WO2023216816A1 - 连接器组件、互连***及服务器集群 - Google Patents

连接器组件、互连***及服务器集群 Download PDF

Info

Publication number
WO2023216816A1
WO2023216816A1 PCT/CN2023/088986 CN2023088986W WO2023216816A1 WO 2023216816 A1 WO2023216816 A1 WO 2023216816A1 CN 2023088986 W CN2023088986 W CN 2023088986W WO 2023216816 A1 WO2023216816 A1 WO 2023216816A1
Authority
WO
WIPO (PCT)
Prior art keywords
shielding
circuit board
cable
sub
shielding shell
Prior art date
Application number
PCT/CN2023/088986
Other languages
English (en)
French (fr)
Inventor
刘丽娟
喻军
刘天明
赵志刚
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023216816A1 publication Critical patent/WO2023216816A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627—Snap or like fastening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable

Definitions

  • This application relates to the field of connector technology, and in particular to a connector component, an interconnection system and a server cluster.
  • crosstalk is the most critical electrical performance index.
  • crosstalk is reduced by setting ground wires. Ground wires and signal wires are easy to get entangled, making it difficult to sort out the lines. Moreover, the line layout takes up a lot of space, and the signal spacing cannot be compressed. Therefore, ground wires are used for shielding. The effect is poor, and the shielding problem of the cable and circuit board soldering area has not been solved.
  • This application provides a connector assembly, interconnection system and server cluster with good shielding effect and ensuring high-quality signal transmission.
  • an embodiment of the present application provides a connector assembly.
  • the connector assembly includes a circuit board, a first cable and a first shielding shell.
  • the circuit board includes a ground layer.
  • the surface of the circuit board is provided with There is a first signal tray; the first cable is used to transmit signals and includes a first cable core and a first shielding layer; the first cable core includes a first main body and a third cable located at one end of the first main body.
  • a connection end, the first shielding layer is covered on the outside of the first main body, the first connection end is connected to the first signal board; the first shielding shell is fixed on the circuit board and connected to the ground layer, the first connection terminal and the first signal plate are located between the first shielding shell and the circuit board, and the first shielding shell and the first shielding layer Part of the surface adjacent to the circuit board is in contact, so that the first shielding layer is connected to the ground layer.
  • the circuit board is provided with a signal layer
  • the first signal disk is electrically connected to the signal layer
  • the signal layer and the ground layer are stacked along a first direction
  • the first direction is connected to the surface of the circuit board. Faces intersect.
  • the orthographic projection of the first connection end on the circuit board is located in the orthographic projection of the first signal disk on the circuit board, and the first main body portion is formed from the first The connection end extends outside the circuit board, that is, the projection of part of the first body part along the first direction is located on the circuit board, and the projection of part of the first body part along the first direction is located on the circuit board. Outside the circuit board, the first direction intersects the surface of the circuit board.
  • the first direction is perpendicular to the surface of the circuit board.
  • the first connection end is welded to the first signal pad, so that the first connection end is electrically connected to the first signal pad.
  • an end of the circuit board away from the first cable is provided with a gold finger.
  • the first cable core is used to transmit signals.
  • the first cable core includes a first sub-core and a second sub-core.
  • the first sub-core and the second sub-core are used to transmit signals.
  • a differential signal is used to realize signal transmission, so that the first cable core has strong anti-crosstalk capability.
  • the first signal panel also includes two There is a first signal sub-pan, and the two sub-cores are respectively connected to the two first signal sub-pans.
  • the first cable core may include only one sub-core, and the first signal disk may include one first signal sub-disk.
  • the first cable is a groundless cable, and the first cable is grounded through the first shielding layer. Since it does not include a ground wire, the first cable The small size makes the connection between the first cable and the circuit board more convenient, making the connector assembly small in size and highly efficient in assembly.
  • the first shielding layer is aluminum foil.
  • the material of the first shielding layer may also be other conductive metals with good ductility.
  • the first shielding shell is disposed on the peripheral side of the first connection end, and the first shielding shell extends to the outside of the first body part along the third direction, and the first shielding shell is connected to the first connecting end.
  • the first shielding layer is in contact with each other, and the third direction is the extension direction of the first cable on the circuit board.
  • the third direction is parallel to the surface of the circuit board and The third direction is perpendicular to the first direction.
  • the first shielding shell is in contact with a portion of the surface of the first shielding layer away from the circuit board along the first direction. In other embodiments, the first shielding shell may also be Contact with other surfaces of the first shielding layer.
  • the first shielding layer is connected to the ground layer by being connected to the first shielding shell, thereby grounding the first shielding layer.
  • the first shielding casing and the circuit board are detachably connected, which can realize quick disassembly and assembly of the first shielding casing and improve the reuse rate of the first shielding casing.
  • the connection method between the first shielding shell and the circuit board includes but is not limited to fisheye crimping or pin welding.
  • the orthographic projection of the first shielding shell on the circuit board covers the orthographic projection of the first connection terminal on the circuit board.
  • the size of the first shielding shell is slightly larger than the The size of the first connection end can reduce the area occupied by the first shielding shell of the circuit board, reduce costs and increase signal density. The distance between the first shielding shell and the peripheral side of the first connection end can be closer. Achieve better shielding effect.
  • the first shielding shell may be made of metal such as iron, copper, aluminum, or the like.
  • the material of the first shielding shell may also be alloy, conductive plastic, conductive plastic or other conductive materials.
  • the first shielding shell is in contact with the first shielding layer on the first body part, so that the first cable can be grounded to ensure normal signals.
  • Transmission can not only reduce the interference of external signals on the first cable signal transmission, but also reduce the insertion loss of the first sub-core and the second sub-core, improving the signal transmission quality; at the same time, the first shielding shell In contact with the first shielding layer in a face-to-face manner, the first shielding shell is not easy to damage the first shielding layer, ensuring good contact between the first shielding shell and the first shielding layer.
  • the first shielding shell is provided outside the first connection end, which can shield external interference signals at the first connection end and improve signal transmission stability, because the first connection end needs to be connected to all
  • the first signal panel is electrically connected, the first connection end is not covered with the first shielding layer, the first connection end is easily interfered by external signals, and the first shielding shell can One connection end is isolated from external interference signals, reducing signal transmission loss and transmission errors at the first connection end, ensuring the integrity of the first cable transmission signal, and at the same time, the first shielding shell also Used as the signal reference ground of the first connection end, the first shielding shell is connected to the first shielding layer to realize the continuity of the reference ground of the signal of the first connection end and improve the stability of signal transmission.
  • the first shielding shell is in contact with the surface of the first shielding layer away from the circuit board and the first shielding shell is fixed on the circuit board.
  • the first shielding shell can secure the The first cable is pressed against the circuit board, and the first cable is fixed between the first shielding shell and the circuit board, which can reduce the impact of the vibration of the connector assembly on the first connection end and the circuit board.
  • the adverse effects caused by the electrical connection of the first signal panel ensure the stability of the connection between the first connection end and the first signal panel.
  • the height of the first shielding shell along the first direction can be controlled to further control the height of the first shielding shell.
  • the pressing force between the casing and the first shielding layer ensures that the first shielding casing and the first shielding layer are tightly fitted to ensure that the first shielding layer is always grounded, and the first shielding casing can Adapt the first cables of different sizes to improve the utilization rate of the first shielding shell.
  • this application does not involve the modification of the first cable. Only installing the first shielding shell can realize the grounding of the first shielding layer, achieving the effect of reducing crosstalk and lowering insertion loss. Use The first shielding shell has high processing efficiency and simple assembly.
  • the connector assembly further includes a housing, an unlocking buckle, and a pull ring, and the connection and disconnection of the connector assembly are achieved through the cooperative use of the unlocking buckle and the pull ring.
  • the first shielding shell includes a first sub-part, a second sub-part and a third sub-part connected in sequence, and the extension direction of the first sub-part and the third sub-part
  • the extension directions of the first sub-part and the third sub-part intersect with the extension direction of the second sub-part, and one end of the first sub-part and the third sub-part away from the second sub-part is fixed on the circuit board and connected with the
  • the ground layer is connected, and at least part of the second sub-portion elastically abuts the first shielding layer, so that the first shielding layer is connected to the ground layer.
  • the first shielding casing is a metal casing
  • the first shielding casing has a certain degree of elasticity.
  • the second sub-section can move closer to or away from the circuit board along the first direction.
  • the second sub-portion elastically deforms away from the circuit board along the first direction, and the second sub-portion generates a direction along the first direction.
  • the elastic force in the direction of the circuit board makes the second sub-section closely fit the first shielding layer, and when the connector assembly vibrates, the first cable is driven to vibrate in the first direction.
  • the second sub-part can move close to the first shielding layer through elastic deformation, and the second sub-part maintains a stable and reliable connection with the first shielding layer to ensure that the first shielding layer Grounding improves the shielding effect of the first shielding shell and the quality of signal transmission.
  • one end of the first sub-part and the third sub-part away from the second sub-part is connected to the ground layer, and the connection between the first shielding shell and the ground layer is reliable. Sex is higher.
  • one of the first sub-part and the third sub-part is connected to the ground layer, and the other of the first sub-part and the third sub-part can be directly welded to The circuit board is on a surface close to the first shielding shell or other location convenient for welding.
  • the first shielding shell has an integrated structure, and the first sub-part, the second sub-part and the third sub-part are integrally formed, and the structural strength is higher to ensure that the first sub-part is Shield the enclosure for proper operation.
  • the first shielding shell is integrally stamped and formed, which has simple processing procedures and low cost.
  • the second sub-portion is recessed toward the first cable along a first direction to form a first groove, the first direction intersects the circuit board, and the first groove is recessed toward the first cable.
  • the bottom of the groove is in elastic contact with the first shielding layer.
  • the degree of deformability of the second sub-portion in the first direction is increased.
  • the first sub-portion is The connection between the groove and the first shielding layer is more reliable, and the connection between the second sub-part and the first sub-part and the third sub-part is more stable, especially in areas with frequent vibrations.
  • the arrangement of the first groove can ensure a stable connection between the first shielding shell and the first shielding layer, enabling high-quality signal transmission.
  • the extending direction of the first groove is the same as the extending direction of the first shielding layer, thereby increasing the contact area between the first groove and the first shielding layer, so that the second A shielded shell can provide better shielding.
  • the extension direction of the first groove may also be different from the extension direction of the first shielding layer, and the extension direction of the first groove may be set according to actual needs.
  • a portion of the second sub-portion is recessed along the first direction toward the first cable to form the first groove, and a portion of the second sub-portion is not toward the first cable. It is recessed and still parallel to the circuit board to facilitate the installation connection between the first shielding shell and the circuit board.
  • the first groove is provided with a first opening penetrating the bottom of the groove.
  • the first opening The hole can increase the elasticity of the first groove to reduce the possibility of warping when the first shielding shell is assembled and ensure good contact between the bottom of the first groove and the first shielding layer. .
  • At least part of the first opening does not overlap with the orthographic projection of the first shielding layer on the circuit board. At least part of the first opening is located in a part of the first groove that is not in contact with the first shielding layer. While increasing the elasticity of the first groove, the distance between the first groove and the first shielding layer is increased as much as possible. The contact area of the first shielding layer enables the first shielding shell to perform a better shielding effect.
  • the first opening does not overlap with the orthographic projection of the first shielding layer on the circuit board, and the first opening is located in the first groove and does not overlap with the first
  • the contact area of the shielding layer increases the elasticity of the first groove without reducing the contact area between the first groove and the first shielding layer, so that the first shielding shell can function Better shielding effect.
  • the first opening and the orthographic projection of the first connection end on the circuit board at least partially overlap, and when the connector assembly is assembled, the first shielding shell is first fixed On the circuit board, the first connection end is then soldered to the first signal board through the first opening, or the first connection end is dispensed through the first opening.
  • the connection end is bonded to the first signal plate, and the first shielding shell can play a positioning role for the installation of the first cable.
  • the orthographic projection of the first opening and the first connection end on the circuit board at least partially overlaps.
  • the first sub-part and the third sub-part are provided with pins at one end away from the second sub-part, and the circuit board is provided with a ground through hole, and the ground through hole is provided on the circuit board.
  • the through hole is connected to the ground layer, and the pin extends into the ground through hole to connect the first shielding shell to the ground layer.
  • the ground through hole is provided on the peripheral side of the first cable, and the ground through hole penetrates the surface of the circuit board close to the first shielding shell in the first direction, and passes through the lead.
  • the legs are connected to the ground through holes to achieve a fixed connection between the first shielding shell and the circuit board.
  • the ground through hole penetrates both surfaces of the circuit board along the first direction, making the connection between the pin and the ground through hole simpler and more reliable.
  • the circuit board is provided with four ground through holes, an end of the first sub-part away from the second sub-part is provided with two pins, and the third sub-part is provided with two pins. One end of the part away from the second sub-part is also provided with two pins, and the four pins respectively extend into the four ground through holes to realize the connection between the first shielding shell and the circuit. stable connection to the board.
  • the surface of the circuit board is provided with a second signal plate
  • the connector assembly further includes a second cable and a second shielding shell
  • the second cable includes a second cable core and a second shielding layer
  • the second cable core includes a second main body part and a second connection end located at one end of the second main body part
  • the second shielding layer is wrapped around the outside of the second main body part
  • the second connection terminal is connected to the second signal panel
  • the second shielding shell is fixed on the circuit board and connected to the ground layer
  • the second connection terminal and the second signal panel are located at between the second shielding shell and the circuit board, and the second shielding shell and the second shielding layer are in contact with the surface adjacent to the circuit board, so that the second shielding layer is connected to the ground layer connection
  • the second shielding shell and the first shielding shell are located on the same side of the circuit board, the second shielding shell and the first shielding shell are spaced apart along a second direction, and the second direction is separated from the first shielding shell.
  • the arrangement of the second cable increases the density of signals transmitted by the connector assembly
  • the arrangement of the first shielding shell can reduce the impact of the second cable on the signal transmitted by the first cable.
  • the arrangement of the second shielding shell can reduce the interference of the first cable on the transmission signal of the second cable, while increasing the transmission signal density of the connector assembly, and improving the signal transmission in the The quality of transmission within a connector assembly.
  • the second signal panel and the second cable are both located on the surface of the circuit board close to the first cable.
  • the orthographic projection of the shielding casing on the circuit board does not overlap with the orthographic projection of the first shielding casing on the circuit board.
  • the second direction intersects the first direction and the third direction. In one embodiment, the second direction, the first direction and the third direction are perpendicular to each other.
  • the second cable is the same as the first cable, and the second shielding shell and the first shielding shell have the same structure and volume.
  • the outer diameter of the second cable is the same as the outer diameter of the first cable. In one embodiment, the outer diameter of the second cable may be different from the outer diameter of the first cable. In one embodiment, the materials and volumes of the second shielding shell and the first shielding shell may be different.
  • the first cable is an input signal cable
  • the second cable is an output signal cable. In one embodiment, the second cable is an input signal cable, and the first cable is an output signal cable. In one embodiment, both the first cable and the second cable are input signal cables. In one embodiment, both the first cable and the second cable are output signal cables.
  • the connector assembly further includes more first cables and/or second cables, and the plurality of cables are located on the same side of the circuit board along the first direction. , the peripheral side of each cable is covered with a shielding shell, and multiple shielding shells are spaced apart along the second direction, which increases the density of signal transmission by the connector assembly.
  • the connector assembly can be provided with 4, 8, 16 or other numbers of cables according to actual needs. Each cable is surrounded by a shielding shell, and multiple shielding shells are provided along all sides. The spaced arrangement in the second direction increases the density of signal transmission by the connector assembly.
  • the spacing of the cables along the second direction can be 3.62 mm to 2.23 mm.
  • the distance between the cables along the The spacing in the second direction can be less than 2.23 mm. Due to the arrangement of shielding shells between multiple cables, the crosstalk performance between signals at the cable connection ends is improved, the ground return flow of multiple cables is improved, and the number of multiple cables is reduced. cable loop inductance.
  • the surface of the circuit board is provided with a third signal plate
  • the connector assembly further includes a third cable and a third shielding shell
  • the third cable includes a third cable core and a third shielding layer
  • the third cable core includes a third main body part and a third connection end located at one end of the third main body part
  • the third shielding layer is wrapped around the outside of the third main body part
  • the third connection terminal is connected to the third signal panel
  • the third shielding shell is fixed on the circuit board and connected to the ground layer
  • the third connection terminal and the third signal panel are located at between the third shielding shell and the circuit board, and the third shielding shell and the third shielding layer are in contact with the surface adjacent to the circuit board, so that the third shielding layer is connected to the ground layer connection
  • the third shielding shell and the first shielding shell are respectively located on both sides of the circuit board along a first direction, the first direction intersects the circuit board, the first shielding shell and the first shielding shell are The orthographic projection of the third shielding shell on the
  • the arrangement of the third cable increases the signal transmission density of the connector assembly.
  • the third signal plate and the third cable are located on the surface of the circuit board away from the first cable along the first direction.
  • the third shielding shell and the first shielding shell are respectively located on the circuit board.
  • the two sides along the first direction can save space on the circuit board, allowing more cables or other electronic components to be connected to the circuit board.
  • the first cable is an input signal cable
  • the third cable is an output signal cable.
  • the third cable is an input signal cable
  • the first cable is an output signal cable.
  • both the first cable and the third cable are input signal cables.
  • both the first cable and the third cable are output signal cables.
  • the third shielding shell and the first shielding shell are arranged staggered along the third direction, that is, the orthographic projection of the third shielding shell on the circuit board is different from the first shielding shell.
  • the orthographic projection of the housing on the circuit board does not overlap at least partially, which can better reduce the crosstalk at the third connection end and the first connection end, and reserves space for the third shielding The housing and the installation of the first shielding housing and the circuit board.
  • the third shielding shell and the first shielding shell are arranged staggered along the second direction, that is, the orthographic projection of the third shielding shell on the circuit board is different from the first shielding shell.
  • the orthographic projection of the housing on the circuit board is A few parts do not overlap, which can better reduce the crosstalk at the third connection end and the first connection end, and reserve space to facilitate the connection between the third shielding shell and the first shielding shell. Describe the installation of the circuit board.
  • the orthographic projection of the third shielding shell on the circuit board and the third shielding shell can be realized.
  • the orthographic projection of a shielded housing on the circuit board does not overlap.
  • the third shielding shell and the first shielding shell are arranged staggered along the second direction and the third direction, which can better reduce the distance between the third connection end and the crosstalk at the first connection end, and space is reserved to facilitate the installation of the third shielding casing, the first shielding casing and the circuit board.
  • the orthographic projection of the third shielding casing on the circuit board and the orthographic projection of the first shielding casing on the circuit board may also overlap.
  • the ground through holes of the third shielding shell need to be staggered with the ground through holes of the first shielding shell, and accordingly, the third shielding shell
  • the pin positions on the housing need to be different from the pin positions of the first shielding housing, so that the respective pins correspond to the respective ground through holes.
  • the connector assembly further includes a plurality of first cables spaced apart along the second direction, and the connector assembly includes a plurality of first cables spaced apart along the second direction.
  • the third cable, a plurality of the first cables and a plurality of the third cables are respectively located on both sides of the circuit board along the first direction, and the peripheral side of each first cable.
  • the first shielding shells are all covered with the third shielding shells, and the third shielding shells are all covered with the peripheral sides of each of the third cables.
  • a plurality of the first shielding shells are spaced apart along the second direction, A plurality of third shielding shells are arranged at intervals along the second direction, and a plurality of first shielding shells and a plurality of third shielding shells are staggered, thereby increasing the density of signals transmitted by the connector assembly. And space is reserved to facilitate the installation of the third shielding shell, the first shielding shell and the circuit board.
  • the circuit board is provided with the same number of first cables and third cables on both sides of the first direction, and the first cables and the third cables are One of them is an input signal cable, and the other of the first cable and the third cable is an output signal cable.
  • the surface of the circuit board is provided with a second signal plate
  • the connector assembly further includes a second cable and a second shielding shell
  • the second cable includes a second cable core and a second shielding layer
  • the second cable core includes a second main body part and a second connection end located at one end of the second main body part
  • the second shielding layer is wrapped around the outside of the second main body part
  • the second connection terminal is connected to the second signal panel
  • the second shielding shell is fixed on the circuit board and connected to the ground layer
  • the second connection terminal and the second signal panel are located at between the second shielding shell and the circuit board, and the second shielding shell and the second shielding layer are in contact with the surface adjacent to the circuit board, so that the second shielding layer is connected to the ground layer connection
  • the second shielding shell and the first shielding shell are located on the same side of the circuit board, the second shielding shell and the first shielding shell are connected side by side along the second direction, and the second shielding shell and the first shielding shell are connected side by side
  • the arrangement of the second cable increases the signal transmission density of the connector assembly.
  • the second signal plate and the second cable are both located on the surface of the circuit board close to the first cable, and the orthographic projection of the second shielding shell on the circuit board is in line with the first shielding
  • the orthographic projection of the housing onto the circuit board does not overlap.
  • the second shielded shell and the first shielded shell are connected and arranged side by side along the second direction, and the second cable is arranged closer to the first cable, which can save space on the circuit board, so that More cables or other electronic components can be connected to the circuit board.
  • the arrangement of the first shielding shell can reduce the interference of the second cable on the transmission signal of the first cable, and the arrangement of the second shielding shell can reduce the interference of the first cable on the third cable.
  • the interference of the two cable transmission signals not only increases the transmission signal density of the connector assembly, but also improves the quality of signal transmission within the connector assembly.
  • the first shielding shell includes a first sub-part, a second sub-part and a third sub-part connected in sequence. Three sub-parts, at least part of the second sub-part is in elastic contact with the first shielding layer; the second shielding shell includes the third sub-part, the fourth sub-part and the fifth sub-part connected in sequence, At least part of the fourth sub-portion is elastically contacted with the second shielding layer.
  • the extension direction of the first sub-section, the extension direction of the third sub-section and the extension direction of the fifth sub-section are all consistent with the extension direction of the second sub-section or the extension direction of the fourth sub-section.
  • the extending directions intersect; one end of the first sub-part away from the second sub-part is fixed on the circuit board and connected to the ground layer, and the third sub-part is away from the second sub-part or the One end of the fourth sub-part is fixed on the circuit board and connected to the ground layer, and one end of the fifth sub-part away from the fourth sub-part is fixed on the circuit board and connected to the ground layer .
  • the overall shape of the first shielding shell and the second shielding shell is roughly "M" shaped.
  • the first shielding shell and the second shielding shell share the third sub-section. On the one hand, it can save all The space on the circuit board allows more cables or other electronic components to be connected to the circuit board; on the other hand, the manufacturing cost of the first shielded housing and the second shielded housing can be saved.
  • the first sub-part, the third sub-part and the fifth sub-part can be simplified from a plate shape to a columnar shape, making the processing and installation of the shielding shell easier.
  • the connector assembly includes more cables arranged along the second direction, and a shielding shell is provided around each cable.
  • the shielding shells are connected in sequence and share the same phase. adjacent sides to form a whole.
  • the connector assembly includes more cables, and the plurality of cables are distributed on both sides of the circuit board along the first direction.
  • the shielding shells on both sides form a shielding shell as a whole.
  • the first shielding shell is provided with two first openings arranged along the second direction, and the orthographic projection of the two first openings on the circuit board Located on the peripheral side of the first cable, the arrangement of the first opening can, on the one hand, increase the elasticity of the first groove to reduce the possibility of warping when the first shielding shell is assembled. , ensuring good contact between the bottom of the first groove and the first shielding layer, on the other hand, the first cable can be fixed on the circuit board through the first opening, or When the first cable becomes loose, the connection between the first cable and the circuit board can be reinforced by dispensing glue through the first opening.
  • the second shielding shell has a similar structure to the first shielding shell.
  • the second sub-part is provided with a second opening, and the second opening is connected to the first connection end and/or the first signal plate on the circuit board.
  • the second opening is located on a side of the first opening close to the first connecting end along the third direction, and the second opening is arranged to facilitate the connection between the first connecting end and the first connecting end.
  • the connection to the first signal panel is fixed.
  • the second shielding shell has a similar structure to the first shielding shell.
  • the first shielding shell when the connector assembly is assembled, the first shielding shell is first fixed on the circuit board, and then the first connection end is welded to the circuit board through the second opening. On the first signal disk, or by dispensing glue through the second opening, the first connection end is bonded to the first signal disk.
  • the first shielding shell can be the first wire
  • the installation of the cable plays a positioning role.
  • the second opening can also be used to fix the problem. Tighten the connection between the first connection end and the first signal panel.
  • a ground pad is provided on a surface of the circuit board close to the first cable, and the ground pad is in contact with a portion of the first shielding layer close to one side of the circuit board. catch.
  • the ground pad and the first shielding shell are arranged so that both surfaces of the first cable along the first direction are grounded, and the first shielding shell is in contact with the first shielding layer.
  • the connection can press the first shielding layer and the ground pad tightly, which can better achieve the shielding effect and reduce the external environment. The impact of the environment on the signal transmission of the first cable.
  • the ground pad is electrically connected to the ground layer, and both surfaces of the first cable along the first direction are electrically connected to the ground layer.
  • the ground pad is a metal sheet disposed at a local position on the surface of the circuit board, and the first shielding layer is in contact with the metal sheet close to the surface of the circuit board to achieve a shielding effect.
  • a portion of the first shielding layer close to the surface of the ground pad is welded to the ground pad to protect and fix the first cable.
  • part of the surface of the first shielding layer close to the ground pad is bonded to the ground pad, for example, the first shielding layer is bonded to the ground pad through ultraviolet curable glue (UV glue). on the ground pad to protect and fix the first cable.
