WO2023093178A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2023093178A1
WO2023093178A1 PCT/CN2022/115813 CN2022115813W WO2023093178A1 WO 2023093178 A1 WO2023093178 A1 WO 2023093178A1 CN 2022115813 W CN2022115813 W CN 2022115813W WO 2023093178 A1 WO2023093178 A1 WO 2023093178A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
main board
prism
lens
opening
Prior art date
Application number
PCT/CN2022/115813
Other languages
English (en)
French (fr)
Inventor
尹帮实
崔佳轩
薛康乐
严斌
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2023093178A1 publication Critical patent/WO2023093178A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the present application relates to the technical field of periscope camera devices, and in particular to an electronic device.
  • the focal length of the camera placed along the thickness direction of the electronic device is small, and the optical zoom capability is limited. At present, the maximum optical zoom can reach 3 times.
  • the camera module is arranged perpendicular to the thickness direction of the electronic device, and the light is refracted through a special optical prism. Imaging is realized on the photosensitive element.
  • the camera module arranged perpendicular to the thickness direction of the electronic device is a periscope camera module.
  • the periscope camera module can achieve a higher optical zoom factor and capture distant objects more clearly.
  • the present application provides an electronic device, the assembly structure of the periscope camera module inside the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.
  • the electronic equipment provided by this application includes a back cover, a main board and a camera module.
  • the back cover is an external component of the electronic device, which can cover the battery and other components of the electronic device, and is used to protect the internal components of the electronic device and prevent external dust from entering the electronic device.
  • the motherboard is an important internal part of electronic equipment, on which are installed chips and circuit components that make up electronic equipment, such as BIOS chips, I/O control chips, keyboard and panel control switch interfaces, and power supply plug-ins.
  • the main board is used to connect electrical components of different voltages together to form a communication line, and can also be used to centralize the data processed by internal devices and transmit them to the outside world to realize communication functions.
  • Camera modules are used to capture still images or video.
  • the back cover of the electronic device provided by the present application is opposite to the main board, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component.
  • the imaging component is used to collect ambient light, form an optical signal, and convert the optical signal into an electrical signal and transmit it to the signal transmission component.
  • the signal transmission component is used to receive the electrical signal from the imaging component, amplify it, and transmit the electrical signal to other components.
  • the first part of the imaging assembly is arranged on the main board facing the rear cover, and the second part of the imaging assembly extends toward the opening, so that the rear cover can sink and be closer to the main board.
  • the distance between the cover and the main board reduces the thickness of the electronic device and further reduces the volume of the electronic device.
  • the signal transmission component is arranged on the main board facing the rear cover, and the imaging component and the signal transmission component are connected through a flexible circuit board.
  • the first part of the imaging component is disposed on both sides of the opening opposite to the signal transmission component.
  • the first part of the imaging component includes a prism
  • the second part of the imaging component includes a lens barrel, a photosensitive element, and a module substrate
  • the prism is used to change the optical path of the incident light so that it passes into the lens
  • the lens barrel is used to fix the optical components inside it, such as lenses, filters, etc., and to prevent light loss caused by the expansion of the beam.
  • the photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor.
  • CMOS complementary metal-oxide-semiconductor
  • the photosensitive element is used to convert the optical signal passing through the lens barrel into an electrical signal, and then transmit the electrical signal to a signal processing element such as an ISP to further complete the signal processing of the electrical signal.
  • the electronic device of the present application may include 1 or N camera modules, where N is a positive integer greater than 1.
  • the prism includes a first light-transmitting surface, and the first light-transmitting surface is a surface of the prism facing the signal transmission component, and one end of the lens barrel is sealingly connected to the first light-transmitting surface of the prism , the other end of the lens barrel extends toward the opening.
  • the photosensitive element is arranged at the other end of the lens barrel, and is sealed and connected with the lens barrel.
  • the module substrate is attached to one side surface of the photosensitive element, and one side surface of the photosensitive element is On the surface away from the lens barrel, the photosensitive element is connected to the signal transmission component through the flexible circuit board.
  • the lens barrel includes a first structure part and a second structure part, both of which are hollow structures with the same inner diameter, and one end of the first structure part is connected to the second structure part.
  • the first light-transmitting surface is sealed and connected, and the other end of the first structure part is sealed and connected with the second structure part.
  • the direction of the cover extends, and the included angle of the second structure part relative to the main board is greater than 0° and less than 90°.
  • connection between the prism and the first structural part is located at the edge of the opening, and the first structural part is arranged obliquely relative to the main board, and moves away from the rear cover from the opening. Extending, the included angle of the first structure part relative to the main board is greater than 0° and less than 90°.
  • the first structure part is parallel to the main board, and the first structure part is arranged between the prism and the edge of the opening, so One end of the first structural part away from the prism is coplanar with the edge of the opening; one end of the second structural part is sealed and connected to one end of the first structural part, and the other end is away from the back cover to the opening. direction extension.
  • the prism further includes a second light-transmitting surface, and the second light-transmitting surface is a surface of the prism on a side away from the main board.
  • the back cover also includes a lens hole, a lens protection sheet is arranged in the lens hole, the lens protection sheet is opposite to and parallel to the second light-transmitting surface, and the lens protection sheet is used to prevent external dust from entering the Inside the electronics.
  • the electronic device further includes a decoration and a connecting platform
  • the decoration is a hollow ring structure
  • the outer diameter of the decoration is the same as the inner diameter of the lens hole
  • the decoration is embedded in the In the lens hole
  • the lens protection sheet is fixed in the decorative part
  • the connecting platform is a hollow ring structure, and it is attached to the inner side of the rear cover, and the inner ring of the connecting platform is connected to the decoration The outer ring connection of the piece,
  • the inner wall of the decoration part is provided with a first groove
  • the lens protection sheet is located in the decoration part
  • the edge of the lens protection sheet is embedded in the first groove
  • a storage table is also included, the storage table is a hollow ring structure, and the outer ring of the storage table is connected to the inner ring of the decorative part, and the lens protection sheet is bonded to the storage table away from the surface of the motherboard.
  • the distance from the surface of the storage table far away from the main board to the surface of the decoration member away from the main board is greater than or equal to the thickness of the lens protection sheet.
  • the second structural part further includes a first surface, the first surface is a bottom plane of the second structural part away from the lens protection sheet, the first surface is opposite to the main board parallel.
  • the decorative part further includes a second surface, and the second surface is a surface of the decorative part facing the second structural part and having the same curvature as the second structural part.
  • the second structural part further includes a second groove, the second groove is located at the contact between the second structural part and the decorative part, so that the decorative part is partially embedded in the in the second groove.
  • the imaging assembly further includes a support frame, the support frame is located on the main board and is used for carrying the prism.
  • the electronic device further includes a sealing ring, the sealing ring surrounds the edge of the second light-transmitting surface, and is glued between the prism and the lens protection sheet, and the sealing ring is used for It is used to protect the prism and prevent external water vapor, dust and other substances from adhering to the surface of the prism.
  • the storage table extends toward the center of the decorative part until it reaches the surface of the sealing ring on a side away from the lens protection sheet, and the surface of the sealing ring on a side away from the lens protection sheet bonding.
  • the electronic device further includes a fixing frame, the fixing frame is fixedly connected to the main board and wraps around the support frame, so as to limit the movement of the support frame.
  • the fixing frame includes a first connecting body and at least one second connecting body, the first connecting body and at least one second connecting body are integrally structured, and the first connecting body covers the Around the supporting frame, at least one of the second connecting bodies is fixed on the main board through positioning bolts.
  • a supporting sheet is also included, which is used to support the camera module to balance the gravity of the camera module.
  • the support sheet includes a first support portion, a second support portion and a third support portion.
  • the second support part and the third support part are arranged opposite to the two sides of the first support part, and are fixedly connected with the first support part.
  • An embedding groove is provided on the surface of the main board away from the rear cover, and two embedding grooves are oppositely arranged on both sides of the opening, and the second supporting part and the third supporting part are partially embedded In the embedding groove, there is a space between the first support part and the main board.
  • the present application provides an electronic device, including a back cover, a main board and a camera module, the back cover and the main board are arranged oppositely, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component.
  • the first part of the imaging component is arranged on the main board facing the back cover, the second part of the imaging component extends toward the opening, the signal transmission component is set on the main board facing the back cover, and the imaging component and the signal transmission component are connected through a flexible circuit board.
  • the imaging component can partially extend into the opening, so that the internal assembly structure of the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.
  • FIG. 1 is a schematic structural view of a current electronic device
  • Fig. 2 is a schematic diagram of an assembly structure of a periscope camera module inside an electronic device
  • Fig. 3 is a partial structural schematic diagram of a periscope camera module
  • FIG. 4 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • FIG. 5 is a schematic structural diagram of a motherboard provided in some embodiments of the present application.
  • Fig. 6 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 7 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 8 is a schematic structural diagram of a second structural part provided in some embodiments of the present application.
  • FIG. 9 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 10 is a schematic diagram of the second surface structure of the decorative part provided by some embodiments of the present application.
  • Fig. 11 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 12 is a schematic structural diagram of a second structural part provided in some embodiments of the present application.
  • Fig. 13 is a schematic three-dimensional cross-sectional view of a decorative part provided by some embodiments of the present application.
  • Fig. 14 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 15 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 16 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 17 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • Fig. 18 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 19 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • FIG. 20 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • Fig. 21 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • Fig. 22 is a schematic diagram of an internal assembly structure of an electronic device provided by some embodiments of the present application.
