WO2022188415A1 - Flexible circuit board, display panel and preparation method therefor, and display device - Google Patents

Flexible circuit board, display panel and preparation method therefor, and display device Download PDF

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Publication number
WO2022188415A1
WO2022188415A1 PCT/CN2021/125636 CN2021125636W WO2022188415A1 WO 2022188415 A1 WO2022188415 A1 WO 2022188415A1 CN 2021125636 W CN2021125636 W CN 2021125636W WO 2022188415 A1 WO2022188415 A1 WO 2022188415A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
groove
display panel
chip
Prior art date
Application number
PCT/CN2021/125636
Other languages
French (fr)
Chinese (zh)
Inventor
陈泳霖
肖云瀚
胡宏锦
张家祥
左堃
王明强
白久园
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/273,772 priority Critical patent/US20240090127A1/en
Publication of WO2022188415A1 publication Critical patent/WO2022188415A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display, and in particular, to a flexible circuit board, a display panel, a preparation method and a display device.
  • FMLOC Flexible Multi-Layer on Cell
  • OLED Organic Light-Emitting Diode
  • SMT Surface Mount Technology
  • the present application proposes a flexible circuit board, comprising: a circuit substrate, the circuit substrate is a multi-layer flexible circuit board, and at least two layers of the multi-layer flexible circuit board have electroplating sub-layers, so
  • the first surface of the multilayer flexible circuit board has a plurality of groove lines, and the depth of the grooves of the groove lines is not less than the depth of the grooves closest to the first surface in the multilayer flexible circuit board. Depth of plating sublayer. Therefore, groove lines can be formed on the surface of the flexible circuit board by a relatively simple method.
  • the arrangement of groove lines on the flexible circuit board can improve the uniformity of the underfill during filling, thereby effectively reducing the air bubbles generated during the underfill process.
  • the depth of the groove of the groove line is the same as the depth of the electroplating sub-layer of the multilayer flexible circuit board.
  • the groove has a bottom surface and an opening, and an orthographic projection of the bottom surface of the groove on the circuit substrate is located at an orthographic projection of the opening of the groove on the circuit substrate. within the projection. Therefore, the effect of improving the flow uniformity of the underfill by the groove lines provided on the flexible circuit board can be improved.
  • the shape of the cross-section of the groove in the direction perpendicular to the plane of the circuit substrate is a trapezoid, and the angle of at least one of the four bottom corners of the trapezoid is 120-150° .
  • the effect of improving the flow uniformity of the underfill by the groove lines provided on the flexible circuit board can be further improved.
  • the shape of the cross section of the groove in a direction perpendicular to the plane where the circuit substrate is located is a triangle.
  • the shape of the cross section of the groove in a direction perpendicular to the plane of the circuit substrate is a circle.
  • the present application proposes a display panel, comprising: a flexible circuit board, the flexible circuit board is the aforementioned, a chip circuit board, and the chip circuit board passes through the flexible circuit board A plurality of soldering sites are electrically connected, a fixing glue is arranged between the flexible circuit board and the chip circuit board, and the fixing glue is distributed at least in the gaps between the plurality of soldering sites, and the flexible circuit board At least one of a side surface close to the chip circuit board and a side surface of the chip circuit board close to the flexible circuit board has a plurality of groove lines, and the soldering site is located in the plurality of grooves between the lines.
  • the touch wiring layer is configured to drive the touch metal layer
  • the touch wiring layer is at least partially located on the In the flexible circuit board, other layers except the electroplating sublayer closest to the first surface are removed, and the touch trace layer is electrically connected to the soldering site.
  • the orthographic projection of the soldering site on the flexible circuit board does not coincide with the plurality of groove lines on the flexible circuit board. Therefore, the reliability of the soldering site can be improved.
  • the welding sites there are a plurality of the welding sites, and the plurality of the welding sites are arranged in an array.
  • the number of welding sites per unit area can be further increased, thereby further improving the reliability of the welding sites.
  • a part of the plurality of groove lines extends along a first direction, and the other part extends along a second direction, and the first direction and the second direction are perpendicular to each other.
  • the groove lines are alternately distributed with the welding sites. Therefore, the space utilization rate of the flexible circuit board and the chip circuit board can be effectively improved, and a welding spot with a better fixing effect can be obtained.
  • the fixing glue is an underfill glue.
  • the welding site can be further strengthened.
  • the side of the flexible circuit board close to the chip circuit board and the surface of the chip circuit board close to the flexible circuit board have alignment marks, and the alignment marks include pre-alignment marks. Leave the gasket. Thereby, the positional accuracy of fixing the chip circuit board to the flexible circuit board can be further improved.
  • the present application proposes a method for manufacturing the aforementioned display panel, comprising: providing a flexible circuit board, providing a chip circuit board, the flexible circuit board having one side with a plurality of groove lines close to the chip circuit board, and form a plurality of welding sites between the flexible circuit board and the chip circuit board, and inject a fixing glue between the flexible circuit board and the chip circuit board to make the fixing
  • the glue is distributed at least in the spaces between the plurality of welding sites.
  • the method of forming the welding site is at least one of flow welding or dip welding.
  • the present application provides a display device, including a display panel, where the display panel is the aforementioned display panel. Therefore, the display device has all the features and advantages of the display panel described above, which will not be repeated here.
  • FIG. 1 shows a schematic front view of a flexible circuit board according to an embodiment of the present application
  • FIG. 2 shows a schematic top view structure of a flexible circuit board according to an embodiment of the present application
  • FIG. 3 shows a schematic top-view structure diagram of a display panel according to an embodiment of the present application
  • FIG. 4 shows a schematic plan view of a partial structure of a display panel according to an embodiment of the present application
  • FIG. 5 shows a schematic cross-sectional view of a part of the structure of the display panel along the AA' direction shown in FIG. 3 according to an embodiment of the present application;
  • FIG. 6 shows a schematic cross-sectional view of a partial structure of a display panel in the related art
  • Figure 7 shows a schematic diagram of a sizing process according to an embodiment of the present application.
  • FIG. 8 shows a schematic diagram of a single edge sizing process according to an embodiment of the present application.
  • FIG. 9 shows a schematic diagram of an L-shaped sizing process according to an embodiment of the present application.
  • FIG. 10 shows a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application.
  • the present application aims to solve one of the technical problems in the related art to a certain extent.
  • the present application proposes a flexible circuit board 100, comprising: a circuit substrate, the circuit substrate is a multilayer flexible circuit board, and at least two layers of the multilayer flexible circuit board have electroplating Sublayer, the first surface of the multi-layer flexible circuit board has a plurality of groove lines, and the depth of the grooves of the groove lines is not less than the depth of the electroplating sub-layer 120 closest to the first surface in the multi-layer flexible circuit board.
  • An insulating sub-layer 130 is provided between adjacent plating sub-layers 120 .
  • the multiple groove lines on the first surface of the flexible circuit board can improve the uniformity of underfill filling. Soldering sites are formed to electrically connect the flexible circuit board and the chip circuit board to ensure the normal operation of the chip circuit board. Therefore, those skilled in the art can understand that the first surface of the flexible circuit board needs to have an electroplating sub-layer to be able to simultaneously achieve the above effects.
  • the underfill adhesive 400 is used to The underfill is performed between the chip circuit board 200 and the flexible circuit board 100 ′, because when the underfill 400 flows between the chip circuit board 200 and the flexible circuit board 100 ′, the roughness of the surface of the soldering site 300 is different and the flow itself The randomness of the underfill 400 easily causes the underfill 400 to flow unevenly between the chip circuit board 200 and the flexible circuit board 100 ′, which eventually leads to uneven distribution of the underfill 400 when filling around the soldering site 300 , thereby causing the soldering site to be unevenly distributed.
  • Bubble is generated around the point 300.
  • the solder joints 300 cannot be fixed in place by the underfill 400, which will cause the solder joints 300 to be deformed by external forces during assembly and use, and the adjacent solder joints 300 will be short-circuited through penetrating air bubbles, resulting in a short circuit. , which eventually causes the display panel to fail the test.
  • the inventor found that by performing structural design of the flexible circuit board 100 in the corresponding area of the chip circuit board 200 , that is, by etching the surface layer of the flexible circuit board 100 , in the flexible circuit board 100 A groove line is formed on the surface layer, taking the trapezoidal groove line as an example, and then the chip circuit board 200 is fixed on the flexible circuit board 100, and the underfill 400 is used to underfill between the chip circuit board 200 and the flexible circuit board 100.
  • the underfill glue 400 when the flexible circuit board 100 has the above groove line design, when the underfill glue 400 is filled, the glue will preferentially drain smoothly along the trapezoidal groove line.
  • each welding site 300 can be evenly covered by the underfill 300 in the four directions of front, rear, left, right, and so on, which greatly reduces the process of colloid filling in the existing design. randomness.
