WO2023179109A1 - 气溶胶产生装置及其发热体和用于制备发热体的材料 - Google Patents
气溶胶产生装置及其发热体和用于制备发热体的材料 Download PDFInfo
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- WO2023179109A1 WO2023179109A1 PCT/CN2022/138158 CN2022138158W WO2023179109A1 WO 2023179109 A1 WO2023179109 A1 WO 2023179109A1 CN 2022138158 W CN2022138158 W CN 2022138158W WO 2023179109 A1 WO2023179109 A1 WO 2023179109A1
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- Prior art keywords
- conductive layer
- heating element
- conductive
- layer
- oxide
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 41
- 239000000443 aerosol Substances 0.000 title claims abstract description 20
- 230000004888 barrier function Effects 0.000 claims abstract description 91
- 239000010410 layer Substances 0.000 claims description 268
- 238000010438 heat treatment Methods 0.000 claims description 114
- 239000000919 ceramic Substances 0.000 claims description 78
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 27
- 238000005245 sintering Methods 0.000 claims description 23
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 18
- 239000010935 stainless steel Substances 0.000 claims description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 10
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 10
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 5
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 5
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 5
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 5
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 5
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 5
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 5
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 5
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 5
- 229910001954 samarium oxide Inorganic materials 0.000 claims description 5
- 229940075630 samarium oxide Drugs 0.000 claims description 5
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 32
- 239000000203 mixture Substances 0.000 description 22
- 239000000843 powder Substances 0.000 description 19
- 239000011195 cermet Substances 0.000 description 18
- 239000002202 Polyethylene glycol Substances 0.000 description 16
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 16
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 16
- 229920001223 polyethylene glycol Polymers 0.000 description 16
- 238000002360 preparation method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
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- 238000012360 testing method Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 229910052727 yttrium Inorganic materials 0.000 description 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 6
- 229910052726 zirconium Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000462 isostatic pressing Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000013590 bulk material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 238000013001 point bending Methods 0.000 description 4
- 238000013112 stability test Methods 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- 229910052688 Gadolinium Inorganic materials 0.000 description 3
- 229910052772 Samarium Inorganic materials 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
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- 239000010432 diamond Substances 0.000 description 3
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- 238000010030 laminating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
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- 230000000670 limiting effect Effects 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
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Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
Definitions
- the present invention relates to the field of atomization, and more specifically, to an aerosol generating device, a heating element thereof, and materials for preparing the heating element.
- the aerosol generating device is a heat-not-burn atomization device that generates aerosol by heating the atomization material in a low-temperature heat-not-burn manner.
- the heating element of the existing aerosol generating device usually consists of two parts: an insulating substrate and a conductive heating circuit coated on the insulating substrate.
- the microstructure of the conductive heating circuit is loose and porous. This loose and porous structure is easily destroyed during repeated operation of the heating element, thus affecting the resistance stability of the heating element.
- the wire diameter and thickness of the conductive heating circuit itself is very small, and the resistance of the conductive heating circuit is directly related to the wire diameter. Therefore, high requirements are placed on the preparation process of the conductive heating circuit.
- the technical problem to be solved by the present invention is to provide an improved heating element, materials for preparing the heating element, and an aerosol generating device with the heating element in view of the above-mentioned defects of the prior art.
- the technical solution adopted by the present invention to solve the technical problem is to construct a heating element for use in an aerosol generating device.
- the heating element includes a main body; the main body includes a first conductive layer, a barrier layer and a second conductive layer. layer, wherein the barrier layer is located between the first conductive layer and the second conductive layer to separate at least a portion of the first conductive layer and the second conductive layer; the first One end of the conductive layer and one end of the second conductive layer are electrically connected.
- the first conductive layer and the second conductive layer are conductive ceramics
- the barrier layer is insulating ceramics.
- the first conductive layer, the second conductive layer, and the barrier layer are all conductive ceramics, and the resistivities of the first conductive layer and the second conductive layer are less than the The resistivity of the barrier layer.
- the first conductive layer and the second conductive layer are symmetrically disposed on two opposite sides of the barrier layer.
- the first conductive layer, the second conductive layer and the barrier layer are respectively composed of several layers of first conductive layer blanks, several layers of second conductive layer blanks and several layers of barrier layer blanks. formed after sintering.
- the main body part is prepared in one step by a co-sintering method after laminating the several layers of first conductive layer blanks, the several layers of barrier layer blanks, and the several layers of second conductive layer blanks. get.
- the heating element further includes a conductive connection portion disposed at one end of the main body portion to electrically conduct the first conductive layer and the second conductive layer.
- the conductive connection portion is electrically connected to a portion of the first conductive layer and the second conductive layer extending out of the barrier layer.
- the heating element further includes a protective layer disposed on the outer surface of the main body.
- the main body portion has a first end and a second end opposite to the first end, and the first conductive layer and the second conductive layer extend from the first end to the third end.
- the resistivities at both ends are consistent or inconsistent.
- the heating element further includes a first electrode and a second electrode connected to the other ends of the first conductive layer and the second conductive layer respectively.
- the present invention also provides a material for preparing the heating element as described in any one of the above, including a conductive material for preparing the first conductive layer and the second conductive layer and a conductive material for preparing the barrier layer.
- a conductive material for preparing the first conductive layer and the second conductive layer and a conductive material for preparing the barrier layer.
- a barrier material a barrier material; the conductive material includes a first ceramic phase and a first metal phase, and the barrier material includes a second ceramic phase.
- the weight ratio of the first metal phase to the first ceramic phase is between 30/70 and 70/30.
- the first metal phase includes at least one of Ni, Fe, Cu, Co, and stainless steel.
- the first ceramic phase and the second ceramic phase each include a ceramic body material including alumina, zirconium oxide, cerium oxide, titanium oxide, manganese oxide, chromium oxide, oxide At least one of iron, nickel oxide, yttrium oxide, lanthanum oxide, samarium oxide, niobium oxide, molybdenum oxide, and zinc oxide.
- the first ceramic phase and/or the second ceramic phase further includes a doping element doped into the ceramic bulk material.
- the barrier material further includes a second metallic phase.
- the second metal phase includes at least one of Ni, Fe, Cu, Co, and stainless steel.
- the weight ratio of the first metallic phase to the first ceramic phase is greater than the weight ratio of the second metallic phase to the second ceramic phase.
- the present invention also provides an aerosol generating device, including the heating element described in any one of the above.
- the heating element of the invention is an integrated heating element and does not require additional conductive lines; the heating element has a compact and dense structure that is not easily damaged, has high mechanical strength and good resistance stability; and the heating element The whole body heats up evenly.
- Figure 1 is a schematic cross-sectional structural view of the heating element in the first embodiment of the present invention
- FIG. 2 is a schematic diagram of the preparation process of the heating element shown in Figure 1;
- Figure 3 is a schematic cross-sectional structural view of the heating element in the second embodiment of the present invention.
- FIG 4 is a schematic diagram of the preparation process of the heating element shown in Figure 3;
- Figure 5 is a schematic diagram of the preparation process of the heating element in the third embodiment of the present invention.
- Figure 6 is a schematic cross-sectional structural view of the heating element in the fourth embodiment of the present invention.
- FIG. 7 is a schematic diagram of the preparation process of the heating element shown in Figure 6;
- Figure 8 is a schematic three-dimensional structural diagram of the aerosol generating device in use in some embodiments of the present invention.
- Fig. 9 is a schematic cross-sectional structural view of the aerosol generating device shown in Fig. 8.
- first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include at least one of these features.
- “plurality” means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.
- connection In the present invention, unless otherwise clearly stated and limited, the terms “installation”, “connection”, “connection”, “fixing” and other terms should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. , or integrated into one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise specified restrictions. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
- a first feature being “on” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. touch.
- the terms “above”, “above” and “above” the first feature is above the second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature.
- "Below”, “below” and “beneath” the first feature to the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature has a smaller horizontal height than the second feature.
- the heating element 10 in the first embodiment of the present invention includes a main body 11 and a conductive connection part 12 provided at one end of the main body 11 .
- the heating element 10 can be in various shapes such as sheet, columnar or needle shape.
- the main body part 11 is co-fired from the first conductive layer 111, the barrier layer 112 and the second conductive layer 113.
- the first conductive layer 111 and the second conductive layer 113 have low resistivity, and their function is to generate heat after being energized to generate heat to heat the aerosol to form the matrix.
- the barrier layer 112 is disposed between the first conductive layer 111 and the second conductive layer 113, and may be made of insulating material or have high resistivity.
- the barrier layer 112 in the middle separates the first conductive layer 111 and the second conductive layer 113 on both sides thereof to prevent short circuit between the first conductive layer 111 and the second conductive layer 113 on both sides.
- the conductive connection part 12 has low resistivity, and its function is to electrically conduct the first conductive layer 111 and the second conductive layer 113, so that the heating element 10 has a current loop formed in the working state.
