorter than d1.
  • the distance between adjacent conductors in the laminated portion 11 and the laminated portion 21 and the distance between adjacent conductors in the laminated portion 21 and the laminated portion 31 do not have to be the same d1, and are smaller than the distance between the conductors in each laminated portion. It is fine as long as it is a long distance.
  • the distance between the laminate portions 11 and 21 and the distance between the laminate portions 21 and 31 are adjusted so that d1 is wider than d2. widening the interval.
  • FIG. 11 is a conceptual diagram showing a fourth modification regarding the stacking order of the conductors 10 and 20 in the stacked body 304.
  • a laminate 304 according to modification 4 is an example in which one conductor 10 is added to the top layer of the laminate section 11 of the laminate 3, and one conductor 20 is added to the bottom layer of the laminate section 21 of the laminate 3. Applies to.
  • both the laminate section 11 and the laminate section 21 are composed of four layers of conductors 10 and 20.
  • the conductors 10a, 10b and the conductors 20a, 20b are laminated in the laminated part 11, and the conductors 10c, 10d and the conductors 20c, 20d are laminated in the laminated part 21.
  • the lamination pattern of the conductors 10 and 20 in the lamination part 11 and the lamination pattern of the conductors 10 and 20 in the lamination part 21 are common. That is, in the laminate 304 according to the fourth modification, the conductors 10 are laminated in the upper two layers of both the laminated portion 11 and the laminated portion 21, and the conductors 20 are laminated in the lower two layers.
  • the stacking order of the conductor 10 and the conductor 20 in the stacked part 11 is the same as the stacked order of the conductor 10 and the conductor 20 in the stacked part 21. In this way, by standardizing the lamination order of the conductor 10 and the conductor 20 in the plurality of laminated parts 11 and 21, it is possible to reduce the incidence of manufacturing defects.
  • Modifications 1 to 4 have been explained in order.
  • the laminated parts 11 and 21 of Modifications 1 to 4 the case where the maximum number of conductors 10 or 20 that can be successively laminated is two has been described.
  • the conductors 10 or 20 may be stacked such that the maximum number of conductors 10 or 20 that can be consecutively stacked is three or more.
  • a conductor 20 may be additionally placed under the lowest layer conductor 20 (20b) in the laminated portion 11.
  • a conductor 20 may be additionally placed under the conductor 20 in the lowest layer of each of the laminated parts 11, 21, and 31.
  • the conductor (10, 20) in the lowest layer of the laminated portion 11 is different from the conductor (10, 20) in the uppermost layer of the laminated portion 21.
  • the conductor 20 is arranged at the lowest layer of the laminated section 11 shown in FIG. 6, and the conductor 10 is arranged at the uppermost layer of the laminated section 21 shown in FIG.
  • the conductor 10 (or the conductor 20) may be placed in both the lowest layer of the laminated portion 11 and the highest layer of the laminated portion 21.
  • each of coil L1 and coil L2 constitutes a single loop
  • each of conductors 10a-10c constitutes a single loop of coil L1
  • each of conductors 20a-20c constitutes a single loop of coil L2.
  • At least one of the coil L1 and the coil L2 may be configured in a spiral loop pattern.
  • a single loop of the coil L1 may be configured by connecting the conductors 10a to 10c in series
  • a single loop of the coil L2 may be configured by connecting the conductors 20a to 20c in series.
  • the coil component described in Paragraph 1 includes an insulator having a pair of principal surfaces facing each other, two or more first conductors forming a first coil, and three or more first conductors forming a second coil. three or more second conductors, the first conductor and the second conductor are laminated in parallel to the pair of main surfaces of the insulator, the first coil, and the three or more second conductors of the plurality of conductors.
  • the first coil and the second coil are arranged such that their winding axes are oriented in the normal direction to the pair of principal surfaces, and the openings of each of the first coil and the second coil are
  • the insulator includes a first laminated portion and a second laminated portion, and the first laminated portion has two or more second conductors adjacent to each other in the lamination direction with respect to the first conductor.
  • the second laminated portion includes a laminated portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction, and the second laminated portion includes a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction.
  • the distance between the conductor placed in the layer on the second laminated part side and the conductor placed in the layer on the first laminated part side among the first conductor and second conductor included in the second laminated part is the first
  • the distance between adjacent conductors in the laminated portion is greater than the distance between adjacent conductors in the laminated portion and the distance between adjacent conductors in the second laminated portion.
  • the second laminated portion includes a portion where three conductors including a first conductor and a second conductor are laminated adjacent to each other in the lamination direction.
  • each of the first coil and the second coil has a single-loop coil shape when the insulator is viewed from the normal direction.
  • each of the two or more first conductors has a coil shape of a single loop of the first coil
  • each of the three or more second conductors has a coil shape of a single loop of the second coil.
  • the plurality of side surfaces include a first side surface, a second side surface, and a third side surface
  • the plurality of electrodes include a first electrode provided on the first side surface and a second electrode provided on the second side surface.
  • the first coil includes a first conductor configured by the first wiring pattern, and a first conductor configured by the second wiring pattern
  • the second coil includes a first conductor configured by the first wiring pattern, and a first conductor configured by the second wiring pattern.
  • the first conductor configured by the first wiring pattern is connected to the first electrode and the third electrode.
  • the first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by the first via conductor
  • the second conductor formed by the third wiring pattern is connected to the first conductor formed by the first wiring pattern.
  • a second conductor connected to the electrode and the third electrode and formed by the fourth wiring pattern is connected to a second conductor formed by the third wiring pattern and a second via conductor.
  • the filter circuit of Item 7 includes the coil component according to any one of Items 1 to 6, and a capacitor connected to the coil component.

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Abstract

The present disclosure relates to a coil component (100) comprising an insulator (3) that has a pair of main surfaces facing mutually opposite directions, two or more first conductors (10a-10c) that form a first coil, and three or more second conductors (20a-20c) that form a second coil. The first and second conductors are layered parallel to the pair of main surfaces of the insulator. A first coil (L1) and a second coil (L2) are arranged such that winding axes thereof face a direction normal to the pair of main surfaces. Openings in each of the first coil (L1) and the second coil (L2) at least partially overlap one another. The insulator (3) is provided with a first layered part (11) and a second layered part (21), the first layered part (11) including a portion in which two or more of the second conductors (20a, 20b) are adjacently layered in a layering direction with respect to a first conductor (10a), and the second layered part (21) including a portion in which a first conductor (10c) and a second conductor (20c) are adjacently layered in the layering direction. The distance (d1) between a conductor (20b) that is included in the first layered part (11) and is positioned at a layer on a second-layered-part (21) side among the first conductors (10) and the second conductors (20), and a conductor (10b) that is included in the second layered part (21) and is positioned at a layer on a first-layered-part (11) side among the first conductors (10) and the second conductors (20) is greater than both the distance (d2) between adjacent conductors within the first layered part (11) and the distance (d2) between adjacent conductors within the second layered part (21).

Description

コイル部品、およびこれを含むフィルタ回路Coil parts and filter circuits containing them
　本開示は、コイル部品、およびこれを含むフィルタ回路に関する。 The present disclosure relates to a coil component and a filter circuit including the same.
　電子機器では、コイル部品を含むフィルタ回路などを用いたノイズ対策が行われる。一般に、フィルタ回路には、キャパシタンス素子であるコンデンサが用いられるため、コンデンサの寄生インダクタンスである等価直列インダクタンス（ESL：Equivalent　Series　Inductance）によりノイズ抑制効果が低下する。このようなコンデンサの等価直列インダクタンスＥＳＬを打ち消す機能を備えるコイル部品が知られている。 In electronic equipment, noise countermeasures are taken using filter circuits that include coil components. Generally, a filter circuit uses a capacitor, which is a capacitance element, so that the noise suppression effect is reduced by the equivalent series inductance (ESL), which is the parasitic inductance of the capacitor. Coil components having a function of canceling the equivalent series inductance ESL of such a capacitor are known.
　特開２０２０－３１１１８号公報（特許文献１）には、第１渦巻き状導体および第２渦巻き状導体からなる第１コイルと、第３渦巻き状導体および第４渦巻き状導体からなる第２コイルとを備えるコモンモードノイズフィルタが開示されている。 JP 2020-31118 A (Patent Document 1) discloses a first coil consisting of a first spiral conductor and a second spiral conductor, and a second coil consisting of a third spiral conductor and a fourth spiral conductor. A common mode noise filter is disclosed.
　特許文献１に記載のコモンモードノイズフィルタにおいては、第１コイルを構成する第１渦巻き状導体および第２渦巻き状導体間に第２コイルが挟み込まれ、第２コイルを構成する第３渦巻き状導体と第４渦巻き状導体との間隔が、第１渦巻き状導体と第３渦巻き状導体との間隔、および第２渦巻き状導体と第４渦巻き状導体との間隔より小さくなっている。 In the common mode noise filter described in Patent Document 1, a second coil is sandwiched between a first spiral conductor and a second spiral conductor that constitute the first coil, and a third spiral conductor that constitutes the second coil. and the fourth spiral conductor is smaller than the interval between the first spiral conductor and the third spiral conductor and the interval between the second spiral conductor and the fourth spiral conductor.
特開２０２０－３１１１８号公報JP2020-31118A
　特許文献１に記載のコモンモードノイズフィルタにおいては、第１コイルを構成する第１渦巻き状導体と第２コイルを構成する第３渦巻き状導体との間、および、第１コイルを構成する第２渦巻き状導体と第２コイルを構成する第４渦巻き状導体との間に広い間隔が設けられている。 In the common mode noise filter described in Patent Document 1, between the first spiral conductor that constitutes the first coil and the third spiral conductor that constitutes the second coil, and between the second spiral conductor that constitutes the first coil, A wide spacing is provided between the spiral conductor and the fourth spiral conductor constituting the second coil.
　このため、特許文献１に記載のコモンモードノイズフィルタによれば、寄生容量を減らすことができるものの、第１コイルと第２コイルとの間の磁気結合力が弱まるおそれがある。 Therefore, although the common mode noise filter described in Patent Document 1 can reduce parasitic capacitance, there is a risk that the magnetic coupling force between the first coil and the second coil may be weakened.
　本開示の目的は、寄生容量を低減させつつも、第１コイルと第２コイルとの間の磁気結合力を向上させることが可能なコイル部品、およびこれを含むフィルタ回路を提供することである。 An object of the present disclosure is to provide a coil component that can improve the magnetic coupling force between a first coil and a second coil while reducing parasitic capacitance, and a filter circuit including the same. .
　本開示の一形態に係るコイル部品は、互いに対向する一対の主面を有する絶縁体と、第１コイルを形成する２つ以上の第１導体と、第２コイルを形成する３つ以上の第２導体と、を備え、第１導体および第２導体は、絶縁体の一対の主面に平行に積層され、第１コイルおよび第２コイルは、一対の主面に対する法線方向に巻回軸が向くように配置され、第１コイルおよび第２コイルの各々の開口が少なくとも一部が重なっており、絶縁体は、第１積層部および第２積層部を備え、第１積層部は、第１導体に対して積層方向に隣り合って２以上の第２導体が積層された部分を含み、第２積層部は、第１導体と第２導体とが積層方向に隣り合って積層された部分を含み、第１積層部に含まれる第１導体および第２導体のうち第２積層部側の層に配置された導体と、第２積層部に含まれる第１導体および第２導体のうち第１積層部側の層に配置された導体との間隔は、第１積層部内において隣り合う導体の間隔および第２積層部内において隣り合う導体の間隔よりも離れている。 A coil component according to an embodiment of the present disclosure includes an insulator having a pair of principal surfaces facing each other, two or more first conductors forming a first coil, and three or more first conductors forming a second coil. 2 conductors, the first conductor and the second conductor are laminated in parallel to the pair of main surfaces of the insulator, and the first coil and the second coil are wound with a winding axis normal to the pair of main surfaces. are arranged so that the openings of the first coil and the second coil face at least a portion of each other, the insulator includes a first laminated portion and a second laminated portion, and the first laminated portion faces the first laminated portion. The second laminated portion includes a portion where two or more second conductors are laminated adjacent to each other in the lamination direction with respect to one conductor, and the second laminated portion is a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction. Among the first conductor and second conductor included in the first laminated part, the conductor disposed in the layer on the second laminated part side, and the first conductor and the second conductor included in the second laminated part, The distance between the conductors arranged in the layer on the side of the first laminated portion is greater than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion.
