WO2023197583A1 - 应用于lga插槽的双地端子结构及lga插槽 - Google Patents

应用于lga插槽的双地端子结构及lga插槽 Download PDF

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Publication number
WO2023197583A1
WO2023197583A1 PCT/CN2022/130315 CN2022130315W WO2023197583A1 WO 2023197583 A1 WO2023197583 A1 WO 2023197583A1 CN 2022130315 W CN2022130315 W CN 2022130315W WO 2023197583 A1 WO2023197583 A1 WO 2023197583A1
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ground terminal
dual
connection area
cantilever
terminal
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PCT/CN2022/130315
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English (en)
French (fr)
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吴生玉
杜正中
刘潇璇
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中兴通讯股份有限公司
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Publication of WO2023197583A1 publication Critical patent/WO2023197583A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  

Definitions

  • the present application relates to the field of connectors, and in particular to a dual ground terminal structure applied to an LGA slot and an LGA slot.
  • the adjacent LGA ground terminals in the CPU/CPO Socket are all independently structured. Each ground terminal is individually set in the terminal receiving slot. Each ground terminal leads to a contact point to connect to the corresponding terminal on the CPU/CPO. Contacts.
  • the ground terminals and signal terminals use the same structure and are arranged diagonally along a certain angle. As the CPU/CPO transmission rate becomes higher and higher, using the above structure will cause resonance during the high-frequency signal transmission process. Problem, in order to improve the quality of high-frequency signals, the structure of the ground terminal needs to be improved to improve the resonance problem during high-frequency signal transmission.
  • the embodiment of the present application provides a dual ground terminal structure and an LGA slot applied to an LGA slot.
  • embodiments of the present application provide a dual ground terminal structure applied to an LGA slot, including: a first ground terminal including a first connection area; a second ground terminal including a second connection area, and the third ground terminal includes a second connection area.
  • a ground terminal and the second ground terminal are arranged according to the arrangement of adjacent terminal receiving slots in the LGA slot; the terminal connector is conductively connected to the first connection area and the second connection area respectively.
  • inventions of the present application provide an LGA slot, including: a dual ground terminal receiving slot and a dual ground terminal structure as described in the first aspect.
  • the dual ground terminal receiving slot is a double slot structure, consisting of two phases.
  • the first terminal receiving groove and the second terminal receiving groove are adjacent to each other.
  • the first terminal receiving groove and the second terminal receiving groove are connected.
  • the double ground terminal structure is accommodated in the double ground terminal receiving groove.
  • Figure 1 is a structural diagram of the dual ground terminal structure provided by the embodiment of the present application from a first perspective;
  • Figure 2 is a structural diagram of the dual ground terminal structure provided by the embodiment of the present application from a second perspective;
  • Figure 3 is a simulated insertion loss curve diagram of a single ground terminal and a double ground terminal structure provided by the embodiment of the present application;
  • Figure 4 is a schematic structural diagram of the arrangement of terminal receiving slots on the plastic base provided by the embodiment of the present application.
  • Figure 5 is an arrangement structural diagram of a set of typical differential signal terminals and ground terminals provided by an embodiment of the present application
  • Figure 6 is a structural diagram of a dual ground terminal structure with LGA elastic contacts and BGA circular contacts provided by an embodiment of the present application;
  • FIG. 7 is a schematic assembly diagram of the first part and the second part of the terminal connector provided by the embodiment of the present application.
  • At least one (item) refers to one or more, and “plurality” refers to two or more.
  • “And/or” is used to describe the relationship between associated objects, indicating that there can be three relationships. For example, “A and/or B” can mean: only A exists, only B exists, and A and B exist simultaneously. , where A and B can be singular or plural. The character “/” generally indicates that the related objects are in an "or” relationship. “At least one of the following” or similar expressions thereof refers to any combination of these items, including any combination of a single item (items) or a plurality of items (items).
  • At least one of a, b or c can mean: a, b, c, "a and b", “a and c", “b and c", or "a and b and c” ”, where a, b, c can be single or multiple.
  • Socket also known as slot, is used to fix the chip and establish a communication bridge between the chip and the PCB.
  • Socket often includes multiple metal terminals, and each metal terminal connects the contacts on the chip and the contacts on the PCB.
  • the metal terminals on the Socket are not placed along the horizontal rules, but are arranged diagonally along a certain angle, there is a gap between the CPU and the PCB.