  • the present application greatly reduces the possibility of penetrating bubbles caused by multi-bubble connections by avoiding or minimizing the bubbles generated during the filling process due to random or uneven flow around the welding site.
  • the reliability of solder joints also avoids the risk of short circuits between solder joints due to penetrating air bubbles.
  • the kinds of circuit substrates are not particularly limited.
  • the circuit substrate can be a multi-layer flexible circuit board, because each layer of the multi-layer flexible circuit board has an electroplating sub-layer, and the material forming the electro-plating sub-layer is generally copper metal. Groove lines with specific structures are formed on the surface of the circuit substrate.
  • the depth of the groove of the groove line is not particularly limited, for example, the depth of the groove of the groove line may be the same as the depth of the plating sub-layer of the multilayer flexible circuit board.
  • the groove line can not only improve the uniformity of the flow of the underfill during underfilling, but also will not be affected by the groove. The depth is too deep to cause excessive waste to the multilayer flexible circuit board.
  • the groove structure of the groove line is not particularly limited.
  • the groove of the groove line may have an opening and a bottom surface, and the orthographic projection of the bottom surface of the groove on the circuit substrate is located at the opening of the groove. Inside the orthographic projection on the circuit board.
  • the shape of the groove is not particularly limited.
  • the shape of the cross-section of the groove in a direction perpendicular to the plane of the circuit substrate may be a trapezoid, and the shape of at least one of the four bottom corners of the trapezoid may be a trapezoid.
  • the angle is 120-150°.
  • the shape of the cross section of the groove in the direction perpendicular to the plane of the circuit substrate may be a triangle.
  • the shape of the cross section of the groove in a direction perpendicular to the plane of the circuit substrate is a circle.
  • the present application proposes a display panel.
  • the display panel includes: a flexible circuit
  • the board 100, the flexible circuit board are the above, the chip circuit board 200, the chip circuit board 100 and the flexible circuit board 200 are electrically connected by a plurality of welding sites 300, and there is a fixing glue 400 between the flexible circuit board 100 and the chip circuit board 200,
  • the fixing glue 400 is distributed at least in the spaces between the plurality of soldering sites 300 , and at least one of the side surface of the flexible circuit board 200 close to the chip circuit board 100 and the side surface of the chip circuit board 100 close to the flexible circuit board 200
  • the weld site 300 is located between the plurality of groove lines.
  • the type of the chip circuit board is not particularly limited, for example, the chip circuit board may be a touch chip circuit board.
  • the structure of the display panel is not particularly limited.
  • the display panel may further include a touch metal layer 600 and a touch wiring layer 500
  • the touch wire layer 600 is configured to drive the touch metal layer 500
  • the touch metal layer can transmit the touch signal received by the touch wire layer to the touch chip circuit board through the touch wire layer for subsequent data processing deal with.
  • the touch metal layer 600 is located in the pixel area 700
  • the touch wiring layer 500 is mainly located in the peripheral area, that is, the area on the display panel other than the pixel area 700 , and extends to the binding area 800 , and the welding in the binding area 800 Site 300 is electrically connected.
  • part of the touch trace layer 500 located in the binding area 800 is at least partially located on other layers of the flexible circuit board except the electroplating sub-layer 130 . Therefore, the use performance of the display panel can be further improved through the arrangement of the touch wiring layer and the touch metal layer.
  • the position of the soldering site 300 on the flexible circuit board 100 is not particularly limited, for example, the orthographic projection of the soldering site on the flexible circuit board may be the same as the The groove lines are not coincident.
  • the orthographic projection of the soldering site on the flexible circuit board does not coincide with the multiple groove lines on the flexible circuit board, the contact area between the soldering site and the flexible circuit board and the chip circuit board The largest, the best welding effect.
  • the arrangement of the plurality of soldering spots on the flexible circuit board 100 is not particularly limited, for example, the plurality of soldering spots may be arranged in an array cloth.
  • the welding points are arranged in an array, the distribution of the welding points between the flexible circuit board and the chip circuit board is more uniform, and the connection between the chip circuit board and the flexible circuit board is firmer.
  • the direction of the plurality of groove lines on the flexible circuit board 100 is not particularly limited.
  • a part of the plurality of groove lines may extend along the first direction, and the other part may extend along the first direction.
  • the second direction extends, and the first direction and the second direction are perpendicular to each other. Therefore, it is convenient to prepare the soldering sites with the array structure and the underfill can flow more uniformly between the flexible circuit board and the chip circuit board.
  • groove lines and welding sites can be alternately distributed, thereby effectively improving the flow uniformity during filling of the underfill agent on the basis of further improving space utilization.
  • the type of the fixing glue is not particularly limited, for example, the fixing glue may be an underfill glue, and specifically, the fixing glue may be epoxy resin.
  • the structures of the flexible circuit board and the chip circuit board are not particularly limited, for example, the side of the flexible circuit board close to the chip circuit board and the surface of the chip circuit board close to the flexible circuit board have alignment marks, Specifically, the alignment mark may be a reserved spacer. Therefore, positioning can be performed through the reserved pads on the flexible circuit board and the chip circuit board, and then a plurality of welding sites are formed between the flexible circuit board and the chip circuit board. Referring to FIG.
  • the alignment can be improved by aligning the flexible circuit board reserved gasket 110 and the chip circuit board reserved gasket 210 Accuracy, improve the positional accuracy of the chip circuit board, and improve the utilization rate of the flexible circuit board.
  • the method for forming a plurality of groove lines on the side surface of the circuit substrate without traces is not particularly limited.
  • a plurality of groove lines may be formed on the side surface of the circuit substrate without traces by etching. Grooved line.
  • the present application proposes a method for preparing the above-mentioned display panel.
  • the display panel prepared by the method has a high yield and good stability in use.
  • the method specifically includes the following steps:
  • a flexible circuit board is provided in this step, and the flexible circuit board is as described above, that is, one side of the flexible circuit board has a plurality of groove lines.
  • the groove lines may be formed on the side of the flexible circuit board where no metal traces are provided, and the groove lines may be formed by an etching method.
  • the shape, extension direction and arrangement of the cross-section of the groove of the groove line in the direction perpendicular to the plane of the circuit substrate have been described in detail above and will not be repeated here.
  • S200 Provide a chip circuit board, one side of the flexible circuit board with multiple groove lines is close to the chip circuit board, and multiple welding sites are formed between the flexible circuit board and the chip circuit board
  • the chip circuit board and the flexible circuit board are connected by soldering in this step, and the method of forming the soldering site is not particularly limited, for example, the method of forming the soldering site may be flow soldering or dip soldering at least one of them.
  • the fixing glue is injected in this step so that the fixing glue is distributed at least in the gaps between the plurality of welding sites, thereby strengthening the welding sites and improving the reliability of the welding sites.
  • the type of the fixing glue is not particularly limited, for example, the fixing glue can be underfill glue, and specifically, the fixing glue can be epoxy resin.
  • the manner of injecting the fixing glue between the flexible circuit board and the chip circuit board is not particularly limited, for example, injecting the fixing glue between the flexible circuit board and the chip circuit board
  • the method can be unilateral sizing or L-shaped sizing.
  • the present application provides a display device, including a display panel, and the display panel is the above-mentioned display panel. Therefore, the display device has all the features and advantages of the above-mentioned display panel, which will not be repeated here.
  • the circuit substrate is a multi-layer flexible circuit board. Multiple groove lines are formed by etching on the side surface of the multi-layer flexible circuit board without wiring. The multiple groove lines intersect vertically. The depth of the groove lines The same thickness as the plating sublayer of the multilayer flexible circuit board.
  • circuit substrate which is a multi-layer flexible circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Disclosed in the present application are a flexible circuit board, a display panel and a preparation method therefor, and a display device. The flexible circuit board comprises a circuit substrate; the circuit substrate is a multi-layer flexible circuit board; at least two layers of the multi-layer flexible circuit board are each provided with an electroplating sub-layer; a first surface of the multi-layer flexible circuit board is provided with a plurality of groove lines; and the groove depth of the groove lines is not less than the depth of the electroplating sub-layer in the multi-layer flexible circuit board closest to the first surface.

Description

柔性电路板、显示面板、制备方法和显示装置Flexible circuit board, display panel, manufacturing method and display device 技术领域technical field
本申请涉及显示领域，具体地，涉及柔性电路板、显示面板、制备方法和显示装置。The present application relates to the field of display, and in particular, to a flexible circuit board, a display panel, a preparation method and a display device.
