WO2023083002A1 - 用于冷藏冷冻装置门体的密封梁和冷藏冷冻装置 - Google Patents

用于冷藏冷冻装置门体的密封梁和冷藏冷冻装置 Download PDF

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WO2023083002A1
WO2023083002A1 PCT/CN2022/127706 CN2022127706W WO2023083002A1 WO 2023083002 A1 WO2023083002 A1 WO 2023083002A1 CN 2022127706 W CN2022127706 W CN 2022127706W WO 2023083002 A1 WO2023083002 A1 WO 2023083002A1
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Prior art keywords
sealing beam
semiconductor
semiconductor module
refrigerating
module
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PCT/CN2022/127706
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English (en)
French (fr)
Inventor
张纯
吕鹏
赵晓军
张�浩
孟亮
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青岛海尔电冰箱有限公司
海尔智家股份有限公司
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Publication of WO2023083002A1 publication Critical patent/WO2023083002A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/02—Doors; Covers
    • F25D23/028—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/04—Preventing the formation of frost or condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/006—General constructional features for mounting refrigerating machinery components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/02—Doors; Covers

Definitions

  • the invention relates to the technical field of refrigeration and storage, in particular to a sealing beam used for a door body of a refrigeration and freezing device and a refrigeration and freezing device.
  • refrigerators, freezers and other refrigeration and freezing devices have become a necessity in family life.
  • Most of the ingredients in the refrigerator are stored inside the refrigerator.
  • French door refrigerators are a popular refrigerator product.
  • French side-by-side refrigerators are usually designed with a vertical beam between its two refrigerated doors.
  • the presence of this vertical beam will facilitate the lapping and sealing of the door seal between the two refrigerated doors.
  • the vertical beam can also be called a seal. beam.
  • the surface temperature of the refrigerator is relatively low during normal cooling, and condensation is prone to occur, which affects the appearance of the refrigerator and affects the user's sense of use. Therefore, in existing refrigerator products, the problem of condensation on the front surface of the vertical beam has always been a difficult problem to be solved, which affects user experience.
  • refrigerators are often equipped with heating wires to heat up and prevent condensation. However, when the heating wires heat the surface temperature of the vertical beams, the temperature difference here will increase, which will increase the loss of cooling capacity in the refrigerator compartment.
  • the existing sealing beam structure is relatively complicated.
  • the present invention is proposed in order to provide a sealing beam for the door body of a refrigerator-freezer and a refrigerator-freezer that overcome the above-mentioned problems or at least partially solve the above-mentioned problems.
  • the cooling capacity in the storage room of the device is lost, and the structure is simple, the number of components is small, the assembly is simple, and the energy utilization rate is high.
  • the present invention provides a sealing beam for the door body of a refrigerating and freezing device, which includes:
  • a semiconductor module having a cooling surface and a heating surface, both of which are continuously extending surfaces;
  • An outer frame the outer frame is arranged on the outer periphery of the semiconductor module, so that the cooling surface of the semiconductor module is part or all of the rear surface of the sealing beam, and the manufacturing of the semiconductor module
  • the hot face is part or all of the front face of the sealing beam.
  • the semiconductor module includes at least two semiconductor sub-modules arranged in sequence along the front-to-back direction; the front surface of each semiconductor sub-module is its heating surface, and the rear surface is its cooling surface, so that the frontmost The front surface of the semiconductor sub-module is the heating surface of the semiconductor module, and the rear surface of the last semiconductor sub-module is the cooling surface of the semiconductor module;
  • each adjacent two semiconductor sub-modules are thermally connected.
  • a thermal insulation structure is provided between every two adjacent semiconductor sub-modules and between the outer frame.
  • a heat conduction plate or a plurality of heat conduction strips extending along the sealing beam are arranged between the two opposite surfaces of every two adjacent semiconductor sub-modules.
  • the sealing beam further includes a guide assembly, and the guide assembly is installed on the outer frame and outside one end of the semiconductor module.
  • the sealing beam further includes a guide assembly, wherein one end of two adjacent semiconductor sub-modules has an installation space for installing the guide assembly.
  • the sealing beam further includes a shaft sleeve assembly, and the shaft sleeve assembly is installed on a frame of the outer frame extending along the length direction of the semiconductor module.
