WO2023191230A1 - Gel gasket film and packaging box comprising same - Google Patents

Gel gasket film and packaging box comprising same Download PDF

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Publication number
WO2023191230A1
WO2023191230A1 PCT/KR2022/018162 KR2022018162W WO2023191230A1 WO 2023191230 A1 WO2023191230 A1 WO 2023191230A1 KR 2022018162 W KR2022018162 W KR 2022018162W WO 2023191230 A1 WO2023191230 A1 WO 2023191230A1
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WO
WIPO (PCT)
Prior art keywords
film
release film
conductive sheet
thermally conductive
gel gasket
Prior art date
Application number
PCT/KR2022/018162
Other languages
French (fr)
Korean (ko)
Inventor
최현석
박정현
한상효
Original Assignee
주식회사 에스엠티
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Application filed by 주식회사 에스엠티 filed Critical 주식회사 에스엠티
Publication of WO2023191230A1 publication Critical patent/WO2023191230A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a film for a gel gasket and a packaging box equipped with the same, and more specifically, to control the surface area of the embossing dot release film to facilitate peeling, and to attach it to an electrostatic chuck or focus ring and release the release film. It relates to a film for a gel gasket that minimizes traces of embossing when removed and a packaging box provided therewith.
  • a plasma processing device having a loading table for installing the wafer inside a vacuum chamber is used.
  • Plasma processing devices are used to process substrates by etching, physical vapor deposition (PVD), chemical vapor deposition (CVD), ion implantation, and resist removal.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • One type of plasma processing device used for plasma processing includes a reaction chamber equipped with upper and lower electrodes. An electric field is established between the electrodes to excite the processing gas into a plasma state to process the substrate in the reaction chamber.
  • a heater is installed on the outer periphery of the loading table, and a focus ring is installed on it to heat it through a gel gasket such as a heat conductive sheet.
  • the gel gasket attached to the electrostatic chuck (ESC) and focus ring is thin, has soft surface hardness, and has strong surface adhesion.
  • the gel gasket is attached to the electrostatic chuck or focus ring, there should be no defects such as tilting or substrate defects.
  • the embossing dot release film of the conventional gel gasket has a diamond-shaped surface, but the surface adhesive area is large, so it is not easy to peel the film, or there is a problem of leaving diamond-shaped marks on the gasket surface after peeling the film. there is. Accordingly, research and development on gel gaskets is necessary.
  • the present invention designs the surface area of the embossing dot release film to a specific range to facilitate peeling, and when attached to an electrostatic chuck or focus ring and the release film is removed, the release film
  • a film for a gel gasket that minimizes traces of embossing of the film, a packaging box equipped with the same, and a method for attaching the film for a gel gasket.
  • a film for a gel gasket that protects the surface of a thermally conductive sheet and facilitates attachment and detachment, a packaging box provided therewith, and a method for attaching the film for a gel gasket are provided.
  • a film for a gel gasket according to an embodiment of the present invention includes a base film; a lower release film laminated on the base film; A thermally conductive sheet laminated on the lower release film; and an upper release film laminated on the top of the thermally conductive sheet, wherein the lower release film and the upper release film are embossed release films that form a protrusion on one surface facing the thermally conductive sheet.
  • a film for a gel gasket according to an embodiment of the present invention includes a base film; A thermally conductive sheet laminated on the base film; and an upper release film laminated on the top of the thermally conductive sheet, wherein the upper release film is an embossed release film that forms a protrusion on one surface facing the thermally conductive sheet.
  • the lower release film and the upper release film each have a body portion and satisfy i) or ii) below.
  • PA1/PA2 is 0.3 or more and 0.8 or less.
  • p1 is used to be 0.3 mm or more and 3.0 mm or less.
  • k1 is used to be larger than k2.
  • One embodiment of the present invention uses a packaging box for a gel gasket film including a plurality of gel gasket films stacked in parallel on a tray.
  • the upper release film is made of a single film and is formed to be attached to a plurality of gel gasket films on the tray.
  • the method of attaching the gel gasket film of the present invention to the surface to be adhered includes the first step of separating the upper release film; A second step of separating the thermally conductive sheet from the base film; A third step of attaching the thermally conductive sheet to the adherend surface; It includes a fourth step of separating the lower release film.
  • the adhesive surface, the thermal conductive sheet, and the lower release film are stacked to form one another.
  • the peeling force of the thermal conductive sheet and the lower release film is smaller than the peeling force (PA2) of the thermal conductive sheet and the adhered surface, so that the lower release film is separated from the adhered surface while the thermal conductive sheet is attached to the adhered surface. separated.
  • the cycle of the embossing protrusions is adjusted to a specific range, so that embossing marks are not left on the thermal conductive sheet even when the release film is peeled. It has the effect of preventing the thermally conductive sheet from lifting from the electrode when peeling off the release film.
  • the gel gasket of the present invention is used in a very thin form, which has the effect of covering the surface of a thermally conductive sheet and enabling the laminating of strong sheets for attachment to an electrostatic chuck or focus ring.
  • Figure 1 shows a cross-sectional schematic diagram of the film for a gel gasket of the present invention.
  • Figure 2 shows a cross-sectional schematic diagram of the release film of the present invention.
  • Figure 3 shows a front schematic view of the release film of the present invention.
  • Figure 4 shows an enlarged cross-section of the release film of the present invention.
  • Figure 5 shows a schematic diagram of peeling a release film from a thermally conductive sheet when the lattice period is large.
  • Figure 6 shows a schematic diagram of peeling a release film from a thermally conductive sheet when the lattice period is small.
  • Figure 7 shows a schematic diagram of a packaging box equipped with the release film of the present invention.
  • Figure 8 shows a flow chart of the film attachment method for a gel gasket of the present invention.
  • Figure 9 shows a schematic diagram of the peel force measurement method.
  • Figure 10 shows a state of OK workability in which the thermally conductive sheet remains attached to the adhered surface even when the release film is peeled off when the release film is peeled off with the thermally conductive sheet attached to the adhered surface, and when the release film is peeled off, the thermally conductive sheet is A photo shows a state in which workability is NG, with part or all of the surface peeled off.
  • Figure 1 shows a cross-sectional schematic diagram of a gel gasket film (100A) according to an embodiment of the present invention.
  • the film 100A for a gel gasket according to an embodiment of the present invention includes a base film 10; a lower release film (30) laminated on the base film (10); A thermally conductive sheet (20) laminated on the lower release film (30); and an upper release film 40 laminated on the thermally conductive sheet 20, and embossing may be performed on one or both of the lower release film 30 and the upper release film 40.
  • the film 100B for a gel gasket includes a base film 10; A thermally conductive sheet (20) laminated on the base film (10); It includes an upper release film 40 laminated on the thermally conductive sheet 20, and embossing can be performed on the upper release film 40.
  • Figure 2 shows a cross-sectional schematic diagram of the release film of the present invention.
  • the lower release film 30 is provided with a first body portion 31A, and the first body portion 31A has the following i ) or ii) may be provided.
  • a protrusion 32A formed on the upper part of the main body 31A or ii) a protrusion 32B formed on the upper part of the main body 31B and a concave part 33B formed on the lower part of the main body 31B.
  • the thermally conductive sheet 20 can be easily peeled off from the lower release film 30 even if it has adhesive strength.
  • a protruding portion 32B formed on the upper portion of the main body portion 31B and a concave portion 33B formed on the lower portion of the main body portion 31B are formed. do.
  • Figure 3 shows a front schematic view of the release film of the present invention.
  • the release film is provided with a diamond-shaped lattice, and the spacing of the lattice can be formed repeatedly with a p1 period.
  • the protrusions 32 which are the partition walls of the grid, may be formed with a width of w.
  • the contact area between the release film 30 having a periodic diamond-shaped pattern and the thermally conductive sheet 20 is narrower than the contact area between the release film 30 and the thermally conductive sheet 20 without a periodic diamond-shaped pattern.
  • the release film 30 can be easily peeled off from the thermally conductive sheet 20.
  • FIG. 4 shows a schematic diagram of peeling the release film from the thermally conductive sheet 20 when the diamond-shaped lattice period is large.
  • the release film 40 in contact with the thermally conductive sheet 20 is removed from the thermally conductive sheet 20, and a blood such as the electrode member 50 of the plasma device is removed.
