WO2022186679A1 - Contactor and method for manufacturing same - Google Patents
Contactor and method for manufacturing same Download PDFInfo
- Publication number
- WO2022186679A1 WO2022186679A1 PCT/KR2022/003888 KR2022003888W WO2022186679A1 WO 2022186679 A1 WO2022186679 A1 WO 2022186679A1 KR 2022003888 W KR2022003888 W KR 2022003888W WO 2022186679 A1 WO2022186679 A1 WO 2022186679A1
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- WIPO (PCT)
- Prior art keywords
- contactor
- buffer
- conductive
- mold
- pad
- Prior art date
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Definitions
- the present invention relates to a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other.
- an interconnection structure electrically connecting a terminal of a pad under test and a terminal of a pad of a test device is used.
- the interconnection structure mounted on the test device sends electricity while in contact with the pad of the test object, and the defective pad of the test object is selected according to the signal returned at that time.
- the interconnection structure may electrically transmit an inspection signal while ensuring contact with the terminal of the pad under test by elastic force.
- a conventional interconnect structure uses a pogo pin, and the pogo pin includes a hollow pipe, a spring positioned in the pipe, and at least one terminal movable while supported by the spring and the pipe. With this configuration, the pogo pin can electrically transmit the inspection signal while ensuring the contact with the terminal of the subject pad by the elastic force.
- the present invention is to solve the problems of the prior art described above, a contactor with a simple manufacturing process and low manufacturing cost, which can replace a contact pin such as a conventional pogo pin manufactured by processing and assembling a spring part. would like to provide
- an embodiment of the present invention is a method of manufacturing a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other, preparing a mold having a receiving part to do; inserting a conductive part into the receiving part; filling a liquid buffer containing conductive particles into the receiving part into which the conductive part is inserted; aligning a magnetic force concentrating member having a magnetic pad formed thereon at a position corresponding to the receiving portion to the mold; curing the buffer unit under preset pressure and temperature conditions; and separating the contactor in which the conductive part and the buffer part are integrally formed from the mold.
- Another embodiment of the present invention provides a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other, the contactor comprising: a conductive part having an insertion part; and a buffer portion containing conductive particles and formed to receive the insertion portion, wherein the buffer portion is cured to a shape accommodating the insertion portion by a phase change and is integrally coupled with the conductive portion. ter can be provided.
- any one of the means for solving the problems of the present invention described above it is possible to provide a contactor that has a simple structure and is easy to manufacture compared to a conventional pogo pin configuration.
- the contactor according to the present invention is integrally configured, defects due to processing and assembly tolerances can be improved, and contact resistance can be prevented from being increased due to pinching or damage between components during use.
- the contactor according to the present invention includes a soft contact configuration, damage applied to an object to be inspected can be minimized, and it is advantageous in miniaturization and high-speed measurement.
- the conductive part providing electrical connection and rigidity and the buffer part providing elasticity can be firmly coupled integrally.
- the phase change of the buffer part while aligning the conductive particles can be manufactured to be completely integrated with the conductive part, so that the disadvantage of complicated processes and the risk of breakage or separation during use can be eliminated in the case of assembling.
- the bonding area is enlarged and a strong coupling can be made.
- the length of the contactor can be increased by filling and stacking buffer portions in each of the plurality of plates. Accordingly, it is possible to effectively manufacture a contactor having a long shape while maintaining a minute cross-sectional area.
- FIG. 1 and 2 are views showing embodiments of a contactor according to the present invention.
- FIG. 3 is a view showing a method of manufacturing a contactor according to the present invention.
- FIG. 4 to 10 are views illustrating each step of the method for manufacturing the contactor shown in FIG. 3 .
- FIG. 11 is a cross-sectional view illustrating another embodiment of a contactor according to the present invention.
- the contactor according to the present invention is a structure for electrically connecting a pad of an inspection apparatus and a pad of an object to be inspected to each other, and may include a probe pin.
- the contactor 100 may include a conductive part 110 and a buffer part 120 .
- the contactor 100 according to the present invention has a simple structure and easy assembly compared to the conventional pogo pin configuration. Since the contactor 100 is integrally formed, defects due to processing and assembly tolerances may be improved, and contact resistance may be prevented from increasing due to pinching or damage between components during use.
- the contactor 100 since the contactor 100 according to the present invention includes a soft contact configuration, damage applied to an object to be inspected during inspection can be minimized.
- the contactor 100 has the advantage of being more compact than the conventional pogo pin and capable of responding to high-speed measurement.
- FIG. 3 is a view showing a method for manufacturing a contactor according to the present invention
- FIGS. 4 to 10 are views showing each step of the method for manufacturing a contactor shown in FIG. 3 . 3 and 4
- the mold 210 including the receiving part 211 may be prepared in step S110 .
- the contactor 100 according to the present invention can respond to the miniaturization trend by manufacturing the buffer part 120 connected to the conductive part 110 using the mold 210 without going through an assembly process.
- the mold 210 is a manufacturing frame made of a metal or resin material for manufacturing the contactor 100 .
- the mold 210 may be made of a non-magnetic metal or resin. As an example, it may include aluminum (Al) and Torlon.
- the mold 210 may include a plurality of accommodating parts 211 as shown in FIG. 4 .
- the mold 210 may form a plurality of accommodating parts 211 based on a predetermined interval.
- the accommodating part 211 may be formed by laminating a plurality of plates 212 as one mold for manufacturing the contactor 100 . Thereafter, when the contactor 100 is manufactured and the contactor 100 is separated from the mold 210 , the plurality of stacked plates 212 can be removed one by one, so that the mold 210 and the contactor 100 are removed. (100) can be separated more easily, and can be separated without damage to the molded contactor (100).
- the accommodating part 211 may include a first through-hole 211a and a second through-hole 211b.
- the second through-hole 211b may have a smaller diameter than the first through-hole 211a.
- the receiving portion 211 formed on one side of the mold 210 may have a first through hole 211a
- the receiving portion 211 formed on the other side of the mold 210 may have a second through hole.
- a hole 211b may be provided.
- the first through-hole 211a may accommodate the conductive part 110 of the contactor 100 to be described later
- the second through-hole 211b is used to form a buffer part 120 of the contactor 100 to be described later. can
- the conductive part 110 may be inserted into the receiving part 211 in step S120 .
- the conductive part 110 may be inserted in one direction.
- the conductive part 110 may be formed of a metal material and may include an insertion part 111 .
- the conductive part 110 may further include a head part 112 connected to the insertion part 111 and having a diameter larger than that of the insertion part 111 and the buffer part 120 .
- the conductive part 110 may include an insertion part 111 accommodated in the buffer part 120 , and a head part 112 separated from the insertion part 111 .
- the conductive part 110 may be formed of a material including a ferromagnetic metal, for example, iron, nickel, and/or cobalt.
- the insertion part 111 and the buffer part 120 of the conductive part 110 have a concentric cylindrical shape, and the diameter of the insertion part 111 is smaller than the diameter of the buffer part 120 .
- the conductive part 110 and the buffer part 120 may be integrally coupled and formed through the insertion part 111 .
- the conductive part 110 may be inserted into the receiving part 211 so that the head portion 112 of the conductive part 110 is exposed. That is, the insertion part 111 of the conductive part 110 may be inserted into the receiving part 211 .
- a part of the conductive part 110 is disposed to be supported on the inner surface of the first through hole 211a, and the other part of the conductive part 110 is disposed at a central portion spaced apart from the inner surface of the second through hole 211b.
- the head portion 112 of the conductive part 110 is disposed to be supported on the inner surface of the first through hole 211a, and the insertion part 111 of the conductive part 110 is disposed on the inner surface of the second through hole 211b. It may be disposed in a central portion spaced apart from the.
- the liquid buffer 120 containing conductive particles may be filled in the receiving part 211 in which the conductive part 110 is inserted.
- the liquid buffer part 120 may be filled in another direction.
- the liquid buffer unit 120 may be filled in the receiving unit 211 in the other direction by inverting the mold 210 into which the conductive unit 110 is inserted in one direction.
- the mold 210 in which the head part 112 of the conductive part 110 is inserted into the first through hole 211a is reversely turned over to fill the liquid buffer 120 through the second through hole 211b.
- the buffer unit 120 may have a shape that contains the conductive particles 121 and accommodates at least a portion of the conductive unit 110 .
