WO2022160564A1 - 控片量测方法及量测装置 - Google Patents

控片量测方法及量测装置 Download PDF

Info

Publication number
WO2022160564A1
WO2022160564A1 PCT/CN2021/100249 CN2021100249W WO2022160564A1 WO 2022160564 A1 WO2022160564 A1 WO 2022160564A1 CN 2021100249 W CN2021100249 W CN 2021100249W WO 2022160564 A1 WO2022160564 A1 WO 2022160564A1
Authority
WO
WIPO (PCT)
Prior art keywords
measurement
target
product
sheet
measured
Prior art date
Application number
PCT/CN2021/100249
Other languages
English (en)
French (fr)
Inventor
朱贺
Original Assignee
长鑫存储技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Priority to US17/598,807 priority Critical patent/US11862495B2/en
Publication of WO2022160564A1 publication Critical patent/WO2022160564A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present application relates to the technical field of semiconductor manufacturing, and in particular, to a wafer control measurement method and a measurement device.
  • the measuring machine is used to measure parameters such as the feature size of the pattern in the semiconductor structure.
  • the traditional measurement method is that after the wafer product to be measured is placed on the measurement device through a transmission structure such as a robotic arm, the wafer to be measured is moved to the inner part of the measurement device by a moving unit inside the measurement device. A specific measurement location, and then the measurement is performed at the specific measurement location.
  • the current method is to define various mark patterns in the wafer to be measured, and to compensate the movement error generated by the moving unit by identifying the mark patterns, so as to ensure the accuracy of the final measurement point. accuracy.
  • Control wafers are silicon wafers used to monitor machine performance during semiconductor manufacturing.
  • the control chip When the control chip is used to monitor the performance of the measuring device, after the transmission structure such as a mechanical arm transmits the control chip to the measuring device, the moving unit inside the measuring device directly moves the control chip to a specific position. Measurement location. Since the surface of the control film only has a single film layer without any logo pattern, the movement error during the movement of the control film cannot be compensated by the logo pattern, but only depends on the stability of the machine itself.
  • the present application provides a control chip measurement method and a measurement device, which are used to solve the problem that the measurement position accuracy of the control chip inside the measurement device is low in the prior art, so as to better measure the machine and the process. monitor.
  • the present application provides a method for measuring the control film, comprising the following steps:
  • the product sheet has several alignment marks and product measurement points corresponding to the alignment marks respectively;
  • a control sheet is placed, and the projection of the control sheet in the vertical direction is aligned and coincident with the product sheet.
  • the control sheet is measured directly.
  • control sheet has multiple measurement points to be measured, and the multiple product measurement points correspond to the multiple measurement points to be measured one-to-one; after placing the control sheet, it also includes the following: step:
  • the alignment mark corresponding to the measurement site is used as a target alignment mark
  • the target to-be-measured location point is measured according to the target alignment mark.
  • the specific steps of measuring the target to-be-measured measuring point according to the target alignment mark include:
  • the specific step of judging whether the target alignment mark is aligned with a predetermined position includes:
  • Whether the target alignment mark is aligned with a predetermined position is detected by an optical method.
  • the target to-be-measured site is measured by the measurement component.
  • the specific steps of placing the control film include:
  • a control piece is fixed above the product piece, so that the projection of the control piece in the vertical direction is aligned and coincident with the product piece.
  • the specific steps of synchronously moving the product piece and the control piece include:
  • a first bearing structure and a second bearing structure located above the first bearing structure are provided, the first bearing structure is used for bearing and fixing the product sheet, and the second bearing structure is used for bearing and fixing the controller.
  • a sheet, the first carrying structure and the second carrying structure are connected to the same moving structure;
  • the first carrying structure and the second carrying structure are driven to move synchronously by the moving structure.
  • the present application also provides a measuring device, comprising:
  • the product sheet has a plurality of alignment marks and product measurement points corresponding to the alignment marks respectively;
  • a second carrying structure for carrying a control sheet, the projection of the control sheet on the second carrying structure in the vertical direction is aligned and coincident with the product sheet on the first carrying structure;
  • the measuring module is used for measuring the control sheet after the product measuring point is determined according to the alignment mark.
  • control sheet has a plurality of measurement points to be measured, and a plurality of the product measurement points are in one-to-one correspondence with the plurality of the measurement points to be measured;
  • the measurement module is also used for judging whether the target alignment mark is aligned with the predetermined position, the target alignment mark is the alignment mark corresponding to the target standard measurement point, and the target standard measurement point is the same as the target standard measurement point.
  • a standard measurement point corresponding to a target measurement point to be measured, the target measurement point to be measured is a to-be-measured measurement point selected by the user.
  • the measurement module is further configured to obtain the distance between each of the standard measurement points and the corresponding alignment mark; after confirming that the target alignment mark is aligned with the predetermined position , the measurement module is further configured to move the product sheet and the control sheet synchronously according to the distance between the target alignment mark and the target standard measurement point, so that the target to be measured is positioned The points are aligned with the metrology assembly.
  • the measurement module includes:
  • a first measuring unit located above the first bearing structure, is used for measuring the product piece and for judging whether the target alignment mark is aligned with a predetermined position.
  • the first bearing structure is located below the second bearing structure.
  • the second carrying structure is also used to carry a semiconductor structure, and the semiconductor structure has an identification mark;
  • the measurement module further includes:
  • a second measuring unit located above the second carrying structure, is used for measuring the control sheet and for judging whether the identification mark is aligned with a predetermined position.
  • a connecting structure located between the first bearing structure and the second bearing structure, for connecting the first bearing structure and the second bearing structure;
  • the moving structure is located under the first bearing structure and connected to the first bearing structure, and is used for synchronously driving the first bearing structure and the second bearing structure to move.