  • Figure 23 is a schematic diagram of the exploded structure between the support sheet and the main board provided by some embodiments of the present application.
  • Figure 24 is a schematic diagram of the exploded structure between the support sheet and the main board provided in some embodiments of the present application.
  • Fig. 25 is a schematic structural diagram of a support sheet provided by some embodiments of the present application.
  • Fig. 26 is a schematic structural diagram of a support sheet provided by some embodiments of the present application.
  • 1-back cover 2-main board; 3-periscope camera module; 4-lens hole; 5-camera module; 6-decorative parts; 7-sealing ring; 8-fixing frame; ;11-support sheet; 21-opening; 22 embedded groove; 31-lens protection sheet; 32-prism; 33-lens barrel; 34-photosensitive element; 35-connector; 36-lens assembly; 37-module substrate; 38-Flexible circuit board; 51-Imaging component; 52-Signal transmission component; 53-Support frame; 61-Connection platform; Body; 111-first supporting part; 112-second supporting part; 113-third supporting part; 114-window; 311-first side; 312-second side; 323-reflecting surface; 331-first structure part; 332-second structure part; 333-first surface; 334-second groove; 511-first part; 512-second part.
  • FIG. 1 is a schematic structural diagram of a current electronic device
  • FIG. 2 is a schematic diagram of an internal assembly structure of the electronic device.
  • the electronic device may include a rear cover 1, a main board 2, and a periscope camera module 3.
  • the periscope camera module 3 is an image input device and is the most important device for image capture. important electronic devices.
  • the periscope camera module 3 may include a lens protection sheet 31 , a prism 32 , a lens barrel 33 , a photosensitive element 34 , a connector 35 , a lens assembly 36 and a module substrate 37 .
  • the back cover 1 includes at least one lens hole 4, and the lens protection sheet 31 can be embedded in the lens hole 4.
  • the lens protection sheet 31 is made of light-transmitting material, and is used to transmit ambient light and prevent external dust from entering the interior of the electronic device.
  • the lens protection sheet 31 includes a first side 311 and a second side 312, wherein the first side 311 is the side of the lens protection sheet 31 facing the outside of the electronic device, and the second side 312 is the side of the lens protection sheet 31 facing the inside of the electronic device On the side, the light L1 enters the lens protection sheet 31 from the first side 311 and exits the lens protection sheet 31 from the second side 312 , and enters the interior of the electronic device.
  • the lens barrel 33 is arranged parallel to the mainboard 2 between the mainboard 2 and the lens protection sheet 31. More specifically, the side of the lens barrel 33 close to the lens hole 4 is provided with a broken wall structure so that the light L1 can enter the inside of the lens barrel.
  • the prism 32 It is fixed at one end of the lens barrel 33 and is located at the bottom of the broken wall structure of the lens barrel 33.
  • the light L1 can enter the prism 32 from the broken wall structure of the lens barrel 33, the photosensitive element 34 is fixed at the other end of the lens barrel 33, and the lens assembly 36 is set In the lens barrel 33, and between the prism 32 and the photosensitive element 34, the photosensitive element 34 is attached to the module substrate 37, and the module substrate 37 is connected to the connector 35 provided on the main board 2 through a flexible circuit board. .
  • Fig. 3 is a partial structural schematic diagram of a periscope camera module, referring to Fig. 2 and Fig. 3, the prism 32 in the electronic device may be a triangular prism, including a first light-transmitting surface 321, a second light-transmitting surface 322 and a reflection Surface 323, the first light-transmitting surface 321 is the side surface of the prism 32 facing the photosensitive element 34, the second light-transmitting surface 322 is the side surface of the prism 32 facing the lens protection sheet 31, the second light-transmission surface 322 and the lens protection sheet 31 parallel settings. More specifically, photosensitive pixel blocks for receiving light signals are disposed on the photosensitive element 34 , and the first light-transmitting surface 321 is disposed opposite to the side of the photosensitive element 34 on which the photosensitive pixel blocks are disposed.
  • the light L1 After passing through the second side surface 312, the light L1 reaches the second light-transmitting surface 322 through the opening on the lens barrel 33, enters from the second light-transmitting surface 322, and reflects after reaching the reflecting surface 323, and the direction of the light path changes.
  • the first light-transmitting surface 321 passes through and reaches the photosensitive element 34 through the lens assembly 36.
  • the conversion of optical signals to electrical signals can be realized through the photosensitive element 34, and the photosensitive element 34 can transmit the converted electrical signal to the module substrate 37.
  • the module substrate 37 transmits the electrical signal to the connector 35 through the flexible circuit board 38 , and then the electrical signal is transmitted to the main board through the connector 35 , and the main board can process the received electrical signal to generate an electronic image.
  • an embodiment of the present application provides a An electronic device, including but not limited to mobile phones, tablet computers, aerial vehicles, smart wearable devices, etc., the electronic device reduces the thickness of the electronic device by improving the assembly structure of its internal camera module, thereby reducing the The volume of electronic equipment makes electronic equipment more miniaturized and compact.
  • FIG. 4 is a schematic diagram of an assembly structure of a camera module provided in an electronic device according to some embodiments of the present application.
  • the electronic device includes a rear cover 1 , a camera module 5 , a lens protection sheet 31 and a main board 2 , and the camera module 5 includes an imaging component 51 and a signal transmission component 52 .
  • the back cover 1 is an external component of the electronic device, used to protect the internal components of the electronic device, and the back cover 1 can cover components such as batteries of the electronic device.
  • the back cover 1 can be made of plastic material, and the plastic has good ductility, which is conducive to the shaping and production of the back cover 1 , and further facilitates the mass production of the back cover 1 .
  • the specific material of the back cover 1 can also be set according to different situations.
  • the back cover 1 can also be made of metal materials such as aluminum and iron, and the hardness of metal materials such as aluminum and iron is better. , which is beneficial to the protection of the internal components of the electronic device, and the specific material of the back cover 1 is not limited here.
  • FIG. 5 is a schematic structural diagram of the main board provided by some embodiments of the present application.
  • the main board 2 includes an opening 21, which is a hollow structure located in the middle of the main board 2. It should be noted that the size of the opening 21 and the position on the main board can be set according to actual needs, and the specific size of the opening and the specific position on the main board are not limited here.
  • the edge of the lens hole 4 is provided with a decoration 6, the decoration 6 is a hollow ring structure, and the outer diameter of the decoration 6 is the same as the inner diameter of the lens hole 4, so that The decorative part 6 and the lens hole 4 can be sealed and connected to prevent external dust from entering the interior of the electronic device.
  • the outer wall of the decorative part 6 is provided with a connecting platform 61, the outer ring of the connecting platform 61 is sealed and connected with the inner ring of the decorative part 6, and the connecting platform 61 is attached to the inner side of the rear cover 1, and is used to fix the decorative part 6 on the lens hole 4 More specifically, the connecting platform 61 can be attached to the inner side of the rear cover 1 by means of bonding, welding, clamping, etc., so that the decorative part 6 is fixed in the lens hole 4 .
  • the inner wall of the decoration 6 is provided with a first groove
  • the lens protection sheet 31 is located in the decoration 6
  • the edge of the lens protection sheet 31 is embedded in the first groove.
  • a storage platform 62 is provided on the inner wall of the decorative part 6 , and the storage platform 62 is a hollow ring structure, and the outer ring of the storage platform 62 is in sealing connection with the inner ring of the decorative part 6 .
  • the storage table 62 is used to fix the lens protection sheet 31, and the lens protection sheet 31 is bonded to the surface of the storage table 62 away from the main board 2, and the distance from the surface of the storage table far away from the main board to the surface of the decorative part away from the main board is greater than or equal to the lens protection sheet thickness of.
  • the imaging component 51 , the signal transmission component 52 and the main board 2 are all located inside the electronic device.
  • the first part 511 of the imaging component 51 is disposed on the main board 2 facing the back cover 1 and opposite to the lens protection sheet 31
  • the second part 512 extends toward the opening 21 .
  • the signal transmission component 52 is arranged on the main board 2, and is located between the rear cover 1 and the main board 2, and is connected to the imaging component 51 through the flexible circuit board 38.
  • the specific position of the signal transmission component 52 is not specifically limited.
  • the signal transmission component 52 can be opposite to the first part 511 of the imaging component 51 set on both sides of the opening.
  • the first part 511 of the imaging component 51 includes the prism 32
  • the second part 512 of the imaging component 51 includes the lens barrel 33 , the lens component 36 , the photosensitive element 34 and the module substrate 37 .
  • FIG. 6 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device.
  • the prism 32 is arranged on the main board 2 opposite to the lens protection sheet 31.
  • the prism 32 includes a first The transparent surface 321 , the second transparent surface 322 and the reflective surface 323 .
  • the first light-transmitting surface 321 is a side surface where the prism 32 is connected with the second part of the imaging assembly 51, one end of the lens barrel is sealed and connected with the first light-transmitting surface of the prism, and the other end of the lens barrel 33 faces the prism with the photosensitive element 34 32 one side sealing connection.
  • the first light-transmitting surface 321 can be sealed and connected to one end of the lens barrel 33 by means of bonding, welding, clipping, or the like.
  • the prism 32 is a triangular prism, but in other implementation manners, the prism 32 may also be a polygonal prism 32, and the specific type of the prism 32 is not limited here.
  • the prism 32 may be made of quartz glass, which has high hardness and high transparency, which is beneficial to improve the wear resistance and optical performance of the prism 32 .
  • the prism 32 can also be made of optical glass, alkali metal halide (such as sodium bromide) crystal and other materials.