背景技术Background technique
随着显示面板的不断发展，FMLOC(Flexible Multi-Layer on Cell)技术作为柔性OLED(Organic Light-Emitting Diode)的新兴技术，极具大规模应用前景。但目前FMLOC方案中一般采用表面贴装工艺(SMT，Surface Mount Technology)将芯片电路板固定到柔性电路板上，但采用表面贴装工艺固定的芯片电路板和柔性电路板间易出现焊接位点间短路等问题，最终导致面板测试失败，无法正常使用，造成耗材和能源的极大浪费。With the continuous development of display panels, FMLOC (Flexible Multi-Layer on Cell) technology, as an emerging technology of flexible OLED (Organic Light-Emitting Diode), has great large-scale application prospects. However, in the current FMLOC scheme, surface mount technology (SMT, Surface Mount Technology) is generally used to fix the chip circuit board to the flexible circuit board, but soldering spots are prone to appear between the chip circuit board and the flexible circuit board fixed by the surface mount process. Short circuit and other problems will eventually lead to panel test failure and cannot be used normally, resulting in a great waste of consumables and energy.
因此，目前的柔性电路板、显示面板、制备方法和显示装置仍有待改进。Therefore, the current flexible circuit boards, display panels, manufacturing methods and display devices still need to be improved.
申请内容Application content
在本申请的一个方面，本申请提出了一种柔性电路板，包括：电路基板，所述电路基板为多层柔性电路板，所述多层柔性电路板的至少两层具有电镀亚层，所述多层柔性电路板的第一表面具有多条凹槽线，所述凹槽线的所述凹槽的深度不小于所述多层柔性电路板中最靠近所述第一表面处的所述电镀亚层的深度。由此，可通过较为简单的方法在柔性电路板表面形成凹槽线。通过柔性电路板上凹槽线的设置可提高底部填充胶填充时的均匀性，进而有效减少底部填充过程中产生的气泡。In one aspect of the present application, the present application proposes a flexible circuit board, comprising: a circuit substrate, the circuit substrate is a multi-layer flexible circuit board, and at least two layers of the multi-layer flexible circuit board have electroplating sub-layers, so The first surface of the multilayer flexible circuit board has a plurality of groove lines, and the depth of the grooves of the groove lines is not less than the depth of the grooves closest to the first surface in the multilayer flexible circuit board. Depth of plating sublayer. Therefore, groove lines can be formed on the surface of the flexible circuit board by a relatively simple method. The arrangement of groove lines on the flexible circuit board can improve the uniformity of the underfill during filling, thereby effectively reducing the air bubbles generated during the underfill process.
根据本申请的实施例，所述凹槽线的所述凹槽的深度与所述多层柔性电路板的所述电镀亚层的深度相同。由此，可通过较为简单的方法获得具有提高底部填充胶填充均匀性的多条凹槽线。According to an embodiment of the present application, the depth of the groove of the groove line is the same as the depth of the electroplating sub-layer of the multilayer flexible circuit board. Thus, a plurality of groove lines with improved underfill filling uniformity can be obtained by a relatively simple method.
根据本申请的实施例，所述凹槽具有底面和开口，所述凹槽的所述底面在所述电路基板上的正投影位于所述凹槽的所述开口在所述电路基板上的正投影内。由此，可提高柔性电路板上设置的凹槽线对于底部填充胶流动均匀性的改进效果。According to an embodiment of the present application, the groove has a bottom surface and an opening, and an orthographic projection of the bottom surface of the groove on the circuit substrate is located at an orthographic projection of the opening of the groove on the circuit substrate. within the projection. Therefore, the effect of improving the flow uniformity of the underfill by the groove lines provided on the flexible circuit board can be improved.
根据本申请的实施例，所述凹槽在垂直于所述电路基板所在平面的方向上的截面的形状为梯形，所述梯形的四个底角中的至少之一的角度为120-150°。由此，可进一步提高柔性电路板上设置的凹槽线对于底部填充胶流动均匀性的改进效果。According to the embodiment of the present application, the shape of the cross-section of the groove in the direction perpendicular to the plane of the circuit substrate is a trapezoid, and the angle of at least one of the four bottom corners of the trapezoid is 120-150° . Thus, the effect of improving the flow uniformity of the underfill by the groove lines provided on the flexible circuit board can be further improved.
根据本申请的实施例，所述凹槽在垂直于所述电路基板所在平面的方向上的截面的形状为三角形。由此，可进一步提高柔性电路板上设置的凹槽线对于底部填充胶流动均匀性的改进效果。According to the embodiment of the present application, the shape of the cross section of the groove in a direction perpendicular to the plane where the circuit substrate is located is a triangle. Thus, the effect of improving the flow uniformity of the underfill by the groove lines provided on the flexible circuit board can be further improved.
根据本申请的实施例，所述凹槽在垂直于所述电路基板所在平面的方向上的截面的形 状为圆形。由此，可进一步提高柔性电路板上设置的凹槽线对于底部填充胶流动均匀性的改进效果。According to an embodiment of the present application, the shape of the cross section of the groove in a direction perpendicular to the plane of the circuit substrate is a circle. Thus, the effect of improving the flow uniformity of the underfill by the groove lines provided on the flexible circuit board can be further improved.
在本申请的又一方面，本申请提出了一种显示面板，包括：柔性电路板，所述柔性电路板为前面所述的，芯片电路板，所述芯片电路板与所述柔性电路板通过多个焊接位点电连接，所述柔性电路板以及所述芯片电路板之间具有固定胶，所述固定胶至少分布于所述多个焊接位点之间的空隙处，所述柔性电路板靠近所述芯片电路板的一侧表面与所述芯片电路板靠近所述柔性电路板的一侧表面中的至少之一具有多条凹槽线，所述焊接位点位于所述多条凹槽线之间处。由此，通过将芯片电路板与具有凹槽线的柔性电路板焊接，并在芯片电路板与柔性电路板间进行底部填充后，可获得具有较高可靠性的焊接位点以及相邻焊接位点间无贯穿气泡，进而提高显示面板的使用稳定性。In yet another aspect of the present application, the present application proposes a display panel, comprising: a flexible circuit board, the flexible circuit board is the aforementioned, a chip circuit board, and the chip circuit board passes through the flexible circuit board A plurality of soldering sites are electrically connected, a fixing glue is arranged between the flexible circuit board and the chip circuit board, and the fixing glue is distributed at least in the gaps between the plurality of soldering sites, and the flexible circuit board At least one of a side surface close to the chip circuit board and a side surface of the chip circuit board close to the flexible circuit board has a plurality of groove lines, and the soldering site is located in the plurality of grooves between the lines. Therefore, by welding the chip circuit board and the flexible circuit board with groove lines, and after underfilling between the chip circuit board and the flexible circuit board, a welding point with high reliability and an adjacent welding point can be obtained. There are no penetrating air bubbles between the dots, thereby improving the use stability of the display panel.
根据本申请的实施例，进一步包括触控金属层和触控走线层，所述触控走线层被配置为驱动所述触控金属层，所述触控走线层至少部分位于所述柔性电路板中除去最靠近所述第一表面处的电镀亚层外的其它层，所述触控走线层与所述焊接位点电连接。由此，可提高显示面板的使用性能。According to an embodiment of the present application, it further includes a touch metal layer and a touch wiring layer, the touch wiring layer is configured to drive the touch metal layer, and the touch wiring layer is at least partially located on the In the flexible circuit board, other layers except the electroplating sublayer closest to the first surface are removed, and the touch trace layer is electrically connected to the soldering site. Thereby, the usability of the display panel can be improved.
根据本申请的实施例，所述焊接位点在所述柔性电路板上的正投影与所述柔性电路板上的多条凹槽线均不重合。由此，可提高焊接位点的可靠性。According to the embodiment of the present application, the orthographic projection of the soldering site on the flexible circuit board does not coincide with the plurality of groove lines on the flexible circuit board. Thereby, the reliability of the soldering site can be improved.
根据本申请的实施例，具有多个所述焊接位点，多个所述焊接位点阵列排布。由此，可进一步提高单位面积上的焊接位点数量，进而进一步提高焊接位点的可靠性。According to the embodiments of the present application, there are a plurality of the welding sites, and the plurality of the welding sites are arranged in an array. As a result, the number of welding sites per unit area can be further increased, thereby further improving the reliability of the welding sites.
根据本申请的实施例，所述多条凹槽线中的一部分沿第一方向延伸，另一部分沿第二方向延伸，所述第一方向和所述第二方向相互垂直。由此，可最大化利用柔性电路板，获得具有较好底部填充胶均匀效果的凹槽线。According to an embodiment of the present application, a part of the plurality of groove lines extends along a first direction, and the other part extends along a second direction, and the first direction and the second direction are perpendicular to each other. In this way, the flexible circuit board can be maximized, and groove lines with better underfill uniformity can be obtained.
根据本申请的实施例，所述凹槽线与所述焊接位点交替分布。由此，可有效提高柔性电路板和芯片电路板的空间利用率，获得具有较好固定效果的焊接位点。According to an embodiment of the present application, the groove lines are alternately distributed with the welding sites. Therefore, the space utilization rate of the flexible circuit board and the chip circuit board can be effectively improved, and a welding spot with a better fixing effect can be obtained.
