WO2023179681A1 - 一种处理盒及安装在处理盒上的芯片支架 - Google Patents

一种处理盒及安装在处理盒上的芯片支架 Download PDF

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Publication number
WO2023179681A1
WO2023179681A1 PCT/CN2023/083126 CN2023083126W WO2023179681A1 WO 2023179681 A1 WO2023179681 A1 WO 2023179681A1 CN 2023083126 W CN2023083126 W CN 2023083126W WO 2023179681 A1 WO2023179681 A1 WO 2023179681A1
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WO
WIPO (PCT)
Prior art keywords
electrical contact
frame
wall surface
contact portion
process cartridge
Prior art date
Application number
PCT/CN2023/083126
Other languages
English (en)
French (fr)
Inventor
曾丽坤
梁祺杰
武新宇
王常彪
Original Assignee
珠海纳思达信息技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海纳思达信息技术有限公司 filed Critical 珠海纳思达信息技术有限公司
Publication of WO2023179681A1 publication Critical patent/WO2023179681A1/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
    • G03G21/16—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements
    • G03G21/18—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements using a processing cartridge, whereby the process cartridge comprises at least two image processing means in a single unit

Definitions

  • the present invention relates to the technical field of imaging equipment, and in particular to a process box and a chip holder installed on the process box.
  • a configuration in which a photosensitive member and a processing member that can act on the photosensitive member are integrally assembled into a unit as a process cartridge, and the process cartridge can be installed in the imaging apparatus and Detachable from the imaging device.
  • the maintenance operation can be performed by the user himself in the case of running out of toner or in the case of damage to the processing member, and therefore the maintenance performance can be significantly improved.
  • JP-A 2004-37876 the electrical contact part and the storage part are flush with each other, and a protrusion protruding in the mounting direction of the process cartridge is provided.
  • the contact member contacts the external member before the storage portion, and thus avoids breakage of the storage portion due to collision between the external member and the storage portion.
  • the storage part and the electrical contact part are provided on the same plane, and therefore the degree of freedom of arrangement is low, and the need for easy installation or disassembly cannot be met.
  • a process cartridge detachably mounted on an image forming apparatus including: a frame having a first wall surface; a photosensitive member rotatably supported by the frame; and an electrical contact portion mounted on the a frame and for electrical connection with the imaging device; a storage portion electrically connected with the electrical contact portion and configured to store information related to the process cartridge; the storage portion is located at the electrical contact portion toward the process cartridge one side; viewed along the normal direction of the first wall surface, the projected size of the storage portion is smaller than the projected size of the electrical contact portion; and/or viewed along the normal direction of the first wall surface , in the axial direction of the photosensitive member, the projection of the storage portion is located within the projection range of the electrical contact portion.
  • the projection range of the electrical contact in the axial direction of the photosensitive member is 3.5 mm to 5.5 mm when viewed along the normal direction of the first wall surface.
  • the frame includes a developing frame and a photosensitive frame; the electrical contact part and the storage part are jointly provided on the developing frame or the photosensitive frame.
  • the storage portion is located outside the range of the gap between the photosensitive frame and the developing frame.
  • the storage part includes a first substrate, the electrical contact part is provided on a second substrate, and a plane where the first substrate is located intersects a plane where the second substrate is located.
  • the electrical contact is disposed on a surface of the second substrate and parallel to the first wall surface; a wafer is disposed on the first substrate, and the cross section of the wafer is consistent with the first wall surface. The planes on which the electrical contacts are located intersect.
  • the electrical contact portion and the storage portion are electrically connected through a flexible conductive medium.
  • the developing frame or photosensitive frame includes an end cap to which the electrical contacts and storage are mounted.
  • a chip holder installed on a process box is provided.
  • the chip holder is used to install and fix the electrical contact part and the storage part on the process box.
  • the process box is as described above. any of the above.
  • the chip support and the frame are provided separately or integrally formed.
  • the process box of the present invention can protect the storage part well and avoid damage to the storage part due to collision between external components and the storage part.
  • Figure 1 is an overall structural diagram of a process box according to Embodiment 1 of the present invention.
  • Figure 2 is a cross-sectional view of the process box according to Embodiment 1 of the present invention.
  • Figure 3 is an overall structural diagram of the process box from another angle according to Embodiment 1 of the present invention.
  • Figure 4 is an enlarged schematic diagram of point A in Figure 3;
  • Figure 5 is a schematic structural diagram of the chip of the process box according to Embodiment 1 of the present invention.
  • Figure 6 is a schematic diagram of the process box viewed from the Z direction according to Embodiment 1 of the present invention.
  • Figure 7 is an enlarged schematic diagram of B in Figure 6;
  • Figure 8 is a schematic diagram of the chip of the process box viewed from the Z direction according to Embodiment 1 of the present invention.
  • Figure 9 is a structural diagram of the chip holder of the process box according to Embodiment 1 of the present invention.
  • Figure 10 is a schematic diagram of the chip and chip holder installation of the process box according to Embodiment 1 of the present invention.
  • Figure 11 is a partially exploded view of the process box according to Embodiment 1 of the present invention.
  • Figure 12 is a cross-sectional view of the chip position of the process cartridge according to Embodiment 1 of the present invention.
  • Figure 13 is an overall structural diagram of the process box according to Embodiment 2 of the present invention.
  • Figure 14 is an enlarged schematic diagram of position C in Figure 11;
  • Figure 15 is a schematic structural diagram of the chip of the process box according to Embodiment 2 of the present invention.
  • Figure 16 is a partial schematic diagram of the process box viewed from the Z direction according to Embodiment 2 of the present invention.
  • Figure 17 is an enlarged schematic diagram of D in Figure 16;
  • Figure 18 is a schematic diagram of the chip of the process box viewed from the Z direction in Embodiment 2 of the present invention.
  • Figure 19 is a schematic structural diagram of the chip holder of the process box of the second embodiment of the present invention from one angle;
  • Figure 20 is a schematic structural diagram of the chip holder of the process box of the second embodiment of the present invention from another angle;
  • Figure 21 is a schematic diagram of the chip and chip holder installation of the process box according to Embodiment 2 of the present invention.
  • Figure 22 is a partially exploded view of the process box according to Embodiment 2 of the present invention.
  • Figure 23 is a schematic diagram of the overall structure of the process box from one angle according to Embodiment 3 of the present invention.
  • Figure 24 is a schematic diagram of the overall structure of the process box from another angle according to Embodiment 3 of the present invention.
  • Figure 25 is an enlarged schematic diagram of E in Figure 24;
  • Figure 26 is a schematic structural diagram of the chip of the process box according to Embodiment 3 of the present invention.
  • Figure 27 is a partial schematic diagram of the process box viewed from the Z direction in Embodiment 3 of the present invention.
  • Figure 28 is an enlarged schematic diagram of F in Figure 27;
  • Figure 29 is a schematic structural diagram of the chip holder of the process box according to Embodiment 3 of the present invention.
  • Figure 30 is a partially exploded view of the process box of Embodiment 3 of the present invention.
  • Figure 31 is a schematic diagram of the overall structure of the process box according to Embodiment 4 of the present invention.
  • Figure 32 is a partial schematic diagram of the process box viewed from the Z direction in Embodiment 4 of the present invention.
  • Figure 33 is an enlarged schematic diagram of G in Figure 32;
  • Figure 34 is a schematic structural diagram of the chip of the process box according to Embodiment 4 of the present invention.
  • Figure 35 is a schematic diagram of the chip of the process box according to Embodiment 4 of the present invention viewed from the Z direction;
  • Figure 36 is a schematic diagram of the end cover and chip installation of the process box according to Embodiment 4 of the present invention.
