CN219611924U - Photosensitive assembly, camera module and electronic equipment - Google Patents

Abstract

The utility model provides a photosensitive assembly, a camera module and electronic equipment. The photosensitive chip is attached to the surface of the circuit board facing the accommodating space, and comprises a first surface, wherein the first surface is the surface of the photosensitive chip facing the accommodating space and is provided with a photosensitive area. The optical filter is at least arranged on the photosensitive area. The photosensitive assembly omits the arrangement of the boss, and the gap between the lead and the boss can be further reduced. Therefore, the camera module reduces the height of the camera module by reducing the height of the photosensitive assembly, and is beneficial to the miniaturization development of the camera module.

Description

Photosensitive assembly, camera module and electronic equipment

Technical Field

The present utility model relates to the field of electronic products, and in particular, to a photosensitive assembly, a camera module, and an electronic device.

Background

Currently, electronic devices such as mobile phones, tablet computers, cameras, video cameras, smart glasses and the like all have a camera module for taking pictures or videos. The height of camera module includes: the height of the optical lens and the height of the photosensitive assembly. On the premise of meeting the performance of the camera module, the height of the optical lens is limited, and no room for continuous reduction is reserved.

The current requirement for the thickness of the whole electronic equipment is thinner and thinner, and the height of the camera module is one of the main reasons for restricting the thinning of the electronic equipment. The camera performance is better and the height is lower and lower, and on the premise of meeting the performance of the camera module, the height reduction of the camera module is almost impossible or the cost is high.

Disclosure of Invention

The embodiment of the utility model provides a photosensitive assembly, a camera module and electronic equipment, which are used for solving the problem that the height of the camera module cannot be thinned.

In order to achieve the above purpose, the embodiment of the present utility model adopts the following technical scheme:

in a first aspect, the present utility model provides a photosensitive assembly, where the photosensitive assembly includes a circuit board, a frame, a photosensitive chip, and an optical filter, the frame is disposed at a periphery of the circuit board, and the circuit board and the frame form an accommodating space. The photosensitive chip is attached to the surface of the circuit board facing the accommodating space, and comprises a first surface, wherein the first surface is the surface of the photosensitive chip facing the accommodating space and is provided with a photosensitive area. The optical filter is at least arranged on the photosensitive area.

Compared with the embodiment, the embodiment can omit the height of the boss, and the optical filter is not required to be placed in the frame through the support of the boss. The optical filter is in direct contact with the first surface, that is, no gap exists between the optical filter and the photosensitive chip. The optical filter can be adhered to the first surface of the photosensitive chip through optical adhesive, and the optical filter can also be made of a material with viscosity, so that the optical filter can be directly connected to the first surface. The arrangement of the boss is omitted, and the gap between the lead and the boss can be further reduced. Therefore, the camera module reduces the height of the camera module by reducing the height of the photosensitive assembly, and is beneficial to the miniaturization development of the camera module.

In one possible implementation, the optical filter includes a transparent substrate and a filter material added to the transparent substrate, the filter material for filtering infrared light. The transparent substrate may include plastic, glass, optical cement, and the like. The infrared light in the light is filtered through the filter material in the transparent base material, so that the imaging quality of the camera module is improved. In some embodiments, the transparent substrate is plastic or glass, the transparent substrate is in direct contact with the photosensitive chip, and an optical adhesive is disposed between the transparent substrate and the photosensitive chip, and the optical adhesive adheres the transparent substrate to the photosensitive chip. The transparent base material can be provided with different materials according to different camera modules so as to adapt to the use conditions of different camera modules.

In one possible implementation, the transparent substrate is an optical adhesive. The filter material is directly added into the optical cement, and the filter material filters infrared light rays. The optical cement is arranged on the first surface of the photosensitive chip and at least arranged in the photosensitive area. When light rays penetrate through the lens and enter the photosensitive area of the photosensitive chip, the light rays are filtered by the filter material in the optical cement. The transparent substrate is set as an optical cement, and the optical cement has adhesiveness. Therefore, the optical cement can be directly adhered to the first surface of the photosensitive chip. That is, a connection structure is not required between the optical filter and the photosensitive chip, and the optical filter can be connected to the photosensitive chip by self-adhesion. The height of the photosensitive assembly can be further reduced, and the height of the camera module can be further reduced.

In one possible implementation, the filter material is iron oxide and/or manganese dioxide. Iron oxide, manganese dioxide or a mixture of iron oxide and manganese dioxide is added to the transparent substrate. The light is filtered through a filter material added to the transparent substrate. Specifically, the iron oxide, the manganese dioxide or the mixture of the iron oxide and the manganese dioxide is mainly used for filtering infrared light rays in the light rays, so that the imaging quality of the camera module is better.