　本開示の一形態に係るフィルタ回路は、上記のコイル部品と、コイル部品に接続するコンデンサとを備える。 A filter circuit according to one embodiment of the present disclosure includes the above-described coil component and a capacitor connected to the coil component.
　本開示の一形態によれば、寄生容量を低減させつつも、第１コイルと第２コイルとの間の磁気結合力を向上させることが可能なコイル部品、およびこれを含むフィルタ回路を提供することができる。 According to one aspect of the present disclosure, there is provided a coil component capable of reducing parasitic capacitance while improving magnetic coupling force between a first coil and a second coil, and a filter circuit including the same. be able to.
本実施の形態に係るコイル部品の透過斜視図である。FIG. 2 is a transparent perspective view of a coil component according to the present embodiment. 本実施の形態に係るコイル部品の透過平面図である。FIG. 2 is a transparent plan view of a coil component according to the present embodiment. 本実施の形態に係るコイル部品の配線パターンを説明するための斜視図である。FIG. 2 is a perspective view for explaining the wiring pattern of the coil component according to the present embodiment. 本実施の形態に係るコイル部品に含まれるコイルの平面図である。FIG. 3 is a plan view of a coil included in the coil component according to the present embodiment. 本実施の形態に係るコイル部品の透過側面図である。FIG. 2 is a transparent side view of a coil component according to the present embodiment. 積層体における導体の積層順序を説明するための概念図である。FIG. 2 is a conceptual diagram for explaining the order in which conductors are laminated in a laminate. 本実施の形態に係るコイル部品を含むフィルタ回路の回路図である。FIG. 2 is a circuit diagram of a filter circuit including a coil component according to the present embodiment. 積層体における導体の積層順序に関する変形例１を示す概念図である。It is a conceptual diagram which shows the modification 1 regarding the lamination order of a conductor in a laminated body. 積層体における導体の積層順序に関する変形例２を示す概念図である。It is a conceptual diagram which shows the modification 2 regarding the lamination|stacking order of a conductor in a laminated body. 積層体における導体の積層順序に関する変形例３を示す概念図である。It is a conceptual diagram which shows the modification 3 regarding the lamination order of a conductor in a laminated body. 積層体における導体の積層順序に関する変形例４を示す概念図である。FIG. 7 is a conceptual diagram showing a fourth modification regarding the order of stacking conductors in a laminate.
　以下、本開示の実施の形態について、図面を参照しながら詳細に説明する。なお、図中同一または相当部分には同一符号を付してその説明は繰り返さない。 Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In addition, the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated.
　図１は、本実施の形態に係るコイル部品１００の透過斜視図である。図２は、本実施の形態に係るコイル部品１００の透過平面図である。図３は、本実施の形態に係るコイル部品１００の配線パターンを説明するための斜視図である。図４は、本実施の形態に係るコイル部品１００に含まれるコイルＬ１，Ｌ２の平面図である。 FIG. 1 is a transparent perspective view of a coil component 100 according to the present embodiment. FIG. 2 is a transparent plan view of the coil component 100 according to this embodiment. FIG. 3 is a perspective view for explaining the wiring pattern of the coil component 100 according to this embodiment. FIG. 4 is a plan view of coils L1 and L2 included in coil component 100 according to this embodiment.
　図１～図４では、コイル部品１００の長辺方向をＸ方向、短辺方向をＹ方向、高さ方向をＺ方向としている。 In FIGS. 1 to 4, the long side direction of the coil component 100 is the X direction, the short side direction is the Y direction, and the height direction is the Z direction.
　コイル部品１００は、コイルＬ１とコイルＬ２とを含む。コイル部品１００は、セラミック層の積層体（絶縁体）３で構成されている。積層体３には、コイルＬ１（第１コイル）およびコイルＬ２（第２コイル）の配線パターンを形成した基板（セラミックグリーンシート）が積層されている。セラミック層の積層方向はＺ方向であり、矢印の向きが上層方向を示している。 The coil component 100 includes a coil L1 and a coil L2. The coil component 100 is composed of a laminate (insulator) 3 of ceramic layers. A substrate (ceramic green sheet) on which a wiring pattern of a coil L1 (first coil) and a coil L2 (second coil) is formed is laminated on the laminate 3. The stacking direction of the ceramic layers is the Z direction, and the direction of the arrow indicates the upper layer direction.
　積層体３は、互いに対向する一対の主面、および前記一対の主面間を結ぶ複数の側面を有している。以下、互いに対向する一対の主面のうち、積層体３の上面を「第１主面」と称し、底面を「第２主面」と称する場合があり、互いに対向する一対の主面を単に「主面」と称する場合がある。 The laminate 3 has a pair of main surfaces facing each other and a plurality of side surfaces connecting the pair of main surfaces. Hereinafter, of the pair of principal surfaces facing each other, the top surface of the laminate 3 may be referred to as the "first principal surface" and the bottom surface may be referred to as the "second principal surface". Sometimes referred to as the "principal surface."
　積層体３の長辺側の２つの側面のうち、一方の側面（第１側面）には電極４ａ（第１電極）が設けられ、他方の側面（第２側面）には電極４ｂ（第２電極）が設けられている。短辺側の２つの側面のうち、一方の側面（第３側面）には電極４ｃ（第３電極）が設けられ、他方の側面（第４側面）には電極４ｄ（第４電極）が設けられている。図１および図２に示すように、電極４ａ～４ｄは、積層体３の側面から第１主面および第２主面に延在するように設けられる。 Of the two long side surfaces of the laminate 3, an electrode 4a (first electrode) is provided on one side (first side), and an electrode 4b (second electrode) is provided on the other side (second side). electrodes) are provided. Of the two side surfaces on the short side, an electrode 4c (third electrode) is provided on one side (third side), and an electrode 4d (fourth electrode) is provided on the other side (fourth side). It is being As shown in FIGS. 1 and 2, the electrodes 4a to 4d are provided so as to extend from the side surface of the stacked body 3 to the first main surface and the second main surface.
　図１～図３に示されるように、コイルＬ１およびコイルＬ２は、積層体３の主面に対する法線方向に巻回軸が向くように配置され、コイルＬ１およびコイルＬ２の各々の開口が互いに重なって磁気結合している。コイルＬ１は、積層体３においてＺ軸方向に積層された導体１０ａ～１０ｃにより構成されている。コイルＬ２は、積層体３においてＺ軸方向に積層された導体２０ａ～２０ｃにより構成されている。このように、コイルＬ１およびコイルＬ２は、積層体３の主面に平行に積層された複数の導体１０ａ～１０ｃ，２０ａ～２０ｃにより構成される。 As shown in FIGS. 1 to 3, the coil L1 and the coil L2 are arranged so that the winding axes are oriented in the normal direction to the main surface of the laminate 3, and the openings of the coil L1 and the coil L2 are mutually arranged. They overlap and are magnetically coupled. The coil L1 is composed of conductors 10a to 10c laminated in the Z-axis direction in the laminate 3. The coil L2 is composed of conductors 20a to 20c laminated in the Z-axis direction in the laminate 3. In this way, the coil L1 and the coil L2 are composed of a plurality of conductors 10a to 10c and 20a to 20c laminated in parallel to the main surface of the laminate 3.
　以下、コイルＬ１を構成する導体１０ａ，１０ｂ，１０ｃを導体１０と称する場合があり、コイルＬ２を構成する導体２０ａ，２０ｂ，２０ｃを導体２０と称する場合がある。また、導体１０，２０をまとめて導体（１０，２０）と称する場合がある。 Hereinafter, the conductors 10a, 10b, 10c forming the coil L1 may be referred to as the conductor 10, and the conductors 20a, 20b, 20c forming the coil L2 may be referred to as the conductor 20. Further, the conductors 10 and 20 may be collectively referred to as a conductor (10, 20).
　図１に示されるように、コイルＬ１を構成する導体１０ａと導体１０ｂとの間に、コイルＬ２を構成する導体２０ａ～２０ｃのうちの導体２０ａ，２０ｂが積層されている。コイルＬ２を構成する導体２０ｃは、導体１０ｃと隣り合う位置に積層されている。 As shown in FIG. 1, conductors 20a and 20b of the conductors 20a to 20c forming the coil L2 are stacked between the conductor 10a and the conductor 10b forming the coil L1. The conductor 20c constituting the coil L2 is stacked adjacent to the conductor 10c.
　図３を参照して、コイルＬ１，Ｌ２の配線パターンを説明する。コイルＬ１，Ｌ２は、積層体３において６層のセラミックグリーンシート上に形成された導体１０，２０によって形成されている。図３には、６層の各層に含まれる導体１０，２０の配線パターンが示されている。各配線パターンは、例えば、基板であるセラミックグリーンシートに、導電性ペースト（Ｎｉペースト）をスクリーン印刷法により印刷することにより形成される。 The wiring pattern of the coils L1 and L2 will be explained with reference to FIG. 3. The coils L1 and L2 are formed of conductors 10 and 20 formed on six layers of ceramic green sheets in the laminate 3. FIG. 3 shows the wiring patterns of the conductors 10 and 20 included in each of the six layers. Each wiring pattern is formed, for example, by printing conductive paste (Ni paste) on a ceramic green sheet, which is a substrate, by a screen printing method.
　積層体３は、このように、基板であるセラミックグリーンシートが複数層に積層されることにより形成されている。積層体３を構成する各層は、すべて同じ材料によって構成されている。このように、積層体３の各層は、同じ材料によって構成されているため、積層体３の積層工程が終了した後、一括焼成の工程において、熱膨張係数の違いで積層体３に剥がれや割れが発生するおそれを防止できる。 The laminate 3 is thus formed by laminating multiple layers of ceramic green sheets, which are substrates. Each layer constituting the laminate 3 is made of the same material. In this way, each layer of the laminate 3 is made of the same material, so after the lamination process of the laminate 3 is completed, during the batch firing process, the laminate 3 may peel or crack due to the difference in thermal expansion coefficient. This can prevent the possibility of this occurring.
　コイルＬ１は、第１層目に配置される導体１０ａと、第４層目に配置される導体１０ｂと、第５層目に配置される導体１０ｃとによって構成される。コイルＬ２は、第２層目に配置される導体２０ａと、第３層目に配置される導体２０ｂと、第６層目に配置される導体２０ｃとによって構成される。 The coil L1 is composed of a conductor 10a placed in the first layer, a conductor 10b placed in the fourth layer, and a conductor 10c placed in the fifth layer. The coil L2 includes a conductor 20a placed in the second layer, a conductor 20b placed in the third layer, and a conductor 20c placed in the sixth layer.
　導体１０ｂの接続部６３ａと導体１０ｃの接続部６３ｂとは、ビア導体５３によって接続されている。導体１０ｂの接続部６４ａと導体１０ｃの接続部６４ｂとは、ビア導体５４によって接続されている。 The connecting portion 63a of the conductor 10b and the connecting portion 63b of the conductor 10c are connected by a via conductor 53. The connecting portion 64a of the conductor 10b and the connecting portion 64b of the conductor 10c are connected by the via conductor 54.
　導体２０ａの接続部６１ａと導体２０ｂの接続部６１ｂとは、ビア導体５１によって接続されている。導体２０ａの接続部６２ａと導体２０ｂの接続部６２ｂとは、ビア導体５２によって接続されている。 The connecting portion 61a of the conductor 20a and the connecting portion 61b of the conductor 20b are connected by a via conductor 51. The connecting portion 62a of the conductor 20a and the connecting portion 62b of the conductor 20b are connected by the via conductor 52.