  • the traditional signal terminals and ground terminals adopt the same structure, and there is no obvious signal transmission quality problem.
  • insertion loss the insertion loss of the terminal
  • embodiments of the present application provide a dual ground terminal structure and LGA slot applied to an LGA (Land Grid Array) slot.
  • the dual ground terminal structure improves the resonance generated when the LGA slot transmits high-frequency signals.
  • an embodiment of the present invention provides a dual ground terminal structure applied to an LGA slot, including: a first ground terminal 1, a second ground terminal 2, and a terminal Connector 3.
  • the first ground terminal 1 includes a first connection area 11 .
  • the second ground terminal 2 includes a second connection area 21.
  • the first ground terminal 1 and the second ground terminal 2 are arranged according to the arrangement of adjacent terminal receiving slots in the LGA slot.
  • the terminal connector 3 is conductively connected to the first connection area 11 and the second connection area 21 respectively.
  • the double ground terminal structure of the embodiment of the present application consists of two ground terminals, namely a first ground terminal 1 and a second ground terminal 2.
  • the first ground terminal 1 and the second ground terminal 2 are connected to each other through a terminal connector 3.
  • the first ground terminal 1 and the second ground terminal 2 are arranged according to the arrangement of adjacent ground terminals in the LGA slot (that is, diagonally arranged) to adapt to the terminal arrangement structure of the current LGA slot; double
  • the application of the ground terminal structure reduces the insertion loss in the high frequency range.
  • the insertion loss curve obtained through simulation is shown in Figure 3.
  • the horizontal axis represents the frequency
  • the vertical axis represents the insertion loss value
  • curve A represents the traditional single ground terminal.
  • curve B represents the insertion loss curve of the dual ground terminal structure of the embodiment of the present application. It can be clearly seen that around 45GHz (within the dotted line box), curve B does not have a sudden change, and the insertion loss value changes smoothly with frequency. , therefore, the dual ground terminal structure of the embodiment of the present application can effectively reduce the resonance generated in the high frequency range of the LGA slot during the transmission of high frequency signals.
  • first ground terminal 1 and the second ground terminal 2 may adopt the same structure or may adopt different structures; if they adopt the same structure, the overall structure of the LGA slot using the dual ground terminal structure is directly different from the conventional one. It is compatible with the LGA package chip; if a different structure is used, it will be adjusted according to the contact definition of the installed LGA package chip, and there is no restriction here.
  • the first connection area 11 and the second connection area 21 are configured to be connected to the terminal connector 3 through which the first ground terminal 1 and the second ground terminal 2 are bound.
  • the first connection area 11 and the second connection area 21 may actually be parts of the ground terminal other than the contacts.
  • the first connection area 11 in the embodiment of the present application is provided on the ground terminal.
  • the second connection area 21 is provided between the upper and lower contacts of the second ground terminal 2 . Referring to Figures 1 and 2, it can be seen that the first cantilever 12 and the second cantilever 13 are respectively led out from the upper and lower sides of the first ground terminal 1.
  • the first connection area 11 is located between the first cantilever 12 and the second cantilever 13.
  • the second ground terminal 2 The third cantilever 22 and the fourth cantilever 23 are respectively led out from the upper and lower sides, and the second connection area 21 is located between the third cantilever 22 and the fourth cantilever 23.
  • the first cantilever 12 and the third cantilever 22 are located on one side of the double ground terminal structure, and the second cantilever 13 and the fourth cantilever 23 are located on the other side of the double ground terminal structure.
  • the first contact 14 is provided on the first cantilever 12
  • the third contact 24 is provided on the third cantilever 22
  • the first contact 14 and the third contact 24 are arranged to contact the contacts on the chip.
  • the second cantilever 13 is provided with a first contact 14 .
  • the second contact 15 is provided, and the fourth contact 25 is provided on the fourth cantilever 23.
  • the second contact 15 and the fourth contact 25 are arranged to contact the contacts on the PCB board.
  • the first contact 14 , the second contact 15 , the third contact 24 and the fourth contact 25 are all arranged at the end of the corresponding cantilever, that is, away from the first connection area 11 and away from the second connection area. 21 position.
  • the shapes of the four cantilevers are not limited to the shapes shown in Figure 1.
  • the cantilevers may also be curved cantilevers, and the bends of the curved cantilevers serve as contact points for the corresponding cantilevers.
