WO2023066944A1 - Système adhésif réactif en forme de bande - Google Patents
Système adhésif réactif en forme de bande Download PDFInfo
- Publication number
- WO2023066944A1 WO2023066944A1 PCT/EP2022/078992 EP2022078992W WO2023066944A1 WO 2023066944 A1 WO2023066944 A1 WO 2023066944A1 EP 2022078992 W EP2022078992 W EP 2022078992W WO 2023066944 A1 WO2023066944 A1 WO 2023066944A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive system
- composition
- adhesive
- layer
- radicals
- Prior art date
Links
- 239000004823 Reactive adhesive Substances 0.000 title description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 88
- 239000000853 adhesive Substances 0.000 claims abstract description 86
- 229920000642 polymer Polymers 0.000 claims abstract description 40
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 30
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims abstract description 20
- 239000003054 catalyst Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000009833 condensation Methods 0.000 claims abstract description 13
- 230000005494 condensation Effects 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 125000003118 aryl group Chemical group 0.000 claims abstract description 8
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 70
- -1 polydimethylsiloxane Polymers 0.000 claims description 38
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 17
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 15
- 150000001282 organosilanes Chemical class 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- ZKALVNREMFLWAN-VOTSOKGWSA-N (ne)-n-(4-methylpentan-2-ylidene)hydroxylamine Chemical group CC(C)C\C(C)=N\O ZKALVNREMFLWAN-VOTSOKGWSA-N 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- VFQDANREJKRKPD-UHFFFAOYSA-N N-(1-ethoxy-1-methoxybutan-2-ylidene)hydroxylamine Chemical compound C(C)C(=NO)C(OCC)OC VFQDANREJKRKPD-UHFFFAOYSA-N 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 104
- 150000001875 compounds Chemical class 0.000 description 30
- 239000000758 substrate Substances 0.000 description 26
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 16
- 238000012360 testing method Methods 0.000 description 16
- 239000002390 adhesive tape Substances 0.000 description 15
- 238000004132 cross linking Methods 0.000 description 15
- 238000001723 curing Methods 0.000 description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- 239000004014 plasticizer Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000002318 adhesion promoter Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229920002521 macromolecule Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 5
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 239000002274 desiccant Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 4
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 150000004756 silanes Chemical class 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- 239000004971 Cross linker Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000012876 carrier material Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical group CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 101100301546 Arabidopsis thaliana REM19 gene Proteins 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910008051 Si-OH Inorganic materials 0.000 description 2
- 229910006358 Si—OH Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000013008 moisture curing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000012048 reactive intermediate Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- WXWYJCSIHQKADM-ZNAKCYKMSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-ethenylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)C=C WXWYJCSIHQKADM-ZNAKCYKMSA-N 0.000 description 1
- OGZPYBBKQGPQNU-DABLZPOSSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-methylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](C)(O\N=C(/C)CC)O\N=C(/C)CC OGZPYBBKQGPQNU-DABLZPOSSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 229910020487 SiO3/2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002323 Silicone foam Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 235000019568 aromas Nutrition 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- LQRUPWUPINJLMU-UHFFFAOYSA-N dioctyl(oxo)tin Chemical compound CCCCCCCC[Sn](=O)CCCCCCCC LQRUPWUPINJLMU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- GHDJXHALPUPXOD-UHFFFAOYSA-N ethoxysilylmethanamine Chemical compound NC[SiH2]OCC GHDJXHALPUPXOD-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 150000002905 orthoesters Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002631 room-temperature vulcanizate silicone Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013514 silicone foam Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- INETXKGLHYNTHK-AQWWNALJSA-N tetrakis[(e)-butan-2-ylideneamino] silicate Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)O\N=C(/C)CC INETXKGLHYNTHK-AQWWNALJSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/346—Applications of adhesives in processes or use of adhesives in the form of films or foils for building applications e.g. wrap foil
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/54—Fixing of glass panes or like plates
- E06B3/56—Fixing of glass panes or like plates by means of putty, cement, or adhesives only
Definitions
- the invention relates to the technical field of reactive adhesives based on silicone, which here should be used for producing wear and durable adhesive bonds. More specifically, the invention proposes an adhesive system with a silicone core layer and a reactive outer layer also based on silicone, which cures under the influence of moisture. The invention also provides the use of an adhesive system according to the invention for the production of assembly bonds.
- expandable adhesive systems which may be referred to as “adhesive patches”, are known for such applications.
- adhesive patches high layer thicknesses can be implemented through expansion of the adhesive compound.
- this requires a high temperature, which cannot be tolerated by all substrates.
- curing of the adhesive compounds enables high strengths - with low elongation at break - to be achieved.
- immediate load bearing is not possible with these systems.
- liquid adhesives which cover a wide range of strength and elongation after curing at very low temperatures.