  • the terms “installation”, “connection”, “fixing” and other terms should be understood in a broad sense.
  • it can be a fixed connection, a detachable connection, or an integrated connection.
  • It can be mechanically connected or electrically connected or can communicate with each other; it can be directly connected or Indirect connection through an intermediary may be an internal connection between two elements or an interactive relationship between two elements, unless otherwise expressly limited.
  • a first feature being “on” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. touch.
  • the terms “above”, “above” and “above” the first feature is above the second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature.
  • "Below”, “below” and “beneath” the first feature to the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature has a smaller horizontal height than the second feature.
  • references to the terms “one embodiment,” “some embodiments,” “examples,” “specific examples,” or “some examples” or the like means that specific features, structures, or structures are described in connection with the embodiment or example. , materials or features are included in at least one embodiment or example of the invention. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification unless they are inconsistent with each other.
  • Electronic imaging devices form images on recording materials using, for example, electrophotographic imaging processes.
  • Electronic imaging equipment includes, for example, electrophotographic copiers, electrophotographic printers (LED printers, laser printers, etc.), electrophotographic printer-type fax machines, and the like.
  • a process cartridge is detachably installed in an electronic imaging apparatus and includes a photosensitive member, a developing member for developing an electrostatic latent image formed on the photosensitive member, and the like.
  • the electronic imaging device includes a driving head, which is used to transmit the driving force of the electronic imaging device to the process cartridge to make the process cartridge work.
  • this embodiment provides a process cartridge, which includes a frame, a toner bin assembly, a waste toner bin assembly, a drive unit 30 , a chip 40 and a chip holder 50 .
  • the frame includes a developing frame 10 and a photosensitive frame 20 .
  • the powder bin assembly includes a powder bin 11 for storing toner, a developing roller 12 , a powder knife 13 and a stirring frame 14 installed in the powder bin 11 .
  • the waste toner bin assembly includes a waste toner bin 21 for collecting waste toner, a photosensitive drum 22, a charging roller 23, and a cleaning blade 24.
  • the developing frame 10 surrounds a toner bin 11 for storing toner.
  • the developing frame 10 is generally in the shape of a long box, and has end surfaces at both ends in the length direction.
  • the developing frame 10 may be provided with a powder adding port through which toner is replenished into the toner bin 11 .
  • the powder adding port may be provided on one end face of the developing frame 10 .
  • the stirring frame 14 and the developing roller 12 are rotatably supported at both ends of the length direction of the developing frame 10.
  • the stirring frame 14 and the developing roller 12 can rotate under the action of the driving unit 30.
  • the axial directions of the stirring frame 14 and the developing roller 12 are both along the The length direction of the developing frame 10 .
  • the toner in the powder bin 11 passes through the mixing rack 14 Stir to prevent the toner in the powder bin 11 from agglomerating. At the same time, the toner can also be transported toward the developing roller 12 and be adsorbed by the charged developing roller 12 .
  • the photosensitive frame 20 surrounds a waste toner bin 21 for collecting waste toner.
  • the photosensitive frame 20 also has a length direction, and its length direction is consistent with the length direction of the developing frame 10.
  • the photosensitive drum 22 is rotatably supported. At both ends of the photosensitive frame 20 in the length direction, the axial direction of the photosensitive drum 22 coincides with the length direction of the photosensitive frame 20 .
  • a coordinate system is established as shown in FIG. 3 , in which the axial direction of the photosensitive drum 22 is the X-axis direction, the direction perpendicular to the axial direction X of the photosensitive drum 22 is the Y-direction, and the X-axis direction is ,
  • the direction perpendicular to the Y-axis direction is the Z-axis direction.
  • the plane formed by the X-axis and the Y-axis is the XY plane
  • the plane formed by the Y-axis and the Z-axis is the YZ plane
  • the plane formed by the X-axis and the Z-axis is the XZ plane.
  • the photosensitive frame 20 has a first wall surface 20a.
  • the first wall surface 20a is located on the XY plane.
  • the first wall surface 20a has a mounting position 20a1 combined with the chip holder 50.
  • the first wall surface 20a The normal direction of surface 20a is along the Z-axis direction.
  • the waste toner bin 21 is arranged along the length direction of the photosensitive frame 20 , and is located on one side of the photosensitive drum 22 .
  • the toner adsorbed by the developing roller 12 transfers the toner to the photosensitive drum 22 through the potential difference between the developing roller 12 and the photosensitive drum 22.
  • the cleaning blade 24 makes linear contact with the photosensitive drum 22 to clean the surface of the photosensitive drum 22 that has not been completely transferred.
  • Toner that is, waste toner, is stored in the waste toner bin 21 after cleaning.
  • the charging roller 23 is used to charge the surface of the photosensitive drum 22 with uniform charge, so that the photosensitive drum 22 can absorb toner.
  • gaps 60 between some parts of the photosensitive frame 20 and some parts of the developing frame 10 which are not completely fitted. As shown in FIG. 3 , there are gaps 60 between the photosensitive frame 20 and the developing frame 10 in the Y direction.
  • the driving unit 30 is located outside the end surface of the frame in the length direction. Specifically, it can be located outside one or both end surfaces of the developing frame 10 in the length direction, or it can also be located at one or both ends of the photosensitive frame 20 in the length direction. outside of the end face.
  • the driving unit 30 is used to receive and transmit the driving force of the imaging device (such as a laser printer) to operate the process cartridge.
  • the driving unit 30 may include a power receiving member and a gear set, thereby receiving and transmitting the driving force of the imaging device to drive the photosensitive drum 22, the developing roller 12, the stirring rack 14, etc. to rotate.
  • the photosensitive frame 20 may also include an end cover.
  • the end cover is disposed outside the end face in the length direction of the photosensitive frame 20 to cover part or all of the gear of the drive unit 30 in the end cover for protection.
  • the end cover may It is provided integrally with the photosensitive frame 20, or it can be a separate structure, and is fixedly installed on the photosensitive frame 20 by welding, pasting, buckling, plugging or other methods.
  • the developing frame 10 may include an end cover, and the end cover may be disposed outside the end surface of the developing frame 10 in the length direction.
  • the chip 40 includes a storage portion 41 electrically connected to the electrical contact portion 42 through a flexible conductive medium 43 and an electrical contact portion 42 configured to store information related to the process cartridge.
  • the electrical contacts 42 are electrically connected to the imaging device, thereby establishing a core.
  • the tablet 40 communicates with the imaging device.
  • the flexible conductive medium 43 may be a conductive cable or a conductive foil.
  • the storage part 41 is connected to the electrical contact part 42 through a flexible conductive medium 43, so that the position of the storage part 41 can be set more flexibly.
  • the storage part 41 includes a first substrate 411 and a wafer 412 and a battery 413 provided on the first substrate 411 .
  • the first substrate 411 is a rectangular plate-shaped member.
  • the wafer 412 and the battery 413 are disposed on one surface of the first substrate 411 .
  • the shape of the wafer 412 is generally a protrusion with an arc surface.
  • the electrical contact portion 42 is provided on one surface of the second substrate 421.
  • the number of the electrical contact portions 42 is two.
  • the electrical contact portion 42 is provided facing away from the process cartridge, that is, it is provided on the surface of the second substrate 421 away from the process cartridge.
  • the second substrate 421 is arranged parallel to the first wall surface 20a, that is, the electrical contact portion 42 is also parallel to the first wall surface 20a.
  • the plane where the first substrate 411 is located intersects the plane where the second substrate 421 is located.
  • the first substrate 421 is located parallel to the first wall surface 20a.