  • alkali metal halide such as sodium bromide
  • the specific material of the prism 32 can be set according to different situations, and the material of the prism 32 is not limited here.
  • the lens barrel 33 includes a first structure part 331 and a second structure part 332. Both the first structure part 331 and the second structure part 332 are hollow structures with the same inner diameter. One end of the first structure part 331 is sealed with the first light-transmitting surface 321. connected, and the other end is sealingly connected with one end of the second structure part 332 . The other end of the second structure portion 332 extends toward the signal transmission component 52 .
  • the prism 32 is spaced from the edge of the opening 21, the first structural part 331 is parallel to the main board 2, and the first structural part 331 is arranged between the prism 32 and the edge of the opening 21. Meanwhile, the end of the first structure portion 331 away from the prism 32 is in the same plane as the edge of the opening 21 .
  • One end of the second structure part 332 is sealingly connected to the first structure part 331 , and the other end extends toward the opening 21 away from the rear cover 1 .
  • connection between the prism 32 and the first structural part 331 may also be located at the edge of the opening 21, and the first structural part 331 is arranged obliquely relative to the main board 2, and moves away from the rear cover 1 toward the opening 21.
  • the angle A between the first structure part 331 and the main board 2 is 0° ⁇ A ⁇ 90°, so that the other end of the second structure part 332 is located in the opening 21 of the main board 2 .
  • the end of the second structural part 332 away from the first structural part 331 may partly or completely pass through the opening 21 of the main board 2 .
  • the distance that the second structure part 332 extends along the bending direction can be set according to the size of the opening 21 on the main board 2 and the actual needs without affecting the light transmission. The distance is limited.
  • the technical solution provided by the embodiment of the present application is conducive to reducing the thickness of the electronic device. Specifically, if the distance between the highest point and the lowest point of the tangent plane where the top of the second structure part is located is defined as S1 in the direction perpendicular to the horizontal plane, then S1 That is, the thickness that can be reduced by the electronic device (that is, the distance that the casing can sink).
  • the thickness S1 that can be reduced by the above-mentioned electronic device is the limit distance, which can be realized by adjusting the angle of A in practical applications.
  • the photosensitive element 34 is arranged at the end of the second structural part 332 away from the first structural part 331 , the lens assembly 36 is vertically arranged in the lens barrel 33 , and is located between the prism 32 and the photosensitive element. 34 , the module substrate 37 is disposed on the side of the photosensitive element 34 away from the lens assembly 36 .
  • the lens assembly 36 can be lens elements such as a fixed-focus lens, a telephoto lens, and a wide-angle lens. In specific applications, it can also be configured with optical lenses such as optical filters.
  • the lens assembly 36 can be designed with reference to the prior art. , this application will not go into details.
  • the side of the photosensitive element 34 facing the first light-transmitting surface 321 includes a plurality of photosensitive pixel blocks, and each photosensitive pixel block corresponds to three photosensitive units of red, green and blue. After the light signal passing through the lens assembly 36 reaches the photosensitive element, it further enters the The corresponding photosensitive unit, which is essentially a photodiode, can convert light signals of different intensities into electrical signals of different intensities, and use the module substrate 37 to transmit the converted electrical signals to other components.
  • the imaging assembly 51 further includes a support frame 53, the support frame 53 is arranged on the main board 2, and is in contact with the prism 32, and the size of the support frame 53 matches the size of the prism 32, so as to Ensure that the support frame 53 can stably carry the prism 32.
  • the support frame 53 can carry the prism and at the same time move the prism by matching with magnets, balls, etc., so as to realize the change of the reflection position of the optical path, optical anti-shake, etc. function, in a specific application, the support frame can be designed with reference to the prior art, which will not be repeated in this application.
  • light L2 enters the lens protection sheet 31 from the first side 311, passes through the lens protection sheet 31 from the second side 312, enters through the second light-transmitting surface 322 of the prism 32, and is reflected after reaching the reflecting surface 323.
  • the propagating direction of the light changes, and passes through the first light-transmitting surface 321, and reaches the photosensitive element 34 through the lens assembly 36.
  • the photosensitive element 34 can realize the conversion of the optical signal to the electrical signal, and the photosensitive element 34 can convert the converted electrical signal
  • the signal is transmitted to the module substrate 37, and the module substrate 37 transmits the electrical signal to the signal transmission component 52 through the flexible circuit board 38, and then the signal transmission component 52 transmits the electrical signal to the main board, and the main board can process the received electrical signal , to generate an electronic image.
  • the included angle between the reflecting surface 323 and the first light-transmitting surface 321 is C
  • the included angle between the reflecting surface 323 and the second light-transmitting surface 322 is B
  • the size of the angle between B and C needs to be determined according to The selected refractive index of the prism 32, after the light reaches the reflective surface 323 and is reflected, is expected to be set at the angle at which the light is deflected relative to the horizontal plane.
  • Figure 7 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application
  • Figure 8 is a schematic structural diagram of the second structural part provided by some embodiments of the present application, in one implementation, as shown in Figure 7 and Figure 8
  • the second structural part 332 also includes a first surface 333
  • the first surface 333 is the bottom plane of the second structural part 332 away from the lens protection sheet 31
  • the first surface 333 is parallel to the main board 2, so as to reduce the second
  • the distance S2 from the first surface 333 of the structure part 332 to the top cut surface of the second structure part 332 further reduces the thickness of the electronic device.
  • FIG. 9 is a schematic diagram of an internal assembly structure of an electronic device provided by some embodiments of the present application
  • FIG. 10 is a schematic structural diagram of a decorative part provided by some embodiments of the present application.
  • the decorative part 6 further includes a second surface 63 , the second surface 63 is that the decorative part 6 faces the second structural part 332 and has the same arc as the second structural part 332 In order to further reduce the thickness of the electronic device by reducing the distance between the lens protection sheet 31 and the prism 32 .
  • FIG. 11 is a schematic diagram of an internal assembly structure of an electronic device provided in some embodiments of the present application
  • FIG. 12 is a schematic structural diagram of a second structural part provided in some embodiments of the present application.
  • the second structural part 332 further includes a second groove 334
  • the second groove 334 is located at the contact position between the second structural part 332 and the decorative part 6, so that The decorative part 6 is partially embedded in the second groove 334 , and by reducing the distance between the lens protection sheet 31 and the prism 32 , the thickness of the electronic device is further reduced.
  • the present application does not impose specific restrictions on the position, shape and size of the second groove 334, as long as the shape and size of the second groove 334 are consistent with the shape and size of the contact point between the decorative part 6 and the second structural part 332. It only needs to be matched so that the decorative part 6 can be partially embedded in the groove, which will not be repeated in this application.
  • Fig. 13 is a three-dimensional schematic cross-sectional view of a decorative part provided by some embodiments of the present application.
  • the connecting platform 61 surrounds the decorative part 6 for connecting the decorative part 6 Connected with the rear cover 1
  • the storage table 62 can be distributed on the inner wall of the decoration part in a stepped manner, and is used for placing the lens protection sheet 31 .
  • a sealing ring 7 is also provided between the prism 32 and the lens protection sheet 31 .
  • the sealing ring 7 is a hollow ring structure, and the cross-sectional shape of the sealing ring 7 matches the shape of the second light-transmitting surface 322 of the prism 32 .
  • the second light-transmitting surface 322 can be rectangular, and the sealing ring 7 can be a cube or a cuboid, forming a hollow cavity inside, and the cross-section of the sealing ring 7 is the same rectangle as the second light-transmitting surface 322 .
  • the second light-transmitting surface 322 may be triangular
  • the sealing ring 7 may be a triangular prism forming a hollow cavity inside.
  • the section of the sealing ring 7 is the same triangle as the second light-transmitting surface 322 .
  • the sealing ring 7 can be made of materials such as foam, rubber, silica gel, etc., and is used to protect the prism 32 and prevent external water vapor or dust from adhering to the surface of the prism 32 and affecting the light transmission and reflection capabilities of the prism 32.
  • the sealing ring 7 surrounds the edge of the second light-transmitting surface 322 of the prism 32 and is in close contact with the prism 32 and the lens protection sheet 31 . Specifically, the sealing ring 7 can be bonded between the prism 32 and the lens protection sheet 31 .
  • FIG. 15 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • the storage table 62 can extend toward the center of the decoration 6 until it reaches the second light-transmitting surface 322 edge side.
  • a sealing ring 7 can be arranged between the prism 32 and the object table 62.
  • the sealing ring 7 is a hollow annular structure, and the shape of the sealing ring 7 matches the shape of the second light-transmitting surface 322 .
  • the second light-transmitting surface 322 can be rectangular, and the sealing ring 7 can be a cube or a cuboid, forming a hollow cavity inside, and the cross-section of the sealing ring 7 is the same rectangle as the second light-transmitting surface 322 .
  • the second light-transmitting surface 322 may be triangular, and the sealing ring 7 may be a triangular prism forming a hollow cavity inside.
  • the section of the sealing ring 7 is the same triangle as the second light-transmitting surface 322 .
  • the sealing ring 7 is distributed on the edge of the second light-transmitting surface 322 and is in close contact with the prism 32 and the object table 62 . Specifically, the sealing ring 7 can be bonded between the prism 32 and the object table 62 .
