WO2022173120A1 - Appareil d'inspection doté d'une unité de dépression - Google Patents

Appareil d'inspection doté d'une unité de dépression Download PDF

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Publication number
WO2022173120A1
WO2022173120A1 PCT/KR2021/019973 KR2021019973W WO2022173120A1 WO 2022173120 A1 WO2022173120 A1 WO 2022173120A1 KR 2021019973 W KR2021019973 W KR 2021019973W WO 2022173120 A1 WO2022173120 A1 WO 2022173120A1
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WIPO (PCT)
Prior art keywords
unit
substrate
inspection
path
probe
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PCT/KR2021/019973
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English (en)
Korean (ko)
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정상헌
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바이옵트로 주식회사
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Publication of WO2022173120A1 publication Critical patent/WO2022173120A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145—Indicating the presence of current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to an inspection apparatus for inspecting possible dents after energization inspection.
  • PCB Printed Circuit Board
  • Printed Circuit Board is one of the basic essential parts in almost all equipment such as household appliances such as washing machines and televisions, household goods including mobile phones, automobiles, satellites, and the like.
  • the present invention is an apparatus for inspecting a dent on a substrate, and since dents that may occur due to the inspection itself such as an energization inspection can also be an important factor in causing a defect in the substrate, by performing engraving inspection after energization inspection, better quality It is to provide an inspection apparatus for producing the substrate.
  • the present invention is an inspection device in which the inspection process is performed in the order of an alignment unit, a probe unit, and an engraving unit. It may include an engraving unit.
  • a second position at which the substrate waits before moving to the alignment unit is set, and a shuttle unit for transferring the substrate along an imaginary straight line connecting the second position, the alignment unit, and the probe unit may be provided to optimize the inspection process can do.
  • the alignment unit and the stamping unit are positioned at a third position, which is a position for the inspection step between the second position and the probe unit, so that the two-shuttle inspection can be optimized.
  • a fifth position waiting after completion of the inspection of the substrate is set, and the path from the second position through the alignment unit to the probe unit is a first path, and from the probe unit to the probe unit.
  • the first path and the second path may be in the forward and reverse directions of an imaginary straight line.
  • the first path may be shorter than the second path.
  • the alignment unit and the stamping unit are located in the same inspection area, when the shuttle unit moves the first path or the 1-1 and 1-2 paths, only movement in the first direction is allowed, and the position of the alignment unit is corrected. If the 3rd position and the position of the imprinting unit is the 4-2 position, the 3rd position and the 4-2 position are the same, and if the direction from the imprinting unit to the probe unit is the 1st direction, alignment
  • the unit and the imprinting unit may be provided at positions spaced apart from each other in the first direction.
  • the alignment unit and the imprinting unit may be provided adjacent to each other, and the process progress direction from the alignment unit to the probe unit and the process progress direction from the imprint unit to the next step may be opposite to each other.
  • a process progress direction from the alignment unit to the probe unit and a process progress direction from the stamp unit to the next step may be perpendicular to each other.
  • a plurality of shuttle units for moving the substrate through the first path and the second path are provided, wherein the respective second and fifth positions of each shuttle unit coincide with each other, and the second position and the fifth position are can match each other.
  • a 1-1 path is from the second position to the alignment unit, a 1-2 path is from the alignment unit to the probe unit, a 2-1 path is from the probe unit to the imprinting unit, and the imprinting unit to the imprinting unit is a 2-1 path.
  • the path to the fifth position is the 2-2 path
  • the 1-2 path may be shorter than the 2-1 path, and the 1-1 path and the 2-2 path may coincide with each other.
  • the 1-2 th path may be shorter than the 2-1 path, and the 1-1 path may be shorter than the 2-2 path.
  • the second shuttle unit for moving the second substrate may be located on the 1-2 path or the 2-1 path.
  • the second position, the alignment unit, the probe unit, the imprinting unit, and the fifth position are provided with an index unit occupying each step of the inspection process, and the inspection of the substrate is performed in order by the rotation of the index unit, the second position,
  • the alignment unit, the probe unit, the imprinting unit, and the fifth position do not overlap each other on the index unit, and the rotation angle during one step of the index unit may be determined according to the number of initially set steps of the index unit.