In one possible implementation, the filter includes a first filter portion. The orthographic projection of the first filtering part on the first surface is overlapped with the photosensitive area. The photosensitive area of the photosensitive chip is opposite to the light-emitting surface of the optical lens and is used for receiving light rays emitted by the light-emitting surface of the optical lens. The first light filtering part is arranged opposite to the photosensitive area, the first light filtering part can be optical cement and light filtering materials, the first light filtering part is coated on the surface of the photosensitive area, and the first light filtering part is directly adhered to the photosensitive area. The first filtering part filters infrared light rays emitted into the photosensitive area, so that the imaging quality of the camera module is improved. And when the first light filtering part is made of optical cement and light filtering materials, the optical cement is arranged on the surface of the photosensitive area to form a protection effect on the photosensitive area, so that the service life of the photosensitive assembly is prolonged.

In one possible implementation, the filter further comprises a second filtering portion. The photosensitive chip also comprises a non-photosensitive area surrounding the photosensitive area, and the orthographic projection of the second filtering part on the first surface is overlapped with the non-photosensitive area. The photosensitive chip also comprises a non-photosensitive area surrounding the photosensitive area, and the orthographic projection of the second filtering part on the first surface is overlapped with the non-photosensitive area. The non-photosensitive area is an area where the photosensitive chip is electrically connected with the circuit board, the second light filtering part is arranged opposite to the non-photosensitive area, the second light filtering part can be made of optical cement and light filtering materials, the second light filtering part is coated on the surface of the non-photosensitive area, and the second light filtering part can be directly adhered to the non-photosensitive area. When light enters the photosensitive chip through the optical lens, part of the light can be refracted to a non-photosensitive area of the photosensitive chip. The second filtering part filters the infrared light refracted to the non-photosensitive area, so that the imaging quality of the camera module is further improved. And the second filtering part is arranged on the surface of the non-photosensitive area, so that the non-photosensitive area can be protected, and the service life of the photosensitive assembly is further prolonged.

In one possible implementation, the filter further includes a third filtering portion. The surface of the circuit board facing the accommodating space comprises an electronic device area, and the electronic device area surrounds the periphery of the photosensitive chip. The orthographic projection of the third filter portion on the surface of the circuit board facing the accommodating space overlaps the electronic device region. The third light filtering part can be optical adhesive and light filtering material, the third light filtering part is coated on the surface of the electronic device area, and the third light filtering part can be directly adhered to the electronic device area. When light enters the photosensitive chip through the optical lens, part of the light can be refracted to the electronic device area. And the third filtering part filters infrared light refracted to the electronic device area, so that the imaging quality of the camera module is further improved. And the third filtering part is arranged on the surface of the electronic device area, so that the electronic device area can be protected, and the service life of the photosensitive assembly is prolonged.

In one possible implementation, the electronics area is provided with electronics, which are enclosed in the third filter portion. The height of the electronic component protruding out of the surface of the circuit board is smaller than the height of the third light filtering part protruding out of the surface of the circuit board. When the camera module collides, the third light filtering part plays a role in protecting the electronic components, so that the risk of damaging the electronic components is reduced, and the service life of the camera module is prolonged.

In one possible implementation, the photosensitive assembly further includes a lead. The lead wire is connected between the non-photosensitive area of the photosensitive chip and the circuit board. The portion of the lead wire opposite to the non-photosensitive region is wrapped in the second filter portion, and the portion of the lead wire opposite to the electronic device region is wrapped in the third filter portion. The second filtering part and the third filtering part play a role in protecting the lead wire and prevent the lead wire from being damaged when the camera module collides. Thereby improving the service life of the camera module.

In one possible implementation, a light shielding material is provided in the second and third filter portions. The light rays are emitted into the photosensitive area through the optical lens, and part of the light rays are refracted to the photosensitive area through the non-photosensitive area and the electronic device area, so that the imaging quality of the camera module can be reduced. Therefore, the second light filtering part and the third light filtering part are provided with the shading materials, and the shading materials reduce the refraction of light rays, so that the imaging quality of the camera module is guaranteed. In some embodiments, the light blocking material may be an ink layer.

In one possible implementation, the surface of the filter facing away from the circuit board is flush with the surface of the frame facing away from the circuit board. The optical filter may be composed of an optical cement and a filter material, and a mixture of the optical cement and the filter material is filled into the housing of the photosensitive assembly. Under the premise of meeting the requirement of reducing the height of the camera module, the optical filter reaches the maximum height, and can protect the photosensitive chip and electronic components in the shell, so that the service life of the camera module is prolonged.

In one possible implementation, the thickness of the filter protruding from the photosensitive chip is less than or equal to 0.15mm. The specific value can be set according to different camera modules, for example, in the embodiment of the utility model, the specific setting value can be 0.1mm, 0.11mm, 0.12mm, 0.14mm or 0.15mm, so as to reduce the height of the camera modules.

In one possible implementation, the filter interfaces with the inner wall of the frame. In the preparation process of the photosensitive assembly, the frame is directly injection molded on the surface of the circuit board, and the electronic components and the leads are wrapped in the frame. The frame protects the electronic components and leads.

