WO2022134846A1 - Metal-coated silver screen and preparation method therefor - Google Patents

Metal-coated silver screen and preparation method therefor Download PDF

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Publication number
WO2022134846A1
WO2022134846A1 PCT/CN2021/127065 CN2021127065W WO2022134846A1 WO 2022134846 A1 WO2022134846 A1 WO 2022134846A1 CN 2021127065 W CN2021127065 W CN 2021127065W WO 2022134846 A1 WO2022134846 A1 WO 2022134846A1
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Prior art keywords
layer
metal
metal screen
base layer
dielectric layer
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PCT/CN2021/127065
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French (fr)
Chinese (zh)
Inventor
陆嘉伟
薛九枝
樊杰
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江苏集萃智能液晶科技有限公司
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Publication of WO2022134846A1 publication Critical patent/WO2022134846A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/54—Accessories
    • G03B21/56—Projection screens
    • G03B21/60—Projection screens characterised by the nature of the surface

Definitions

  • the invention relates to a projection screen, in particular to a metal screen and a preparation method thereof.
  • the commonly used screens mainly include diffuse reflection screens, such as cloth screens, plastic screens and screens coated with matte paint, zinc oxide and other coatings on their surfaces. Such screens are usually not affected by viewing angles, but their The brightness is low, which affects the viewing effect; at present, metal screens are used more, and usually a layer of metal powder that can reflect light, such as aluminum powder, is coated on the base surface of the screen. This type of screen has a high reflectivity, and the brightness gain is sufficient to meet the normal viewing needs.
  • metal screens can avoid the interference of ghost images, and the viewing effect is more shocking.
  • the screen surface is usually denser, and it is not easy to pass through the sound, which affects the quality of the surround sound.
  • Punch holes on metal screens are to first prepare the base layer and metal layer, and then punch holes on the metal screen, but the metal is easily oxidized by the influence of ambient temperature and humidity.
  • a protective layer is added on the top, but after adding the protective layer, the metal layer will be easily exposed. As shown in the preparation process shown in Figure 1, once the exposed metal is oxidized, the screen cannot guarantee the normal viewing effect. would be a huge loss.
  • the main purpose of the present invention is to provide a metal screen, which is prepared by adjusting the punching process, which effectively improves the problem of bare metal and increases the service life of the metal screen.
  • the present application provides a metal screen
  • the metal screen includes a base layer, a metal layer located on the base layer, a first dielectric layer covering the metal layer, and a through hole formed after perforation.
  • the holes in the base layer, the metal layer and the first dielectric layer, the holes are formed by directly punching holes on the base layer before depositing the metal layer and the first dielectric layer on the base layer in sequence , so that the metal layer at the cross section of the hole is covered by the first dielectric layer.
  • the diameter of the holes ranges from 200 ⁇ m to 600 ⁇ m.
  • the spacing between the holes is 1000 ⁇ m ⁇ 1500 ⁇ m.
  • the metal layer is at least one of gold, silver, aluminum, and copper.
  • the thickness of the metal layer is 20 nm ⁇ 200 nm.
  • the metal screen further includes a second dielectric layer located between the upper surface of the base layer and the lower surface of the metal layer.
  • the first dielectric layer and/or the second dielectric layer is at least one of silicon dioxide, titanium dioxide, and silicon nitride.
  • the thickness of the first dielectric layer and/or the second dielectric layer is 5 nm ⁇ 50 nm.
  • the deposition method of the metal layer and/or the first dielectric layer and/or the second dielectric layer is evaporation coating or sputtering coating.
  • the base layer has a lower surface of the base layer and an upper surface of the base layer opposite to the lower surface of the base layer, and the lower surface of the base layer may be a flat surface or an uneven surface with microstructures or other structures surface, the upper surface of the base layer is an uneven microstructured surface, the metal layer has a lower surface of the metal layer and an upper surface of the metal layer, the metal layer is substantially conformal to the upper surface of the base layer, so that the metal layer The upper surface of the layer forms a microstructured surface substantially conforming to the upper surface of the base layer.
  • the included angle ⁇ between any point tangent on the upper surface of the metal layer and a plane parallel to the lower surface of the base layer is controlled to vary randomly between 0 degrees and +/-30 degrees.
  • any region with a dimension greater than 1 mm along the direction parallel to the lower surface of the base layer, the structure of the upper surface of the metal layer is composed of at least two wave crests and at least two wave troughs, and the wave crest and wave trough Has a random structure and is basically non-repetitive.
  • the probability of occurrence of an included angle ⁇ between a tangent at any point on the upper surface of the metal layer and a plane parallel to the lower surface of the base layer varies continuously with the angle.
  • the probability of occurrence of the included angle ⁇ at 0 degrees is the largest, and the probability of occurrence of the included angle ⁇ decreases continuously as the absolute value of the angle increases.
  • the ratio of the maximum value to the minimum value of the occurrence probability of the included angle ⁇ is less than 10:1.
  • the ratio of the maximum value to the minimum value of the occurrence probability of the included angle ⁇ is less than 2:1.
  • the cross section of the uneven microstructured surface is an arc structure or a wavy structure.
  • the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer is not greater than 0.5 mm.
  • the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer is not greater than 0.05 mm.
  • the height difference between the wave crest and the wave trough on the upper surface of the metal layer is not greater than 100 ⁇ m.
  • the height difference between the wave crest and the wave trough on the upper surface of the metal layer is not greater than 10 ⁇ m.
  • the base layer is a polyester material.
  • the polyester material is at least one of PVC, PET, and PC.
  • the preparation method of the microstructured surface is transfer printing.
  • the transfer printing is any one of thermal transfer printing and UV transfer printing.
  • the fabrication process for preparing the microstructure of the microstructured surface is any one of embossing, surface cutting, surface etching, and sandblasting.
  • the metal screen further includes a cover layer.
  • the present application also provides a method for preparing a metal screen.
  • the preparation method is applied to the above-mentioned metal screen, and includes the following steps: first, preparing a base layer; The holes form holes; thirdly, coating the base layer after drilling: depositing a metal layer and a first dielectric layer on the upper surface of the base layer in sequence; finally, making a cover layer on the surface of the first dielectric layer.
  • a second dielectric layer is deposited on the upper surface of the base layer.