  • a plurality of shuttle units for moving the substrate in the order of the alignment unit, the probe unit, and the imprinting unit are provided, wherein the shuttle unit moves from the alignment unit to the probe unit and the inspection direction is a first direction, from the probe unit to the If the direction to be inspected while moving to the imprinting unit is referred to as a second direction, the plurality of shuttle units have degrees of freedom only in the first and second directions, and movement in the first and second directions may be restricted. have.
  • Fig. 2 (a) is an explanatory diagram illustrating the dent
  • Fig. 2 (b) is an explanatory diagram showing the occurrence of defects due to the dent.
  • Figure 3 shows the substrate before the dent occurs
  • (b) and (c) of Figure 3 (b) and (c) show the state in which the dent occurs
  • (b) is a reference value for judging whether there is a defect
  • (c) shows the occurrence of a defect that exceeds the reference value of (b).
  • FIG. 4 is an explanatory view showing a two-shuttle method of the inspection apparatus of the present invention.
  • FIG. 5 is an explanatory view showing the two shuttle units of FIG. 4 before merging the two shuttle units.
  • FIG. 6 is an explanatory view showing a place where the imprinting unit of the inspection device of the present invention can be located.
  • Figure 7 is an explanatory view showing that the second path is corrected by providing the stamping unit of the present invention.
  • FIG. 8 is a diagram illustrating an index unit according to the present invention, and is an explanatory diagram illustrating a case in which the index unit consists of five steps.
  • FIG. 9 is a diagram illustrating an index unit according to the present invention, and is an explanatory diagram illustrating a case in which the index unit consists of four steps.
  • FIG. 10 is a schematic view showing a loading unit and a loading unit constituting the inspection apparatus of the present invention.
  • FIG. 11 is a schematic view showing an alignment unit included in the loading unit constituting the inspection apparatus of the present invention.
  • FIG. 12 is a schematic diagram showing a substrate 200 to be inspected by the inspection apparatus of the present invention.
  • FIG. 13 is a schematic diagram showing an inspection unit 190 constituting the inspection apparatus of the present invention.
  • the board 200 (Bare Board) before the circuit is printed needs to complete the energization test after the manufacturing process is completed, and shipment may be possible only when all electrical signals through this are not abnormal. It may be important to determine normal, short, or open having a specific resistance of the substrate 200 through the energization test, and to classify the normal substrate 200 and the erroneous substrate 200 through this. .
  • the inspection is performed with a probe having a pointed tip through a probe, etc. can
  • a probe is mounted on a robot arm, etc. to contact the substrate 200 and conduct a energization test, and it moves to another inspection position by moving on the xy plane consisting of the x-axis (first direction) and y-axis (second direction).
  • the target inspection position descends for inspection in the -z-axis (reverse direction of the third direction), and after inspection, it rises to the +z-axis (the third direction) and moves the xy plane again to another inspection position. Moving can be performed repeatedly.
  • the same substrate 200 is repeatedly arranged on one plate or frame in a grid format in an appropriate number for the equipment rather than one substrate 200, and during inspection, a plurality of substrates 200 ) may be conducted for the entire plate or frame on which the energization test or the dent (D) test is carried out. Accordingly, in order to hold a node for a plurality of circuits and perform an inspection even during a single inspection, the probe must be able to move rapidly in the first direction, the second direction, or the third direction.
  • the third direction movement of the probe slows the speed when the probe approaches the substrate 200 so that it is in close contact with the substrate 200, but the height of the substrate 200 is different, and the distance and probe Since the thickness of the probe is on the order of several microns, it is easy to cause a defect error even if it is precisely controlled.
  • the dent (D) is generated by the energization test
  • the circuit printed circuit board 200 may undergo various processes depending on the purpose, and heating or cooling may be repeated in this process. Accordingly, due to the empty space, an error in which the circuit itself is turned off or inflated may occur as air in the empty space contracts or expands. That is, dents may occur due to the energization test itself after the energization test.
  • the probe of the probe unit can be raised and lowered to contact the target point. When the probe and the substrate are in contact, the impact of the substrate can be alleviated by slowly adjusting the elevating speed of the probe only in the vicinity of the probe.
  • the circuit is mounted on the substrate 200 by leaving the dent (D) and operating the equipment for several hours or several days, the user may have a problem of discarding the circuit itself, which is several times more expensive than the substrate 200. It may be necessary to periodically and frequently manage the stamping (D) in units of one hour.
  • the controller may calculate a substrate position error of the alignment unit 170 through a camera located in the alignment unit 170 .