　コイルＬ１の一部を構成する導体１０ａおよび導体１０ｂの間に、コイルＬ２の一部を構成する導体２０ａ，２０ｂが挟まれている。さらに、コイルＬ２の一部を構成する導体２０ｂおよび２０ｃの間に、コイルＬ１の一部を構成する導体１０ｂ，１０ｃが挟まれている。このように、積層体３においては、コイルＬ１の一部を構成する複数の導体１０の間にコイルＬ２の一部を構成する導体２０が挟まれ、かつ、コイルＬ２の一部を構成する複数の導体２０の間にコイルＬ１の一部を構成する導体１０が挟まれている。 Conductors 20a and 20b, which constitute a part of the coil L2, are sandwiched between the conductor 10a and the conductor 10b, which constitute a part of the coil L1. Further, conductors 10b and 10c, which constitute a part of the coil L1, are sandwiched between conductors 20b and 20c, which constitute a part of the coil L2. In this way, in the laminate 3, the conductor 20 forming part of the coil L2 is sandwiched between the plurality of conductors 10 forming part of the coil L1, and the conductor 20 forming part of the coil L2 is sandwiched between the plurality of conductors 10 forming part of the coil L1. A conductor 10, which constitutes a part of the coil L1, is sandwiched between the conductors 20 of the coil L1.
　導体１０ａおよび導体１０ｂの配線パターンは共通している。導体２０ｂおよび導体２０ｃの配線パターンは共通している。導体２０ｂおよび導体２０ｃの配線パターンは、導体１０ａおよび導体１０ｂの配線パターンを裏返しにしたパターンである。導体２０ａの配線パターンは、導体１０ｃを裏返しにしたパターンである。 The wiring pattern of the conductor 10a and the conductor 10b is common. The wiring pattern of the conductor 20b and the conductor 20c is common. The wiring pattern of the conductor 20b and the conductor 20c is a pattern obtained by inverting the wiring pattern of the conductor 10a and the conductor 10b. The wiring pattern of the conductor 20a is a pattern obtained by turning the conductor 10c upside down.
　導体１０ａ～１０ｃおよび導体２０ａ～２０ｃは、図３に示される仮想線Ｖ１，Ｖ１がコイルＬ１，Ｌ２の開口中心を貫くように、積層体３に積層される。したがって、コイルＬ１およびコイルＬ２は、積層体３の主面に対する法線方向に開口が向くように配置される。また、図２に示されるように、主面に対する法線方向から積層体３を見た場合、コイルＬ１の開口パターンと、コイルＬ２の開口パターンとは、共通するものとなる。 The conductors 10a to 10c and the conductors 20a to 20c are stacked in the laminate 3 so that the virtual lines V1 and V1 shown in FIG. 3 penetrate through the centers of the openings of the coils L1 and L2. Therefore, the coil L1 and the coil L2 are arranged so that the openings thereof face in the normal direction to the main surface of the laminate 3. Further, as shown in FIG. 2, when the laminate 3 is viewed from the normal direction to the main surface, the opening pattern of the coil L1 and the opening pattern of the coil L2 are common.
　図４に示されるように、主面に対する法線方向から積層体３を見た場合、コイルＬ１およびコイルＬ２の各々は、シングルループのコイル形状を有する。さらに、図３に示されるように、主面に対する法線方向から積層体３を見た場合、導体１０ａ～１０ｃの各々は、コイルＬ１のシングルループのコイル形状を有し、導体２０ａ～２０ｃの各々は、コイルＬ２のシングルループのコイル形状を有する。 As shown in FIG. 4, when the laminate 3 is viewed from the normal direction to the main surface, each of the coil L1 and the coil L2 has a single-loop coil shape. Further, as shown in FIG. 3, when the laminate 3 is viewed from the normal direction to the main surface, each of the conductors 10a to 10c has a single loop coil shape of the coil L1, and each of the conductors 20a to 20c has a coil shape of a single loop. Each has a single loop coil shape of coil L2.
　図１に示されるように、導体１０ａの端部９１ａおよび導体１０ｂの端部９１ｂは、電極４ａと接続されている。導体１０ａの端部９３ａおよび導体１０ｂの端部９３ｃは、電極４ｃと接続されている。導体２０ｂの端部９２ａおよび導体２０ｃの端部９２ｂは、電極４ｂと接続されている。導体２０ｂの端部９３ｂおよび導体２０ｃの端部９３ｄは、電極４ｃと接続されている。 As shown in FIG. 1, an end 91a of the conductor 10a and an end 91b of the conductor 10b are connected to the electrode 4a. An end 93a of the conductor 10a and an end 93c of the conductor 10b are connected to the electrode 4c. An end 92a of the conductor 20b and an end 92b of the conductor 20c are connected to the electrode 4b. An end 93b of the conductor 20b and an end 93d of the conductor 20c are connected to the electrode 4c.
　コイルＬ１は、第１配線パターンにより構成される導体１０ｂ、および第２配線パターンにより構成される導体１０ｃを含む。コイルＬ２は、第３配線パターンにより構成される導体２０ｂ、および第４配線パターンにより構成される導体２０ａを含む。第１配線パターンにより構成される導体１０ｂは、端部９１ｂにおいて電極４ａと接続され、端部９３ｂにおいて電極４ｃと接続されている。第２配線パターンにより構成される導体１０ｃは、第１配線パターンにより構成される導体１０ｂとビア導体５３，５４によって接続されている。第３配線パターンにより構成される導体２０ｂは、端部９２ａにおいて電極４ｂと接続され、端部９３ｂにおいて電極４ｃと接続されている。第４配線パターンにより構成される導体２０ａは、第３配線パターンにより構成される導体２０ｂとビア導体５１，５２によって接続されている。 The coil L1 includes a conductor 10b formed by a first wiring pattern and a conductor 10c formed by a second wiring pattern. Coil L2 includes a conductor 20b formed by a third wiring pattern and a conductor 20a formed by a fourth wiring pattern. The conductor 10b formed by the first wiring pattern is connected to the electrode 4a at an end 91b, and connected to the electrode 4c at an end 93b. The conductor 10c formed by the second wiring pattern is connected to the conductor 10b formed by the first wiring pattern through via conductors 53 and 54. The conductor 20b formed by the third wiring pattern is connected to the electrode 4b at an end 92a, and connected to the electrode 4c at an end 93b. The conductor 20a formed by the fourth wiring pattern is connected to the conductor 20b formed by the third wiring pattern through via conductors 51 and 52.
　導体１０ａの端部９１ａおよび導体１０ｂの端部９１ｂにより、コイルＬ１の第１端部が構成される。導体１０ａの端部９３ａおよび導体１０ｂの端部９３ｃにより、コイルＬ１の第２端部が構成される。導体２０ｂの端部９２ａおよび導体２０ｃの端部９２ｂにより、コイルＬ２の第１端部が構成される。導体２０ｂの端部９３ｂおよび導体２０ｃの端部９３ｄにより、コイルＬ２の第２端部が構成される。 The end 91a of the conductor 10a and the end 91b of the conductor 10b constitute a first end of the coil L1. The end 93a of the conductor 10a and the end 93c of the conductor 10b constitute a second end of the coil L1. The end 92a of the conductor 20b and the end 92b of the conductor 20c constitute a first end of the coil L2. The end 93b of the conductor 20b and the end 93d of the conductor 20c constitute a second end of the coil L2.
　本実施の形態においては、コイルＬ１とコイルＬ２との接続点が電極４ｃに存在する。換言すると、本実施の形態においては、コイルＬ１とコイルＬ２との接続点から電極４ｃに至る距離がゼロである。以下、コイルＬ１とコイルＬ２との接続点を「中間接続点」とも称する。 In this embodiment, the connection point between the coil L1 and the coil L2 exists at the electrode 4c. In other words, in this embodiment, the distance from the connection point between coil L1 and coil L2 to electrode 4c is zero. Hereinafter, the connection point between the coil L1 and the coil L2 will also be referred to as an "intermediate connection point."
　図１および図２に示されるように、主面に対する法線方向から積層体３を見た場合、コイルＬ１の端部９３ａ，９３ｃと、コイルＬ２の端部９３ｂ，９３ｄとは、互いに重なる位置に配置されている。 As shown in FIGS. 1 and 2, when the laminate 3 is viewed from the normal direction to the main surface, the ends 93a, 93c of the coil L1 and the ends 93b, 93d of the coil L2 are located at positions where they overlap with each other. It is located in
　電極４ｃは、コイルＬ１とコイルＬ２との中間接続点を含む。図４に示されるように、電極４ａに電圧を印加する場合、電極４ａ（Ｉｎ）から流入した電流は、コイルＬ１の端部９１ａ，９１ｂから端部９３ａ，９３ｃに流れて電極４ｃに達し、電極４ｃを経由してコイルＬ１の端部９３ｂ，９３ｄに流入する。コイルＬ２の端部９３ｂ，９３ｄに流入した電流は、コイルＬ２の端部９２ａ，９２ｂに流れ、電極４ｂ（Ｏｕｔ）に達する。この場合、電極４ａは、Ｉｎ端子として機能し、電極４ｂはＯｕｔ端子として機能し、電極４ｃは、中間接続端子として機能する。 The electrode 4c includes an intermediate connection point between the coil L1 and the coil L2. As shown in FIG. 4, when applying a voltage to the electrode 4a, the current flowing from the electrode 4a (In) flows from the ends 91a, 91b of the coil L1 to the ends 93a, 93c, and reaches the electrode 4c. It flows into the ends 93b and 93d of the coil L1 via the electrode 4c. The current that has flowed into the ends 93b, 93d of the coil L2 flows to the ends 92a, 92b of the coil L2, and reaches the electrode 4b (Out). In this case, the electrode 4a functions as an In terminal, the electrode 4b functions as an Out terminal, and the electrode 4c functions as an intermediate connection terminal.
　図３に示されるとおり、本実施の形態では、導体１０ｂ，１０ｃの両端付近をビア導体５３，５４で接続し、導体２０ａ，２０ｂの両端付近をビア導体５１，５２で接続する。これにより、導体１０ｂ，１０ｃの並列回路と、導体２０ａ，２０ｂの並列回路とが構成される。 As shown in FIG. 3, in this embodiment, the vicinity of both ends of the conductors 10b and 10c are connected by via conductors 53 and 54, and the vicinity of both ends of the conductors 20a and 20b are connected by via conductors 51 and 52. This forms a parallel circuit of conductors 10b and 10c and a parallel circuit of conductors 20a and 20b.
　コイル部品１００では、複数層に積層された導体１０ａ～１０ｃおよび導体２０ａ～２０ｃにおいて、電流が並列回路を流れる。このため、コイル部品１００は、大電流に対応することができる。 In the coil component 100, current flows in parallel circuits in the conductors 10a to 10c and the conductors 20a to 20c laminated in multiple layers. Therefore, the coil component 100 can handle large currents.
　本実施の形態においては、導体１０ｂと導体１０ｃとをビア導体５３，５４によって接続することにより、ビア導体５３，５４および導体１０ｂを経由して導体１０ｃと電極４ａ，４ｃとを導通させている（図１および図３参照）。これにより、導体１０ｃと電極４ａ，４ｃとを導通させるために、導体１０ｃの両端部を導体１０ｂのように引き出して電極４ａ，４ｃへ接続する必要がない。 In this embodiment, the conductor 10b and the conductor 10c are connected by the via conductors 53, 54, so that the conductor 10c and the electrodes 4a, 4c are electrically connected via the via conductors 53, 54 and the conductor 10b. (See Figures 1 and 3). Thereby, in order to establish conduction between the conductor 10c and the electrodes 4a, 4c, there is no need to draw out both ends of the conductor 10c and connect them to the electrodes 4a, 4c like the conductor 10b.
　同様に、本実施の形態においては、導体２０ａと導体２０ｂとをビア導体５１，５２によって接続することにより、ビア導体５１，５２および導体２０ｂを経由して導体２０ａと電極４ｂ，４ｃとを導通させている（図１および図３参照）。これにより、導体２０ａと電極４ｂ，４ｃとを導通させるために、導体２０ａの両端部を導体２０ｂのように引き出して電極４ａ，４ｃへ接続する必要がない。 Similarly, in this embodiment, conductor 20a and electrodes 4b, 4c are electrically connected via via conductors 51, 52 and conductor 20b by connecting conductor 20a and conductor 20b with via conductors 51, 52. (See Figures 1 and 3). Thereby, in order to establish conduction between the conductor 20a and the electrodes 4b, 4c, there is no need to draw out both ends of the conductor 20a and connect them to the electrodes 4a, 4c like the conductor 20b.