  • the beneficial effect of the present invention is to provide a metal screen
  • the metal screen includes a base layer, a metal layer located on the base layer, a first dielectric layer covering the metal layer, and a through hole formed after drilling.
  • the holes of the base layer, the metal layer and the first dielectric layer, the holes are formed by directly punching holes on the base layer before depositing the metal layer and the first dielectric layer on the base layer in sequence , so that the metal layer at the cross section of the hole is covered by the first dielectric layer.
  • the present application also provides a method for preparing a metal screen.
  • the punching sequence in the manufacturing process By adjusting the punching sequence in the manufacturing process, first punching holes on the base layer, and then depositing a metal layer and a first dielectric layer on the base layer in sequence, it is beneficial to make holes in the base layer.
  • the metal layer at the cross-section of the hole is covered by the first dielectric layer, which plays an all-round protective effect on the metal layer, prevents oxidation caused by the screen being exposed to the air for a long time during use, and effectively improves the service life of the metal screen.
  • FIG. 1 is a schematic diagram of the production process flow of a traditional metal screen for first coating and then punching
  • FIG. 2 is a schematic structural diagram of an embodiment of a metal screen
  • FIG 3 is a schematic diagram of reflected light from a flat surface (A) and a rough surface (B);
  • FIG. 4 is a schematic diagram of incident light and reflected light on an arc
  • FIG. 5 is a schematic diagram of the angle of reflected light rays at different depths of arcs on the microstructured surface
  • FIG. 6 is a schematic diagram of the reflected light intensity distribution (A) and the morphology probability distribution (B) of the microstructure;
  • FIG. 9 is a schematic cross-sectional structure diagram of an embodiment structure of a metal screen
  • FIG. 10 is a schematic diagram of the manufacturing process flow of the metal screen for first punching and then coating
  • 11 is a schematic view of the structure of the inner section of the metal screen prepared by first coating and then punching and first punching and then coating;
  • FIG. 12 is an enlarged schematic view of the structure of the inner section of the hole of the metal screen prepared by the process flow of punching first and then coating;
  • FIG. 13 is a schematic diagram of the structure of a metal screen without a dielectric layer deposited
  • 01 base layer; 02, metal layer; 03, dielectric layer; 04, hole; 05, cover layer; 06, first dielectric layer; 07, second dielectric layer; 08, hole cross section; 001, incident light; 002, flat surface; 003, reflected light; 004, rough surface; 005, arc; 006, arc tangent; 007, included angle; 011, first arc; 012, second arc; 013, lower surface of base layer 014, the upper surface of the base layer; 021, the lower surface of the metal layer; 022, the upper surface of the metal layer.
  • the present application provides a metal screen, as shown in FIG. A dielectric layer 06 and holes 04 formed after punching through the base layer 01 , the metal layer 02 and the first dielectric layer 06 , the holes 04 are formed by depositing the metal on the base layer 01 in sequence
  • the layer 02 and the first dielectric layer 06 are formed by directly punching holes on the base layer 01 before, so that the metal layer 02 at the cross section of the hole 04 is covered by the first dielectric layer 06 .
  • the diameter of the holes 04 is 200 ⁇ m ⁇ 600 ⁇ m.
  • the diameters of the holes 04 can be, but not limited to, 200 ⁇ m, 400 ⁇ m, and 600 ⁇ m; the spacing between the holes 04 It is 1000 ⁇ m ⁇ 1500 ⁇ m. As a further preferred embodiment, the spacing between the holes 04 can be, but not limited to, 1000 ⁇ m, 1250 ⁇ m, and 1500 ⁇ m.
  • the deposition method of the metal layer 02 and/or the first dielectric layer 06 may be, but not limited to, evaporation coating or sputtering coating.
  • the metal layer 02 may be, but not limited to, at least one of gold, silver, aluminum, copper, and the like.
  • the thickness of the metal layer 02 is 20 nm ⁇ 200 nm.
  • the metal screen further includes a second dielectric layer 07 located between the upper surface 014 of the base layer and the lower surface 021 of the metal layer.
  • the first dielectric layer and /or the second dielectric layer 07 may be, but not limited to, at least one of silicon dioxide, titanium dioxide, silicon nitride, etc., and may also be one or more of other oxides and nitrides.
  • the deposition method of the second dielectric layer 07 may be, but not limited to, evaporation coating or sputtering coating.
  • the first dielectric layer 06 and the second dielectric layer 07 are collectively referred to as a dielectric layer 03 , and the first dielectric layer 06 and/or the second dielectric layer
  • the thickness of the layer 07 is 5 nm to 50 nm.
  • the dielectric deposition on both sides of the metal layer 02 is to prevent oxidation caused by the screen being exposed to the air for a long time during use, and to protect the metal in an all-round way.
  • the second dielectric layer 07 can also increase the metal Adhesion between layer 02 and said base layer 01 .
  • the base layer 01 has a base layer lower surface 013 and a base layer upper surface 014 opposite to the base layer lower surface 013, the base layer lower surface 013 is a flat surface, and the base layer upper surface 014 014 is an uneven microstructured surface,
  • the metal layer 02 has a metal layer lower surface 021 and a metal layer upper surface 022, the metal layer 02 is substantially conformal to the base layer upper surface 014, so that the metal layer The upper surface 022 forms a microstructured surface substantially conforming to the upper surface 014 of the base layer.
  • the included angle ⁇ 007 between the tangent of any point on the upper surface 022 of the metal layer and the plane parallel to the lower surface 013 of the base layer is controlled to vary randomly between 0 degrees and +/-30 degrees.
  • any region whose size is greater than 1 mm along the direction parallel to the lower surface 013 of the base layer, the structure of the upper surface 022 of the metal layer is composed of at least two wave crests and at least two wave troughs, and the wave crests The trough has a random structure and is basically not repetitive.
  • the theoretical basis for the design of the uneven microstructured surface on the upper surface 014 of the base layer is as follows: As shown in FIG. direction out; when a beam of incident light 001 hits a rough surface, the direction of its reflection is related to the microstructure of the surface.
  • this microstructure exists in the form of an arc 005 or an approximate arc 005, as shown in Figure 4, we take the incident light 001 incident on the arc 005 as the arc radial line to make the arc tangent 006, we can find that The reflection direction of the reflected light 003 is closely related to the tangent.
