WO2022166244A1 - 电子元件的散热装置和电子设备 - Google Patents

电子元件的散热装置和电子设备 Download PDF

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Publication number
WO2022166244A1
WO2022166244A1 PCT/CN2021/123601 CN2021123601W WO2022166244A1 WO 2022166244 A1 WO2022166244 A1 WO 2022166244A1 CN 2021123601 W CN2021123601 W CN 2021123601W WO 2022166244 A1 WO2022166244 A1 WO 2022166244A1
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Prior art keywords
heat dissipation
liquid
electronic components
liquid outlet
dissipation device
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PCT/CN2021/123601
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English (en)
French (fr)
Inventor
王超
李霁阳
坂本仁
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华为技术有限公司
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Publication of WO2022166244A1 publication Critical patent/WO2022166244A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Definitions

  • the present application relates to the field of heat dissipation of electronic components, and more particularly to a heat dissipation device for electronic components and electronic equipment.
  • CPU and memory are the main heat sources.
  • the CPU is generally laid out on the motherboard, and its power consumption is concentrated.
  • the industry usually uses a closed liquid cooling circulation channel to dissipate heat to the CPU.
  • components such as memory, which are arranged in an array of plug-in cards on the motherboard, due to the large number of plug-in cards, scattered power consumption, and the need to support on-site plug-in maintenance, especially for example, the memory resource pool server has a large number of memory, and the memory modules are separated from each other.
  • the gap is small (for example, below 8mm), which poses a great challenge to the cooling of the memory.
  • a possible memory cooling solution is to use cooling pipes (referred to as cold rows) for liquid flow to dissipate heat.
  • the coolant pipes are arranged between adjacent in-line (also referred to as memory modules), the coolant pipes and the memory modules are clamped by clamps, and thermal pads are filled between the memory modules and the clamps to absorb tolerances and reduce contact thermal resistance.
  • the cost of the thermal pad wrapped around the memory module is relatively high.
  • this setting method limits the maintenance of the memory module. In the operation of replacing the memory module, the cold row and the thermal pad need to be removed as a whole before the memory module is replaced. After the memory module is replaced, the thermal pad needs to be re-wrapped.
  • US Patent Publication US2009/0237883A1 discloses another memory cooling solution, which uses a top-covered memory cold plate.
  • the plate-shaped liquid-cooling radiator is arranged above the memory module, and a clip and a heat-conducting pad are arranged between the memory module and the radiator.
  • the internal flow channel of the radiator in this solution is complicated, and the installation and fixing of the radiator are complicated. Since the heat sink is fixed above the memory module, the heat sink is very close to the memory module, and there are clips and thermal pads between the memory module and the heat sink. It is difficult to plug and maintain the memory modules in the form of storage modules.
  • Chinese utility model patent CN203279429U discloses another memory heat dissipation scheme, which uses a spray-type evaporative cooling circulation system.
  • a sealed box is provided in the cabinet, and the coolant is pumped and circulated in the sealed box.
  • the cooling liquid can be atomized through the nozzle and sprayed to the heating unit. After heat exchange with the heating unit, the cooling liquid in liquid form flows back to the liquid storage tank, and the evaporated cooling liquid is condensed into liquid by the condenser and flows back to the liquid storage tank. .
  • the present application proposes a heat dissipation device for electronic components and electronic equipment.
  • an embodiment of the present application provides a heat dissipation device for an electronic component, which is used for heat dissipation of a plurality of electronic components, and the plurality of electronic components are arranged side by side;
  • the heat dissipation device includes one or more guide pipes for conveying cooling liquid, and the one or more guide pipes are arranged on the side of the plurality of electronic components;
  • the wall of each of the guide pipes facing the electronic components is formed with a plurality of through-flowing liquid outlet holes, and the cooling liquid can flow out from the liquid outlet holes and be directly sprayed on the side surfaces of the plurality of electronic components.
  • the heat dissipation device according to the present implementation can effectively dissipate heat to the electronic components, the cooling liquid can be in direct contact with the electronic components, the heat dissipation pad does not need to be arranged between the heat dissipation device and the electronic components, the cost of the heat dissipation device is low, and the transportation efficiency of the cooling liquid is high , and the coolant does not need to be atomized.
  • the liquid outlet holes are arranged along a first direction, and the heat dissipation device is used to dissipate heat for a plurality of electronic components arranged in a second direction, and the second direction is perpendicular to the first direction,
  • one of the guide tubes is provided between the adjacent electronic components.
  • the guide tube is arranged between adjacent electronic components, so that the guide tube can deliver the cooling liquid to the electronic components located on both sides of the guide tube.
  • the heat dissipation device further includes a liquid separator, and the liquid separator includes a liquid inlet and A plurality of liquid outlets, each of the guide pipes is connected with one of the liquid outlets.
  • the use of the dispenser makes the device only need to have one liquid inlet, and the device has a compact structure.
  • the liquid outlet holes are arranged along a first direction, and the heat dissipation device is used for cooling a plurality of electronic components arranged in the second direction heat dissipation, the second direction is perpendicular to the first direction,
  • the guide tube is one, and forms a zigzag reciprocating structure that runs through the end and the end,
  • the series-connected guide tubes have a simple structure, and their zigzag and reciprocating structure can cover a large area so as to deliver cooling liquid to a plurality of electronic components.
  • the guide tube has flexibility.
  • the shape of the flexible guide tube can be adjusted adaptively according to the structure of the electronic component, so that the arrangement of the heat sink is convenient and the compatibility is strong.
  • the cooling liquid is used to flow from the cooling liquid at a speed greater than 0.2 m/s
  • the liquid outlet hole flows out. This ensures that the coolant can be sprayed at the target heat sink at a sufficient flow rate.
  • the diameter of the liquid outlet hole is 0.3 mm to 1 mm, and/ or
  • the distance between the adjacent liquid outlet holes is 5mm to 30mm.
  • both sides of each of the electronic components are provided with the conductive flow tube
  • the guide tubes are provided on both sides of each of the electronic components,
  • the liquid outlet hole of one of the guide pipes located on one side of the electronic component and the liquid outlet hole of the one of the guide pipe located on the other side of the electronic component are in the liquid outlet hole. staggered in the arrangement direction.
  • the staggered arrangement of the liquid outlet holes on both sides of the electronic components can reduce the number of liquid outlet holes on the liquid guide under the premise of ensuring the heat dissipation effect, so that the pumping power can be reduced, or more Small coolant flow to achieve better cooling effect.
  • an eighth possible implementation manner of the heat dissipation device for electronic components at least part of the extension line of the axis of the liquid outlet hole and all the The target heat dissipation point of the electronic component intersects.
  • the above arrangement of the liquid outlet holes enables the cooling liquid to flow to the target heat dissipation point more efficiently.
  • the electronic component includes a memory stick.
  • the heat dissipation device of the present application can be effectively arranged around the memory sticks to provide efficient heat dissipation.
  • an embodiment of the present application provides an electronic device, including a plurality of electronic components and a heat sink according to the first aspect, or any possible implementation manner of the above first aspect.
  • an embodiment of the present application provides a heat dissipation device for an electronic component, which is used for heat dissipation of a plurality of electronic components, and the plurality of electronic components are arranged side by side;
  • the heat dissipation device includes a base, a liquid conducting part and a liquid outlet,
  • the base part is at least partially disposed on the side of the electronic component, the liquid guide part is fixed on the base part so as to form a liquid guide groove between the liquid guide part and the base part,
  • the liquid guide portion forms a drop in the vertical direction while extending along the first direction, so that the cooling liquid can flow along the liquid guide portion and through the electronic components under the action of gravity,
  • the liquid outlet portion is provided at an end portion of the liquid guide portion located high in the first direction.
  • the liquid guide provided by this arrangement can be flexibly arranged according to the arrangement of the electronic components, and the liquid guide groove can utilize the gravity of the cooling liquid to transport the cooling liquid.
  • the base is sleeved on the electronic component in contact with the electronic component, and the base is in a direction perpendicular to the first direction
  • the cross section is U-shaped.
  • the base is attached to the electronic components, which facilitates the installation of the base.
  • the cooling fluid in a second possible implementation manner of the third aspect, in the vertical direction, there are multiple liquid guiding parts. This allows the cooling fluid to contact more areas of the base, or areas of the base that are closer to the target heat dissipation point of the electronic components, in a more distributed manner.