  • the control sheet measuring method and measuring device provided by the present application, by providing a product sheet with an alignment mark, in the process of measuring the control sheet, by identifying the alignment mark on the product sheet, to determine the control sheet
  • the measurement point on the sheet, that is, the product sheet is used as the reference frame, so that the position error of the control sheet during the measurement process can be reduced or even eliminated, so that the measurement position accuracy of the control sheet can reach the product level, In this way, the measurement machine itself and process changes can be better monitored.
  • FIG. 2 is a schematic structural diagram of a measuring device in a specific embodiment of the present application.
  • FIG. 1 is a flowchart of the control film measurement method in the specific embodiment of the present application
  • FIG. 2 is a schematic structural diagram of the measuring device in the specific embodiment of the present application.
  • the control sheet measurement method shown in FIG. 1 can be applied to the measurement device shown in FIG. 2 .
  • the control film measurement method provided by this specific embodiment includes the following steps:
  • step S11 a product sheet 22 is fixed, and the product sheet 22 has several alignment marks and product measurement points corresponding to the alignment marks respectively.
  • the product piece 22 is used as a reference frame for positioning and controlling the position of the piece. During the positioning process, the product piece 22 is fixed relative to the bearing surface inside the measuring device for carrying the product piece. Changeless. Taking the measuring device shown in FIG. 2 as an example, the first supporting structure 20 in the measuring device is used for supporting the product sheet 22 . In the process of positioning the control sheet by using the product sheet 22 as a reference frame, the position of the product sheet 22 relative to the first bearing structure 20 is fixed.
  • the first bearing structure 20 may be, but not limited to, a chuck.
  • the number of the alignment marks on the product sheet 22 may be one or more, and those skilled in the art can select them according to actual needs, for example, according to the measurement points to be measured on the control sheet. quantity.
  • the multiple mentioned in this specific embodiment refers to two or more.
  • the specific shape of the alignment mark can be set by those skilled in the art according to actual needs. When the number of the alignment marks on the product sheet 22 is multiple, the shapes of the alignment marks may all be different, so as to identify different points to be measured on the control sheet.
  • Step S12 determining the product measurement point according to the alignment mark.
  • step S13 a control sheet 23 is placed, and the projection of the control sheet 23 in the vertical direction is aligned and coincident with the product sheet 22.
  • the projection of the control sheet 23 in the vertical direction is aligned with the product sheet 22 means that after the product sheet 22 and the control sheet 23 are fixed, the control sheet 23 is aligned in the vertical direction. The projection is completely coincident with the product sheet 22 . Still take the measurement device shown in FIG. 2 as an example.
  • the second carrying structure 21 in the measuring device is used for carrying the control sheet 23 . After the control sheet 23 is fixed on the second supporting structure 21 , the projection of the control sheet 23 along the Z-axis direction is aligned and coincident with the product sheet 22 on the first supporting structure 20 . By defining the relative positional relationship between the control piece 23 and the product piece 22 , it is convenient to use the product piece 22 as a reference frame to measure the control piece 23 later.
  • the second bearing structure 21 can be, but not limited to, a chuck.
  • the position alignment of the product sheet 22 on the measuring device is realized, and then the product sheet can be directly aligned with the product sheet 22. 22 to measure.
  • the control piece 23 make sure that the projection of the control piece 23 in the vertical direction is aligned with the product piece 22, because the position of the product piece 22 on the measuring device is aligned , the position of the corresponding control piece 23 on the measuring device is also aligned, that is, the alignment of the measurement position of the control piece 23 is achieved through the product piece 22 .
  • control sheet 23 After placing the control sheet 23, the following steps are also included:
  • the control sheet 23 is directly measured.
  • control sheet 23 when the measurement point to be measured on the control sheet 23 corresponds to the product measurement point determined on the product sheet 22, since the control sheet 23 in the vertical direction has been realized The projection is aligned and coincident with the product sheet 22, so the control sheet 23 can be directly measured.
  • control sheet 23 has a plurality of measurement points to be measured, and a plurality of the product measurement points are in one-to-one correspondence with the plurality of measurement points to be measured; after placing the control sheet, also It includes the following steps:
  • a measuring point to be measured as the target measuring point to be measured and select a standard measuring point corresponding to the target measuring point to be measured as the target standard measuring point, so as to be consistent with the target standard measuring point.
  • the alignment mark corresponding to the measurement site is used as a target alignment mark;
  • the target to-be-measured location point is measured according to the target alignment mark.
  • the specific steps of measuring the target to-be-measured measuring point according to the target alignment mark include:
  • the specific step of judging whether the target alignment mark is aligned with a predetermined position includes:
  • Whether the target alignment mark is aligned with a predetermined position is judged by an optical detection method.
  • a first measurement unit 26 and a first stage 27 connected to the first measurement unit 26 may also be provided in the measurement device.
  • the first measurement unit 26 is used for judging whether the target alignment mark is aligned with a predetermined position through an optical detection method.
  • the first stage 27 extends along the vertical direction (ie, the Z-axis direction in FIG. 2 ), and the first measuring unit 26 may extend along the extension direction of the first stage 27 (ie, the Z-axis direction). ) moves, thereby adjusting the distance between the first measuring unit 26 and the product sheet 22, so that a clear alignment mark image can be obtained.
  • the positions of the first stage 27 and the first measuring unit 26 are fixed.
  • the predetermined position is the detection position of the first measurement unit 26 .
  • the product measurement points on the product sheet 22 are in a one-to-one correspondence with the to-be-measured measurement points on the control sheet 23, and the product sheet 22 corresponds to each product on the product sheet 22.
  • the measurement points are all provided with alignment marks corresponding to them. After selecting a to-be-measured point on the control sheet 23 as the target to-be-measured point, according to the correspondence between the to-be-measured point, the standard measurement point and the alignment mark , the target alignment mark corresponding to the target to-be-measured point can be obtained. Afterwards, the first measuring unit 26 recognizes the target alignment marks to correct the positions of the product sheet 22 and the control sheet 23 inside the measuring device.
  • the first measurement unit 25 does not detect the target alignment mark, it is confirmed that the target alignment mark is not aligned with the predetermined position, and the product sheet 22 and the product sheet 22 are moved synchronously.