- the buffer part 120 may be formed to accommodate the insertion part 111 .
- the buffer unit 120 may be accommodated to surround the outer circumferential surface of the insertion portion 111 of the conducting unit 110 and coupled to one surface of the head portion 112 of the conducting unit 110 .
- the conductive particles 121 contained in the buffer part 120 may be arranged in the longitudinal direction of the buffer part 120 .
- the conductive particles 121 are in contact with each other to impart conductivity to the buffer unit 120 in the longitudinal direction.
- the buffer unit 120 is compressed by applying pressure in the longitudinal direction for the inspection of the object, which is an electrical element, the conductive particles 121 become closer to each other and the longitudinal electrical conductivity of the buffer unit 120 may be higher.
- the conductive particles 121 may be made of a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, etc. or an alloy material of two or more of these metal materials, which are ferromagnetic.
- the conductive particles 121 may be manufactured by coating the surface of the core metal with a metal having excellent conductivity, such as gold, silver, rhodium, palladium, platinum, or silver and gold, yin and rhodium, silver and palladium. have.
- the conductive particles 121 are, in order to improve conductivity, a MEMS tip (tip). It may further include flakes, wire rods, carbon nanotubes (CNTs), graphene (graphene), and the like.
- the step of filling the buffer unit 120 may be alternately performed with sequentially stacking a plurality of plates 212 .
- the head portion 112 of the conductive unit 110 may be inserted into the first plate 212 , and the second plate 212 may be stacked on the first plate 212 accommodating the conductive unit 110 , , the liquid buffer unit 120 may be filled in the receiving unit 211 of the stacked second plate 212 .
- the third plate 212 may be stacked, and the buffer part 120 may be formed by filling the buffer part 120 in liquid into the receiving part 211 of the stacked third plate 212 .
- the plates (the second plate and the third plate) filled with the buffer unit 120 may be sequentially stacked on the plate (the first plate) into which the conductive unit 110 is inserted.
- the magnetic force concentrating member 220 in which the magnetic pad 221 made of a ferromagnetic material is formed at a position corresponding to the receiving part 211 may be aligned with the mold 210 .
- the magnetic force concentrating member 220 may include a plurality of magnetic pads 221 spaced apart from each other.
- the magnetic pad 221 may be made of, for example, a magnetic metal such as nickel (Ni), a nickel-cobalt alloy (NiCo), and iron (Fe).
- the magnetic force concentrating member 220 may be formed of a weak magnetic material to induce the magnetic force to be concentrated on the magnetic pad 221 .
- the magnetic force concentrating member 220 is installed in the mold 210 so that the receiving portion 211 is closed by the magnetic pad 221 . ) can be adhered to.
- the magnetic force concentrating member 220 may be in close contact with the upper end and lower end of the mold 210 in which the liquid buffer unit 120 is filled in the receiving unit 211 .
- the magnetic pad 221 of the first magnetic force concentrating member 220 may be in close contact with the first through-hole 211a of the mold 210
- the magnetic pad 221 of the second magnetic force concentrating member 220 may be in close contact with the second through hole 211b of the mold 210 .
- the magnetic pad 221 is for concentrating the magnetic force of the contactor 100 .
- the buffer unit 120 may be cured under preset pressure and temperature conditions. Referring to FIG. 8 , in step S150 of curing the buffer unit 120 , at least one of heat and pressure may be applied to the conductive unit 110 and the buffer unit 120 by the magnetic force concentrating member 220 .
- the buffer unit 120 may be cured to a shape accommodating the insertion portion 111 by a phase change from a liquid phase to a solid phase, and may be integrally coupled with the conductive unit 110 .
- the buffer part 120 When the buffer part 120 is filled in the accommodating part 211, at least a portion may be in a liquid phase, and the shape may be fixed while being in contact with the accommodating part 211 and the conductive part 110 in the accommodating part 211 . Thereafter, the buffer unit 120 may undergo a phase change to a solid phase, increase in viscosity, and may be cured.
- the buffer unit 120 may form a structure directly bonded to the conductive unit 110 integrally.
- the buffer part 120 and the conductive part 110 may be integrally formed by forming a bonding surface with each other, and the contactor 100 may be integrally formed without a bonding medium including an adhesive material or a fastening part. can be formed with
- the buffer unit 120 may be cured to a shape that accommodates the insertion portion 111 of the conductive unit 110 by external pressure, and the buffer unit 120 is a conductive unit ( It may be cured into a shape to accommodate the insertion portion 111 of the 110 , and may be integrally coupled with the conductive unit 110 . However, even if no additional heat or pressure is applied, the buffer unit 120 may be cured while maintaining the shape and contact state within a preset temperature and pressure range.
- the liquid buffer unit 120 may be cured by applying heat while applying pressure to the magnetic force concentrating member 220 in close contact with the mold 210 .
- the buffer unit 120 may be formed of various types of polymer materials.
- the buffer unit 120 may be implemented with a diene rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and the like and their hydrogen compounds.
- the buffer unit 120 may be implemented as a block copolymer such as a styrene butadiene block copolymer, a styrene isoprene block copolymer, and their hydrogen compounds.
- the buffer unit 120 may be implemented with chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylenepropylenediene copolymer, and the like.
- the buffer unit 120 may be obtained by curing a liquid resin.
- step S160 the contactor 100 in which the conductive part 110 and the buffer part 120 are integrally formed may be separated from the mold 210 .
- the magnetic force concentrating member 220 in close contact with the mold 210 may be separated from the mold 210 .
- the plate 212 accommodating the buffer unit 120 is separated, and then the plate accommodating the conductive unit 110 . (212) can be separated.
- the second and third plates 212 containing the buffer unit 120 are separated from the contactor 100
- the first plate 212 containing the conductive unit 110 is separated from the contactor 100 . can be separated from
- the buffer unit 120 according to the present invention has a cylindrical shape, and the conductive particles 121 are distributed only in the area less than a predetermined radius in the buffer unit 120.
- the buffer unit 120 has a rod shape extending in one direction, and the conductive particles 121 are distributed only in the central region in the cross section of any figure shape perpendicular to the one direction.
- the buffer unit 120 may insert the conductive unit 110 on one side, and may include a protruding surface on the other side.
- the conductive particles 121 may be distributed in the longitudinal direction in the central region of the buffer unit 120 so as to extend from the conductive unit 110 .
- the buffer part 120 may insert the conductive part 110 on one side, and the conductive particles 121 are located in the central region of the buffer part 120 so as to extend with the conductive part 110 . It can be distributed in the longitudinal direction.
- the buffer part 120 may insert the conductive parts 110 on both sides, and the conductive particles 121 extend with the conductive parts 110 inserted on both sides. may be distributed in the longitudinal direction in the central region of Referring to (d) of FIG. 11 , the buffer part 120 may include protruding surfaces on both sides, and may include the conductive part 110 in the central region. The conductive particles 121 may be distributed in the longitudinal direction on both sides of the buffer part 120 so as to extend from the conductive part 110 .
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- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
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Abstract
The present invention relates to a method for manufacturing a contactor which electrically connects a pad of a subject and a pad of an inspection device with each other, the method comprising the steps of: preparing a mold equipped with a receiving unit; inserting a conductive unit in the receiving unit; filling the receiving unit, having the conductive unit inserted therein, with a liquid buffer unit containing conductive particles; aligning, with the mold, a magnetic force concentration member which has formed thereon a magnetic pad positioned so as to correspond to the receiving unit; curing the buffer unit under predetermined pressure and temperature conditions; and separating, from the mold, a contactor having the conductive unit and the buffer unit integrally formed.
Description
본 발명은 피검사체의 패드와 검사 장치의 패드를 서로 전기적으로 접속시키는 컨택터에 관한 것이다.The present invention relates to a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other.
반도체 소자에 대한 성능 검사 시에는 피검사체 패드의 단자와 검사 장치 패드의 단자를 전기적으로 연결하는 상호 접속 구조체가 사용된다. 검사 장치에 장착되어 있는 상호 접속 구조체가 피검사체의 패드에 접촉하면서 전기를 보내고, 그 때 돌아오는 신호에 따라 피검사체의 불량 패드를 선별하게 된다.In the performance test of the semiconductor device, an interconnection structure electrically connecting a terminal of a pad under test and a terminal of a pad of a test device is used. The interconnection structure mounted on the test device sends electricity while in contact with the pad of the test object, and the defective pad of the test object is selected according to the signal returned at that time.
