WO2023087609A1 - Threaded deep ultraviolet device structure - Google Patents
Threaded deep ultraviolet device structure Download PDFInfo
- Publication number
- WO2023087609A1 WO2023087609A1 PCT/CN2022/086478 CN2022086478W WO2023087609A1 WO 2023087609 A1 WO2023087609 A1 WO 2023087609A1 CN 2022086478 W CN2022086478 W CN 2022086478W WO 2023087609 A1 WO2023087609 A1 WO 2023087609A1
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- WO
- WIPO (PCT)
- Prior art keywords
- deep ultraviolet
- circuit layer
- functional area
- ultraviolet device
- threaded
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims 32
- 239000011229 interlayer Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000004659 sterilization and disinfection Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- 230000001954 sterilising effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
- A61L2/08—Radiation
- A61L2/10—Ultraviolet radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the invention relates to the technical field of semiconductor devices, in particular to a threaded deep ultraviolet device structure.
- UVC LEDs Deep ultraviolet light-emitting diodes
- UVC LEDs have the advantages of high reliability, long life, fast response, low power consumption, environmental protection and pollution-free, and small size. They are widely used in water sterilization, air sterilization, surface sterilization and other fields. It is worth noting that at present, a single deep ultraviolet device is commonly used to be welded to a circuit board at high temperature, and the circuit board forms multiple integrations. Since a single deep ultraviolet device needs to be soldered at high temperature, it is necessary to install and replace multiple integrated circuit boards. Repairing is very difficult, especially for consumer applications, where installation, replacement and repairing operations cannot be completed. Once the deep ultraviolet device is abnormal in the sterilization and disinfection equipment, the entire sterilization and disinfection equipment will be unusable.
- the purpose of the present invention is to provide a threaded deep ultraviolet device structure to solve the above-mentioned problems in the prior art.
- a single threaded deep ultraviolet device structure realizes installation, replacement and repair without heating, and further improves integration.
- the stability of circuit boards with multiple threaded deep ultraviolet device structures are provided.
- the present invention provides the following scheme:
- the invention provides a threaded deep ultraviolet device structure, comprising an upper shell, a deep ultraviolet device and a lower shell, the deep ultraviolet device is connected to the lower shell through the upper shell, and the outer peripheral surface of the upper shell is arranged
- the deep ultraviolet device includes a substrate, a deep ultraviolet light-emitting diode, a protection diode and a number of conductive metal pillars, the upper surface of the substrate is provided with a first circuit layer structure, and the lower surface of the substrate is provided with a second circuit Layer structure, a plurality of conductive metal pillars are arranged through the substrate, the two ends of each conductive metal pillar are respectively connected to the first circuit layer structure and the second circuit layer structure, the deep ultraviolet light-emitting diode and the
- the protection diodes form a parallel circuit, the deep ultraviolet light emitting diodes and the protection diodes are both arranged on the first circuit layer structure, and the outer sides of the deep ultraviolet light emitting diodes and the protection diodes are provided with
- the upper case includes an upper case body, the outer peripheral surface of the upper case body is provided with the threaded structure, and the upper surface of the upper case body is provided with a number of force-bearing columns, one of each of the force-bearing columns
- the side is a curved surface
- the lower surface of the upper shell body is provided with a placement groove
- the shape of the placement groove matches the shape of the substrate
- the inner side of the placement groove is provided with an upper casing hole
- each of the curved surfaces faces the
- the above-mentioned upper shell holes are provided, and a number of upper fixing column holes are opened on the placement groove, and an upper shell step is arranged on the outside of the placement groove, and the upper shell step is matched with the lower shell, and the upper shell step is provided with There are several lower fixing post holes.
- the upper surface of the first circuit layer structure is further provided with several upper fixing posts, the upper fixing posts correspond to the holes of the upper fixing posts one by one, and the dam and the lens pass through the upper fixing posts. Shell hole settings.
- the height of the upper fixing column is the same as the height of the inner ring step; the depth of the placement groove is the sum of the thicknesses of the substrate, the first circuit layer structure, and the second circuit layer structure equal.
- the first circuit layer structure includes a circuit layer in a first functional area, a circuit layer in a second functional area, and a circuit layer in a non-functional area, and the circuit layer in the first functional area and the circuit layer in the second functional area are arranged opposite to each other And there is a distance between the line layer in the first functional area and the line layer in the second functional area, and the line layer in the non-functional area is set between the line layer in the first functional area and the line layer in the second functional area There is a distance between the line layer in the non-functional area, the line layer in the first functional area, and the line layer in the second functional area, and the dam and several upper fixing columns are arranged on the On the circuit layer in the non-functional area, there is a distance between the inner ring step and the circuit layer in the first functional area and the circuit layer in the second functional area, and the deep ultraviolet light-emitting diode and the protection diode are both arranged On the circuit layer of the first functional area and the circuit layer of the second functional area.
- the second circuit layer structure includes a first structure and a second structure, a distance is set between the first structure and the second structure, and the first structure and the circuit layer in the first functional area
- the second structure corresponds to the line layer of the second functional area.
- pads are provided on the lower surface of the first structure and the lower surface of the second structure, and the length of the pad is less than or equal to the length of the first structure or the second structure, and the The width of the pad is less than or equal to the width of the first structure or the second structure, and the thickness of the pad is greater than the thickness of the first structure or the second structure and less than or equal to the height of the dam.
- the lower case includes a lower case body, and a lower case hole is opened on the lower case body, and a lower fixing post is arranged on the lower case body, and the lower fixing post and the lower fixing post hole are arranged one by one. correspond.
- the thickness of the lower shell body is consistent with the height of the upper shell step.
- the invention realizes detachable connection with the circuit board through the threaded structure, realizes the integration of multiple threaded deep ultraviolet device structures on the circuit board, convenient and quick loading and unloading of a single threaded deep ultraviolet device structure that needs to be installed, replaced and repaired, and the entire operation process It does not need to be done under heated conditions.
- Fig. 1 is the front schematic view of the threaded deep ultraviolet device structure of the present invention
- Fig. 2 is the rear schematic view of the threaded deep ultraviolet device structure of the present invention.
- Fig. 3 is the front exploded view of the threaded deep ultraviolet device structure of the present invention.
- Figure 4 is an exploded view of the back side of the threaded deep ultraviolet device structure of the present invention.
- Fig. 5 is a schematic front view of the deep ultraviolet device of the present invention.
- Figure 6 is a schematic diagram of the back of the deep ultraviolet device of the present invention.
- 100-threaded deep ultraviolet device structure 1-upper shell, 2-deep ultraviolet device, 3-lower shell, 4-thread structure, 5-substrate, 6-deep ultraviolet light-emitting diode, 7-protective diode, 8 -conductive metal column, 9-first circuit layer structure, 10-second circuit layer structure, 11-dam, 12-inner ring step, 13-lens, 14-upper shell body, 15-force column, 16- Curved surface, 17-placing slot, 18-upper housing hole, 19-upper fixing post hole, 20-upper case step, 21-lower fixing post hole, 22-upper fixing post, 23-line layer of the first functional area, 24- Circuit layer in the second functional area, 25-line layer in non-functional area, 26-first structure, 27-second structure, 28-pad, 29-lower shell body, 30-lower shell hole, 31-lower fixing column, 32 - Through hole.
