WO2023216687A1 - Microphone structure and voice communication device - Google Patents
Microphone structure and voice communication device Download PDFInfo
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- WO2023216687A1 WO2023216687A1 PCT/CN2023/079600 CN2023079600W WO2023216687A1 WO 2023216687 A1 WO2023216687 A1 WO 2023216687A1 CN 2023079600 W CN2023079600 W CN 2023079600W WO 2023216687 A1 WO2023216687 A1 WO 2023216687A1
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- 238000004891 communication Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 230000005540 biological transmission Effects 0.000 claims abstract description 19
- 230000007704 transition Effects 0.000 claims abstract description 5
- 239000012528 membrane Substances 0.000 claims description 15
- 230000004308 accommodation Effects 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 210000000988 bone and bone Anatomy 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Definitions
- the present application relates to the field of microphone technology, for example, to a microphone structure and voice communication equipment.
- Micro-Electro-Mechanical System uses advanced semiconductor manufacturing processes to achieve mass manufacturing of sensors, actuators and other devices.
- the transmission method of traditional MEMS microphones is that the MEMS chip diaphragm receives airborne speech.
- the sound pressure signal passes through the sound inlet and is sensed by the high-sensitivity vibrating film of the MEMS chip, converting the sound signal into an electrical signal.
- An Application Specific Integrated Circuit (ASIC) chip electrically connected to the MEMS chip amplifies the signal and outputs it.
- the MEMS chip is a microcapacitor composed of a silicon diaphragm and a silicon back plate. It can convert changes in sound pressure into changes in capacitance, and then the ASIC chip converts the changes in capacitance into electrical signals to achieve "sound-to-electricity" conversion.
- Airborne speech includes the voice of the caller and noise from the surroundings. When the noise is loud, the microphone will be interfered by noise, such as surrounding people, mechanical equipment, wind noise, etc. , seriously affecting call quality.
- This application provides a microphone structure and voice communication equipment that can effectively reduce noise, reduce noise in the surrounding environment, and effectively improve call quality.
- a microphone structure including:
- the first substrate, the second substrate and the third substrate are stacked sequentially from top to bottom;
- the first substrate is provided with a sound transmission hole along the thickness direction;
- the second substrate is provided with a first sound cavity;
- the third substrate is provided with a second sound cavity, the sound transmission hole, the first sound cavity The cavity and the second sound cavity are coaxially arranged;
- the hollow shell sealing cover is provided on the first substrate, the hollow shell and the first substrate are surrounded to form an accommodation cavity, and the acoustic element is provided on the first substrate and located in the accommodation cavity;
- An elastic vibrating membrane is sealingly provided at the transition between the first sound cavity and the second sound cavity.
- a voice communication device includes a technical solution of a microphone structure as described in any one of the above.
- Figure 1 is a cross-sectional view of the microphone structure in Embodiment 1 of the present application.
- Figure 2 is a first schematic diagram of the elastic vibration film with wrinkles in Embodiment 1 of the present application;
- Figure 3 is a second schematic diagram of the elastic vibration film with wrinkles in Embodiment 1 of the present application.
- FIG. 4 is a schematic structural diagram of the elastic vibration film being an elastic soft film in Embodiment 1 of the present application;
- FIG. 5 is a schematic structural diagram of the elastic vibration film being an elastic metal sheet in Embodiment 1 of the present application;
- Figure 6 is a schematic structural diagram of the fixed frame in Embodiment 2 of the present application.
- Figure 7 is a cross-sectional view of the microphone structure in Embodiment 2 of the present application.
- the term “above” or “below” a first feature on a second feature may include direct contact between the first and second features, or may also include the first and second features. Not in direct contact but through additional characteristic contact between them.
- the terms “above”, “above” and “above” a first feature on a second feature include the first feature being directly above and diagonally above the second feature, or simply mean that the first feature is higher in level than the second feature.
- “Below”, “under” and “under” the first feature is the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature is less horizontally than the second feature.
- this embodiment provides a microphone structure. The specific contents of this embodiment will be described below with reference to FIGS. 1 to 7 .
- the microphone structure includes a hollow housing 1, a first substrate 2, an acoustic element 3, a second substrate 7, a third substrate 4 and an elastic vibration film 5.
- the microphone structure of this embodiment uses bone conduction for sound transmission, and is attached to the outer skin of human bones during use.
- the first substrate 2, the second substrate 7 and the third substrate 4 are an integrated structure laminated sequentially from top to bottom.
- the first substrate 2, the second substrate 7 and the third substrate 4 are all printed circuit boards (PCB).
- PCB printed circuit boards
- RDL redistribution layer
- the first substrate 2 , the second substrate 7 and the third substrate 4 are electrically connected through the through hole 9 .
- the sealing cover of the hollow housing 1 is provided on the first substrate 2.
- a receiving cavity 11 is formed between the hollow housing 1 and the first substrate 2.
- the first substrate 2 is provided with a sound transmission hole 21 through the thickness direction.
- Acoustic components 3 It is provided on the first substrate 2 and located in the containing cavity 11 .
- the second substrate 7 is provided with a first sound cavity 71; the third substrate 4 is provided with a second sound cavity 41; the sound transmission hole 21, the first sound cavity 71 and the second sound cavity 41 are coaxially arranged; the elastic vibration membrane 5 is provided with a seal At the transition between the first sound cavity 71 and the second sound cavity 41 .