- the main body part 11 has a symmetrical structure, that is, the first conductive layer 111 and the second conductive layer 113 have the same composition and the same structural dimensions (such as length, width, thickness dimensions), and the barrier layer 112 is located in the middle of the main body part 11 In this way, the main body portion 11 will not bend due to inconsistent stress on both sides during the co-sintering process.
- the compositions of the first conductive layer 111 and the second conductive layer 113 may also be different, and/or the structural dimensions of the first conductive layer 111 and the second conductive layer 113 may also be different.
- the main body part 11 has a first end 114 and a second end 115 that are oppositely arranged.
- the conductive connection part 12 is provided at the first end 114 of the main body part 11 to connect the first conductive layer 111 and the second conductive layer 113 to the first end 114 Series conduction.
- the resistivities of the first conductive layer 111 and the second conductive layer 113 from the first end 114 to the second end 115 may be consistent or inconsistent.
- the resistivities of the first conductive layer 111 and the second conductive layer 113 from the first end 114 to the second end 115 are the same to ensure uniform heat generation.
- the resistivity of the first end 114 of the first conductive layer 111 and the second conductive layer 113 is greater than the resistivity of the second end 115 of the first conductive layer 111 and the second conductive layer 113 to be suitable for the first end 114 The demand for higher temperature and lower temperature of the second end 115.
- the resistivity of the first conductive layer 111 and the second conductive layer 113 gradually decreases from the first end 114 to the second end 115 to meet the requirement that the temperature of the first end 114 to the second end 115 gradually decreases.
- the resistance of the conductive connection part 12 can be controllable and adjustable through a controllable short-circuit process, thereby making the temperature field of the heating element 10 controllable and adjustable.
- the heating element 10 further includes a first electrode 131 and a second electrode 132.
- the first electrode 131 and the second electrode 132 are respectively connected to and electrically conductive with the second end 115 of the first conductive layer 111 and the second conductive layer 113. .
- the first electrode 131 and the second electrode 132 have low resistivity, and function as positive and negative electrodes to connect to external power sources.
- the first electrode 131 and the second electrode 132 may be electrode wires, such as aluminum wires or silver wires.
- the first electrode 131 and the second electrode 132 can be respectively connected to the end surface or side surface of the second end 115 by welding or other methods.
- the heating element 10 may further include a protective layer 14 disposed on the outer surface of the main body 11 and/or the conductive connection part 12 .
- the protective layer 14 can be a glass glaze layer or a ceramic coating, and its thickness is generally less than 0.1 mm.
- the protective layer 14 can protect the main body part 11 and/or the conductive connection part 12 located inside it, reduce the erosion effect of oxygen and impurities on the main body part 11 and/or the conductive connection part 12, and prevent the main body part 11 and/or the conductive connection part 12 from being heated.
- the conductive connection part 12 reacts with the aerosol-forming matrix to extend the life of the heating element 10 , improve the surface smoothness of the heating element 10 , and reduce the adhesion of the heated aerosol-forming matrix on the heating element 10 .
- the heating element 10 in the present invention is an integrated heating element and does not require additional conductive circuits. It is itself a heating element.
- the main body part 11 generates heat as a whole, thereby having the characteristics of uniform heat generation.
- the integrated heating element 10 has high mechanical strength, so that it can be used both as a heating element for generating heat and as a supporting body for support.
- the heating element 10 since the main body 11 of the heating element 10 has stable metal or semiconductor temperature coefficient characteristics, the heating element 10 itself can also be used as a thermocouple to achieve precise temperature control.
- the main body 11 can be a ceramic structure and can be prepared by high-temperature sintering. Its structure is compact and dense, not easily damaged, and has good resistance stability. It should be noted that the first conductive layer 111 and the second conductive layer 113 can each be formed by stacking several layers of conductive layer blanks and then sintering, and the barrier layer 112 can be formed by stacking several layers of barrier layer blanks and then sintering them.
- the conductive material of the first conductive layer 111 and the second conductive layer 113 is a first conductive ceramic with low resistivity, such as a first cermet.
- the first cermet is a composite oxide of metal and ceramic, which includes a first ceramic phase and a first metal phase.
- the first metal phase may be one of Ni, Fe, Cu, Co, and stainless steel, or any combination thereof (including alloys).
- the first metal phase does not contain precious metals and therefore is less expensive. In other embodiments, the first metal phase may also include noble metals without considering cost.
- the addition of the first ceramic phase has two functions: one is to regulate the resistivity of the first cermet, and the other is to improve the mechanical properties of the first cermet.
- the first ceramic phase may be one of aluminum oxide, zirconium oxide, cerium oxide, titanium oxide, manganese oxide, chromium oxide, iron oxide, nickel oxide, yttrium oxide, lanthanum oxide, samarium oxide, niobium oxide, molybdenum oxide, and zinc oxide. species or any combination between them.
- the ceramic bulk material of the first ceramic phase can also be doped and replaced with appropriate element types (such as yttrium, zirconium, aluminum, samarium or gadolinium, etc.) and doping amounts in order to appropriately improve the structure of the first ceramic phase. stability and improve its mechanical properties.
- doping zirconia with yttrium can improve the phase structure stability of zirconia
- doping alumina with zirconium can improve the toughness of alumina. It is worth noting that no matter what element is used and how much doping amount is used for doping and substitution of the ceramic body material, it is within the protection scope of the present invention.
- the resistivity of the first cermet is related to the material composition of the first metal phase and the first ceramic phase, the morphology of their respective powders, the ratio of the first metal phase to the first ceramic phase, sintering density and other parameters.
- the resistivity of the first cermet can be controlled by controlling relevant parameters.
- the weight ratio of the first metal phase to the first ceramic phase is between 30/70 and 70/30.
- the resistivity of the first cermet may be 1*10 -5 ⁇ m ⁇ 10*10 -5 ⁇ m.
- the first metal phase is nano-copper powder
- the first ceramic phase is yttrium-doped zirconia (3YSZ: Y 0.03 Zr 0.97 O 2 ) micron powder
- the weight ratio of copper to 3YSZ is 30:70
- the first The resistivity of cermet is 6*10 -5 ⁇ m.
- the first metal phase is 430L stainless steel micron powder and the first ceramic phase is yttrium-doped zirconia (3YSZ: Y 0.03 Zr 0.97 O 2 ) micron powder
- the weight ratio of 430L stainless steel to 3YSZ is 40:60.
- the first When the porosity of cermet is 97%, its resistivity is 4*10 -5 ⁇ m.
- the first metal phase is 430L stainless steel micron powder
- the first ceramic phase is samarium-doped cerium oxide (SDC: Sm 0.2 Ce 0.8 O 2 ) nanopowder
- the weight ratio of 430L stainless steel to SDC is 70:30
- the The resistivity of a cermet is 5*10 -5 ⁇ m.
- the barrier material of barrier layer 112 may be an insulating material, such as an insulating ceramic, which includes a second ceramic phase.
- the second ceramic phase may be aluminum oxide, zirconium oxide, cerium oxide, titanium oxide, manganese oxide, chromium oxide, iron oxide, nickel oxide, yttrium oxide, lanthanum oxide, samarium oxide, niobium oxide, molybdenum oxide, zinc oxide One or any combination between them.
- the ceramic bulk material of the second ceramic phase can be doped and replaced with appropriate element types (such as yttrium, zirconium, aluminum, samarium or gadolinium, etc.) and doping amounts, in order to appropriately improve the structure of the second ceramic phase.
- doping zirconia with yttrium can improve the phase structure stability of zirconia; doping alumina with zirconium can improve the toughness of alumina. It is worth noting that no matter what element is used and how much doping amount is used for doping and substitution of the ceramic body material, it is within the protection scope of the present invention.
- the barrier layer 112 may also be made of barrier material with high resistivity. Compared with the conductive materials of the first conductive layer 111 and the second conductive layer 113, the barrier material of the barrier layer 112 has a higher resistivity. In some embodiments, the resistivity of the barrier layer 112 is at least 100 times greater than the resistivities of the first conductive layer 111 and the second conductive layer 113 .
- the barrier material of the barrier layer 112 may have the same chemical elements as the conductive materials of the first conductive layer 111 and the second conductive layer 113 but have different resistivities.
- the barrier material of the barrier layer 112 may also be a composite oxide of metal and ceramic, that is, a second cermet, which includes a second ceramic phase and a second metal phase.
- the second metal phase may be one of Ni, Fe, Cu, Co and stainless steel, or any combination thereof (including alloys).
- the first ceramic phase may be one of aluminum oxide, zirconium oxide, cerium oxide, titanium oxide, manganese oxide, chromium oxide, iron oxide, nickel oxide, yttrium oxide, lanthanum oxide, samarium oxide, niobium oxide, molybdenum oxide, and zinc oxide. species or any combination between them.