  • a blood such as the electrode member 50 of the plasma device is removed.
  • Figure 5 shows a schematic diagram of peeling the release film 30 from the thermally conductive sheet 20 when the diamond-shaped lattice period is small.
  • the thermally conductive sheet 20 with the release film 30 attached is attached to the surface to be adhered, such as the electrode member 50 of the plasma device, and the release film ( When 30) is removed, the contact area between the release film 30 and the thermally conductive sheet 20 becomes larger, so that only the release film 30 is not removed from the thermally conductive sheet 20, and the thermally conductive sheet 20 is also removed from the release film. Due to the peeling of (30), a phenomenon in which the adhered surface of the plasma electrode member 50 is lifted may occur, and a problem of having to reattach the thermally conductive sheet 20 to the adhered surface may occur.
  • Figure 6 shows an enlarged cross-section of the release film of the present invention.
  • the pitch (p1) can preferably be 0.3 mm or more and 3.0 mm or less.
  • the separation force between the adhered surface of the electrode member 50 of the plasma of the present invention and the thermally conductive sheet 20 is preferably greater than the separation force between the release film and the thermally conductive sheet 20. That is, when attaching the thermally conductive sheet 20 with a release film attached to the adhesion surface of the plasma electrode member 50 and separating the release film from the thermally conductive sheet 20, the plasma electrode member 50 It is preferable that the adhesive force between the adhered surface and the thermally conductive sheet 20 is greater than the adhesive force between the release film and the thermally conductive sheet 20. Accordingly, the thermally conductive sheet 20 remains on the adhered surface of the plasma electrode member 50 and the release film is separated.
  • PA1 peeling force between the release film and the thermal conductive sheet
  • PA2 peeling force between the adhered surface of the plasma electrode member and the thermal conductive sheet
  • PA1 ⁇ PA2 must be satisfied
  • PA1 /PA2 is preferably 0.3 or more and 0.8 or less.
  • the pressure (P) applied from the release film to the thermally conductive sheet 20 can be defined as follows (Equation 1).
  • F is the pressure applied from the top of the release film
  • A represents the contact area between the release film 30 and the thermally conductive sheet 20. That is, when the pitch (p1) exceeds 3.0 mm, the contact area A between the release film 30 and the thermally conductive sheet 20 decreases, and the pressure applied during the attachment work of the gel gasket increases, so the embossing dot Traces remain on the thermally conductive sheet 20, which is undesirable.
  • the pitch (p1) is less than 0.3 mm
  • the contact area between the upper surface of the diamond-shaped grid and one surface of the thermally conductive sheet 20 increases, so when removing the release film 30, the plasma electrode member ( A part of the thermally conductive sheet 20 attached to the adherend of 50) also tends to peel off, which is not desirable.
  • the width w of the protrusion 32 is also important in the design of the release film.
  • the width of the protrusion of the present invention is preferably 0.1 mm to 1.5 mm.
  • the fact that the width (w) of the protrusion 32 in the release film 30 becomes wider at the same pitch (p1) means that the contact area between the release film 30 and the flexible thermally conductive sheet 20 becomes wider. do.
  • the contact area (S1) between the release film 30 and the thermally conductive sheet 20 is compared to the contact area (S2) of the adhered surface of the thermally conductive sheet 20 and the plasma electrode member 50 from the viewpoint of preventing lifting.
  • the ratio (w/p1) between the width (w) and the pitch (p1) of the protrusion 32 may be 0.3 to 0.5.
  • the height h of the protrusion 32 is preferably 0.05 mm to 0.5 mm, and more preferably the height h of the protrusion 32 is 0.1 mm to 0.3 mm.
  • the height of the protrusion 32 ( The ratio (h/p1) of h) and pitch (p1) can be 0.1 to 0.2.
  • the protrusion 32 of the release film may have a shape that becomes narrower toward the top. As shown in Figure 6, it may have a triangular shape, the end of the triangle may be curved, or it may have a hemispherical shape. Meanwhile, the angle ⁇ formed by both sides of the protrusion 32 may range from 1° to 10°, and more preferably from 3° to 7°. If it is smaller than the above range, the area in contact with the thermally conductive sheet 20 inside the diamond-shaped lattice of the release film 30 becomes too large, which is undesirable. If it is larger than the above range, the thermally conductive sheet 20 is in contact with the adherend. This is undesirable because voids may remain at the boundary after processing.
  • the thickness of the release film 30 is defined as k1 and the depth of the concave portion 33 is defined as k2, it is preferable to use k1 larger than k2.
  • the thickness of the release film 30, k1 is 0.01 mm to 0.1 mm, and the depth of the recessed portion 33, k2, is 0.05 mm to 0.5 mm. If it is smaller than the above range, the protrusion 32 protrudes too much compared to the thickness of the release film 30, so excessive pressure is applied to the thermal conductive sheet 20, and traces of embossing dots remain on the thermal conductive sheet 20. It gets easier.
  • Figure 7 shows a schematic diagram of a packaging box equipped with the release film of the present invention.
  • the packaging box for the gel gasket film includes a tray 500 in which a plurality of gel gasket films 100 are stacked.
  • the upper release film 40 may be made of one film.
  • the upper release film may be individually attached to each of the gel gasket films 100 and used.
  • unnecessary material that may be applied when attached to the thermally conductive sheet 20 is eliminated. It has the advantage of minimizing the variation in pressurization.
  • Figure 8 shows a flow chart of the method for attaching the film 100 for a gel gasket of the present invention.
  • the method of attaching the gel gasket film 100 includes a first step of separating the upper release film 40 from one surface of the thermally conductive sheet 20; A second step of separating the thermally conductive sheet 20 from the base film 10; A third step of attaching one side of the thermally conductive sheet 20 to the adherend surface; It includes a fourth step of separating the lower release film 30 attached to the other surface of the thermally conductive sheet 20.
  • the first step is a step of separating the upper release film 40 from one side of the thermally conductive sheet 20.
  • the upper release film is separated from the thermally conductive sheet. do.
  • the second step is to separate the thermally conductive sheet 20 from the base film 10, and the thermally conductive sheet and the lower release film are separated from the base film, and the adhesive force between the lower release film and the base film is caused by friction force. Since the peeling force of the thermal conductive sheet and the lower release film is greater than that of the lower release film and the base film, the lower release film is easily separated from the base film.
  • the third step is a step of attaching one side of the thermally conductive sheet 20 to the adhered surface, and the adhered surface, the thermally conductive sheet, and the lower release film are laminated in that order.
  • the fourth step is a step of separating the lower release film 30 attached to the other side of the thermally conductive sheet 20 while the thermally conductive sheet 20 is attached to the adhered surface.
  • the peeling force of the thermally conductive sheet and the lower release film is smaller than the peeling force (PA2) of the thermally conductive sheet and the adhered surface, the lower release film is separated from the adhered surface while the thermally conductive sheet is attached to the adhered surface.
  • Peeling force (PA1) and thermal conductivity of the thermal conductive sheet and the release film when the pitch (mm), protrusion width (mm), and protrusion height (mm) of the release film were used in Examples 1 to 4 and Comparative Examples 1 to 4.
  • the peeling force (PA2) between the sheet and the Si electrode member was determined, and workability was evaluated.
  • Figure 9 shows a schematic diagram of the peeling force measurement method
  • Figure 10 shows that when peeling off the release film with a thermally conductive sheet attached to the adhered surface, the workability is OK as the thermally conductive sheet remains attached to the adhered surface even after the release film is peeled off.
  • the release film is peeled off, part or all of the thermally conductive sheet falls off from the adhered surface, showing a picture of NG workability.
  • the condition of the film for a gel gasket of the present invention can be confirmed.
  • the peel force was measured using a 90° peel test method according to ASTM D3330 standards by installing a 1 kg load cell in a tensile strength tester Instron 3367.

Abstract

The present invention relates to a gel gasket film, and a packaging box comprising same, and more specifically relates to a gel gasket film in which the surface area of an embossed dot release film is small, making peeling easy, and wherein when the gel gasket is attached to a static chuck or focus ring, and then the release film is removed, there is minimal evidence of embossing, and a packaging box comprising same.