  • the plane where 411 is located is perpendicular to the plane where the second substrate 421 is located, that is, the first substrate 411 is perpendicular to the first wall surface 20a.
  • the angle between the plane where the first substrate 411 is located and the plane where the second substrate 421 is located is an acute angle or an obtuse angle.
  • the cross-section of the wafer 412 parallel to the plane where the first substrate 411 is located is a circular cross-section, and the plane where the circular cross-section is located intersects the plane where the electrical contact portion 42 is located.
  • the cross-section of the wafer 412 is ( circular cross-section) perpendicular to the plane in which the electrical contact 42 is located and also perpendicular to the first wall surface 20a.
  • the angle between the cross section of the wafer 412 and the plane where the electrical contact portion 42 is located is an acute angle or an obtuse angle.
  • the chip holder 50 is used to install and fix the chip 40 , and the chip holder 50 is detachably connected to the photosensitive frame 20 .
  • the photosensitive frame 20 has a first wall surface 20a.
  • the first wall surface 20a has a mounting position 20a1 combined with the chip holder 50.
  • the mounting position 20a1 is a hole or groove formed on the first wall surface 20a.
  • the chip holder A part of 50 is inserted into the photosensitive frame 20 from the hole or slot and fixed on the photosensitive frame 20, so that the chip 40 is installed on the photosensitive frame 20, that is, the storage part 41 and the electrical contact part 42 of the chip 40 are both located on the photosensitive frame. 20 on.
  • the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 20a, the electrical The contact portion 42 is located outside the first wall surface 20a, and the electrical contact portion 42 is completely exposed outside the first wall surface 20a. Electrical contact 42 is generally parallel to first wall surface 20a. A part of the storage part 41 may be inserted into the hole or groove on the first wall surface 20a, and part of the storage part 41 may be exposed on the first wall surface 20a, or the entire storage part 41 may be inserted into the hole or groove on the first wall surface 20a.
  • the storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 20a and does not protrude beyond the electrical contact portion 42. Therefore, the electrical contact portion 42 can shield the storage portion 41 to avoid external components. Collision storage unit 41.
  • the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 .
  • the area of the observable portion of the storage portion 41 is its projected size S1
  • the area of the observable portion of the electrical contact portion 42 is its projected size S2.
  • the projected size S1 of the storage portion 41 (area ) is smaller than the projected size S2 (area) of the electrical contact 42 .
  • the projection of the storage portion 41 is within the projection range of the electrical contact portion 42 .
  • the projections of the storage portion 41 and the electrical contact portion 42 are located on the XY plane. In the X-axis direction, the projection D1 of the storage portion 41 completely falls within the range of the projection D2 of the electrical contact portion 42 .
  • the projection range of the electrical contact portion 42 in the X-axis direction is 3.5mm-5.5mm, and the projection D1 of the storage portion 41 in the X-axis direction is smaller than that of the electrical contact portion 42 in the X-axis direction.
  • the projection D2 completely falls within the projection range of the electrical contact portion 42 .
  • the electrical contact portion 42 can effectively shield the storage portion 41 , thereby preventing external components from colliding with the storage portion 41 and causing damage to the storage portion 41 .
  • the chip holder 50 includes a main body, and the main body is provided with a first mounting part 51 , a second mounting part 52 , a first clamping part 53 and a second clamping part 54 .
  • the first mounting part 51 is used to install the electrical contact part 42 of the chip 40
  • the second mounting part 52 is used to install the storage part 41
  • the first clamping part 53 and the second clamping part 54 are used to connect with the photosensitive frame 20 snap, thereby installing the chip holder 50 on the photosensitive frame 20 .
  • the first mounting part 51 is located on the side of the main body away from the process cartridge, and the second mounting part 52 is located inside the first mounting part 51 .
  • the first engaging portion 53 and the second engaging portion 54 are located at both ends of the main body in the Y direction.
  • One of the first engaging portions 53 is a protrusion and the other is an elastic arm.
  • the elastic arm is also provided with a engaging portion. Bit raised.
  • the storage portion 41 of the chip 40 can be installed into the second mounting portion 52 first, and the electrical contact portion 42 of the chip 40 can be installed into the first mounting portion 51 , that is, first
  • the chip 40 is mounted to the chip holder 50 , and then the chip holder 50 together with the chip 40 is mounted to the photosensitive frame 20 . It is easy to meet the requirement of convenient installation or removal of the chip 40 as a whole.
  • the chip 40 and the chip holder 50 are installed on the photosensitive frame 20 , the storage part 41 is surrounded by the photosensitive frame 20 , and the entire chip 40 is located in the gap 60 between the photosensitive frame 20 and the developing frame 10 , will not be exposed in the gap 60 between the photosensitive frame 20 and the developing frame 10 , and some external components can be prevented from colliding with the storage portion 41 from the gap 60 .
  • the chip holder 50 may also be integrally provided with the photosensitive frame 20 .
  • This embodiment provides another process cartridge.
  • the difference from Embodiment 1 is that the chip 40 and the chip holder 50 of this embodiment are installed on the developing frame 10 .
  • the developing frame 10 has a first wall surface 10a, the first wall surface 10a is located on the XY plane, and the first wall surface 10a has an installation position combined with the chip holder 50 10a1, the normal direction of the first wall surface 10a is along the Z-axis direction.
  • the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 10a, the electrical The contact portion 42 is located outside the first wall surface 10a, and the electrical contact portion 42 is completely exposed outside the first wall surface 10a. Electrical contact 42 is generally parallel to first wall surface 10a. A part of the storage part 41 may be inserted into the installation position 10a1 on the first wall surface 10a, and part of the storage part 41 may be exposed on the first wall surface 10a, or the entire storage part 41 may be inserted into the installation position 10a1 on the first wall surface 10a.
  • the storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 10a and does not protrude beyond the electrical contact portion 42. Therefore, the electrical contact portion 42 can shield the storage portion 41 to avoid external components. Collision storage unit 41.
  • the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 .
  • the area of the observable portion of the storage portion 41 is its projected size S1
  • the area of the observable portion of the electrical contact portion 42 is its projected size S2.
  • the projected size S1 (area) of the portion 41 is smaller than the projected size S2 (area) of the electrical contact portion 42 .
  • the projection of the storage portion 41 is within the projection range of the electrical contact portion 42 .
  • the projections of the storage portion 41 and the electrical contact portion 42 are located on the XY plane. In the X-axis direction, the projection D1 of the storage portion 41 completely falls within the range of the projection D2 of the electrical contact portion 42 .
  • the projection range of the electrical contact portion 42 in the X-axis direction is 3.5mm-5.5mm, and the projection D1 of the storage portion 41 in the D2 is projected in the axial direction and completely falls within the projection range of the electrical contact portion 42 .
  • the chip holder 50 of this embodiment has a different structure.
  • the chip holder 50 includes a main body, and the main body is provided with a first mounting part 51 , a second mounting part 52 , a first clamping part 53 and a second clamping part 54 .
  • the first mounting part 51 is used to install the electrical contact part 42 of the chip 40
  • the second mounting part 52 is used to install the storage part 41
  • the first engaging part 53 and the second engaging part 54 are used to engage with the developing frame 10
  • the chip holder 50 is installed on the developing frame 10 .
  • the first mounting part 51 is located on the side of the main body away from the process cartridge, and the second mounting part 52 is located inside the first mounting part 51 .
  • the second mounting part 52 is located on one side of the main body, and the first engaging part 53 and the second engaging part 54 are located on the other side of the main body.
  • the first engaging portion 53 and the second engaging portion 54 are respectively facing both sides of the main body in the Y direction.
  • One of the first locking parts 53 is a protrusion
  • the other is an elastic arm.