  • elastic contacts are used under the LGA standard, but the elastic contacts can also be changed to contacts of other structures according to the actual situation.
  • BGA Ball Grid Array
  • the contact 25 is changed into a circular contact suitable for BGA connection, and the second contact 15 and the fourth contact 25 are connected to the contacts on the PCB in the form of BGA ball-mounted contacts, that is, the structure shown in Figure 6 .
  • the terminal connector 3 can be integrally formed with one of the first connection area 11 and the second connection area 21 . At this time, the connection between the first ground terminal 1 and the second ground terminal 2 is achieved through assembly.
  • the terminal connector 3 can also be The first connection area 11 and the second connection area 21 are uniformly formed in one piece, which means that the entire dual-ground terminal structure can be formed at one time by stamping.
  • the structure of the terminal connector 3 can also be in various forms, which can be rectangular, diamond, circular or other shapes, and circular, rectangular or other special-shaped holes can be opened on it. In short, the terminal connector 3 only needs to have the first The ground terminal 1 and the second ground terminal 2 only need to be connected and conduct electricity.
  • the terminal connector 3 itself can be assembled in addition to being integrally formed; in a possible case, the terminal connector 3 It includes a first part 331 and a second part 332 that are independent of each other.
  • the first part 331 is integrally connected to the first connection area 11, and the second part 332 is integrally connected to the second connection area 21.
  • the first part 331 and the second part 332 are assembled with each other to form a terminal.
  • Connector 3 Different assembly structures can be used between the first part 331 and the second part 332.
  • the first part 331 and the second part 332 both have U-shaped parts, and the two U-shaped parts are matched and connected to complete the assembly; another example is The first part 331 and the second part 332 are connected by laser spot welding, etc., and no examples are given here.
  • the above-mentioned integral connection between the first part 331 and the first connection area 11 means that the first part 331 and the first connection area 11 are connected to each other to form a whole.
  • the integrated connection method may be welding and fixation, or may be directly integrally formed, etc., which will not be discussed here.
  • the second part 332 is integrally connected to the second connection area 21 in the same way, and is also welded and fixed or integrally formed.
  • first part 331 and the second part 332 shown in Figure 7 do not represent the cross-sectional structure, but are additionally done in order to clearly distinguish the two different areas of the first part 331 and the second part 332. Markings are provided to facilitate identification of these two different components.
  • the terminal connector 3 includes a first bending part 31 , a connecting part 33 and a second bending part 32 connected in sequence.
  • the first bending part 31 and the first connection area 11 The edges are connected, and the second bending portion 32 is connected with the edge of the second connection area 21 .
  • the staggered first ground terminal 1 and the second ground terminal 2 are connected together through the first bending part 31 and the second bending part 32, and in order to enhance the stability of the double ground terminal structure in the terminal receiving groove,
  • the connecting portion 33 is a flat metal piece, which can also be rectangular, circular, rhombus or other shapes, and is not limited here.
  • inventions of the present application also provide an LGA slot, including a dual-ground terminal receiving slot 4 and the above-mentioned dual-ground terminal structure.
  • the dual-ground terminal receiving slot 4 is a double-slot structure, consisting of an adjacent third It consists of a first terminal receiving slot and a second terminal receiving slot, the first terminal receiving slot and the second terminal receiving slot are connected, and the double ground terminal structure is accommodated in the double ground terminal receiving slot 4 .
  • the terminal receiving slot area on the plastic base is shown, in which the dual ground terminal receiving slot 4 occupies the slots of two terminal receiving slots.
  • This area also includes a third terminal receiving slot 5 configured to accommodate a ground terminal and a fourth terminal receiving slot 6 configured to accommodate a signal terminal.
  • the double ground terminal receiving slot 4 and the third terminal receiving slot 5 surround the Four terminal receiving slots 6 are provided.
  • two differential signal terminals forming a pair are provided in two adjacent fourth terminal receiving grooves 6.
  • the arrangement rules are shown in Figure 5 as an example.
  • Two fourth terminal receiving slots 6 are located in the center. Laterally aligned third terminal receiving slots 5 are arranged on the left and right sides of the fourth terminal receiving slots 6.
  • the fourth terminal receiving slots Double-ground terminal receiving slots 4 are provided on the upper and lower sides of 6. These double-ground terminal receiving slots 4 are arranged horizontally.