  • UV glue ultraviolet curable glue
  • an embodiment of the present application provides an interconnection system.
  • the interconnection system includes a first electronic device and a connector assembly as described in any one of the above.
  • the first electronic device is remote from the circuit board.
  • One end of the first cable is electrically connected.
  • the interconnection system further includes a second electronic device, one end of the connector assembly is electrically connected to the first electronic device, and the other end of the connector assembly is electrically connected to the second electronic device. Electrical connection realizes the interconnection between the first electronic device and the second electronic device through the arrangement of the connector assembly.
  • the first electronic device may be a single board, and the second electronic device may be a backplane. In one embodiment, the first electronic device may be a backplane, and the second electronic device may be a single board. In one embodiment, both the first electronic device and the second electronic device are single boards. In one embodiment, the second electronic device is a backplane, and the first electronic device is a network card. In one embodiment, the second electronic device is a backplane, and the first electronic device is a switch.
  • an embodiment of the present application provides a server cluster, which is characterized in that it includes a plurality of servers, and the servers include a high-speed backplane, a switch, a service board, a backplane connector, and a plurality of servers as described in any one of the above.
  • a connector assembly, the backplane connector is connected to an end of the first cable away from the circuit board, the backplane connector is fixedly connected to the high-speed backplane, and the plurality of connector assemblies
  • the circuit boards in a part of the connector assemblies are connected to the switch, and the circuit boards in another part of the connector assemblies are connected to the service board.
  • the first shielding shell is in contact with the first shielding layer on the first body part, thereby realizing the grounding of the first cable and ensuring normal signals. transmission, which can not only reduce the interference of external signals on the first cable signal transmission, but also improve the quality of signal transmission.
  • the first shielding shell is located outside the first connection end, which can shield the The external interference signal at the first connection end improves signal transmission stability and solves the signal shielding problem at the connection between the first cable and the circuit board.
  • Figure 1 is a schematic diagram of an interconnection system provided by an embodiment of the present application.
  • Figure 2 is a schematic diagram of an interconnection system in a server cluster provided by an embodiment of the present application
  • Figure 3 is a perspective view of the connector assembly provided by the first embodiment of the present application.
  • Figure 4 is an exploded view of the connector assembly provided by the first embodiment of the present application.
  • Figure 5 is a schematic structural diagram of the first cable core provided by an embodiment of the present application.
  • Figure 6 is a schematic structural diagram of a first shielding shell provided by an embodiment of the present application.
  • Figure 7a is a schematic diagram of a single ground wire cable connector assembly provided in an embodiment
  • Figure 7b is a schematic diagram of a dual ground wire cable connector assembly provided in an embodiment
  • Figure 8 is a perspective view of a connector assembly provided by an embodiment of the present application.
  • Figure 9 is an exploded view of a connector assembly provided by an embodiment of the present application.
  • Figure 10 is a schematic diagram of the positional relationship between the first opening and the circuit board provided by an embodiment of the present application.
  • Figure 11 is a perspective view of the connector assembly provided by the second embodiment of the present application.
  • Figure 12 is an exploded view of the connector assembly provided by the second embodiment of the present application.
  • Figure 13a is a far-end crosstalk optimization effect diagram in the second embodiment of the present application.
  • Figure 13b is a near-end crosstalk optimization effect diagram in the second embodiment of the present application.
  • Figure 14 is a schematic diagram of a connector assembly provided by an embodiment of the present application.
  • Figure 15 is a top view of the connector assembly provided by the third embodiment of the present application.
  • Figure 16 is a bottom view of the connector assembly provided by the third embodiment of the present application.
  • Figure 17 is a cross-sectional view of the connector assembly provided by the third embodiment of the present application.
  • Figure 18 is an exploded view of the connector assembly provided by the fourth embodiment of the present application.
  • Figure 19 is an exploded view of the connector assembly provided by the fifth embodiment of the present application.
  • Figure 20 is an exploded view of the connector assembly provided by the fifth embodiment of the present application.
  • Figure 21 is a bottom view of the shielding housing provided by the fifth embodiment of the present application.
  • Figure 22a is a far-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • Figure 22b is a near-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • Figure 23a is a far-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • Figure 23b is a near-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • Figure 24 is a schematic diagram of a connector assembly provided by an embodiment of the present application.
  • Figure 25 is an exploded view of a connector assembly provided by an embodiment of the present application.
  • Crosstalk refers to the noise on the line caused by the coupling between two signal lines, the mutual inductance and mutual capacitance between the signal lines.
  • Single board includes printed circuit board (PCB board, Printed Circuit Board) and electronic devices (such as chips, resistors, capacitors, etc.) provided on the PCB board.
  • PCB board printed circuit board
  • electronic devices such as chips, resistors, capacitors, etc.
  • the backplane is an important part of communication equipment, providing electrical signal connections and physical support for each single board or module in the system.
  • I/O Abbreviation for input/output, that is, input and output ports.
  • QSFP Abbreviation for Quad small form-factor pluggable, that is, four-channel SFP interface.
  • SFP is the abbreviation of Small form-factor pluggable, that is, small pluggable interface.
  • OSFP The abbreviation of Octal small form-factor pluggable, that is, eight-channel SFP interface.
  • GenZ The abbreviation of Generation Z, which is the GenZ series of high-speed interfaces.
  • CXP is the abbreviation of CoaXPress, which is an asymmetric high-speed point-to-point serial communication digital interface.
  • minSAS HD is the abbreviation of Mini-SAS High Density, which is a small serial link and high-density transmission interface.
  • This application provides a connector, which includes a circuit board, a first cable and a first shielding shell; the circuit board includes a ground layer, and a first signal disk is provided on the surface of the circuit board; the first cable is used to transmit signals,
  • the first cable includes a first cable core and a first shielding layer.
  • the first cable core includes a first main body part and a first connection end located at one end of the first main body part.
  • the first shielding layer is wrapped around the outside of the first main body part.
  • the first connection terminal is connected to the first signal panel;
  • the first shielding shell is fixed on the circuit board and connected to the ground layer, the first connection terminal and the first signal panel are located between the first shielding shell and the circuit board, and the first The shielding shell is in contact with the surface of the first shielding layer adjacent to the circuit board, so that the first shielding layer is connected to the ground layer.
  • the interference of external signals on the signal transmission of the first cable can be reduced, ensuring the signal transmission stability of the first cable and the electrical performance of the signal.
  • FIG 1 is a schematic diagram of an interconnection system provided by an embodiment of the present application.
  • the interconnection system 1 can be used in various communication equipment.
  • the communication equipment is provided with a backplane and a single board.
  • the interconnection between single boards and backplanes constitutes an interconnection system 1, which is used to implement communication functions.
  • the interconnection system combining backplanes and single boards is the most common interconnection architecture and is usually used in communication equipment. in high-speed links.
  • the backplane provides a signal transmission channel and carries current to other single boards.
  • the backplane and single boards together form an interconnection system 1.
  • the single board and A connector assembly 10 is provided between the backplanes, and a stable connection between the single board and the backplane is achieved through the connector assembly 10.
  • the connector assembly 10 is the key to affecting the entire communication equipment. part.
  • the single board may be a service board or a switching board.
  • the interconnection system 1 includes a first electronic device 20 and a connector assembly 10 .
  • the first electronic device 20 and the circuit board in the connector assembly 10 One end is electrically connected.
  • the interconnection system 1 further includes a second electronic device 30 , one end of the connector assembly 10 is electrically connected to the first electronic device 20 , and the other end of the connector assembly 10 is electrically connected to the second electronic device 30 .
  • the connector assembly 10 is provided to realize interconnection between the first electronic device 20 and the second electronic device 30 .
  • the first electronic device 20 may be a single board, and the second electronic device 30 may be a backplane. In one embodiment, the first electronic device 20 may be a backplane, and the second electronic device 30 may be a single board. In one embodiment, both the first electronic device 20 and the second electronic device 30 are single boards. In one embodiment, the second electronic device 30 is a backplane, and the first electronic device 20 is a network card. In one embodiment, the second electronic device 30 is a backplane, and the first electronic device 20 is a switch.
  • the first electronic device 20 is provided with a single board connector 21 and the second electronic device 30 is provided with a backplane connector 31.
  • the connection system 1 also includes a cable connector 11.
  • the cable connector 11 is electrically connected to the connector assembly 10 through the cable.
  • the end of the connector assembly 10 away from the cable connector 11 is connected to the single board connector 21.
  • the connector assembly 10 is connected to the first electronic device 20 through the connection between the cable connector 11 and the backplane connector 31 to realize the connection between the connector assembly 10 and the second electronic device 30 .
  • the connector assembly 10 is a male connector
  • the board connector 21 is a female connector
  • the cable connector 11 is a female connector
  • the backplane connector 31 is a male connector. In other implementations, it can be set according to actual needs This application does not limit the male and female connectors of the connector assembly 10 , the single board connector 21 , the cable connector 11 and the backplane connector 31 .
  • the interface model used by the connector assembly 10 to connect to the first electronic device 20 or the second electronic device 30 may be an I/O interface. In one embodiment, the interface model used by the connector assembly 10 to connect to the first electronic device 20 or the second electronic device 30 may be QSFP, SFP, OSFP, GenZ, CXP, minSAS HD and other interfaces.
  • the interconnection system 1 can be applied in a server cluster.
  • the server cluster includes multiple servers.
  • the server includes multiple interconnection systems 1.
  • the server includes a first electronic device 20, a second electronic device 30 and multiple There is a connector assembly 10.
  • the server also includes a third electronic device 40. Taking the first electronic device 20 as a service board, the second electronic device 30 as a high-speed backplane, and the third electronic device 40 as a switch as an example, the backplane connector 31 is fixedly connected to the high-speed backplane, the first electronic device 20 is connected to the second electronic device 30 through the connector assembly 10a, and the third electronic device 40 is connected to the second electronic device 30 through the connector assembly 10b.
  • the server includes a high-speed backplane 30, multiple service boards 20 and multiple switches 40.
  • One end of the connector assembly 10a is connected to the backplane connector 31, and the other end of the connector assembly 10a is connected to the backplane connector 31.
  • One end is connected to the service board 20, one end of the connector assembly 10b is connected to the backplane connector 31, and the other end of the connector assembly 10b is connected to the switch 40.
  • Signal communication is realized between the service board 20 and the switch 40 through the high-speed backplane 30.
  • the connector assembly 10 in this application is described in detail below.
  • Figure 3 is a perspective view of the connector assembly 10 provided by the first embodiment of the present application.
  • Figure 4 is an exploded view of Figure 3.
  • Figure 5 is a diagram of the first cable core 211.
  • Structural schematic diagram FIG. 6 is a schematic structural diagram of the first shielding shell 310.
  • the first embodiment of the present application provides a connector assembly 10.
  • the connector assembly 10 includes a circuit board 100, a first cable 210 and a first shielding shell 310; the circuit board 100 includes a ground layer 110, and the surface of the circuit board 100 is provided with The first signal tray 120 (shown in Figure 4); the first cable 210 is used to transmit signals.
  • the first cable 210 includes a first cable core 211 and a first shielding layer 212 (shown in Figures 3 and 4) , the first cable core 211 includes a first main body part 2112 and a first connection end 2111 located at one end of the first main body part 2112 (as shown in Figure 5), and the first shielding layer 212 is wrapped around the outside of the first main body part 2112,
  • the first connection end 2111 is connected to the first signal pad 120;
  • the first shielding shell 310 is fixed on the circuit board 100 and connected to the ground layer 110.
  • the first connection end 2111 and the first signal pad 120 are located between the first shielding shell 310 and the circuit between the boards 100 (as shown in FIG. 10 ), and the first shielding shell 310 and the first shielding layer 212 are in contact with a portion of the surface adjacent to the circuit board 100 , so that the first shielding layer 212 is connected to the ground layer 110 .
  • the circuit board 100 has a multi-layer structure.
  • a circuit board 100 may have one ground layer 110 .
  • the circuit board 100 may also have two or more ground layers. 110.
  • the circuit board 100 is provided with a signal layer (not shown in the figure).
  • the first signal disk 120 is electrically connected to the signal layer. Multiple signal layers can also be provided in the circuit board 100 as needed.
  • the signal layer and the ground layer 110 are arranged along the first signal layer.
  • Direction X is stacked, and the first direction And the relative positional relationship between the ground layer 110 and the signal layer is not limited.
  • the circuit board 100 can be a whole board, or include multiple circuit sub-boards.
  • the multiple circuit sub-boards are spliced into the circuit board 100.
  • the function of each circuit sub-board can be set as needed.
  • the surface of one of the circuit sub-boards is configured.
  • the orthographic projection of the first connection end 2111 on the circuit board 100 is located in the orthographic projection of the first signal disk 120 on the circuit board 100 (as shown in FIG. 10 ), and the first main body part 2112 is formed from the first
  • the connection end 2111 extends outside the circuit board 100, that is, the projection of part of the first main body 2112 along the first direction X is located on the circuit board 100, and the projection of part of the first main body 2112 along the first direction X is located outside the circuit board 100.
  • One direction X intersects the surface of the circuit board 100 .
  • the first direction X is perpendicular to the surface of the circuit board 100
  • the first direction X is the thickness direction of the connector assembly 10 .
  • the first connection end 2111 is welded to the first signal pad 120, so that the first connection end 2111 is connected to the first signal pad 120. 120 electrical connections.
  • part of the first body part 2112 located on the circuit board 100 is fixedly connected to the circuit board 100 through insulating glue, so that part of the first body part 2112 is fixed on the circuit board 100 to prevent the first body part 2112 from loosening. This results in poor contact between the first connection terminal 2111 and the first signal panel 120 , affecting the electrical connection between the first connection terminal 2111 and the first signal panel 120 .
  • the end of the circuit board 100 away from the first cable 210 is electrically connected to the first electronic device 20.
  • the end of the circuit board 100 away from the first cable 210 is provided with a gold finger, and the connector assembly 10 is implemented through the gold finger. Connection with the first electronic device 20 .
  • an end of the first cable 210 away from the first connection end 2111 is further provided with a cable connector 11 (as shown in FIG. 1 ). Through the cable connector 11, the first cable 210 and the second cable 210 are connected to each other.
  • the electronic device 30 is electrically connected.
  • the first cable core 211 is used to transmit signals.
  • the first cable core 211 includes a first sub-core 2113 and a second sub-core 2114 (as shown in Figure 5).
  • the first sub-core 2113 and the second sub-core 2114 are
  • the core 2114 is used to transmit a differential signal. Signal transmission is realized through the differential signal.
  • the differential signal is expressed as the level difference between the first sub-core 2113 and the second sub-core 2114.
  • Two sub-cores are provided in the first cable core 211. , when an external interference signal acts on the first cable core 211, the interference signal changes the levels of the first sub-core 2113 and the second sub-core 2114 at the same time.
  • the first signal panel 120 also includes two first signal sub-pans (not shown in the figure), and the two sub-cores are respectively connected to the two first signal sub-pans.
  • the first cable core 211 may also include only one sub-core.
  • the first signal disk 120 includes a first signal sub-disk, which implements signal transmission through single-ended signals, and the design structure is simple and convenient.
  • the first cable 210 is a groundless cable, that is, the first cable 210 does not contain a ground wire.
  • the first cable 210 is grounded through the first shielding layer 212 so that the first cable 210 is grounded. Since it does not contain a ground wire, , the size of the first cable 210 is small, and the connection between the first cable 210 and the circuit board 100 is more convenient, so that the connector assembly 10 is small in size and has high assembly efficiency.
  • the first cable core 211 is wrapped around the first insulation layer, the first shielding layer 212 and the second insulation layer in sequence. In Figures 3 and 4, only the first cable core 211 and the first shielding layer 212 are shown, not shown.
  • the first insulation layer is coated on the outside of the first cable core 211 to insulate and isolate the first cable core 211 from the first shielding layer 212; the first shielding layer 212 is coated on the outside of the first cable core 211.
  • grounding the first shielding layer 212 can reduce the impact of crosstalk on the signal transmission of the first cable core 211;
  • the insulating layer covers the outside of the first shielding layer 212 and is used to isolate the first shielding layer 212 from the outside world.
  • the outside of the first connection terminal 2111 is not covered with the first insulation layer, the first shielding layer 212 and the second insulation layer, so as to facilitate the electrical connection between the first connection terminal 2111 and the first signal pad 120 .
  • the contact portion between the first main body 2112 and the first shielding layer 212 is only covered with the first insulating layer and the first shielding layer 212, and part of the second insulating layer is removed to expose the first shielding layer 212.
  • the first shielding layer 212 is brought into contact with the first shielding layer 212 .
  • the first shielding layer 212 is aluminum foil.
  • the material of the first shielding layer 212 may also be other conductive metals with good ductility.
  • the first shielding shell 310 is disposed on the peripheral side of the first connection end 2111, and the first shielding shell 310 extends to the outside of the first main body part 2112 along the third direction Z.
  • a shielding layer 212 is in contact, and the third direction Z is the extension direction of the first cable 210 on the circuit board 100.
  • the third direction Z is parallel to the surface of the circuit board 100, and the third direction Z is parallel to the surface of the circuit board 100.
  • the first direction X is vertical.
  • the third direction Z is the length direction of the connector assembly 10 .
  • the first shielding shell 310 is in contact with a portion of the surface of the first shielding layer 212 away from the circuit board 100 along the first direction X. In other embodiments, the first shielding shell 310 may also be in contact with the first shielding layer 212 . Other surfaces of 212 are in contact. For example, the first shielding shell 310 is in contact with two surfaces of the first shielding layer 212 along the second direction Y, and the second direction Y intersects the extension direction of the first cable 210 . The first shielding layer 212 is connected to the ground layer 110 by connecting to the first shielding shell 310, so that the first shielding layer 212 is grounded.
  • the first shielding shell 310 is detachably connected to the circuit board 100 , which enables quick disassembly and assembly of the first shielding shell 310 and improves the reuse rate of the first shielding shell 310 .
  • the connection method between the first shielding shell 310 and the circuit board 100 includes but is not limited to fisheye crimping or pin welding.
  • the orthographic projection of the first shielding shell 310 on the circuit board 100 covers the orthographic projection of the first connection terminal 2111 on the circuit board 100.
  • the size of the first shielding shell 310 is slightly larger than the size of the first connection terminal 2111. , in order to reduce the area occupied by the first shielding shell 310 of the circuit board 100, reduce costs and increase signal density, the shorter distance between the first shielding shell 310 and the first connection end 2111 can achieve better shielding effect.
  • the material of the first shielding shell 310 may be metal such as iron, copper, aluminum, etc.
  • the material of the first shielding shell 310 may also be an alloy or conductive plastic, conductive plastic, or other conductive material.
  • the first cable 210 in the prior art includes a first cable core 211 and a ground wire 213, such as a single ground wire cable (as shown in Figure 7a ) and a double-ground cable (as shown in Figure 7b), it is only necessary to ground the ground wire 213 in the first cable 210.
  • a ground wire 213 such as a single ground wire cable (as shown in Figure 7a ) and a double-ground cable (as shown in Figure 7b)
  • the first cable 210 with the ground wire 213 is large in size and takes up a lot of space on the circuit board 100, which is not conducive to The signal transmission density of the connector assembly 10 is increased.
  • a separate shielding member for grounding needs to be provided for the first cable 210 without the ground wire 213, a separate shielding member for grounding needs to be provided.
  • the shielding member overlaps the shielding layer of the first cable 210, and a fixing part for fixing the shielding member also needs to be provided to connect the grounding.
  • the shielding member is fixed on the first cable 210. This solution will cause complex processing of the connector assembly 10 and increase the number of parts.
  • the connector assembly 10 When the connector assembly 10 is provided with a ground pad, if the surface of the first shielding layer 212 close to the ground pad is bonded or welded to the ground pad, no additional fixing structure is added to the first shielding layer 212. In the connector assembly During the use of 10, the problem of poor contact between the ground pad and the first shielding layer 212 is also prone to occur, and the process is complex and the processing efficiency is low. When the first cable 210 is subsequently replaced, the circuit board 100 or the first cable 210 may easily be damaged. of damage. The above-mentioned solutions for grounding the first shielding layer 212 do not solve the signal shielding problem and the grounding problem at the first connection end 2111.
  • the first shielding shell 310 contacts the first shielding layer 212 on the first body part 2112, so that the first cable 210 can be grounded. Ensuring normal signal transmission can not only reduce the interference of external signals on the signal transmission of the first cable 210, but also reduce the insertion loss of the first sub-core and the second sub-core and improve the signal transmission quality; at the same time, the first shielding shell 310 and the first shielding layer 212 are in face-to-face contact.
  • the first shielding shell 310 is not easy to damage the first shielding layer 212 and ensures good contact between the first shielding shell 310 and the first shielding layer 212 .
  • the first shielding shell 310 is located outside the first connection end 2111, which can shield external interference signals at the first connection end 2111 and improve signal transmission stability, because the first connection end 2111 needs to communicate with the first signal
  • the disk 120 is electrically connected, and the first connection end 2111 is not covered with the first shielding layer 212.
  • the first connection end 2111 is easily interfered by external signals, and the first shielding shell 310 can isolate the first connection end 2111 from external interference signals. , reduce the loss of signal transmission and the occurrence of transmission errors at the first connection end 2111, and ensure the integrity of the signal transmission by the first cable 210.
  • the first shielding shell 310 is also used as a signal at the first connection end 2111. With reference to the ground, the first shielding shell 310 is connected to the first shielding layer 212 to realize the continuity of the reference ground of the signal at the first connection end 2111 and improve the stability of signal transmission.
  • the connector assembly 10 also includes a housing 400 (shown in FIG. 8 ) in which the circuit board 100 and the first cable 210 are located.
  • the housing 400 of the connector assembly 10 also has a certain shielding effect and can also be used for signal shielding of the first connection end 2111, if The casing 400 shields the signal and grounds the first cable 210.
  • an additional shielding elastic piece (not shown in the figure) needs to be provided on the inner surface of the casing 400. The shielding elastic piece will shield the first cable 210.
  • the layer 212 is pressed tightly to realize the grounding of the first shielding layer 212.
  • the housing 400 is generally a standard housing and the volume of the housing 400 is larger than the first shielding housing 310, the housing 400 and the first connection end 2111 The distance is far, not only the shielding effect at the first connection end 2111 is poor, but also the matching between the shielding elastic piece and the housing 400 is poor, the shielding elastic piece has a poor contact effect with the first shielding layer 212, and a good connection cannot be achieved
  • the accuracy of the connection between the housing 400 and the first connection end 2111 is poor, and the shielding elastic sheet is also easy to damage the first shielding layer 212.
  • the method of arranging the shielding elastic sheet on the housing 400 is complicated in process and high in cost. Therefore, compared with this embodiment, The first shielding shell 310 in the first shielding shell 400 has a poor signal shielding effect and is not enough to achieve high-quality signal transmission.
  • the first shielding shell 310 when the first shielding shell 310 is in contact with the surface of the first shielding layer 212 away from the circuit board 100 and the first shielding shell 310 is fixed on the circuit board 100 , the first shielding shell 310 can press the first cable 210 Towards the circuit board 100, the first cable 210 is fixed between the first shielding shell 310 and the circuit board, which can reduce defects in the electrical connection between the first connection end 2111 and the first signal panel 120 due to vibration of the connector assembly 10. influence to ensure the stability of the connection between the first connection terminal 2111 and the first signal panel 120 .
  • the height of the first shielding shell 310 along the first direction The layer 212 is tightly fitted to ensure that the first shielding layer 212 is always grounded, and the first shielding shell 310 can adapt to the first cables 210 of different sizes, thereby improving the utilization rate of the first shielding shell 310.
  • the modification of the first cable 210 is not involved. Only installing the first shielding shell 310 can realize the grounding of the first shielding layer 212, thereby achieving the effect of reducing crosstalk and lowering the insertion loss. Using the third A shielding shell 310 has high processing efficiency and simple assembly.
  • FIG. 8 is a schematic structural diagram of the connector assembly 10 .
  • FIG. 9 is an exploded view of the connector assembly 10 in FIG. 8 .
  • the connector assembly 10 further includes a housing 400, an unlocking buckle 500 and a pull ring 600 (as shown in Figures 8 and 9), a portion of the circuit board 100, a portion of the first cable 210 and a first shielding shell 310 is located in the housing 400.
  • the first cable 210 extends from the inside of the housing 400 to the outside of the housing 400 along the third direction Z to facilitate the connection between the first cable 210 and the second electronic device 30; the circuit board 100 extends along the third direction Z.
  • the housing 400 includes a connected first sub-housing 410 and a second sub-housing 420.
  • the housing 400 is a detachable housing to facilitate the connection of the first cable 210, the first shielding shell 310 and
  • the circuit board 100 is installed into the housing 400 to facilitate assembly of the connector assembly 10 .
  • the first shielding shell 310 includes a first sub-part 311, a second sub-part 312 and a third sub-part 313 connected in sequence (as shown in FIG. 6).
  • An extension of the first sub-part 311 The direction and the extension direction of the third sub-part 313 intersect with the extension direction of the second sub-part 312, and the ends of the first sub-part 311 and the third sub-part 313 away from the second sub-part 312 are fixed on the circuit board 100 and connected with the circuit board 100.
  • the ground layer 110 is connected, and at least part of the second sub-portion 312 is elastically contacted with the first shielding layer 212 so that the first shielding layer 212 is connected to the ground layer 110 .
  • the extension direction of the first sub-section 311 , the extension direction of the second sub-section 312 and the extension direction of the third sub-section 313 all refer to the extension direction of the entire board surface.
  • the first sub-portion 311 and the third sub-portion 313 can also be curved plates with a certain curvature in other embodiments.
  • the shape of the second sub-portion 312 depends on the shape of the surface of the first shielding layer 212. If the surface of the first shielding layer 212 facing away from the circuit board 100 is square, then the second sub-portion 312 and the surface of the first shielding layer 212 are square.
  • the contact portion of the first shielding layer 212 can be set in a square shape.
  • the contact portion of the second sub-portion 312 and the first shielding layer 212 can be set in an arc shape. shape to ensure that the second sub-part 312 and the first shielding layer 212 can be arranged in close contact and ensure the reliability of the connection between the second sub-part 312 and the first shielding layer 212.
  • the first shielding shell 310 is generally in the shape of a "concave", and the notch faces the first cable 210 to cover the first cable 210 .
  • the extension direction of the first sub-section 311 and the extension direction of the third sub-section 313 are parallel, and the extension directions of the first sub-section 311 and the extension direction of the third sub-section 313 are parallel to the extension directions of the second sub-section 312 .
  • the extension directions intersect perpendicularly.
  • the extending direction of the first sub-portion 311 and the extending direction of the third sub-portion 313 are both parallel to the first direction X.
  • the extension direction of the second sub-portion 312 is parallel to the surface of the circuit board 100 .
  • the first shielding shell 310 Since the first shielding shell 310 is a metal shell, the first shielding shell 310 has a certain degree of elasticity. Specifically, the second sub-section 312 can move closer to or away from the circuit board 100 along the first direction X, and the second sub-section 312 abuts against When the first shielding layer 212 is applied, the second sub-portion 312 elastically deforms away from the circuit board 100 along the first direction X, and the second sub-portion 312 generates an elastic force along the first direction The portion 312 is in close contact with the first shielding layer 212, and when the connector assembly 10 vibrates and drives the first cable 210 to vibrate in the first direction Movement, the second sub-section 312 maintains a stable and reliable connection with the first shielding layer 212 to ensure that the first shielding layer 212 is grounded and improve the shielding effect of the first shielding shell 310 and the quality of signal transmission.
  • the ends of the first sub-part 311 and the third sub-part 313 away from the second sub-part 312 are both connected to the ground layer 110, and the connection reliability between the first shielding shell 310 and the ground layer 110 is higher.
  • one of the first sub-portion 311 and the third sub-portion 313 is connected to the ground layer 110 , and the other of the first sub-portion 311 and the third sub-portion 313 can be directly soldered to the circuit board 100 close to the ground layer 110 .