  • the angle ⁇ of the reflected light is related to the angle ⁇ .
  • the angle of reflection ⁇ refers to the angle between the reflected light and the interface normal.
  • a scattering unit contains the range of x from -1 to 1.
  • dy/dx In order to make the reflected light intensity of ⁇ around 0° have better concentration, we need the value of dy/dx to be relatively large around 0°, and the value of d 2 y/dx 2 to be relatively small around 0°.
  • the incident light 001 is not incident from a single direction, there will be a probability distribution of the reflection angle after the incident light hits the microstructured surface, and this probability distribution is related to the size of the arc 005 on the microstructured surface.
  • the circles forming the arc 005 are of the same size, so the factor affecting the reflection angle is the depth of the arc 005.
  • the microstructure of the microstructured surface above the base layer shown here needs to obey a certain probability distribution. From a certain known reflected light intensity distribution, we can deduce the topography distribution of the microstructured surface microstructure, as shown in Fig. 6,
  • the tilt angle is ⁇ j .
  • the commonly used parameters for evaluating screen performance are: total reflectivity, viewing angle, brightness gain, and polarization contrast.
  • the total reflectivity can be reflected in the viewing angle and brightness gain.
  • the higher the brightness gain the narrower the viewing angle; otherwise, the larger the viewing angle.
  • the higher the polarization contrast the better the viewing effect.
  • a high polarization-maintaining metal screen with uneven microstructured surface can be prepared with a total reflectivity of more than 95% and a vertical polarization contrast ratio greater than 1000:1 or at most greater than 2000:1.
  • the polarization contrast ratio of the high polarization-maintaining metal screen can reach 200:1, effectively eliminating the problem of ghosting in 3D movies; in addition, we can adjust the microstructured surface, Control the final viewing angle and gain, the gain can be adjusted between 1.3-3.5, and the viewing angle can also be controlled from ⁇ 20° to ⁇ 50°.
  • the large viewing angle range can meet the needs of large theaters, bringing more audience.
  • the probability of occurrence of the included angle ⁇ 007 between the tangent of any point on the upper surface 022 of the metal layer and the plane parallel to the lower surface 013 of the base layer varies continuously with the angle of the included angle ⁇ .
  • the probability of occurrence of the included angle ⁇ 007 at 0 degrees is the largest, and the probability of occurrence of the included angle ⁇ 007 decreases continuously as the absolute value of the angle increases.
  • the ratio of the maximum value to the minimum value of the occurrence probability of the included angle ⁇ 007 is less than 10:1.
  • the ratio of the maximum value to the minimum value of the occurrence probability of the included angle ⁇ 007 is less than 2:1.
  • the cross section of the uneven microstructured surface is an arc structure or a wavy structure.
  • the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer 02 is not greater than 0.5 mm; as a further preferred embodiment, the metal layer 02 The characteristic length L between adjacent wave crests or adjacent wave troughs is not greater than 0.05mm.
  • the height difference between the peaks and valleys of the upper surface 022 of the metal layer is not greater than 100 ⁇ m.
  • the height difference between the peaks and valleys of the upper surface 022 of the metal layer is not greater than 10 ⁇ m.
  • the base layer 01 is a polyester material; as a further preferred embodiment, the polyester material can be, but not limited to, at least one of PVC, PET, PC, and the like.
  • the microstructured surface can be prepared by, but not limited to, transfer printing.
  • the transfer can be, but not limited to, any one of thermal transfer and UV transfer.
  • the fabrication process for preparing the microstructure of the microstructured surface may be, but not limited to, any one of imprinting, surface cutting, surface etching, and sandblasting.
  • the metal screen further includes a cover layer 05, and the cover layer 05 mainly plays a protective role to prevent damage to the film surface during transportation, splicing, and hanging.
  • the preparation method is applied to the above-mentioned metal screen.
  • the preparation method It includes the following steps: firstly, preparing the base layer 01; secondly, performing laser drilling on the fabricated base layer 01 to form holes 04; thirdly, coating the punched base layer 01: depositing a metal layer 02 on the upper surface 014 of the base layer, and then on A first dielectric layer 06 is deposited on the metal layer 02 ; finally, a cover layer 05 is formed on the surface of the first dielectric layer 06 .
  • a second dielectric layer 07 is deposited on the upper surface of the base layer 01 before depositing the metal layer 02 .
  • the base layer may be a base layer 01 with a microstructured surface.
  • the present application also provides experimental data for verification.
  • the specific experimental data and performance comparison are analyzed as follows.
  • an uneven microstructured surface is formed on the surface of the polyester film by UV transfer, and the polyester film with the microstructured surface is the base layer 01;
  • secondly perform laser drilling on the fabricated base layer 01 to form holes 04, the hole diameter of the holes 04 is 200 ⁇ m, and the hole spacing of the holes 04 is 1250 ⁇ m; again, the base layer 01 after punching is coated: first on the base layer 01 A dielectric layer, namely the first dielectric layer 06, is uniformly deposited on the surface by sputtering.
  • the first dielectric layer 06 is at least one of silicon dioxide, titanium dioxide and silicon nitride.
  • the first dielectric layer 06 The thickness of the metal layer 02 is 5 nm to 50 nm; then the metal layer 02 is deposited on the first dielectric layer 06, the metal layer 02 is any one of gold, silver, and aluminum, and the thickness of the metal layer 02 is 20nm to 200nm; and then deposit a dielectric layer on the metal layer 02 level, that is, the second dielectric layer 07, the second dielectric layer 07 is at least one of silicon dioxide, titanium dioxide, silicon nitride, the first dielectric layer 07
  • the thickness of the second dielectric layer 07 is basically the same as the thickness of the first dielectric layer 06, and the thickness of the second dielectric layer 07 is 5 nm to 50 nm; finally, a cover layer 05 is prepared on the surface of the deposited second dielectric layer 07 , to prevent damage to the membrane surface during transportation, splicing, hanging, etc.
  • the entire production process flow is shown in Figure 10.
  • the polyester film with the microstructured surface is called the base layer 01;
  • a dielectric layer namely the first dielectric layer 06
  • the first dielectric layer 06 is made of silicon dioxide, titanium dioxide, and silicon nitride.