- the purpose of the present invention is to provide a threaded deep ultraviolet device structure to solve the above-mentioned problems in the prior art.
- a single threaded deep ultraviolet device structure realizes installation, replacement and repair without heating, and further improves integration.
- the stability of circuit boards with multiple threaded deep ultraviolet device structures are provided.
- this embodiment provides a threaded deep ultraviolet device structure 100, including an upper shell 1, a deep ultraviolet device 2 and a lower shell 3, and the deep ultraviolet device 2 passes through the upper shell 1 and the lower shell 3 connection, the outer peripheral surface of the upper shell 1 is provided with a threaded structure 4, the deep ultraviolet device 2 includes a substrate 5, a deep ultraviolet light emitting diode 6, a protection diode 7 and a number of conductive metal pillars 8, the substrate 5 is made of ceramics, and the substrate 5 is preferably Square, the upper surface of the substrate 5 is provided with a first circuit layer structure 9, the lower surface of the substrate 5 is provided with a second circuit layer structure 10, a number of conductive metal columns 8 are arranged through the substrate 5, and the two ends of each conductive metal column 8 are respectively connected to the The first circuit layer structure 9 is connected to the second circuit layer structure 10, the substrate 5 is connected to the first circuit layer structure 9 and the second circuit layer structure 10 through the conductive metal pillar 8, and the deep ultraviolet light emitting diode 6 and
- the outer side of the ultraviolet light-emitting diode 6 and the protective diode 7 is provided with a dam 11, and the inner side of the dam 11 is provided with an inner ring step 12.
- Both the dam 11 and the inner ring step 12 are formed by electroplated copper metal, and the inner ring step 12 is provided with Lens 13, by evenly applying adhesive on the inner ring step 12, the lens 13 is placed on the inner ring step 12, and the lens 13 is evenly stressed, and the bonding force with a certain shear strength is achieved through a certain temperature, so that the lens 13 is on the inner ring step 12.
- the deep ultraviolet light emitting diode 6 and the protection diode 7 form an airtight protective cavity, and the lens 13 is covered outside the deep ultraviolet light emitting diode 6 and the protection diode 7 .
- the detachable connection between the threaded structure 4 and the circuit board is realized, and multiple threaded deep ultraviolet device structures 100 are integrated on the circuit board, which is convenient and quick to assemble and disassemble a single threaded deep ultraviolet device structure 100 that needs to be installed, replaced and repaired. , the entire operation process does not need to be completed under heating conditions.
- both the first circuit layer structure 9 and the second circuit layer structure 10 are formed by electroplating a layer of copper metal according to the corresponding circuit structure design.
- the upper shell 1 includes an upper shell body 14, the upper shell body 14 is made of metal material or non-metallic material, and when it is made of metal aluminum, it is milled and shaped by a machine tool;
- the tool punching machine is provided with an upper shell hole 18, which is a light exit hole.
- the shape of the placement groove 17 matches the base plate 5, and the depth of the placement groove 17 is the same as The sum of the thicknesses of the substrate 5, the first circuit layer structure 9, and the second circuit layer structure 10 is equal, the placement groove 17 and the substrate 5 are preferably square, and the upper fixing column holes are opened by drilling drills at the four corners of the placement groove 17 19.
- the position of the upper fixing column hole 19 corresponds to the position of the upper fixing column 22, and the opening depth of the upper fixing column hole 19 is consistent with the height of the upper fixing column 22, forming a fixed force bearing surface for the deep ultraviolet device 2; place the outside of the groove 17
- An upper shell step 20 is provided. After the upper shell 1 and the deep ultraviolet device 2 are installed, the upper shell step 20 is equal to the second circuit layer structure 10, and the upper shell step 20 matches the lower shell 3.
- the lower shell 3 is located on the upper shell step 20, and the upper shell step 20 is provided with several lower fixing column holes 21, preferably four lower fixing column holes 21, and the four lower fixing column holes 21 are respectively located at the four corners of the upper shell step 20 place;
- the upper surface and the lower surface of the upper shell 1 are fixed by a jig, and the outer peripheral surface of the upper shell body 14 is processed by a machine tool or a grinding tool to realize a convex continuous spiral structure, so as to realize the purpose of the screw thread function of the upper shell 1;
- the other surface of the shell body 14 is milled with four force-bearing columns 15, and the four force-bearing columns 15 are evenly arranged around the upper shell hole 18.
- the height of the force-bearing columns 15 is smaller than the height of the dam 11, and each force-bearing column
- the inner surfaces of 15 are cut into cup-shaped curved surfaces 16 by machine tool milling, each curved surface 16 is set towards the upper shell hole 18, and the four curved surfaces 16 pairs of matching focusing cups are fixed in position.
- the purpose of mounting and locking the entire threaded deep ultraviolet device structure 100 is achieved.
- the upper shell body 14 is made of non-metallic material, it is injection-extruded by pressing and grinding abrasive tools.
- the upper surface of the first line layer structure 9 is also provided with several upper fixing columns 22, the height of the upper fixing columns 22 is the same as the height of the inner ring step 12, and the upper fixing columns 22 are located on the outside of the dam 11, preferably There are four upper fixing columns 22, and the four upper fixing columns 22 are respectively arranged at the four corners of the first circuit layer structure 9.
- the upper fixing columns 22 are made of metal, and the upper fixing columns 22 correspond to the upper fixing column holes 19 one by one.
- the height of the upper fixing column 22 is consistent with the depth of the upper fixing column hole 19 , and the dam 11 and the lens 13 are arranged through the upper casing hole 18 .
- the first line layer structure 9 includes a line layer 23 in a first functional area, a line layer 24 in a second functional area, and a line layer 25 in a non-functional area, and a line layer 23 in a first functional area and a line layer 24 in a second functional area. It is relatively arranged and there is a distance between the line layer 23 in the first functional area and the line layer 24 in the second functional area, and the line layer 25 in the non-functional area is arranged outside the line layer 23 in the first functional area and the line layer 24 in the second functional area. There is a distance between the line layer 25 in the non-functional area and the line layer 23 in the first functional area and the line layer 24 in the second functional area.
- the second circuit layer structure 10 includes a first structure 26 and a second structure 27, a distance is provided between the first structure 26 and the second structure 27, and the first structure 26 corresponds to the circuit layer 23 in the first functional area , the second structure 27 corresponds to the circuit layer 24 in the second functional area.
- both the lower surface of the first structure 26 and the lower surface of the second structure 27 thicken the copper layer by electroplating copper to form two independent conductive pads 28, and the length of the pads 28 is less than or equal to the first The length of a structure 26 or the second structure 27, the width of the pad 28 is less than or equal to the width of the first structure 26 or the second structure 27, the thickness of the pad 28 is greater than the thickness of the first structure 26 or the second structure 27 and is less than or equal to The height of the dam 11.
- the substrate 5, the circuit layer 23 in the first functional area, the circuit layer 24 in the second functional area, the first structure 26 and the second structure 27 are all formed by laser drilling according to the positions of the conductive metal pillars 8. 1. Electroplate copper metal in the through hole 32 of the substrate 5 to form a conductive metal column 8, so as to realize bidirectional conduction between the front circuit and the rear circuit of the substrate 5.
