WO2023013487A1 - Composition durcissable multicomposant et son utilisation - Google Patents
Composition durcissable multicomposant et son utilisation Download PDFInfo
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- WO2023013487A1 WO2023013487A1 PCT/JP2022/028867 JP2022028867W WO2023013487A1 WO 2023013487 A1 WO2023013487 A1 WO 2023013487A1 JP 2022028867 W JP2022028867 W JP 2022028867W WO 2023013487 A1 WO2023013487 A1 WO 2023013487A1
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- curable composition
- epoxy resin
- polyoxyalkylene polymer
- weight
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 117
- 229920000642 polymer Polymers 0.000 claims abstract description 138
- -1 mercaptan compound Chemical class 0.000 claims abstract description 114
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- 229920000647 polyepoxide Polymers 0.000 claims abstract description 88
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 82
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 70
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 59
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims description 35
- 239000011256 inorganic filler Substances 0.000 claims description 20
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 10
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 150000003512 tertiary amines Chemical class 0.000 claims description 8
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims description 6
- 125000005842 heteroatom Chemical group 0.000 claims description 6
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 5
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- QJOOZNCPHALTKK-UHFFFAOYSA-N trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC QJOOZNCPHALTKK-UHFFFAOYSA-N 0.000 claims description 5
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 claims description 4
- XZQIZFNSIXIEBH-UHFFFAOYSA-N 3-[chloromethyl(dimethoxy)silyl]propane-1-thiol Chemical compound CO[Si](CCl)(OC)CCCS XZQIZFNSIXIEBH-UHFFFAOYSA-N 0.000 claims description 4
- FWWKQFGBMPLAND-UHFFFAOYSA-N 3-[dimethoxy(methoxymethyl)silyl]propane-1-thiol Chemical compound COC[Si](OC)(OC)CCCS FWWKQFGBMPLAND-UHFFFAOYSA-N 0.000 claims description 4
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- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- KTJUNCYQALUJRL-UHFFFAOYSA-N dimethoxymethylsilylmethanethiol Chemical compound COC(OC)[SiH2]CS KTJUNCYQALUJRL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
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- 125000005647 linker group Chemical group 0.000 claims description 4
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- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 4
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- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 14
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- 239000004014 plasticizer Substances 0.000 description 14
- 229920000620 organic polymer Polymers 0.000 description 13
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 12
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- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 7
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- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical compound COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 6
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- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 5
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 5
- OHXAOPZTJOUYKM-UHFFFAOYSA-N 3-Chloro-2-methylpropene Chemical compound CC(=C)CCl OHXAOPZTJOUYKM-UHFFFAOYSA-N 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
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- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 4
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- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 4
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- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 4
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- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 3
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 3
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- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
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- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 description 3
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
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- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 2
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- 235000013824 polyphenols Nutrition 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- MBSOYVMTSJAYPW-UHFFFAOYSA-N sulfanylsilane 3-trimethoxysilylpropane-1-thiol Chemical compound S[SiH3].CO[Si](OC)(OC)CCCS MBSOYVMTSJAYPW-UHFFFAOYSA-N 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- BOTMPGMIDPRZGP-UHFFFAOYSA-N triethoxy(isocyanatomethyl)silane Chemical compound CCO[Si](OCC)(OCC)CN=C=O BOTMPGMIDPRZGP-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- XSIGLRIVXRKQRA-UHFFFAOYSA-N triethoxysilylmethanethiol Chemical compound CCO[Si](CS)(OCC)OCC XSIGLRIVXRKQRA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Definitions
- the present invention relates to a multi-component curable composition, and a cured product and waterproof material using it.
- the present invention also relates to a method of manufacturing a waterproof structure using the multi-component curable composition.
- Patent Document 1 discloses a technique of blending a modified silicone compound containing two or more reactive silicon groups in one molecule, a mercaptosilane compound, and an epoxy resin. is disclosed.
- Patent Document 2 discloses a polyoxyalkylene polymer having a specific reactive silicon group, a (meth)acrylic acid ester polymer having a specific reactive silicon group, and an epoxy resin curing agent. and a B-part comprising an epoxy resin and a silanol condensation catalyst are disclosed.
- an object of the present invention is to provide a multicomponent curable composition capable of providing a cured product having excellent tensile properties and tear strength.
- the present inventors have made intensive studies to solve the above problems, and found that aminosilane (C), mercaptan It is the first time that a multicomponent curable composition capable of providing a cured product having excellent tensile properties and tear strength can be obtained by blending the compound (D) and the hydroxyl group-containing polyoxyalkylene polymer (F). This led to the completion of the present invention.
- one aspect of the present invention is a polyoxyalkylene polymer (A) having a reactive silicon group represented by general formula (1), an epoxy resin curing agent (B), an aminosilane (C), and a mercaptan compound (D ) and a B agent containing an epoxy resin (E), wherein the A agent and / or the B agent contains a hydroxyl group-containing polyoxyalkylene polymer (F).
- A a reactive silicon group represented by general formula (1)
- an epoxy resin curing agent B
- an aminosilane C
- a mercaptan compound D
- E a B agent containing an epoxy resin
- F a hydroxyl group-containing polyoxyalkylene polymer
- composition —Si(R) 3-a (X) a
- each R is independently a hydrocarbon group having 1 to 20 carbon atoms, or —OSi(R′) 3 (R′ is each independently a hydrocarbon group having 1 to 20 carbon atoms.
- the hydrocarbon group as R may be substitute
- a multicomponent curable composition capable of providing a cured product having excellent tensile properties and tear strength.
- a multi-component curable composition according to one embodiment of the present invention is a polyoxyalkylene having a reactive silicon group represented by general formula (1)
- each R is independently a hydrocarbon group having 1 to 20 carbon atoms, or —OSi(R′) 3 (R′ is each independently a hydrocarbon group having 1 to 20 carbon atoms.
- the hydrocarbon group as R may be substituted and may have a hetero-containing group.
- X is each independently a hydroxyl group or a hydro is a degradable group.
- a is an integer of 1 to 3.
- Inexpensive two-liquid urethane products are commonly used for coating film waterproofing materials, but non-isocyanate products have been required due to environmental regulations.
- Patent Documents 1 and 2 for example, when a non-isocyanate curing agent is used, there is room for improvement in terms of tensile properties and tear strength.
- the curable composition contains a plasticizer and a low-cost filler in order to reduce the viscosity and cost, the above problems arise.
- ⁇ Aminosilane (C), mercaptan compound (D), and hydroxyl group-containing polyoxyalkylene polymer (F) are compounded into a multicomponent curable composition containing a specific polyoxyalkylene polymer and epoxy resin. By doing so, it is possible to obtain a multicomponent curable composition capable of providing a cured product having excellent tensile properties and tear strength.
- the multicomponent curable composition contains an inorganic filler (e.g., calcium carbonate), a plasticizer, etc., the aminosilane (C), the mercaptan compound (D), and the hydroxyl group-containing polyoxyalkylene polymer
- an inorganic filler e.g., calcium carbonate
- a plasticizer e.g., ethylene glycol dimethacrylate
- the aminosilane (C) e.g., calcium carbonate
- D mercaptan compound
- F hydroxyl group-containing polyoxyalkylene polymer
- the present multi-component curable composition that is environmentally friendly and has excellent tensile properties and tear strength.
- the present multi-component curable composition can be used by increasing the content of inexpensive materials such as calcium carbonate (inorganic filler), plasticizer, and the like, so the cost can be reduced. But it is advantageous.
- a waterproof material with excellent tensile properties and tear strength can be produced without using highly toxic isocyanate.
- sustainable development such as Goal 12 “Ensure sustainable consumption and production patterns” and Goal 14 “Conserve and sustainably use the seas, seas and marine resources for sustainable development”. can contribute to the achievement of various development goals (SDGs).
- SDGs development goals
- the multicomponent curable composition comprises a polyoxyalkylene polymer (A) having a specific reactive silicon group, an epoxy resin curing agent (B), an aminosilane (C), and a mercaptan compound (D ) and a B agent containing an epoxy resin (E), and the A agent and/or the B agent contain a hydroxyl group-containing polyoxyalkylene polymer (F).
- a polyoxyalkylene polymer (A) having a reactive silicon group has a reactive silicon group represented by general formula (1).
