WO2023036008A1

WO2023036008A1 - Camera module and electronic device

Info

Publication number: WO2023036008A1
Application number: PCT/CN2022/115627
Authority: WO
Inventors: 原帅; 李琛; 刘炎森; 夏太红; 张宪先; 翟羽佳
Original assignee: 荣耀终端有限公司
Priority date: 2021-09-10
Filing date: 2022-08-29
Publication date: 2023-03-16
Also published as: CN115802129A

Abstract

Provided are a camera module and an electronic device, which relate to the technical field of electronic devices and aim to solve the problem of poor heat dissipation when a camera module (30) achieves optical image stabilization and/or automatic focusing by means of motion of a photosensitive component (32). The camera module (30) comprises an optical lens (31), the photosensitive component (32), and a bottom plate (33). The photosensitive component (32) is located on a light-exit side of the optical lens (31), and a photosensitive face of the photosensitive component (32) faces the optical lens (31). The bottom plate (33) is located on the side of the photosensitive component (32) away from the optical lens (31), the bottom plate (33) is spaced apart from the photosensitive component (32), a heat-conducting liquid (36) is provided in a gap between the photosensitive component (32) and the bottom plate (33), and the photosensitive component (32) is thermally conductive to the bottom plate (33) by means of the heat-conducting liquid (36). The camera module (30) provided in the embodiments of the present application is used to take a photo or a video.

Description

一种摄像头模组和电子设备A camera module and electronic equipment

本申请要求于2021年09月10日提交国家知识产权局、申请号为202111064360.4、发明名称为“一种摄像头模组和电子设备”的中国专利申请的优先权，以及于2021年10月22日提交国家知识产权局、申请号为202111234239.1、发明名称为“一种摄像头模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with the application number 202111064360.4 and the title of the invention "a camera module and electronic equipment" submitted to the State Intellectual Property Office on September 10, 2021, and filed on October 22, 2021 The priority of the Chinese patent application with the application number 202111234239.1 and the title of the invention "a camera module and electronic device" submitted to the State Intellectual Property Office, the entire content of which is incorporated by reference in this application.

技术领域technical field

本申请涉及电子设备技术领域，尤其涉及一种摄像头模组和电子设备。The present application relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment.

背景技术Background technique

目前，手机、平板电脑、照相机、摄像机、智能眼镜等电子设备均具有摄像头模组，用于拍摄照片或视频。摄像头模组的散热性能是影响摄像头模组性能乃至电子设备整机性能的关键因素之一。在摄像头模组内，由于感光组件(也称为图像传感器)中感光芯片的功率较大，在运行时，感光组件的发热量较大，因此提高对感光组件的散热能力是提高摄像头模组的散热性能的关键。Currently, electronic devices such as mobile phones, tablet computers, cameras, video cameras, and smart glasses all have camera modules for taking photos or videos. The heat dissipation performance of the camera module is one of the key factors affecting the performance of the camera module and even the performance of the entire electronic device. In the camera module, due to the high power of the photosensitive chip in the photosensitive component (also called an image sensor), the photosensitive component generates a large amount of heat during operation, so improving the heat dissipation capacity of the photosensitive component is the key to improving the camera module. key to thermal performance.

现有技术中，一些摄像头模组通过感光组件的运动，来实现自动对焦(automatic focusing，AF)和/或光学防抖(optical image stabilization，OIS)。具体的，感光组件沿光学镜头的光轴方向移动，可以实现AF。感光组件沿感光面所处平面移动或者相对于光学镜头的光轴倾斜，可以实现OIS，该感光组件运动防抖技术也称为sensor-shift OIS技术或传感器偏移防抖技术，即通过移动图像传感器来达到防抖的目的。在此类摄像头模组内，为了不干涉感光组件的运动，感光组件通常悬置于摄像头模组内。这样，感光组件与摄像头模组的壳体之间由空气隔开。空气的导热系数低，只有0.0267瓦/(米·开尔文)，瓦/(米·开尔文)也即是W/m·K，远低于钢片、石墨片、导热硅脂等常规使用的散热材料。这就导致这类摄像头模组的散热性能差，摄像头模组乃至电子设备整机的性能低。In the prior art, some camera modules implement automatic focusing (automatic focusing, AF) and/or optical image stabilization (OIS) through the movement of photosensitive components. Specifically, the photosensitive component moves along the optical axis direction of the optical lens to realize AF. The photosensitive component moves along the plane where the photosensitive surface is located or tilts relative to the optical axis of the optical lens to achieve OIS. The photosensitive component motion anti-shake technology is also called sensor-shift OIS technology or sensor shift anti-shake technology, that is, by moving the image sensor to achieve the purpose of anti-shake. In this type of camera module, in order not to interfere with the movement of the photosensitive component, the photosensitive component is usually suspended in the camera module. In this way, the photosensitive component and the casing of the camera module are separated by air. The thermal conductivity of air is low, only 0.0267 W/(m·Kelvin), W/(m·Kelvin) is W/m·K, which is far lower than that of conventionally used heat dissipation materials such as steel sheets, graphite sheets, and thermal grease. . This leads to poor heat dissipation performance of this type of camera module, and low performance of the camera module and even the whole electronic device.

发明内容Contents of the invention

本申请实施例提供一种摄像头模组和电子设备，用于解决摄像头模组通过感光组件的运动来实现光学防抖和/或自动对焦时，散热性能差的问题。Embodiments of the present application provide a camera module and electronic equipment, which are used to solve the problem of poor heat dissipation when the camera module implements optical image stabilization and/or auto-focus through the movement of a photosensitive component.

为达到上述目的，本申请的实施例采用如下技术方案：In order to achieve the above object, the embodiments of the present application adopt the following technical solutions:

第一方面，提供了一种摄像头模组，该摄像头模组包括光学镜头、感光组件和底板。感光组件位于光学镜头的出光侧，且感光组件的感光面朝向光学镜头。底板位于感光组件的远离光学镜头的一侧，且底板与感光组件间隔设置，感光组件与底板之间的间隙内设有导热液体，感光组件借助导热液体与底板热导通。In a first aspect, a camera module is provided, and the camera module includes an optical lens, a photosensitive component and a bottom plate. The photosensitive component is located on the light emitting side of the optical lens, and the photosensitive surface of the photosensitive component faces the optical lens. The bottom plate is located on the side of the photosensitive component away from the optical lens, and the bottom plate and the photosensitive component are spaced apart. A heat-conducting liquid is provided in the gap between the photosensitive component and the bottom plate, and the photosensitive component is in thermal conduction with the bottom plate through the heat-conducting liquid.

本申请实施例提供的摄像头模组，由于导热液体在感光组件运动时呈液态，液态物质对感光组件的阻力较小，不会影响摄像头模组的AF和OIS功能。在此基础上，由于导热液体具有导热性能，因此借助该导热液体可以将感光组件的热量传导至底板，并进一步由底板传导至摄像头模组的外部，以实现散热。由此能够提高散热模组的散热性能，同时能够避免感光组件的热量向靠近光学镜头的方向传导至光学镜头内，从而避免影响光学镜头的光学性能，由此能够保证摄像头模组的拍摄清晰度。In the camera module provided by the embodiment of the present application, since the heat-conducting liquid is in a liquid state when the photosensitive component moves, the resistance of the liquid substance to the photosensitive component is small, and the AF and OIS functions of the camera module will not be affected. On this basis, since the heat-conducting liquid has heat-conducting properties, the heat of the photosensitive component can be conducted to the bottom plate by means of the heat-conducting liquid, and further conducted from the bottom plate to the outside of the camera module to realize heat dissipation. In this way, the heat dissipation performance of the heat dissipation module can be improved, and at the same time, the heat of the photosensitive component can be prevented from being transmitted to the optical lens in the direction close to the optical lens, thereby avoiding affecting the optical performance of the optical lens, thereby ensuring the shooting clarity of the camera module .

在第一方面的一种可能的实现方式中，导热液体的导热系数大于或者等于0.59W/m·K。这样，导热液体的导热系数较高，能够快速将感光组件的热量传导至底板，能够提高摄像头模组的散热性能。In a possible implementation manner of the first aspect, the thermal conductivity of the heat-conducting liquid is greater than or equal to 0.59 W/m·K. In this way, the thermal conductivity of the heat-conducting liquid is relatively high, which can quickly conduct the heat of the photosensitive component to the bottom plate, and can improve the heat dissipation performance of the camera module.

在第一方面的一种可能的实现方式中，导热液体的熔点大于或者等于-20℃，且小于或者等于50℃。这样，由于感光组件在运行时的温度可能达到50℃以上，因此在导热液体设置于感光组件与底板之间时，感光组件的运行温度高于导热液体的熔点的这段时间内，导热液体呈液态，无需加热或者冷却处理来使得导热液体呈液态。因此摄像头模组的成本较低。同时，由于导热液体的熔点大于或者等于-20℃，因此可以满足电子设备在大多数温度场景下的使用需求，成本较低。In a possible implementation manner of the first aspect, the melting point of the heat conducting liquid is greater than or equal to -20°C and less than or equal to 50°C. In this way, since the temperature of the photosensitive component may reach more than 50°C during operation, when the heat-conducting liquid is arranged between the photosensitive component and the bottom plate, the temperature of the photosensitive component is higher than the melting point of the heat-conducting liquid during this period of time. Liquid state, no heating or cooling process is required to make the heat transfer liquid liquid. Therefore, the cost of the camera module is relatively low. At the same time, since the melting point of the heat-conducting liquid is greater than or equal to -20°C, it can meet the use requirements of electronic equipment in most temperature scenarios, and the cost is low.

在第一方面的一种可能的实现方式中，导热液体为润滑油、导热油或者为含有镓、铟、锡、锌、银中的至少一种的液态金属。In a possible implementation manner of the first aspect, the heat conduction liquid is lubricating oil, heat conduction oil, or liquid metal containing at least one of gallium, indium, tin, zinc, and silver.

在第一方面的一种可能的实现方式中，导热液体为镓基液态金属。镓基液态金属的导热系数较高，能够快速将感光组件的热量传导至底板，能够提高摄像头模组的散热性能。同时镓基液态金属具有一定的生物兼容性，不会对人体造成损害，满足手机等消费电子领域产品的使用要求。In a possible implementation manner of the first aspect, the heat conducting liquid is gallium-based liquid metal. Gallium-based liquid metal has a high thermal conductivity, which can quickly transfer the heat of the photosensitive component to the bottom plate, and can improve the heat dissipation performance of the camera module. At the same time, gallium-based liquid metal has a certain degree of biocompatibility, will not cause damage to the human body, and meets the use requirements of mobile phones and other consumer electronics products.

在第一方面的一种可能的实现方式中，导热液体为镓铟锡液态合金。镓铟锡液态合金在20℃时的导热系数大于70W/m·K，能够快速将感光组件的热量传导至底板，提高摄像头模组的散热性能。In a possible implementation manner of the first aspect, the heat conducting liquid is a gallium indium tin liquid alloy. The thermal conductivity of gallium indium tin liquid alloy at 20°C is greater than 70W/m·K, which can quickly conduct the heat of the photosensitive component to the bottom plate and improve the heat dissipation performance of the camera module.

在第一方面的一种可能的实现方式中，导热液体的表面张力大于或者等于72dyn/cm。这样，导热液体36的表面张力较大，凝聚成团，不会向四周扩散，便于密封。In a possible implementation manner of the first aspect, the surface tension of the heat transfer liquid is greater than or equal to 72 dyn/cm. In this way, the surface tension of the heat-conducting liquid 36 is relatively high, and the heat-conducting liquid 36 is agglomerated into groups, and will not spread around, which is convenient for sealing.

在第一方面的一种可能的实现方式中，底板的靠近感光组件的表面设有挡墙，挡墙位于导热液体的***并沿导热液体的周向延伸。借助该挡墙，可以将导热液体密封在挡墙内，以实现对导热液体的密封。In a possible implementation manner of the first aspect, a retaining wall is provided on the surface of the bottom plate close to the photosensitive component, and the retaining wall is located at the periphery of the heat-conducting liquid and extends along the circumferential direction of the heat-conducting liquid. With the help of the retaining wall, the heat-conducting liquid can be sealed in the retaining wall, so as to realize the sealing of the heat-conducting liquid.

在第一方面的一种可能的实现方式中，挡墙包括第一挡墙。第一挡墙为环绕导热液体的***一周设置的凸棱。凸棱的结构简单，且不会破坏底板的结构强度。In a possible implementation manner of the first aspect, the retaining wall includes a first retaining wall. The first retaining wall is a rib provided around the periphery of the heat-conducting liquid. The convex rib has a simple structure and will not damage the structural strength of the bottom plate.

在第一方面的一种可能的实现方式中，底板的靠近感光组件的表面设有凹槽，导热液体设置于凹槽内，凹槽的侧壁形成第一挡墙。该第一挡墙未凸出底板外，能够防止对感光组件的运动造成干扰。In a possible implementation manner of the first aspect, a groove is provided on the surface of the bottom plate close to the photosensitive component, the heat-conducting liquid is disposed in the groove, and the sidewall of the groove forms a first retaining wall. The first retaining wall does not protrude out of the bottom plate, which can prevent interference with the movement of the photosensitive component.

在第一方面的一种可能的实现方式中，挡墙还包括第二挡墙，该第二挡墙设置于第一挡墙的***一周。这样，可以对导热液体进行二次密封，进一步增强对导热液体的密封效果。In a possible implementation manner of the first aspect, the retaining wall further includes a second retaining wall, and the second retaining wall is arranged around a periphery of the first retaining wall. In this way, secondary sealing can be performed on the heat-conducting liquid, further enhancing the sealing effect on the heat-conducting liquid.

在第一方面的一种可能的实现方式中，第二挡墙为设置于底板的靠近感光组件的表面上的凸棱，凸棱的远离底板的一端与感光组件连接，且凸棱由柔性材料制作。这样，第二挡墙、感光组件和底板围成封闭的腔体，并将导热液体密封于其内，能够有效密封导热液体，防止电子设备出现晃动、跌落等情况时导热液体泄露。In a possible implementation manner of the first aspect, the second retaining wall is a rib provided on the surface of the base plate close to the photosensitive component, the end of the rib away from the base plate is connected to the photosensitive component, and the rib is made of a flexible material make. In this way, the second retaining wall, the photosensitive component and the bottom plate form a closed cavity, and the heat-conducting liquid is sealed inside, which can effectively seal the heat-conducting liquid and prevent the heat-conducting liquid from leaking when the electronic equipment shakes or falls.

在第一方面的一种可能的实现方式中，凸棱由无影胶制作。摄像头模组还包括侧框。侧框设置于底板的边缘一周，且底板与侧框围成容纳空间，该容纳空间至少将感光组件容纳于内，侧框上设有透光窗口，透光窗口与第二挡墙相对。这样，第二挡墙、底板和感光组件的装配过程可以为：首先，在底板的表面设置无影胶水；然后，将感光组件放置于无影胶水上；最后，通过透光窗口向无影胶水照射UV光，以使无影胶水固化，由此得到第二挡墙。此装配操作简单，容易实现。In a possible implementation manner of the first aspect, the raised rib is made of shadowless glue. The camera module also includes side frames. The side frame is arranged around the edge of the bottom plate, and the bottom plate and the side frame enclose an accommodating space, the accommodating space accommodates at least the photosensitive component inside, and a light-transmitting window is arranged on the side frame, and the light-transmitting window is opposite to the second retaining wall. In this way, the assembly process of the second retaining wall, the bottom plate and the photosensitive component can be as follows: first, the shadowless glue is set on the surface of the bottom plate; then, the photosensitive component is placed on the shadowless glue; UV light is irradiated to cure the shadowless glue, thereby obtaining the second retaining wall. This assembly operation is simple and easy to realize.