  • each of the liquid guiding portions is provided with a liquid outlet portion, or
  • the liquid outlet part is arranged at the end of the liquid guide part located at the highest position in the first direction, and a plurality of the liquid guide parts are arranged in a zigzag shape, so that the cooling liquid can be discharged at the end of the liquid guide part under the action of gravity.
  • the way of changing the flow direction in the first direction flows through the liquid guiding parts adjacent in the vertical direction in sequence.
  • the liquid outlet part can be flexibly arranged, and the number of the liquid outlet part can be reduced as much as possible, so that the device structure is more compact.
  • one or more through holes are provided on the liquid conducting portion, so that the liquid conducting portion located above is provided with one or more through holes.
  • the cooling liquid in the trough can partially flow to the liquid-conducting trough located below. In this way, a liquid outlet for supplying cooling liquid may not be specially provided for the liquid guiding groove located below.
  • the base is provided with a through hole communicating with the liquid guiding groove , the through hole is open toward the electronic component in a second direction perpendicular to the first direction, so that the cooling liquid in the liquid guiding groove can partially flow from the through hole to the base and the Gap between electronic components to directly cool the electronic components.
  • This arrangement enables the coolant to contact the electronic components with a larger contact area and a more direct contact method.
  • FIG. 1 shows a schematic diagram of a heat dissipation system of an electronic component according to an embodiment of the present application.
  • Fig. 2a shows a schematic diagram of a heat dissipation device of an electronic component according to the first embodiment of the present application.
  • Figure 2b is a partially exploded schematic view of Figure 2a.
  • Figure 3 is a schematic view of a cross section of Figure 2a perpendicular to the first direction.
  • FIG. 4 shows a schematic diagram of a cross-section of a heat sink of an electronic component according to a second embodiment of the present application.
  • FIG. 5 shows a schematic diagram of a heat dissipation device for an electronic component according to a third embodiment of the present application.
  • FIG. 6 shows a schematic diagram of a heat dissipation device for an electronic component according to a fourth embodiment of the present application.
  • FIG. 7 and 8 show schematic diagrams of cross-sections of two possible heat sinks for electronic components according to the fourth embodiment of the present application.
  • FIGS. 9 and 10 show schematic diagrams of a possible heat dissipation device for an electronic component according to the fifth embodiment of the present application.
  • FIG. 11 shows a schematic diagram of another possible heat dissipation device for electronic components according to the fifth embodiment of the present application.
  • FIG. 12 shows a schematic diagram of a heat dissipation device for an electronic component according to a sixth embodiment of the present application.
  • FIG. 13 shows a schematic diagram of a conceptual implementation of a heat sink for electronic components according to the present application.
  • orientations such as “upper” and “lower” described in the present application are based on the orientations in the drawings and are not absolute. In practical applications, the relevant orientations may be changed correspondingly with the change of the installation direction of the device.
  • FIG. 1 and FIG. 13 the basic implementation manner of the heat dissipation system of the electronic component and the heat dissipation device therein according to the present application will be introduced.
  • the cooling system has a casing S, and the casing S is, for example, a closed box provided in a server cabinet, or a closed server cabinet.
  • the closed casing S can effectively prevent the evaporation of the circulating cooling liquid inside.
  • the casing S is provided with electronic components, a heat sink A, a pump, an inner circulation channel T1, a heat exchanger H and a part of the outer circulation channel T2 (the rest of the outer circulation channel T2 extends out of the casing S).
  • the electronic components include a circuit board B, a memory module M disposed on the circuit board B, a central processing unit (ie, a CPU) U, and other electronic components E.
  • a central processing unit ie, a CPU
  • an outer circulation channel T2 that is sealed with respect to the inner cavity of the casing S is used.
  • the outer circulation channel T2 extends from the shell S to the inner cavity of the shell S.
  • the outer circulation channel T2 is connected to the cold plate L, and the cold plate L is arranged around the CPU.
  • the cooling liquid in the outer circulation channel T2 flows through the cold plate.
  • the outer circulation channel T2 also flows through the heat exchanger H to take the heat in the heat exchanger H out of the shell S.
  • the heat dissipation device A is used to dissipate heat to the memory module M and other electronic components E that need heat dissipation.
  • the radiator A is connected to the inner circulation channel T1, and pumps (the first pump P1 and the second pump P2, two pumps are used to improve reliability, one of which can be used as a backup) through the inner circulation channel T1 to deliver the coolant to the pump.
  • Heat sink A The cooling liquid flowing out of the heat sink A may flow through the memory module M and/or other electronic components E in a contact manner, or spray the memory module M and/or other electronic components E (for example, also called jet impact).
  • the basic manner in which the cooling device A delivers the cooling liquid to the electronic components refer to FIG. 13 .
  • the electronic component in the figure is a memory stick M, and the memory stick M has a plurality of memory particles M0.
  • the cooling device A delivers the cooling liquid to the surroundings of the memory particles MO, and is ejected through, for example, the liquid outlet hole 22 and sprayed to the memory particles MO.
  • the cooling liquid flowing through the electronic components will fall into the cooling liquid pool PL formed by the lower part of the inner cavity of the housing S.
  • the circuit board B is provided with openings, and the cooling liquid can flow away from the circuit board B more quickly and conveniently through the openings on the circuit board B.
  • the cooling liquid in the cooling liquid pool PL can be pumped by the first pump P1 and/or the second pump P2, and sent to the heat sink A again through the inner circulation channel T1 to form a circulation.
  • the inner circulation channel T1 flows through the heat exchanger H, so that the cooling liquid in the inner circulation channel T1 can be cooled; optionally, the heat exchanger H is arranged at the outlet of the pump.
  • the CPU may also use other cooling devices to dissipate heat.
  • the heat exchanger H and the outer circulation channel T2 may be specially provided for exchanging the heat in the inner circulation channel T1 out of the casing S.
  • the circulating power of the cooling liquid in the external circulation channel T2 comes from a cooling liquid distribution unit (ie, CDU, Coolant Distribution Unit) disposed outside the cabinet.
  • a cooling liquid distribution unit ie, CDU, Coolant Distribution Unit
  • the heat sink A includes a liquid distributor 10 and a liquid guide 20 which are connected.
  • the liquid guide 20 includes a plurality of parallel guide tubes 21 .
  • the dispenser 10 has a liquid inlet 11 and a plurality of liquid outlets.
  • the liquid inlet 11 is used for connecting with the inner circulation channel T1 (refer to FIG. 1 ) to allow the cooling liquid to flow into the liquid separator 10 .
  • Each liquid outlet is connected with a guide pipe 21 to distribute the cooling liquid to a plurality of guide pipes 21 , or in other words, a plurality of guide pipes 21 are formed in parallel by the liquid distributor 10 .
  • positioning brackets may also be arranged between the plurality of guide tubes 21 . In the first direction D1, the positioning brackets are, for example, disposed at the two ends of each guide tube 21 and the middle of the guide tube 21. On the one hand, the positioning bracket plays the role of fixing the plurality of guide tubes 21 together, On the other hand, it also functions as an intermediate connector, so that the plurality of guide tubes 21 can be fixed to the casing S, for example.
  • each memory module M has a plurality of target heat dissipation points (such as memory particles), and these target heat dissipation points are arranged at least in the first direction D1.
  • the memory banks M are arranged in a second direction D2 that is perpendicular to the first direction D1.
  • four memory banks M are arranged in parallel in the second direction D2, and 2 memory banks M are arranged in parallel in the first direction D1.
  • the present application does not treat the memory banks M in the first direction D1. Whether it is multiple is not limited.
  • the guide tube 21 is arranged on the side of the memory module M. As shown in FIG. In the second direction D2, a guide tube 21 is provided between every two adjacent memory banks M, and a guide tube 21 is also provided on the outer side of the outermost memory bank M, so that each memory bank M is provided with a guide tube 21. There is a guide tube 21 on both sides. For the four memory banks M in the second direction D2 in this embodiment, five guide tubes 21 are correspondingly provided in total.
  • the distance between two adjacent guide tubes 21 is equal to the distance between two adjacent memory banks M (based on the center line of the memory bank M).
  • the spacing for the reference for example, the spacing is 7mm to 8mm.
  • the guide tube 21 is approximately at the same height as the memory module M in the vertical direction (in particular, the vertical direction is perpendicular to both the first direction D1 and the second direction D2).
  • the size of the guide tube 21 is approximately the same as the size of the area covered by the memory particles.