Description

겔 가스킷용 필름 및 이를 구비한 포장 박스Film for gel gasket and packaging box equipped with the same
본 발명은 겔 가스킷용 필름 및 이를 구비한 포장 박스에 관한 것이며, 보다 상세하게는 엠보싱 닷(embossing dot) 이형 필름의 표면적을 제어하여 박리를 용이하게 하며, 정전척이나 포커스링에 부착하고 이형 필름을 제거하였을 때 엠보싱의 흔적을 최소화한 겔 가스킷용 필름 및 이를 구비한 포장 박스에 관한 것이다.The present invention relates to a film for a gel gasket and a packaging box equipped with the same, and more specifically, to control the surface area of the embossing dot release film to facilitate peeling, and to attach it to an electrostatic chuck or focus ring and release the release film. It relates to a film for a gel gasket that minimizes traces of embossing when removed and a packaging box provided therewith.
반도체 제조 공정에 있어서, 반도체 웨이퍼에 플라스마 처리를 실시하기 위해서, 진공 챔버의 내부에 웨이퍼를 설치하는 적재대를 갖는 플라스마 처리 장치가 사용되고 있다. 플라즈마 처리 장치들은 에칭, PVD (physical vapor deposition), CVD (chemical vapor deposition), 이온 주입 및 레지스트 제거 등에 따라 기판들을 처리하는데 사용된다. 플라즈마 처리에 사용되는 플라즈마 처리 장치의 한 유형은 상부 및 하부 전극들을 구비한 반응 챔버를 포함한다. 전계가 전극들 사이에 수립되어 처리 가스를 플라즈마 상태로 여기시켜 기판을 반응 챔버에서 처리한다.In a semiconductor manufacturing process, in order to perform plasma processing on a semiconductor wafer, a plasma processing device having a loading table for installing the wafer inside a vacuum chamber is used. Plasma processing devices are used to process substrates by etching, physical vapor deposition (PVD), chemical vapor deposition (CVD), ion implantation, and resist removal. One type of plasma processing device used for plasma processing includes a reaction chamber equipped with upper and lower electrodes. An electric field is established between the electrodes to excite the processing gas into a plasma state to process the substrate in the reaction chamber.
최근, 반도체 웨이퍼의 대직경화와 가공 정밀도의 미세화가 진행되고 있으며, 웨이퍼에 대하여 균일하게 플라스마 처리를 행하기 위해서, 온도 분포를 균일하게 적용할 필요가 있다. 그래서, 적재대의 외주부에 히터를 설치하고, 그 위에 열전도성 시트와 같은 겔 가스킷(Gel Gasket)를 통해 포커스 링을 설치하여 가열하여 사용되고 있다. Recently, the diameter of semiconductor wafers has become larger and the processing precision has been refined, and in order to uniformly perform plasma processing on the wafer, it is necessary to apply a uniform temperature distribution. Therefore, a heater is installed on the outer periphery of the loading table, and a focus ring is installed on it to heat it through a gel gasket such as a heat conductive sheet.
한편, 정전척(ESC,Electro Static Chuck) 및 포커스링에 부착하는 겔 가스킷은 두께가 얇고, 표면 경도가 소프트하며, 표면 점착력은 강한 특성을 갖고 있다. 특히, 겔 가스킷을 정전척이나 포커스링에 부착하였을 때, 틸팅(tilting), 기판 등의 불량은 없어야 한다. Meanwhile, the gel gasket attached to the electrostatic chuck (ESC) and focus ring is thin, has soft surface hardness, and has strong surface adhesion. In particular, when the gel gasket is attached to the electrostatic chuck or focus ring, there should be no defects such as tilting or substrate defects.
그러나, 종래의 겔 가스킷의 엠보싱 닷(embossing dot) 이형 필름은 다이아몬드 형태의 표면을 갖지만, 표면 접착 면적이 커서 필름 박리가 용이하지 않거나 필름을 박리한 후 가스킷 표면에 다이아몬드 형태의 자국을 남기는 문제가 있다. 이에 겔 가스킷에 대한 연구 개발이 필요한 실정이다. However, the embossing dot release film of the conventional gel gasket has a diamond-shaped surface, but the surface adhesive area is large, so it is not easy to peel the film, or there is a problem of leaving diamond-shaped marks on the gasket surface after peeling the film. there is. Accordingly, research and development on gel gaskets is necessary.
본 발명은 상기와 같은 문제점을 해결하기 위하여, 엠보싱 닷(embossing dot) 이형 필름의 표면적을 특정 범위로 설계하여 박리를 용이하게 하며, 정전척이나 포커스링에 부착하고 이형 필름을 제거하였을 때, 이형 필름의 엠보싱의 흔적을 최소화한 겔 가스킷용 필름, 이를 구비한 포장 박스 및 겔 가스킷용 필름 부착 방법을 제공한다. In order to solve the above problems, the present invention designs the surface area of the embossing dot release film to a specific range to facilitate peeling, and when attached to an electrostatic chuck or focus ring and the release film is removed, the release film Provided is a film for a gel gasket that minimizes traces of embossing of the film, a packaging box equipped with the same, and a method for attaching the film for a gel gasket.
나아가, 열전도성 시트의 표면을 보호하며, 탈부착을 용이하게 하는 겔 가스킷용 필름, 이를 구비한 포장 박스 및 겔 가스킷용 필름 부착 방법을 제공한다. Furthermore, a film for a gel gasket that protects the surface of a thermally conductive sheet and facilitates attachment and detachment, a packaging box provided therewith, and a method for attaching the film for a gel gasket are provided.
본 발명의 일 실시형태인 겔 가스킷용 필름은 기저필름; 상기 기저필름 상에 적층된 하부 이형필름; 상기 하부 이형필름 상에 적층된 열전도성 시트; 상기 열전도성 시트의 상부에 적층된 상부 이형필름;을 포함하며, 상기 하부 이형필름 및 상부 이형필름은 상기 열전도성 시트과 마주보는 일면에 돌출부를 형성하는 엠보싱 이형필름인 것을 사용한다. A film for a gel gasket according to an embodiment of the present invention includes a base film; a lower release film laminated on the base film; A thermally conductive sheet laminated on the lower release film; and an upper release film laminated on the top of the thermally conductive sheet, wherein the lower release film and the upper release film are embossed release films that form a protrusion on one surface facing the thermally conductive sheet.
본 발명의 일 실시형태인 겔 가스킷용 필름은 기저필름; 상기 기저필름 상에 적층된 열전도성 시트; 상기 열전도성 시트의 상부에 적층된 상부 이형필름;을 포함하며, 상기 상부 이형필름은 상기 열전도성 시트과 마주보는 일면에 돌출부를 형성하는 엠보싱 이형필름인 것을 사용한다. A film for a gel gasket according to an embodiment of the present invention includes a base film; A thermally conductive sheet laminated on the base film; and an upper release film laminated on the top of the thermally conductive sheet, wherein the upper release film is an embossed release film that forms a protrusion on one surface facing the thermally conductive sheet.
상기 하부 이형필름 및 상부 이형필름은 각각 본체부를 구비하고, 하기 i) 또는 ii)를 만족한다. The lower release film and the upper release film each have a body portion and satisfy i) or ii) below.
i) 상기 본체부 상부에 형성된 돌출부i) a protrusion formed on the upper part of the main body
ii) 상기 본체부 상부에 형성된 돌출부 및 상기 본체부 하부에 형성된 오목부ii) a protrusion formed in the upper part of the main body and a concave part formed in the lower part of the main body
상기 상부 이형필름과 상기 열전도성 시트 사이의 박리력을 PA1으로 정의하고, 상기 열전도성 시트와 상기 플라즈마 장치의 전극 부재의 피착면 사이의 박리력을 PA2 로 정의할 때, PA1 < PA2를 만족하는 것을 사용한다. When the peeling force between the upper release film and the thermally conductive sheet is defined as PA1, and the peeling force between the thermally conductive sheet and the adhered surface of the electrode member of the plasma device is defined as PA2, PA1 < PA2 is satisfied. use it
여기서, PA1/PA2 는 0.3 이상 0.8 이하인 것을 사용한다. Here, PA1/PA2 is 0.3 or more and 0.8 or less.
상기 돌출부 사이의 거리를 피치(p1)으로 정의하면, p1은 0.3mm 이상 3.0mm 이하인 것을 사용한다. If the distance between the protrusions is defined as pitch (p1), p1 is used to be 0.3 mm or more and 3.0 mm or less.