In one possible implementation, the photosensitive assembly further includes a lead. The lead wire is connected between the photosensitive chip and the circuit board. The orthographic projection of the interface of the optical filter and the frame on the first surface is positioned on the first surface, and the lead is wrapped in the frame. The frame protects the leads.

In a second aspect, a camera module is provided, where the camera module includes a lens and the photosensitive assembly, and the photosensitive assembly is located on a light-emitting side of the lens.

The camera module provided by the embodiment of the utility model comprises the photosensitive assembly according to any technical scheme, so that the camera module and the photosensitive assembly can solve the same technical problem and achieve the same effect.

In a third aspect, an electronic device is provided, including a controller and a camera module, at least one camera module being electrically connected to the controller.

The electronic equipment provided by the embodiment of the utility model comprises the camera module according to any technical scheme, so that the electronic equipment and the camera module can solve the same technical problems and achieve the same effects.

Drawings

Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present utility model;

FIG. 2 is an exploded view of the electronic device shown in FIG. 1;

fig. 3 is a schematic diagram of a part of a structure of a camera module according to some embodiments of the present utility model;

fig. 4 is a schematic structural diagram of a camera module according to still other embodiments of the present utility model;

FIG. 5 is an enlarged view of area A of FIG. 4;

FIG. 6 is a schematic diagram of a photosensitive assembly according to some embodiments of the present utility model;

FIG. 7 is a schematic structural diagram of a photosensitive assembly according to still other embodiments of the present utility model;

FIG. 8 is a schematic structural diagram of a photosensitive assembly according to still other embodiments of the present utility model;

FIG. 9 is a schematic structural diagram of a photosensitive assembly according to still other embodiments of the present utility model;

FIG. 10 is a schematic structural diagram of a photosensitive assembly according to still other embodiments of the present utility model;

FIG. 11 is a schematic structural view of a photosensitive assembly according to still other embodiments of the present utility model;

FIG. 12 is a schematic view of a photosensitive assembly according to still other embodiments of the present utility model;

FIG. 13 is a schematic structural diagram of a photosensitive assembly according to still other embodiments of the present utility model.

Detailed Description

In embodiments of the present utility model, the terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature.

In embodiments of the present utility model, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present utility model, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

The utility model provides electronic equipment, which is one type of electronic equipment with a shooting function. In particular, the electronic device may be a portable electronic device or other suitable electronic device. For example, the electronic device may be a cell phone, a tablet (tablet personal computer), a laptop (laptop computer), a personal digital assistant (personal digital assistant, PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (augmented reality, AR) glasses, AR helmets, virtual Reality (VR) glasses, VR helmets, or the like.

Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present utility model, and fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a screen 10, a back case 20, a camera module 30, and a camera trim cover 40.

It is to be understood that fig. 1 and 2 only schematically illustrate some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 1 and 2. In other examples, the electronic device 100 may not include the screen 10 and the camera trim cover 40.

The screen 10 is used to display images, videos, and the like. The screen 10 includes a light-transmitting cover plate 11 and a display screen 12 (english name: panel, also referred to as display panel). The light-transmitting cover plate 11 is laminated with the display screen 12. The light-transmitting cover plate 11 is mainly used for protecting and preventing dust of the display screen 12. The material of the transparent cover plate 11 includes, but is not limited to, glass. The display 12 may be a flexible display or a rigid display. For example, the display 12 may be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini-led (mini organic light-emitting diode) display, a micro-led (micro organic light-emitting diode) display, a micro-organic led (micro organic light-emitting diode) display, a quantum dot led (quantum dot light emitting diodes, QLED) display, a liquid crystal display (liquid crystal display, LCD).

The back shell 20 is used to protect the internal electronics of the electronic device 100. The back case 20 includes a back cover 21 and a rim 22. The back cover 21 is located at one side of the display screen 12 far away from the transparent cover plate 11, and is stacked with the transparent cover plate 11 and the display screen 12. The frame 22 is located between the back cover 21 and the light-transmitting cover plate 11. And the frame 22 is fixed to the back cover 21. Illustratively, the bezel 22 may be fixedly attached to the back cover 21 by adhesive. The frame 22 and the back cover 21 may be integrally formed, i.e. the frame 22 and the back cover 21 are integrally formed. The light-transmitting cover plate 11 is fixed to the rim 22 by gluing. The light-transmitting cover plate 11, the back cover 21 and the frame 22 enclose an internal accommodating space of the electronic device 100. The internal accommodation space accommodates the display screen 12 therein.

For convenience of the following description, an XYZ coordinate system is established, and a lamination direction of the light-transmitting cover plate 11, the display screen 12, and the back cover 21 in the electronic apparatus 100 (i.e., a thickness direction of the electronic apparatus 100) is defined as a Z-axis direction. The plane in which the light-transmitting cover plate 11, the display screen 12, or the back cover 21 is located is an XY plane. Specifically, the width direction of the electronic device 100 is the X-axis direction, and the length direction of the electronic device 100 is the Y-axis direction. It is understood that the coordinate system setting of the electronic device 100 may be flexibly set according to actual needs.