在第一方面的一种可能的实现方式中，透光窗口为设置于侧框上的开口，开口处覆盖有盖体结构。盖体结构用于封堵该透光窗口，以起到防水防尘的作用。盖体结构可以为麦拉片、铜箔、焊接于侧框上的金属片或者涂设于透光窗口内的胶材。In a possible implementation manner of the first aspect, the light-transmitting window is an opening provided on the side frame, and the opening is covered with a cover structure. The cover structure is used to block the light-transmitting window to play the role of waterproof and dustproof. The cover structure can be Mylar sheet, copper foil, metal sheet welded on the side frame, or adhesive material coated in the light-transmitting window.

在第一方面的一种可能的实现方式中，感光组件的靠近底板的表面设有挡墙，挡墙位于导热液体的***并沿导热液体的周向延伸。借助该挡墙，可以将导热液体密封在挡墙内，以实现对导热液体的密封。In a possible implementation manner of the first aspect, a retaining wall is provided on the surface of the photosensitive component close to the bottom plate, and the retaining wall is located at the periphery of the heat-conducting liquid and extends along the circumferential direction of the heat-conducting liquid. With the help of the retaining wall, the heat-conducting liquid can be sealed in the retaining wall, so as to realize the sealing of the heat-conducting liquid.

在第一方面的一种可能的实现方式中，第二挡墙也可以设置至少一个断开部位，以使得第二挡墙内外空气空间连通，以实现内外的气压平衡。In a possible implementation manner of the first aspect, the second retaining wall may also be provided with at least one disconnection portion, so that the internal and external air spaces of the second retaining wall are communicated, so as to achieve air pressure balance inside and outside.

在第一方面的一种可能的实现方式中，底板的靠近感光组件的表面设有阻流槽，阻流槽位于导热液体的***并沿导热液体的周向延伸。由此借助阻流槽破坏底板表面的连续平整性。这样，导热液体在自身张力作用下难以跨越阻流槽进入阻流槽的***。由此避免导热液体由感光组件与底板之间的间隙移出。由于阻流槽未凸出底板外，能够防止对感光组件的运动造成干扰。In a possible implementation manner of the first aspect, a choke groove is provided on the surface of the bottom plate close to the photosensitive component, and the choke groove is located at the periphery of the heat transfer liquid and extends along the circumference of the heat transfer liquid. As a result, the continuous smoothness of the floor surface is disrupted by means of the baffle grooves. In this way, it is difficult for the heat-conducting liquid to cross the choke groove and enter the periphery of the choke groove under the action of its own tension. This prevents the thermally conductive liquid from moving out of the gap between the photosensitive component and the bottom plate. Since the choke groove does not protrude out of the bottom plate, it can prevent interference to the movement of the photosensitive component.

在第一方面的一种可能的实现方式中，阻流槽的数量为多个，多个阻流槽由内至外依次层叠设置。这样，可以对导热液体进行多次密封，以进一步避免导热液体由感光组件与底板之间的间隙移出。In a possible implementation manner of the first aspect, there are multiple choke slots, and the multiple choke slots are stacked sequentially from inside to outside. In this way, the heat-conducting liquid can be sealed multiple times to further prevent the heat-conducting liquid from moving out from the gap between the photosensitive component and the bottom plate.

在第一方面的一种可能的实现方式中，阻流槽的延伸路径为连续且封闭的曲线。这样，阻流槽可以对导热液体的周向上的各个位置进行密封，密封效果较优。In a possible implementation manner of the first aspect, the extension path of the choke groove is a continuous and closed curve. In this way, the choke groove can seal various positions in the circumferential direction of the heat-conducting liquid, and the sealing effect is better.

在第一方面的一种可能的实现方式中，阻流槽包括多个间隔设置的阻流槽段，且相邻两个阻流槽的阻流槽段在导热液体的周向上错位排列。由此能够在一定程度上保证底板的结构强度，同时能够保证对导热液体的阻流效果。In a possible implementation manner of the first aspect, the choke slots include a plurality of choke slot segments arranged at intervals, and the choke slot segments of two adjacent choke slots are arranged in a staggered manner in the circumferential direction of the heat transfer liquid. Therefore, the structural strength of the bottom plate can be guaranteed to a certain extent, and at the same time, the flow-blocking effect on the heat-conducting liquid can be guaranteed.

在第一方面的一种可能的实现方式中，底板上导热液体所处的表面区域为第一表面区域，阻流槽的与第一表面区域相接的内侧面为第一内侧面，第一表面区域与第一内侧面之间在阻流槽内侧的夹角大于或者等于30°。这样，阻流槽对导热液体的密封作用较优。在满足此条件下，阻流槽的截面形状可以为矩形，也可以为梯形，还可以为三角形。在此不做具体限定。In a possible implementation manner of the first aspect, the surface area where the heat transfer liquid is located on the bottom plate is the first surface area, the inner surface of the choke groove connected to the first surface area is the first inner surface, and the first The included angle between the surface area and the first inner side is greater than or equal to 30° at the inner side of the choke groove. In this way, the choke groove has a better sealing effect on the heat-conducting liquid. Under this condition, the cross-sectional shape of the choke groove can be rectangular, trapezoidal, or triangular. No specific limitation is made here.

在第一方面的一种可能的实现方式中，摄像头模组还包括驱动装置，驱动装置用于驱动感光组件相对于底板运动，以实现AF和/或OIS。In a possible implementation manner of the first aspect, the camera module further includes a driving device for driving the photosensitive component to move relative to the bottom plate, so as to realize AF and/or OIS.

在第一方面的一种可能的实现方式中，感光组件与底板的间距小于或者等于底板上的导热液体在自身表面张力作用下的自然高度的90％。这样能够保证感光组件在相对于底板运动的过程中，始终与导热液体接触进行热传导。In a possible implementation manner of the first aspect, the distance between the photosensitive component and the bottom plate is less than or equal to 90% of the natural height of the heat-conducting liquid on the bottom plate under its own surface tension. This can ensure that the photosensitive component is always in contact with the heat-conducting liquid for heat conduction during the movement relative to the base plate.

在第一方面的一种可能的实现方式中，感光组件的靠近底板的表面设有阻流槽，该阻流槽位于导热液体的***并沿该导热液体的周向延伸。这样，导热液体在自身张力作用下难以跨越阻流槽进入阻流槽的***。由此避免导热液体由感光组件与底板之间的间隙移出。由于阻流槽未凸出感光组件外，可以降低感光组件在运动过程中与底板之间产生碰撞的可能性。In a possible implementation manner of the first aspect, a choke groove is provided on the surface of the photosensitive component close to the bottom plate, and the choke groove is located at the periphery of the heat transfer liquid and extends along the circumference of the heat transfer liquid. In this way, it is difficult for the heat-conducting liquid to cross the choke groove and enter the periphery of the choke groove under the action of its own tension. This prevents the thermally conductive liquid from moving out of the gap between the photosensitive component and the bottom plate. Because the choke groove does not protrude out of the photosensitive component, the possibility of collision between the photosensitive component and the bottom plate during movement can be reduced.

第二方面，提供了一种电子设备，该电子设备包括屏幕、背壳、如上任一技术方案所述的摄像头模组和摄像头装饰盖。屏幕包括层叠设置的透光盖板和显示屏。背壳包括背盖和边框，背盖位于显示屏的远离透光盖板的一侧，并与透光盖板、显示屏层叠设置，背盖上设有安装口，边框位于背盖与透光盖板之间，透光盖板、背盖与边框围成内部容纳空间。摄像头模组设置于该内部容纳空间内。摄像头装饰盖覆盖并固定于安装口处，摄像头装饰盖上设有透光区域，该透光区域与摄像头模组的入光面相对。In a second aspect, an electronic device is provided, and the electronic device includes a screen, a back shell, a camera module as described in any one of the above technical solutions, and a camera decoration cover. The screen includes a light-transmitting cover plate and a display screen arranged in layers. The back shell includes a back cover and a frame. The back cover is located on the side of the display screen away from the light-transmitting cover, and is stacked with the light-transmitting cover and the display screen. Between the cover plates, the light-transmitting cover plate, the back cover and the frame enclose the inner accommodation space. The camera module is arranged in the inner accommodation space. The camera decorative cover covers and is fixed on the installation opening, and the camera decorative cover is provided with a light-transmitting area, and the light-transmitting area is opposite to the light-incident surface of the camera module.

由于本实施例提供的电子设备包括如上任一技术方案所述的摄像头模组，因此二者能够解决相同的技术问题，并达到相同的效果。Since the electronic device provided in this embodiment includes the camera module described in any one of the above technical solutions, the two can solve the same technical problem and achieve the same effect.

附图说明Description of drawings

图1为本申请一些实施例提供的电子设备的立体图；FIG. 1 is a perspective view of an electronic device provided by some embodiments of the present application;

图2为图1所示电子设备的***图；Figure 2 is an exploded view of the electronic device shown in Figure 1;

图3为本申请一些实施例提供的摄像头模组的部分结构示意图；FIG. 3 is a partial structural schematic diagram of a camera module provided by some embodiments of the present application;

图4为本申请一些实施例提供的摄像头模组的结构示意图；FIG. 4 is a schematic structural diagram of a camera module provided by some embodiments of the present application;

图5为本申请又一些实施例提供的摄像头模组的结构示意图；FIG. 5 is a schematic structural diagram of a camera module provided in some other embodiments of the present application;

图6为本申请又一些实施例提供的摄像头模组的结构示意图；FIG. 6 is a schematic structural diagram of a camera module provided in some other embodiments of the present application;

图7为本申请又一些实施例提供的摄像头模组的结构示意图；FIG. 7 is a schematic structural diagram of a camera module provided in some other embodiments of the present application;

图8为本申请又一些实施例提供的摄像头模组的部分结构示意图；FIG. 8 is a partial structural schematic diagram of a camera module provided in some other embodiments of the present application;

图9为本申请又一些实施例提供的摄像头模组的部分结构示意图；FIG. 9 is a partial structural schematic diagram of a camera module provided in some other embodiments of the present application;

图10为图9所示摄像头模组中底板的一种俯视图；Fig. 10 is a top view of the bottom plate in the camera module shown in Fig. 9;

图11为图9所示摄像头模组中底板的又一种俯视图；Fig. 11 is another top view of the bottom plate of the camera module shown in Fig. 9;

图12为本申请又一些实施例提供的摄像头模组的部分结构示意图；Fig. 12 is a partial structural schematic diagram of a camera module provided in some other embodiments of the present application;

图13为本申请又一些实施例提供的摄像头模组的部分结构示意图；Fig. 13 is a partial structural schematic diagram of a camera module provided in some other embodiments of the present application;

图14为本申请一些实施例提供的摄像头模组的装配过程结构示意图；其中，图14中的(a)为在底板的表面设置阻尼胶水后的结构示意图；图14中的(b)为将感光组件放置于阻尼胶水上后的结构示意图；图14中的(c)为对阻尼胶水进行固化处理时摄像头模组的结构示意图；Fig. 14 is a schematic structural diagram of the assembly process of the camera module provided by some embodiments of the present application; wherein, (a) in Fig. 14 is a schematic structural diagram after setting damping glue on the surface of the bottom plate; (b) in Fig. 14 is the Schematic diagram of the structure of the photosensitive component placed on the damping glue; (c) in Figure 14 is a schematic structural diagram of the camera module when the damping glue is cured;

图15为图14所示摄像头模组的装配过程流程图；Fig. 15 is a flow chart of the assembly process of the camera module shown in Fig. 14;

图16为本申请一些实施例提供的摄像头模组的壳体的结构示意图；FIG. 16 is a schematic structural diagram of a housing of a camera module provided in some embodiments of the present application;

图17为本申请又一些实施例提供的摄像头模组的壳体的结构示意图；Fig. 17 is a schematic structural diagram of a housing of a camera module provided in some other embodiments of the present application;

图18为本申请又一些实施例提供的摄像头模组的装配过程流程图；Fig. 18 is a flow chart of the assembly process of the camera module provided by some other embodiments of the present application;

图19为本申请又一些实施例提供的摄像头模组的结构示意图；Fig. 19 is a schematic structural diagram of a camera module provided in some other embodiments of the present application;

图20为本申请又一些实施例提供的摄像头模组的部分结构示意图；Fig. 20 is a partial structural schematic diagram of a camera module provided in some other embodiments of the present application;

图21为图20所示摄像头模组中底板的俯视图；Fig. 21 is a top view of the bottom plate in the camera module shown in Fig. 20;

图22为图20中区域I的局部放大图；Figure 22 is a partial enlarged view of area I in Figure 20;

图23为本申请一些实施例提供的摄像头模组中底板上不同的阻流槽的截面结构示意图；Fig. 23 is a schematic cross-sectional structure diagram of different choke grooves on the bottom plate of the camera module provided by some embodiments of the present application;

图24为本申请又一些实施例提供的摄像头模组中底板的俯视图；Fig. 24 is a top view of the bottom plate of the camera module provided in some other embodiments of the present application;

图25为本申请又一些实施例提供的摄像头模组中底板的俯视图；Fig. 25 is a top view of the bottom plate of the camera module provided in some other embodiments of the present application;

图26为本申请又一些实施例提供的摄像头模组中底板的俯视图。Fig. 26 is a top view of the bottom plate of the camera module provided by some other embodiments of the present application.

具体实施方式Detailed ways

在本申请实施例中，术语“第一”、“第二”、“第三”、“第四”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”、“第四”的特征可以明示或者隐含地包括一个或者更多个该特征。In this embodiment of the application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated The number of technical characteristics. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features.

在本申请实施例中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。In the embodiments of the present application, the term "comprising", "comprising" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes Including other elements not expressly listed, or also including elements inherent in such process, method, article or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.

在本申请实施例中，“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。In the embodiment of this application, "and/or" is just a kind of relationship describing the relationship between related objects, which means that there may be three kinds of relationships, for example, A and/or B, which can mean that A exists alone, and A and B exist at the same time. B, there are three situations of B alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.

本申请提供一种电子设备，该电子设备为具有拍摄功能的一类电子设备。具体的，该电子设备可以是便携式电子装置或其他合适的电子装置。例如，电子设备可以是手机、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、个人数码助理(personal digital assistant，PDA)、照相机、个人计算机、笔记本电脑、车载设备、可穿戴设备、增强现实(augmented reality，AR)眼镜、AR头盔、虚拟现实(virtual reality，VR)眼镜或者VR头盔等。The present application provides an electronic device, which is a type of electronic device with a shooting function. Specifically, the electronic device may be a portable electronic device or other suitable electronic devices. For example, an electronic device can be a cell phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, notebook computer, vehicle-mounted device, wearable device , augmented reality (augmented reality, AR) glasses, AR helmets, virtual reality (virtual reality, VR) glasses or VR helmets, etc.