상호 접속 구조체는 탄성력에 의해 피검사체 패드의 단자와의 접촉을 보장하면서 전기적으로 검사 신호를 전달할 수 있다. 종래의 상호 접속 구조체는 포고 핀(Pogo pin)을 사용하고 있으며, 포고 핀은 속이 빈 파이프와, 파이프 내에 위치되는 스프링과, 스프링 및 파이프에 지지되면서 이동 가능한 적어도 하나의 단자를 포함한다. 이러한 구성에 의해 포고 핀은 탄성력에 의해 피검사체 패드의 단자와의 접촉을 보장하면서 전기적으로 검사 신호를 전달할 수 있다.The interconnection structure may electrically transmit an inspection signal while ensuring contact with the terminal of the pad under test by elastic force. A conventional interconnect structure uses a pogo pin, and the pogo pin includes a hollow pipe, a spring positioned in the pipe, and at least one terminal movable while supported by the spring and the pipe. With this configuration, the pogo pin can electrically transmit the inspection signal while ensuring the contact with the terminal of the subject pad by the elastic force.
다만, 포고 핀은 동작 시 구성요소 간의 구조적인 끼임 현상이 일어날 수 있고, 반복 사용 시 구성요소의 물리적인 손상 가능성이 있다. 아울러, 피검사체 패드의 단자 간 피치(pitch)가 소형화되는 추세에 따라, 포고 핀 또한 소형화하여 제조할 필요성이 있고, 소형화 추세에 따라 구성요소 간의 끼임이나 손상 가능성 등을 방지하는 구조적인 제약 조건이 설계 및 제조에 있어 더욱 중요한 요소가 될 수 있다.However, when the pogo pin is operated, structural jamming between the components may occur, and there is a possibility of physical damage to the components during repeated use. In addition, as the pitch between the terminals of the test subject pad becomes smaller, there is a need to manufacture a smaller pogo pin, and there are structural constraints that prevent the possibility of pinching or damage between components according to the miniaturization trend. It can be a more important factor in design and manufacturing.
본 발명은 전술한 종래 기술의 문제점을 해결하기 위한 것으로서, 스프링 부품의 가공과 조립에 의해 제조되는 종래 포고 핀과 같은 접촉 핀을 대체할 수 있는, 제조 과정이 간단하고 제조 비용이 저렴한 컨택터를 제공하고자 한다.The present invention is to solve the problems of the prior art described above, a contactor with a simple manufacturing process and low manufacturing cost, which can replace a contact pin such as a conventional pogo pin manufactured by processing and assembling a spring part. would like to provide
또한, 포고 핀의 소형화 추세에 따라 포고 핀의 구조적 끼임 현상이나 물리적 손상 가능성 등을 방지하는 컨택터를 제공하고자 한다. In addition, according to the trend of miniaturization of the pogo pin, it is an object of the present invention to provide a contactor that prevents the possibility of structural jamming or physical damage of the pogo pin.
다만, 본 실시예가 이루고자 하는 기술적 과제는 상기된 바와 같은 기술적 과제들로 한정되지 않으며, 또 다른 기술적 과제들이 존재할 수 있다.However, the technical problems to be achieved by the present embodiment are not limited to the technical problems described above, and other technical problems may exist.
상술한 기술적 과제를 달성하기 위한 수단으로서, 본 발명의 일 실시예는, 피검사체의 패드와 검사 장치의 패드를 서로 전기적으로 접속시키는 컨택터를 제조하는 방법에 있어서, 수용부를 구비하는 몰드를 준비하는 단계; 상기 수용부에 전도부를 삽입하는 단계; 상기 전도부가 삽입되어 있는 수용부에 전도성 입자가 함유된 액상의 완충부를 채우는 단계; 상기 수용부에 대응하는 위치에 자성체 패드가 형성된 자력 집중 부재를 상기 몰드에 정렬시키는 단계; 기설정된 압력 및 온도 조건에서 상기 완충부를 경화시키는 단계; 및 상기 몰드로부터 상기 전도부 및 상기 완충부가 일체로 형성된 컨택터를 분리하는 단계를 포함하는, 컨택터를 제조하는 방법을 제공 할 수 있다.As a means for achieving the above-described technical problem, an embodiment of the present invention is a method of manufacturing a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other, preparing a mold having a receiving part to do; inserting a conductive part into the receiving part; filling a liquid buffer containing conductive particles into the receiving part into which the conductive part is inserted; aligning a magnetic force concentrating member having a magnetic pad formed thereon at a position corresponding to the receiving portion to the mold; curing the buffer unit under preset pressure and temperature conditions; and separating the contactor in which the conductive part and the buffer part are integrally formed from the mold.
본 발명의 다른 실시예는, 피검사체의 패드와 검사 장치의 패드를 서로 전기적으로 접속시키는 컨택터에 있어서, 삽입 부분을 구비하는 전도부; 및 전도성 입자를 함유하고, 상기 삽입 부분을 수용하도록 형성되는 완충부를 포함하며, 상기 완충부는 상 변화에 의하여 상기 삽입 부분을 수용하는 형상으로 경화되어 상기 전도부와 일체로 결합되는 것을 특징으로 하는, 컨택터를 제공할 수 있다.Another embodiment of the present invention provides a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other, the contactor comprising: a conductive part having an insertion part; and a buffer portion containing conductive particles and formed to receive the insertion portion, wherein the buffer portion is cured to a shape accommodating the insertion portion by a phase change and is integrally coupled with the conductive portion. ter can be provided.
상술한 과제 해결 수단은 단지 예시적인 것으로서, 본 발명을 제한하려는 의도로 해석되지 않아야 한다. 상술한 예시적인 실시예 외에도, 도면 및 발명의 상세한 설명에 기재된 추가적인 실시예가 존재할 수 있다.The above-described problem solving means are merely exemplary, and should not be construed as limiting the present invention. In addition to the exemplary embodiments described above, there may be additional embodiments described in the drawings and detailed description.
전술한 본 발명의 과제 해결 수단 중 어느 하나에 의하면, 종래 포고 핀 구성에 비하여 구조가 간단하고 제조가 용이한 컨택터를 제공할 수 있다. 또한, 본 발명에 따른 컨택터는 일체형으로 구성되어 가공 및 조립 공차에 의한 불량을 개선할 수 있고, 사용 시 구성요소 간의 끼임 또는 손상에 의하여 접촉 저항이 증가되는 것이 방지될 수 있다.According to any one of the means for solving the problems of the present invention described above, it is possible to provide a contactor that has a simple structure and is easy to manufacture compared to a conventional pogo pin configuration. In addition, since the contactor according to the present invention is integrally configured, defects due to processing and assembly tolerances can be improved, and contact resistance can be prevented from being increased due to pinching or damage between components during use.
또한, 본 발명에 따른 컨택터는 연질의 접촉 구성을 포함하여 피검사체에 가해지는 손상이 최소화될 수 있으며, 소형화가 유리하고 고속 측정에 대응할 수 있다. In addition, since the contactor according to the present invention includes a soft contact configuration, damage applied to an object to be inspected can be minimized, and it is advantageous in miniaturization and high-speed measurement.
본 발명에 따른 컨택터 제조 방법에 의하면, 전기 접속 및 강성을 제공하는 전도부와 탄성을 제공하는 완충부가 일체로 견고하게 결합될 수 있다. 구체적으로, 전도성 입자를 정렬시키면서 완충부를 상 변화시켜 전도부와 완전히 일체를 이루도록 제조할 수 있어, 조립에 의하는 경우 공정이 복잡한 단점과 사용 중 파손 또는 분리될 수 있는 위험이 해소될 수 있다. 뿐만 아니라, 전도부의 적어도 일부를 완충부가 감싸 수용하는 형상으로 상호 결합됨으로써, 접합 면적이 확대되어 견고한 결합이 이루어질 수 있다.According to the method for manufacturing a contactor according to the present invention, the conductive part providing electrical connection and rigidity and the buffer part providing elasticity can be firmly coupled integrally. Specifically, the phase change of the buffer part while aligning the conductive particles can be manufactured to be completely integrated with the conductive part, so that the disadvantage of complicated processes and the risk of breakage or separation during use can be eliminated in the case of assembling. In addition, since at least a portion of the conductive part is coupled to each other in a shape that the buffer part wraps and accommodates, the bonding area is enlarged and a strong coupling can be made.