  • there are upper and lower rows of memory particles on the memory module M and the total height of the two rows of memory particles is 20mm.
  • the size of the guide pipe 21 in the vertical direction is also 20 mm; of course, the size of the guide pipe 21 in the vertical direction can also be smaller than the size of the memory particles.
  • the flow guide tube 21 has, for example, a flat waist shape in the cross section perpendicular to the first direction D1. Specifically, the size of the flow guide tube 21 in the second direction D2 is smaller than that in the Dimensions in the vertical direction.
  • the guide tube 21 of this shape can be formed by, for example, flattening a standard copper round tube.
  • the present application does not limit the material for making the guide tube 21, for example, it may be metal or non-metal such as rubber or plastic.
  • the present application does not limit the thermal conductivity of the guide tube 21 .
  • the guide tube 21 extends along the first direction D1 , so that in the first direction D1 , the guide tube 21 can at least cover a plurality of memory particles on the memory module M.
  • the side wall of the guide tube 21 is formed with a plurality of penetrating liquid outlet holes 22, and the plurality of liquid outlet holes 22 are arranged in the first direction D1.
  • each memory particle corresponds to at least one liquid outlet hole 22 .
  • the number of the liquid outlet holes 22 on one side of one guide tube 21 may be less than the number of memory particles on the memory bank M opposite to it.
  • the cooling liquid in the guide tube 21 can flow out from the liquid outlet hole 22 and be sprayed to the memory particles, so as to dissipate heat to the memory module M in a contact manner.
  • the liquid outlet holes 22 are formed on the side walls of the two memory banks M facing both sides of the guide tube 21;
  • the liquid outlet holes 22 are formed on the inner side walls of the guide tubes 21 facing the inner side of the memory bank M.
  • the diameter of the liquid outlet holes 22 is 0.3 mm to 1 mm, and in the first direction D1, the distance between adjacent liquid outlet holes 22 (calculated based on the center line of the liquid outlet holes 22) is 5 mm. to 30mm.
  • the above-mentioned size setting of the liquid outlet hole 22 can ensure the flow rate of the cooling liquid, so that a better cooling effect can be achieved with a smaller pumping power, or a smaller flow rate of the cooling liquid.
  • the present application does not limit the number of the liquid outlet holes 22 and the arrangement of the liquid outlet holes 22 on the side wall of the guide tube 21 , and the liquid outlet holes 22 on each side wall can be formed in an array or staggered with each other. set up. In the vertical direction, the liquid outlet holes 22 may be arranged at the same height to form one layer, or may be arranged at different heights to form multiple layers.
  • liquid outlet holes 22 arranged on the two side walls of a guide tube 21 they may be symmetrical or staggered.
  • the liquid outlet holes 22 on the two guide tubes 21 may be staggered in the first direction D1, or spaced apart.
  • the staggered arrangement of the liquid outlet holes 22 on both sides of the electronic components can reduce the number of liquid outlet holes on the liquid guide under the premise of ensuring the heat dissipation effect, so that the pumping power can be reduced, or the Smaller coolant flow to achieve better cooling effect.
  • the structure of the guide tube 21 and the pumping speed of the cooling liquid satisfy that the speed of the cooling liquid flowing out of the liquid outlet hole 22 is greater than 0.2 m/s.
  • the cooling liquid is a non-conductive liquid with a dielectric strength greater than 40kV.
  • the cooling fluid may be mineral oil or fluorinated fluid.
  • the simulation test of the heat sink is carried out.
  • the memory module (specifically DIMM) used in the simulation has 20 memory particles on one side (40 in total on both sides), and the 20 memory particles on each side are arranged in upper and lower rows, with 10 in each row.
  • the total power of the memory stick is 20W
  • the average power of each memory chip is 0.5W.
  • liquid outlet holes 22 There are 5 liquid outlet holes 22 on one side of the guide tube 21 (a single memory bank has 10 liquid outlet holes 22 on both sides), the distance between adjacent liquid outlet holes 22 is 25mm, and the diameter of the liquid outlet holes 22 is 25 mm. is 0.35mm.
  • the simulation uses fluorinated liquid as the cooling liquid and the inlet temperature is lower than 50 °C.
  • the simulation results show that the maximum temperature of the memory particles used for heat dissipation by the heat dissipation device according to this embodiment is 90°C.
  • FIG. 4 a heat dissipation device according to a second embodiment of the present application is introduced.
  • the second embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as those of the first embodiment, and detailed descriptions of these features are omitted.
  • the improvement of this embodiment mainly lies in that a guide plate 30 is provided for the guide pipe 21 with a smaller size in the vertical direction.
  • FIG. 4 is a schematic view of the heat dissipation device viewed along the first direction D1 (refer to FIG. 2 a ).
  • the lower part of the memory module M is inserted into the circuit board (not shown in the figure), in order to guide the flow of the splashed cooling liquid, a guide plate 30 is arranged in the space between the guide tube 21 and the circuit board. Tube 21 is connected.
  • the guide plate 30 is, for example, a strip-shaped plate with a similar shape to the guide tube 21 , which is connected with the guide tube 21 to have the effect of extending the size of the guide tube 21 in the vertical direction.
  • the lower portion of the baffle 30 may be very close to the circuit board.
  • the cooling liquid ejected from the heat sink (including the cooling liquid splashed by contact with other components) can flow along the guide plate 30 under the guide tube 21 in a desired path. Makes the circulation path of the coolant smoother.
  • a channel for the cooling liquid to flow may not be provided in the baffle plate 30 .
  • the thickness of the guide plate 30 in the second direction D2 may be smaller than the thickness of the guide tube 21 in the second direction D2.
  • the third embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as those of the first embodiment, and detailed descriptions of these features are omitted.
  • the liquid guide 20 includes a guide tube 21 , and the guide tube 21 forms a zigzag reciprocating structure that runs through end to end.
  • the guide tube 21 constitutes the liquid guide 20 alone, which is also referred to as the liquid guide 20 in an S-shaped structure that is bent and reciprocated.
  • One end of the liquid guide 20 forms a liquid inlet 211, and the other end is closed.
  • a section of the guide tube 21 is accommodated between adjacent memory banks M. As shown in FIG.
  • the size and spacing of each section of the guide tube 21 between adjacent memory banks M and the arrangement of the liquid outlet holes 22 on the section are similar to those in the first embodiment, and will not be repeated here.
  • the guide tube 21 can also be made of a flexible material, for example, a hose-shaped guide tube 21 is made of PVC (ie polyvinyl chloride), so that the guide tube 21 can pass through the guide tube. 21 is bent to form an S shape.
  • PVC polyvinyl chloride
  • the series-connected liquid guides 20 have the characteristics of simple and compact structure.
  • the fourth embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as the first embodiment, and detailed descriptions of these features are omitted.
  • the main difference between this embodiment and the first embodiment is that the liquid guide 20 is arranged above the memory bank M instead of the side.
  • the liquid guide 20 is a single guide tube 21, and the guide tube 21 is flat and covers the memory bank M in both the first direction D1 and the second direction D2.
  • One end of the guide tube 21 in the first direction D1 is the liquid inlet 211 , and the other end is closed.
  • the liquid outlet hole 22 is formed in the lower wall of the guide tube 21 located at the lower part.
  • the cooling liquid in the guide pipe 21 can be ejected from the liquid outlet hole 22 by means of gravity or gravity and the pressure in the guide pipe 21 , and sprinkle onto the memory bank M below.
  • the axis of the liquid outlet hole 22 may extend in the vertical direction (refer to FIG. 7 ), or may form an included angle with the vertical direction (hereinafter referred to as inclined arrangement, refer to FIG. 8 ).
  • the extension line of the above-mentioned axis intersects the memory particles on the memory module M, or in other words, the extension line of the axis of the liquid outlet hole 22 intersects with the target heat dissipation point of the electronic component, thereby
  • the cooling liquid ejected from the liquid outlet hole 22 can flow to the target heat dissipation point more effectively.
  • the dashed arrows in FIGS. 7 and 8 show the approximate path of the cooling liquid exiting from the liquid outlet hole 22 .
  • the diameter of the liquid outlet holes 22 is 0.3 mm to 1 mm, and in the first direction D1, the distance between adjacent liquid outlet holes 22 (taking the center line of the liquid outlet holes 22 as Benchmark calculation spacing) is 5mm to 30mm.