- these liquid adhesives in particular, tolerance compensation for uneven substrate surfaces is possible; however, before complete curing has taken place, the (low-viscosity) adhesive compound is always squeezed out of the bond joint, in particular when pressure is exerted on the adhesively bonded composite. Such squeezing out of the adhesive compound is often undesirable.
- Reactive adhesive compounds or adhesive systems equipped therewith are also used to solve the objects outlined. With these compounds or systems, however, depending on the curing mechanism, often only very limited layer thicknesses can be achieved. To cure the adhesive systems used, high temperatures are usually required, which in many cases are not well tolerated by the substrates to be bonded.
- Adhesive tapes for the described application criteria are also known in the prior art.
- Such adhesive tapes are characterized by good dimensional stability and are available in high layer thicknesses. Curing is not required.
- the adhesive tapes are mostly highly stretchable; however, only limited holding forces can generally be achieved.
- a principal advantage of adhesive tapes is that they allow a certain load bearing immediately after application because of their adhesive effect.
- WO 2017/191322 A1 describes a method for the adhesion of an essentially cured silicone-based material on a substrate surface, the essentially cured silicone-based material being obtained by curing a condensation-curable composition, comprising
- a crosslinker selected from silanes with at least two hydrolyzable groups and silyl-functionalized molecules with at least two silyl groups, each of which has at least one hydrolyzable group;
- a condensation catalyst selected from titanates and zirconates.
- the method provides that a reactive intermediate layer is applied to a substrate surface and the reactive intermediate layer is pressed between the silicone-based material and the substrate surface with the application of pressure, whereby chemical bonding of the silicone-based material to the substrate surface is achieved.
- DE102010 051 274 A1 describes a silicone tape for the elastic closure of joints with a silicone body which is provided with adhesive layers on two opposite longitudinal surfaces. An additional geometric structure that increases the elastic lateral mobility is implemented inside the silicone body or outside its outer cross-section.
- WO 2007/011538 A2 describes a pressure sensitive adhesive composition, comprising
- (C) a polydiorganosiloxane terminated with a condensation reactive group, the resin/polymer ratio being 2.0 to 3.0.
- a crosslinker e.g., ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, acrylate, st
- RTV silicone compounds with “RTV” standing for “room temperature vulcanization” or “room temperature crosslinking”.
- the second-mentioned compounds are referred to as HTV silicone compounds, with “HTV” standing for “high temperature vulcanization” or “high temperature crosslinking”.
- RTV systems are often preferred because their use does not involve the use of elevated temperatures and thus the substrates to be bonded or sealed are not exposed to such influences.
- RTV1 systems and RTV2 systems where RTV1 compounds crosslink in accordance with the mechanism described above for one-component systems, and RTV2 compounds crosslink in accordance with the mechanism for two-component systems.
- silicone-based adhesive systems for the production of assembly bonds
- window panes An example of the use of silicone-based adhesive systems for the production of assembly bonds is the installation of window panes.
- frequently paste-like or liquid silicone-based adhesive systems are used, which are injected with pumps or cartridges into the gap between frame and pane.
- a spacer tape is first applied, which establishes the thickness of the joint; subsequently the gap next to the tape is filled with the adhesive compound.
- RTV2 systems are often used, but their delivery and application require relatively failure-prone pumping, mixing and metering systems.
- An object of the invention is to provide an adhesive system for assembly applications which can be applied easily and precisely in position and then quickly develops an adhesive force that is at least sufficient to fix the parts to be assembled.
- the adhesive system should be able to cure in air and transfer high forces after curing.
- a first and general aspect of the invention is a tapeshaped adhesive system, comprising a) a carrier layer containing at least one silicone and at least one filler; and b) at least one chemically pre-crosslinked outer layer which can be further crosslinked with moisture, comprising
- radicals R 1 independently of one another represent an alkyl, alkenyl or aryl group or a hydrogen atom
- the adhesive system according to the invention is suitable for producing assembly bonds and, like an adhesive tape, can be applied very precisely to the surfaces to be bonded without the need for equipment. It has an inherent tack and is therefore able to adequately fix the substrates to be bonded right from the start. The system can then cure quickly and has, as compared to many conventional adhesive systems, a reduced release of harmful substances. In addition, it makes it possible to dispense with spacer tapes, as are often required for producing assembly bonds.
- the adhesive system according to the invention is dimensionally stable under the usual pressure load, so it can be wound up like an adhesive tape - optionally with the aid of a release liner - and is not squeezed out of the bond joint.
- the adhesive system according to the invention can preferably also be characterized as an adhesive system that can be wound up in a dimensionally stable manner.
- the adhesive system according to the invention is in some aspects comparable with conventional adhesive tapes, that is to say adhesive tapes provided with pressuresensitive adhesive compounds, differs from it, however, especially by its reactive adhesive compound and the significantly higher achievable adhesive bonding end strengths.