  • the control sheet 23 until the first measurement unit 25 can detect the complete target alignment mark.
  • control film measurement method also includes the following steps:
  • the product sheet 22 and the control sheet 23 are moved synchronously according to the distance between the target alignment mark and the target standard measurement point, so that The target to-be-measured measuring point is aligned with the measuring component;
  • the target to-be-measured site is measured by the measurement component.
  • the product sheet 22 and the control sheet 23 need to be moved synchronously.
  • control sheet 23 the specific steps of placing the control sheet 23 include:
  • a control piece 23 is fixed above the product piece 22 so that the projection of the control piece 23 in the vertical direction is aligned with the product piece 22 .
  • the specific steps of synchronously moving the product piece 22 and the control piece 23 include:
  • a first carrying structure 20 and a second carrying structure 21 located above the first carrying structure 20 are provided, the first carrying structure 20 is used for carrying and fixing the product sheet 22, and the second carrying structure 21 is used for Bearing and fixing the control sheet 23, the first bearing structure 20 and the second bearing structure 21 are connected to the same moving structure 24;
  • the first carrying structure 20 and the second carrying structure 21 are driven to move synchronously by the moving structure 24 .
  • the measuring device includes a base 30 , and the moving structure 24 is disposed on the base 30 .
  • the first bearing structure 20 is arranged above the moving structure 24
  • the second bearing structure 21 is arranged above the first bearing structure 20
  • the first bearing structure 20 and the second bearing structure 21 are
  • the first bearing structure 20 is connected with the moving structure 24 through the connection structure 29 .
  • the moving structure 24 includes a first driving part 241 and a second driving part 242 .
  • the first driving part 241 is used to drive the first bearing structure 20 to move in a first horizontal direction (eg, the X-axis direction), and at the same time, the connecting structure 29 drives the second bearing structure 21 to move along the first horizontal direction synchronously. A horizontal movement.
  • the second driving part 242 is used to drive the first bearing structure 20 to move along the second horizontal direction (eg, the Y-axis direction), and at the same time, the second bearing structure 21 is driven synchronously along the first bearing structure 21 through the connecting structure 29 .
  • the first horizontal direction is perpendicular to the second horizontal direction.
  • the first bearing structure 20 is arranged below the second bearing structure 21 , and those skilled in the art can also adjust the relationship between the first bearing structure 20 and the second bearing structure 21 according to actual needs.
  • the first bearing structure 20 is arranged above the second bearing structure 21 .
  • the method for calibrating the position of the product piece may be to set a calibration mark on the product piece, and adjust the position of the product piece by identifying the calibration mark.
  • FIG. 2 is a schematic structural diagram of the measuring device in the specific embodiment of the present application.
  • the measuring device provided by this specific embodiment can measure the control sheet by using the method shown in FIG. 1 .
  • the measuring device includes:
  • the first carrying structure 20 is used for carrying and fixing a product sheet 22, the product sheet 22 has a plurality of alignment marks and product measurement points corresponding to the alignment marks respectively;
  • the second carrying structure 21 is used to carry and fix a control piece 23 , and the projection of the control piece 23 on the second carrying structure 21 in the vertical direction is the same as that of the control piece 23 on the first carrying structure 20 .
  • the product pieces 22 are aligned and overlapped;
  • the measuring module is used for measuring the control sheet 23 after the product measuring point is determined according to the alignment mark.
  • control sheet 23 has a plurality of measurement points to be measured, and a plurality of the product measurement points are in one-to-one correspondence with a plurality of the measurement points to be measured;
  • the measurement module is used to determine whether the target alignment mark is aligned with the predetermined position, the target alignment mark is an alignment mark corresponding to a target standard measurement point, and the target standard measurement point is the same as the target standard measurement point.
  • a standard measurement point corresponding to a target measurement point to be measured, the target measurement point to be measured is a to-be-measured measurement point selected by the user.
  • the measurement module includes:
  • the first measuring unit 26 is located above the first bearing structure 20 and is used for judging whether the target alignment mark is aligned with a predetermined position.
  • the measuring device further includes:
  • the measurement module is also used to obtain the distance between each of the standard measurement points and the corresponding alignment mark; after confirming that the target alignment mark is aligned with the predetermined position, the measurement The measurement module is also used to move the product sheet 22 and the control sheet 23 synchronously according to the distance between the target alignment mark and the target standard measurement point, so that the target measurement point to be measured is The metrology assemblies are aligned.
  • the first bearing structure 20 is located below the second bearing structure 21 .
  • the second carrying structure 21 is also used to carry a semiconductor structure, and the semiconductor structure has an identification mark;
  • the second measuring unit 26 is located above the second bearing structure 21 and is used for measuring the control sheet 23 and for judging whether the identification mark is aligned with a predetermined position.
  • the measuring device further includes a second stage 28, the second stage 28 extends along the vertical direction (ie, the Z-axis direction), and the second measuring unit 25 can be along the The second stage 28 moves up and down, so as to adjust the distance between the second measuring unit 25 and the semiconductor structure on the second carrier structure 21 to obtain a clear identification mark image.
  • the identification mark on the semiconductor structure can be directly measured by the second measurement unit 25 The identification is performed to correct the position of the semiconductor structure without the need for correction through the product sheet.
  • the measuring device further includes:
  • the moving structure 24 is located under the first bearing structure 20 and is connected to the first bearing structure 20 for synchronously driving the first bearing structure 20 and the second bearing structure 21 to move.
  • the method for measuring the control sheet and the measuring device provided by this specific embodiment provide a product sheet with an alignment mark, and in the process of measuring the control sheet, by identifying the alignment mark on the product sheet, Determine the measurement point on the control sheet, that is, use the product sheet as the reference frame, so that the position error of the control sheet during the measurement process can be reduced or even eliminated, so that the measurement position accuracy of the control sheet can reach the product level, so as to better monitor the measurement machine itself and process changes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