  • the substrate position error stored in the controller may be corrected by moving or rotating the table on which the substrate is seated in the probe unit 190 in the opposite direction.
  • the controller may move the substrate to a position and angle that corrects the substrate position error calculated by the alignment unit 170 , and then control the substrate seating table of the probe unit so that the probe can contact the accurate measurement point of the substrate.
  • control unit compares the imprint of the substrate by the probe with a reference value, and when the imprint (D) of the image photographed by the camera is equal to or greater than the reference value, it may be determined as a bad imprint.
  • the amount of imprinting of the substrate by the probe provided in the probe unit may be captured by the camera of the imprinting unit.
  • the control unit may compare the amount of imprinting of the substrate with a reference value from the image obtained from the camera of the imprinting unit.
  • the controller may determine at least one of abrasion of the probe, bending of the probe, and foreign matter caught in the probe from the comparison result.
  • the defect rate may rather occur in the substrate 200 , so it is also necessary to consider it as one of the defect rates and classify it through inspection. That is, during a series of processes in which the substrate 200 is loaded, inspected and unloaded again, the probe unit 190 for inspecting the energization of the substrate 200 is engraved (D) for inspecting engraving (D) due to energization It may be a previous stage of the unit 300 .
  • Imprint (D) inspection may be to confirm the dent (D) by the energized inspection. Since it takes too long to check all the circuit connections during the energization test, the user sets the position of the board 200 that is more dense and complicated depending on the pattern according to the specific board 200 and is prone to defects. can be identified and selective testing can be performed. In this case, by dividing sections by time and setting different positions for each section, data indicating which section has a high defect rate can be collected and used for analysis. Therefore, since only the sampling position set in each section by the user can perform the energization inspection, the engraving (D) unit 300 refers to the location data of the energization inspection rather than inspecting the entire circuit for the engraving (D) inspection. can be done quickly.
  • the inspection process of the inspection apparatus can be divided into a shuttle method and an index method.
  • the shuttle method includes a one-shuttle method using one shuttle and two There may be a two-shuttle method using a dog shuttle.
  • the substrate 200 may be moved by the shuttle unit 150 on a virtual straight line from the standby position to the inspection position during the inspection process, and the index method is the index unit 400 .
  • each unit or each part of the inspection apparatus may be moved one step at a time to proceed with the process.
  • the inspection apparatus by the shuttle system is demonstrated first.
  • the inspection device of the present invention includes a first loading unit 110, loading units 130, 140, a shuttle unit 150, an alignment unit 170, a probe unit 190, a second loading unit 120, a stamp ( D) may include a unit 300 .
  • Substantial inspection of the inspection apparatus may be performed on a straight inspection path of the alignment unit 170 , the probe unit 190 , and the engraving (D) unit 300 by the shuttle unit 150 .
  • the inspection means at least any one of an alignment inspection by the alignment unit 170 , an energization inspection by the probe unit 190 , and an engraving (D) inspection by the dent (D) unit 300, unless it is precisely referred to herein. can do.
  • the inspection order of the inspection apparatus is based on the energization inspection of the substrate 200, the alignment unit 170 may be made before the energization inspection, and the dent (D) inspection may be performed after the energization inspection.
  • a position at which the substrate 200 is loaded before the inspection may be referred to as a first position P1 , which may be a position of the first loading unit 110 .
  • a position at which the substrate 200 is loaded by the shuttle unit 150 before starting the operation by the shuttle unit 150 may be referred to as a second position P2 .
  • the second position P2 may be referred to as an initial position i.
  • the substrate 200 may be moved from the first position P1 to the second position P2 by the first loading unit 130 .
  • the initial position i may be the second position P2 or the fifth position P5 in the case of two shuttles. That is, the initial position i may be a place where the first loading unit 130 waits before moving the substrate 200 before the energization inspection or the dent (D) inspection to the shuttle unit 150 for inspection, and the shuttle unit ( 150), it is possible to increase the inspection efficiency of the entire inspection apparatus by minimizing the movement direction.
  • a direction in which the substrate 200 is directed from the initial positions (i, P2, P5) toward the alignment units 170 and 170 and the probe units 190 and 190 is the first direction, and the first direction is It may be in the x-axis direction of FIG. 1 .