- the lower shell 3 includes a lower shell body 29, the thickness of the lower shell body 29 is consistent with the height of the upper shell step 20, and the lower shell body 29 is made of metal or non-metallic material.
- Machine tool milling and molding the center of the lower shell body 29 is provided with a lower shell hole 30 through an abrasive stamping machine, and the lower shell hole 30 is an external hole for the welding pad, and one side of the lower shell body 29 is cut into four lower fixed holes by a machine tool.
- the column 31 corresponds to the lower fixing column 31 and the lower fixing column hole 21 one by one, and the height of the lower fixing column 31 is consistent with the depth of the lower fixing column hole 21, so that the lower shell 3 and the upper shell 1 form an integral structure.
- the lower fixing columns 31 are located in the lower fixing column holes 21 respectively, forming a fixed force-bearing surface for the deep ultraviolet device 2, and realizing that the lower case 3 and the upper case 1 form an integral structure .
- the lower shell body 29 is made of non-metallic material, it is molded by injection molding with a grinding tool.
- the upper fixing column 22 is located in the upper fixing column hole 19
- the lower fixing column 31 is located in the lower fixing column hole 21
- the upper shell 1, the deep ultraviolet device 2 and the lower shell 3 are combined into a firm whole to form a Threaded deep ultraviolet device structure 100.
- the threaded deep ultraviolet device structure 100 of this embodiment solves the problem of repairing a single threaded deep ultraviolet device structure 100 by installing and welding a circuit board with multiple threaded deep ultraviolet device structures 100 .
- the four force bearing columns 15 of the four force-bearing columns apply a horizontal rotation external force, and the threaded deep ultraviolet device structure 100 of this embodiment is embedded into the fixed frame combined with the circuit board through the rotation of the threaded structure 4, and the threaded structure 4 and the fixed frame
- the holes are arranged at the same number of rotations, so that the two solder pads 28 of the threaded deep ultraviolet device structure 100 are in coincident contact with the solder pads of the circuit board.
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Abstract
The present invention relates to the technical field of semiconductor devices. Disclosed is a threaded deep ultraviolet device structure, comprising an upper housing, a deep ultraviolet device, and a lower housing. The deep ultraviolet device is connected to the lower housing by means of the upper housing; a threaded structure is provided on the outer peripheral surface of the upper housing; the deep ultraviolet device comprises a substrate, a deep ultraviolet light-emitting diode, a protection diode, and a plurality of conductive metal posts; the plurality of conductive metal posts pass through the substrate; two ends of each conductive metal post are respectively connected to a first circuit layer structure and a second circuit layer structure; the deep ultraviolet light-emitting diode and the protection diode form a parallel circuit; the deep ultraviolet light-emitting diode and the protection diode are both disposed on the first circuit layer structure; a box dam is disposed outside the deep ultraviolet light-emitting diode and the protection diode; a lens is covered outside the deep ultraviolet light-emitting diode and the protection diode. The threaded deep ultraviolet device structure of the present invention realizes installation, replacement and repair without heating, thereby further improving the stability of a circuit board.
Description
本发明涉及半导体器件技术领域，特别是涉及一种带螺纹的深紫外器件结构。The invention relates to the technical field of semiconductor devices, in particular to a threaded deep ultraviolet device structure.
深紫外发光二极管(UVC LED)具有可靠性高、寿命长，反应快，功耗低，环保无污染，体型小等优势，被广泛应用于水杀菌消毒、空气杀菌消毒、表面杀菌消毒等领域。值得注意的是，目前普遍使用单颗深紫外器件通过高温焊接到线路板上，线路板形成多颗集成，由于单颗深紫外器件要通过高温焊接，对于多颗集成的线路板进行安装与更换返修造成很大难度，特别是对于消费者应用端更是无法完成安装与更换返修操作，杀菌消毒设备一旦出现深紫外器件异常，就会造成整个杀菌消毒设备无法使用。Deep ultraviolet light-emitting diodes (UVC LEDs) have the advantages of high reliability, long life, fast response, low power consumption, environmental protection and pollution-free, and small size. They are widely used in water sterilization, air sterilization, surface sterilization and other fields. It is worth noting that at present, a single deep ultraviolet device is commonly used to be welded to a circuit board at high temperature, and the circuit board forms multiple integrations. Since a single deep ultraviolet device needs to be soldered at high temperature, it is necessary to install and replace multiple integrated circuit boards. Repairing is very difficult, especially for consumer applications, where installation, replacement and repairing operations cannot be completed. Once the deep ultraviolet device is abnormal in the sterilization and disinfection equipment, the entire sterilization and disinfection equipment will be unusable.
发明内容Contents of the invention
本发明的目的是提供一种带螺纹的深紫外器件结构，以解决上述现有技术存在的问题，单个带螺纹的深紫外器件结构实现了无加热的条件下安装与更换返修，进一步提高了集成多个带螺纹的深紫外器件结构的线路板的稳定性。The purpose of the present invention is to provide a threaded deep ultraviolet device structure to solve the above-mentioned problems in the prior art. A single threaded deep ultraviolet device structure realizes installation, replacement and repair without heating, and further improves integration. The stability of circuit boards with multiple threaded deep ultraviolet device structures.
为实现上述目的，本发明提供了如下方案：To achieve the above object, the present invention provides the following scheme:
本发明提供了一种带螺纹的深紫外器件结构，包括上壳、深紫外器件和下壳，所述深紫外器件通过所述上壳与所述下壳连接，所述上壳的外周面设置有螺纹结构，所述深紫外器件包括基板、深紫外发光二极管、保护二极管和若干导电金属柱，所述基板的上表面设置有第一线路层结构，所述基板的下表面设置有第二线路层结构，若干所述导电金属柱贯穿所述基板设置，各所述导电金属柱的两端分别与所述第一线路层结构和所述第二线路层结构连接，所述深紫外发光二极管和所述保护二极管形成并联电路，所述深紫外发光二极管和所述保护二极管均设置在所述第一线路层结构上，所述深紫外发光二极管和所述保护二极管的外侧设置有围坝，所述围坝的内侧设置有内环台阶，所述内环台阶上设置有透镜，所述透镜罩设 在所述深紫外发光二极管和所述保护二极管的外侧。The invention provides a threaded deep ultraviolet device structure, comprising an upper shell, a deep ultraviolet device and a lower shell, the deep ultraviolet device is connected to the lower shell through the upper shell, and the outer peripheral surface of the upper shell is arranged Has a threaded structure, the deep ultraviolet device includes a substrate, a deep ultraviolet light-emitting diode, a protection diode and a number of conductive metal pillars, the upper surface of the substrate is provided with a first circuit layer structure, and the lower surface of the substrate is provided with a second circuit Layer structure, a plurality of conductive metal pillars are arranged through the substrate, the two ends of each conductive metal pillar are respectively connected to the first circuit layer structure and the second circuit layer structure, the deep ultraviolet light-emitting diode and the The protection diodes form a parallel circuit, the deep ultraviolet light emitting diodes and the protection diodes are both arranged on the first circuit layer structure, and the outer sides of the deep ultraviolet light emitting diodes and the protection diodes are provided with dams, so An inner ring step is arranged inside the dam, and a lens is arranged on the inner ring step, and the lens cover is arranged outside the deep ultraviolet light-emitting diode and the protection diode.