  • both sides of the heat conduction plate are bonded to the corresponding semiconductor sub-modules respectively, and the heat conduction plate is thermally connected to the corresponding semiconductor sub-modules through heat conduction silica gel.
  • the present invention also provides a refrigerating and freezing device, comprising a box body, a storage compartment is provided in the box body, a first door body is arranged on the front side of the storage room room, and a door body is arranged on the first door body A sealing beam, wherein the sealing beam is any one of the above-mentioned sealing beams, and the rear surface of the sealing beam faces the storage compartment.
  • the refrigerating and freezing device further includes a second door body disposed on the front side of the storage compartment, and the second door body is disposed opposite to the first door body.
  • the characteristics of the semiconductor module being heated on one side and cooling on the other are utilized, and the hot end face of the semiconductor module is directly used as the front surface of the sealing beam to prevent the air in the room from condensing on the surface of the sealing beam; at the same time , The cold end face of the semiconductor module is directly used as the rear surface of the sealing beam to assist refrigeration, which can reduce the loss of cooling capacity in the storage room while improving the condensation problem of the sealing beam.
  • the hot end face of the semiconductor module is directly used as the front surface of the sealing beam
  • the cold end face of the semiconductor module is directly used as the rear surface of the sealing beam, so that there is no need to specially set a protective surface and a protection surface on the front side and the rear side of the semiconductor module. cover, etc., and can be directly used for anti-condensation and auxiliary refrigeration, with high energy utilization and high efficiency.
  • the semi-conductor refrigerating sheet of the semiconductor module is heating and cooling at the same time, and its heating capacity is higher than the cooling capacity.
  • the heating surface of the semiconductor module is directly used as the front surface of the sealing beam, which is especially suitable for solving the condensation problem of the sealing beam, and has high condensation removal efficiency and good effect ; In addition, it also has the characteristics of high energy density, no noise, and small size, which can make the thickness of the sealing beam smaller, and has a higher ability to solve the problem of condensation on the front surface.
  • the semiconductor module includes at least two semiconductor sub-modules arranged in sequence along the front and rear directions, which can improve the condensation removal efficiency.
  • the cooling surface on the front side is thermally connected to the heating surface on the rear side, which can neutralize the cold generated by the cooling surface on the front side and the heat generated by the heating surface on the rear side, helping to maintain the stability of the semiconductor sub-modules on the rear side.
  • the temperature difference between the heating surface and the cooling surface is conducive to continuous cooling and reduces the impact on the temperature of the storage compartment.
  • Fig. 1 is a schematic structural diagram of a sealed beam according to an embodiment of the present invention
  • Fig. 2 is a schematic side view of the sealing beam shown in Fig. 1;
  • Fig. 3 is a schematic partial structural diagram of the sealing beam shown in Fig. 1;
  • Fig. 4 is a schematic exploded view of the sealing beam shown in Fig. 1;
  • Fig. 5 is a schematic structural diagram of a refrigerating and freezing device according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a refrigerating and freezing device according to an embodiment of the present invention. As shown in FIG. 1 and with reference to FIGS. 2 to 4 , an embodiment of the present invention provides a sealing beam for a door body of a refrigerating and freezing device.
  • the sealing beam includes an outer frame 10 and a semiconductor module 20 .
  • the semiconductor module 20 has a cooling surface and a heating surface, both of which are continuously extending surfaces.
  • the outer frame 10 is arranged on the outer periphery of the semiconductor module 20, so that the cooling surface of the semiconductor module 20 is part or all of the rear surface of the sealing beam, and the heating surface of the semiconductor module 20 is part or all of the front surface of the sealing beam.
  • the sealing beam there is no special need to provide protective surfaces, protective covers, etc. on the front and rear sides of the semiconductor module 20, and there are fewer structural components, which facilitates installation. And utilize the characteristics of the semiconductor module 20 heating while cooling, the hot end face of the semiconductor module 20 is directly used as the front surface of the sealing beam to prevent the air in the room from condensing on the surface of the sealing beam; at the same time, the cold end of the semiconductor module 20 is The end face is directly used as the rear surface of the sealing beam to assist cooling, which can reduce the loss of cooling capacity in the storage room while improving the condensation problem of the sealing beam. That is, the sealing beam can compensate for the loss of cooling near the sealing beam when the traditional heating wire prevents condensation, and better maintain the indoor temperature of the storage room.