  • the first shielding shell 310 has an integrated structure, and the first sub-section 311, the second sub-section 312 and the third sub-section 313 are integrally formed, which has higher structural strength and ensures the normal operation of the first shielding shell 310. .
  • the first shielding shell 310 is integrally stamped and formed, which has simple processing procedures and low cost.
  • the second sub-portion 312 is recessed toward the first cable 210 to form a first groove 3121 (as shown in FIG. 6 ) along the first direction X, which intersects the circuit board 100,
  • the bottom of the first groove 3121 is in elastic contact with the first shielding layer 212 .
  • the connection reliability of the shielding layer 212 is higher, and the connection between the second sub-part 312 and the first sub-part 311 and the third sub-part 313 is stronger, especially when the connector assembly 10 is used in an environment with frequent vibrations.
  • the arrangement of the first groove 3121 can ensure a stable connection between the first shielding shell 310 and the first shielding layer 212 and enable high-quality signal transmission.
  • the extending direction of the first groove 3121 is the same as the extending direction of the first shielding layer 212, that is, the first groove 3121 and the first shielding layer 212 both extend along the third direction Z, increasing the size of the first groove 3121.
  • the contact area between the groove 3121 and the first shielding layer 212 enables the first shielding shell 310 to achieve a better shielding effect.
  • the extension direction of the first groove 3121 may be different from the extension direction of the first shielding layer 212 , and the extension direction of the first groove 3121 may be set according to actual needs.
  • part of the second sub-portion 312 is recessed toward the first cable 210 along the first direction
  • the boards 100 are parallel to facilitate the installation connection between the first shielding housing 310 and the circuit board 100 .
  • the first groove 3121 is provided with a first opening 3122 that penetrates the bottom of the groove (as shown in FIG. 6 ).
  • the first opening 3122 can increase the elasticity of the first groove 3121 to reduce the possibility of warping when the first shielding shell 310 is assembled and ensure good contact between the bottom of the first groove 3121 and the first shielding layer 212 .
  • At least part of the first opening 3122 does not overlap with the orthographic projection of the first shielding layer 212 on the circuit board 100 . At least part of the first opening 3122 is located in the part where the first groove 3121 is not in contact with the first shielding layer 212. While increasing the elasticity of the first groove 3121, the distance between the first groove 3121 and the first shielding layer 212 is increased as much as possible. The contact area enables the first shielding shell 310 to perform a better shielding effect.
  • the orthographic projection of the first opening 3122 and the first shielding layer 212 on the circuit board 100 does not overlap (as shown in FIG. 10 ), and the first opening 3122 is located in the first groove 3121 and does not overlap with the first
  • the contact area of the shielding layer 212 increases the elasticity of the first groove 3121 without reducing the contact area between the first groove 3121 and the first shielding layer 212, so that the first shielding shell 310 can perform better. Shielding effect.
  • the orthographic projection of the first opening 3122 and the first connection end 2111 on the circuit board 100 at least partially overlaps.
  • the first shielding shell 310 is first fixed on the circuit board 100 , and then weld the first connection end 2111 to the first signal plate 120 through the first opening 3122, or bond the first connection end 2111 to the first signal plate 120 through the first opening 3122 by dispensing glue.
  • the first shielding shell 310 can play a positioning role for the installation of the first cable 210 .
  • the orthographic projection of the first opening 3122 and the first connection end 2111 on the circuit board 100 at least partially overlaps.
  • pins 301 are provided at one end of the first sub-part 311 and the third sub-part 313 away from the second sub-part 312 (as shown in FIG. 6 ), and a ground through hole is provided on the circuit board 100 101 (as shown in Figure 4), the ground through hole 101 is connected to the ground layer 110, and the pin 301 extends into the ground through hole 101 to connect the first shielding shell 310 to the ground layer 110.
  • the ground through hole 101 is provided on the peripheral side of the first cable 210, and the ground through hole 101 penetrates the circuit board 100 along the first direction X close to the surface of the first shielding shell 310, and is connected to the ground through hole 101 through the pin 301 To achieve fixed connection between the first shielding shell 310 and the circuit board 100 .
  • the ground through hole 101 penetrates both surfaces of the circuit board 100 along the first direction X, making the connection between the pin 301 and the ground through hole 101 simpler and more reliable.
  • the circuit board 100 is provided with four ground through holes 101
  • the first sub-section 311 is provided with two pins 301 at one end away from the second sub-section 312
  • the third sub-section 313 is located away from the second sub-section
  • One end of 312 is also provided with two pins 301
  • the four pins 301 respectively extend into the four ground through holes 101 to achieve stable connection between the first shielding shell 310 and the circuit board 100.
  • a ground pad 111 is provided on the surface of the circuit board 100 close to the first cable 210 (as shown in FIG. 4 ), and the ground pad 111 is connected to the part of the first shield close to the side of the circuit board 100 Layers 212 abut.
  • the ground pad 111 and the first shielding shell 310 are arranged so that both surfaces of the first cable 210 along the first direction The layer 212 is pressed tightly against the ground pad 111, which can provide a better shielding effect and reduce the impact of the external environment on the signal transmission of the first cable 210.
  • the ground pad 111 is electrically connected to the ground layer 110 , and both surfaces of the first cable 210 along the first direction X are electrically connected to the ground layer 110 .
  • the ground pad 111 is a metal sheet disposed at a local position on the surface of the circuit board 100, and the first shielding layer 212 is close to the surface of the circuit board 100 and contacts the metal sheet to achieve a shielding effect.
  • a portion of the first shielding layer 212 is welded to a surface close to the ground pad 111 to protect and fix the first cable 210 .
  • part of the surface of the first shielding layer 212 close to the ground pad 111 is bonded to the ground pad 111 , for example, the first shielding layer 212 is bonded to the ground pad 111 through ultraviolet curable glue (UV glue). to protect and fix the first cable 210.
  • UV glue ultraviolet curable glue
  • Figure 11 is a perspective view of the connector assembly 10 provided by the second embodiment of the present application.
  • Figure 12 is an exploded view of Figure 11.
  • the second embodiment of the present application provides a connector assembly 10, and What is different from the first embodiment is that the surface of the circuit board 100 is also provided with a second signal plate 130.
  • the connector assembly 10 also includes a second cable 220 and a second shielding shell 320.
  • the second cable 220 includes a second cable core. 221 and the second shielding layer 222.
  • the second cable core 221 includes a second main body 2212 and a second connection end 2211 located at one end of the second main body 2212.
  • the second shielding layer 222 is wrapped around the outside of the second main body 2212.
  • the second connection end 2211 is connected to the second signal pad 130; the second shielding shell 320 is fixed on the circuit board 100 and connected to the ground layer 110.
  • the second connection end 2211 and the second signal pad 130 are located between the second shielding shell 320 and the circuit between the boards 100, and the second shielding shell 320 and the second shielding layer 222 are in contact with the surface away from the circuit board 100, so that the second shielding layer 222 is connected to the ground layer 110;
  • the second shielding shell 320 and the first shielding shell 310 Located on the same side of the circuit board 100 , the second shielding shell 320 and the first shielding shell 310 are spaced apart along the second direction Y, and the second direction Y intersects the extension direction of the first cable 210 .
  • the arrangement of the second cable 220 increases the signal transmission density of the connector assembly 10 .
  • the second signal panel 130 and the second cable 220 are both located on the surface of the circuit board 100 close to the first cable 210.
  • the orthographic projection of the second shielding shell 320 on the circuit board 100 is the same as the orthographic projection of the first shielding shell 310 on the circuit board 100. Orthographic projections do not overlap.
  • the second direction Y intersects the first direction X and the third direction Z. In this embodiment, the second direction Y, the first direction X and the third direction Z are perpendicular to each other.
  • the second direction Y is the axis of the connector assembly 10 In the width direction, the first direction X is the thickness direction of the connector component 10 , and the third direction Z is the length direction of the connector component 10 .
  • the second cable 220 is the same as the first cable 210 , and the second shielding shell 320 and the first shielding shell 310 have the same structure and volume.
  • the outer diameter of the second cable 220 is the same as the outer diameter of the first cable 210 . In one embodiment, the outer diameter of the second cable 220 and the outer diameter of the first cable 210 may also be different. In one embodiment, the materials and volumes of the second shielding housing 320 and the first shielding housing 310 may also be different.
  • the first cable 210 is an input signal cable
  • the second cable 220 is an output signal cable. In one embodiment, the second cable 220 is an input signal cable, and the first cable 210 is an output signal cable. In one embodiment, both the first cable 210 and the second cable 220 are input signal cables. In one embodiment, both the first cable 210 and the second cable 220 are output signal cables.
  • first shielding shell 310 and the second shielding shell 320 are not provided, when the first cable 210 and the second cable 220 transmit signals, the first cable 210 and the second cable 220 are coupled to each other, and the first cable 210 and the second cable 220 are coupled to each other.
  • the transmission of signals between the cable 210 and the second cable 220 will have adverse effects.
  • the crosstalk between the two cables will be more serious, where the The crosstalk between the end of the first cable 210 close to the first connection end 2111 and the end of the second cable 220 close to the second connection end 2211 is called near-end crosstalk.
  • the crosstalk between the end of the cable 220 close to the second connection end 2211 is called far-end crosstalk.
  • the crosstalk between the end of the second cable 220 close to the second connection end 2211 and the end of the first cable 210 close to the first connection end 2111 Crosstalk is called near-end crosstalk
  • crosstalk between the end of the second cable 220 far away from the second connection end 2211 and the end of the first cable 210 close to the first connection end 2111 is called far-end crosstalk.
  • the arrangement of the first shielding shell 310 can reduce the interference of the second cable 220 on the transmission signal of the first cable 210
  • the arrangement of the second shielding shell 320 can reduce the interference of the first cable 210 on the transmission signal of the first cable 210.
  • the interference of the signals transmitted by the two cables 220 not only increases the density of signals transmitted by the connector assembly 10, but also improves the quality of signal transmission within the connector assembly 10.
  • Figure 13a is a far-end crosstalk optimization effect diagram in the second embodiment of the present application.
  • Figure 13b is a near-end crosstalk optimization effect diagram in the second embodiment of the present application.
  • the effect of end crosstalk and far end crosstalk optimization is compared with the implementation shown in Figure 11 with the single ground wire cable grounding implementation in Figure 7a and the dual ground wire cable grounding implementation in Figure 7b.
  • Figures 13a and 13b the abscissa represents frequency, and the ordinate represents crosstalk amplitude.
  • PSFEXT_diff2_outCD_Q112Imported represents the far-end crosstalk test data of the implementation in Figure 11
  • PSFEXT_diff2_outCD_Dgnd Imported represents the far-end crosstalk of the dual-ground cable grounding implementation in Figure 7b.
  • PSFEXT_diff2_outCD_Q56_Sgnd Imported represents the far-end crosstalk test data of the implementation of single ground cable grounding in Figure 7a; in Figure 13b, PSNEXT_diff2_outCD_Q112Setup1: Sweep represents the near-end crosstalk test data of the implementation in Figure 11, PSNEXT_diff2_outCD_Dgnd Imported represents Figure 7b
  • the near-end crosstalk test data of the implementation of double ground cable grounding PSNEXT_diff2_outCD_Sgnd Imported represents the near-end crosstalk test data of the implementation of single ground cable grounding in Figure 7a.
  • Figure 13a and Figure 13b compared with the implementation of Figure 11
  • both near-end crosstalk and far-end crosstalk are optimized by 25dB, and the crosstalk amplitude is optimized by about 25%.
  • the implementation in Figure 11 has an optimized near-end crosstalk of 33dB and an improved far-end crosstalk. 35dB, the overall crosstalk amplitude increases by about 58%.
  • the use of a groundless cable combined with a shielded shell improves the shielding effect on crosstalk, especially the crosstalk shielding at the first connection end 2111 and the second connection end 2211.
  • the effect is to make the signal transmission quality higher.
  • the connector assembly 10 further includes more first cables 210 and/or second cables 220 (as shown in FIG. 14 ), and the plurality of cables are located on the circuit board 100 along the first direction X.
  • the circumference of each cable is covered with a shielding shell, and multiple shielding shells are spaced apart along the second direction Y, which increases the density of signals transmitted by the connector assembly 10 .
  • the connector assembly 10 can be provided with 4, 8, 16 or other numbers of cables according to actual needs. Each cable is surrounded by a shielding shell, and multiple shielding shells are provided along the second Setting intervals in the direction Y increases the density of signal transmission by the connector assembly 10.
  • the spacing of the cables along the second direction Y can be 3.62 mm to 2.23 mm. When a larger number of cables are provided, the distance between the cables along the second direction Y The spacing can be less than 2.23 mm. Due to the setting of shielded shells between multiple cables, the crosstalk performance between signals at the cable connection ends is improved, the ground return flow of multiple cables is improved, and the loop inductance of multiple cables is reduced.
  • Figure 15 is a top view of the connector assembly 10 provided by the third embodiment of the present application.
  • Figure 16 is a bottom view of the connector assembly 10 provided by the third embodiment of the present application.
  • Figure 17 This is a cross-sectional view of a connector assembly 10 provided in the third embodiment of the present application.
  • the third embodiment of the present application provides a connector assembly 10. The difference from the first embodiment is that the surface of the circuit board 100 is also provided with a third
  • the signal board 140, the connector assembly 10 also includes a third cable 230 and a third shielding shell 330.
  • the third cable 230 includes a third cable core 231 and a third shielding layer 232.
  • the third cable core 231 includes a third main body part.
  • the third shielding layer 232 is wrapped around the outside of the third main body 2312.
  • the third connection end 2311 is connected to the third signal panel 140;
  • the third shielding shell 330 Fixed on the circuit board 100 and connected to the ground layer 110, the third connection terminal 2311 and the third signal pad 140 are located between the third shielding shell 330 and the circuit board 100, and the third shielding shell 330 is adjacent to the third shielding layer 232
  • the surface of the circuit board 100 is in contact with each other so that the third shielding layer 232 is connected to the ground layer 110;
  • the third shielding shell 330 and the first shielding shell 310 are respectively located on both sides of the circuit board along the first direction X, and the first direction X and
  • the circuit board 100 intersects, and the orthographic projections of the first shielding housing 310 and the third shielding housing 330 on the circuit board 100 at least partially do not overlap.
  • the arrangement of the third cable 230 increases the signal transmission density of the connector assembly 10 .
  • the third signal plate 140 and the third cable 230 are located on the surface of the circuit board 100 away from the first cable 210 along the first direction X.
  • the third shielding shell 330 and the first shielding shell 310 are respectively located on the surface of the circuit board along the first direction X.
  • the two sides can save space on the circuit board 100, so that more cables or other electronic components can be connected to the circuit board 100.
  • the first cable 210 is an input signal cable
  • the third cable 230 is an output signal cable.
  • the third cable 230 is an input signal cable
  • the first cable 210 is an output signal cable.
  • both the first cable 210 and the third cable 230 are input signal cables.
  • both the first cable 210 and the third cable 230 are output signal cables.
  • the third shielding housing 330 is located on one side of the first shielding housing 310 along the third direction Z, or the first shielding housing 310 is located on one side of the third shielding housing 330 along the third direction Z (as shown in Figure 17 as shown), the third shielding shell 330 and the first shielding shell 310 are arranged staggered along the third direction Z, that is, the orthographic projection of the third shielding shell 330 on the circuit board 100 and the orthogonal projection of the first shielding shell 310 on the circuit board 100
  • the projections are at least partially non-overlapping, which can better reduce the crosstalk at the third connection end 2311 and the first connection end 2111, and reserve space to facilitate the connection between the third shielding shell 330 and the first shielding shell 310 and the circuit board 100.
  • the third shielding shell 330 and the first shielding shell 310 are fixedly connected to the circuit board using the ground through hole 101, the third shielding shell 330 and the first shielding shell 310 are staggered along the third direction Z.
  • the ground through hole 101 of 330 is also staggered with the ground through hole 101 of the first shielding shell 310 along the third direction Z, so that the installation of the third shielding shell 330 and the installation of the first shielding shell 310 will not interfere with each other.
  • the third shielding housing 330 is located on one side of the first shielding housing 310 along the second direction Y, or the first shielding housing 310 is located on one side of the third shielding housing 330 along the second direction Y.
  • Housing 330 and first shield The housings 310 are staggered along the second direction Y, that is, the orthographic projection of the third shielding housing 330 on the circuit board 100 and the orthographic projection of the first shielding housing 310 on the circuit board 100 at least partially do not overlap, which can better reduce the Crosstalk at the three connection terminals 2311 and the first connection terminal 2111, and space is reserved to facilitate the installation of the third shielding housing 330 and the first shielding housing 310 with the circuit board 100, for example, the third shielding housing 330 and the first shielding housing 330 When the shell 310 is fixedly connected to the circuit board using the ground through hole 101, the third shielding shell 330 and the first shielding shell 310 are staggered along the second direction Y, and the ground through hole 101 of the third shielding shell
  • the orthographic projection of the third shielding shell 330 on the circuit board 100 and the position of the first shielding shell 310 on the circuit board can be achieved. Orthographic projections on 100 do not overlap.
  • the third shielding housing 330 is located on one side of the first shielding housing 310 along the second direction Y, and the third shielding housing 330 is located on one side of the first shielding housing 310 along the third direction Z.
  • the housing 330 and the first shielding housing 310 are staggered along the second direction Y and the third direction Z, which can better reduce the crosstalk at the third connection end 2311 and the first connection end 2111 and reserve space for convenience. Install the third shielding case 330 and the first shielding case 310 with the circuit board 100 .
  • the orthographic projection of the third shielding shell 330 on the circuit board 100 and the orthographic projection of the first shielding shell 310 on the circuit board 100 may also overlap.
  • the ground through holes 101 of the first shielding casing 310 and the third shielding casing 330 need to be staggered with the ground through holes 101 of the first shielding casing 310.
  • the pins 301 on the third shielding casing 330 need to be positioned in the same direction as the first shielding casing 330.
  • the positions of the pins 301 of the shielding shell 310 are different, so that the respective pins 301 correspond to the respective ground through holes 101 .
  • the connector assembly 10 further includes a plurality of first cables 210 spaced apart along the second direction Y, and the connector assembly 10 includes a plurality of third cables 230 spaced apart along the second direction Y,
  • the plurality of first cables 210 and the plurality of third cables 230 are respectively located on both sides of the circuit board 100 along the first direction X.
  • the circumference of each first cable 210 is covered with a first shielding shell 310.
  • the third cable 230 is evenly covered with a third shielding shell 330 on its circumference.
  • a plurality of first shielding shells 310 are spaced apart along the second direction Y, and a plurality of third shielding shells 330 are spaced apart along the second direction Y.
  • the first shielding shells 310 and the third shielding shells 330 are staggered, which increases the signal transmission density of the connector assembly 10 and leaves space to facilitate the connection between the third shielding shells 330 and the first shielding shells 310 and the circuit board. 100 installed.
  • the circuit board 100 is provided with the same number of first cables 210 and third cables 230 on both sides of the first direction X, and one of the first cables 210 and the third cable 230 is an input signal. Cable, the other one of the first cable 210 and the third cable 230 is an output signal cable.
  • Figure 18 is an exploded view of the connector assembly 10 provided in the fourth embodiment of the present application.
  • the fourth embodiment of the present application provides a connector assembly 10. What is different from the first embodiment is that the circuit board 100
  • a second signal plate 130 is also provided on the surface of
  • the core 221 includes a second main body 2212 and a second connection end 2211 located at one end of the second main body 2212.
  • the second shielding layer 222 covers the outside of the second main body 2212.
  • the second connection end 2211 is connected to the second signal plate 130.
  • the second shielding shell 320 is fixed on the circuit board 100 and connected to the ground layer 110, the second connection terminal 2211 and the second signal plate 130 are located between the second shielding shell 320 and the circuit board 100, and the second shielding shell 320
  • the second shielding layer 222 is in contact with the surface adjacent to the circuit board 100 so that the second shielding layer 222 is connected to the ground layer 110;
  • the second shielding shell 320 and the first shielding shell 310 are located on the same side of the circuit board 100.
  • the housing 320 and the first shielding housing 310 are connected side by side along the second direction Y, and the second direction Y intersects the extension direction of the first cable 210 .
  • the arrangement of the second cable 220 increases the signal transmission density of the connector assembly 10 .
  • the second signal panel 130 and The second cables 220 are all located on the surface of the circuit board 100 close to the first cable 210.
  • the orthographic projection of the second shielding shell 320 on the circuit board 100 does not overlap with the orthographic projection of the first shielding shell 310 on the circuit board 100.
  • the second shielded shell 320 and the first shielded shell 310 are connected side by side along the second direction Y.
  • the second cable 220 is arranged closer to the first cable 210, which can save space on the circuit board 100 and enable connection on the circuit board 100. More cables or other electronic components.
  • the arrangement of the first shielding shell 310 can reduce the interference of the second cable 220 on the signal transmitted by the first cable 210.
  • the arrangement of the second shielding shell 320 can reduce the interference of the first cable 210 on the signal transmitted by the second cable 220. Interference not only increases the density of signals transmitted by the connector assembly 10, but also improves the quality
  • the fifth embodiment of the present application provides a connector assembly 10.
  • the first shielding shell 310 includes a first sub-part 311, a second sub-part 312 and a first sub-part 312 connected in sequence.
  • the third sub-part 313 and at least part of the second sub-part 312 are in elastic contact with the first shielding layer 212;
  • the second shielding shell 320 includes the third sub-part 313, the fourth sub-part 314 and the fifth sub-part 315 connected in sequence, at least Part of the fourth sub-section 314 is in elastic contact with the second shielding layer 222 .
  • the extension direction of the first sub-part 311, the extension direction of the third sub-part 313 and the extension direction of the fifth sub-part 315 all intersect with the extension direction of the second sub-part 312 or the extension direction of the fourth sub-part 314;
  • the end of one sub-section 311 away from the second sub-section 312 is fixed on the circuit board 100 and connected to the ground layer 110
  • the end of the third sub-section 313 away from the second sub-section 312 or the fourth sub-section 314 is fixed on the circuit board 100
  • one end of the fifth sub-part 315 away from the fourth sub-part 314 is fixed on the circuit board 100 and connected to the ground layer 110 .
  • the overall shape of the first shielding shell 310 and the second shielding shell 320 is roughly "M" shaped.
  • the first shielding shell 310 and the second shielding shell 320 share the third sub-section 313.
  • the space on the circuit board 100 can be saved. , so that more cables or other electronic components can be connected to the circuit board 100; on the other hand, the manufacturing cost of the first shielding shell 310 and the second shielding shell 320 can be saved.
  • Figure 20 is an exploded view of the connector assembly 10 provided by the fifth embodiment of the present application.
  • Figure 21 is a bottom view of the shielding shell provided by the fifth embodiment of the present application.
  • the first sub-part 311, the third sub-part 313 and the fifth sub-part 315 can be simplified from the plate shape to the columnar shape, making the processing and installation of the shielding shell easier.
  • the first shielding shell 310 and the second shielding shell 320 have an integrated structure, and the shielding shell is integrally formed. On the one hand, it saves space on the circuit board 100 and allows the cables to be placed on the circuit board 100 It can be arranged in high density to improve the signal transmission density and quality of the connector assembly 10; on the other hand, it makes the processing of the shielding shell easier, improves the processability, and improves the production efficiency of the shielding shell; on the other hand, first The shielding shell 310 and the second shielding shell 320 can position the first cable 210 and the second cable 220 for installation, so that the first cable 210 and the second cable 220 can be installed on the circuit board 100 more accurately. superior.
  • Figure 22a is a far-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • Figure 22b is a near-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • the abscissa represents the frequency
  • the ordinate represents the crosstalk amplitude.
  • PSFEXT_diff2_outCD Imported represents the remote test data of the implementation in Figure 20
  • PSFEXT_diff2_outCD_dualdrain Imported represents the remote test data of the dual ground cable grounding implementation in Figure 7b.
  • PSFEXT_diff2_outCD_singledrain Imported represents the remote test data of the single ground cable grounding implementation in Figure 7a; in Figure 22b, PSNEXT_diff2_outCD Imported represents the near-end test data of the implementation in Figure 20, PSNEXT_diff2_outCD_dualdrain Imported represents the dual grounding implementation in Figure 7b
  • PSNEXT_diff2_outCD_singledrain Imported represents the near-end test data of the single ground cable grounding implementation in Figure 7a.
  • the crosstalk amplitude at 28GHz is selected as the frequency point for optimization comparison.
  • the implementation of Figure 20 Compared with the implementation of double-ground cable grounding in Figure 7b, the comprehensive near-end crosstalk is optimized by 7dB, and the crosstalk amplitude is optimized by about 12%; the comprehensive far-end crosstalk is optimized by 9dB, and the crosstalk amplitude is optimized by about 17%.
  • the implementation in Figure 20 has a comprehensive near-end crosstalk optimization of 8dB, and the crosstalk amplitude is optimized by about 14%; the comprehensive far-end crosstalk is optimized by 12dB, and the crosstalk amplitude is optimized by about 23%.
  • the use of a groundless cable combined with a shielded shell improves the shielding effect on crosstalk, especially the crosstalk shielding at the first connection end 2111 and the second connection end 2211.
  • the effect is to make the signal transmission quality higher.
  • Figure 23a is a far-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • Figure 23b is a near-end crosstalk optimization effect diagram in the fifth embodiment of the present application.
  • the abscissa represents frequency
  • the ordinate represents frequency.
  • PSFEXT_diff2_outCD Imported represents the remote test data with the shielded shell implementation in Figure 20
  • PSFEXT_diff2_outCD_qupinbi Imported represents the remote test data without the shielded shell implementation in Figure 20
  • PSNEXT_diff2_outCD Imported represents the figure 20 has the near-end test data of the shielded shell implementation
  • PSNEXT_diff2_outCD_qupinbi Imported represents the near-end test data of the shielded shell implementation in Figure 20.
  • the crosstalk amplitude at 28 GHz is selected as the frequency point for optimization comparison. From Figure 23a and Figure 23b, it can be seen from Figure 23a and Figure 23b that the implementation with a shielded shell in Figure 20 and the implementation without the shielded shell in Figure 20 have optimized the comprehensive near-end crosstalk by 9dB. The overall crosstalk amplitude is optimized by about 16%; the comprehensive far-end crosstalk is optimized by 4dB, and the overall crosstalk amplitude is optimized by about 7%.
  • the arrangement of the shielded shell has a better shielding effect, and the use of a groundless cable combined with the shielded shell improves the shielding effect on crosstalk, especially in the first
  • the crosstalk shielding effect at the first connection end 2111 and the second connection end 2211 makes the signal transmission quality higher.
  • the connector assembly 10 includes more cables arranged along the second direction Y (as shown in Figure 24).
  • a shielding shell is provided around each cable, and the shielding shells are connected in sequence. and share the same adjacent side to form a whole.
  • the connector assembly 10 in Figure 24 is a four-way connector.
  • the connector assembly 10 includes more cables, and the multiple cables are distributed on both sides of the circuit board 100 along the first direction
  • the shielding shells on both sides of the direction X respectively form a whole shielding shell.
  • the connector assembly 10 in Figure 25 is an eight-channel connector.
  • the first shielding shell 310 is provided with two first openings 3122 arranged along the second direction Y (as shown in FIG. 21 ).
  • the two first openings 3122 are located on the circuit board 100 .
  • the orthographic projection is located on the peripheral side of the first cable 210.
  • the arrangement of the first opening 3122 can, on the one hand, increase the elasticity of the first groove 3121, thereby reducing the possibility of warping when the first shielding shell 310 is assembled, ensuring that The bottom of the first groove 3121 is in good contact with the first shielding layer 212.
  • the first cable 210 can be fixed on the circuit board 100 through the first opening 3122, or when the first cable 210 is loose Therefore, the connection between the first cable 210 and the circuit board 100 can be reinforced by dispensing glue through the first opening 3122 .
  • the second shielding shell 320 has a similar structure to the first shielding shell 310 and will not be described again here.
  • the second sub-portion 312 is provided with a second opening 3123 (as shown in FIG. 21 ), and the second opening 3123 is connected to the first connection end 2111 and/or the first signal panel 120 in the circuit.
  • the orthographic projections on plate 100 at least partially overlap.
  • the second opening 3123 is located on the side of the first opening 3122 close to the first connection end 2111 along the third direction Z.
  • the second opening 3123 is provided to facilitate the connection between the first connection end 2111 and the first signal panel 120 fixed.
  • the second shielding shell 320 has a similar structure to the first shielding shell 310 and will not be described again here.
  • the first shielding shell 310 when the connector assembly 10 is assembled, the first shielding shell 310 is first fixed on the circuit board 100, and then the first connection end 2111 is welded to the first signal plate 120 through the second opening 3123. Or through the second opening 3123 The first connection end 2111 is bonded to the first signal plate 120 by dispensing glue.
  • the first shielding shell 310 can play a positioning role for the installation of the first cable 210.
  • the connector assembly 10 is used for a long time, During the process, if the connection between the first connecting end 2111 and the first signal panel 120 becomes loose, the connection between the first connecting end 2111 and the first signal panel 120 can be tightened through the second opening 3123 .