  • At least one of the first dielectric layers 06 has a thickness of 5 nm to 50 nm; then a metal layer 02 is deposited on the first dielectric layer 06, and the metal layer 02 is made of gold, silver, and aluminum.
  • the thickness of the metal layer 02 is 20nm to 200nm; and then a dielectric layer is deposited on the metal layer 02, that is, the second dielectric layer 07, and the second dielectric layer 07 is silicon dioxide, titanium dioxide, At least one of silicon nitride, the thickness of the second dielectric layer 07 is basically the same as the thickness of the first dielectric layer 06, and the thickness of the second dielectric layer 07 is 5nm-50nm;
  • a cover layer 05 is prepared on the surface of the second dielectric layer 07 to prevent damage to the film surface during transportation, splicing, hanging, etc.; Laser drilling is performed on the surface to form holes 04, the hole diameter of the holes 04 is 200 ⁇ m, and the hole spacing of the holes 04 is 1250 ⁇ m; finally, a cover layer 05 is prepared on the surface of the film to prevent the film during transportation, splicing, hanging and other processes. surface damage.
  • the main difference between the present comparative example 1 and the embodiment 1 lies in the order of punching in the process flow.
  • the surface of the metal layer 02 at the cross-section of the hole 04 will be covered by the first dielectric layer 06, preventing it from being directly exposed to the air, as shown in Figure 11(A) , the enlarged schematic diagram of the hole section 08 is shown in FIG. 12 .
  • 11(B) is the final front view of the metal layer 02 first prepared and then formed by the punching process. Since the punching will cut off the cross section of the metal layer 02, the metal layer 02 at the edge of the hole 04 is directly exposed to the air. Therefore, the metal layer 02 cannot be protected.
  • an uneven microstructured surface is formed on the surface of the polyester film by UV transfer printing, and the polyester film with the microstructured surface is called the base layer 01;
  • the fabricated base layer 01 is laser-drilled to form holes 04, the hole diameter of the holes 04 is 200 ⁇ m, and the hole spacing of the holes 04 is 1250 ⁇ m;
  • the base layer 01 is coated: metallization is carried out on the surface of the base layer 01
  • the deposition of layer 02, the metal layer 02 is any one of gold, silver, and aluminum, and the thickness of the metal layer 02 is 20nm-200nm; finally, a cover layer 05 is prepared on the surface of the film to prevent transportation, splicing, Damage to the membrane surface during hanging and other processes.
  • a schematic diagram of the structure of the metal screen without any dielectric layer is shown in FIG. 13 .
  • Example 1 The metal screens obtained in Example 1, Comparative Example 1 and Comparative Example 2 were tested for oxidation resistance, and the test conditions were 70° C., 80% humidity environment, and placed for 50 hours.
  • the screen sample without any dielectric layer is the first to be oxidized; the surface oxidation of the screen sample with the first dielectric layer 06 protection added after coating and then punching is obviously better than that at the cross-section of the hole 04;
  • the screen samples that are punched and then coated and protected by the first dielectric layer 06 and the second dielectric layer 07 are basically not oxidized in a high temperature and high humidity environment. The reason is that: the hole 02 at the edge of the hole 04 will be exposed to the environment and the risk of contact with the air is increased after the hole is punched after coating.
  • the dielectric layer is deposited on both sides of layer 02, which is beneficial to cover the metal layer at the cross-section of the hole with the dielectric layer, and has a comprehensive protective effect on the metal layer to prevent the screen from being exposed to the air for a long time during use. Oxidation effectively improves the life of the metal screen.
  • the metal screen is not excluded.
  • layers other than the cover layer 05 and the second dielectric layer 07 on either side of the fuselage such as: bonding layer, adhesive layer, reinforcement layer, anti-reflection layer, absorption layer, anti-reflection layer, etc., and this Those skilled in the art should understand that these layers may be understood as part of the base layer 01 , the metal layer 02 , and the first dielectric layer 06 .
  • the present application provides a metal screen.
  • the metal screen includes a base layer 01, a metal layer 02 on the base layer 01, a first dielectric layer 06 covering the metal layer 02, and a punched hole.
  • the holes 04 formed later through the base layer 01 , the metal layer 02 and the first dielectric layer 06 are formed by depositing the metal layer 02 and the first dielectric layer on the base layer 01 in sequence.
  • the layer 06 is directly formed by punching holes on the base layer 01, so that the metal layer 02 at the cross-section of the hole 04 is covered by the first dielectric layer 06; the metal screen also includes an upper surface 014 on the base layer. and the second dielectric layer 07 between the lower surface 021 of the metal layer.
  • the present application also provides a method for preparing a metal screen, by adjusting the punching sequence in the manufacturing process and depositing a dielectric layer on both sides of the metal layer, especially first punching holes on the base layer, and then depositing metal layers in sequence It is beneficial to cover the metal layer at the cross-section of the hole with the dielectric layer, which can protect the metal layer in an all-round way, prevent the screen from being exposed to the air for a long time during use, and effectively improve the metal screen. service life.
  • the metal screen of the present invention can be applied to a projection system, and can be used as a cinema screen, a home theater screen, and the like.

Abstract

A metal-coated silver screen, comprising a base layer (01), a metal layer (02) located on the base layer (01), a first dielectric layer (06) coating the metal layer (02), and a hole (04) formed by punching and penetrating through the base layer (01), the metal layer (03), and the first dielectric layer (06). The hole (04) is formed by directly punching the base layer (01) before the metal layer (02) and the first dielectric layer (06) are sequentially deposited on the base layer (01), such that the metal layer (02) at the cross section of the hole (04) is covered by the first dielectric layer (06). Further provided is a preparation method for the metal-coated silver screen. The punching sequence in a manufacturing technological process is adjusted, the base layer (01) is first punched, then the metal layer (02) and the first dielectric layer (06) are sequentially deposited on the surface of the base layer (01), and the metal layer (02) at the cross section of the hole (04) is covered by the first dielectric layer (06), such that metal is protected in all directions, oxidation caused by long-time exposition of the screen in air in a using process is prevented, and the service life of the metal-coated silver screen is effectively prolonged.

Description

一种金属银幕及其制备方法A kind of metal screen and preparation method thereof
本申请要求了申请日为2020年12月22日，申请号为CN202011528061.7，发明名称为“一种金属银幕及其制备方法”的发明专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the invention patent application whose filing date is December 22, 2020, the application number is CN202011528061.7, and the invention name is "a metal screen and its preparation method", the entire contents of which are incorporated herein by reference Applying.