  • the hot end face of the semiconductor module 20 is directly used as the front surface of the sealing beam, and the cold end face of the semiconductor module 20 is directly used as the rear surface of the sealing beam, so it is not necessary to provide special protection on the front side and the rear side of the semiconductor module 20.
  • Surface, protective cover, etc., without heat transfer, can be directly used for anti-condensation and auxiliary refrigeration, with high efficiency and high energy utilization.
  • the semiconductor module 20 includes at least two semiconductor sub-modules 22 sequentially arranged along the front-back direction.
  • the front surface of each semiconductor submodule 22 is its heating surface
  • the rear surface is its cooling surface, so that the front surface of the frontmost semiconductor submodule 22 is the heating surface of the semiconductor module 20, and the rearmost semiconductor submodule 22 is the heating surface of the semiconductor module 20.
  • the rear surface of the semiconductor module 20 is the cooling surface.
  • the two opposite surfaces of every adjacent two semiconductor sub-modules 22 are thermally connected.
  • the semiconductor module 20 includes at least two semiconductor sub-modules 22 arranged sequentially along the front and rear directions, which is beneficial to increase the temperature difference between the heating surface and the cooling surface of the semiconductor module 20, and can improve the efficiency of decondensation and reduce the impact on the storage room during decondensation. Influence of room temperature.
  • the cooling surface on the front side is thermally connected to the heating surface on the rear side, which can neutralize the cold generated by the cooling surface on the front side and the heat generated by the heating surface on the rear side, and help maintain the semiconductor sub-surface on the rear side.
  • the temperature difference between the heating surface and the cooling surface of the module 22 is conducive to continuous cooling and reduces the influence on the temperature of the storage compartment.
  • the number of semiconductor sub-modules 22 is two.
  • Each semiconductor sub-module 22 includes a semiconductor cooling chip for generating cold and heat. After the semiconductor refrigeration chip is powered on, it cools and heats at the same time. Its working principle is that the DC power supply provides the energy required for the flow of electrons. When it reaches the N-type semiconductor, the heat is released again. Every time it passes through an NP module, heat is sent from one side to the other side to cause a temperature difference and form a hot and cold end.
  • a thermal insulation structure 30 is provided between every two adjacent semiconductor sub-modules 22 and between the outer frame 10, for example, foaming can be performed to form a thermal insulation layer, which can at least improve the sealing performance, so that the semiconductor module 20 is not When working, the thermal insulation performance of the refrigerating and freezing device can be guaranteed, and the sealing beam can also have sufficient strength.
  • a heat conduction plate 40 is disposed between two opposing surfaces of every two adjacent semiconductor sub-modules 22 .
  • the heat conduction plate 40 may be perpendicular to the front-to-rear direction, that is, the two sides of the heat conduction plate 40 may be attached to the corresponding semiconductor sub-modules 22 .
  • the heat conduction plate 40 is thermally connected with the corresponding semiconductor sub-module 22 through heat conduction silica gel.
  • a plurality of heat conduction strips extending along the sealing beam are arranged between the two opposite surfaces of every two adjacent semiconductor sub-modules 22 , and the space between two adjacent heat conduction strips can also be Fill with insulation material.
  • the sealing beam further includes a guide assembly 50, and one end of the semiconductor module 20 has an installation space for installing the guide assembly 50, that is to say, part of the structure of the guide assembly 50 can be disposed in the installation space.
  • the outer frame 10 is provided with a hole through which the guide assembly 50 passes.
  • one end of two adjacent semiconductor sub-modules 22 has an installation space for installing the guide assembly 50 .
  • the number of semiconductor sub-modules 22 is two.
  • the guide assembly 50 is disposed at a special position of the semiconductor module 20 to make full use of the space.
  • the guide assembly 50 is installed on the outer frame 10 and is outside one end of the semiconductor module 20 . That is, an installation space is provided outside one end of the outer frame 10 , and part of the structure of the guide assembly 50 is provided in the installation space. That is to say, the guide assembly 50 is completely disposed on the outer frame 10 .
  • the sealing beam further includes a shaft sleeve assembly 60 , and the shaft sleeve assembly 60 is mounted on a frame of the outer frame 10 extending along the length direction of the semiconductor module 20 .
  • the sealing beam further includes two sealing gaskets, which are respectively arranged at both ends of the semiconductor module 20 , and each sealing gasket is arranged between one end surface of the semiconductor module 20 and the outer frame 10 .