- —Si(R) 3-a (X) a (1) each R is independently a hydrocarbon group having 1 to 20 carbon atoms, or —OSi(R′) 3 (R′ is each independently a hydrocarbon group having 1 to 20 carbon atoms.
- the hydrocarbon group as R may be substituted and may have a hetero-containing group.
- X is each independently a hydroxyl group or a hydro is a degradable group.
- a is an integer of 1 to 3.
- the number of carbon atoms in the hydrocarbon group of R is preferably 1 to 10, more preferably 1 to 5, even more preferably 1 to 3.
- Specific examples of R include, for example, methyl group, ethyl group, chloromethyl group, methoxymethyl group and N,N-diethylaminomethyl group, preferably methyl group, ethyl group and chloromethyl group. , a methoxymethyl group, more preferably a methyl group or a methoxymethyl group. According to the said structure, it has the advantage that it is easy to balance storage stability and reactivity.
- Examples of X include hydroxyl group, halogen, alkoxy group, acyloxy group, ketoximate group, amino group, amide group, acid amide group, aminooxy group, mercapto group, and alkenyloxy group.
- an alkoxy group such as a methoxy group and an ethoxy group is more preferred, and a methoxy group and an ethoxy group are particularly preferred, since they are moderately hydrolyzable and easy to handle.
- Specific examples of the reactive silicon group possessed by the polyoxyalkylene polymer (A) include a trimethoxysilyl group, a triethoxysilyl group, a tris(2-propenyloxy)silyl group, a triacetoxysilyl group, and dimethoxymethyl silyl group, diethoxymethylsilyl group, dimethoxyethylsilyl group, (chloromethyl)dimethoxysilyl group, (chloromethyl)diethoxysilyl group, (methoxymethyl)dimethoxysilyl group, (methoxymethyl)diethoxysilyl group, (N ,N-diethylaminomethyl)dimethoxysilyl group, (N,N-diethylaminomethyl)diethoxysilyl group, and the like, but are not limited thereto.
- methyldimethoxysilyl trimethoxysilyl, triethoxysilyl, (chloromethyl)dimethoxysilyl, (methoxymethyl)dimethoxysilyl, (methoxymethyl)diethoxysilyl, (N,N- Diethylaminomethyl)dimethoxysilyl group is preferred because it exhibits high activity and gives a cured product with good mechanical properties, and a trimethoxysilyl group and a triethoxysilyl group are more preferred because a cured product with high rigidity can be obtained. A trimethoxysilyl group is more preferred.
- the polyoxyalkylene-based polymer (A) may have more than one reactive silicon group on average at one terminal site. Having more than one reactive silicon group on average at one terminal site means that the polyoxyalkylene polymer (A) has 2 at one terminal site as represented by the following general formula (2) It shows that polyoxyalkylenes with one or more reactive silicon groups are included. That is, the polyoxyalkylene-based polymer (A) may contain only a polyoxyalkylene having two or more reactive silicon groups at one terminal site, or two or more at one terminal site. and polyoxyalkylenes having one reactive silicon group at one terminal site.
- the plurality of terminal sites possessed by one molecule of polyoxyalkylene may include both a terminal site having two or more reactive silicon groups and a terminal site having one reactive silicon group.
- the polyoxyalkylene polymer (A) as a whole has an average of more than one reactive silicon group at one terminal site, but a poly having a terminal site having no reactive silicon group It may contain oxyalkylene.
- the terminal portion of the polyoxyalkylene-based polymer (A) in this multi-component curable composition has the general formula (2):
- R 1 and R 3 are each independently a divalent C 1-6 bonding group, and the atoms bonded to the respective carbon atoms adjacent to R 1 and R 3 are carbon, oxygen , nitrogen, each of R 2 and R 4 is independently hydrogen or a hydrocarbon group having 1 to 10 carbon atoms, n is an integer of 1 to 10, R 5 is a substituted or an unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxyl group or a hydrolyzable group, and c is an integer of 1 to 3.).
- R 1 and R 3 may be a divalent organic group having 1 to 6 carbon atoms, may contain an oxygen atom, or may be a hydrocarbon group.
- the number of carbon atoms in the hydrocarbon group is preferably 1-4, more preferably 1-3, even more preferably 1-2.
- Specific examples of R 1 include CH 2 OCH 2 , CH 2 O and CH 2 , preferably CH 2 OCH 2 .
- Specific examples of R 3 include CH 2 and CH 2 CH 2 , preferably CH 2 .
- the number of carbon atoms in the hydrocarbon groups of R 2 and R 4 is preferably 1-5, more preferably 1-3, even more preferably 1-2.
- Specific examples of R 2 and R 4 include a hydrogen atom, a methyl group and an ethyl group, preferably a hydrogen atom and a methyl group, more preferably a hydrogen atom.
- the terminal moiety represented by the general formula (2) is CH 2 OCH 2 for R 1 , CH 2 for R 3 , and hydrogen atoms for R 2 and R 4 .
- n is preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and even more preferably 1 or 2.
- n is not limited to one value, and may be a mixture of multiple values.
- the number of reactive silicon groups possessed by the polyoxyalkylene polymer (A) is preferably more than 1.0 on average at one terminal site, more preferably 1.1 or more. , is more preferably 1.5 or more, and even more preferably 2.0 or more. Also, the number is preferably 5 or less, more preferably 3 or less.
- the number of terminal sites having more than one reactive silicon group contained in one molecule of the polyoxyalkylene polymer (A) is preferably 0.5 or more on average, and 1.0 It is more preferably 1 or more, still more preferably 1.1 or more, and even more preferably 1.5 or more. Also, the number is preferably 4 or less, more preferably 3 or less.
- the polyoxyalkylene polymer (A) may have reactive silicon groups in addition to the terminal sites, but having them only in the terminal sites yields a rubber-like cured product with high elongation and low elastic modulus. It is preferable because it becomes easy to be
- the average number of reactive silicon groups per molecule of the polyoxyalkylene polymer (A) is preferably more than 1.0, more preferably 1.2 or more, and further preferably 1.3 or more. It is preferably 1.5 or more, more preferably 1.7 or more. Also, the number is preferably 6.0 or less, more preferably 5.5 or less, and most preferably 5.0 or less. If the average number of reactive silicon groups per molecule is 1.0 or less, a cured product with high strength may not be obtained. If the average number of reactive silicon groups per molecule exceeds 6.0, it may not be possible to obtain a cured product with high elongation.
- the main chain skeleton of the polyoxyalkylene polymer (A) is not particularly limited, and examples include polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, Examples include polyoxypropylene-polyoxybutylene copolymers. Among them, polyoxypropylene is preferred.
- the number average molecular weight of the polyoxyalkylene polymer (A) is 3,000 to 100,000, more preferably 3,000 to 50,000, and particularly preferably 3,000 to 30,000 in terms of polystyrene equivalent molecular weight in GPC. If the number average molecular weight is less than 3,000, the amount of reactive silicon groups to be introduced increases, which may be disadvantageous in terms of production costs. There is
- the organic polymer precursor before the introduction of the reactive silicon group was subjected to the hydroxyl value measurement method of JIS K 1557 and the iodine value of JIS K 0070.
- the terminal group concentration was measured by titration analysis based on the principle of the measurement method, and indicate the terminal group equivalent molecular weight obtained by considering the structure of the organic polymer (degree of branching determined by the polymerization initiator used).
- the terminal group-equivalent molecular weight of the polyoxyalkylene-based polymer (A) is obtained by preparing a calibration curve of the number average molecular weight obtained by general GPC measurement of the organic polymer precursor and the above-mentioned terminal-group-equivalent molecular weight. It is also possible to convert the number-average molecular weight of the polymer (A) obtained by GPC into a terminal group-equivalent molecular weight.
- the molecular weight distribution (Mw/Mn) of the polyoxyalkylene polymer (A) is not particularly limited, but is preferably narrow, preferably less than 2.0, more preferably 1.6 or less, and even more preferably 1.5 or less. , 1.4 or less is particularly preferred, and 1.2 or less is most preferred.
- the molecular weight distribution of the polyoxyalkylene polymer (A) can be obtained from the number average molecular weight and weight average molecular weight obtained by GPC measurement.
- main chain structure of the polyoxyalkylene polymer (A) of the present invention may be linear or branched.