- the ceramic bulk material of the second ceramic phase can be doped and replaced with appropriate element types (such as yttrium, zirconium, aluminum, samarium or gadolinium, etc.) and doping amounts, in order to appropriately improve the structure of the second ceramic phase. stability and improve its mechanical properties.
- doping zirconia with yttrium can improve the phase structure stability of zirconia
- doping alumina with zirconium can improve the toughness of alumina. It is worth noting that no matter what element is used and how much doping amount is used to dope and replace the ceramic body material of the second ceramic phase, it is within the protection scope of the present invention.
- a second cermet with high resistivity By adjusting the ratio of the second metal phase to the second ceramic phase, a second cermet with high resistivity can be obtained.
- the resistivity of the second cermet is related to the material composition of the second metal phase and the second ceramic phase, the morphology of their respective powders, the ratio of the second metal phase to the second ceramic phase, sintering density and other parameters.
- the resistivity of the second cermet can be controlled by controlling relevant parameters.
- the ratio of the second metal phase to the second ceramic phase in the second cermet is lower, that is, the weight ratio of the second metal phase to the second ceramic phase is smaller than that of the first metal phase to the first ceramic phase.
- the weight ratio of the resistivity of the barrier layer 112 is higher than that of the first conductive layer 111 and the second conductive layer 113 .
- the current preferentially passes through the first conductive layer 111 and the second conductive layer 113 .
- the heating element 10 is a columnar heating element and has a sandwich structure.
- the lengths of the first conductive layer 111 , the barrier layer 112 and the second conductive layer 113 along the direction from the first end 114 to the second end 115 are equal, and the first conductive layer 111 , the barrier layer 112 and the second conductive layer 113 are at the first end.
- the end surfaces of 114 and the second end 115 are respectively flush, so that the barrier layer 112 located in the middle completely separates the first conductive layer 111 and the second conductive layer 113 located on both sides thereof.
- the conductive connection portion 12 can be formed by subjecting the first end 114 of the main body portion 11 to conductive treatment.
- stainless steel solder is used to conduct conductive treatment on the end surface of the first end 114 to form the conductive connection portion 12 .
- the solder is not limited to stainless steel solder.
- it can also be silver copper solder, pure silver solder or nickel solder.
- the conductive treatment is not limited to welding.
- the conductive connection portion 12 can also be formed by printing, plating, or physical deposition.
- the heating element 10 can be prepared through the following preparation process:
- Preparation of the conductive layer blank Take an appropriate amount of metal powder, ceramic powder and mixture and uniformly mix and disperse them, and then prepare the conductive layer blank A based on the dispersed mixture;
- the preparation of the barrier layer blank B can be achieved in the following two ways:
- barrier layer blank B based on the dispersed mixture; this method is suitable for the case where the barrier material of barrier layer 112 is insulating ceramic;
- the main body 11 is prepared by laminating several layers of conductive layer blanks A, several layers of barrier layer blanks B, and several layers of conductive layer blanks A through a high-temperature co-sintering method in one step.
- the structure has high strength and the preparation process is simple.
- the conductive layer blank A and the barrier layer blank B can be prepared by processes such as tape casting or dry pressing, and the entire blank C can be prepared by processes such as hot pressing or warm isostatic pressing.
- the sizes of the conductive layer blank A and the barrier layer blank B in this embodiment are the same.
- Figures 3-4 show the heating element 10 in the second embodiment of the present invention.
- the heating element 10 in this embodiment is a needle-shaped heating element.
- the end 114 is rounded, for example, can be sharpened, in order to reduce the friction force between the heating element 10 and the aerosol-forming substrate, so as to facilitate the insertion of the heating element 10 into the aerosol-forming substrate.
- Example 1 430L/3YSZ needle-shaped heating element 10
- the 430L/3YSZ weight ratio of 40:60 weigh 20g of 430L (5 microns) and 30g of 3YSZ (Y 0.03 Zr 0.97 O 2 ), then weigh 1.5g of triethanolamine (TEA) and 30g of alcohol, and add them to the roller ball mill tank. Disperse by ball milling for 8 hours, then add 1.4g polyethylene glycol (PEG400), 1.2g dibutyl phthalate (DBP) and 1.5g polyvinyl butyral (PVB) and continue ball milling for 8 hours to prepare a product with suitable viscosity.
- the slurry for tape casting is prepared by the tape casting method using a knife height of 300 microns to obtain the conductive layer blank A (100mm*100mm).
- 3YSZ ceramic powder 1.1g of triethanolamine (TEA) and 30g of alcohol, add them to a roller ball mill tank and ball mill to disperse for 8 hours, then add 0.9g of polyethylene glycol (PEG400), 1g of dibutyl phthalate ( DBP) and 1g polyvinyl butyral (PVB) were continuously ball-milled for 8 hours to prepare a slurry with suitable viscosity for casting.
- the barrier layer blank B (100mm*100mm) was prepared using the casting method using a knife height of 300 microns. .
- Four layers of conductive layer blank A, one layer of barrier layer blank B and four layers of conductive layer blank A are laminated together in sequence.
- the entire green body C was placed in the air at 500°C for debinding treatment for 4 hours, and then placed in a vacuum furnace for sintering treatment at 1400°C for 4 hours to obtain a sintered body D with a sandwich structure.
- the sintered body D is then cut into several cylinders E with a diameter of 1.95mm and a length of 22mm using a diamond wire cutting machine. Using machining, one end of the cylinder E is sharpened to obtain the main body 11.
- the first electrode 131 and the second electrode 132 are respectively welded to the rear end of the main body 11 (the end away from the needle tip).
- a glass glaze layer is prepared on the main body part 11 and the conductive connection part 12 to form a protective layer 14 .
- the 430L/3YSZ needle-shaped heating element 10 is completed.
- the mechanical strength of the needle-shaped heating element 10 material was measured to be 450 MPa.
- the TCR (temperature coefficient of resistance) of the heating element 10 is 1300ppm, and its linearity is extremely high, making it easy to control temperature.
- the stability test shows that the resistance of the heating element 10 has zero attenuation after 6,000 dry-burning cycle tests (heating to 350°C for 2 minutes, then turning off the power and cooling to room temperature, which is one cycle).
- Example 2 316L/SDC needle-shaped heating element 10
- the entire green body C was placed in the air at 500°C for debinding treatment for 4 hours, and then placed in a vacuum furnace for sintering treatment at 1400°C for 4 hours to obtain a sintered body D with a sandwich structure.
- the sintered body D is then cut into several cylinders E with a diameter of 1.95mm and a length of 22mm using a diamond wire cutting machine. Using machining, one end of the cylinder E is sharpened to obtain the main body 11.
- the first electrode 131 and the second electrode 132 are respectively welded to the rear end of the main body 11 (the end away from the needle tip).
- a glass glaze layer is prepared on the main body part 11 and the conductive connection part 12 to form a protective layer 14 .
- the 316L/SDC needle-shaped heating element 10 is completed.
- the mechanical strength of the needle-shaped heating element 10 was measured to be 450 MPa.
- the TCR of the heating element 10 is 1250 ppm, and its linearity is extremely high, making it easy to control temperature.
- the stability test shows that the resistance of the heating element 10 has zero attenuation after 5,000 dry-burning cycle tests (heating to 350°C for 2 minutes, then turning off the power and cooling to room temperature, which is one cycle).
- the Cu/3YSZ weight ratio of 30:70 weigh 15g of Cu (5 microns) and 35g of 3YSZ (Y 0.03 Zr 0.97 O 2 ), then weigh 1.5g of triethanolamine (TEA) and 40g of alcohol, and add them to the roller ball mill tank. Disperse by ball milling for 8 hours, then add 1.4g polyethylene glycol (PEG400), 1.2g dibutyl phthalate (DBP) and 1.5g polyvinyl butyral (PVB) and continue ball milling for 8 hours to prepare a product with appropriate viscosity.
- the slurry for tape-casting was prepared using the tape-casting method with a knife height of 300 microns to obtain the conductive layer blank A (100mm*100mm).
- conductive layer blank A Four layers of conductive layer blank A, one layer of barrier layer blank B and four layers of conductive layer blank A are laminated together in sequence. After vacuum molding, they are pressed into a whole blank C using warm isostatic pressing. The entire green body C was placed in the air at 500°C for debinding treatment for 4 hours, and then placed in a vacuum furnace for sintering treatment at 1050°C for 4 hours to obtain a sintered body D with a sandwich structure. The sintered body D is then cut into several cylinders E with a diameter of 1.95mm and a length of 22mm using a diamond wire cutting machine. Using machining, one end of the cylinder E is sharpened to obtain the main body 11.
- the needle tip of the main body part 11 is conductively processed using stainless steel solder to form a conductive connection part 12.
- the first electrode 131 and the second electrode 132 are respectively welded to the rear end of the main body 11 (the end away from the needle tip).