根据本申请的实施例，所述固定胶为底部填充胶。由此，可进一步加固焊接位点。According to an embodiment of the present application, the fixing glue is an underfill glue. Thereby, the welding site can be further strengthened.
根据本申请的实施例，所述柔性电路板靠近所述芯片电路板一侧，以及所述芯片电路板靠近所述柔性电路板一侧的表面均具有对位标记，所述对位标记包括预留垫片。由此可进一步提高将芯片电路板固定到柔性电路板上的位置准确度。According to the embodiment of the present application, the side of the flexible circuit board close to the chip circuit board and the surface of the chip circuit board close to the flexible circuit board have alignment marks, and the alignment marks include pre-alignment marks. Leave the gasket. Thereby, the positional accuracy of fixing the chip circuit board to the flexible circuit board can be further improved.
在本申请的又一方面，本申请提出了一种制备前面所述的显示面板的方法，包括：提供柔性电路板，提供芯片电路板，所述柔性电路板具有多条凹槽线的一侧靠近所述芯片电路板，并在所述柔性电路板与所述芯片电路板间形成多个焊接位点，向所述柔性电路板与所述芯片电路板间注入固定胶，以令所述固定胶至少分布于所述多个焊接位点之间的空隙处。通过该方法制备的显示面板为前面所述的，由此，该方法具有前面所述的显示面板的 全部特征及优点，在此不再赘述。总言之，通过该方法制备显示面板的良品率较高，具有较好的使用稳定性。In yet another aspect of the present application, the present application proposes a method for manufacturing the aforementioned display panel, comprising: providing a flexible circuit board, providing a chip circuit board, the flexible circuit board having one side with a plurality of groove lines close to the chip circuit board, and form a plurality of welding sites between the flexible circuit board and the chip circuit board, and inject a fixing glue between the flexible circuit board and the chip circuit board to make the fixing The glue is distributed at least in the spaces between the plurality of welding sites. The display panel prepared by this method is as described above. Therefore, this method has all the features and advantages of the above-mentioned display panel, which will not be repeated here. All in all, the display panel prepared by this method has a high yield and good stability in use.
根据本申请的实施例，形成所述焊接位点的方式为流焊或浸焊中的至少一种。由此，可通过较为简单的方式获得具有稳定结构的焊接位点。According to an embodiment of the present application, the method of forming the welding site is at least one of flow welding or dip welding. Thereby, a welding site with a stable structure can be obtained in a relatively simple manner.
在本申请的又一方面，本申请提出了一种显示装置，包括显示面板，所述显示面板为前面所述的显示面板。由此，该显示装置具有前面所述的显示面板的全部特征及优点，在此不再赘述。In yet another aspect of the present application, the present application provides a display device, including a display panel, where the display panel is the aforementioned display panel. Therefore, the display device has all the features and advantages of the display panel described above, which will not be repeated here.
附图说明Description of drawings
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:
图1显示了根据本申请的一个实施例的柔性电路板的正视结构示意图；FIG. 1 shows a schematic front view of a flexible circuit board according to an embodiment of the present application;
图2显示了根据本申请的一个实施例的柔性电路板的俯视结构示意图；FIG. 2 shows a schematic top view structure of a flexible circuit board according to an embodiment of the present application;
图3显示了根据本申请的一个实施例的显示面板的俯视结构示意图；FIG. 3 shows a schematic top-view structure diagram of a display panel according to an embodiment of the present application;
图4显示了根据本申请的一个实施例的显示面板的俯视部分结构示意图；FIG. 4 shows a schematic plan view of a partial structure of a display panel according to an embodiment of the present application;
图5显示了根据本申请的一个实施例的显示面板沿图3中所示出的AA’方向的部分结构截面示意图；FIG. 5 shows a schematic cross-sectional view of a part of the structure of the display panel along the AA' direction shown in FIG. 3 according to an embodiment of the present application;
图6显示了相关技术中的显示面板的部分结构结构截面示意图；FIG. 6 shows a schematic cross-sectional view of a partial structure of a display panel in the related art;
图7显示了根据本申请的一个实施例的施胶工艺的示意图；Figure 7 shows a schematic diagram of a sizing process according to an embodiment of the present application;
图8显示了根据本申请的一个实施例的单边施胶工艺的示意图；FIG. 8 shows a schematic diagram of a single edge sizing process according to an embodiment of the present application;
图9显示了根据本申请的一个实施例的L型施胶工艺的示意图；9 shows a schematic diagram of an L-shaped sizing process according to an embodiment of the present application;
图10显示了根据本申请的一个实施例的制备显示面板的方法的流程示意图。FIG. 10 shows a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application.
具体实施方式Detailed ways
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。The following describes in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application.
本申请旨在一定程度上解决相关技术中的技术问题之一。The present application aims to solve one of the technical problems in the related art to a certain extent.
在本申请的一个方面，参考图1和图2，本申请提出了一种柔性电路板100，包括：电路基板，电路基板为多层柔性电路板，多层柔性电路板的至少两层具有电镀亚层，多层柔性电路板的第一表面具有多条凹槽线，凹槽线的凹槽的深度不小于多层柔性电路板中最靠近第一表面处的电镀亚层120的深度，相邻电镀亚层120之间具有绝缘亚层130。通过柔性 电路板上凹槽线的设置可提高底部填充胶填充时的均匀性，进而有效减少底部填充过程中产生的气泡。In one aspect of the present application, referring to FIG. 1 and FIG. 2 , the present application proposes a flexible circuit board 100, comprising: a circuit substrate, the circuit substrate is a multilayer flexible circuit board, and at least two layers of the multilayer flexible circuit board have electroplating Sublayer, the first surface of the multi-layer flexible circuit board has a plurality of groove lines, and the depth of the grooves of the groove lines is not less than the depth of the electroplating sub-layer 120 closest to the first surface in the multi-layer flexible circuit board. An insulating sub-layer 130 is provided between adjacent plating sub-layers 120 . By arranging the groove lines on the flexible circuit board, the uniformity of the underfill can be improved, thereby effectively reducing the air bubbles generated during the underfill process.
需要特别指出的是，柔性电路板的第一表面上所具有的多条凹槽线可提高底部填充胶填充时的均匀性，此外，还需在柔性电路板的第一表面与芯片电路板间形成焊接位点以将柔性电路板和芯片电路板电连接，保证芯片电路板的正常工作，因此，本领域技术人员可以理解的是，柔性电路板的第一表面需具有电镀亚层才可以同时实现上述效果。It should be specially pointed out that the multiple groove lines on the first surface of the flexible circuit board can improve the uniformity of underfill filling. Soldering sites are formed to electrically connect the flexible circuit board and the chip circuit board to ensure the normal operation of the chip circuit board. Therefore, those skilled in the art can understand that the first surface of the flexible circuit board needs to have an electroplating sub-layer to be able to simultaneously achieve the above effects.
为了方便理解，下面首先对该显示面板可实现上述有益效果的原理进行简单说明：In order to facilitate understanding, the following first briefly describes the principle that the display panel can achieve the above beneficial effects:
相关技术中，参考图6，在将芯片电路板200固定到柔性电路板100’上，即在柔性电路板100’与芯片电路板200间形成焊接位点300后，将采用底部填充胶400在芯片电路板200与柔性电路板100’间进行底部填充，因底部填充胶400在芯片电路板200与柔性电路板100’间流过时，因焊接位点300表面各处的粗糙度不同以及流动本身所具有的随机性，易使得底部填充胶400在芯片电路板200与柔性电路板100’间非均匀流动，最终导致底部填充胶400在焊接位点300四周填充时分布不均匀，进而导致焊接位点300周围产生气泡，当焊接位点300周围的气泡数量过多，即形成贯穿气泡，当焊接位点300周围的气泡数量过多时，焊接位点300未能完全被底部填充胶400包围，即焊接位点300未被能被底部填充胶400固定到位，进而会导致焊接位点300在装配使用过程中因受外力作用发生形变，相邻焊接位点300间通过贯穿气泡发生短接，进而短路，最终造成显示面板的测试不通过。In the related art, referring to FIG. 6 , after the chip circuit board 200 is fixed on the flexible circuit board 100 ′, that is, after the welding site 300 is formed between the flexible circuit board 100 ′ and the chip circuit board 200 , the underfill adhesive 400 is used to The underfill is performed between the chip circuit board 200 and the flexible circuit board 100 ′, because when the underfill 400 flows between the chip circuit board 200 and the flexible circuit board 100 ′, the roughness of the surface of the soldering site 300 is different and the flow itself The randomness of the underfill 400 easily causes the underfill 400 to flow unevenly between the chip circuit board 200 and the flexible circuit board 100 ′, which eventually leads to uneven distribution of the underfill 400 when filling around the soldering site 300 , thereby causing the soldering site to be unevenly distributed. Bubble is generated around the point 300. When the number of bubbles around the welding point 300 is too large, penetrating bubbles are formed. The solder joints 300 cannot be fixed in place by the underfill 400, which will cause the solder joints 300 to be deformed by external forces during assembly and use, and the adjacent solder joints 300 will be short-circuited through penetrating air bubbles, resulting in a short circuit. , which eventually causes the display panel to fail the test.
