WO2022154102A1 - Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé - Google Patents
Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé Download PDFInfo
- Publication number
- WO2022154102A1 WO2022154102A1 PCT/JP2022/001216 JP2022001216W WO2022154102A1 WO 2022154102 A1 WO2022154102 A1 WO 2022154102A1 JP 2022001216 W JP2022001216 W JP 2022001216W WO 2022154102 A1 WO2022154102 A1 WO 2022154102A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- treated
- layer
- treatment layer
- base material
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 190
- 239000011889 copper foil Substances 0.000 title claims abstract description 175
- 239000010410 layer Substances 0.000 claims description 142
- 239000000463 material Substances 0.000 claims description 72
- 239000011347 resin Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 63
- 239000002335 surface treatment layer Substances 0.000 claims description 46
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 21
- 229910052721 tungsten Inorganic materials 0.000 claims description 21
- 239000010937 tungsten Substances 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 6
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 description 55
- 238000007747 plating Methods 0.000 description 51
- 239000000243 solution Substances 0.000 description 51
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 39
- 238000009713 electroplating Methods 0.000 description 30
- 238000000034 method Methods 0.000 description 27
- 239000010949 copper Substances 0.000 description 23
- 239000000203 mixture Substances 0.000 description 22
- 238000007788 roughening Methods 0.000 description 18
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 17
- 230000008878 coupling Effects 0.000 description 17
- 238000010168 coupling process Methods 0.000 description 17
- 238000005859 coupling reaction Methods 0.000 description 17
- 229910000077 silane Inorganic materials 0.000 description 17
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000006087 Silane Coupling Agent Substances 0.000 description 14
- 238000009826 distribution Methods 0.000 description 14
- 238000005259 measurement Methods 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 239000011701 zinc Substances 0.000 description 13
- 239000007788 liquid Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 229910018605 Ni—Zn Inorganic materials 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000011651 chromium Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 150000003658 tungsten compounds Chemical class 0.000 description 6
- 208000012868 Overgrowth Diseases 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000002500 effect on skin Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- QWMFKVNJIYNWII-UHFFFAOYSA-N 5-bromo-2-(2,5-dimethylpyrrol-1-yl)pyridine Chemical compound CC1=CC=C(C)N1C1=CC=C(Br)C=N1 QWMFKVNJIYNWII-UHFFFAOYSA-N 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010731 rolling oil Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- -1 that is Substances 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Definitions
- the present inventors have found that Sk of the surface-treated layer is involved in the adhesiveness with the resin substrate. rice field. From the viewpoint of stably obtaining the adhesive force to the resin base material, the Sku of the surface treatment layer is preferably 2.80 to 4.00, and more preferably 2.90 to 3.75. The Sk of the surface treatment layer is measured in accordance with ISO 25178-2: 2012.
- the lower limit value of Sq of the surface treatment layer is preferably 0.29 ⁇ m, more preferably 0.30 ⁇ m, still more preferably 0.34 ⁇ m, and the upper limit value is preferably 0. It is .48 ⁇ m, more preferably 0.43 ⁇ m.
- the surface treatment layer has a Sa of 0.20 to 0.32 ⁇ m and an Sq of 0.26 to 0. It is preferably .40 ⁇ m.
- the copper-clad laminate according to the embodiment of the present invention includes the above-mentioned surface-treated copper foil and a resin base material adhered to the surface-treated layer of the surface-treated copper foil.
- This copper-clad laminate can be manufactured by adhering a resin base material to the surface-treated layer of the above-mentioned surface-treated copper foil.
- the resin base material is not particularly limited, and those known in the art can be used. Examples of resin base materials include paper base material phenol resin, paper base material epoxy resin, synthetic fiber cloth base material epoxy resin, glass cloth / paper composite base material epoxy resin, glass cloth / glass non-woven composite base material epoxy resin, and glass. Examples thereof include cloth-based epoxy resin, polyester film, polyimide resin, liquid crystal polymer, and fluororesin. Among these, the resin base material is preferably a polyimide resin.