　導体１０ｃの両端部を引き出して電極４ａ，４ｃへ接続してもよい。同様に、導体２０ａの両端部を引き出して電極４ａ，４ｃへ接続してもよい。この場合には、ビア導体５１～５４は不要となる。この場合、電極４ａ～４ｃに対して設ける必要のある導体（１０，２０）の端部の数が増大する。このように、電極４ａ～４ｃに対して設ける必要のある導体（１０，２０）の端部の数が増加すると、導体（１０，２０）を積層体３に積み重ねて押し固める際、端部同士が近接し積層体３で剥がれが生じやすくなることがある。 Both ends of the conductor 10c may be drawn out and connected to the electrodes 4a, 4c. Similarly, both ends of the conductor 20a may be drawn out and connected to the electrodes 4a, 4c. In this case, via conductors 51 to 54 are unnecessary. In this case, the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c increases. As described above, when the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c increases, when stacking the conductors (10, 20) in the laminate 3 and compacting them, the ends are may become close to each other, and peeling may easily occur in the laminate 3.
　そこで、本実施の形態においては、導体１０ｂと導体１０ｃとをビア導体５３，５４によって接続し、また、導体２０ａと導体２０ｂとをビア導体５１，５２によって接続している。これにより、電極４ａ～４ｃに対して設ける必要のある導体（１０，２０）の端部の数を少なくすることができる。その結果、積層体３の製造工程において積層体３に剥がれが生じることを防止できる。もちろん、製造する際に剥がれが生じにくいのであれば、導体１０ｃの両端部を電極４ａ，４ｃへ接続し、導体２０ａの両端部を電極４ａ，４ｃへ接続してもよい。 Therefore, in this embodiment, conductor 10b and conductor 10c are connected by via conductors 53 and 54, and conductor 20a and conductor 20b are connected by via conductors 51 and 52. This makes it possible to reduce the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c. As a result, peeling of the laminate 3 can be prevented during the manufacturing process of the laminate 3. Of course, if peeling does not easily occur during manufacturing, both ends of the conductor 10c may be connected to the electrodes 4a, 4c, and both ends of the conductor 20a may be connected to the electrodes 4a, 4c.
　図５は、本実施の形態に係るコイル部品１００の透過側面図である。図６は、積層体３における導体１０，２０の積層順序を説明するための概念図である。 FIG. 5 is a transparent side view of the coil component 100 according to the present embodiment. FIG. 6 is a conceptual diagram for explaining the lamination order of the conductors 10 and 20 in the laminate 3. As shown in FIG.
　図６は、積層体３における導体１０，２０の積層順序を概念的に説明する観点から、図５に示される側面図を簡略化した図面である。したがって、図５においては、電極４ｃ，４ｄへの導体１０，２０の接続箇所およびビア導体５１～５４の図示を省略している。 FIG. 6 is a simplified side view of the side view shown in FIG. 5 from the viewpoint of conceptually explaining the lamination order of the conductors 10 and 20 in the laminate 3. Therefore, in FIG. 5, the connection points of the conductors 10 and 20 to the electrodes 4c and 4d and the via conductors 51 to 54 are not shown.
　積層体３内には、導体１０，２０の組み合わせにより構成される積層部１１および積層部２１が存在する。積層部１１は、コイルＬ１の一部を構成する導体１０ａと、コイルＬ２の一部を構成する導体２０ａ，２０ｂとを含む。積層部２１は、コイルＬ１の一部の構成する導体１０ｂ，１０ｃと、コイルＬ２の一部を構成する導体２０ｃとを含む。このように、積層体３は、２以上の導体（１０，２０）が積層された積層部１１（第１積層部）および積層部２１（第２積層部）を備える。 Inside the laminate 3, there are a laminate section 11 and a laminate section 21 that are formed by a combination of the conductors 10 and 20. The laminated portion 11 includes a conductor 10a that constitutes a part of the coil L1, and conductors 20a and 20b that constitute a part of the coil L2. The laminated portion 21 includes conductors 10b and 10c that constitute a part of the coil L1, and a conductor 20c that constitutes a part of the coil L2. In this way, the laminate 3 includes the laminate section 11 (first laminate section) and the laminate section 21 (second laminate section) in which two or more conductors (10, 20) are stacked.
　図５に示されるように、積層部１１において、導体２０ａと導体２０ｂとはビア導体５１，５２により接続されている。積層部２１において、導体１０ｂと導体１０ｃとはビア導体５３，５４により接続されている。 As shown in FIG. 5, in the laminated portion 11, the conductor 20a and the conductor 20b are connected by via conductors 51 and 52. In the laminated portion 21, the conductor 10b and the conductor 10c are connected by via conductors 53 and 54.
　図５および図６に示されるように、積層部１１および積層部２１は、いずれも、３層に亘って積層された導体（１０，２０）を含んでいる。積層部１１および積層部２１の各々には、コイルＬ１の一部を構成する導体１０とコイルＬ２の一部を構成する導体２０とが含まれるように、導体１０，２０が配置されている。これにより、積層部１１および積層部２１のいずれにおいても、コイルＬ１とコイルＬ２との相互インダクタンスの結合力を強めることができる。 As shown in FIGS. 5 and 6, the laminated portion 11 and the laminated portion 21 both include conductors (10, 20) laminated in three layers. The conductors 10 and 20 are arranged in each of the laminated portion 11 and the laminated portion 21 so that the conductor 10 forming part of the coil L1 and the conductor 20 forming part of the coil L2 are included. Thereby, in both the laminated portion 11 and the laminated portion 21, the mutual inductance coupling force between the coil L1 and the coil L2 can be strengthened.
　特に、本実施の形態においては、積層部１１の最上位層にコイルＬ１の一部を構成する導体１０ａが配置され、積層部２１の最下位層にコイルＬ２の一部を構成する導体２０ｃが配置されている。 In particular, in the present embodiment, the conductor 10a forming part of the coil L1 is arranged in the uppermost layer of the laminated part 11, and the conductor 20c forming part of the coil L2 is arranged in the lowermost layer of the laminated part 21. It is located.
　積層部１１は、導体１０（１０ａ）に対して積層方向に隣り合って２以上の導体２０（２０ａ，２０ｂ）が積層された部分を含み、積層部２１は、導体１０（１０ｃ）と導体２０（２０ｃ）とが積層方向に隣り合って積層された部分を含む。積層部２１は、導体１０と導体２０とを含む３つの導体（１０ｂ，１０ｃ，２０ｃ）が積層方向に隣り合って積層された部分を含む。 The laminated portion 11 includes a portion in which two or more conductors 20 (20a, 20b) are laminated adjacent to the conductor 10 (10a) in the lamination direction, and the laminated portion 21 includes the conductor 10 (10c) and the conductor 20. (20c) are stacked adjacent to each other in the stacking direction. The stacked portion 21 includes a portion where three conductors (10b, 10c, 20c) including the conductor 10 and the conductor 20 are stacked adjacent to each other in the stacking direction.
　積層部１１に含まれる導体１０および導体２０のうち積層部２１側の層に配置された導体２０ｂと、積層部２１に含まれる導体１０および導体２０のうち積層部１１側の層に配置された導体１０ｂとの間隔ｄ１は、積層部１１内において隣り合う導体（１０，２０）の間隔ｄ２および積層部２１内において隣り合う導体（１０，２０）の間隔ｄ２よりも離れている。 Among the conductors 10 and 20 included in the laminated part 11, the conductor 20b is arranged in the layer on the laminated part 21 side, and the conductor 20b is arranged in the layer on the laminated part 11 side among the conductors 10 and 20 included in the laminated part 21. The distance d1 between the conductors 10b and the conductor 10b is greater than the distance d2 between the adjacent conductors (10, 20) in the laminated portion 11 and the distance d2 between the adjacent conductors (10, 20) in the laminated portion 21.
　本実施の形態では、ｄ２に比べてｄ１が広くなるように、積層部１１と積層部２１との間隔を広げている。より具体的には、導体（１０，２０）同士の間隔（ｄ２）をできるだけ狭くしつつ、積層部１１と積層部２１との間については、磁気結合力を考慮しつつも、できるだけ間隔（ｄ１）を離すようにしている。 In this embodiment, the distance between the laminated portions 11 and 21 is widened so that d1 is wider than d2. More specifically, the distance (d2) between the conductors (10, 20) is made as narrow as possible, while the distance (d1) between the laminated portions 11 and 21 is made as narrow as possible while taking into account the magnetic coupling force. ).
　これにより、積層部１１と積層部２１との間で発生し得る寄生容量を低減させつつも、コイルＬ１とコイルＬ２との間の磁気結合力を向上させることが可能なコイル部品１００を提供することができる。 This provides a coil component 100 that can improve the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that may occur between the laminated part 11 and the laminated part 21. be able to.
　なお、ここでは、積層部１１内において隣り合う導体（１０，２０）の間隔、および積層部２１内において隣り合う導体（１０，２０）の間隔が、いずれもｄ２に調整された積層体３を例示した。 Here, the laminated body 3 is used in which the distance between adjacent conductors (10, 20) in the laminated portion 11 and the distance between adjacent conductors (10, 20) in the laminated portion 21 are both adjusted to d2. I gave an example.
　しかし、積層部１１内において隣り合う導体（１０，２０）の間隔、および積層部２１内において隣り合う導体（１０，２０）の間隔は、ｄ１より短ければ、積層部１１内において隣り合う導体（１０，２０）の間隔と、積層部２１内において隣り合う導体（１０，２０）の間隔とが異なっていてもよい。 However, if the distance between the adjacent conductors (10, 20) in the laminated portion 11 and the distance between the adjacent conductors (10, 20) in the laminated portion 21 are shorter than d1, then the distance between the adjacent conductors (10, 20) in the laminated portion 11 is shorter than d1. The spacing between the conductors (10, 20) and the spacing between adjacent conductors (10, 20) in the laminated portion 21 may be different.
　層部１１内において隣り合う導体（１０，２０）の間隔は、同じでなくてもよい。例えば、導体１０ａと導体２０ａとの間隔と、導体２０ａと導体２０ｂとの間隔とを異ならせてもよい。同様に、導体１０ｂと導体１０ｃとの間隔と、導体１０ｃと導体２０ｃとの間隔とを異ならせてもよい。 The spacing between adjacent conductors (10, 20) within the layer section 11 does not have to be the same. For example, the distance between the conductor 10a and the conductor 20a may be different from the distance between the conductor 20a and the conductor 20b. Similarly, the distance between the conductor 10b and the conductor 10c and the distance between the conductor 10c and the conductor 20c may be made different.
　このように、導体１０，２０の間隔を様々に設計することにより、コイルＬ１、２の磁気結合力を細かく調整することができる。例えば、２つの導体１０ｂ，１０ｃの間隔を短くすると、導体１０ｂ，１０ｃ間の磁気結合力が高まる。その結果、コイルＬ１の自己インダクタンスを強めることができる。 In this way, by variously designing the spacing between the conductors 10 and 20, the magnetic coupling force between the coils L1 and L2 can be finely adjusted. For example, when the distance between the two conductors 10b and 10c is shortened, the magnetic coupling force between the conductors 10b and 10c increases. As a result, the self-inductance of the coil L1 can be increased.
　ここで、例えばコイルＬ１とコイルＬ２を１層ずつ一組とし、３組作成して２か所の間隔を広げる場合に比べ、本実施例のように、コイルＬ１やコイルＬ２の一部を２層積層し、２組とすることで、同じＭを得るのに発生する寄生容量を減らすことができる。 Here, for example, compared to the case where the coil L1 and the coil L2 are made into a set with one layer each and three sets are made and the interval between the two places is widened, as in this embodiment, a part of the coil L1 and the coil L2 is By stacking the layers and forming two sets, it is possible to reduce the parasitic capacitance that occurs when obtaining the same M.