  • the number of a liquid discharge hole 22 arranged in a straight line is preferably greater than the number of the memory modules M, so as to facilitate heat dissipation from both sides of the memory module M.
  • the speed of the cooling liquid flowing out of the liquid outlet hole 22 is greater than 0.2 m/s.
  • the present application does not limit the number and arrangement of the liquid outlet holes 22.
  • the liquid outlet holes 22 can be formed in multiple rows, and the position of each row or the plurality of liquid outlet holes 22 corresponds to a group of memory modules M and is used for the memory modules of the group.
  • M output coolant.
  • the liquid guide 20 of this form has a simple structure, does not require complicated pipelines, and does not require connection of multiple conduits such as welding.
  • the heat sink with this arrangement is especially suitable for being arranged above an electronic component with a small vertical dimension and a large space above, for example, above the electronic component E in FIG. 1 .
  • the liquid guide 20 disposed above the electronic components may also include a plurality of guide pipes, and the liquid distributor may provide cooling liquid to the plurality of guide pipes.
  • the fifth embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as those of the first embodiment, and detailed descriptions of these features are omitted.
  • the cooling liquid flows along the non-closed liquid-conducting groove, and dissipates heat to the memory module M during the flow.
  • the cooling liquid flowing through the liquid guiding groove finally falls into the cooling liquid pool PL (refer to FIG. 1 ) and participates in the next cycle.
  • the liquid guiding groove is formed in the liquid guiding device 20 , and the liquid guiding device 20 includes a base portion 201 , a liquid guiding portion 202 and a liquid outlet portion 203 .
  • the base portion 201 is formed in a U-shaped clip shape, so that the base portion 201 can be easily sleeved on the memory module M. As shown in FIG. On the one hand, the base portion 201 can be fixed by the memory module M, and on the other hand, the base portion 201 can be in contact with the memory module M to better realize heat conduction.
  • the base 201 includes two substrates 201a and a top plate 201b connecting the two substrates 201a, the two substrates 201a being spaced apart in the second direction D2 to accommodate the memory modules M.
  • the substrate 201a is located at the side of the memory module M. As shown in FIG.
  • the liquid-conducting portion 202 is disposed on the wall of the substrate 201a facing away from the memory bank M. As shown in FIG. In this embodiment, the liquid-conducting portion 202 is elongated, and in a cross-section perpendicular to the first direction D1, the liquid-conducting portion 202 is disposed obliquely with respect to the substrate 201a, that is, the lower portion of the liquid-conducting portion 202 is connected to the substrate 201a , the upper portion of the liquid-conducting portion 202 is spaced apart from the substrate 201a, so that a liquid-conducting groove is formed between the liquid-conducting portion 202 and the substrate 201a.
  • the liquid guide portion 202 forms a vertical drop while extending along the first direction D1, so that the cooling liquid can flow in the liquid guide groove under the action of gravity, thereby taking away the liquid on the base portion 201 from the memory bank M. heat.
  • the liquid conducting portion 202 may be connected to the base portion 201 by, for example, bonding or welding, or may be formed integrally with the base portion 201 .
  • the cooling liquid is supplied by the liquid outlet 203, for example, the liquid outlet 203 is connected to a pump.
  • the liquid outlet portion 203 is provided at an approximate end position of the liquid guide portion 202 in the first direction D1.
  • the axis of the liquid outlet hole may be substantially perpendicular to the outer surface of the substrate 201a facing away from the memory module M (as shown in FIG. 9 and FIG. 10 ), or may be inclined to the outer surface of the substrate 201a (as shown in FIG. 11 ).
  • a plurality of liquid guiding parts 202 can be provided, and the plurality of liquid guiding parts 202 can be arranged substantially in parallel.
  • the plurality of liquid guiding parts 202 The sections 202 are all high at the same end position and low at the same other end position.
  • a liquid outlet 203 is provided at the high end of each liquid conducting portion 202 , and the plurality of liquid outlets 203 may be connected to each other, for example, connected in parallel.
  • the inner diameter of the liquid outlet 203 is 0.3 mm to 5 mm.
  • the speed of the cooling liquid flowing out of the liquid guide portion 202 is greater than 0.1 m/s.
  • one or more through holes may be provided on the liquid guide portion 202 (no through holes are provided on the liquid guide portion 202 located at the bottom), so that the cooling liquid in the upper liquid guide groove can partially to the drainage channel located below.
  • the plurality of liquid guiding parts 202 may also be arranged in a zigzag shape, that is, the plurality of liquid guiding parts 202 are inclined in different directions, so that they are connected end to end in series.
  • the two liquid-conducting parts 202 adjacent to each other in the vertical direction one end of the liquid-conducting part 202 on the upper layer is high and the other end is low in the first direction D1, and the liquid-conducting part 202 on the next layer is in the first direction D1.
  • One end in one direction D1 is low and the other end is high.
  • the cooling liquid can flow through the plurality of liquid guide parts 202 in sequence from top to bottom under the action of gravity, and the flow direction of each two adjacent liquid guide parts 202 in the first direction D1 is reversed in the first direction. of.
  • the dashed arrows in FIG. 12 show possible paths for the cooling liquid to flow along the plurality of liquid guides 202 .
  • Only one liquid outlet 203 may be provided on each side of the liquid guide parts 202 connected in series, and the liquid outlet part 203 is arranged above the liquid guide part 202 located at the highest position on each side. Or alternatively, the liquid outlet portion 203 is disposed above the base portion 201 , and the cooling liquid flowing out of the liquid outlet portion 203 can flow to the two substrates 201 a on both sides of the base portion 201 relatively uniformly.
  • the cooling liquid in the flow may interact with the memory module M. Therefore, the application says that the cooling liquid can be in contact with the memory module M.
  • a through hole communicating with the liquid guiding groove may be formed on the substrate 201a, the through hole penetrating the substrate 201a in the thickness direction of the substrate 201a (the second direction D2), so that the cooling liquid in the liquid guiding groove can partially
  • the flow from the through hole to the gap between the substrate 201a and the memory module M directly cools the memory module M.
  • such through holes are inclined with respect to the thickness direction (second direction D2) of the substrate 201a, so that the height of the through holes on the inner side surface of the substrate 201a close to the memory module M is lower than that on the substrate 201a away from the memory module M.
  • the height of the outer side which facilitates the flow of coolant to the memory module M.
  • the through holes are opened toward the gap between the memory particles on the memory bank M, so that the cooling liquid can easily flow to the inner side of the base 201 .
  • At least the substrate 201a of the base 201 is made of a material (eg, metal) with good thermal conductivity.
  • the present application does not limit the specific shape of the liquid guiding portion 202.
  • the liquid guiding portion 202 may be formed in an arc shape to increase the capacity of the liquid guiding groove.
  • the clip-shaped liquid guide 20 in the fifth embodiment can also be provided in, for example, the heat sink of the fourth embodiment, so as to guide the flow direction of the cooling liquid.
  • the present application also provides an electronic device, which includes a plurality of electronic components (eg, memory sticks) and a heat dissipation device according to the present application.
  • the heat dissipation device can efficiently dissipate heat to electronic components.
  • the cooling liquid can be in direct contact with the electronic components, and there is no need to provide a thermal pad between the heat sink and the electronic components (such as memory modules), which reduces the cost of the heat sink and facilitates pluggable maintenance of the electronic components.