The camera module 30 is used for taking pictures/videos, and the camera module 30 is fixed in the internal accommodating cavity of the electronic device 100. In some embodiments, referring to fig. 2, the electronic device 100 further includes a midplane 23. The middle plate 23 is fixed to the inner surface of the rim 22 for one revolution. For example, the middle plate 23 may be fixed to the rim 22 by welding. Middle plate 23 may also be integrally formed with rim 22. The middle plate 23 serves as a structural "skeleton" of the electronic device 100, and the camera module 30 may be fixed to and supported by the middle plate 23 by screwing, clamping, welding, or the like. On this basis, optionally, the materials of the middle plate 23 and the frame 22 are both high thermal conductive materials. Illustratively, the materials of middle plate 23 and rim 22 include, but are not limited to, metals such as stainless steel, aluminum alloys, magnesium aluminum alloys, and the like. The middle plate 23 is in heat-conducting contact with the rim 22. The heat of the camera module 30 can be conducted to the middle plate 23 and further conducted from the middle plate 23 to the frame 22. The bezel 22 is in contact with the external air environment of the electronic device 100, and thus heat of the bezel 22 may be further dissipated into the external air environment of the electronic device 100. Thereby enabling rapid heat dissipation of the camera module 30. Meanwhile, the structural strength of the metal is generally better, and the supporting performance of the middle plate 23 and the structural strength of the frame 22 can be ensured.

In other embodiments, the camera module 30 may be fastened to other heat conductive structures of the electronic device 100 by screwing, clamping, welding, or the like. For example, when the material of the back cover 21 or the frame 22 is a metal or other high thermal conductive material, the camera module 30 may be fixed on the back cover 21 or the frame 22 to conduct heat to the external air environment of the electronic device 100 through the back cover 21 or the frame 22.

The camera module 30 may be used as a rear camera module or a front camera module.

In some embodiments, referring to fig. 2, the camera module 30 is fixed to the surface of the middle plate 23 near the back cover 21. The light incident surface of the camera module 30 faces the back cover 21. The back cover 21 is provided with a mounting opening 50. The camera decorative cover 40 covers and is fixed to the mounting opening 50. The camera decorative cover 40 is used for protecting the camera module 30. In some embodiments, the camera decorative cover 40 protrudes to a side of the back cover 21 away from the light-transmissive cover plate 11. In this way, the camera decorative cover 40 can increase the installation space of the camera module 30 in the Z-axis direction within the electronic device 100. In other embodiments, the camera trim cover 40 may also be flush with the back cover 21 or recessed into the interior receiving space of the electronic device 100. The camera decorative cover 40 is provided with a light-transmitting region 41. The light-transmitting region 41 allows the light L1 of the subject to transmit and enter the light-incident surface of the camera module 30. In the present embodiment, the camera module 30 is used as a rear camera module of the electronic apparatus 100. Specifically, the camera module 30 may be used as a rear-mounted main camera module, a wide-angle camera module, or a telephoto camera module.

In other embodiments, the camera module 30 may be fixed on the surface of the middle plate 23 near the transparent cover plate 11. The light incident surface of the camera module 30 faces the light-transmitting cover plate 11. The display screen 12 is provided with an optical path avoiding hole. The light path avoidance hole allows the scenery light to penetrate through the light-transmitting cover plate 11 and then enter the light incident surface of the camera module 30. In this way, the camera module 30 functions as a front camera module of the electronic apparatus 100.

The electronic device 100 also includes a controller. At least one camera module 30 is electrically connected to the controller. The controller is used for controlling the working state of the camera module 30.

Referring to fig. 3, fig. 3 is a schematic diagram illustrating a portion of a camera module 30 according to some embodiments of the utility model. The camera module 30 includes a lens 31, a photosensitive assembly 32, and a chassis 33.

The lens 31 is used for imaging the subject light L1. When the camera module 30 is applied to the electronic device 100 shown in fig. 1-2, the optical axis O of the lens 31 may extend along the Z-axis direction or may extend in a direction parallel to the XY plane. When the optical axis O of the lens 31 extends along the Z-axis direction, the camera module 30 is a vertical camera module. When the optical axis O of the lens 31 extends in a direction parallel to the XY plane, the camera module 30 is a periscope type camera module. The embodiment shown in fig. 3 and the following embodiments are all described based on camera module 30 being an upright camera module, and are not to be construed as limiting the utility model in any way.