在本申请中，参考图5，发明人发现，通过对柔性电路板100在芯片电路板200对应区域的进行结构设计，即通过对柔性电路板100的表层进行蚀刻处理，在柔性电路板100的表层形成凹槽线，以梯形凹槽线为例，随后将芯片电路板200固定到柔性电路板100上，并采用底部填充胶400在芯片电路板200与柔性电路板100间进行底部填充，当柔性电路板100具有上述凹槽线设计时，在底部填充胶400进行填充时，胶体会优先沿梯形凹槽线平滑引流，在均匀注满所有凹槽线后，凹槽内胶体的表面张力达到最大，后续再流经凹槽线的底部填充胶400会破坏凹槽内胶体表面的最大张力，进而在重力的作用下开始向两侧溢出，因为在垂直于重力的平面，重力不会带来额外的方向性，故由凹槽内向凹槽两侧溢出的胶体会较为均匀。且因为凹槽线均匀分布于各焊接位点300四周，故每个焊接位点300都能被前后左右四个方向的底部填充胶300均匀覆盖，极大地减少了现有设计中胶体填充过程中的随机性。本申请通过避免或尽可能减少填充过程中因随机性未流过或未均匀流过焊接位点四周所产生的气泡，极大地降低了因多气泡连接而产生贯穿气泡的可能，在进一步加强焊接焊点可靠性的同时也避免了焊接位点间因贯穿气泡发生短接的风险。In the present application, referring to FIG. 5 , the inventor found that by performing structural design of the flexible circuit board 100 in the corresponding area of the chip circuit board 200 , that is, by etching the surface layer of the flexible circuit board 100 , in the flexible circuit board 100 A groove line is formed on the surface layer, taking the trapezoidal groove line as an example, and then the chip circuit board 200 is fixed on the flexible circuit board 100, and the underfill 400 is used to underfill between the chip circuit board 200 and the flexible circuit board 100. When When the flexible circuit board 100 has the above groove line design, when the underfill glue 400 is filled, the glue will preferentially drain smoothly along the trapezoidal groove line. After all the groove lines are evenly filled, the surface tension of the glue in the groove reaches Maximum, the underfill 400 that flows through the groove line subsequently will destroy the maximum tension of the colloidal surface in the groove, and then begin to overflow to both sides under the action of gravity, because in the plane perpendicular to gravity, gravity will not bring Due to the additional directionality, the colloid overflowing from the groove to both sides of the groove will be more uniform. And because the groove lines are evenly distributed around each welding site 300, each welding site 300 can be evenly covered by the underfill 300 in the four directions of front, rear, left, right, and so on, which greatly reduces the process of colloid filling in the existing design. randomness. The present application greatly reduces the possibility of penetrating bubbles caused by multi-bubble connections by avoiding or minimizing the bubbles generated during the filling process due to random or uneven flow around the welding site. The reliability of solder joints also avoids the risk of short circuits between solder joints due to penetrating air bubbles.
根据本申请的一些实施例，电路基板的种类不受特别限制。例如电路基板可以为多层柔性电路板，因为多层柔性电路板的每层均具有电镀亚层，形成电镀亚层的材料一般为金 属铜，由此，可通过较为简单的方法，如蚀刻等在电路基板的表面形成具有特定结构的凹槽线。According to some embodiments of the present application, the kinds of circuit substrates are not particularly limited. For example, the circuit substrate can be a multi-layer flexible circuit board, because each layer of the multi-layer flexible circuit board has an electroplating sub-layer, and the material forming the electro-plating sub-layer is generally copper metal. Groove lines with specific structures are formed on the surface of the circuit substrate.
根据本申请的一些实施例，凹槽线的凹槽的深度不受特别限制，例如凹槽线的凹槽的深度可与多层柔性电路板的电镀亚层的深度相同。当凹槽线的凹槽的深度与多层柔性电路板的电镀亚层的深度相同时，凹槽线既可以起到提高底部填充胶进行底部填充时流动的均匀性，又不会因凹槽深度过深从而对多层柔性电路板造成过多的浪费。According to some embodiments of the present application, the depth of the groove of the groove line is not particularly limited, for example, the depth of the groove of the groove line may be the same as the depth of the plating sub-layer of the multilayer flexible circuit board. When the depth of the groove of the groove line is the same as the depth of the electroplating sub-layer of the multilayer flexible circuit board, the groove line can not only improve the uniformity of the flow of the underfill during underfilling, but also will not be affected by the groove. The depth is too deep to cause excessive waste to the multilayer flexible circuit board.
根据本申请的一些实施例，凹槽线的凹槽结构不受特别限制，例如凹槽线的凹槽可具有开口和底面，凹槽的底面在电路基板上的正投影位于凹槽的开口在电路基板上的正投影内。当凹槽的结构为上述形状时，在底部填充胶进行填充时，胶体均匀注满所有凹槽线后，当胶体继续注入时，胶体在重力的作用下开始向两侧均匀溢出，进而提高底部填充胶的流动均匀性。According to some embodiments of the present application, the groove structure of the groove line is not particularly limited. For example, the groove of the groove line may have an opening and a bottom surface, and the orthographic projection of the bottom surface of the groove on the circuit substrate is located at the opening of the groove. Inside the orthographic projection on the circuit board. When the structure of the groove is the above shape, when the underfill is filled with glue, after the glue fills all the groove lines evenly, when the glue continues to be injected, the glue starts to overflow to both sides evenly under the action of gravity, thereby improving the bottom. The flow uniformity of the filler.
根据本申请的一些实施例，凹槽的形状不受特别限制，例如凹槽在垂直于电路基板所在平面的方向上的截面的形状可以为梯形，梯形的四个底角中的至少之一的角度为120-150°。根据本申请的一个实施例，凹槽在垂直于电路基板所在平面的方向上的截面的形状可以为三角形。根据本申请的一些实施例，凹槽在垂直于电路基板所在平面的方向上的截面的形状为圆形。According to some embodiments of the present application, the shape of the groove is not particularly limited. For example, the shape of the cross-section of the groove in a direction perpendicular to the plane of the circuit substrate may be a trapezoid, and the shape of at least one of the four bottom corners of the trapezoid may be a trapezoid. The angle is 120-150°. According to an embodiment of the present application, the shape of the cross section of the groove in the direction perpendicular to the plane of the circuit substrate may be a triangle. According to some embodiments of the present application, the shape of the cross section of the groove in a direction perpendicular to the plane of the circuit substrate is a circle.
在本申请的又一方面，本申请提出了一种显示面板，参考图5，为了便于理解，图中仅示出了一个电镀亚层120和一个绝缘亚层130，该显示面板包括：柔性电路板100，柔性电路板为上述的，芯片电路板200，芯片电路板100与柔性电路板200通过多个焊接位点300电连接，柔性电路板100以及芯片电路板200之间具有固定胶400，固定胶400至少分布于多个焊接位点300之间的空隙处，柔性电路板200靠近芯片电路板100的一侧表面与芯片电路板100靠近柔性电路板200的一侧表面中的至少之一具有多条凹槽线，焊接位点300位于多条凹槽线之间处。由此，通过将芯片电路板与具有凹槽线的柔性电路板焊接，并在芯片电路板与柔性电路板间进行底部填充后，可获得具有较高可靠性的焊接位点以及相邻焊接位点间无贯穿气泡，进而提高显示面板的使用稳定性。In another aspect of the present application, the present application proposes a display panel. Referring to FIG. 5 , for ease of understanding, only one electroplating sub-layer 120 and one insulating sub-layer 130 are shown in the figure. The display panel includes: a flexible circuit The board 100, the flexible circuit board are the above, the chip circuit board 200, the chip circuit board 100 and the flexible circuit board 200 are electrically connected by a plurality of welding sites 300, and there is a fixing glue 400 between the flexible circuit board 100 and the chip circuit board 200, The fixing glue 400 is distributed at least in the spaces between the plurality of soldering sites 300 , and at least one of the side surface of the flexible circuit board 200 close to the chip circuit board 100 and the side surface of the chip circuit board 100 close to the flexible circuit board 200 With a plurality of groove lines, the weld site 300 is located between the plurality of groove lines. Therefore, by welding the chip circuit board and the flexible circuit board with groove lines, and after underfilling between the chip circuit board and the flexible circuit board, a welding point with high reliability and an adjacent welding point can be obtained. There are no penetrating air bubbles between the dots, thereby improving the use stability of the display panel.