  • a direction perpendicular to the first direction and in which the shuttle unit 150 moves the substrate 200 after inspection along a second path may be referred to as a second direction, and the second direction may be the y-axis direction of FIG. 1 .
  • a direction perpendicular to the first direction and the second direction and opposite to the inspection direction of the probe units 190 and 190 may be referred to as a third direction, and the third direction may be the z-axis direction of FIG. 1 .
  • the alignment unit 170 may check the alignment state of the substrate 200 using a camera or the like, and this position may be referred to as a third position P3, and the substrate 200 is moved to the second position ( It may be moved from P2) to the third position P3.
  • the position at which the probe unit 190 conducts the energization test may be referred to as a fourth position P4, and for the efficiency of the inspection operation, the second position P2, the third position P3, and the fourth position P4 are It may be arranged on a straight line (a).
  • a position at which the substrate 200, which has completed the energization test, completes movement by the shuttle unit 150 may be referred to as a fifth position P5, and the substrate 200 is moved to the fifth position by the second loading unit 140 It may be moved from (P5) to a sixth position (P6).
  • the sixth position P6 may be a position of the second loading unit 120 . Since the second loading unit 120 can separate the normal substrate 200 and the defective substrate 200 after inspection, a plurality of second loading units may be provided. The defective substrate 200 may be provided in plurality again for classification according to the cause of the defective substrate 200 by inspection. Among the plurality of second loading units 120 , in FIG. 1 , the position of the second loading unit 120 on which the top substrate 200 is placed may be illustrated as the sixth position P6 .
  • a path from the initial position i to the probe unit 190 may be referred to as a first path, and a path from the initial position i to the fifth position P5 after the energization test may be referred to as a second path. That is, the first path may be a path from the second position P2 to the fourth position P4 , and the second path may be a path from the fourth position P4 to the fifth position P5 .
  • the first path and the second path may be the same.
  • the first route and the second route may be set differently, and the shuttle unit moves
  • the first path may be shorter than the second path because the inspection by the inspection device requires more time than time. Accordingly, the first path is arranged in a straight line that can quickly pass through the second position P2 to the fourth position P4, and the second path can bypass the first path by adding movement in the second direction. .
  • the dent (D) unit 300 may be located between the fourth position (P4) and the fifth position (P5). Accordingly, the fourth position (P4) can be divided into a 4-1 position (P4-1) for conducting an energization inspection, and a 4-2 position (P4-2) for performing a dent (D) inspection.
  • stamping (D) unit 300 may be located at any point on the second path, the 4-1 position (P4-1), the third position (P3), the fifth position (P5), or the 4-1th position It may be located in any one of the position P4-1 and the fifth position P5.
  • the first shuttle unit 150a and Two stamping (D) units 300 by the second shuttle unit 150b may be required. This is because, in addition to the double the equipment value of the dent (D) unit 300, the energized substrate 200 is divided into two units and inspected, so that when the cause of the defective substrate 200 is found, the dent (D) unit 300 ) may double the risk of defective factors.
  • 1 to 6 may indicate the entire process in which the substrate 200 is inspected by the inspection device in order.
  • 1 indicates moving from the first loading unit 110 to the second position P2 serving as a stop by the first transfer unit, and 2 is aligned for alignment check at the second position P2.
  • 3 indicates that the substrate 200 that has completed the alignment inspection moves to the 4-1 position (P4-1) and moves to the probe unit 190 for energization inspection
  • 4 indicates that the substrate 200, which has completed the energization test, moves to the dent (D) unit 300 at the 4-2 position (P4-2) for engraving (D) inspection
  • 5 indicates dent (D) inspection indicates that the board 200, which has completed It may indicate movement from the fifth position P5 (the second position P2 ) to the sixth position P6 of the second loading unit 120 .
  • the energization test and the dent (D) inspection may be performed at the same position.
  • the energization test during the test operation of the present invention may take longer than the time spent in other locations. Therefore, in the case of the two-shuttle system, interference between the shuttle units is likely to occur, and the time of the inspection process may be delayed.
  • the imprinting (D) unit 300 may be provided at the fifth position P5 , and the fifth position P5 may be the same as the initial position of the second position P2 .
  • Each shuttle unit may be provided separately at the fifth position P5, but in this case, a plurality of second loading units 120 for loading the normal substrate 200 may be provided, and again loaded on the plurality of loading units. A facility for assembling the substrate 200 may be required. This complicates the process, delays time, and may cause other defects. Accordingly, the second position P2 and the fifth position P5 serving as a stop between the shuttle unit and the loading unit may be the same.