- a glass glaze layer is prepared on the main body part 11 and the conductive connection part 12 to form a protective layer 14 .
- the Cu/3YSZ needle-shaped heating element 10 is completed.
- the mechanical strength of the needle-shaped heating element 10 material was measured to be 160 MPa.
- the TCR of the heating element 10 is 1000ppm, and its linearity is extremely high, making it easy to control temperature.
- the stability test shows that the resistance of the heating element 10 has zero attenuation after 3,000 dry-burning cycle tests (heating to 350°C for 2 minutes, then turning off the power and cooling to room temperature, which is one cycle).
- FIG. 5 shows the heating element 10 in the third embodiment of the present invention.
- the heating element 10 in this embodiment is a sheet-shaped heating element.
- the 430L/3YSZ weight ratio of 40:60 weigh 20g of 430L (5 microns) and 30g of 3YSZ (Y 0.03 Zr 0.97 O 2 ), then weigh 1.5g of triethanolamine (TEA) and 30g of alcohol, and add them to the roller ball mill tank. Disperse by ball milling for 8 hours, then add 1.4g polyethylene glycol (PEG400), 1.2g dibutyl phthalate (DBP) and 1.5g polyvinyl butyral (PVB) and continue ball milling for 8 hours to prepare a product with suitable viscosity.
- the slurry for tape casting is prepared by the tape casting method using a knife height of 300 microns to obtain the conductive layer blank A (100mm*100mm).
- 3YSZ ceramic powder 1.1g of triethanolamine (TEA) and 30g of alcohol, add them to a roller ball mill tank and ball mill to disperse for 8 hours, then add 0.9g of polyethylene glycol (PEG400), 1g of dibutyl phthalate ( DBP) and 1g polyvinyl butyral (PVB) were continuously ball-milled for 8 hours to prepare a slurry with suitable viscosity for casting.
- the barrier layer blank B (100mm*100mm) was prepared using the casting method using a knife height of 300 microns. . Two layers of conductive layer blank A, one layer of barrier layer blank B and two layers of conductive layer blank A are laminated together in sequence.
- the entire green body C was placed in the air at 500°C for debinding treatment for 4 hours, and then placed in a vacuum furnace for sintering treatment at 1400°C for 4 hours to obtain a sintered body D with a sandwich structure.
- the sintered body D is then cut and processed into a sheet-shaped main body portion 11 with a certain size and shape.
- One end of the sheet-shaped main body 11 is conductively processed using stainless steel solder to form a conductive connection portion 12 .
- the first electrode 131 and the second electrode 132 are respectively welded to the other end of the sheet-shaped main body 11 (the end away from the conductive connection part 12 ).
- a glass glaze layer is prepared on the main body part 11 and the conductive connection part 12 to form a protective layer 14 .
- the 430L/3YSZ sheet heating element 10 is completed.
- the mechanical strength of the sheet heating element 10 material was measured to be 400MPa.
- the TCR of the heating element 10 is 1350 ppm, and its linearity is extremely high, making it easy to control temperature.
- the stability test shows that the resistance of the heating element 10 has zero attenuation after 6,000 dry-burning cycle tests (heating to 350°C for 2 minutes, then turning off the power and cooling to room temperature, which is one cycle).
- Figures 6-7 show the heating element 10 in the fourth embodiment of the present invention.
- the barrier layer 112 in this embodiment separates the first conductive layer 111 and the second conductive layer 113. Partial areas are spaced apart, and the first conductive layer 111 and the second conductive layer 113 extend out of the barrier layer 112 and are connected and connected, thereby eliminating the need to provide a conductive connection portion 12 at the first end 114 of the main body 11 .
- the first conductive layer 111 includes a first conductive body part 1111 and a first conductive connection part 1112 located at one end of the first conductive body part 1111.
- the second conductive layer 113 includes a second conductive body part 1131 and a first conductive connection part 1112 located at one end of the second conductive body.
- the second conductive connection part 1132 at one end of the part 1131.
- the barrier layer 112 is located between the first conductive body part 1111 and the second conductive body part 1131, completely separating the first conductive body part 1111 and the second conductive body part 1131.
- the first conductive connection part 1112 extends outward from the barrier layer 112 from one end of the first conductive body part 1111, and the second conductive connection part 1132 extends outward from the barrier layer 112 from one end of the second conductive body part 1131.
- the first conductive connection The portion 1112 and the second conductive connection portion 1132 are in contact and conductive, so that the main body portion 11 has a current loop formed in the working state.
- the first conductive body part 1111 may be disposed at an end edge of the first conductive body part 1111 , or may be disposed adjacent to an end edge of the first conductive body part 1111 .
- the second conductive connection portion 1132 can be disposed at an end edge of the second conductive body portion 1131 , or can be disposed adjacent to an end edge of the second conductive body portion 1131 .
- the heating element 10 in this embodiment can also be in various shapes such as sheet, columnar or needle shape.
- the heating element 10 in this embodiment can also be prepared in one step by using a high-temperature co-sintering method after lamination, which has high structural strength and a simple preparation process.
- the heating element 10 can be prepared through the following preparation process:
- Preparation of the conductive layer blank Take an appropriate amount of metal powder, ceramic powder and mixture and uniformly mix and disperse them, and then prepare the conductive layer blank A based on the dispersed mixture;
- the preparation of the barrier layer blank B can be achieved in the following two ways:
- barrier layer blank B based on the dispersed mixture; this method is suitable for the case where the barrier material of barrier layer 112 is insulating ceramic;
- the length of the conductive layer blank A along the extending direction from the first end 114 to the second end 115 is greater than the length of the barrier layer blank B along the extending direction from the first end 114 to the second end 115 .
- the end surfaces of the several layers of conductive layer blanks A and the several layers of barrier layer blanks B are kept aligned at the second end 115 flat. After sintering, the portion of the conductive layer blank A that is longer than the barrier layer blank B forms the first conductive connection portion 1112 and the second conductive connection portion 1132 .
- FIGS 8-9 illustrate an aerosol generating device 100 in some embodiments of the present invention.
- the aerosol generating device 100 can be used to bake and heat the aerosol-forming substrate 200 inserted therein into a non-burning state.
- the aerosol extract in the aerosol-forming matrix 200 is released.
- the aerosol-forming substrate 200 can be in the shape of a cylinder, and the aerosol generating device 100 can be in the shape of a generally square column. It can be understood that in other embodiments, the aerosol generating device 100 is not limited to a square columnar shape, and may also be in a cylindrical shape, an elliptical columnar shape, or other shapes.
- the aerosol generating device 100 includes a housing 30 and a heating element 10 housed in the housing 30 , a storage tube 20 , a battery 40 , and a motherboard 50 .
- the heating element 10 can be the heating element in any of the above embodiments.
- the inner wall surface of the holding tube 20 defines a holding space 21 for holding the aerosol-forming matrix 200.
- the top wall of the housing 30 is provided with a socket 31 for inserting the aerosol-forming matrix 200.
- the aerosol-forming matrix 200 can be inserted through the socket. 31 is inserted into the containment space 21.
- the upper end of the heating element 10 (the end provided with the conductive connection part 12) can be extended into the receiving space 21 and inserted into the aerosol-forming substrate 200, for baking and heating the aerosol-forming substrate 200 after being energized and heated.
- the mainboard 50 is electrically connected to the battery 40 and the heating element 10 respectively. Relevant control circuits are arranged on the mainboard 50 , and the connection between the battery 40 and the heating element 10 can be controlled through the switch provided on the casing 30 .