- the outer layer of the adhesive system according to the invention reacts with water (vapor) from the environment after the final application and in the process cures with the formation of high bond strengths.
- Assembly bonds within the meaning of the present invention have bond strengths of 0.5 MPa and more, in particular of at least 0.7 MPa or of at least 0.8 MPa, and can reach the level of structural bonds.
- the adhesive system according to the invention comprises a carrier layer which contains at least one silicone and at least one filler.
- the silicone of the carrier layer is preferably a polydiorganosiloxane, more preferably a polydimethylsiloxane.
- the silicone of the carrier layer is preferably crosslinked, more preferably chemically crosslinked.
- the silicone of the carrier layer is a chemically crosslinked polydiorganosiloxane, more preferably a chemically crosslinked polydimethylsiloxane.
- “Chemically crosslinked” means that between at least some macromolecules of the silicone linking has taken place with the formation of chemical bonds, which is expressed in an increased cohesion compared to the uncrosslinked macromolecules present next to one another.
- the chemical linking may occur, in principle, via a known auxiliary substance and/or an initial reaction of individual macromolecules with one another.
- Ongoing crosslinking is accompanied by a noticeable change in relevant properties, such as, for example, the cohesion of the respective layer. It is crucial that the ongoing crosslinking and the associated changes in properties take place to a technically perceptible and relevant extent.
- the carrier layer of the adhesive system according to the invention is preferably completely crosslinked.
- the silicone of the carrier layer is a polydimethylsiloxane elastomer, that is to say it has rubber-like properties.
- the carrier layer in one embodiment, can be obtained by
- composition comprising o at least one polydiorganosiloxane which has at least two terminal ethylenically unsaturated groups, o at least one compound which has at least two Si-H groups, o at least one catalyst for the reaction of the Si-H groups with the ethylenically unsaturated groups; and o at least one filler;
- the ethylenically unsaturated terminal groups are preferably vinyl groups.
- the filler is preferably selected from calcium carbonate and silicon dioxide.
- the compound having at least two Si-H groups is preferably a Si-H-functionalized polydimethylsiloxane with a low molar mass.
- the catalyst is preferably a platinum catalyst, in particular a Karstedt catalyst.
- the mixture obtained is preferably shaped into a layer continuously, in particular by passing through an extruder with a nozzle or a calender.
- the curing of the layer takes place preferably by means of supply of heat and in particular by exposing the layer to a temperature of > 100 °C, more preferably > 120 °C, in particular > 140 °C for at least 1 min, in particular for at least 2 min.
- the carrier can be obtained by:
- composition comprising o at least one polydiorganosiloxane, o at least one peroxide compound; and o at least one filler;
- the polydiorganosiloxane preferably has at least one terminal ethylenically unsaturated group, more preferably at least one terminal vinyl group.
- the filler is preferably selected from calcium carbonate and silicon dioxide.
- the mixture obtained is preferably shaped into a layer by passing through an extruder or a calender.
- the curing of the layer takes place preferably by exposing the layer to a temperature of > 100 °C, more preferably > 120 °C, in particular > 140 °C for at least 1 min, in particular for at least 2 min.
- the resulting layer can be used directly as a carrier of the adhesive system according to the invention; preferably, however, it is subjected to a further drying at at least 180 °C, particularly preferably at at least 200 °C for at least 1 h.
- the carrier layer can be obtained by
- composition comprising o at least one OH-terminated polydiorganosiloxane, at least one crosslinker which has at least three hydrolyzable functional groups, at least one condensation catalyst; and o at least one filler, and
- the polydiorganosiloxane preferably has an OH group at both ends.
- the number average molecular weight Mn of the OH-terminated polydiorganosiloxane in this embodiment is preferably 50,000 to 200,000 g/mol, more preferably 90,000 to 150,000 g/mol, in particular 100,000 to 140,000 g/mol.
- the filler is preferably selected from calcium carbonate and silicon dioxide; in addition, inorganic fillers functionalized with adhesion-promoting silanes can also be used.
- composition to be mixed and thus also the carrier layer can each contain one or more adhesion promoters, pigments and/or drying agents.
- adhesion promoter and drying agent preferably each comprise a silane.
- the shaping of the mixture obtained into a layer is carried out, for example, by passing through a calender, but can also be carried out in other ways.
- the composition to be mixed comprises, in addition to the components described so far, preferably at least one plasticizer, particularly preferably an unfunctionalized polydimethylsiloxane.
- the plasticizer - if present - is of course also part of the finished carrier layer.