  • Figure 16 is a schematic diagram of the assembly structure inside the electronic device provided by some embodiments of the present application
  • Figure 17 is a schematic diagram of the three-dimensional assembly structure inside the electronic device provided by some embodiments of the present application, as shown in Figure 16 and Figure 17, in one implementation
  • the electronic device may also include a fixing frame 8, which is wrapped around the prism 32 and the supporting frame 53, and is fixedly connected to the main board to limit the positions of the prism 32 and the supporting frame 53.
  • the fixing frame 8 may It is fixedly connected to the main board 2 by means of bonding, welding, clamping or the like.
  • FIG. 18 is a schematic diagram of an internal assembly structure of an electronic device provided by some embodiments of the present application
  • FIG. 19 is a schematic diagram of a three-dimensional assembly structure of an internal electronic device provided by some embodiments of the present application.
  • the fixing frame 8 may further include a first connecting body 81 and a second connecting body 82, and the first connecting body 81 and the second connecting body 82 may be an integral structure.
  • the first connecting body 81 is located on the main board, and the prism 32 and the supporting frame 53 may be partially or completely embedded in the first connecting body 81 .
  • the second connecting body 82 can be a cube structure, the length of each side of which is less than or equal to the length of the base of one side of the outer surface of the first connecting body 81 in contact with it, and the second connecting body 82 is located between the first connecting body 81-
  • the bottom of the side outer surface is fixedly connected with the first connecting body 81, the second connecting body 82 is in contact with the main board 2, and the second connecting body 82 and the main board 2 are provided with coaxial perforations, and the positioning bolt 9 is arranged in the perforating holes, and
  • the outer diameter of the positioning bolt 9 is the same as the inner diameter of the perforation, which is used to increase the stability of the connection between the second connecting body 82 and the main board 2, and avoid relative sliding between the camera module 5 and the main board 2, so as to limit the camera module 5 s position.
  • FIG. 20 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • the first connecting body 81 in order to further limit the position of the camera module 5, can be fixedly connected with two second connecting bodies 82 respectively to form an integrated structure, the second connecting body 82 is in contact with the main board 2.
  • the two second connectors 82 can be located at the bottom of the outer surfaces on both sides opposite to the first connector 81, or can be located at the bottom of the outer surfaces on both sides adjacent to the first connector 81.
  • each second connecting body 82 and the main board 2 are provided with a coaxial perforation
  • the positioning pin 9 is arranged in the perforation, and the outer diameter of the positioning pin 9 is the same as the inner diameter of the perforating to increase the second connecting body 82 and the main board. 2
  • the position of the second connecting body 82 can be adjusted as required, which is not specifically limited in this application.
  • Figure 21 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • a plurality of second connectors 82 are fixedly connected to form an integrated structure.
  • the plurality of second connectors 82 are all in contact with the main board 2.
  • at least one second connector is provided at the bottom of the outer surface of each side of the first connector 81.
  • each second connecting body 82 and the main board 2 are provided with a coaxial perforation, the positioning pin 9 is arranged in the perforation, and the outer diameter of the positioning pin 9 is the same as the inner diameter of the perforation, so as to increase the second connecting body 82
  • the stability of the connection with the main board 2, in specific implementation, the positions of these second connecting bodies 82 can be adjusted as required, which is not specifically limited in this application.
  • the inner wall of the perforation is provided with a first thread structure
  • the outer wall of the positioning bolt 9 is provided with a second thread structure matching the first thread structure
  • the positioning bolt 9 and the perforation pass through the first thread structure and the second thread structure.
  • the structure is tightly connected, which increases the stability of the connection between the second connecting body 82 and the main board 2 .
  • Figure 22 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application
  • Figure 23 is a schematic diagram of the exploded structure between the support sheet and the main board provided by some embodiments of the present application, as shown in Figures 22 and 23, in a
  • the electronic device further includes a support sheet 11, and the support sheet 11 includes a first support portion 111, a second support portion 112, and a third support portion 113.
  • the second support portion 112 and the third support portion 113 are oppositely disposed on two sides of the first support portion 111 , and are fixedly connected with the first support portion 111 .
  • Embedding grooves 22 are respectively provided on the parts of the main board 2 close to the two sides of the opening 21, and the second supporting part 112 and the third supporting part 113 can be partially embedded in the embedding grooves 22 by bonding, welding, clipping, etc., so that the first supporting part
  • the part 111 is located on the side of the main board 2 away from the back cover 1, and there is a space between the main board 2.
  • the first support part 111 can provide support for the second structural part 332 to balance the gravity on the second structural part 332, thereby fixing the second structural part 332.
  • Second structural part 332 Second structural part 332 .
  • Fig. 24 is a schematic diagram of an exploded structure between a support sheet and a main board provided in some embodiments of the present application.
  • the connection line between the center points of the two embedding grooves 22 is along the long side of the electronic device, or as shown in FIG. 24, the two embedding grooves 22 is along the direction of the width of the electronic device, as long as the second support part 112 and the third support part 113 are embedded in the insertion groove 22, the first support part 111 is located at the bottom of the opening 21, and the opening 21
  • the projected area of the first supporting portion 111 may be less than or equal to the area of the surface of the first supporting portion 111 close to the main board 2 .
  • the supporting sheet 11 can be made of plastic material, and the plastic has good ductility, which is beneficial to shaping and manufacturing the supporting sheet 11 , and further facilitates the mass production of the supporting sheet 11 .
  • the specific material of the support piece 11 can also be set according to different situations.
  • the support piece 11 can also be made of metal materials such as steel, iron, alloy, etc., and metal materials such as steel, iron, alloy, etc. The hardness is better, which is beneficial to provide support for the second structure part 332, and the specific material of the support piece 11 is not limited here.
  • Figure 25 is a schematic structural view of the support sheet provided by some embodiments of the present application
  • Figure 26 is a schematic structural view of the support sheet provided by some embodiments of the present application, see Figure 25 and Figure 26, in one implementation, the support sheet 11 A window 114 is also provided to reduce the weight of the electronic device after adding the supporting sheet 11 .
  • the opening 114 is a plurality of opening structures evenly arranged on the supporting sheet 11, and the shape of the hole can be circular, square, rectangular or any other shape, or the opening 114 is a strip-shaped hollow arranged on the supporting sheet 11 structure, it should be noted that if the window opening 114 is a strip-shaped hollow structure arranged on the support sheet 11, the strip-shaped hollow structure should not be too large, so as to avoid the second structural part 332 being completely exposed from the strip-shaped hollow structure. The ability to support the second structure part 332 is lost.
  • the present application provides an electronic device, including a back cover, a main board and a camera module, the back cover and the main board are arranged oppositely, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component.
  • the first part of the imaging component is arranged on the main board facing the back cover, the second part of the imaging component extends toward the opening, the signal transmission component is set on the main board facing the back cover, and the imaging component and the signal transmission component are connected through a flexible circuit board.
  • the imaging component can partially extend into the opening, so that the internal assembly structure of the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.