请参阅图1和图2，图1为本申请一些实施例提供的电子设备100的立体图，图2为图1所示电子设备100的***图。在本实施例中，电子设备100为手机。电子设备100包括屏幕10、背壳20、摄像头模组30和摄像头装饰盖40。Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a perspective view of an electronic device 100 provided by some embodiments of the present application, and FIG. 2 is an exploded view of the electronic device 100 shown in FIG. 1 . In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a screen 10 , a back shell 20 , a camera module 30 and a camera decoration cover 40 .

可以理解的是，图1和图2仅示意性的示出了电子设备100包括的一些部件，这些部件的实际形状、实际大小、实际位置和实际构造不受图1和图2的限制。在其他一些示例中，电子设备100也可以不包括屏幕10和摄像头装饰盖40。It can be understood that FIG. 1 and FIG. 2 only schematically show some components included in the electronic device 100 , and the actual shape, actual size, actual position and actual configuration of these components are not limited by FIG. 1 and FIG. 2 . In some other examples, the electronic device 100 may not include the screen 10 and the camera decoration cover 40 .

屏幕10用于显示图像、视频等。屏幕10包括透光盖板11和显示屏12(英文名称：panel，也称为显示面板)。透光盖板11与显示屏12层叠设置。透光盖板11主要用于对显示屏12起到保护以及防尘作用。透光盖板11的材质包括但不限于玻璃。显示屏12可以采用柔性显示屏，也可以采用刚性显示屏。例如，显示屏12可以为有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，迷你发光二极管(mini organic light-emitting diode)显示屏，微型发光二极管(micro organic light-emitting diode)显示屏，微型有机发光二极管(micro organic light-emitting diode)显示屏，量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏，液晶显示屏(liquid crystal display，LCD)。The screen 10 is used to display images, videos, and the like. The screen 10 includes a light-transmitting cover plate 11 and a display screen 12 (English name: panel, also called a display panel). The transparent cover 11 and the display screen 12 are stacked. The light-transmitting cover plate 11 is mainly used for protecting and dustproofing the display screen 12 . The material of the transparent cover 11 includes but not limited to glass. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (organic light-emitting diode, OLED) display, an active matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED) Display, mini organic light-emitting diode display, micro organic light-emitting diode display, micro organic light-emitting diode display, quantum dot light-emitting diode (quantum dot light emitting diodes, QLED) display, liquid crystal display (liquid crystal display, LCD).

背壳20用于保护电子设备100的内部电子器件。背壳20包括背盖21和边框22。背盖21位于显示屏12远离透光盖板11的一侧，并与透光盖板11、显示屏12层叠设置。边框22位于背盖21与透光盖板11之间。且边框22固定于背盖21上。示例性的，边框22可以通过粘胶固定连接于背盖21上。边框22也可以与背盖21为一体成型结构，即边框22与背盖21为一个整体结构。透光盖板11通过胶粘固定于边框22上。透光盖板11、背盖21与边框22围成电子设备100的内部容纳空间。该内部容纳空间将显示屏12容纳在内。The back case 20 is used to protect internal electronic components of the electronic device 100 . The back shell 20 includes a back cover 21 and a frame 22 . The back cover 21 is located on the side of the display screen 12 away from the transparent cover 11 , and is stacked with the transparent cover 11 and the display 12 . The frame 22 is located between the back cover 21 and the transparent cover 11 . And the frame 22 is fixed on the back cover 21 . Exemplarily, the frame 22 can be fixedly connected to the back cover 21 by glue. The frame 22 can also be integrally formed with the back cover 21 , that is, the frame 22 and the back cover 21 form an integral structure. The transparent cover 11 is fixed on the frame 22 by glue. The light-transmitting cover 11 , the back cover 21 and the frame 22 enclose the interior space of the electronic device 100 . The inner accommodating space accommodates the display screen 12 .

为了方便下文描述，建立XYZ坐标系，定义电子设备100内透光盖板11、显示屏12、背盖21的层叠方向(也即是电子设备100的厚度方向)为Z轴方向。透光盖板11、显示屏12或者背盖21所处的平面为XY平面。具体的，电子设备100的宽度方向为X轴方向，电子设备100的长度方向为Y轴方向。可以理解的是，电子设备100的坐标系设置可以根据实际需要灵活设置。For the convenience of the following description, an XYZ coordinate system is established, and the lamination direction of the light-transmitting cover 11 , the display screen 12 , and the back cover 21 in the electronic device 100 (that is, the thickness direction of the electronic device 100 ) is defined as the Z-axis direction. The plane where the transparent cover 11 , the display screen 12 or the back cover 21 is located is the XY plane. Specifically, the width direction of the electronic device 100 is the X-axis direction, and the length direction of the electronic device 100 is the Y-axis direction. It can be understood that the setting of the coordinate system of the electronic device 100 can be flexibly set according to actual needs.

摄像头模组30用于拍摄照片/视频，摄像头模组30固定于电子设备100的内部容纳腔中。在一些实施例中，请参阅图2，电子设备100还包括中板23。中板23固定于边框22的内表面一周。示例的，中板23可以通过焊接固定于边框22上。中板23也可以与边框22为一体成型结构。中板23用作电子设备100的结构“骨架”，摄像头模组30可以通过螺纹连接、卡接、焊接等方式固定并支撑于该中板23上。在此基础上，可选的，中板23和边框22的材料均为高导热性材料。示例的，中板23和边框22的材料包括但不限于不锈钢、铝合金、镁铝合金等金属。中板23与边框22之间导热接触。摄像头模组30的热量可以传导至中板23，并进一步由中板23传导至边框22。边框22与电子设备100的外部空气环境接触，因此边框22的热量可以进一步散发至电子设备100的外部空气环境中。由此可以对摄像头模组30进行快速散热。同时金属的结构强度通常较优，能够保证中板23的支撑性能和边框22的结构强度。The camera module 30 is used to take photos/videos, and the camera module 30 is fixed in the inner cavity of the electronic device 100 . In some embodiments, please refer to FIG. 2 , the electronic device 100 further includes a middle board 23 . The middle plate 23 is fixed around the inner surface of the frame 22 . For example, the middle plate 23 can be fixed on the frame 22 by welding. The middle plate 23 can also be integrally formed with the frame 22 . The middle board 23 is used as a structural "skeleton" of the electronic device 100 , and the camera module 30 can be fixed and supported on the middle board 23 by means of screw connection, clamping, welding and the like. On this basis, optionally, the materials of the middle plate 23 and the frame 22 are high thermal conductivity materials. Exemplarily, the materials of the middle plate 23 and the frame 22 include but not limited to stainless steel, aluminum alloy, magnesium aluminum alloy and other metals. The middle plate 23 is in thermal contact with the frame 22 . The heat of the camera module 30 can be conducted to the middle board 23 , and further conducted to the frame 22 from the middle board 23 . The frame 22 is in contact with the external air environment of the electronic device 100 , so the heat of the frame 22 can be further dissipated into the external air environment of the electronic device 100 . In this way, the camera module 30 can be rapidly dissipated. At the same time, the structural strength of the metal is generally better, which can ensure the supporting performance of the middle plate 23 and the structural strength of the frame 22 .

在其他一些实施例中，摄像头模组30可以通过螺纹连接、卡接、焊接等方式固定于电子设备100的其他导热结构上。比如当背盖21或边框22的材料为金属等高导热材料时，摄像头模组30可以固定于背盖21或边框22上，以通过背盖21或边框22将热量传导至电子设备100的外部空气环境中。In some other embodiments, the camera module 30 may be fixed on other heat-conducting structures of the electronic device 100 through screw connection, clamping, welding and other methods. For example, when the material of the back cover 21 or the frame 22 is a high thermal conductivity material such as metal, the camera module 30 can be fixed on the back cover 21 or the frame 22, so as to conduct heat to the outside of the electronic device 100 through the back cover 21 or the frame 22 air environment.

摄像头模组30可以用作后置摄像头模组，也可以用作前置摄像头模组。The camera module 30 can be used as a rear camera module or as a front camera module.

在一些实施例中，请继续参阅图2，摄像头模组30固定于中板23靠近背盖21的表面。摄像头模组30的入光面朝向背盖21。背盖21上设有安装口50。摄像头装饰盖40覆盖并固定于安装口50处。摄像头装饰盖40用于保护摄像头模组30。一些实施例中，摄像头装饰盖40凸出至背盖21远离透光盖板11的一侧。这样，摄像头装饰盖40能够增加摄像头模组30在电子设备100内沿Z轴方向的安装空间。在另一些实施例中，摄像头装饰盖40也可以与背盖21平齐或者内凹至电子设备100的内部容纳空间内。摄像头装饰盖40上设有透光区域41。透光区域41允许景物光线L1透过，并射入摄像头模组30的入光面。在本实施例中，摄像头模组30用作电子设备100的后置摄像头模组。具体的，摄像头模组30可以用作后置的主摄像头模组、广角摄像头模组或者长焦摄像头模组。In some embodiments, please continue to refer to FIG. 2 , the camera module 30 is fixed on the surface of the middle board 23 close to the back cover 21 . The incident surface of the camera module 30 faces the back cover 21 . The back cover 21 is provided with an installation opening 50 . The camera head decoration cover 40 covers and is fixed on the installation opening 50 . The camera decoration cover 40 is used to protect the camera module 30 . In some embodiments, the camera head decoration cover 40 protrudes to the side of the back cover 21 away from the transparent cover 11 . In this way, the camera decoration cover 40 can increase the installation space of the camera module 30 along the Z-axis in the electronic device 100 . In some other embodiments, the camera decoration cover 40 may also be flush with the back cover 21 or recessed into the inner accommodation space of the electronic device 100 . A light-transmitting area 41 is provided on the camera head decoration cover 40 . The light-transmitting area 41 allows the scene light L1 to pass through and enter the light-incident surface of the camera module 30 . In this embodiment, the camera module 30 is used as a rear camera module of the electronic device 100 . Specifically, the camera module 30 can be used as a rear main camera module, a wide-angle camera module or a telephoto camera module.

在其他一些实施例中，摄像头模组30也可以固定于中板23靠近透光盖板11的表面。摄像头模组30的入光面朝向透光盖板11。显示屏12上设有光路避让孔。该光路避让孔允许景物光线穿过透光盖板11后射入摄像头模组30的入光面。这样，摄像头模组30用作电子设备100的前置摄像头模组。In some other embodiments, the camera module 30 may also be fixed on the surface of the middle board 23 close to the transparent cover 11 . The light incident surface of the camera module 30 faces the transparent cover 11 . The display screen 12 is provided with an optical path avoidance hole. The light path escape hole allows the scene light to pass through the transparent cover plate 11 and enter the light incident surface of the camera module 30 . In this way, the camera module 30 is used as a front camera module of the electronic device 100 .

请参阅图3，图3为本申请一些实施例提供的摄像头模组30的部分结构示意图。摄像头模组30包括光学镜头31、感光组件32和底板33。Please refer to FIG. 3 . FIG. 3 is a partial structural diagram of the camera module 30 provided by some embodiments of the present application. The camera module 30 includes an optical lens 31 , a photosensitive component 32 and a bottom plate 33 .

光学镜头31用于对景物光线L1进行成像。在将该摄像头模组30应用于图1-图2所示电子设备100内时，光学镜头31的光轴O可以沿Z轴方向延伸，也可以沿平行于XY平面的方向延伸。当光学镜头31的光轴O沿Z轴方向延伸时，该摄像头模组30为直立式摄像头模组。当光学镜头31的光轴O沿平行于XY平面的方向延伸时，该摄像头模组30为潜望式摄像头模组。图3所示实施例以及下文各实施例均是基于摄像头模组30为直立式摄像头模组的基础上进行的说明，这并不能认为是对本申请构成的特殊限制。The optical lens 31 is used to image the scene light L1. When the camera module 30 is applied in the electronic device 100 shown in FIGS. 1-2 , the optical axis O of the optical lens 31 may extend along the Z-axis direction, or extend along the direction parallel to the XY plane. When the optical axis O of the optical lens 31 extends along the Z axis, the camera module 30 is a vertical camera module. When the optical axis O of the optical lens 31 extends parallel to the XY plane, the camera module 30 is a periscope camera module. The embodiment shown in FIG. 3 and the following embodiments are all described on the basis that the camera module 30 is an upright camera module, which should not be regarded as a special limitation to the present application.

感光组件32位于光学镜头31的出光侧，景物光线L1经过光学镜头31成像之后生成成像光束L2，该成像光束L2射入感光组件32，并由感光组件32将图像信号转换成电信号输出。其中，感光组件32包括电路板321和感光芯片322。感光芯片322设置于电路板321靠近光学镜头31的表面。在其他一些实施例中，电路板321上设有安装口，感光芯片322嵌设于该安装口内。感光芯片322具有感光面，该感光面朝向光学镜头31。可选的，请继续参阅图3，感光组件32除了包括电路板321和感光芯片322之外，还包括加强板323。加强板323设置于电路板321的远离光学镜头31的一侧，并与电路板321层叠并固定在一起。加强板323用于增加感光组件32的结构强度。在其他一些实施例中，也可以不设置该加强板323。感光组件32能够沿光学镜头31的光轴O向靠近或者远离光学镜头31的方向移动，以实现自动对焦(automatic focusing，AF)；和/或，感光组件32能够在XY平面内移动或者相对于光学镜头31的光轴O倾斜，以实现光学防抖(optical image stabilization，OIS)。用于驱动感光组件32运动，以实现AF和/或OIS的结构可以为形状记忆合金(shape memory alloy，SMA)马达或者音圈马达等等，在此不做具体限定。The photosensitive component 32 is located on the light-emitting side of the optical lens 31. After the scene light L1 is imaged by the optical lens 31, an imaging beam L2 is generated. The imaging beam L2 enters the photosensitive component 32, and the photosensitive component 32 converts the image signal into an electrical signal for output. Wherein, the photosensitive component 32 includes a circuit board 321 and a photosensitive chip 322 . The photosensitive chip 322 is disposed on the surface of the circuit board 321 close to the optical lens 31 . In some other embodiments, the circuit board 321 is provided with an installation opening, and the photosensitive chip 322 is embedded in the installation opening. The photosensitive chip 322 has a photosensitive surface facing the optical lens 31 . Optionally, please continue to refer to FIG. 3 , the photosensitive assembly 32 includes a reinforcing plate 323 in addition to the circuit board 321 and the photosensitive chip 322 . The reinforcing plate 323 is disposed on a side of the circuit board 321 away from the optical lens 31 , and is stacked and fixed with the circuit board 321 . The reinforcing plate 323 is used to increase the structural strength of the photosensitive assembly 32 . In some other embodiments, the reinforcing plate 323 may not be provided. The photosensitive assembly 32 can move toward or away from the direction of the optical lens 31 along the optical axis O of the optical lens 31, so as to realize automatic focusing (automatic focusing, AF); and/or, the photosensitive assembly 32 can move in the XY plane or relative to The optical axis O of the optical lens 31 is tilted to achieve optical image stabilization (OIS). The structure for driving the photosensitive assembly 32 to realize AF and/or OIS may be a shape memory alloy (shape memory alloy, SMA) motor or a voice coil motor, etc., which are not specifically limited herein.

