WO2023164812A1 - 彩膜基板、显示基板及其制造方法、显示装置 - Google Patents

彩膜基板、显示基板及其制造方法、显示装置 Download PDF

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Publication number
WO2023164812A1
WO2023164812A1 PCT/CN2022/078675 CN2022078675W WO2023164812A1 WO 2023164812 A1 WO2023164812 A1 WO 2023164812A1 CN 2022078675 W CN2022078675 W CN 2022078675W WO 2023164812 A1 WO2023164812 A1 WO 2023164812A1
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sub
color filter
pixel
color
substrate
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PCT/CN2022/078675
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English (en)
French (fr)
Inventor
李翔
舒适
于勇
徐传祥
岳阳
张笑
王明星
李伟
何伟
邹浩伟
姚琪
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京东方科技集团股份有限公司
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Priority to CN202280000364.2A priority Critical patent/CN116998251A/zh
Priority to PCT/CN2022/078675 priority patent/WO2023164812A1/zh
Publication of WO2023164812A1 publication Critical patent/WO2023164812A1/zh

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  • the present disclosure relates to the field of display technology, in particular, to a color filter substrate and a manufacturing method thereof, a display substrate and a manufacturing method thereof, and a display device.
  • the color transfer scheme of partitioned micro-inorganic light-emitting diodes is to use the partitioned blue light-emitting diode scheme to divide a large blue light-emitting diode into multiple small light-emitting diodes, which can be controlled independently, which can reduce the number of keystrokes.
  • the luminous efficiency of the device can be improved by using the scheme of adding blue light and color transfer, but the preparation of the color transfer chip requires the color film substrate and the light-emitting element to be boxed.
  • the design problem of the film substrate leads to a thicker bonding glue during bonding, which increases the distance between the color transfer layer and the light-emitting area in the color filter substrate and easily leads to the occurrence of cross-color.
  • the solutions to reduce the risk of cross-color in related technologies mainly include: Changing the refractive index of each film layer or making a lens structure requires the redevelopment of each film layer, which increases the difficulty of development. The thickness of the lens structure is high, which is not conducive to the thinning of the device.
  • a color filter substrate including:
  • a plurality of pixel units are arranged on the base substrate, and each pixel unit includes a plurality of sub-pixels;
  • the pixel unit includes:
  • the retaining wall is disposed on one side of the base substrate, the retaining wall includes a first retaining wall disposed around the periphery of the pixel unit and a second retaining wall disposed between adjacent sub-pixels, the multiple The sub-pixels include a first sub-pixel for color rotation and a second sub-pixel for scattering;
  • a color transfer material layer disposed in the first sub-pixel
  • At least one of the first retaining wall and the second retaining wall is located in the same layer as the scattering material layer and is made of the same material.
  • a side of the first barrier wall away from the base substrate in a direction perpendicular to the plane where the base substrate is located, has a first distance from the base substrate to the base substrate. There is a second distance from the side of the second retaining wall away from the base substrate to the base substrate, and the first distance is greater than the second distance.
  • the pixel unit includes two or more first sub-pixels
  • the second barrier wall between adjacent first sub-pixels has a first sub-distance from the side of the base substrate away from the base substrate to the base substrate
  • the second barrier wall between adjacent first sub-pixels and second sub-pixels has a second sub-pitch from the side of the base substrate away from the base substrate
  • the first sub-pitch is greater than the second sub-pitch.
  • the dimension of at least one boundary of the cross-section of at least one of the first retaining wall and the second retaining wall is greater than the thickness of the scattering material layer, and the cross-section is parallel to The direction of the plane where the base substrate is located.
  • the dimension of at least one boundary of the section of at least one of the first retaining wall and the second retaining wall is greater than or equal to that of the first retaining wall and/or the The thickness of the second retaining wall in a direction perpendicular to the plane where the base substrate is located, and the cross section is parallel to the direction of the plane where the base substrate is located.
  • the thickness of the scattering material layer is smaller than the thickness of the color-shifting material layer.
  • the color filter substrate further includes:
  • the black matrix disposed between the base substrate and the retaining wall, the black matrix includes a plurality of openings, and the openings correspond to the plurality of sub-pixels;
  • a color filter layer the color filter layer includes a first color filter part and a second color filter part
  • the orthographic projection of the first color filter part on the base substrate is located in the opening
  • the orthographic projection of the second color filter portion on the base substrate is located within the orthographic projection of the black matrix on the base substrate.
  • the first sub-pixel includes a first color sub-pixel and a third color sub-pixel
  • the second sub-pixel includes a second color sub-pixel
  • the first color sub-pixel and the third color sub-pixel is located in the first sub-pixel
  • the second color sub-pixel is located in the second sub-pixel.
  • the first color filter part includes:
  • the first color filter layer is disposed on the first color sub-pixel, and the third color filter layer is disposed on the third color sub-pixel.
  • the first color filter part includes:
  • the second color filter layer is arranged on the second color sub-pixel.
  • the thickness of the second color filter part is greater than the thickness of the first color filter part.
  • the second color filter part includes at least two filter layers stacked.
  • the optical density of the material of the retaining wall is in the range of 0.1/um to 0.3/um.
  • the color transfer material layer includes quantum dot material.
  • the color filter substrate further includes:
  • An encapsulation layer is disposed on a side of the retaining wall away from the base substrate, and the encapsulation layer covers at least one of the retaining wall, the color transfer material layer and the scattering material layer.
  • a display substrate including:
  • a light-emitting element disposed on the side of the color filter substrate away from the base substrate;
  • a bonding material layer arranged between the color filter substrate and the light emitting element.
  • the light emitting element includes MicroLED or OLED.
  • the bonding material layer between the color transfer material layer of the color filter substrate and the light emitting element has a first thickness
  • the bonding material layer between the scattering material layer of the color filter substrate and the light emitting element has a second thickness
  • the first thickness is smaller than the second thickness.
  • Another aspect of the present disclosure provides a method for manufacturing a color filter substrate, including:
  • each pixel unit including a plurality of sub-pixels
  • Forming a pixel unit includes:
  • Forming a retaining wall on one side of the base substrate, forming a retaining wall includes forming a first retaining wall disposed around the periphery of the pixel unit and forming a second retaining wall disposed between adjacent sub-pixels, the multiple The sub-pixels include a first sub-pixel for color rotation and a second sub-pixel for scattering;
  • the scattering material layer and the retaining wall are formed by one patterning process.
  • a method for manufacturing a display substrate including:
  • a bonding glue is formed on the side of the color transfer material layer of the color filter substrate away from the base substrate, and the bonding glue is located in the first sub-pixel;
  • Another aspect of the present disclosure provides a display device, including: the above-mentioned display substrate.
  • FIG. 1A is a schematic plan view of a color filter substrate according to an exemplary embodiment of the present disclosure
  • FIG. 1B is a schematic plan view of a color filter substrate according to another exemplary embodiment of the present disclosure.
  • Fig. 2 is a schematic cross-sectional view of a color filter substrate along line AA' in Fig. 1A according to an exemplary embodiment of the present disclosure
  • Fig. 3A schematically shows the curve relationship between the film thickness and brightness data of different scattering material layers obtained by testing
  • Fig. 3B schematically shows a schematic cross-sectional view of the retaining wall of the color filter substrate according to the embodiment of the present disclosure along the line BB' in Fig. 2;
  • FIG. 4 is a flowchart of a method of manufacturing a color filter substrate according to an exemplary embodiment of the present disclosure
  • FIG. 5 is a flowchart of a method of manufacturing a color filter substrate after operation S20 according to an exemplary embodiment of the present disclosure
  • 6A to 6G are cross-sectional views during the manufacturing process of the color filter substrate corresponding to the color filter substrate manufacturing method according to an exemplary embodiment of the present disclosure
  • FIG. 7 is a cross-sectional view of a display substrate according to an exemplary embodiment of the present disclosure.
  • FIG. 8 is a flowchart of a method of manufacturing a display substrate according to an exemplary embodiment of the present disclosure
  • 9A to 9C are cross-sectional views during a manufacturing process of a display substrate corresponding to a display substrate manufacturing method according to an exemplary embodiment of the present disclosure
  • Fig. 10 is a schematic diagram of a display device according to an exemplary embodiment of the present disclosure.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • connection When describing some embodiments, the expression “connected” and its derivatives may be used.
  • electrically connected may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • parallel As used herein, “parallel”, “perpendicular”, and “equal” include the stated situation and the situation similar to the stated situation, the range of the similar situation is within the acceptable deviation range, wherein the The stated range of acceptable deviation is as determined by one of ordinary skill in the art taking into account the measurement in question and errors associated with measurement of the particular quantity (ie, limitations of the measurement system).
  • “parallel” includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; Deviation within 5°.
  • “Equal” includes absolute equality and approximate equality, where the difference between the two that may be equal is less than or equal to 5% of either within acceptable tolerances for approximate equality, for example.
  • a layer or element when referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or that the layer or element can be on another layer or substrate. There is an intermediate layer in between.
  • the "same layer” in this article refers to the layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using a mask to form a patterning process.
  • a patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure can be continuous or discontinuous, and these specific patterns may also be at different heights Or have different thicknesses.
  • heterolayer refers to the layer structure formed by using the corresponding film forming process to form the film layer for forming a specific pattern, and then using the corresponding mask plate to form the layer structure through the patterning process, for example, "two layer structure "Different layer arrangement” refers to the formation of two layer structures under corresponding process steps (film-forming process and patterning process).
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations in shape from the drawings as a result, for example, of manufacturing techniques and/or tolerances are contemplated.
  • example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • the term "color conversion” refers to the conversion of the color of light, converting light of a certain color into light of another color.
  • the blue light is converted into light of a red material by using different color transfer materials and a red filter layer.
  • another color transfer material and a green filter layer are used to convert blue light into light of a green material.
  • scattering refers to the modulation of the intensity of light by means of scattering particles placed inside a solvent or other material.
  • scattering particles such as titanium dioxide are set in acrylic resin to form a scattering material layer, so as to adjust the intensity of light.
  • an embodiment of the present disclosure provides a color filter substrate, the color filter substrate includes but is not limited to a base substrate; a plurality of pixel units are arranged on the base substrate, and each pixel unit includes a plurality of sub-pixels
  • the pixel unit includes: a retaining wall disposed on one side of the base substrate, the retaining wall includes a first retaining wall disposed around the periphery of the pixel unit and a second retaining wall disposed between adjacent sub-pixels, and the plurality of sub-pixels include The first sub-pixel for color transfer and the second sub-pixel for scattering; the color transfer material layer is arranged in the first sub-pixel; the scattering material layer is arranged in the second sub-pixel; wherein, the first At least one of the retaining wall and the second retaining wall is located in the same layer as the scattering material layer and is made of the same material.
  • the scattering material layer is set to be made of the same material as the retaining wall.
  • the thickness of the scattering material layer is reduced, which is convenient for subsequent processes to provide more areas to accommodate keys when bonding with electronic components.
  • the combined material layer can effectively reduce the risk of cross-color, improve the display effect and product yield.
  • FIG. 1A is a schematic plan view of a color filter substrate according to an exemplary embodiment of the present disclosure.
  • FIG. 1B is a schematic plan view of a color filter substrate according to another exemplary embodiment of the present disclosure.
  • Fig. 2 is a schematic cross-sectional view of a color filter substrate along line AA' in Fig. 1A according to an exemplary embodiment of the present disclosure.
  • a color filter substrate 100 (100') includes a base substrate 10 (10') and a plurality of pixel units 20 (20').
  • a plurality of pixel units 20 are disposed on the base substrate 10 , and each pixel unit 20 includes a plurality of sub-pixels.