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本申请提供一种连接器组件、互连***及服务器集群，连接器组件包括电路板、第一线缆和第一屏蔽外壳；电路板包括接地层，电路板的表面设有第一信号盘；第一线缆用于传输信号，第一线缆包括第一缆芯和第一屏蔽层，第一缆芯包括第一主体部和位于第一主体部一端的第一连接端，第一屏蔽层包覆在第一主体部的外侧，第一连接端与第一信号盘连接；第一屏蔽外壳固定在电路板上并与接地层连接，第一连接端和第一信号盘位于第一屏蔽外壳和电路板之间，且第一屏蔽外壳与第一屏蔽层邻近电路板的部分表面抵接，以使第一屏蔽层与接地层连接。通过第一屏蔽外壳的设置，可降低外部信号对第一线缆的信号传输的干扰，保证第一线缆的信号传输稳定性和信号的电性能。

Description

连接器组件、互连***及服务器集群
本申请要求于2022年5月11日提交中国专利局、申请号为202210507736.2、申请名称为“连接器组件、互连***及服务器集群”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及连接器技术领域，特别涉及一种连接器组件、互连***及服务器集群。
背景技术
随着通讯速率的升级，***的集成度越来越高，单板布线的密度越来越大，***对连接器的高速电性能指标提出更加严苛的要求，而串扰是其中最为关键的电性能指标之一。串扰表现为对受害网络的噪声注入，直接降低了信号的信噪比，使得信号传输质量劣化。现有技术中，通过设置接地线的方式降低串扰，接地线和信号线之间容易缠绕，将线路理清的难度高，并且线路布局占用空间大，信号间距无法压缩，采用接地线的方式屏蔽效果差，并且线缆与电路板焊接区的屏蔽问题未能得到解决。
发明内容
本申请提供一种屏蔽效果较好、保证信号高质量传输的连接器组件、互连***及服务器集群。
第一方面，本申请一实施方式提供一种连接器组件，所述连接器组件包括电路板、第一线缆和第一屏蔽外壳，所述电路板包括接地层，所述电路板的表面设有第一信号盘；所述第一线缆用于传输信号，包括第一缆芯和第一屏蔽层，所述第一缆芯包括第一主体部和位于所述第一主体部一端的第一连接端，所述第一屏蔽层包覆在所述第一主体部的外侧，所述第一连接端与所述第一信号盘连接；所述第一屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第一连接端和所述第一信号盘位于所述第一屏蔽外壳和所述电路板之间，且所述第一屏蔽外壳与所述第一屏蔽层邻近所述电路板的部分表面抵接，以使所述第一屏蔽层与所述接地层连接。
其中，所述电路板中设有信号层，所述第一信号盘与信号层电连接，信号层与所述接地层沿第一方向层叠设置，所述第一方向与所述电路板的板面相交。在一实施方式中，所述第一连接端在所述电路板上的正投影位于所述第一信号盘在所述电路板上的正投影中，所述第一主体部自所述第一连接端延伸至所述电路板外，即部分所述第一主体部沿所述第一方向的投影位于所述电路板上，部分所述第一主体部沿所述第一方向的投影位于所述电路板外，所述第一方向与所述电路板的板面相交。在一实施方式中，所述第一方向垂直于所述电路板的板面。在一实施方式中，所述第一连接端焊接在所述第一信号盘，以使所述第一连接端与所述第一信号盘电连接。在一实施方式中，所述电路板远离所述第一线缆的一端设有金手指。
所述第一缆芯用于传输信号，在一实施方式中，所述第一缆芯包括第一子芯和第二子芯，所述第一子芯和所述第二子芯用于传递一个差分信号，通过差分信号实现信号传输，使得所述第一缆芯的抗串扰能力强。当所述第一缆芯中设置两根子芯时，所述第一信号盘也包括两 个第一信号子盘，两根子芯分别与两个第一信号子盘连接。在一实施方式中，所述第一缆芯也可仅包括一根子芯，所述第一信号盘包括一个第一信号子盘。
所述第一线缆为无地线线缆，所述第一线缆通过所述第一屏蔽层接地而使所述第一线缆接地，由于不包含地线，所述第一线缆的尺寸小，所述第一线缆与所述电路板的连接更便捷，使所述连接器组件的体积小、组装效率高。
在一实施方式中，所述第一屏蔽层为铝箔。在一实施方式中，所述第一屏蔽层的材质还可以为具有较好延展性的其他导电金属。
所述第一屏蔽外壳设置在所述第一连接端的周侧，并且所述第一屏蔽外壳沿所述第三方向延伸至所述第一主体部的外侧，所述第一屏蔽外壳与所述第一屏蔽层抵接，所述第三方向为所述第一线缆在所述电路板上的延伸方向，在一实施方式中，所述第三方向与所述电路板的板面平行且所述第三方向与所述第一方向垂直。在一实施方式中，所述第一屏蔽外壳与所述第一屏蔽层沿所述第一方向背离所述电路板的部分表面抵接，在其他实施方式中，所述第一屏蔽外壳也可与所述第一屏蔽层的其他表面抵接。所述第一屏蔽层通过与所述第一屏蔽外壳连接而与所述接地层连接，从而使所述第一屏蔽层接地。在一实施方式中，所述第一屏蔽外壳与所述电路板为可拆卸连接，可实现所述第一屏蔽外壳的快速拆装，提高所述第一屏蔽外壳的重复利用率。在一实施方式中，所述第一屏蔽外壳与所述电路板的连接方式包含但不限于鱼眼压接，或引脚焊接。
所述第一屏蔽外壳在所述电路板上的正投影覆盖所述第一连接端在所述电路板上的正投影，在一实施方式中，所述第一屏蔽外壳的尺寸稍大于所述第一连接端的尺寸，以减小所述第一屏蔽外壳占用所述电路板的面积，降低成本且提高信号密度，所述第一屏蔽外壳与所述第一连接端周侧的距离较近可实现更好的屏蔽效果。在一实施方式中，所述第一屏蔽外壳的材质可为铁、铜、铝等金属。在一实施方式中，所述第一屏蔽外壳的材质还可为合金或导电塑料、导电塑胶等导电材料。
通过所述第一屏蔽外壳的设置，第一，所述第一屏蔽外壳与所述第一主体部上的所述第一屏蔽层抵接，可实现所述第一线缆接地，保证信号正常传输，不仅可减小外界信号对所述第一线缆信号传输的干扰，还可减小第一子芯和第二子芯的***损耗，提高信号传输质量；同时，所述第一屏蔽外壳与所述第一屏蔽层通过面与面的方式抵接，所述第一屏蔽外壳不易于损坏所述第一屏蔽层，保证所述第一屏蔽外壳与所述第一屏蔽层的良好接触。
第二，所述第一屏蔽外壳罩设在所述第一连接端的外侧，可屏蔽所述第一连接端处的外界干扰信号且提升信号传输稳定性，由于所述第一连接端需要与所述第一信号盘电连接，所述第一连接端外部并未包覆所述第一屏蔽层，所述第一连接端容易受到外界信号干扰，而所述第一屏蔽外壳可将所述第一连接端与外界干扰信号隔离，减小所述第一连接端的信号传输的丢失和传输错误问题的出现，保证所述第一线缆传输信号的完整性，同时，所述第一屏蔽外壳还用于作为所述第一连接端的信号参考地，所述第一屏蔽外壳与所述第一屏蔽层连接，实现所述第一连接端信号的参考地连续，提升信号传输稳定性。
第三，所述第一屏蔽外壳与所述第一屏蔽层背离所述电路板的表面抵接且所述第一屏蔽外壳固定在所述电路板上，所述第一屏蔽外壳可将所述第一线缆压向所述电路板，所述第一线缆被固定在所述第一屏蔽外壳与电路板之间，可减小由于所述连接器组件振动对所述第一连接端与所述第一信号盘电连接造成的不良影响，保证所述第一连接端与所述第一信号盘连接的稳固性。
第四，可通过控制所述第一屏蔽外壳的沿所述第一方向的高度，进而控制所述第一屏蔽 外壳与所述第一屏蔽层的压紧力，以使所述第一屏蔽外壳与所述第一屏蔽层紧密贴合，保证所述第一屏蔽层始终接地，且所述第一屏蔽外壳可适配不同尺寸的所述第一线缆，提高所述第一屏蔽外壳的利用率。
第五，本申请中，不涉及对所述第一线缆的改造，仅安装所述第一屏蔽外壳即可实现所述第一屏蔽层接地，达到减小串扰和降低***损耗的效果，使用所述第一屏蔽外壳时加工效率高、组装简单。
在一实施方式中，所述连接器组件还包括壳体、解锁扣和拉环，通过所述解锁扣和所述拉环的配合使用，以实现所述连接器组件的连接与断开。
在一种可能的实现方式中，所述第一屏蔽外壳包括依次连接的第一子部、第二子部和第三子部，所述第一子部的延伸方向和所述第三子部的延伸方向均与所述第二子部的延伸方向相交，且所述第一子部和所述第三子部远离所述第二子部的一端固定在所述电路板上并与所述接地层连接，至少部分所述第二子部与所述第一屏蔽层弹性抵接，以使所述第一屏蔽层与所述接地层连接。
由于所述第一屏蔽外壳为金属外壳，所述第一屏蔽外壳具有一定的弹性，具体表现为所述第二子部可沿所述第一方向靠近或者远离所述电路板运动，所述第二子部抵接至所述第一屏蔽层时，所述第二子部沿所述第一方向远离所述电路板发生弹性形变，所述第二子部产生一个沿所述第一方向朝向所述电路板方向的弹力，以使所述第二子部与所述第一屏蔽层紧密贴合，且当所述连接器组件振动而带动所述第一线缆沿所述第一方向振动时，所述第二子部可通过弹性形变紧贴所述第一屏蔽层运动，所述第二子部与所述第一屏蔽层保持稳定、可靠的连接，以保证所述第一屏蔽层接地，提高所述第一屏蔽外壳的屏蔽效果及信号传输的质量。
在一实施方式中，所述第一子部和所述第三子部远离所述第二子部的一端均与所述接地层连接，所述第一屏蔽外壳与所述接地层的连接可靠性更高。在一实施方式中，所述第一子部和所述第三子部其中之一与所述接地层连接，所述第一子部和所述第三子部中的另一个可直接焊接在所述电路板靠近所述第一屏蔽外壳的表面上或者其他方便焊接的位置上。
在一实施方式中，所述第一屏蔽外壳为一体化结构，所述第一子部、所述第二子部和所述第三子部一体成型，结构强度更高，保证所述第一屏蔽外壳的正常工作。在一实施方式中，所述第一屏蔽外壳一体式冲压成型，加工工序简单，成本较低。
在一种可能的实现方式中，所述第二子部沿第一方向朝向所述第一线缆凹陷形成第一凹槽，所述第一方向与所述电路板相交，所述第一凹槽的槽底与所述第一屏蔽层弹性抵接。
通过所述第一凹槽的设置，增加所述第二子部在所述第一方向的可形变的程度，相较于将所述第二子部设置成完全平整的形状，所述第一凹槽与所述第一屏蔽层的连接可靠性更高，且所述第二子部与所述第一子部和所述第三子部连接的稳固性更强，特别是在振动频繁的环境中使用所述连接器组件时，所述第一凹槽的设置可保证所述第一屏蔽外壳与所述第一屏蔽层稳定连接，使信号高质量传输。
在一实施方式中，所述第一凹槽的延伸方向与所述第一屏蔽层的延伸方向相同，增大所述第一凹槽与所述第一屏蔽层的接触面积，使所述第一屏蔽外壳可起到更好地屏蔽作用。在一实施方式中，所述第一凹槽的延伸方向也可与所述第一屏蔽层的延伸方向不同，可根据实际需要设置所述第一凹槽的延伸方向。在一实施方式中，部分所述第二子部沿所述第一方向朝向所述第一线缆凹陷形成所述第一凹槽，部分所述第二子部未朝向所述第一线缆凹陷且仍保持与所述电路板平行，以便于所述第一屏蔽外壳与所述电路板的安装连接。
在一种可能的实现方式中，所述第一凹槽上设有贯穿所述槽底的第一开孔。所述第一开 孔可增加所述第一凹槽的弹性，以减小所述第一屏蔽外壳组装时产生翘曲的可能性，保证所述第一凹槽的槽底与所述第一屏蔽层的良好接触。
在一种可能的实现方式中，至少部分所述第一开孔与所述第一屏蔽层在所述电路板上的正投影不重叠。至少部分所述第一开孔位于所述第一凹槽未与所述第一屏蔽层接触的部位，在增加所述第一凹槽的弹性的同时，尽量增大所述第一凹槽与所述第一屏蔽层的接触面积，使所述第一屏蔽外壳可起到更好地屏蔽作用。
在一实施方式中，所述第一开孔与所述第一屏蔽层在所述电路板上的正投影不重叠，所述第一开孔位于所述第一凹槽未与所述第一屏蔽层接触的部位，在增加所述第一凹槽的弹性的同时，并未减小所述第一凹槽与所述第一屏蔽层的接触面积，使所述第一屏蔽外壳可起到更好地屏蔽作用。
在一实施方式中，所述第一开孔与所述第一连接端在所述电路板上的正投影至少部分重叠，所述连接器组件在组装时，先将所述第一屏蔽外壳固定在所述电路板上，而后通过所述第一开孔将所述第一连接端焊接在所述第一信号盘上，或者通过所述第一开孔以点胶的方式将所述第一连接端粘接在所述第一信号盘上，所述第一屏蔽外壳可为所述第一线缆的安装起到定位作用。在一实施方式中，所述第一开孔与所述第一连接端在所述电路板上的正投影至少部分重叠，当所述连接器组件在长久使用过程中，若所述第一连接端与所述第一信号盘的连接出现松动，还可以通过所述第一开孔紧固所述第一连接端与所述第一信号盘的连接。
在一种可能的实现方式中，所述第一子部和所述第三子部远离所述第二子部的一端设有引脚，所述电路板上设有地通孔，所述地通孔连接所述接地层，所述引脚伸入所述地通孔内以使所述第一屏蔽外壳与所述接地层连接。其中，所述地通孔设置在所述第一线缆的周侧，且所述地通孔贯穿所述电路板沿所述第一方向靠近所述第一屏蔽外壳的表面，通过所述引脚与所述地通孔连接以实现所述第一屏蔽外壳与所述电路板固定连接。
在一实施方式中，所述地通孔贯穿所述电路板沿所述第一方向的两个表面，使所述引脚与所述地通孔的连接更加简单、更加可靠。在一实施方式中，所述电路板上设有四个所述地通孔，所述第一子部远离所述第二子部的一端设有两个所述引脚，所述第三子部远离所述第二子部的一端同样设有两个所述引脚，四个所述引脚分别伸入四个所述地通孔内，以实现所述第一屏蔽外壳与所述电路板的稳定连接。
在一种可能的实现方式中，所述电路板的表面设有第二信号盘，所述连接器组件还包括第二线缆和第二屏蔽外壳，所述第二线缆包括第二缆芯和第二屏蔽层，所述第二缆芯包括第二主体部和位于所述第二主体部一端的第二连接端，所述第二屏蔽层包覆在所述第二主体部的外侧，所述第二连接端与所述第二信号盘连接；所述第二屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第二连接端和所述第二信号盘位于所述第二屏蔽外壳和所述电路板之间，且所述第二屏蔽外壳与所述第二屏蔽层邻近所述电路板的表面抵接，以使所述第二屏蔽层与所述接地层连接；所述第二屏蔽外壳与第一屏蔽外壳位于所述电路板的同一侧，所述第二屏蔽外壳与所述第一屏蔽外壳沿第二方向间隔设置，所述第二方向与所述第一线缆的延伸方向相交。
其中，所述第二线缆的设置，增加了所述连接器组件传输信号的密度，所述第一屏蔽外壳的设置可减小所述第二线缆对所述第一线缆传输信号的干扰，所述第二屏蔽外壳的设置可减小所述第一线缆对所述第二线缆传输信号的干扰，在增加所述连接器组件传输信号密度的同时，提高了信号在所述连接器组件内传输的质量。
所述第二信号盘及所述第二线缆均位于所述电路板靠近所述第一线缆的表面，所述第二 屏蔽外壳在所述电路板上的正投影与所述第一屏蔽外壳在所述电路板上的正投影不重叠。所述第二方向与所述第一方向、所述第三方向均相交，在一实施方式中，所述第二方向、所述第一方向和所述第三方向互相垂直。
在一实施方式中，所述第二线缆与所述第一线缆相同，所述第二屏蔽外壳与所述第一屏蔽外壳具有相同的构造和体积。
在一实施方式中，所述第二线缆的外径与所述第一线缆的外径相同。在一实施方式中，所述第二线缆的外径与所述第一线缆的外径也可以不同。在一实施方式中，所述第二屏蔽外壳与所述第一屏蔽外壳的材质、体积也可不同。在一实施方式中，所述第一线缆为输入信号线缆，所述第二线缆为输出信号线缆。在一实施方式中，所述第二线缆为输入信号线缆，所述第一线缆为输出信号线缆。在一实施方式中，所述第一线缆和所述第二线缆均为输入信号线缆。在一实施方式中，所述第一线缆和所述第二线缆均为输出信号线缆。
在一实施方式中，所述连接器组件还包括更多根所述第一线缆和/或所述第二线缆，多根线缆位于所述电路板沿所述第一方向的同一侧，每根线缆的周侧均罩设有屏蔽外壳，多个屏蔽外壳沿所述第二方向间隔设置，增加了所述连接器组件传输信号的密度。在一实施方式中，所述连接器组件可根据实际需要设置4根、8根、16根等数量的线缆，每根线缆的周侧均罩设有屏蔽外壳，多个屏蔽外壳沿所述第二方向间隔设置，增加了所述连接器组件传输信号的密度，线缆沿所述第二方向的间距可以为3.62毫米至2.23毫米，当设置更多数量的线缆时，线缆沿所述第二方向的间距可以小于2.23毫米，多根线缆间由于屏蔽外壳的设置，改善了线缆连接端的信号间的串扰性能，改善了多根线缆的地回流，减小多根线缆的回路电感。
在一种可能的实现方式中，所述电路板的表面设有第三信号盘，所述连接器组件还包括第三线缆和第三屏蔽外壳，所述第三线缆包括第三缆芯和第三屏蔽层，所述第三缆芯包括第三主体部和位于所述第三主体部一端的第三连接端，所述第三屏蔽层包覆在所述第三主体部的外侧，所述第三连接端与所述第三信号盘连接；所述第三屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第三连接端和所述第三信号盘位于所述第三屏蔽外壳和所述电路板之间，且所述第三屏蔽外壳与所述第三屏蔽层邻近所述电路板的表面抵接，以使所述第三屏蔽层与所述接地层连接；所述第三屏蔽外壳与所述第一屏蔽外壳分别位于所述电路板沿第一方向的两侧，所述第一方向与所述电路板相交，所述第一屏蔽外壳和所述第三屏蔽外壳在所述电路板上的正投影至少部分不重叠。
其中，所述第三线缆的设置，增加了所述连接器组件传输信号的密度。第三信号盘及所述第三线缆均位于所述电路板沿所述第一方向远离所述第一线缆的表面，所述第三屏蔽外壳与所述第一屏蔽外壳分别位于电路板沿所述第一方向的两侧可节约所述电路板上的空间，使所述电路板上可连接更多线缆或其他电子元件。在一实施方式中，所述第一线缆为输入信号线缆，所述第三线缆为输出信号线缆。在一实施方式中，所述第三线缆为输入信号线缆，所述第一线缆为输出信号线缆。在一实施方式中，所述第一线缆和所述第三线缆均为输入信号线缆。在一实施方式中，所述第一线缆和所述第三线缆均为输出信号线缆。
在一实施方式中，所述第三屏蔽外壳与所述第一屏蔽外壳沿所述第三方向错开设置，即所述第三屏蔽外壳在所述电路板上的正投影与所述第一屏蔽外壳在所述电路板上的正投影至少部分不重叠，可更好地减小所述第三连接端和所述第一连接端处的串扰，且预留出空间以便于所述第三屏蔽外壳和所述第一屏蔽外壳与所述电路板的安装。
在一实施方式中，所述第三屏蔽外壳与所述第一屏蔽外壳沿所述第二方向错开设置，即所述第三屏蔽外壳在所述电路板上的正投影与所述第一屏蔽外壳在所述电路板上的正投影至 少部分不重叠，可更好地减小所述第三连接端和所述第一连接端处的串扰，且预留出空间以便于所述第三屏蔽外壳和所述第一屏蔽外壳与所述电路板的安装。
在一实施方式中，当所述第三屏蔽外壳沿所述第二方向远离所述第一屏蔽外壳设置时，可实现所述第三屏蔽外壳在所述电路板上的正投影与所述第一屏蔽外壳在所述电路板上的正投影不重叠。
在一实施方式中，所述第三屏蔽外壳与所述第一屏蔽外壳沿所述第二方向及所述第三方向均错开设置，可更好地减小所述第三连接端和所述第一连接端处的串扰，且预留出空间以便于安装所述第三屏蔽外壳和所述第一屏蔽外壳与所述电路板。
在一实施方式中，所述第三屏蔽外壳在所述电路板上的正投影与所述第一屏蔽外壳在所述电路板上的正投影也可以重叠，此时为了有利于顺利安装所述第三屏蔽外壳与所述第一屏蔽外壳，所述第三屏蔽外壳的所述地通孔需要与所述第一屏蔽外壳的所述地通孔错开设置，而相应地，所述第三屏蔽外壳上的所述引脚位置需要与所述第一屏蔽外壳的所述引脚位置不同，以使各自的所述引脚对应各自的所述地通孔。
在一实施方式中，所述连接器组件还包括多根沿所述第二方向间隔设置的所述第一线缆，且所述连接器组件包括多根沿所述第二方向间隔设置的所述第三线缆，多根所述第一线缆与多根所述第三线缆分别位于所述电路板沿所述第一方向的两侧，每根所述第一线缆的周侧均罩设有所述第一屏蔽外壳，每根所述第三线缆的周侧均罩设有所述第三屏蔽外壳，多个所述第一屏蔽外壳沿所述第二方向间隔设置，多个所述第三屏蔽外壳沿所述第二方向间隔设置，多个所述第一屏蔽外壳与多个所述第三屏蔽外壳均错开设置，增加了所述连接器组件传输信号的密度，且预留出空间以便于所述第三屏蔽外壳和所述第一屏蔽外壳与所述电路板的安装。
在一实施方式中，所述电路板沿所述第一方向的两侧设置相同数量的所述第一线缆和所述第三线缆，所述第一线缆和所述第三线缆中的一个为输入信号线缆，所述第一线缆和所述第三线缆中的另一个为输出信号线缆。
在一种可能的实现方式中，所述电路板的表面设有第二信号盘，所述连接器组件还包括第二线缆和第二屏蔽外壳，所述第二线缆包括第二缆芯和第二屏蔽层，所述第二缆芯包括第二主体部和位于所述第二主体部一端的第二连接端，所述第二屏蔽层包覆在所述第二主体部的外侧，所述第二连接端与所述第二信号盘连接；所述第二屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第二连接端和所述第二信号盘位于所述第二屏蔽外壳和所述电路板之间，且所述第二屏蔽外壳与所述第二屏蔽层邻近所述电路板的表面抵接，以使所述第二屏蔽层与所述接地层连接；所述第二屏蔽外壳与所述第一屏蔽外壳位于所述电路板的同一侧，所述第二屏蔽外壳与所述第一屏蔽外壳沿第二方向并排连接设置，所述第二方向与所述第一线缆的延伸方向相交。
其中，所述第二线缆的设置，增加了所述连接器组件传输信号的密度。所述第二信号盘及所述第二线缆均位于所述电路板靠近所述第一线缆的表面，所述第二屏蔽外壳在所述电路板上的正投影与所述第一屏蔽外壳在所述电路板上的正投影不重叠。所述第二屏蔽外壳与所述第一屏蔽外壳沿所述第二方向并排连接设置，所述第二线缆更加靠近所述第一线缆设置，可节约所述电路板上的空间，使所述电路板上可连接更多线缆或其他电子元件。所述第一屏蔽外壳的设置可减小所述第二线缆对所述第一线缆传输信号的干扰，所述第二屏蔽外壳的设置可减小所述第一线缆对所述第二线缆传输信号的干扰，在增加所述连接器组件传输信号密度的同时，提高了信号在所述连接器组件内传输的质量。
在一种可能的实现方式中，所述第一屏蔽外壳包括依次连接的第一子部、第二子部和第 三子部，至少部分所述第二子部与所述第一屏蔽层弹性抵接；所述第二屏蔽外壳包括依次连接的所述第三子部、第四子部和第五子部，至少部分所述第四子部与所述第二屏蔽层弹性抵接。
其中，所述第一子部的延伸方向、所述第三子部的延伸方向和所述第五子部的延伸方向均与所述第二子部的延伸方向或所述第四子部的延伸方向相交；所述第一子部远离所述第二子部的一端固定在所述电路板上并与所述接地层连接，所述第三子部远离所述第二子部或所述第四子部的一端固定在所述电路板上并与所述接地层连接，所述第五子部远离所述第四子部的一端固定在所述电路板上并与所述接地层连接。
所述第一屏蔽外壳和所述第二屏蔽外壳的整体形状大致呈“M”字形，所述第一屏蔽外壳和所述第二屏蔽外壳共用所述第三子部，一方面，可节约所述电路板上的空间，使所述电路板上可连接更多线缆或其他电子元件；另一方面，可节约所述第一屏蔽外壳和所述第二屏蔽外壳的制造成本。
在一实施方式中，所述第一子部、所述第三子部和所述第五子部可从板面形状简化为柱状，使屏蔽外壳的加工与安装更加简易。
在一实施方式中，所述连接器组件中包括更多根沿所述第二方向排布的线缆，每根线缆周侧均设置屏蔽外壳，屏蔽外壳之间依次连接且共用同一个相邻侧边以形成一个整体。
在一实施方式中，所述连接器组件中包括更多根线缆，多根线缆分布在所述电路板沿所述第一方向的两侧，位于所述电路板沿所述第一方向两侧的屏蔽外壳分别形成一个屏蔽外壳整体。
在一实施方式中，所述第一屏蔽外壳上设有两个沿所述第二方向排布的所述第一开孔，两个所述第一开孔在所述电路板上的正投影位于所述第一线缆的周侧，所述第一开孔的设置，一方面可增加所述第一凹槽的弹性，以减小所述第一屏蔽外壳组装时产生翘曲的可能性，保证所述第一凹槽的槽底与所述第一屏蔽层的良好接触，另一方面，可通过所述第一开孔将所述第一线缆固定在所述电路板上，或者当所述第一线缆松动使，可通过所述第一开孔以点胶的方式加固所述第一线缆与所述电路板的连接。所述第二屏蔽外壳与所述第一屏蔽外壳具有类似结构。
在一种可能的实现方式中，所述第二子部设有第二开孔，所述第二开孔与所述第一连接端和/或所述第一信号盘在所述电路板上的正投影至少部分重叠。
其中，所述第二开孔位于所述第一开孔沿所述第三方向靠近所述第一连接端的一侧，所述第二开孔的设置，便于所述第一连接端与所述第一信号盘的连接固定。所述第二屏蔽外壳与所述第一屏蔽外壳具有类似结构。
在一实施方式中，所述连接器组件在组装时，先将所述第一屏蔽外壳固定在所述电路板上，而后通过所述第二开孔将所述第一连接端焊接在所述第一信号盘上，或者通过所述第二开孔以点胶的方式将所述第一连接端粘接在所述第一信号盘上，所述第一屏蔽外壳可为所述第一线缆的安装起到定位作用，同时，当所述连接器组件在长久使用过程中，若所述第一连接端与所述第一信号盘的连接出现松动，还可以通过所述第二开孔紧固所述第一连接端与所述第一信号盘的连接。
在一种可能的实现方式中，所述电路板靠近所述第一线缆的表面设有地焊盘，所述地焊盘与靠近所述电路板一侧的部分所述第一屏蔽层抵接。所述地焊盘和所述第一屏蔽外壳的设置，使所述第一线缆沿所述第一方向的两个表面均接地，且所述第一屏蔽外壳与所述第一屏蔽层抵接可将所述第一屏蔽层与所述地焊盘压紧，可以更好地起到屏蔽效果，以降低外界环 境对所述第一线缆信号传输的影响。
在一实施方式中，所述地焊盘与所述接地层电连接，所述第一线缆沿所述第一方向的两个表面均与所述接地层电连接。在一实施方式中，所述地焊盘为设置在所述电路板表面局部位置的一块金属片，所述第一屏蔽层靠近所述电路板表面与金属片抵接以达到屏蔽效果。在一实施方式中，部分所述第一屏蔽层靠近所述地焊盘的表面与所述地焊盘焊接，以保护固定所述第一线缆。在一实施方式中，部分所述第一屏蔽层靠近所述地焊盘的表面与所述地焊盘粘接，如通过紫外光固化胶(UV胶)将所述第一屏蔽层粘接在所述地焊盘上，以保护固定所述第一线缆。
第二方面，本申请一实施方式提供一种互连***，所述互连***包括第一电子装置和如上任一项所述的连接器组件，所述第一电子装置与所述电路板远离所述第一线缆的一端电连接。
在一实施方式中，所述互连***还包括第二电子装置，所述连接器组件的一端与所述第一电子装置电连接，所述连接器组件的另一端与所述第二电子装置电连接，通过所述连接器组件的设置，实现所述第一电子装置与所述第二电子装置的互连。