나아가, 본 발명에 따른 컨택터 제조 방법에 의하면, 복수의 플레이트 각각에 완충부를 채워 넣고 적층함으로써 컨택터의 길이를 늘려 나갈 수 있다. 따라서, 단면적은 미세하게 유지하면서 길이가 긴 형상의 컨택터를 효과적으로 제조할 수 있다.Furthermore, according to the method for manufacturing a contactor according to the present invention, the length of the contactor can be increased by filling and stacking buffer portions in each of the plurality of plates. Accordingly, it is possible to effectively manufacture a contactor having a long shape while maintaining a minute cross-sectional area.
도 1 및 도 2는 본 발명에 따른 컨택터의 실시예들을 도시한 도면이다. 1 and 2 are views showing embodiments of a contactor according to the present invention.
도 3은 본 발명에 따른 컨택터 제조 방법을 도시한 도면이다. 3 is a view showing a method of manufacturing a contactor according to the present invention.
도 4 내지 도 10은 도 3에 도시한 컨택터 제조 방법의 각 단계를 도시한 도면이다. 4 to 10 are views illustrating each step of the method for manufacturing the contactor shown in FIG. 3 .
도 11은 본 발명에 따른 컨택터의 다른 실시예들을 도시한 단면도이다.11 is a cross-sectional view illustrating another embodiment of a contactor according to the present invention.
아래에서는 첨부한 도면을 참조하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예를 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. However, the present invention may be embodied in several different forms and is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 소자를 사이에 두고 "전기적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미하며, 하나 또는 그 이상의 다른 특징이나 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Throughout the specification, when a part is "connected" with another part, this includes not only the case of being "directly connected" but also the case of being "electrically connected" with another element interposed therebetween. . Also, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated, and one or more other features However, it is to be understood that the existence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded in advance.
이하 첨부된 도면을 참고하여 본 발명의 일 실시예를 상세히 설명하기로 한다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 1 및 도 2는 본 발명에 따른 컨택터의 실시예들을 도시한 도면이다. 본 발명에 따른 컨택터는 검사 장치의 패드와 피검사체의 패드를 서로 전기적으로 접속시키는 구조체이며, 프로브 핀을 포함할 수 있다.1 and 2 are views showing embodiments of a contactor according to the present invention. The contactor according to the present invention is a structure for electrically connecting a pad of an inspection apparatus and a pad of an object to be inspected to each other, and may include a probe pin.
도 1 및 도 2를 참조하면, 컨택터(100)는 전도부(110) 및 완충부(120)를 포함할 수 있다. 본 발명에 따른 컨택터(100)는 종래 포고 핀 구성에 비하여 구조가 간단하고 조립이 용이하다. 컨택터(100)는 일체형으로 구성된다는 점에서 가공 및 조립 공차에 의한 불량을 개선할 수 있고, 사용 시 구성요소 간의 끼임 또는 손상에 의하여 접촉 저항이 증가되는 것이 방지될 수 있다. 1 and 2 , the contactor 100 may include a conductive part 110 and a buffer part 120 . The contactor 100 according to the present invention has a simple structure and easy assembly compared to the conventional pogo pin configuration. Since the contactor 100 is integrally formed, defects due to processing and assembly tolerances may be improved, and contact resistance may be prevented from increasing due to pinching or damage between components during use.
또한, 본 발명에 따른 컨택터(100)는 연질의 접촉 구성을 포함하여 검사 중에 피검사체에 가해지는 손상이 최소화될 수 있다. 컨택터(100)는 종래 포고 핀보다 소형화에 유리하고 고속 측정에 대응할 수 있는 이점이 있다.In addition, since the contactor 100 according to the present invention includes a soft contact configuration, damage applied to an object to be inspected during inspection can be minimized. The contactor 100 has the advantage of being more compact than the conventional pogo pin and capable of responding to high-speed measurement.
도 3은 본 발명에 따른 컨택터 제조 방법을 도시한 도면이고, 도 4 내지 도 10은 도 3에 도시한 컨택터 제조 방법의 각 단계를 도시한 도면이다. 도 3 및 도 4를 참조하면, 컨택터를 제조하는 방법(S100)은 단계 S110에서 수용부(211)를 구비하는 몰드(210)를 준비할 수 있다. 본 발명에 따른 컨택터(100)는 조립 과정을 거치지 않고 몰드(210)를 이용하여 전도부(110)에 연결되는 완충부(120)를 제조함으로써, 소형화 추세에 대응할 수 있다. 3 is a view showing a method for manufacturing a contactor according to the present invention, and FIGS. 4 to 10 are views showing each step of the method for manufacturing a contactor shown in FIG. 3 . 3 and 4 , in the method of manufacturing the contactor ( S100 ), the mold 210 including the receiving part 211 may be prepared in step S110 . The contactor 100 according to the present invention can respond to the miniaturization trend by manufacturing the buffer part 120 connected to the conductive part 110 using the mold 210 without going through an assembly process.
몰드(210)를 준비하는 단계(S110)에서는 복수의 플레이트(212)가 적층되어 수용부(211)가 형성될 수 있다. 몰드(210)는 컨택터(100)를 제조하기 위한 금속 또는 수지 재질의 제조 틀이다. 예를 들어, 몰드(210)는 자성이 없는 금속이나 수지로 이루어질 수 있다. 일 예로, 알루미늄(Al) 및 토론(Torlon) 등을 포함할 수 있다.In the step of preparing the mold 210 ( S110 ), a plurality of plates 212 may be stacked to form the receiving part 211 . The mold 210 is a manufacturing frame made of a metal or resin material for manufacturing the contactor 100 . For example, the mold 210 may be made of a non-magnetic metal or resin. As an example, it may include aluminum (Al) and Torlon.
몰드(210)는, 도 4에 도시된 바와 같이, 복수의 수용부(211)를 포함할 수 있다. 예를 들어, 몰드(210)는 일정 간격을 기준으로 복수의 수용부(211)를 형성할 수 있다. 수용부(211)는 컨택터(100)를 제조하기 위한 하나의 금형 틀로 복수의 플레이트(212)를 적층시키면서 형성할 수 있다. 이후, 컨택터(100)의 제조가 완료되어 몰드(210)로부터 컨택터(100)를 분리하는 경우, 적층된 복수의 플레이트(212)를 한층씩 제거할 수 있어, 몰드(210)와 컨택터(100)를 보다 쉽게 분리할 수 있고, 성형된 컨택터(100)에 손상이 가지 않게 분리할 수 있다.The mold 210 may include a plurality of accommodating parts 211 as shown in FIG. 4 . For example, the mold 210 may form a plurality of accommodating parts 211 based on a predetermined interval. The accommodating part 211 may be formed by laminating a plurality of plates 212 as one mold for manufacturing the contactor 100 . Thereafter, when the contactor 100 is manufactured and the contactor 100 is separated from the mold 210 , the plurality of stacked plates 212 can be removed one by one, so that the mold 210 and the contactor 100 are removed. (100) can be separated more easily, and can be separated without damage to the molded contactor (100).
도 4를 참조하면, 수용부(211)는 제1 관통홀(211a) 및 제2 관통홀(211b)을 구비할 수 있다. 제2 관통홀(211b)은 제1 관통홀(211a)보다 작은 직경을 가질 수 있다. 예를 들어, 몰드(210)의 일 측면에 형성된 수용부(211)는 제1 관통홀(211a)을 구비할 수 있고, 몰드(210)의 타 측면에 형성된 수용부(211)는 제2 관통홀(211b)을 구비할 수 있다. 제1 관통홀(211a)은 후술하는 컨택터(100)의 전도부(110)를 수용할 수 있고, 제2 관통홀(211b)은 후술하는 컨택터(100)의 완충부(120)를 형성시킬 수 있다.Referring to FIG. 4 , the accommodating part 211 may include a first through-hole 211a and a second through-hole 211b. The second through-hole 211b may have a smaller diameter than the first through-hole 211a. For example, the receiving portion 211 formed on one side of the mold 210 may have a first through hole 211a, and the receiving portion 211 formed on the other side of the mold 210 may have a second through hole. A hole 211b may be provided. The first through-hole 211a may accommodate the conductive part 110 of the contactor 100 to be described later, and the second through-hole 211b is used to form a buffer part 120 of the contactor 100 to be described later. can
본 발명에 따른 컨택터를 제조하는 방법(S100)은 단계 S120에서 수용부(211)에 전도부(110)를 삽입할 수 있다. 도 5를 참조하면, 수용부(211)에 전도부(110)를 삽입하는 단계(S120)에서는 전도부(110)가 일 방향으로 삽입될 수 있다.In the method ( S100 ) of manufacturing a contactor according to the present invention, the conductive part 110 may be inserted into the receiving part 211 in step S120 . Referring to FIG. 5 , in the step of inserting the conductive part 110 into the receiving part 211 ( S120 ), the conductive part 110 may be inserted in one direction.