  • FIG. 1A exemplarily shows that a plurality of sub-pixels are arranged in parallel and arranged in a row in each pixel unit
  • FIG. 1B exemplarily shows that a plurality of sub-pixels are arranged in a matrix and arranged in multiple rows in each pixel unit.
  • the pixel unit 20 includes a barrier wall 21 (21'), the barrier wall 21 is arranged on one side of the substrate 10, the barrier wall 21 forms a plurality of pixel units 20 and a plurality of sub-pixels 30 around, each sub-pixel 30 (30') includes a first sub-pixel 31 (31') and a second sub-pixel 32 (32').
  • the first sub-pixel 31 is used for color conversion, for example, converting blue light into red light.
  • the second sub-pixel 32 is used for scattering, for example, scattering the blue light to change the intensity of the blue light and the like.
  • the base substrate 10 may include a glass backplane or the like, for example.
  • the color transfer material layer 40 is disposed in the first sub-pixel 31
  • the scattering material layer 50 is disposed in the second sub-pixel 32 .
  • the color-shifting material layer 40 may include, for example, a first color-shifting material layer 41 and a second color-shifting material layer 42 , and different color-shifting material layers 40 may perform color shifting for different incident lights.
  • the first color conversion material layer 41 is used for color conversion of light incident on a first sub-pixel 31 , for example, color conversion of incident blue light (Blue) into red light (Red).
  • the second color conversion material layer 42 is used for color conversion of light incident on another first sub-pixel 31 , for example, color conversion of incident blue light (Blue) into green light (Green).
  • the color transfer material layer includes quantum dots (Quantum Dots, QD for short) material.
  • the number of first sub-pixels in each pixel unit can be set according to actual needs, for example, 2, 3 and so on.
  • the number of color transfers performed on different colors in the color transfer material layer may correspond to the number of the first sub-pixels, and may also be set according to actual design requirements. For example, there may be 2, 3, etc. color transfer material layers for performing color transfer to different colors.
  • the color-transfer material layer may include resin, such as an acrylic-based material, and the materials of the first color-transfer material layer and the second color-transfer material layer may be the same or different.
  • the scattering material layer 50 is disposed inside the second sub-pixel 32 .
  • the scattering material layer 50 can adjust the intensity of incident light.
  • the scattering material layer 50 is used to adjust the intensity of light incident on the second sub-pixel 32 .
  • the light intensity of the incident blue light (Blue) is adjusted.
  • the scattering material layer 50 may include, for example, a matrix and a scattering particle dispersed in the matrix.
  • the matrix includes a thermosetting resin, such as acrylic resin
  • the scattering particles include one or a combination of titanium dioxide, silicon dioxide, organosilicon compounds, and polystyrene.
  • an encapsulation layer 60 is disposed on a side of the barrier wall 21 away from the base substrate 10 .
  • the encapsulation layer 60 covers at least one of the barrier wall 21 , the color transfer material layer 40 and the scattering material layer 50 .
  • the encapsulation layer 60 is used to encapsulate the barrier wall 21, the color transfer material layer 40 and the scattering material layer 50, so as to ensure that the color transfer material layer 40 and the scattering material layer 50 will not be damaged by the intrusion of moisture or other substances, or Defects are generated, affecting the color transfer effect of the color transfer material layer 40 and/or the scattering effect of the scattering material layer 50 .
  • the scattering material layer 50 is located at the same layer as the retaining wall 21 and is made of the same material.
  • the scattering material layer 50 and the barrier wall 21 are located on the same layer and are made of the same material. It can be understood that the scattering material layer 50 and the barrier wall 21 are formed on the same layer through the same process during preparation, and they are formed on the same layer during photolithography.
  • the mask process is etched to form the scattering material layer and the retaining wall, which can effectively reduce the manufacturing process of the manufacturing process and improve the manufacturing efficiency.
  • the same material is used for the scattering material layer 50 and the retaining wall 21 during the manufacturing process.
  • Materials of the barrier wall 21 and the scattering material layer 50 include materials as described above, such as acrylic-based materials and the like.
  • the scattering material layer 50 and the retaining wall 21 are made of the same material, so that the retaining wall 21 and the scattering material layer 50 can be prepared simultaneously through one mask preparation method.
  • the material consumption can be saved, for example, other materials specially used for the scattering material layer can be reduced.
  • one photolithography process can be reduced, the process can be simplified, and the production efficiency can be improved.
  • the optical density value (OD, Optical Density) of the material for preparing the retaining wall 21 is in the range of 0.1/um to 0.3/um, for example, 0.15/um or 0.2/um or 0.25 /um.
  • the height of the retaining wall material is generally set to be greater than 12um, and the critical dimension (CD value) in the process is greater than 20um. It is calculated that the longitudinal transmittance of the retaining wall material is less than 0.4%, and the transverse transmittance is less than 0.01%. Therefore, there is no horizontal or vertical crosstalk problem with the wall material.
  • Transmittance refers to the ability of light to pass through the medium after passing through the medium.
  • Lateral transmittance refers to the ability of light to pass through the barrier when it passes through the barrier in the transverse direction (parallel to the plane of the substrate)
  • longitudinal transmittance refers to the ability of light to pass through the barrier in the longitudinal direction (perpendicular to the substrate). The direction of the plane in which it is located) the ability to pass through the retaining wall when passing through.
  • the thickness of the scattering material layer 50 can be reduced by making the scattering material layer 50 and the retaining wall 21 the same material, because the transmittance of the material for preparing the retaining wall 21 has a corresponding relationship with the thickness.
  • the transmittance is between 10% and 60% when the film thickness of the scattering material layer 50 is set in the range of 1um to 5um.
  • the film thickness of the scattering material layer 50 can be selected according to the transmittance requirement and viewing angle matching.
  • FIG. 3A schematically shows the curve relationship between film thickness and luminance data of different scattering material layers obtained through testing.
  • the optical density value of the material of the existing scattering material layer is 0.1/um.
  • each curve represents the viewing angle data, and the curve indicating the film thickness in the coordinates is the film thickness.
  • the viewing angle data of the thick lower scattering material layer blue refers to the viewing angle of the backlight, and QD refers to the viewing angle of the color transfer material layer.
  • the concentration of titanium dioxide indicates the concentration of scattering particles in the scattering material layer.
  • the backlight brightness at different angles can be obtained by changing the position of the charge-coupled device (CCD), and the viewing angle curve can be obtained by normalizing the brightness data. The flatter the curve in Figure 3A, the better the viewing angle.
  • the viewing angle test of the scattering material layer is to place a film made of a scattering material layer on the backlight for testing.
  • QD is to put a film made of a color transfer material layer on the backlight. slices for testing.
  • the scattering material layer in the embodiment of the disclosure is made of the same material as the retaining wall, and the optical density value of the scattering material layer in the embodiment of the disclosure is 0.1um to 0.3/
  • the range of um, for example, can be 0.2/um, 0.25/um, etc. Therefore, the thickness of the scattering material layer can be reduced with the same transmittance.
  • the scattering material layer 50 and the retaining wall 21 are made of the same material, and the optical density of the material is in the range of 0.2/um to 0.25/um, for example, the optical density value is determined to be 0.2/um .
  • the film thickness of the scattering material layer 50 can be reduced under the premise of keeping the scattering performance of the scattering material layer 50 unchanged. Therefore, the distance between the side of the scattering material layer away from the base substrate and the side of the base substrate is reduced, that is, the distance between the scattering material layer and the light-emitting element is increased, which is conducive to filling the substrate for bonding the color filter at this position. And the holding capacity of the bonding glue or bonding material layer of the light-emitting element.
  • the optical density of the scattering material layer in the prior art is at least 0.1/um.
  • the optical density of the retaining wall material is at least 0.2/um.
  • the thickness of the scattering material layer made of the retaining wall material can be reduced from the original 9.5um to less than 5um, while keeping the viewing angle performance unchanged.
  • the retaining wall 21 surrounds and forms a plurality of pixel units and a plurality of sub-pixels in the pixel units.
  • the blocking wall 21 (21') includes a first blocking wall 211 (211') arranged around the periphery of the pixel unit 20 and a second blocking wall located between adjacent sub-pixels. Wall 212 (212').
  • first distance H1 from the side of the first barrier wall 211 away from the base substrate 10 to the base substrate 10
  • second distance H2 the first distance H1 being greater than the second distance H2.
  • the first retaining wall 211 surrounds the periphery of each pixel unit 20 .
  • the cross-sectional structure of a pixel unit in FIG. 1A is shown in the figure, and the retaining wall located on the peripheral side of each pixel unit is the first retaining wall 211, such as the retaining walls on both sides in FIG. 2 It is the first retaining wall 211.
  • the retaining wall between the two first retaining walls 211 is the second retaining wall 212 .
  • the second barrier 212 is located between adjacent sub-pixels.
  • the second barrier 212 includes a third barrier 213 located between the first color transfer material layer 41 and the second color transfer material layer 42 and a third barrier wall 213 located between the second color transfer material layer 42 and the scattering material layer 50 Four retaining walls 214.
  • the second barrier wall 212 provided between adjacent sub-pixels may include a plurality, and each second barrier wall 212 between adjacent sub-pixels Heights can vary.
  • the second spacing H2 between the side of the second barrier wall 212 away from the base substrate and the base substrate 10 between the adjacent sub-pixels is smaller than that of the first barrier wall 211 from the side away from the base substrate 10 to
  • the base substrate 10 has a first pitch H1. That is, in the color filter substrate of the embodiment of the present disclosure, all the second distances H2 are smaller than the first distance H1.
  • the side of the third barrier 213 away from the base substrate 10 has a second distance H21 from the base substrate 10
  • the side of the fourth barrier 214 away from the base substrate 10 has a second distance from the base substrate 10. H22.
  • H1 is greater than H21 and H1 is greater than H22.
  • the pixel unit 20 includes two or more first sub-pixels 31, and in the direction perpendicular to the plane where the base substrate 10 is located, the adjacent first sub-pixels 31 There is a first sub-distance between the second barrier wall 211 between the side away from the base substrate and the base substrate 10 , such as H21 in FIG. 2 .
  • the second barrier wall 211 between adjacent first sub-pixels 31 and second sub-pixels 32 has a second sub-pitch H22 from the side away from the base substrate to the base substrate 10, and the first sub-pitch H21 is larger than the first sub-pitch H21. Two sub-distances H22.
  • the second retaining wall 212 includes a third retaining wall 213 and a fourth retaining wall 214 .
  • the third barrier 213 is disposed between two adjacent first sub-pixels 31 .
  • the fourth barrier 214 is disposed between adjacent first sub-pixels 31 and second sub-pixels 32 . It can be seen from the above that the third barrier wall 213 has a first sub-distance H21 from the base substrate 10 , and the fourth barrier wall 214 has a second sub-distance H22 from the base substrate 10 .
  • the first sub-pitch H21 of the third barrier wall 213 in the second barrier wall between adjacent first sub-pixels 31 is greater than or equal to that between adjacent first sub-pixels 31 and second sub-pixels 32
  • the second sub-pitch H22 of the fourth barrier wall 214 in the second barrier wall is greater than or equal to that between adjacent first sub-pixels 31 and second sub-pixels 32.
  • the scattering material layer and the retaining wall material using the same material and the same process, it is possible to reduce the thickness of the scattering material layer while ensuring the same display effect, thereby During the subsequent bonding of the light-emitting elements, a large accommodation space is provided for the bonding material layer, so as to prevent the overflow of the material of the bonding material layer during bonding.
  • At least one border of the cross-section of at least one of the first barrier and the second barrier has a dimension greater than the thickness of the scattering material layer, and the cross-section is parallel to the direction of the plane of the substrate.
  • FIG. 3B schematically shows a cross-sectional view of the barrier wall of the color filter substrate according to the embodiment of the present disclosure along the line BB' in FIG. 2 .