The photosensitive assembly 32 is located at the light emitting side of the lens 31, and the object light L1 is imaged by the lens 31 to generate an imaging light beam L2, and the imaging light beam L2 is incident on the photosensitive assembly 32, and the photosensitive assembly 32 converts the image signal into an electrical signal for output. The photosensitive assembly 32 includes a circuit board 321 and a photosensitive chip 322. The photosensitive chip 322 is disposed on the surface of the circuit board 321 near the lens 31. In other embodiments, the circuit board 321 is provided with a mounting opening, and the photosensitive chip 322 is embedded in the mounting opening. The photo chip 322 has a photo surface facing the lens 31. Optionally, referring to fig. 3, the photosensitive assembly 32 may further include a reinforcing plate 323 in addition to the circuit board 321 and the photosensitive chip 322. The reinforcing plate 323 is disposed on a side of the circuit board 321 away from the lens 31, and is laminated and fixed with the circuit board 321. The reinforcing plate 323 serves to increase the structural strength of the photosensitive member 32.

In other embodiments, the reinforcing plate 323 may not be provided. The photosensitive member 32 is movable in a direction approaching or separating from the lens 31 along the optical axis O of the lens 31 to achieve auto-focusing (automatic focusing, AF); and/or the photosensitive assembly 32 can be moved in the XY plane or tilted with respect to the optical axis O of the lens 31 to achieve optical anti-shake (optical image stabilization, OIS). The structure used to drive the photosensitive assembly 32 to move to achieve AF and/or OIS may be a shape memory alloy (shape memory alloy, SMA) motor, voice coil motor, or the like, and is not specifically limited herein.

The bottom plate 33 is located on the side of the photosensitive assembly 32 away from the lens 31. The bottom plate 33 serves as a bottom protection plate of the camera module 30, protects the photosensitive assembly 32, prevents foreign objects from invading from the bottom of the camera module 30 to interfere with AF and/or OIS movement of the photosensitive assembly 32, and simultaneously prevents moisture and dust from entering the photosensitive assembly 32 from the bottom of the camera module 30 to cause problems such as short circuit and rust.

It should be noted that fig. 3 only shows a schematic view of a part of the structure of the camera module 30, and the camera module 30 further includes other structures, which are specifically as follows.

The concrete structure is as follows: referring to fig. 4, fig. 4 is a schematic structural diagram of a camera module 30 according to still another embodiment of the utility model. In this embodiment, the camera module 30 includes a frame 34 and a bracket 35 in addition to the optical lens 31 and the photosensitive assembly 32. The frame 34 is disposed around the periphery of the circuit board 321, the frame 34 and the circuit board 321 together form a casing of the photosensitive assembly 32, and the top of the frame 34 encloses the light-transmitting hole 341. The optical lens 31 is disposed outside the housing of the photosensitive assembly 32 and moves along its own optical axis O with respect to the housing to achieve AF. Specifically, the holder 35 is located outside the housing of the photosensitive assembly 32 and fixed to the housing, and the optical lens 31 is movable along its own optical axis O with respect to the holder 35, whereby the movement of the optical lens 31 with respect to the housing of the photosensitive assembly 32 is achieved by means of the holder 35. The bracket 35 may be integrally formed with the housing of the photosensitive member 32, or may be separately manufactured and assembled together, which is not particularly limited herein. The photosensitive member 32 is disposed in the housing, and the photosensitive member 32 is movable in an XY plane with respect to the housing or tiltable with respect to the optical axis O of the optical lens 31 to realize OIS. The camera module 30 in this embodiment has both the AF function and the OIS function, and has better shooting definition and better performance.

With continued reference to fig. 4, in order to improve the imaging quality of the camera module 30, an optical filter 324 is disposed between the photosensitive chip 322 and the optical lens 31. The filter 324 is an optical device used to select the desired radiation band in the optical information. In some embodiments, the filter 324 may be Blue Glass (BG) for filtering infrared light in optical information. At the inner wall of the frame 34, there are provided bosses 342 for supporting the optical filters 324, and the number of bosses 342 is at least two. The light passing through the optical lens 31 is emitted into the photosensitive assembly 32 through the optical filter 324, and the optical filter 324 filters the infrared light, so that the imaging of the camera module 30 is better. Therefore, in summary, the height of the camera module 30 includes: the height of the optical lens 31 and the height of the photosensitive assembly 32. On the premise of meeting the performance of the camera module 30, the height of the optical lens 31 is limited, and no room for continuous reduction is provided.

The height of photosensitive assembly 32 includes: the height of the filter 324, the height of the boss 342, the height of the adhesive between the frame 34 and the bracket 35, the height of the photo-sensing chip 322, the height of the circuit board 321, and the height of the escape gap between the electronic component 3245 on the circuit board 321 and the boss 342. The electronic component 3245 here mainly includes a lead 325, a resistor, a capacitor, and the like.

Referring to fig. 5, fig. 5 is an enlarged view of a region a in fig. 4. It should be noted that, the circuit board 321 and the photo-sensing chip 322 are electrically connected by the lead 325, one end of the lead 325 is connected to the photo-sensing chip 322 and protrudes from the photo-sensing chip 322 by a certain height, and the other end of the lead 325 is connected to the circuit board 321. The height of the avoiding gap between the electronic component 3245 and the boss 342 on the circuit board 321 is the distance h1 between the highest point of the lead 325 protruding from the photosensitive chip 322 and the boss 342.