상기 상부 이형필름 및 하부 이형필름의 두께를 k1, 오목부의 들어간 깊이를 k2라고 정의하면, k1은 k2보다 큰 것을 사용한다. If the thickness of the upper release film and the lower release film are defined as k1 and the depth of the concave portion is defined as k2, k1 is used to be larger than k2.
본 발명의 일 실시형태는 겔 가스킷용 필름이 복수개가 병렬로 트레이에 적층되어 있는 포함하는 겔 가스킷용 필름용 포장 박스를 사용한다. One embodiment of the present invention uses a packaging box for a gel gasket film including a plurality of gel gasket films stacked in parallel on a tray.
상기 상부 이형필름은 한매의 필름으로 이루어져 상기 트레이 상에 복수개의 겔 가스킷용 필름 상에 부착 가능하도록 형성된다. The upper release film is made of a single film and is formed to be attached to a plurality of gel gasket films on the tray.
본 발명의 겔 가스킷용 필름으로 피착면에 부착하는 방법은 상부 이형필름을 분리하는 제1 단계; 열전도성 시트를 기저필름에서 분리하는 제2 단계; 상기 열전도성 시트를 피착면에 부착하는 제3 단계; 하부 이형 필름을 분리하는 제4 단계;를 포함한다. The method of attaching the gel gasket film of the present invention to the surface to be adhered includes the first step of separating the upper release film; A second step of separating the thermally conductive sheet from the base film; A third step of attaching the thermally conductive sheet to the adherend surface; It includes a fourth step of separating the lower release film.
상기 제3 단계에서 피착면, 열전도성 시트, 하부 이형필름으로 적층되어 형성한다. In the third step, the adhesive surface, the thermal conductive sheet, and the lower release film are stacked to form one another.
상기 제4 단계에서 상기 열전도성 시트와 하부 이형필름의 박리력은 열전도성 시트와 피착면의 박리력(PA2)보다 작아서 열전도성 시트가 피착면에 부착되어 있는 상태로 하부 이형필름은 피착면으로부터 분리된다. In the fourth step, the peeling force of the thermal conductive sheet and the lower release film is smaller than the peeling force (PA2) of the thermal conductive sheet and the adhered surface, so that the lower release film is separated from the adhered surface while the thermal conductive sheet is attached to the adhered surface. separated.
본 발명의 겔 가스킷용 필름, 이를 구비한 포장 박스 및 겔 가스킷용 필름 부착 방법에 의하면, 엠보싱의 돌출부의 주기를 특정 범위로 조절함에 따라 이형 필름의 박리에 의하여도 열전도성 시트에 엠보싱 자국을 남기지 않는 효과가 있으며, 이형 필름을 박리할 때 열전도성 시트가 전극에서 들뜨지 않게 하는 효과가 있다. According to the gel gasket film, the packaging box provided therewith, and the gel gasket film attachment method of the present invention, the cycle of the embossing protrusions is adjusted to a specific range, so that embossing marks are not left on the thermal conductive sheet even when the release film is peeled. It has the effect of preventing the thermally conductive sheet from lifting from the electrode when peeling off the release film.
나아가, 본 발명의 겔 가스킷을 매우 얇은 형태로 사용하며, 열전도성 시트의 표면을 보고하고 정전척이나 포커스링에 부착하기 위하여 강도가 있는 시트류의 합지가 가능한 효과가 있다. Furthermore, the gel gasket of the present invention is used in a very thin form, which has the effect of covering the surface of a thermally conductive sheet and enabling the laminating of strong sheets for attachment to an electrostatic chuck or focus ring.
도 1은 본 발명의 겔 가스킷용 필름의 단면 개략도를 나타낸다. Figure 1 shows a cross-sectional schematic diagram of the film for a gel gasket of the present invention.
도 2는 본 발명의 이형필름의 단면 개략도를 나타낸다.Figure 2 shows a cross-sectional schematic diagram of the release film of the present invention.
도 3은 본 발명의 이형필름의 정면 개략도를 나타낸다.Figure 3 shows a front schematic view of the release film of the present invention.
도 4는 본 발명의 이형필름의 단면 확대도를 나타낸다.Figure 4 shows an enlarged cross-section of the release film of the present invention.
도 5는 열전도성 시트에서 격자 주기가 큰 경우에 이형필름을 박리할 때의 개략도를 나타낸다. Figure 5 shows a schematic diagram of peeling a release film from a thermally conductive sheet when the lattice period is large.
도 6은 열전도성 시트에서 격자 주기가 작은 경우에 이형필름을 박리할 때의 개략도를 나타낸다. Figure 6 shows a schematic diagram of peeling a release film from a thermally conductive sheet when the lattice period is small.
도 7은 본 발명의 이형필름을 구비한 포장 박스의 개략도를 나타낸다.Figure 7 shows a schematic diagram of a packaging box equipped with the release film of the present invention.
도 8은 본 발명의 겔 가스킷용 필름 부착 방법의 플로우 차트를 나타낸다.Figure 8 shows a flow chart of the film attachment method for a gel gasket of the present invention.
도 9는 박리력 측정방법의 개략도를 나타낸다.Figure 9 shows a schematic diagram of the peel force measurement method.
도 10은 피착면에 열전도성 시트가 부착된 상태에서 이형필름을 박리할 때, 이형필름을 박리해도 열전도성 시트가 피착면에 붙여져 있는 작업성 OK의 상태 및 이형필름을 박리하면 열전도성 시트는 피착면에서 일부 또는 전부가 떨어져 작업성 NG의 상태의 사진을 나타낸다.Figure 10 shows a state of OK workability in which the thermally conductive sheet remains attached to the adhered surface even when the release film is peeled off when the release film is peeled off with the thermally conductive sheet attached to the adhered surface, and when the release film is peeled off, the thermally conductive sheet is A photo shows a state in which workability is NG, with part or all of the surface peeled off.
하기에 나타난 도면에서 동일한 참조부호는 동일한 구성요소를 지칭하며, 도면상에서 각 구성요소의 크기는 설명의 명료성과 편의상 과장되어 있을 수 있다. 한편, 이하에 설명되는 실시예는 단지 예시적인 것에 불과하며, 이러한 실시예로부터 다양한 변형이 가능하다. 이하에서, 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 또한 어떤 부분이 어떤 구성 요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다. In the drawings shown below, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience of explanation. Meanwhile, the embodiments described below are merely illustrative, and various modifications are possible from these embodiments. Hereinafter, terms are used solely for the purpose of distinguishing one component from another. Singular expressions include plural expressions unless the context clearly dictates otherwise. Additionally, when a part is said to "include" a certain component, this means that it may further include other components rather than excluding other components, unless specifically stated to the contrary.
도 1은 본 발명의 일 실시형태인 겔 가스킷용 필름(100A)의 단면 개략도를 나타낸다. 도 1(a)에 나타난 것처럼, 본 발명의 일 실시형태인 겔 가스킷용 필름(100A)은 기저필름(10); 상기 기저필름(10) 상에 적층된 하부 이형필름(30); 상기 하부 이형필름(30) 상에 적층된 열전도성 시트(20); 상기 열전도성 시트(20)의 상부에 적층된 상부 이형필름(40);을 포함하며, 상기 하부 이형필름(30) 및 상부 이형필름(40)의 어느 하나 또는 둘에 엠보싱 가공을 행할 수 있다. 도 1(b)에 나타난 것처럼, 본 발명의 일 실시형태인 겔 가스킷용 필름(100B)은 기저필름(10); 상기 기저필름(10) 상에 적층된 열전도성 시트(20); 상기 열전도성 시트(20)의 상부에 적층된 상부 이형필름(40);을 포함하며, 상기 상부 이형필름(40)에 엠보싱 가공을 행할 수 있다. Figure 1 shows a cross-sectional schematic diagram of a gel gasket film (100A) according to an embodiment of the present invention. As shown in Figure 1(a), the film 100A for a gel gasket according to an embodiment of the present invention includes a base film 10; a lower release film (30) laminated on the base film (10); A thermally conductive sheet (20) laminated on the lower release film (30); and an upper release film 40 laminated on the thermally conductive sheet 20, and embossing may be performed on one or both of the lower release film 30 and the upper release film 40. As shown in Figure 1(b), the film 100B for a gel gasket according to an embodiment of the present invention includes a base film 10; A thermally conductive sheet (20) laminated on the base film (10); It includes an upper release film 40 laminated on the thermally conductive sheet 20, and embossing can be performed on the upper release film 40.