底板33位于感光组件32的远离光学镜头31的一侧。底板33用作摄像头模组30的底部保护板，对感光组件32起到防护作用，防止外物由摄像头模组30的底部侵入而干涉感光组件32的AF和/或OIS运动，同时防止水分、灰尘由摄像头模组30的底部进入感光组件32而引起短路、生锈等问题。The bottom plate 33 is located on a side of the photosensitive assembly 32 away from the optical lens 31 . The bottom plate 33 is used as the bottom protection plate of the camera module 30, which protects the photosensitive component 32, prevents foreign objects from intruding from the bottom of the camera module 30 and interferes with the AF and/or OIS movement of the photosensitive component 32, and prevents moisture, Dust enters the photosensitive component 32 from the bottom of the camera module 30 and causes problems such as short circuit and rust.

需要说明的是，图3仅给出了摄像头模组30的部分结构示意图，该摄像头模组30的具体结构包括但不限于以下四种。It should be noted that FIG. 3 only shows a partial structural diagram of the camera module 30 , and the specific structures of the camera module 30 include but are not limited to the following four.

第一种具体结构：请参阅图4，图4为本申请一些实施例提供的摄像头模组30的结构示意图。本实施例中，摄像头模组30除了包括光学镜头31、感光组件32和底板33之外，还包括侧框34和支架35。侧框34围绕底板33的边缘一周设置，侧框34与底板33共同形成摄像头模组30的壳体。侧框34与底板33可以一体成型，也可以分体制作并装配在一起，在此不作具体限定。光学镜头31和感光组件32设置于该壳体内，且光学镜头31和感光组件32相对固定。在一些实施例中，光学镜头31、感光组件32均固定于支架35上，由此借助支架35实现了光学镜头31、感光组件32二者的相对固定。在其他一些实施例中，光学镜头31、感光组件32也可以直接固定在一起。光学镜头31、感光组件32和支架35组成的整体能够相对于壳体(包括底板33和侧框34)在XY平面内移动或者相对于光轴O倾斜，以实现OIS。本实施例所述的摄像头模组30仅具有OIS功能，能够在一定程度上保证拍摄的清晰度。The first specific structure: please refer to FIG. 4 , which is a schematic structural diagram of the camera module 30 provided by some embodiments of the present application. In this embodiment, the camera module 30 includes a side frame 34 and a bracket 35 in addition to an optical lens 31 , a photosensitive component 32 and a bottom plate 33 . The side frame 34 is arranged around the edge of the bottom plate 33 , and the side frame 34 and the bottom plate 33 jointly form a casing of the camera module 30 . The side frame 34 and the bottom plate 33 can be integrally formed, or can be made separately and assembled together, which is not specifically limited here. The optical lens 31 and the photosensitive component 32 are arranged in the casing, and the optical lens 31 and the photosensitive component 32 are relatively fixed. In some embodiments, both the optical lens 31 and the photosensitive component 32 are fixed on the bracket 35 , so that the relative fixing of the optical lens 31 and the photosensitive component 32 is realized by means of the bracket 35 . In some other embodiments, the optical lens 31 and the photosensitive component 32 can also be directly fixed together. The whole composed of the optical lens 31 , the photosensitive assembly 32 and the support 35 can move in the XY plane relative to the housing (including the bottom plate 33 and the side frame 34 ) or tilt relative to the optical axis O to realize OIS. The camera module 30 described in this embodiment only has the OIS function, which can guarantee the clarity of shooting to a certain extent.

第二种具体结构：请参阅图5，图5为本申请又一些实施例提供的摄像头模组30的结构示意图。本实施例中，摄像头模组30除了包括光学镜头31、感光组件32和底板33之外，还包括侧框34和支架35。侧框34围绕底板33的边缘一周设置，侧框34与底板33共同形成摄像头模组30的壳体。光学镜头31和感光组件32设置于该壳体内，光学镜头31能够相对于感光组件32沿自身光轴O移动，以实现AF。具体的，光学镜头31设置于支架35内并能够相对于支架35沿自身光轴O移动，感光组件32固定于支架35上。由此借助支架35实现光学镜头31相对于感光组件32的AF运动。在此基础上，光学镜头31、感光组件32和支架35组成的整体能够相对于壳体(包括底板33和侧框34)在XY平面内移动或者相对于光轴O倾斜，以实现OIS。本实施例所述的摄像头模组30同时具有AF功能和OIS功能，拍摄的清晰度较优，性能较好。The second specific structure: please refer to FIG. 5 , which is a schematic structural diagram of a camera module 30 provided in some other embodiments of the present application. In this embodiment, the camera module 30 includes a side frame 34 and a bracket 35 in addition to an optical lens 31 , a photosensitive component 32 and a bottom plate 33 . The side frame 34 is arranged around the edge of the bottom plate 33 , and the side frame 34 and the bottom plate 33 jointly form a casing of the camera module 30 . The optical lens 31 and the photosensitive assembly 32 are disposed in the housing, and the optical lens 31 can move relative to the photosensitive assembly 32 along its own optical axis O to achieve AF. Specifically, the optical lens 31 is disposed in the bracket 35 and can move along its own optical axis O relative to the bracket 35 , and the photosensitive component 32 is fixed on the bracket 35 . Thus, the AF movement of the optical lens 31 relative to the photosensitive assembly 32 is realized by means of the bracket 35 . On this basis, the whole composed of the optical lens 31 , the photosensitive assembly 32 and the bracket 35 can move in the XY plane relative to the housing (including the bottom plate 33 and the side frame 34 ) or tilt relative to the optical axis O to realize OIS. The camera module 30 described in this embodiment has both the AF function and the OIS function, and the shooting resolution is better and the performance is better.

第三种具体结构：请参阅图6，图6为本申请又一些实施例提供的摄像头模组30的结构示意图。本实施例中，摄像头模组30除了包括光学镜头31、感光组件32和底板33之外，还包括侧框34。侧框34围绕底板33的边缘一周设置，侧框34与底板33共同形成感光组件32的壳体，侧框34的顶部围成通光孔341。光学镜头31设置于感光组件32的壳体外并固定于该壳体上。感光组件32设置于壳体内，光学镜头31成像之后生成的成像光束穿过通光孔341射入该感光组件32。感光组件32能够沿光学镜头31的光轴O的延伸方向移动，以实现AF；和/或，感光组件32能够相对于壳体在XY平面内移动或者相对于光学镜头31的光轴O倾斜，以实现OIS。本实施例所述的摄像头模组30具有AF功能和/或OIS功能，拍摄的清晰度较优，性能较好。The third specific structure: please refer to FIG. 6 , which is a schematic structural diagram of a camera module 30 provided in some other embodiments of the present application. In this embodiment, the camera module 30 includes a side frame 34 in addition to an optical lens 31 , a photosensitive component 32 and a bottom plate 33 . The side frame 34 is arranged around the edge of the bottom plate 33 , the side frame 34 and the bottom plate 33 together form the housing of the photosensitive assembly 32 , and the top of the side frame 34 encloses a light hole 341 . The optical lens 31 is disposed outside the casing of the photosensitive component 32 and fixed on the casing. The photosensitive component 32 is disposed in the casing, and the imaging light beam generated by the optical lens 31 is injected into the photosensitive component 32 through the light hole 341 . The photosensitive component 32 can move along the extension direction of the optical axis O of the optical lens 31 to achieve AF; and/or, the photosensitive component 32 can move in the XY plane relative to the housing or tilt relative to the optical axis O of the optical lens 31, To achieve OIS. The camera module 30 described in this embodiment has an AF function and/or an OIS function, and the shooting definition is better and the performance is better.

第四种具体结构：请参阅图7，图7为本申请又一些实施例提供的摄像头模组30的结构示意图。本实施例中，摄像头模组30除了包括光学镜头31、感光组件32和底板33之外，还包括侧框34和支架35。侧框34围绕底板33的边缘一周设置，侧框34与底板33共同形成感光组件32的壳体，侧框34的顶部围成通光孔341。光学镜头31设置于感光组件32的壳体外，并相对于该壳体沿自身光轴O移动，以实现AF。具体的，支架35位于感光组件32的壳体外并固定于该壳体上，光学镜头31能够相对于支架35沿自身光轴O移动，由此借助支架35实现光学镜头31相对于感光组件32的壳体的移动。支架35可以与感光组件32的壳体一体成型，也可以分体制作并装配在一起，在此不做具体限定。感光组件32设置于该壳体内，且感光组件32能够相对于该壳体在XY平面内移动或者相对于光学镜头31的光轴O倾斜，以实现OIS。本实施例所述的摄像头模组30同时具有AF功能和OIS功能，拍摄的清晰度较优，性能较好。The fourth specific structure: please refer to FIG. 7 , which is a schematic structural diagram of the camera module 30 provided by some other embodiments of the present application. In this embodiment, the camera module 30 includes a side frame 34 and a bracket 35 in addition to an optical lens 31 , a photosensitive component 32 and a bottom plate 33 . The side frame 34 is arranged around the edge of the bottom plate 33 , the side frame 34 and the bottom plate 33 together form the housing of the photosensitive assembly 32 , and the top of the side frame 34 encloses a light hole 341 . The optical lens 31 is disposed outside the casing of the photosensitive assembly 32 and moves relative to the casing along its own optical axis O to achieve AF. Specifically, the bracket 35 is located outside the housing of the photosensitive assembly 32 and is fixed on the housing, and the optical lens 31 can move relative to the bracket 35 along its own optical axis O, thereby realizing the positioning of the optical lens 31 relative to the photosensitive assembly 32 by means of the bracket 35 Movement of the housing. The bracket 35 can be integrally formed with the casing of the photosensitive assembly 32 , or can be made separately and assembled together, which is not specifically limited here. The photosensitive component 32 is disposed in the casing, and the photosensitive component 32 can move in the XY plane relative to the casing or tilt relative to the optical axis O of the optical lens 31 to realize OIS. The camera module 30 described in this embodiment has both the AF function and the OIS function, and the shooting resolution is better and the performance is better.

上述任一实施例所述的摄像头模组30均是通过感光组件32相对于底板33的运动，来实现AF和/或OIS。具体的，感光组件32相对于底板33的移动方式为沿光学镜头31的光轴O靠近或者远离底板33移动，或者相对于底板33在与底板33平行的平面(也即是XY平面)内移动，或者相对于底板33倾斜。上述任一实施例所述的摄像头模组30内，感光组件32的功率较大，发热量较大，因此需要将感光组件32的热量向远离光学镜头31的一侧传导至底板33上，并进一步经由该底板33传导至摄像头模组30的外部，以实现散热。由此能够提高摄像头模组30的散热性能，同时能够减小感光组件32向靠近光学镜头31的方向传导至光学镜头31的热量，从而避免影响光学镜头31的光学性能，由此能够保证摄像头模组30的拍摄清晰度。但是，为了避免干涉感光组件32的运动，请继续参阅图3或图4-图7中任一附图所示实施例，感光组件32悬置于摄像头模组30内，感光组件32与底板33之间由空气隔开。空气的导热系数低，只有0.0267W/m·K，远低于钢片、石墨片、导热硅脂等常规使用的散热材料。因此，摄像头模组30的散热性能差，摄像头模组以及包括该摄像头模组的电子设备的性能低。The camera module 30 described in any of the above embodiments implements AF and/or OIS through the movement of the photosensitive component 32 relative to the bottom plate 33 . Specifically, the photosensitive assembly 32 moves relative to the base plate 33 by moving closer to or away from the base plate 33 along the optical axis O of the optical lens 31, or moving relative to the base plate 33 in a plane parallel to the base plate 33 (that is, the XY plane). , or inclined relative to the bottom plate 33. In the camera module 30 described in any of the above-mentioned embodiments, the power of the photosensitive component 32 is relatively large, and the heat generated is relatively large. Therefore, it is necessary to transfer the heat of the photosensitive component 32 to the bottom plate 33 to the side away from the optical lens 31, and It is further conducted to the outside of the camera module 30 through the bottom plate 33 to realize heat dissipation. Thus, the heat dissipation performance of the camera module 30 can be improved, and at the same time, the heat that the photosensitive component 32 conducts to the optical lens 31 in a direction close to the optical lens 31 can be reduced, thereby avoiding affecting the optical performance of the optical lens 31, thereby ensuring that the camera module Group 30 shot sharpness. However, in order to avoid interfering with the movement of the photosensitive assembly 32, please continue to refer to the embodiment shown in any one of Fig. 3 or Fig. 4-Fig. separated by air. The thermal conductivity of air is low, only 0.0267W/m·K, which is far lower than conventionally used heat dissipation materials such as steel sheet, graphite sheet, and thermal grease. Therefore, the heat dissipation performance of the camera module 30 is poor, and the performance of the camera module and electronic equipment including the camera module is low.

为了解决上述问题，请参阅图8，图8为本申请又一些实施例提供的摄像头模组30的部分结构示意图。摄像头模组30包括光学镜头31、感光组件32和底板33，光学镜头31、感光组件32和底板33三者之间的具体装配结构包括但不限于图4-图7中任一附图所示实施例。除此之外，摄像头模组30还包括导热液体36。该导热液体36设置于感光组件32与底板33之间的间隙内，且感光组件32借助该导热液体36与底板33热导通。In order to solve the above problems, please refer to FIG. 8 , which is a partial structural diagram of a camera module 30 provided in some other embodiments of the present application. The camera module 30 includes an optical lens 31, a photosensitive assembly 32, and a base plate 33. The specific assembly structure between the optical lens 31, the photosensitive assembly 32, and the base plate 33 includes, but is not limited to, that shown in any one of Figures 4-7. Example. Besides, the camera module 30 also includes a heat conducting liquid 36 . The heat-conducting liquid 36 is disposed in the gap between the photosensitive component 32 and the bottom plate 33 , and the photosensitive component 32 is in thermal communication with the bottom plate 33 through the heat-conducting liquid 36 .

本申请实施例提供的摄像头模组30，由于导热液体36在感光组件32运动时呈液态，感光组件32移动时，导热液体36随之流动，液态物质对感光组件32的阻力较小，不会影响摄像头模组30的AF和OIS功能。在此基础上，由于导热液体36具有导热性能，因此借助该导热液体36可以将感光组件32的热量传导至底板33，并进一步由底板33传导至摄像头模组30的外部，以实现散热。由此能够提高散热模组30的散热性能，同时能够避免感光组件32的热量向靠近光学镜头31的方向传导至光学镜头31内，从而避免影响光学镜头31的光学性能，由此能够保证摄像头模组30的拍摄清晰度。In the camera module 30 provided in the embodiment of the present application, since the heat-conducting liquid 36 is in a liquid state when the photosensitive component 32 moves, when the photosensitive component 32 moves, the heat-conducting liquid 36 flows with it, and the resistance of the liquid substance to the photosensitive component 32 is small, so it will not Affects the AF and OIS functions of the camera module 30. On this basis, since the heat-conducting liquid 36 has heat-conducting properties, the heat of the photosensitive assembly 32 can be conducted to the bottom plate 33 by means of the heat-conducting liquid 36 , and further conducted to the outside of the camera module 30 from the bottom plate 33 to realize heat dissipation. Thus, the heat dissipation performance of the heat dissipation module 30 can be improved, and at the same time, the heat of the photosensitive component 32 can be prevented from being transmitted into the optical lens 31 in a direction close to the optical lens 31, thereby avoiding affecting the optical performance of the optical lens 31, thus ensuring that the camera module Group 30 shot sharpness.