- the cross-sectional area of the second sound cavity 41 is smaller than the cross-sectional area of the first sound cavity 71 .
- the elastic vibration membrane 5 is provided on the step between the first sound cavity 71 and the second sound cavity 41 .
- a receiving cavity 11 is formed between the hollow housing 1 and the first substrate 2 , and a second substrate 7 and a third substrate are sealingly provided on the side of the first substrate 2 away from the hollow housing 1 4.
- the first sound cavity 71, the second sound cavity 41 and the sound transmission hole 21 are arranged coaxially up and down.
- the acoustic element 3 is located in the accommodating cavity 11 , and an elastic vibration membrane 5 is sealingly provided at the transition between the first sound cavity 71 and the second sound cavity 41 .
- the microphone structure provided in this application uses human bones to conduct sound signals, and the third substrate 4 is pressed against the surface of the human bones. When the vibration signal is transmitted from the third substrate 4, the elastic vibration film 5 receives the vibration signal.
- the microphone structure also includes a fixed frame 8 , the first end surface of the fixed frame 8 is bonded with the elastic vibration film 5 , and the second end surface of the fixed frame 8 is bonded to the third substrate 4 .
- a fixed frame 8 By adding a fixed frame 8, the entire elastic vibration film 5 is first bonded to the frame of the fixed frame 8, and then the fixed frame 8 with the elastic vibration film 5 bonded is fixed to the third substrate 4 with glue, which is easy to mount. And the installation is stable.
- the microphone structure also includes a mass block 6 , which is disposed on the upper surface of the elastic vibration film 5 and located in the first sound cavity 71 .
- the setting of the mass block 6 can make the elastic vibration membrane 5 have a better vibration effect and be more sensitive to incoming vibration signals. Even a small vibration signal can cause the elastic vibration membrane 5 to vibrate.
- the mass block 6 is bonded to the elastic vibration film 5 . In other embodiments, other fixing methods can also be used to fix the mass block 6 on the elastic vibration membrane 5, without excessive restrictions here.
- the mass block 6 is made of metal or ceramic material, which can reduce electromagnetic interference and help further improve the sound quality.
- Figure 4 is a schematic structural diagram in which the elastic vibration film 5 is an elastic soft film.
- the elastic vibration film 5 is provided with ventilation holes 51, and the ventilation holes 51 are arranged to adjust the first sound cavity 71 and The air pressure in the second sound cavity 41. Since the hollow shell 1 is sealedly connected to the first substrate 2, the elastic vibration membrane 5 is in a sealed cavity state.
- the ventilation holes 51 By adding the ventilation holes 51, when vibrating, the gas molecules in the second sound cavity 41 enter through the ventilation holes 51.
- the ventilation hole 51 can adjust the air pressure, thereby adjusting the performance of the entire chip within a small range and improving the sensitivity.
- the elastic soft membrane is made of plastic.
- Figure 5 is a schematic structural diagram in which the elastic vibration film 5 is an elastic metal sheet.
- the elastic metal sheet is made of metallic steel or metallic copper.
- the acoustic element 3 includes a MEMS chip 31 and an ASIC chip 32.
- the MEMS chip 31 and the ASIC chip 32 are connected using gold wires.
- the MEMS chip 31 is configured to receive the sound pressure signal from the sound transmission hole 21 and transmit the sound pressure signal Converted into electrical signals, the ASIC chip is set to amplify the electrical signals and output them.
- the electrical connection between the ASIC chip 32 and the MEMS chip 31 is realized through gold wires.
- the MEMS chip 31 converts the sound pressure signal into an electrical signal
- the electrical signal is transmitted to the ASIC chip 32.
- the ASIC chip 32 amplifies the electrical signal and outputs it. The signal passes through the through hole and is finally output from the pad below the third substrate (PCB board) 7 to realize signal transmission.
- the MEMS chip 31 and the ASIC chip 32 are both bonded to the same side of the first substrate 2, and the MEMS chip 31 is disposed at the exit of the sound transmission hole 21, so that the sound pressure signal can pass through the sound transmission hole 21. It is directly received by the MEMS chip 31, shortening the time for processing sound.
- the MEMS chip 31 and the ASIC chip 32 are both bonded to the first substrate 2 using glue, and the MEMS chip 31 and the ASIC chip 32 are located in the accommodation cavity 11 .
- the MEMS chip 31 and the ASIC chip 32 may also be disposed on the upper and lower sides of the first substrate 2 .
- the MEMS chip 31 is installed on the upper surface of the first substrate 2
- the ASIC chip 32 is installed on the lower surface of the first substrate 2 and is located in the first sound cavity 71 .
- the elastic vibration film 5 is a flat film. As shown in Figures 2 and 3, folds can also be set circumferentially on the outer edge of the flat membrane to optimize the floating state of the elastic vibrating membrane 5 with the sound signal by referring to the function of the spring, further improving the sound quality.
- the hollow shell 1 is made of metal material.
- the sound transmission characteristics of metal are used to ensure the sealing effect in the accommodation cavity 11 and improve the sound quality effect.
- This embodiment also provides a voice communication device, which includes the above-mentioned microphone structure.
- Voice communication equipment can be mobile phones, headphones and other equipment.
- the working principle of the microphone structure of this embodiment is as follows: when a vibration signal is transmitted from the third substrate 4, the elastic vibration film 5 resonates after receiving the vibration signal.