- the adhesive system according to the invention contains at least one chemically precrosslinked outer layer which can be further crosslinked with moisture, comprising at least one polymer with at least two terminal silyl groups according to formula (1)
- radicals R 1 independently of one another represent an alkyl, alkenyl or aryl group or a hydrogen atom
- the outer layer Due to its pre-crosslinking or - synonymously - partial crosslinking, the outer layer essentially retains its shape and dimensions when applied to a substrate without any major external influence.
- the outer layer although already pre-crosslinked, can be further crosslinked by moisture, for example air humidity, in that the silyl groups are hydrolyzed and the resulting Si-OH groups condense with other Si-OH or hydrolyzable groups of two or more macromolecules. “Chemically pre-crosslinked” thus means that the maximum possible degree of crosslinking of the macromolecules present in the outer layer has not yet been reached, but rather a more extensive linking of the macromolecules with one another can take place to such an extent that this further linking leads to technical relevant changes in properties of the outer layer.
- the extent of crosslinking of the outer layer determines, inter alia, the ratio of loss modulus (G") and storage modulus (G'), referred to as tan 6.
- G loss modulus
- G' storage modulus
- the ratio of loss modulus (G") and storage modulus (G') (tan 6) of the outer layer of the adhesive system according to the invention is at least twice as great, more preferably at least 2.5 times as great and in particular at least 3 times as great as the minimum tan 0 that is achievable for this layer under otherwise identical conditions.
- the layer is only crosslinked to a certain extent and, under the influence of moisture, would further crosslink up to the tan 6 minimum that it can achieve. If the outer layer is protected from the ingress of moisture until it is applied, it has a significant viscous fluidity immediately thereafter; the layer can therefore flow onto a substrate to a certain extent and thus wet it.
- the outer layer of the adhesive system according to the invention therefore has a so-called “tack”, which ensures that, at its initial use, it has pressure-sensitive adhesive properties and accordingly, advantageously, can be used similar to a pressure-sensitive adhesive compound.
- the outer layer of the adhesive system according to the invention applied on material surfaces customary in industry builds up a degree of adhesivity typical of pressuresensitive adhesives. Nevertheless, it should not be referred to as a “pressure-sensitive adhesive”.
- the adhesion built up can be significantly less than in the case of typical pressure-sensitive adhesive compounds; on the other hand, a pressuresensitive adhesive compound has permanent tack, while the outer layer of the adhesive system according to the invention largely loses its inherent tack, which is present in the pre-crosslinked state, as a result of further crosslinking, without, however, losing the adhesion to the substrates that was established before further crosslinking.
- “Further crosslinkable with moisture” is understood to mean that the chemically precrosslinked outer layer can (further) crosslink under the action of water, in particular only under the action of air humidity, with the formation of chemical bonds, which leads to a further build-up of cohesion within the layer to a technically relevant extent compared to the pre-crosslinked state.
- the outer layer of the adhesive system according to the invention is at least sufficiently dimensionally stable so that it does not flow out or is not squeezed out when it is rolled up or wound up into a roll or spool.
- the outer layer of the adhesive system according to the invention also has sufficient dimensional stability for its intended use, in particular for application to a substrate to be bonded and its subsequent bonding.
- the adhesive system according to the invention can therefore be applied under a pressure that is customary for pressure-sensitive adhesive tapes, without a disruptive flow of the outer layer adversely affecting the adhesive performance.
- the adhesive system according to the invention may be referred to as a structural adhesive tape or as an adhesive tape for producing structural bonds, if one were to disregard the use of pressure-sensitive adhesive compounds, which is per se defined for adhesive tapes.
- the outer layer in the partially crosslinked state has a range of properties similar to a pressure-sensitive adhesive compound, but largely loses them, as already explained, with its final curing.
- the outer layer comprises at least one polymer with at least two terminal silyl groups according to formula (1).
- radicals R 2 according to formula (1) which can be cleaved off with water are preferably selected independently of one another from the group consisting of alkoxy, acyloxy, amino, enoxy and ketoxime groups; they are particularly preferably selected independently of one another from the group consisting of methoxy, ethoxy, methyl ethyl ketoxime and methyl isobutyl ketoxime groups.
- variable b according to formula (1) is preferably 2 or 3, in particular 3.
- radicals R 1 according to formula (1) are preferably selected from the group consisting of methyl, ethyl, phenyl and vinyl groups.
- the terminal silyl groups according to formula (1) are preferably selected independently of one another from the group consisting of vinyldimethoxysilyl, vinyldiethoxysilyl, methyldimethoxysilyl, methyldiethoxysilyl, trimethoxysilyl, triethoxysilyl, methylbis(methylethylketoxime)silyl, tris(methylethylketoxime)silyl, tris(methylethylketoxime)silyl, vinylbis(methylethylketoxime)silyl, vinylbis(methylisobutylketoxime)silyl, methylbis(methylisobutylketoxime)silyl and tris(methylisobutylketoxime)silyl groups.