优选地，所述上壳包括上壳本体，所述上壳本体的外周面设置有所述螺纹结构，所述上壳本体的上表面设置有若干受力柱，各所述受力柱的一侧为曲面，所述上壳本体的下表面开设有放置槽，所述放置槽的形状与所述基板的形状匹配，所述放置槽的内侧开设有上壳孔，各所述曲面均朝向所述上壳孔设置，所述放置槽上开设有若干上固定柱孔，所述放置槽的外侧设置有上壳台阶，所述上壳台阶与所述下壳匹配，所述上壳台阶上开设有若干下固定柱孔。Preferably, the upper case includes an upper case body, the outer peripheral surface of the upper case body is provided with the threaded structure, and the upper surface of the upper case body is provided with a number of force-bearing columns, one of each of the force-bearing columns The side is a curved surface, the lower surface of the upper shell body is provided with a placement groove, the shape of the placement groove matches the shape of the substrate, the inner side of the placement groove is provided with an upper casing hole, and each of the curved surfaces faces the The above-mentioned upper shell holes are provided, and a number of upper fixing column holes are opened on the placement groove, and an upper shell step is arranged on the outside of the placement groove, and the upper shell step is matched with the lower shell, and the upper shell step is provided with There are several lower fixing post holes.
优选地，所述第一线路层结构的上表面还设置有若干上固定柱，所述上固定柱与所述上固定柱孔一一对应，所述围坝和所述透镜穿过所述上壳孔设置。Preferably, the upper surface of the first circuit layer structure is further provided with several upper fixing posts, the upper fixing posts correspond to the holes of the upper fixing posts one by one, and the dam and the lens pass through the upper fixing posts. Shell hole settings.
优选地，所述上固定柱的高度与所述内环台阶的高度相同；所述放置槽的深度与所述基板、所述第一线路层结构、所述第二线路层结构的厚度之和相等。Preferably, the height of the upper fixing column is the same as the height of the inner ring step; the depth of the placement groove is the sum of the thicknesses of the substrate, the first circuit layer structure, and the second circuit layer structure equal.
优选地，所述第一线路层结构包括第一功能区线路层、第二功能区线路层和非功能区线路层，所述第一功能区线路层和所述第二功能区线路层相对设置且所述第一功能区线路层和所述第二功能区线路层之间设置有间距，所述非功能区线路层设置在所述第一功能区线路层和所述第二功能区线路层的外侧，所述非功能区线路层与所述第一功能区线路层和所述第二功能区线路层之间均设置有间距，所述围坝和若干所述上固定柱均设置在所述非功能区线路层上，所述内环台阶与所述第一功能区线路层和所述第二功能区线路层之间设置有间距，所述深紫外发光二极管和所述保护二极管均设置在所述第一功能区线路层和所述第二功能区线路层上。Preferably, the first circuit layer structure includes a circuit layer in a first functional area, a circuit layer in a second functional area, and a circuit layer in a non-functional area, and the circuit layer in the first functional area and the circuit layer in the second functional area are arranged opposite to each other And there is a distance between the line layer in the first functional area and the line layer in the second functional area, and the line layer in the non-functional area is set between the line layer in the first functional area and the line layer in the second functional area There is a distance between the line layer in the non-functional area, the line layer in the first functional area, and the line layer in the second functional area, and the dam and several upper fixing columns are arranged on the On the circuit layer in the non-functional area, there is a distance between the inner ring step and the circuit layer in the first functional area and the circuit layer in the second functional area, and the deep ultraviolet light-emitting diode and the protection diode are both arranged On the circuit layer of the first functional area and the circuit layer of the second functional area.
优选地，所述第二线路层结构包括第一结构和第二结构，所述第一结构和所述第二结构之间设置有间距，所述第一结构与所述第一功能区线路层对应，所述第二结构与所述第二功能区线路层对应。Preferably, the second circuit layer structure includes a first structure and a second structure, a distance is set between the first structure and the second structure, and the first structure and the circuit layer in the first functional area Correspondingly, the second structure corresponds to the line layer of the second functional area.
优选地，所述第一结构的下表面和所述第二结构的下表面均设置有焊盘，所述焊盘的长度小于等于所述第一结构或所述第二结构的长度，所述焊盘的宽度小于等于所述第一结构或所述第二结构的宽度，所述焊盘的厚度大于所述第一结构或所述第二结构的厚度且小于等于所述围坝的高度。Preferably, pads are provided on the lower surface of the first structure and the lower surface of the second structure, and the length of the pad is less than or equal to the length of the first structure or the second structure, and the The width of the pad is less than or equal to the width of the first structure or the second structure, and the thickness of the pad is greater than the thickness of the first structure or the second structure and less than or equal to the height of the dam.
优选地，所述下壳包括下壳本体，所述下壳本体上开设有下壳孔，所述下壳本体上设置有下固定柱，所述下固定柱与所述下固定柱孔一一对应。Preferably, the lower case includes a lower case body, and a lower case hole is opened on the lower case body, and a lower fixing post is arranged on the lower case body, and the lower fixing post and the lower fixing post hole are arranged one by one. correspond.
优选地，所述下壳本体的厚度与所述上壳台阶的高度一致。Preferably, the thickness of the lower shell body is consistent with the height of the upper shell step.
本发明相对于现有技术取得了以下技术效果：Compared with the prior art, the present invention has achieved the following technical effects:
本发明通过螺纹结构与线路板实现可拆卸连接，实现多个带螺纹的深紫外器件结构集成在线路板上，方便快捷装卸需要安装与更换返修的单个带螺纹的深紫外器件结构，整个操作过程无需在加热的条件下完成。The invention realizes detachable connection with the circuit board through the threaded structure, realizes the integration of multiple threaded deep ultraviolet device structures on the circuit board, convenient and quick loading and unloading of a single threaded deep ultraviolet device structure that needs to be installed, replaced and repaired, and the entire operation process It does not need to be done under heated conditions.
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1为本发明的带螺纹的深紫外器件结构正面示意图；Fig. 1 is the front schematic view of the threaded deep ultraviolet device structure of the present invention;
图2为本发明的带螺纹的深紫外器件结构背面示意图；Fig. 2 is the rear schematic view of the threaded deep ultraviolet device structure of the present invention;
图3为本发明的带螺纹的深紫外器件结构正面***图；Fig. 3 is the front exploded view of the threaded deep ultraviolet device structure of the present invention;
图4为本发明的带螺纹的深紫外器件结构背面***图；Figure 4 is an exploded view of the back side of the threaded deep ultraviolet device structure of the present invention;
图5为本发明的深紫外器件正面示意图；Fig. 5 is a schematic front view of the deep ultraviolet device of the present invention;
图6为本发明的深紫外器件背面示意图；Figure 6 is a schematic diagram of the back of the deep ultraviolet device of the present invention;
其中：100-带螺纹的深紫外器件结构，1-上壳，2-深紫外器件，3-下壳，4-螺纹结构，5-基板，6-深紫外发光二极管，7-保护二极管，8-导电金属柱，9-第一线路层结构，10-第二线路层结构，11-围坝，12-内环台阶，13-透镜，14-上壳本体，15-受力柱，16-曲面，17-放置槽，18-上壳孔，19-上固定柱孔，20-上壳台阶，21-下固定柱孔，22-上固定柱，23-第一功能区线路层，24-第二功能区线路层，25-非功能区线路层，26-第一结构，27-第二结构，28-焊盘，29-下壳本体，30-下壳孔，31-下固定柱，32-通孔。Among them: 100-threaded deep ultraviolet device structure, 1-upper shell, 2-deep ultraviolet device, 3-lower shell, 4-thread structure, 5-substrate, 6-deep ultraviolet light-emitting diode, 7-protective diode, 8 -conductive metal column, 9-first circuit layer structure, 10-second circuit layer structure, 11-dam, 12-inner ring step, 13-lens, 14-upper shell body, 15-force column, 16- Curved surface, 17-placing slot, 18-upper housing hole, 19-upper fixing post hole, 20-upper case step, 21-lower fixing post hole, 22-upper fixing post, 23-line layer of the first functional area, 24- Circuit layer in the second functional area, 25-line layer in non-functional area, 26-first structure, 27-second structure, 28-pad, 29-lower shell body, 30-lower shell hole, 31-lower fixing column, 32 - Through hole.