在一实施方式中，所述第一电子装置可以为单板，所述第二电子装置可以为背板。在一实施方式中，所述第一电子装置可以为背板，所述第二电子装置可以为单板。在一实施方式中，所述第一电子装置与所述第二电子装置均为单板。在一实施方式中，所述第二电子装置为背板，所述第一电子装置为网卡。在一实施方式中，所述第二电子装置为背板，所述第一电子装置为交换机。
第三方面，本申请一实施方式提供一种服务器集群，其特征在于，包括多个服务器，所述服务器包括高速背板、交换机、业务板、背板连接器和多个如上任一项所述的连接器组件，所述背板连接器和所述第一线缆远离所述电路板的一端连接，所述背板连接器固定连接在所述高速背板上，所述多个连接器组件中的一部分所述连接器组件中的电路板与所述交换机连接，所述多个连接器组件中的另一部分所述连接器组件的电路板与所述业务板连接。
本申请中，通过所述第一屏蔽外壳的设置，所述第一屏蔽外壳与所述第一主体部上的所述第一屏蔽层抵接，实现所述第一线缆接地，保证信号正常传输，不仅可减小外界信号对所述第一线缆信号传输的干扰，还可提高信号传输质量，同时，所述第一屏蔽外壳罩设在所述第一连接端的外侧，可屏蔽所述第一连接端处的外界干扰信号且提升信号传输稳定性，解决了所述第一线缆与所述电路板的连接处的信号屏蔽问题。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对本申请实施例中所需要使用的附图进行说明。
图1是是本申请一实施方式提供的互连***的示意图；
图2是本申请一实施方式提供的服务器集群中的互连***的示意图；
图3是本申请第一实施例提供的连接器组件的立体图；
图4是本申请第一实施例提供的连接器组件的***图；
图5是本申请一实施方式提供的第一缆芯的结构示意图；
图6是本申请一实施方式提供的第一屏蔽外壳的结构示意图；
图7a是一实施方式提供的单地线线缆连接器组件的示意图；
图7b是一实施方式提供的双地线线缆连接器组件的示意图；
图8是本申请一实施方式提供的连接器组件的立体图；
图9是本申请一实施方式提供的连接器组件的***图；
图10是本申请一实施方式提供的第一开孔与电路板位置关系的示意图；
图11是本申请第二实施例提供的连接器组件的立体图；
图12是本申请第二实施例提供的连接器组件的***图；
图13a是本申请第二实施例中远端串扰优化效果图；
图13b是本申请第二实施例中近端串扰优化效果图；
图14是本申请一实施方式提供的连接器组件的示意图；
图15是本申请第三实施例提供的连接器组件的俯视图；
图16是本申请第三实施例提供的连接器组件的仰视图；
图17是本申请第三实施例提供的连接器组件的剖面图；
图18是本申请第四实施例提供的连接器组件的***图；
图19是本申请第五实施例提供的连接器组件的***图；
图20是本申请第五实施例提供的连接器组件的***图；
图21是本申请第五实施例提供的屏蔽外壳的仰视图；
图22a是本申请第五实施例中远端串扰优化效果图；
图22b是本申请第五实施例中近端串扰优化效果图；
图23a是本申请第五实施例中远端串扰优化效果图；
图23b是本申请第五实施例中近端串扰优化效果图；
图24是本申请一实施方式提供的连接器组件的示意图；
图25是本申请一实施方式提供的连接器组件的***图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
本文中，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
此外，本文中，“上”、“下”等方位术语是相对于附图中的结构示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据结构所放置的方位的变化而相应地发生变化。
为方便理解，下面先对本申请实施例所涉及的英文简写和有关技术术语进行解释和描述。
串扰：是指两条信号线之间的耦合、信号线之间的互感和互容引起线上的噪声。
单板：单板包括印制电路板(PCB板，Printed Circuit Board)和设置于PCB板上的电子器件(如芯片，电阻，电容等)。
背板：背板是通讯设备中的重要组成部分，为***中的各个单板或模块等提供电气信号连接和物理支撑。
I/O：为input/output的缩写，即输入输出端口。
QSFP：为Quad small form-factor pluggable的缩写，即四通道SFP接口。
SFP：为Small form-factor pluggable的缩写，即小型可插拔接口。
OSFP：为Octal small form-factor pluggable的缩写，即八通道SFP接口。
GenZ：为Generation Z的缩写，即GenZ系列高速接口。
CXP：为CoaXPress的缩写，即非对称高速点对点串行通信数字接口。
minSAS HD：为Mini-SAS High Density的缩写，即小型串行链接、高密传输接口。
本申请提供一种连接器，连接器包括电路板、第一线缆和第一屏蔽外壳；电路板包括接地层，电路板的表面设有第一信号盘；第一线缆用于传输信号，第一线缆包括第一缆芯和第一屏蔽层，第一缆芯包括第一主体部和位于第一主体部一端的第一连接端，第一屏蔽层包覆在第一主体部的外侧，第一连接端与第一信号盘连接；第一屏蔽外壳固定在电路板上并与接地层连接，第一连接端和第一信号盘位于第一屏蔽外壳和电路板之间，且第一屏蔽外壳与第一屏蔽层邻近电路板的表面抵接，以使第一屏蔽层与接地层连接。
通过第一屏蔽外壳的设置，可降低外部信号对第一线缆的信号传输的干扰，保证第一线缆的信号传输稳定性和信号的电性能。
请参阅图1，图1是本申请一实施方式提供的互连***示意图，互连***1可用于各种通信设备中，通信设备中设有背板和单板，单板与单板之间、或者单板与背板之间的互连构成互连***1，用于实现通信的功能，其中，背板与单板组合的互连***是最为常见的互连架构，通常用于通讯设备的高速链路中。以单板与背板之间连接为例，背板提供信号的传输通道，同时承载电流供给其他单板，背板和单板共同构成互连***1，为了实现信号互连，在单板与背板之间设置连接器组件10，通过连接器组件10实现单板与背板之间的稳定连接，连接器组件10作为背板和单板之间的连接桥梁，是影响整个通信设备的关键部件。在一实施方式中，单板可以为业务板或交换板。
本申请一实施方式提供一种互连***1(如图1所示)，互连***1包括第一电子装置20和连接器组件10，第一电子装置20与连接器组件10中的电路板的一端电连接。在一实施方式中，互连***1还包括第二电子装置30，连接器组件10的一端与第一电子装置20电连接，连接器组件10的另一端与第二电子装置30电连接，通过连接器组件10的设置，实现第一电子装置20与第二电子装置30的互连。
在一实施方式中，第一电子装置20可以为单板，第二电子装置30可以为背板。在一实施方式中，第一电子装置20可以为背板，第二电子装置30可以为单板。在一实施方式中，第一电子装置20与第二电子装置30均为单板。在一实施方式中，第二电子装置30为背板，第一电子装置20为网卡。在一实施方式中，第二电子装置30为背板，第一电子装置20为交换机。
以第一电子装置20为单板、第二电子装置30为背板为例，第一电子装置20上设有单板连接器21，第二电子装置30上设有背板连接器31，互连***1还包括线缆连接器11，线缆连接器11通过线缆与连接器组件10实现电连接，连接器组件10远离线缆连接器11的一端通过与单板连接器21连接以实现连接器组件10与第一电子装置20的连接，连接器组件10通过线缆连接器11与背板连接器31的连接而实现连接器组件10与第二电子装置30的连接。在一实施方式中，连接器组件10为公端连接器，单板连接器21为母端连接器，线缆连接器11为母端连接器，背板连接器31为公端连接器，在其他实施方式中，可根据实际需要设置 连接器组件10、单板连接器21、线缆连接器11及背板连接器31连接器的公母，本申请对此不作限制。
在一实施方式中，连接器组件10与第一电子装置20或第二电子装置30连接的接口型号可为I/O接口。在一实施方式中，连接器组件10与第一电子装置20或第二电子装置30连接的接口型号可为QSFP、SFP、OSFP、GenZ、CXP、minSAS HD等接口。
请参阅图2，互连***1可应用于一种服务器集群中，服务器集群包括多个服务器，服务器中包括多个互连***1，服务器包括第一电子装置20、第二电子装置30和多个连接器组件10，服务器中还包括第三电子装置40，以第一电子装置20为业务板、第二电子装置30为高速背板、第三电子装置40为交换机为例，背板连接器31固定连接在高速背板上，第一电子装置20通过连接器组件10a与第二电子装置30连接，第三电子装置40通过连接器组件10b与第二电子装置30连接。在如图2所示的实施方式中，服务器中包括高速背板30、多块业务板20及多块交换机40，连接器组件10a的一端与背板连接器31连接，连接器组件10a的另一端与业务板20连接，连接器组件10b的一端与背板连接器31连接，连接器组件10b的另一端与交换机40连接，业务板20和交换机40之间通过高速背板30实现信号通讯。
下面详细介绍本申请中的连接器组件10。
请参阅图3、图4、图5和图6，图3为本申请第一实施例提供的连接器组件10的立体图，图4为图3的***图，图5为第一缆芯211的结构示意图，图6为第一屏蔽外壳310的结构示意图。
本申请第一实施例提供一种连接器组件10，连接器组件10包括电路板100、第一线缆210和第一屏蔽外壳310；电路板100包括接地层110，电路板100的表面设有第一信号盘120(如图4所示)；第一线缆210用于传输信号，第一线缆210包括第一缆芯211和第一屏蔽层212(如图3和图4所示)，第一缆芯211包括第一主体部2112和位于第一主体部2112一端的第一连接端2111(如图5所示)，第一屏蔽层212包覆在第一主体部2112的外侧，第一连接端2111与第一信号盘120连接；第一屏蔽外壳310固定在电路板100上并与接地层110连接，第一连接端2111和第一信号盘120位于第一屏蔽外壳310和电路板100之间(如图10所示)，且第一屏蔽外壳310与第一屏蔽层212邻近电路板100的部分表面抵接，以使第一屏蔽层212与接地层110连接。
其中，电路板100具有多层结构，在一实施方式中，一块电路板100中可具有一层接地层110，在其他实施方式中，电路板100也可具有两层或两层以上的接地层110。电路板100中设有信号层(图中未示出)，第一信号盘120与信号层电连接，电路板100中也可根据需要设置多层信号层，信号层与接地层110沿第一方向X层叠设置，第一方向X与电路板100的板面相交，图3中对接地层110的指示位置仅为示意作用，不代表接地层110的实际位置，本申请对接地层110的数量、位置以及接地层110与信号层的相对位置关系不作限制。
电路板100可为一整块板，或者包括多个电路子板，多个电路子板拼接为电路板100，每个电路子板的功能可根据需要来设置，其中一个电路子板的表面设有第一信号盘120。
在本实施方式中，第一连接端2111在电路板100上的正投影位于第一信号盘120在电路板100上的正投影中(如图10所示)，第一主体部2112自第一连接端2111延伸至电路板100外，即部分第一主体部2112沿第一方向X的投影位于电路板100上，部分第一主体部2112沿第一方向X的投影位于电路板100外，第一方向X与电路板100的板面相交。在本实施方式中，第一方向X垂直于电路板100的板面，第一方向X为连接器组件10的厚度方向。在一实施方式中，第一连接端2111焊接在第一信号盘120，以使第一连接端2111与第一信号盘 120电连接。在一实施方式中，位于电路板100上的部分第一主体部2112与电路板100通过绝缘胶固定连接，以使部分第一主体部2112固定在电路板100上，防止第一主体部2112松动而导致第一连接端2111与第一信号盘120接触不良，影响第一连接端2111与第一信号盘120的电连接。
电路板100远离第一线缆210的一端与第一电子装置20电连接，在本实施方式中，电路板100远离第一线缆210的一端设有金手指，通过金手指实现连接器组件10与第一电子装置20的连接。在一实施方式中，第一线缆210远离第一连接端2111的一端还设有线缆连接器11(如图1所示)，通过线缆连接器11实现第一线缆210与第二电子装置30电连接。
第一缆芯211用于传输信号，在本实施方式中，第一缆芯211包括第一子芯2113和第二子芯2114(如图5所示)，第一子芯2113和第二子芯2114用于传递一个差分信号，通过差分信号实现信号传输，差分信号被表现为第一子芯2113和第二子芯2114之间的电平差，在第一缆芯211中设置两根子芯，当外界的干扰信号作用至第一缆芯211时，干扰信号同时改变第一子芯2113和第二子芯2114的电平，此时第一子芯2113和第二子芯2114之间的电平差不发生改变，使得第一缆芯211的抗串扰能力强。当第一缆芯211中设置两根子芯时，第一信号盘120也包括两个第一信号子盘(图中未示出)，两根子芯分别与两个第一信号子盘连接。在一实施方式中，第一缆芯211也可仅包括一根子芯，此时，第一信号盘120包括一个第一信号子盘，通过单端信号实现信号传输，设计结构简单方便。
第一线缆210为无地线线缆，即第一线缆210中不包含地线，第一线缆210通过第一屏蔽层212接地而使第一线缆210接地，由于不包含地线，第一线缆210的尺寸小，第一线缆210与电路板100的连接更便捷，使连接器组件10的体积小、组装效率高。
第一缆芯211的周侧依次包裹第一绝缘层、第一屏蔽层212和第二绝缘层，图3和图4中仅示意出第一缆芯211和第一屏蔽层212，未示出第一绝缘层和第二绝缘层，第一绝缘层包覆在第一缆芯211的外侧，用于将第一缆芯211与第一屏蔽层212绝缘隔离；第一屏蔽层212包覆在第一绝缘层的外侧，且第一屏蔽层212位于第一绝缘层与第二绝缘层之间，将第一屏蔽层212接地，可减少串扰对第一缆芯211信号传输的影响；第二绝缘层包覆在第一屏蔽层212的外侧，用于将第一屏蔽层212与外界隔离。在本实施方式中，第一连接端2111的外侧不包覆第一绝缘层、第一屏蔽层212和第二绝缘层，以便于第一连接端2111与第一信号盘120电连接。在本实施方式中，第一主体部2112与第一屏蔽层212抵接部位仅包覆第一绝缘层和第一屏蔽层212，去除部分第二绝缘层将第一屏蔽层212裸露，以使实现第一屏蔽层212与第一屏蔽层212抵接。在一实施方式中，第一屏蔽层212为铝箔。在一实施方式中，第一屏蔽层212的材质还可以为具有较好延展性的其他导电金属。
第一屏蔽外壳310设置在第一连接端2111的周侧，并且第一屏蔽外壳310沿第三方向Z延伸至第一主体部2112的外侧，第一屏蔽外壳310与邻近电路板100的部分第一屏蔽层212抵接，第三方向Z为第一线缆210在电路板100上的延伸方向，在本实施方式中，第三方向Z与电路板100的板面平行且第三方向Z与第一方向X垂直。在本实施方式中，第三方向Z为连接器组件10的长度方向。
在一实施方式中，第一屏蔽外壳310与第一屏蔽层212沿第一方向X背离电路板100的部分表面抵接，在其他实施方式中，第一屏蔽外壳310也可与第一屏蔽层212的其他表面抵接，例如，第一屏蔽外壳310与第一屏蔽层212沿第二方向Y的两个表面抵接，第二方向Y与第一线缆210的延伸方向相交。第一屏蔽层212通过与第一屏蔽外壳310连接而与接地层110连接，从而使第一屏蔽层212接地。
在一实施方式中，第一屏蔽外壳310与电路板100为可拆卸连接，可实现第一屏蔽外壳310的快速拆装，提高第一屏蔽外壳310的重复利用率。在一实施方式中，第一屏蔽外壳310与电路板100的连接方式包含但不限于鱼眼压接，或引脚焊接。
第一屏蔽外壳310在电路板100上的正投影覆盖第一连接端2111在电路板100上的正投影，在一实施方式中，第一屏蔽外壳310的尺寸稍大于第一连接端2111的尺寸，以减小第一屏蔽外壳310占用电路板100的面积，降低成本且提高信号密度，第一屏蔽外壳310与第一连接端2111周侧的距离较近可实现更好的屏蔽效果。在一实施方式中，第一屏蔽外壳310的材质可为铁、铜、铝等金属。在一实施方式中，第一屏蔽外壳310的材质还可为合金或导电塑料、导电塑胶等导电材料。
若不设置第一屏蔽外壳310，为了保证第一线缆210接地，现有技术中第一线缆210包括第一缆芯211和地线213，如单地线线缆(如图7a所示)和双地线线缆(如图7b所示)，只需使第一线缆210中的地线213接地即可，但地线213接地时需要在电路板100额外设置地线焊盘来焊接地线213，不仅占据电路板100的板面空间，还是使得第一线缆210安装效率低，且有地线213的第一线缆210尺寸大，占用电路板100的空间多，不利于增大连接器组件10的信号传输密度。对于无地线213的第一线缆210，则需要设置单独用于接地的屏蔽件，屏蔽件搭接在第一线缆210的屏蔽层上，还需要设置固定屏蔽件的固定部件，以将屏蔽件固定在第一线缆210上，这种方案会造成连接器组件10加工复杂，零部件增多的问题。当连接器组件10设置地焊盘，如果将第一屏蔽层212靠近地焊盘的表面与地焊盘粘接或焊接来接地，不对第一屏蔽层212增加额外的固定结构，在连接器组件10的使用过程中，也容易出现地焊盘与第一屏蔽层212接触不良的问题，且工艺复杂、加工效率低，后续更换第一线缆210时容易造成电路板100或第一线缆210的损坏。上述第一屏蔽层212接地的方案，均未解决第一连接端2111处信号屏蔽问题和接地问题。
而在本实施方式中，通过第一屏蔽外壳310的设置，第一方面，第一屏蔽外壳310与第一主体部2112上的第一屏蔽层212抵接，可实现第一线缆210接地，保证信号正常传输，不仅可减小外界信号对第一线缆210信号传输的干扰，还可减小第一子芯和第二子芯的***损耗，提高信号传输质量；同时，第一屏蔽外壳310与第一屏蔽层212通过面与面的方式抵接，第一屏蔽外壳310不易于损坏第一屏蔽层212，保证第一屏蔽外壳310与第一屏蔽层212的良好接触。
第二方面，第一屏蔽外壳310罩设在第一连接端2111的外侧，可屏蔽第一连接端2111处的外界干扰信号且提升信号传输稳定性，由于第一连接端2111需要与第一信号盘120电连接，第一连接端2111外部并未包覆第一屏蔽层212，第一连接端2111容易受到外界信号干扰，而第一屏蔽外壳310可将第一连接端2111与外界干扰信号隔离，减小第一连接端2111的信号传输的丢失和传输错误问题的出现，保证第一线缆210传输信号的完整性，同时，第一屏蔽外壳310还用于作为第一连接端2111的信号参考地，第一屏蔽外壳310与第一屏蔽层212连接，实现第一连接端2111信号的参考地连续，提升信号传输稳定性。
连接器组件10还包括壳体400(如图8所示)，电路板100和第一线缆210位于壳体400内。当连接器组件10仅包括第一线缆210这一根线缆时，虽然连接器组件10的壳体400也具有一定的屏蔽效果，也可用于第一连接端2111的信号屏蔽，但若采用壳体400屏蔽信号且将第一线缆210接地，而不设置第一屏蔽外壳310，则需要在壳体400的内表面额外设置屏蔽弹片(图中未示出)，屏蔽弹片将第一屏蔽层212压紧以实现第一屏蔽层212接地，由于壳体400一般为标准壳体，壳体400的体积大于第一屏蔽外壳310，壳体400与第一连接端2111 的距离较远，不仅对第一连接端2111处屏蔽效果差，而且屏蔽弹片与壳体400的匹配性较差，屏蔽弹片与第一屏蔽层212抵接效果差、达不到较好地连接精度，使得壳体400与第一连接端2111连接稳定性差，屏蔽弹片也容易损坏第一屏蔽层212，在壳体400上设置屏蔽弹片的方式工艺复杂、成本高，因而相较于本实施方式中的第一屏蔽外壳310，利用壳体400进行信号屏蔽的效果差，不足以实现信号的高质量传输。
第三方面，当第一屏蔽外壳310与第一屏蔽层212背离电路板100的表面抵接且第一屏蔽外壳310固定在电路板100上，第一屏蔽外壳310可将第一线缆210压向电路板100，第一线缆210被固定在第一屏蔽外壳310与电路板之间，可减小由于连接器组件10振动对第一连接端2111与第一信号盘120电连接造成的不良影响，保证第一连接端2111与第一信号盘120连接的稳固性。
第四方面，可通过控制第一屏蔽外壳310的沿第一方向X的高度，进而控制第一屏蔽外壳310与第一屏蔽层212的压紧力，以使第一屏蔽外壳310与第一屏蔽层212紧密贴合，保证第一屏蔽层212始终接地，且第一屏蔽外壳310可适配不同尺寸的第一线缆210，提高第一屏蔽外壳310的利用率。
第五方面，本实施方式中，不涉及对第一线缆210的改造，仅安装第一屏蔽外壳310即可实现第一屏蔽层212接地，达到减小串扰和降低***损耗的效果，使用第一屏蔽外壳310时加工效率高、组装简单。
请参阅图8和图9，图8为连接器组件10的结构示意图，图9为图8中连接器组件10的***图。在一实施方式中，连接器组件10还包括壳体400、解锁扣500和拉环600(如图8和图9所示)，部分电路板100、部分第一线缆210和第一屏蔽外壳310位于壳体400内，第一线缆210自壳体400内沿第三方向Z延伸至壳体400外，以便于第一线缆210与第二电子装置30连接；电路板100沿第三方向Z远离第一线缆210的一端与第二电子装置30连接；通过解锁扣500和拉环600的配合使用，以实现连接器组件10与第一电子装置20的连接与断开。在一实施方式中，壳体400包括相连接的第一子壳410和第二子壳420，壳体400为可拆卸的壳体，以便于将第一线缆210、第一屏蔽外壳310和电路板100安装至壳体400内，便于连接器组件10的组装。
在一种可能的实施方式中，第一屏蔽外壳310包括依次连接的第一子部311、第二子部312和第三子部313(如图6所示)，第一子部311的延伸方向和第三子部313的延伸方向均与第二子部312的延伸方向相交，且第一子部311和第三子部313远离第二子部312的一端固定在电路板100上并与接地层110连接，至少部分第二子部312与第一屏蔽层212弹性抵接，以使第一屏蔽层212与接地层110连接。其中，第一子部311的延伸方向、第二子部312的延伸方向和第三子部313的延伸方向均指的是整体板面的延伸方向，在本实施方式中，第一子部311和第三子部313均为直板形，在其他实施方式中，第一子部311和第三子部313也可为具有一定弧度的弧形板。在一实施方式中，第二子部312板面的形状可视第一屏蔽层212表面的形状而定，若第一屏蔽层212背离电路板100的表面为方形，则第二子部312与第一屏蔽层212抵接部位可设置成方形，若第一屏蔽层212背离电路板100的表面为圆弧形，则第二子部312与第一屏蔽层212抵接部位可设置成圆弧形，以保证第二子部312与第一屏蔽层212可贴合设置，保证第二子部312与第一屏蔽层212连接可靠性。
第一屏蔽外壳310大致呈“凹”字形，凹口朝向第一线缆210以罩设第一线缆210。在本实施方式中，第一子部311的延伸方向和第三子部313的延伸方向平行，且第一子部311的延伸方向和第三子部313的延伸方向与第二子部312的延伸方向垂直相交。在一实施方式 中，第一子部311的延伸方向和第三子部313的延伸方向均与第一方向X平行。在一实施方式中，第二子部312的延伸方向与电路板100的板面平行。
由于第一屏蔽外壳310为金属外壳，第一屏蔽外壳310具有一定的弹性，具体表现为第二子部312可沿第一方向X靠近或者远离电路板100运动，第二子部312抵接至第一屏蔽层212时，第二子部312沿第一方向X远离电路板100发生弹性形变，第二子部312产生一个沿第一方向X朝向电路板100方向的弹力，以使第二子部312与第一屏蔽层212紧密贴合，且当连接器组件10振动而带动第一线缆210沿第一方向X振动时，第二子部312可通过弹性形变紧贴第一屏蔽层212运动，第二子部312与第一屏蔽层212保持稳定、可靠的连接，以保证第一屏蔽层212接地，提高第一屏蔽外壳310的屏蔽效果及信号传输的质量。
在本实施方式中，第一子部311和第三子部313远离第二子部312的一端均与接地层110连接，第一屏蔽外壳310与接地层110的连接可靠性更高。在一实施方式中，第一子部311和第三子部313其中之一与接地层110连接，第一子部311和第三子部313中的另一个可直接焊接在电路板100靠近第一屏蔽外壳310的表面上或者其他方便焊接的位置上。
在一实施方式中，第一屏蔽外壳310为一体化结构，第一子部311、第二子部312和第三子部313一体成型，结构强度更高，保证第一屏蔽外壳310的正常工作。在一实施方式中，第一屏蔽外壳310一体式冲压成型，加工工序简单，成本较低。
在一种可能的实现方式中，第二子部312沿第一方向X朝向第一线缆210凹陷形成第一凹槽3121(如图6所示)，第一方向X与电路板100相交，第一凹槽3121的槽底与第一屏蔽层212弹性抵接。通过第一凹槽3121的设置，增加第二子部312在第一方向X的可形变的程度，相较于将第二子部312设置成完全平整的形状，第一凹槽3121与第一屏蔽层212的连接可靠性更高，且第二子部312与第一子部311和第三子部313连接的稳固性更强，特别是在振动频繁的环境中使用连接器组件10时，第一凹槽3121的设置可保证第一屏蔽外壳310与第一屏蔽层212稳定连接，使信号高质量传输。