- Polsii The basic structure of the polymer with at least two terminal silyl groups according to formula (1) (hereinafter also: Polsii) is preferably selected from the group consisting of polyethers, polyurethanes, polysiloxanes, polyureas, polyacrylates, polyolefins and polyesters and copolymers of these.
- Polymer Polsii is particularly preferably an organopolysiloxane, in particular an organopolysiloxane based on siloxane units according to formula (2)
- radicals R" independently of one another represent an alkyl, alkenyl, aryl, alkoxy or ketoxime group or a hydrogen atom;
- radicals R' independently of one another represent alkyl, aryl or alkenyl radicals
- Formula (2) is not a structural formula and in this respect only reflects the composition of the organopolysiloxane from the siloxane units, but not their interconnection with one another.
- the outer layer of the adhesive system according to the invention can be obtained by
- composition comprising:
- the mixture obtained is preferably shaped into a layer by means of a calender, knife coating or nozzle coating, particularly preferably by means of a calender or nozzle coating, in particular by means of a calender.
- the mixture obtained is shaped by means of a slot nozzle and a calender; the mixture can be predistributed across the width by means of the slot nozzle and finally adjusted to the desired layer thickness in the calender, optionally with further distribution across the width.
- unevenness in the shaped compound can also be minimized or eliminated in the calender.
- polymer Poll or the entirety of all polymers Poll contained in the composition to be mixed is 35 to 55% by weight, in particular 40 to 50% by weight, each based on the total weight of the composition to be mixed.
- polymer Pol2 or the entirety of all polymers Pol2 contained in the composition to be mixed is 5 to 25% by weight, in particular 10 to 20% by weight, each based on the total weight of the composition to be mixed.
- the organosilane and/or the organooligosiloxane or the entirety of all organosilanes and/or organooligosiloxanes contained in the composition to be mixed is preferably 0.5 to 3% by weight, in particular 1 to 2% by weight, each based on the total weight of the composition to be mixed.
- polymer Poll is a polydiorganosiloxane according to formula (3)
- radicals R' have the meaning given for formula (2), m > 0 and R 1 , R 2 , a and b have the meaning according to formula (1).
- the radicals R' can be distributed over the polydiorganosiloxane in all conceivable and chemically possible constellations.
- polydimethylsiloxanes, poly(methylphenyl)siloxanes and poly(dimethylsiloxane/diphenylsiloxane) copolymers are known.
- the radicals R' in formula (3) preferably represent independently of one another methyl, ethyl or phenyl radicals.
- the polydiorganosiloxane according to formula (3) is particularly preferably a polydimethylsiloxane, a poly(methylphenyl)siloxane or a dimethylsiloxane-diphenylsiloxane copolymer, very particularly preferably a polydimethylsiloxane.
- Formula (3) is a structural formula, so it also shows the linkage of the siloxane units to one another.
- polymer Poll has a number average molecular weight M n (in accordance with the measuring method described herein) from 40,000 to 150,000 g/mol, more preferably from 80,000 to 120,000 g/mol.
- polymer Poll has a viscosity from 70 to 13 0 Pa-s, particularly preferably from 90 to 1 0 Pa-s (according to DIN 53019, plate-plate).
- polymer Pol2 is a polydiorganosiloxane according to formula (4)
- radicals R' have the meaning given for formula (2), m > 0 and radicals R 1 have the meaning according to formula (1).
- the radicals R' can be distributed over the polydiorganosiloxane in all conceivable and chemically possible constellations.
- polydimethylsiloxanes, poly(methylphenyl)siloxanes and poly(dimethylsiloxane/diphenylsiloxane) copolymers are known.
- the radicals R' in formula (4) preferably represent independently of one another methyl, ethyl or phenyl radicals.
- the polydiorganosiloxane according to formula (4) is particularly preferably a polydimethylsiloxane, a poly(methylphenyl)siloxane or a dimethylsiloxane-diphenylsiloxane copolymer, very particularly preferably a polydimethylsiloxane.
- Formula (4) is a structural formula, so it also shows the linkage of the siloxane units to one another.
- polymer Pol2 has a number average molecular weight Mn of 50,000 to 90,000 g/mol, more preferably from 60,000 to 85,000 g/mol. Also preferably, polymer Pol2 has a viscosity from 5 to 40 Pa-s, particularly preferably from 10 to 30 Pa-s.
- polymers Poll and Pol2 can be composed of the same or different monomers.
- polymer Pol2 is composed of the same monomers as polymer Poll , although the number of repeating units and consequently the molecular weight may differ.
- the composition to be mixed contains at least one organosilane or organooligosiloxane with at least three Si-bonded groups which can be cleaved off with water.