- the polyoxyalkylene-based polymer (A) is a mixture of a high-viscosity polyoxyalkylene-based polymer (A-1) and a low-viscosity polyoxyalkylene-based polymer (A-2). It is preferable to use
- the viscosity of the polyoxyalkylene polymer (A-1) is not particularly limited, but is preferably 6.0 Pa s to 50 Pa s, more preferably 7.0 Pa s to 48 Pa s, and 8.0 Pa s. ⁇ 45 Pa ⁇ s is more preferable.
- This configuration has the advantage of improving the adhesiveness of the obtained multi-component curable composition and the tensile elongation of the cured product.
- the viscosity of the polyoxyalkylene polymer (A-2) is not particularly limited, but is preferably 1 Pa s to 5 Pa s, more preferably 1.5 Pa s to 4 Pa s, and 2 Pa s to 3 Pa s. is more preferred. This configuration has the advantage that the resulting multi-component curable composition has a low viscosity.
- the weight ratio (A-1):(A-2) of the polyoxyalkylene polymer (A-1) and the polyoxyalkylene polymer (A-2) is 95:5 to 50:50. is preferred. Within this range, a cured product exhibiting flexibility and high shear adhesive strength can be obtained. Furthermore, in order to achieve both high rigidity and flexibility, (A-1):(A-2) is preferably 80:20 to 50:50, more preferably 70:30 to 50:50. preferable.
- Introduction of a reactive silicon group to the main chain of the polyoxyalkylene polymer (A) may be performed by a known method. For example, the following methods are mentioned.
- Method I An organic polymer having a functional group such as a hydroxy group is reacted with a compound having an active group that exhibits reactivity with the functional group and an unsaturated group to obtain an organic polymer having an unsaturated group. Then, the resulting organic polymer having unsaturated groups is reacted with a hydrosilane compound having reactive silicon groups by hydrosilylation.
- Examples of compounds having a reactive active group and an unsaturated group that can be used in Method I include unsaturated group-containing epoxy compounds such as allyl glycidyl ether, allyl chloride, methallyl chloride, vinyl bromide, allyl bromide, Examples thereof include compounds having a carbon-carbon double bond such as methallyl bromide, vinyl iodide, allyl iodide and methallyl iodide.
- Examples of compounds having a carbon-carbon triple bond include propargyl chloride, 1-chloro-2-butyne, 4-chloro-1-butyne, 1-chloro-2-octyne, 1-chloro-2-pentyne, 1,4-dichloro-2-butyne, 5-chloro-1-pentyne, 6-chloro-1-hexyne, propargyl bromide, 1-bromo-2-butyne, 4-bromo-1-butyne, 1-bromo- 2-octyne, 1-bromo-2-pentyne, 1,4-dibromo-2-butyne, 5-bromo-1-pentyne, 6-bromo-1-hexyne, propargyl iodide, 1-iodo-2-butyne, 4-iodo-1-butyne, 1-iodo-2-octyne, 1-iodo-2-p
- Halogenated hydrocarbon compounds having a carbon-carbon triple bond as well as compounds such as vinyl chloride, allyl chloride, methallyl chloride, vinyl bromide, allyl bromide, methallyl bromide, vinyl iodide, allyl iodide, and methallyl iodide. Hydrocarbon compounds with unsaturated bonds other than halogenated hydrocarbons with carbon-carbon triple bonds may be used.
- hydrosilane compounds that can be used in method I include halogenated silanes, alkoxysilanes, acyloxysilanes, ketoximate silanes, and the like. Hydrosilane compounds are not limited to these.
- halogenated silanes include trichlorosilane, methyldichlorosilane, dimethylchlorosilane, and phenyldichlorosilane.
- Alkoxysilanes include, for example, trimethoxysilane, triethoxysilane, triisopropoxysilane, dimethoxymethylsilane, diethoxymethylsilane, diisopropoxymethylsilane, (methoxymethyl)dimethoxysilane, phenyldimethoxysilane, 1-[ 2-(Trimethoxysilyl)ethyl]-1,1,3,3-tetramethyldisiloxane and the like.
- acyloxysilanes include methyldiacetoxysilane and phenyldiacetoxysilane.
- ketoximate silanes include bis(dimethylketoximate)methylsilane and bis(cyclohexylketoximate)methylsilane.
- halogenated silanes and alkoxysilanes are particularly preferred.
- Alkoxysilanes are most preferred because they are mildly hydrolyzable and easy to handle.
- alkoxysilanes it is easy to obtain, it is easy to obtain a resin composition for foams with excellent curability and storage stability, and it is possible to produce foams with excellent tensile strength using the resin composition for foams.
- Dimethoxymethylsilane is preferred because it is easy to use.
- Trimethoxysilane and triethoxysilane are also preferable from the viewpoint of easily obtaining a resin composition for foam having excellent curability.
- Method II A compound having a mercapto group and a reactive silicon group is subjected to a radical addition reaction in the presence of a radical initiator and/or a radical generation source to obtain an organic polymer having an unsaturated group in the same manner as in Method I. Method of introducing into the unsaturated group site of.
- Compounds having a mercapto group and a reactive silicon group that can be used in method II include, for example, 3-mercapto-n-propyltrimethoxysilane, 3-mercapto-n-propylmethyldimethoxysilane, 3-mercapto-n-propyl triethoxysilane, 3-mercapto-n-propylmethyldiethoxysilane, mercaptomethyltrimethoxysilane, mercaptomethyltriethoxysilane and the like.
- Compounds having mercapto groups and reactive silicon groups are not limited to these.
- Method III A method of reacting an organic polymer having a functional group such as a hydroxyl group, an epoxy group, an isocyanate group, etc. in the molecule with a compound having a functional group showing reactivity to these functional groups and a reactive silicon group. .
- the method of reacting an organic polymer having a hydroxy group with a compound having an isocyanate group and a reactive silicon group, which can be employed in Method III, is not particularly limited. and the like.
- Compounds having isocyanate groups and reactive silicon groups that can be used in Method III include, for example, 3-isocyanato-n-propyltrimethoxysilane, 3-isocyanato-n-propylmethyldimethoxysilane, 3-isocyanato-n- Examples include propyltriethoxysilane, 3-isocyanato-n-propylmethyldiethoxysilane, isocyanatomethyltrimethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyldimethoxymethylsilane, isocyanatomethyldiethoxymethylsilane and the like. Compounds having isocyanate groups and reactive silicon groups are not limited to these.
- Silane compounds such as trimethoxysilane, in which three hydrolyzable groups are bonded to one silicon atom, may undergo a disproportionation reaction. As the disproportionation reaction progresses, unstable compounds such as dimethoxysilane are produced, which can be difficult to handle. However, such a disproportionation reaction does not proceed with 3-mercapto-n-propyltrimethoxysilane and 3-isocyanato-n-propyltrimethoxysilane. Therefore, when a group in which three hydrolyzable groups are bonded to one silicon atom, such as a trimethoxysilyl group, is used as the silicon-containing group, method II or method III is preferably used.
- the disproportionation reaction does not proceed with the silane compound represented by the following formula (2a).
- X is the same as in formula (1a).
- 2m+2 R 2a are independently the same as R 1a in Formula (1a).
- R 3a represents a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.
- m represents an integer of 0 or more and 19 or less.
- R 2a are each independently preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrocarbon group having 1 to 8 carbon atoms. A hydrocarbon group having 1 or more and 4 or less atoms is more preferable.
- R 3a is preferably a divalent hydrocarbon group having 1 to 12 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 8 carbon atoms, and a divalent hydrocarbon group having 2 carbon atoms. groups are more preferred.
- m is most preferably 1.
- Silane compounds represented by formula (2a) include, for example, 1-[2-(trimethoxysilyl)ethyl]-1,1,3,3-tetramethyldisiloxane, 1-[2-(trimethoxysilyl) propyl]-1,1,3,3-tetramethyldisiloxane, 1-[2-(trimethoxysilyl)hexyl]-1,1,3,3-tetramethyldisiloxane and the like.
- the method of reacting an organic polymer having a terminal hydroxy group with a compound having an isocyanate group and a reactive silicon group provides a high conversion rate in a relatively short reaction time.
- the organic polymer having a reactive silicon group obtained by Method I has a lower viscosity than the organic polymer having a reactive silicon group obtained by Method III, and the resin composition for foams has good workability. is obtained, and the organic polymer having a reactive silicon group obtained by Method II has a strong odor derived from mercaptosilane. Therefore, Method I is particularly preferred.