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- Resistance Heating (AREA)
Abstract
一种气溶胶产生装置(100)及发热体(10)和用于制备发热体(10)的材料,发热体(10)包括主体部(11);主体部(11)包括第一导电层(111)、阻隔层(112)以及第二导电层(113),其中,阻隔层(112)位于第一导电层(111)和第二导电层(113)之间以将第一导电层(111)和第二导电层(113)的至少部分区域间隔开;第一导电层(111)的一端和第二导电层(113)的一端电性导通。发热体(10)为一体式发热体(10),不需要额外设置导电线路;发热体(10)的结构紧凑致密不容易被破坏,机械强度高,阻值稳定性好;且发热体(10)整体发热,发热均匀。
Description
本发明涉及雾化领域,更具体地说,涉及一种气溶胶产生装置及其发热体和用于制备发热体的材料。
气溶胶产生装置是一种通过低温加热不燃烧的方式加热雾化材料以生成气溶胶的加热不燃烧型雾化装置。现有的气溶胶产生装置的发热体通常由两部分构成:绝缘基板和涂覆在绝缘基板上的导电发热线路。导电发热线路的微观结构表现为疏松多孔,这种疏松多孔的结构在发热体反复工作的过程中很容易被破坏,从而影响发热体的阻值稳定性。此外,导电发热线路的线径厚度本身就很小,而导电发热线路的电阻又跟线径直接相关,因此对导电发热线路的制备工艺提出了很高要求。
本发明要解决的技术问题在于,针对现有技术的上述缺陷,提供一种改进的发热体、用于制备该发热体的材料以及具有该发热体的气溶胶产生装置。
本发明解决其技术问题所采用的技术方案是:构造一种发热体,用于气溶胶产生装置,所述发热体包括主体部;所述主体部包括第一导电层、阻隔层以及第二导电层,其中,所述阻隔层位于所述第一导电层和所述第二导电层之间以将所述第一导电层和所述第二导电层的至少部分区域间隔开;所述第一导电层的一端和所述第二导电层的一端电性导通。
在一些实施例中,所述第一导电层、所述第二导电层为导电陶瓷,所述阻隔层为绝缘陶瓷。
在一些实施例中,所述第一导电层、所述第二导电层、所述阻隔层均为导电陶瓷,且所述第一导电层及所述第二导电层的电阻率均小于所述阻隔层的电阻率。
在一些实施例中,所述第一导电层和所述第二导电层分别对称地设置于所述阻隔层的两相对侧。
在一些实施例中,所述第一导电层、所述第二导电层以及所述阻隔层分别由若干层第一导电层素坯、若干层第二导电层素坯以及若干层阻隔层素坯烧结后形成。
在一些实施例中,所述主体部由所述若干层第一导电层素坯、所述若干层阻隔层素坯以及所述若干层第二导电层素坯叠合后通过共烧结法一步制备得到。
在一些实施例中,所述发热体还包括导电连接部,所述导电连接部设置于所述主体部的一端,以将所述第一导电层及所述第二导电层电性导通。
在一些实施例中,所述导电连接部由所述第一导电层及所述第二导电层延伸出所述阻隔层的部分电性导通。
在一些实施例中,所述发热体还包括设置于所述主体部外表面的保护层。
在一些实施例中,所述主体部具有第一端以及与所述第一端相对的第二端,所述第一导电层、所述第二导电层从所述第一端至所述第二端的电阻率一致或者不一致。
在一些实施例中,所述发热体还包括分别与所述第一导电层及所述第二导电层的另一端连接的第一电极、第二电极。
本发明还提供一种用于制备如上述任一项所述的发热体的材料,包括用于制备所述第一导电层和所述第二导电层的导电材料以及用于制备所述阻隔层的阻隔材料;所述导电材料包括第一陶瓷相和第一金属相,所述阻隔材料包括第二陶瓷相。
在一些实施例中,所述第一金属相与所述第一陶瓷相的重量比在30/70~70/30之间。
在一些实施例中,所述第一金属相包括Ni、Fe、Cu、Co、不锈钢中的至少一种。
在一些实施例中,所述第一陶瓷相和所述第二陶瓷相分别包括陶瓷本体材料,所述陶瓷本体材料包括氧化铝、氧化锆、氧化铈、氧化钛、氧化锰、氧化铬、氧化铁、氧化镍、氧化钇、氧化镧、氧化钐、氧化铌、氧化钼、氧化锌中的至少一种。
在一些实施例中,所述第一陶瓷相和/或所述第二陶瓷相还包括掺杂于所述陶瓷本体材料的掺杂元素。
在一些实施例中,所述阻隔材料还包括第二金属相。
在一些实施例中,所述第二金属相包括Ni、Fe、Cu、Co、不锈钢中的至少一种。
在一些实施例中,所述第一金属相与所述第一陶瓷相的重量比大于所述第二金属相与所述第二陶瓷相的重量比。
本发明还提供一种气溶胶产生装置,包括上述任一项所述的发热体。
实施本发明至少具有以下有益效果:本发明的发热体为一体式发热体,不需要额外设置导电线路;发热体的结构紧凑致密不容易被破坏,机械强度高,阻值稳定性好;且发热体整体发热,发热均匀。
下面将结合附图及实施例对本发明作进一步说明,附图中:
图1是本发明第一实施例中发热体的剖面结构示意图;
图2是图1所示发热体的制备过程示意图;
图3是本发明第二实施例中发热体的剖面结构示意图;
图4是图3所示发热体的制备过程示意图;
图5是本发明第三实施例中发热体的制备过程示意图;
图6是本发明第四实施例中发热体的剖面结构示意图;
图7是图6所示发热体的制备过程示意图;
图8是本发明一些实施例中气溶胶产生装置在使用状态下的立体结构示意图;
图9是图8所示气溶胶产生装置的剖面结构示意图。
为了对本发明的技术特征、目的和效果有更加清楚的理解,现对照附图详细说明本发明的具体实施方式。
在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本发明内涵的情况下做类似改进,因此本发明不受下面公开的具体实施例的限制。
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系或者是本发明产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中,“多个”的含义是至少两个,例如两个、三个等,除非另有明确具体的限定。
在本发明中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。
如图1所示,本发明第一实施例中的发热体10包括主体部11以及设置于主体部11一端的导电连接部12。该发热体10可以为片状、柱状或针状等各种形状。
主体部11由第一导电层111、阻隔层112以及第二导电层113共烧成型。其中,第一导电层111、第二导电层113具有低电阻率,其作用是在通电后发热,以产生热量加热气溶胶形成基质。阻隔层112设置于第一导电层111和第二导电层113之间,其可以为绝缘材质或具有高电阻率。位于中间的阻隔层112将位于其两侧的第一导电层111和第二导电层113隔开,避免其两侧的第一导电层111和第二导电层113之间发生短路。导电连接部12具有低电阻率,其作用是将第一导电层111、第二导电层113电性导通,使得发热体10在工作状态有电流回路形成。
主体部11为对称结构,即,第一导电层111、第二导电层113的组成成分相同且具有相同的结构尺寸(例如长度、宽度、厚度尺寸),阻隔层112位于主体部11的正中间,这样,在共烧结过程中主体部11不会由于两边应力不一致而产生弯曲。在其他实施例中,第一导电层111、第二导电层113的组成成分也可不同,和/或,第一导电层111、第二导电层113的结构尺寸也可不同。
主体部11具有相对设置的第一端114和第二端115,导电连接部12设置于主体部11的第一端114,以将第一导电层111、第二导电层113于第一端114串联导通。根据用途需求,第一导电层111、第二导电层113从第一端114至第二端115的电阻率可一致或者也可不一致。例如,第一导电层111、第二导电层113从第一端114至第二端115的电阻率相同,以使发热均匀。再例如,第一导电层111、第二导电层113的第一端114的电阻率大于第一导电层111、第二导电层113的第二端115的电阻率,以适用于第一端114温度较高、第二端115温度较低的需求。又例如,第一导电层111、第二导电层113从第一端114至第二端115的电阻率逐渐减小,以适用于第一端114至第二端115的温度逐渐降低的需求。此外,导电连接部12的电阻可以通过可控短路工艺实现可控可调,从而使得发热体10的温度场可控可调。
进一步地,该发热体10还包括第一电极131、第二电极132,第一电极131、第二电极132分别与第一导电层111、第二导电层113的第二端115连接并导通。第一电极131、第二电极132具有低电阻率,其作用是作为正负极以外接外部电源。在一些实施例中,第一电极131、第二电极132可以为电极丝,例如铝丝或银丝。第一电极131、第二电极132可通过焊接等方式分别连接于第二端115的端面或侧面。