  • the retaining wall 21 includes a first retaining wall 211 and a second retaining wall 212
  • the second retaining wall 212 includes a third retaining wall 213 and a fourth retaining wall 214
  • a schematic cross-sectional view of the third retaining wall 213 along line BB' is shown in FIG. 3B .
  • the cross section along BB' of the first barrier wall and the second barrier wall is parallel to the direction of the plane where the base substrate 10 is located.
  • the border of the section of the third retaining wall 213 along BB' includes a first border 2131 and a second border 2132
  • the size of the border of the first border 2131 represents the length B1 of the first border 2131
  • the size of the border of the second border 2132 Denotes the length B2 of the second boundary 2132 .
  • the dimension of the cross-section of the first barrier wall and/or the second barrier wall along the plane parallel to the base substrate may be determined according to the examples described above.
  • the thickness of the scattering material layer 50 is shown as D1 in FIG. 2 .
  • both the dimension B1 of the first boundary 2131 and the dimension B2 of the second boundary 2132 are greater than the thickness D1 of the scattering material layer 50 . It can ensure that the scattering material layer 50 has a good light scattering effect without affecting the transmittance. At the same time, it can ensure that the retaining wall has a good light shielding effect, avoid cross-color between adjacent sub-pixels, and improve the display effect.
  • the size of at least one boundary of the section of at least one of the first barrier wall and the second barrier wall is greater than or equal to that of the first barrier wall and/or the second barrier wall perpendicular to the substrate.
  • the thickness in the direction of the plane where the substrate is located, and the section is parallel to the direction of the plane where the substrate is located.
  • the dimension B1 of the first border 2131 and/or the dimension B2 of the second border 2132 of the section of the third retaining wall 213 in the second retaining wall 212 is greater than or equal to the third retaining wall in the vertical Thickness D2 in the plane direction of the base substrate.
  • the boundary of the section of the retaining wall (including the first retaining wall and the second retaining wall) can be determined according to the above examples.
  • the barrier wall by determining the boundary of the section of the barrier wall along the direction parallel to the plane of the base substrate to be greater than or equal to the thickness of the barrier wall in the direction perpendicular to the plane of the base substrate, it is ensured that the barrier wall has a better
  • the effect of blocking light prevents the problem of cross-color between adjacent sub-pixels.
  • the thickness of the scattering material layer is smaller than the thickness of the color transfer material layer.
  • the color transfer material layer 40 has a thickness D3 in a direction perpendicular to the plane of the base substrate
  • the scattering material layer 50 has a thickness D1 in a direction perpendicular to the plane of the base substrate.
  • D1 is smaller than D3, so as to ensure that the color filter substrate can accommodate more bonding materials at the position of the scattering material layer 50 relative to the position of the color transfer material layer 40 .
  • the color filter substrate 100 further includes a black matrix 70 and a color filter layer 80 .
  • the black matrix 70 is disposed between the base substrate 10 and the barrier wall 21 , and the black matrix 70 includes a plurality of openings 701 corresponding to a plurality of sub-pixels.
  • the color filter layer 80 covers the black matrix 70 and the base substrate 10 .
  • the color filter layer 80 includes a first color filter part 801 and a second color filter part 802 .
  • the orthographic projection of the first color filter part 801 on the base substrate 10 is located in the opening 701 .
  • the orthographic projection of the second color filter portion 802 on the base substrate 10 is located within the orthographic projection of the black matrix 70 on the base substrate.
  • the color filter layer 80 covers the side of the black matrix 70 away from the base substrate, and the color filter covers the base substrate in the region of the opening 701 .
  • the first color filter part 801 is disposed in the opening 701 formed by the black matrix 70
  • the second color filter part 802 covers the area where the black matrix 70 is located.
  • the black matrix 70 can block light, so that the light passing through the color filter layer 80 enters the target area through the opening 701 formed by the black matrix 70 .
  • the black matrix 70 may be formed by an inkjet method, and the formation of the black matrix 70 by the inkjet method does not require an additional mask process and/or photolithography process, which can simplify the manufacturing process and reduce the manufacturing cost.
  • setting the color filter layer 80 includes setting a first color filter part 801 and a second color filter part 802 .
  • the color filters of the second color filter part 802 may be the same or different, or partly the same.
  • the color filters of the second color filter part 802 include color filters of multiple colors.
  • the plurality of sub-pixels include a first color sub-pixel Z1, a second color sub-pixel Z2 and a third color sub-pixel Z3, and the first color sub-pixel Z1 and the third color sub-pixel
  • the pixel Z3 is located in the first sub-pixel 31
  • the second color sub-pixel Z2 is located in the second sub-pixel 32 .
  • the first sub-color pixel Z1 is, for example, a red sub-pixel R (Red)
  • the third color sub-pixel Z3 is, for example, a green sub-pixel G (Green)
  • the second color sub-pixel Z2 is, for example, a blue sub-pixel B ( Blue)
  • the red sub-pixel R and the green sub-pixel G are located in the first sub-pixel 31, and the blue sub-pixel B is located in the second sub-pixel 32.
  • the first sub-pixel 31 includes a first region 311 corresponding to the first color-transfer material layer 41 , and the first sub-pixel 31 further includes a second region 312 corresponding to the second color-transfer material layer 42 .
  • the red sub-pixel R is located in the first area 311
  • the green sub-pixel G is located in the second area 312 .
  • the plurality of sub-pixels may also include sub-pixels of other colors, such as white sub-pixels, and the positions of the plurality of sub-pixels may be adjusted according to actual needs to meet the requirements of different light emitting elements.
  • the color of the second color sub-pixel located in the second sub-pixel is consistent with the luminous color of the light-emitting element, and the colors of the first-color sub-pixel and the third-color sub-pixel located in the first sub-pixel are inconsistent with the luminous color of the light-emitting element.
  • the color of the second color sub-pixel located in the second sub-pixel is kept consistent with the light emitting color of the light-emitting element, that is, a scattering material layer needs to be provided in the second pixel area, and the scattering material layer is consistent with the barrier wall.
  • the manufacturing materials and manufacturing process are the same, thereby reducing the manufacturing process of the color filter substrate, and at the same time reducing the thickness of the scattering material layer, providing more accommodation space for the bonding material layer when bonding light-emitting elements on the color filter substrate. , improve the display effect and reduce the abnormal light emission.
  • the first color filter part 801 includes a first color filter layer 81 disposed on the first sub-color pixel, for example, a red filter layer disposed on the red sub-pixel R;
  • the third color filter layer 82 of the pixel for example, the green filter layer disposed on the green sub-pixel G; and the second color filter layer 83 disposed on the second color sub-pixel, such as disposed on the blue sub-pixel B Blue filter layer.
  • the red filter layer makes the light entering the target area a red light
  • the green filter layer makes the light entering the target area a green light
  • the blue filter layer makes the light entering the target area a blue light .
  • the first color filter part may also be provided with filter layers of other colors as required, so as to meet the requirements of different color filters.
  • the second color filter part includes at least two filter layers stacked.
  • the second color filter part 802 may be an intersecting area of different color filter layers.
  • the filter layers of different colors overlap or stack due to different process sequences.
  • a color filter layer with multiple color filter layers is formed.
  • two filter layers are included between the first barrier wall 21 and the black matrix 70 .
  • a green filter layer and a blue filter layer are stacked between the first barrier wall 21 and the black matrix 70 close to the red sub-pixel R.
  • red filter layers between the third barrier 213 and the black matrix 70 there are stacked and overlapping red filter layers, green filter layers and blue filter layers.
  • a part of the red filter layer is covered by the green filter layer, and the blue filter layer is stacked on the green filter layer.
  • the thickness of the second color filter part 802 is greater than the thickness of the first color filter part 801 .
  • the second color filter part 802 includes at least two filter layers, and the first color filter part 801 includes one filter layer.
  • the thickness of the second color filter part 802 is greater than the thickness of the first color filter part 801, the difficulty of preparing a high-thickness retaining wall can be reduced.
  • the color filter layer 80 includes a red filter layer 81, a green filter layer 82, and a blue filter layer. Filter layer 83.
  • the color filter layer 80 first coat the red filter layer 81, then coat the green filter layer 82, and finally coat the blue filter layer 83.
  • the red filter layer covers A part of the black matrix 70, and then continue to form the third color filter layer 82, such as the green filter layer, the green filter layer overlaps the red filter layer at the position of the second color filter part 802, due to the existence of the coating process
  • the phenomenon of shape following described above continues to form the second color filter on the side of the first color filter layer 81 away from the base substrate at the position of the second color filter part 802 where the third barrier 213 is located.
  • Layer 83 continues to form a green filter layer with a certain thickness on the side of the red filter layer far away from the base substrate, and continues to be at the position where the second color filter part 802 is located when coating other color filter layers. Continue to form filter layers of corresponding colors, so that the thickness of the color filter layer at the position of the second color filter part 802 is greater than the thickness of the color filter layer at the position of the first color filter part 801 .
  • the materials and processes for forming the scattering material layer and the retaining wall are the same, and under the preparation conditions and processes, there is a limit condition for the formed height difference.
  • the embodiment of the present disclosure utilizes the shape following phenomenon of the coating process, and the thickness of the color filter layer formed in the second color filter part is greater than the thickness of the color filter layer formed in the first color filter part, which can effectively reduce the thickness of the color filter layer formed in the color filter part.
  • the thickness of the retaining wall formed on the side of the film layer away from the base substrate reduces the process difficulty of preparing patterns with different height differences on the same layer of the retaining wall and the scattering material layer.
  • a positive resist solution may be used to form the scattering material layer and the retaining wall, and a halftone mask is used to realize one-time preparation of the retaining wall and the scattering material layer with different thicknesses.
  • the negative photoresist solution is adopted.
  • the film thickness and the exposure amount are positively correlated.
  • different thicknesses of the barrier can be realized by using a halftone mask. and one-time preparation of the scattering material layer.
  • the main photospacer and sub photospacer in existing LCD products are prepared by the halftone mask process.
  • a negative glue solution is adopted in the process of forming the scattering material layer and the retaining wall. It is difficult to realize a high step difference process in the same layer of negative glue, and a mask can be used for the scattering material layer alone preparation.
  • the contact positions of the film layers of different colors of the color film can be overlapped, and the height of the scattering material layer of the retaining wall can be realized by using the step difference at the overlap of the color film Difference.
  • the display using the above-mentioned color filter substrate may include but not limited to QD-OLED, QD-LCD, QD-LED and the like.
  • FIG. 4 is a flowchart of a method of manufacturing a color filter substrate according to an exemplary embodiment of the present disclosure.
  • FIG. 5 is a flowchart of a method of manufacturing a color filter substrate after operation S20 according to an exemplary embodiment of the present disclosure.
  • 6A to 6G are cross-sectional views during the manufacturing process of the color filter substrate corresponding to the manufacturing method of the color filter substrate according to an exemplary embodiment of the present disclosure.
  • Some embodiments of the present disclosure also provide a manufacturing method of a color filter substrate, as shown in FIGS. 4 to 6G , the manufacturing method includes operation S10 to operation S23 .
  • a base substrate is formed. As shown in FIG. 6A , a base substrate 10 is formed.
  • each pixel unit including a plurality of sub-pixels.
  • operation S21 may include operation S21 to operation S24 after operation S20. That is, forming a pixel unit includes operations S21 to S23.
  • a retaining wall 21 is formed on one side of the base substrate 10, and the retaining wall 21 surrounds a plurality of pixel units and a plurality of sub-pixels in the pixel unit, and the plurality of sub-pixels include a first sub-pixel for performing color transfer. 31 and a second sub-pixel 32 for scattering.