导热液体36为导热性能较高的一类液体。具体的，该导热液体36为导热系数大于或者等于空气的导热系数(0.0267W/m·K)的一类液体。进一步的，该导热液体36为导热系数大于或者等于0.59W/m·K的一类液体。具体的，该导热液体36可以是润滑油、导热油等起导热作用的液态流体，也可以是含有镓、铟、锡、锌、银中至少一种成分的液态金属。在一些实施例中，导热液体36为镓基液态金属，镓基液态金属的导热系数较高，能够快速将感光组件32的热量传导至底板33，能够提高摄像头模组30的散热性能。同时镓基液态金属具有一定的生物兼容性，不会对人体造成损害，满足手机等消费电子领域产品的使用要求。示例的，该导热液体36为镓铟锡液态合金，镓铟锡液态合金在20℃时的导热系数大于70W/m·K，能够快速将感光组件32的热量传导至底板33，提高摄像头模组30的散热性能。The heat conduction liquid 36 is a type of liquid with high heat conduction performance. Specifically, the heat transfer liquid 36 is a type of liquid whose thermal conductivity is greater than or equal to that of air (0.0267 W/m·K). Further, the heat transfer liquid 36 is a type of liquid with a thermal conductivity greater than or equal to 0.59 W/m·K. Specifically, the heat-conducting liquid 36 may be a liquid fluid that conducts heat, such as lubricating oil, heat-conducting oil, or a liquid metal containing at least one of gallium, indium, tin, zinc, and silver. In some embodiments, the heat-conducting liquid 36 is gallium-based liquid metal, which has a high thermal conductivity and can quickly transfer heat from the photosensitive component 32 to the bottom plate 33 , thereby improving the heat dissipation performance of the camera module 30 . At the same time, gallium-based liquid metal has a certain degree of biocompatibility, will not cause damage to the human body, and meets the use requirements of mobile phones and other consumer electronics products. As an example, the heat conducting liquid 36 is a gallium indium tin liquid alloy. The thermal conductivity of the gallium indium tin liquid alloy at 20°C is greater than 70W/m·K, which can quickly transfer the heat of the photosensitive component 32 to the bottom plate 33, improving the camera module. 30 thermal performance.

为了使导热液体36在感光组件32运动时呈液态，导热液体36的熔点可以为任意值，当导热液体36设置于电子设备100中的摄像头模组30内且呈固态时，可以选择采用加热或者冷却等方式来使得导热液体36呈液态后，再驱动感光组件32运动以实现AF和/或OIS。在此基础上，为了保证导热液体36在感光组件32运动时呈液态，在一些实施例中，摄像头模组30还包括温度传感器，温度传感器用于检测导热液体36的温度，当导热液体36的温度大于导热液体36的熔点时，驱动感光组件32运动，以实现AF和/或OIS。In order to make the heat-conducting liquid 36 in a liquid state when the photosensitive component 32 moves, the melting point of the heat-conducting liquid 36 can be any value. After cooling the heat transfer liquid 36 into a liquid state, the photosensitive assembly 32 is driven to move to realize AF and/or OIS. On this basis, in order to ensure that the heat-conducting liquid 36 is in a liquid state when the photosensitive component 32 moves, in some embodiments, the camera module 30 further includes a temperature sensor, which is used to detect the temperature of the heat-conducting liquid 36, when the temperature of the heat-conducting liquid 36 When the temperature is higher than the melting point of the heat conducting liquid 36, the photosensitive component 32 is driven to move, so as to realize AF and/or OIS.

在一些实施例中，导热液体36的熔点小于或者等于50摄氏度(℃)。这样，由于感光组件32在运行时的温度可能达到50℃以上，因此在导热液体36设置于感光组件32与底板33之间时，感光组件32的运行温度高于导热液体36熔点的这段时间内，导热液体36呈液态，在驱动感光组件32运动以实现AF和/或OIS之前，无需加热或者冷却处理来使得导热液体36呈液态，因此，摄像头模组30的成本较低。在此基础上，进一步可选的，导热液体36的熔点小于或者等于室温(25℃)。这样，导热液体36在室温状态下即呈液态，在感光组件32在室温环境下开始启动直至最后停止运行的这整个运行时间段内，均不需要加热或者冷却处理来使得导热液体36呈液态。In some embodiments, the thermally conductive liquid 36 has a melting point less than or equal to 50 degrees Celsius (° C.). In this way, since the temperature of the photosensitive component 32 may reach over 50°C during operation, when the thermally conductive liquid 36 is arranged between the photosensitive component 32 and the bottom plate 33, the operating temperature of the photosensitive component 32 is higher than the melting point of the thermally conductive liquid 36 during this period Inside, the heat-conducting liquid 36 is in a liquid state, and no heating or cooling process is required to make the heat-conducting liquid 36 in a liquid state before the photosensitive assembly 32 is driven to move to achieve AF and/or OIS. Therefore, the cost of the camera module 30 is relatively low. On this basis, further optionally, the melting point of the heat conducting liquid 36 is less than or equal to room temperature (25° C.). In this way, the heat-conducting liquid 36 is in a liquid state at room temperature, and no heating or cooling is required to make the heat-conducting liquid 36 in a liquid state during the entire operating period from when the photosensitive assembly 32 starts to stop at room temperature.

在一些实施例中，导热液体36的熔点大于或者等于-20℃。这样，可以满足电子设备在大多数温度场景下的使用需求。具体的，导热液体36的熔点可以为-20℃，-19℃，0℃，2℃，7℃，11℃，25℃等等，在此不做具体限定。In some embodiments, the thermally conductive liquid 36 has a melting point greater than or equal to -20°C. In this way, the use requirements of electronic equipment in most temperature scenarios can be met. Specifically, the melting point of the heat conducting liquid 36 may be -20°C, -19°C, 0°C, 2°C, 7°C, 11°C, 25°C, etc., which are not specifically limited here.

为了将导热液体36密封在感光组件32与底板33之间，在一些实施例中，该导热液体36的表面张力大于或者等于72达因/厘米，达因/厘米也即是dyn/cm。这样，导热液体36的表面张力较大，凝聚成团，不会向四周扩散，便于进行密封。在此基础上，可以采用以下两种设计思路将导热液体36密封在感光组件32与底板33之间。具体的，该两种设计思路分别为下述设计思路一和设计思路二。In order to seal the heat transfer liquid 36 between the photosensitive assembly 32 and the bottom plate 33 , in some embodiments, the surface tension of the heat transfer liquid 36 is greater than or equal to 72 dynes/cm, dyne/cm is dyn/cm. In this way, the surface tension of the heat-conducting liquid 36 is relatively high, and the heat-conducting liquid 36 is agglomerated into clusters and will not spread around, which is convenient for sealing. On this basis, the following two design ideas can be adopted to seal the heat-conducting liquid 36 between the photosensitive component 32 and the bottom plate 33 . Specifically, the two design ideas are respectively the following design idea 1 and design idea 2.

设计思路一：在底板33的靠近感光组件32的表面设置挡墙，该挡墙位于导热液体36的***，并沿导热液体36的周向延伸，以将导热液体36密封在挡墙内。其中，该挡墙可以为设置于底板33的靠近感光组件32的表面的凸棱，也可以在底板33的靠近感光组件32的表面设置凹槽，凹槽用于容纳导热液体36，凹槽的侧壁形成该挡墙。Design Idea 1: A retaining wall is provided on the surface of the bottom plate 33 close to the photosensitive component 32 , the retaining wall is located at the periphery of the heat transfer liquid 36 and extends along the circumferential direction of the heat transfer liquid 36 to seal the heat transfer liquid 36 in the retaining wall. Wherein, the retaining wall can be a rib arranged on the surface of the bottom plate 33 close to the photosensitive component 32, or a groove can be arranged on the surface of the bottom plate 33 close to the photosensitive component 32, and the groove is used to accommodate the heat-conducting liquid 36. The side walls form the barrier.

示例的，请参阅图9，图9为本申请又一些实施例提供的摄像头模组30的部分结构示意图。在本实施例中，底板33的靠近感光组件32的表面设有第一挡墙37，该第一挡墙37为设置于底板33的靠近感光组件32的表面的凸棱，该凸棱环绕导热液体36的***一周设置。由此借助凸棱将导热液体36密封于其内，避免导热液体36由感光组件32与底板33之间的间隙移出。凸棱的结构简单，且不会破坏底板33的结构强度。凸棱可以与底板33为一体式结构，也可以独立于底板33之外，而通过胶粘等方式固定于底板33上。For an example, please refer to FIG. 9 , which is a partial structural diagram of a camera module 30 provided in some other embodiments of the present application. In this embodiment, the surface of the bottom plate 33 close to the photosensitive component 32 is provided with a first retaining wall 37, which is a rib provided on the surface of the bottom plate 33 close to the photosensitive component 32, and the rib surrounds the heat conducting The periphery of the liquid 36 is set around. Thus, the thermally conductive liquid 36 is sealed inside by means of the ribs, preventing the thermally conductive liquid 36 from moving out from the gap between the photosensitive element 32 and the bottom plate 33 . The ribs have a simple structure and will not damage the structural strength of the bottom plate 33 . The ribs can be integrated with the bottom plate 33 , or can be independent from the bottom plate 33 and fixed on the bottom plate 33 by means of gluing or the like.

上述示例中，请参阅图10，图10为图9所示摄像头模组30中底板33的一种俯视图。凸棱的延伸路径可以为连续且封闭的曲线。具体的，该凸棱的延伸路径可以为圆形、方形等等，在图10所示的实施例中，凸棱的延伸路径为圆形。导热液体36设置于该凸棱所环绕的区域内。该凸棱能够对导热液体36的周向上的任意部位起到密封作用，密封效果较优。凸棱的数量可以为一个，也可以为由内至外设置的多个。在图10所示的实施例中，凸棱的数量为一个。在又一些示例中，请参阅图11，图11为图9所示摄像头模组30中底板33的又一种俯视图。在本示例中，凸棱的数量为两个，该两个凸棱由内至外层叠设置。这样，可以对导热液体36进行二次密封，增强对导热液体36的密封效果。在又一些实施例中，凸棱的数量也可以为三个或者三个以上。In the above example, please refer to FIG. 10 , which is a top view of the bottom plate 33 in the camera module 30 shown in FIG. 9 . The extending path of the rib can be a continuous and closed curve. Specifically, the extending path of the rib can be circular, square, etc. In the embodiment shown in FIG. 10 , the extending path of the rib is circular. The heat conducting liquid 36 is arranged in the area surrounded by the rib. The ribs can seal any part of the heat transfer liquid 36 in the circumferential direction, and the sealing effect is better. The number of ribs can be one, or multiple from inside to outside. In the embodiment shown in FIG. 10, the number of ribs is one. In some other examples, please refer to FIG. 11 , which is another top view of the bottom plate 33 in the camera module 30 shown in FIG. 9 . In this example, the number of ribs is two, and the two ribs are stacked from inside to outside. In this way, the heat transfer liquid 36 can be sealed twice to enhance the sealing effect on the heat transfer liquid 36 . In some other embodiments, the number of ribs may also be three or more.

请返回参阅图9，感光组件32与底板33之间的间隙高度为d，凸棱的高度h1小于d，这样可以避免凸棱干扰感光组件32的运动。在一些实施例中，凸棱的高度h1小于或者等于(3/4)d。示例的，该凸棱的高度h1为(3/4)d、(1/2)d或者(1/4)d。这样，可以进一步避免凸棱干扰感光组件32的运动。Please refer back to FIG. 9 , the height of the gap between the photosensitive component 32 and the bottom plate 33 is d, and the height h1 of the rib is smaller than d, so as to prevent the rib from interfering with the movement of the photosensitive component 32 . In some embodiments, the height h1 of the rib is less than or equal to (3/4)d. Exemplarily, the height h1 of the rib is (3/4)d, (1/2)d or (1/4)d. In this way, it is possible to further prevent the ribs from interfering with the movement of the photosensitive element 32 .

在又一些实施例中，请参阅图12，图12为本申请又一些实施例提供的摄像头模组30的部分结构示意图。在本实施例中，底板33的靠近感光组件32的表面设置凹槽C，导热液体36容纳于凹槽C内，凹槽C的侧壁形成第一挡墙37。该第一挡墙37未凸出底板33外，能够防止第一挡墙37对感光组件32的运动造成干扰。In some other embodiments, please refer to FIG. 12 , which is a partial structural schematic diagram of a camera module 30 provided in some other embodiments of the present application. In this embodiment, a groove C is provided on the surface of the bottom plate 33 close to the photosensitive element 32 , the heat transfer liquid 36 is accommodated in the groove C, and the sidewall of the groove C forms a first retaining wall 37 . The first retaining wall 37 does not protrude from the bottom plate 33 , which can prevent the first retaining wall 37 from interfering with the movement of the photosensitive assembly 32 .

在底板33的靠近感光组件32的表面设置有上述任一实施例所述的第一挡墙37的基础上，可以在第一挡墙37的***一周再设置第二挡墙，以对导热液体36进行二次密封，进一步增强对导热液体36的密封效果。同理的，该第二挡墙可以为凸棱，也可以在底板33的靠近感光组件32的表面设置阶梯槽，导热液体36设置于阶梯槽的底面，阶梯槽的靠近底面的侧壁形成第一挡墙37，靠近开口的侧壁形成第二挡墙38，该两个侧壁之间连接有台阶面。On the basis that the first retaining wall 37 described in any of the above-mentioned embodiments is provided on the surface of the bottom plate 33 close to the photosensitive assembly 32, a second retaining wall can be provided around the periphery of the first retaining wall 37 to protect the heat transfer liquid. 36 for secondary sealing to further enhance the sealing effect on the heat transfer liquid 36. Similarly, the second retaining wall can be a rib, and a stepped groove can also be arranged on the surface of the bottom plate 33 close to the photosensitive assembly 32, the heat-conducting liquid 36 is arranged on the bottom surface of the stepped groove, and the side wall near the bottom surface of the stepped groove forms the first A retaining wall 37 forms a second retaining wall 38 near the side wall of the opening, and a stepped surface is connected between the two side walls.

示例的，请参阅图13，图13为本申请又一些实施例提供的摄像头模组30的部分结构示意图。在第一挡墙37的***再设置有第二挡墙38。第一挡墙37为凹槽的侧壁。在其他一些实施例中，第一挡墙37也可以为凸棱。第二挡墙38为设置于底板33上的凸棱。借助第二挡墙38对导热液体36进行二次密封，可以增强对导热液体36的密封效果。For an example, please refer to FIG. 13 . FIG. 13 is a partial structural diagram of a camera module 30 provided in some other embodiments of the present application. A second retaining wall 38 is provided on the periphery of the first retaining wall 37 . The first retaining wall 37 is a side wall of the groove. In some other embodiments, the first retaining wall 37 may also be a convex rib. The second retaining wall 38 is a rib disposed on the bottom plate 33 . Secondary sealing of the heat transfer liquid 36 by means of the second retaining wall 38 can enhance the sealing effect of the heat transfer liquid 36 .