- the vibration generated by the elastic vibration film 5 causes air pressure changes in the cavity, and as the vibration signal is transmitted, the elastic vibration film 5 resonates.
- the air pressure signal caused by the vibration frequency and amplitude is sensed by the high-sensitivity vibration film of the MEMS chip 31.
- the setting of the mass block 6 can make the vibration effect of the elastic vibration film 5 better. Even a small vibration signal can cause the vibration of the elastic film. , complete feedback and transmission of sound, avoiding sound distortion.
- This embodiment provides a microphone structure. Compared with Embodiment 1, the basic structure of the microphone structure provided by this embodiment is the same as Embodiment 1. Only the arrangement of the mass block 6 is different. This embodiment does not The structure that is the same as that of Embodiment 1 will be described again.
- the mass 6 of this embodiment is bonded to the lower surface of the elastic vibration film 5 and located in the second sound cavity 41 .
- the mass block 6 is provided on both the lower surface and the upper surface of the elastic vibration membrane 5 .
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present application discloses a microphone structure and a voice communication device. The microphone structure comprises a hollow housing, a first substrate, an acoustic element, a second substrate, a third substrate and an elastic vibration thin film. The first substrate, the second substrate, and the third substrate are sequentially laminated from top to bottom. A sound transmission hole is formed in the first substrate in a penetrating manner in the thickness direction; a first sound cavity is formed in the second substrate; and a second sound cavity is formed in the third substrate, and the sound transmission hole, the first sound cavity, and the second sound cavity are coaxially arranged. The hollow housing sealingly covers the first substrate, an accommodating cavity is defined by the hollow housing and the first substrate, and the acoustic element is provided on the first substrate and located in the accommodating cavity. The elastic vibration thin film is sealedly provided at a transition position of the first sound cavity and the second sound cavity.
Description
本申请要求在2022年05月10日提交中国专利局、申请号为202210505314.1以及202221109905.9的中国专利申请的优先权,该申请的全部内容通过引用结合在本申请中。This application claims priority to Chinese patent applications with application numbers 202210505314.1 and 202221109905.9 submitted to the China Patent Office on May 10, 2022. The entire content of this application is incorporated into this application by reference.
本申请涉及麦克风技术领域,例如涉及一种麦克风结构和语音通讯设备。The present application relates to the field of microphone technology, for example, to a microphone structure and voice communication equipment.
微机电***(Micro-Electro-Mechanical System,MEMS)技术是采用先进的半导体制造工艺,实现传感器、驱动器等器件的批量制造。传统MEMS麦克风的传导方式是MEMS芯片振膜接受空气传播的语音,声压信号经过进音孔被MEMS芯片的高灵敏度振动薄膜感知,将声音信号转变为电信号。与MEMS芯片电气连接的专用集成电路(Application Specific Integrated Circuit,ASIC)芯片将信号运算放大后输出。MEMS芯片是一个由硅振膜和硅背极板构成的微型电容器,能将声压变化转化为电容变化,然后由ASIC芯片将电容变化转化为电信号,实现"声—电"转换。Micro-Electro-Mechanical System (MEMS) technology uses advanced semiconductor manufacturing processes to achieve mass manufacturing of sensors, actuators and other devices. The transmission method of traditional MEMS microphones is that the MEMS chip diaphragm receives airborne speech. The sound pressure signal passes through the sound inlet and is sensed by the high-sensitivity vibrating film of the MEMS chip, converting the sound signal into an electrical signal. An Application Specific Integrated Circuit (ASIC) chip electrically connected to the MEMS chip amplifies the signal and outputs it. The MEMS chip is a microcapacitor composed of a silicon diaphragm and a silicon back plate. It can convert changes in sound pressure into changes in capacitance, and then the ASIC chip converts the changes in capacitance into electrical signals to achieve "sound-to-electricity" conversion.
传统MEMS麦克风的传感器接受空气传播的语音,空气传播的语音包括通话人的声音和来自周围的噪声,而噪声较大的时候,麦克风就会受到噪声干扰,例如周围人群、机械设备、风噪等,严重影响通话质量。The sensor of a traditional MEMS microphone receives airborne speech. Airborne speech includes the voice of the caller and noise from the surroundings. When the noise is loud, the microphone will be interfered by noise, such as surrounding people, mechanical equipment, wind noise, etc. , seriously affecting call quality.
为此,亟需提供一种麦克风结构和语音通讯设备以解决上述问题。For this reason, there is an urgent need to provide a microphone structure and voice communication equipment to solve the above problems.
发明内容Contents of the invention
本申请提供一种麦克风结构和语音通讯设备,有效的进行降噪,降低周围环境的杂音,有效提高通话质量。This application provides a microphone structure and voice communication equipment that can effectively reduce noise, reduce noise in the surrounding environment, and effectively improve call quality.