- an organosilane is used, it is particularly preferably selected from the group consisting of vinyltrimethoxysilane (VTMO), vinyltriethoxysilane (VTEO), methyltrimethoxysilane (MTMO), methyltriethoxysilane (MTEO), tetraethylorthosilicate (TEOS), tetramethylorthosilicate (TMOS), methyltris(methylethylketoxime)silane, tetra(methylethylketoxime)silane, vinyltris(methylethylketoxime)silane, methyltris(methylisobutylketoxime)silane, vinyltris(methylisobutylketoxime)silane und tetra(methylisobutylketoxime)s
- polymer Poll or the entirety of all polymers Poll is present preferably in an amount of 30 to 60% by weight, more preferably 35 to 55% by weight, each based on the total weight of the composition.
- polymer Pol2 or the entirety of all polymers Pol2 is present preferably in an amount of 5 to 30% by weight, more preferably 8 to 20% by weight, each based on the total weight of the composition.
- the weight ratio of the entirety of all polymers Poll to the entirety of all polymers Pol2 is 5 : 1 to 10 : 1.
- the organosilane or organooligosiloxane or the entirety of all organosilanes and organooligosiloxanes each having at least three Si-bonded groups which can be cleaved off with water is present preferably in an amount of 0.5 to 3% by weight, more preferably 0.8 to 2.5% by weight, based in each case on the total weight of the composition.
- the mixing of the composition is preferably carried out in the absence of moisture.
- the outer layer of the adhesive system according to the invention or the composition to be mixed for producing it comprise at least one condensation catalyst.
- the condensation catalyst is preferably selected from the group consisting of tin, titanium, zinc, zirconium, phosphorus and bismuth compounds; in particular it is selected from the group consisting of tin organic, titanium organic, zinc organic, zirconium organic, bismuth organic compounds and organophosphorus compounds.
- the entirety of all the condensation catalysts contained is preferably 0.01 to 1 % by weight, particularly preferably 0.03 to 0.3% by weight, each based on the total weight of the outer layer or the composition.
- the outer layer like the composition to be mixed for its production, preferably comprises at least one filler.
- the filler is selected from the group consisting of CaCOs, pyrogenic silica, precipitated silica, AI(OH)s and boronitride.
- all of the fillers listed can be surface-hydrophobized; for example, chalk has been rendered hydrophobic with fatty acids, for example stearic acid, and the silicas have preferably been rendered hydrophobic with silanes.
- the entirety of all fillers contained in the outer layer or in the composition to be mixed is preferably 20 to 80% by weight, particularly preferably 30 to 60% by weight, based in each case on the total weight of the outer layer or the composition to be mixed.
- the outer layer or the composition to be mixed for its production comprises at least one chalk.
- the chalk can be functionalized or unfunctionalized, one or more chalks can be contained.
- chalk contained in the outer layer or in the composition to be mixed is present in total in an amount of at most 60% by weight, based on the total weight of the outer layer or the composition to be mixed, more preferably 20 to 55% by weight, in particular 25 to 40% by weight.
- the outer layer or the composition to be mixed can comprise one or more adhesion promoters.
- the adhesion promoter is preferably selected from aminoalkylalkoxysilanes, methylaminoalkylalkoxysilanes, ethylenediamine-based alkoxysilanes, triethyleneamine- based alkoxysilanes and epoxyalkylalkoxysilanes.
- the adhesion promoter is selected from aminopropylalkoxysilanes and glycidyloxypropylalkoxysilanes; particularly preferably it is selected from aminopropyltriethoxysilane (AMEO) and glycidyloxypropyltriethoxysilane (GLYEO).
- the entirety of all adhesion promoters contained in the outer layer or in the composition to be mixed is preferably 0.1 to 2% by weight, particularly preferably 0.5 to 1.5% by weight, each based on the total weight of the outer layer or the composition to be mixed.
- the outer layer or the composition to be mixed can comprise one or more plasticizers.
- the plasticizer is preferably a trimethylsilyl-terminated polydiorganosiloxane or a mixture of trimethylsilyl-terminated polydiorganosiloxanes with different chain lengths; particularly preferably it is a trimethylsilyl-terminated PDMS or a mixture of trimethylsilyl- terminated PDMS with different chain lengths.
- the outer layer or the composition to be mixed contains, as plasticizer, a combination of one or more of the aforementioned PDMS fluids and one or more plasticizers selected from the group consisting of mineral oil plasticizers, in particular n-paraffins, iso-paraffins and naphthenes; linear or branched, saturated or monounsaturated hydrocarbons with at least 12 carbon aromas; and alkylbenzenes, especially polyalkylbenzenes.
- plasticizers selected from the group consisting of mineral oil plasticizers, in particular n-paraffins, iso-paraffins and naphthenes; linear or branched, saturated or monounsaturated hydrocarbons with at least 12 carbon aromas; and alkylbenzenes, especially polyalkylbenzenes.