进一步地,在一些实施例中,该发热体10还可包括设置于主体部11和/或导电连接部12外表面的保护层14。该保护层14可以为玻璃釉层或陶瓷涂层,其厚度一般小于0.1mm。保护层14可对位于其内部的主体部11和/或导电连接部12进行保护,降低氧和杂质等对主体部11和/或导电连接部12的侵蚀作用,防止加热时主体部11和/或导电连接部12与气溶胶形成基质发生反应,提高发热体10的寿命,并可提高发热体10的表面光滑度,减少加热后的气溶胶形成基质在发热体10上的黏连。
本发明中的发热体10为一体式发热体,不需要额外设置导电线路,其自身就是一个发热体。主体部11整体发热,从而具有发热均匀的特点。此外,一体化的发热体10的机械强度高,从而既可以作为发热体用于发热,又可以作为支撑体用于支撑。另外,由于发热体10的主体部11具有稳定的金属或者半导体温度系数特征,从而该发热体10自身还可用作热电偶,能够实现精准控温。
主体部11可以为陶瓷结构并可通过高温烧结制备得到,其结构紧凑致密不容易被破坏,阻值稳定性较好。需要说明的是,第一导电层111、第二导电层113分别可由若干层导电层素坯叠置后烧结而成,阻隔层112可由若干层阻隔层素坯叠置后烧结而成。具体地,第一导电层111和第二导电层113的导电材料为具有低电阻率的第一导电陶瓷,例如第一金属陶瓷。该第一金属陶瓷为金属和陶瓷的复合氧化物,其包括第一陶瓷相和第一金属相。该第一金属相可以为Ni、Fe、Cu、Co和不锈钢中的一种,或者它们之间任意的组合物(包括合金)。该第一金属相不包含贵金属,因而成本较低。在其他实施例中,在不考虑成本的情况下,该第一金属相也可包括贵金属。
该第一陶瓷相的加入有两个作用:一是调控第一金属陶瓷的电阻率,二是改善第一金属陶瓷的机械性能。第一陶瓷相可以为氧化铝、氧化锆、氧化铈、氧化钛、氧化锰、氧化铬、氧化铁、氧化镍、氧化钇、氧化镧、氧化钐、氧化铌、氧化钼、氧化锌中的一种或者它们之间任意的组合物。
此外,还可选用适当的元素种类(例如钇、锆、铝、钐或钆等)和掺杂量对第一陶瓷相的陶瓷本体材料进行掺杂取代,目的在于适当提高第一陶瓷相的结构稳定性和改善其机械性能。例如,采用钇对氧化锆进行掺杂,可以提高氧化锆的相结构稳定性;采用锆对氧化铝进行掺杂,可以提高氧化铝的韧性。值得注意的是,不管使用什么元素和使用多少掺杂量对陶瓷本体材料进行掺杂取代,都在本发明的保护范围内。
第一金属陶瓷的电阻率与第一金属相和第一陶瓷相的材料成分及它们各自粉体的形貌、第一金属相与第一陶瓷相的比例以及烧结致密度等参数有关。通过控制相关参数可以实现对第一金属陶瓷的电阻率进行调控。在一些实施例中,第一金属相与第一陶瓷相的重量比配比在30/70~70/30之间。第一金属陶瓷的电阻率可以为1*10
-5Ω•m~10*10
-5Ω•m。例如,当第一金属相为纳米铜粉,第一陶瓷相为钇掺杂的氧化锆(3YSZ:Y
0.03Zr
0.97O
2)微米粉,铜与3YSZ的重量比为30:70时,第一金属陶瓷的电阻率为6*10
-5Ω•m。当第一金属相为430L不锈钢微米粉体,第一陶瓷相为钇掺杂的氧化锆(3YSZ:Y
0.03Zr
0.97O
2)微米粉,430L不锈钢与3YSZ的重量比为40:60,第一金属陶瓷的孔隙率为97%时,其电阻率为4*10
-5Ω•m。当第一金属相为430L不锈钢微米粉体,第一陶瓷相为钐掺杂的氧化铈(SDC:Sm
0.2Ce
0.8O
2)纳米粉,430L不锈钢与SDC的重量比为70:30时,第一金属陶瓷的电阻率为5*10
-5Ω•m。
在一些实施例中,阻隔层112的阻隔材料可以为绝缘材料,例如绝缘陶瓷,其包括第二陶瓷相。该第二陶瓷相可以是氧化铝、氧化锆、氧化铈、氧化钛、氧化锰、氧化铬、氧化铁、氧化镍、氧化钇、氧化镧、氧化钐、氧化铌、氧化钼、氧化锌中的一种或者它们之间任意的组合物。此外,还可以选用适当的元素种类(例如钇、锆、铝、钐或钆等)和掺杂量对第二陶瓷相的陶瓷本体材料进行掺杂取代,目的在于适当提高第二陶瓷相的结构稳定性和改善其机械性能。例如,采用钇对氧化锆进行掺杂,可以提高氧化锆的相结构稳定性;采用锆对氧化铝进行掺杂,可以提高氧化铝的韧性。值得注意的是,不管使用什么元素和使用多少掺杂量对陶瓷本体材料进行掺杂取代,都在本发明的保护范围内。
在另一些实施例中,阻隔层112也可采用具有高电阻率的阻隔材料。与第一导电层111和第二导电层113的导电材料相比,阻隔层112的阻隔材料具有更高的电阻率。在一些实施例中,阻隔层112的电阻率为第一导电层111、第二导电层113的电阻率的至少100倍。该阻隔层112的阻隔材料可与第一导电层111和第二导电层113的导电材料具有相同的化学元素,但是具有不同的电阻率。具体地,该阻隔层112的阻隔材料也可以是金属与陶瓷的复合氧化物,即第二金属陶瓷,其包括第二陶瓷相和第二金属相。该第二金属相可以为Ni、Fe、Cu、Co和不锈钢中的一种,或者它们之间任意的组合物(包括合金)。第一陶瓷相可以为氧化铝、氧化锆、氧化铈、氧化钛、氧化锰、氧化铬、氧化铁、氧化镍、氧化钇、氧化镧、氧化钐、氧化铌、氧化钼、氧化锌中的一种或者它们之间任意的组合物。
此外,还可以选用适当的元素种类(例如钇、锆、铝、钐或钆等)和掺杂量对第二陶瓷相的陶瓷本体材料进行掺杂取代,目的在于适当提高第二陶瓷相的结构稳定性和改善其机械性能。例如,采用钇对氧化锆进行掺杂,可以提高氧化锆的相结构稳定性,采用锆对氧化铝进行掺杂可以提高氧化铝的韧性。值得注意的是,不管使用什么元素和使用多少掺杂量对第二陶瓷相的陶瓷本体材料进行掺杂取代,都在本发明的保护范围内。
通过调控第二金属相与第二陶瓷相的比例,可以获得具有高电阻率的第二金属陶瓷。第二金属陶瓷的电阻率与第二金属相和第二陶瓷相的材料成分及它们各自粉体的形貌、第二金属相与第二陶瓷相的比例以及烧结致密度等参数有关。通过控制相关参数可以实现对第二金属陶瓷的电阻率进行调控。与第一金属陶瓷相比,第二金属陶瓷中第二金属相与第二陶瓷相的比例要低,即第二金属相与第二陶瓷相的重量比小于第一金属相与第一陶瓷相的重量比,因此也导致阻隔层112的电阻率比第一导电层111和第二导电层113的电阻率要高。当有电流通过的时候,电流优先通过第一导电层111和第二导电层113。
具体地,再如图1所示,在本实施例中,发热体10为柱状发热体并具有三明治结构。第一导电层111、阻隔层112以及第二导电层113沿第一端114至第二端115方向的长度相等,且第一导电层111、阻隔层112、第二导电层113在第一端114和第二端115的端面分别齐平,使得位于中间的阻隔层112将位于其两侧的第一导电层111和第二导电层113完全隔开。导电连接部12可通过将主体部11的第一端114做导电处理形成,例如,在第一端114的端面使用不锈钢焊料做导电处理来形成导电连接部12。可以理解地,该焊料并不局限于不锈钢焊料,例如,其也可以为银铜焊料、纯银焊料或镍焊料等。在其他实施例中,该导电处理也不局限于焊接方式,例如导电连接部12也可通过印刷、镀膜或物理沉积等方式形成。
如图2所示,该发热体10可通过如下制备工艺制备:
S1、导电层素坯的制备:取适量金属粉体与陶瓷粉体及混合剂均匀混合分散,然后基于分散好的混合物制备导电层素坯A;
S2、阻隔层素坯的制备:
具体地,该阻隔层素坯B的制备可通过以下两种方式实现:
S21、取适量金属粉体与陶瓷粉体及混合剂均匀混合分散,然后基于分散好的混合物制备阻隔层素坯B;该方式适用于阻隔层112的阻隔材料为第二金属陶瓷的情况,与导电层素坯A相比,阻隔层素坯B中的陶瓷含量更高;
或者,
S22、直接取适量陶瓷粉体及混合剂均匀混合分散,然后基于分散好的混合物制备阻隔层素坯B;该方式适用于阻隔层112的阻隔材料为绝缘陶瓷的情况;
S3、取若干层导电层素坯A和若干层阻隔层素坯B以A+B+A的顺序叠合得到素坯整体C;
S4、对素坯整体C进行高温烧结得到烧结体D;
S5、对烧结体D进行机械加工,获得目标尺寸形状的主体部11;
S6、在主体部11的第一端114做导电处理,使得位于两侧的第一导电层111、第二导电层113导通,在主体部11的第二端115制备第一电极131、第二电极132;
S7、将主体部11和导电连接部12上釉处理,以制备保护层14。
主体部11采用若干层导电层素坯A、若干层阻隔层素坯B、若干层导电层素坯A依次叠合后通过高温共烧结法一步制备得到,结构强度高,制备工艺简单。其中,导电层素坯A、阻隔层素坯B可通过流延或干压等工艺制备,素坯整体C可通过热压或温等静压等工艺制备。此外,本实施例中的导电层素坯A和阻隔层素坯B的尺寸相同。
图3-4示出了本发明第二实施例中的发热体10,其与第一实施例的主要区别在于,本实施例中的发热体10为针状发热体,主体部11的第一端114被圆滑处理,例如,可以被削尖处理,目的在于降低发热体10与气溶胶形成基质之间的摩檫力,便于发热体10***到气溶胶形成基质中。