　ここで、図７を参照して、本実施の形態に係るコイル部品１００が適用される回路の一例として、フィルタ回路１を説明する。図７は、本実施の形態に係るコイル部品１００を含むフィルタ回路１の回路図である。 Here, with reference to FIG. 7, a filter circuit 1 will be described as an example of a circuit to which the coil component 100 according to the present embodiment is applied. FIG. 7 is a circuit diagram of filter circuit 1 including coil component 100 according to this embodiment.
　フィルタ回路１は、例えば、ＥＭＩ除去フィルタであり、３次のＴ型ＬＣフィルタ回路である。このフィルタ回路１にコイル部品１００が用いられている。なお、以下の実施の形態では、フィルタ回路１の構成として３次のＴ型ＬＣフィルタ回路を用いて説明するが、５次のＴ型ＬＣフィルタ回路や、より高次のＴ型ＬＣフィルタ回路に対しても同様の構成のコイル部品１００を適用することができる。 The filter circuit 1 is, for example, an EMI removal filter, and is a third-order T-type LC filter circuit. A coil component 100 is used in this filter circuit 1. In the following embodiment, a third-order T-type LC filter circuit is used as the configuration of the filter circuit 1, but a fifth-order T-type LC filter circuit or a higher-order T-type LC filter circuit may be used. The coil component 100 having a similar configuration can also be applied to the above.
　図７に示すように、コイル部品１００が適用されるフィルタ回路１は、コンデンサＣ１を備えている。コイル部品１００は、コイルＬ１とコイルＬ２とに並列接続されたコイルＬ１とコイルＬ２に発生する寄生容量によるコンデンサＣを含む。このようなコイルＬ１とコイルＬ２に並列にコンデンサＣがあると、本来後述するコンデンサＣ１を通って除去したい高周波帯のノイズがコンデンサＣを通ってしまうため、ノイズ除去が不十分となってしまう。そのため、このようなコンデンサＣはできるだけ抑制する方が望ましい。 As shown in FIG. 7, the filter circuit 1 to which the coil component 100 is applied includes a capacitor C1. The coil component 100 includes a capacitor C due to parasitic capacitance generated in the coil L1 and the coil L2, which are connected in parallel to the coil L1 and the coil L2. If a capacitor C is placed in parallel with such a coil L1 and a coil L2, noise in a high frequency band that is originally intended to be removed through the capacitor C1 described later passes through the capacitor C, resulting in insufficient noise removal. Therefore, it is desirable to suppress such a capacitor C as much as possible.
　コンデンサＣ１は、コイル部品１００に接続される。コンデンサＣ１は、コイルＬ１およびコイルＬ２の中間接続点が構成される電極４ｃに一方の端部を接続し、ＧＮＤ配線に他方の端部を接続している。コンデンサＣ１は、例えば、BaTiO3(チタン酸バリウム)を主成分とした積層セラミックコンデンサにより構成される。コンデンサＣ１として、他の材料を主成分とした積層セラミックコンデンサを採用してもよい。例えば、コンデンサＣ１として、アルミ電解コンデンサなどの他の種類のコンデンサを採用してもよい。 The capacitor C1 is connected to the coil component 100. The capacitor C1 has one end connected to an electrode 4c that constitutes an intermediate connection point between the coil L1 and the coil L2, and the other end connected to the GND wiring. The capacitor C1 is constituted by, for example, a multilayer ceramic capacitor mainly composed of BaTiO3 (barium titanate). As the capacitor C1, a multilayer ceramic capacitor mainly composed of other materials may be used. For example, other types of capacitors such as an aluminum electrolytic capacitor may be used as the capacitor C1.
　コンデンサＣ１は、寄生インダクタンス（等価直列インダクタンス（ESL））としてインダクタＬ３を有している。図７に示されるように、コンデンサＣ１は、インダクタＬ３がキャパシタＣ１ａに直列に接続された回路構成によって表される。なお、コンデンサＣ１は、さらに寄生抵抗（等価直列抵抗（ESR））がインダクタＬ３およびキャパシタＣ１ａに直列に接続された回路構成と等価であるように構成してもよい。 The capacitor C1 has an inductor L3 as a parasitic inductance (equivalent series inductance (ESL)). As shown in FIG. 7, capacitor C1 is represented by a circuit configuration in which inductor L3 is connected in series with capacitor C1a. Note that the capacitor C1 may be configured so that the parasitic resistance (equivalent series resistance (ESR)) is equivalent to a circuit configuration in which the inductor L3 and the capacitor C1a are connected in series.
　コイルＬ１とコイルＬ２とは磁気結合しており、コンデンサＣ１と直列に負のインダクタンス成分（―Ｍ）を生じている。この負のインダクタンス成分を図７では－Ｍのインダクタとして示している。この負のインダクタンス成分によって、コンデンサＣ１の寄生インダクタンス（インダクタＬ３）を打ち消すことができる。これにより、コンデンサＣ１の寄生インダクタンス成分を見かけ上小さくすることができる。コンデンサＣ１、コイルＬ１およびコイルＬ２で構成されるフィルタ回路１は、コイルＬ１とコイルＬ２との相互インダクタンスによる負のインダクタンス成分で、コンデンサＣ１の寄生インダクタンスを打ち消すことにより、高周波帯のノイズ減衰効果を向上させることができる。 The coil L1 and the coil L2 are magnetically coupled, producing a negative inductance component (-M) in series with the capacitor C1. This negative inductance component is shown as an inductor of -M in FIG. This negative inductance component can cancel the parasitic inductance (inductor L3) of the capacitor C1. Thereby, the parasitic inductance component of the capacitor C1 can be made smaller in appearance. A filter circuit 1 composed of a capacitor C1, a coil L1, and a coil L2 cancels out the parasitic inductance of the capacitor C1 with a negative inductance component due to the mutual inductance between the coil L1 and the coil L2, thereby reducing the noise damping effect in the high frequency band. can be improved.
　本実施の形態においては、コイルＬ１とコイルＬ２との中間接続点が電極４ｃに存在している。換言すると、本実施の形態においては、コイルＬ１とコイルＬ２との中間接続点から電極４ｃに至る配線パターンがコイルＬ１およびコイルＬ２のいずれにも設けられていない。このため、コイルＬ１とコイルＬ２との中間接続点から電極４ｃに至る配線パターンを設ける従来の構成と比較して、その配線パターンの距離が製造ばらつきによって長短と変化することがないため、寄生インダクタンス成分の大きさにばらつきが生じてしまうことを防止できる。本実施の形態に係るコイル部品１００には、寄生インダクタンス成分の大きさのばらつきの要因となる余計な配線パターンが設けられていないため、配線パターンに依存する寄生インダクタンス成分が存在しない。 In this embodiment, the intermediate connection point between the coil L1 and the coil L2 is present at the electrode 4c. In other words, in the present embodiment, neither the coil L1 nor the coil L2 is provided with a wiring pattern extending from the intermediate connection point between the coil L1 and the coil L2 to the electrode 4c. Therefore, compared to the conventional configuration in which a wiring pattern is provided from the intermediate connection point between the coil L1 and the coil L2 to the electrode 4c, the distance of the wiring pattern does not change due to manufacturing variations, so the parasitic inductance It is possible to prevent variations in the size of the components. Since the coil component 100 according to the present embodiment is not provided with an extra wiring pattern that causes variations in the magnitude of the parasitic inductance component, there is no parasitic inductance component that depends on the wiring pattern.
　したがって、コイル部品１００の製造において、そのようなばらつきを抑えるために精度を極限まで高めるための労力やそのために必要とされるコストを抑えることができる。ゆえに、本実施の形態によれば、寄生インダクタ成分の大きさにばらつきが生じないようにすることが可能なコイル部品およびそれを含むフィルタ回路を提供することできる。 Therefore, in manufacturing the coil component 100, it is possible to reduce the effort and cost required to maximize accuracy in order to suppress such variations. Therefore, according to the present embodiment, it is possible to provide a coil component that can prevent variations in the size of parasitic inductor components and a filter circuit including the coil component.
　さらに、コイル部品１００を電源ラインのノイズを除去するための部品として用いて、電極４ａから電極４ｂに電流を流す場合、積層体３の内部を流れる電流が積層体３外部の電極４ｃを通る。このとき、電流が積層体３の内部を流れ続ける従来パターンに比べて、電極４ｃが放熱機能を発揮し、電流により生じた熱が電極４ｃにおいて放熱される。したがって、コイル部品１００によれは、放熱効果を高めることができる。 Further, when the coil component 100 is used as a component for removing noise from a power line and current is caused to flow from the electrode 4a to the electrode 4b, the current flowing inside the laminate 3 passes through the electrode 4c outside the laminate 3. At this time, compared to the conventional pattern in which the current continues to flow inside the laminate 3, the electrode 4c exhibits a heat dissipation function, and the heat generated by the current is dissipated in the electrode 4c. Therefore, the heat dissipation effect of the coil component 100 can be improved.
　さらに、本実施の形態に係るコイル部品１００においては、電極４ａ～４ｃおよびコイルＬ１，Ｌ２の導通検査の手順を簡素化できるという効果が奏される。コイルＬ１とコイルＬ２との中間接続点から電極４ｃに至る配線パターンが設けられる従来のコイル部品の場合、電極４ａと電極４ｂとの間の導通を試験しただけでは、コイルＬ１とコイルＬ２との中間接続点と、電極４ｃとの間の導通に問題がないことを確認することができない。コイルＬ１とコイルＬ２との中間接続点と電極４ｃの間に別の配線が入るために、この別の配線の断線状態や、この別の配線と電極４ｃとの接続状態を検査する必要がある。このため、従来構造では、別の配線や、電極４ｃに問題のないことを確認するために、電極４ａと電極４ｂとの間の検査に加えて、電極４ａもしくは電極４ｂと電極４ｃとの間の導通検査を行う必要があった。 Furthermore, the coil component 100 according to the present embodiment has the effect of simplifying the procedure for testing continuity of the electrodes 4a to 4c and the coils L1 and L2. In the case of a conventional coil component in which a wiring pattern is provided from the intermediate connection point between coil L1 and coil L2 to electrode 4c, it is not possible to test the continuity between coil L1 and coil L2 by simply testing the continuity between electrode 4a and electrode 4b. It is not possible to confirm that there is no problem in conduction between the intermediate connection point and the electrode 4c. Since another wire is inserted between the intermediate connection point between the coil L1 and the coil L2 and the electrode 4c, it is necessary to inspect the disconnection state of this other wire and the connection state between this other wire and the electrode 4c. . For this reason, in the conventional structure, in order to confirm that there are no problems with other wiring or the electrode 4c, in addition to inspecting between the electrode 4a and the electrode 4b, the inspection between the electrode 4a or the electrode 4b and the electrode 4c is It was necessary to conduct a continuity test.
　これに対して、本実施の形態に係るコイル部品１００においては、中間接続端子に該当する電極４ｃがコイルＬ１とコイルＬ２とを導通させる導通ラインとして機能している。このため、コイル部品１００においては、電極４ａと電極４ｂとの間の導通検査をすることで、電極４ａ～４ｃおよびコイルＬ１，Ｌ２の導通検査を終えることができる。 On the other hand, in the coil component 100 according to the present embodiment, the electrode 4c corresponding to the intermediate connection terminal functions as a conduction line that connects the coil L1 and the coil L2. Therefore, in the coil component 100, by testing the continuity between the electrodes 4a and 4b, it is possible to complete the continuity test of the electrodes 4a to 4c and the coils L1 and L2.