在一实施方式中，第一凹槽3121的延伸方向与第一屏蔽层212的延伸方向相同，即第一凹槽3121与第一屏蔽层212均沿第三方向Z延伸，增大第一凹槽3121与第一屏蔽层212的接触面积，使第一屏蔽外壳310可起到更好地屏蔽作用。在一实施方式中，第一凹槽3121的延伸方向也可与第一屏蔽层212的延伸方向不同，可根据实际需要设置第一凹槽3121的延伸方向。在本实施方式中，部分第二子部312沿第一方向X朝向第一线缆210凹陷形成第一凹槽3121，部分第二子部312未朝向第一线缆210凹陷且仍保持与电路板100平行，以便于第一屏蔽外壳310与电路板100的安装连接。
在一种可能的实现方式中，第一凹槽3121上设有贯穿槽底的第一开孔3122(如图6所示)。第一开孔3122可增加第一凹槽3121的弹性，以减小第一屏蔽外壳310组装时产生翘曲的可能性，保证第一凹槽3121的槽底与第一屏蔽层212的良好接触。
在一种可能的实现方式中，至少部分第一开孔3122与第一屏蔽层212在电路板100上的正投影不重叠。至少部分第一开孔3122位于第一凹槽3121未与第一屏蔽层212接触的部位，在增加第一凹槽3121的弹性的同时，尽量增大第一凹槽3121与第一屏蔽层212的接触面积，使第一屏蔽外壳310可起到更好地屏蔽作用。
在一实施方式中，第一开孔3122与第一屏蔽层212在电路板100上的正投影不重叠(如图10所示)，第一开孔3122位于第一凹槽3121未与第一屏蔽层212接触的部位，在增加第一凹槽3121的弹性的同时，并未减小第一凹槽3121与第一屏蔽层212的接触面积，使第一屏蔽外壳310可起到更好地屏蔽作用。
在一实施方式中，第一开孔3122与第一连接端2111在电路板100上的正投影至少部分重叠，连接器组件10在组装时，先将第一屏蔽外壳310固定在电路板100上，而后通过第一开孔3122将第一连接端2111焊接在第一信号盘120上，或者通过第一开孔3122以点胶的方式将第一连接端2111粘接在第一信号盘120上，第一屏蔽外壳310可为第一线缆210的安装起到定位作用。在一实施方式中，第一开孔3122与第一连接端2111在电路板100上的正投影至少部分重叠，当连接器组件10在长久使用过程中，若第一连接端2111与第一信号盘120的连接出现松动，还可以通过第一开孔3122紧固第一连接端2111与第一信号盘120的连接。
在一种可能的实现方式中，第一子部311和第三子部313远离第二子部312的一端设有引脚301(如图6所示)，电路板100上设有地通孔101(如图4所示)，地通孔101连接接地层110，引脚301伸入地通孔101内以使第一屏蔽外壳310与接地层110连接。其中，地通孔101设置在第一线缆210的周侧，且地通孔101贯穿电路板100沿第一方向X靠近第一屏蔽外壳310的表面，通过引脚301与地通孔101连接以实现第一屏蔽外壳310与电路板100固定连接。
在一实施方式中，地通孔101贯穿电路板100沿第一方向X的两个表面，使引脚301与地通孔101的连接更加简单、更加可靠。在一实施方式中，电路板100上设有四个地通孔101，第一子部311远离第二子部312的一端设有两个引脚301，第三子部313远离第二子部312的一端同样设有两个引脚301，四个引脚301分别伸入四个地通孔101内，以实现第一屏蔽外壳310与电路板100的稳定连接。
在一种可能的实现方式中，电路板100靠近第一线缆210的表面设有地焊盘111(如图4所示)，地焊盘111与靠近电路板100一侧的部分第一屏蔽层212抵接。地焊盘111和第一屏蔽外壳310的设置，使第一线缆210沿第一方向X的两个表面均接地，且第一屏蔽外壳310与第一屏蔽层212抵接可将第一屏蔽层212与地焊盘111压紧，可以更好地起到屏蔽效果，以降低外界环境对第一线缆210信号传输的影响。
在一实施方式中，地焊盘111与接地层110电连接，第一线缆210沿第一方向X的两个表面均与接地层110电连接。在一实施方式中，地焊盘111为设置在电路板100表面局部位置的一块金属片，第一屏蔽层212靠近电路板100表面与金属片抵接以达到屏蔽效果。在一实施方式中，部分第一屏蔽层212靠近地焊盘111的表面与地焊盘111焊接，以保护固定第一线缆210。在一实施方式中，部分第一屏蔽层212靠近地焊盘111的表面与地焊盘111粘接，如通过紫外光固化胶(UV胶)将第一屏蔽层212粘接在地焊盘111上，以保护固定第一线缆210。
请参阅图11和图12，图11为本申请第二实施例提供的连接器组件10的立体图，图12为图11的***图，本申请第二实施例提供一种连接器组件10，与第一实施例不同的是，电路板100的表面还设有第二信号盘130，连接器组件10还包括第二线缆220和第二屏蔽外壳320，第二线缆220包括第二缆芯221和第二屏蔽层222，第二缆芯221包括第二主体部2212和位于第二主体部2212一端的第二连接端2211，第二屏蔽层222包覆在第二主体部2212的外侧，第二连接端2211与第二信号盘130连接；第二屏蔽外壳320固定在电路板100上并与接地层110连接，第二连接端2211和第二信号盘130位于第二屏蔽外壳320和电路板100之间，且第二屏蔽外壳320与第二屏蔽层222背离电路板100的表面抵接，以使第二屏蔽层222与接地层110连接；第二屏蔽外壳320与第一屏蔽外壳310位于电路板100的同一侧，第二屏蔽外壳320与第一屏蔽外壳310沿第二方向Y间隔设置，第二方向Y与第一线缆210的延伸方向相交。
其中，第二线缆220的设置，增加了连接器组件10传输信号的密度。第二信号盘130及第二线缆220均位于电路板100靠近第一线缆210的表面，第二屏蔽外壳320在电路板100上的正投影与第一屏蔽外壳310在电路板100上的正投影不重叠。第二方向Y与第一方向X、第三方向Z均相交，在本实施方式中，第二方向Y、第一方向X和第三方向Z互相垂直，第二方向Y为连接器组件10的宽度方向，第一方向X为连接器组件10的厚度方向，第三方向Z为连接器组件10的长度方向。
在本实施例中，第二线缆220与第一线缆210相同，第二屏蔽外壳320与第一屏蔽外壳310具有相同的构造和体积。
在一实施方式中，第二线缆220的外径与第一线缆210的外径相同。在一实施方式中，第二线缆220的外径与第一线缆210的外径也可以不同。在一实施方式中，第二屏蔽外壳320与第一屏蔽外壳310的材质、体积也可不同。在一实施方式中，第一线缆210为输入信号线缆，第二线缆220为输出信号线缆。在一实施方式中，第二线缆220为输入信号线缆，第一线缆210为输出信号线缆。在一实施方式中，第一线缆210和第二线缆220均为输入信号线缆。在一实施方式中，第一线缆210和第二线缆220均为输出信号线缆。
若不设置第一屏蔽外壳310和第二屏蔽外壳320，第一线缆210和第二线缆220传输信号时，第一线缆210和第二线缆220之间互相耦合，对第一线缆210和第二线缆220信号的传输造成不利的影响，特别是当第一线缆210和第二线缆220之间间隔较小时，两根线缆间的串扰会更加严重，其中，第一线缆210靠近第一连接端2111的一端对第二线缆220靠近第二连接端2211的一端的串扰称为近端串扰，第一线缆210远离第一连接端2111的一端对第二线缆220靠近第二连接端2211的一端的串扰称为远端串扰，同样地，第二线缆220靠近第二连接端2211的一端对第一线缆210靠近第一连接端2111的一端的串扰称为近端串扰，第二线缆220远离第二连接端2211的一端对第一线缆210靠近第一连接端2111的一端的串扰称为远端串扰。
而在本实施方式中，第一屏蔽外壳310的设置可减小第二线缆220对第一线缆210传输信号的干扰，第二屏蔽外壳320的设置可减小第一线缆210对第二线缆220传输信号的干扰，在增加连接器组件10传输信号密度的同时，提高了信号在连接器组件10内传输的质量。
请参阅图13a和图13b，图13a为本申请第二实施例中远端串扰优化效果图，图13b为本申请第二实施例中近端串扰优化效果图，为了说明采用本实施例对近端串扰及远端串扰优化的效果，以图11所示的实施方式与图7a中单地线线缆接地和图7b中双地线线缆接地的实施方式作比较，图13a和图13b中，横坐标表示频率，纵坐标表示串扰幅值，图13a中，PSFEXT_diff2_outCD_Q112Imported代表图11中实施方式的远端串扰测试数据，PSFEXT_diff2_outCD_Dgnd Imported代表图7b中双地线线缆接地的实施方式的远端串扰测试数据，PSFEXT_diff2_outCD_Q56_Sgnd Imported代表图7a中单地线线缆接地的实施方式的远端串扰测试数据；图13b中，PSNEXT_diff2_outCD_Q112Setup1：Sweep代表图11中实施方式的近端串扰测试数据，PSNEXT_diff2_outCD_Dgnd Imported代表图7b中双地线线缆接地的实施方式的近端串扰测试数据，PSNEXT_diff2_outCD_Sgnd Imported代表图7a中单地线线缆接地的实施方式的近端串扰测试数据。
在112Gbps PAM4格式的信号传输速率下，信号基频为112/4＝28GHz，所以选择在28GHz的串扰幅值作为优化比较的频点，由图13a和图13b可知，图11的实施方式相比于图7b中双地线线缆接地的实施方式，近端串扰和远端串扰均优化25dB，串扰幅度优化约25％。图11的实施方式相比于图7a中单地线线缆接地的实施方式，近端串扰优化33dB，远端串扰优 化35dB，整体串扰幅值提升约58％。由此可知，在本实施方式中，采用无地线线缆结合屏蔽外壳的方式，提高了对串扰的屏蔽效果，特别是提高了在第一连接端2111和第二连接端2211处的串扰屏蔽效果，使信号传输的质量更高。
在一实施方式中，连接器组件10还包括更多根第一线缆210和/或第二线缆220(如图14所示)，多根线缆位于电路板100沿第一方向X的同一侧，每根线缆的周侧均罩设有屏蔽外壳，多个屏蔽外壳沿第二方向Y间隔设置，增加了连接器组件10传输信号的密度。在一实施方式中，连接器组件10可根据实际需要设置4根、8根、16根等数量的线缆，每根线缆的周侧均罩设有屏蔽外壳，多个屏蔽外壳沿第二方向Y间隔设置，增加了连接器组件10传输信号的密度，线缆沿第二方向Y的间距可以为3.62毫米至2.23毫米，当设置更多数量的线缆时，线缆沿第二方向Y的间距可以小于2.23毫米，多根线缆间由于屏蔽外壳的设置，改善了线缆连接端的信号间的串扰性能，改善了多根线缆的地回流，减小多根线缆的回路电感。
请参阅图15、图16和图17，图15为本申请第三实施例提供的连接器组件10的俯视图，图16为本申请第三实施例提供的连接器组件10的仰视图，图17为本申请第三实施例提供的连接器组件10的剖面图，本申请第三实施例提供一种连接器组件10，与第一实施例不同的是，电路板100的表面还设有第三信号盘140，连接器组件10还包括第三线缆230和第三屏蔽外壳330，第三线缆230包括第三缆芯231和第三屏蔽层232，第三缆芯231包括第三主体部2312和位于第三主体部2312一端的第三连接端2311，第三屏蔽层232包覆在第三主体部2312的外侧，第三连接端2311与第三信号盘140连接；第三屏蔽外壳330固定在电路板100上并与接地层110连接，第三连接端2311和第三信号盘140位于第三屏蔽外壳330和电路板100之间，且第三屏蔽外壳330与第三屏蔽层232邻近电路板100的表面抵接，以使第三屏蔽层232与接地层110连接；第三屏蔽外壳330与第一屏蔽外壳310分别位于电路板沿第一方向X的两侧，第一方向X与电路板100相交，第一屏蔽外壳310和第三屏蔽外壳330在电路板100上的正投影至少部分不重叠。
其中，第三线缆230的设置，增加了连接器组件10传输信号的密度。第三信号盘140及第三线缆230均位于电路板100沿第一方向X远离第一线缆210的表面，第三屏蔽外壳330与第一屏蔽外壳310分别位于电路板沿第一方向X的两侧可节约电路板100上的空间，使电路板100上可连接更多线缆或其他电子元件。在一实施方式中，第一线缆210为输入信号线缆，第三线缆230为输出信号线缆。在一实施方式中，第三线缆230为输入信号线缆，第一线缆210为输出信号线缆。在一实施方式中，第一线缆210和第三线缆230均为输入信号线缆。在一实施方式中，第一线缆210和第三线缆230均为输出信号线缆。
在一实施方式中，第三屏蔽外壳330位于第一屏蔽外壳310沿第三方向Z的一侧，或第一屏蔽外壳310位于第三屏蔽外壳330沿第三方向Z的一侧(如图17所示)，第三屏蔽外壳330与第一屏蔽外壳310沿第三方向Z错开设置，即第三屏蔽外壳330在电路板100上的正投影与第一屏蔽外壳310在电路板100上的正投影至少部分不重叠，可更好地减小第三连接端2311和第一连接端2111处的串扰，且预留出空间以便于第三屏蔽外壳330和第一屏蔽外壳310与电路板100的安装，例如，第三屏蔽外壳330和第一屏蔽外壳310使用地通孔101与电路板固定连接时，第三屏蔽外壳330与第一屏蔽外壳310沿第三方向Z错开设置，第三屏蔽外壳330的地通孔101也与第一屏蔽外壳310的地通孔101沿第三方向Z错开设置，第三屏蔽外壳330的安装与第一屏蔽外壳310的安装不会互相干扰。
在一实施方式中，第三屏蔽外壳330位于第一屏蔽外壳310沿第二方向Y的一侧，或第一屏蔽外壳310位于第三屏蔽外壳330沿第二方向Y的一侧，第三屏蔽外壳330与第一屏蔽 外壳310沿第二方向Y错开设置，即第三屏蔽外壳330在电路板100上的正投影与第一屏蔽外壳310在电路板100上的正投影至少部分不重叠，可更好地减小第三连接端2311和第一连接端2111处的串扰，且预留出空间以便于第三屏蔽外壳330和第一屏蔽外壳310与电路板100的安装，例如，第三屏蔽外壳330和第一屏蔽外壳310使用地通孔101与电路板固定连接时，第三屏蔽外壳330与第一屏蔽外壳310沿第二方向Y错开设置，第三屏蔽外壳330的地通孔101也与第一屏蔽外壳310的地通孔101沿第二方向Y错开设置，第三屏蔽外壳330的安装与第一屏蔽外壳310的安装不会互相干扰。
在一实施方式中，当第三屏蔽外壳330沿第二方向Y远离第一屏蔽外壳310设置时，可实现第三屏蔽外壳330在电路板100上的正投影与第一屏蔽外壳310在电路板100上的正投影不重叠。
在一实施方式中，第三屏蔽外壳330位于第一屏蔽外壳310沿第二方向Y的一侧，且第三屏蔽外壳330位于第一屏蔽外壳310沿第三方向Z的一侧，第三屏蔽外壳330与第一屏蔽外壳310沿第二方向Y及第三方向Z均错开设置，可更好地减小第三连接端2311和第一连接端2111处的串扰，且预留出空间以便于安装第三屏蔽外壳330和第一屏蔽外壳310与电路板100。
在一实施方式中，第三屏蔽外壳330在电路板100上的正投影与第一屏蔽外壳310在电路板100上的正投影也可以重叠，此时为了有利于顺利安装第三屏蔽外壳330与第一屏蔽外壳310，第三屏蔽外壳330的地通孔101需要与第一屏蔽外壳310的地通孔101错开设置，而相应地，第三屏蔽外壳330上的引脚301位置需要与第一屏蔽外壳310的引脚301位置不同，以使各自的引脚301对应各自的地通孔101。
在一实施方式中，连接器组件10还包括多根沿第二方向Y间隔设置的第一线缆210，且连接器组件10包括多根沿第二方向Y间隔设置的第三线缆230，多根第一线缆210与多根第三线缆230分别位于电路板100沿第一方向X的两侧，每根第一线缆210的周侧均罩设有第一屏蔽外壳310，每根第三线缆230的周侧均罩设有第三屏蔽外壳330，多个第一屏蔽外壳310沿第二方向Y间隔设置，多个第三屏蔽外壳330沿第二方向Y间隔设置，多个第一屏蔽外壳310与多个第三屏蔽外壳330均错开设置，增加了连接器组件10传输信号的密度，且预留出空间以便于第三屏蔽外壳330和第一屏蔽外壳310与电路板100的安装。
在一实施方式中，电路板100沿第一方向X的两侧设置相同数量的第一线缆210和第三线缆230，第一线缆210和第三线缆230中的一个为输入信号线缆，第一线缆210和第三线缆230中的另一个为输出信号线缆。
请参阅图18，图18为本申请第四实施例提供的连接器组件10的***图，本申请第四实施例提供一种连接器组件10，与第一实施例不同的是，电路板100的表面还设有第二信号盘130，连接器组件10还包括第二线缆220和第二屏蔽外壳320，第二线缆220包括第二缆芯221和第二屏蔽层222，第二缆芯221包括第二主体部2212和位于第二主体部2212一端的第二连接端2211，第二屏蔽层222包覆在第二主体部2212的外侧，第二连接端2211与第二信号盘130连接；第二屏蔽外壳320固定在电路板100上并与接地层110连接，第二连接端2211和第二信号盘130位于第二屏蔽外壳320和电路板100之间，且第二屏蔽外壳320与第二屏蔽层222邻近电路板100的表面抵接，以使第二屏蔽层222与接地层110连接；第二屏蔽外壳320与第一屏蔽外壳310位于电路板100的同一侧，第二屏蔽外壳320与第一屏蔽外壳310沿第二方向Y并排连接设置，第二方向Y与第一线缆210的延伸方向相交。
其中，第二线缆220的设置，增加了连接器组件10传输信号的密度。第二信号盘130及 第二线缆220均位于电路板100靠近第一线缆210的表面，第二屏蔽外壳320在电路板100上的正投影与第一屏蔽外壳310在电路板100上的正投影不重叠。第二屏蔽外壳320与第一屏蔽外壳310沿第二方向Y并排连接设置，第二线缆220更加靠近第一线缆210设置，可节约电路板100上的空间，使电路板100上可连接更多线缆或其他电子元件。第一屏蔽外壳310的设置可减小第二线缆220对第一线缆210传输信号的干扰，第二屏蔽外壳320的设置可减小第一线缆210对第二线缆220传输信号的干扰，在增加连接器组件10传输信号密度的同时，提高了信号在连接器组件10内传输的质量。
请参阅图19，本申请第五实施例提供一种连接器组件10，与第四实施例不同的是，第一屏蔽外壳310包括依次连接的第一子部311、第二子部312和第三子部313，至少部分第二子部312与第一屏蔽层212弹性抵接；第二屏蔽外壳320包括依次连接的第三子部313、第四子部314和第五子部315，至少部分第四子部314与第二屏蔽层222弹性抵接。
其中，第一子部311的延伸方向、第三子部313的延伸方向和第五子部315的延伸方向均与第二子部312的延伸方向或第四子部314的延伸方向相交；第一子部311远离第二子部312的一端固定在电路板100上并与接地层110连接，第三子部313远离第二子部312或第四子部314的一端固定在电路板100上并与接地层110连接，第五子部315远离第四子部314的一端固定在电路板100上并与接地层110连接。
第一屏蔽外壳310和第二屏蔽外壳320的整体形状大致呈“M”字形，第一屏蔽外壳310和第二屏蔽外壳320共用第三子部313，一方面，可节约电路板100上的空间，使电路板100上可连接更多线缆或其他电子元件；另一方面，可节约第一屏蔽外壳310和第二屏蔽外壳320的制造成本。
请参阅图20和图21，图20为本申请第五实施例提供的连接器组件10的***图，图21为本申请第五实施例提供的屏蔽外壳的仰视图，在一实施方式中，第一子部311、第三子部313和第五子部315可从板面形状简化为柱状，使屏蔽外壳的加工与安装更加简易。
在一种可能的实现方式中，第一屏蔽外壳310与第二屏蔽外壳320为一体化结构，屏蔽外壳为一体式成型，一方面，节省电路板100上的空间，使线缆在电路板100上可高密度排布，提高连接器组件10信号传输密度和质量；另一方面，使屏蔽外壳的加工更简易，改善了可加工性，提升了屏蔽外壳的生产效率；再一方面，第一屏蔽外壳310与第二屏蔽外壳320可为第一线缆210和第二线缆220的安装起到定位作用，使第一线缆210和第二线缆220可以更加精准地安装到电路板100上。
请参阅图22a和图22b，图22a为本申请第五实施例中远端串扰优化效果图，图22b为本申请第五实施例中近端串扰优化效果图，为了说明采用本实施例中的实施方式对近端串扰及远端串扰优化的效果，以图20的实施方式与图7a中单地线线缆接地和图7b中双地线线缆接地的实施方式作比较，图22a和图22b中，横坐标表示频率，纵坐标表示串扰幅值，图22a中，PSFEXT_diff2_outCD Imported代表图20中实施方式的远端测试数据，PSFEXT_diff2_outCD_dualdrain Imported代表图7b中双地线线缆接地的实施方式的远端测试数据，PSFEXT_diff2_outCD_singledrain Imported代表图7a中单地线线缆接地的实施方式的远端测试数据；图22b中，PSNEXT_diff2_outCD Imported代表图20中实施方式的近端测试数据，PSNEXT_diff2_outCD_dualdrain Imported代表图7b中双地线线缆接地的实施方式的近端测试数据，PSNEXT_diff2_outCD_singledrain Imported代表图7a中单地线线缆接地的实施方式的近端测试数据。
选择在28GHz的串扰幅值作为优化比较的频点，由图22a和图22b可知，图20的实施 方式相比于图7b中双地线线缆接地的实施方式，综合近端串扰优化7dB，串扰幅度优化约12％；综合远端串扰优化9dB，串扰幅度优化约17％。图20的实施方式相比于图7a中单地线线缆接地的实施方式，综合近端串扰优化8dB，串扰幅度优化约14％；综合远端串扰优化12dB，串扰幅度优化约23％。由此可知，在本实施方式中，采用无地线线缆结合屏蔽外壳的方式，提高了对串扰的屏蔽效果，特别是提高了在第一连接端2111和第二连接端2211处的串扰屏蔽效果，使信号传输的质量更高。
请参阅图23a和图23b，图23a为本申请第五实施例中远端串扰优化效果图，图23b为本申请第五实施例中近端串扰优化效果图，为了说明本实施方式中屏蔽外壳对近端串扰及远端串扰优化的效果，以图20中具备屏蔽外壳的实施方式与图20中去掉屏蔽外壳的实施方式作比较，图23a和图23b中，横坐标表示频率，纵坐标表示串扰幅值，图23a中，PSFEXT_diff2_outCD Imported代表图20中具备屏蔽外壳实施方式的远端测试数据，PSFEXT_diff2_outCD_qupinbi Imported代表图20中去掉屏蔽外壳实施方式的远端测试数据；图23b中，PSNEXT_diff2_outCD Imported代表图20中具备屏蔽外壳实施方式的近端测试数据，PSNEXT_diff2_outCD_qupinbi Imported代表图20中去掉屏蔽外壳实施方式的近端测试数据。
选择在28GHz的串扰幅值作为优化比较的频点，由图23a和图23b可知，图20中具备屏蔽外壳的实施方式与图20中去掉屏蔽外壳的实施方式，综合近端串扰优化了9dB，整体串扰幅度优化约16％；综合远端串扰优化4dB，整体串扰幅度优化约7％。由此可知，在本实施方式中，屏蔽外壳的设置，起到了较好的屏蔽效果，且采用无地线线缆结合屏蔽外壳的方式，提高了对串扰的屏蔽效果，特别是提高了在第一连接端2111和第二连接端2211处的串扰屏蔽效果，使信号传输的质量更高。
在一实施方式中，连接器组件10中包括更多根沿第二方向Y排布的线缆(如图24所示)，每根线缆周侧均设置屏蔽外壳，屏蔽外壳之间依次连接且共用同一个相邻侧边以形成一个整体。在图24中的连接器组件10为四通道连接器。
在一实施方式中，连接器组件10中包括更多根线缆，多根线缆分布在电路板100沿第一方向X的两侧(如图25所示)，位于电路板100沿第一方向X两侧的屏蔽外壳分别形成一个屏蔽外壳整体。在图25中的连接器组件10为八通道连接器。
在一实施方式中，第一屏蔽外壳310上设有两个沿第二方向Y排布的第一开孔3122(如图21所示)，两个第一开孔3122在电路板100上的正投影位于第一线缆210的周侧，第一开孔3122的设置，一方面可增加第一凹槽3121的弹性，以减小第一屏蔽外壳310组装时产生翘曲的可能性，保证第一凹槽3121的槽底与第一屏蔽层212的良好接触，另一方面，可通过第一开孔3122将第一线缆210固定在电路板100上，或者当第一线缆210松动使，可通过第一开孔3122以点胶的方式加固第一线缆210与电路板100的连接。第二屏蔽外壳320与第一屏蔽外壳310具有类似结构，在此不再赘述。
在一种可能的实现方式中，第二子部312设有第二开孔3123(如图21所示)，第二开孔3123与第一连接端2111和/或第一信号盘120在电路板100上的正投影至少部分重叠。其中，第二开孔3123位于第一开孔3122沿第三方向Z靠近第一连接端2111的一侧，第二开孔3123的设置，便于第一连接端2111与第一信号盘120的连接固定。第二屏蔽外壳320与第一屏蔽外壳310具有类似结构，在此不再赘述。
在一实施方式中，连接器组件10在组装时，先将第一屏蔽外壳310固定在电路板100上，而后通过第二开孔3123将第一连接端2111焊接在第一信号盘120上，或者通过第二开孔3123 以点胶的方式将第一连接端2111粘接在第一信号盘120上，第一屏蔽外壳310可为第一线缆210的安装起到定位作用，同时，当连接器组件10在长久使用过程中，若第一连接端2111与第一信号盘120的连接出现松动，还可以通过第二开孔3123紧固第一连接端2111与第一信号盘120的连接。
以上对本申请实施例所提供的连接器、互连***及服务器集群进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (14)