도 2는 본 발명의 이형필름의 단면 개략도를 나타내며, 도 2에 나타난 것처럼, 상기 하부 이형필름(30)은 제1 본체부(31A)를 구비하고, 상기 제1 본체부(31A)는 하기 i) 또는 ii)을 구비할 수 있다.Figure 2 shows a cross-sectional schematic diagram of the release film of the present invention. As shown in Figure 2, the lower release film 30 is provided with a first body portion 31A, and the first body portion 31A has the following i ) or ii) may be provided.
i) 상기 본체부(31A) 상부에 형성된 돌출부(32A)i) Protrusion 32A formed on the upper part of the main body 31A
ii) 상기 본체부(31B) 상부에 형성된 돌출부(32B) 및 상기 본체부(31B) 하부에 형성된 오목부(33B)ii) a protrusion 32B formed on the upper part of the main body 31B and a concave part 33B formed on the lower part of the main body 31B
즉, i) 상기 본체부(31A) 상부에 형성된 돌출부(32A)를 구비하거나 ii) 상기 본체부(31B) 상부에 형성된 돌출부(32B) 및 상기 본체부(31B) 하부에 형성된 오목부(33B)를 구비함에 따라 열전도성 시트(20)는 점착력을 가지고 있어도 하부 이형필름(30)으로부터 쉽게 박리가 가능해 진다. 여기서, 본체부(31B)를 돌기가 있는 프레스로 열압착하게 되면 ii) 상기 본체부(31B) 상부에 형성된 돌출부(32B) 및 상기 본체부(31B) 하부에 형성된 오목부(33B)를 형성하게 된다. That is, i) a protrusion 32A formed on the upper part of the main body 31A, or ii) a protrusion 32B formed on the upper part of the main body 31B and a concave part 33B formed on the lower part of the main body 31B. As it is provided, the thermally conductive sheet 20 can be easily peeled off from the lower release film 30 even if it has adhesive strength. Here, when the main body portion 31B is heat-compressed using a press with protrusions, ii) a protruding portion 32B formed on the upper portion of the main body portion 31B and a concave portion 33B formed on the lower portion of the main body portion 31B are formed. do.
도 3은 본 발명의 이형필름의 정면 개략도를 나타낸다. 도 3에 나타난 것처럼, 이형필름에는 다이아몬드 형태의 격자를 구비하고, 상기 격자의 간격은 p1 주기를 가지고 반복되게 형성할 수 있다. 여기서, 격자의 격벽인 돌출부(32)는 w의 폭을 가지고 형성될 수 있다. 이와 같이, 주기적인 다이아몬드 형태의 패턴을 갖는 이형필름(30)과 열전도성 시트(20)의 접촉 면적은 주기적인 다이아몬드 형태의 패턴을 갖지 않는 이형필름과 열전도성 시트(20)의 접촉 면적보다도 좁게 되어 열전도성 시트(20)로부터 이형필름(30)은 쉽게 박리될 수 있다. Figure 3 shows a front schematic view of the release film of the present invention. As shown in Figure 3, the release film is provided with a diamond-shaped lattice, and the spacing of the lattice can be formed repeatedly with a p1 period. Here, the protrusions 32, which are the partition walls of the grid, may be formed with a width of w. In this way, the contact area between the release film 30 having a periodic diamond-shaped pattern and the thermally conductive sheet 20 is narrower than the contact area between the release film 30 and the thermally conductive sheet 20 without a periodic diamond-shaped pattern. Thus, the release film 30 can be easily peeled off from the thermally conductive sheet 20.
한편, 도 4는 열전도성 시트(20)에서 다이아몬드 형태의 격자 주기가 큰 경우에 이형필름을 박리할 때의 개략도를 나타낸다. 도 4에 나타난 바와 같이, p1 주기가 큰 경우에 열전도성 시트(20)에 접촉하고 있는 이형필름(40)을 열전도성 시트(20)로부터 제거하고, 플라즈마 장치의 전극 부재(50)와 같은 피접착면에 부착하게 되면 열전도성 시트(20)와 피착면 사이에 보이드(void)가 생기기가 쉬워진다. 이러한 보이드는 플라즈마의 전극 부재(50)의 피착면에서 열전도성 시트(20)로 전달되는 열전도도를 저하시킬 수 있는 요인이 된다. Meanwhile, FIG. 4 shows a schematic diagram of peeling the release film from the thermally conductive sheet 20 when the diamond-shaped lattice period is large. As shown in FIG. 4, when the p1 period is large, the release film 40 in contact with the thermally conductive sheet 20 is removed from the thermally conductive sheet 20, and a blood such as the electrode member 50 of the plasma device is removed. When attached to the adhesive surface, it is easy for a void to be created between the thermally conductive sheet 20 and the adhesive surface. These voids become a factor that can reduce the thermal conductivity transmitted from the adhesion surface of the plasma electrode member 50 to the thermal conductive sheet 20.
도 5는 열전도성 시트(20)에서 다이아몬드 형태의 격자 주기가 작은 경우에 이형필름(30)을 박리할 때의 개략도를 나타낸다. 도 5에 나타난 바와 같이, p1 주기가 작은 경우에 이형필름(30)이 부착된 상태의 열전도성 시트(20)가 플라즈마 장치의 전극 부재(50)와 같은 피착면에 부착된 상태에서 이형필름(30)을 제거하게 되면, 이형필름(30)과 열전도성 시트(20)와의 접촉 면적은 넓게 되어 이형필름(30)만 열전도성 시트(20)에서 제거되지 않고 열전도성 시트(20)도 이형필름(30)의 박리에 따라 플라즈마의 전극 부재(50)의 피착면에서 들떠지게 되는 현상이 발생할 수 있고, 열전도성 시트(20)를 다시 피착면에 부착해야 되는 문제가 발생할 수 있다. Figure 5 shows a schematic diagram of peeling the release film 30 from the thermally conductive sheet 20 when the diamond-shaped lattice period is small. As shown in Figure 5, when the p1 period is small, the thermally conductive sheet 20 with the release film 30 attached is attached to the surface to be adhered, such as the electrode member 50 of the plasma device, and the release film ( When 30) is removed, the contact area between the release film 30 and the thermally conductive sheet 20 becomes larger, so that only the release film 30 is not removed from the thermally conductive sheet 20, and the thermally conductive sheet 20 is also removed from the release film. Due to the peeling of (30), a phenomenon in which the adhered surface of the plasma electrode member 50 is lifted may occur, and a problem of having to reattach the thermally conductive sheet 20 to the adhered surface may occur.
따라서, 이형필름의 다이아몬드 형태의 격자 사이의 피치를 특정 범위에 한정할 필요가 있으며, 하기에서 구체적으로 설명한다.Therefore, it is necessary to limit the pitch between the diamond-shaped lattices of the release film to a specific range, which will be described in detail below.
도 6는 본 발명의 이형필름의 단면 확대도를 나타낸다. 도 6에 나타난 것처럼, 상기 돌출부(32) 사이의 거리를 피치(p1)으로 정의하면, 상기 피치(p1)은 0.3mm 이상 3.0mm 이하인 것을 바람직하게 사용할 수 있다. Figure 6 shows an enlarged cross-section of the release film of the present invention. As shown in FIG. 6, if the distance between the protrusions 32 is defined as a pitch (p1), the pitch (p1) can preferably be 0.3 mm or more and 3.0 mm or less.