本申请提供以下技术方案:This application provides the following technical solutions:
一种麦克风结构,包括:A microphone structure including:
中空型外壳;Hollow shell;
从上到下依次叠压的第一基板、第二基板和第三基板;The first substrate, the second substrate and the third substrate are stacked sequentially from top to bottom;
所述第一基板沿厚度方向贯通开设有传音孔;所述第二基板设置有第一音腔;所述第三基板设置有第二音腔,所述传音孔、所述第一音腔和所述第二音腔同轴设置;
The first substrate is provided with a sound transmission hole along the thickness direction; the second substrate is provided with a first sound cavity; the third substrate is provided with a second sound cavity, the sound transmission hole, the first sound cavity The cavity and the second sound cavity are coaxially arranged;
所述中空型外壳密封罩设于所述第一基板上,所述中空型外壳和所述第一基板围设形成容纳腔,声学元件设置于所述第一基板且位于所述容纳腔内;The hollow shell sealing cover is provided on the first substrate, the hollow shell and the first substrate are surrounded to form an accommodation cavity, and the acoustic element is provided on the first substrate and located in the accommodation cavity;
弹性振动薄膜,密封设置于所述第一音腔和所述第二音腔的过渡处。An elastic vibrating membrane is sealingly provided at the transition between the first sound cavity and the second sound cavity.
一种语音通讯设备,包括如上任一项所述的麦克风结构的技术方案。A voice communication device includes a technical solution of a microphone structure as described in any one of the above.
为了说明本申请实施例中的技术方案,下面将对本申请实施例描述中所需要使用的附图作简单的介绍。In order to illustrate the technical solutions in the embodiments of the present application, a brief introduction will be given below to the drawings required to be used in the description of the embodiments of the present application.
图1为本申请实施例一中麦克风结构的剖视图;Figure 1 is a cross-sectional view of the microphone structure in Embodiment 1 of the present application;
图2为本申请实施例一中带有褶皱的弹性振动薄膜的第一种示意图;Figure 2 is a first schematic diagram of the elastic vibration film with wrinkles in Embodiment 1 of the present application;
图3为本申请实施例一中带有褶皱的弹性振动薄膜的第二种示意图;Figure 3 is a second schematic diagram of the elastic vibration film with wrinkles in Embodiment 1 of the present application;
图4为本申请实施例一中弹性振动薄膜为弹性软膜的结构示意图;Figure 4 is a schematic structural diagram of the elastic vibration film being an elastic soft film in Embodiment 1 of the present application;
图5为本申请实施例一中弹性振动薄膜为弹性金属薄片的结构示意图;Figure 5 is a schematic structural diagram of the elastic vibration film being an elastic metal sheet in Embodiment 1 of the present application;
图6为本申请实施例二中固定框的结构示意图;Figure 6 is a schematic structural diagram of the fixed frame in Embodiment 2 of the present application;
图7为本申请实施例二中麦克风结构的剖视图。Figure 7 is a cross-sectional view of the microphone structure in Embodiment 2 of the present application.
附图标记:Reference signs:
1、中空型外壳;11、容纳腔;2、第一基板;21、传音孔;3、声学元件;4、第三基板;5、弹性振动薄膜;51、透气孔;6、质量块;7、第二基板;8、固定框;9、通孔;1. Hollow shell; 11. Accommodation cavity; 2. First substrate; 21. Sound transmission hole; 3. Acoustic component; 4. Third substrate; 5. Elastic vibration membrane; 51. Breathing hole; 6. Mass block; 7. Second substrate; 8. Fixed frame; 9. Through hole;
31、MEMS芯片;32、ASIC芯片;31. MEMS chip; 32. ASIC chip;
41、第二音腔;71、第一音腔。41. The second tone cavity; 71. The first tone cavity.
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行描述。所描述的实施例是本申请一部分实施例,而不是全部的实施例。在附图中描述和示出的本申请实施例的组件可以以多种不同的配置来布置和设计。The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. The described embodiments are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application described and illustrated in the drawings may be arranged and designed in a variety of different configurations.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that similar reference numerals and letters represent similar items in the following figures, therefore, once an item is defined in one figure, it does not need further definition or explanation in subsequent figures.
在本申请的描述中,需要说明的是,术语“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该产品使用时惯常摆放的方位或位置关系,仅是
为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。在本申请的描述中,除非另有说明,“多个”的含义是两个或两个以上。In the description of this application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or The positional relationship is based on the orientation or positional relationship shown in the attached drawing, or the orientation or positional relationship where the product is usually placed when used. It is only In order to facilitate the description of the present application and simplify the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish descriptions and shall not be understood as indicating or implying relative importance. In the description of this application, unless otherwise stated, "plurality" means two or more.
在本申请的描述中,还需要说明的是,除非另有明确的规定和限定,术语“设置”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接。对于本领域的普通技术人员而言,可以视具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "setting" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection, or Integrally connected; can be mechanical or electrical. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood depending on the specific circumstances.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise explicitly stated and limited, the term "above" or "below" a first feature on a second feature may include direct contact between the first and second features, or may also include the first and second features. Not in direct contact but through additional characteristic contact between them. Furthermore, the terms "above", "above" and "above" a first feature on a second feature include the first feature being directly above and diagonally above the second feature, or simply mean that the first feature is higher in level than the second feature. “Below”, “under” and “under” the first feature is the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature is less horizontally than the second feature.
下面描述本申请的实施例,所述实施例的示例在附图中示出,其中相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。The embodiments of the present application are described below. Examples of the embodiments are shown in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and cannot be understood as limiting the present application.
为了有效的进行降噪,降低周围环境的杂音,有效提高通话质量,本实施例提供一种麦克风结构,以下结合图1至图7对本实施例的具体内容进行描述。In order to effectively reduce noise, reduce noise in the surrounding environment, and effectively improve call quality, this embodiment provides a microphone structure. The specific contents of this embodiment will be described below with reference to FIGS. 1 to 7 .