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没 有付出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without paying creative efforts all belong to the protection scope of the present invention.
本发明的目的是提供一种带螺纹的深紫外器件结构，以解决上述现有技术存在的问题，单个带螺纹的深紫外器件结构实现了无加热的条件下安装与更换返修，进一步提高了集成多个带螺纹的深紫外器件结构的线路板的稳定性。The purpose of the present invention is to provide a threaded deep ultraviolet device structure to solve the above-mentioned problems in the prior art. A single threaded deep ultraviolet device structure realizes installation, replacement and repair without heating, and further improves integration. The stability of circuit boards with multiple threaded deep ultraviolet device structures.
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本发明作进一步详细的说明。In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
如图1-图6所示：本实施例提供了一种带螺纹的深紫外器件结构100，包括上壳1、深紫外器件2和下壳3，深紫外器件2通过上壳1与下壳3连接，上壳1的外周面设置有螺纹结构4，深紫外器件2包括基板5、深紫外发光二极管6、保护二极管7和若干导电金属柱8，基板5采用陶瓷制成，基板5优选为正方形，基板5的上表面设置有第一线路层结构9，基板5的下表面设置有第二线路层结构10，若干导电金属柱8贯穿基板5设置，各导电金属柱8的两端分别与第一线路层结构9和第二线路层结构10连接，基板5通过导电金属柱8连通第一线路层结构9和第二线路层结构10，深紫外发光二极管6和保护二极管7形成并联电路，深紫外发光二极管6和保护二极管7均设置在第一线路层结构9上，深紫外发光二极管6位于第一线路层结构9的中心处，保护二极管7位于深紫外发光二极管6的一侧，深紫外发光二极管6和保护二极管7的外侧设置有围坝11，围坝11的内侧设置有内环台阶12，围坝11和内环台阶12均采用电镀铜金属形成，内环台阶12上设置有透镜13，通过在内环台阶12上均匀涂抹粘合剂，透镜13放置内环台阶12上面，并对透镜13均匀受力，通过一定温度达到具有一定剪切强度的结合力，使透镜13对深紫外发光二极管6与保护二极管7形成一密闭保护腔体，透镜13罩设在深紫外发光二极管6和保护二极管7的外侧。本实施例通过螺纹结构4与线路板实现可拆卸连接，实现多个带螺纹的深紫外器件结构100集成在线路板上，方便快捷装卸需要安装与更换返修的单个带螺纹的深紫外器件结构100，整个操作过程无需在加热的条件下完成。As shown in Figures 1-6: this embodiment provides a threaded deep ultraviolet device structure 100, including an upper shell 1, a deep ultraviolet device 2 and a lower shell 3, and the deep ultraviolet device 2 passes through the upper shell 1 and the lower shell 3 connection, the outer peripheral surface of the upper shell 1 is provided with a threaded structure 4, the deep ultraviolet device 2 includes a substrate 5, a deep ultraviolet light emitting diode 6, a protection diode 7 and a number of conductive metal pillars 8, the substrate 5 is made of ceramics, and the substrate 5 is preferably Square, the upper surface of the substrate 5 is provided with a first circuit layer structure 9, the lower surface of the substrate 5 is provided with a second circuit layer structure 10, a number of conductive metal columns 8 are arranged through the substrate 5, and the two ends of each conductive metal column 8 are respectively connected to the The first circuit layer structure 9 is connected to the second circuit layer structure 10, the substrate 5 is connected to the first circuit layer structure 9 and the second circuit layer structure 10 through the conductive metal pillar 8, and the deep ultraviolet light emitting diode 6 and the protection diode 7 form a parallel circuit, Both the deep ultraviolet light-emitting diode 6 and the protection diode 7 are arranged on the first circuit layer structure 9, the deep ultraviolet light-emitting diode 6 is located at the center of the first circuit layer structure 9, and the protection diode 7 is located on one side of the deep ultraviolet light-emitting diode 6. The outer side of the ultraviolet light-emitting diode 6 and the protective diode 7 is provided with a dam 11, and the inner side of the dam 11 is provided with an inner ring step 12. Both the dam 11 and the inner ring step 12 are formed by electroplated copper metal, and the inner ring step 12 is provided with Lens 13, by evenly applying adhesive on the inner ring step 12, the lens 13 is placed on the inner ring step 12, and the lens 13 is evenly stressed, and the bonding force with a certain shear strength is achieved through a certain temperature, so that the lens 13 is on the inner ring step 12. The deep ultraviolet light emitting diode 6 and the protection diode 7 form an airtight protective cavity, and the lens 13 is covered outside the deep ultraviolet light emitting diode 6 and the protection diode 7 . In this embodiment, the detachable connection between the threaded structure 4 and the circuit board is realized, and multiple threaded deep ultraviolet device structures 100 are integrated on the circuit board, which is convenient and quick to assemble and disassemble a single threaded deep ultraviolet device structure 100 that needs to be installed, replaced and repaired. , the entire operation process does not need to be completed under heating conditions.
本实施例中，第一线路层结构9和第二线路层结构10均依据相应的 线路结构设计电镀一层铜金属而形成。In this embodiment, both the first circuit layer structure 9 and the second circuit layer structure 10 are formed by electroplating a layer of copper metal according to the corresponding circuit structure design.