- polyoxyalkylene polymers having a reactive silicon group examples include, for example, JP-B-45-36319, JP-B-46-12154, JP-A-50-156599, and JP-A-54-6096. , JP-A-55-13767, JP-A-55-13468, JP-A-57-164123, JP-B-3-2450, US Pat. No. 3632557, US Pat. No. 4345053, US Pat. and US Pat. No. 4,960,844.
- JP-A-61-197631, JP-A-61-215622, JP-A-61-215623, JP-A-61-218632, JP-A-3-72527, JP-A-3- 47825 and JP-A-8-231707 the number average molecular weight is 6,000 or more and the molecular weight distribution (Mw/Mn) is 1.6 or less or 1.3 or less.
- Mw/Mn molecular weight distribution
- a polyoxyalkylene polymer having a narrow reactive silicon group is also preferred. Polyoxyalkylene polymers having such reactive silicon groups may be used alone, or two or more of them may be used in combination.
- a synthetic method for introducing an average of more than 1.0 reactive silicon groups to one terminal site of a polyoxyalkylene polymer will be described below.
- the polyoxyalkylene polymer (A) having an average of more than 1.0 reactive silicon groups at one terminal site has two at one terminal of the hydroxyl group-terminated polymer obtained by polymerization. After introducing the above carbon-carbon unsaturated bonds, it is preferable to react with a reactive silicon group-containing compound that reacts with the carbon-carbon unsaturated bonds.
- the polyoxyalkylene polymer (A) is preferably produced by polymerizing an epoxy compound with an initiator having a hydroxyl group using a double metal cyanide complex catalyst such as a zinc hexacyanocobaltate glyme complex.
- initiators having a hydroxyl group examples include ethylene glycol, propylene glycol, glycerin, pentaerythritol, low-molecular-weight polyoxypropylene glycol, polyoxypropylene triol, allyl alcohol, polypropylene monoallyl ether, polypropylene monoalkyl ether, and the like. Those having the above are mentioned.
- Epoxy compounds include alkylene oxides such as ethylene oxide and propylene oxide, and glycidyl ethers such as methyl glycidyl ether and allyl glycidyl ether. Among these, propylene oxide is preferred.
- alkali metal salt used in the present invention sodium hydroxide, sodium methoxide, sodium ethoxide, potassium hydroxide, potassium methoxide and potassium ethoxide are preferred, and sodium methoxide and potassium methoxide are more preferred.
- Sodium methoxide is particularly preferred because of its availability.
- the temperature at which the alkali metal salt is allowed to act is preferably 50°C or higher and 150°C or lower, more preferably 110°C or higher and 140°C or lower.
- the time for which the alkali metal salt is allowed to act is preferably 10 minutes or more and 5 hours or less, more preferably 30 minutes or more and 3 hours or less.
- epoxy compound having a carbon-carbon unsaturated bond used in the present invention, especially general formula (3):
- R 1 and R 2 in the formula are the same as above
- allyl glycidyl ether, methallyl glycidyl ether, glycidyl acrylate, glycidyl methacrylate, butadiene monoxide, and 1,4-cyclopentadiene monoepoxide are preferred from the viewpoint of reaction activity, and allyl glycidyl ether is particularly preferred.
- the amount of the epoxy compound having a carbon-carbon unsaturated bond used in the present invention can be any amount in consideration of the introduction amount and reactivity of the carbon-carbon unsaturated bond to the polymer.
- the molar ratio of the hydroxyl group-terminated polymer to the hydroxyl group is preferably 0.2 or more, more preferably 0.5 or more. Also, it is preferably 5.0 or less, more preferably 2.0 or less.
- the reaction temperature for the ring-opening addition reaction of an epoxy compound having a carbon-carbon unsaturated bond with a polymer containing a hydroxyl group is preferably 60° C. or higher and 150° C. or lower. It is more preferably 110° C. or higher and 140° C. or lower.
- the halogenated hydrocarbon compound having a carbon-carbon unsaturated bond used in the present invention includes vinyl chloride, allyl chloride, methallyl chloride, vinyl bromide, allyl bromide, methallyl bromide, vinyl iodide, allyl iodide, iodine, and methallyl chloride, and it is more preferable to use allyl chloride and methallyl chloride from the viewpoint of ease of handling.
- the amount of the halogenated hydrocarbon compound having a carbon-carbon unsaturated bond is not particularly limited, but the molar ratio to the hydroxyl group of the hydroxyl-terminated polymer is preferably 0.7 or more, and 1.0 or more. more preferred. Moreover, 5.0 or less is preferable and 2.0 or less is more preferable.
- the temperature at which the halogenated hydrocarbon compound having a carbon-carbon unsaturated bond is reacted is preferably 50°C or higher and 150°C or lower, more preferably 110°C or higher and 140°C or lower.
- the reaction time is preferably 10 minutes or more and 5 hours or less, more preferably 30 minutes or more and 3 hours or less.
- the method for introducing the reactive silicon group is not particularly limited, and the three methods described above can be used, and other known methods can be used.
- Epoxy resin curing agent (B) The epoxy resin curing agent (B) in the present multi-component curable composition is preferably an epoxy resin curing agent having a tertiary amine. This configuration has the advantage of improving the tear strength of the cured product.
- any compound having a tertiary amine can be used.
- Examples include benzylamine, N-methyl-N-(dimethylaminopropyl)aminoethanol, 2,4,6-tris(dimethylaminomethyl)phenol, tripropylamine, DBU, DBN, and salts of these tertiary amines can be, but are not limited to. These may be used alone or in combination of two or more, and a known epoxy resin curing agent other than component (B) may be further added.
- the epoxy resin curing agent (B) having a tertiary amine is preferably an aromatic amine, and more preferably has three or more amino groups. Specifically, 2,4,6-tris(dimethylaminomethyl)phenol can be exemplified.
- the content of the epoxy resin curing agent (B) is preferably 0.1 to 10 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). It is more preferably 0.5 to 9.0 parts by weight, even more preferably 1.0 to 8.0 parts by weight, and particularly preferably 2.0 to 7.0 parts by weight. If the content of the epoxy resin curing agent (B) is within the above range, there is an advantage that both improvement in tear strength of the cured product and cost reduction can be easily achieved.
- aminosilane (C) examples include ⁇ -aminopropyltriethoxysilane, N- ⁇ -(aminoethyl)- ⁇ -aminopropyltrimethoxysilane, N- ⁇ -(amino ethyl)- ⁇ -aminopropylmethyldimethoxysilane and the like. These may use only 1 type and may use 2 or more types together.
- Silquest A-1120 manufactured by Momentive Performance Materials Japan LLC
- Silquest A-1110 manufactured by Momentive Performance Materials Japan LLC
- KBM-602 Shin-Etsu Chemical Co., Ltd. (manufactured by Shin-Etsu Chemical Co., Ltd.)
- KBM-603 manufactured by Shin-Etsu Chemical Co., Ltd.
- KBM-903 manufactured by Shin-Etsu Chemical Co., Ltd.
- the content of the aminosilane (C) is preferably 0.1 to 5.0 parts by weight with respect to the total 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). It is more preferably 2 to 4.5 parts by weight, still more preferably 0.3 to 4.0 parts by weight, and particularly preferably 0.4 to 3.8 parts by weight. If the content of the aminosilane (C) is within the above range, there is an advantage that both improvement in tear strength of the cured product and cost reduction can easily be achieved.
- the mercaptan compound (D) in the present multi-component curable composition includes, for example, n-dodecylmercaptan, tert-dodecylmercaptan, laurylmercaptan, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis ( 3-mercaptopropionate), 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylchloromethyldimethoxysilane, 3-mercaptopropylmethoxymethyldimethoxysilane, (mercaptomethyl)dimethoxymethylsilane, (mercaptomethyl)trimethoxysilane and the like.
- Examples of commercially available products include Z6062 (manufactured by Dow Chemical Japan Co., Ltd.), Thiocalcol 20 (manufactured by Kao Corporation), KBM-802 (manufactured by Shin-Etsu Chemical Co., Ltd.), KBM-803 (manufactured by Shin-Etsu Chemical Co., Ltd.), etc. may be used.