  • the structure of the heat dissipation system is simple, and the outer circulation of the heat dissipation system can use the common outer circulation channel for cooling the CPU.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请涉及电子元件的散热装置和电子设备。散热装置包括用于对多个电子元件进行散热，所述多个电子元件并排排列；所述散热装置包括用于输送冷却液的一个或多个导流管，所述一个或多个导流管设置在所述多个电子元件的侧方；每个所述导流管的朝向所述电子元件的壁形成有多个贯穿的出液孔，所述冷却液能从所述出液孔流出并直接喷射在所述多个电子元件的侧面。根据本申请的散热装置结构简单，散热性能好。

Description

电子元件的散热装置和电子设备
本申请要求于2021年2月2日提交中国专利局、申请号为202110144687.6、发明名称为“电子元件的散热装置和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子元件的散热领域，更具体地涉及一种电子元件的散热装置和电子设备。
背景技术
对于电子设备，以服务器为例，随着中央处理器(CPU)功率的增大，机房单柜的功率密度可达20kW甚至更高。为避免大功率机柜局部热点的过高功率，需要给服务器和机房散热。
CPU和内存作为服务器的两大关键器件是主要热源。CPU一般在主板上平铺布置，其功耗集中，业界通常使用封闭的液冷循环通道给CPU散热。而像内存这样的在主板上阵列式插卡布置的元件，由于插卡数量多、功耗分散且需要支持现场插拔维护，尤其例如内存资源池服务器上的内存数量多、内存模组间的间隙小(例如8mm以下)，这对内存的冷却提出了很大的挑战。
一种可能的内存散热方案是使用能供液体流动的冷却管道(简称冷排)散热。例如，将冷却液管道设置在相邻的直插式也简称内存条之间，冷却液管道与内存条之间通过夹具夹紧，在内存条和夹具之间填充导热垫以吸收公差和降低接触热阻。然而，这种散热方案中，内存条外包裹的导热垫成本较高。并且，这种设置方式限制了对内存条的维护作业，在更换内存条的作业中，需要将冷排和导热垫整体拆除后再更换内存条，在更换内存条后还需要重新包裹导热垫。
与上述方案类似还有一种可能的冷排设置方式，这种方式使相邻的两个内存条公用一个冷排，冷排位于两个内存条之间。内存条的内侧与冷排之间设置导热垫，相邻的两个内存条通过夹具保证与导热垫的贴合。在这种方式中，内存条上只有一侧的内存颗粒与导热垫接触，另一侧的内存颗粒的热量传导至冷排的导热效果差。该方案较难应对大功率(例如大于10W)的内存散热。
美国专利公开US2009/0237883A1公开了另一种内存散热方案，该方案使用顶盖式内存冷板。板状的液冷散热器设置在内存条的上方，在内存条和散热器之间设有夹片和导热垫。然而，该方案的散热器内部流道复杂，散热器的安装和固定都较复杂。由于散热器固定在内存条上方，散热器距离内存条非常近，且内存条和散热器之间还设有夹片和导热垫，这使得对单个内存条，特别是DIMM(双列直插式存储模块)形式的内存条的插拔维护困难。
中国实用新型专利CN203279429U公开了又一种内存散热方案，该方案使用喷淋式蒸发冷却循环***。在柜体中提供密封箱体，使冷却液在密封箱体内泵送循环。冷 却液能通过喷嘴被雾化后喷射到发热单元，与发热单元进行热交换后，液体形态的冷却液流回储液箱，汽化蒸发的冷却液经冷凝器冷凝成液体后流回储液箱。该方案中一组发热单元(例如多个内存条)只设置一个喷嘴，冷却液需要被雾化后才能覆盖多个发热点，同时喷头也需要被设置在远离发热单元的较高位置。这使得装置的成本较高且难以做到结构紧凑，对内存的散热效果有限。
发明内容
有鉴于此，本申请提出了一种电子元件的散热装置和电子设备。
第一方面，本申请的实施例提供了一种电子元件的散热装置，用于对多个电子元件进行散热，所述多个电子元件并排排列；
所述散热装置包括用于输送冷却液的一个或多个导流管，所述一个或多个导流管设置在所述多个电子元件的侧方；
每个所述导流管的朝向所述电子元件的壁形成有多个贯穿的出液孔，所述冷却液能从所述出液孔流出并直接喷射在所述多个电子元件的侧面。根据本实现方式的散热装置散热能有效地给电子元件散热，冷却液能与电子元件直接接触，散热装置与电子元件之间不需要设置导热垫，散热装置的成本低，冷却液的输送效率高，且冷却液不需要被雾化。
根据第一方面，在电子元件的散热装置的第一种可能的实现方式中，
所述出液孔沿第一方向排列，所述散热装置用于给多个在第二方向上排列的电子元件散热，所述第二方向与所述第一方向垂直，
所述导流管有多个，多个所述导流管在所述第二方向上并联地设置，
在所述第二方向上，相邻的所述电子元件之间设有一个所述导流管。导流管设置在相邻的电子元件之间，使得导流管能给位于其两侧的电子元件输送冷却液，装置整体紧凑，对冷却液的输送定位精确。
根据第一方面的第一种可能的实现方式，在电子元件的散热装置的第二种可能的实现方式中，所述散热装置还包括分液器，所述分液器包括一个入液口和多个出液口，每个所述导流管与一个所述出液口相连。使用分液器使得装置的入液口只需要有一个，装置结构紧凑。
根据第一方面，在电子元件的散热装置的第三种可能的实现方式中，所述出液孔沿第一方向排列，所述散热装置用于给多个在第二方向上排列的电子元件散热，所述第二方向与所述第一方向垂直，
所述导流管为一个，并形成首尾贯通的曲折往复的结构，
在所述第二方向上，相邻的所述电子元件之间容纳有所述导流管的部分区段。串联的导流管结构简单，且其曲折往复的结构能覆盖较大的区域以给多个电子元件输送冷却液。
根据第一方面的第三种可能的实现方式，在电子元件的散热装置的第四种可能的实现方式中，所述导流管具有柔性。柔性的导流管能根据电子元件的结构而适应性地调整形状，使得散热装置的布置方便、兼容性强。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在电子元件的散热装置的第五种可能的实现方式中，所述冷却液用于以大于0.2m/s的速度从所述出液孔流出。这保证了冷却液能以足够的流速喷射目标散热点。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在电子元件的散热装置的第六种可能的实现方式中，所述出液孔的孔径为0.3mm至1mm，和/或
相邻的所述出液孔之间的间距为5mm至30mm。上述结构使得冷却液从出液孔流出的速度能得到保证，以确保目标散热点均能得到有效冷却。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在电子元件的散热装置的第七种可能的实现方式中，每个所述电子元件的两侧均设有所述导流管，
每个所述电子元件的两侧均设有所述导流管，
位于所述电子元件的一侧的一个所述导流管的所述出液孔与位于所述电子元件的另一侧的一个所述导流管的所述出液孔在所述出液孔的排列方向上错开地设置。出液孔的这种在电子元件两侧交错的设置方式，能在保证散热效果的前提下减少导液器上的出液孔的数量，从而能以较小的泵送功率、或者说用较小的冷却液流量来实现较好的冷却效果。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在电子元件的散热装置的第八种可能的实现方式中，至少部分的所述出液孔的轴线的延长线与所述电子元件的目标散热点相交。出液孔的上述设置使得冷却液能更有效地流至目标散热点。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在电子元件的散热装置的第九种可能的实现方式中，所述电子元件包括内存条。特别对于分散分布的、使用插卡方案的内存条，本申请的散热装置能有效设置在其周围以提供高效的散热。
根据第二方面，本申请的实施例提供了一种电子设备，包括多个电子元件和根据第一方面，或以上第一方面的任意一种可能的实现方式的散热装置。
根据第三方面，本申请的实施例提供了一种电子元件的散热装置，用于对多个电子元件进行散热，所述多个电子元件并排排列；
所述散热装置包括基部、导液部和出液部，
所述基部至少部分地设置在所述电子元件的侧方，所述导液部固定于所述基部从而在所述导液部和所述基部之间形成导液槽，