本实施例中，上壳1包括上壳本体14，上壳本体14采用金属材质或非金属材质制成，采用金属铝材质时，通过机床铣切成型；在上壳本体14的中间通过磨具冲压机开设上壳孔18，上壳孔18为出光孔，在上壳本体14的一个面通过机床铣切出放置槽17，放置槽17的形状与基板5匹配，放置槽17的深度与基板5、第一线路层结构9、第二线路层结构10的厚度之和相等，放置槽17与基板5均优选为方形，在放置槽17四个角位置通过打孔钻头开设上固定柱孔19，上固定柱孔19与上固定柱22位置对应，上固定柱孔19的开孔深度与上固定柱22高度一致，形成对深紫外器件2一定的固定受力面；放置槽17的外侧设置有上壳台阶20，上壳1与深紫外器件2安装后，上壳台阶20与第二线路层结构10持平，上壳台阶20与下壳3匹配，上壳1与下壳3安装后，下壳3位于上壳台阶20上，上壳台阶20上开设有若干下固定柱孔21，优选为四个下固定柱孔21，四个下固定柱孔21分别位于上壳台阶20的四角处；通过治具固定上壳1的上表面和下表面，上壳本体14的外周面通过机床或磨具加工实现凸型的连续的螺旋结构，实现上壳1螺纹功能的目的；通过在上壳本体14的另一个面通过机床铣切出四个受力柱15，四个受力柱15围绕上壳孔18均匀设置，受力柱15的高度小于围坝11的高度，各受力柱15的内侧面均通过机床铣切成碗杯状曲面16，各曲面16均朝向上壳孔18设置，四个曲面16对配套聚光杯位置固定，通过对受力柱15水平旋转受力，实现对整个带螺纹的深紫外器件结构100的安装锁紧目的。In this embodiment, the upper shell 1 includes an upper shell body 14, the upper shell body 14 is made of metal material or non-metallic material, and when it is made of metal aluminum, it is milled and shaped by a machine tool; The tool punching machine is provided with an upper shell hole 18, which is a light exit hole. On one surface of the upper shell body 14, a placement groove 17 is milled out by a machine tool. The shape of the placement groove 17 matches the base plate 5, and the depth of the placement groove 17 is the same as The sum of the thicknesses of the substrate 5, the first circuit layer structure 9, and the second circuit layer structure 10 is equal, the placement groove 17 and the substrate 5 are preferably square, and the upper fixing column holes are opened by drilling drills at the four corners of the placement groove 17 19. The position of the upper fixing column hole 19 corresponds to the position of the upper fixing column 22, and the opening depth of the upper fixing column hole 19 is consistent with the height of the upper fixing column 22, forming a fixed force bearing surface for the deep ultraviolet device 2; place the outside of the groove 17 An upper shell step 20 is provided. After the upper shell 1 and the deep ultraviolet device 2 are installed, the upper shell step 20 is equal to the second circuit layer structure 10, and the upper shell step 20 matches the lower shell 3. After the upper shell 1 and the lower shell 3 are installed , the lower shell 3 is located on the upper shell step 20, and the upper shell step 20 is provided with several lower fixing column holes 21, preferably four lower fixing column holes 21, and the four lower fixing column holes 21 are respectively located at the four corners of the upper shell step 20 place; the upper surface and the lower surface of the upper shell 1 are fixed by a jig, and the outer peripheral surface of the upper shell body 14 is processed by a machine tool or a grinding tool to realize a convex continuous spiral structure, so as to realize the purpose of the screw thread function of the upper shell 1; The other surface of the shell body 14 is milled with four force-bearing columns 15, and the four force-bearing columns 15 are evenly arranged around the upper shell hole 18. The height of the force-bearing columns 15 is smaller than the height of the dam 11, and each force-bearing column The inner surfaces of 15 are cut into cup-shaped curved surfaces 16 by machine tool milling, each curved surface 16 is set towards the upper shell hole 18, and the four curved surfaces 16 pairs of matching focusing cups are fixed in position. The purpose of mounting and locking the entire threaded deep ultraviolet device structure 100 is achieved.
上壳本体14采用非金属材质时，通过压磨磨具注塑挤压成型。When the upper shell body 14 is made of non-metallic material, it is injection-extruded by pressing and grinding abrasive tools.
本实施例中，第一线路层结构9的上表面还设置有若干上固定柱22，上固定柱22的高度与内环台阶12的高度相同，上固定柱22位于围坝11的外侧，优选为四个上固定柱22，四个上固定柱22分别设置在第一线路层结构9的四角处，上固定柱22采用金属制成，上固定柱22与上固定柱孔19一一对应，上固定柱22的高度与上固定柱孔19的深度一致，围坝11和透镜13穿过上壳孔18设置。上壳1与下壳3扣合时，各上固定柱22分别位于一上固定柱孔19中，形成对深紫外器件2一定的固定受力面。In this embodiment, the upper surface of the first line layer structure 9 is also provided with several upper fixing columns 22, the height of the upper fixing columns 22 is the same as the height of the inner ring step 12, and the upper fixing columns 22 are located on the outside of the dam 11, preferably There are four upper fixing columns 22, and the four upper fixing columns 22 are respectively arranged at the four corners of the first circuit layer structure 9. The upper fixing columns 22 are made of metal, and the upper fixing columns 22 correspond to the upper fixing column holes 19 one by one. The height of the upper fixing column 22 is consistent with the depth of the upper fixing column hole 19 , and the dam 11 and the lens 13 are arranged through the upper casing hole 18 . When the upper case 1 and the lower case 3 are fastened together, each upper fixing column 22 is respectively located in an upper fixing column hole 19 , forming a fixed force bearing surface for the deep ultraviolet device 2 .
本实施例中，第一线路层结构9包括第一功能区线路层23、第二功 能区线路层24和非功能区线路层25，第一功能区线路层23和第二功能区线路层24相对设置且第一功能区线路层23和第二功能区线路层24之间设置有间距，非功能区线路层25设置在第一功能区线路层23和第二功能区线路层24的外侧，非功能区线路层25与第一功能区线路层23和第二功能区线路层24之间均设置有间距，若干上固定柱22均设置在非功能区线路层25上，围坝11电镀在非功能区线路层25上，内环台阶12与第一功能区线路层23和第二功能区线路层24之间设置有间距，深紫外发光二极管6和保护二极管7均通过高温焊接在第一功能区线路层23和第二功能区线路层24上，即深紫外发光二极管6和保护二极管7均既与第一功能区线路层23连接，又与第二功能区线路层24连接。In this embodiment, the first line layer structure 9 includes a line layer 23 in a first functional area, a line layer 24 in a second functional area, and a line layer 25 in a non-functional area, and a line layer 23 in a first functional area and a line layer 24 in a second functional area. It is relatively arranged and there is a distance between the line layer 23 in the first functional area and the line layer 24 in the second functional area, and the line layer 25 in the non-functional area is arranged outside the line layer 23 in the first functional area and the line layer 24 in the second functional area. There is a distance between the line layer 25 in the non-functional area and the line layer 23 in the first functional area and the line layer 24 in the second functional area. Several upper fixing columns 22 are arranged on the line layer 25 in the non-functional area. On the circuit layer 25 in the non-functional area, there is a distance between the inner ring step 12 and the circuit layer 23 in the first functional area and the circuit layer 24 in the second functional area. Both the deep ultraviolet light-emitting diode 6 and the protection diode 7 are welded on the first On the circuit layer 23 of the functional area and the circuit layer 24 of the second functional area, that is, the deep ultraviolet LED 6 and the protection diode 7 are both connected to the circuit layer 23 of the first functional area and connected to the circuit layer 24 of the second functional area.
本实施例中，第二线路层结构10包括第一结构26和第二结构27，第一结构26和第二结构27之间设置有间距，第一结构26与第一功能区线路层23对应，第二结构27与第二功能区线路层24对应。In this embodiment, the second circuit layer structure 10 includes a first structure 26 and a second structure 27, a distance is provided between the first structure 26 and the second structure 27, and the first structure 26 corresponds to the circuit layer 23 in the first functional area , the second structure 27 corresponds to the circuit layer 24 in the second functional area.