根据本申请的一些实施例，芯片电路板的种类不受特别限制，例如芯片电路板可以为触控芯片电路板。According to some embodiments of the present application, the type of the chip circuit board is not particularly limited, for example, the chip circuit board may be a touch chip circuit board.
根据本申请的一些实施例，参考图3，显示面板的结构不受特别限制，例如当芯片电路板为触控芯片电路板时，显示面板可进一步包括触控金属层600和触控走线层500，触控走线层600被配置为驱动触控金属层500，触控金属层可将其接收的触控信号经触控走线层传输至触控芯片电路板上，以进行后续的数据处理。触控金属层600位于像素区700内，触控走线层500主要位于周边区，即显示面板上除像素区700以外的区域，并延伸至绑定区 800，与绑定区800内的焊接位点300电连接。其中，位于绑定区800内的部分触控走线层500至少部分位于柔性电路板除电镀亚层130外的其它层。由此，可通过触控走线层和触控金属层的设置进一步提高显示面板的使用性能。According to some embodiments of the present application, referring to FIG. 3 , the structure of the display panel is not particularly limited. For example, when the chip circuit board is a touch chip circuit board, the display panel may further include a touch metal layer 600 and a touch wiring layer 500, the touch wire layer 600 is configured to drive the touch metal layer 500, and the touch metal layer can transmit the touch signal received by the touch wire layer to the touch chip circuit board through the touch wire layer for subsequent data processing deal with. The touch metal layer 600 is located in the pixel area 700 , and the touch wiring layer 500 is mainly located in the peripheral area, that is, the area on the display panel other than the pixel area 700 , and extends to the binding area 800 , and the welding in the binding area 800 Site 300 is electrically connected. Wherein, part of the touch trace layer 500 located in the binding area 800 is at least partially located on other layers of the flexible circuit board except the electroplating sub-layer 130 . Therefore, the use performance of the display panel can be further improved through the arrangement of the touch wiring layer and the touch metal layer.
根据本申请的一些实施例，参考图4，焊接位点300在柔性电路板100上的位置不受特别限制，例如焊接位点在柔性电路板上的正投影可与柔性电路板上的多条凹槽线均不重合。当焊接位点大小相近时，焊接位点在柔性电路板上的正投影与柔性电路板上的多条凹槽线均不重合时，焊接位点与柔性电路板以及芯片电路板间的接触面积最大，焊接效果最好。According to some embodiments of the present application, referring to FIG. 4 , the position of the soldering site 300 on the flexible circuit board 100 is not particularly limited, for example, the orthographic projection of the soldering site on the flexible circuit board may be the same as the The groove lines are not coincident. When the size of the soldering site is similar, and the orthographic projection of the soldering site on the flexible circuit board does not coincide with the multiple groove lines on the flexible circuit board, the contact area between the soldering site and the flexible circuit board and the chip circuit board The largest, the best welding effect.
根据本申请的一些实施例，参考图4，柔性电路板100上的所具有的多个焊接位点焊接位点300的排布方式不受特别限制，例如，多个焊接位点可以为阵列排布。当焊接位点为阵列排布时，焊接位点在柔性电路板和芯片电路板间的分布更为均匀，芯片电路板与柔性电路板间的连接更为牢固。According to some embodiments of the present application, referring to FIG. 4 , the arrangement of the plurality of soldering spots on the flexible circuit board 100 is not particularly limited, for example, the plurality of soldering spots may be arranged in an array cloth. When the welding points are arranged in an array, the distribution of the welding points between the flexible circuit board and the chip circuit board is more uniform, and the connection between the chip circuit board and the flexible circuit board is firmer.
根据本申请的一些实施例，参考图4，柔性电路板100上的多条凹槽线的走向不受特别限制，例如多条凹槽线中的一部分可沿第一方向延伸，另一部分可沿第二方向延伸，且第一方向和第二方向相互垂直。由此，便于制备具有阵列结构的焊接位点以及底部填充胶更为均匀地在柔性电路板和芯片电路板间流动。根据本申请的一些实施例，凹槽线与焊接位点可交替分布，进而在进一步提高空间利用率的基础上，有效提高底部填充剂填充时的流动均匀性。According to some embodiments of the present application, referring to FIG. 4 , the direction of the plurality of groove lines on the flexible circuit board 100 is not particularly limited. For example, a part of the plurality of groove lines may extend along the first direction, and the other part may extend along the first direction. The second direction extends, and the first direction and the second direction are perpendicular to each other. Therefore, it is convenient to prepare the soldering sites with the array structure and the underfill can flow more uniformly between the flexible circuit board and the chip circuit board. According to some embodiments of the present application, groove lines and welding sites can be alternately distributed, thereby effectively improving the flow uniformity during filling of the underfill agent on the basis of further improving space utilization.
根据本申请的一些实施例，固定胶的种类不受特别限制，例如固定胶可以为底部填充胶，具体地，固定胶可以为环氧树脂。According to some embodiments of the present application, the type of the fixing glue is not particularly limited, for example, the fixing glue may be an underfill glue, and specifically, the fixing glue may be epoxy resin.
根据本申请的实施例，柔性电路板和芯片电路板的结构不受特别限制，例如柔性电路板靠近芯片电路板一侧，以及芯片电路板靠近柔性电路板一侧的表面均具有对位标记，具体地，对位标记可以为预留垫片。由此，可通过柔性电路板和芯片电路板上的预留垫片进行定位，随后在柔性电路板与芯片电路板间形成多个焊接位点。参考图5，在将柔性电路板具有多条凹槽线的一侧靠近芯片电路板后，可通过将柔性电路板预留垫片110和芯片电路板预留垫片210进行对位提高对位精准度，提高芯片电路板的位置准确性，提高柔性电路板的利用率。According to the embodiments of the present application, the structures of the flexible circuit board and the chip circuit board are not particularly limited, for example, the side of the flexible circuit board close to the chip circuit board and the surface of the chip circuit board close to the flexible circuit board have alignment marks, Specifically, the alignment mark may be a reserved spacer. Therefore, positioning can be performed through the reserved pads on the flexible circuit board and the chip circuit board, and then a plurality of welding sites are formed between the flexible circuit board and the chip circuit board. Referring to FIG. 5 , after the side of the flexible circuit board with a plurality of groove lines is placed close to the chip circuit board, the alignment can be improved by aligning the flexible circuit board reserved gasket 110 and the chip circuit board reserved gasket 210 Accuracy, improve the positional accuracy of the chip circuit board, and improve the utilization rate of the flexible circuit board.
根据本申请的一些实施例，在电路基板不走线的一侧表面形成多条凹槽线的方法不受特别限制，例如可通过蚀刻的方法在电路基板不走线的一侧表面形成多条凹槽线。According to some embodiments of the present application, the method for forming a plurality of groove lines on the side surface of the circuit substrate without traces is not particularly limited. For example, a plurality of groove lines may be formed on the side surface of the circuit substrate without traces by etching. Grooved line.
在本申请的又一方面，本申请提出了一种制备上述的显示面板的方法，通过该方法制备显示面板的良品率较高，具有较好的使用稳定性。具体地，参考图10，该方法具体包括以下步骤：In yet another aspect of the present application, the present application proposes a method for preparing the above-mentioned display panel. The display panel prepared by the method has a high yield and good stability in use. Specifically, referring to Figure 10, the method specifically includes the following steps:
S100：提供柔性电路板S100: Provides a flexible circuit board
根据本申请的一些实施例，在该步骤提供柔性线路板，柔性线路板为前述的，即该柔性线路板的一侧具有多条凹槽线。According to some embodiments of the present application, a flexible circuit board is provided in this step, and the flexible circuit board is as described above, that is, one side of the flexible circuit board has a plurality of groove lines.
根据本申请的实施例，凹槽线可以形成在柔性线路板未设置金属走线的一侧，凹槽线可以是通过刻蚀的方法而形成的。关于凹槽线的凹槽在垂直于电路基板所在平面的方向上的截面的形状、延伸方向以及排布，前面已经进行了详细的描述，在此不再赘述。According to the embodiment of the present application, the groove lines may be formed on the side of the flexible circuit board where no metal traces are provided, and the groove lines may be formed by an etching method. The shape, extension direction and arrangement of the cross-section of the groove of the groove line in the direction perpendicular to the plane of the circuit substrate have been described in detail above and will not be repeated here.
S200：提供芯片电路板，柔性电路板具有多条凹槽线的一侧靠近芯片电路板，并在柔性电路板与芯片电路板间形成多个焊接位点S200: Provide a chip circuit board, one side of the flexible circuit board with multiple groove lines is close to the chip circuit board, and multiple welding sites are formed between the flexible circuit board and the chip circuit board
根据本申请的一些实施例，在该步骤将芯片电路板和柔性线路板通过焊接的方式连接，形成焊接位点的方式不受特别限制，例如形成焊接位点的方式可以为流焊或浸焊中的至少一种。According to some embodiments of the present application, the chip circuit board and the flexible circuit board are connected by soldering in this step, and the method of forming the soldering site is not particularly limited, for example, the method of forming the soldering site may be flow soldering or dip soldering at least one of them.