  • the elastic arm is also provided with a locking protrusion.
  • the storage portion 41 of the chip 40 can be installed first into the second In the mounting part 52 , the electrical contact part 42 of the chip 40 is installed into the first mounting part 51 , that is, the chip 40 is first installed on the chip holder 50 , and then the chip holder 50 together with the chip 40 is installed on the developing frame 10 . It is easy to meet the requirement of convenient installation or removal of the chip 40 as a whole.
  • the chip 40 and the chip holder 50 are installed on the developing frame 10 , and the entire chip 40 is located outside the range of the gap 60 between the developing frame 10 and the photosensitive frame 20 , and will not be exposed to the developing frame 10 In the gap 60 between the photosensitive frame 20 and the photosensitive frame 20 , some external components can be prevented from colliding with the storage portion 41 from the gap 60 .
  • the chip holder 50 may also be integrally provided with the developing frame 10 .
  • Embodiment 1 provides yet another process box.
  • Embodiment 2 The difference from Embodiment 1 and Embodiment 2 is that the structure of the chip 40 and the structure of the chip holder 50 in this embodiment are different.
  • the photosensitive frame 20 may also include an end cover 70.
  • the chip 40 and the chip bracket 50 are installed on the end cover 70.
  • the end cover 70 has a first wall surface 70a.
  • the wall surface 70a is located on the XY plane, the first wall surface 70a has an installation position for combination with the chip holder 50, and the normal direction of the first wall surface 70a is along the Z-axis direction.
  • the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 70 a, the electrical contact portion 41 is electrically connected to the end cover 70 .
  • the contact portion 42 is located outside the first wall surface 70a, and the electrical contact portion 42 is completely exposed outside the first wall surface 70a. Electrical contact 42 is generally parallel to first wall surface 70a. A part of the storage part 41 may be inserted into the installation position on the first wall surface 70a, and part of the storage part 41 may be exposed on the first wall surface 70a, or the entire storage part 41 may be inserted into the installation position on the first wall surface 70a.
  • the storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 70a and does not protrude beyond the electrical contact portion 42. Therefore, the electrical contact portion 42 can shield the storage portion 41 to avoid external components. Collision storage unit 41. In the Y-axis direction, the electrical contact portion 42 is located on one side of the storage portion 41 .
  • the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 .
  • the area of the observable portion of the storage portion 41 is its projected size S1
  • the area of the observable portion of the electrical contact portion 42 is its projected size S2.
  • Part 41 (the dotted line part in Figure 28) is basically blocked by the first baffle 55, and the area that can be observed is basically zero, that is, the projected size S1 of the storage part 41 is basically zero, and the projected size S1 of the storage part 41 ( area) is smaller than the projected size S2 (area) of the electrical contact 42 .
  • the chip holder 50 of this embodiment has a different structure.
  • the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51, a third A baffle 55 , a first clamping part 53 and a second clamping part 54 .
  • the first mounting part 51 is used to install the electrical contact part 42 of the chip 40
  • the first clamping part 53 and the second clamping part 54 are used to engage with the end cover 70 to install the chip holder 50 on the end cover 70 superior.
  • the first mounting portion 51 is located on the side of the main body away from the process cartridge.
  • the first engaging portion 53 and the second engaging portion 54 are respectively facing both sides of the main body in the Y direction.
  • the first latching part 53 and the second latching part 54 are both latching protrusions.
  • the first baffle 55 is located on one side of the first mounting portion 51 in the Y-axis direction and on the side of the main body away from the process cartridge in the Z-axis direction.
  • the first baffle 55 is used to block the storage of the chip 40 in the Z-axis direction. Department 41.
  • a second baffle 72 is provided on the end cover 70.
  • the second baffle 72 extends along the YZ plane.
  • the second baffle 72 and the end cover 70 are on the inner side of the end surface in the X-axis direction. There is a gap 71 between them.
  • the storage part 41 of the chip 40 can be installed on the main body first by pasting or welding, and the electrical contact part 42 of the chip 40 can be installed into the first installation part 51, that is, the chip can first be installed on the main body.
  • 40 is mounted to the chip holder 50, and then the chip holder 50 together with the chip 40 is mounted to the end cap 70. It is easy to meet the requirement of convenient installation or removal of the chip 40 as a whole.
  • the chip 40 and the chip holder 50 are installed on the end cover 70, and the first baffle 55 and the second baffle 72 block the storage part 41 of the chip 40, so that the storage part 41 will not be exposed in the gap 60 between the photosensitive frame 20 and the developing frame 10, and some external components can be prevented from colliding with the storage portion 41 from the gap 60.
  • the developing frame 10 may also include an end cover, and the chip and the chip holder are mounted on the end cover.
  • This embodiment provides another process box.
  • the difference from Embodiment 3 is that the structure of the chip 40 in this embodiment is different.
  • the chip holder 50 and the end cover 70 are an integrated structure.
  • a first mounting portion 51 for mounting the electrical contact portion 42 of the chip 40 is formed on the first wall surface 70 a of the end cap 70 , and the first wall surface 70 a is located at XY On the plane, the first mounting portion 51 protrudes from the first wall surface 70a along the Z-axis direction.
  • the end cover 70 is also provided with a second baffle 72.
  • the second baffle 72 extends along the YZ plane.
  • the second baffle 72 and the end cover 70 are on the inner side of the end surface in the X-axis direction. There is a gap 71 between them.
  • the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 70 a, the electrical The contact portion 42 is located outside the first wall surface 70a, and the electrical contact portion 42 is completely exposed outside the first wall surface 70a. Electrical contact 42 is generally parallel to first wall surface 70a.
  • the storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 70a and does not protrude beyond the electrical contact portion 42. Therefore, the electrical contact portion 42 can shield the storage portion 41 to avoid external components. Collision storage unit 41.
  • the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 .
  • the area of the observable portion of the storage portion 41 is its projected size S1
  • the area of the observable portion of the electrical contact portion 42 is its projected size S2.
  • the storage portion 41 is basically blocked by the electrical contact portion 42 and the chip holder 50 , the area that can be observed is substantially zero, that is, the projected size S1 of the storage portion 41 is substantially zero, and the projected size S1 (area) of the storage portion 41 is smaller than the projected size S2 (area) of the electrical contact portion 42 .
  • the projection of the storage portion 41 is within the projection range of the electrical contact portion 42 .
  • the projections of the storage portion 41 and the electrical contact portion 42 are located on the XY plane. In the X-axis direction, the projection D1 of the storage portion 41 completely falls within the range of the projection D2 of the electrical contact portion 42 .
  • the size of the projection range of the electrical contact portion 42 in the X-axis direction is 3.5mm-5.5mm, and the projection D1 of the storage portion 41 in the X-axis direction is smaller than that of the electrical contact portion 42 in the X-axis direction.
  • the projection in the direction D2 completely falls within the projection range of the electrical contact portion 42 .
  • the electrical contact portion 42 can effectively shield the storage portion 41 , thereby preventing external components from colliding with the storage portion 41 and causing damage to the storage portion 41 .
  • the chip 40 is installed on the end cover 70 , and the electrical contact part 42 and the second baffle 72 block the storage part 41 of the chip 40 so that the storage part 41 is not exposed to the photosensitive frame 20 In the gap 60 between the storage unit 10 and the developing frame 10 , some external components can be prevented from colliding with the storage portion 41 from the gap 60 .