  • the fifth position P5 serves as a stop between the shuttle unit and the loading unit, in addition to the interference between the first shuttle unit 150a and the second shuttle unit 150b, the first transfer unit and the second transfer unit Interference may also be considered. That is, since the four facilities move sequentially in the automation process, the inspection design may be too complicated to perform the dent (D) inspection at the fifth position (P5).
  • the engraving (D) unit 300 may be provided at the third position (P3). That is, the third position P3 may be the same as the 4-2 position, and the alignment inspection and the stamping (D) inspection may be performed.
  • the alignment unit 170 can check the alignment state of the substrate 200 by the first camera, and the stamping (D) unit 300 can check the stamping (D) of the substrate 200 using the second camera.
  • the second camera may have a narrower field of view (FOV) than the first camera. This may be because the dent (D) may be confirmed by a microscopic level of resolution since it is generated by a energization test.
  • the alignment unit 170 and the stamping (D) unit 300 may be vertically divided based on the first path or the center of each unit may pass through the first path.
  • the shuttle unit in order to align the center in the second direction for the alignment inspection and the dent (D) inspection, which may cause a defect according to the position adjustment.
  • two units may be arranged at the third position P3 (the 4-2 position P4-2) so that each unit passes through the center on the first path.
  • each shuttle unit may be located at the third position P3 at the same time.
  • the alignment unit 170 may be located downstream on the second path than the stamp (D) unit 300, and the alignment unit ( The shuttle unit entering 170 can avoid interference with each other by entering the third position P3 before the shuttle unit entering the stamping (D) unit 300 .
  • the upstream and downstream may be the same as the line and the back according to the time series of the inspection process in the first path or the second path, and the shuttle unit may have a limited degree of freedom in moving in the third direction (z direction). .
  • the shuttle unit moves from the 4-2 position (P4-2) to the fifth position When moving to (P5), it must move from the third position (P3) to the second position (P2).
  • the shuttle unit may pass a path that overlaps the first path in the reverse direction or a path that bypasses the first path. have.
  • the first path moves from the second position P2 to the third position P3, the 1-1 path R1-1, and the third position P3 to the 4-1 position
  • a path moving to (P4-1) may be included as a 1-2 path
  • the second path is a 2-1 path (R2) from a 4-1 position (P4-1) to a 4-2 position.
  • a 2-2 path R2-2 path may be included from the 4-2 position P4-2 to the fifth position P5. That is, in the drawing, 5 may indicate the second-second path (R2-2) path.
  • the speed of the inspection process is shortened compared to the detour path, but there is a possibility that an interference problem between each shuttle unit may occur. may be increased, and this may be referred to as the first method.
  • the 2-2 path (R2-2) path is a bypass path other than the 1-1 path (R1-1)
  • the time of the inspection process is relatively longer, but the problem of interference between each shuttle unit can be avoided. and this may be referred to as the second method.
  • the second shuttle unit 150b may be in the second path, and vice versa, and the first shuttle unit 150b may be in the first path.
  • the paths may be the same.
  • the first shuttle unit 150a moves from the 4-2 position (P4-2) to the fifth position and the second for alignment inspection.
  • the second shuttle units 150b moving from the position P2 to the third position P3 may interfere with each other. Accordingly, when the first shuttle unit 150a is on the path 2-2 path R2-2, the second shuttle unit 150b moves on the path 1-2 path R1-2 and 2-1 Interference between each shuttle unit can be avoided by being located in any one of the paths R2-1.
  • the second shuttle unit 150b performs the steps 1-2 Interference between each shuttle unit can be avoided by being located in either the path R1-2 or the 2-1 path R2-1.
  • the interference problem between the shuttle units may be a case in which the movement of the shuttle unit is restricted in the x-y plane while being fixed for a specific z value. If there is no restriction on the movement of each shuttle unit in the third direction, the interference problem can be avoided even when each shuttle unit is on the same path.
  • first shuttle unit 150a and the second shuttle unit 150b simultaneously perform the alignment inspection and the dent (D) inspection at the third position P3 (position 4-2), or 1
  • the shuttle unit 150a is stamped (D)
  • the inspection is completed, the substrate 200 through the 2-2 path (R2-2) path through the path from the third position (P3) to the fifth position (P5) and
  • the vertical positions of each shuttle unit are mutually Interference can be prevented by adjusting.