  • the above-mentioned terminal receiving slots form a specific area. In this specific area, when high-frequency signals are transmitted through differential signal terminals, it is possible to avoid Insertion loss mutation problem. It can be understood that the edge position of the LGA slot may not always be the third terminal receiving slot 5 or the dual ground terminal receiving slot 4. That is, the edge position may be the fourth terminal receiving slot 6. The signal terminals at this position One side is empty.
  • the resonance generated in the high-frequency range during high-frequency signal transmission can be effectively improved, causing the insertion loss to change smoothly with frequency, improving the quality of signal transmission, and preparing for higher-speed signals in the future.
  • Transmission provides a reliable hardware foundation.
  • the dual ground terminal structure and LGA slot provided by the embodiments of the present application have at least the following beneficial effects: the dual ground terminal structure is connected together by two ground terminals, which is used to reduce the insertion of the ground terminal in the LGA slot. Loss, since the insertion loss of traditional ground terminals has a significant impact on the generation of resonance in high-frequency signal scenarios, the use of the above-mentioned double ground terminal structure can effectively improve the resonance generated during high-frequency signal transmission, making the insertion loss smooth with frequency. changes, improve the quality of signal transmission, and provide a reliable hardware foundation for higher-speed signal transmission in the future.

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Abstract

本申请公开了一种应用于LGA插槽的双地端子结构及LGA插槽，其中，双地端子结构包括第一接地端子(1)、第二接地端子(2)和端子连接件(3)，第一接地端子(1)包括第一连接区(11)；第二接地端子(2)包括第二连接区(21)，第一接地端子(1)和第二接地端子(2)按照LGA插槽中相邻端子收容槽的排布方式设置；端子连接件(3)分别与第一连接区(11)和第二连接区(21)导电连接。

Description

应用于LGA插槽的双地端子结构及LGA插槽
相关申请的交叉引用
本申请基于申请号为202210385397.5、申请日为2022年4月13日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及连接器相关领域，尤其涉及一种应用于LGA插槽的双地端子结构及LGA插槽。
背景技术