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Abstract

一种处理盒及安装在处理盒上的芯片支架，处理盒可拆卸地安装于成像设备，包括：框架（20），具有第一壁表面（20a）；由框架（20）可旋转地支撑的感光构件（22）；电接触部（42），安装于框架（20）并用于与成像设备电连接；存储部（41），与电接触部（42）电连接并且构造成存储与处理盒相关的信息；存储部（41）位于电接触部（42）朝向处理盒的一侧；沿第一壁表面（20a）的法向方向观察，存储部（41）的投影尺寸小于电接触部（42）的投影尺寸；和/或，沿第一壁表面（20a）的法向方向观察，在感光构件（22）的轴向方向上，存储部（41）的投影位于电接触部（42）的投影范围之内。处理盒可以将存储部（41）很好地保护起来，可以避免由于外部构件与存储部（41）之间的碰撞而导致存储部损坏的情况。

Description

一种处理盒及安装在处理盒上的芯片支架 技术领域
本发明涉及成像设备技术领域，尤其涉及一种处理盒及安装在处理盒上的芯片支架。
背景技术
在电子照相类型的成像设备中，已知如下构造，在所述构造中感光构件和可作用在感光构件上的处理构件一体地组装成单元作为处理盒，并且处理盒可安装在成像设备中并可从所述成像设备拆卸。通过这种构造，可以由用户自己在调色剂用完的情况下或在处理构件损坏的情况下进行维护操作，并且因此可以显著改善维护性能。
此外，近年来，还实现了如下构造，在所述构造中用于存储与处理盒相关的信息(例如服务信息和处理信息等各种信息)的存储部分安装在处理盒上。在该构造中，在设置在成像设备的设备主组件侧上的电接触部分与设置在处理盒侧上并且电连接到存储部分的电接触部分之间形成电连接。随后，在成像设备的设备主组件与处理盒的存储部分之间进行电气通信，并且使用存储在存储部分中的信息，使得可以进一步改善图像质量和维护性能。
此外，在日本特开申请(JP‐A)2004‐37876中公开的处理盒中，电接触部分和存储部分彼此齐平，并且提供在处理盒的安装方向上突出的突起部。通过这种构造，在处理盒掉落等期间，接触构件在存储部分之前接触外部构件，并且因此避免由于外部构件与存储部分之间的碰撞而导致的存储部分的破损。然而，在JP‐A 2004‐37876中公开的构造中，存储部分和电接触部分设置在相同平面上，并且因此布置的自由度低，也不能满足安装或拆卸方便的需求。
发明内容
根据本发明的一个方面，提供了一种处理盒，可拆卸地安装于成像设备，包括：框架，具有第一壁表面；由框架可旋转地支撑的感光构件；电接触部，安装于所述框架并用于与所述成像设备电连接；存储部，与所述电接触部电连接并且构造成存储与所述处理盒相关的信息；所述存储部位于所述电接触部朝向所述处理盒的一侧；沿所述第一壁表面的法向方向观察，所述存储部的投影尺寸小于所述电接触部的投影尺寸；和/或，沿所述第一壁表面的法向方向观察，在所述感光构件的轴向方向上，所述存储部的投影位于所述电接触部的投影范围之内。
在一些实施方式中，沿所述第一壁表面的法向方向观察，在所述感光构件的轴向方向上，所述电接触部的投影范围是3.5mm-5.5mm。
在一些实施方式中，所述框架包括显影框架和感光框架；所述电接触部和存储部共同设置在显影框架或感光框架上。
在一些实施方式中，所述存储部位于所述感光框架和显影框架之间的间隙的范围之外。
在一些实施方式中，所述存储部包括第一基板，所述电接触部设置在第二基板，所述第一基板所在的平面与所述第二基板所在的平面相交。
在一些实施方式中，所述电接触部设置于所述第二基板的表面且平行于所述第一壁表面；所述第一基板上设有晶圆，所述晶圆的横截面与所述电接触部所在的平面相交。
在一些实施方式中，所述电接触部与所述存储部通过柔性导电介质电连接。
在一些实施方式中，所述显影框架或感光框架包括端盖，所述电接触部和存储部安装于所述端盖。
根据本发明的另一方面，提供一种安装在处理盒上的芯片支架，所述芯片支架用于将所述电接触部与所述存储部安装固定在处理盒上，所述处理盒如上述任一项所述。
在一些实施方式中，所述芯片支架与框架分体设置或一体成型。
本发明的有益效果：本发明的处理盒可以将存储部很好地保护起来，可以避免由于外部构件与存储部之间的碰撞而导致存储部损坏的情况。
附图说明
图1为本发明实施例一的处理盒的整体结构图；
图2为本发明实施例一的处理盒的剖视图；
图3为本发明实施例一的处理盒的另一角度的整体结构图；
图4为图3中A处放大示意图；
图5为本发明实施例一的处理盒的芯片的结构示意图；
图6为本发明实施例一的处理盒从Z方向观察的示意图；
图7为图6中B处放大示意图；
图8为本发明实施例一的处理盒的芯片从Z方向观察的示意图；
图9为本发明实施例一的处理盒的芯片支架的结构图；
图10为本发明实施例一的处理盒的芯片和芯片支架安装示意图；
图11为本发明实施例一的处理盒的局部分解图；
图12为本发明实施例一的处理盒的芯片位置的剖视图；
图13为本发明实施例二的处理盒的整体结构图；
图14为图11中C处放大示意图；
图15为本发明实施例二的处理盒的芯片的结构示意图；
图16为本发明实施例二的处理盒从Z方向观察的局部示意图；
图17为图16中D处放大示意图；
图18为本发明实施例二的处理盒的芯片从Z方向观察的示意图；
图19为本发明实施例二的处理盒的芯片支架一角度的结构示意图；
图20为本发明实施例二的处理盒的的芯片支架另一角度的结构示意图；
图21为本发明实施例二的处理盒的芯片和芯片支架安装示意图；
图22为本发明实施例二的处理盒的局部分解图；
图23为本发明实施例三的处理盒一角度的整体结构示意图；
图24为本发明实施例三的处理盒另一角度的整体结构示意图；
图25为图24中E处放大示意图；
图26为本发明实施例三的处理盒的芯片的结构示意图；
图27为本发明实施例三的处理盒的从Z方向观察的局部示意图；
图28为图27中F处放大示意图；
图29为本发明实施例三的处理盒的芯片支架的结构示意图；
图30为本发明实施例三的处理盒的局部分解图；
图31为本发明实施例四的处理盒的整体结构示意图；
图32为本发明实施例四的处理盒的从Z方向观察的局部示意图；
图33为图32中G处放大示意图；
图34为本发明实施例四的处理盒的芯片的结构示意图；
图35为本发明实施例四的处理盒的芯片从Z方向观察的示意图；
图36为本发明实施例四的处理盒的端盖与芯片安装示意图。
具体实施方式
下面结合附图对本发明作进一步详细的说明，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可 以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在以上描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
实施例一
电子成像设备使用例如电子照相成像处理在记录材料上形成图像。电子成像设备包括例如电子照相复印机、电子照相打印机(LED打印机，激光打印机等)、电子照相打印机型的传真机等。处理盒，可拆卸地安装到电子成像设备中，处理盒包含感光构件、用于显影形成于感光构件上的静电潜像的显影构件等。电子成像设备包括驱动头，驱动头用于将电子成像设备的驱动力传输至处理盒，使处理盒工作。
如图1和图2所示，本实施例提供一种处理盒，包括框架、粉仓组件、废粉仓组件、驱动单元30、芯片40和芯片支架50。