技术领域technical field
本发明涉及投影银幕，尤其涉及一种金属银幕及其制备方法。The invention relates to a projection screen, in particular to a metal screen and a preparation method thereof.
背景技术Background technique
近年来，随着电影市场的持续火热，越来越多的人走进影院观看电影。银幕作为影院中不可或缺的一部分，银幕的好坏对观影效果起着举足轻重的作用。目前，常用的银幕主要有漫散反射银幕，比如布质幕、塑料幕布及在其表面上涂有无光漆、氧化锌等涂料的银幕，这类银幕通常不受观看角度的影响，但其亮度较低，影响观影效果；目前，使用较多的有金属银幕，通常是在幕基面上涂覆一层能反射光线的金属粉，如铝粉等。这类银幕具有较高的反射率，亮度增益足够满足正常观影需求。In recent years, as the movie market continues to be hot, more and more people go to the cinema to watch movies. As an indispensable part of the cinema, the quality of the screen plays a pivotal role in the viewing effect. At present, the commonly used screens mainly include diffuse reflection screens, such as cloth screens, plastic screens and screens coated with matte paint, zinc oxide and other coatings on their surfaces. Such screens are usually not affected by viewing angles, but their The brightness is low, which affects the viewing effect; at present, metal screens are used more, and usually a layer of metal powder that can reflect light, such as aluminum powder, is coated on the base surface of the screen. This type of screen has a high reflectivity, and the brightness gain is sufficient to meet the normal viewing needs.
对于3D电影来说，相比于普通银幕，金属银幕可以避免鬼影的干扰，观影效果更加震撼。为了使声音和画面动作效果的配合更加协调，扬声器最好安装在银幕的中央位置，可是通常银幕幕面质地较密，不易透过声音，影响环音质量，为了弥补这一缺点，多会采用在金属银幕上进行打孔处理。目前，打孔金属银幕的制备流程是先将基层、金属层都制备完成后，再在金属银幕上打孔，但是金属易受环境温度湿度影响而氧化，传统的金属银幕的制备会在金属层上面增加保护层，但增加保护层后打孔，金属层也会容易暴露出来，如图1所示的制备流程，暴露出 来的金属一旦氧化，银幕无法保证正常观影效果，对于影院来说这会是巨大的损失。For 3D movies, compared with ordinary screens, metal screens can avoid the interference of ghost images, and the viewing effect is more shocking. In order to coordinate the sound and picture action effects more harmoniously, it is best to install the speakers in the center of the screen, but the screen surface is usually denser, and it is not easy to pass through the sound, which affects the quality of the surround sound. Punch holes on metal screens. At present, the preparation process of perforated metal screen is to first prepare the base layer and metal layer, and then punch holes on the metal screen, but the metal is easily oxidized by the influence of ambient temperature and humidity. A protective layer is added on the top, but after adding the protective layer, the metal layer will be easily exposed. As shown in the preparation process shown in Figure 1, once the exposed metal is oxidized, the screen cannot guarantee the normal viewing effect. would be a huge loss.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的是提供一种金属银幕，该金属银幕是通过调整打孔工艺制备而成，有效改善了金属裸露问题，提高了金属银幕的寿命。The main purpose of the present invention is to provide a metal screen, which is prepared by adjusting the punching process, which effectively improves the problem of bare metal and increases the service life of the metal screen.
为实现上述目的，本申请提供了一种金属银幕，所述金属银幕包括基层、位于所述基层上的金属层、包覆所述金属层的第一介质层以及经打孔后形成的贯穿所述基层、所述金属层和所述第一介质层的孔洞，所述孔洞是在所述基层上依次沉积所述金属层和所述第一介质层之前直接在所述基层上打孔形成的，使所述孔洞截面处的所述金属层被所述第一介质层覆盖。To achieve the above purpose, the present application provides a metal screen, the metal screen includes a base layer, a metal layer located on the base layer, a first dielectric layer covering the metal layer, and a through hole formed after perforation. The holes in the base layer, the metal layer and the first dielectric layer, the holes are formed by directly punching holes on the base layer before depositing the metal layer and the first dielectric layer on the base layer in sequence , so that the metal layer at the cross section of the hole is covered by the first dielectric layer.
作为本申请的进一步改进，所述孔洞的直径为200μm～600μm。As a further improvement of the present application, the diameter of the holes ranges from 200 μm to 600 μm.
作为本申请的进一步改进，所述孔洞间距为1000μm～1500μm。As a further improvement of the present application, the spacing between the holes is 1000 μm˜1500 μm.
作为本申请的进一步改进，所述金属层为金、银、铝、铜中的至少一种。As a further improvement of the present application, the metal layer is at least one of gold, silver, aluminum, and copper.
作为本申请的进一步改进，所述金属层的厚度为20nm～200nm。As a further improvement of the present application, the thickness of the metal layer is 20 nm˜200 nm.
作为本申请的进一步改进，所述金属银幕还包括位于所述基层上表面和所述金属层下表面之间的第二介质层。As a further improvement of the present application, the metal screen further includes a second dielectric layer located between the upper surface of the base layer and the lower surface of the metal layer.
作为本申请的进一步改进，所述第一介质层和/或所述第二介质层为二氧化硅、二氧化钛、氮化硅中的至少一种。As a further improvement of the present application, the first dielectric layer and/or the second dielectric layer is at least one of silicon dioxide, titanium dioxide, and silicon nitride.
作为本申请的进一步改进，所述第一介质层和/或所述第二介质层的厚度为5nm～50nm。As a further improvement of the present application, the thickness of the first dielectric layer and/or the second dielectric layer is 5 nm˜50 nm.
作为本申请的进一步改进，所述金属层和/或所述第一介质层和/或所述第二介质层的沉积方式为蒸发镀膜或溅射镀膜。As a further improvement of the present application, the deposition method of the metal layer and/or the first dielectric layer and/or the second dielectric layer is evaporation coating or sputtering coating.