  • a blocking piece extends from the front edge of each sealing gasket in a direction away from the other sealing gasket, and the blocking piece can be attached to the front surface of the outer frame 10 .
  • the gasket can reduce the heat transfer caused by the fit gap between the outer frame 10 and the semiconductor module 20 .
  • the outer frame 10 is made of plastic material.
  • the rotating shaft sleeve assembly 60 may include a shaft sleeve 61 and a torsion spring 62, a rotating shaft is arranged on the corresponding door body, the rotating shaft is inserted into the shaft sleeve, and the torsion spring is arranged between the rotating shaft and the shaft sleeve to promote sealing.
  • the beams are perpendicular to the corresponding door body.
  • the guide assembly 50 may include a spring 51 and a guide piece 52 , the guide piece is telescopically arranged, and the spring is used for the guide piece to extend out of the outer frame 10 .
  • the top wall of the storage compartment is provided with a guide groove with the opening facing downward.
  • the embodiment of the present invention also provides a refrigerating and freezing device.
  • the refrigerating and freezing device includes a box body 71 , and one or more storage compartments are defined in the box body 71 . Further, the refrigerating and freezing device further includes at least one door/cover for opening and closing the above-mentioned several storage compartments.
  • the refrigerator-freezer also includes a refrigeration system, which may be a compression refrigeration system for cooling each storage compartment.
  • a compressor refrigeration system may include a compressor, a condenser, a throttling element, and an evaporator connected in series.
  • the refrigerating and freezing device can be an air-cooled refrigerating and freezing device, and the evaporator can be arranged in the cooling chamber of the box body 71, so as to provide cold energy to the storage compartment through the air duct assembly and the fan.
  • the air duct assembly has a supply air path and a return air path, and the fan is configured to cause the gas in the storage room to enter the cooling room from the return air path, exchange heat with the evaporator, and enter the storage room through the air supply path. room.
  • the refrigerating-freezing device may be a direct-cooling refrigerating-freezing device.
  • the refrigeration system may be another type of refrigeration system such as a semiconductor refrigeration system.
  • the refrigerating and freezing device may be a refrigerator, a freezer, a freezer, and the like.
  • the compressor compresses the vaporized refrigerant into a high-temperature and high-pressure gas, and then discharges it from the exhaust port of the compressor.
  • the inlet of the condenser is connected to the exhaust port of the compressor.
  • the high-temperature and high-pressure gaseous refrigerant flows through the condenser, and gradually condenses into a high-pressure liquid during the process of radiating heat to the outside.
  • the inlet of the throttling element is connected to the outlet of the condenser.
  • the pressure decreases and becomes a gas-liquid mixture, and then enters the evaporator to absorb the heat in the gas to vaporize, and then returns to the compressor.
  • the fan makes the airflow flow between the storage compartment and the cooling compartment, so that the temperature in the storage compartment is reduced.
  • two doors are arranged on the front side of the box body 71 of the refrigerating and freezing device, and the two doors are arranged oppositely, and the rear side of each door body has a storage compartment, or the two doors
  • the door body is used to close a storage compartment.
  • a sealing beam also called a vertical beam, between the two door bodies.
  • the sealing beam can be arranged on a door body.
  • the sealing beam is the sealing beam in any of the above-mentioned embodiments.
  • the sealing beam can be arranged vertically, arranged horizontally and extending along the front-to-back direction, or arranged horizontally and extending along the left-right direction, or it can be arranged in other forms.
  • its rear side corresponds to a storage compartment, and the sealing beam in any of the above embodiments may also be arranged between the door body and the frame at the opening of the storage compartment.
  • the refrigerating and freezing device includes a box body 71, which has a storage compartment inside, and a first door body 72 is arranged on the front side of the storage room room, and the first door body 72 is provided with a sealing beam, wherein the sealing beam is any one of the above-mentioned sealing beams, and the rear surface of the sealing beam faces the storage compartment.
  • the refrigerating and freezing device further includes a second door body 73 disposed on the front side of the storage compartment, and the second door body 73 is disposed opposite to the first door body 72 .
  • the first door body 72 and the second door body 73 can form a side-by-side door body.