본 발명의 플라즈마의 전극 부재(50)의 피착면과 열전도성 시트(20)의 분리되는 힘은 이형필름과 열전도성 시트(20)의 분리되는 힘보다도 큰 것이 좋다. 즉, 플라즈마의 전극 부재(50)의 피착면에 이형필름이 부착된 열전도성 시트(20)를 부착하고 상기 이형필름을 열전도성 시트(20)로부터 분리할 때, 플라즈마의 전극 부재(50)의 피착면과 열전도성 시트(20)의 점착력은 이형필름과 열전도성 시트(20)의 점착력보다 큰 것이 바람직하다. 이에 따라, 플라즈마의 전극 부재(50)의 피착면에 열전도성 시트(20)는 남아 있고 이형필름은 분리되게 된다. The separation force between the adhered surface of the electrode member 50 of the plasma of the present invention and the thermally conductive sheet 20 is preferably greater than the separation force between the release film and the thermally conductive sheet 20. That is, when attaching the thermally conductive sheet 20 with a release film attached to the adhesion surface of the plasma electrode member 50 and separating the release film from the thermally conductive sheet 20, the plasma electrode member 50 It is preferable that the adhesive force between the adhered surface and the thermally conductive sheet 20 is greater than the adhesive force between the release film and the thermally conductive sheet 20. Accordingly, the thermally conductive sheet 20 remains on the adhered surface of the plasma electrode member 50 and the release film is separated.
본 발명에서 이형필름과 열전도성 시트 사이의 박리력을 PA1으로 정의하고, 플라즈마의 전극 부재의 피착면과 열전도성 시트 사이의 박리력을 PA2 로 정의할 때, PA1 < PA2를 만족해야 하며, PA1/PA2 는 0.3 이상 0.8 이하가 바람직하다. In the present invention, when the peeling force between the release film and the thermal conductive sheet is defined as PA1 and the peeling force between the adhered surface of the plasma electrode member and the thermal conductive sheet is defined as PA2, PA1 < PA2 must be satisfied, and PA1 /PA2 is preferably 0.3 or more and 0.8 or less.
한편, 이형필름에서 열전도성 시트(20)로 가압되는 압력(P)은 하기와 (식 1)과 같이 정의될 수 있다.Meanwhile, the pressure (P) applied from the release film to the thermally conductive sheet 20 can be defined as follows (Equation 1).
Figure PCTKR2022018162-appb-img-000001
(식 1)
Figure PCTKR2022018162-appb-img-000001
(Equation 1)
여기서, F는 이형필름의 상부에서 가해지는 압력이며, A는 이형필름(30)과 열전도성 시트(20)의 접촉되는 면적을 나타낸다. 즉, 피치(p1)은 3.0 mm 를 초과하는 경우에 이형필름(30)과 열전도성 시트(20)의 접촉되는 면적 A는 줄어들게 되고, 겔 가스킷의 부착 작업 등에서 가해지는 압력은 커지게 되므로 엠보싱 닷 흔적은 열전도성 시트(20)에 남게되어 바람직하지 않다. 이에 비하여, 피치(p1)은 0.3 mm 미만인 경우에 다이아몬드 형태의 격자 상부면과 열전도성 시트(20)의 일면은 접촉하는 면적은 많아지기 때문에 이형필름(30)을 제거할 때 플라즈마의 전극 부재(50)의 피착물에 부착된 열전도성 시트(20)의 일부도 박리되기 쉬워져서 바람직하지 않다.Here, F is the pressure applied from the top of the release film, and A represents the contact area between the release film 30 and the thermally conductive sheet 20. That is, when the pitch (p1) exceeds 3.0 mm, the contact area A between the release film 30 and the thermally conductive sheet 20 decreases, and the pressure applied during the attachment work of the gel gasket increases, so the embossing dot Traces remain on the thermally conductive sheet 20, which is undesirable. In contrast, when the pitch (p1) is less than 0.3 mm, the contact area between the upper surface of the diamond-shaped grid and one surface of the thermally conductive sheet 20 increases, so when removing the release film 30, the plasma electrode member ( A part of the thermally conductive sheet 20 attached to the adherend of 50) also tends to peel off, which is not desirable.
한편, 돌출부(32)의 폭(w)도 이형필름의 설계에 중요하다. 본 발명의 돌출부의 폭은 0.1mm 내지 1.5mm인 것이 바람직하다. 동일한 피치(p1)에 이형필름(30)에서 돌출부(32)의 폭(w)의 폭이 넓어지는 것은 이형필름(30)과 연성을 갖는 열전도성 시트(20)의 접촉 면적은 넓어지는 것의 의미한다. 본 발명에서는 이형필름(30)과 열전도성 시트(20)의 접촉 면적(S1)은 열전도성 시트(20)와 플라즈마 전극 부재(50)의 피착면의 접촉 면적(S2)에 비해서 들뜸 방지의 관점에서 예를 들어 돌출부(32)의 폭(w)과 피치(p1)의 비율(w/p1)은 0.3 내지 0.5를 사용할 수 있다.Meanwhile, the width w of the protrusion 32 is also important in the design of the release film. The width of the protrusion of the present invention is preferably 0.1 mm to 1.5 mm. The fact that the width (w) of the protrusion 32 in the release film 30 becomes wider at the same pitch (p1) means that the contact area between the release film 30 and the flexible thermally conductive sheet 20 becomes wider. do. In the present invention, the contact area (S1) between the release film 30 and the thermally conductive sheet 20 is compared to the contact area (S2) of the adhered surface of the thermally conductive sheet 20 and the plasma electrode member 50 from the viewpoint of preventing lifting. For example, the ratio (w/p1) between the width (w) and the pitch (p1) of the protrusion 32 may be 0.3 to 0.5.
또한, 돌출부(32)의 높이(h)는 0.05mm 내지 0.5mm인 것이 바람직하며, 돌출부(32)의 높이(h)는 0.1mm 내지 0.3mm인 것이 더욱 바람직하다. 여기서, 돌출부(32)의 높이(h)도 너무 낮게 형성되면 이형필름의 다이아몬드 형태의 격자 내부의 바닥면에 열전도성 시트(20)가 접촉할 우려가 있으므로 예를 들어 돌출부(32)의 높이(h)와 피치(p1)의 비율(h/p1)는 0.1 내지 0.2를 사용할 수 있다. Additionally, the height h of the protrusion 32 is preferably 0.05 mm to 0.5 mm, and more preferably the height h of the protrusion 32 is 0.1 mm to 0.3 mm. Here, if the height h of the protrusion 32 is formed too low, there is a risk that the thermally conductive sheet 20 may contact the bottom surface inside the diamond-shaped lattice of the release film, so for example, the height of the protrusion 32 ( The ratio (h/p1) of h) and pitch (p1) can be 0.1 to 0.2.
여기서, 이형필름의 돌출부(32)에서 상부로 갈수록 좁아지는 형상을 가질 수 있다. 도 6에 나타난 것처럼, 삼각형의 형태를 가져도 되고, 삼각형의 끝단은 곡선을 이루어도 되고, 반구 형태를 가져도 된다. 한편, 돌출부(32)의 양측 변의 이루는 각도(θ)는 1° 내지 10°, 더욱 바람직하게는 3° 내지 7°를 가질 수 있다. 상기 범위보다 작으면 이형필름(30)의 다이아몬드 형태의 격자 내부에 열전도성 시트(20)와 접촉하는 면적이 너무 넓어져서 바람직하지 않고, 상기 범위보다 크면 열전도성 시트(20)를 피착제와 접촉한 후에 경계면에서 보이드가 남을 수 있어 바람직하지 않다. Here, the protrusion 32 of the release film may have a shape that becomes narrower toward the top. As shown in Figure 6, it may have a triangular shape, the end of the triangle may be curved, or it may have a hemispherical shape. Meanwhile, the angle θ formed by both sides of the protrusion 32 may range from 1° to 10°, and more preferably from 3° to 7°. If it is smaller than the above range, the area in contact with the thermally conductive sheet 20 inside the diamond-shaped lattice of the release film 30 becomes too large, which is undesirable. If it is larger than the above range, the thermally conductive sheet 20 is in contact with the adherend. This is undesirable because voids may remain at the boundary after processing.