- Chromate-treated layer ⁇ Conditions for forming electrolytic chromate-treated layer> Chromate solution composition: 3 g / L K 2 Cr 2 O 7 , 0.33 g / L Zn Chromate solution pH: 3.7 Chromate liquid temperature: 55 ° C Electrolysis conditions: Current density 1.4 A / dm 2 , Time 0.7 seconds Chromate treatment count: 2 times
- Example 3 A surface-treated copper foil was obtained under the same conditions as in Example 1 except that the amount of tungsten in the plating solution composition was changed to 3 ppm under the conditions for forming the roughened particles.
- Roughening treatment layer ⁇ Conditions for forming roughened particles> Plating solution composition: 12 g / L Cu, 50 g / L sulfuric acid, 5 ppm tungsten (derived from sodium tungstate dihydrate) Plating liquid temperature: 27 ° C Electroplating conditions: Current density 48.3A / dm 2 , Time 0.81 seconds Number of electroplating processes: 2 times
- Example 1 The rolled copper foil (copper foil without surface treatment) used in Example 1 was used as a comparison.
- the surface-treated copper foils of Examples 1 to 10 Comparing the surface-treated copper foils of Examples 1 to 10 with the copper foils of Comparative Example 1, it can be seen that Str is a very close value.
- the surface-treated copper foils of Examples 1 to 10 have already been described in view of the fact that the copper foil of Comparative Example 1 is surface-treated and that Str exhibits surface anisotropy and isotropic properties.
- the surface-treated layer particularly the roughened particle layer, is uniformly formed along the minute uneven portion (oil pit in the case of rolled copper foil) on the surface of the copper foil. You can see that it has been done. If the roughened particle layer is not formed along the minute uneven portion, the Str value should be significantly different before and after the surface treatment.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Une feuille de cuivre traitée en surface comprend une feuille de cuivre et une couche de traitement de surface formée sur au moins une surface de la feuille de cuivre. La couche de traitement de surface présente un Sku de 2,50 à 4,50 et un Str de 0,20 à 0,40.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022575656A JPWO2022154102A1 (fr) | 2021-01-15 | 2022-01-14 | |
| KR1020237019472A KR20230104700A (ko) | 2021-01-15 | 2022-01-14 | 표면 처리 구리박, 동장 적층판 및 프린트 배선판 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021005362 | 2021-01-15 | ||
| JP2021-005362 | 2021-01-15 | ||
| JPPCT/JP2021/026045 | 2021-07-09 | ||
| PCT/JP2021/026045 WO2022153580A1 (fr) | 2021-01-15 | 2021-07-09 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022154102A1 true WO2022154102A1 (fr) | 2022-07-21 |
Family
ID=82447065
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/026045 WO2022153580A1 (fr) | 2021-01-15 | 2021-07-09 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
| PCT/JP2022/001216 WO2022154102A1 (fr) | 2021-01-15 | 2022-01-14 | Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/026045 WO2022153580A1 (fr) | 2021-01-15 | 2021-07-09 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022154102A1 (fr) |
| KR (1) | KR20230104700A (fr) |
| TW (1) | TW202229651A (fr) |
| WO (2) | WO2022153580A1 (fr) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169169A (ja) * | 1992-11-19 | 1994-06-14 | Nikko Guurudo Foil Kk | 印刷回路用銅箔及びその製造方法 |