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Abstract

一种用于冷藏冷冻装置门体的密封梁和冷藏冷冻装置。密封梁包括外框和半导体模块。半导体模块具有制冷面和制热面。外框设置于半导体模块的外周，以使半导体模块的制冷面为密封梁的后表面的部分或全部，以及使半导体模块的制热面为密封梁的前表面的部分或全部。该密封梁可以补偿传统加热丝防凝露时，密封梁附近的冷量流失，更好的维持储物间室内温度。而且，可不用在半导体模块的前侧和后侧特别设置保护面、保护罩等，结构构件少，安装方便，且减少热传递，提高热冷量的利用率。

Description

用于冷藏冷冻装置门体的密封梁和冷藏冷冻装置 技术领域
本发明涉及制冷储物技术领域，特别是涉及一种用于冷藏冷冻装置门体的密封梁和冷藏冷冻装置。
背景技术
随着科技的发展、社会经济的发展以及人们生活水平的提高，高生活质量成了用户的必备需求，特别地冰箱、冷柜等冷藏冷冻装置已经成为家庭生活中的必需品，用户往往会将家庭中的大多数食材存储于冰箱内部。例如，法式对开门电冰箱是人们喜爱的冰箱产品。
法式对开门电冰箱通常在其两扇冷藏门之间会设计一个竖梁，该竖梁的存在会便于两扇冷藏门之间的门封的搭接和密封，竖梁也可被称为密封梁。冰箱在正常制冷时其表面温度比较低，容易产生凝露，影响冰箱美观且影响用户使用感。因此，在现有的冰箱产品中，竖梁前表面的凝露问题一直是函待解决的难题，影响用户体验。为了解决这一问题，冰箱上往往配有加热丝进行升温防凝露，但是加热丝加热竖梁外表温度的同时，此处因温差升大，会加剧冰箱间室在此处的冷量流失。而且，现有的密封梁结构比较复杂。
发明内容
鉴于上述问题，提出了本发明以便提供一种克服上述问题或者至少部分地解决上述问题的用于冷藏冷冻装置门体的密封梁和冷藏冷冻装置，能够在改善凝露问题的同时，减少冷藏冷冻装置的储物间室内的制冷量流失，且结构简单，构件数量少，装配简单，能量利用率高。
具体地，本发明提供了一种用于冷藏冷冻装置门体的密封梁，其包括：
半导体模块，所述半导体模块具有制冷面和制热面，所述制冷面和所述制热面均为连续延伸的面；和
外框，所述外框设置于所述半导体模块的外周，以使所述半导体模块的所述制冷面为所述密封梁的后表面的部分或全部，以及使所述半导体模块的所述制热面为所述密封梁的前表面的部分或全部。
可选地，所述半导体模块包括至少两个沿前后方向依次设置的半导体子模块；每个所述半导体子模块的前表面为其制热面，后表面为其制冷面，以 使最前侧的所述半导体子模块的前表面为所述半导体模块的制热面，最后侧的所述半导体子模块的后表面为所述半导体模块的制冷面；
每相邻两个所述半导体子模块相对的两个面热连接。
可选地，每相邻两个所述半导体子模块之间，以及与所述外框之间均设置有保温结构。
可选地，每相邻两个所述半导体子模块相对的两个面之间设置有导热板或多个沿所述密封梁延伸的导热条。
可选地，所述密封梁还包括导向组件，所述导向组件安装于所述外框，且处于所述半导体模块的一端外侧。
可选地，所述密封梁还包括导向组件，其中相邻的两个所述半导体子模块的一端具有安装空间，用于安装所述导向组件。
可选地，所述密封梁还包括转轴套组件，所述转轴套组件安装于所述外框的一个沿所述半导体模块的长度方向延伸的边框。
可选地，所述导热板的两侧面分别与对应的所述半导体子模块贴合，且所述导热板通过导热硅胶与对应的所述半导体子模块热连接。
本发明还提供了一种冷藏冷冻装置，包括箱体，所述箱体内具有储物间室，所述储物间室的前侧设置有第一门体，所述第一门体上设置有密封梁，其中，所述密封梁为上述任一种密封梁，所述密封梁的后表面朝向所述储物间室。
可选地，所述冷藏冷冻装置还包括第二门体，设置于所述储物间室的前侧，且所述第二门体与所述第一门体相对设置。
本发明的冷藏冷冻装置及密封梁中，利用半导体模块一面制热一面制冷的特性，将半导体模块的热端端面直接作为密封梁的前表面，防止房间内的空气在密封梁表面凝露；同时，将半导体模块的冷端端面直接作为密封梁的后表面，辅助制冷，能够在改善密封梁凝露问题的同时，减少储物间室内的制冷量流失。