본 발명에 따른 전도부(110)는 금속 재질로 형성할 수 있고 삽입 부분(111)을 구비할 수 있다. 전도부(110)는 삽입 부분(111)과 연결되고 삽입 부분(111) 및 완충부(120)보다 직경이 크게 형성되는 헤드 부분(112)을 더 구비할 수 있다. 예를 들어, 전도부(110)는 완충부(120)에 수용되는 삽입 부분(111)과, 삽입 부분(111)과 구분되는 헤드 부분(112)으로 이루어질 수 있다. 전도부(110)는 강자성체 금속, 예를 들면, 철, 니켈, 및/또는 코발트 등을 포함하는 재질로 형성될 수 있다.The conductive part 110 according to the present invention may be formed of a metal material and may include an insertion part 111 . The conductive part 110 may further include a head part 112 connected to the insertion part 111 and having a diameter larger than that of the insertion part 111 and the buffer part 120 . For example, the conductive part 110 may include an insertion part 111 accommodated in the buffer part 120 , and a head part 112 separated from the insertion part 111 . The conductive part 110 may be formed of a material including a ferromagnetic metal, for example, iron, nickel, and/or cobalt.
전도부(110)의 삽입 부분(111) 및 완충부(120)는 동심의 원통 형상을 갖고, 삽입 부분(111)의 직경은 완충부(120)의 직경보다 작은 것을 특징으로 한다. 전도부(110)와 완충부(120)는 삽입 부분(111)을 통해 일체로 결합 형성될 수 있다.The insertion part 111 and the buffer part 120 of the conductive part 110 have a concentric cylindrical shape, and the diameter of the insertion part 111 is smaller than the diameter of the buffer part 120 . The conductive part 110 and the buffer part 120 may be integrally coupled and formed through the insertion part 111 .
전도부(110)를 삽입하는 단계(S120)에서는 전도부(110)의 헤드 부분(112)이 노출되도록 수용부(211)에 전도부(110)가 삽입될 수 있다. 즉, 전도부(110)의 삽입 부분(111)을 수용부(211)에 삽입시킬 수 있다.In the step of inserting the conductive part 110 ( S120 ), the conductive part 110 may be inserted into the receiving part 211 so that the head portion 112 of the conductive part 110 is exposed. That is, the insertion part 111 of the conductive part 110 may be inserted into the receiving part 211 .
본 발명에 따라 전도부(110)의 일부분은 제1 관통홀(211a)의 내면에 지지되도록 배치되고, 전도부(110)의 다른 일부분은 제2 관통홀(211b)의 내면에서 이격된 중심 부분에 배치될 수 있다. 예를 들어, 전도부(110)의 헤드 부분(112)이 제1 관통홀(211a)의 내면에 지지되도록 배치되고, 전도부(110)의 삽입 부분(111)이 제2 관통홀(211b)의 내면에서 이격된 중심 부분에 배치될 수 있다.According to the present invention, a part of the conductive part 110 is disposed to be supported on the inner surface of the first through hole 211a, and the other part of the conductive part 110 is disposed at a central portion spaced apart from the inner surface of the second through hole 211b. can be For example, the head portion 112 of the conductive part 110 is disposed to be supported on the inner surface of the first through hole 211a, and the insertion part 111 of the conductive part 110 is disposed on the inner surface of the second through hole 211b. It may be disposed in a central portion spaced apart from the.
단계 S130에서 전도부(110)가 삽입되어 있는 수용부(211)에 전도성 입자가 함유된 액상의 완충부(120)를 채울 수 있다. 도 6을 참조하면, 완충부(120)를 채우는 단계(S130)에서는 액상의 완충부(120)가 타 방향으로 채워질 수 있다. 예를 들어, 일 방향으로 전도부(110)가 삽입된 몰드(210)를 반대로 뒤집어 타 방향으로 수용부(211)에 액상의 완충부(120)를 채울 수 있다. 구체적으로, 제1 관통홀(211a)에 전도부(110)의 헤드 부분(112)이 삽입된 몰드(210)를 반대로 뒤집어 제2 관통홀(211b)을 통해 액상의 완충부(120)를 채워 넣을 수 있다.In step S130 , the liquid buffer 120 containing conductive particles may be filled in the receiving part 211 in which the conductive part 110 is inserted. Referring to FIG. 6 , in the step ( S130 ) of filling the buffer part 120 , the liquid buffer part 120 may be filled in another direction. For example, the liquid buffer unit 120 may be filled in the receiving unit 211 in the other direction by inverting the mold 210 into which the conductive unit 110 is inserted in one direction. Specifically, the mold 210 in which the head part 112 of the conductive part 110 is inserted into the first through hole 211a is reversely turned over to fill the liquid buffer 120 through the second through hole 211b. can
본 발명에 따른 완충부(120)는 전도성 입자(121)를 함유하고 전도부(110)의 적어도 일부분을 수용하는 형상을 가질 수 있다. 완충부(120)는 삽입 부분(111)을 수용하도록 형성될 수 있다. 완충부(120)는 전도부(110)의 삽입 부분(111)의 외주면을 감싸도록 수용하고 전도부(110)의 헤드 부분(112)의 일면에 결합될 수 있다.The buffer unit 120 according to the present invention may have a shape that contains the conductive particles 121 and accommodates at least a portion of the conductive unit 110 . The buffer part 120 may be formed to accommodate the insertion part 111 . The buffer unit 120 may be accommodated to surround the outer circumferential surface of the insertion portion 111 of the conducting unit 110 and coupled to one surface of the head portion 112 of the conducting unit 110 .
완충부(120)에 함유되어 있는 전도성 입자(121)들은 완충부(120)의 길이 방향으로 배열될 수 있다. 전도성 입자(121)들은 서로 접촉하여 완충부(120)에 길이 방향으로 전도성을 부여한다. 전기 소자인 피검사체의 검사를 위해 완충부(120)가 길이 방향으로 압력이 가해져 압축되면, 전도성 입자(121)들이 서로 더욱 가까워지면서 완충부(120)의 길이 방향 전기 전도도가 더 높아질 수 있다.The conductive particles 121 contained in the buffer part 120 may be arranged in the longitudinal direction of the buffer part 120 . The conductive particles 121 are in contact with each other to impart conductivity to the buffer unit 120 in the longitudinal direction. When the buffer unit 120 is compressed by applying pressure in the longitudinal direction for the inspection of the object, which is an electrical element, the conductive particles 121 become closer to each other and the longitudinal electrical conductivity of the buffer unit 120 may be higher.
예를 들어, 전도성 입자(121)들은 강자성체인 철, 구리, 아연, 크롬, 니켈, 은, 코발트, 알루미늄 등과 같은 단일 도전성 금속재 또는 이들 금속재료 둘 이상의 합금재로 이루어질 수 있다. 또한, 전도성 입자(121)들은 코어 금속의 표면을 전도성이 뛰어난 금, 은, 로듐, 파라듐, 백금 또는 은과 금, 음과 로듐, 은과 파라듐 등과 같은 금속으로 코팅하는 방법으로 제조될 수도 있다. 나아가, 전도성 입자(121)는, 전도성 향상을 위하여, MEMS 팁(tip). 플레이크(flake), 선재, 탄소나노튜브(CNT, carbon nanotube), 그래핀(graphene) 등을 더 포함할 수 있다.For example, the conductive particles 121 may be made of a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, etc. or an alloy material of two or more of these metal materials, which are ferromagnetic. In addition, the conductive particles 121 may be manufactured by coating the surface of the core metal with a metal having excellent conductivity, such as gold, silver, rhodium, palladium, platinum, or silver and gold, yin and rhodium, silver and palladium. have. Furthermore, the conductive particles 121 are, in order to improve conductivity, a MEMS tip (tip). It may further include flakes, wire rods, carbon nanotubes (CNTs), graphene (graphene), and the like.