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Abstract

本申请提供了一种电子设备，包括后盖、主板以及摄像头模组，后盖和主板相对设置，主板包括开口，摄像头模组包括成像组件和信号传递组件。其中，成像组件的第一部分面向后盖设置在主板上，成像组件的第二部分向所述开口延伸，信号传递组件面向后盖设置在主板上，成像组件和信号传递组件通过柔性电路板连接。本申请提供的电子设备，由于主板上有开口，成像组件可以部分延伸至开口中，使得电子设备内部的装配结构更为合理，通过减小电子设备的厚度以减小电子设备的体积。

Description

一种电子设备
本申请要求在2021年11月25日提交的、申请号为202111412812.3、发明名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及潜望式摄像装置技术领域，尤其涉及一种电子设备。
背景技术
由于手机、平板电脑等电子设备厚度尺寸的限制，采用沿电子设备厚度方向放置的摄像头焦距较小，光学变焦能力有限，目前最高能达到3倍光学变焦。
因此，为了实现高倍光学变焦，需要区别于传统的摄像头沿电子设备厚度方向设置的方式，在电子设备内部采用垂直于电子设备厚度方向设置摄像头模组的方式，通过特殊的光学棱镜让光线折射至感光元件上实现成像。这种采用垂直于电子设备厚度方向设置的摄像头模组就是潜望式摄像头模组，潜望式摄像头模组能够达到较高的光学变焦倍数，拍摄远处物体更清晰。
然而，随着手机、平板电脑等电子设备日益趋向小型化、紧凑化，对电子设备的体积也具有更严格的要求。因此，如何减小电子设备的体积是亟需解决的问题。
发明内容
本申请提供了一种电子设备，其潜望式摄像头模组在电子设备内部的装配结构更为合理，通过减小电子设备的厚度以减小电子设备的体积。
本申请提供的电子设备，包括后盖、主板以及摄像头模组。
其中，后盖为电子设备的外部零部件，可以覆盖电子设备的电池等元件，用于保护电子设备的内部元件，防止外界灰尘进入电子设备内部。主板是电子设备的重要内部部件，上面安装了组成电子设备的芯片和电路元件，例如BIOS芯片、I/O控制芯片、键盘和面板控制开关接口以及供电插件等元件。主板用于将不同电压的用电器元件连接在一起，以形成通信线路，也可以用于将内部设备处理的数据集中，并传递至外界，以实现通讯功能。摄像头模组用于捕获静态图像或视频。
本申请提供的电子设备的后盖和主板相对设置，所述主板包括开口，所述摄像头模组包括成像组件和信号传递组件。成像组件用于收集环境光线，形成光信号，并将光信号转换为电信号传递至信号传递组件，信号传递组件用于接收成像组件传来的电信号，放大后，将电信号传出至其他组件。
其中，所述成像组件的第一部分面向所述后盖设置在所述主板上，所述成像组件的第二部分向所述开口延伸，以使后盖可以下沉，更接近主板，通过减少后盖和主板之间的距离，从而减小电子设备的厚度，进一步的减小了电子设备的体积。信号传递组件面向所述后盖设置在所述主板上，成像组件和所述信号传递组件通过柔性电路板连接。
可选的，所述成像组件的第一部分与所述信号传递组件相对的设置在所述开口的两侧。
可选的，所述成像组件的第一部分包括棱镜，所述成像组件的第二部分包括镜筒、感光元件以及模组基板，其中，棱镜用于改变入射光线的光路，使其传入至镜筒中，镜筒用于固定其内部的光学元件，例如镜头、滤光片等，以及防止光束外扩造成光线损耗。感光元件可以是电荷耦合器件(charge coupled device，CCD)或互补金属氧化物半导体(complementary metal-oxide-semiconductor，CMOS)光电晶体管。感光元件用于将通过镜筒的光信号转换成电信号，之后将电信号传递给如ISP等信号处理元件，以进一步完成对电信的号加工处理。本申请的电子设备可以包括1个或N个摄像头模组，N为大于1的正整数。
所述棱镜包括第一透光面，所述第一透光面是所述棱镜面向所述信号传递组件的一侧表面，所述镜筒的一端与所述棱镜的第一透光面密封连接，所述镜筒的另一端向所述开口延伸。
所述感光元件设置在所述镜筒的另一端，且与所述镜筒密封连接，所述模组基板贴合设置在所述感光元件的一侧表面，所述感光元件的一侧表面是远离所述镜筒的面，所述感光元件通过所述柔性电路板与所述信号传递组件连接。
可选的，所述镜筒包括第一结构部和第二结构部，所述第一结构部和所述第二结构部均为中空结构，且内径相同，所述第一结构部一端与所述第一透光面密封连接，所述第一结构部另一端与所述第二结构部密封连接，所述第二结构部相对于所述主板倾斜设置，且向所述开口远离所述后盖的方向延伸，所述第二结构部相对于所述主板的夹角大于0°且小于90°。
可选的，所述棱镜与所述第一结构部的连接处位于所述开口的边缘，所述第一结构部相对于所述主板倾斜设置，且向所述开口远离所述后盖的方向延伸，所述第一结构部相对于所述主板的夹角大于0°且小于90°。
可选的，所述棱镜与所述开口的边缘具有间隔，所述第一结构部与所述主板平行，且所述第一结构部设置在所述棱镜与所述开口的边缘之间，所述第一结构部远离所述棱镜的一端与所述开口的边缘共面；所述第二结构部一端与所述第一结构部一端密封连接，另一端向所述开口远离所述后盖的方向延伸。
可选的，所述棱镜还包括第二透光面，所述第二透光面是所述棱镜远离所述主板的一侧表面。所述后盖还包括镜头孔，所述镜头孔中设置有镜头保护片，所述镜头保护片与所述第二透光面相对且平行设置，所述镜头保护片用于防止外界灰尘进入到电子设备内部。
可选的，所述电子设备还包括装饰件和连接台，所述装饰件为中空的环状结构，所述装饰件的外径与所述镜头孔的内径相同，所述装饰件嵌入在所述镜头孔内，所述镜头保护片固定在所述装饰件中；所述连接台为中空的环形结构，且贴合于所述后盖内侧设置，所述连接台的内环与所述装饰件的外环连接，
可选的，所述装饰件的内壁设置有第一凹槽，所述镜头保护片位于所述装饰件内，且所述镜头保护片的边缘嵌入在所述第一凹槽中。
可选的，还包括置物台，所述置物台为中空的环状结构，且所述置物台的外环与所述装饰件的内环连接，所述镜头保护片粘接在所述置物台远离所述主板的表面。
所述置物台的远离所述主板的表面到所述装饰件远离所述主板的表面的距离大于或等于所述镜头保护片的厚度。
可选的，所述第二结构部还包括第一表面，所述第一表面是所述第二结构部远离所述镜头保护片一侧的底部平面，所述第一表面与所述主板相平行。
可选的，所述装饰件还包括第二表面，所述第二表面是所述装饰件朝向所述第二结构部且与所述第二结构部的弧度相同的面。
可选的，所述第二结构部还包括第二凹槽，所述第二凹槽位于所述第二结构部与所述装饰件的接触处，以使所述装饰件部分嵌入在所述第二凹槽中。
可选的，所述成像组件还包括支撑架，所述支撑架位于所述主板上，用于搭载所述棱镜。
可选的，所述电子设备还包括密封圈，所述密封圈环绕在所述第二透光面的边缘，且粘接在所述棱镜和所述镜头保护片之间，所述密封圈用于保护棱镜，防止外界水汽、灰尘等物质附着在棱镜表面。
可选的，所述置物台向所述装饰件中心方向延伸，直至延伸到所述密封圈远离所述镜头保护片的一侧表面，与所述密封圈远离所述镜头保护片的一侧表面粘接。
可选的，所述电子设备还包括固定架，所述固定架与所述主板固定连接且包覆在所述支撑架周围，用于限制所述支撑架产生移动。
可选的，所述固定架包括第一连接体和至少一个第二连接体，所述第一连接体和至少一个所述第二连接体为一体结构，所述第一连接体包覆在所述支撑架周围，至少一个所述第二连接体通过定位栓固定在所述主板上。
可选的，还包括支撑片，用于支撑所述摄像头模组，以平衡摄像头模组的重力。所述支撑片包括第一支撑部、第二支撑部和第三支撑部。所述第二支撑部和所述第三支撑部相对设置在所述第一支撑部的两侧，与所述第一支撑部固定连接。
所述主板远离所述后盖的一侧表面上设置有嵌入槽，两个所述嵌入槽相对的设置在所述开口的两侧，所述第二支撑部和所述第三支撑部部分嵌入在所述嵌入槽中，所述第一支撑部与所述主板之间有间隔。
由以上技术可知，本申请提供了一种电子设备，包括后盖、主板以及摄像头模组，后盖和主板相对设置，主板包括开口，摄像头模组包括成像组件和信号传递组件。其中，成像组件的第一部分面向后盖设置在主板上，成像组件的第二部分向所述开口延伸，信号传递组件面向后盖设置在主板上，成像组件和信号传递组件通过柔性电路板连接。本申请提供的电子设备，由于主板上有开口，成像组件可以部分延伸至开口中，使得电子设备内部的装配结构更为合理，通过减小电子设备的厚度以减小电子设备的体积。
附图说明
图1为目前一种电子设备的结构示意图；
图2为一种潜望式摄像头模组在电子设备内部的装配结构示意图；
图3为一种潜望式摄像头模组的部分结构示意图；
图4为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图；
图5为本申请部分实施例提供的主板的结构示意图；
图6为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图；
图7为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图；
图8为本申请部分实施例提供的第二结构部的结构示意图；
图9为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图；
图10为本申请部分实施例提供的装饰件的第二表面结构示意图；
图11为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图；
图12为本申请部分实施例提供的第二结构部的结构示意图；
图13为本申请部分实施例提供的装饰件的三维截面示意图；
图14为本申请部分实施例提供的电子设备内部的装配结构示意图；
图15为本申请部分实施例提供的电子设备内部的装配结构示意图；
图16为本申请部分实施例提供的电子设备内部的装配结构示意图；