本申请涉及一种控片量测方法及量测装置。所述控片量测方法包括如下步骤：固定一产品片，所述产品片上具有若干对准标记以及与所述对准标记分别对应的产品量测位点；根据所述对准标记确定所述产品量测位点；放置控片，所述控片在竖直方向上的投影与所述产品片对准重合。本申请可以减少甚至是消除所述控片在测量过程中的位置误差，使得所述控片的量测位置精度可以达到产品级别，从而能够更好的对量测机台本身以及制程变化进行监控。

Description

控片量测方法及量测装置
相关申请引用说明
本申请要求于2021年1月27日递交的中国专利申请号202110108391.9、申请名为“控片量测方法及量测装置”的优先权，其全部内容以引用的形式附录于此。
技术领域
本申请涉及半导体制造技术领域，尤其涉及一种控片量测方法及量测装置。
背景技术
在半导体制程过程中，量测机台用于量测半导体结构中图案的特征尺寸等参数。传统的量测方法是通过机械手臂等传输结构将待量测晶圆产品放置在量测装置上之后，通过量测装置内部的移动单元将所述待量测晶圆移动至量测装置内部的特定量测位置，然后在所述特定量测位置进行量测。
然而，在通过所述移动单元移动所述待量测晶圆时，可能会产生数百微米的误差。为了对误差进行补偿校准，当前采用的方法是在待量测晶圆中定义各种标记图形，通过对标记图形的识别来补偿所述移动单元产生的移动误差，从而确保最终量测点位的准确性。
控片是半导体制程过程中用于监控机台性能的硅片。在采用控片对量测装置的性能进行监控时，机械手臂等传输结构将所述控片传输至量测装置上之后，所述量测装置内部的移动单元直接将所述控片移动至特定量测位置。由于控片表面仅具有单一膜层，而没有任何标识图形，因此，控片移动过程中的移动误差不能通过标识图形进行补偿，而只能依赖于机台自身的稳定性。
因此，如何提高控片在量测装置内部量测位置的精确度，从而更好的对机台及制程进行监控，是当前亟待解决的技术问题。
发明内容
本申请提供一种控片量测方法及量测装置，用于解决现有技术中控片在量测装置内部的量测位置精确度较低的问题，以更好的对机台及制程进行监控。
为了解决上述问题，本申请提供了一种控片量测方法，包括如下步骤：
固定一产品片，所述产品片上具有若干对准标记以及与所述对准标记分别 对应的产品量测位点；
根据所述对准标记确定所述产品量测位点；
放置控片，所述控片在竖直方向上的投影与所述产品片对准重合。
可选的，放置控片之后还包括如下步骤：
直接对所述控片进行量测。
可选的，所述控片上具有多个待测量测位点，多个所述产品量测位点与多个所述待测量测位点一一对应；放置控片之后，还包括如下步骤：
选择一待测量测位点作为目标待测量测位点，并选择与所述目标待测量测位点对应的产品量测位点作为目标产品量测位点，以与所述目标产品量测位点对应的所述对准标记作为目标对准标记；
根据所述目标对准标记对所述目标待测量测位点进行量测。
可选的，根据所述目标对准标记对所述目标待测量测位点进行量测的具体步骤包括：
判断所述目标对准标记是否与预定位置对准，若是，则对所述目标待测量测位点进行量测。
可选的，判断所述目标对准标记是否与预定位置对准的具体步骤包括：
通过光学方法检测所述目标对准标记是否与预定位置对准。
可选的，还包括如下步骤：
判断所述目标对准标记是否与预定位置对准，若否，则同步移动所述产品片和所述控片。
可选的，还包括如下步骤：
提供用于量测所述控片的量测组件；
获取所述产品量测位点和与其对应的所述对准标记之间的间距；
当确认所述目标对准标记与预定位置对准之后，根据所述目标对准标记与所述目标标准量测位点之间的间距同步移动所述产品片和所述控片，使得所述目标待测量测位点与所述量测组件对准；
通过所述量测组件对所述目标待测量测位点进行量测。
可选的，放置控片的具体步骤包括：
于所述产品片上方固定一控片，使得所述控片在竖直方向上的投影与所述 产品片对准重合。
可选的，同步移动所述产品片与所述控片的具体步骤包括：
提供第一承载结构以及位于所述第一承载结构上方的第二承载结构，所述第一承载结构用于承载并固定所述产品片，所述第二承载结构用于承载并固定所述控片，所述第一承载结构和所述第二承载结构连接至同一移动结构；
通过所述移动结构同步驱动所述第一承载结构和所述第二承载结构运动。
为了解决上述问题，本申请还提供了一种量测装置，包括：
第一承载结构，用于承载并固定产品片，所述产品片上具有若干对准标记以及与所述对准标记分别对应的产品量测位点；
第二承载结构，用于承载控片，位于所述第二承载结构上的所述控片在竖直方向上的投影与位于所述第一承载结构上的所述产品片对准重合；
量测模块，用于在根据所述对准标记确定所述产品量测位点之后对所述控片进行量测。
可选的，所述控片上具有多个待测量测位点，多个所述产品量测位点与多个所述待测量测位点一一对应；
所述量测模块还用于判断目标对准标记是否与预定位置对准，所述目标对准标记是与目标标准量测位点对应的对准标记，所述目标标准量测位点是与一目标待测量测位点对应的标准量测位点，所述目标待测量测位点是用户选择的一待测量测位点。
可选的，所述量测模块还用于获取每一所述标准量测位点和与其对应的所述对准标记之间的间距；当确认所述目标对准标记与预定位置对准之后，所述量测模块还用于根据所述目标对准标记与所述目标标准量测位点之间的间距同步移动所述产品片和所述控片，使得所述目标待测量测位点与所述量测组件对准。
可选的，所述量测模块包括：
第一量测单元，位于所述第一承载结构上方，用于对所述产品片进行量测，并用于判断所述目标对准标记是否与预定位置对准。
可选的，所述第一承载结构位于所述第二承载结构下方。
可选的，所述第二承载结构还用于承载半导体结构，所述半导体结构中具 有识别标记；所述量测模块还包括：
第二量测单元，位于所述第二承载结构上方，用于对控片进行量测，并用于判断所述识别标记是否与预定位置对准。
可选的，还包括：
连接结构，位于所述第一承载结构和所述第二承载结构之间，用于连接所述第一承载结构和所述第二承载结构；