相关技术中，CPU/CPO Socket中相邻的LGA接地端子，都是独立结构的，每个接地端子单独设置在端子收容槽中，每个接地端子都引出一个触点连接CPU/CPO上对应的触点。目前接地端子和信号端子都是采用同一种结构并且沿着一定的角度斜着排布，随着CPU/CPO传输的速率越来越高，沿用上述结构会导致在高频信号传输过程中产生谐振问题，为改善高频信号质量，需要对接地端子的结构进行改进，以改善高频信号传输过程中的谐振问题。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种应用于LGA插槽的双地端子结构及LGA插槽。
第一方面，本申请实施例提供了一种应用于LGA插槽的双地端子结构，包括：第一接地端子，包括第一连接区；第二接地端子，包括第二连接区，所述第一接地端子和所述第二接地端子按照LGA插槽中相邻端子收容槽的排布方式设置；端子连接件，分别与所述第一连接区和所述第二连接区导电连接。
第二方面，本申请实施例提供了一种LGA插槽，包括：双地端子收容槽和如第一方面所述的双地端子结构，所述双地端子收容槽为双槽结构，由相邻的第一端子收容槽和第二端子收容槽组成，所述第一端子收容槽和所述第二端子收容槽连通，所述双地端子结构容置于所述双地端子收容槽中。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的示例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1是本申请实施例提供的双地端子结构在第一视角下的结构图；
图2是本申请实施例提供的双地端子结构在第二视角下的结构图；
图3是本申请实施例提供的单个接地端子和双地端子结构的模拟插损曲线图；
图4是本申请实施例提供的塑料基座上端子收容槽排布的结构示意图；
图5是本申请实施例提供的一组典型的差分信号端子和接地端子的排布结构图；
图6是本申请实施例提供的具有LGA弹性触点和BGA圆形触点的双地端子结构的结构图；
图7是本申请实施例提供的端子连接件的第一部分和第二部分的装配示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请的说明书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例，例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、***、产品或装置不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或装置固有的其他步骤或单元。
应当理解，在本申请中，“至少一个(项)”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，用于描述关联对象的关联关系，表示可以存在三种关系，例如，“A和/或B”可以表示：只存在A，只存在B以及同时存在A和B三种情况，其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项(个)”或其类似表达，是指这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a，b或c中的至少一项(个)，可以表示：a，b，c，“a和b”，“a和c”，“b和c”，或“a和b和c”，其中a，b，c可以是单个，也可以是多个。
应当理解，在本申请实施例的描述中，多个(或多项)的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。
Socket又称插槽，用于固定芯片并建立芯片与PCB之间的通信桥梁，Socket往往包括有多个金属端子，每个金属端子连通芯片上的触点和PCB上的触点。在CPU/CPO Socket领域(下面以应用于CPU的Socket为例说明)，由于Socket上的金属端子不是沿着横向规则放置的，而是沿着一定的角度斜着排列，CPU与PCB之间在传输频率较低的信号时，传统的信号端子和接地端子都是采用同一种结构方式，没有明显的信号传输质量问题。但是随着CPU Socket要传输的信号频率越来越高，如果仍采用之前的端子结构方式排列(即各个端子独立设置)，那么在信号传输到更高频率的时候(如45GHz)，通过模拟会发现，端子的***损耗(下面简称插损)在高频率范围内会导致明显的谐振现象，影响信号传输的质量。
基于此，本申请实施例提供了一种应用于LGA(Land Grid Array)插槽的双地端子结构及LGA插槽，通过双地端子结构改善LGA插槽传输高频信号时产生的谐振。
参照图1和图2两个不同视角下的附图，本发明实施例提供的一种应用于LGA插槽的双地端子结构，包括：第一接地端子1、第二接地端子2，和端子连接件3。
第一接地端子1，包括第一连接区11。
第二接地端子2，包括第二连接区21，第一接地端子1和第二接地端子2按照LGA插槽 中相邻端子收容槽的排布方式设置。
端子连接件3，分别与第一连接区11和第二连接区21导电连接。
本申请实施例的双地端子结构由两个接地端子构成，分别为第一接地端子1和第二接地端子2，第一接地端子1和第二接地端子2之间通过端子连接件3连接在一起，同时，第一接地端子1和第二接地端子2按照LGA插槽中相邻接地端子的排布方式排列(即斜向排列)，以适配当前LGA插槽的端子排布结构；双地端子结构的应用降低了在高频率范围内的***损耗，如图3所示的经过模拟得到的插损曲线，横轴表示频率，纵轴表示插损值，曲线A表示传统单个接地端子的插损曲线，曲线B表示本申请实施例的双地端子结构的插损曲线，可以明显见到在45GHz附近(虚线框内)，曲线B不会出现突变，插损值随频率变化而平滑变化，因此本申请实施例的双地端子结构可以有效减小LGA插槽在传输高频信号过程中高频率范围内产生的谐振。