  • the distance from each inspection device is different for each shuttle unit during alignment inspection, energization inspection, or dent (D) inspection, so the position must be set individually.
  • the focal length may vary due to a difference in vertical distance, so it may be complicated to provide a plurality of cameras or to inspect different focal lengths for each shuttle unit.
  • an additional movement or addition of a process may advance the time of the accumulated defect rate.
  • the configuration of a simple inspection process in the shortest time can not only reduce the cost due to an increase in yield, but also reduce the cumulative defect rate of the repeated process.
  • the inspection apparatus using the index method may be to bend a straight path between the alignment unit 170 and the probe unit 190 in a one-shuttle method in a round circle method.
  • the index method may be a method in which steps of each inspection process are performed one by one by rotation on a turntable in order, not by a linear path by a shuttle unit.
  • the index unit 400 corresponding to the shuttle unit may be provided, similarly to the process in which the shuttle unit and the loading unit are separated and the loading unit is separated, and in the index method, the index unit 400 and the loading unit are separated
  • the process can proceed. That is, by the loading units 130 and 140, the substrate 200 is transferred from or to the loading unit at the second position P2 and the fifth position P5 corresponding to the position before and after the inspection process.
  • Each process position of the index unit 400 may be a second position (P2) to a fifth position (P5), and the inspection is performed while the one-step turntable rotates in a time series sequence with the substrate 200 positioned at each position.
  • a role in the inspection process at the first position P1 to the sixth position may be the same as that of the shuttle method.
  • Each position of the index unit 400 may have various polygonal shapes according to process settings. Unlike the shuttle method, each step of the inspection process may occupy one vertex of the turntable polygon, and it may be difficult to provide two or more processes at one vertex.
  • the angle of table rotation may be determined according to the number of processes provided in each index unit 400 , and in the case of n steps, the rotation angle per one rotation of each process may be 360/n.
  • the rotation angle per one rotation of each process may be 360/n.
  • the one rotation angle of the turntable may be 72° (360/5).
  • the second position P2 and the fifth position P5 are the same position, they may have a rectangular shape, and a rotation angle of the turntable may be 90° (360/4).
  • the loading units 130 and 140 may move the substrate 200 loaded on the first loading unit 110 to the initial position i.
  • the cleaning unit 180 may remove foreign substances from the inspection surface of the substrate 200 on which the energization inspection is performed by the inspection unit 190 .
  • a third loading unit for moving the substrate 200 loaded on the loading unit upstream of the cleaning unit 180 may be provided.
  • the shuttle unit 150 may transfer the substrate 200 at the initial position i along the transfer path of the substrate 200 .
  • the substrate 200 moved to the initial position i by the first loading unit 110 may move together with the shuttle unit 150 while being placed on the shuttle unit 150 .
  • the cradle is transported by the shuttle unit 150 so that the substrate 200 placed on the cradle may also be transported together.
  • an example in which the substrate 200 is placed on the shuttle unit 150 is disclosed.
  • the alignment unit 170 is located on the transfer path of the substrate 200 and may check the alignment state of the substrate 200 using a camera or the like.
  • the alignment state of the substrate 200 whose alignment has been confirmed may be corrected by the alignment unit 170 or the alignment state may be corrected by the shuttle unit 150 .
  • the alignment state of the substrate 200 may be relatively corrected by correcting the position of the inspection unit 190 , which has acquired the alignment state information from the alignment unit 170 .
  • the inspection unit 190 is located downstream of the alignment unit 170 on the transfer path of the substrate 200 , and may inspect the energization state of the substrate 200 using the probe 193 .
  • the alignment unit 170 is an element that enables reliable inspection in the inspection unit 190 by checking the alignment state of the substrate 200 .
  • the inspection unit 190 is preferably located downstream of the alignment unit 170 .
  • the downstream of the alignment unit 170 represents a position where the distance from the initial position i is greater than the distance from the initial position i to the alignment unit 170 . Since the substrate 200 moves in the positive direction of the x-axis from the initial position i in the inspection process, a position having an x-coordinate value greater than the x-coordinate value of the alignment unit 170 becomes a downstream position.
  • the substrate 200 tested in the tested unit may be loaded.
  • the second loading unit 120 may be configured in plurality.