移动结构，位于所述第一承载结构下方，且连接所述第一承载结构，用于同步驱动所述第一承载结构和所述第二承载结构运动。
本申请提供的控片量测方法及量测装置，通过提供一个具有对准标记的产品片，在对控片进行量测的过程中，通过识别所述产品片上的对准标记，来确定控片上的量测位点，即以所述产品片作为参考系，从而可以减少甚至是消除所述控片在测量过程中的位置误差，使得所述控片的量测位置精度可以达到产品级别，从而能够更好的对量测机台本身以及制程变化进行监控。
附图说明
附图1是本申请具体实施方式中控片量测方法的流程图；
附图2是本申请具体实施方式中量测装置的结构示意图。
具体实施方式
下面结合附图对本申请提供的控片量测方法及量测装置的具体实施方式做详细说明。
本具体实施方式提供了一种控片量测方法，附图1是本申请具体实施方式中控片量测方法的流程图，附图2是本申请具体实施方式中量测装置的结构示意图，图1中所示的控片量测方法可以应用于图2所示的量测装置中。如图1和图2所示，本具体实施方式提供的控片量测方法，包括如下步骤：
步骤S11，固定一产品片22，所述产品片22上具有若干对准标记以及与所述对准标记分别对应的产品量测位点。
具体来说，所述产品片22作为定位控片位置的参考系，其在定位的过程中，所述产品片22相对于量测装置内部用于承载所述产品片的承载面而言是固定不变的。以图2所示的量测装置为例，所述量测装置中的第一承载结构20用于承载所述产品片22。在采用所述产品片22作为参考系对控片进行定位的 过程中，所述产品片22相对于所述第一承载结构20的位置固定不变。所述第一承载结构20可以是但不限于一卡盘。
所述产品片22上所述对准标记的数量可以为一个，也可以为多个，本领域技术人员可以根据实际需要进行选择，例如根据所述控片上所要量测的待测量测位点的数量。本具体实施方式中所述的多个是指两个及两个以上。所述对准标记的具体形状，本领域技术人员可以根据实际需要进行设置。当所述产品片22上所述对准标记的数量为多个时，多个所述对准标记的形状可以均不相同，以便于识别所述控片上不同的待测量测位点。
步骤S12，根据所述对准标记确定所述产品量测位点。
步骤S13，放置控片23，所述控片23在竖直方向上的投影与所述产品片22对准重合。
所述控片23在竖直方向上的投影与所述产品片22对准重合是指，在固定所述产品片22和所述控片23之后，所述控片23沿竖直方向上的投影与所述产品片22完全重合。仍以图2所示的量测装置为例。所述量测装置中的第二承载结构21用于承载所述控片23。当所述控片23固定于所述第二承载结构21之后，所述控片23沿Z轴方向的投影与位于所述第一承载结构20上的所述产品片22对准重合。通过限定所述控片23与所述产品片22之间的相对位置关系，便于后续能够以所述产品片22作为参考系对所述控片23进行量测。所述第二承载结构21可以是但不限于一卡盘。
具体来说，根据所述对准标记确定所述产品片22上的产品量测位点之后，即实现了所述产品片22在量测装置上的位置对准，接下来可以直接对产品片22进行量测。在放置所述控片23时，确保所述控片23在竖直方向上的投影与所述产品片22对准重合，由于所述产品片22在所述量测装置上的位置是对准的，则相应的所述控片23在所述量测装置上的位置也是对准的，即通过所述产品片22实现了对所述控片23量测位置的对准。
可选的，放置控片23之后，还包括如下步骤：
直接对所述控片23进行量测。
具体来说，当所述控片23上的待测量测位点与所述产品片22上确定的产品量测位点对应时，由于已实现了所述控片23在竖直方向上的投影与所述产 品片22对准重合，因此，可以直接对所述控片23进行量测。
可选的，所述控片23上具有多个待测量测位点，多个所述产品量测位点与多个所述待测量测位点一一对应；放置控片之后，还包括如下步骤：
选择一待测量测位点作为目标待测量测位点，并选择与所述目标待测量测位点对应的标准量测位点作为目标标准量测位点，以与所述目标标准量测位点对应的所述对准标记作为目标对准标记；
根据所述目标对准标记对所述目标待测量测位点进行量测。
可选的，根据所述目标对准标记对所述目标待测量测位点进行量测的具体步骤包括：
判断所述目标对准标记是否与预定位置对准，若是，则对所述目标待测量测位点进行量测。
可选的，判断所述目标对准标记是否与预定位置对准的具体步骤包括：
通过光学检测方法判断所述目标对准标记是否与预定位置对准。
可选的，还包括如下步骤：
判断所述目标对准标记是否与预定位置对准，若否，则同步移动所述产品片22和所述控片23。
具体来说，如图2所示，还可以在所述量测装置中设置第一量测单元26和与所述第一量测单元26连接的第一载物台27。所述第一量测单元26用于通过光学检测方法判断所述目标对准标记是否与预定位置对准。所述第一载物台27沿竖直方向(即图2中的Z轴方向)延伸，所述第一量测单元26可以沿所述第一载物台27的延伸方向(即Z轴方向)移动，从而调整所述第一量测单元26与所述产品片22之间的距离，以便能够获得清晰的对准标记图像。所述第一载物台27和所述第一量测单元26的位置是固定不变的。所述预定位置为所述第一量测单元26的检测位置。
所述产品片22上的所述产品量测位点与所述控片23上的所述待测量测位点是一一对应的关系，且所述产品片22上针对每一个所述产品量测位点，都设置有与其对应的对准标记。当选择所述控片23上的一个待测量测位点作为目标待测量测位点之后，根据待测量测位点、标准量测位点以及对准标记三者之间的对应关系，即可得到与所述目标待测位点对应的目标对准标记。之后， 通过所述第一量测单元26识别所述目标对准标记来校正所述产品片22和所述控片23在所述量测装置内部的位置。举例来说，当所述第一量测单元25未检测到所述目标对准标记时，则确认所述目标对准标记与所述预定位置未对准，则同步移动所述产品片22和所述控片23，直至所述第一量测单元25能够检测到完整的所述目标对准标记。
可选的，所述控片量测方法还包括如下步骤：
提供一用于量测所述控片23的量测组件；
获取每一所述标准量测位点和与其对应的所述对准标记之间的间距；