作为本申请的进一步改进，所述基层具有基层下表面和与所述基层下表面相对的基层上表面，所述基层下表面可以为平坦的表面，也可以是具有微结构或其他结构的不平坦表面，所述基层上表面为不平坦的微结构化表面，所述金属层具有金属层下表面和金属层上表面，所述金属层基本上保形于所述基层上表面，使所述金属层上表面形成与所述基层上表面基本一致的微结构化表面。As a further improvement of the present application, the base layer has a lower surface of the base layer and an upper surface of the base layer opposite to the lower surface of the base layer, and the lower surface of the base layer may be a flat surface or an uneven surface with microstructures or other structures surface, the upper surface of the base layer is an uneven microstructured surface, the metal layer has a lower surface of the metal layer and an upper surface of the metal layer, the metal layer is substantially conformal to the upper surface of the base layer, so that the metal layer The upper surface of the layer forms a microstructured surface substantially conforming to the upper surface of the base layer.
作为本申请的进一步改进，所述金属层上表面上任一点切线与所述基层下表面平行的平面之间的夹角θ控制在0度至+/-30度之间随机变化。As a further improvement of the present application, the included angle θ between any point tangent on the upper surface of the metal layer and a plane parallel to the lower surface of the base layer is controlled to vary randomly between 0 degrees and +/-30 degrees.
作为本申请的进一步改进，任选一个沿平行于所述基层下表面的方向尺寸大于1mm的区域，所述金属层上表面的结构都由至少两个波峰和至少两个波谷组成，而且波峰波谷具有随机结构，基本不具有重复性。As a further improvement of the present application, any region with a dimension greater than 1 mm along the direction parallel to the lower surface of the base layer, the structure of the upper surface of the metal layer is composed of at least two wave crests and at least two wave troughs, and the wave crest and wave trough Has a random structure and is basically non-repetitive.
作为本申请的进一步改进，所述金属层上表面上任一点切线与所述基层下表面平行的平面之间的夹角θ出现的几率随角度连续变化。As a further improvement of the present application, the probability of occurrence of an included angle θ between a tangent at any point on the upper surface of the metal layer and a plane parallel to the lower surface of the base layer varies continuously with the angle.
作为本申请的进一步改进，所述夹角θ在0度出现的几率最大，所述夹角θ随着角度绝对值的增大出现的几率连续变小。As a further improvement of the present application, the probability of occurrence of the included angle θ at 0 degrees is the largest, and the probability of occurrence of the included angle θ decreases continuously as the absolute value of the angle increases.
作为本申请的进一步改进，所述夹角θ出现几率的最大值与最小值之比小于10:1。As a further improvement of the present application, the ratio of the maximum value to the minimum value of the occurrence probability of the included angle θ is less than 10:1.
作为本申请的进一步改进，所述夹角θ出现几率的最大值与最小值之比小于2:1。As a further improvement of the present application, the ratio of the maximum value to the minimum value of the occurrence probability of the included angle θ is less than 2:1.
作为本申请的进一步改进，所述不平坦的微结构化表面的剖面是弧形结构或波状结构。As a further improvement of the present application, the cross section of the uneven microstructured surface is an arc structure or a wavy structure.
作为本申请的进一步改进，所述金属层的相邻波峰或相邻波谷之间的特征长度L不大于0.5mm。As a further improvement of the present application, the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer is not greater than 0.5 mm.
作为本申请的进一步改进，所述金属层的相邻波峰或相邻波谷之间的特征长度L不大于0.05mm。As a further improvement of the present application, the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer is not greater than 0.05 mm.
作为本申请的进一步改进，所述金属层上表面的波峰和波谷之间的高度差不大于100μm。As a further improvement of the present application, the height difference between the wave crest and the wave trough on the upper surface of the metal layer is not greater than 100 μm.
作为本申请的进一步改进，所述金属层上表面的波峰和波谷之间的高度差不大于10μm。As a further improvement of the present application, the height difference between the wave crest and the wave trough on the upper surface of the metal layer is not greater than 10 μm.
作为本申请的进一步改进，所述基层为聚酯材料。As a further improvement of the present application, the base layer is a polyester material.
作为本申请的进一步改进，所述聚酯材料为PVC、PET、PC中的至少一种。As a further improvement of the present application, the polyester material is at least one of PVC, PET, and PC.
作为本申请的进一步改进，所述微结构化表面的制备方式为转印。As a further improvement of the present application, the preparation method of the microstructured surface is transfer printing.
作为本申请的进一步改进，所述转印为热转印、UV转印中的任意一种。As a further improvement of the present application, the transfer printing is any one of thermal transfer printing and UV transfer printing.
作为本申请的进一步改进，制备所述微结构化表面的微结构的制作工艺为压印、表面切削、表面刻蚀、喷砂工艺中的任意一种。As a further improvement of the present application, the fabrication process for preparing the microstructure of the microstructured surface is any one of embossing, surface cutting, surface etching, and sandblasting.
作为本申请的进一步改进，所述金属银幕还包括覆盖层。As a further improvement of the present application, the metal screen further includes a cover layer.
为实现上述目的，本申请还提供了一种金属银幕的制备方法，所述的制备方法应用于上述所述的金属银幕，包括如下步骤：首先，制备基层；其次，对制作好的基层进行打孔形成孔洞；再次，对打孔后的基层 进行镀膜：在基层上表面依次沉积金属层和第一介质层；最后，在所述第一介质层表面制作覆盖层。In order to achieve the above purpose, the present application also provides a method for preparing a metal screen. The preparation method is applied to the above-mentioned metal screen, and includes the following steps: first, preparing a base layer; The holes form holes; thirdly, coating the base layer after drilling: depositing a metal layer and a first dielectric layer on the upper surface of the base layer in sequence; finally, making a cover layer on the surface of the first dielectric layer.
作为本申请的进一步改进，在沉积所述金属层之前，先在所述基层上表面沉积第二介质层。As a further improvement of the present application, before depositing the metal layer, a second dielectric layer is deposited on the upper surface of the base layer.