S300：向柔性电路板与芯片电路板间注入固定胶S300: Inject the fixing glue between the flexible circuit board and the chip circuit board
根据本申请的一些实施例，在该步骤注入固定胶以令固定胶至少分布于多个焊接位点之间的空隙处，进而对焊接位点进行加固，提高焊接位点的可靠性。固定胶的种类不受特别限制，例如固定胶可以为底部填充胶，具体地，固定胶可以为环氧树脂。According to some embodiments of the present application, the fixing glue is injected in this step so that the fixing glue is distributed at least in the gaps between the plurality of welding sites, thereby strengthening the welding sites and improving the reliability of the welding sites. The type of the fixing glue is not particularly limited, for example, the fixing glue can be underfill glue, and specifically, the fixing glue can be epoxy resin.
根据本申请的一些实施例，参考图7、图8和图9，向柔性电路板与芯片电路板间注入固定胶的方式不受特别限制，例如向柔性电路板与芯片电路板间注入固定胶的方式可以为单边施胶或者L型施胶。According to some embodiments of the present application, referring to FIGS. 7 , 8 and 9 , the manner of injecting the fixing glue between the flexible circuit board and the chip circuit board is not particularly limited, for example, injecting the fixing glue between the flexible circuit board and the chip circuit board The method can be unilateral sizing or L-shaped sizing.
在本申请的又一方面，本申请提出了一种显示装置，包括显示面板，显示面板为上述的显示面板。由此，该显示装置具有上述的显示面板的全部特征及优点，在此不再赘述。In another aspect of the present application, the present application provides a display device, including a display panel, and the display panel is the above-mentioned display panel. Therefore, the display device has all the features and advantages of the above-mentioned display panel, which will not be repeated here.
下面通过具体的实施例对本申请的方案进行说明，需要说明的是，下面的实施例仅用于说明本申请，而不应视为限定本申请的范围。实施例中未注明具体技术或条件的，按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。所用试剂或仪器未注明生产厂商者，均为可以通过市购获得的常规产品。The solution of the present application will be described below through specific examples. It should be noted that the following examples are only used to illustrate the present application, and should not be regarded as limiting the scope of the present application. If no specific technique or condition is indicated in the examples, the technique or condition described in the literature in the field or the product specification is used. The reagents or instruments used without the manufacturer's indication are conventional products that can be obtained from the market.
实施例1：Example 1:
1.提供电路基板，电路基板为多层柔性电路板，在多层柔性电路板不走线的一侧表面通过蚀刻形成多条凹槽线，多条凹槽线垂直相交，凹槽线的深度与多层柔性电路板的电镀亚层的厚度相同。1. Provide a circuit substrate. The circuit substrate is a multi-layer flexible circuit board. Multiple groove lines are formed by etching on the side surface of the multi-layer flexible circuit board without wiring. The multiple groove lines intersect vertically. The depth of the groove lines The same thickness as the plating sublayer of the multilayer flexible circuit board.
2.提供触控芯片电路板，将柔性电路板具有多条凹槽线的一侧靠近芯片电路板，通过浸焊的方式在柔性电路板与触控芯片电路板间形成阵列排布的焊接位点。2. Provide a touch chip circuit board, place the side of the flexible circuit board with multiple groove lines close to the chip circuit board, and form an array of welding positions between the flexible circuit board and the touch chip circuit board by dip soldering point.
3.向柔性电路板与触控芯片电路板间以单边施胶的方式注入底部填充胶。3. Inject underfill glue between the flexible circuit board and the touch chip circuit board by means of unilateral gluing.
结果表明，如图5所示，底部填充胶在柔性电路板与触控芯片电路板间分布均匀，焊接位点固定到位，通过镜检观察可知，相邻焊接位点间无贯穿气泡，显示面板通过触控面 板测试。The results show that, as shown in Figure 5, the underfill glue is evenly distributed between the flexible circuit board and the touch chip circuit board, and the welding sites are fixed in place. Pass the touch panel test.
对比例1：Comparative Example 1:
1.提供电路基板，电路基板为多层柔性电路板。1. Provide a circuit substrate, which is a multi-layer flexible circuit board.
2.提供触控芯片电路板，将柔性电路板一侧靠近芯片电路板，通过浸焊的方式在柔性电路板与触控芯片电路板间形成阵列排布的焊接位点。2. Provide a touch chip circuit board, place one side of the flexible circuit board close to the chip circuit board, and form an array of welding sites between the flexible circuit board and the touch chip circuit board by dip soldering.
3.向柔性电路板与触控芯片电路板间以单边施胶的方式注入底部填充胶。3. Inject underfill glue between the flexible circuit board and the touch chip circuit board by means of unilateral gluing.
结果表明，如图6所示，底部填充胶在柔性电路板与触控芯片电路板间分布极不均匀，通过镜检观察可知，相邻焊接位点有大量气泡，且形成贯穿气泡，焊接位点在触控面板测试中发生形变，相邻焊接位点通过贯穿气泡短接后发生短路，显示面板无法通过触控面板测试。The results show that, as shown in Figure 6, the distribution of the underfill glue between the flexible circuit board and the touch chip circuit board is extremely uneven. Through microscopic observation, it can be seen that there are a large number of air bubbles in the adjacent welding sites, and through bubbles are formed. The point is deformed during the touch panel test, and the adjacent soldering points are short-circuited after passing through the bubble, and the display panel cannot pass the touch panel test.
在本申请的描述中，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请而不是要求本申请必须以特定的方位构造和操作，因此不能理解为对本申请的限制。In the description of the present application, the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and does not require the present application to be in a specific manner. The orientation configuration and operation are therefore not to be construed as limitations on the present application.
在本说明书的描述中，参考术语“一个实施例”、“另一个实施例”等的描述意指结合该实施例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, description with reference to the terms "one embodiment", "another embodiment", etc. means that a particular feature, structure, material or characteristic described in connection with the embodiment is included in at least one embodiment of the present application . In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limitations to the present application. Embodiments are subject to variations, modifications, substitutions and variations.

Claims (17)

  1. 一种柔性电路板，其中，包括：A flexible circuit board, comprising:
    电路基板，所述电路基板为多层柔性电路板，所述多层柔性电路板的至少两层具有电镀亚层，所述多层柔性电路板的第一表面具有多条凹槽线，所述凹槽线的所述凹槽的深度不小于所述多层柔性电路板中最靠近所述第一表面处的所述电镀亚层的深度。A circuit substrate, the circuit substrate is a multilayer flexible circuit board, at least two layers of the multilayer flexible circuit board have electroplating sub-layers, the first surface of the multilayer flexible circuit board has a plurality of groove lines, the The depth of the grooves of the groove line is not less than the depth of the electroplating sublayer in the multilayer flexible circuit board closest to the first surface.
  2. 根据权利要求1所述的柔性电路板，其中，所述凹槽线的所述凹槽的深度与所述多层柔性电路板的所述电镀亚层的深度相同。The flexible circuit board of claim 1 , wherein the grooves of the groove line have the same depth as the plating sub-layers of the multilayer flexible circuit board.
  3. 根据权利要求2所述的柔性电路板，其中，所述凹槽具有底面和开口，所述凹槽的所述底面在所述电路基板上的正投影位于所述凹槽的所述开口在所述电路基板上的正投影内。The flexible circuit board according to claim 2, wherein the groove has a bottom surface and an opening, and an orthographic projection of the bottom surface of the groove on the circuit substrate is located where the opening of the groove is located. within the orthographic projection on the circuit substrate.
  4. 根据权利要求3所述的柔性电路板，其中，所述凹槽在垂直于所述电路基板所在平面的方向上的截面的形状为梯形，所述梯形的四个底角中的至少之一的角度为120-150°。The flexible circuit board according to claim 3, wherein the shape of the cross section of the groove in a direction perpendicular to the plane where the circuit substrate is located is a trapezoid, and at least one of the four bottom corners of the trapezoid is in the shape of a trapezoid. The angle is 120-150°.
  5. 根据权利要求3所述的柔性电路板，其中，所述凹槽在垂直于所述电路基板所在平面的方向上的截面的形状为三角形。The flexible circuit board according to claim 3, wherein the shape of the cross section of the groove in a direction perpendicular to the plane where the circuit substrate is located is a triangle.
  6. 根据权利要求3所述的柔性电路板，其中，所述凹槽在垂直于所述电路基板所在平面的方向上的截面的形状为圆形。The flexible circuit board according to claim 3, wherein the shape of the cross section of the groove in a direction perpendicular to the plane where the circuit substrate is located is a circle.