特别地，将半导体模块的热端端面直接作为密封梁的前表面，将半导体模块的冷端端面直接作为密封梁的后表面，可不用在半导体模块的前侧和后侧特别设置保护面、保护罩等，且可直接用于防凝露和辅助制冷，能量利用率高，效率高。
而且，半导体模块的半导体制冷片同时制热制冷，其制热量高于制冷量， 半导体模块的制热面直接作为密封梁的前表面，特别适用于解决密封梁凝露问题，除凝露效率高效果好；此外还拥有能量密度高、无噪音、体积小等特点，可使密封梁的厚度较小，且具有较高的解决前表面凝露问题的能力。
进一步地，本发明的密封梁中，半导体模块包括至少两个沿前后方向依次设置的半导体子模块，能够提高除凝露效率。且前侧的制冷面与后侧的制热面热连接，可将前侧的制冷面产生的冷量与后侧的制热面产生的热量相中和，帮助维持后侧的半导体子模块的制热面、制冷面的之间的温差，利于持续制冷，降低对储物间室温度的影响。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的密封梁的示意性结构图；
图2是图1所示密封梁的示意性侧视图；
图3是图1所示密封梁的示意性局部结构图；
图4是图1所示密封梁的示意性***图；
图5是根据本发明一个实施例的冷藏冷冻装置的示意性结构图。
具体实施方式
图1是根据本发明一个实施例的冷藏冷冻装置的示意性结构图。如图1所示并参考图2至图4，本发明实施例提供了一种用于冷藏冷冻装置门体的密封梁。
密封梁包括外框10和半导体模块20。半导体模块20具有制冷面和制热面，制冷面和制热面均为连续延伸的面。外框10设置于半导体模块20的外周，以使半导体模块20的制冷面为密封梁的后表面的部分或全部，以及使半导体模块20的制热面为密封梁的前表面的部分或全部。
本发明实施例的密封梁中，不用在半导体模块20的前侧和后侧特别设置保护面、保护罩等，结构构件少，便于安装。且利用半导体模块20一面制热一面制冷的特性，将半导体模块20的热端端面直接作为密封梁的前表 面，防止房间内的空气在密封梁表面凝露；同时，将半导体模块20的冷端端面直接作为密封梁的后表面，辅助制冷，能够在改善密封梁凝露问题的同时，减少储物间室内的制冷量流失。即，该密封梁可以补偿传统加热丝防凝露时，密封梁附近的冷量流失，更好的维持储物间室内温度。
特别地，将半导体模块20的热端端面直接作为密封梁的前表面，将半导体模块20的冷端端面直接作为密封梁的后表面，可不用在半导体模块20的前侧和后侧特别设置保护面、保护罩等，不需要进行热传递，可直接用于防凝露和辅助制冷，效率高，且能量利用率高。
在本发明的一些实施例中，如图3和图4所示，半导体模块20包括至少两个沿前后方向依次设置的半导体子模块22。每个半导体子模块22的前表面为其制热面，后表面为其制冷面，以使最前侧的半导体子模块22的前表面为半导体模块20的制热面，最后侧的半导体子模块22的后表面为半导体模块20的制冷面。每相邻两个半导体子模块22相对的两个面热连接。
半导体模块20包括至少两个沿前后方向依次设置的半导体子模块22，利于提高半导体模块20的制热面与制冷面之间的温差，能够提高除凝露效率和降低除冷凝时对储物间室温度的影响。具体地，前侧的制冷面与后侧的制热面热连接，可将前侧的制冷面产生的冷量与后侧的制热面产生的热量相中和，帮助维持后侧的半导体子模块22的制热面、制冷面的之间的温差，利于持续制冷，降低对储物间室温度的影响。优选地，半导体子模块22的数量为两个。每个半导体子模块22包括用于产冷和产热的半导体制冷片。半导体制冷片在通电后，一面制冷，一面制热，其工作原理是由直流电源提供电子流所需的能量，通上电源后，电子负极出发，首先经过P型半导体，于此吸热量，到了N型半导体，又将热量放出，每经过一个NP模块，就有热量由一边被送到另外一边造成温差而形成冷热端。