可以理解的是，第一接地端子1和第二接地端子2可有采用相同的结构，也可以采用不同的结构；如果采用相同结构，则应用双地端子结构的LGA插槽整体结构直接与常规的LGA封装芯片相兼容；如果采用不同结构，则按照安装的LGA封装芯片的触点定义进行调整，在此不作限制。
第一连接区11和第二连接区21被设置为与端子连接件3连接，通过端子连接件3绑定第一接地端子1和第二接地端子2。第一连接区11和第二连接区21实际上可以是接地端子上除触点以外的部分，为了提高连接后双地端子结构的稳定性，本申请实施例的第一连接区11设置在第一接地端子1的上下两个触点之间，第二连接区21设置在第二接地端子2的上下两个触点之间。参照图1和图2可知，第一接地端子1上下两侧分别引出第一悬臂12和第二悬臂13，第一连接区11位于第一悬臂12和第二悬臂13之间，第二接地端子2上下两侧分别引出第三悬臂22和第四悬臂23，第二连接区21位于第三悬臂22和第四悬臂23之间。其中第一悬臂12和第三悬臂22位于双地端子结构的一侧，第二悬臂13和第四悬臂23位于双地端子结构的另一侧。
第一悬臂12上设置第一触点14，第三悬臂22上设置第三触点24，第一触点14和第三触点24被设置为接触芯片上的触点，第二悬臂13上设置第二触点15，第四悬臂23上设置第四触点25，第二触点15和第四触点25被设置为接触PCB板上的触点。如图1所示，第一触点14、第二触点15、第三触点24和第四触点25都设置在对应悬臂的末端，即远离第一连接区11和远离第二连接区21的位置。可以理解的是，上述四个悬臂的形状并不限定如图1所示的形状，例如上述悬臂也可以是弯曲悬臂，弯曲悬臂的弯折处作为对应悬臂的触点。当然，LGA标准下采用弹性触点，但是根据实际情况也可以将弹性触点改成其他结构的触点，例如采用BGA(Ball Grid Array)植球触点，将第二触点15和第四触点25改成适于BGA连接的圆形触点，第二触点15和第四触点25通过BGA植球触点的形式连接PCB上的触点，即如图6所示的结构。
端子连接件3可以与第一连接区11和第二连接区21的其中一个一体成型，此时通过装配实现第一接地端子1和第二接地端子2之间的连接，端子连接件3也可以与第一连接区11和第二连接区21均一体成型，相当于整个双地端子结构可以通过冲压一次成型。端子连接件3的结构也可以有多种形式，可以是矩形、菱形、圆形或其他形状，其上可以开圆形、矩形或其他异形孔等，总之，端子连接件3只需要将第一接地端子1和第二接地端子2连通导电 即可。
可以理解的是，本申请实施例的两个接地端子端子连接件3连接，那么端子连接件3本身除了是一体成型外，可以是装配得到的；在一种可能的情况下，端子连接件3包括互相独立的第一部分331和第二部分332，第一部分331与第一连接区11一体连接，第二部分332与第二连接区21一体连接，第一部分331和第二部分332互相装配构成端子连接件3。第一部分331和第二部分332之间可以采用不同的装配结构，例如参照图7所示，第一部分331和第二部分332都具有U形件，两个U形件配合连接完成装配；又如第一部分331和第二部分332之间通过激光点焊的方式连接，等等，在此不一一举例。上述第一部分331与第一连接区11一体连接，是指第一部分331与第一连接区11互相连接成一个整体，该一体连接方式可以是焊接固定，也可以是直接一体成型等，在此不作限定；第二部分332与第二连接区21一体连接同理，也是焊接固定或一体成型等。值得注意的是，图7所示的第一部分331和第二部分332上的斜线并不代表剖面结构，而是为了明显区分第一部分331和第二部分332这两个不同的区域而额外做出的标识，以便于识别这两个不同的部件。
在本申请实施例中，参照图1，端子连接件3包括依次连接的第一弯折部31、连接部33和第二弯折部32，第一弯折部31与第一连接区11的边缘连接，第二弯折部32与第二连接区21的边缘连接。通过第一弯折部31和第二弯折部32将错位设置的第一接地端子1和第二接地端子2连接在一起，并在为了加强双地端子结构在端子收容槽内的稳固程度，连接部33采用平板状金属件，该平板状金属件同样可以是矩形、圆形、菱形或者其他形状，在此不作限制。
应用上述双地端子结构，本申请实施例还提供一种LGA插槽，包括双地端子收容槽4和上述的双地端子结构，双地端子收容槽4为双槽结构，由相邻的第一端子收容槽和第二端子收容槽组成，第一端子收容槽和第二端子收容槽连通，双地端子结构容置于双地端子收容槽4中。
参照图4和图5所示，展示了塑胶基座上一部分端子收容槽的区域，其中双地端子收容槽4占用两个端子收容槽的槽位。该区域中还包括被设置为容置接地端子的第三端子收容槽5和被设置为容置信号端子的第四端子收容槽6，双地端子收容槽4和第三端子收容槽5围绕第四端子收容槽6设置。在相邻的两个第四端子收容槽6中，设置组成一对的两个差分信号端子。排布规则以图5所示作为例子说明，两个第四端子收容槽6处于中央位置，第四端子收容槽6的左右两侧设置横向对齐的第三端子收容槽5，第四端子收容槽6的上下两侧设置双地端子收容槽4，这些双地端子收容槽4横向排列，上述这些端子收容槽组成一个特定区域，在这个特定区域中通过差分信号端子传输高频率信号时，可以避免***损耗突变的问题。可以理解的是，在LGA插槽的边缘位置，可能并不都是第三端子收容槽5或者双地端子收容槽4，即边缘位置可以是第四端子收容槽6，这个位置上的信号端子的一侧为空。