Accordingly, further reduction in the height of the camera module 30 may be achieved by reducing the height of the filter 324 and the standoff of the leads 325. However, too small filter 324 may cause a problem of reduced strength, and filter 324 may be easily damaged when a collision occurs during use of camera module 30. The minimum height of the current filter 324 may be 0.03mm. The clearance of dodging of the lead 325 is too small, and the lead 325 is easy to break when the camera module 30 collides. In order to meet the requirements of protecting the leads 325, the minimum height of the clearance gap of the leads 325 can be 0.15mm at present.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a photosensitive assembly 32 according to some embodiments of the present utility model. In order to further reduce the height of the camera module 30, the present utility model further provides a photosensitive assembly 32, which includes a circuit board 321, a frame 34, a photosensitive chip 322 and an optical filter 324, wherein the frame 34 is disposed at the periphery of the circuit board 321, and the circuit board 321 and the frame 34 form an accommodating space. The photosensitive chip 322 is mounted on a surface of the circuit board 321 facing the accommodating space, the photosensitive chip 322 includes a first surface 3221, the first surface 3221 is a surface of the photosensitive chip 322 facing the accommodating space, and the first surface 3221 has a photosensitive region 3222. The filter 324 is disposed at least on the photosensitive region 3222.

The photosensitive region 3222 refers to a region of the photosensitive chip 322 that captures light. The photosensitive region 3222 includes a plurality of pixel units, each including a photoelectric converter and a switching tube. The photoelectric converter is a device for converting an optical signal into an electrical signal, and may be, for example, a PD (photo diode), an APD (avalanche photo diode ), or the like. The switching transistor may be an N-or P-channel metal oxide semiconductor field effect transistor (nmosft, NMOS transistor or PMOSFET, PMOS), for example. The input end of the switching tube is connected with the signal output end of the photoelectric converter. When the switching tube is turned off, the pixel unit does not output an electric signal, and when the switching tube is turned on, the pixel unit can output the electric signal converted by the photoelectric converter. Other structures for pixel cells are well known to those skilled in the art and will not be described in detail herein.

The optical filter 324 is directly disposed on the first surface 3221 of the photosensitive chip 322, and compared with the above embodiment, the height of the boss 342 can be omitted in this embodiment, and the optical filter 324 is not required to be disposed in the frame 34 through the support of the boss 342. The filter 324 is in direct contact with the first surface 3221, that is, there is no gap between the filter 324 and the photo-sensing chip 322. The optical filter 324 may be adhered to the first surface 3221 of the photosensitive chip 322 by using an optical adhesive, and the optical filter 324 may also be made of a material having an adhesive property, so that the optical filter 324 may be directly connected to the first surface 3221. The boss 342 is omitted, and the gap between the lead 325 and the boss 342 can be further reduced. Therefore, the camera module 30 reduces its height by reducing the height of the photosensitive assembly 32, which is beneficial to the miniaturization development of the camera module 30.

In some embodiments, the filter 324 includes a transparent substrate and a filter material added to the transparent substrate for filtering infrared light. The transparent substrate may include plastic, glass, optical cement, and the like. The infrared light in the light is filtered by the filter material in the transparent substrate, so that the imaging quality of the camera module 30 is improved. In some embodiments, the transparent substrate is plastic or glass, the transparent substrate is in direct contact with the photosensitive chip 322, and an optical adhesive is disposed between the transparent substrate and the photosensitive chip 322, and the optical adhesive adheres the transparent substrate to the photosensitive chip 322. The transparent substrate can be provided with different materials according to different camera modules 30 so as to adapt to the use conditions of different camera modules 30.

In other embodiments, the transparent substrate is an optical adhesive. In this way, the filter material is directly added into the optical cement, and the filter material filters the infrared light. The optical cement is disposed on the first surface 3221 of the photosensitive chip 322, and at least disposed on the photosensitive region 3222. When light is transmitted through the lens and enters the photosensitive region 3222 of the photosensitive chip 322, the light is filtered by the filter material in the optical cement. The transparent substrate is set as an optical cement, and the optical cement has adhesiveness. Therefore, the optical cement may be directly adhered to the first surface 3221 of the photosensitive chip 322. That is, a connection structure is not required between the optical filter 324 and the photo-sensing chip 322, and the optical filter 324 can be connected to the photo-sensing chip 322 by self-adhesion. The height of the photosensitive assembly 32 and thus the height of the camera module 30 can be further reduced.

In some embodiments, the filter material is iron oxide and/or manganese dioxide. Iron oxide, manganese dioxide or a mixture of iron oxide and manganese dioxide is added to the transparent substrate. The light is filtered through a filter material added to the transparent substrate. Specifically, the iron oxide, manganese dioxide or the mixture of the iron oxide and manganese dioxide mainly filters the infrared light in the light, so that the imaging quality of the camera module 30 is better.