实施例一Embodiment 1
如图1所示,麦克风结构包括中空型外壳1、第一基板2、声学元件3、第二基板7、第三基板4和弹性振动薄膜5。本实施例的麦克风结构利用骨传导进行传音,使用时贴附于人体骨骼的外表皮上。As shown in Figure 1, the microphone structure includes a hollow housing 1, a first substrate 2, an acoustic element 3, a second substrate 7, a third substrate 4 and an elastic vibration film 5. The microphone structure of this embodiment uses bone conduction for sound transmission, and is attached to the outer skin of human bones during use.
第一基板2、第二基板7和第三基板4从上到下依次叠压的一体化结构。第一基板2、第二基板7和第三基板4均为印制电路板(Printed Circuit Board,PCB),通过穿透硅通孔技术,使第一基板2、第二基板7和第三基板4通过通孔9和重新分布层层(Redistribution layer,RDL)的线路电连接。可选的,第一基板2、第二基板7和第三基板4通过通孔9电连接。The first substrate 2, the second substrate 7 and the third substrate 4 are an integrated structure laminated sequentially from top to bottom. The first substrate 2, the second substrate 7 and the third substrate 4 are all printed circuit boards (PCB). Through through-silicon via technology, the first substrate 2, the second substrate 7 and the third substrate 4 is electrically connected through the through hole 9 and the lines of the redistribution layer (RDL). Optionally, the first substrate 2 , the second substrate 7 and the third substrate 4 are electrically connected through the through hole 9 .
中空型外壳1密封罩设于第一基板2上,中空型外壳1和第一基板2之间围设形成容纳腔11,第一基板2沿厚度方向贯通开设有传音孔21。声学元件3
设置于第一基板2且位于容纳腔11内。第二基板7设置有第一音腔71;第三基板4设置有第二音腔41,传音孔21、第一音腔71和第二音腔41同轴设置;弹性振动薄膜5密封设置在第一音腔71和第二音腔41的过渡处。在本实施例中第二音腔41的横截面积小于第一音腔71的横截面积。弹性振动薄膜5设置在第一音腔71和第二音腔41之间的台阶上。The sealing cover of the hollow housing 1 is provided on the first substrate 2. A receiving cavity 11 is formed between the hollow housing 1 and the first substrate 2. The first substrate 2 is provided with a sound transmission hole 21 through the thickness direction. Acoustic components 3 It is provided on the first substrate 2 and located in the containing cavity 11 . The second substrate 7 is provided with a first sound cavity 71; the third substrate 4 is provided with a second sound cavity 41; the sound transmission hole 21, the first sound cavity 71 and the second sound cavity 41 are coaxially arranged; the elastic vibration membrane 5 is provided with a seal At the transition between the first sound cavity 71 and the second sound cavity 41 . In this embodiment, the cross-sectional area of the second sound cavity 41 is smaller than the cross-sectional area of the first sound cavity 71 . The elastic vibration membrane 5 is provided on the step between the first sound cavity 71 and the second sound cavity 41 .
本申请所提供的麦克风结构,中空型外壳1和第一基板2之间围设形成容纳腔11,在第一基板2远离中空型外壳1的一侧密封设置有第二基板7和第三基板4,第一音腔71、第二音腔41和传音孔21上下同轴设置。声学元件3位于容纳腔11内,在第一音腔71和第二音腔41的过渡处密封设置有弹性振动薄膜5。本申请所提供的麦克风结构利用人体骨骼来进行声音信号的传导,将第三基板4抵靠在人体骨骼表面,当振动信号从第三基板4传入时,弹性振动薄膜5受到该振动信号后产生谐振,弹性振动薄膜5产生的振动在腔内产生气压变化,随振动频率和幅度引起的气压信号被声学元件3感知。由于无需设置进音孔,而是利用骨传导声音,有效的进行降噪,降低周围环境的杂音,使通话清晰、音质高清且富有穿透力,减少周围噪声等无用信号的影响,同时保留通话人的语音信号,有效提高通话质量。In the microphone structure provided by this application, a receiving cavity 11 is formed between the hollow housing 1 and the first substrate 2 , and a second substrate 7 and a third substrate are sealingly provided on the side of the first substrate 2 away from the hollow housing 1 4. The first sound cavity 71, the second sound cavity 41 and the sound transmission hole 21 are arranged coaxially up and down. The acoustic element 3 is located in the accommodating cavity 11 , and an elastic vibration membrane 5 is sealingly provided at the transition between the first sound cavity 71 and the second sound cavity 41 . The microphone structure provided in this application uses human bones to conduct sound signals, and the third substrate 4 is pressed against the surface of the human bones. When the vibration signal is transmitted from the third substrate 4, the elastic vibration film 5 receives the vibration signal. Resonance is generated, and the vibration generated by the elastic vibration membrane 5 causes air pressure changes in the cavity. The air pressure signal caused by the vibration frequency and amplitude is sensed by the acoustic element 3 . Since there is no need to set up a sound inlet, bone conduction sound is used to effectively reduce noise and reduce the noise in the surrounding environment, making the call clear, high-definition and penetrating, reducing the influence of useless signals such as surrounding noise, while preserving the call Human voice signals effectively improve call quality.