  1. 一种连接器组件，其特征在于，所述连接器组件包括：
    电路板，包括接地层，所述电路板的表面设有第一信号盘；
    第一线缆，用于传输信号，包括第一缆芯和第一屏蔽层，所述第一缆芯包括第一主体部和位于所述第一主体部一端的第一连接端，所述第一屏蔽层包覆在所述第一主体部的外侧，所述第一连接端与所述第一信号盘连接；
    第一屏蔽外壳，固定在所述电路板上并与所述接地层连接，所述第一连接端和所述第一信号盘位于所述第一屏蔽外壳和所述电路板之间，且所述第一屏蔽外壳与所述第一屏蔽层邻近所述电路板的部分表面抵接，以使所述第一屏蔽层与所述接地层连接。
  2. 根据权利要求1所述的连接器组件，其特征在于，所述第一屏蔽外壳包括依次连接的第一子部、第二子部和第三子部，所述第一子部的延伸方向和所述第三子部的延伸方向均与所述第二子部的延伸方向相交，且所述第一子部和所述第三子部远离所述第二子部的一端固定在所述电路板上并与所述接地层连接，至少部分所述第二子部与所述第一屏蔽层弹性抵接，以使所述第一屏蔽层与所述接地层连接。
  3. 根据权利要求2所述的连接器组件，其特征在于，所述第二子部沿第一方向朝向所述第一线缆凹陷形成第一凹槽，所述第一方向与所述电路板相交，所述第一凹槽的槽底与所述第一屏蔽层弹性抵接。
  4. 根据权利要求3所述的连接器组件，其特征在于，所述第一凹槽上设有贯穿所述槽底的第一开孔。
  5. 根据权利要求4所述的连接器组件，其特征在于，至少部分所述第一开孔与所述第一屏蔽层在所述电路板上的正投影不重叠。
  6. 根据权利要求2所述的连接器组件，其特征在于，所述第一子部和所述第三子部远离所述第二子部的一端设有引脚，所述电路板上设有地通孔，所述地通孔连接所述接地层，所述引脚伸入所述地通孔内以使所述第一屏蔽外壳与所述接地层连接。
  7. 根据权利要求1所述的连接器组件，其特征在于，所述电路板的表面设有第二信号盘，所述连接器组件还包括第二线缆和第二屏蔽外壳，所述第二线缆包括第二缆芯和第二屏蔽层，所述第二缆芯包括第二主体部和位于所述第二主体部一端的第二连接端，所述第二屏蔽层包覆在所述第二主体部的外侧，所述第二连接端与所述第二信号盘连接；所述第二屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第二连接端和所述第二信号盘位于所述第二屏蔽外壳和所述电路板之间，且所述第二屏蔽外壳与所述第二屏蔽层邻近所述电路板的表面抵接，以使所述第二屏蔽层与所述接地层连接；
    所述第二屏蔽外壳与第一屏蔽外壳位于所述电路板的同一侧，所述第二屏蔽外壳与所述第一屏蔽外壳沿第二方向间隔设置，所述第二方向与所述第一线缆的延伸方向相交。
  8. 根据权利要求1所述的连接器组件，其特征在于，所述电路板的表面设有第三信号盘， 所述连接器组件还包括第三线缆和第三屏蔽外壳，所述第三线缆包括第三缆芯和第三屏蔽层，所述第三缆芯包括第三主体部和位于所述第三主体部一端的第三连接端，所述第三屏蔽层包覆在所述第三主体部的外侧，所述第三连接端与所述第三信号盘连接；所述第三屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第三连接端和所述第三信号盘位于所述第三屏蔽外壳和所述电路板之间，且所述第三屏蔽外壳与所述第三屏蔽层邻近所述电路板的表面抵接，以使所述第三屏蔽层与所述接地层连接；
    所述第三屏蔽外壳与所述第一屏蔽外壳分别位于所述电路板沿第一方向的两侧，所述第一方向与所述电路板相交，所述第一屏蔽外壳和所述第三屏蔽外壳在所述电路板上的正投影至少部分不重叠。
  9. 根据权利要求1所述的连接器组件，其特征在于，所述电路板的表面设有第二信号盘，所述连接器组件还包括第二线缆和第二屏蔽外壳，所述第二线缆包括第二缆芯和第二屏蔽层，所述第二缆芯包括第二主体部和位于所述第二主体部一端的第二连接端，所述第二屏蔽层包覆在所述第二主体部的外侧，所述第二连接端与所述第二信号盘连接；所述第二屏蔽外壳固定在所述电路板上并与所述接地层连接，所述第二连接端和所述第二信号盘位于所述第二屏蔽外壳和所述电路板之间，且所述第二屏蔽外壳与所述第二屏蔽层邻近所述电路板的表面抵接，以使所述第二屏蔽层与所述接地层连接；
    所述第二屏蔽外壳与所述第一屏蔽外壳位于所述电路板的同一侧，所述第二屏蔽外壳与所述第一屏蔽外壳沿第二方向并排连接设置，所述第二方向与所述第一线缆的延伸方向相交。
  10. 根据权利要求9所述的连接器组件，其特征在于，所述第一屏蔽外壳包括依次连接的第一子部、第二子部和第三子部，至少部分所述第二子部与所述第一屏蔽层弹性抵接；所述第二屏蔽外壳包括依次连接的所述第三子部、第四子部和第五子部，至少部分所述第四子部与所述第二屏蔽层弹性抵接。
  11. 根据权利要求10所述的连接器组件，其特征在于，所述第二子部设有第二开孔，所述第二开孔与所述第一连接端和/或所述第一信号盘在所述电路板上的正投影至少部分重叠。
  12. 根据权利要求1所述的连接器组件，其特征在于，所述电路板靠近所述第一线缆的表面设有地焊盘，所述地焊盘与靠近所述电路板一侧的部分所述第一屏蔽层抵接。
  13. 一种互连***，其特征在于，所述互连***包括第一电子装置和如权利要求1-12任一项所述的连接器组件，所述第一电子装置与所述电路板远离所述第一线缆的一端电连接。
  14. 一种服务器集群，其特征在于，包括多个服务器，所述服务器包括高速背板、交换机、业务板、背板连接器和多个如权利要求1-12任一项所述的连接器组件，所述背板连接器和所述第一线缆远离所述电路板的一端连接，所述背板连接器固定连接在所述高速背板上，所述多个连接器组件中的一部分所述连接器组件中的电路板与所述交换机连接，所述多个连接器组件中的另一部分所述连接器组件的电路板与所述业务板连接。
PCT/CN2023/088986 2022-05-11 2023-04-18 连接器组件、互连***及服务器集群 WO2023216816A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210507736.2A CN117096677A (zh) 2022-05-11 2022-05-11 连接器组件、互连***及服务器集群
CN202210507736.2 2022-05-11