  • a retaining wall 21 is formed, wherein the retaining wall 21 includes a first retaining wall 211 disposed around a pixel unit and a second retaining wall 212 disposed between adjacent sub-pixels, the second retaining wall 212 includes the wall between the first sub-color pixel and the third color sub-pixel and the wall between the first color sub-pixel and the second color sub-pixel, for example, the first color sub-pixel R and the green sub-pixel G
  • the third barrier 213 and the fourth barrier 214 between the green sub-pixel G and the blue sub-pixel B.
  • the color transfer material layer 40 is formed in the first sub-pixel 31 .
  • a color-transfer material layer 40 is formed, including a first color-transfer material layer 41 located in the red sub-pixel R and a second color-transfer material layer 42 located in the green sub-pixel G.
  • the scattering material layer 50 is formed in the second sub-pixel 32 .
  • the scattering material layer and the retaining wall are formed by one patterning process.
  • the scattering material layer 50 is formed.
  • the sequence between operation S23 and operation S22 may be that operation S23 is performed first, and then operation S22 is performed.
  • operation S23 is performed at the same time to form a scattering material layer 50 in the second sub-pixel 32, and the scattering material layer 50 and the barrier wall 21 use the same process and manufactured through the same mask.
  • the same material is used for the scattering material layer and the retaining wall.
  • the manufacturing process of the color filter substrate can be reduced, the amount of materials used can be saved, and the manufacturing cost can be reduced.
  • the thickness of the scattering material layer provides more accommodation space for the bonding material layer when the subsequent color filter substrate is bonded to the light-emitting element, and prevents the bonding material layer from overflowing during bonding.
  • operation S22 may be performed first, and then operation S23 is performed.
  • an encapsulation layer 60 is formed on the side of the retaining wall 21 away from the base substrate, and the encapsulation layer 60 covers the retaining wall 21, the color transfer material layer 40 and the scattering material.
  • Layer 50 Encapsulate the retaining wall, the color transfer material layer and the scattering material layer through the encapsulation layer to ensure that the color transfer material layer 40 and the scattering material layer 50 will not be damaged by the intrusion of moisture or other substances, or have defects that affect the color.
  • the color transfer effect of the transfer material layer 40 and/or the scattering effect of the scattering material layer 50 are examples of the transfer material layer 40 and/or the scattering effect of the scattering material layer 50.
  • an encapsulation layer 60 is formed on a side of the barrier wall 21 , the color transfer material layer 40 and the scattering material layer 50 away from the base substrate.
  • forming the barrier wall 21 on one side of the base substrate 10 includes forming a first barrier wall 211 disposed around the periphery of the pixel unit and forming a first barrier wall 211 disposed between adjacent sub-pixels.
  • the second retaining wall 212 In the direction perpendicular to the plane where the base substrate is located, there is a first distance H1 between the side of the first barrier wall 211 away from the base substrate and the base substrate, and the side of the second barrier wall 212 away from the base substrate to the substrate.
  • the base substrate has a second distance H2, and the first distance H1 is larger than the second distance H2.
  • the first sub-distance from the side of the second barrier located between adjacent first sub-pixels away from the base substrate to the base substrate is greater than or equal to
  • the second barrier wall located between adjacent first sub-pixels and second sub-pixels has a second sub-distance from one side of the base substrate to the base substrate.
  • operations S201 to S202 are further included.
  • a black matrix 70 is formed between the base substrate 10 and the barrier wall 21, the black matrix 70 includes a plurality of openings 701 corresponding to the plurality of sub-pixels. As shown in FIG. 6A , a black matrix 70 is formed on the base substrate 10 , and the black matrix has a plurality of openings 701 .
  • the color filter layer 80 is formed, and the color filter layer 80 includes a first color filter part 801 and a second color filter part 802, wherein the orthographic projection of the first color filter part 801 on the base substrate is located in the opening 701 ; The orthographic projection of the second color filter portion 802 on the base substrate is located within the orthographic projection of the black matrix 70 on the base substrate 10 .
  • the thickness of the formed second color filter part is greater than the thickness of the formed first color filter part.
  • a first filter layer 81 is formed on the first sub-pixel Z1 , for example, a red filter layer is formed on the red sub-pixel R.
  • a third filter layer 82 is formed in the third sub-pixel Z3, for example, a green filter layer 82 is formed in the green sub-pixel G.
  • a third filter layer 82 is formed in the second sub-pixel Z2
  • the second filter layer 83 forms a blue filter layer on the blue sub-pixel B.
  • the color filter layer 80 including the first filter layer 81 , the third filter layer 82 and the second filter layer 83 is formed.
  • FIG. 7 is a cross-sectional view of a display substrate according to an exemplary embodiment of the present disclosure.
  • the display substrate 1000 includes the color filter substrate 100 as described above and a light emitting element 200 disposed on the side of the color filter substrate away from the base substrate.
  • the light emitting element 200 is connected to the color filter substrate 100 through a bonding material layer 300 Bond.
  • the light emitting element 200 includes a light emitting unit 210 for emitting light of a preset color.
  • the light emitting unit 210 in this embodiment is used to emit blue light.
  • the light emitting unit can be used to emit light of other colors, such as red light.
  • the light emitting element 200 includes, for example, Micro LED or OLED.
  • the bonding material layer between the color transfer material layer of the color filter substrate and the light-emitting element has a first thickness D4, and the layer between the scattering material layer of the color filter substrate and the light-emitting element
  • the bonding material layer has a second thickness D5, and the first thickness D4 is smaller than the second thickness D5.
  • the second thickness D5 is smaller than the first thickness D4, so that when forming the bonding material layer, there is a larger distance between the scattering material layer and the light-emitting element to accommodate more bonding materials, The problem of overflow of the bonding material caused when the light-emitting element 200 is bonded to the color filter substrate 100 is prevented.
  • FIG. 8 is a flowchart of a method of manufacturing a display substrate according to an exemplary embodiment of the present disclosure.
  • 9A to 9C are cross-sectional views during the manufacturing process of a display substrate corresponding to a display substrate manufacturing method according to an exemplary embodiment of the present disclosure.
  • Some embodiments of the present disclosure also provide a method for manufacturing a display substrate. As shown in FIG. 8 to FIG. 9C , the specific process includes operation S100 to operation S300.
  • the color filter substrate is formed by the method for manufacturing the color filter substrate described above, and the formed color filter substrate is shown in FIG. 9A .
  • a bonding glue is formed on a side of the color transfer material layer of the color filter substrate away from the base substrate, and the bonding glue is located in the first sub-pixel, as shown in FIG. 9B .
  • the formed bonding glue is located in the first pixel, that is, the orthographic projection of the formed bonding glue on the substrate overlaps with the orthographic projection of the color transfer material layer on the substrate, and forms The orthographic projection of the bonding glue on the substrate does not overlap with the orthographic projection of the scattering material layer on the substrate.
  • the light-emitting element is bonded on the color filter substrate, so that the bonding glue flows from the position of the first sub-pixel of the color filter substrate to the position of the second sub-pixel of the color filter substrate to form a bonding material layer, as shown in Figure 9C.
  • the bonding glue is located at the position of the first sub-pixel of the color filter substrate.
  • the bonding glue is driven by external pressure from the position of the first sub-pixel of the color filter substrate toward the color filter.
  • the position of the second sub-pixel of the substrate flows, and fills the area between the scattering material layer and the light-emitting element, finally forming a bonding material layer.
  • the bonding glue 300 is formed on the side of the color filter substrate 100 away from the base substrate, for example, on the side of the first color transfer material layer 41 and the second color transfer material layer 42 that is far away from the base substrate through a point Coating the bonding glue 300 by glue or silk screen printing.
  • the bonding material layer 300 is not provided on the side of the scattering material layer 50 away from the base substrate. As shown in Figure 9B.
  • the bonding material layer 300 When bonding the light-emitting element 200 to the color filter substrate, since the bonding material layer 300 is not provided on the side of the scattering material layer 50 away from the base substrate, and due to the different settings of the barrier walls, the bonding material layer Flow from the side of the first color transfer material layer 41 and the second color transfer material layer 42 away from the base substrate to the side of the scattering material layer 50 away from the base substrate, thereby effectively preventing the bonding material layer 300 from The overflow problem arises.
  • Fig. 10 is a schematic diagram of a display device according to an exemplary embodiment of the present disclosure.
  • a display device 2000 includes the above-mentioned display substrate 1000 .
  • the display device 2000 described above may be any device that displays an image regardless of whether it is moving (for example, video) or fixed (for example, still image) and regardless of text or text. More specifically, it is contemplated that the described embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile phones, wireless devices, personal data assistants (PDAs) , Handheld or Laptop Computers, GPS Receivers/Navigators, Cameras, MP4 Video Players, Camcorders, Game Consoles, Watches, Clocks, Calculators, Television Monitors, Flat Panel Displays, Computer Monitors, Automotive Displays (eg, odometer displays, etc.), navigators, cockpit controls and/or displays, displays for camera views (e.g., displays for rear-view cameras in vehicles), electronic photographs, electronic billboards or signage, projectors, building structures, packaging and aesthetic structures (for example, for a display of an image of a piece of jewelry), etc.