图17为本申请部分实施例提供的电子设备内部的三维装配结构示意图；
图18为本申请部分实施例提供的电子设备内部的装配结构示意图；
图19为本申请部分实施例提供的电子设备内部的三维装配结构示意图；
图20为本申请部分实施例提供的电子设备内部的三维装配结构示意图；
图21为本申请部分实施例提供的电子设备内部的三维装配结构示意图；
图22为本申请部分实施例提供的电子设备内部的装配结构示意图；
图23为本申请部分实施例提供的支撑片与主板之间的***结构示意图；
图24为本申请部分实施例提供的支撑片与主板之间的***结构示意图；
图25为本申请部分实施例提供的支撑片的结构示意图；
图26为本申请部分实施例提供的支撑片的结构示意图。
图示说明：
其中，1-后盖；2-主板；3-潜望式摄像头模组；4-镜头孔；5-摄像头模组；6-装饰件；7-密封圈；8-固定架；9-定位栓；11-支撑片；21-开口；22嵌入槽；31-镜头保护片；32-棱镜；33-镜筒；34-感光元件；35-连接器；36-镜头组件；37-模组基板；38-柔性电路板；51-成像组件；52-信号传递组件；53-支撑架；61-连接台；62-置物台；63-第二表面；81-第一连接体；82-第二连接体；111-第一支撑部；112-第二支撑部；113-第三支撑部；114-开窗；311-第一侧面；312-第二侧面；321-第一透光面；322-第二透光面；323-反射面；331-第一结构部；332-第二结构部；333-第一表面；334-第二凹槽；511-第一部分；512-第二部分。
具体实施方式
下面将详细地对实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下实施例中描述的实施方式并不代表与本申请相一致的所有实施方式。仅是与权利要求书中所详述的、本申请的一些方面相一致的***和方法的示例。
图1为目前一种电子设备的结构示意图，图2为该电子设备的内部装配结构示意图。如图1和图2所示，该电子设备可以包括后盖1、主板2以及潜望式摄像头模组3，潜望式摄像头模组3是一种图像输入装置，是用于影像捕捉的至关重要的电子器件。潜望式摄像头模组3可以包括镜头保护片31、棱镜32、镜筒33、感光元件34、连接器35、镜头组件36以及模组基板37。
其中，后盖1包括至少一个镜头孔4，镜头保护片31可以嵌入在镜头孔4中，镜头保护片31采用透光材质制成，用于透过环境光线和防止外界灰尘进入电子设备内部。镜头保护片31包括第一侧面311和第二侧面312，其中，第一侧面311为镜头保护片31面向电子设备外 部的一侧侧面，第二侧面312为镜头保护片31面向电子设备内部的一侧侧面，光线L1从第一侧面311射入镜头保护片31并从第二侧面312射出镜头保护片31，进入到电子设备内部。镜筒33平行于主板2设置在主板2和镜头保护片31之间，更为具体的，镜筒33靠近镜头孔4一侧设置有破壁结构，以便光线L1可以进入镜筒内部，棱镜32固定在镜筒33内一端，且位于镜筒33的破壁结构底部，光线L1可以从镜筒33的破壁结构进入棱镜32，感光元件34固定在镜筒33内另一端，镜头组件36设置在镜筒33中，且位于棱镜32和感光元件34之间，感光元件34贴合设置在模组基板37上，模组基板37通过柔性电路板与设置在主板2上的连接器35进行连接。
图3为一种潜望式摄像头模组的部分结构示意图,参见图2和图3，该电子设备中的棱镜32可以是三棱镜，包括第一透光面321、第二透光面322和反射面323，第一透光面321是棱镜32面向感光元件34的一侧表面，第二透光面322是棱镜32面向镜头保护片31的一侧表面，第二透光面322与镜头保护片31平行设置。更为具体的，感光元件34上设置有用于接收光信号的感光像素块，第一透光面321与感光元件34上设置有感光像素块的一侧相对设置。
光线L1从第二侧面312穿出后通过镜筒33上的开口到达第二透光面322，并由第二透光面322射入，到达反射面323后发生反射，光路方向发生改变，从第一透光面321穿出，通过镜头组件36到达感光元件34上，通过感光元件34可以实现光信号到电信号的转换，感光元件34可以将转换好的电信号传至模组基板37，模组基板37通过柔性电路板38将电信号传至连接器35，再由连接器35将电信号传至主板，主板可以对接收到的电信号进行处理，以生成电子图像。
但是，上述潜望式摄像头模组3在电子设备内部的装配结构会导致电子设备的厚度较大，从而使得电子设备的体积较大，为了减小电子设备的体积，本申请实施例提供了一种电子设备，该电子设备包括但不限于手机、平板电脑、航拍飞行器、智能可穿戴设备等，该电子设备通过改进其内部摄像头模组的装配结构，减小了电子设备的厚度，从而减小电子设备的体积，使电子设备更加小型化、紧凑化。
图4为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图。如图4所示，该电子设备包括后盖1、摄像头模组5、镜头保护片31以及主板2，摄像头模组5包括成像组件51以及信号传递组件52。
其中，后盖1为电子设备的外部零部件，用于保护电子设备的内部元件，后盖1可以覆盖电子设备的电池等元件。后盖1可以由塑料材质制成，塑料的延展性好，有利于后盖1的定型和制作，进而有利于后盖1的量产化。此外，也可以根据不同的情况来设置后盖1的具体材质，例如，在其他实现方式中，后盖1也可以由铝、铁等金属材料制成，铝、铁等金属材料的硬度较好，有利于对电子设备内部元件的保护，在此不对后盖1的具体材质做限定。
进一步如图1和图4所示，后盖1包括至少一个镜头孔4，镜头孔4可以位于后盖1的左上位置、右上位置或其他任意位置，本申请实施例对此不作限定。镜头保护片31可以安装在镜头孔4中，用于防止外界灰尘进入电子设备内部。
在一种实现方式中，主板2和后盖1相对设置。进一步地，图5为本申请部分实施例提供的主板的结构示意图，如图5所示，主板2包括开口21，开口21是位于主板2中部的镂空结构，需要说明的是，开口21的尺寸和在主板上的位置可根据实际需求设置，在此不对开口的具体尺寸和在主板上的具***置做限定。
进一步如图4所示，在一种实现方式中，镜头孔4的边缘设置有装饰件6，装饰件6为中空的环形结构，装饰件6的外径与镜头孔4的内径相同，以使装饰件6和镜头孔4可以密封连接，防止外界灰尘进入电子设备内部。装饰件6的外壁设置有连接台61，连接台61的外环与装饰件6的内环密封连接，连接台61贴合于后盖1内侧设置，用于将装饰件6固定在镜头孔4中，更为具体的，连接台61可通过粘接、焊接、卡接等方式贴合于后盖1的内侧设置，从而使装饰件6固定在镜头孔4中。
在一种实现方式中，装饰件6的内壁设置有第一凹槽，镜头保护片31位于装饰件6内，且镜头保护片31的边缘嵌入在第一凹槽中。
在一种实现方式中，装饰件6的内壁设置有置物台62，置物台62为中空的环状结构，置物台62的外环与装饰件6的内环密封链接。置物台62用于固定镜头保护片31，镜头保护片31粘接在置物台62远离主板2的表面，且置物台的远离主板的表面到装饰件远离主板的表面的距离大于或等于镜头保护片的厚度。
进一步如图4所示，成像组件51、信号传递组件52和主板2均位于电子设备内部。其中，成像组件51的第一部分511面向后盖1设置在主板2上，且与镜头保护片31相对设置，第二部分512向开口21延伸。信号传递组件52设置在主板2上，且位于后盖1和主板2之间，与成像组件51通过柔性电路板38连接，在本申请中，对信号传递组件52的具***置不做特殊限定，只要满足其设置在主板2上，且可以通过柔性电路板38与成像组件51连接，以满足正常的信号传递功能即可，示例性的，信号传递组件52可以与成像组件51的第一部分511相对的设置在开口的两侧。
成像组件51的第一部分511包括棱镜32，成像组件51的第二部分512包括镜筒33、镜头组件36、感光元件34以及模组基板37。
如图6所示，图6为本申请部分实施例提供的一种摄像头模组在电子设备内部的装配结构示意图，棱镜32与镜头保护片31相对的设置在主板2上，棱镜32包括第一透光面321、第二透光面322和反射面323。第一透光面321是棱镜32与成像组件51的第二部分连接的一侧表面，镜筒的一端与棱镜的第一透光面密封连接，镜筒33的另一端与感光元件34面向棱镜32一侧密封连接。具体的，第一透光面321可通过粘接、焊接、卡接等方式与镜筒33的一端密封连接。
需要说明的是，在一个例子中，棱镜32为三棱镜，但在其他实施方式中，棱镜32还可以为多边棱镜32，在此不对棱镜32的具体种类做出限制。
进一步地，棱镜32可以采用石英石玻璃制成，石英石玻璃的硬度高并且透明度高，有利于提升棱镜32的耐磨能力和光学性能。棱镜32还可以采用光学玻璃、碱金属卤化物(如溴化钠)晶体等材料制成，具体的，可以根据不同的情况来设置棱镜32的具体材质，在此不对棱镜32的材料做限定。
镜筒33包括第一结构部331和第二结构部332，第一结构部331和第二结构部332均为中空结构，且内径相同，第一结构部331一端与第一透光面321密封连接，另一端与第二结构部332一端密封连接。第二结构部332另一端向靠近信号传递组件52的方向延伸。
在一种实现方式中，进一步如图4所示，棱镜32与开口21的边缘具有间隔，第一结构部331与主板2平行，且第一结构部331设置在棱镜32与开口21的边缘之间，第一结构部331远离棱镜32的一端与开口21的边缘共面。第二结构部332一端与第一结构部331密封连接，另一端向开口21远离后盖1的方向延伸。
在一种实现方式中，棱镜32与第一结构部331的连接处还可以位于开口21的边缘，第一结构部331相对于主板2倾斜设置，且向开口21远离所述后盖1的方向延伸，第一结构部331相对于主板2的有夹角A，0°<A<90°，使第二结构部332另一端部位于主板2的开口21中。