또한, 상기 이형필름(30)의 두께를 k1, 오목부(33)의 들어간 깊이를 k2라고 정의하면, k1은 k2보다 큰 것을 사용하는 것이 바람직하다. 예를 들어, 상기 이형필름(30)의 두께를 k1은 0.01mm 내지 0.1mm를 사용하고, 오목부(33)의 들어간 깊이를 k2는 0.05mm 내지 0.5mm를 사용하는 것이 바람직하다. 상기 범위보다 작게 되면 돌출부(32)가 이형필름(30)의 두께에 비하여 너무 많이 돌출되기 때문에 열전도성 시트(20)에 과다한 압력을 가해지게 되어 엠보싱 닷 흔적은 열전도성 시트(20)에 남게되기 쉬워진다. In addition, if the thickness of the release film 30 is defined as k1 and the depth of the concave portion 33 is defined as k2, it is preferable to use k1 larger than k2. For example, it is preferable that the thickness of the release film 30, k1, is 0.01 mm to 0.1 mm, and the depth of the recessed portion 33, k2, is 0.05 mm to 0.5 mm. If it is smaller than the above range, the protrusion 32 protrudes too much compared to the thickness of the release film 30, so excessive pressure is applied to the thermal conductive sheet 20, and traces of embossing dots remain on the thermal conductive sheet 20. It gets easier.
도 7은 본 발명의 이형필름을 구비한 포장 박스의 개략도를 나타낸다. 도 7에 나타난 것처럼, 겔 가스킷용 필름용 포장 박스는 겔 가스킷용 필름(100)이 복수개 적층되어 있는 트레이(500)를 구비한다. Figure 7 shows a schematic diagram of a packaging box equipped with the release film of the present invention. As shown in FIG. 7, the packaging box for the gel gasket film includes a tray 500 in which a plurality of gel gasket films 100 are stacked.
여기서, 상기 상부 이형필름(40)은 1매의 필름으로 이루어지게 할 수 있다. 겔 가스킷용 필름(100) 각각에 대하여 상부 이형필름을 개별적으로 부착하여 사용하여도 된다. 다만, 상기 상부 이형필름(40)을 1매의 필름으로 사용함으로써, 상부 이형필름(40)을 점착력 있는 열전도성 시트(20)에서 분리할 때 열전도성 시트(20)에 부착시 가해질 수 있는 불필요한 가압의 편차를 최소화할 수 있는 장점을 갖는다. Here, the upper release film 40 may be made of one film. The upper release film may be individually attached to each of the gel gasket films 100 and used. However, by using the upper release film 40 as a single film, when the upper release film 40 is separated from the adhesive thermally conductive sheet 20, unnecessary material that may be applied when attached to the thermally conductive sheet 20 is eliminated. It has the advantage of minimizing the variation in pressurization.
도 8은 본 발명의 겔 가스킷용 필름(100) 부착 방법의 플로우 차트를 나타낸다. 도 8에 나타난 것처럼, 겔 가스킷용 필름(100)을 부착하는 방법은 상부 이형필름(40)을 열전도성 시트(20)의 일면으로부터 분리하는 제1 단계; 상기 열전도성 시트(20)를 기저필름(10)에서 분리하는 제2 단계; 상기 열전도성 시트(20)의 일면을 피착면에 부착하는 제3 단계; 상기 열전도성 시트(20)의 타면에 부착된 하부 이형필름(30)을 분리하는 제4 단계;를 포함한다.Figure 8 shows a flow chart of the method for attaching the film 100 for a gel gasket of the present invention. As shown in Figure 8, the method of attaching the gel gasket film 100 includes a first step of separating the upper release film 40 from one surface of the thermally conductive sheet 20; A second step of separating the thermally conductive sheet 20 from the base film 10; A third step of attaching one side of the thermally conductive sheet 20 to the adherend surface; It includes a fourth step of separating the lower release film 30 attached to the other surface of the thermally conductive sheet 20.
상기 제1 단계는 상부 이형필름(40)을 열전도성 시트(20)의 일면으로부터 분리하는 단계로서, 복수개가 열전도성 시트에서 한매의 상부 이형필름을 사용하는 경우 상부 이형필름을 열전도성 시트에서 분리한다. The first step is a step of separating the upper release film 40 from one side of the thermally conductive sheet 20. When a single upper release film is used in a plurality of thermally conductive sheets, the upper release film is separated from the thermally conductive sheet. do.
상기 제2 단계는 상기 열전도성 시트(20)를 기저필름(10)에서 분리하는 단계로 열전도성 시트과 하부 이형필름을 기저필름으로부터 분리하는 것이며, 하부 이형필름과 기저필름 사이에는 점착력은 마찰력에 의한 것이며, 열전도성 시트와 하부 이형필름의 박리력은 하부 이형필름과 기저필름의 박리력보다 크기 때문에 상기 하부 이형필름을 기저필름으로부터 쉽게 분리된다. The second step is to separate the thermally conductive sheet 20 from the base film 10, and the thermally conductive sheet and the lower release film are separated from the base film, and the adhesive force between the lower release film and the base film is caused by friction force. Since the peeling force of the thermal conductive sheet and the lower release film is greater than that of the lower release film and the base film, the lower release film is easily separated from the base film.
상기 제3 단계는 상기 열전도성 시트(20)의 일면을 피착면에 부착하는 단계이며, 피착면, 열전도성 시트, 하부 이형필름의 순서로 적층되어 있다. The third step is a step of attaching one side of the thermally conductive sheet 20 to the adhered surface, and the adhered surface, the thermally conductive sheet, and the lower release film are laminated in that order.
상기 제4 단계는 피착면에 상기 열전도성 시트(20)가 부착된 상태로 상기 열전도성 시트(20)의 타면에 부착된 하부 이형필름(30)을 분리하는 단계이다. 여기서, 열전도성 시트와 하부 이형필름의 박리력은 열전도성 시트와 피착면의 박리력(PA2)보다 작기 때문에 열전도성 시트가 피착면에 부착되어 있는 상태로 하부 이형필름은 피착면으로부터 분리된다. The fourth step is a step of separating the lower release film 30 attached to the other side of the thermally conductive sheet 20 while the thermally conductive sheet 20 is attached to the adhered surface. Here, since the peeling force of the thermally conductive sheet and the lower release film is smaller than the peeling force (PA2) of the thermally conductive sheet and the adhered surface, the lower release film is separated from the adhered surface while the thermally conductive sheet is attached to the adhered surface.
(실시예)(Example)
실시예 1 내지 4, 비교예 1 내지 4에서 이형필름의 피치(mm), 돌출부 폭(mm), 돌출부 높이(mm)를 사용한 경우에 열전도성 시트와 이형필름의 박리력(PA1)과 열전도성 시트와 Si 전극부재의 박리력(PA2)을 구하고, 작업성을 평가하였다.Peeling force (PA1) and thermal conductivity of the thermal conductive sheet and the release film when the pitch (mm), protrusion width (mm), and protrusion height (mm) of the release film were used in Examples 1 to 4 and Comparative Examples 1 to 4. The peeling force (PA2) between the sheet and the Si electrode member was determined, and workability was evaluated.
구분division 실시예1Example 1 실시예2Example 2 실시예3Example 3 실시예4Example 4 비교예1Comparative Example 1 비교예2Comparative example 2 비교예3Comparative example 3 비교예4Comparative example 4
피치(mm)Pitch (mm) 0.30.3 1.01.0 2.02.0 3.03.0 0.10.1 1.01.0 2.02.0 4.04.0
돌출부 폭
(mm)protrusion width
(mm) 		0.10.1 0.50.5 1.01.0 1.51.5 0.10.1 0.050.05 1.01.0 2.02.0
돌출부
높이(mm)projection part
Height (mm) 		0.050.05 0.10.1 0.30.3 0.50.5 0.050.05 0.10.1 0.030.03 1.01.0
PA1(gf)PA1(gf) 20.620.6 30.530.5 37.937.9 47.747.7 10.310.3 50.550.5 52.152.1 55.255.2
PA2(gf)PA2(gf) 58.958.9 60.460.4 61.261.2 62.862.8 50.250.2 60.960.9 62.062.0 64.264.2
PA1/PA2PA1/PA2 0.350.35 0.500.50 0.620.62 0.760.76 0.210.21 0.830.83 0.840.84 0.860.86
작업성Workability OKOK OKOK OKOK OKOK NGNG NGNG NGNG NGNG
도 9는 박리력 측정방법의 개략도를 나타내고, 도 10은 피착면에 열전도성 시트가 부착된 상태에서 이형필름을 박리할 때, 이형필름을 박리해도 열전도성 시트가 피착면에 붙여져 있는 작업성 OK의 상태 및 이형필름을 박리하면 열전도성 시트는 피착면에서 일부 또는 전부가 떨어져 작업성 NG의 상태의 사진을 나타낸다. 상기 작업성에 따라서 본 발명의 겔 가스킷용 필름의 상태를 확인할 수 있다. Figure 9 shows a schematic diagram of the peeling force measurement method, and Figure 10 shows that when peeling off the release film with a thermally conductive sheet attached to the adhered surface, the workability is OK as the thermally conductive sheet remains attached to the adhered surface even after the release film is peeled off. When the release film is peeled off, part or all of the thermally conductive sheet falls off from the adhered surface, showing a picture of NG workability. Depending on the workability, the condition of the film for a gel gasket of the present invention can be confirmed.