在上述示例中，可选的，第二挡墙38的远离底板33的一端与感光组件32连接。这样，第二挡墙38、感光组件32和底板33围成封闭的腔体，并将导热液体36密封于其内，能够有效密封导热液体36，防止电子设备出现晃动、跌落等情况时导热液体36泄露。在此基础上，第二挡墙38由柔性材料制作，柔性材料能够产生变形，感光组件32能够相对于底板33运动，以实现AF和/或OIS。在一些实施例中，第二挡墙38由阻尼胶制作，该阻尼胶包括但不限于无影胶(也称光敏胶、紫外光固化胶或者UV胶)、热固胶、普通的硅胶和橡胶。阻尼胶的弹性较优，易产生变形，且寿命较长，稳定性较优，能够延长摄像头模组30的使用寿命和稳定性。In the above example, optionally, an end of the second retaining wall 38 away from the bottom plate 33 is connected to the photosensitive component 32 . In this way, the second retaining wall 38, the photosensitive assembly 32, and the bottom plate 33 form a closed cavity, and the heat-conducting liquid 36 is sealed in it, which can effectively seal the heat-conducting liquid 36 and prevent the electronic equipment from shaking or falling. 36 leaked. On this basis, the second retaining wall 38 is made of flexible material, which can be deformed, and the photosensitive component 32 can move relative to the bottom plate 33 to realize AF and/or OIS. In some embodiments, the second retaining wall 38 is made of damping glue, which includes but is not limited to shadowless glue (also known as photosensitive glue, ultraviolet curing glue or UV glue), thermosetting glue, common silica gel and rubber . The damping rubber has good elasticity, is easy to deform, has a long service life and good stability, and can prolong the service life and stability of the camera module 30 .

第二挡墙38与底板33之间，以及第二挡墙38与感光组件32之间可以采用胶粘、一体式等方式连接。在一些实施例中，当第二挡墙38由阻尼胶制作时，底板33、第二挡墙38、感光组件32三者为一体式结构，也即该三者为一个结构件整体。请参阅图14和图15，图14为本申请一些实施例提供的摄像头模组30的装配过程结构示意图，图15为图14所示摄像头模组30的装配过程流程图。具体的，摄像头模组30的装配过程可以包括以下步骤S100～S300。S100：在底板33的表面设置阻尼胶水a。示例的，可以采用点胶工艺在底板33的表面设置阻尼胶水a。该阻尼胶水a沿环形设置，并形成环形且封闭的阻尼胶水墙。请参阅图14中的(a)，图14中的(a)为在底板33的表面设置阻尼胶水a后的结构示意图。S200：将感光组件32放置于阻尼胶水a上。请参阅图14中的(b)，图14中的(b)为将感光组件32放置于阻尼胶水a上后的结构示意图。S300：对阻尼胶水a进行固化处理，以使底板33、第二挡墙38、感光组件32三者形成为一体。请参阅图14中的(c)，图14中的(c)为对阻尼胶水a进行固化处理时摄像头模组30的结构示意图。其中，阻尼胶水a的固化方式可以根据阻尼胶水a的材料进行确定，比如阻尼胶水a的材料为无影胶，则需要采用紫外光照射实现固化。又比如阻尼胶水a的材料为热固胶，则需要采用加热实现固化。还比如阻尼胶水a为普通的硅胶或橡胶，则可以采用冷却实现固化。在一些实施例中，阻尼胶为无影胶，这样上述步骤中的阻尼胶水a的固化方式可以采用紫外光(也即是UV 光)照射实现固化。在此基础上，请继续参阅图14中的(c)，底板33的边缘一周设有侧框34，侧框34与底板33围成容纳空间，该容纳空间至少将感光组件32容纳于其内并允许感光组件32在其内运动以实现AF和/或OIS。具体的，该侧框34可以为图4-图7中任一附图所示实施例中的侧框34。侧框34与底板33可以为一体结构，也可以分体制作并装配在一起，在此不做具体限定。侧框34上设有透光窗口342，该透光窗口342与第二挡墙38相对。一些实施例中，透光窗口342的数量为多个，多个透光窗口342围绕侧框34的周向均匀设置。示例的，请参阅图16，图16为本申请一些实施例提供的摄像头模组30的壳体的结构示意图，本实施例中，透光窗口342的数量为四个，四个透光窗口342分别设置于侧框34的四个侧壁上。这样一来，借助该透光窗口342透过UV光照射无影胶水，可以实现无影胶水的固化。此操作简单，效率较高。The connection between the second retaining wall 38 and the bottom plate 33 and between the second retaining wall 38 and the photosensitive assembly 32 can be by means of glue, integral type, or the like. In some embodiments, when the second retaining wall 38 is made of damping glue, the bottom plate 33 , the second retaining wall 38 , and the photosensitive assembly 32 are integrated, that is, the three are integrated as a structural member. Please refer to FIG. 14 and FIG. 15 . FIG. 14 is a schematic structural diagram of the assembly process of the camera module 30 provided by some embodiments of the present application, and FIG. 15 is a flowchart of the assembly process of the camera module 30 shown in FIG. 14 . Specifically, the assembly process of the camera module 30 may include the following steps S100-S300. S100: setting damping glue a on the surface of the bottom plate 33 . As an example, the damping glue a may be provided on the surface of the bottom plate 33 by using a glue dispensing process. The damping glue a is arranged along a ring, and forms a ring-shaped and closed damping glue wall. Please refer to (a) in FIG. 14 . (a) in FIG. 14 is a schematic diagram of the structure after setting the damping glue a on the surface of the bottom plate 33 . S200: Place the photosensitive component 32 on the damping glue a. Please refer to (b) in FIG. 14 . (b) in FIG. 14 is a schematic structural view of placing the photosensitive component 32 on the damping glue a. S300: Curing the damping glue a, so that the bottom plate 33, the second retaining wall 38, and the photosensitive component 32 are integrated. Please refer to (c) in FIG. 14. (c) in FIG. 14 is a schematic structural diagram of the camera module 30 when the damping glue a is cured. Wherein, the curing method of the damping glue a can be determined according to the material of the damping glue a, for example, the material of the damping glue a is shadowless glue, and it needs to be cured by ultraviolet light irradiation. For another example, if the material of the damping glue a is a thermosetting glue, it needs to be cured by heating. For example, if the damping glue a is ordinary silica gel or rubber, it can be cured by cooling. In some embodiments, the damping glue is shadowless glue, so the curing method of the damping glue a in the above steps can be cured by ultraviolet light (ie UV light) irradiation. On this basis, please continue to refer to (c) in FIG. 14 , a side frame 34 is provided around the edge of the bottom plate 33, and the side frame 34 and the bottom plate 33 enclose an accommodating space, and the accommodating space at least accommodates the photosensitive assembly 32 therein And allow the photosensitive assembly 32 to move therein to realize AF and/or OIS. Specifically, the side frame 34 may be the side frame 34 in the embodiment shown in any one of Fig. 4-Fig. 7 . The side frame 34 and the bottom plate 33 can be integrally constructed, or can be fabricated separately and assembled together, which is not specifically limited here. A light-transmitting window 342 is disposed on the side frame 34 , and the light-transmitting window 342 is opposite to the second retaining wall 38 . In some embodiments, there are multiple light-transmitting windows 342 , and the multiple light-transmitting windows 342 are uniformly arranged around the circumference of the side frame 34 . For an example, please refer to FIG. 16. FIG. 16 is a schematic structural diagram of the housing of the camera module 30 provided in some embodiments of the present application. In this embodiment, the number of light-transmitting windows 342 is four, and the four light-transmitting windows 342 They are respectively arranged on the four side walls of the side frame 34 . In this way, the shadowless glue can be cured by irradiating the shadowless glue with UV light through the light-transmitting window 342 . This operation is simple and efficient.

在上述实施例中，透光窗口342可以为设置于侧框34上的开口，也可以为设置于侧框34上的透光盖板区域。在此不做具体限定。在一些实施例中，请参阅图14中的(c)，透光窗口342为设置与侧框34上的开口。在此基础上，开口处覆盖有盖体结构(图中未示出)，盖体结构用于封堵该透光窗口342，以起到防水防尘的作用。盖体结构可以为麦拉片、铜箔、焊接于侧框34上的金属片或者涂设于透光窗口342内的胶材。当透光窗口342为设置于侧框34上的开口时，该开口可以为圆形开口、方形开口、椭圆形开口、矩形开口等等。在一些实施例中，为了允许尽可能多的UV光射入壳体内，在一些实施例中，请参阅图16，透光窗口342为长条形开口，该长条形开口沿侧框34的周向延伸。这样，透光窗口342在侧框34的周向上的占用长度较大，可以设置较少数量的透光窗口342即可保证UV光射入壳体的量。但是随着透光窗口342的长度增大，摄像头模组30的壳体的结构强度降低。因此，为了在保证UV光射入壳体的量的同时，保证摄像头模组30的壳体的结构强度，在一些实施例中，请参阅图17，图17为本申请又一些实施例提供的摄像头模组30的壳体的结构示意图，在本实施例中，透光窗口342为方形开口，侧框34的每个侧壁上均设置有多个透光窗口342，该多个透光窗口342沿侧框34的周向间隔排布，由此，在保证UV光射入壳体的量的同时，可以借助相邻两个透光窗口342之间的连接筋条保证摄像头模组30的壳体的结构强度。在其他一些实施例中，图17中的透光窗口342也可以为圆形开口、三角形开口、棱形开口等等，在此不做具体限定。In the above embodiments, the light-transmitting window 342 may be an opening disposed on the side frame 34 , or may be a light-transmitting cover area disposed on the side frame 34 . No specific limitation is made here. In some embodiments, please refer to (c) in FIG. 14 , the light-transmitting window 342 is an opening disposed on the side frame 34 . On this basis, the opening is covered with a cover structure (not shown in the figure), and the cover structure is used to block the light-transmitting window 342 to play the role of waterproof and dustproof. The cover structure can be a mylar sheet, copper foil, a metal sheet welded on the side frame 34 or an adhesive material coated in the transparent window 342 . When the light-transmitting window 342 is an opening disposed on the side frame 34 , the opening can be a circular opening, a square opening, an oval opening, a rectangular opening, and the like. In some embodiments, in order to allow as much UV light as possible to enter the housing, in some embodiments, please refer to FIG. Circumferential extension. In this way, the occupied length of the light-transmitting windows 342 in the circumferential direction of the side frame 34 is large, and a small number of light-transmitting windows 342 can be provided to ensure the amount of UV light entering the housing. However, as the length of the light-transmitting window 342 increases, the structural strength of the housing of the camera module 30 decreases. Therefore, in order to ensure the structural strength of the housing of the camera module 30 while ensuring the amount of UV light entering the housing, in some embodiments, please refer to FIG. 17 , which is provided by some other embodiments of the present application. A schematic structural view of the housing of the camera module 30. In this embodiment, the light-transmitting window 342 is a square opening, and each side wall of the side frame 34 is provided with a plurality of light-transmitting windows 342. The plurality of light-transmitting windows 342 are arranged at intervals along the circumferential direction of the side frame 34, thus, while ensuring the amount of UV light entering the casing, the connecting ribs between two adjacent light-transmitting windows 342 can be used to ensure the stability of the camera module 30. The structural strength of the shell. In some other embodiments, the light-transmitting window 342 in FIG. 17 may also be a circular opening, a triangular opening, a prismatic opening, etc., which are not specifically limited here.

为了实现摄像头模组30的装配，请参阅图18，图18为本申请又一些实施例提供的摄像头模组30的装配过程流程图。在上述步骤S100之前，摄像头模组30的装配过程还包括：S400：在底板33的表面设置图14中的(a)中的第一挡墙37。具体的，该第一挡墙37的设置过程可以为：通过冲压、铣削等工艺在底板33的表面冲压一定深度的凹槽C，凹槽C的侧壁形成第一挡墙37。在其他一些实施例中，也可以在底板33的表面设置凸棱，以形成第一挡墙37。In order to realize the assembly of the camera module 30 , please refer to FIG. 18 . FIG. 18 is a flow chart of the assembly process of the camera module 30 provided in some other embodiments of the present application. Before the above step S100 , the assembly process of the camera module 30 further includes: S400 : setting the first retaining wall 37 in (a) of FIG. 14 on the surface of the bottom plate 33 . Specifically, the setting process of the first retaining wall 37 may be: stamping a groove C of a certain depth on the surface of the bottom plate 33 through stamping, milling and other processes, and the side walls of the groove C form the first retaining wall 37 . In some other embodiments, ribs may also be provided on the surface of the bottom plate 33 to form the first retaining wall 37 .

在步骤S400之后，步骤S200之前，请继续参阅图18，摄像头模组30的装配过程还包括：S500：在第一挡墙37围成的区域内设置图14中的(b)中的导热液体36。示例的，可以采用针管注射的方式在第一挡墙37围成的区域内设置导热液体36。这样，装配过程合理，方便操作。该步骤S500可以在上述步骤S100之后，也可以在上述步骤S100之前，还可以与上述步骤S100同时进行。在图18所示的实施例中，步骤 S500在上述步骤S100之后。After step S400, before step S200, please continue to refer to FIG. 18, the assembly process of the camera module 30 also includes: S500: Set the heat transfer liquid in (b) in FIG. 14 in the area surrounded by the first retaining wall 37 36. As an example, the heat transfer liquid 36 may be provided in the area surrounded by the first retaining wall 37 by needle injection. In this way, the assembly process is reasonable and the operation is convenient. This step S500 may be performed after the above step S100, or before the above step S100, or may be performed simultaneously with the above step S100. In the embodiment shown in Fig. 18, step S500 is after the above step S100.

在上述步骤S200中，在将感光组件32放置于阻尼胶水a上的同时，感光组件32也被放置在了导热液体36上。请参阅图14中的(b)，感光组件32与底板33之间的间隙高度d小于或者等于导热液体36在自身表面张力作用下的自然高度，由此使得感光组件32与导热液体36接触进行热传导。进一步可选的，感光组件32与底板33之间的间隙高度d小于或者等于导热液体36在自身表面张力作用下的自然高度的90％，这样能够保证感光组件32在相对于底板33运动的过程中，始终与导热液体36接触进行热传导。In the above step S200 , while the photosensitive component 32 is placed on the damping glue a, the photosensitive component 32 is also placed on the heat conducting liquid 36 . Please refer to (b) in FIG. 14 , the gap height d between the photosensitive component 32 and the bottom plate 33 is less than or equal to the natural height of the heat-conducting liquid 36 under the action of its own surface tension, thus making the photosensitive component 32 contact with the heat-conducting liquid 36. Heat Conduction. Further optionally, the height d of the gap between the photosensitive assembly 32 and the bottom plate 33 is less than or equal to 90% of the natural height of the heat-conducting liquid 36 under the action of its own surface tension, which can ensure that the photosensitive assembly 32 moves relative to the bottom plate 33 , always in contact with the heat transfer liquid 36 for heat conduction.