- the content of the mercaptan compound (D) is preferably 0.2 to 5.0 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). It is more preferably 0.22 to 4.5 parts by weight, more preferably 0.24 to 4.0 parts by weight, and particularly preferably 0.26 to 3.8 parts by weight. If the content of the mercaptan compound (D) is within the above range, there is an advantage that both improvement in tear strength of the cured product and cost reduction are readily compatible.
- Epoxy resin (E) The epoxy resin (E) in the present multi-component curable composition is preferably an epoxy resin having at least two epoxy groups per molecule. This configuration has the advantage of improving the tear strength of the cured product.
- epoxy resin (E) examples include epichlorohydrin-bisphenol A type epoxy resin, epichlorohydrin-bisphenol F type epoxy resin, flame retardant epoxy resin such as glycidyl ether of tetrabromobisphenol A, novolac type epoxy resin, and hydrogenated bisphenol A type epoxy resin.
- Resins glycidyl ether type epoxy resins of bisphenol A propylene oxide adducts, p-oxybenzoic acid glycidyl ether ester type epoxy resins, m-aminophenol type epoxy resins, diaminodiphenylmethane type epoxy resins, urethane modified epoxy resins, various alicyclic Epoxy resin, N,N-diglycidylaniline, N,N-diglycidyl-o-toluidine, triglycidyl isocyanurate, polyalkylene glycol diglycidyl ether, glycidyl ether of polyhydric alcohol such as glycerin, hydantoin type epoxy resin, petroleum resin Examples include epoxidized unsaturated polymers such as, but not limited to, commonly used epoxy resins can be used. Epoxy resins having at least two epoxy groups per molecule are preferred because they have high reactivity during curing and the cured product can easily form a three-dimensional
- the weight ratio (A):(E) of the polyoxyalkylene polymer (A) and the epoxy resin (E) is preferably 90:10 to 50:50. . If the proportion of (A) is more than 90%, the strength will be reduced, and if it is less than 50%, the flexibility will be reduced and the material will become too hard. Furthermore, 80:20 to 60:40 is more preferable in terms of balance between flexibility and strength.
- This multi-component curable composition contains a hydroxyl group-containing polyoxyalkylene polymer (F) in the A agent and/or the B agent.
- the hydroxyl group-containing polyoxyalkylene polymer (F) functions as a plasticizer.
- the hydroxyl group-containing polyoxyalkylene polymer (F) is used as a plasticizer for the polyoxyalkylene polymer (A), it can be crosslinked at room temperature like the reactive silicon groups possessed by the oxyalkylene polymer (A). It is preferred that it does not contain a group capable of
- the main chain of the hydroxyl group-containing polyoxyalkylene polymer (F) has the general formula: -R f -O- (In the formula, R f is a divalent hydrocarbon group, most preferably an alkylene group having 3 or 4 carbon atoms). A specific example of R f is etc.
- the molecular chain of the hydroxyl group-containing polyoxyalkylene polymer (F) may consist of one type of repeating unit or may consist of two or more types of repeating units. is preferably represented by
- hydroxyl group-containing polyoxyalkylene polymer (F) are not particularly limited, but include, for example, polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer coalescence, polyoxypropylene-polyoxybutylene copolymer, and the like.
- polyoxypropylene is preferable from the viewpoint of suppressing bleeding that occurs with the lapse of time.
- the hydroxyl group-containing polyoxyalkylene polymer (F) acts as a plasticizer for the polyoxyalkylene polymer (A) having a reactive silicon group, its number average molecular weight is It must be less than coalesce (A).
- the number average molecular weight of the hydroxyl group-containing polyoxyalkylene polymer (F) is preferably 300 or more, more preferably 800 or more, even more preferably 1000 or more.
- the upper limit is preferably 15,000 or less, more preferably 10,000 or less, even more preferably 8,000 or less, and particularly preferably 5,000 or less.
- the number average molecular weight of the hydroxyl group-containing polyoxyalkylene polymer (F) is 300 or more, it is effective in that it is difficult to volatilize.
- the number average molecular weight of the hydroxyl group-containing polyoxyalkylene polymer (F) is 15,000 or less, the viscosity of the multi-component curable composition can be easily lowered.
- the number average molecular weight of the hydroxyl group-containing polyoxyalkylene polymer (F) is a molecular weight corresponding to the number average molecular weight obtained by terminal group analysis.
- Mw/Mn is 1.6 or less, preferably 1.5 or less.
- the molecular weight distribution (Mw/Mn) of the hydroxyl group-containing polyoxyalkylene polymer (F) is measured using GPC (converted to polystyrene).
- the content of the hydroxyl group-containing polyoxyalkylene polymer (F) is preferably 5 parts by weight or more, and 10 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). 1 part or more is more preferable, and 20 parts by weight or more is even more preferable.
- the upper limit is preferably 150 parts by weight or less, more preferably 100 parts by weight or less, and even more preferably 50 parts by weight or less.
- the cured product can have an appropriate mechanical strength.
- the hydroxyl group-containing polyoxyalkylene polymer (F) can also be blended during polymer production.
- the hydroxyl group-containing polyoxyalkylene polymer (F) may be produced by a polymerization method using a normal caustic alkali, but may be produced by a polymerization method using a double metal cyanide complex such as zinc hexacyanocobaltate as a catalyst. Others can also be used.
- the multi-component curable composition preferably further contains an inorganic filler.
- Inorganic fillers are inexpensive materials, so they enable cost reduction.
- inorganic fillers include, but are not limited to, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, diatomaceous earth, calcined clay, clay, talc, barite, anhydride gypsum, titanium oxide, bentonite, organic bentonite, and dioxic oxide.
- calcium carbonate is preferable from the viewpoint of being cheaper.
- These inorganic fillers may be used alone or in combination of two or more.
- the content of the inorganic filler is, for example, preferably 50 to 300 parts by weight, preferably 50 to 200 parts by weight, with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). is more preferably 50 to 180 parts by weight, more preferably 60 to 160 parts by weight, even more preferably 70 to 150 parts by weight.
- the content of the inorganic filler is within the above range, there is an advantage that both low viscosity and low cost of the multi-component curable composition are easily achieved.
- the inorganic filler may be contained in agent A, agent B, or both agent A and agent B.
- the inorganic filler is preferably contained in liquid B (agent B) from the viewpoint of adsorbed water.
- the multi-component curable composition preferably further contains a curing catalyst.
- Any curing catalyst can be used without any particular limitation as long as it can be used as a condensation catalyst.
- Curing catalysts include, for example, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin diethylhexanoate, dibutyltin dioctate, dibutyltin dimethylmalate, dibutyltin diethylmalate, dibutyltin dibutylmalate, dibutyltin diisooctyl Dialkyls such as maleate, dibutyltin ditridecylmalate, dibutyltin dibenzylmalate, dibutyltin maleate, dioctyltin diacetate, dioctyltin distearate, dioctyltin dilaurate, dioctyltin diethyl maleate, dioctyltin diisooctyl maleate, etc.
- Tin dicarboxylates dialkyltin alkoxides such as dibutyltin dimethoxide and dibutyltin diphenoxide, intramolecular coordinating derivatives of dialkyltin such as dibutyltin diacetylacetonate and dibutyltin diethylacetoacetate, such as , reactants of dialkyltin oxides such as dibutyltin oxide and dioctyltin oxide with ester compounds such as dioctyl phthalate, diisodecyl phthalate and methyl maleate; tin obtained by reacting dialkyltin oxides, carboxylic acids and alcohol compounds; compounds such as dibutyltin bistriethoxysilicate, dioctyltin bistriethoxysilicate, and other dialkyltin oxides and silicate compounds, and tetravalent tin compounds such as oxy derivatives of these dialkyltin compounds (stannoxane compounds);
- diethylenetriamine triethylenetetramine, oleylamine, cyclohexylamine, benzylamine, diethylaminopropylamine, xylylenediamine, ethylenediamine, hexamethylenediamine, triethylenediamine, guanidine, diphenylguanidine, 2,4,6-tris(dimethylaminomethyl)phenol , morpholine, N-methylmorpholine, 2-ethyl-4-methylimidazole, 1,8-diazabicyclo(5,4,0)undecene-7 (DBU) and other amine compounds, or calcium carbonate of these amine compounds.