本发明的有益效果在于，通过提供了一种金属银幕，所述金属银幕包括基层、位于所述基层上的金属层、包覆所述金属层的第一介质层以及经打孔后形成的贯穿所述基层、所述金属层和所述第一介质层的孔洞，所述孔洞是在所述基层上依次沉积所述金属层和所述第一介质层之前直接在所述基层上打孔形成，使所述孔洞截面处的所述金属层被所述第一介质层覆盖。本申请还提供了一种金属银幕的制备方法，通过调整制作工艺流程中的打孔顺序，先在基层上打孔，再依次在所述基层上沉积金属层和第一介质层，有利于将孔洞截面处的金属层被第一介质层覆盖，对金属层起到全方位的保护作用，防止使用过程中银幕长时间暴露在空气中造成的氧化，有效提高了金属银幕的使用寿命。The beneficial effect of the present invention is to provide a metal screen, the metal screen includes a base layer, a metal layer located on the base layer, a first dielectric layer covering the metal layer, and a through hole formed after drilling. the holes of the base layer, the metal layer and the first dielectric layer, the holes are formed by directly punching holes on the base layer before depositing the metal layer and the first dielectric layer on the base layer in sequence , so that the metal layer at the cross section of the hole is covered by the first dielectric layer. The present application also provides a method for preparing a metal screen. By adjusting the punching sequence in the manufacturing process, first punching holes on the base layer, and then depositing a metal layer and a first dielectric layer on the base layer in sequence, it is beneficial to make holes in the base layer. The metal layer at the cross-section of the hole is covered by the first dielectric layer, which plays an all-round protective effect on the metal layer, prevents oxidation caused by the screen being exposed to the air for a long time during use, and effectively improves the service life of the metal screen.
附图说明Description of drawings
图1为传统的金属银幕的先镀膜再打孔的制作工艺流程示意图；FIG. 1 is a schematic diagram of the production process flow of a traditional metal screen for first coating and then punching;
图2为金属银幕的一个实施例结构示意图；2 is a schematic structural diagram of an embodiment of a metal screen;
图3为平整的表面(A)和粗糙的表面(B)反射光线示意图；3 is a schematic diagram of reflected light from a flat surface (A) and a rough surface (B);
图4为圆弧上入射光与反射光的示意图；4 is a schematic diagram of incident light and reflected light on an arc;
图5为微结构化表面上圆弧不同深度下的反射光线角度示意图；5 is a schematic diagram of the angle of reflected light rays at different depths of arcs on the microstructured surface;
图6为反射光强分布(A)和微结构的形貌概率分布(B)示意图；6 is a schematic diagram of the reflected light intensity distribution (A) and the morphology probability distribution (B) of the microstructure;
图7为σ＝40°时反射光强分布(A)及金属银幕表面微结构深宽比 (B)示意图；7 is a schematic diagram of the reflected light intensity distribution (A) and the aspect ratio (B) of the metal screen surface microstructure when σ=40°;
图8为σ＝20°时反射光强分布(A)及金属银幕表面微结构深宽比(B)示意图；8 is a schematic diagram of the reflected light intensity distribution (A) and the aspect ratio (B) of the surface microstructure of the metal screen when σ=20°;
图9为一种金属银幕的一个实施例结构的剖面结构示意图；FIG. 9 is a schematic cross-sectional structure diagram of an embodiment structure of a metal screen;
图10为金属银幕的先打孔再镀膜的制作工艺流程示意图；FIG. 10 is a schematic diagram of the manufacturing process flow of the metal screen for first punching and then coating;
图11为先镀膜再打孔和先打孔再镀膜制备的金属银幕的孔内切面结构示意图；11 is a schematic view of the structure of the inner section of the metal screen prepared by first coating and then punching and first punching and then coating;
图12为先打孔再镀膜的工艺流程制备的金属银幕的孔洞内切面结构放大示意图；12 is an enlarged schematic view of the structure of the inner section of the hole of the metal screen prepared by the process flow of punching first and then coating;
图13为未沉积介质层的金属银幕结构示意图；13 is a schematic diagram of the structure of a metal screen without a dielectric layer deposited;
图中：01、基层；02、金属层；03、介质层；04、孔洞；05、覆盖层；06、第一介质层；07、第二介质层；08、孔洞截面；001、入射光；002、平整表面；003、反射光；004、粗糙表面；005、圆弧；006、圆弧切线；007、夹角；011、第一圆弧；012、第二圆弧；013、基层下表面；014、基层上表面；021、金属层下表面；022、金属层上表面。In the figure: 01, base layer; 02, metal layer; 03, dielectric layer; 04, hole; 05, cover layer; 06, first dielectric layer; 07, second dielectric layer; 08, hole cross section; 001, incident light; 002, flat surface; 003, reflected light; 004, rough surface; 005, arc; 006, arc tangent; 007, included angle; 011, first arc; 012, second arc; 013, lower surface of base layer 014, the upper surface of the base layer; 021, the lower surface of the metal layer; 022, the upper surface of the metal layer.
具体实施方式Detailed ways
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例，不用来限制本发明的范围。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below with reference to the specific embodiments of the present application and the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments, and are not intended to limit the scope of the present invention. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
为提高金属银幕的寿命，本申请提供了一种金属银幕，如图2所示，所述金属银幕包括基层01、位于所述基层01上的金属层02、包覆所述金属层02的第一介质层06以及经打孔后形成的贯穿所述基层01、所述金属层02和所述第一介质层06的孔洞04，所述孔洞04是在所述基层01上依次沉积所述金属层02和所述第一介质层06之前直接在所述基层01上打孔形成的，使所述孔洞04截面处的所述金属层02被所述第一介质层06覆盖。作为优选的实施方案，所述孔洞04的直径为200μm～600μm，作为进一步优选的实施方案，所述孔洞04的直径可以为但不仅仅限于200μm、400μm、600μm；所述孔洞04之间的间距为1000μm～1500μm，作为进一步优选的实施方案，所述孔洞04之间的间距可以为但不仅仅限于1000μm、1250μm、1500μm。作为优选的实施方案，所述金属层02和/或所述第一介质层06的沉积方式可以为但不仅仅限于蒸发镀膜或溅射镀膜。In order to improve the service life of the metal screen, the present application provides a metal screen, as shown in FIG. A dielectric layer 06 and holes 04 formed after punching through the base layer 01 , the metal layer 02 and the first dielectric layer 06 , the holes 04 are formed by depositing the metal on the base layer 01 in sequence The layer 02 and the first dielectric layer 06 are formed by directly punching holes on the base layer 01 before, so that the metal layer 02 at the cross section of the hole 04 is covered by the first dielectric layer 06 . As a preferred embodiment, the diameter of the holes 04 is 200 μm˜600 μm. As a further preferred embodiment, the diameters of the holes 04 can be, but not limited to, 200 μm, 400 μm, and 600 μm; the spacing between the holes 04 It is 1000 μm˜1500 μm. As a further preferred embodiment, the spacing between the holes 04 can be, but not limited to, 1000 μm, 1250 μm, and 1500 μm. As a preferred embodiment, the deposition method of the metal layer 02 and/or the first dielectric layer 06 may be, but not limited to, evaporation coating or sputtering coating.