  • PDAs personal data assistants
  • Handheld or Laptop Computers GPS Receiv

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

提供一种彩膜基板(100)及其制造方法、显示基板(1000)及其制造方法、显示装置(2000)。彩膜基板(100)包括：衬底基板(10)；多个像素单元(20)，设置于衬底基板(10)上，每一个像素单元(20)包括多个子像素(30)；像素单元(20)包括：挡墙(21)，设置于衬底基板(10)的一侧，挡墙(21)包括围绕像素单元(20)周侧设置的第一挡墙(211)和位于相邻子像素(30)之间设置的第二挡墙(212)，多个子像素(30)包括用于进行色转的第一子像素(31)以及用于进行散射的第二子像素(32)；色转材料层(40)，设置于第一子像素(31)内；散射材料层(50)，设置于第二子像素(32)内；其中，第一挡墙(211)和第二挡墙(212)的至少一者与散射材料层(50)位于相同层且采用相同材料制成。

Description

彩膜基板、显示基板及其制造方法、显示装置 技术领域
本公开涉及显示技术领域，具体而言，涉及一种彩膜基板及其制造方法、显示基板及其制造方法、显示装置。
背景技术
分区微型无机发光二极管的色转方案是采用分区蓝色发光二极管方案将一个大的蓝色发光二极管进行分区，分割成多个小的发光二极管，可进行独立控制，这样可减少打键的次数降低成本，另外由于常规的红色芯片微型化后效率下降明显，故采用蓝光加色转的方案可提高器件的发光效率，但色转芯片的制备需要将彩膜基板与发光元件进行对盒，由于彩膜基板的设计问题，导致键合时键合胶较厚，增加了彩膜基板中色转层和发光区的距离易导致串色的发生，相关技术中的减小串色风险的方案主要有改变各膜层的折射率或者做透镜结构，改变膜层折射率的方案需要对各膜层进行重新开发，增加了开发难度，透镜结构的厚度较高，不利于器件的轻薄化。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域技术人员已知的现有技术的信息。
发明内容
在一个方面，提供一种彩膜基板，包括：
衬底基板；
多个像素单元，设置于所述衬底基板上，每一个像素单元包括多个子像素；
所述像素单元包括：
挡墙，设置于所述衬底基板的一侧，所述挡墙包括围绕所述像素单元周侧设置的第一挡墙和位于相邻子像素之间设置的第二挡墙，所述多个子像素包括用于进行色转的第一子像素以及用于进行散射的第二子像素；
色转材料层，设置于所述第一子像素内；
散射材料层，设置于所述第二子像素内；
其中，所述第一挡墙和所述第二挡墙的至少一者与所述散射材料层位于相同层且采用相同材料制成。
在本公开的一些示例性实施例中，在垂直于所述衬底基板所在平面的方向上，所述第一挡墙的远离所述衬底基板的一侧到所述衬底基板具有第一间距，所述第二挡墙的远离所述衬底基板的一侧到所述衬底基板具有第二间距，所述第一间距大于所述第二间距。
在本公开的一些示例性实施例中，所述像素单元包括两个或两个以上第一子像素，
在垂直于所述衬底基板所在平面的方向上，相邻的第一子像素之间的所述第二挡墙远离所述衬底基板的一侧到所述衬底基板具有第一子间距，相邻的第一子像素和第二子像素之间的所述第二挡墙远离所述衬底基板的一侧到所述衬底基板具有第二子间距，
其中，所述第一子间距大于所述第二子间距。
在本公开的一些示例性实施例中，所述第一挡墙和所述第二挡墙的至少一者的截面的至少一个边界的尺寸大于所述散射材料层的厚度，所述截面平行于所述衬底基板所在平面的方向。
在本公开的一些示例性实施例中，所述第一挡墙和所述第二挡墙的至少一者的截面的至少一个边界的尺寸大于或等于所述第一挡墙和/或所述第二挡墙在垂直于所述衬底基板所在平面方向的厚度，所述截面平行于所述衬底基板所在平面的方向。
在本公开的一些示例性实施例中，在垂直于所述衬底基板所在平面的方向，所述散射材料层的厚度小于所述色转材料层的厚度。
在本公开的一些示例性实施例中，所述的彩膜基板还包括：
黑矩阵，设置在所述衬底基板和所述挡墙之间，所述黑矩阵包括多个开口，所述开口与所述多个子像素对应；
彩膜层，所述彩膜层包括第一彩膜部和第二彩膜部，
其中，所述第一彩膜部在衬底基板上的正投影位于所述开口内；
所述第二彩膜部在衬底基板上的正投影位于所述黑矩阵在所述衬底基板上的正投影内。
在本公开的一些示例性实施例中，所述第一子像素包括第一颜色子像素和第三颜色子像素，所述第二子像素包括第二颜色子像素，所述第一颜色子像素和所述第三颜色子像素位于所述第一子像素，所述第二颜色子像素位于所述第二子像素。
在本公开的一些示例性实施例中，所述第一彩膜部包括：
设置于所述第一颜色子像素的第一颜色滤光层，设置于所述第三颜色子像素的第三颜色滤光层。
在本公开的一些示例性实施例中，所述第一彩膜部包括：
设置于所述第二颜色子像素的第二颜色滤光层。
在本公开的一些示例性实施例中，在垂直于所述衬底基板所在平面的方向上，所述第二彩膜部的厚度大于所述第一彩膜部厚度。
在本公开的一些示例性实施例中，所述第二彩膜部包括层叠设置的至少两个滤光层。
在本公开的一些示例性实施例中，所述挡墙的材料的光密度值在0.1/um至0.3/um的范围内。
在本公开的一些示例性实施例中，所述色转材料层包括量子点材料。
在本公开的一些示例性实施例中，所述的彩膜基板还包括：
封装层，设置于所述挡墙远离所述衬底基板的一侧，所述封装层覆盖所述挡墙、色转材料层和散射材料层的至少一者。
本公开的另一方面，提供了一种显示基板，包括：
如上文所述的彩膜基板；
设置在所述彩膜基板远离衬底基板一侧的发光元件；以及
设置在所述彩膜基板和所述发光元件之间的键合材料层。
在本公开的一些示例性实施例中，所述发光元件包括MicroLED或者OLED。
在本公开的一些示例性实施例中，所述彩膜基板的色转材料层与所述发光元件之间的键合材料层具有第一厚度，
所述彩膜基板的散射材料层与所述发光元件之间的键合材料层具有第二厚度，
所述第一厚度小于所述第二厚度。
本公开的另一方面提供了一种彩膜基板的制造方法，包括：
形成衬底基板；
在所述衬底基板上形成多个像素单元，每一个像素单元包括多个子像素；
形成像素单元包括：
在所述衬底基板的一侧形成挡墙，形成挡墙包括形成围绕所述像素单元周侧设置的第一挡墙和形成位于相邻子像素之间设置的第二挡墙，所述多个子像素包括用于进行色转的第一子像素以及用于进行散射的第二子像素；
在所述第一子像素内形成色转材料层；
在所述第二子像素内形成散射材料层；
其中，所述散射材料层与所述挡墙采用一次图案化工艺形成。
在又一方面，提供了一种显示基板的制造方法，包括：
根据上文所述的制造方法形成彩膜基板；
在所述彩膜基板的色转材料层的远离衬底基板的一侧形成键合胶，所述键合胶位于第一子像素；
将发光元件键合在所述彩膜基板上，以使所述键合胶从彩膜基板的第一子像素的位置流入到所述彩膜基板的第二子像素的位置，以形成键合材料层。
本公开的另一方面，提供了一种显示装置，包括：如上文所述的显示基板。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1A是根据本公开的示例性实施例的彩膜基板的平面示意图；
图1B是根据本公开的另一示例性实施例的彩膜基板的平面示意图；
图2是根据本公开的示例性实施例的彩膜基板沿图1A中的AA’线的剖面示意图；
图3A示意性示出了测试得到的不同的散射材料层的膜层厚度与亮度数据的曲线关系；
图3B示意性示出了本公开实施例的彩膜基板的挡墙沿图2中BB’线的剖面示意图；
图4是根据本公开的示例性实施例的彩膜基板的制造方法的流程图；
图5是根据本公开的示例性实施例的彩膜基板的制造方法在操作S20之后的流程图；
图6A至图6G是根据本公开的示例性实施例的与彩膜基板制造方法对应的彩膜基板的制造过程中剖视图；
图7是根据本公开的示例性实施例的显示基板的剖视图；
图8是根据本公开的示例性实施例的显示基板的制造方法的流程图；
图9A至图9C是根据本公开的示例性实施例的与显示基板制造方法对应的显示基板的制造过程中剖视图；
图10是根据本公开的示例性实施例的一种显示装置示意图。
需要注意的是，为了清晰起见，在用于描述本公开的实施例的附图中，层、结构或区域的尺寸可能被放大或缩小，即这些附图并非按照实际的比例绘制。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征 可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“电连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“约”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量***的局限性)所确定。
如本文所使用的那样，“平行”、“垂直”、“相等”包括所阐述的情况以及与所阐述的情况相近似的情况，该相近似的情况的范围处于可接受偏差范围内，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量***的局限性)所确定。例如，“平行”包括绝对平行和近似平行，其中近似平行的可接受偏差范围例如可以是5°以内偏差；“垂直”包括绝对垂直和近似垂直，其中近似垂直的可接受偏差范围例如也可以是5°以内偏差。“相等”包括绝对相等和近似相等，其中近似相等的可接受偏差范围内例如可以是相等的两者之间的差值小于或等于其中任一者的5％。
应当理解的是，当层或元件被称为在另一层或基板上时，可以是该层或元件直接在另一层或基板上，或者也可以是该层或元件与另一层或基板之间存在中间层。
本文中“同层”指的是采用同一成膜工艺形成用于形成特定图形的膜层，然后利用掩模板通过一次构图工艺形成的层结构。根据特定图形的不同，一次构图工艺可能包括多次曝光、显影或刻蚀工艺，而形成的层结构中的特定图形可以是连续的也可以 是不连续的，这些特定图形还可能处于不同的高度或者具有不同的厚度。与之相反地，“异层”指的是分别采用相应的成膜工艺形成用于形成特定图形的膜层，然后利用相应的掩模板通过构图工艺形成的层结构，例如，“两个层结构异层设置”是指两个层结构分别在相应的工艺步骤(成膜工艺和构图工艺)下形成。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
在本公开的实施例中，术语“色转”是指光的颜色进行转换，将某一颜色的光转换为另一颜色的光。例如，通过采用不同的色转材料以及红色滤光层将蓝色的光转换成红色材料的光。又例如，通过另一色转材料以及绿色滤光层将蓝色的光转换成绿色材料的光。
术语“散射”是指对光的强度进行调整，将光的强度通过设置在溶剂或其他材料内部的散射粒子进行调整。例如，在丙烯酸树脂中设置二氧化钛等散射粒子形成散射材料层，从而实现对光的强度进行调整。
在相关技术中，由于彩膜基板的结构设计不合理以及现有制备工艺的局限性，导致彩膜基板在与发光元件进行键合时，彩膜基板的色转材料层与发光元件的发光区距离增加，导致串色的发生。
为了解决上述问题，本公开的实施例提供了一种彩膜基板，该彩膜基板包括但不限于衬底基板；多个像素单元，设置于衬底基板上，每一个像素单元包括多个子像素；像素单元包括：挡墙，设置于衬底基板的一侧，挡墙包括围绕像素单元周侧设置的第一挡墙和位于相邻子像素之间设置的第二挡墙，多个子像素包括用于进行色转的第一子像素以及用于进行散射的第二子像素；色转材料层，设置于第一子像素内；散射材料层，设置于第二子像素内；其中，第一挡墙和第二挡墙的至少一者与散射材料层位于相同层且采用相同材料制成。