- the outer layer or the composition to be mixed can furthermore also comprise pigments and/or drying agents.
- Silanes, metal oxides or orthoesters are preferably contained as drying agents.
- the invention also provides a method for producing an adhesive system according to the invention, comprising a. mixing a composition comprising:
- radicals R 1 independently of one another represent an alkyl, alkenyl or aryl group or a hydrogen atom
- step b applying the mixture obtained from step a) to a carrier layer which contains at least one silicone and at least one filler; and c. storing the composite obtained in this way in the absence of moisture.
- step a) For the composition of step a) and the carrier layer, the embodiments, preferred features, etc. described hereinabove apply without limitation. Mixing of the components in step a) is preferably carried out under exclusion of moisture.
- the carrier layer is physically pretreated before coating with the mixture obtained from a), in particular it is pretreated with a plasma.
- a pretreatment can improve the anchoring of the mixture obtained from a) on the carrier layer.
- the application of the mixture obtained from a) on the carrier layer may, in principle, be carried out by means of lamination of the mixture that has already been shaped into a layer, or continuously.
- the mixture obtained from a) is preferably applied to the carrier layer by means of a calender, a nozzle coating or a combination of a slot nozzle coating and a calender.
- the composite obtained from steps a) and b) is stored in the absence of moisture preferably for at least 5 min, more preferably for at least 10 min.
- This step enables the pre-crosslinking of the outer layer, as a result of which it builds up sufficient cohesion so that, for example, a release liner can be peeled off and the composite of carrier and outer layer can be converted.
- the adhesive system according to the invention preferably comprises an outer layer as described above on each of the main sides of the carrier layer, so that the adhesive system can be used in a manner similar to a double-sided adhesive tape.
- the structure according to the invention comprising the carrier layer and the outer layer has the effect that the outer layer cures very quickly after the adhesive system has been used; in particular, it cures faster than when it is used on its own, similar to adhesive transfer tape.
- the carrier layer due to its nature, has a high permeability for air humidity. The moisture required to crosslink the outer layer(s) could thus quickly diffuse through the carrier layer and be distributed over the entire width and depth of the outer layer(s).
- the adhesive system according to the invention has the advantage of a shorter curing time from the outset due to the precrosslinking of the outer layer(s).
- a sealant would not be sufficiently dimensionally stable to be applied to a carrier material and also to be able to remain there.
- a sealant could also not be applied with such precise positioning as the adhesive system according to the invention. Due to its pronounced tendency to flow, a sealant would also not be able to adequately fix the parts to be bonded from the start.
- the carrier layer of the adhesive system according to the invention can be provided with the chemically pre-crosslinked outer layer both on one side and on both sides.
- the two outer layers can be identical or different from one another both in terms of their composition and in terms of their dimensions - in particular in terms of their thickness.
- An asymmetrical structure of the adhesive system is therefore possible and can be advantageous especially in the case of different substrates to be connected, because the respective outer layer can be tailored specifically to the requirements of the respective substrate.
- the total thickness of the adhesive system according to the invention can be up to 10 mm, preferably up to 9 mm, more preferably up to 8 mm, for example up to 7 mm.
- the adhesive system according to the invention also accordingly differs from a conventional adhesive tape based on a pressure-sensitive adhesive with regard to its layer thickness.
- an adhesive system according to the invention for producing assembly bonds.
- an adhesive system according to the invention is suitable for producing bonds on all load-bearing substrates; the only exceptions are substrates with explicitly low-energy surfaces such as, for example, pure polyolefins or perfluorinated olefins.
- An adhesive system according to the invention is preferably used to produce bonds on metals, including on coated, in particular painted, metals; plastics; ceramics; mineral surfaces; glass; lacquers; silicone-based release surfaces; and fibers, for example textiles.
- An adhesive system according to the invention is particularly preferably used for producing bonds on metals, including on coated, in particular painted, metals; ceramics; mineral surfaces; glass and lacquers; especially on glass. It is very particularly preferred to use an adhesive system according to the invention for producing structural bonds when installing glass panes in frame elements (“structural glazing”).
- the substrates to be bonded can be provided with a primer to improve adhesion.
- composition thus obtained was applied by means of a doctor blade to a silicone rubber carrier material (Simple Seal®, Tremco, 10 x 5 cm, standard thickness 2 mm, other layer thicknesses used are listed in Table 2) with a layer thickness of 2.2 mm and covered with a polyethylene film.
- a silicone rubber carrier material Silicone Seal®, Tremco, 10 x 5 cm, standard thickness 2 mm, other layer thicknesses used are listed in Table 2
- the thus obtained multilayer composite with a thickness of 6.4 mm was stored for one day in a moisture-proof packaging at room temperature; thereafter, the polyethylene films could be pulled off easily.