- DBU 1,8-diazabicyclo(5,4,0)undecene-7
- silane coupling agents having an amino group such as amino-modified silyl polymers, silylated amino polymers, unsaturated aminosilane complexes, phenylamino long-chain alkylsilanes, and aminosilylated silicones, which are modified derivatives thereof;
- Catalysts further known silanol condensation catalysts such as fatty acids such as felzatic acid, other acidic catalysts such as organic acidic phosphoric acid ester compounds, basic catalysts and the like can be exemplified.
- These curing catalysts may be used alone or in combination of two or more.
- the content of the curing catalyst is preferably, for example, 0.1 to 5 parts by weight, preferably 0.2 parts by weight, with respect to the total 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). It is more preferably from 0.3 to 1 part by weight, more preferably from 0.3 to 1 part by weight. If the content of the curing catalyst is within the above range, there is an advantage that both curability and cost reduction can easily be achieved.
- the multi-component curable composition preferably further contains a dehydrating agent.
- a dehydrating agent By containing a dehydrating agent, the present multi-component curable composition has an advantage of excellent storage stability.
- dehydrating agents include, but are not limited to, vinylsilane, tosylisocyanate, vinyltrimethoxysilane, calcium oxide, zeolite, p-toluenesulfonylisocyanate, 3-ethyl-2-methyl-2-(3-methylbutyl)-1. , 3-oxazolidine and the like. These dehydrating agents may be used alone or in combination of two or more.
- the content of the dehydrating agent is, for example, 0.1 to 10 parts by weight, and 0.1 to 5.0 parts by weight, based on 100 parts by weight of the total of the polyoxyalkylene polymer (A) and the epoxy resin (E). It is preferably 0 parts by weight, more preferably 1.0 to 3.0 parts by weight.
- the content of the dehydrating agent is 0.1 parts by weight or more with respect to 100 parts by weight of the polyoxyalkylene polymer (A)
- the polyoxyalkylene polymer (A) that reacts in the presence of water becomes excessive. It has the advantage of being able to prevent reactions.
- the content of the dehydrating agent is 3.0 parts by weight or less with respect to the total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E), storage stability and cost reduction are achieved. have the advantage of being compatible with each other.
- this multi-component curable composition contains fillers, adhesion imparting agents, anti-sagging agents, antioxidants, light stabilizers, ultraviolet absorbers, tackifying resins, low-molecular-weight plasticizers, and other additives. agents, other resins, etc. may be added.
- various additives may be added to the present multi-component curable composition as necessary for the purpose of adjusting various physical properties of the curable composition or cured product.
- Such additives include, for example, solvents, diluents, photo-curing substances, oxygen-curing substances, surface property modifiers, silicates, curability modifiers, radical inhibitors, metal deactivators, ozone deterioration inhibitors, agents, phosphorus peroxide decomposers, lubricants, pigments, antifungal agents, flame retardants, foaming agents, and the like.
- fillers other than the inorganic filler can be blended into the present multi-component curable composition.
- examples of fillers include PVC powder and PMMA powder.
- the amount of the filler used is preferably 0.5 to 100 parts by weight, more preferably 1 to 60 parts by weight, with respect to 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E) combined. .
- Organic balloons may be added for the purpose of reducing the weight (lowering the specific gravity) of the multi-component curable composition.
- Adhesion imparting agent An adhesion-imparting agent can be added to the present multi-component curable composition.
- a silane coupling agent or a reactant of the silane coupling agent can be added as an adhesion imparting agent.
- silane coupling agents include ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropylmethyldimethoxysilane, N- ⁇ -aminoethyl- ⁇ -aminopropyltrimethoxysilane, N- ⁇ -aminoethyl- ⁇ - Amino group-containing silanes such as aminopropylmethyldimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, (2-aminoethyl)aminomethyltrimethoxysilane; ⁇ -isocyanatopropyltrimethoxysilane, ⁇ -isocyanatopropyltrimethoxysilane; isocyanate group-containing silanes such as ethoxysilane, ⁇ -isocyanatopropylmethyldimethoxysilane, ⁇ -isocyanatomethyltrimethoxysilane, ⁇ -isocyan
- the adhesiveness-imparting agent may be used alone or in combination of two or more. Reaction products of various silane coupling agents can also be used.
- the amount of the silane coupling agent used is preferably 0.1 to 20 parts by weight, particularly 0.5 to 10 parts by weight, based on 100 parts by weight of the total of the polyoxyalkylene polymer (A) and the epoxy resin (E). Parts by weight are preferred.
- an anti-sagging agent may be added to the multi-component curable composition to prevent sagging and improve workability.
- the anti-sagging agent is not particularly limited, but examples thereof include polyamide waxes; hydrogenated castor oil derivatives; metal soaps such as calcium stearate, aluminum stearate and barium stearate. These anti-sagging agents may be used alone or in combination of two or more.
- the amount of anti-sagging agent to be used is preferably 0.1 to 20 parts by weight with respect to 100 parts by weight in total of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- Antioxidants can be used in the present multi-component curable composition.
- the use of an antioxidant can enhance the weather resistance of the cured product.
- antioxidants include hindered phenols, monophenols, bisphenols, and polyphenols. Specific examples of antioxidants are also described in JP-A-4-283259 and JP-A-9-194731.
- the amount of the antioxidant used is preferably 0.1 to 10 parts by weight, particularly 0.2 to 5 parts by weight, with respect to 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E) combined. part is preferred.
- a light stabilizer can be used in the present multi-part curable composition.
- the use of a light stabilizer can prevent photo-oxidative deterioration of the cured product.
- Benzotriazole-based, hindered amine-based, and benzoate-based compounds can be exemplified as light stabilizers, and hindered amine-based compounds are particularly preferred.
- the amount of the light stabilizer used is preferably 0.1 to 10 parts by weight, particularly 0.2 to 5 parts by weight, based on 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E) combined. part is preferred.
- An ultraviolet absorber can be used in the present multi-component curable composition.
- the use of an ultraviolet absorber can enhance the surface weather resistance of the cured product.
- Benzophenone-based, benzotriazole-based, salicylate-based, substituted tolyl-based and metal chelate-based compounds can be exemplified as ultraviolet absorbers, and benzotriazole-based compounds are particularly preferred, and commercially available names of Tinuvin P, Tinuvin 213, Tinuvin 234, Tinuvin 326, Tinuvin 327, Tinuvin 328, Tinuvin 329, and Tinuvin 571 (manufactured by BASF).
- the amount of the ultraviolet absorber to be used is preferably 0.1 to 10 parts by weight, particularly 0.2 to 5 parts by weight, per 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E) combined. part is preferred.
- a tackifying resin can be added to the present multi-component curable composition for the purpose of enhancing the adhesiveness or adhesion to a substrate, or for other purposes.
- the tackifier resin there is no particular limitation and any commonly used one can be used.
- terpene-based resins aromatic modified terpene resins, hydrogenated terpene resins, terpene-phenolic resins, phenolic resins, modified phenolic resins, xylene-phenolic resins, cyclopentadiene-phenolic resins, coumarone-indene resins, rosin-based Resins, rosin ester resins, hydrogenated rosin ester resins, xylene resins, low molecular weight polystyrene resins, styrene copolymer resins, styrene block copolymers and hydrogenated products thereof, petroleum resins (e.g., C5 hydrocarbon resins, C9 hydrocarbon resins, C5C9 hydrocarbon copolymer resins, etc.), hydrogenated petroleum resins, DCPD resins, and the like. These may be used alone or in combination of two or more.
- petroleum resins e.g., C5 hydrocarbon resins, C9 hydrocarbon resins, C
- the amount of the tackifying resin used is preferably 2 to 100 parts by weight, more preferably 5 to 50 parts by weight, with respect to the total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E). More preferably, it is 5 to 30 parts by weight.
- a low molecular weight plasticizer can be added to the present multi-part curable composition. More specifically, diisonoyl phthalate, 2-ethoxyethanol, bis(2-ethylhexyl) phthalate, diisodecyl phthalate, and the like are preferable as the low-molecular-weight plasticizer. These low-molecular-weight plasticizers may be used alone or in combination of two or more.
- the content of the low-molecular-weight plasticizer in the present multi-liquid curable composition is not particularly limited. It is preferably 5 to 150 parts by weight, more preferably 20 to 100 parts by weight, even more preferably 30 to 80 parts by weight. This configuration has an advantage that it is easy to achieve both low viscosity of the multi-component curable composition and high tear strength of the cured product.