根据本公开的实施例，通过将散射材料层和挡墙采用相同的材料和相同的工艺制造，可以节省材料的用量，减少光刻制程。此外，散射材料层设置为与挡墙相同的材 料制成，在达到相同显示效果的情况下，减少散射材料层的厚度，便于后续工艺在与电子元件进行键合时，提供更多区域容纳键合材料层，从而有效减少串色风险，提高显示效果和产品良率。
下面结合图1对本公开实施例的彩膜基板的结构进行详细说明。
图1A是根据本公开的示例性实施例的彩膜基板的平面示意图。图1B是根据本公开的另一示例性实施例的彩膜基板的平面示意图。图2是根据本公开的示例性实施例的彩膜基板沿图1A中的AA’线的剖面示意图。
在本公开的实施例中，如图1A、图1B和图2所示，彩膜基板100(100’)包括衬底基板10(10’)、多个像素单元20(20’)。多个像素单元20设置于衬底基板10上，每个像素单元20包括有多个子像素。图1A示例性的示出了多个子像素平行排列成一行设置于每一个像素单元内，图1B示例性示出了多个子像素呈矩阵排列成多行设置于每一个像素单元内。
示例性地，像素单元20包括挡墙21(21’)，挡墙21设置在衬底基板10的一侧，挡墙21在围绕形成多个像素单元20和多个子像素30，每一个子像素30(30’)包括第一子像素31(31’)和第二子像素32(32’)。第一子像素31用于进行色转，例如，将蓝色的光转换为红色的光。第二子像素32用于进行散射，例如，将蓝色的光进行散射，以改变蓝色光的强度等。
示例性地，衬底基板10例如可以包括玻璃背板等。
在本公开的实施例中，如图2所示，色转材料层40设置在第一子像素31内，散射材料层50设置在第二子像素32内。色转材料层40例如可以包括第一色转材料层41和第二色转材料层42，不同的色转材料层40可以对不同的入射光进行色转。
示例性地，第一色转材料层41用于对入射至一个第一子像素31的光进行色转，例如，将入射的蓝色光(Blue)色转成红色光(Red)。第二色转材料层42用于对入射至另一个第一子像素31的光进行色转，例如，将入射的蓝色光(Blue)色转成绿色光(Green)。
在本公开的实施例中，色转材料层包括量子点(Quantum Dots，缩写QD)材料。
在其他的可选实施例中，每一个像素单元中的第一子像素的数目可以根据实际的需要进行设定，例如2个、3个等。色转材料层的对不同颜色进行色转的数目可以与 第一子像素的数目相对应，也可以根据实际的设计需要进行设定。例如，对不同颜色进行色转的色转材料层可以是2个、3个等。
示例性地，色转材料层例如可以包括树脂，例如丙烯酸基材料，第一色转材料层和第二色转材料层的材料可以相同或者不同。
在本公开的实施例中，散射材料层50设置在第二子像素32内。散射材料层50可以对入射光进行强度调整。
示例性地，散射材料层50用于对入射至第二子像素32的光进行强度调整。例如，对入射的蓝色光(Blue)的光线强度进行调整。
示例性地，散射材料层50例如可以包括一基质和一分散于该基质中的散射粒子。例如，基质包括热固性树脂，例如丙烯酸树脂，散射粒子包括二氧化钛、二氧化硅、有机硅化合物、以及聚苯乙烯中的一者或其组合。
在本公开的实施例中，在挡墙21的远离衬底基板10的一侧，设置有封装层60。封装层60覆盖挡墙21、色转材料层40和散射材料层50的至少一者。
封装层60用于对挡墙21、色转材料层40以及散射材料层50进行封装，以确保色转材料层40和散射材料层50不会受到水气或其他物质的侵入而被破坏，或者产生缺陷，影响色转材料层40的色转效果和/或散射材料层50的散射效果。
在本公开的实施例中，散射材料层50与挡墙21位于相同层且采用相同材料制成。
散射材料层50和挡墙21位于相同层且采用相同材料制成可以理解为，散射材料层50和挡墙21在制备时，通过同样的工艺形成于同一层，并且在光刻时，通过一道掩膜工艺进行刻蚀，以形成散射材料层和挡墙，可以有效减少制备工艺的制程，提高制备效率。
散射材料层50和挡墙21在制备过程中，采用相同的材料。
挡墙21和散射材料层50的材料包括如上文所述的材料，例如丙烯酸基材料等。
在本公开的实施例中，散射材料层50与挡墙21采用相同的材料制备，可以实现通过一道掩膜制备的方法同时制备出挡墙21和散射材料层50。一方面可以节省材料用量，例如可以减少专门用于散射材料层的其他材料。另一方面，可以减少一道光刻工艺制程，简化工艺，提高生产效率。
在本公开的实施例中，制备挡墙21的材料的光密度值(OD，Optical Density)为的范围值为0.1/um至0.3/um的范围，例如，0.15/um或者0.2/um或者0.25/um。挡墙 材料的高度一般设置为大于12um，工艺中的关键尺寸(CD值)大于20um，计算得出挡墙材料的纵向透过率小于0.4％，横向透过率小于0.01％。因而，挡墙材料不存在横向或纵向串扰的问题。
透过率是指光线穿过介质后，透过介质的能力。横向透过率是指光线从挡墙的横向(平行于衬底基板所在平面的方向)穿过时透过挡墙的能力，纵向透过率是指光线从挡墙的纵向(垂直于衬底基板所在平面的方向)穿过时透过挡墙的能力。
在本实施例中，通过将散射材料层50与挡墙21选用相同的材料制造，可以减少散射材料层50的厚度，由于在制备挡墙21的材料的透过率与厚度具有对应关系。例如，散射材料层50选用与挡墙21相同的材料制造时，在散射材料层50的膜厚度设置在1um至5um的范围内，透过率为10％至60％之间。此时，可以根据透过率需求和视角匹配进行散射材料层50的膜厚选择。
图3A示意性示出了测试得到的不同的散射材料层的膜层厚度与亮度数据的曲线关系。
如图3A所示，在现有技术中，现有的散射材料层的材料的光密度值为0.1/um，在进行测试时，各曲线代表视角数据，坐标中标识膜厚的曲线为该膜厚下散射材料层的视角数据，blue指背光的视角，QD指色转材料层的视角。二氧化钛浓度表示散射材料层中的散射粒子的浓度，在进行测试时，改变电耦合器件(CCD)的位置即可得到不同角度下的背光亮度，对亮度数据进行归一化即可得到视角曲线，图3A中的曲线越平代表视角越好，散射材料层视角测试是将背光上放置一块由散射材料层制成的膜片进行测试，QD是将背光上放上色转材料层制成的膜片进行测试。由图3A中可以得出，对于现有的散射材料层的材料，当散射材料层的厚度在9.42um以上时，具有较好的视角，而当散射材料层的厚度越小时，得出的视角越差，例如当散射材料层的厚度为3.8um时，在所有的膜层厚度中，具有最差的视角。
由于相关技术中的散射材料层的光密度值小于0.1um，本公开实施例的散射材料层与挡墙选用相同的材料，本公开实施例的散射材料层的光密度值为0.1um至0.3/um的范围，例如，可以为0.2/um、0.25/um等。因而，可以在具有相同透过率的情况下，减小散射材料层的厚度。
在本公开的实施例中，将散射材料层50与挡墙21选用相同的材料制造，该材料的光密度至为0.2/um至0.25/um的范围内，例如光密度值确定为0.2/um。则可以实现 在保证散射材料层50的散射性能不变的前提下，实现散射材料层50的膜厚减少。从而使散射材料层的远离衬底基板的一侧距离衬底基板一侧的距离减少，即，增加了散射材料层距离发光元件的距离，有利于在该位置处填充用于键合彩膜基板和发光元件的键合胶或者键合材料层的容纳量。
示例性地，现有技术中的散射材料层的光密度至为0.1/um，当将散射材料层选用与挡墙相同的材料制造时，挡墙材料的光密度至为0.2/um，则选用挡墙材料制造的散射材料层的厚度可以由原来的9.5um减少到5um以下，同时保证视角性能不变。
在本公开的实施例中，挡墙21围绕形成多个像素单元和像素单元内的多个子像素。如图1A、图1B和图2所示，挡墙21(21’)包括围绕像素单元20周侧设置的第一挡墙211(211’)和位于相邻子像素之间设置的第二挡墙212(212’)。在垂直于衬底基板10所在平面的方向上，第一挡墙211的远离衬底基板10的一侧到衬底基板10具有第一间距H1，第二挡墙212的远离衬底基板的一侧到衬底基板10具有第二间距H2，第一间距H1大于第二间距H2。
示例性地，第一挡墙211围绕每一个像素单元20的周侧。如图2所示，图中示出了图1A中的一个像素单元的剖面结构，位于每一个像素单元的周侧的挡墙为第一挡墙211，例如图2中的两侧的挡墙为第一挡墙211。在两个第一挡墙211之间的挡墙为第二挡墙212。第二挡墙212位于相邻子像素之间设置。例如，第二挡墙212包括位于第一色转材料层41和第二色转材料层42之间的第三挡墙213以及位于第二色转材料层42和散射材料层50之间的第四挡墙214。
在本公开的实施例中，由于像素单元内具有多个子像素，相邻子像素之间设置的第二挡墙212可以包括多个，并且每相邻子像素之间的第二挡墙212的高度可以不同。相邻子像素之间的所有的第二挡墙212的远离衬底基板的一侧到衬底基板10具有的第二间距H2均小于第一挡墙211的远离衬底基板10的一侧到衬底基板10具有的第一间距H1。即在本公开实施例的彩膜基板中，所有的第二间距H2均小于第一间距H1。
示例性地，第三挡墙213的远离衬底基板10一侧到衬底基板10具有第二间距H21，第四挡墙214的远离衬底基板10一侧到衬底基板10具有第二间距H22。其中，H1大于H21且H1大于H22。
在本实施例中，如图2所示，像素单元20包括两个或两个以上第一子像素31，在垂直于衬底基板10所在平面的方向上，相邻的第一子像素31之间的第二挡墙211 远离衬底基板的一侧到衬底基板10具有第一子间距，例如图2中的H21。相邻的第一子像素31和第二子像素32之间的第二挡墙211远离衬底基板的一侧到衬底基板10具有第二子间距H22，第一子间距H21大于所述第二子间距H22。
示例性地，第二挡墙212包括第三挡墙213和第四挡墙214。第三挡墙213设置在相邻的两个第一子像素31之间。第四挡墙214设置在相邻的第一子像素31和第二子像素32之间。由上文可知，第三挡墙213到衬底基板10具有第一子间距H21，第四挡墙214到衬底基板10具有第二子间距H22。由此，相邻的第一子像素31之间的第二挡墙中的第三挡墙213的第一子间距H21大于或等于相邻的第一子像素31和第二子像素32之间的第二挡墙中的第四挡墙214的第二子间距H22。
根据本公开的实施例，如上文所述，通过将散射材料层与挡墙材料采用相同材料和相同工艺制成，可以实现在保证在同样显示效果的情况下，减少散射材料层的厚度，从而在后续的键合发光元件时，为键合材料层提供较大的容纳空间，防止键合材料层的材料在进行键合时发生溢出的问题。
在本公开的实施例中，第一挡墒和第二挡墙的至少一者的截面的至少一个边界的尺寸大于散射材料层的厚度，截面平行于衬底基板所在平面的方向。
如图3B示意性示出了本公开实施例的彩膜基板的挡墙沿图2中BB’线的剖面示意图。
示例性地，如图3B所示，挡墙21包括第一挡墙211和第二挡墙212，第二挡墙212包括第三挡墙213和第四挡墙214。示例性地，第三挡墙213沿着BB’线的剖面示意图如图3B所示。其中，第一挡墙和第二挡墙的沿BB’的截面是平行于衬底基板10所在平面的方向。其中，第三挡墙213沿BB’的截面的边界包括第一边界2131和第二边界2132，第一边界2131的边界的尺寸表示第一边界2131的长度B1，第二边界2132的边界的尺寸表示第二边界2132的长度B2。
在其他的可选实施例中，第一挡墙和/或第二挡墙的沿平行于衬底基板所在的平面的截面的尺寸可以根据上文所述的示例进行确定。
散射材料层50的厚度如图2中的D1所示。
根据本公开的实施例，第一边界2131的尺寸B1和第二边界2132的尺寸B2均大于散射材料层50的厚度D1。能够保证散射材料层50具有较好的光散射效果，且不影 响透过率，同时可以保证挡墙具有较好的对光的遮挡效果，避免相邻子像素之间串色，提高显示效果。
在本公开的实施例中，第一挡墙和第二挡墙的至少一者的截面的至少一个边界的尺寸大于或等于第一挡墙和/或所述第二挡墙在垂直于衬底基板所在平面方向的厚度，截面平行于衬底基板所在平面的方向。