Publications (1)

Publication Number Publication Date
WO2023216816A1 true WO2023216816A1 (zh) 2023-11-16

Family

ID=88729624

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/088986 WO2023216816A1 (zh) 2022-05-11 2023-04-18 连接器组件、互连***及服务器集群

Country Status (3)

Country Link
CN (1) CN117096677A (zh)
TW (1) TW202410579A (zh)
WO (1) WO2023216816A1 (zh)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869308B2 (en) * 2002-12-11 2005-03-22 Hon Hai Precision Ind. Co., Ltd. Cable connector having cross-talk suppressing feature and method for making the connector
CN205004467U (zh) * 2015-07-01 2016-01-27 东莞莫仕连接器有限公司 线缆连接器
CN205104699U (zh) * 2015-08-07 2016-03-23 富士康(昆山)电脑接插件有限公司 线缆连接器组件
CN206364484U (zh) * 2016-12-19 2017-07-28 番禺得意精密电子工业有限公司 线缆装置
CN207199937U (zh) * 2017-08-10 2018-04-06 东莞铭基电子科技集团有限公司 高速连接器
CN111755911A (zh) * 2020-07-10 2020-10-09 上海航天科工电器研究院有限公司 一种高速连接器的线缆连接结构
CN113346262A (zh) * 2021-04-29 2021-09-03 山东英信计算机技术有限公司 一种用于脉冲振幅调变的线缆转接装置及转接方法
CN113904129A (zh) * 2021-12-09 2022-01-07 鹏元晟高科技股份有限公司 一种高速信号线缆组件
CN114256696A (zh) * 2020-09-21 2022-03-29 华为技术有限公司 连接器组件及其制造方法和电子设备
CN216450895U (zh) * 2021-07-26 2022-05-06 浙江兆龙互连科技股份有限公司 具有屏蔽及接地功能的电连接器

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869308B2 (en) * 2002-12-11 2005-03-22 Hon Hai Precision Ind. Co., Ltd. Cable connector having cross-talk suppressing feature and method for making the connector
CN205004467U (zh) * 2015-07-01 2016-01-27 东莞莫仕连接器有限公司 线缆连接器
CN205104699U (zh) * 2015-08-07 2016-03-23 富士康(昆山)电脑接插件有限公司 线缆连接器组件
CN206364484U (zh) * 2016-12-19 2017-07-28 番禺得意精密电子工业有限公司 线缆装置
CN207199937U (zh) * 2017-08-10 2018-04-06 东莞铭基电子科技集团有限公司 高速连接器
CN111755911A (zh) * 2020-07-10 2020-10-09 上海航天科工电器研究院有限公司 一种高速连接器的线缆连接结构
CN114256696A (zh) * 2020-09-21 2022-03-29 华为技术有限公司 连接器组件及其制造方法和电子设备
CN113346262A (zh) * 2021-04-29 2021-09-03 山东英信计算机技术有限公司 一种用于脉冲振幅调变的线缆转接装置及转接方法
CN216450895U (zh) * 2021-07-26 2022-05-06 浙江兆龙互连科技股份有限公司 具有屏蔽及接地功能的电连接器
CN113904129A (zh) * 2021-12-09 2022-01-07 鹏元晟高科技股份有限公司 一种高速信号线缆组件

Also Published As

Publication number Publication date
CN117096677A (zh) 2023-11-21
TW202410579A (zh) 2024-03-01

Similar Documents

Publication Publication Date Title
US7736195B1 (en) Circuits, systems and methods for implementing high speed data communications connectors that provide for reduced modal alien crosstalk in communications systems
CN103428991B (zh) 高数据率连接器***
KR100385489B1 (ko) 고속신호를 포함한 상이한 신호들을 처리하기 위한 커넥터
CN103548214B (zh) 高速输入/输出连接接口元件、线缆组件和串扰减小的互连***
US7175475B2 (en) Receptacle for copper wire transceivers
US11600950B2 (en) High-speed signal connector and receptacle assembly equipped therewith and transceiver module assembly equipped therewith
TW200929736A (en) Shield case and printed circuit board assembly incorporating same
CN111308620B (zh) 一种光模块
CN106356688A (zh) 构造用于谐振控制的可插拔连接器和互连***
JP6394420B2 (ja) ケーブルの接続構造、および、それを備えるケーブル用コネクタ
US6608258B1 (en) High data rate coaxial interconnect technology between printed wiring boards
WO2023216816A1 (zh) 连接器组件、互连***及服务器集群
CN216488672U (zh) 电连接器
WO2022057422A1 (zh) 连接器组件及其制造方法和电子设备
TWI769682B (zh) 具有電磁屏蔽功能的電連接器
CN113725641A (zh) 一种线缆连接装置、连接组件及其制作方法
US11342695B2 (en) Cable connection apparatus, connection assembly, and method for manufacturing connection assembly
WO2023016002A1 (zh) 一种连接器、电路板组件及电子设备
CN212323250U (zh) 一种线缆连接装置及其连接组件
CN211579048U (zh) 连接组件
CN101944671A (zh) 具有插接定位结构的电路排线
US11095075B2 (en) Electrical device with a plug connector having a flexible section
WO2022217604A1 (zh) 电缆连接器和电子设备
US20210296830A1 (en) Electrical connector
CN109962357B (zh) Fpc连接器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23802591

Country of ref document: EP

Kind code of ref document: A1