| WO2010110092A1 (fr) * | 2009-03-27 | 2010-09-30 | 日鉱金属株式会社 | Feuille de cuivre pour carte de circuit imprimé et son procédé de production |
| WO2013047272A1 (fr) * | 2011-09-30 | 2013-04-04 | Jx日鉱日石金属株式会社 | Feuille de cuivre excellente en ce qui concerne l'adhésion avec une résine, son procédé de fabrication et plaque à circuits imprimés ou matière d'électrode négative de batterie utilisant une feuille de cuivre électrolytique |
| WO2014081041A1 (fr) * | 2012-11-26 | 2014-05-30 | Jx日鉱日石金属株式会社 | Feuille de cuivre électrolytique traitée en surface, stratifié et carte de circuit imprimé |
| JP2014139336A (ja) * | 2012-09-11 | 2014-07-31 | Jx Nippon Mining & Metals Corp | キャリア付き銅箔 |
| WO2018110579A1 (fr) * | 2016-12-14 | 2018-06-21 | 古河電気工業株式会社 | Feuille de cuivre traitée en surface et stratifié cuivré |
| WO2018207786A1 (fr) * | 2017-05-09 | 2018-11-15 | Ｊｘ金属株式会社 | Feuille de cuivre électrolytique, stratifié cuivré, carte de circuit imprimé, leurs procédés de production, dispositif électronique et son procédé de production |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012112009A (ja) | 2010-11-26 | 2012-06-14 | Hitachi Cable Ltd | 銅箔、及び銅箔の製造方法 |
| EP2651656B1 (fr) * | 2010-12-14 | 2017-04-26 | 3M Innovative Properties Company | Images et procédé de fabrication associé |
| TWI697574B (zh) * | 2019-11-27 | 2020-07-01 | 長春石油化學股份有限公司 | 電解銅箔、電極及包含其之鋰離子電池 |
| KR20220106200A (ko) * | 2020-02-04 | 2022-07-28 | 미쓰이금속광업주식회사 | 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판 |
-
2021
- 2021-07-09 WO PCT/JP2021/026045 patent/WO2022153580A1/fr active Application Filing
-
2022
- 2022-01-14 TW TW111101709A patent/TW202229651A/zh unknown
- 2022-01-14 WO PCT/JP2022/001216 patent/WO2022154102A1/fr active Application Filing
- 2022-01-14 KR KR1020237019472A patent/KR20230104700A/ko unknown
- 2022-01-14 JP JP2022575656A patent/JPWO2022154102A1/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169169A (ja) * | 1992-11-19 | 1994-06-14 | Nikko Guurudo Foil Kk | 印刷回路用銅箔及びその製造方法 |
| WO2010110092A1 (fr) * | 2009-03-27 | 2010-09-30 | 日鉱金属株式会社 | Feuille de cuivre pour carte de circuit imprimé et son procédé de production |
| WO2013047272A1 (fr) * | 2011-09-30 | 2013-04-04 | Jx日鉱日石金属株式会社 | Feuille de cuivre excellente en ce qui concerne l'adhésion avec une résine, son procédé de fabrication et plaque à circuits imprimés ou matière d'électrode négative de batterie utilisant une feuille de cuivre électrolytique |
| JP2014139336A (ja) * | 2012-09-11 | 2014-07-31 | Jx Nippon Mining & Metals Corp | キャリア付き銅箔 |
| WO2014081041A1 (fr) * | 2012-11-26 | 2014-05-30 | Jx日鉱日石金属株式会社 | Feuille de cuivre électrolytique traitée en surface, stratifié et carte de circuit imprimé |
| WO2018110579A1 (fr) * | 2016-12-14 | 2018-06-21 | 古河電気工業株式会社 | Feuille de cuivre traitée en surface et stratifié cuivré |
| WO2018207786A1 (fr) * | 2017-05-09 | 2018-11-15 | Ｊｘ金属株式会社 | Feuille de cuivre électrolytique, stratifié cuivré, carte de circuit imprimé, leurs procédés de production, dispositif électronique et son procédé de production |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230104700A (ko) | 2023-07-10 |
| JPWO2022154102A1 (fr) | 2022-07-21 |
| WO2022153580A1 (fr) | 2022-07-21 |
| TW202229651A (zh) | 2022-08-01 |
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