  • the inspection apparatus of the present invention includes a first loading unit 110 , loading units 130 , 140 , a shuttle unit 150 , an alignment unit 170 , an inspection unit 190 , and a second loading unit 120 .
  • the energization test of the substrate 200 may be automatically performed.
  • the substrate 200 before the inspection and the substrate 200 after the inspection are separated and loaded in the first loading unit 110 and the second loading unit 120, so that the substrate 200 before the inspection and the substrate 200 after the inspection ) to prevent mixing.
  • the shuttle unit 150 may transfer the substrate 200 inspected by the inspection unit 190 to an initial position.
  • the loading unit may load the substrate 200 inspected by the inspection unit 190 and transferred to the initial position by the shuttle unit 150 on the second loading unit 120 .
  • the substrate 200 before the inspection and the substrate 200 after the inspection may be stacked near each other.
  • the first loading unit 110 and the second loading unit 120 may be arranged on a virtual vertical line c with respect to the transfer path a of the substrate 200 from the initial position to the inspection unit 190 . According to this configuration, since the first loading unit 110 and the second loading unit 120 that can be transported by the user can be arranged almost nearby, work convenience can be increased.
  • each loading unit is arranged only on one side of the x-axis, there is an advantage of high space utilization compared to the case where each loading unit is arranged on both sides with the inspection unit 190 in the center on the x-axis. In addition, it is possible to minimize the movement path of the loading unit by moving the substrate 200 of the first loading unit 110 to the initial position and moving the substrate 200 in the initial position to the second loading unit 120 . In addition, when there are a plurality of loading units, each loading unit can also be arranged adjacent to each other since each loading unit is gathered nearby. Therefore, there is an advantage of high space utilization compared to the case in which the loading units are scattered in distant places.
  • the inspection apparatus of the present invention inspects the energization state of the substrate 200 transferred in the x-axis direction from the (x 1 , y 1 ) coordinate in the xy plane, and (x 1 , y a ) the inspected substrate 200 It may be to load the coordinates (here, a is a natural number not 1).
  • the loading unit 111 may lower the substrate 200 of the second height to the first height without directly raising the substrate 200 to the first height, and then lower it to the third height.
  • the first height may be d
  • the second height may be e
  • the third height may be f.
  • each height may have a relationship of d > e > f. According to this configuration, the loading unit is driven in the order of the left figure, the middle figure, and the right figure in FIG. 2 .
  • the first loading unit 130 moves the substrate 200 to an initial position before the inspection.
  • the loading target substrate 200 may be in a state of being loaded in a plurality of the first loading unit (110).
  • the loading unit may reciprocate up and down in a second distance section h 2 shorter than the first distance after loading the substrate 200 loaded on the loading unit by a first distance h 1 . This action is similar to the so-called action of brushing something off. Only the uppermost substrate 200 can be reliably loaded into the loading unit by the operation of the loading unit.
  • each loading unit may include an alignment unit.
  • the substrate 200 may be provided with a plurality of circuit patterns 210 and alignment marks 230 formed for each circuit pattern.
  • Each circuit pattern 210 may be a unit mounted on a product.
  • eight circuit patterns are shown, and each circuit pattern may form a substrate of a mobile communication terminal. That is, the substrate 200 may be separated into eight circuit patterns in a post process performed downstream of the inspection device and installed in each mobile communication terminal.
  • alignment marks may be formed for each circuit pattern in order to facilitate post-processing.
  • the alignment unit 170 constituting the inspection apparatus of the present invention may check the alignment state of each circuit pattern by using each alignment mark provided for each circuit pattern. That is, the alignment unit 170 of the present invention can check the alignment state of all alignment marks regardless of the inspection unit of the inspection unit 190 .
  • the inspection unit 190 is located downstream of the alignment unit 170 on the transfer path of the substrate 200 , and may inspect the energization state of each circuit pattern by using one or more circuit patterns as an inspection unit.
  • the inspection unit may be the number of circuit patterns that can be inspected during one driving of the inspection unit 190 , specifically, one z-axis reciprocating motion in the xyz space.
  • the alignment unit 170 of the present invention may check the alignment state of all circuit patterns regardless of the inspection unit of the inspection unit 190 .
  • the inspection unit of the inspection unit 190 may be set in various ways.