如图2和图3B所示，第二挡墙212中的第三挡墙213的截面的第一边界2131的尺寸B1和/或第二边界2132的尺寸B2大于或等于第三挡墙在垂直于衬底基板所在平面方向的厚度D2。
在其他的实施例中，挡墙(包括第一挡墙和第二挡墙)的截面的边界均可以根据上述的示例进行确定。
根据本公开的实施例，通过将挡墙的沿平行于衬底基板所在平面方向的截面的边界确定为大于或等于挡墙在垂直于衬底基板所在平面方向的厚度，保证挡墙具有较好的阻挡光线的效果，防止相邻子像素之间产生串色的问题。
在本公开的实施例中，在垂直于衬底基板所在平面的方向，散射材料层的厚度小于色转材料层的厚度。
示例性地，如图2所示，色转材料层40在垂直于衬底基板所在平面的方向具有厚度D3，散射材料层50在垂直于衬底基板所在平面的方向具有厚度D1。D1小于D3，从而保证彩膜基板能够在散射材料层50的位置相对于色转材料层40的位置，能够容纳更多的键合材料。
在本公开的实施例中，如图2所示，彩膜基板100还包括黑矩阵70以及彩膜层80。
黑矩阵70设置在衬底基板10和挡墙21之间，黑矩阵70包括多个开口701，开口701与多个子像素对应。彩膜层80覆盖黑矩阵70和衬底基板10。彩膜层80包括第一彩膜部801和第二彩膜部802。第一彩膜部801在衬底基板10上的正投影位于开口701内。第二彩膜部802在衬底基板10上的正投影位于黑矩阵70在衬底基板上的正投影内。
示例性地，彩膜层80覆盖黑矩阵70的远离衬底基板的一侧，并且彩膜在开口701的区域内覆盖衬底基板。第一彩膜部801设置在黑矩阵70形成的开口701内，第二彩膜部802覆盖所述黑矩阵70所在的区域。
示例性地，黑矩阵70例如可以阻挡光线，以使经过彩膜层80的光线经过黑矩阵70形成的开口701进入目标区域。可以通过喷墨方法形成黑矩阵70，通过喷墨方法形成黑矩阵70不需要执行额外掩膜工艺和/或光刻工艺，可以简化制造工艺并降低制造成本。
示例性地，在形成黑矩阵70后，设置彩膜层80，包括设置第一彩膜部801和第二彩膜部802。第二彩膜部802的彩膜可以是相同或者不同，也可以是部分相同。例如，第二彩膜部802的彩膜包括有多种颜色的彩膜。
在本公开的实施例中，如图2所示，多个子像素包括第一颜色子像素Z1、第二颜色子像素Z2和第三颜色子像素Z3，第一颜色子像素Z1和第三颜色子像素Z3位于第一子像素31，第二颜色子像素Z2位于第二子像素32。
示例性地，第一子颜色像素Z1例如为红色子像素R(Red)，第三颜色子像素Z3例如为绿色子像素G(Green)，第二颜色子像素Z2例如为蓝色子像素B(Blue)，红色子像素R和绿色子像素G位于第一子像素31，蓝色子像素B位于所述第二子像素32。
示例性地，第一子像素31包括与第一色转材料层41相对应的第一区域311，第一子像素31还包括与第二色转材料层42相对应的第二区域312。红色子像素R位于第一区域311内，绿色子像素G位于第二区域312内。
在本公开的可选实施例中，多个子像素还可以包括其他颜色的子像素，例如白色子像素，多个子像素的设置位置可以根据实际的需要进行调整，以满足不同的发光元件的需求。例如，位于第二子像素的第二颜色子像素的颜色与发光元件的发光颜色保持一致，位于第一子像素的第一颜色子像素和第三颜色子像素的颜色与发光元件的发光颜色不一致。
根据本公开的实施例，将位于第二子像素的第二颜色子像素的颜色与发光元件的发光颜色保持一致，即在第二像素区域需要设置散射材料层，该散射材料层与挡墙的制造材料和制造工艺相同，从而减少彩膜基板的制造工序，同时可以减少散射材料层的厚度，为后续的在彩膜基板上键合发光元件时，为键合材料层提供更多的容纳空间，提高显示效果，减少发光异常的情况。
在本公开的实施例中，第一彩膜部801包括设置于第一子颜色像素的第一颜色滤光层81，例如设置于红色子像素R的红色滤光层；设置于第三颜色子像素的第三颜色 滤光层82，例如，设置于绿色子像素G的绿色滤光层；以及设置于第二颜色子像素的第二颜色滤光层83，例如设置于蓝色子像素B的蓝色滤光层。
示例性地，红色滤光层使射入目标区域的光线为红色光线，绿色滤光层使射入目标区域的光线为绿色光线，蓝色滤光层使射入目标区域的光线为蓝色光线。
在本公开的其他可选实施例中，第一彩膜部还可以根据需要设置其他颜色的滤光层，以满足不同颜色滤光的需求。
在本公开的实施例中，第二彩膜部包括层叠设置的至少两个滤光层。第二彩膜部802可以是不同的颜色滤光层的相交的区域，在第二彩膜部802形成彩膜层时，不同颜色的滤光层由于工艺顺序的不同，呈现交叠或者堆叠，形成具有多个颜色滤光层的彩膜层。
示例性地，如图2所示，第一挡墙21与黑矩阵70之间包括两个滤光层。例如，在图2中靠近红色子像素R的第一挡墙21与黑矩阵70之间包括相堆叠设置的绿色滤光层和蓝色滤光层。在图2中靠近蓝色子像素B的第一挡墙21与黑矩阵之间包括相交叠设置的红色滤光层和蓝色滤光层。
示例性地，如图2所示，第三挡墙213与黑矩阵70之间包括相堆叠以及相交叠设置的红色滤光层、绿色滤光层以及蓝色滤光层。红色滤光层的一部分被绿色滤光层所覆盖，蓝色滤光层堆叠在绿色滤光层上。
示例性地，如图2所示，第四挡墙214与黑矩阵70之间包括相交叠设置的绿色滤光层和蓝色滤光层，蓝色滤光层的一部分覆盖在绿色滤光层上。
在本公开的实施例中，在垂直于衬底基板所在平面的方向上，第二彩膜部802的厚度大于第一彩膜部801的厚度。
第二彩膜部802包括至少两个滤光层，第一彩膜部801包括一个滤光层。通过将第二彩膜部802的厚度设置为大于第一彩膜部801的厚度，可以降低高厚度挡墙的制备难度。
在本公开的实施例中，根据涂布工艺存在形貌追随的现象，即在涂层的涂布的区域，当涂层的侧边具有不同的高度时，在进行涂布过程中，涂层随着形貌的变化而变化，容易出现随形貌而变化的凸起。
示例性地，如图2所示，在形成不同颜色的滤光层的过程中，具有不同的涂布顺序，例如，彩膜层80包括红色滤光层81、绿色滤光层82以及蓝色滤光层83。在形成 彩膜层80时，先涂布红色滤光层81，然后涂布绿色滤光层82，最后涂布蓝色滤光层83。
在第三挡墙213的靠近衬底基板10的一侧，且位于第二彩膜部802的位置，在涂布第一颜色滤光层81，例如红色滤光层时，红色滤光层覆盖黑矩阵70的一部分，再继续形成第三颜色滤光层82，例如绿色滤光层，绿色滤光层在第二彩膜部802的位置与红色滤光层交叠，由于涂布工艺存在上文所述的形貌追随的现象，在第三挡墙213所在的第二彩膜部802的位置，继续在第一颜色滤光层81的远离衬底基板的一侧形成第二颜色滤光层83，例如，在红色滤光层的远离衬底基板的一侧继续形成一定厚度的绿色滤光层，在涂布其他颜色的滤光层时，继续在第二彩膜部802所在的位置继续形成对应颜色的滤光层，从而使第二彩膜部802所在位置的彩膜层的厚度大于位于第一彩膜部801所在位置的彩膜层的厚度。
根据本公开的实施例，形成散射材料层和挡墙的材料和工艺相同，在该制备条件和工艺下，形成的高度差存在极限条件。例如当形成挡墙材料的厚度较厚时，则无法形成，或者制备工艺难度较大。对此，本公开实施例通过利用涂布工艺的形貌追随现象，在第二彩膜部形成的彩膜层厚度大于第一彩膜部形成的彩膜层的厚度，可以有效减小在彩膜层的远离衬底基板一侧形成的挡墙的厚度，降低挡墙以及散射材料层同层制备不同高度差图形的工艺难度。
在本公开的一种实施例中，形成散射材料层和挡墙可以采用正胶方案，利用半色调掩膜(halftone mask)实现不同厚度的挡墙和散射材料层的一次制备。
在本公开的另一种实施例中，采用负胶方案，在曝光能量不足时，膜厚和曝光量正相关，可根据该原理通过利用半色调掩膜(halftone mask)实现不同厚度的挡墙和散射材料层的一次制备。例如，现有LCD产品中main photospacer和sub photospacer通过halftone mask工艺制备。
在本公开的又一实施例中，在形成散射材料层和挡墙的过程中，采用负胶方案，负胶同层实现高段差工艺难度较大，可将散射材料层单独采用一张掩膜制备。
在本公开的另一实施例中，采用负胶方案，可将彩膜的不同颜色的膜层相接触的位置进行交叠，利用彩膜交叠处的段差来实现挡墙散射材料层的高度差。
在本公开的实施例中，使用上文所述的彩膜基板的显示可以包括但不限于QD-OLED，QD-LCD和QD-LED等。
图4是根据本公开的示例性实施例的彩膜基板的制造方法的流程图。图5是根据本公开的示例性实施例的彩膜基板的制造方法在操作S20之后的流程图。图6A至图6G是根据本公开的示例性实施例的与彩膜基板制造方法对应的彩膜基板的制造过程中剖视图。
下面结合图4至图6G对本公开实施例的彩膜基板的制造方法进行详细说明。
本公开的一些实施例还提供了一种彩膜基板的制造方法，如图4至图6G所示，该制造方法包括操作S10至操作S23。
在操作S10中，形成衬底基板。如图6A所示，形成衬底基板10。
在操作S20中，在衬底基板上形成多个像素单元，每一个像素单元包括多个子像素。
在本公开的实施例中，操作S20之后可以包括操作S21至操作S24。即形成像素单元包括操作S21至操作S23。
在操作S21中，在衬底基板10的一侧形成挡墙21，挡墙21在像素单元内围绕形成多个像素单元和多个子像素，多个子像素包括用于进行色转的第一子像素31以及用于进行散射的第二子像素32。
示例性地，如图6E所示，形成挡墙21，其中挡墙21包括围绕像素单元设置的第一挡墙211以及位于相邻子像素之间设置的第二挡墙212，第二挡墙212包括第一子颜色像素和第三颜色子像素之间的挡墙和第一颜色子像素和第二颜色子像素之间的挡墙，例如红色子像素R和绿色子像素G之间的第三挡墙213以及绿色子像素G与蓝色子像素B之间的第四挡墙214。
在操作S22中，在第一子像素31内形成色转材料层40。
示例性地，如图6F所示，形成色转材料层40，包括位于红色子像素R的第一色转材料层41和位于绿色子像素G的第二色转材料层42。
在操作S23中，在第二子像素32内形成散射材料层50。散射材料层与挡墙采用一次图案化工艺形成。
示例性地，如图6E所示，在形成挡墙21的同时，形成散射材料层50。
在本公开的实施例中，操作S23和操作S22之间的顺序可以是先执行操作S23，再执行操作S22。例如，在操作S21中，在衬底基板10的一侧形成挡墙21时，同时 执行操作S23，在第二子像素32内形成散射材料层50，该散射材料层50和挡墙21采用相同的工艺，并且通过同一道掩膜制造。散射材料层和挡墙采用相同的材料。
根据本公开的实施例，可以减少彩膜基板的制造工序，节省材料用量，降低制造成本，同时，散射材料层和挡墙采用相同的材料可以实现在保持彩膜基板的显示效果的同时，降低散射材料层的厚度，在后续的彩膜基板与发光元件进行键合时，为键合材料层提供更多的容纳空间，防止键合材料层在进行键合时产生溢出的问题。
在其他的可选实施例中，可以是先执行操作S22，再执行操作S23。
在本公开的实施例中，在形成色转材料层之后，还包括在挡墙21远离衬底基板的一侧形成封装层60，封装层60覆盖挡墙21、色转材料层40和散射材料层50。通过封装层对挡墙、色转材料层和散射材料层进行封装，以确保色转材料层40和散射材料层50不会受到水气或其他物质的侵入而被破坏，或者产生缺陷，影响色转材料层40的色转效果和/或散射材料层50的散射效果。
示例性地，如图6G所示，在挡墙21、色转材料层40以及散射材料层50的远离衬底基板的一侧形成封装层60。
在本公开的实施例中，在操作S21中，在衬底基板10的一侧形成挡墙21包括形成围绕像素单元周侧设置的第一挡墙211和形成位于相邻子像素之间设置的第二挡墙212。在垂直于衬底基板所在平面的方向上，第一挡墙211的远离衬底基板的一侧到衬底基板具有第一间距H1，第二挡墙212的远离衬底基板的一侧到衬底基板具有第二间距H2，第一间距H1大于第二间距H2。
在本公开的实施例中，形成第二挡墙时，位于相邻的第一子像素之间的第二挡墙远离衬底基板的一侧到衬底基板具有的第一子间距大于或等于位于相邻的第一子像素和第二子像素之间的第二挡墙远离衬底基板的一侧到衬底基板具有的第二子间距。