进一步地，每相邻两个半导体子模块22之间，以及与外框10之间均设置有保温结构30，例如可进行发泡形成保温层，至少可提高封闭性能，使得半导体模块20在不工作时，保证冷藏冷冻装置的保温性能，也能够使密封梁具有足够的强度。
在本发明的一些实施例中，如图4所示，每相邻两个半导体子模块22相对的两个面之间设置有导热板40。导热板40可与前后方向垂直，即导热板40的两侧面可以与对应的半导体子模块22贴合。导热板40通过导热硅 胶与对应的半导体子模块22热连接。在本发明的一些替代性实施例中，每相邻两个半导体子模块22相对的两个面之间设置有多个沿密封梁延伸的导热条，相邻的两个导热条之间也可填充保温材料。
在本发明的一些实施例中，密封梁还包括导向组件50，半导体模块20的一端具有安装空间，用于安装导向组件50，也就是说导向组件50的部分结构可设置于安装空间。外框10上设置有同于导向组件50穿过的孔洞。具体地，其中相邻的两个半导体子模块22的一端具有安装空间，用于安装导向组件50。优选地，半导体子模块22的数量为两个。导向组件50设置于半导体模块20的特殊位置处，可充分利用空间。在本发明的另一些实施例中，导向组件50安装于外框10，且处于半导体模块20的一端外侧。即，外框10的一端外侧设置有安装空间，导向组件50的部分结构设置于安装空间内。也就是说，导向组件50完全设置于外框10上。
进一步地，密封梁还包括转轴套组件60，转轴套组件60安装于外框10的一个沿半导体模块20的长度方向延伸的边框。
为了保证密封性能和隔热效果，密封梁还包括两个密封垫，分别设置于半导体模块20的两端，且每个密封垫设置于半导体模块20的一个端部端面与外框10之间。进一步地，每个密封垫的前边缘向远离另一密封垫的方向延伸出挡片，挡片可与外框10的前表面贴合。密封垫可减少因外框10与半导体模块20的配合间隙造成的换热。外框10由塑料材质制成。
在本发明的一些实施例中，转轴套组件60可包括轴套61和扭簧62，对应的门体上设置有转轴，转轴***轴套，扭簧设置于转轴和轴套之间，促使密封梁垂直于对应的门体。
导向组件50可包括弹簧51和导向件52，导向件可伸缩地设置，弹簧用于导向件伸出外框10。储物间室顶壁设置有开口朝下的导向槽。在该门体打开时，密封梁处于近似垂直于门体的状态，即完全折叠状态。该门体关闭过程中，密封梁将沿竖直轴线转动至近似平行于门体的状态，即完全展开状态，以密封该门体与另一门体之间的间隙。在开关门过程中，导向件将沿导向槽的延伸轨迹运动，以引导密封梁正确转动。
本发明实施例还提供了一种冷藏冷冻装置，如图5所示，冷藏冷冻装置包括箱体71，箱体71内限定有一个或多个储物间室。进一步地，冷藏冷冻装置还包括用于开闭上述若干个储物间室的至少一个门体/盖。冷藏冷冻装置 还包括制冷***，制冷***可为用于为每个储物间室供冷的压缩制冷***。压缩机制冷***可包括串联连接的压缩机、冷凝器、节流元件和蒸发器。冷藏冷冻装置可为风冷式冷藏冷冻装置，蒸发器可设置于箱体71的冷却室内，以便于通过风道组件和风机向储物间室提供冷量。具体地，风道组件具有送风风路和回风风路，风机配置成促使储物间室内的气体从回风风路进入冷却室，与蒸发器换热经由送风风路进入储物间室。在一些可选实施例中，冷藏冷冻装置可为直冷式冷藏冷冻装置。在一些可选实施例中，制冷***可为半导体制冷***等其他类的制冷***。冷藏冷冻装置可以为冰箱、冰柜、冷柜等。
制冷***为压缩制冷***时，压缩机将汽化的制冷剂压缩成高温高压的气体，然后从压缩机的排气口排出。冷凝器的入口与压缩机的排气口相连，高温高压的气态制冷剂流经冷凝器，在向室外散热的过程中，逐渐冷凝成高压的液体。节流元件的入口与冷凝器的出口相连，高压的液态制冷剂流经节流元件后压力降低变成气液混合物，然后进入蒸发器吸收气体中的热量汽化，再返回压缩机。同时，风机使气流在储物间室和冷却室之间流动，使得储物间室内的温度降低。