- test substrates made of aluminum 6060 (7.6 x 2.5 x 0.5 cm) were treated once with a primer solution (TREMprime Silicon Porous Primer, Tremco Inc., in a weight ratio of primer : toluene 2 : 1).
- a melamine resin sponge was used for application. After application of the primer, the test substrates were kept in air to dry for 60 min.
- the above-prepared multilayer composite was taken out of the moisture-proof packaging and cut in strips of 5 x 1 .3 cm.
- the polyethylene film was removed from one side of the strip of the multilayer composite. Next, the now exposed side of one strip was applied in the middle and on the entire surface of the primer solution-treated side of an aluminum test substrate, wherein a bubble-free application was effected by rolling on the strip. Then, on the remaining side of the strip, the second polyethylene film was removed, and the primer- treated side of the second aluminum substrate was applied on the now exposed outer layer. In the resulting test specimen the two aluminum test substrates were plane- parallel to each other and were congruent along their dimensions (length and width).
- test specimens produced were stored at 23 °C and 50 % relative humidity (storage time is specified in the tables of results); from the beginning of storage, the test specimens were loaded with a weight of 600 g per sample, which - if the test specimens had been stored for that long at all - was removed after 48 hours.
- the testing of the samples was carried out using the tensile testing machine Z020 from Zwick/Roell.
- test specimen was placed in a bracket of the tensile testing machine free from tension, and the aluminum substrates could be pulled apart in the z-direction in a plane-parallel manner.
- the aluminum substrates were pulled apart with a test speed of 12.7 mm/min until failure of the bond. As a result, the maximum force at the corresponding elongation at break was determined.
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- Chemical & Material Sciences (AREA)
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Abstract
L'invention a pour but de fournir un système adhésif en forme de bande pour des applications d'assemblage qui peuvent être appliquées facilement et avec précision en position, puis développe rapidement une force adhésive qui est au moins suffisante pour fixer les pièces à assembler. À cet effet, l'invention concerne un système adhésif en forme de bande, comprenant • a) une couche de support contenant au moins une silicone et au moins une charge ; et • b) au moins une couche externe chimiquement pré-réticulée qui peut être encore réticulée avec de l'humidité, comprenant • au moins un polymère avec au moins deux groupes silyle terminaux selon la formule (1) Si(R1)a(R2)b (1), les radicaux R1 représentant indépendamment l'un de l'autre un alkyle, un alcényle ou un aryle ou un atome d'hydrogène, les radicaux R2 représentant indépendamment l'un de l'autre un groupe qui peut être clivé avec de l'eau, et b = 1, 2 ou 3 et a = 3-b ; et • au moins un catalyseur de condensation. L'invention a également pour objet un procédé de fabrication d'un système adhésif en forme de bande selon l'invention et l'utilisation d'un système adhésif en forme de bande selon l'invention en tant qu'adhésif dans la production de liaisons d'assemblage.
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US202163256657P | 2021-10-18 | 2021-10-18 | |
US63/256,657 | 2021-10-18 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007011538A2 (fr) | 2005-07-19 | 2007-01-25 | Dow Corning Corporation | Adhesifs par pression et procedes d'elaboration |
WO2007011540A1 (fr) | 2005-07-19 | 2007-01-25 | Dow Corning Corporation | Moyen de fixation de structures |
DE102010051274A1 (de) | 2010-11-12 | 2012-05-16 | Jörg Krüger | Siliconband zum elastischen Verschließen von Fugen |
WO2017191322A1 (fr) | 2016-05-06 | 2017-11-09 | Dow Corning Corporation | Procédé de collage de matériau à base de silicone sur un substrat |
EP3763795A1 (fr) * | 2019-07-08 | 2021-01-13 | tesa SE | Matière polymère à stabilité dimensionnelle, réticulable à l'humidité |
-
2022
- 2022-10-18 WO PCT/EP2022/078992 patent/WO2023066944A1/fr unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007011538A2 (fr) | 2005-07-19 | 2007-01-25 | Dow Corning Corporation | Adhesifs par pression et procedes d'elaboration |
WO2007011540A1 (fr) | 2005-07-19 | 2007-01-25 | Dow Corning Corporation | Moyen de fixation de structures |
DE102010051274A1 (de) | 2010-11-12 | 2012-05-16 | Jörg Krüger | Siliconband zum elastischen Verschließen von Fugen |
WO2017191322A1 (fr) | 2016-05-06 | 2017-11-09 | Dow Corning Corporation | Procédé de collage de matériau à base de silicone sur un substrat |
EP3763795A1 (fr) * | 2019-07-08 | 2021-01-13 | tesa SE | Matière polymère à stabilité dimensionnelle, réticulable à l'humidité |
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