如图1和图2所示，框架包括显影框架10和感光框架20。粉仓组件包括用于存储碳粉的粉仓11、显影辊12、出粉刀13及安装在粉仓11内的搅拌架14。废粉仓组件包括用于收集废粉的废粉仓21、感光鼓22、充电辊23、清洁刮刀24。
如图2所示，显影框架10围成存储碳粉的粉仓11，显影框架10大致为长条盒子形状，显影框架10在长度方向的两端具有端面。显影框架10上可以设置有加粉口，通过加粉口向粉仓11内补充碳粉，加粉口可以开设在显影框架10的其中一个端面上。搅拌架14和显影辊12可旋转的支撑在显影框架10长度方向的两端，搅拌架14和显影辊12可在驱动单元30的作用下旋转，搅拌架14和显影辊12的轴向均沿显影框架10的长度方向。粉仓11中的碳粉通过搅拌架 14搅拌，防止粉仓11内的碳粉结块，同时也可以向显影辊12方向输送碳粉，被带电的显影辊12吸附。
如图1和图2所示，感光框架20围成收集废粉的废粉仓21，感光框架20也具有长度方向，其长度方向与显影框架10的长度方向一致，感光鼓22可旋转的支撑在感光框架20在长度方向上的两端，感光鼓22的轴向与感光框架20的长度方向一致。
为了更好地对处理盒进行说明，如图3中建立坐标系，其中感光鼓22的轴向方向为X轴方向，与感光鼓22的轴向X相垂直的方向为Y方向，与X轴、Y轴方向垂直的方向为Z轴方向。X轴与Y轴组成的平面为XY平面，Y轴与Z轴组成的平面为YZ平面，X轴与Z轴组成的平面为XZ平面。
如图3和图4所示，感光框架20上具有第一壁表面20a，第一壁表面20a位于XY平面上，第一壁表面20a上具有与芯片支架50结合的安装位置20a1，第一壁表面20a的法向方向沿Z轴方向。
废粉仓21沿感光框架20的长度方向设置，废粉仓21位于感光鼓22的一侧。显影辊12吸附的碳粉通过与感光鼓22之间的电势差将碳粉转移给感光鼓22，经过转印后，清洁刮刀24与感光鼓22线性接触，清洁感光鼓22表面尚未完全转印的碳粉，即废粉，清洁后的废粉存放在废粉仓21内。充电辊23用于对感光鼓22表面充上均匀电荷，从而使感光鼓22能够吸附碳粉。
感光框架20的一些部分与显影框架10的一些部分之间存在间隙60，并不是完全贴合，如图3所示，感光框架20与显影框架10在Y方向上存在间隙60。
如图1所示，驱动单元30，位于框架长度方向的端面外侧，具体可以设于显影框架10在长度方向的一个或两个端面外侧，也可以设于感光框架20在长度方向的一个或两个端面外侧。驱动单元30用于接收并传递成像设备(如激光打印机)的驱动力使处理盒工作。驱动单元30可以包括动力接收件和齿轮组，从而接收成像设备的驱动力并传递，带动感光鼓22、显影辊12、搅拌架14等旋转。
进一步的，感光框架20还可以包括端盖，端盖罩设在感光框架20长度方向的端面外侧，将驱动单元30的齿轮的一部分或全部罩盖在端盖内，起保护作用，端盖可以与感光框架20是一体设置的，也可以是分体结构，通过焊接、粘贴、卡扣、插接或其他方式固定安装在感光框架20上。
也可以是，显影框架10包括端盖，端盖罩设在显影框架10长度方向的端面外侧。
如图5所示，芯片40包括存储部41和电接触部42，存储部41通过柔性导电介质43电连接电接触部42，存储部41构造为存储与处理盒相关的信息。
在处理盒安装至成像设备时，电接触部42与成像设备电连接，从而建立芯 片40与成像设备的通信。
柔性导电介质43可以是导电排线或者导电箔。存储部41通过柔性导电介质43连接电接触部42，使得存储部41的位置可以设置得更灵活。
存储部41包括第一基板411以及设置在第一基板411上的晶圆412和电池413。第一基板411为长方形板状构件，晶圆412和电池413设置在第一基板411的一个表面上，晶圆412的形状大致为具有圆弧表面的突起。
电接触部42设置在第二基板421一个表面上，电接触部42的数量为两个，电接触部42背向处理盒设置，即设置在第二基板421远离处理盒的表面上。
第二基板421平行于第一壁表面20a设置，即电接触部42也平行于第一壁表面20a，第一基板411所在的平面与第二基板421所在的平面相交，优选的，第一基板411所在的平面垂直于第二基板421所在的平面，也即第一基板411垂直于第一壁表面20a。可选择的，第一基板411所在的平面与第二基板421所在的平面之间的夹角为锐角或钝角。
进一步的，晶圆412平行于第一基板411所在的平面的横截面为圆形截面，该圆形截面所在的平面与电接触部42所在的平面相交，优选的，晶圆412的横截面(圆形截面)与电接触部42所在的平面垂直，也与第一壁表面20a垂直。可选择的，晶圆412的横截面与电接触部42所在的平面之间的夹角为锐角或钝角。
如图7和图8所示，芯片支架50用于安装固定芯片40，芯片支架50可拆卸地连接至感光框架20。感光框架20上具有第一壁表面20a，第一壁表面20a上具有与芯片支架50结合的安装位置20a1，具体的，安装位置20a1是形成于第一壁表面20a上的孔或槽，芯片支架50的一部分从孔或槽中***到感光框架20中，并固定在感光框架20上，从而将芯片40安装至感光框架20上，即芯片40的存储部41和电接触部42均位于感光框架20上。
如图3和图4所示，在芯片40安装至感光框架20后，存储部41位于电接触部42朝向处理盒的一侧，即在沿第一壁表面20a的法向方向Z上，电接触部42位于第一壁表面20a的外侧，电接触部42完全露出于第一壁表面20a外侧。电接触部42大致平行于第一壁表面20a。存储部41的一部分可以***到第一壁表面20a上的孔或槽内，部分露出于第一壁表面20a，也可以是存储部41全部***到第一壁表面20a上的孔或槽内。
存储部41在第一壁表面20a的法向方向Z上位于电接触部42的内侧，不会突出于电接触部42，由此，电接触部42可以对存储部41形成遮挡，避免外部构件碰撞存储部41。
如图6和图7所示，进一步的，沿第一壁表面20a的法向方向Z观察，存储部41的投影尺寸S1小于电接触部42的投影尺寸S2。具体的，沿第一壁表面 的法向Z观察，存储部41能够被观察到的部分的面积为其投影尺寸S1，电接触部42能够被观察到的部分的面积为其投影尺寸S2，存储部41的投影尺寸S1(面积)小于电接触部42的投影尺寸S2(面积)。
如图8所示，进一步的，沿第一壁表面20a的法向方向Z观察，在感光鼓的轴向X方向上，存储部41的投影位于电接触部42的投影范围之内。存储部41和电接触部42的投影位于XY平面上，在X轴方向上，存储部41的投影D1完全落入电接触部42的投影D2范围之内。
如图8所示，优选的，电接触部42在X轴方向上的投影范围是3.5mm‐5.5mm，而存储部41在X轴方向上的投影D1小于电接触部42在X轴方向上的投影D2，并完全落入到电接触部42的投影范围内。
通过上述的存储部41和电接触部42的位置关系设置，可以使电接触部42对存储部41形成有效的遮挡，避免外部构件与存储部41发生碰撞，导致存储部41损坏。
如图9和图10所示，本实施例中，芯片支架50包括主体，主体上设有第一安装部51、第二安装部52、第一卡接部53和第二卡接部54。
其中，第一安装部51用于安装芯片40的电接触部42，第二安装部52用于安装存储部41，第一卡接部53和第二卡接部54用于与感光框架20相卡合，从而将芯片支架50安装在感光框架20上。
如图9和图10所示，在Z方向上，第一安装部51位于主体远离处理盒的一侧，第二安装部52位于第一安装部51的内侧。第一卡接部53和第二卡接部54位于主体在Y方向上的两端，第一卡接部53其中一者为凸起，另一者为弹性臂，弹性臂上也设有卡位凸起。