本实施例中，第一结构26的下表面和第二结构27的下表面均通过电镀铜工艺的方式加厚铜层形成两个独立的导电的焊盘28，焊盘28的长度小于等于第一结构26或第二结构27的长度，焊盘28的宽度小于等于第一结构26或第二结构27的宽度，焊盘28的厚度大于第一结构26或第二结构27的厚度且小于等于围坝11的高度。In this embodiment, both the lower surface of the first structure 26 and the lower surface of the second structure 27 thicken the copper layer by electroplating copper to form two independent conductive pads 28, and the length of the pads 28 is less than or equal to the first The length of a structure 26 or the second structure 27, the width of the pad 28 is less than or equal to the width of the first structure 26 or the second structure 27, the thickness of the pad 28 is greater than the thickness of the first structure 26 or the second structure 27 and is less than or equal to The height of the dam 11.
本实施例中，基板5、第一功能区线路层23、第二功能区线路层24、第一结构26和第二结构27上均依据导电金属柱8的位置通过激光打孔形成通孔32，在基板5的通孔32中电镀铜金属形成导电金属柱8，从而实现基板5正面线路与背面线路双向导通。In this embodiment, the substrate 5, the circuit layer 23 in the first functional area, the circuit layer 24 in the second functional area, the first structure 26 and the second structure 27 are all formed by laser drilling according to the positions of the conductive metal pillars 8. 1. Electroplate copper metal in the through hole 32 of the substrate 5 to form a conductive metal column 8, so as to realize bidirectional conduction between the front circuit and the rear circuit of the substrate 5.
本实施例中，下壳3包括下壳本体29，下壳本体29的厚度与上壳台阶20的高度一致，下壳本体29采用金属材质或非金属材质制成，采用金属铝材质时，通过机床铣切成型；下壳本体29的中心处通过磨具冲压机开设下壳孔30，下壳孔30为焊盘外置孔，下壳本体29的一面通过机床铣切成四个下固定柱31，下固定柱31与下固定柱孔21一一对应，下固定柱31的高度与下固定柱孔21的深度一致，实现下壳3与上壳1形成一个整体结构。上壳1与下壳3扣合时，各下固定柱31分别位于一下固定柱孔21中，形成对深紫外器件2一定的固定受力面，实现下壳3与上壳 1形成一个整体结构。In this embodiment, the lower shell 3 includes a lower shell body 29, the thickness of the lower shell body 29 is consistent with the height of the upper shell step 20, and the lower shell body 29 is made of metal or non-metallic material. Machine tool milling and molding; the center of the lower shell body 29 is provided with a lower shell hole 30 through an abrasive stamping machine, and the lower shell hole 30 is an external hole for the welding pad, and one side of the lower shell body 29 is cut into four lower fixed holes by a machine tool. The column 31 corresponds to the lower fixing column 31 and the lower fixing column hole 21 one by one, and the height of the lower fixing column 31 is consistent with the depth of the lower fixing column hole 21, so that the lower shell 3 and the upper shell 1 form an integral structure. When the upper case 1 and the lower case 3 are fastened together, the lower fixing columns 31 are located in the lower fixing column holes 21 respectively, forming a fixed force-bearing surface for the deep ultraviolet device 2, and realizing that the lower case 3 and the upper case 1 form an integral structure .
下壳本体29采用非金属材质时，通过压磨磨具注塑挤压成型。When the lower shell body 29 is made of non-metallic material, it is molded by injection molding with a grinding tool.
本实施例通过上固定柱22位于上固定柱孔19、下固定柱31位于下固定柱孔21，上壳1、深紫外器件2和下壳3三者结合成一个牢固的整体，形成一种带螺纹的深紫外器件结构100。In this embodiment, the upper fixing column 22 is located in the upper fixing column hole 19, the lower fixing column 31 is located in the lower fixing column hole 21, and the upper shell 1, the deep ultraviolet device 2 and the lower shell 3 are combined into a firm whole to form a Threaded deep ultraviolet device structure 100.
本实施例的带螺纹的深紫外器件结构100解决了安装焊接有多个带螺纹的深紫外器件结构100的线路板对单个带螺纹的深紫外器件结构100的返修难题，直接对上壳1上的四个受力柱15子施加水平旋转外力，通过螺纹结构4旋转把本实施例的带螺纹的深紫外器件结构100镶嵌进与线路板结合的固定架，通过将螺纹结构4和固定架内孔设置成相同的旋转圈数，使带螺纹的深紫外器件结构100的两个焊盘28与线路板的焊盘吻合接触。通过无加热焊接与无加热对线路板的单个带螺纹的深紫外器件结构100返修，解决了消费者应用端更换深紫外器件2的难题，也提高了具有多个带螺纹的深紫外器件结构100的线路板的整体性能。The threaded deep ultraviolet device structure 100 of this embodiment solves the problem of repairing a single threaded deep ultraviolet device structure 100 by installing and welding a circuit board with multiple threaded deep ultraviolet device structures 100 . The four force bearing columns 15 of the four force-bearing columns apply a horizontal rotation external force, and the threaded deep ultraviolet device structure 100 of this embodiment is embedded into the fixed frame combined with the circuit board through the rotation of the threaded structure 4, and the threaded structure 4 and the fixed frame The holes are arranged at the same number of rotations, so that the two solder pads 28 of the threaded deep ultraviolet device structure 100 are in coincident contact with the solder pads of the circuit board. Rework the single threaded deep ultraviolet device structure 100 of the circuit board through heating-free welding and heating, which solves the problem of replacing the deep ultraviolet device 2 at the consumer application end, and also improves the deep ultraviolet device structure 100 with multiple threads. The overall performance of the circuit board.
本说明书中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处。综上所述，本说明书内容不应理解为对本发明的限制。In this description, specific examples are used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the method and core idea of the present invention; meanwhile, for those of ordinary skill in the art, according to this The idea of the invention will have changes in the specific implementation and scope of application. In summary, the contents of this specification should not be construed as limiting the present invention.
Claims (9)
- 一种带螺纹的深紫外器件结构，其特征在于：包括上壳、深紫外器件和下壳，所述深紫外器件通过所述上壳与所述下壳连接，所述上壳的外周面设置有螺纹结构，所述深紫外器件包括基板、深紫外发光二极管、保护二极管和若干导电金属柱，所述基板的上表面设置有第一线路层结构，所述基板的下表面设置有第二线路层结构，若干所述导电金属柱贯穿所述基板设置，各所述导电金属柱的两端分别与所述第一线路层结构和所述第二线路层结构连接，所述深紫外发光二极管和所述保护二极管形成并联电路，所述深紫外发光二极管和所述保护二极管均设置在所述第一线路层结构上，所述深紫外发光二极管和所述保护二极管的外侧设置有围坝，所述围坝的内侧设置有内环台阶，所述内环台阶上设置有透镜，所述透镜罩设在所述深紫外发光二极管和所述保护二极管的外侧。A threaded deep ultraviolet device structure, characterized in that it includes an upper shell, a deep ultraviolet device and a lower shell, the deep ultraviolet device is connected to the lower shell through the upper shell, and the outer peripheral surface of the upper shell is arranged Has a threaded structure, the deep ultraviolet device includes a substrate, a deep ultraviolet light-emitting diode, a protection diode and a number of conductive metal pillars, the upper surface of the substrate is provided with a first circuit layer structure, and the lower surface of the substrate is provided with a second circuit Layer structure, a plurality of conductive metal pillars are arranged through the substrate, the two ends of each conductive metal pillar are respectively connected to the first circuit layer structure and the second circuit layer structure, the deep ultraviolet light-emitting diode and the The protection diodes form a parallel circuit, the deep ultraviolet light emitting diodes and the protection diodes are both arranged on the first circuit layer structure, and the outer sides of the deep ultraviolet light emitting diodes and the protection diodes are provided with dams, so An inner ring step is arranged inside the dam, and a lens is arranged on the inner ring step, and the lens cover is arranged outside the deep ultraviolet light-emitting diode and the protection diode.