当确认所述目标对准标记与预定位置对准之后，根据所述目标对准标记与所述目标标准量测位点之间的间距同步移动所述产品片22和所述控片23，使得所述目标待测量测位点与所述量测组件对准；
通过所述量测组件对所述目标待测量测位点进行量测。
具体来说，在通过所述产品片22上的所述对准标记对所述控片23的位置进行矫正之后，为了确保所述控片23移动的方向和距离与所述产品片22移动的方向和距离相同，从而确保所述控片23上目标待测量测位点量测的准确性，需要同步移动所述产品片22和所述控片23。
可选的，放置控片23的具体步骤包括：
于所述产品片22上方固定一控片23，使得所述控片23在竖直方向上的投影与所述产品片22对准重合。
可选的，同步移动所述产品片22与所述控片23的具体步骤包括：
提供第一承载结构20以及位于所述第一承载结构20上方的第二承载结构21，所述第一承载结构20用于承载并固定所述产品片22，所述第二承载结构21用于承载并固定所述控片23，所述第一承载结构20和所述第二承载结构21连接至同一移动结构24；
通过所述移动结构24同步驱动所述第一承载结构20和所述第二承载结构21运动。
举例来说，如图2所示，所述量测装置包括基座30，所述移动结构24设置于所述基座30上。所述第一承载结构20设置于所述移动结构24上方，所述第二承载结构21设置于所述第一承载结构20上方，且所述第一承载结构20 和所述第二承载结构21通过连接结构29连接，所述第一承载结构20与所述移动结构24连接。所述移动结构24包括第一驱动部241和第二驱动部242。所述第一驱动部241用于驱动所述第一承载结构20沿第一水平方向(例如X轴方向)运动，同时通过所述连接结构29带动所述第二承载结构21同步沿所述第一水平方向运动。所述第二驱动部242用于驱动所述第一承载结构20沿第二水平方向(例如Y轴方向)运动，同时通过所述连接结构29带动所述第二承载结构21同步沿所述第二水平方向运动。所述第一水平方向与所述第二水平方向垂直。
本具体实施方式是将所述第一承载结构20设置在所述第二承载结构21下方，本领域技术人员也可以根据实际需要调整所述第一承载结构20和所述第二承载结构21之间的相对位置关系，例如将所述第一承载结构20设置在所述第二承载结构21上方。
当对多片控片进行测量或者对一片控片上的多个待测量测位点进行测量时，为了确保测量结果的准确性以及可比性，作为参考系的所述产品片的位置是固定不变的。但是，当用于承载所述产品片的第一承载结构或者是与所述第一承载结构连接的移动结构因硬件问题而导致更换时，则需要重新对所述产品片的位置进行校准。对所述产品片位置校准的方法可以是在所述产品片上设置校准标记，通过识别所述校准标记来调整所述产品片的位置。
不仅如此，本具体实施方式还提供了一种量测装置，附图2是本申请具体实施方式中量测装置的结构示意图。本具体实施方式提供的量测装置可以采用如图1所示的方法对控片进行量测。如图2所示，所述量测装置，包括：
第一承载结构20，用于承载并固定一产品片22，所述产品片22上具有若干对准标记以及与所述对准标记分别对应的产品量测位点；
第二承载结构21，用于承载并固定一控片23，位于所述第二承载结构21上的所述控片23在竖直方向上的投影与位于所述第一承载结构20上的所述产品片22对准重合；
量测模块，用于在根据所述对准标记确定所述产品量测位点之后对所述控片23进行量测。
可选的，所述控片23上具有多个待测量测位点，多个所述产品量测位点 与多个所述待测量测位点一一对应；
所述量测模块用于判断目标对准标记是否与预定位置对准，所述目标对准标记是与一目标标准量测位点对应的对准标记，所述目标标准量测位点是与一目标待测量测位点对应的标准量测位点，所述目标待测量测位点是用户选择的一待测量测位点。
可选的，所述量测模块包括：
第一量测单元26，位于所述第一承载结构20上方，并用于判断所述目标对准标记是否与预定位置对准。
可选的，所述量测装置还包括：
量测组件，用于量测所述控片23；
所述量测模块还用于获取每一所述标准量测位点和与其对应的所述对准标记之间的间距；当确认所述目标对准标记与预定位置对准之后，所述量测模块还用于根据所述目标对准标记与所述目标标准量测位点之间的间距同步移动所述产品片22和所述控片23，使得所述目标待测量测位点与所述量测组件对准。
可选的，所述第一承载结构20位于所述第二承载结构21下方。
可选的，所述第二承载结构21还用于承载半导体结构，所述半导体结构中具有识别标记；
第二量测单元26，位于所述第二承载结构21上方，用于对所述控片23进行量测，并用于判断所述识别标记是否与预定位置对准。
具体来说，所述量测装置还包括第二载物台28，所述第二载物台28沿竖直方向(即Z轴方向)延伸，所述第二量测单元25可以沿所述第二载物台28上下运动，从而调整所述第二量测单元25与位于所述第二承载结构21上的所述半导体结构之间的距离，以获得清晰的识别标记图像。当对半导体结构(即制程产品)进行量测时，由于所述半导体结构本身具备所述识别标记，因此，可以通过所述第二量测单元25直接对所述半导体结构上的所述识别标记进行识别，从而矫正所述半导体结构的位置，无需通过产品片进行矫正。
可选的，所述量测装置还包括：
连接结构29，位于所述第一承载结构20和所述第二承载结构21之间，用 于连接所述第一承载结构20和所述第二承载结构21；
移动结构24，位于所述第一承载结构20下方，且连接所述第一承载结构20，用于同步驱动所述第一承载结构20和所述第二承载结构21运动。
本具体实施方式提供的控片量测方法及量测装置，通过提供一个具有对准标记的产品片，在对控片进行量测的过程中，通过识别所述产品片上的对准标记，来确定控片上的量测位点，即以所述产品片作为参考系，从而可以减少甚至是消除所述控片在测量过程中的位置误差，使得所述控片的量测位置精度可以达到产品级别，从而能够更好的对量测机台本身以及制程变化进行监控。
以上所述仅是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (16)