所述导液部在沿第一方向延伸的同时在竖直方向上形成落差，使得所述冷却液能在重力作用下沿所述导液部流动并流过所述电子元件，
所述出液部设置在所述导液部的在所述第一方向上位于高处的端部。这种设置方式所提供的导液器能灵活地根据电子元件的布置方式而进行布置，且导液槽能利用冷却液的重力来输送冷却液。
根据第三方面，在第三方面的第一种可能的实现方式中，所述基部与所述电子元件相接触地套设于所述电子元件，所述基部在垂直于所述第一方向上的横截面中形成为U字形。基部依附于电子元件，使得基部的安装方便。
根据第三方面，或以上第三方面的任意一种可能的实现方式，在第三方面的第二种可能的实现方式中，在竖直方向上，所述导液部有多个。这使得冷却液能以较分散的方式与基部的更多的区域、或者是基部的更靠近电子元件的目标散热点的区域接触。
根据第三方面的第二种可能的实现方式，在第三方面的第三种可能的实现方式中，每个所述导液部的所述端部设有一个出液部，或者
所述出液部设置在位于最高位置的所述导液部的在所述第一方向上的端部，多个所述导液部呈Z字形排列，使得冷却液能在重力作用下以在所述第一方向上改变流向的方式顺次流过在竖直方向上相邻的所述导液部。出液部可以灵活设置，并可以尽量减少出液部的数量，使得装置结构更紧凑。
根据第三方面的第二种可能的实现方式，在第三方面的第四种可能的实现方式中，所述导液部上设置有一个或多个通孔，使得位于上方的所述导液槽内的冷却液能部分地流至位于下方的所述导液槽。通过这种方式，可以不为位于下方的导液槽专门设置提供冷却液的出液部。
根据第三方面，或第三方面的的第一种可能的实现方式，在第三方面的第五种可能的实现方式中，在所述基部上设有与所述导液槽连通的通孔，该通孔在与所述第一方向垂直的第二方向上朝向所述电子元件开放，从而所述导液槽中的冷却液能够部分地从所述通孔流到所述基部和所述电子元件之间的间隙，以直接冷却所述电子元件。这种设置方式能使冷却液更大的接触面积、更直接的接触方式接触电子元件。
本申请的这些和其他方面在以下(多个)实施例的描述中会更加简明易懂。
附图说明
包含在说明书中并且构成说明书的一部分的附图与说明书一起示出了本申请的示例性实施例、特征和方面，并且用于解释本申请的原理。
图1示出了根据本申请的一个实施例的电子元件的散热***的示意图。
图2a示出了根据本申请的第一实施例的电子元件的散热装置的示意图。
图2b是图2a的部分分解的示意图。
图3是图2a的垂直于第一方向的横截面的示意图。
图4示出了根据本申请的第二实施例的电子元件的散热装置的横截面的示意图。
图5示出了根据本申请的第三实施例的电子元件的散热装置的示意图。
图6示出了根据本申请的第四实施例的电子元件的散热装置的示意图。
图7和图8示出了根据本申请的第四实施例的两种可能的电子元件的散热装置的横截面的示意图。
图9和图10示出了根据本申请的第五实施例的一种可能的电子元件的散热装置的示意图。
图11示出了根据本申请的第五实施例的另一种可能的电子元件的散热装置的示意图。
图12示出了根据本申请的第六实施例的电子元件的散热装置的示意图。
图13示出了根据本申请的电子元件的散热装置的一种概念性的实现方式的示意图。
附图标记说明：
S容器；A散热装置；B电路板；M内存条；M0内存颗粒；U中央处理器；E电子元件；L冷板；PL冷却液池；P1第一泵；P2第二泵；H换热器；T1内循 环通道；T2外循环通道；
10分液器；11入液口；20导液器；21导流管；211入液口；22出液孔；201基部；201a基板；201b顶板；202导液部；30导流板；D1第一方向；D2第二方向。
具体实施例
以下将参考附图详细说明本申请的各种示例性实施例、特征和方面。附图中相同的附图标记表示功能相同或相似的元件。尽管在附图中示出了实施例的各种方面，但是除非特别指出，不必按比例绘制附图。
在这里专用的词“示例性”和“例如”等意为“用作例子、实施例或说明性”。这里作为“示例性”和“例如”所说明的任何实施例不必解释为优于或好于其它实施例。
另外，为了更好的说明本申请，在下文的具体实施例中给出了众多的具体细节。本领域技术人员应当理解，没有某些具体细节，本申请同样可以实施。在一些实例中，对于本领域技术人员熟知的方法、手段、元件和电路未作详细描述，以便于凸显本申请的主旨。
本申请中描述的“上”和“下”等方位是基于附图中的方位而言的、并不是绝对的，在实际应用中，相关方位可以随着装置安装方向的改变而相应改变。
参照图1至图13，以主要应用于服务器的直插式存储模块(简称内存条)为例，介绍根据本申请的电子元件的散热装置A以及包括该散热装置A的电子元件的散热***。
首先参照图1和图13，介绍根据本申请的电子元件的散热***以及其中的散热装置的基本实现方式。
散热***具有壳体S，壳体S例如是设置于服务器机柜内的密闭的盒子，或者是密闭的服务器机柜。密闭的壳体S能有效阻止内部的循环冷却液的蒸发。壳体S内设有电子元件、散热装置A、泵、内循环通道T1、换热器H以及部分的外循环通道T2(外循环通道T2的其余部分伸出壳体S)。
电子元件包括电路板B以及设置于电路板B的内存条M、中央处理器(即CPU)U以及其它电子元件E。
CPU的散热使用相对于壳体S的内腔密闭的外循环通道T2。外循环通道T2从壳体S外伸至壳体S的内腔，外循环通道T2与冷板L相连，冷板L设置在CPU的周围，外循环通道T2内的冷却液在流过冷板L的过程中吸收CPU的产热。外循环通道T2还流过换热器H，以将换热器H内的热量带出壳体S。
散热装置A用于给内存条M和其它需要散热的电子元件E散热。散热装置A与内循环通道T1相连，使用泵(第一泵P1和第二泵P2，使用两个泵为提高可靠性，其中一个泵可以作为备份用)通过内循环通道T1将冷却液输送给散热装置A。从散热装置A流出的冷却液可以以接触的方式流过内存条M和/或其它电子元件E，或者对内存条M和/或其它电子元件E进行喷射(例如，也可称射流冲击)。
其中，散热装置A给电子元件输送冷却液的基本方式例如参照图13。图中的电子元件为内存条M，内存条M上具有多个内存颗粒M0。散热装置A将冷却液输送至内 存颗粒M0的周围，并通过例如出液孔22射出并喷射到内存颗粒MO。
回到图1，流过电子元件的冷却液将落在壳体S的内腔的下部所形成的冷却液池PL内。可选地，电路板B上设有开孔，冷却液可以通过电路板B上的开孔更快速便捷地从电路板B流走。
冷却液池PL内的冷却液能被第一泵P1和/或第二泵P2泵送，经内循环通道T1再次输送至散热装置A形成循环。并且，内循环通道T1流过换热器H，使得内循环通道T1内的冷却液能得到降温；可选地，换热器H设置在泵的出口。
应当理解，CPU也可以使用其它冷却装置进行散热，在这种情况下，换热器H和外循环通道T2可以是专门为了将内循环通道T1内的热量换出壳体S而设置的。
可选地，外循环通道T2内冷却液的循环动力来自于设置在机柜外的冷却液分配单元(即CDU，Coolant Distribution Unit)。
(散热装置的第一实施例)
接下来参照图2a、图2b和图3，介绍根据本申请的第一实施例的电子元件的散热装置A。
参照图2a和图2b，散热装置A包括相连的分液器10和导液器20。导液器20包括多个并列的导流管21。
具体地，分液器10具有一个入液口11和多个出液口。入液口11用于与内循环通道T1(参照图1)相连以使冷却液流入分液器10。每个出液口与一个导流管21相连，以将冷却液分配至多个导流管21，或者说，多个导流管21通过分液器10形成了并联。为了方便固定多个导流管21，多个导流管21之间还可以设置定位支架。在第一方向D1上，定位支架例如设置在每个导流管21的两个端部以及导流管21的中部，定位支架一方面起到将多个导流管21固定在一起的作用，另一方面也起到中间连接件的作用，从而可以将这多个导流管21固定到例如壳体S。
对于插设在主板上的阵列设置的多个内存条M，每个内存条M上具有多个目标散热点(例如内存颗粒)，这些目标散热点至少在第一方向D1上排列开，多个内存条M在与第一方向D1相垂直的第二方向D2上排列。图2a中在第二方向D2上并列设置了4个内存条M，还在第一方向D1上并列设置了2个内存条M，然而应当理解，本申请对第一方向D1上的内存条M是否为多个不作限制。
导流管21设置在内存条M的侧方。在第二方向D2上，每两个相邻的内存条M之间设有一个导流管21，并且最外侧的内存条M的外侧也设有导流管21，从而使得每个内存条M的两侧都设有一个导流管21。对于本实施例中在第二方向D2上的4个内存条M，共对应设有5个导流管21。