With continued reference to fig. 6, in some embodiments, the filter 324 includes a first filter portion 3241. The front projection of the first filter portion 3241 on the first surface 3221 overlaps the photosensitive region 3222. The photosensitive area 3222 of the photosensitive chip 322 is opposite to the light emitting surface of the optical lens 31, and the photosensitive area 3222 is configured to receive light incident on the light emitting surface of the optical lens 31. The first filter portion 3241 is disposed opposite to the photosensitive region 3222, the first filter portion 3241 may be an optical cement and a filter material, the first filter portion 3241 is coated on the surface of the photosensitive region 3222, and the first filter portion 3241 is directly adhered to the photosensitive region 3222. The first filtering portion 3241 filters the infrared light incident on the photosensitive region 3222, thereby improving the imaging quality of the camera module 30. In addition, when the first filter portion 3241 is made of optical cement and a filter material, the optical cement disposed on the surface of the photosensitive region 3222 can also protect the photosensitive region 3222, so as to further improve the service life of the photosensitive assembly 32.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, the filter 324 further includes a second filtering portion 3242. The photo-sensing chip 322 further includes a non-photosensitive region 3223 surrounding the photosensitive region 3222, and the orthographic projection of the second filter portion 3242 on the first surface 3221 overlaps with the non-photosensitive region 3223. The non-photosensitive region 3223 is a region where the photosensitive chip 322 is electrically connected to the circuit board 321, the second filter portion 3242 is disposed opposite to the non-photosensitive region 3223, the second filter portion 3242 may be an optical adhesive and a filter material, the second filter portion 3242 is coated on the surface of the non-photosensitive region 3223, and the second filter portion 3242 may be directly adhered to the non-photosensitive region 3223. When the light enters the photosensitive chip 322 through the optical lens 31, a part of the light is refracted to the non-photosensitive area 3223 of the photosensitive chip 322. The second filtering portion 3242 filters the infrared light refracted to the non-photosensitive region 3223, and further improves the imaging quality of the camera module 30. In addition, the second filter portion 3242 is disposed on the surface of the non-photosensitive region 3223, and can protect the non-photosensitive region 3223, thereby improving the service life of the photosensitive assembly 32.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, the filter 324 further includes a third filtering portion 3243. The surface of the circuit board 321 facing the accommodation space includes an electronic device region 3244 for mounting an electronic component 3245. Electronics region 3244 surrounds the periphery of photosensitive chip 322. The orthographic projection of the third filter portion 3243 on the surface of the circuit board 321 facing the accommodation space overlaps the electronic device region 3244. The third filter portion 3243 is disposed opposite to the electronic device region 3244, the third filter portion 3243 may be an optical adhesive and a filter material, the third filter portion 3243 is coated on a surface of the electronic device region 3244, and the third filter portion 3243 may be directly adhered to the electronic device region 3244. When light enters the photosensitive chip 322 through the optical lens 31, part of the light is refracted to the electronic device area 3244. The third filtering portion 3243 filters the infrared light refracted to the electronic device region 3244, further improving the imaging quality of the camera module 30. In addition, the third filter portion 3243 is disposed on the surface of the electronic device region 3244, which can protect the electronic device region 3244, thereby improving the service life of the photosensitive assembly 32.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, the electronic device region 3244 is provided with electronic components 3245, the electronic components 3245 being enclosed within the third filter portion 3243. That is, the height of the electronic component 3245 protruding from the surface of the circuit board 321 is smaller than the height of the third filter portion 3243 protruding from the surface of the circuit board 321. When the camera module 30 collides, the third filtering part 3243 plays a role in protecting the electronic component 3245, so that the risk of damage to the electronic component 3245 is reduced, and the service life of the camera module 30 is prolonged.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, photosensitive assembly 32 also includes leads 325. The lead 325 is connected between the non-photosensitive region 3223 of the photosensitive chip 322 and the circuit board 321. The photo chip 322 is electrically connected to the circuit board 321 through a lead 325. The portion of the lead 325 opposite the non-photosensitive region 3223 is wrapped in the second filter portion 3242, and the portion of the lead 325 opposite the electronic device region 3244 is wrapped in the third filter portion 3243. The second filter portion 3242 and the third filter portion 3243 protect the leads 325 from damaging the leads 325 when the camera module 30 collides. Thereby improving the life of the camera module 30.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, a light shielding material 3246 is disposed within the second and third filter portions 3242 and 3243. When light enters the photosensitive region 3222 through the optical lens 31, part of the light is refracted to the photosensitive region 3222 through the non-photosensitive region 3223 and the electronic device region 3244, so that the imaging quality of the camera module 30 is reduced. Therefore, the light shielding material 3246 is disposed on the second light filtering portion 3242 and the third light filtering portion 3243, and the light shielding material 3246 reduces refraction of light, thereby ensuring imaging quality of the camera module 30. In some embodiments, the light blocking material 3246 can be an ink layer.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, the surface of the filter 324 facing away from the circuit board 321 is flush with the surface of the frame 34 facing away from the circuit board 321. The filter 324 may be composed of an optical cement and a filter material, and a mixture of the optical cement and the filter material is filled into the housing of the photosensitive assembly 32. Under the premise of reducing the height of the camera module 30, the optical filter 324 reaches the maximum height, so that the photosensitive chip 322 and the electronic components 3245 in the shell can be protected, and the service life of the camera module 30 is prolonged.