  1. 一种控片量测方法，包括：
    固定一产品片，所述产品片上具有若干对准标记以及与所述对准标记分别对应的产品量测位点；
    根据所述对准标记确定所述产品量测位点；
    放置控片，所述控片在竖直方向上的投影与所述产品片对准重合。
  2. 根据权利要求1所述的控片量测方法，其中，放置控片之后还包括如下步骤：
    直接对所述控片进行量测。
  3. 根据权利要求1所述的控片量测方法，其中，所述控片上具有多个待测量测位点，多个所述产品量测位点与多个所述待测量测位点一一对应；放置控片之后，还包括如下步骤：
    选择一待测量测位点作为目标待测量测位点，并选择与所述目标待测量测位点对应的产品量测位点作为目标产品量测位点，以与所述目标产品量测位点对应的所述对准标记作为目标对准标记；
    根据所述目标对准标记对所述目标待测量测位点进行量测。
  4. 根据权利要求3所述的控片量测方法，其中，根据所述目标对准标记对所述目标待测量测位点进行量测的具体步骤包括：
    判断所述目标对准标记是否与预定位置对准，若是，则对所述目标待测量测位点进行量测。
  5. 根据权利要求4所述的控片量测方法，其中，判断所述目标对准标记是否与预定位置对准的具体步骤包括：
    通过光学方法检测所述目标对准标记是否与预定位置对准。
  6. 根据权利要求3所述的控片量测方法，还包括：
    判断所述目标对准标记是否与预定位置对准，若否，则同步移动所述产品片和所述控片。
  7. 根据权利要求6所述的控片量测方法，还包括：
    提供用于量测所述控片的量测组件；
    获取所述产品量测位点和与其对应的所述对准标记之间的间距；
    当确认所述目标对准标记与预定位置对准之后，根据所述目标对准标记与所述目标标准量测位点之间的间距同步移动所述产品片和所述控片，使得所述目标待测量测位点与所述量测组件对准；
    通过所述量测组件对所述目标待测量测位点进行量测。
  8. 根据权利要求7所述的控片量测方法，其中，放置控片的具体步骤包括：
    于所述产品片上方固定一控片，使得所述控片在竖直方向上的投影与所述产品片对准重合。
  9. 根据权利要求8所述的控片量测方法，其中，同步移动所述产品片与所述控片的具体步骤包括：
    提供第一承载结构以及位于所述第一承载结构上方的第二承载结构，所述第一承载结构用于承载并固定所述产品片，所述第二承载结构用于承载并固定所述控片，所述第一承载结构和所述第二承载结构连接至同一移动结构；
    通过所述移动结构同步驱动所述第一承载结构和所述第二承载结构运动。
  10. 一种量测装置，包括：
    第一承载结构，用于承载并固定产品片，所述产品片上具有若干对准标记以及与所述对准标记分别对应的产品量测位点；
    第二承载结构，用于承载控片，位于所述第二承载结构上的所述控片在竖直方向上的投影与位于所述第一承载结构上的所述产品片对准重合；
    量测模块，用于在根据所述对准标记确定所述产品量测位点之后对所述控片进行量测。
  11. 根据权利要求10所述的量测装置，其中，所述控片上具有多个待测量测位点，多个所述产品量测位点与多个所述待测量测位点一一对应；
    所述量测模块还用于判断目标对准标记是否与预定位置对准，所述目标对准标记是与目标标准量测位点对应的对准标记，所述目标标准量测位点是与一目标待测量测位点对应的标准量测位点，所述目标待测量测位点是用户选择的一待测量测位点。
  12. 根据权利要求11所述的量测装置，其中，所述量测模块还用于获取每一所述标准量测位点和与其对应的所述对准标记之间的间距；当确认所述目标对准标记与预定位置对准之后，所述量测模块还用于根据所述目标对准标记与所述目标标准量测位点之间的间距同步移动所述产品片和所述控片，使得所述目标待测量测位点与所述量测组件对准。
  13. 根据权利要求12所述的量测装置，其中，所述量测模块包括：
    第一量测单元，位于所述第一承载结构上方，用于对所述产品片进行量测，并用于判断所述目标对准标记是否与预定位置对准。
  14. 根据权利要求13所述的量测装置，其中，所述第一承载结构位于所述第二承载结构下方。
  15. 根据权利要求14所述的量测装置，其中，所述第二承载结构还用于承载半导体结构，所述半导体结构中具有识别标记；所述量测模块还包括：
    第二量测单元，位于所述第二承载结构上方，用于对控片进行量测，并用于判断所述识别标记是否与预定位置对准。
  16. 根据权利要求10所述的量测装置，还包括：
    连接结构，位于所述第一承载结构和所述第二承载结构之间，用于连接所述第一承载结构和所述第二承载结构；
    移动结构，位于所述第一承载结构下方，且连接所述第一承载结构，用于同步驱动所述第一承载结构和所述第二承载结构运动。
PCT/CN2021/100249 2021-01-27 2021-06-16 控片量测方法及量测装置 WO2022160564A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/598,807 US11862495B2 (en) 2021-01-27 2021-06-16 Monitor wafer measuring method and measuring apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110108391.9 2021-01-27
CN202110108391.9A CN112908898B (zh) 2021-01-27 2021-01-27 控片量测方法及量测装置