박리력 측정방법은 인장강도 시험기 Instron 3367에 1 kg 로드셀을 설치하여 ASTM D3330 규격으로 90° peel test 방법으로 측정하였다. The peel force was measured using a 90° peel test method according to ASTM D3330 standards by installing a 1 kg load cell in a tensile strength tester Instron 3367.
본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.The present invention is not limited to the above-mentioned embodiments, but can be manufactured in various different forms, and those skilled in the art may recognize other specific forms without changing the technical idea or essential features of the present invention. You will be able to understand that this can be implemented. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

Claims (10)

  1. 기저필름;base film;
    상기 기저필름 상에 적층된 하부 이형필름;a lower release film laminated on the base film;
    상기 하부 이형필름 상에 적층된 열전도성 시트;A thermally conductive sheet laminated on the lower release film;
    상기 열전도성 시트의 상부에 적층된 상부 이형필름;을 포함하며,It includes an upper release film laminated on top of the thermally conductive sheet,
    상기 하부 이형필름 및 상부 이형필름은 상기 열전도성 시트과 마주보는 일면에 돌출부를 형성하는 엠보싱 이형필름인 것을 특징으로 하는 겔 가스킷용 필름. A film for a gel gasket, wherein the lower release film and the upper release film are embossed release films that form a protrusion on one surface facing the thermally conductive sheet.
  2. 기저필름;base film;
    상기 기저필름 상에 적층된 열전도성 시트;A thermally conductive sheet laminated on the base film;
    상기 열전도성 시트의 상부에 적층된 상부 이형필름;을 포함하며,It includes an upper release film laminated on top of the thermally conductive sheet,
    상기 상부 이형필름은 상기 열전도성 시트과 마주보는 일면에 돌출부를 형성하는 엠보싱 이형필름인 것을 특징으로 하는 겔 가스킷용 필름. A film for a gel gasket, wherein the upper release film is an embossed release film forming a protrusion on one surface facing the thermally conductive sheet.
  3. 청구항 1에 있어서,In claim 1,
    상기 하부 이형필름은 본체부를 구비하고, 하기 i) 또는 ii)를 만족하는 것을 특징으로 하는 겔 가스킷용 필름. A film for a gel gasket, wherein the lower release film has a main body and satisfies i) or ii) below.
    i) 상기 본체부 상부에 형성된 돌출부i) a protrusion formed on the upper part of the main body
    ii) 상기 본체부 상부에 형성된 돌출부 및 상기 본체부 하부에 형성된 오목부ii) a protrusion formed in the upper part of the main body and a concave part formed in the lower part of the main body
  4. 청구항 3에 있어서,In claim 3,
    상기 상부 이형필름과 상기 열전도성 시트 사이의 박리력을 PA1으로 정의하고, 상기 열전도성 시트와 상기 플라즈마 장치의 전극 부재의 피착면 사이의 박리력을 PA2 로 정의할 때, PA1 < PA2를 만족하는 것을 특징으로 하는 겔 가스킷용 필름. When the peeling force between the upper release film and the thermally conductive sheet is defined as PA1, and the peeling force between the thermally conductive sheet and the adhered surface of the electrode member of the plasma device is defined as PA2, PA1 < PA2 is satisfied. A film for a gel gasket, characterized in that.
  5. 청구항 4에 있어서,In claim 4,
    PA1/PA2 는 0.3 이상 0.8 이하인 것을 특징으로 하는 겔 가스킷용 필름. A film for a gel gasket, wherein PA1/PA2 is 0.3 or more and 0.8 or less.
  6. 청구항 3에 있어서,In claim 3,
    상기 돌출부 사이의 거리를 피치(p1)으로 정의하면, p1은 0.3mm 이상 3.0mm 이하인 것을 특징으로 하는 겔 가스킷용 필름. If the distance between the protrusions is defined as a pitch (p1), p1 is a film for a gel gasket, characterized in that p1 is 0.3 mm or more and 3.0 mm or less.
  7. 청구항 3에 있어서,In claim 3,
    상기 하부 이형필름의 두께를 k1, 오목부의 들어간 깊이를 k2라고 정의하면, k1은 k2보다 큰 것을 특징으로 하는 겔 가스킷용 필름. If the thickness of the lower release film is defined as k1 and the depth of the concave portion is defined as k2, then k1 is a film for a gel gasket, characterized in that k2 is greater than k2.
  8. 청구항 1에 기재된 겔 가스킷용 필름이 복수개가 일정 간격 이격되어 병렬로 적층된 트레이를 포함하는 겔 가스킷용 필름용 포장 박스.A packaging box for a gel gasket film, including a tray in which a plurality of gel gasket films according to claim 1 are stacked in parallel at regular intervals.
  9. 청구항 8에 있어서,In claim 8,
    상기 상부 이형필름은 한매의 필름으로 이루어져 상기 트레이 상에 복수개의 겔 가스킷용 필름 상에 부착 가능하도록 형성된 것을 특징으로 하는 겔 가스킷용 필름용 포장 박스.A packaging box for a gel gasket film, wherein the upper release film is made of a single film and is formed to be attached to a plurality of gel gasket films on the tray.
  10. 상부 이형필름을 분리하는 제1 단계;A first step of separating the upper release film;
    열전도성 시트를 기저필름에서 분리하는 제2 단계;A second step of separating the thermally conductive sheet from the base film;
    상기 열전도성 시트를 피착면에 부착하는 제3 단계;A third step of attaching the thermally conductive sheet to the adherend surface;
    하부 이형 필름을 분리하는 제4 단계;를 포함하는 것을 특징으로 하는 겔 가스킷용 필름으로 피착면에 부착하는 방법. A method of attaching a gel gasket film to an adherend surface, comprising: a fourth step of separating the lower release film.
PCT/KR2022/018162 2022-03-29 2022-11-17 Gel gasket film and packaging box comprising same WO2023191230A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013053295A (en) * 2011-08-09 2013-03-21 Sekisui Chem Co Ltd Double-sided adhesive sheet
KR20180017585A (en) * 2016-08-10 2018-02-21 주식회사 엘지화학 Sub-gasket film for fuel cell comprising the same, membrane electrode assembly comprising the same and fuel cell stack comprising the same
CN210560226U (en) * 2019-08-17 2020-05-19 苏州汇美包装制品有限公司 Easily-laminated heat-conducting silica gel gasket
JP6739478B2 (en) * 2018-07-18 2020-08-12 デクセリアルズ株式会社 Method for manufacturing heat conductive sheet
CN111607364A (en) * 2020-06-03 2020-09-01 彗晶新材料科技(深圳)有限公司 Graphene heat conduction material, preparation method thereof and electronic equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990009303A (en) 1997-07-09 1999-02-05 윤종용 Waffle-packed trays for handling bare chips
JP4137146B2 (en) 2006-07-21 2008-08-20 トヨタ自動車株式会社 gasket
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
KR101934679B1 (en) 2018-08-08 2019-01-02 김용훈 Method for attaching gasket

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013053295A (en) * 2011-08-09 2013-03-21 Sekisui Chem Co Ltd Double-sided adhesive sheet
KR20180017585A (en) * 2016-08-10 2018-02-21 주식회사 엘지화학 Sub-gasket film for fuel cell comprising the same, membrane electrode assembly comprising the same and fuel cell stack comprising the same
JP6739478B2 (en) * 2018-07-18 2020-08-12 デクセリアルズ株式会社 Method for manufacturing heat conductive sheet
CN210560226U (en) * 2019-08-17 2020-05-19 苏州汇美包装制品有限公司 Easily-laminated heat-conducting silica gel gasket
CN111607364A (en) * 2020-06-03 2020-09-01 彗晶新材料科技(深圳)有限公司 Graphene heat conduction material, preparation method thereof and electronic equipment

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