  • the test unit may be determined by the probe 193 of the test unit 190 , and the probe 193 is determined during initial setting. Accordingly, according to the present embodiment, the inspection unit may be changed during initial setting, and the substrate 200 may be aligned with respect to various inspection units.
  • the test unit 190 may include a plurality of probes 193 , a jig 191 supporting the probes 193 , and a base plate 195 on which the jig 191 is installed.
  • the probe 193 may be formed in the area p facing the circuit pattern to be inspected in the jig 191 .
  • One end of the probe 193 may protrude in the region p, and the other end may be connected to an electronic circuit.
  • the electronic circuit may apply a test signal to the circuit pattern, receive a response signal, and perform an energization test with the received response signal.
  • the number of setting degrees of freedom when the inspection unit 190 is initially set and the number of working degrees of freedom when the inspection unit 190 is driven may be different from each other.
  • the test unit 190 may perform a energization test on both surfaces of the substrate 200 . Due to the recent high integration of circuit patterns, a plurality of circuit patterns may be formed on both surfaces of the substrate 200 . In some cases, the circuit pattern on one surface of the substrate 200 may be connected to the circuit pattern on the other surface of the substrate 200 . Therefore, for quick and reliable energization inspection, the inspection unit 190 includes a first inspection unit 192 in contact with one surface of the substrate 200 and a second inspection unit 194 in contact with the other surface of the substrate 200 . It is possible to check the energization state of (200). In this case, the first inspection unit 192 and the second inspection unit 194 may be in contact with the substrate 200 at the same time.
  • a case in which the first inspection unit 192 is located above the substrate 200 and the second inspection unit 194 is located below the substrate 200 is disclosed.
  • the substrate 200 may be placed on the shuttle in which the through hole 153 is formed and gripped by the grip part 151 of the shuttle.
  • Two shuttle units 150 a first path, two second paths, a first loading unit 130 for moving only the substrate 200 before inspection to an initial position, a second loading unit 130 for moving only the substrate 200 after inspection from the initial position
  • the loading unit 140, the alignment unit 170, which are arranged on a straight line from the initial position, and there is no movement in the xy plane, and the inspection unit 190 can perform the energization inspection of the substrate 200 quickly and automatically without interfering with each other.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

La présente invention concerne un appareil d'inspection présentant un processus d'inspection réalisé dans l'ordre d'une unité d'alignement, d'une unité de sonde et d'une unité de dépression, l'appareil d'inspection pouvant comprendre : l'unité d'alignement qui inspecte l'état d'alignement d'un substrat ; l'unité de sonde qui inspecte l'état de conduction du substrat ; et l'unité de dépression qui inspecte l'état de dépression du substrat.
PCT/KR2021/019973 2021-02-15 2021-12-27 Appareil d'inspection doté d'une unité de dépression WO2022173120A1 (fr)

Applications Claiming Priority (2)

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KR10-2021-0019902 2021-02-15
KR1020210019902A KR102550573B1 (ko) 2021-02-15 2021-02-15 찍힘 유니트를 구비한 검사 장치

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WO2022173120A1 true WO2022173120A1 (fr) 2022-08-18

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120048130A (ko) * 2010-11-05 2012-05-15 (주)미래컴퍼니 기판 검사 장치 및 기판 검사 방법
JP2013250259A (ja) * 2012-05-30 2013-12-12 Samsung Electro-Mechanics Co Ltd 基板検査装置及びその位置補正方法
KR20140086558A (ko) * 2012-12-28 2014-07-08 바이옵트로 주식회사 검사 장치
KR101663756B1 (ko) * 2016-04-20 2016-10-10 (주)소닉스 인라인형 액정 셀 검사 장치
KR20200054726A (ko) * 2018-11-12 2020-05-20 (주)제이티 전자부품 핸들러

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120048130A (ko) * 2010-11-05 2012-05-15 (주)미래컴퍼니 기판 검사 장치 및 기판 검사 방법
JP2013250259A (ja) * 2012-05-30 2013-12-12 Samsung Electro-Mechanics Co Ltd 基板検査装置及びその位置補正方法
KR20140086558A (ko) * 2012-12-28 2014-07-08 바이옵트로 주식회사 검사 장치
KR101663756B1 (ko) * 2016-04-20 2016-10-10 (주)소닉스 인라인형 액정 셀 검사 장치
KR20200054726A (ko) * 2018-11-12 2020-05-20 (주)제이티 전자부품 핸들러

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