In some embodiments, the thickness of the filter 324 protruding from the photo-sensing chip 322 is less than or equal to 0.15mm. The specific value may be set according to different camera modules 30, for example, in the embodiment of the present utility model, the specific setting value may be 0.1mm, 0.11mm, 0.12mm, 0.14mm or 0.15mm, so as to reduce the height of the camera module 30.

Referring to fig. 13, fig. 13 is a schematic structural diagram of a photosensitive assembly 32 according to still another embodiment of the present utility model. In some embodiments, the filter 324 interfaces with the inner wall of the frame 34. Photosensitive assembly 32 also includes leads 325. The lead 325 is connected between the photo chip 322 and the circuit board 321. An orthographic projection of the interface of filter 324 and frame 34 on first surface 3221 is positioned on first surface 3221, and leads 325 are encased within frame 34. In the process of preparing the photosensitive assembly 32, the frame 34 is directly injection molded on the surface of the circuit board 321, and the electronic component 3245 and the leads 325 are wrapped in the frame 34. Frame 34 protects electronic components 3245 and leads 325.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (16)

1. A photosensitive assembly, comprising:

the circuit board and the frame are arranged on the periphery of the circuit board, and the circuit board and the frame form an accommodating space;

the photosensitive chip is attached to the surface, facing the accommodating space, of the circuit board and comprises a first surface, wherein the first surface is the surface, facing the accommodating space, of the photosensitive chip and is provided with a photosensitive area;

the optical filter is at least arranged on the photosensitive area.

2. The photosensitive assembly of claim 1, wherein the optical filter comprises a transparent substrate and a filter material added to the transparent substrate, the filter material for filtering infrared light.

3. The photosensitive assembly of claim 2, wherein the transparent substrate is an optical adhesive.

4. A photosensitive assembly according to claim 2 or claim 3, wherein the filter material is iron oxide and/or manganese dioxide.

5. The photosensitive assembly of claim 1 or 2, wherein the optical filter comprises: a first filter portion;

the orthographic projection of the first filtering part on the first surface is overlapped with the photosensitive area.

6. The photosensitive assembly of claim 5, wherein said filter further comprises: a second filter portion;

the photosensitive chip further comprises a non-photosensitive area surrounding the photosensitive area, and the orthographic projection of the second filtering part on the first surface is overlapped with the non-photosensitive area.

7. The photosensitive assembly of claim 6, wherein the filter further comprises: a third filter part;

the surface of the circuit board facing the accommodating space comprises an electronic device area, and the electronic device area surrounds the periphery of the photosensitive chip;

an orthographic projection of the third filter portion on a surface of the circuit board facing the accommodating space overlaps the electronic device region.

8. The photosensitive assembly of claim 7, wherein the electronics area is provided with electronics, the electronics being encased in a third filter portion.

9. The photosensitive assembly of claim 7 or 8, further comprising: a lead wire;

the lead is connected between the non-photosensitive area of the photosensitive chip and the circuit board;

the portion of the lead wire opposite to the non-photosensitive region is wrapped in the second light filtering portion, and the portion of the lead wire opposite to the electronic device region is wrapped in the third light filtering portion.

10. The photosensitive assembly of claim 7 or 8, wherein a light shielding material is disposed within the second filter portion and the third filter portion.

11. The photosensitive assembly of claim 1 or 2, wherein,

the surface of the optical filter, which faces away from the circuit board, is flush with the surface of the frame, which faces away from the circuit board.

12. The photosensitive assembly of claim 1 or 2, wherein the thickness of the optical filter protruding from the photosensitive chip is less than or equal to 0.15mm.

13. The photosensitive assembly of claim 1 or 2, wherein the filter is attached to an inner wall of the frame.

14. The photosensitive assembly of claim 13, further comprising: a lead wire;

the lead is connected between the photosensitive chip and the circuit board;

an orthographic projection of an interface of the optical filter and the frame on the first surface is positioned on the first surface, and the lead is wrapped in the frame.

15. The utility model provides a camera module, its characterized in that still includes:

a lens;

the photosensitive assembly of any one of claims 1-14, said photosensitive assembly being positioned on a light exit side of said lens.

16. An electronic device, comprising:

a controller;

the camera module of at least one claim 15, the at least one camera module electrically connected to the controller.