완충부(120)를 채우는 단계(S130)는 복수의 플레이트(212)를 순차적으로 적층하는 것과 번갈아가며 수행될 수 있다. 예를 들어, 제1 플레이트(212)에 전도부(110)의 헤드 부분(112)을 삽입할 수 있고, 전도부(110)를 수용한 제1 플레이트(212)에 제2 플레이트(212)를 적층하고, 적층된 제2 플레이트(212)의 수용부(211)에 액상의 완충부(120)를 채워 넣을 수 있다. 이 후, 제3 플레이트(212)를 적층하고, 적층된 제3 플레이트(212)의 수용부(211)에 액상의 완충부(120)를 채워 넣어 완충부(120)를 형성할 수 있다. 또는, 완충부(120)를 채운 플레이트들(제2 플레이트 및 제3 플레이트)을 전도부(110)가 삽입된 플레이트(제1 플레이트) 상에 순차적으로 적층할 수 있다.The step of filling the buffer unit 120 ( S130 ) may be alternately performed with sequentially stacking a plurality of plates 212 . For example, the head portion 112 of the conductive unit 110 may be inserted into the first plate 212 , and the second plate 212 may be stacked on the first plate 212 accommodating the conductive unit 110 , , the liquid buffer unit 120 may be filled in the receiving unit 211 of the stacked second plate 212 . Thereafter, the third plate 212 may be stacked, and the buffer part 120 may be formed by filling the buffer part 120 in liquid into the receiving part 211 of the stacked third plate 212 . Alternatively, the plates (the second plate and the third plate) filled with the buffer unit 120 may be sequentially stacked on the plate (the first plate) into which the conductive unit 110 is inserted.
단계 S140에서 수용부(211)에 대응하는 위치에 강자성체 재질의 자성체 패드(221)가 형성된 자력 집중 부재(220)를 몰드(210)에 정렬시킬 수 있다. 도 7을 참조하면, 자력 집중 부재(220)는 일정 간격을 두고 복수의 자성체 패드(221)를 포함할 수 있다. 여기서, 자성체 패드(221)는, 일 예로, 니켈(Ni), 니켈-코발트 합금(NiCo) 및 철(Fe) 등과 같은 자성체 금속으로 이루어질 수 있다. 이때, 자력 집중 부재(220)는 약자성체 재질로 형성함으로써, 자성체 패드(221)에 자력이 집중되도록 유도할 수 있다.In step S140 , the magnetic force concentrating member 220 in which the magnetic pad 221 made of a ferromagnetic material is formed at a position corresponding to the receiving part 211 may be aligned with the mold 210 . Referring to FIG. 7 , the magnetic force concentrating member 220 may include a plurality of magnetic pads 221 spaced apart from each other. Here, the magnetic pad 221 may be made of, for example, a magnetic metal such as nickel (Ni), a nickel-cobalt alloy (NiCo), and iron (Fe). In this case, the magnetic force concentrating member 220 may be formed of a weak magnetic material to induce the magnetic force to be concentrated on the magnetic pad 221 .
도 7을 참조하면, 자력 집중 부재(220)를 몰드(210)에 정렬시키는 단계(S140)에서는 자성체 패드(221)에 의하여 수용부(211)가 폐쇄되도록 자력 집중 부재(220)가 몰드(210)에 밀착될 수 있다. 예를 들어, 수용부(211)에 액상의 완충부(120)가 채워진 몰드(210)의 상단과 하단에 자력 집중 부재(220)를 밀착시킬 수 있다. 구체적으로, 제1 자력 집중 부재(220)의 자성체 패드(221)는 몰드(210)의 제1 관통홀(211a)에 밀착될 수 있고, 제2 자력 집중 부재(220)의 자성체 패드(221)는 몰드(210)의 제2 관통홀(211b)에 밀착될 수 있다. 자성체 패드(221)는 컨택터(100)의 자력을 집중시키기 위함이다.Referring to FIG. 7 , in the step of aligning the magnetic force concentrating member 220 with the mold 210 ( S140 ), the magnetic force concentrating member 220 is installed in the mold 210 so that the receiving portion 211 is closed by the magnetic pad 221 . ) can be adhered to. For example, the magnetic force concentrating member 220 may be in close contact with the upper end and lower end of the mold 210 in which the liquid buffer unit 120 is filled in the receiving unit 211 . Specifically, the magnetic pad 221 of the first magnetic force concentrating member 220 may be in close contact with the first through-hole 211a of the mold 210 , and the magnetic pad 221 of the second magnetic force concentrating member 220 . may be in close contact with the second through hole 211b of the mold 210 . The magnetic pad 221 is for concentrating the magnetic force of the contactor 100 .
단계 S150에서 기설정된 압력 및 온도 조건에서 완충부(120)를 경화시킬 수 있다. 도 8을 참조하면, 완충부(120)를 경화시키는 단계(S150)에서는 자력 집중 부재(220)에 의하여 열 및 압력 중 적어도 하나가 전도부(110) 및 완충부(120)에 가해질 수 있다. In step S150, the buffer unit 120 may be cured under preset pressure and temperature conditions. Referring to FIG. 8 , in step S150 of curing the buffer unit 120 , at least one of heat and pressure may be applied to the conductive unit 110 and the buffer unit 120 by the magnetic force concentrating member 220 .
본 발명에서, 완충부(120)는 액체 상으로부터 고체 상으로의 상 변화에 의하여 삽입 부분(111)을 수용하는 형상으로 경화되어 전도부(110)와 일체로 결합될 수 있다. 완충부(120)는 수용부(211)에 채워질 때 적어도 일부분이 액체 상일 수 있고, 수용부(211) 내에서 수용부(211) 및 전도부(110)와 접촉되면서 그 형태가 고정될 수 있다. 이후, 완충부(120)는 고체 상으로 상 변화가 일어날 수 있고, 점성(viscosity)이 증가되고 경화될 수 있다. 완충부(120)는 전도부(110)와 일체로 직접 접합된 구조체를 형성할 수 있다. 즉, 본 발명에 따른 컨택터(100)는 완충부(120)와 전도부(110)가 서로 접합면을 형성하여 일체로 이루어질 수 있고, 접착 물질 또는 체결 부품 등을 포함하는 결합을 위한 매개물 없이 일체로 형성될 수 있다.In the present invention, the buffer unit 120 may be cured to a shape accommodating the insertion portion 111 by a phase change from a liquid phase to a solid phase, and may be integrally coupled with the conductive unit 110 . When the buffer part 120 is filled in the accommodating part 211, at least a portion may be in a liquid phase, and the shape may be fixed while being in contact with the accommodating part 211 and the conductive part 110 in the accommodating part 211 . Thereafter, the buffer unit 120 may undergo a phase change to a solid phase, increase in viscosity, and may be cured. The buffer unit 120 may form a structure directly bonded to the conductive unit 110 integrally. That is, in the contactor 100 according to the present invention, the buffer part 120 and the conductive part 110 may be integrally formed by forming a bonding surface with each other, and the contactor 100 may be integrally formed without a bonding medium including an adhesive material or a fastening part. can be formed with
실시예에 따라, 완충부(120)는 외부의 압력에 의해 전도부(110)의 삽입 부분(111)을 수용하는 형상으로 경화될 수 있고, 완충부(120)는 외부에서 가해지는 열에 의해 전도부(110)의 삽입 부분(111)을 수용하는 형상으로 경화되어 전도부(110)와 일체로 결합될 수 있다. 다만, 추가로 열이나 압력을 가하지 않더라도, 기설정된 온도 및 압력 범위에서 완충부(120)를 형상 및 접촉 상태을 유지하면서 경화되도록 할 수 있다.According to the embodiment, the buffer unit 120 may be cured to a shape that accommodates the insertion portion 111 of the conductive unit 110 by external pressure, and the buffer unit 120 is a conductive unit ( It may be cured into a shape to accommodate the insertion portion 111 of the 110 , and may be integrally coupled with the conductive unit 110 . However, even if no additional heat or pressure is applied, the buffer unit 120 may be cured while maintaining the shape and contact state within a preset temperature and pressure range.