- This multi-liquid curable composition is suitable for construction and industrial sealing materials such as waterproofing materials, architectural elastic sealing materials, siding board sealing materials, double glazing sealing materials, vehicle sealing materials, back sealing materials for solar cells.
- Electrical and electronic component materials such as adhesives, electrical insulating materials such as insulation coating materials for electric wires and cables, adhesives, adhesives, elastic adhesives, contact adhesives, tile adhesives, reactive hot melt adhesives, paints , powder coatings, coating materials, foams, sealing materials for can lids, etc., heat dissipation sheets, potting agents for electrical and electronic devices, films, gaskets, marine deck caulking, casting materials, various molding materials, artificial marble, and netting Sealing materials for rust prevention and waterproofing of glass and laminated glass edges (cut parts), anti-vibration, damping, sound and seismic isolation materials used in automobiles, ships, home appliances, etc., automotive parts, electrical parts, various machine parts It can be used for various purposes such as a liquid sealing material used in such as.
- a cured product (hereinafter referred to as "main cured product") is provided by curing the present multi-component curable composition.
- the cured product is formed by curing the multi-component curable composition.
- the cured product contains component (A), component (B), component (C), and component A containing component (D), component (E), and component (F). It is formed by curing a multi-component curable composition containing a B agent at room temperature without heating.
- the cured product comprises an agent A containing component (A), component (B), component (C), component (D), and component (F), and component (E) and a multi-component curable composition containing and cured at room temperature without heating.
- the cured product comprises an agent A containing component (A), component (B), component (C), component (D), and component (F), and component (E) and a B agent containing component (F), and cured at room temperature without heating.
- the present multi-component curable composition contains a volatile component such as a solvent, the volatile component volatilizes during the curing period. Therefore, the present cured product does not substantially contain the volatile components contained in the present multi-component curable composition.
- waterproof material In one embodiment of the present invention, a waterproof material containing the cured product (hereinafter referred to as "the present waterproof material”) is provided.
- This waterproof material forms a seamless coating film and is highly reliable in waterproofing, so it is particularly useful as a moisture-permeable coating film waterproofing material for roofs that requires high waterproof performance.
- Moisture-permeable coating film waterproofing materials for roofs of buildings are waterproofing materials applied to base materials for roofs such as sheathing boards.
- the use of the present waterproof material is not particularly limited, but it is preferably used as an outdoor waterproof material for ceilings, rooftops, balconies, irrigation channels, garages and the like.
- the present waterproof material may contain, in addition to the present cured product, any component that a waterproof material may generally contain. 1 type may be sufficient as such a component, and 2 or more types may be sufficient as it. Also, the content of such components is not particularly limited, and can be appropriately set by those skilled in the art as long as the effects of the present invention are achieved.
- a method of making a waterproof structure comprising applying the multi-part curable composition to a building substrate.
- this multi-component curable composition can provide a cured product with excellent tensile properties and tear strength. It is possible to provide a waterproof structure excellent in
- the method of applying the multi-component curable composition to the base of the building is not particularly limited, but for example, the multi-component curable composition may be directly applied to the base of the building, or may be applied to the base. For example, it may be applied after a primer has been applied.
- a method for manufacturing a waterproof structure which includes the step of applying a topcoat onto a coating film formed by curing the multi-component curable composition.
- one aspect of the present invention includes the following. ⁇ 1> A agent containing a polyoxyalkylene polymer (A) having a reactive silicon group represented by the general formula (1), an epoxy resin curing agent (B), an aminosilane (C), and a mercaptan compound (D) , and a B agent containing an epoxy resin (E), A multicomponent curable composition, wherein the A agent and/or the B agent contain a hydroxyl group-containing polyoxyalkylene polymer (F).
- each R is independently a hydrocarbon group having 1 to 20 carbon atoms, or —OSi(R′) 3 (R′ is each independently a hydrocarbon group having 1 to 20 carbon atoms.
- the hydrocarbon group as R may be substituted and may have a hetero-containing group.
- X is each independently a hydroxyl group or a hydro is a degradable group.
- a is an integer of 1 to 3.
- the content of the aminosilane (C) is 0.1 to 3.0 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- the content of the mercaptan compound (D) is 0.1 to 3.0 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- the content of the inorganic filler is 50 to 300 parts by weight with respect to the total 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- the terminal portion of the polyoxyalkylene polymer (A) has the general formula (2):
- R 1 and R 3 are each independently a divalent C 1-6 bonding group, and the atoms bonded to the respective carbon atoms adjacent to R 1 and R 3 are carbon, oxygen , nitrogen, each of R 2 and R 4 is independently hydrogen or a hydrocarbon group having 1 to 10 carbon atoms, n is an integer of 1 to 10, R 5 is a substituted or an unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxyl group or a hydrolyzable group, and c is an integer of 1 to 3.), represented by ⁇ 1> to ⁇ 5>, the multi-component curable composition according to any one of above.
- the aminosilane (C) is ⁇ -aminopropyltriethoxysilane, N- ⁇ -(aminoethyl)- ⁇ -aminopropyltrimethoxysilane, and N- ⁇ -(aminoethyl)- ⁇ -aminopropylmethyl
- the multi-component curable composition according to any one of ⁇ 1> to ⁇ 7> which is at least one selected from the group consisting of dimethoxysilane.
- the mercaptan compound (D) is n-dodecyl mercaptan, tert-dodecyl mercaptan, lauryl mercaptan, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), 3 - from mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylchloromethyldimethoxysilane, 3-mercaptopropylmethoxymethyldimethoxysilane, (mercaptomethyl)dimethoxymethylsilane and (mercaptomethyl)trimethoxysilane.
- the multi-component curable composition according to any one of ⁇ 1> to ⁇ 8> which is at least one selected from the group consisting of: ⁇ 10>
- ⁇ 11> The hydroxyl group-containing polyoxyalkylene polymer (F) according to any one of ⁇ 1> to ⁇ 10>, wherein the hydroxyl group-containing polyoxyalkylene polymer (F) has a number average molecular weight of 300 or more.
- ⁇ 12> A cured product obtained by curing the multi-component curable composition according to any one of ⁇ 1> to ⁇ 11>.
- ⁇ 13> A waterproof material comprising the cured product according to ⁇ 12>.
- ⁇ 14> A method for producing a waterproof structure, comprising the step of applying the multi-component curable composition according to any one of ⁇ 1> to ⁇ 11> to a foundation of a building.
- a method for producing a waterproof structure comprising a step of applying a topcoat onto a coating film formed by curing the multi-component curable composition according to any one of ⁇ 1> to ⁇ 11>. .
- One aspect of the invention may include the following. ⁇ 16> A agent containing a polyoxyalkylene polymer (A) having a reactive silicon group represented by the general formula (1), an epoxy resin curing agent (B), an aminosilane (C), and a mercaptan compound (D) , and a B agent containing an epoxy resin (E), A multicomponent curable composition, wherein the A agent and/or the B agent contain a hydroxyl group-containing polyoxyalkylene polymer (F).
- each R is independently a hydrocarbon group having 1 to 20 carbon atoms, or —OSi(R′) 3 (R′ is each independently a hydrocarbon group having 1 to 20 carbon atoms.
- the hydrocarbon group as R may be substituted and may have a hetero-containing group.
- X is each independently a hydroxyl group or a hydro is a degradable group.
- a is an integer of 1 to 3.
- the content of the mercaptan compound (D) is 0.2 to 5.0 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- the content of the inorganic filler is 50 to 180 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- the content of the aminosilane (C) is 0.1 to 5.0 parts by weight with respect to a total of 100 parts by weight of the polyoxyalkylene polymer (A) and the epoxy resin (E).
- the terminal portion of the polyoxyalkylene polymer (A) has the general formula (2):
- R 1 and R 3 are each independently a divalent C 1-6 bonding group, and the atoms bonded to the respective carbon atoms adjacent to R 1 and R 3 are carbon, oxygen , nitrogen, each of R 2 and R 4 is independently hydrogen or a hydrocarbon group having 1 to 10 carbon atoms, n is an integer of 1 to 10, R 5 is a substituted or an unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxyl group or a hydrolyzable group, and c is an integer of 1 to 3.), represented by ⁇ 16> to ⁇ 20>.