如图10至图12所示，安装时，可以先将芯片40的存储部41安装到第二安装部52中，将芯片40的电接触部42安装到第一安装部51中，即先将芯片40安装至芯片支架50，然后将芯片支架50连同芯片40一起安装到感光框架20上。容易满足芯片40整体的安装或拆卸方便的需求。
如图3和图12所示，本实施例中，芯片40和芯片支架50安装在感光框架20上，存储部41被感光框架20包围，芯片40整***于感光框架20与显影框架10的间隙60的范围之外，不会暴露在感光框架20和显影框架10之间的间隙60中，可以避免一些外部构件从间隙60中碰撞到存储部41。
在一些其他的实施方式中，芯片支架50也可以是与感光框架20一体设置。
实施例二
本实施例提供另一种处理盒，与实施例一不同的是，本实施例的芯片40和芯片支架50安装在显影框架10上。
如图13和图14所示，本实施例中，显影框架10上具有第一壁表面10a，第一壁表面10a位于XY平面上，第一壁表面10a上具有与芯片支架50结合的安装位置10a1，第一壁表面10a的法向方向沿Z轴方向。
如图13和图14所示，在芯片40安装至显影框架10后，存储部41位于电接触部42朝向处理盒的一侧，即在沿第一壁表面10a的法向方向Z上，电接触部42位于第一壁表面10a的外侧，电接触部42完全露出于第一壁表面10a外侧。电接触部42大致平行于第一壁表面10a。存储部41的一部分可以***到第一壁表面10a上的安装位置10a1内，部分露出于第一壁表面10a，也可以是存储部41全部***到第一壁表面10a上的安装位置10a1内。存储部41在第一壁表面10a的法向方向Z上位于电接触部42的内侧，不会突出于电接触部42，由此，电接触部42可以对存储部41形成遮挡，避免外部构件碰撞存储部41。
如图15至图17所示，进一步的，沿第一壁表面10a的法向方向Z观察，存储部41的投影尺寸S1小于电接触部42的投影尺寸S2。具体的，沿第一壁表面的法向Z观察，存储部41能够被观察到的部分的面积为其投影尺寸S1，电接触部42能够被观察到的部分的面积为其投影尺寸S2，存储部41的投影尺寸S1(面积)小于电接触部42的投影尺寸S2(面积)。
如图15和图18所示，进一步的，沿第一壁表面10a的法向方向Z观察，在感光鼓的轴向X方向上，存储部41的投影位于电接触部42的投影范围之内。存储部41和电接触部42的投影位于XY平面上，在X轴方向上，存储部41的投影D1完全落入电接触部42的投影D2范围之内。
如图15和图18所示，优选的，电接触部42在X轴方向上的投影范围是3.5mm‐5.5mm，而存储部41在X轴方向上的投影D1小于电接触部42在X轴方向上投影D2，并完全落入到电接触部42的投影范围内。
与实施例一的另一个不同之处是，本实施例的芯片支架50结构不同。如图19和图20所示，本实施例中，芯片支架50包括主体，主体上设有第一安装部51、第二安装部52、第一卡接部53和第二卡接部54。其中第一安装部51用于安装芯片40的电接触部42，第二安装部52用于安装存储部41，第一卡接部53和第二卡接部54用于与显影框架10相卡合，从而将芯片支架50安装在显影框架10上。
如图19和图20所示，在Z方向上，第一安装部51位于主体远离处理盒的一侧，第二安装部52位于第一安装部51的内侧。在X方向上，第二安装部52位于主体的一侧，第一卡接部53和第二卡接部54位于主体的另一侧。第一卡接部53和第二卡接部54分别朝向主体在Y方向上的两侧。第一卡接部53其中一者为凸起，另一者为弹性臂，弹性臂上设有也设有卡位凸起。
如图21和图22所示，安装时，可以先将芯片40的存储部41安装到第二 安装部52中，将芯片40的电接触部42安装到第一安装部51中，即先将芯片40安装至芯片支架50，然后将芯片支架50连同芯片40一起安装到显影框架10上。容易满足芯片40整体的安装或拆卸方便的需求。
如图22所示，本实施例中，芯片40和芯片支架50安装在显影框架10上，芯片40整***于显影框架10与感光框架20的间隙60的范围之外，不会暴露在显影框架10和感光框架20之间的间隙60中，可以避免一些外部构件从间隙60中碰撞到存储部41。
在一些其他的实施方式中，芯片支架50也可以是与显影框架10一体设置。
本实施例的处理盒的其他结构与实施例一相同，在此不再赘述。
实施例三
本实施例提供又一种处理盒，与实施例一和实施例二不同的是，本实施例的芯片40结构、芯片支架50结构不同。
如图23和图24所示，本实施例中，感光框架20还可以包括端盖70，芯片40和芯片支架50安装在端盖70上，端盖70上具有第一壁表面70a，第一壁表面70a位于XY平面上，第一壁表面70a上具有与芯片支架50结合的安装位置，第一壁表面70a的法向方向沿Z轴方向。
如图24至图26所示，在芯片40安装至端盖70后，存储部41位于电接触部42朝向处理盒的一侧，即在沿第一壁表面70a的法向方向Z上，电接触部42位于第一壁表面70a的外侧，电接触部42完全露出于第一壁表面70a外侧。电接触部42大致平行于第一壁表面70a。存储部41的一部分可以***到第一壁表面70a上的安装位置内，部分露出于第一壁表面70a，也可以是存储部41全部***到第一壁表面70a上的安装位置内。存储部41在第一壁表面70a的法向方向Z上位于电接触部42的内侧，不会突出于电接触部42，由此，电接触部42可以对存储部41形成遮挡，避免外部构件碰撞存储部41。在Y轴方向上，电接触部42位于存储部41的一侧。
如图27和图28所示，进一步的，沿第一壁表面70a的法向方向Z观察，存储部41的投影尺寸S1小于电接触部42的投影尺寸S2。具体的，沿第一壁表面的法向Z观察，存储部41能够被观察到的部分的面积为其投影尺寸S1，电接触部42能够被观察到的部分的面积为其投影尺寸S2，存储部41(图28中的虚线部分)基本上被第一挡板55遮挡，能被观察到的面积基本为零，即存储部41的投影尺寸S1基本为零，存储部41的投影尺寸S1(面积)小于电接触部42的投影尺寸S2(面积)。
与实施例一的另一个不同之处是，本实施例的芯片支架50结构不同。如图24所示，本实施例中，芯片支架50包括主体，主体上设有第一安装部51、第 一挡板55、第一卡接部53和第二卡接部54。其中第一安装部51用于安装芯片40的电接触部42，第一卡接部53和第二卡接部54用于与端盖70相卡合，从而将芯片支架50安装在端盖70上。
如图29所示，在Z方向上，第一安装部51位于主体远离处理盒的一侧。第一卡接部53和第二卡接部54分别朝向主体在Y方向上的两侧。第一卡接部53和第二卡接部54均为卡位凸起。第一挡板55在Y轴方向上位于第一安装部51的一侧，在Z方向上位于主体远离处理盒的一侧，第一挡板55用于在Z轴方向上遮挡芯片40的存储部41。
如图30所示，进一步的，端盖70上还设置有第二挡板72，第二挡板72沿YZ平面延伸，第二挡板72与端盖70在X轴的方向的端面内侧之间具有间隔71，当芯片40和芯片支架50安装到端盖70的安装位置时，存储部41***到第二挡板72和端盖70内侧的间隔71中，使得第二挡板72能在X轴方向上遮挡存储部41。第二挡板72与端盖70为一体成型结构。
如图29所示，安装时，可以先将芯片40的存储部41以粘贴或焊接等方式安装在主体上，将芯片40的电接触部42安装到第一安装部51中，即先将芯片40安装至芯片支架50，然后将芯片支架50连同芯片40一起安装到端盖70上。容易满足芯片40整体的安装或拆卸方便的需求。