如图1结合图6所示,麦克风结构还包括固定框8,固定框8的第一端面粘接有弹性振动薄膜5,固定框8的第二端面粘接于第三基板4上。通过增设固定框8,先将整块弹性振动薄膜5粘接在固定框8的边框处,用胶水再将粘接有弹性振动薄膜5的固定框8固定到第三基板4上,易于贴装且安装稳固。As shown in FIG. 1 combined with FIG. 6 , the microphone structure also includes a fixed frame 8 , the first end surface of the fixed frame 8 is bonded with the elastic vibration film 5 , and the second end surface of the fixed frame 8 is bonded to the third substrate 4 . By adding a fixed frame 8, the entire elastic vibration film 5 is first bonded to the frame of the fixed frame 8, and then the fixed frame 8 with the elastic vibration film 5 bonded is fixed to the third substrate 4 with glue, which is easy to mount. And the installation is stable.
如图1所示,麦克风结构还包括质量块6,质量块6设置于弹性振动薄膜5的上表面且位于第一音腔71内。其中质量块6的设置可以让弹性振动薄膜5的振动效果更好,也对传入的振动信号更敏感,即使传入微小的振动信号也能引起弹性振动薄膜5的振动。示例性的,质量块6与弹性振动薄膜5粘接。在其他实施例中,还可以采用其他固定方式,将质量块6固定在弹性振动薄膜5上,在此不作过多的限制。质量块6采用金属或陶瓷材质制成,可降低电磁干扰,有利于进一步提高音质。As shown in FIG. 1 , the microphone structure also includes a mass block 6 , which is disposed on the upper surface of the elastic vibration film 5 and located in the first sound cavity 71 . The setting of the mass block 6 can make the elastic vibration membrane 5 have a better vibration effect and be more sensitive to incoming vibration signals. Even a small vibration signal can cause the elastic vibration membrane 5 to vibrate. As an example, the mass block 6 is bonded to the elastic vibration film 5 . In other embodiments, other fixing methods can also be used to fix the mass block 6 on the elastic vibration membrane 5, without excessive restrictions here. The mass block 6 is made of metal or ceramic material, which can reduce electromagnetic interference and help further improve the sound quality.
在一些应用场景中,如图4所示,图4是弹性振动薄膜5为弹性软膜的结构示意图,弹性振动薄膜5上设置有透气孔51,透气孔51设置为调节第一音腔71和第二音腔41内气压。由于中空型外壳1与第一基板2密封连接,使弹性振动薄膜5上面处于密闭的腔体状态,通过增设透气孔51,振动的时候,第二音腔41内的气体分子通过透气孔51进入第一音腔71内,平衡第一音腔71和第二音腔41的气压。透气孔51可以调节气压,从而可以小范围内调整整个芯片的性能,提高灵敏度。弹性软膜采用塑料制成。
In some application scenarios, as shown in Figure 4, Figure 4 is a schematic structural diagram in which the elastic vibration film 5 is an elastic soft film. The elastic vibration film 5 is provided with ventilation holes 51, and the ventilation holes 51 are arranged to adjust the first sound cavity 71 and The air pressure in the second sound cavity 41. Since the hollow shell 1 is sealedly connected to the first substrate 2, the elastic vibration membrane 5 is in a sealed cavity state. By adding the ventilation holes 51, when vibrating, the gas molecules in the second sound cavity 41 enter through the ventilation holes 51. In the first sound cavity 71 , the air pressures of the first sound cavity 71 and the second sound cavity 41 are balanced. The ventilation hole 51 can adjust the air pressure, thereby adjusting the performance of the entire chip within a small range and improving the sensitivity. The elastic soft membrane is made of plastic.
在一些应用场景中,如图5所示,图5是弹性振动薄膜5为弹性金属薄片的结构示意图。弹性金属薄片采用金属钢或金属铜制成。In some application scenarios, as shown in Figure 5, Figure 5 is a schematic structural diagram in which the elastic vibration film 5 is an elastic metal sheet. The elastic metal sheet is made of metallic steel or metallic copper.
如图1所示,声学元件3包括MEMS芯片31和ASIC芯片32,MEMS芯片31和ASIC芯片32采用金线连接,MEMS芯片31设置为接受来自传音孔21的声压信号并将声压信号转换为电信号,ASIC芯片设置为将电信号运算放大后输出。通过金线实现ASIC芯片32和MEMS芯片31的电连接,MEMS芯片31将声压信号转换为电信号后,电信号传入ASIC芯片32中,ASIC芯片32将电信号运算放大后输出,输出的信号经由通孔最后由第三基板(PCB板)7下方的焊盘输出,实现信号的传输。As shown in Figure 1, the acoustic element 3 includes a MEMS chip 31 and an ASIC chip 32. The MEMS chip 31 and the ASIC chip 32 are connected using gold wires. The MEMS chip 31 is configured to receive the sound pressure signal from the sound transmission hole 21 and transmit the sound pressure signal Converted into electrical signals, the ASIC chip is set to amplify the electrical signals and output them. The electrical connection between the ASIC chip 32 and the MEMS chip 31 is realized through gold wires. After the MEMS chip 31 converts the sound pressure signal into an electrical signal, the electrical signal is transmitted to the ASIC chip 32. The ASIC chip 32 amplifies the electrical signal and outputs it. The signal passes through the through hole and is finally output from the pad below the third substrate (PCB board) 7 to realize signal transmission.