　さらに、本実施の形態に係るコイル部品１００を電源ラインのノイズを除去するなどの用途に用いる場合、電極４ａおよび電極４ｂは、電源ラインに対してシリーズで接続する実装端子として機能する。すなわち、電極４ａおよび電極４ｂは、実装端子により構成されている。コイル部品１００においては、積層体３の長辺側に電極４ａ，４ｂを設けているため、積層体３の短辺側に電極４ａ，４ｂを設ける場合と比較して、実装端子のサイズを大きくすることができる。その結果、電源ラインに電流を流したときに、実装部分で発生する熱をその電極幅によって十分に放熱させることができる。 Furthermore, when the coil component 100 according to the present embodiment is used for purposes such as removing noise from a power line, the electrodes 4a and 4b function as mounting terminals connected in series to the power line. That is, the electrode 4a and the electrode 4b are constituted by mounting terminals. In the coil component 100, since the electrodes 4a and 4b are provided on the long sides of the laminate 3, the size of the mounting terminals can be made larger compared to the case where the electrodes 4a and 4b are provided on the short sides of the laminate 3. can do. As a result, when a current is passed through the power supply line, the heat generated in the mounting portion can be sufficiently dissipated by the width of the electrode.
　また、本実施の形態に係るコイル部品１００においては、積層体３の長辺側の幅の広い電極４ａにコイルＬ１の端部９１ａ，９１ｂを配置し、積層体３の長辺側の幅の広い電極４ｂにコイルＬ２の端部９２ａ，９２ｂを配置することにより、長辺の一端から他端までの距離を活かして大きな開口のコイルを形成することができるという効果も奏される。 Further, in the coil component 100 according to the present embodiment, the ends 91a and 91b of the coil L1 are arranged on the electrode 4a, which is wide on the long side of the laminate 3, and the width on the long side of the laminate 3 is wide. By arranging the ends 92a and 92b of the coil L2 on the wide electrode 4b, it is also possible to form a coil with a large opening by taking advantage of the distance from one end of the long side to the other end.
　また、本実施の形態に係るコイル部品１００はこれに限られることなく、例えば長辺、短辺がない、正方形であってもよいし、コイルは略直方体ではなく、円形もしくは楕円形であってもよい。円形にすることにより、コイルを形成する導体内に電流密度が局所的に高い場所が発生することがないため大電流が流れる用途でも発熱による故障がおこりにくい。 Further, the coil component 100 according to the present embodiment is not limited to this, and may have a square shape without long sides or short sides, or may have a circular or elliptical shape instead of a substantially rectangular parallelepiped. Good too. By making the coil circular, there are no locally high current density areas within the conductor forming the coil, so failures due to heat generation are less likely to occur even in applications where large currents flow.
　＜変形例１＞
　次に、本実施の形態に適用可能な変形例１を説明する。図８は、積層体３０１における導体１０，２０の積層順序に関する変形例１を示す概念図である。 <Modification 1>
Next, a first modification applicable to this embodiment will be described. FIG. 8 is a conceptual diagram showing a first modification regarding the stacking order of the conductors 10 and 20 in the stacked body 301.
　変形例１に係る積層体３０１は、積層体３の積層部１１の最上位層に導体１０を１つ追加し、積層体３の積層部２１から導体１０を１つ削除した例に該当する。変形例１に係る積層体３０１では、積層部１１が４層の導体１０，２０により構成され、積層部２１が２層の導体１０，２０により構成される。 The laminate 301 according to Modification 1 corresponds to an example in which one conductor 10 is added to the uppermost layer of the laminate part 11 of the laminate 3 and one conductor 10 is removed from the laminate part 21 of the laminate 3. In the laminate 301 according to the first modification, the laminate section 11 is composed of four layers of conductors 10 and 20, and the laminate section 21 is composed of two layers of conductors 10 and 20.
　積層体３０１においては、積層体３と同様、積層部１１および積層部２１の各々にコイルＬ１の一部を構成する導体１０とコイルＬ２の一部を構成する導体２０とが含まれるように、導体１０，２０が配置されている。積層体３０１においては、積層体３と同様、積層部１１の最上位層にコイルＬ１の一部を構成する導体１０ａが配置され、積層部２１の最下位層にコイルＬ２の一部を構成する導体２０ｃが配置されている。 In the laminate 301, as in the laminate 3, each of the laminate portion 11 and the laminate portion 21 includes a conductor 10 constituting a part of the coil L1 and a conductor 20 constituting a part of the coil L2. Conductors 10 and 20 are arranged. In the laminated body 301, similarly to the laminated body 3, the conductor 10a forming part of the coil L1 is arranged in the uppermost layer of the laminated part 11, and the conductor 10a forming part of the coil L2 is arranged in the lowermost layer of the laminated part 21. A conductor 20c is arranged.
　変形例１に係る積層体３０１においても、積層体３と同様に、ｄ２に比べてｄ１が広くなるように、積層部１１と積層部２１との間隔を広げている。これにより、変形例１においも、積層部１１と積層部２１との間で発生し得る寄生容量を低減させつつも、コイルＬ１とコイルＬ２との間の磁気結合力を向上させることが可能である。 Similarly to the laminate 3, in the laminate 301 according to the first modification, the interval between the laminate portions 11 and 21 is widened so that d1 is wider than d2. As a result, in Modification 1 as well, it is possible to reduce the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21, and to improve the magnetic coupling force between the coil L1 and the coil L2. be.
　変形例１に係る積層体３０１においては、積層体３と異なり、積層部１１の層数と積層部２１の層数とが異なっている。このように、積層部１１の層数と積層部２１の層数とを異ならせることによって、コイルＬ１，Ｌ２の各々の自己インダクタンスの値を細やかに調整することが可能となる。その結果、コイルＬ１，Ｌ２の相互インダクタンスを細かく調整することも可能となる。 In the laminate 301 according to Modification Example 1, unlike the laminate 3, the number of layers in the laminate portion 11 and the number of layers in the laminate portion 21 are different. In this way, by making the number of layers of the laminated portion 11 and the number of layers of the laminated portion 21 different, it is possible to finely adjust the value of the self-inductance of each of the coils L1 and L2. As a result, it is also possible to finely adjust the mutual inductance of the coils L1 and L2.
　＜変形例２＞
　次に、本実施の形態に適用可能な変形例２を説明する。図９は、積層体３０２における導体１０，２０の積層順序に関する変形例２を示す概念図である。 <Modification 2>
Next, a second modification applicable to this embodiment will be described. FIG. 9 is a conceptual diagram showing a second modification regarding the stacking order of the conductors 10 and 20 in the stacked body 302.
　変形例２に係る積層体３０２は、積層体３の積層部２１から導体１０を１つ削除した例に該当する。積層体３０２の積層部１１の構成は、積層体３の積層部１１の構成と同じである。変形例２に係る積層体３０２では、積層部１１が３層の導体１０，２０により構成され、積層部２１が２層の導体１０，２０により構成される。 The laminate 302 according to Modification 2 corresponds to an example in which one conductor 10 is removed from the laminate portion 21 of the laminate 3. The configuration of the laminated portion 11 of the laminated body 302 is the same as the configuration of the laminated portion 11 of the laminated body 3. In the laminate 302 according to the second modification, the laminate section 11 is composed of three layers of conductors 10 and 20, and the laminate section 21 is composed of two layers of conductors 10 and 20.
　積層体３０２においては、積層体３と同様、積層部１１および積層部２１の各々にコイルＬ１の一部を構成する導体１０とコイルＬ２の一部を構成する導体２０とが含まれるように、導体１０，２０が配置されている。積層体３０２においては、積層体３と同様、積層部１１の最上位層に、コイルＬ１の一部を構成する導体１０ａが配置され、積層部２１の最下位層に、コイルＬ２の一部を構成する導体２０ｃが配置されている。 In the laminated body 302, as in the laminated body 3, the laminated portion 11 and the laminated portion 21 each include the conductor 10 constituting a part of the coil L1 and the conductor 20 constituting a part of the coil L2. Conductors 10 and 20 are arranged. In the laminated body 302, like the laminated body 3, a conductor 10a constituting a part of the coil L1 is arranged in the uppermost layer of the laminated part 11, and a part of the coil L2 is arranged in the lowermost layer of the laminated part 21. A constituting conductor 20c is arranged.
　変形例２に係る積層体３０２においても、積層体３と同様に、ｄ２に比べてｄ１が広くなるように、積層部１１と積層部２１との間隔を広げている。これにより、変形例２においも、積層部１１と積層部２１との間で発生し得る寄生容量を低減させつつも、コイルＬ１とコイルＬ２との間の磁気結合力を向上させることが可能である。 Similarly to the laminate 3, in the laminate 302 according to the second modification, the interval between the laminate portions 11 and 21 is widened so that d1 is wider than d2. As a result, in Modification 2 as well, it is possible to improve the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21. be.
　変形例２に係る積層体３０３においても、変形例１に関わる積層体３０２と同様に、積層部１１の層数と積層部２１の層数とが異なっている。このように、積層部１１の層数と積層部２１の層数とを異ならせることによって、コイルＬ１，Ｌ２の各々の自己インダクタンスの値を細やかに調整することが可能となる。その結果、コイルＬ１，Ｌ２の相互インダクタンスを細かく調整することも可能となる。 Similarly to the laminate 302 according to Modification 1, in the laminate 303 according to Modification 2, the number of layers in the laminate section 11 and the number of layers in the laminate section 21 are different. In this way, by making the number of layers of the laminated portion 11 and the number of layers of the laminated portion 21 different, it is possible to finely adjust the value of the self-inductance of each of the coils L1 and L2. As a result, it is also possible to finely adjust the mutual inductance of the coils L1 and L2.
　＜変形例３＞
　次に、本実施の形態に適用可能な変形例３を説明する。図１０は、積層体３０３における導体１０，２０の積層順序に関する変形例３を示す概念図である。 <Modification 3>
Next, a third modification applicable to this embodiment will be described. FIG. 10 is a conceptual diagram showing a third modification regarding the stacking order of the conductors 10 and 20 in the stacked body 303.
　変形例３に係る積層体３０３は、導体１０，２０の組み合わせを含む積層部１１、積層部２１、および積層部３１を含む。積層部１１と積層部２１との間隔、および積層部２１と積層部３１との間隔は、各々、ｄ１である。 A laminate 303 according to Modification 3 includes a laminate section 11, a laminate section 21, and a laminate section 31 including a combination of conductors 10 and 20. The distance between the laminated portion 11 and the laminated portion 21 and the distance between the laminated portion 21 and the laminated portion 31 are each d1.
　変形例３に係る積層部１１内において隣り合う導体（１０，２０）の間隔、積層部２１内において隣り合う導体（１０，２０）の間隔、および積層部３１内において隣り合う導体（１０，２０）の間隔は、いずれもｄ２である。変形例３においても、ｄ１＞ｄ２の関係が成立する。 The distance between adjacent conductors (10, 20) in the laminated portion 11 according to modification 3, the distance between adjacent conductors (10, 20) in the laminated portion 21, and the distance between adjacent conductors (10, 20) in the laminated portion 31. ) are all d2. In Modification 3 as well, the relationship d1>d2 holds true.
　変形例３に係る積層体３０３の積層構造は、本実施の形態として説明した図６の積層体３における積層部１１と積層部２１との間に、積層部を追加した構造に該当する。 The laminated structure of the laminated body 303 according to the third modification corresponds to a structure in which a laminated part is added between the laminated part 11 and the laminated part 21 in the laminated body 3 of FIG. 6 described as the present embodiment.
　変形例３に係る積層体３０３において、積層部１１には、導体１０（１０ａ）の隣に２つの導体２０（２０ａ，２０ｂ）が積層されており、積層部２１には、導体１０（１０ｃ）と導体２０（２０ｃ）とが隣り合って積層された部分が存在する。積層部１１と積層部２１との間隔ｄ１は、積層部１１内において隣り合う導体（１０，２０）の間隔ｄ２および積層部２１内において隣り合う導体（１０，２０）の間隔ｄ２よりも離れている。 In the laminated body 303 according to the third modification, the two conductors 20 (20a, 20b) are laminated next to the conductor 10 (10a) in the laminated part 11, and the conductor 10 (10c) is laminated in the laminated part 21. There is a portion where the conductor 20 (20c) and the conductor 20 (20c) are stacked adjacent to each other. The distance d1 between the laminated portion 11 and the laminated portion 21 is greater than the distance d2 between adjacent conductors (10, 20) in the laminated portion 11 and the distance d2 between adjacent conductors (10, 20) in the laminated portion 21. There is.