实施例:以下实施例用于说明如何采用简单的“流延-热压-共烧结”工艺制备针状发热体10。显然,本发明的发热体10也可以采用其它工艺最终实现共烧结制备,也在本发明的保护范围内。
实施例1:430L/3YSZ针状发热体10
按照430L/3YSZ重量比为40:60称取430L(5微米)20g、3YSZ(Y
0.03Zr
0.97O
2)30g,再称取三乙醇胺(TEA)1.5g和酒精30g,一起加入滚筒球磨罐中球磨分散8h,然后加入1.4g聚乙二醇(PEG400)、1.2g邻苯二甲酸二丁酯(DBP)和1.5g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到导电层素坯A(100mm*100mm)。称取3YSZ陶瓷粉体35.1g、三乙醇胺(TEA)1.1g和酒精30g,加入滚筒球磨罐中球磨分散8h,然后加入0.9g聚乙二醇(PEG400)、1g邻苯二甲酸二丁酯(DBP)和1g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到阻隔层素坯B(100mm*100mm)。将四层导电层素坯A、一层阻隔层素坯B和四层导电层素坯A依次叠合在一起,真空塑封后使用温等静压将其压合成为一个素坯整体C。将素坯整体C置于空气中于500摄氏度排胶处理4h后,再将其置于真空炉中于1400℃烧结处理4h后得到具有三明治结构的烧结体D。再将烧结体D使用金刚石线切割机切割成若干直径为1.95mm、长度为22mm的圆柱体E。采用机加工,再将圆柱体E的一端做削尖处理,得到主体部11。在主体部11的针尖处使用不锈钢焊料做导电处理,制备导电连接部12。在主体部11的尾端(远离针尖的一端)分别焊接第一电极131、第二电极132。在主体部11和导电连接部12上制备玻璃釉层,以形成保护层14。
于此,该430L/3YSZ针状发热体10即制备完成。通过三点抗弯强度测试,测量得到该针状发热体10材料的机械强度为450MPa。该发热体10的TCR(电阻温度系数)为1300ppm,且线性度极高,便于控温。稳定性测试表明:该发热体10经过6000次干烧循环测试(通电加热到350℃后2min,关掉电源降到室温,为一次循环)后阻值零衰减。
实施例2:316L/SDC针状发热体10
按照316L/SDC重量比为70/30称取316L(5微米)35g、SDC(Sm
0.03Ce
0.97O
2,粒径为50nm)15g,再称取三乙醇胺(TEA)1.5g和酒精30g,一起加入滚筒球磨罐中球磨分散8h,然后加入1.4g聚乙二醇(PEG400)、1.2g邻苯二甲酸二丁酯(DBP)和1.5g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到导电层素坯A(100mm*100mm)。称取SDC粉体30g、三乙醇胺(TEA)1g和酒精30g,加入滚筒球磨罐中球磨分散8h,然后加入0.8g聚乙二醇(PEG400)、0.8g邻苯二甲酸二丁酯(DBP)和0.8g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到阻隔层素坯B(100mm*100mm)。将四层导电层素坯A、一层阻隔层素坯B和四层导电层素坯A依次叠合在一起,真空塑封后使用温等静压将其压合成为一个素坯整体C。将素坯整体C置于空气中于500摄氏度排胶处理4h后,再将其置于真空炉中于1400℃烧结处理4h后得到具有三明治结构的烧结体D。再将烧结体D使用金刚石线切割机切割成若干直径为1.95mm、长度为22mm的圆柱体E。采用机加工,再将圆柱体E的一端做削尖处理,得到主体部11。在主体部11的针尖处使用不锈钢焊料做导电处理,得到导电连接部12。在主体部11的尾端(远离针尖的一端)分别焊接第一电极131、第二电极132。在主体部11和导电连接部12上制备玻璃釉层,以形成保护层14。
于此,该316L/SDC针状发热体10即制备完成。通过三点抗弯强度测试,测量得到该针状发热体10的机械强度为450MPa。该发热体10的TCR为1250ppm,且线性度极高,便于控温。稳定性测试表明:该发热体10经过5000次干烧循环测试(通电加热到350℃后2min,关掉电源降到室温,为一次循环)后阻值零衰减。
实施例3:Cu/3YSZ针状发热体10
按照Cu/3YSZ重量比为30:70称取Cu(5微米)15g和3YSZ(Y
0.03Zr
0.97O
2)35g,然后再称取三乙醇胺(TEA)1.5g和酒精40g,一起加入滚筒球磨罐中球磨分散8h,然后加入1.4g聚乙二醇(PEG400)、1.2g邻苯二甲酸二丁酯(DBP)和1.5g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到导电层素坯A(100mm*100mm)。称取Cu(5微米)5g、3YSZ(Y
0.03Zr
0.97O
2)45g、三乙醇胺(TEA)1.5g和酒精40g,加入滚筒球磨罐中球磨分散8h,然后加入1.4g聚乙二醇(PEG400)、1.2g邻苯二甲酸二丁酯(DBP)和1.5g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到阻隔层素坯B(100mm*100mm)。将四层导电层素坯A、一层阻隔层素坯B和四层导电层素坯A依次叠合在一起,真空塑封后使用温等静压将其压合成为一个素坯整体C。将素坯整体C置于空气中于500摄氏度排胶处理4h后,再将其置于真空炉中于1050℃烧结处理4h后得到具有三明治结构的烧结体D。再将烧结体D使用金刚石线切割机切割成若干直径为1.95mm长度为22mm的圆柱体E。采用机加工,再将圆柱体E的一端做削尖处理,得到主体部11。将主体部11的针尖使用不锈钢焊料做导电处理,形成导电连接部12。在主体部11的尾端(远离针尖的一端)分别焊接第一电极131、第二电极132。在主体部11和导电连接部12上制备玻璃釉层,以形成保护层14。
于此,该Cu/3YSZ针状发热体10即制备完成。通过三点抗弯强度测试,测量得到该针状发热体10材料的机械强度为160MPa。该发热体10的TCR为1000ppm,且线性度极高,便于控温。稳定性测试表明:该发热体10经过3000次干烧循环测试(通电加热到350℃后2min,关掉电源降到室温,为一次循环)后阻值零衰减。
图5示出了本发明第三实施例中发热体10,其与上述实施例中的主要区别在于,本实施例中的发热体10为片状发热体。
实施例:以下实施例用于说明如何采用简单的“流延-热压-共烧结”工艺制备片状发热体10。显然,本发明的发热体10也可以采用其它工艺最终实现共烧结制备,也在本发明的保护范围内。
按照430L/3YSZ重量比为40:60称取430L(5微米)20g、3YSZ(Y
0.03Zr
0.97O
2)30g,再称取三乙醇胺(TEA)1.5g和酒精30g,一起加入滚筒球磨罐中球磨分散8h,然后加入1.4g聚乙二醇(PEG400)、1.2g邻苯二甲酸二丁酯(DBP)和1.5g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到导电层素坯A(100mm*100mm)。称取3YSZ陶瓷粉体35.1g、三乙醇胺(TEA)1.1g和酒精30g,加入滚筒球磨罐中球磨分散8h,然后加入0.9g聚乙二醇(PEG400)、1g邻苯二甲酸二丁酯(DBP)和1g聚乙烯醇缩丁醛(PVB)继续球磨8h制备得到粘稠度合适的流延用浆料,采用流延法使用300微米刀高制备得到阻隔层素坯B(100mm*100mm)。将两层导电层素坯A、一层阻隔层素坯B和两层导电层素坯A依次叠合在一起,真空塑封后使用温等静压将其压合成为一个素坯整体C。将素坯整体C置于空气中于500摄氏度排胶处理4h后,再将其置于真空炉中于1400℃烧结处理4h后得到具有三明治结构的烧结体D。再将烧结体D切割加工成具有一定尺寸和外形的片状主体部11。将片状主体部11的一端使用不锈钢焊料做导电处理,以形成导电连接部12。在片状主体部11的另一端(远离导电连接部12的一端)分别焊接第一电极131、第二电极132。在主体部11和导电连接部12上制备玻璃釉层,以形成保护层14。
于此,该430L/3YSZ片状发热体10即制备完成。通过三点抗弯强度测试,测量得到该片状发热体10材料的机械强度为400MPa。该发热体10的TCR为1350ppm,且线性度极高,便于控温。稳定性测试表明:该发热体10经过6000次干烧循环测试(通电加热到350℃后2min,关掉电源降到室温,为一次循环)后阻值零衰减。
图6-7示出了本发明第四实施例中发热体10,其与上述实施例中的主要区别在于,本实施例中的阻隔层112将第一导电层111和第二导电层113的部分区域间隔开,第一导电层111及第二导电层113延伸出阻隔层112的部分连接导通,从而无需在主体部11的第一端114设置导电连接部12。