- the aminosilane (C) is ⁇ -aminopropyltriethoxysilane, N- ⁇ -(aminoethyl)- ⁇ -aminopropyltrimethoxysilane, and N- ⁇ -(aminoethyl)- ⁇ -aminopropylmethyl
- the multi-component curable composition according to any one of ⁇ 16> to ⁇ 22> which is at least one selected from the group consisting of dimethoxysilane.
- the mercaptan compound (D) is n-dodecylmercaptan, tert-dodecylmercaptan, laurylmercaptan, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), 3 - from mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylchloromethyldimethoxysilane, 3-mercaptopropylmethoxymethyldimethoxysilane, (mercaptomethyl)dimethoxymethylsilane and (mercaptomethyl)trimethoxysilane
- the multi-component curable composition according to any one of ⁇ 16> to ⁇ 23> which is at least one selected from the group consisting of: ⁇ 25>
- ⁇ 26> The hydroxyl group-containing polyoxyalkylene polymer (F) according to any one of ⁇ 16> to ⁇ 25>, wherein the hydroxyl group-containing polyoxyalkylene polymer (F) has a number average molecular weight of 300 or more.
- a multi-component curable composition. ⁇ 27> A cured product obtained by curing the multi-component curable composition according to any one of ⁇ 16> to ⁇ 26>.
- ⁇ 28> A waterproof material comprising the cured product according to ⁇ 27>.
- ⁇ 29> A method for producing a waterproof structure, comprising the step of applying the multi-component curable composition according to any one of ⁇ 16> to ⁇ 26> to the foundation of a building.
- a method for producing a waterproof structure comprising the step of applying a topcoat onto a coating film formed by curing the multi-component curable composition according to any one of ⁇ 16> to ⁇ 26>. .
- a tensile strength test was performed at 23° C. and 50% RH using Autograph (AGS-J) manufactured by Shimadzu Corporation. Evaluation was carried out according to JIS A 6021 urethane-based high elongation type (former type 1). Specifically, tensile strength and tensile elongation were determined by punching according to JIS No.3. Tensile measurements were performed at 500 mm/min.
- Tear strength A tensile strength test was performed at 23° C. and 50% RH using Autograph (AGS-J) manufactured by Shimadzu Corporation. Evaluation was carried out according to JIS A 6021 urethane-based high elongation type (former type 1). The tear strength was obtained by punching with an angle-shaped dumbbell without cuts specified in JIS K 6252.
- Polyoxypropylene glycol having a number average molecular weight of about 4,800 is used as an initiator, and propylene oxide is polymerized with a zinc hexacyanocobaltate glyme complex catalyst, and a number average molecular weight of 28,000 having hydroxyl groups at both ends (terminal group equivalent molecular weight of 18,000 ) to obtain polyoxypropylene (P-1) having a molecular weight distribution Mw/Mn of 1.21. Subsequently, a 28% methanol solution of sodium methoxide was added in an amount of 1.0 molar equivalent to the hydroxyl group of this hydroxyl-terminated polyoxypropylene (P-1).
- Example 1 (A-1) and (A-2) as the polyoxyalkylene polymer (A) having a reactive silicon group, Ankamine K54 as the epoxy resin curing agent (B), and A-1120 as the aminosilane (C). , Z6062 as a mercaptan compound (D), vinylsilane A-171 as a dehydrating agent, and MSCAT-01 as a curing catalyst were added in the amounts shown in Table 1, respectively, and stirred by hand for 2 minutes to obtain solution A. (Agent A) was produced.
- Epikote 828 as the epoxy resin (E), Actcol 21-56 as the hydroxyl-containing polyoxyalkylene polymer (F), calcium carbonate (Whiten SB) as the inorganic filler, and carbon black (Asahi Thermal) as the filler. and were added in the respective amounts shown in Table 1, stirred by hand for 2 minutes, and then passed through three ceramic rolls three times to prepare liquid B (agent B).
- liquid A (agent A), liquid B (agent B), and liquid C (agent C) were sequentially added to a disposable cup and stirred by hand. After that, they were mixed and defoamed with a super mixer (ARE-250, manufactured by Thinky Co., Ltd.). Specifically, mixing and defoaming were performed by stirring at 500 rpm for 20 seconds, 1500 rpm for 20 seconds, and 2000 rpm for 40 seconds, followed by defoaming at 1500 rpm for 40 seconds. Then, the defoamed mixture was poured into a mold (Teflon (registered trademark) sheet + packer, thickness 2 mm).
- ARE-250 manufactured by Thinky Co., Ltd.
- Examples 2 to 16 Comparative Examples 1 to 6
- a curable resin composition and a cured product were prepared in the same manner as in Example 1, except that the amount of each component was changed as shown in Tables 1 and 2.
- Tensile properties and tear strength were evaluated for the resulting cured product. Results are shown in Tables 1 and 2.
- Tables 1 and 2 show that the curable compositions of Examples 1 to 16 are excellent in tensile properties and tear strength when cured. That is, according to one embodiment of the present invention, it was shown that a curable composition capable of providing a cured product having excellent tensile properties and tear strength can be provided.
- the curable compositions of Comparative Examples 1 to 6 are poor in tensile properties and tear strength. That is, it was shown that when the curable composition does not satisfy the configuration of the present multicomponent curable composition, the tensile properties and tear strength are poor.
- this multi-component curable composition can provide a cured product having excellent tensile properties and tear strength, it can be suitably used for waterproof materials and the like.
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Abstract
La présente invention a pour but de résoudre le problème de la production d'une composition durcissable multicomposant capable de fournir un produit durci possédant d'excellentes propriétés de traction et de résistance au déchirement. La présente invention concerne une composition durcissable multicomposant comprenant les éléments suivants : un composant A, comportant un polymère polyoxyalkylène possédant un groupe silicium particulièrement réactif (A), un agent de durcissement de résine époxy (B), un aminosilane (C) et un composé mercaptan (D); et un composant B, comportant une résine époxy (E). La composition durcissable multicomposant comprend un polymère polyoxyalkylène contenant un groupe hydroxyle (F) dans le composant A et/ou le composant B.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09279047A (ja) * | 1996-04-11 | 1997-10-28 | Sekisui Chem Co Ltd | 室温硬化性2液混合型組成物 |
JP2002309077A (ja) * | 2001-04-16 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 2液型硬化性組成物 |
WO2006075482A1 (fr) * | 2005-01-11 | 2006-07-20 | Kaneka Corporation | Composition durcissable |
JP2011256284A (ja) * | 2010-06-09 | 2011-12-22 | Kaneka Corp | 初期接着強度の高い2液型硬化性組成物 |
WO2019069866A1 (fr) * | 2017-10-06 | 2019-04-11 | 株式会社カネカ | Composition durcissable |
WO2020170908A1 (fr) * | 2019-02-18 | 2020-08-27 | 株式会社カネカ | Composition durcissable |
WO2021024817A1 (fr) * | 2019-08-06 | 2021-02-11 | 株式会社カネカ | Composition durcissable |
WO2021059972A1 (fr) * | 2019-09-25 | 2021-04-01 | 株式会社カネカ | Composition durcissable |
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2022
- 2022-07-27 WO PCT/JP2022/028867 patent/WO2023013487A1/fr active Application Filing
- 2022-07-27 JP JP2023540281A patent/JPWO2023013487A1/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09279047A (ja) * | 1996-04-11 | 1997-10-28 | Sekisui Chem Co Ltd | 室温硬化性2液混合型組成物 |
JP2002309077A (ja) * | 2001-04-16 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 2液型硬化性組成物 |
WO2006075482A1 (fr) * | 2005-01-11 | 2006-07-20 | Kaneka Corporation | Composition durcissable |
JP2011256284A (ja) * | 2010-06-09 | 2011-12-22 | Kaneka Corp | 初期接着強度の高い2液型硬化性組成物 |
WO2019069866A1 (fr) * | 2017-10-06 | 2019-04-11 | 株式会社カネカ | Composition durcissable |
WO2020170908A1 (fr) * | 2019-02-18 | 2020-08-27 | 株式会社カネカ | Composition durcissable |
WO2021024817A1 (fr) * | 2019-08-06 | 2021-02-11 | 株式会社カネカ | Composition durcissable |
WO2021059972A1 (fr) * | 2019-09-25 | 2021-04-01 | 株式会社カネカ | Composition durcissable |
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