在上述步骤S500中，导热液体36在第一挡墙37围成的区域内的涂布面积小于该区域的面积。这样，之后在将感光组件32放置于导热液体36上时，有一定的余量使得导热液体36向该区域内未涂布区域内扩张，防止导热液体36在将感光组件32放置于导热液体36的过程中越过第一挡墙37。In the above step S500 , the coating area of the heat transfer liquid 36 in the area enclosed by the first retaining wall 37 is smaller than the area of the area. In this way, when the photosensitive assembly 32 is placed on the heat-conducting liquid 36, there is a certain margin to make the heat-conducting liquid 36 expand to the uncoated area in this area, preventing the heat-conducting liquid 36 from placing the photosensitive assembly 32 on the heat-conducting liquid 36. Cross the first retaining wall 37 in the process.

在其他一些实施例中，第二挡墙38也可以由泡棉、塑料等柔性材料制作。In some other embodiments, the second retaining wall 38 may also be made of flexible materials such as foam and plastic.

为了平衡第二挡墙38内外的气压，第二挡墙38也可以设置至少一个断开部位，以使得第二挡墙38内外空气空间连通，以实现内外的气压平衡。In order to balance the air pressure inside and outside the second retaining wall 38 , the second retaining wall 38 may also be provided with at least one disconnection portion, so that the air space inside and outside the second retaining wall 38 is communicated, so as to realize air pressure balance inside and outside.

根据本设计思路，在第二挡墙38的***还可以设置第三挡墙、第四挡墙等等，以对导热液体36分别进行三次密封、四次密封等等。在其他一些实施例中，也可以只设置上述第二挡墙38，而不设置上述第一挡墙37，在此不做具体限定。示例的，请参阅图19，图19为本申请又一些实施例提供的摄像头模组30的结构示意图，在本实施例中，底板33的靠近感光组件32的表面未设置凹槽C，因此未借助凹槽C形成第一挡墙37，而仅设置有上述第二挡墙38。而且，第一挡墙37和第二挡墙38也可以设置于感光组件32的靠近底板33的表面，或者，第一挡墙37和第二挡墙38中的一个设置于底板33的靠近感光组件32的表面，另一个设置于感光组件32的靠近底板33的表面。当第一挡墙37和第二挡墙38中的一个设置于底板33的靠近感光组件32的表面，另一个设置于感光组件32的靠近底板33的表面时，第二挡墙38可以位于第一挡墙37的***，也可以与第一挡墙37相对。在此不做具体限定。当感光组件32的靠近底板33的表面设置有第一挡墙37和/或第二挡墙38时，若感光组件32仅包括图3中的电路板321和感光芯片322，则第一挡墙37和/或第二挡墙38可以在电路板321的底面上通过使用较厚的油墨层或铜层进行蚀刻加工形成。若感光组件32包括图3中的电路板321、感光芯片322和加强板323，则第一挡墙37和/或第二挡墙38可以在加强板323上通过冲压、蚀刻、铣削等方式加工形成。According to this design concept, a third retaining wall, a fourth retaining wall, etc. may be provided on the periphery of the second retaining wall 38 to seal the heat transfer liquid 36 three times, four times, etc. respectively. In some other embodiments, only the above-mentioned second retaining wall 38 may be provided without the above-mentioned first retaining wall 37 , which is not specifically limited here. For an example, please refer to FIG. 19. FIG. 19 is a schematic structural diagram of a camera module 30 provided in some other embodiments of the present application. The first retaining wall 37 is formed by means of the groove C, and only the above-mentioned second retaining wall 38 is provided. Moreover, the first retaining wall 37 and the second retaining wall 38 can also be arranged on the surface of the photosensitive assembly 32 close to the bottom plate 33, or one of the first retaining wall 37 and the second retaining wall 38 is arranged on the surface of the bottom plate 33 close to the photosensitive The other surface of the component 32 is disposed on the surface of the photosensitive component 32 close to the bottom plate 33 . When one of the first retaining wall 37 and the second retaining wall 38 is arranged on the surface of the bottom plate 33 close to the photosensitive assembly 32, and the other is arranged on the surface of the photosensitive assembly 32 near the bottom plate 33, the second retaining wall 38 can be located at the first The periphery of a retaining wall 37 may also be opposite to the first retaining wall 37 . No specific limitation is made here. When the surface of the photosensitive assembly 32 close to the bottom plate 33 is provided with the first retaining wall 37 and/or the second retaining wall 38, if the photosensitive assembly 32 only includes the circuit board 321 and the photosensitive chip 322 in Fig. 3, then the first retaining wall 37 and/or the second retaining wall 38 can be formed on the bottom surface of the circuit board 321 by etching with a thicker ink layer or copper layer. If the photosensitive assembly 32 includes the circuit board 321, the photosensitive chip 322 and the reinforcing plate 323 in FIG. form.

设计思路二：在底板33的靠近感光组件32的表面设置阻流槽，该阻流槽位于导热液体36的***并沿导热液体36的周向延伸，当导热液体36流到阻流槽时，导热液体36的表面受张力影响而导致其很难跨过阻流槽，不再向前流动，从而实现液体的密封。具体由于阻流槽相对于底板33表面下沉，可增大导热液体36的接触角，因此导热液体36在自身表面张力作用下不再流动，可以将导热液体36密封在该阻流槽围成的区域内，由此实现液体的密封。其中，阻流槽可以采用冲压、铣削等工艺加工形成。Design idea two: a choke groove is provided on the surface of the bottom plate 33 close to the photosensitive component 32, the choke groove is located at the periphery of the heat transfer liquid 36 and extends along the circumferential direction of the heat transfer liquid 36, when the heat transfer liquid 36 flows into the choke groove, The surface of the heat-conducting liquid 36 is affected by the tension, which makes it difficult for it to cross the choke slot and no longer flow forward, thereby achieving liquid sealing. Specifically, because the choke groove sinks relative to the surface of the bottom plate 33, the contact angle of the heat transfer liquid 36 can be increased, so the heat transfer liquid 36 no longer flows under the effect of its own surface tension, and the heat transfer liquid 36 can be sealed in the choke groove to form a In the area, liquid sealing is thus achieved. Wherein, the choke groove can be formed by stamping, milling and other processes.

示例的，请参阅图20，图20为本申请又一些实施例提供的摄像头模组30的部分结构示意图。在本实施例中，底板33的靠近感光组件32的表面设有阻流槽39。请参阅图21，图21为图20所示摄像头模组30中底板33的俯视图。该阻流槽39沿导热液体36的周向延伸，由此借助阻流槽39破坏底板33表面的连续平整性。这样，导热液体36在自身张力作用下难以跨越阻流槽39进入阻流槽39的***。由此避免导热液体36由感光组件32与底板33之间的间隙移出。由于阻流槽39未凸出底板33外，能够防止对感光组件32的运动造成干扰。For an example, please refer to FIG. 20 . FIG. 20 is a partial structural diagram of a camera module 30 provided in some other embodiments of the present application. In this embodiment, a flow blocking groove 39 is provided on the surface of the bottom plate 33 close to the photosensitive element 32 . Please refer to FIG. 21 , which is a top view of the bottom plate 33 in the camera module 30 shown in FIG. 20 . The choke groove 39 extends along the circumferential direction of the heat transfer liquid 36 , thereby destroying the continuous flatness of the surface of the bottom plate 33 by means of the choke groove 39 . In this way, it is difficult for the heat-conducting liquid 36 to cross the choke groove 39 and enter the periphery of the choke groove 39 under the action of its own tension. This prevents the heat transfer liquid 36 from moving out from the gap between the photosensitive assembly 32 and the bottom plate 33 . Since the choke groove 39 does not protrude out of the bottom plate 33 , it can prevent interference to the movement of the photosensitive assembly 32 .

一些实施例中，请参阅图22，图22为图20中区域I的局部放大图。假设底板33上导热液体36所处的表面区域为第一表面区域00，阻流槽39的与该第一表面区域00相接的内侧面为第一内侧面01，第一表面区域00与第一内侧面01之间在阻流槽39内侧的夹角α大于或者等于30°。这样，阻流槽39对导热液体36的密封作用较优，且便于后续加工。在满足此条件下，请参阅图23，图23为本申请一些实施例提供的摄像头模组30中底板33上不同的阻流槽39的截面结构示意图。阻流槽39的截面形状可以为图23中的(a)所示的矩形，也可以为图23中的(b)或图23中的(c)所示的梯形，还可以为图23中的(d)所示的三角形。在此不做具体限定。For some embodiments, please refer to FIG. 22 , which is a partially enlarged view of area I in FIG. 20 . Assuming that the surface area where the heat transfer liquid 36 is located on the bottom plate 33 is the first surface area 00, the inner surface of the choke groove 39 that is in contact with the first surface area 00 is the first inner surface 01, and the first surface area 00 and the second surface area The included angle α between the inner surfaces 01 on the inner side of the choke groove 39 is greater than or equal to 30°. In this way, the blocking groove 39 has a better sealing effect on the heat-conducting liquid 36 and is convenient for subsequent processing. Under this condition, please refer to FIG. 23 , which is a schematic cross-sectional structure diagram of different flow blocking grooves 39 on the bottom plate 33 of the camera module 30 provided by some embodiments of the present application. The cross-sectional shape of the choke groove 39 can be a rectangle shown in (a) in Figure 23, also can be a trapezoid shown in (b) in Figure 23 or (c) in Figure 23, can also be The triangle shown in (d). No specific limitation is made here.

在图20和图21所示示例的基础上，阻流槽39的数量可以为一个，也可以为由内至外层叠设置的多个。在图20和图21所示的示例中，阻流槽39的数量为一个。在其他一些示例中，请参阅图24，图24为本申请又一些实施例提供的摄像头模组30中底板33的俯视图，阻流槽39的数量为两个，该两个阻流槽39由内至外层叠设置。在其他又一些示例中，图25，图25为本申请又一些实施例提供的摄像头模组30中底板33的俯视图，阻流槽39的数量为三个，该三个阻流槽39由内至外层叠设置。当阻流槽39的数量为多个时，可以对导热液体36进行多次密封，以进一步避免导热液体36由感光组件32与底板33之间的间隙移出。On the basis of the example shown in FIG. 20 and FIG. 21 , the number of choke grooves 39 may be one, or multiple stacked from inside to outside. In the example shown in FIG. 20 and FIG. 21 , the number of the choke groove 39 is one. In some other examples, please refer to FIG. 24. FIG. 24 is a top view of the bottom plate 33 in the camera module 30 provided in some other embodiments of the present application. Inside-out cascading setup. In some other examples, Fig. 25, Fig. 25 is a top view of the bottom plate 33 in the camera module 30 provided by some other embodiments of the present application, the number of choke slots 39 is three, and the three choke slots 39 consist of to outer cascade settings. When there are multiple baffle grooves 39 , the heat-conducting liquid 36 can be sealed multiple times to further prevent the heat-conducting liquid 36 from moving out from the gap between the photosensitive assembly 32 and the bottom plate 33 .

阻流槽39的延伸路径可以大致为图24所示的矩形，也可以为图21或图25所示的圆形，在其他一些实施例中，该延伸形状还可以为椭圆形、三角形或者其他不规则的形状。The extension path of the choke groove 39 can be roughly a rectangle as shown in FIG. 24, or a circle as shown in FIG. 21 or 25. In some other embodiments, the extension shape can also be an oval, a triangle or other shapes. Irregular shape.

阻流槽39的延伸路径可以为连续且封闭的曲线，也可以包括多个间隔设置的阻流槽段。在图21、图24或图25所示的示例中，阻流槽39的延伸路径为连续且封闭的曲线。这样，阻流槽39可以对导热液体36的周向上的各个位置进行密封，密封效果较优。在其他一些示例中，请参阅图26，图26为本申请又一些实施例提供的摄像头模组30中底板33的俯视图。阻流槽39包括多个间隔设置的阻流槽段391，由此能够在一定程度上保证底板33的结构强度。在此基础上，可选的，阻流槽39的数量为多个，比如为图26所示的三个，该多个阻流槽39由内至外层叠设置，且相邻两个阻流槽39的阻流槽段391在导热液体36的周向上错位排列，也即是相邻两个阻流槽39的阻流槽段391设置于导热液体36的周向上的不同位置。这样，能够保证对导热液体36的阻流效果。The extension path of the choke groove 39 may be a continuous and closed curve, or may include a plurality of choke groove segments arranged at intervals. In the example shown in FIG. 21 , FIG. 24 or FIG. 25 , the extension path of the choke groove 39 is a continuous and closed curve. In this way, the choke groove 39 can seal various positions of the heat transfer liquid 36 in the circumferential direction, and the sealing effect is better. In some other examples, please refer to FIG. 26 , which is a top view of the bottom plate 33 in the camera module 30 provided in some other embodiments of the present application. The choke groove 39 includes a plurality of choke groove segments 391 arranged at intervals, thereby ensuring the structural strength of the bottom plate 33 to a certain extent. On this basis, optionally, the number of choke slots 39 is multiple, such as three as shown in FIG. The choke slot segments 391 of the slots 39 are arranged in a staggered manner in the circumferential direction of the heat transfer liquid 36 , that is, the choke slot segments 391 of two adjacent choke slots 39 are arranged at different positions in the circumferential direction of the heat transfer liquid 36 . In this way, the flow blocking effect on the heat transfer liquid 36 can be ensured.

在该设计思路二中，感光组件32与底板33之间的间隙高度d(请参阅图20)也小于或者等于导热液体36在自身表面张力作用下的自然高度，由此使得感光组件32与导热液体36接触进行热传导。进一步可选的，感光组件32与底板33之间的间隙高度d也小于或者等于底板33上导热液体36在自身表面张力作用下的自然高度的90％，这样能够保证感光组件32在相对于底板33运动的过程中，始终与导热液体36接触进行热传导。In the second design idea, the gap height d (see FIG. 20 ) between the photosensitive component 32 and the bottom plate 33 is also less than or equal to the natural height of the heat-conducting liquid 36 under its own surface tension, thereby making the photosensitive component 32 and the heat-conducting liquid The liquid 36 is in contact for heat transfer. Optionally, the height d of the gap between the photosensitive assembly 32 and the bottom plate 33 is also less than or equal to 90% of the natural height of the heat transfer liquid 36 on the bottom plate 33 under the action of its own surface tension, so that the photosensitive assembly 32 can be guaranteed to be in the same position relative to the bottom plate. During the movement of 33, it is always in contact with the heat-conducting liquid 36 for heat conduction.

假设最内层的阻流槽39围成的区域为第一区域，则导热液体36在第一区域内的涂布面积小于该第一区域的面积。也就是说，导热液体36未涂满第一区域。这样，之后在将感光组件32放置于导热液体36上时，有一定的余量使得导热液体36向该区域内未涂布区域内扩张，防止导热液体36在将感光组件32放置于导热液体36的过程中越过阻流槽39。Assuming that the area surrounded by the innermost choke groove 39 is the first area, the coating area of the heat transfer liquid 36 in the first area is smaller than the area of the first area. That is to say, the heat transfer liquid 36 does not fill the first area. In this way, when the photosensitive assembly 32 is placed on the heat-conducting liquid 36, there is a certain margin to make the heat-conducting liquid 36 expand to the uncoated area in this area, preventing the heat-conducting liquid 36 from placing the photosensitive assembly 32 on the heat-conducting liquid 36. Cross the choke groove 39 in the process.