可选地，相邻两个导流管21之间的间距(以导流管21的中心线为基准计算间距)等于相邻两个内存条M之间的间距(以内存条M的中心线为基准计算间距)，例如间距为7mm至8mm。
导流管21在竖直方向(特别是，竖直方向与第一方向D1和第二方向D2均垂直)上大致与内存条M处于同样的高度。可选地，在竖直方向上，导流管21的尺寸大致与内存颗粒所覆盖区域的尺寸相同，例如，内存条M上有上下两排内存颗粒，这两排内存颗粒的总高度为20mm，则导流管21在竖直方向上的尺寸也为20mm；当然，导 流管21在竖直方向上的尺寸也可以小于内存颗粒的尺寸。
由于内存条M之间的间隙较小，导流管21在垂直于第一方向D1的横截面中例如呈扁平的腰形，具体地，导流管21在第二方向D2上的尺寸小于在竖直方向上的尺寸。这种形状的导流管21例如可以通过将标准的铜圆管压扁而形成。
应当理解，本申请对导流管21的制作材料不作限制，其例如可以是金属、也可以是橡胶或塑料等非金属。本申请对导流管21的导热性不作限制。
导流管21沿第一方向D1延伸，使得在第一方向D1上，导流管21至少能覆盖内存条M上的多个内存颗粒。
同时参照图3，导流管21的侧壁形成有多个贯穿的出液孔22，多个出液孔22在第一方向D1上排开。可选地，在第一方向D1上，每个内存颗粒至少对应一个出液孔22。可选地，在第一方向D1上，一个导流管21的一侧的出液孔22的数量可以少于与其相对的内存条M上的内存颗粒的数量。导流管21内的冷却液能从出液孔22处流出并喷射至内存颗粒，从而以接触的方式给内存条M散热。
可选地，对于设置于两个内存条M之间的导流管21，导流管21的朝向两边的两个内存条M的侧壁上均形成出液孔22；对于设置在最外侧的两个导流管21，仅在导流管21的朝向位于内侧的内存条M的内侧壁上形成出液孔22。
可选地，出液孔22的孔径为0.3mm至1mm，在第一方向D1上，相邻的出液孔22之间的间距(以出液孔22的中心线为基准计算间距)为5mm至30mm。出液孔22的上述尺寸设置能保证冷却液的流速，从而能以较小的泵送功率、或者说用较小的冷却液流量来实现较好的冷却效果。
本申请对出液孔22的数量以及出液孔22在导流管21的侧壁上的排列方式不作限制，每个侧壁上的出液孔22可以形成阵列也可以是彼此之间交错地设置。在竖直方向上，出液孔22可以排布在同一高度而形成一层，也可以排布在不同高度而形成多层。
对于设置于一个导流管21的两个侧壁上的出液孔22，它们可以是对称的，也可以是交错布置的。
此外，对于每个内存条M两侧的两个导流管21，这两个导流管21上的出液孔22可以是在第一方向D1上交错布置、或者说间隔开地设置。出液孔22的这种在电子元件两侧交错的设置方式，能在保证散热效果的前提下减少导液器上的出液孔的数量，从而能以较小的泵送功率、或者说用较小的冷却液流量来实现较好的冷却效果。可选地，导流管21的结构和冷却液的泵送速度满足，冷却液从出液孔22内流出的速度大于0.2m/s。
优选地，冷却液为非导电的液体，且介电强度大于40kV。例如冷却液可以是矿物油或者氟化液。
对该散热装置进行仿真试验。
仿真使用的内存条(具体为DIMM)一侧具有20个(两侧共40个)内存颗粒，每侧的20个内存颗粒分上下两排设置，每排10个。内存条总功率为20W，平均每个内存颗粒的功率为0.5W。
导流管21上单侧具有5个出液孔22(单根内存条在两侧共设有10个出液孔22)，相邻出液孔22的间距为25mm，出液孔22的直径为0.35mm。
仿真使用氟化液作为冷却液进液温度低于50℃。
仿真结果显示，使用根据本实施例的散热装置进行散热的内存颗粒的最高温度为90℃。
应当理解，上述各参数的取值只是针对该仿真试验而设置的，不用于限制本申请。
(散热装置的第二实施例)
接下来，参照图4，介绍根据本申请的第二实施例的散热装置。第二实施例是第一实施例的变型，对于与第一实施例相同或相似的技术特征在图中使用相同的附图标记，并省略对这些特征的详细描述。
本实施例相对于第一实施例的改进主要在于，为在竖直方向上尺寸较小的导流管21设置了导流板30。
图4为沿第一方向D1(参照图2a)观察散热装置的示意图。内存条M的下部插设于电路板(图未示)，为引导飞溅的冷却液的流动，在导流管21和电路板之间的空间设置导流板30，导流板30与导流管21相连。
导流板30例如为外形与导流管21相仿的条形板，其与导流管21相连而起到了在竖直方向上延伸导流管21的尺寸的效果。导流板30的下部可以非常接近电路板。从散热装置***出的冷却液(包括接触到其它部件而飞溅的冷却液)可以在导流管21的下方顺着导流板30按期望的路径流动。使得冷却液的循环路径更顺畅。
可以理解，可以不在导流板30中设置供冷却液流动的通道。可选地，导流板30的在第二方向D2上的厚度可以小于导流管21在第二方向D2上的厚度。
(散热装置的第三实施例)
接下来，参照图5，介绍根据本申请的第三实施例的散热装置。第三实施例是第一实施例的变型，对于与第一实施例相同或相似的技术特征在图中使用相同的附图标记，并省略对这些特征的详细描述。
本实施例与第一实施例的区别主要在于，导液器20包括的一个导流管21，该导流管21形成首尾贯通的曲折往复的结构。实际上，在本实施方式中，导流管21单独构成导液器20，也称，导液器20形成S形的、弯折往复的结构。导液器20的一个端部形成入液口211，另一个端部封闭。
在第二方向D2上，相邻的内存条M之间容纳有导流管21的一个区段。导流管21的位于相邻的内存条M之间的每个区段的尺寸、间隔距离以及该区段上的出液孔22的设置方式与第一实施例类似，在此不做赘述。
可选地，在本实施例中，导流管21也可以使用具有柔性的材料制作，例如使用PVC(即聚氯乙烯)制成软管状的导流管21，从而能通过将导流管21弯折而使其形成S形。
串联的导液器20具有结构简单紧凑的特点。
(散热装置的第四实施例)
接下来，参照图6至图8，介绍根据本申请的第四实施例的散热装置。第四实施例是第一实施例的变型，对于与第一实施例相同或相似的技术特征在图中使用相同的附图标记，并省略对这些特征的详细描述。
本实施例与第一实施例的区别主要在于，导液器20设置在内存条M的上方而非 侧方。
本实施例中，导液器20为单个导流管21，导流管21呈扁平状，在第一方向D1和第二方向D2上均覆盖内存条M。导流管21在第一方向D1上的一端为入液口211、另一端封闭。出液孔22形成于导流管21的位于下部的下壁。导流管21内的冷却液能借助于重力或者重力和导流管21内的压力从出液孔22射出，并洒落至下方的内存条M。
出液孔22的轴线可以沿竖直方向延伸(参照图7)，也可以与竖直方向形成夹角(以下简称倾斜设置，参照图8)。在出液孔22的轴线倾斜设置的情况下，上述轴线的延长线与内存条M上的内存颗粒相交，或者说，出液孔22的轴线的延长线与电子元件的目标散热点相交，从而使得从出液孔22射出的冷却液能更有效地流至目标散热点。图7和图8中的虚线箭头示出了冷却液从出液孔22射出的大致路径。
可选地，在本实施例中，出液孔22的孔径为0.3mm至1mm，在第一方向D1上，相邻的出液孔22之间的间距(以出液孔22的中心线为基准计算间距)为5mm至30mm。在第二方向D2上，例如直线状排布的一排出液孔22的数量优选大于内存条M的数量，从而便于对内存条M的两侧散热。
可选地，在本实施例中，冷却液从出液孔22内流出的速度大于0.2m/s。
本申请对出液孔22的数量以及排列方式不作限制，例如，出液孔22可以形成多排，每一排或多排出液孔22的位置对应一组内存条M并用于给该组内存条M输出冷却液。
这种形式的导液器20结构简单，不需要复杂的管路，不需要对多个导管进行例如焊接等的连接。
这种设置方式的散热装置尤其适合设置于竖直尺寸较小、上方具有较大空间的电子元件的上方，例如图1中的电子元件E的上方。
应当理解，在其它可能的实施方式中，设置在电子元件上方的导液器20也可以包括多个导流管，可以由分液器向多个导流管提供冷却液。
(散热装置的第五实施例)
接下来，参照图9至图12，介绍根据本申请的第五实施例的散热装置。第五实施例是第一实施例的变型，对于与第一实施例相同或相似的技术特征在图中使用相同的附图标记，并省略对这些特征的详细描述。
在本实施例中，冷却液沿非封闭的导液槽流动，在流动过程中给内存条M散热。流过导液槽的冷却液最终落入冷却液池PL(参照图1)并参与下次循环。
首先，参照图9至图11介绍本实施例的导液槽的具体构造。导液槽形成于导液器20，导液器20包括基部201、导液部202和出液部203。
基部201形成为U形的夹片状，使得基部201能方便地套设在内存条M上。这一方面使得基部201能通过内存条M得到固定，另一方面也使得基部201与内存条M接触而能更好地实现热传导。