Publications (1)

Publication Number Publication Date
WO2022160564A1 true WO2022160564A1 (zh) 2022-08-04

Family

ID=76120535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/100249 WO2022160564A1 (zh) 2021-01-27 2021-06-16 控片量测方法及量测装置

Country Status (3)

Country Link
US (1) US11862495B2 (zh)
CN (1) CN112908898B (zh)
WO (1) WO2022160564A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112908898B (zh) 2021-01-27 2022-09-02 长鑫存储技术有限公司 控片量测方法及量测装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102721873A (zh) * 2012-06-07 2012-10-10 京东方科技集团股份有限公司 多晶硅阵列基板上多晶硅薄膜电阻的测试方法
CN105244305A (zh) * 2009-09-22 2016-01-13 Ev集团E·索尔纳有限责任公司 用于对准两个衬底的设备
US20180114712A1 (en) * 2015-12-30 2018-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Control wafer making device
CN111933541A (zh) * 2020-08-10 2020-11-13 北京北方华创微电子装备有限公司 一种半导体设备中晶片的处理方法和***
CN112908898A (zh) * 2021-01-27 2021-06-04 长鑫存储技术有限公司 控片量测方法及量测装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650714B2 (ja) * 1986-07-17 1994-06-29 キヤノン株式会社 露光方法
JPH03155114A (ja) * 1989-11-13 1991-07-03 Sharp Corp 縮小投影露光装置の位置合わせ方法
JP3768761B2 (ja) * 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
JP2002246445A (ja) * 2001-02-16 2002-08-30 Hitachi Kokusai Electric Inc 基板処理装置
US7417748B2 (en) * 2005-04-28 2008-08-26 Corning Incorporated Method and apparatus for measuring dimensional changes in transparent substrates
WO2011101187A1 (en) * 2010-02-19 2011-08-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP6025346B2 (ja) * 2012-03-05 2016-11-16 キヤノン株式会社 検出装置、露光装置及びデバイスを製造する方法
CN104900553B (zh) 2014-03-07 2018-05-01 中芯国际集成电路制造(上海)有限公司 晶圆缺陷检测方法
NL2016925A (en) * 2015-06-18 2016-12-22 Asml Netherlands Bv Method of metrology, inspection apparatus, lithographic system and device manufacturing method
TWI629475B (zh) * 2017-04-18 2018-07-11 財團法人工業技術研究院 非接觸式雙平面定位方法與裝置
CN108132558B (zh) * 2018-01-26 2020-08-25 福州京东方光电科技有限公司 对位检测方法及显示装置
CN110767590A (zh) * 2019-10-31 2020-02-07 长春长光圆辰微电子技术有限公司 一种用硅片凹口对准键合两片硅片的方法
CN111240057B (zh) * 2020-02-24 2022-04-26 惠州市华星光电技术有限公司 一种误差补偿设备及误差补偿方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105244305A (zh) * 2009-09-22 2016-01-13 Ev集团E·索尔纳有限责任公司 用于对准两个衬底的设备
CN102721873A (zh) * 2012-06-07 2012-10-10 京东方科技集团股份有限公司 多晶硅阵列基板上多晶硅薄膜电阻的测试方法
US20180114712A1 (en) * 2015-12-30 2018-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Control wafer making device
CN111933541A (zh) * 2020-08-10 2020-11-13 北京北方华创微电子装备有限公司 一种半导体设备中晶片的处理方法和***
CN112908898A (zh) * 2021-01-27 2021-06-04 长鑫存储技术有限公司 控片量测方法及量测装置

Also Published As

Publication number Publication date
US11862495B2 (en) 2024-01-02
CN112908898B (zh) 2022-09-02
CN112908898A (zh) 2021-06-04
US20220406636A1 (en) 2022-12-22

Similar Documents

Publication Publication Date Title
US8159653B2 (en) Substrate position detection apparatus, and method of adjusting a position of an imaging component of the same
US9299599B2 (en) Thermal processing apparatus for thermal processing substrate and positioning method of positioning substrate transfer position
WO2018059358A1 (zh) 一种光学测量装置和方法
US20170148759A1 (en) Bonding apparatus and bonding method
JP5562424B2 (ja) ２つの基板を位置合わせするための装置
TWI433256B (zh) 定位工具之ｘ-ｙ定位的校準方法及具有這種定位工具的裝置
JP6794536B2 (ja) 光学式測定装置及び方法
KR20000011366A (ko) 본딩방법및그장치
JP2002050560A (ja) ステージ装置、計測装置及び計測方法、露光装置及び露光方法
WO2022160564A1 (zh) 控片量测方法及量测装置
JP2005101455A (ja) 位置決め装置
JPH098104A (ja) チップボンディング装置におけるキャリブレーション方法
JP2009054962A (ja) 位置決め検出装置
JPH09306802A (ja) 投影露光装置
JPH09266164A (ja) 位置合わせ方法および装置
KR20190005568A (ko) 센서 퓨전에 의한 웨이퍼 로봇 위치 교정용 시스템
JP2016096228A (ja) リソグラフィ装置、リソグラフィ方法、および物品製造方法
JPH04298057A (ja) プロービング装置及び方法
KR20080061836A (ko) 노광장치의 포커스 얼라인먼트 방법 및 장치
JPH11204418A (ja) 露光装置、露光方法およびデバイス製造方法
KR20070073013A (ko) 수평 감지용 센서의 위치 조정장치 및 그 조정 방법
JPH09275060A (ja) 位置決め方法および露光装置
JP2017181935A (ja) 露光装置、ステージ較正システム、ステージ較正方法、および較正治具
KR20060093152A (ko) 반도체 제조공정에 사용되는 광학 계측설비
JPH0445598A (ja) 電子部品実装方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21922162

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21922162

Country of ref document: EP

Kind code of ref document: A1