- 根据权利要求1所述的带螺纹的深紫外器件结构，其特征在于：所述上壳包括上壳本体，所述上壳本体的外周面设置有所述螺纹结构，所述上壳本体的上表面设置有若干受力柱，各所述受力柱的一侧为曲面，所述上壳本体的下表面开设有放置槽，所述放置槽的形状与所述基板的形状匹配，所述放置槽的内侧开设有上壳孔，各所述曲面均朝向所述上壳孔设置，所述放置槽上开设有若干上固定柱孔，所述放置槽的外侧设置有上壳台阶，所述上壳台阶与所述下壳匹配，所述上壳台阶上开设有若干下固定柱孔。The threaded deep ultraviolet device structure according to claim 1, characterized in that: the upper case includes an upper case body, the outer peripheral surface of the upper case body is provided with the thread structure, and the upper case body is The surface is provided with a number of stressed columns, one side of each stressed column is a curved surface, the lower surface of the upper shell body is provided with a placement groove, the shape of the placement groove matches the shape of the base plate, and the placement The inner side of the groove is provided with an upper shell hole, each of the curved surfaces is set towards the upper shell hole, a number of upper fixing column holes are opened on the said placement groove, and an upper casing step is arranged on the outer side of the placement groove, and the upper casing The shell step is matched with the lower shell, and several lower fixing column holes are opened on the upper shell step.
- 根据权利要求2所述的带螺纹的深紫外器件结构，其特征在于：所述第一线路层结构的上表面还设置有若干上固定柱，所述上固定柱与所述上固定柱孔一一对应，所述围坝和所述透镜穿过所述上壳孔设置。According to the threaded deep ultraviolet device structure according to claim 2, it is characterized in that: the upper surface of the first circuit layer structure is also provided with several upper fixing posts, and the upper fixing posts are aligned with the holes of the upper fixing posts In one correspondence, the dam and the lens are arranged through the hole of the upper shell.
- 根据权利要求3所述的带螺纹的深紫外器件结构，其特征在于：所述上固定柱的高度与所述内环台阶的高度相同；所述放置槽的深度与所述基板、所述第一线路层结构、所述第二线路层结构的厚度之和相等。The threaded deep ultraviolet device structure according to claim 3, characterized in that: the height of the upper fixing column is the same as the height of the inner ring step; the depth of the placement groove is the same as that of the substrate, the second The sum of the thicknesses of the first circuit layer structure and the second circuit layer structure is equal.
- 根据权利要求3所述的带螺纹的深紫外器件结构，其特征在于：所述第一线路层结构包括第一功能区线路层、第二功能区线路层和非功能区线路层，所述第一功能区线路层和所述第二功能区线路层相对设置且所述第一功能区线路层和所述第二功能区线路层之间设置有间距，所述非功能 区线路层设置在所述第一功能区线路层和所述第二功能区线路层的外侧，所述非功能区线路层与所述第一功能区线路层和所述第二功能区线路层之间均设置有间距，所述围坝和若干所述上固定柱均设置在所述非功能区线路层上，所述内环台阶与所述第一功能区线路层和所述第二功能区线路层之间设置有间距，所述深紫外发光二极管和所述保护二极管均设置在所述第一功能区线路层和所述第二功能区线路层上。The threaded deep ultraviolet device structure according to claim 3, wherein the first circuit layer structure comprises a circuit layer in a first functional area, a circuit layer in a second functional area and a circuit layer in a non-functional area, and the first circuit layer comprises a circuit layer in a non-functional area. A line layer in a function area is set opposite to the line layer in the second function area, and a distance is set between the line layer in the first function area and the line layer in the second function area, and the line layer in the non-function area is set at the The line layer of the first functional area and the outer side of the line layer of the second functional area, the line layer of the non-functional area, the line layer of the first functional area and the line layer of the second functional area are all provided with a distance , the dam and a plurality of the upper fixing columns are arranged on the line layer of the non-functional area, and the inner ring steps are arranged between the line layer of the first functional area and the line layer of the second functional area There is a gap, the deep ultraviolet light emitting diode and the protection diode are both arranged on the circuit layer in the first functional area and the circuit layer in the second functional area.
- 根据权利要求5所述的带螺纹的深紫外器件结构，其特征在于：所述第二线路层结构包括第一结构和第二结构，所述第一结构和所述第二结构之间设置有间距，所述第一结构与所述第一功能区线路层对应，所述第二结构与所述第二功能区线路层对应。The threaded deep ultraviolet device structure according to claim 5, characterized in that: the second circuit layer structure comprises a first structure and a second structure, and an interlayer is arranged between the first structure and the second structure pitch, the first structure corresponds to the circuit layer in the first functional area, and the second structure corresponds to the circuit layer in the second functional area.
- 根据权利要求6所述的带螺纹的深紫外器件结构，其特征在于：所述第一结构的下表面和所述第二结构的下表面均设置有焊盘，所述焊盘的长度小于等于所述第一结构或所述第二结构的长度，所述焊盘的宽度小于等于所述第一结构或所述第二结构的宽度，所述焊盘的厚度大于所述第一结构或所述第二结构的厚度且小于等于所述围坝的高度。The threaded deep ultraviolet device structure according to claim 6, characterized in that: the lower surface of the first structure and the lower surface of the second structure are provided with pads, and the length of the pads is less than or equal to The length of the first structure or the second structure, the width of the pad is less than or equal to the width of the first structure or the second structure, and the thickness of the pad is greater than that of the first structure or the The thickness of the second structure is less than or equal to the height of the dam.
- 根据权利要求2所述的带螺纹的深紫外器件结构，其特征在于：所述下壳包括下壳本体，所述下壳本体上开设有下壳孔，所述下壳本体上设置有下固定柱，所述下固定柱与所述下固定柱孔一一对应。The threaded deep ultraviolet device structure according to claim 2, characterized in that: the lower case includes a lower case body, the lower case body is provided with a lower case hole, and the lower case body is provided with a lower fixing Columns, the lower fixing columns correspond to the holes of the lower fixing columns one by one.
- 根据权利要求8所述的带螺纹的深紫外器件结构，其特征在于：所述下壳本体的厚度与所述上壳台阶的高度一致。The threaded deep ultraviolet device structure according to claim 8, characterized in that: the thickness of the lower shell body is consistent with the height of the upper shell step.
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113793890B (en) | 2022-02-11 |
| CN113793890A (en) | 2021-12-14 |
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