进一步如图6所示，在一种实现方式中，第二结构部332远离第一结构部331的一端可以部分或全部从主板2的开口21中穿出。第二结构部332沿弯折方向延伸的距离在不影响光线传播的情况下，可根据主板2上开口21的尺寸及实际需求设置，在此不对第二结构部332沿弯折方向延伸的具体距离做限定。
本申请实施例提供的技术方案有利于减小电子设备的厚度，具体来说，如果定义第二结构部顶部所在切面的最高点与最低点在垂直于水平面方向之间的距离为S1，那么S1即为电子设备可减少的厚度(即壳体可以下沉的距离)。
这里需要补充说明的是，上述电子设备可减少的厚度S1(即壳体可以下沉的距离S1)为极限距离，在实际应用中，可以通过调整A的角度等方式实现。
进一步参见图6，在一种实现方式中，感光元件34设置在第二结构部332远离第一结构部331的一端，镜头组件36竖直设置在镜筒33中，且位于棱镜32和感光元件34之间，模组基板37设置在感光元件34远离镜头组件36一侧。
进一步地，镜头组件36可以是如定焦镜头、长焦镜头、广角镜头等镜头元件，在具体应用中，也可以搭配如滤光片等光学镜片设置，可参照现有技术对镜头组件36进行设计，本申请不再赘述。
感光元件34面向第一透光面321一侧包括多个感光像素块，每个感光像素块都对应有红绿蓝三个感光单元，通过镜头组件36的光信号到达感光元件后，进一步进入到相应的感光单元，感光单元的实质为光电二极管，可以将不同强度的光信号转换为不同强度的电信号，并利用模组基板37将转换后的电信号传输至其他元件。
进一步参见图6，在一种实现方式中，成像组件51还包括支撑架53，支撑架53设置在主板2上，与棱镜32接触，且支撑架53的尺寸与棱镜32的尺寸相契合，以保证支撑架53可以稳固的搭载棱镜32，在具体实现中，支撑架53搭载棱镜的同时还可以通过搭配磁石、滚珠等运动，从而带动棱镜运动，以实现光路反射位置的变化、光学防抖等功能，在具体应用中，可参照现有技术对支撑架进行设计，本申请不再赘述。
进一步地，光线L2从第一侧面311进入镜头保护片31，并第二侧面312穿出镜头保护片31后由棱镜32的第二透光面322射入，到达反射面323后发生反射，光线的传播方向发生改变，并从第一透光面321穿出，通过镜头组件36到达感光元件34上，通过感光元件34可以实现光信号到电信号的转换，感光元件34可以将转换好的电信号传至模组基板37，模组基板37通过柔性电路板38将电信号传至信号传递组件52，再由信号传递组件52将电信号传至主板，主板可以对接收到的电信号进行处理，以生成电子图像。
需要说明的是，反射面323与第一透光面321之间的夹角为C、反射面323与第二透光面322之间的夹角为B，B和C角度的大小，需要根据所选的棱镜32的折射率，光线到达反射面323发生反射后，期望光线相对于水平面发射偏折的角度设置，在此不对B和C角度的大小做限定。
图7为本申请部分实施例提供的电子设备内部的装配结构示意图，图8为本申请部分实施例提供的第二结构部的结构示意图，在一种实现方式中，如图7和图8所示，第二结构部 332还包括第一表面333，第一表面333是第二结构部332远离镜头保护片31一侧的底部平面，第一表面333与主板2相平行，以通过减少第二结构部332的第一表面333到第二结构部332顶部切面的距离S2，进一步减少了电子设备的厚度尺寸。
图9为本申请部分实施例提供的电子设备内部的装配结构示意图，图10为本申请部分实施例提供的装饰件的结构示意图。在一种实现方式中，如图9和图10所示，装饰件6还包括第二表面63，第二表面63是装饰件6朝向第二结构部332且与第二结构部332的弧度相同的面，以通过减少镜头保护片31与棱镜32之间的距离，进一步减少了电子设备的厚度尺寸。
图11为本申请部分实施例提供的电子设备内部的装配结构示意图，图12为本申请部分实施例提供的第二结构部的结构示意图。在一种实现方式中，如图11和图12所示，第二结构部332还包括第二凹槽334，第二凹槽334位于第二结构部332与装饰件6的接触处，以使装饰件6部分嵌入在第二凹槽334中，通过减少镜头保护片31与棱镜32之间的距离，进一步减少了电子设备的厚度尺寸。
需要说明的是，本申请不对第二凹槽334的位置、形状以及尺寸做具体的限制，只要满足第二凹槽334的形状尺寸和装饰件6与第二结构部332接触处的形状尺寸相匹配，以使装饰件6可以部分嵌入在凹槽中即可，本申请不再赘述。
图13是本申请部分实施例提供的装饰件的三维截面示意图，如图6和图13所示，在一种实现方式中，连接台61环绕在装饰件6的周围，用于将装饰件6和后盖1连接，置物台62可以呈阶梯式分布在装饰件内壁，用于放置镜头保护片31。
在一种实现方式中，如图14所示，棱镜32和镜头保护片31之间还设置有密封圈7。密封圈7为中空的环形结构，密封圈7的截面形状与棱镜32的第二透光面322的形状相契合。例如，第二透光面322可以是矩形，则密封圈7可以是立方体或长方体，内部形成中空的腔体，密封圈7的截面是与第二透光面322相同的矩形。或者，第二透光面322可以是三角形，则密封圈7可以是三棱柱，内部形成中空的腔体，密封圈7的截面是与第二透光面322相同的三角形。在具体应用中，密封圈7可以是如泡棉、橡胶、硅胶等材质，用于保护棱镜32，防止外界水汽或者灰尘等物质附着在棱镜32表面而影响棱镜32的透光能力和反射能力。
密封圈7环绕在棱镜32的第二透光面322边缘，与棱镜32和镜头保护片31紧密接触，具体的，密封圈7可以粘接在棱镜32和镜头保护片31之间。
图15为本申请部分实施例提供的电子设备内部的装配结构示意图，如图15所示，在一种实现方式中，置物台62可以向装饰件6中心方向延伸，直至到达第二透光面322边缘一侧。为了保护棱镜32，防止外界水汽或者灰尘等物质附着在棱镜32表面，从而影响棱镜32的透光能力和反射能力，可以在棱镜32和置物台62之间设置密封圈7。密封圈7为中空的环形结构，密封圈7的形状与第二透光面322的形状相契合。例如，第二透光面322可以是矩形，则密封圈7可以是立方体或长方体，内部形成中空的腔体，密封圈7的截面是与第二透光面322相同的矩形。或者，第二透光面322可以是三角形，则密封圈7可以是三棱柱，内部形成中空的腔体，密封圈7的截面是与第二透光面322相同的三角形。
密封圈7分布在第二透光面322边缘，与棱镜32和置物台62紧密接触，具体的，密封圈7可以粘接在棱镜32和置物台62之间。
图16为本申请部分实施例提供的电子设备内部的装配结构示意图，图17为本申请部分实施例提供的电子设备内部的三维装配结构示意图，如图16和图17所示，在一种实现方式中，电子设备还可以包括固定架8，固定架8包覆在棱镜32和支撑架53周围，通过与主板 固定连接，以限制棱镜32和支撑架53的位置，具体的，固定架8可以通过粘接、焊接、卡接等方式与主板2固定连接。
图18为本申请部分实施例提供的电子设备内部的装配结构示意图，图19为本申请部分实施例提供的电子设备内部的三维装配结构示意图，如图18所示，在一种实现方式中，为了便于固定架8与主板2之间的拆卸，固定架8还可以包括第一连接体81和第二连接体82，第一连接体81和第二连接体82可以是一体的结构。第一连接体81位于主板上，棱镜32和支撑架53可以部分或全部嵌入在第一连接体81中。第二连接体82可以为立方体结构，其各边的长度均小于或等于与之接触的第一连接体81的一侧外表面的底边长度，第二连接体82位于第一连接体81一侧外表面底部，与第一连接体81固定连接，第二连接体82与主板2接触，且第二连接体82和主板2上设置有同轴的穿孔，定位栓9设置在穿孔中，且定位栓9的外径与穿孔的内径相同，用于增加第二连接体82和主板2之间连接的稳定性，避免摄像头模组5和主板2之间发生相对滑动，以限制摄像头模组5的位置。
图20为本申请部分实施例提供的电子设备内部的三维装配结构示意图。如图20所示，在一种实现方式中，为了进一步限制摄像头模组5的位置，第一连接体81可以分别与两个第二连接体82固定连接，形成一体的结构，第二连接体82与主板2接触，具体的，这两个第二连接体82可以分别位于第一连接体81相对的两侧外表面底部，也可以分别位于第一连接体81相邻的两侧外表面底部，且每一个第二连接体82和主板2上均设置有同轴的穿孔，定位栓9设置在穿孔中，定位栓9的外径与穿孔的内径相同，以增加第二连接体82和主板2之间连接的稳定性，可以理解的是，这两个第二连接体82之间的直线距离越大，摄像头模组5与主板2之间越不容易发生相对滑动，在具体实施中，可以根据需要对第二连接体82的位置进行调整，本申请不做具体限制。
图21为本申请部分实施例提供的电子设备内部的三维装配结构示意图，如图21所示，在一种实现方式中，为了进一步限制摄像头模组5的位置，第一连接体81可以分别与多个第二连接体82固定连接，形成一体的结构，多个第二连接体82均与主板2接触，具体的，第一连接体81每一侧外表面底部均设置有至少一个第二连接体82，且每一个第二连接体82和主板2上均设置有同轴的穿孔，定位栓9设置在穿孔中，定位栓9的外径与穿孔的内径相同，以增加第二连接体82和主板2之间连接的稳定性，在具体实施中，可以根据需要对这些第二连接体82的位置进行调整，本申请不做具体限制。
在一种实现方式中，穿孔的内壁设置有第一螺纹结构，定位栓9的外壁设置有与第一螺纹结构匹配的第二螺纹结构，定位栓9和穿孔通过第一螺纹结构和第二螺纹结构紧密连接，增加了第二连接体82和主板2的之间连接的稳定性。
图22为本申请部分实施例提供的电子设备内部的装配结构示意图，图23为本申请部分实施例提供的支撑片与主板之间的***结构示意图，如图22和图23所示，在一种实现方式中，电子设备还包括支撑片11，支撑片11包括第一支撑部111、第二支撑部112和第三支撑部113。第二支撑部112和第三支撑部113相对设置在第一支撑部111的两边，与第一支撑部111固定连接。主板2靠近开口21两侧的部位分别设置有嵌入槽22，第二支撑部112和第三支撑部113可以通过粘接、焊接、卡接等方式部分嵌入到嵌入槽22中，使得第一支撑部111位于主板2远离后盖1一侧，且与主板2之间有间隔，第一支撑部111可以为第二结构部332提供支撑，以平衡第二结构部332受到的重力，从而固定第二结构部332。