如图1所示,MEMS芯片31和ASIC芯片32均粘接于第一基板2的同一侧,且MEMS芯片31设置于传音孔21的出口处,使声压信号通过传音孔21后可以直接被MEMS芯片31接收,缩短处理声音的时间。本实施例中MEMS芯片31和ASIC芯片32均采用胶水粘接在第一基板2上,且MEMS芯片31和ASIC芯片32位于容纳腔11内。As shown in Figure 1, the MEMS chip 31 and the ASIC chip 32 are both bonded to the same side of the first substrate 2, and the MEMS chip 31 is disposed at the exit of the sound transmission hole 21, so that the sound pressure signal can pass through the sound transmission hole 21. It is directly received by the MEMS chip 31, shortening the time for processing sound. In this embodiment, the MEMS chip 31 and the ASIC chip 32 are both bonded to the first substrate 2 using glue, and the MEMS chip 31 and the ASIC chip 32 are located in the accommodation cavity 11 .
在其他实施例中,MEMS芯片31和ASIC芯片32也可以设置在第一基板2的上下两侧。示例性地,MEMS芯片31安装在第一基板2的上侧表面,ASIC芯片32安装在第一基板2的下侧表面,且位于第一音腔71内。In other embodiments, the MEMS chip 31 and the ASIC chip 32 may also be disposed on the upper and lower sides of the first substrate 2 . For example, the MEMS chip 31 is installed on the upper surface of the first substrate 2 , and the ASIC chip 32 is installed on the lower surface of the first substrate 2 and is located in the first sound cavity 71 .
如图1所示,弹性振动薄膜5为平面膜。如图2和图3所示,还可以在平面膜的外边缘周向设置褶皱,参考弹簧的作用,优化弹性振动薄膜5随声音信号浮动的状态,进一步提高音质。As shown in Figure 1, the elastic vibration film 5 is a flat film. As shown in Figures 2 and 3, folds can also be set circumferentially on the outer edge of the flat membrane to optimize the floating state of the elastic vibrating membrane 5 with the sound signal by referring to the function of the spring, further improving the sound quality.
中空型外壳1采用金属材质制成。利用金属传音特性,保证容纳腔11内的密闭效果,提高音质效果。The hollow shell 1 is made of metal material. The sound transmission characteristics of metal are used to ensure the sealing effect in the accommodation cavity 11 and improve the sound quality effect.
本实施例还提供了一种语音通讯设备,该语音通讯设备包括上面提到的麦克风结构。语音通讯设备可以是手机、耳机等设备。This embodiment also provides a voice communication device, which includes the above-mentioned microphone structure. Voice communication equipment can be mobile phones, headphones and other equipment.
本实施例的麦克风结构的工作原理如下:当振动信号从第三基板4传入时,弹性振动薄膜5受到该振动信号后产生谐振,弹性振动薄膜5产生的振动在腔内产生气压变化,随振动频率和幅度引起的气压信号被MEMS芯片31的高灵敏度振动薄膜感知,质量块6的设置可以让弹性振动薄膜5的振动效果更好,即使传入微小的振动信号也能引起弹性薄膜的振动,完整的反馈和传达声音,避免声音的失真。The working principle of the microphone structure of this embodiment is as follows: when a vibration signal is transmitted from the third substrate 4, the elastic vibration film 5 resonates after receiving the vibration signal. The vibration generated by the elastic vibration film 5 causes air pressure changes in the cavity, and as the vibration signal is transmitted, the elastic vibration film 5 resonates. The air pressure signal caused by the vibration frequency and amplitude is sensed by the high-sensitivity vibration film of the MEMS chip 31. The setting of the mass block 6 can make the vibration effect of the elastic vibration film 5 better. Even a small vibration signal can cause the vibration of the elastic film. , complete feedback and transmission of sound, avoiding sound distortion.
实施例二Embodiment 2
本实施例提供了一种麦克风结构,与实施例一相比,本实施例提供的麦克风结构的基本结构与实施例一相同,仅质量块6的设置存在差异,本实施例不
再对与实施例一相同的结构进行赘述。This embodiment provides a microphone structure. Compared with Embodiment 1, the basic structure of the microphone structure provided by this embodiment is the same as Embodiment 1. Only the arrangement of the mass block 6 is different. This embodiment does not The structure that is the same as that of Embodiment 1 will be described again.
如图7所示,本实施例的质量块6粘接在弹性振动薄膜5的下表面且位于第二音腔41内。As shown in FIG. 7 , the mass 6 of this embodiment is bonded to the lower surface of the elastic vibration film 5 and located in the second sound cavity 41 .
在其他实施中,弹性振动薄膜5的下表面和上表面均设置有质量块6。
In other implementations, the mass block 6 is provided on both the lower surface and the upper surface of the elastic vibration membrane 5 .