  7. 一种显示面板，其中，包括：A display panel, comprising:
    柔性电路板，所述柔性电路板为权利要求1-6任一项所述的，A flexible circuit board, wherein the flexible circuit board is described in any one of claims 1-6,
    芯片电路板，所述芯片电路板与所述柔性电路板通过多个焊接位点电连接，所述柔性电路板以及所述芯片电路板之间具有固定胶，所述固定胶至少分布于所述多个焊接位点之间的空隙处，A chip circuit board, the chip circuit board and the flexible circuit board are electrically connected through a plurality of welding points, and there is a fixing glue between the flexible circuit board and the chip circuit board, and the fixing glue is distributed at least on the In the gaps between multiple welding sites,
    所述柔性电路板靠近所述芯片电路板一侧的表面与所述芯片电路板靠近所述柔性电路板一侧的表面中的至少之一具有多条凹槽线，At least one of the surface of the flexible circuit board on the side close to the chip circuit board and the surface of the chip circuit board on the side close to the flexible circuit board has a plurality of groove lines,
    所述焊接位点位于所述多条凹槽线之间处。The weld site is located between the plurality of groove lines.
  8. 根据权利要求7所述的显示面板，其中，进一步包括触控金属层和触控走线层，所述触控走线层被配置为驱动所述触控金属层，所述触控走线层至少部分位于所述柔性电路板中除去最靠近所述第一表面处的电镀亚层外的其它层，所述触控走线层与所述焊接位点电连接。The display panel according to claim 7, further comprising a touch metal layer and a touch wiring layer, the touch wiring layer is configured to drive the touch metal layer, the touch wiring layer At least a part of other layers in the flexible circuit board except the electroplating sub-layer closest to the first surface are located, and the touch trace layer is electrically connected to the soldering site.
  9. 根据权利要求8所述的显示面板，其中，所述焊接位点在所述柔性电路板上的正投影与所述柔性电路板上的多条凹槽线均不重合。The display panel of claim 8, wherein the orthographic projection of the soldering site on the flexible circuit board does not coincide with a plurality of groove lines on the flexible circuit board.
  10. 根据权利要求9所述的显示面板，其中，具有多个所述焊接位点，多个所述焊接 位点阵列排布。The display panel of claim 9, wherein there are a plurality of the soldering sites, and the plurality of the soldering sites are arranged in an array.
  11. 根据权利要求9所述的显示面板，其中，所述多条凹槽线中的一部分沿第一方向延伸，另一部分沿第二方向延伸，所述第一方向和所述第二方向相交。9. The display panel of claim 9, wherein a portion of the plurality of groove lines extends along a first direction, and the other portion extends along a second direction, the first direction and the second direction intersecting.
  12. 根据权利要求11所述的显示面板，其中，所述凹槽线与所述焊接位点交替分布。The display panel of claim 11 , wherein the groove lines and the soldering sites are alternately distributed.
  13. 根据权利要求7所述的显示面板，其中，所述固定胶为底部填充胶。The display panel according to claim 7, wherein the fixing glue is an underfill glue.
  14. 根据权利要求7-11任一项所述的显示面板，其中，The display panel according to any one of claims 7-11, wherein,
    所述柔性电路板靠近所述芯片电路板一侧，以及所述芯片电路板靠近所述柔性电路板一侧的表面均具有对位标记，所述对位标记包括预留垫片。The side of the flexible circuit board close to the chip circuit board and the surface of the chip circuit board close to the flexible circuit board are provided with alignment marks, and the alignment marks include reserved pads.
  15. 一种制备权利要求7-14任一项所述的显示面板的方法，其中，包括：A method of preparing the display panel according to any one of claims 7-14, comprising:
    提供柔性电路板，Provide flexible circuit boards,
    提供芯片电路板，所述柔性电路板具有多条凹槽线的一侧靠近所述芯片电路板，并在所述柔性电路板与所述芯片电路板间形成多个焊接位点，A chip circuit board is provided, one side of the flexible circuit board having a plurality of groove lines is close to the chip circuit board, and a plurality of welding sites are formed between the flexible circuit board and the chip circuit board,
    向所述柔性电路板与所述芯片电路板间注入固定胶，以令所述固定胶至少分布于所述多个焊接位点之间的空隙处。A fixing glue is injected between the flexible circuit board and the chip circuit board, so that the fixing glue is distributed at least in the gaps between the plurality of welding points.
  16. 根据权利要求15所述的方法，其中，形成所述焊接位点的方式为流焊或浸焊中的至少一种。16. The method of claim 15, wherein the soldering site is formed by at least one of flow soldering or dip soldering.
  17. 一种显示装置，其中，包括显示面板，所述显示面板为权利要求7-14任一项所述的显示面板。A display device, comprising a display panel, the display panel being the display panel of any one of claims 7-14.
PCT/CN2021/125636 2021-03-08 2021-10-22 Flexible circuit board, display panel and preparation method therefor, and display device WO2022188415A1 (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113038698B (en) * 2021-03-08 2022-09-09 京东方科技集团股份有限公司 Flexible circuit board, display panel, preparation method and display device
CN113727514A (en) * 2021-08-26 2021-11-30 维沃移动通信有限公司 Circuit board assembly and electronic device
CN117460147A (en) * 2021-09-26 2024-01-26 荣耀终端有限公司 Circuit board and electronic equipment
KR20230065682A (en) * 2021-11-05 2023-05-12 삼성에스디아이 주식회사 Optical member and optical display apparatus comprising the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201209971A (en) * 2010-08-17 2012-03-01 Powertech Technology Inc Semiconductor package with bonding wires in window encapsulated by underfill material and method fabricated for the same
CN103491732A (en) * 2013-10-08 2014-01-01 华进半导体封装先导技术研发中心有限公司 Method for manufacturing circuit board layer-adding structure
CN104103604A (en) * 2013-04-07 2014-10-15 力成科技股份有限公司 Packaging structure and manufacturing method thereof
CN104332450A (en) * 2014-11-10 2015-02-04 京东方科技集团股份有限公司 Mask plate for glass cement coating and coating method adopting same
CN105491787A (en) * 2016-01-01 2016-04-13 广州兴森快捷电路科技有限公司 Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board
JP3228842U (en) * 2020-02-17 2020-11-12 ▲き▼邦科技股▲分▼有限公司 Chip package and its circuit board
CN113038698A (en) * 2021-03-08 2021-06-25 京东方科技集团股份有限公司 Flexible circuit board, display panel, preparation method and display device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787271B2 (en) * 1988-03-07 1995-09-20 日立化成工業株式会社 Method for manufacturing multilayer printed wiring board
TWI238507B (en) * 2003-09-29 2005-08-21 Phoenix Prec Technology Corp Integrated circuit package substrate with presolder structure and method for fabricating the same
EP1865549A4 (en) * 2005-03-29 2012-07-11 Panasonic Corp Flip chip mounting method and bump forming method
US8110933B2 (en) * 2006-12-26 2012-02-07 Panasonic Corporation Semiconductor device mounted structure and semiconductor device mounted method
JP4685077B2 (en) * 2007-10-25 2011-05-18 パナソニック株式会社 Mobile phone equipment
CN101226906A (en) * 2008-02-15 2008-07-23 日月光半导体制造股份有限公司 Chip carrier with dams
KR101646808B1 (en) * 2009-10-28 2016-08-08 가부시키가이샤 제이올레드 Lens sheet, display panel device, and display device
CN104659269B (en) * 2015-02-06 2017-05-17 深圳市华星光电技术有限公司 OLED encapsulation method and OLED encapsulation structure
CN106255310A (en) * 2016-08-17 2016-12-21 京东方科技集团股份有限公司 A kind of COF flexible PCB, display device
CN110320972B (en) * 2019-05-20 2022-05-06 荣耀终端有限公司 Fingerprint identification module and electronic equipment
CN111370593A (en) * 2020-03-18 2020-07-03 京东方科技集团股份有限公司 Display panel, manufacturing method and display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201209971A (en) * 2010-08-17 2012-03-01 Powertech Technology Inc Semiconductor package with bonding wires in window encapsulated by underfill material and method fabricated for the same
CN104103604A (en) * 2013-04-07 2014-10-15 力成科技股份有限公司 Packaging structure and manufacturing method thereof
CN103491732A (en) * 2013-10-08 2014-01-01 华进半导体封装先导技术研发中心有限公司 Method for manufacturing circuit board layer-adding structure
CN104332450A (en) * 2014-11-10 2015-02-04 京东方科技集团股份有限公司 Mask plate for glass cement coating and coating method adopting same
CN105491787A (en) * 2016-01-01 2016-04-13 广州兴森快捷电路科技有限公司 Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board
JP3228842U (en) * 2020-02-17 2020-11-12 ▲き▼邦科技股▲分▼有限公司 Chip package and its circuit board
CN113038698A (en) * 2021-03-08 2021-06-25 京东方科技集团股份有限公司 Flexible circuit board, display panel, preparation method and display device

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Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 10/01/2024)