具体地，基部201包括两个基板201a和连接两个基板201a的顶板201b，两个基板201a在第二方向D2上间隔开以容纳内存条M。在基部201套设于内存条M的情况下，基板201a位于内存条M的侧方。
导液部202设置于基板201a的背离内存条M的壁。在本实施例中，导液部202呈长条状，在垂直于第一方向D1的横截面中，导液部202相对于基板201a倾斜地设置，即导液部202的下部与基板201a相连，导液部202的上部与基板201a间隔开，从而在导液部202和基板201a之间形成导液槽。
导液部202在沿第一方向D1延伸的同时在竖直方向上形成落差，使得冷却液能在重力作用下在导液槽内流动，从而带走基部201上的、来自于内存条M的热量。
导液部202可以通过例如粘接或焊接等方式连接至基部201，也可以与基部201形成为一体。
冷却液由出液部203供应，例如出液部203与泵相连。出液部203设置在导液部202的在第一方向D1上的大致端部位置。出液孔的轴线可以大致垂直于基板201a的背离内存条M的外表面(如图9和图10所示)，也可以与基板201a的外表面倾斜设置(如图11所示)。
为使基板201a有较大的与冷却液相接触的面积，导液部202可以设置多个，这多个导液部202可以大致平行地设置，在第一方向D1上，这多个导液部202均在相同的一端位置高、在相同的另一端位置低。
在这种情况下，可选地，在每一个导液部202的位于高处的端部均设置一个出液部203，多个出液部203可以是彼此相通、例如并联的。可选地，出液部203的内径为0.3mm至5mm。
可选地，在本实施例中，冷却液从导液部202内流出的速度大于0.1m/s。
或者，可选地，可以在导液部202上设置一个或多个通孔(位于最下方的导液部202上不设置通孔)，使得位于上方的导液槽内的冷却液能部分地流至位于下方的导液槽。
此外，参照图12，多个导液部202也可以呈Z字形排列，即多个导液部202倾斜方向不同，从而使得它们首尾相连地串联起来。对于在竖直方向上相邻的两个导液部202，位于上一层的导液部202在第一方向D1上的一端高、另一端低，位于下一层的导液部202在第一方向D1上的一端低、另一端高。从而冷却液能在重力作用下从上到下地依次流过多个导液部202，且在第一方向D1上流过每两个相邻的导液部202的流向在第一方向上是反向的。图12中的虚线箭头示出了冷却液沿多个导液部202流动的可能路径。
串联的导液部202可以在每侧只设置一个出液部203，该出液部203设置在每侧位于最高位置的导液部202的上方。或者可选地，将出液部203设置在基部201的上方，出液部203流出的冷却液能较均匀地流至基部201两侧的两个基板201a。
应当理解，在本实施例中，虽然内存条M的大部分区域被导液器20的基部201覆盖，但流动中的冷却液(包括冷却液池PL内的冷却液)可以与内存条M发生接触，因此，本申请称冷却液可以与内存条M接触。
可选地，可以在基板201a上形成与导液槽连通的通孔，该通孔在基板201a厚度方向(第二方向D2)上穿透基板201a，从而导液槽中的冷却液可以部分地从通孔流到基板201a与内存条M之间的间隙，直接冷却内存条M。可选地，这样的通孔相对于基板201a的厚度方向(第二方向D2)倾斜，使得通孔在基板201a的靠近内存条M 的内侧面的高度低于在基板201a的远离内存条M的外侧面的高度，这便于冷却液流到内存条M上。可选地，由于基板201a与内存条M之间的间隙非常小，因此通孔朝向内存条M上的内存颗粒之间的间隙开放，使得冷却液容易流至基部201的内侧。
优选地，在本实施方式中，基部201的至少基板201a由导热性好的材料(例如金属)制成。
本申请对导液部202的具体形状不作限制，例如，在垂直于第一方向D1的横截面中，导液部202可以形成圆弧形以增加导液槽的容量。
应当理解，上述实施方式及其部分方面或特征可以适当地组合。例如：
第五实施例中的夹片状的导液器20也可以设置于例如第四实施例的散热装置，以引导冷却液的流动方向。
应当理解，本申请还提供一种电子设备，其包括多个电子元件(例如内存条)和根据本申请的散热装置。
本申请至少具有以下优点中的一个优点：
(i)根据本申请的散热装置能有效地给电子元件散热。
(ii)冷却液能与电子元件直接接触，散热装置与电子元件(例如内存条)之间不需要设置导热垫，降低散热装置的成本，且方便对电子元件的插拔式的维护。
(iii)散热***结构简单，且散热***的外循环可以借助常用的给CPU散热的外循环通道。
尽管在此结合各实施例对本申请进行了描述，然而，在实施所要求保护的本申请过程中，本领域技术人员通过查看所述附图、公开内容、以及所附权利要求书，可理解并实现所述公开实施例的其它变化。在权利要求中，“包括”(comprising)一词不排除其他组成部分或步骤，“一”或“一个”不排除多个的情况。单个处理器或其它单元可以实现权利要求中列举的若干项功能。相互不同的从属权利要求中记载了某些措施，但这并不表示这些措施不能组合起来产生良好的效果。
以上已经描述了本申请的各实施例，上述说明是示例性的，并非穷尽性的，并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下，对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择，旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进，或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。

Claims (11)

  1. 一种电子元件的散热装置，其特征在于，用于对多个电子元件进行散热，所述多个电子元件并排排列；
    所述散热装置包括用于输送冷却液的一个或多个导流管，所述一个或多个导流管设置在所述多个电子元件的侧方；
    每个所述导流管的朝向所述电子元件的壁形成有多个贯穿的出液孔，所述冷却液能从所述出液孔流出并直接喷射在所述多个电子元件的侧面。
  2. 根据权利要求1所述的电子元件的散热装置，其特征在于，所述出液孔沿第一方向排列，所述散热装置用于给多个在第二方向上排列的电子元件散热，所述第二方向与所述第一方向垂直，
    所述导流管有多个，多个所述导流管在所述第二方向上并联地设置，
    在所述第二方向上，相邻的所述电子元件之间设有一个所述导流管。
  3. 根据权利要求2所述的电子元件的散热装置，其特征在于，所述散热装置还包括分液器，所述分液器包括一个入液口和多个出液口，每个所述导流管与一个所述出液口相连。
  4. 根据权利要求1所述的电子元件的散热装置，其特征在于，所述出液孔沿第一方向排列，所述散热装置用于给多个在第二方向上排列的电子元件散热，所述第二方向与所述第一方向垂直，
    所述导流管为一个，并形成首尾贯通的曲折往复的结构，
    在所述第二方向上，相邻的所述电子元件之间容纳有所述导流管的部分区段。
  5. 根据权利要求4所述的电子元件的散热装置，其特征在于，所述导流管具有柔性。
  6. 根据权利要求1至5中任一项所述的电子元件的散热装置，其特征在于，所述冷却液用于以大于0.2m/s的速度从所述出液孔流出。
  7. 根据权利要求1至6中任一项所述的电子元件的散热装置，其特征在于，所述出液孔的孔径为0.3mm至1mm，和/或
    相邻的所述出液孔之间的间距为5mm至30mm。
  8. 根据权利要求1至7中任一项所述的电子元件的散热装置，其特征在于，每个所述电子元件的两侧均设有所述导流管，
    位于所述电子元件的一侧的一个所述导流管的所述出液孔与位于所述电子元件的另一侧的一个所述导流管的所述出液孔在所述出液孔的排列方向上错开地设置。
  9. 根据权利要求1至8中任一项所述的电子元件的散热装置，其特征在于，至少部分的所述出液孔的轴线的延长线与所述电子元件的目标散热点相交。
  10. 根据权利要求1至9中任一项所述的电子元件的散热装置，其特征在于，所述电子元件包括内存条。
  11. 一种电子设备，其特征在于，包括多个电子元件和根据权利要求1至10中任一项所述的散热装置。
PCT/CN2021/123601 2021-02-02 2021-10-13 电子元件的散热装置和电子设备 WO2022166244A1 (zh)

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