如图25和图30所示，本实施例中，芯片40和芯片支架50安装在端盖70上，第一挡板55和第二挡板72将芯片40的存储部41遮挡，使存储部41不会暴露在感光框架20和显影框架10之间的间隙60中，可以避免一些外部构件从间隙60中碰撞到存储部41。
在一些其他的实施方式中，显影框架10也可以包括端盖，芯片和芯片支架安装于端盖上。
本实施例的处理盒的其他结构与实施例一相同，在此不再赘述。
实施例四
本实施例提供另一个处理盒，与实施例三的不同之处在于，本实施例的芯片40结构不同，芯片支架50与端盖70为一体结构。
如图31至图36所示，本实施例中，端盖70上的第一壁表面70a上形成有用于安装芯片40的电接触部42的第一安装部51，第一壁表面70a位于XY平面上，第一安装部51沿Z轴方向突出于第一壁表面70a设置。
如图31和图32所示，端盖70上还设置有第二挡板72，第二挡板72沿YZ平面延伸，第二挡板72与端盖70在X轴的方向的端面内侧之间具有间隔71，当芯片40安装到端盖70的安装位置时，存储部41***到第二挡板72和端盖70内侧的间隔71中，使得第二挡板72能在X轴方向上遮挡存储部41。
如图31至图36所示，在芯片40安装至端盖70后，存储部41位于电接触部42朝向处理盒的一侧，即在沿第一壁表面70a的法向方向Z上，电接触部42位于第一壁表面70a的外侧，电接触部42完全露出于第一壁表面70a外侧。电接触部42大致平行于第一壁表面70a。存储部41在第一壁表面70a的法向方向Z上位于电接触部42的内侧，不会突出于电接触部42，由此，电接触部42可以对存储部41形成遮挡，避免外部构件碰撞存储部41。
如图32至图34所示，进一步的，沿第一壁表面70a的法向方向Z观察，存储部41的投影尺寸S1小于电接触部42的投影尺寸S2。存储部41能够被观察到的部分的面积为其投影尺寸S1，电接触部42能够被观察到的部分的面积为其投影尺寸S2，存储部41基本上被电接触部42和芯片支架50遮挡，能被观察到的面积基本为零，即存储部41的投影尺寸S1基本为零，存储部41的投影尺寸S1(面积)小于电接触部42的投影尺寸S2(面积)。
如图35所示，进一步的，沿第一壁表面70a的法向方向Z观察，在感光鼓的轴向X方向上，存储部41的投影位于电接触部42的投影范围之内。存储部41和电接触部42的投影位于XY平面上，在X轴方向上，存储部41的投影D1完全落入电接触部42的投影D2范围之内。
如图35所示，优选的，电接触部42的投影范围在X轴方向上的尺寸是3.5mm‐5.5mm，而存储部41在X轴方向上的投影D1小于电接触部42在X轴方向上的投影D2，并完全落入到电接触部42的投影范围内。
通过上述的存储部41和电接触部42的位置关系设置，可以使电接触部42对存储部41形成有效的遮挡，避免外部构件与存储部41发生碰撞，导致存储部41损坏。
如图36所示，本实施例中，芯片40安装在端盖70上，电接触部42和第二挡板72将芯片40的存储部41遮挡，使存储部41不会暴露在感光框架20和显影框架10之间的间隙60中，可以避免一些外部构件从间隙60中碰撞到存储部41。
本实施例的处理盒的结构与实施例一相同，在此不再赘述。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (10)

  1. 一种处理盒，可拆卸地安装于成像设备，其特征在于，包括：
    框架，具有第一壁表面；
    由框架可旋转地支撑的感光构件；
    电接触部，安装于所述框架并用于与所述成像设备电连接；
    存储部，与所述电接触部电连接并且构造成存储与所述处理盒相关的信息；
    所述存储部位于所述电接触部朝向所述处理盒的一侧；
    沿所述第一壁表面的法向方向观察，所述存储部的投影尺寸小于所述电接触部的投影尺寸；和/或，沿所述第一壁表面的法向方向观察，在所述感光构件的轴向方向上，所述存储部的投影位于所述电接触部的投影范围之内。
  2. 根据权利要求1所述的处理盒，其特征在于，沿所述第一壁表面的法向方向观察，在所述感光构件的轴向方向上，所述电接触部的投影范围是3.5mm-5.5mm。
  3. 根据权利要求1所述的处理盒，其特征在于，所述框架包括显影框架和感光框架；
    所述电接触部和存储部共同设置在显影框架或感光框架上。
  4. 根据权利要求3所述的处理盒，其特征在于，所述存储部位于所述感光框架和显影框架之间的间隙的范围之外。
  5. 根据权利要求1-4任一项所述的处理盒，其特征在于，所述存储部包括第一基板，所述电接触部设置在第二基板，所述第一基板所在的平面与所述第二基板所在的平面相交。
  6. 根据权利要求5所述的处理盒，其特征在于，所述电接触部设置于所述第二基板的表面且平行于所述第一壁表面；所述第一基板上设有晶圆，所述晶圆的横截面与所述电接触部所在的平面相交。
  7. 根据权利要求5所述的处理盒，其特征在于，所述电接触部与所述存储部通过柔性导电介质电连接。
  8. 根据权利要求3所述的处理盒，其特征在于，所述显影框架或感光框架包括端盖，所述电接触部和存储部安装于所述端盖。
  9. 一种安装在处理盒上的芯片支架，其特征在于，所述芯片支架用于将所述电接触部与所述存储部安装固定在处理盒上，所述处理盒如权利要求1-8任一项所述。
  10. 根据权利要求9所述的芯片支架，其特征在于，所述芯片支架与框架分体设置或一体成型。
PCT/CN2023/083126 2022-03-23 2023-03-22 一种处理盒及安装在处理盒上的芯片支架 WO2023179681A1 (zh)

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JP2004294950A (ja) * 2003-03-28 2004-10-21 Canon Inc プロセスカートリッジ
CN205942254U (zh) * 2016-06-27 2017-02-08 广州小微电子技术有限公司 信息存储装置及显影剂容器
CN111258198A (zh) * 2018-11-30 2020-06-09 佳能株式会社 处理盒和成像设备
CN112731781A (zh) * 2020-07-29 2021-04-30 珠海艾派克微电子有限公司 处理盒
CN217425935U (zh) * 2022-03-23 2022-09-13 纳思达股份有限公司 一种处理盒及安装在处理盒上的芯片支架

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004294950A (ja) * 2003-03-28 2004-10-21 Canon Inc プロセスカートリッジ
CN205942254U (zh) * 2016-06-27 2017-02-08 广州小微电子技术有限公司 信息存储装置及显影剂容器
CN111258198A (zh) * 2018-11-30 2020-06-09 佳能株式会社 处理盒和成像设备
CN112731781A (zh) * 2020-07-29 2021-04-30 珠海艾派克微电子有限公司 处理盒
CN217425935U (zh) * 2022-03-23 2022-09-13 纳思达股份有限公司 一种处理盒及安装在处理盒上的芯片支架

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