图24为本申请部分实施例提供的支撑片与主板之间的***结构示意图。嵌入槽22位置 的设置方式有多种，可以如图25所示，两个嵌入槽22中心点的连线是沿着电子设备长边方向的，也可以如图24所示，两个嵌入槽22中心点的连线是沿着电子设备宽边方向的，只要满足第二支撑部112和第三支撑部113嵌入到嵌入槽22中后，第一支撑部111位于开口21底部，且开口21的投影面积小于或等于第一支撑部111靠近主板2一侧表面的面积即可。
更为具体的，支撑片11可以由塑料材质制成，塑料的延展性好，有利于支撑片11的定型和制作，进而有利于支撑片11的量产化。此外，也可以根据不同的情况来设置支撑片11的具体材质，例如，在其他实现方式中，支撑片11也可以由钢、铁、合金等金属材料制成，钢、铁、合金等金属材料的硬度较好，有利于对为第二结构部332提供支撑，在此不对支撑片11的具体材质做限定。
图25为本申请部分实施例提供的支撑片的结构示意图，图26为本申请部分实施例提供的支撑片的结构示意图，参见图25和图26，在一种实现方式中，支撑片11上还设置有开窗114，以减小加入支撑片11后电子设备的重量。开窗114为均匀设置在支撑片11上的多个开孔结构，孔的形状可以是圆形、方形、矩形和其他任何形状，或者，开窗114为设置在支撑片11上的条形镂空结构，需要注意的是，若开窗114为设置在支撑片11上的条形镂空结构，则该条形镂空结构不宜过大，避免第二结构部332整个从该条形镂空结构中露出，丧失对第二结构部332的支撑能力。
由以上技术可知，本申请提供了一种电子设备，包括后盖、主板以及摄像头模组，后盖和主板相对设置，主板包括开口，摄像头模组包括成像组件和信号传递组件。其中，成像组件的第一部分面向后盖设置在主板上，成像组件的第二部分向所述开口延伸，信号传递组件面向后盖设置在主板上，成像组件和信号传递组件通过柔性电路板连接。本申请提供的电子设备，由于主板上有开口，成像组件可以部分延伸至开口中，使得电子设备内部的装配结构更为合理，通过减小电子设备的厚度以减小电子设备的体积。
本领域技术人员在考虑说明书及实践这里公开的申请后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由下面的权利要求指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (19)

  1. 一种电子设备，其特征在于，包括后盖、主板以及摄像头模组；所述后盖和所述主板相对设置；所述主板包括开口；
    所述摄像头模组包括成像组件和信号传递组件；
    所述成像组件的第一部分面向所述后盖设置在所述主板上，所述成像组件的第二部分向所述开口延伸；
    所述信号传递组件面向所述后盖设置在所述主板上；
    所述成像组件和所述信号传递组件通过柔性电路板连接。
  2. 根据权利要求1所述的电子设备，其特征在于，所述成像组件的第一部分与所述信号传递组件相对的设置在所述开口的两侧。
  3. 根据权利要求2所述的电子设备，其特征在于，所述成像组件的第一部分包括棱镜，所述成像组件的第二部分包括镜筒、感光元件以及模组基板；
    所述棱镜包括第一透光面，所述第一透光面是所述棱镜面向所述信号传递组件的一侧表面；
    所述镜筒的一端与所述棱镜的第一透光面密封连接，所述镜筒的另一端向所述开口延伸；
    所述感光元件设置在所述镜筒的另一端，且与所述镜筒密封连接；
    所述模组基板贴合设置在所述感光元件的一侧表面，所述感光元件的一侧表面是远离所述镜筒的面，所述感光元件通过所述柔性电路板与所述信号传递组件连接。
  4. 根据权利要求3所述的电子设备，其特征在于，所述镜筒包括第一结构部和第二结构部，所述第一结构部和所述第二结构部均为中空结构，且内径相同；
    所述第一结构部一端与所述第一透光面密封连接，所述第一结构部另一端与所述第二结构部密封连接；
    所述第二结构部相对于所述主板倾斜设置，且向所述开口远离所述后盖的方向延伸，所述第二结构部相对于所述主板的夹角大于0°且小于90°。
  5. 根据权利要求4所述的电子设备，其特征在于，所述棱镜与所述第一结构部的连接处位于所述开口的边缘，所述第一结构部相对于所述主板倾斜设置，且向所述开口远离所述后盖的方向延伸，所述第一结构部相对于所述主板的夹角大于0°且小于90°。
  6. 根据权利要求5所述的电子设备，其特征在于，
    所述棱镜与所述开口的边缘具有间隔；
    所述第一结构部与所述主板平行，且所述第一结构部设置在所述棱镜与所述开口的边缘之间，所述第一结构部远离所述棱镜的一端与所述开口的边缘共面；
    所述第二结构部一端与所述第一结构部一端密封连接，另一端向所述开口远离所述后盖的方向延伸。
  7. 根据权利要求6所述的电子设备，其特征在于，
    所述棱镜还包括第二透光面，所述第二透光面是所述棱镜远离所述主板的一侧表面；
    所述后盖还包括镜头孔，所述镜头孔中设置有镜头保护片，所述镜头保护片与所述第二透光面相对且平行设置。
  8. 根据权利要求7所述的电子设备，其特征在于，所述电子设备还包括装饰件和连接台；
    所述装饰件为中空的环状结构，所述装饰件的外径与所述镜头孔的内径相同，所述装饰件嵌入在所述镜头孔内，所述镜头保护片固定在所述装饰件中；
    所述连接台为中空的环形结构，且贴合于所述后盖内侧设置，所述连接台的内环与所述装饰件的外环连接。
  9. 根据权利要求8所述的电子设备，其特征在于，所述装饰件的内壁设置有第一凹槽，所述镜头保护片位于所述装饰件内，且所述镜头保护片的边缘嵌入在所述第一凹槽中。
  10. 根据权利要求8所述的电子设备，其特征在于，还包括置物台；
    所述置物台为中空的环状结构，且所述置物台的外环与所述装饰件的内环连接；
    所述镜头保护片粘接在所述置物台远离所述主板的表面；
    所述置物台的远离所述主板的表面到所述装饰件远离所述主板的表面的距离大于或等于所述镜头保护片的厚度。
  11. 根据权利要求10所述的电子设备，其特征在于，所述第二结构部还包括第一表面，所述第一表面是所述第二结构部远离所述镜头保护片一侧的底部平面，所述第一表面与所述主板相平行。
  12. 根据权利要求10所述的电子设备，其特征在于，所述装饰件还包括第二表面，所述第二表面是所述装饰件朝向所述第二结构部且与所述第二结构部的弧度相同的面。
  13. 根据权利要求10所述的电子设备，其特征在于，所述第二结构部还包括第二凹槽，所述第二凹槽位于所述第二结构部与所述装饰件的接触处，以使所述装饰件部分嵌入在所述第二凹槽中。
  14. 根据权利要求10所述的电子设备，其特征在于，所述成像组件还包括支撑架，所述支撑架位于所述主板上，用于搭载所述棱镜。
  15. 根据权利要求10所述的电子设备，其特征在于，所述电子设备还包括密封圈，所述密封圈环绕在所述第二透光面的边缘，且粘接在所述棱镜和所述镜头保护片之间。
  16. 根据权利要求10所述的电子设备，其特征在于，所述置物台向所述装饰件中心方向延伸，直至延伸到所述密封圈远离所述镜头保护片的一侧表面，与所述密封圈远离所述镜头保护片的一侧表面粘接。
  17. 根据权利要求14所述的电子设备，其特征在于，所述电子设备还包括固定架，所述固定架与所述主板固定连接且包覆在所述支撑架周围，用于限制所述支撑架产生移动。
  18. 根据权利要求17所述的电子设备，其特征在于，所述固定架包括第一连接体和至少一个第二连接体，所述第一连接体和至少一个所述第二连接体为一体结构，所述第 一连接体包覆在所述支撑架周围，至少一个所述第二连接体通过定位栓固定在所述主板上。
  19. 根据权利要求1所述的电子设备，其特征在于，还包括支撑片，所述支撑片包括第一支撑部、第二支撑部和第三支撑部；
    所述第二支撑部和所述第三支撑部相对设置在所述第一支撑部的两侧，与所述第一支撑部固定连接；
    所述主板远离所述后盖的一侧表面上设置有嵌入槽，两个所述嵌入槽相对的设置在所述开口的两侧，所述第二支撑部和所述第三支撑部部分嵌入在所述嵌入槽中，所述第一支撑部与所述主板之间有间隔。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110365885A (zh) * 2019-07-29 2019-10-22 Oppo广东移动通信有限公司 摄像头组件及电子设备
CN209805871U (zh) * 2019-03-19 2019-12-17 Oppo广东移动通信有限公司 电子设备
CN111917955A (zh) * 2020-08-05 2020-11-10 东莞市亚登电子有限公司 摄像模组和具有其的摄像设备
CN214591630U (zh) * 2021-04-21 2021-11-02 重庆传音通讯技术有限公司 潜望摄像模组及移动终端

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209805871U (zh) * 2019-03-19 2019-12-17 Oppo广东移动通信有限公司 电子设备
CN110365885A (zh) * 2019-07-29 2019-10-22 Oppo广东移动通信有限公司 摄像头组件及电子设备
CN111917955A (zh) * 2020-08-05 2020-11-10 东莞市亚登电子有限公司 摄像模组和具有其的摄像设备
CN214591630U (zh) * 2021-04-21 2021-11-02 重庆传音通讯技术有限公司 潜望摄像模组及移动终端

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