　変形例３に係る積層体３０３において、積層部２１には、導体１０（１０ｃ）の隣に２つの導体２０（２０ｃ，２０ｄ）が積層されており、積層部３１には、導体１０（１０ｅ）と導体２０（２０ｅ）とが隣り合って積層された部分が存在する。積層部２１と積層部３１との間隔ｄ１は、積層部１１内において隣り合う導体（１０，２０）の間隔ｄ２および積層部２１内において隣り合う導体（１０，２０）の間隔ｄ２よりも離れている。 In the laminate 303 according to modification 3, the two conductors 20 (20c, 20d) are stacked next to the conductor 10 (10c) in the stacked part 21, and the conductor 10 (10e) is stacked in the stacked part 31. There is a portion where the conductor 20 (20e) and the conductor 20 (20e) are stacked adjacent to each other. The distance d1 between the laminated portion 21 and the laminated portion 31 is greater than the distance d2 between adjacent conductors (10, 20) in the laminated portion 11 and the distance d2 between adjacent conductors (10, 20) in the laminated portion 21. There is.
　変形例３に係る積層部２１のように、積層部を４層以上に積層した導体（１０，２０）により構成してもよい。また、積層部１１内において隣り合う導体（１０，２０）の間隔、積層部２１内において隣り合う導体（１０，２０）の間隔、および積層部３１内において隣り合う導体（１０，２０）の間隔は、ｄ１より短ければ、どのような間隔に設計してもよい。また、積層部１１と積層部２１の隣り合う導体の間隔と、積層部２１と積層部３１の隣り合う導体の間隔とは、同じｄ１でなくてもよく、各積層部内での導体の距離より長い距離であればよい。 Like the laminated part 21 according to modification 3, the laminated part may be composed of conductors (10, 20) laminated in four or more layers. Also, the distance between adjacent conductors (10, 20) in the laminated portion 11, the distance between adjacent conductors (10, 20) in the laminated portion 21, and the distance between adjacent conductors (10, 20) in the laminated portion 31. may be designed at any interval as long as it is shorter than d1. Further, the distance between adjacent conductors in the laminated portion 11 and the laminated portion 21 and the distance between adjacent conductors in the laminated portion 21 and the laminated portion 31 do not have to be the same d1, and are smaller than the distance between the conductors in each laminated portion. It is fine as long as it is a long distance.
　変形例３に係る積層体３０２においても、積層体３と同様に、ｄ２に比べてｄ１が広くなるように、積層部１１と積層部２１との間隔、および積層部２１と積層部３１との間隔を広げている。これにより、積層部１１と積層部２１との間で発生し得る寄生容量、および積層部２１と積層部３１との間で発生し得る寄生容量を低減させつつも、コイルＬ１とコイルＬ２との間の磁気結合力を向上させることが可能である。 Similarly to the laminate 3, in the laminate 302 according to the third modification, the distance between the laminate portions 11 and 21 and the distance between the laminate portions 21 and 31 are adjusted so that d1 is wider than d2. widening the interval. Thereby, while reducing the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21 and the parasitic capacitance that may occur between the laminated portion 21 and the laminated portion 31, the It is possible to improve the magnetic coupling force between the two.
　＜変形例４＞
　次に、本実施の形態に適用可能な変形例４を説明する。図１１は、積層体３０４における導体１０，２０の積層順序に関する変形例４を示す概念図である。 <Modification 4>
Next, a fourth modification applicable to this embodiment will be described. FIG. 11 is a conceptual diagram showing a fourth modification regarding the stacking order of the conductors 10 and 20 in the stacked body 304.
　変形例４に係る積層体３０４は、積層体３の積層部１１の最上位層に導体１０を１つ追加し、積層体３の積層部２１の最下位層に導体２０を１つ追加した例に該当する。変形例４に係る積層体３０４では、積層部１１および積層部２１のいずれもが４層の導体１０，２０により構成される。積層体３０４では、積層部１１に導体１０ａ，１０ｂと、導体２０ａ，２０ｂとが積層されており、積層部２１に導体１０ｃ，１０ｄと、導体２０ｃ，２０ｄとが積層されている。 A laminate 304 according to modification 4 is an example in which one conductor 10 is added to the top layer of the laminate section 11 of the laminate 3, and one conductor 20 is added to the bottom layer of the laminate section 21 of the laminate 3. Applies to. In the laminate 304 according to the fourth modification, both the laminate section 11 and the laminate section 21 are composed of four layers of conductors 10 and 20. In the laminated body 304, the conductors 10a, 10b and the conductors 20a, 20b are laminated in the laminated part 11, and the conductors 10c, 10d and the conductors 20c, 20d are laminated in the laminated part 21.
　変形例４に係る積層体３０４では、積層部１１における導体１０，２０の積層パターンと、積層部２１における導体１０，２０の積層パターンとが共通している。すなわち、変形例４に係る積層体３０４では、積層部１１および積層部２１のいずれもが上位２層に導体１０が積層され、下位２層に導体２０が積層されている。 In the laminate 304 according to Modification 4, the lamination pattern of the conductors 10 and 20 in the lamination part 11 and the lamination pattern of the conductors 10 and 20 in the lamination part 21 are common. That is, in the laminate 304 according to the fourth modification, the conductors 10 are laminated in the upper two layers of both the laminated portion 11 and the laminated portion 21, and the conductors 20 are laminated in the lower two layers.
　このように、変形例４においては、積層部１１における導体１０および導体２０の積層順序と、積層部２１における導体１０および導体２０の積層順序とが同じである。このように、複数の積層部１１，２１における導体１０および導体２０の積層順序を共通化することにより、製造上の不良発生率を低減させることができる。 In this way, in Modification 4, the stacking order of the conductor 10 and the conductor 20 in the stacked part 11 is the same as the stacked order of the conductor 10 and the conductor 20 in the stacked part 21. In this way, by standardizing the lamination order of the conductor 10 and the conductor 20 in the plurality of laminated parts 11 and 21, it is possible to reduce the incidence of manufacturing defects.
　以上、変形例１～４を順に説明した。変形例１～４の積層部１１，２１として、導体１０または導体２０が連続して積層される最大数が２である場合を説明した。しかし、導体１０または導体２０が連続して積層される最大数が３以上になるように、導体１０または導体２０を積層してもよい。例えば、図８に示される変形例１において、積層部１１内の最下位層の導体２０（２０ｂ）の下に、導体２０を追加して配置してもよい。図１０に示される変形例３において、積層部１１，２１，３１の各々の最下位層の導体２０の下に、導体２０を追加して配置してもよい。 Above, Modifications 1 to 4 have been explained in order. As for the laminated parts 11 and 21 of Modifications 1 to 4, the case where the maximum number of conductors 10 or 20 that can be successively laminated is two has been described. However, the conductors 10 or 20 may be stacked such that the maximum number of conductors 10 or 20 that can be consecutively stacked is three or more. For example, in modification example 1 shown in FIG. 8, a conductor 20 may be additionally placed under the lowest layer conductor 20 (20b) in the laminated portion 11. In modification example 3 shown in FIG. 10, a conductor 20 may be additionally placed under the conductor 20 in the lowest layer of each of the laminated parts 11, 21, and 31.
　本開示においては、積層部１１の最下位層の導体（１０，２０）と、積層部２１の最上位層の導体（１０，２０）とが異なる例を説明した。例えば、図６に示される積層部１１の最下位層には導体２０が配置されており、図６に示される積層部２１の最上位層には導体１０が配置されている。しかしながら、積層部１１の最下位層と積層部２１の最上位層とのいずれにも導体１０（または導体２０）を配置してもよい。 In the present disclosure, an example has been described in which the conductor (10, 20) in the lowest layer of the laminated portion 11 is different from the conductor (10, 20) in the uppermost layer of the laminated portion 21. For example, the conductor 20 is arranged at the lowest layer of the laminated section 11 shown in FIG. 6, and the conductor 10 is arranged at the uppermost layer of the laminated section 21 shown in FIG. However, the conductor 10 (or the conductor 20) may be placed in both the lowest layer of the laminated portion 11 and the highest layer of the laminated portion 21.
　本開示においては、コイルＬ１およびコイルＬ２の各々がシングルループを構成し、導体１０ａ～１０ｃの各々がコイルＬ１のシングルループを構成し、導体２０ａ～２０ｃの各々がコイルＬ２のシングルループを構成する例を説明した。しかし、コイルＬ１およびコイルＬ２の少なくとも一方をスパイラルループのパターンで構成してもよい。また、導体１０ａ～１０ｃを直列に接続することによってコイルＬ１のシングルループを構成してもよく、導体２０ａ～２０ｃを直列に接続することによってコイルＬ２のシングルループを構成してもよい。 In the present disclosure, each of coil L1 and coil L2 constitutes a single loop, each of conductors 10a-10c constitutes a single loop of coil L1, and each of conductors 20a-20c constitutes a single loop of coil L2. An example was explained. However, at least one of the coil L1 and the coil L2 may be configured in a spiral loop pattern. Furthermore, a single loop of the coil L1 may be configured by connecting the conductors 10a to 10c in series, and a single loop of the coil L2 may be configured by connecting the conductors 20a to 20c in series.
　［態様］
　以下、本開示の態様を列挙する。 [Mode]
Aspects of the present disclosure will be listed below.
　（第１項）第１項に記載のコイル部品は、互いに対向する一対の主面を有する絶縁体と、第１コイルを形成する２つ以上の第１導体と、第２コイルを形成する３つ以上の第２導体と、を備え、第１導体および第２導体は、絶縁体の一対の主面に平行に積層され、第１コイル、および複数の導体のうちの３以上の第２導体により構成される第２コイルを含み、第１コイルおよび第２コイルは、一対の主面に対する法線方向に巻回軸が向くように配置され、第１コイルおよび第２コイルの各々の開口が少なくとも一部が重なっており、絶縁体は、第１積層部および第２積層部を備え、第１積層部は、第１導体に対して積層方向に隣り合って２つ以上の第２導体が積層された部分を含み、第２積層部は、第１導体と第２導体とが積層方向に隣り合って積層された部分を含み、第１積層部に含まれる第１導体および第２導体のうち第２積層部側の層に配置された導体と、第２積層部に含まれる第１導体および第２導体のうち第１積層部側の層に配置された導体との間隔は、第１積層部内において隣り合う導体の間隔および第２積層部内において隣り合う導体の間隔よりも離れている。 (Paragraph 1) The coil component described in Paragraph 1 includes an insulator having a pair of principal surfaces facing each other, two or more first conductors forming a first coil, and three or more first conductors forming a second coil. three or more second conductors, the first conductor and the second conductor are laminated in parallel to the pair of main surfaces of the insulator, the first coil, and the three or more second conductors of the plurality of conductors. The first coil and the second coil are arranged such that their winding axes are oriented in the normal direction to the pair of principal surfaces, and the openings of each of the first coil and the second coil are The insulator includes a first laminated portion and a second laminated portion, and the first laminated portion has two or more second conductors adjacent to each other in the lamination direction with respect to the first conductor. The second laminated portion includes a laminated portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction, and the second laminated portion includes a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction. The distance between the conductor placed in the layer on the second laminated part side and the conductor placed in the layer on the first laminated part side among the first conductor and second conductor included in the second laminated part is the first The distance between adjacent conductors in the laminated portion is greater than the distance between adjacent conductors in the laminated portion and the distance between adjacent conductors in the second laminated portion.
　（第２項）第１項に記載のコイル部品において、第２積層部は、第１導体と第２導体とを含む３つの導体が積層方向に隣り合って積層された部分を含む。 (Section 2) In the coil component described in Item 1, the second laminated portion includes a portion where three conductors including a first conductor and a second conductor are laminated adjacent to each other in the lamination direction.
　（第３項）第１項または第２項に記載のコイル部品において、法線方向から絶縁体を見た場合、第１コイルおよび第２コイルの各々は、シングルループのコイル形状を有する。 (Section 3) In the coil component described in Item 1 or 2, each of the first coil and the second coil has a single-loop coil shape when the insulator is viewed from the normal direction.