通过上述双地端子结构和LGA插槽，可以有效改善高频信号传输过程中在高频率范围内产生的谐振，使得***损耗随频率平滑变化，提高信号传输的质量，为未来更高速率的信号传输提供可靠的硬件基础。
本申请实施例提供的应用于LGA插槽的双地端子结构及LGA插槽，至少具有如下有益效果：双地端子结构由两个接地端子连接在一起，用于降低LGA插槽的接地端子***损耗，由于传统的接地端子在高频信号场景下，***损耗对于谐振的产生具有明显影响，因此采用上 述双地端子结构可以有效改善高频信号传输过程中产生的谐振，使得***损耗随频率平滑变化，提高信号传输的质量，为未来更高速率的信号传输提供可靠的硬件基础。
以上是对本申请的一些实施进行了具体说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请范围的前提下还可作出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (13)

  1. 一种应用于LGA插槽的双地端子结构，包括：
    第一接地端子，包括第一连接区；
    第二接地端子，包括第二连接区，所述第一接地端子和所述第二接地端子按照LGA插槽中相邻端子收容槽的排布方式设置；
    端子连接件，分别与所述第一连接区和所述第二连接区导电连接。
  2. 根据权利要求1所述的双地端子结构，其中，所述端子连接件与所述第一连接区和所述第二连接区中的至少一个一体成型。
  3. 根据权利要求1所述的双地端子结构，其中，所述端子连接件包括互相独立的第一部分和第二部分，所述第一部分与所述第一连接区一体连接，所述第二部分与所述第二连接区一体连接，所述第一部分和所述第二部分互相装配构成所述端子连接件。
  4. 根据权利要求1至3任一所述的双地端子结构，其中，所述端子连接件包括依次连接的第一弯折部、连接部和第二弯折部，所述第一弯折部与所述第一连接区的边缘连接，所述第二弯折部与所述第二连接区的边缘连接。
  5. 根据权利要求4所述的双地端子结构，其中，所述连接部为平板状金属件。
  6. 根据权利要求5所述的双地端子结构，其中，所述连接部的形状为矩形、圆形件或菱形。
  7. 根据权利要求4所述的双地端子结构，其中，所述连接部设置有开孔。
  8. 根据权利要求1所述的双地端子结构，其中，所述第一接地端子包括分别连接在所述第一连接区两侧的第一悬臂和第二悬臂，所述第二接地端子包括分别连接在所述第二连接区两侧的第三悬臂和第四悬臂，所述第一悬臂和所述第三悬臂位于所述双地端子结构的一侧，所述第二悬臂和所述第四悬臂位于所述双地端子结构的另一侧。
  9. 根据权利要求8所述的双地端子结构，其中，所述第一悬臂包括第一触点，所述第二悬臂包括第二触点，所述第三悬臂包括第三触点，所述第四悬臂包括第四触点，所述第一触点和所述第三触点用于接触芯片上的触点，所述第二触点和所述第四触点用于接触PCB板上的触点。
  10. 根据权利要求9所述的双地端子结构，其中，所述第一触点和所述第三触点为适于LGA连接的弹性触点，所述第二触点和所述第四触点为适于BGA连接的圆形触点。
  11. 一种LGA插槽，包括双地端子收容槽和如权利要求1至7任一所述的双地端子结构，其中，所述双地端子收容槽为双槽结构，由相邻的第一端子收容槽和第二端子收容槽组成，所述第一端子收容槽和所述第二端子收容槽连通，所述双地端子结构容置于所述双地端子收容槽中。
  12. 根据权利要求11所述的LGA插槽，还包括用于容置单个接地端子的第三端子收容槽和用于容置信号端子的第四端子收容槽，所述双地端子收容槽和所述第三端子收容槽围绕所述第四端子收容槽设置。
  13. 根据权利要求12所述的LGA插槽，其中，所述双地端子结构还包括组成一对的两个差分信号端子，所述两个差分信号端子分别容置于相邻的两个所述第四端子收容槽中。
PCT/CN2022/130315 2022-04-13 2022-11-07 应用于lga插槽的双地端子结构及lga插槽 WO2023197583A1 (zh)

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CN202231193U (zh) * 2010-12-20 2012-05-23 番禺得意精密电子工业有限公司 电连接器
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CN202231193U (zh) * 2010-12-20 2012-05-23 番禺得意精密电子工业有限公司 电连接器
CN202487899U (zh) * 2012-02-01 2012-10-10 东莞联基电业有限公司 一种改良的连接器结构
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