완충부(120)를 경화시키는 단계(S150)에서는 몰드(210)에 밀착된 자력 집중 부재(220)에 압력을 가하면서 열을 가하여 액상의 완충부(120)를 경화시킬 수 있다. 예를 들어, 완충부(120)는 다양한 종류의 고분자 물질로 형성될 수 있다. 완충부(120)는 실리콘, 폴리부타디엔, 폴리이소프렌, SBR, NBR 등 및 그들의 수소화합물과 같은 디엔형 고무로 구현될 수 있다. 또한, 완충부(120)는 스티렌부타디엔 블럭코폴리머, 스티렌이소프렌 블럭코폴리머 등 및 그들의 수소 화합물과 같은 블럭코폴리머로 구현될 수도 있다. 또한, 완충부(120)는 클로로프렌, 우레탄 고무, 폴리에틸렌형 고무, 에피클로로히드린 고무, 에틸렌-프로필렌 코폴리머, 에틸렌프로필렌디엔 코폴리머 등으로 구현될 수도 있다. 완충부(120)는 액상 수지를 경화하여 얻을 수 있다.In the step of curing the buffer unit 120 ( S150 ), the liquid buffer unit 120 may be cured by applying heat while applying pressure to the magnetic force concentrating member 220 in close contact with the mold 210 . For example, the buffer unit 120 may be formed of various types of polymer materials. The buffer unit 120 may be implemented with a diene rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and the like and their hydrogen compounds. In addition, the buffer unit 120 may be implemented as a block copolymer such as a styrene butadiene block copolymer, a styrene isoprene block copolymer, and their hydrogen compounds. In addition, the buffer unit 120 may be implemented with chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylenepropylenediene copolymer, and the like. The buffer unit 120 may be obtained by curing a liquid resin.
단계 S160에서 몰드(210)로부터 전도부(110) 및 완충부(120)가 일체로 형성된 컨택터(100)를 분리할 수 있다. 먼저, 도 9를 참조하면, 몰드(210)에 밀착된 자력 집중 부재(220)를 몰드(210)로부터 분리할 수 있다. 이후, 도 10을 참조하면, 몰드(210)로부터 컨택터(100)를 분리하는 단계(S160)에서는 완충부(120)를 수용한 플레이트(212)를 분리한 후 전도부(110)를 수용한 플레이트(212)를 분리할 수 있다. 예를 들어, 완충부(120)를 수용한 제2 및 제3 플레이트(212)를 컨택터(100)로부터 분리하고, 전도부(110)를 수용한 제1 플레이트(212)를 컨택터(100)로부터 분리할 수 있다.In step S160 , the contactor 100 in which the conductive part 110 and the buffer part 120 are integrally formed may be separated from the mold 210 . First, referring to FIG. 9 , the magnetic force concentrating member 220 in close contact with the mold 210 may be separated from the mold 210 . Thereafter, referring to FIG. 10 , in the step of separating the contactor 100 from the mold 210 ( S160 ), the plate 212 accommodating the buffer unit 120 is separated, and then the plate accommodating the conductive unit 110 . (212) can be separated. For example, the second and third plates 212 containing the buffer unit 120 are separated from the contactor 100 , and the first plate 212 containing the conductive unit 110 is separated from the contactor 100 . can be separated from
적층된 복수의 플레이트(212)를 한 층씩 제거함으로써 제조가 완료된 컨택터(100)에 손상이 가지 않게 몰드(210)로부터 분리시킴과 동시에 보다 쉽게 컨택터(100)를 몰드(210)로부터 분리시킬 수 있다.By removing the stacked plurality of plates 212 one by one, it is possible to separate the contactor 100 from the mold 210 without damaging the manufactured contactor 100 and to separate the contactor 100 from the mold 210 more easily. can
도 11은 본 발명에 따른 컨택터의 다른 실시예들을 도시한 단면도이다. 도 11의 (a) 내지 (d)를 참조하면, 본 발명에 따른 완충부(120)는 원통 형상을 갖고, 전도성 입자(121)는 완충부(120)에서 기설정된 반경 이하의 영역에만 분포될 수 있다. 또한, 원통 형상이 아닌 다른 예를 들어, 완충부(120)는 일 방향으로 연장되는 막대 형상을 갖고, 전도성 입자(121)는 일 방향에 수직한 임의의 도형 형상의 단면에서 중심부 영역에만 분포될 수 있다. 11 is a cross-sectional view illustrating another embodiment of a contactor according to the present invention. 11 (a) to (d), the buffer unit 120 according to the present invention has a cylindrical shape, and the conductive particles 121 are distributed only in the area less than a predetermined radius in the buffer unit 120. can In addition, for example other than the cylindrical shape, the buffer unit 120 has a rod shape extending in one direction, and the conductive particles 121 are distributed only in the central region in the cross section of any figure shape perpendicular to the one direction. can
도 11의 (a)를 참조하면, 완충부(120)는 일측에 전도부(110)를 삽입할 수 있고, 타측에 돌출면을 포함할 수 있다. 전도성 입자(121)는 전도부(110)와 연장되도록 완충부(120)의 중심부 영역에 길이 방향으로 분포될 수 있다. 도 11의 (b)를 참조하면, 완충부(120)는 일측에 전도부(110)를 삽입할 수 있고, 전도성 입자(121)는 전도부(110)와 연장되도록 완충부(120)의 중심부 영역에 길이 방향으로 분포될 수 있다.Referring to (a) of FIG. 11 , the buffer unit 120 may insert the conductive unit 110 on one side, and may include a protruding surface on the other side. The conductive particles 121 may be distributed in the longitudinal direction in the central region of the buffer unit 120 so as to extend from the conductive unit 110 . Referring to (b) of FIG. 11 , the buffer part 120 may insert the conductive part 110 on one side, and the conductive particles 121 are located in the central region of the buffer part 120 so as to extend with the conductive part 110 . It can be distributed in the longitudinal direction.
도 11의 (c)를 참조하면, 완충부(120)는 양측에 전도부(110)를 삽입할 수 있고, 전도성 입자(121)는 양측에 삽입된 전도부(110)와 연장되도록 완충부(120)의 중심부 영역에 길이 방향으로 분포될 수 있다. 도 11의 (d)를 참조하면, 완충부(120)는 양측에 돌출면을 포함할 수 있고, 중심부 영역에 전도부(110)를 포함할 수 있다. 전도성 입자(121)는 전도부(110)와 연장되도록 완충부(120)의 양측에 길이 방향으로 분포될 수 있다.Referring to (c) of FIG. 11 , the buffer part 120 may insert the conductive parts 110 on both sides, and the conductive particles 121 extend with the conductive parts 110 inserted on both sides. may be distributed in the longitudinal direction in the central region of Referring to (d) of FIG. 11 , the buffer part 120 may include protruding surfaces on both sides, and may include the conductive part 110 in the central region. The conductive particles 121 may be distributed in the longitudinal direction on both sides of the buffer part 120 so as to extend from the conductive part 110 .
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The foregoing description of the present invention is for illustration, and those of ordinary skill in the art to which the present invention pertains can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and likewise components described as distributed may also be implemented in a combined form.
본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. do.
Claims (14)
- 피검사체의 패드와 검사 장치의 패드를 서로 전기적으로 접속시키는 컨택터를 제조하는 방법에 있어서,A method of manufacturing a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection device to each other, the method comprising:수용부를 구비하는 몰드를 준비하는 단계;preparing a mold having a receiving portion;상기 수용부에 전도부를 삽입하는 단계;inserting a conductive part into the receiving part;상기 전도부가 삽입되어 있는 수용부에 전도성 입자가 함유된 액상의 완충부를 채우는 단계;filling a liquid buffer containing conductive particles into the receiving part into which the conductive part is inserted;상기 수용부에 대응하는 위치에 자성체 패드가 형성된 자력 집중 부재를 상기 몰드에 정렬시키는 단계;aligning a magnetic force concentrating member having a magnetic pad formed thereon at a position corresponding to the receiving portion to the mold;기설정된 압력 및 온도 조건에서 상기 완충부를 경화시키는 단계; 및curing the buffer unit under preset pressure and temperature conditions; and상기 몰드로부터 상기 전도부 및 상기 완충부가 일체로 형성된 컨택터를 분리하는 단계를 포함하는, 컨택터를 제조하는 방법.and separating a contactor in which the conductive part and the buffer part are integrally formed from the mold.