在一些优选实施例中，冷藏冷冻装置的箱体71的前侧设置有两个门体，两个门体相对设置，每个门体的后侧均具有一个储物间室，或者该两个门体用于封闭一个储物间室。为了保证两个门体之间的密封性能，两个门体之间通常具有密封梁，也可被称为竖梁。密封梁可设置于一个门体上。特别地，密封梁为上述任一实施例中的密封梁。根据门体的安装位置，该密封梁可竖直设置，可水平设置且沿前后方向延伸，也可水平设置且沿左右方向延伸，淡然也可设置成其他形态。当然，在一些实施例中，对于一个门体，其后侧对应一个储物间室，门体与储物间室的开口处的边框之间也可设置上述任一实施例中的密封梁。
也就是说，在本发明的一些实施例中，冷藏冷冻装置包括箱体71，箱体71内具有储物间室，储物间室的前侧设置有第一门体72，第一门体72上设置有密封梁，其中，密封梁为上述任一种密封梁，密封梁的后表面朝向储物间室。在本发明的一些进一步的实施例中，冷藏冷冻装置还包括第二门体73，设置于储物间室的前侧，且第二门体73与第一门体72相对设置。第一门体72和第二门体73可构成对开门体。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种用于冷藏冷冻装置门体的密封梁，包括：
    半导体模块，所述半导体模块具有制冷面和制热面；和
    外框，所述外框设置于所述半导体模块的外周，以使所述半导体模块的所述制冷面为所述密封梁的后表面的部分或全部，以及使所述半导体模块的所述制热面为所述密封梁的前表面的部分或全部。
  2. 根据权利要求1所述的密封梁，其中，
    所述半导体模块包括至少两个沿前后方向依次设置的半导体子模块；每个所述半导体子模块的前表面为其制热面，后表面为其制冷面，以使最前侧的所述半导体子模块的前表面为所述半导体模块的制热面，最后侧的所述半导体子模块的后表面为所述半导体模块的制冷面；
    每相邻两个所述半导体子模块相对的两个面热连接。
  3. 根据权利要求2所述的密封梁，其中，
    每相邻两个所述半导体子模块之间，以及与所述外框之间均设置有保温结构。
  4. 根据权利要求2所述的密封梁，其中，
    每相邻两个所述半导体子模块相对的两个面之间设置有导热板或多个沿所述密封梁延伸的导热条。
  5. 根据权利要求1所述的密封梁，还包括导向组件，所述导向组件安装于所述外框，且处于所述半导体模块的一端外侧。
  6. 根据权利要求2所述的密封梁，还包括导向组件，其中相邻的两个所述半导体子模块的一端具有安装空间，用于安装所述导向组件。
  7. 根据权利要求1所述的密封梁，还包括转轴套组件，所述转轴套组件安装于所述外框的一个沿所述半导体模块的长度方向延伸的边框。
  8. 根据权利要求4所述的密封梁，其中，
    所述导热板的两侧面分别与对应的所述半导体子模块贴合，且所述导热 板通过导热硅胶与对应的所述半导体子模块热连接；
    每个所述半导体子模块包括半导体制冷片。
  9. 一种冷藏冷冻装置，包括箱体，所述箱体内具有储物间室，所述储物间室的前侧设置有第一门体，所述第一门体上设置有密封梁，其中，所述密封梁为权利要求1至8中任一项所述的密封梁，所述密封梁的后表面朝向所述储物间室。
  10. 根据权利要求9所述的冷藏冷冻装置，还包括第二门体，设置于所述储物间室的前侧，且所述第二门体与所述第一门体相对设置。
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CN112902542A (zh) * 2021-02-04 2021-06-04 长虹美菱股份有限公司 一种冰箱半导体翻转梁加热模块及其控制方法
CN216814767U (zh) * 2021-11-15 2022-06-24 青岛海尔电冰箱有限公司 用于冷藏冷冻装置门体的密封梁
CN216814766U (zh) * 2021-11-15 2022-06-24 青岛海尔电冰箱有限公司 用于冷藏冷冻装置门体的密封梁

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