需要说明的是，阻流槽39不仅可以设置于底板33的靠近感光组件32的表面，也可以设置于感光组件32的靠近底板33的表面，还可以在底板33的靠近感光组件32的表面以及感光组件32的靠近底板33的表面均设置阻流槽39，在此不做具体限定。当感光组件32的靠近底板33的表面设置有阻流槽39时，若感光组件32仅包括图3中的电路板321和感光芯片322，则阻流槽39可以在电路板321的底面上通过使用较厚的油墨层或铜层进行蚀刻加工形成。若感光组件32包括图3中的电路板321、感光芯片322和加强板323，则阻流槽39可以在加强板323上通过冲压、蚀刻、铣削等方式加工形成。在此不做具体限定。It should be noted that the choke groove 39 can not only be arranged on the surface of the bottom plate 33 close to the photosensitive assembly 32, but also can be arranged on the surface of the photosensitive assembly 32 close to the bottom plate 33, and can also be arranged on the surface of the bottom plate 33 close to the photosensitive assembly 32 and The surface of the photosensitive component 32 close to the bottom plate 33 is provided with a flow blocking groove 39 , which is not specifically limited here. When the surface of the photosensitive assembly 32 close to the bottom plate 33 is provided with a flow blocking groove 39, if the photosensitive assembly 32 only includes the circuit board 321 and the photosensitive chip 322 in Fig. 3, the flow blocking groove 39 can pass through the bottom surface of the circuit board 321 Formed by etching with a thicker ink layer or copper layer. If the photosensitive assembly 32 includes the circuit board 321 , the photosensitive chip 322 and the reinforcing plate 323 shown in FIG. 3 , the flow blocking groove 39 can be formed on the reinforcing plate 323 by stamping, etching, milling and other methods. No specific limitation is made here.

根据上述设计思路一和设计思路二的描述，可以理解的是，底板33上可以仅设置挡墙，或者仅设置阻流槽，也可以同时设置挡墙和阻流槽，在此不做具体限定。According to the description of the above-mentioned design idea 1 and design idea 2, it can be understood that only the retaining wall, or only the choke groove, or both the dam wall and the choke groove can be arranged on the bottom plate 33, which is not specifically limited here. .

在上述任一实施例的基础上，底板33具有导热性能，一些实施例中，底板33为金属板，金属的导热性能较优，摄像头模组30的散热性能较好，且金属的硬度较大，在保证底板33的结构强度的前提下，厚度可以制作得较小，有利于降低摄像头模组30的厚度。在其他一些实施例中，底板33也可以为印制电路板(printed circuit board，PCB)。On the basis of any of the above embodiments, the bottom plate 33 has thermal conductivity. In some embodiments, the bottom plate 33 is a metal plate, the metal has better thermal conductivity, the camera module 30 has better heat dissipation performance, and the metal has higher hardness. , under the premise of ensuring the structural strength of the bottom plate 33 , the thickness can be made smaller, which is beneficial to reduce the thickness of the camera module 30 . In some other embodiments, the base plate 33 may also be a printed circuit board (printed circuit board, PCB).

在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

一种摄像头模组(30)，其特征在于，包括：A camera module (30), characterized in that it comprises:

光学镜头(31)；Optical lens (31);

感光组件(32)，所述感光组件(32)位于所述光学镜头(31)的出光侧，且所述感光组件(32)的感光面朝向所述光学镜头(31)；a photosensitive component (32), the photosensitive component (32) is located on the light emitting side of the optical lens (31), and the photosensitive surface of the photosensitive component (32) faces the optical lens (31);

底板(33)，所述底板(33)位于所述感光组件(32)的远离所述光学镜头(31)的一侧，且所述底板(33)与所述感光组件(32)间隔设置，所述感光组件(32)与所述底板(33)之间的间隙内设有导热液体(36)，所述感光组件(32)借助所述导热液体(36)与所述底板(33)热导通。a bottom plate (33), the bottom plate (33) is located on the side of the photosensitive component (32) away from the optical lens (31), and the bottom plate (33) is spaced apart from the photosensitive component (32), A heat-conducting liquid (36) is provided in the gap between the photosensitive component (32) and the bottom plate (33), and the photosensitive component (32) is heated by the heat-conducting liquid (36) and the bottom plate (33). conduction.
根据权利要求1所述的摄像头模组(30)，其特征在于，所述导热液体(36)的导热系数大于或者等于0.59W/m·K。The camera module (30) according to claim 1, characterized in that the thermal conductivity of the heat-conducting liquid (36) is greater than or equal to 0.59W/m·K.
根据权利要求1或2所述的摄像头模组(30)，其特征在于，所述导热液体(36)的熔点大于或者等于-20℃，且小于或者等于50℃。The camera module (30) according to claim 1 or 2, characterized in that the melting point of the heat conducting liquid (36) is greater than or equal to -20°C and less than or equal to 50°C.
根据权利要求1-3任一项所述的摄像头模组(30)，其特征在于，所述导热液体(36)为润滑油、导热油或者为含有镓、铟、锡、锌、银中的至少一种的液态金属。The camera module (30) according to any one of claims 1-3, characterized in that the heat-conducting liquid (36) is lubricating oil, heat-conducting oil, or a liquid containing gallium, indium, tin, zinc, silver At least one liquid metal.
根据权利要求4所述的摄像头模组(30)，其特征在于，所述导热液体(36)为镓基液态金属。The camera module (30) according to claim 4, characterized in that the heat-conducting liquid (36) is gallium-based liquid metal.
根据权利要求5所述的摄像头模组(30)，其特征在于，所述导热液体(36)为镓铟锡液态合金。The camera module (30) according to claim 5, characterized in that, the heat conducting liquid (36) is a gallium indium tin liquid alloy.
根据权利要求1-6任一项所述的摄像头模组(30)，其特征在于，所述导热液体(36)的表面张力大于或者等于72dyn/cm。The camera module (30) according to any one of claims 1-6, characterized in that the surface tension of the heat-conducting liquid (36) is greater than or equal to 72 dyn/cm.
根据权利要求7所述的摄像头模组(30)，其特征在于，所述底板(33)的靠近所述感光组件(32)的表面设有挡墙，所述挡墙位于所述导热液体(36)的***并沿所述导热液体(36)的周向延伸。The camera module (30) according to claim 7, characterized in that, the surface of the base plate (33) close to the photosensitive component (32) is provided with a retaining wall, and the retaining wall is located between the heat-conducting liquid ( 36) and extend along the circumference of the heat transfer liquid (36).
根据权利要求8所述的摄像头模组(30)，其特征在于，所述挡墙包括第一挡墙(37)，所述第一挡墙(37)为环绕所述导热液体(36)的***一周设置的凸棱；The camera module (30) according to claim 8, characterized in that, the retaining wall comprises a first retaining wall (37), and the first retaining wall (37) is a wall surrounding the heat transfer liquid (36). Convex ribs set around the periphery;

或者，所述底板(33)的靠近所述感光组件(32)的表面设有凹槽(C)，所述导热液体(36)设置于所述凹槽(C)内，所述凹槽(C)的侧壁形成所述第一挡墙(37)。Alternatively, a groove (C) is provided on the surface of the bottom plate (33) close to the photosensitive component (32), the heat-conducting liquid (36) is arranged in the groove (C), and the groove ( The side walls of C) form said first retaining wall (37).
根据权利要求9所述的摄像头模组(30)，其特征在于，所述挡墙还包括第二挡墙(38)，所述第二挡墙(38)设置于所述第一挡墙(37)的***一周。The camera module (30) according to claim 9, wherein the retaining wall further comprises a second retaining wall (38), and the second retaining wall (38) is arranged on the first retaining wall ( 37) for the outer week.
根据权利要求10所述的摄像头模组(30)，其特征在于，所述第二挡墙(38)为设置于所述底板(33)的靠近所述感光组件(32)的表面上的凸棱，所述凸棱的远离所述底板(33)的一端与所述感光组件(32)连接，且所述凸棱由柔性材料制作。The camera module (30) according to claim 10, characterized in that, the second retaining wall (38) is a protrusion arranged on the surface of the bottom plate (33) close to the photosensitive component (32). An edge, the end of the edge away from the bottom plate (33) is connected to the photosensitive component (32), and the edge is made of flexible material.
根据权利要求11所述的摄像头模组(30)，其特征在于，所述凸棱由无影胶制作；The camera module (30) according to claim 11, characterized in that the rib is made of shadowless glue;

所述摄像头模组(30)还包括：The camera module (30) also includes:

侧框(34)，所述侧框(34)设置于所述底板(33)的边缘一周，且所述底板(33)与所述侧框(34)围成容纳空间，所述容纳空间至少将所述感光组件(32)容纳于内，所述侧框(34)上设有透光窗口(342)，所述透光窗口(342)与所述第二挡墙(38) 相对。a side frame (34), the side frame (34) is arranged around the edge of the bottom plate (33), and the bottom plate (33) and the side frame (34) enclose an accommodating space, the accommodating space is at least The photosensitive component (32) is accommodated inside, and the side frame (34) is provided with a light-transmitting window (342), and the light-transmitting window (342) is opposite to the second retaining wall (38).
根据权利要求12所述的摄像头模组(30)，其特征在于，所述透光窗口(342)为设置于所述侧框(34)上的开口，所述开口处覆盖有盖体结构。The camera module (30) according to claim 12, characterized in that the light-transmitting window (342) is an opening provided on the side frame (34), and the opening is covered with a cover structure.
根据权利要求1-13任一项所述的摄像头模组(30)，其特征在于，所述感光组件(32)的靠近所述底板(33)的表面设有挡墙，所述挡墙位于所述导热液体(36)的***并沿所述导热液体(36)的周向延伸。The camera module (30) according to any one of claims 1-13, characterized in that a retaining wall is provided on the surface of the photosensitive component (32) close to the bottom plate (33), and the retaining wall is located at The periphery of the heat conducting liquid (36) extends along the circumferential direction of the heat conducting liquid (36).
根据权利要求1-14任一项所述的摄像头模组(30)，其特征在于，所述底板(33)的靠近所述感光组件(32)的表面设有阻流槽(39)，所述阻流槽(39)位于所述导热液体(36)的***并沿所述导热液体(36)的周向延伸。The camera module (30) according to any one of claims 1-14, characterized in that, the surface of the base plate (33) close to the photosensitive component (32) is provided with a flow blocking groove (39), so The choke groove (39) is located on the periphery of the heat conducting liquid (36) and extends along the circumferential direction of the heat conducting liquid (36).
根据权利要求15所述的摄像头模组(30)，其特征在于，所述阻流槽(39)的数量为多个，多个所述阻流槽(39)由内至外依次层叠设置。The camera module (30) according to claim 15, characterized in that the number of the choke grooves (39) is multiple, and the multiple choke grooves (39) are stacked sequentially from inside to outside.
根据权利要求15或16所示的摄像头模组(30)，其特征在于，所述阻流槽(39)的延伸路径为连续且封闭的曲线。The camera module (30) according to claim 15 or 16, characterized in that, the extension path of the choke groove (39) is a continuous and closed curve.
根据权利要求16所述的摄像头模组(30)，其特征在于，所述阻流槽(39)包括多个间隔设置的阻流槽段(391)，且相邻两个所述阻流槽(39)的阻流槽段(391)在所述导热液体(36)的周向上错位排列。The camera module (30) according to claim 16, characterized in that, the choke groove (39) comprises a plurality of choke groove segments (391) arranged at intervals, and two adjacent choke grooves The choke groove segments (391) of (39) are staggered in the circumferential direction of the heat transfer liquid (36).
根据权利要求15-18任一项所述的摄像头模组(30)，其特征在于，所述底板(33)上所述导热液体(36)所处的表面区域为第一表面区域，所述阻流槽(39)的与所述第一表面区域相接的内侧面为第一内侧面，所述第一表面区域与所述第一内侧面之间在所述阻流槽(39)内侧的夹角大于或者等于30°。The camera module (30) according to any one of claims 15-18, characterized in that, the surface area where the heat transfer liquid (36) on the base plate (33) is located is a first surface area, and the The inner surface of the choke groove (39) connected to the first surface area is the first inner surface, and the space between the first surface area and the first inner surface is inside the choke groove (39). The included angle is greater than or equal to 30°.
根据权利要求1-19任一项所述的摄像头模组(30)，其特征在于，所述感光组件(32)与底板(33)的间距小于或者等于所述底板(33)上的所述导热液体(36)在自身表面张力作用下的自然高度的90％。The camera module (30) according to any one of claims 1-19, characterized in that the distance between the photosensitive component (32) and the base plate (33) is smaller than or equal to the distance between the base plate (33) 90% of the natural height of the heat-conducting liquid (36) under the action of its own surface tension.
根据权利要求1-20任一项所述的摄像头模组(30)，其特征在于，所述感光组件(32)的靠近所述底板(33)的表面设有阻流槽(39)，所述阻流槽(39)位于所述导热液体(36)的***并沿所述导热液体(36)的周向延伸。The camera module (30) according to any one of claims 1-20, characterized in that, the surface of the photosensitive component (32) close to the bottom plate (33) is provided with a choke groove (39), so The choke groove (39) is located at the periphery of the heat conducting liquid (36) and extends along the circumferential direction of the heat conducting liquid (36).
一种电子设备(100)，其特征在于，包括：An electronic device (100), characterized in that it comprises:

屏幕(10)，所述屏幕(10)包括层叠设置的透光盖板(11)和显示屏(12)；A screen (10), the screen (10) comprising a light-transmitting cover plate (11) and a display screen (12) arranged in layers;

背壳(20)，所述背壳(20)包括背盖(21)和边框(22)，背盖(21)位于显示屏(12)的远离透光盖板(11)的一侧，并与透光盖板(11)、显示屏(12)层叠设置，背盖(21)上设有安装口(50)，边框(22)位于背盖(21)与透光盖板(11)之间，透光盖板(11)、背盖(21)与边框(22)围成内部容纳空间；a back case (20), the back case (20) includes a back cover (21) and a frame (22), the back cover (21) is located on the side of the display screen (12) away from the light-transmitting cover plate (11), and Laminated with the light-transmitting cover (11) and the display screen (12), the back cover (21) is provided with an installation port (50), and the frame (22) is located between the back cover (21) and the light-transmitting cover (11) Between, the transparent cover plate (11), the back cover (21) and the frame (22) enclose the internal accommodation space;

权利要求1-21任一项所述的摄像头模组(30)，所述摄像头模组(30)设置于所述内部容纳空间内；The camera module (30) according to any one of claims 1-21, wherein the camera module (30) is arranged in the internal accommodation space;

摄像头装饰盖(40)，摄像头装饰盖(40)覆盖并固定于所述安装口(50)处，摄像头装饰盖(40)上设有透光区域(41)，所述透光区域(41)与摄像头模组(30)的入光面相对。Camera decorative cover (40), the camera decorative cover (40) covers and is fixed at the described installation port (50), the camera decorative cover (40) is provided with a light-transmitting area (41), and the light-transmitting area (41) It is opposite to the incident surface of the camera module (30).