- 제 1 항에 있어서,The method of claim 1,상기 몰드를 준비하는 단계에서는, 복수의 플레이트가 적층되어 상기 수용부가 형성되는 것을 특징으로 하는, 컨택터를 제조하는 방법.In the step of preparing the mold, a plurality of plates are stacked to form the receiving portion, the method of manufacturing a contactor.
- 제 2 항에 있어서,3. The method of claim 2,상기 완충부를 채우는 단계는, 상기 복수의 플레이트를 순차적으로 적층하는 것과 번갈아가며 수행되는 것을 특징으로 하는, 컨택터를 제조하는 방법.The step of filling the buffer portion, characterized in that the sequential stacking of the plurality of plates is performed alternately, the method of manufacturing a contactor.
- 제 1 항에 있어서,The method of claim 1,상기 자력 집중 부재를 상기 몰드에 정렬시키는 단계에서는, 상기 자성체 패드에 의하여 상기 수용부가 폐쇄되도록 상기 자력 집중 부재가 상기 몰드에 밀착되는 것을 특징으로 하는, 컨택터를 제조하는 방법.In the step of aligning the magnetic force concentrating member with the mold, the magnetic force concentrating member is in close contact with the mold so that the receiving portion is closed by the magnetic pad.
- 제 1 항에 있어서,The method of claim 1,상기 완충부를 경화시키는 단계에서는, 상기 자력 집중 부재에 의하여 열 및 압력 중 적어도 하나가 상기 전도부 및 상기 완충부에 가해지는 것을 특징으로 하는, 컨택터를 제조하는 방법.In the step of curing the buffer, at least one of heat and pressure is applied to the conductive part and the buffer by the magnetic force concentrating member.
- 제 1 항에 있어서,The method of claim 1,상기 완충부는 상기 전도부의 적어도 일부분을 수용하는 형상을 갖는 것을 특징으로 하는, 컨택터를 제조하는 방법.The method for manufacturing a contactor, characterized in that the buffer portion has a shape to receive at least a portion of the conductive portion.
- 제 1 항에 있어서,The method of claim 1,상기 수용부에 전도부를 삽입하는 단계에서는 상기 전도부가 일 방향으로 삽입되고,In the step of inserting the conductive part into the receiving part, the conductive part is inserted in one direction,상기 완충부를 채우는 단계에서는, 상기 액상의 완충부가 타 방향으로 채워지는 것을 특징으로 하는, 컨택터를 제조하는 방법.In the step of filling the buffer part, the liquid buffer part is filled in another direction, a method of manufacturing a contactor.
- 제 1 항에 있어서,The method of claim 1,상기 수용부는,The receiving unit,제1 관통홀; 및a first through hole; and상기 제1 관통홀보다 작은 직경을 갖는 제2 관통홀을 구비하고,and a second through-hole having a smaller diameter than the first through-hole,상기 수용부에 전도부를 삽입하는 단계에서,In the step of inserting the conductive part into the receiving part,상기 전도부의 일부분은 상기 제1 관통홀의 내면에 지지되도록 배치되고,A portion of the conductive part is disposed to be supported on the inner surface of the first through hole,상기 전도부의 다른 일부분은 상기 제2 관통홀의 내면에서 이격된 중심 부분에 배치되는 것을 특징으로 하는, 컨택터를 제조하는 방법.Another portion of the conductive part is disposed in a central portion spaced apart from the inner surface of the second through hole, the method of manufacturing a contactor.
- 제 2 항에 있어서,3. The method of claim 2,상기 몰드로부터 상기 컨택터를 분리하는 단계에서는, 상기 완충부를 수용한 플레이트를 분리한 후 상기 전도부를 수용한 플레이트를 분리하는 것을 특징으로 하는, 컨택터를 제조하는 방법.In the step of separating the contactor from the mold, after separating the plate accommodating the buffer part, the plate accommodating the conductive part is separated.
- 피검사체의 패드와 검사 장치의 패드를 서로 전기적으로 접속시키는 컨택터에 있어서,A contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection device to each other, the contactor comprising:삽입 부분을 구비하는 전도부; 및a conductive portion having an insertion portion; and전도성 입자를 함유하고, 상기 삽입 부분을 수용하도록 형성되는 완충부를 포함하며,Containing conductive particles and comprising a buffer formed to receive the insert portion,상기 완충부는 상 변화에 의하여 상기 삽입 부분을 수용하는 형상으로 경화되어 상기 전도부와 일체로 결합되는 것을 특징으로 하는, 컨택터.The buffer part is hardened to a shape accommodating the insertion part by a phase change and is integrally coupled to the conductive part, the contactor.
- 제 10 항에 있어서,11. The method of claim 10,상기 삽입 부분 및 상기 완충부는 동심의 원통 형상을 갖고,The insertion portion and the buffer portion have a concentric cylindrical shape,상기 삽입 부분의 직경은 상기 완충부의 직경보다 작은 것을 특징으로 하는, 컨택터.A contactor, characterized in that the diameter of the insertion portion is smaller than the diameter of the buffer portion.
- 제 11 항에 있어서,12. The method of claim 11,상기 전도부는, 상기 삽입 부분과 연결되고 상기 삽입 부분 및 상기 완충부보다 직경이 크게 형성되는 헤드 부분을 더 구비하는, 컨택터.The conductive part further includes a head part connected to the insertion part and having a diameter larger than that of the insertion part and the buffer part.
- 제 12 항에 있어서,13. The method of claim 12,상기 완충부는 상기 삽입 부분의 외주면을 감싸도록 수용하고 상기 헤드부분의 일면에 결합되는 것을 특징으로 하는, 컨택터.The buffer portion is accommodated so as to surround the outer peripheral surface of the insertion portion, characterized in that coupled to one surface of the head portion, the contactor.
- 제 10 항에 있어서,11. The method of claim 10,상기 완충부는 원통 형상을 갖고,The buffer has a cylindrical shape,상기 전도성 입자는 상기 완충부에서 기설정된 반경 이하의 영역에만 분포되는 것을 특징으로 하는, 컨택터.The contactor, characterized in that the conductive particles are distributed only in a region less than a predetermined radius in the buffer part.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000322938A (en) * | 1999-05-13 | 2000-11-24 | Jsr Corp | Anisotropic conductive sheet, its manufacture, and electrical test device and electrical test method for circuit device |
KR20130094100A (en) * | 2012-02-15 | 2013-08-23 | 리노공업주식회사 | A probe for testing semiconductor device and test socket using the same |
KR20140143516A (en) * | 2013-06-07 | 2014-12-17 | 주식회사 에이엠에스티 | Method for making of probe and one body type probe |
KR20200024462A (en) * | 2018-08-28 | 2020-03-09 | 주식회사 이노글로벌 | By-directional electrically conductive module and manufacturing method thereof |
KR102153221B1 (en) * | 2019-05-21 | 2020-09-07 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
KR102301835B1 (en) * | 2021-03-05 | 2021-09-14 | (주)위드멤스 | Contactor and manufacturing method thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000322938A (en) * | 1999-05-13 | 2000-11-24 | Jsr Corp | Anisotropic conductive sheet, its manufacture, and electrical test device and electrical test method for circuit device |
KR20130094100A (en) * | 2012-02-15 | 2013-08-23 | 리노공업주식회사 | A probe for testing semiconductor device and test socket using the same |
KR20140143516A (en) * | 2013-06-07 | 2014-12-17 | 주식회사 에이엠에스티 | Method for making of probe and one body type probe |
KR20200024462A (en) * | 2018-08-28 | 2020-03-09 | 주식회사 이노글로벌 | By-directional electrically conductive module and manufacturing method thereof |
KR102153221B1 (en) * | 2019-05-21 | 2020-09-07 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
KR102301835B1 (en) * | 2021-03-05 | 2021-09-14 | (주)위드멤스 | Contactor and manufacturing method thereof |
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