Claims (10)
- 一种麦克风结构,包括:A microphone structure including:中空型外壳(1);Hollow shell(1);从上到下依次叠压的第一基板(2)、第二基板(7)和第三基板(4);The first substrate (2), the second substrate (7) and the third substrate (4) are stacked sequentially from top to bottom;所述第一基板(2)沿厚度方向贯通开设有传音孔(21);所述第二基板(7)设置有第一音腔(71);所述第三基板(4)设置有第二音腔(41),所述传音孔(21)、所述第一音腔(71)和所述第二音腔(41)同轴设置;The first substrate (2) is provided with a sound transmission hole (21) along the thickness direction; the second substrate (7) is provided with a first sound cavity (71); and the third substrate (4) is provided with a third sound cavity (71). Two sound chambers (41), the sound transmission hole (21), the first sound chamber (71) and the second sound chamber (41) are coaxially arranged;所述中空型外壳(1)密封罩设于所述第一基板(2)上,所述中空型外壳(1)和所述第一基板(2)围设形成容纳腔(11),声学元件(3)设置于所述第一基板(2)且位于所述容纳腔(11)内;The sealing cover of the hollow shell (1) is provided on the first substrate (2), and the hollow shell (1) and the first substrate (2) are surrounded to form an accommodation cavity (11), and the acoustic element (3) It is provided on the first substrate (2) and located in the accommodation cavity (11);弹性振动薄膜(5),密封设置于所述第一音腔(71)和所述第二音腔(41)的过渡处。The elastic vibrating membrane (5) is sealed and arranged at the transition between the first sound cavity (71) and the second sound cavity (41).
- 根据权利要求1所述的麦克风结构,还包括固定框(8),所述固定框(8)的第一端面粘接有所述弹性振动薄膜(5),所述固定框(8)的第二端面粘接于所述第三基板(4)上。The microphone structure according to claim 1, further comprising a fixed frame (8), the first end surface of the fixed frame (8) is bonded with the elastic vibration film (5), and the third end surface of the fixed frame (8) is bonded with the elastic vibration film (5). The two end surfaces are bonded to the third substrate (4).
- 根据权利要求1所述的麦克风结构,还包括质量块(6),所述质量块(6)粘接于所述弹性振动薄膜(5)的上表面且位于所述第一音腔(71)内;或The microphone structure according to claim 1, further comprising a mass block (6) bonded to the upper surface of the elastic vibration film (5) and located in the first sound cavity (71) within; or所述质量块(6)粘接于所述弹性振动薄膜(5)的下表面且位于所述第二音腔(41)内。The mass block (6) is bonded to the lower surface of the elastic vibration film (5) and is located in the second sound cavity (41).
- 根据权利要求2所述的麦克风结构,其中,所述弹性振动薄膜(5)上设置有透气孔(51),所述透气孔(51)设置为调节所述第一音腔(71)和所述第二音腔(41)内的气压。The microphone structure according to claim 2, wherein the elastic vibration film (5) is provided with a ventilation hole (51), and the ventilation hole (51) is configured to adjust the first sound cavity (71) and the Describe the air pressure in the second sound cavity (41).
- 根据权利要求2所述的麦克风结构,其中,所述声学元件(3)包括微 机电***MEMS芯片(31)和专用集成电路ASIC芯片(32),所述MEMS芯片(31)和所述ASIC芯片(32)采用金线连接,所述MEMS芯片(31)设置为接受来自所述传音孔(21)的声压信号并将所述声压信号转换为电信号,所述ASIC芯片设置为将所述电信号运算放大后输出。The microphone structure according to claim 2, wherein the acoustic element (3) includes a micro Electromechanical system MEMS chip (31) and application-specific integrated circuit ASIC chip (32). The MEMS chip (31) and the ASIC chip (32) are connected using gold wires. The MEMS chip (31) is configured to accept data from the The sound pressure signal of the sound transmission hole (21) is converted into an electrical signal, and the ASIC chip is configured to amplify the electrical signal and output it.
- 根据权利要求5所述的麦克风结构,其中,所述MEMS芯片(31)和所述ASIC芯片(32)均粘接于所述第一基板(2)的同一侧,且所述MEMS芯片(31)设置于所述传音孔(21)的出口处。The microphone structure according to claim 5, wherein the MEMS chip (31) and the ASIC chip (32) are both bonded to the same side of the first substrate (2), and the MEMS chip (31 ) is arranged at the exit of the sound transmission hole (21).
- 根据权利要求5所述的麦克风结构,其中,所述弹性振动薄膜(5)为平面膜。The microphone structure according to claim 5, wherein the elastic vibration film (5) is a planar film.
- 根据权利要求5所述的麦克风结构,其中,所述第一基板(2)、所述第二基板(7)和所述第三基板(4)均为印制电路板PCB,所述第一基板(2)、所述第二基板(7)和所述第三基板(4)通过通孔(9)电连接。The microphone structure according to claim 5, wherein the first substrate (2), the second substrate (7) and the third substrate (4) are all printed circuit boards (PCBs), and the first The substrate (2), the second substrate (7) and the third substrate (4) are electrically connected through a through hole (9).
- 根据权利要求5所述的麦克风结构,其中,所述中空型外壳(1)采用金属材质制成。The microphone structure according to claim 5, wherein the hollow housing (1) is made of metal.
- 一种语音通讯设备,包括如权利要求1-9任一项所述的麦克风结构。 A voice communication device, including the microphone structure according to any one of claims 1-9.
Applications Claiming Priority (4)
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CN118264970A (en) * | 2024-05-29 | 2024-06-28 | 甬矽电子(宁波)股份有限公司 | MEMS packaging structure and preparation method thereof |
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CN114374920A (en) * | 2021-12-29 | 2022-04-19 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone |
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