在本公开的实施例中，如图5至图6G所示，在操作S20之后以及在操作S21之前，还包括操作S201至操作S202。
在操作S201中，在衬底基板10和挡墙21之间形成黑矩阵70，黑矩阵70包括多个开口701，开口701与所述多个子像素对应。如图6A所示，在衬底基板10上形成黑矩阵70，黑矩阵具有多个开口701。
在操作S202中，形成彩膜层80，彩膜层80包括第一彩膜部801和第二彩膜部802，其中，第一彩膜部801在衬底基板上的正投影位于开口701内；第二彩膜部802在衬底基板上的正投影位于黑矩阵70在衬底基板10上的正投影内。
在本公开的实施例中，在垂直于衬底基板所在平面的方向上，形成的第二彩膜部的厚度大于形成的第一彩膜部的厚度。
示例性地，如图6B至图6D所示，首先，如图6B，在第一子像素Z1形成第一滤光层81，例如在红色子像素R形成红色滤光层。然后，如图6C所示，在第三子像素Z3形成第三滤光层82，例如在绿色子像素G形成绿色滤光层82，继续，如图6D所示，在第二子像素Z2形成第二滤光层83，在蓝色子像素B形成蓝色滤光层。最终形成包括第一滤光层81、第三滤光层82以及第二滤光层83的彩膜层80。
图7是根据本公开的示例性实施例的显示基板的剖视图。
本公开的一些实施例还提供了一种显示基板。如图7所示，显示基板1000包括如上文所述的彩膜基板100以及设置在彩膜基板远离衬底基板一侧的发光元件200，发光元件200通过键合材料层300与彩膜基板100键合。
示例性地，发光元件200上包括有发光单元210，用于发出预设颜色的光线。例如本实施例的发光单元210用于发射蓝色光线。在其他可选的实施例中，发光单元可以用于发出其他颜色的光线，例如红色光线等。
在本公开的实施例中，发光元件200例如包括MicroLED或者OLED。
在本公开的实施例中，如图7所示，彩膜基板的色转材料层与发光元件之间的键合材料层具有第一厚度D4，彩膜基板的散射材料层与发光元件之间的键合材料层具有第二厚度D5，第一厚度D4小于所述第二厚度D5。
根据本公开的实施例，第二厚度D5小于第一厚度D4，可以在形成键合材料层时，使散射材料层与发光元件之间具有更大的间距，以容纳更多的键合材料，防止将发光元件200与彩膜基板100进行键合时导致键合材料外溢的问题出现。
图8是根据本公开的示例性实施例的显示基板的制造方法的流程图。图9A至图9C是根据本公开的示例性实施例的与显示基板制造方法对应的显示基板的制造过程中剖视图。
本公开的一些实施例还提供了一种显示基板的制造方法。如图8至图9C所示，具体流程包括操作S100至操作S300。
在操作S100中，通过前文所述的彩膜基板的制造方法形成彩膜基板，形成的彩膜基板如图9A所示。
在操作S200中，在彩膜基板的色转材料层的远离衬底基板的一侧形成键合胶，键合胶位于第一子像素，如图9B所示。
在本公开的实施例中，形成的键合胶位于第一像素，即形成的键合胶在衬底基板上的正投影与色转材料层在衬底基板上的正投影交叠，并且形成的键合胶在衬底基板上的正投影与散射材料层在衬底基板上的正投影不交叠。
在操作S300中，将发光元件键合在彩膜基板上，以使键合胶从彩膜基板的第一子像素的位置流入到彩膜基板的第二子像素的位置，以形成键合材料层，如图9C所示。
在本公开的实施例中，键合胶位于彩膜基板的第一子像素的位置，在进行键合时，键合胶被外部压力驱动从彩膜基板的第一子像素的位置朝向彩膜基板的第二子像素的位置流动，并填充散射材料层与发光元件之间的区域，最终形成键合材料层。
示例性地，在彩膜基板100的远离衬底基板一侧形成键合胶300，例如，在第一色转材料层41和第二色转材料层42的远离衬底基板的一侧通过点胶或者丝印的方式涂覆键合胶300。在散射材料层50的远离衬底基板的一侧不设置键合材料层300。如图9B所示。
在将发光元件200与彩膜基板进行键合时，由于在散射材料层50的远离衬底基板的一侧没有设置键合材料层300，并且由于挡墙的高度不同的设置，键合材料层从第一色转材料层41和第二色转材料层42的远离衬底基板的一侧流向散射材料层50的远离衬底基板的一侧，从而有效防止键合材料层300在进行黏合时溢出的问题出现。
图10是根据本公开的示例性实施例的一种显示装置示意图。
如图10所示，显示装置2000包括上文所述的显示基板1000。
本公开的上述实施例中的显示装置2000所能实现的有益效果，与上述显示基板1000以及彩膜基板100所能达到的有益效果相同，此处不再赘述。
上述显示装置2000可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显 示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
虽然本公开总体构思的一些实施例已被图示和说明，本领域普通技术人员将理解，在不背离本总体发明构思的原则和精神的情况下，可对这些实施例做出改变，本公开的范围以权利要求和它们的等同物限定。

Claims (21)

  1. 一种彩膜基板，包括：
    衬底基板；
    多个像素单元，设置于所述衬底基板上，每一个像素单元包括多个子像素；
    所述像素单元包括：
    挡墙，设置于所述衬底基板的一侧，所述挡墙包括围绕所述像素单元周侧设置的第一挡墙和位于相邻子像素之间设置的第二挡墙，所述多个子像素包括用于进行色转的第一子像素以及用于进行散射的第二子像素；
    色转材料层，设置于所述第一子像素内；
    散射材料层，设置于所述第二子像素内；
    其中，所述第一挡墙和所述第二挡墙的至少一者与所述散射材料层位于相同层且采用相同材料制成。
  2. 根据权利要求1所述的彩膜基板，其中，
    在垂直于所述衬底基板所在平面的方向上，所述第一挡墙的远离所述衬底基板的一侧到所述衬底基板具有第一间距，所述第二挡墙的远离所述衬底基板的一侧到所述衬底基板具有第二间距，所述第一间距大于所述第二间距。
  3. 根据权利要求2所述的彩膜基板，所述像素单元包括两个或两个以上第一子像素，
    在垂直于所述衬底基板所在平面的方向上，相邻的第一子像素之间的所述第二挡墙远离所述衬底基板的一侧到所述衬底基板具有第一子间距，相邻的第一子像素和第二子像素之间的所述第二挡墙远离所述衬底基板的一侧到所述衬底基板具有第二子间距，
    其中，所述第一子间距大于所述第二子间距。
  4. 根据权利要求1所述的彩膜基板，其中，
    所述第一挡墙和所述第二挡墙的至少一者的截面的至少一个边界的尺寸大于所述散射材料层的厚度，所述截面平行于所述衬底基板所在平面的方向。
  5. 根据权利要求1所述的彩膜基板，其中，
    所述第一挡墙和所述第二挡墙的至少一者的截面的至少一个边界的尺寸大于或等于所述第一挡墙和/或所述第二挡墙在垂直于所述衬底基板所在平面方向的厚度，所述截面平行于所述衬底基板所在平面的方向。
  6. 根据权利要求1所述的彩膜基板，其中，在垂直于所述衬底基板所在平面的方向，所述散射材料层的厚度小于所述色转材料层的厚度。
  7. 根据权利要求1所述的彩膜基板，还包括：
    黑矩阵，设置在所述衬底基板和所述挡墙之间，所述黑矩阵包括多个开口，所述开口与所述多个子像素对应；
    彩膜层，所述彩膜层包括第一彩膜部和第二彩膜部；
    其中，所述第一彩膜部在衬底基板上的正投影位于所述开口内；
    所述第二彩膜部在衬底基板上的正投影位于所述黑矩阵在所述衬底基板上的正投影内。
  8. 根据权利要求7所述的彩膜基板，其中，所述第一子像素包括第一颜色子像素和第三颜色子像素，所述第二子像素包括第二颜色子像素，所述第一颜色子像素和所述第三颜色子像素位于所述第一子像素，所述第二颜色子像素位于所述第二子像素。
  9. 根据权利要求8所述的彩膜基板，其中，所述第一彩膜部包括：
    设置于所述第一颜色子像素的第一颜色滤光层，设置于所述第三颜色子像素的第三颜色滤光层。
  10. 根据权利要求9所述的彩膜基板，其中，所述第一彩膜部包括：
    设置于所述第二颜色子像素的第二颜色滤光层。
  11. 根据权利要求7所述的彩膜基板，其中，在垂直于所述衬底基板所在平面的方向上，所述第二彩膜部的厚度大于所述第一彩膜部厚度。
  12. 根据权利要求7所述的彩膜基板，其中，所述第二彩膜部包括层叠设置的至少两个滤光层。
  13. 根据权利要求1所述的彩膜基板，其中，所述挡墙的材料的光密度值在0.1/um至0.3/um的范围内。
  14. 根据权利要求1所述的彩膜基板，其中，所述色转材料层包括量子点材料。
  15. 根据权利要求1所述的彩膜基板，其中，还包括：
    封装层，设置于所述挡墙远离所述衬底基板的一侧，所述封装层覆盖所述挡墙、色转材料层和散射材料层的至少一者。
  16. 一种显示基板，包括：
    如权利要求1至15中任一项所述的彩膜基板；
    设置在所述彩膜基板远离衬底基板一侧的发光元件；以及
    设置在所述彩膜基板和所述发光元件之间的键合材料层。
  17. 根据权利要求16所述的显示基板，其中，
    所述发光元件包括MicroLED或者OLED。
  18. 根据权利要求16所述的显示基板，其中，
    所述彩膜基板的色转材料层与所述发光元件之间的键合材料层具有第一厚度，
    所述彩膜基板的散射材料层与所述发光元件之间的键合材料层具有第二厚度，
    所述第一厚度小于所述第二厚度。
  19. 一种彩膜基板的制造方法，包括：
    形成衬底基板；
    在所述衬底基板上形成多个像素单元，每一个像素单元包括多个子像素；
    形成像素单元包括：
    在所述衬底基板的一侧形成挡墙，形成挡墙包括形成围绕所述像素单元周侧设置的第一挡墙和形成位于相邻子像素之间设置的第二挡墙，所述多个子像素包括用于进行色转的第一子像素以及用于进行散射的第二子像素；
    在所述第一子像素内形成色转材料层；
    在所述第二子像素内形成散射材料层；
    其中，所述散射材料层与所述挡墙采用一次图案化工艺形成。
  20. 一种显示基板的制造方法，包括：
    根据权利要求19所述的制造方法形成彩膜基板；
    在所述彩膜基板的色转材料层的远离衬底基板的一侧形成键合胶，所述键合胶位于第一子像素；
    将发光元件键合在所述彩膜基板上，以使所述键合胶从彩膜基板的第一子像素的位置流入到所述彩膜基板的第二子像素的位置，以形成键合材料层。
  21. 一种显示装置，包括：如权利要求19所述的显示基板。
PCT/CN2022/078675 2022-03-01 2022-03-01 彩膜基板、显示基板及其制造方法、显示装置 WO2023164812A1 (zh)

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CN113571626A (zh) * 2021-07-16 2021-10-29 上海天马微电子有限公司 一种显示面板和显示装置

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US20200303465A1 (en) * 2019-03-18 2020-09-24 Samsung Display Co., Ltd. Display panel and method of manufacturing the same
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CN113571626A (zh) * 2021-07-16 2021-10-29 上海天马微电子有限公司 一种显示面板和显示装置

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