　（第４項）第３項に記載のコイル部品において、法線方向から絶縁体を見た場合、２つ以上の第１導体の各々は、第１コイルのシングルループのコイル形状を有し、法線方向から絶縁体を見た場合、３つ以上の第２導体の各々は、第２コイルのシングルループのコイル形状を有する。 (Section 4) In the coil component according to Item 3, when the insulator is viewed from the normal direction, each of the two or more first conductors has a coil shape of a single loop of the first coil, When the insulator is viewed from the normal direction, each of the three or more second conductors has a coil shape of a single loop of the second coil.
　（第５項）第１項～第４項のいずれか１項に記載のコイル部品において、第１積層部における第１導体および第２導体の積層順序と、第２積層部における第１導体および第２導体の積層順序とが同じである。 (Section 5) In the coil component according to any one of Items 1 to 4, the stacking order of the first conductor and the second conductor in the first laminated portion, and the stacking order of the first conductor and the second conductor in the second laminated portion. The stacking order of the second conductor is the same.
　（第６項）第１項～第５項のいずれか１項に記載のコイル部品において、絶縁体に設けられる複数の電極をさらに備え、絶縁体は、一対の主面間を結ぶ複数の側面を有し、複数の側面は、第１側面、第２側面、および第３側面を含み、複数の電極は、第１側面に設けられる第１電極と、第２側面に設けられる第２電極と、第３側面に設けられる第３電極とを含み、第１コイルは、第１配線パターンにより構成される第１導体、および第２配線パターンにより構成される第１導体を含み、第２コイルは、第３配線パターンにより構成される第２導体、および第４配線パターンにより構成される第２導体を含み、第１配線パターンにより構成される第１導体は、第１電極および第３電極と接続され、第２配線パターンにより構成される第１導体は、第１配線パターンにより構成される第１導体と第１ビア導体によって接続され、第３配線パターンにより構成される第２導体は、第２電極および第３電極と接続され、第４配線パターンにより構成される第２導体は、第３配線パターンにより構成される第２導体と第２ビア導体によって接続されている。 (Section 6) The coil component according to any one of Items 1 to 5, further comprising a plurality of electrodes provided on the insulator, and the insulator has a plurality of side surfaces connecting the pair of main surfaces. The plurality of side surfaces include a first side surface, a second side surface, and a third side surface, and the plurality of electrodes include a first electrode provided on the first side surface and a second electrode provided on the second side surface. , a third electrode provided on a third side surface, the first coil includes a first conductor configured by the first wiring pattern, and a first conductor configured by the second wiring pattern, the second coil includes a first conductor configured by the first wiring pattern, and a first conductor configured by the second wiring pattern. , a second conductor configured by the third wiring pattern, and a second conductor configured by the fourth wiring pattern, the first conductor configured by the first wiring pattern is connected to the first electrode and the third electrode. The first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by the first via conductor, and the second conductor formed by the third wiring pattern is connected to the first conductor formed by the first wiring pattern. A second conductor connected to the electrode and the third electrode and formed by the fourth wiring pattern is connected to a second conductor formed by the third wiring pattern and a second via conductor.
　（第７項）第７項のフィルタ回路は、第１項～第６項のいずれか１項に記載のコイル部品と、コイル部品に接続するコンデンサとを備える。 (Section 7) The filter circuit of Item 7 includes the coil component according to any one of Items 1 to 6, and a capacitor connected to the coil component.
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した説明ではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the above description, and it is intended that equivalent meanings and all changes within the scope of the claims are included.
　１　フィルタ回路、３，３０１～３０４　絶縁体、４ａ，４ｂ，４ｃ，４ｄ　電極、１０ａ～１０ｅ，２０ａ～２０ｄ　導体、１１　第１積層部、２１　第２積層部、３１　第２積層部、５１～５４　ビア導体、６１ａ，６１ｂ，６２ａ，６２ｂ，６３ａ，６３ｂ，６４ａ，６４ｂ　接続部、９１ａ，９１ｂ，９２ａ，９２ｂ，９３ａ，９３ｂ　端部、１００　コイル部品、Ｃ１　コンデンサ、Ｌ１，Ｌ２　コイル。 1 Filter circuit, 3,301-304 Insulator, 4a, 4b, 4c, 4d Electrode, 10a-10e, 20a-20d Conductor, 11 First laminated part, 21 Second laminated part, 31 Second laminated part, 51- 54 via conductor, 61a, 61b, 62a, 62b, 63a, 63b, 64a, 64b connection, 91a, 91b, 92a, 92b, 93a, 93b end, 100 coil parts, C1 capacitor, L1, L2 coil.

Claims (7)

  1. 　互いに対向する一対の主面を有する絶縁体と、
    　第１コイルを形成する２つ以上の第１導体と、
    　第２コイルを形成する３つ以上の第２導体と、を備え、
    　前記第１導体および前記第２導体は、前記絶縁体の前記一対の主面に平行に積層され、
    　前記第１コイルおよび前記第２コイルは、前記一対の主面に対する法線方向に巻回軸が向くように配置され、前記第１コイルおよび前記第２コイルの各々の開口が少なくとも一部が重なっており、
    　前記絶縁体は、第１積層部および第２積層部を備え、
    　前記第１積層部は、前記第１導体に対して積層方向に隣り合って２つ以上の前記第２導体が積層された部分を含み、
    　前記第２積層部は、前記第１導体と前記第２導体とが前記積層方向に隣り合って積層された部分を含み、
    　前記第１積層部に含まれる前記第１導体および前記第２導体のうち前記第２積層部側の層に配置された導体と、前記第２積層部に含まれる前記第１導体および前記第２導体のうち前記第１積層部側の層に配置された導体との間隔は、前記第１積層部内において隣り合う導体の間隔および前記第２積層部内において隣り合う導体の間隔よりも離れている、コイル部品。     an insulator having a pair of principal surfaces facing each other;
    two or more first conductors forming a first coil;
    three or more second conductors forming a second coil,
    The first conductor and the second conductor are laminated in parallel to the pair of main surfaces of the insulator,
    The first coil and the second coil are arranged such that their winding axes face in the normal direction to the pair of main surfaces, and the openings of the first coil and the second coil overlap at least partially. and
    The insulator includes a first laminated portion and a second laminated portion,
    The first laminated portion includes a portion where two or more of the second conductors are laminated adjacent to the first conductor in the lamination direction,
    The second laminated portion includes a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction,
    Among the first conductor and the second conductor included in the first laminated part, the conductor disposed in the layer on the second laminated part side, and the first conductor and the second conductor included in the second laminated part Among the conductors, the distance between the conductors arranged in the layer on the side of the first laminated portion is greater than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion. coil parts.
  2. 　前記第２積層部は、前記第１導体と前記第２導体とを含む３つの導体が積層方向に隣り合って積層された部分を含む、請求項１に記載のコイル部品。 The coil component according to claim 1, wherein the second laminated portion includes a portion where three conductors including the first conductor and the second conductor are laminated adjacent to each other in the lamination direction.
  3. 　前記法線方向から前記絶縁体を見た場合、前記第１コイルおよび前記第２コイルの各々は、シングルループのコイル形状を有する、請求項１または請求項２に記載のコイル部品。 The coil component according to claim 1 or 2, wherein each of the first coil and the second coil has a single-loop coil shape when the insulator is viewed from the normal direction.
  4. 　前記法線方向から前記絶縁体を見た場合、前記２つ以上の第１導体の各々は、前記第１コイルの前記シングルループのコイル形状を有し、
    　前記法線方向から前記絶縁体を見た場合、前記３つ以上の第２導体の各々は、前記第２コイルの前記シングルループのコイル形状を有する、請求項３に記載のコイル部品。     When looking at the insulator from the normal direction, each of the two or more first conductors has a coil shape of the single loop of the first coil,
    4. The coil component according to claim 3, wherein each of the three or more second conductors has a coil shape of the single loop of the second coil when the insulator is viewed from the normal direction.
  5. 　前記第１積層部における前記第１導体および前記第２導体の積層順序と、前記第２積層部における前記第１導体および前記第２導体の積層順序とが同じである、請求項１～請求項４のいずれか１項に記載のコイル部品。 The lamination order of the first conductor and the second conductor in the first laminated portion is the same as the lamination order of the first conductor and the second conductor in the second laminated portion. 4. The coil component according to any one of 4.
  6. 　前記絶縁体に設けられる複数の電極をさらに備え、
    　前記絶縁体は、前記一対の主面間を結ぶ複数の側面を有し、
    　前記複数の側面は、第１側面、第２側面、および第３側面を含み、
    　前記複数の電極は、第１側面に設けられる第１電極と、第２側面に設けられる第２電極と、第３側面に設けられる第３電極とを含み、
    　前記第１コイルは、第１配線パターンにより構成される前記第１導体、および第２配線パターンにより構成される前記第１導体を含み、
    　前記第２コイルは、第３配線パターンにより構成される前記第２導体、および第４配線パターンにより構成される前記第２導体を含み、
    　前記第１配線パターンにより構成される前記第１導体は、前記第１電極および前記第３電極と接続され、
    　前記第２配線パターンにより構成される前記第１導体は、前記第１配線パターンにより構成される前記第１導体と第１ビア導体によって接続され、
    　前記第３配線パターンにより構成される前記第２導体は、前記第２電極および前記第３電極と接続され、
    　前記第４配線パターンにより構成される前記第２導体は、前記第３配線パターンにより構成される前記第２導体と第２ビア導体によって接続されている、請求項１～請求項５のいずれか１項に記載のコイル部品。     Further comprising a plurality of electrodes provided on the insulator,
    The insulator has a plurality of side surfaces connecting the pair of main surfaces,
    The plurality of sides include a first side, a second side, and a third side,
    The plurality of electrodes include a first electrode provided on the first side, a second electrode provided on the second side, and a third electrode provided on the third side,
    The first coil includes the first conductor configured by a first wiring pattern and the first conductor configured by a second wiring pattern,
    The second coil includes the second conductor configured by a third wiring pattern and the second conductor configured by a fourth wiring pattern,
    The first conductor configured by the first wiring pattern is connected to the first electrode and the third electrode,
    The first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by a first via conductor,
    The second conductor configured by the third wiring pattern is connected to the second electrode and the third electrode,
    Any one of claims 1 to 5, wherein the second conductor formed by the fourth wiring pattern is connected to the second conductor formed by the third wiring pattern by a second via conductor. Coil parts listed in section.
  7. 　請求項１～請求項６のいずれか１項に記載の前記コイル部品と、
    　前記コイル部品に接続するコンデンサとを備える、フィルタ回路。     The coil component according to any one of claims 1 to 6,
    and a capacitor connected to the coil component.
PCT/JP2023/017872 2022-06-01 2023-05-12 Coil component, and filter circuit including same WO2023233966A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124470A (en) * 2010-11-18 2012-06-28 Panasonic Corp Common mode noise filter
WO2018012400A1 (en) * 2016-07-15 2018-01-18 株式会社村田製作所 High frequency transformer and phase shifter
WO2020170708A1 (en) * 2019-02-22 2020-08-27 株式会社村田製作所 Filter circuit module, filter circuit element, filter circuit, and communication device
JP2022008603A (en) * 2019-10-30 2022-01-13 株式会社村田製作所 Coil component and filter circuit including the same
WO2022070888A1 (en) * 2020-10-01 2022-04-07 株式会社村田製作所 Coil component, filter circuit containing same, and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124470A (en) * 2010-11-18 2012-06-28 Panasonic Corp Common mode noise filter
WO2018012400A1 (en) * 2016-07-15 2018-01-18 株式会社村田製作所 High frequency transformer and phase shifter
WO2020170708A1 (en) * 2019-02-22 2020-08-27 株式会社村田製作所 Filter circuit module, filter circuit element, filter circuit, and communication device
JP2022008603A (en) * 2019-10-30 2022-01-13 株式会社村田製作所 Coil component and filter circuit including the same
WO2022070888A1 (en) * 2020-10-01 2022-04-07 株式会社村田製作所 Coil component, filter circuit containing same, and electronic device

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