具体地,第一导电层111包括第一导电主体部1111以及位于第一导电主体部1111一端的第一导电连接部1112,第二导电层113包括第二导电主体部1131以及位于第二导电主体部1131一端的第二导电连接部1132。阻隔层112位于第一导电主体部1111和第二导电主体部1131之间,将第一导电主体部1111和第二导电主体部1131完全隔开。第一导电连接部1112由第一导电主体部1111的一端向外延伸出阻隔层112,第二导电连接部1132由第二导电主体部1131的一端向外延伸出阻隔层112,第一导电连接部1112、第二导电连接部1132接触导通,使得主体部11在工作状态有电流回路形成。
其中,该第一导电主体部1111可设置于第一导电主体部1111的端部边缘位置,也可设置于邻近第一导电主体部1111端部边缘的位置。相应地,该第二导电连接部1132可设置于第二导电主体部1131的端部边缘位置,也可设置于邻近第二导电主体部1131端部边缘的位置。
与上述实施例类似,本实施例中的发热体10也可以为片状、柱状或针状等各种形状。此外,本实施例中的发热体10也可以采用叠层后高温共烧结法一步制备得到,结构强度高,制备工艺简单。
该发热体10可通过如下制备工艺制备:
S1、导电层素坯的制备:取适量金属粉体与陶瓷粉体及混合剂均匀混合分散,然后基于分散好的混合物制备导电层素坯A;
S2、阻隔层素坯的制备:
具体地,该阻隔层素坯B的制备可通过以下两种方式实现:
S21、取适量金属粉体与陶瓷粉体及混合剂均匀混合分散,然后基于分散好的混合物制备阻隔层素坯B;该方式适用于阻隔层112的阻隔材料为第二金属陶瓷的情况,与导电层素坯A相比,阻隔层素坯B中的陶瓷含量更高;
或者,
S22、直接取适量陶瓷粉体及混合剂均匀混合分散,然后基于分散好的混合物制备阻隔层素坯B;该方式适用于阻隔层112的阻隔材料为绝缘陶瓷的情况;
S3、取若干层导电层素坯A和若干层阻隔层素坯B以A+B+A的顺序叠合得到素坯整体C;
S4、对素坯整体C进行高温烧结得到烧结体D;
S5、对烧结体D进行机械加工,获得目标尺寸形状的主体部11;
S6、在主体部11的第二端115制备第一电极131、第二电极132;
S7、将主体部11上釉处理,以制备保护层14。
具体地,在本实施例中,导电层素坯A沿第一端114至第二端115延伸方向的长度大于阻隔层素坯B沿第一端114至第二端115延伸方向的长度。在使用该若干层导电层素坯A和若干层阻隔层素坯B进行叠置时,使该若干层导电层素坯A和该若干层阻隔层素坯B在第二端115的端面保持齐平。烧结成型后,导电层素坯A长度多出阻隔层素坯B的部分形成第一导电连接部1112、第二导电连接部1132。
图8-9出了本发明一些实施例中的气溶胶产生装置100,该气溶胶产生装置100可用于对插接于其中的气溶胶形成基质200进行低温烘烤加热,以在不燃烧的状态下释放气溶胶形成基质200中的气溶胶提取物。该气溶胶形成基质200可呈圆柱状,该气溶胶产生装置100大致可呈方形柱状。可以理解地,在其他实施例中,该气溶胶产生装置100并不局限于呈方形柱状,其也可以呈圆柱状、椭圆柱状等其他形状。
该气溶胶产生装置100包括外壳30以及收容于外壳30的发热体10、收容管20、电池40、主板50。该发热体10可以为上述任一实施例中的发热体。
收容管20的内壁面界定出一用于收容气溶胶形成基质200的收容空间21,外壳30的顶壁上开设有用于供气溶胶形成基质200***的插口31,气溶胶形成基质200可经由插口31***到收容空间21中。发热体10的上端(设置有导电连接部12的一端)可伸入到收容空间21中并***到气溶胶形成基质200中,用于在通电发热后对气溶胶形成基质200进行烘烤加热。主板50分别与电池40、发热体10电连接。主板50上布置有相关的控制电路,可借由设置于外壳30上的开关控制电池40与发热体10之间的通断。
可以理解地,上述各技术特征可以任意组合使用而不受限制。
以上实施例仅表达了本发明的具体实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制;应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,可以对上述技术特点进行自由组合,还可以做出若干变形和改进,这些都属于本发明的保护范围;因此,凡跟本发明权利要求范围所做的等同变换与修饰,均应属于本发明权利要求的涵盖范围。
Claims (20)
- 一种发热体,用于气溶胶产生装置,其特征在于,所述发热体包括主体部(11);所述主体部(11)包括第一导电层(111)、阻隔层(112)以及第二导电层(113),其中,所述阻隔层(112)位于所述第一导电层(111)和所述第二导电层(113)之间以将所述第一导电层(111)和所述第二导电层(113)的至少部分区域间隔开;所述第一导电层(111)的一端和所述第二导电层(113)的一端电性导通。
- 根据权利要求1所述的发热体,其特征在于,所述第一导电层(111)、所述第二导电层(113)为导电陶瓷,所述阻隔层(112)为绝缘陶瓷。
- 根据权利要求1所述的发热体,其特征在于,所述第一导电层(111)、所述第二导电层(113)、所述阻隔层(112)均为导电陶瓷,且所述第一导电层(111)及所述第二导电层(113)的电阻率均小于所述阻隔层(112)的电阻率。
- 根据权利要求1所述的发热体,其特征在于,所述第一导电层(111)和所述第二导电层(113)分别对称地设置于所述阻隔层(112)的两相对侧。
- 根据权利要求1所述的发热体,其特征在于,所述第一导电层(111)、所述第二导电层(113)以及所述阻隔层(112)分别由若干层第一导电层素坯、若干层第二导电层素坯以及若干层阻隔层素坯烧结后形成。
- 根据权利要求5所述的发热体,其特征在于,所述主体部(11)由所述若干层第一导电层素坯、所述若干层阻隔层素坯以及所述若干层第二导电层素坯叠合后通过共烧结法一步制备得到。
- 根据权利要求1所述的发热体,其特征在于,所述发热体还包括导电连接部(12),所述导电连接部(12)设置于所述主体部(11)的一端,以将所述第一导电层(111)及所述第二导电层(113)电性导通。
- 根据权利要求1所述的发热体,其特征在于,所述第一导电层(111)及所述第二导电层(113)延伸出所述阻隔层(112)的部分电性导通。
- 根据权利要求1-8任一项所述的发热体,其特征在于,所述发热体还包括设置于所述主体部(11)外表面的保护层(14)。
- 根据权利要求1-8任一项所述的发热体,其特征在于,所述主体部(11)具有第一端(114)以及与所述第一端(114)相对的第二端(115),所述第一导电层(111)、所述第二导电层(113)从所述第一端(114)至所述第二端(115)的电阻率一致或者不一致。
- 根据权利要求1-8任一项所述的发热体,其特征在于,所述发热体还包括分别与所述第一导电层(111)及所述第二导电层(113)的另一端连接的第一电极(131)、第二电极(132)。
- 一种用于制备如权利要求1-11任一项所述的发热体的材料,其特征在于,包括用于制备所述第一导电层(111)和所述第二导电层(113)的导电材料以及用于制备所述阻隔层(112)的阻隔材料;所述导电材料包括第一陶瓷相和第一金属相,所述阻隔材料包括第二陶瓷相。
- 根据权利要求12所述的材料,其特征在于,所述第一金属相与所述第一陶瓷相的重量比在30/70~70/30之间。
- 根据权利要求12所述的材料,其特征在于,所述第一金属相包括Ni、Fe、Cu、Co、不锈钢中的至少一种。
- 根据权利要求12所述的材料,其特征在于,所述第一陶瓷相和所述第二陶瓷相分别包括陶瓷本体材料,所述陶瓷本体材料包括氧化铝、氧化锆、氧化铈、氧化钛、氧化锰、氧化铬、氧化铁、氧化镍、氧化钇、氧化镧、氧化钐、氧化铌、氧化钼、氧化锌中的至少一种。
- 根据权利要求15所述的材料,其特征在于,所述第一陶瓷相和/或所述第二陶瓷相还包括掺杂于所述陶瓷本体材料的掺杂元素。
- 根据权利要求12-16任一项所述的材料,其特征在于,所述阻隔材料还包括第二金属相。
- 根据权利要求17所述的材料,其特征在于,所述第二金属相包括Ni、Fe、Cu、Co、不锈钢中的至少一种。
- 根据权利要求17所述的材料,其特征在于,所述第一金属相与所述第一陶瓷相的重量比大于所述第二金属相与所述第二陶瓷相的重量比。
- 一种气溶胶产生装置,其特征在于,包括权利要求1至11任一项所述的发热体。
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