本申请中，作为优选的实施方案，所述金属层02可以为但不仅仅限于金、银、铝、铜等中的至少一种。作为进一步优选的实施方案，所述金属层02的厚度为20nm～200nm。作为优选的实施方案，所述金属银幕还包括位于所述基层上表面014和所述金属层下表面021之间的第二介质层07，作为进一步优选的实施方案，所述第一介质层和/或所述第二介质层07可以为但不仅仅限于二氧化硅、二氧化钛、氮化硅等中的至少一种，还可以为其它氧化物、氮化物中的一种或多种，所述第二介质层07的沉积方式可以为但不仅仅限于蒸发镀膜或溅射镀膜。作为更进一步优选的实施方案，如图2所示，所述第一介质层06和所述第二介质层 07统称为介质层03，所述第一介质层06和/或所述第二介质层07的厚度为5nm～50nm。在金属层02两侧都进行了介质沉积是为了防止使用过程中银幕长时间暴露在空气中造成的氧化，对金属起到全方位的保护作用，其中第二介质层07还可以增加所述金属层02与所述基层01之间的粘附力。In this application, as a preferred embodiment, the metal layer 02 may be, but not limited to, at least one of gold, silver, aluminum, copper, and the like. As a further preferred embodiment, the thickness of the metal layer 02 is 20 nm˜200 nm. As a preferred embodiment, the metal screen further includes a second dielectric layer 07 located between the upper surface 014 of the base layer and the lower surface 021 of the metal layer. As a further preferred embodiment, the first dielectric layer and /or the second dielectric layer 07 may be, but not limited to, at least one of silicon dioxide, titanium dioxide, silicon nitride, etc., and may also be one or more of other oxides and nitrides. The deposition method of the second dielectric layer 07 may be, but not limited to, evaporation coating or sputtering coating. As a further preferred embodiment, as shown in FIG. 2 , the first dielectric layer 06 and the second dielectric layer 07 are collectively referred to as a dielectric layer 03 , and the first dielectric layer 06 and/or the second dielectric layer The thickness of the layer 07 is 5 nm to 50 nm. The dielectric deposition on both sides of the metal layer 02 is to prevent oxidation caused by the screen being exposed to the air for a long time during use, and to protect the metal in an all-round way. The second dielectric layer 07 can also increase the metal Adhesion between layer 02 and said base layer 01 .
本申请中，作为优选的实施方案，所述基层01具有基层下表面013和与所述基层下表面013相对的基层上表面014，所述基层下表面013为平坦的表面，所述基层上表面014为不平坦的微结构化表面，所述金属层02具有金属层下表面021和金属层上表面022，所述金属层02基本上保形于所述基层上表面014，使所述金属层上表面022形成与所述基层上表面014基本一致的微结构化表面。作为进一步优选的实施方案，所述金属层上表面022上任一点切线与所述基层下表面013平行的平面之间的夹角θ007控制在0度至+/-30度之间随机变化。作为优选的实施方案，任选一个沿平行于所述基层下表面013的方向尺寸大于1mm的区域，所述金属层上表面022的结构都由至少两个波峰和至少两个波谷组成，而且波峰波谷具有随机结构，基本不具有重复性。In this application, as a preferred embodiment, the base layer 01 has a base layer lower surface 013 and a base layer upper surface 014 opposite to the base layer lower surface 013, the base layer lower surface 013 is a flat surface, and the base layer upper surface 014 014 is an uneven microstructured surface, the metal layer 02 has a metal layer lower surface 021 and a metal layer upper surface 022, the metal layer 02 is substantially conformal to the base layer upper surface 014, so that the metal layer The upper surface 022 forms a microstructured surface substantially conforming to the upper surface 014 of the base layer. As a further preferred embodiment, the included angle θ007 between the tangent of any point on the upper surface 022 of the metal layer and the plane parallel to the lower surface 013 of the base layer is controlled to vary randomly between 0 degrees and +/-30 degrees. As a preferred embodiment, any region whose size is greater than 1 mm along the direction parallel to the lower surface 013 of the base layer, the structure of the upper surface 022 of the metal layer is composed of at least two wave crests and at least two wave troughs, and the wave crests The trough has a random structure and is basically not repetitive.
本申请中，基层上表面014的不平坦的微结构化表面设计的理论依据如下：如图3所示，一束入射光001打到平整的表面时，其反射光003会沿着镜面反射的方向出去；当一束入射光001打到粗糙的表面时，其反射方向与表面的微结构有关。当这个微结构以圆弧005或者近似圆弧005的形式存在时，如图4所示，我们以入射到圆弧005上的入射光001为圆弧径向线做圆弧切线006，可以发现反射光003的反射方向与切线 有着紧密的联系，通过控制切线与水平位置之间的夹角007，我们可以调控反射光003线的方向，从而控制反射角度。所述金属层上表面022与所述基层下表面013平行的水平面的夹角θ，即表面倾斜角θ(切线与x轴的夹角)：In this application, the theoretical basis for the design of the uneven microstructured surface on the upper surface 014 of the base layer is as follows: As shown in FIG. direction out; when a beam of incident light 001 hits a rough surface, the direction of its reflection is related to the microstructure of the surface. When this microstructure exists in the form of an arc 005 or an approximate arc 005, as shown in Figure 4, we take the incident light 001 incident on the arc 005 as the arc radial line to make the arc tangent 006, we can find that The reflection direction of the reflected light 003 is closely related to the tangent. By controlling the angle 007 between the tangent and the horizontal position, we can control the direction of the reflected light 003 line, thereby controlling the reflection angle. The included angle θ between the upper surface 022 of the metal layer and the horizontal plane parallel to the lower surface 013 of the base layer, that is, the surface inclination angle θ (the angle between the tangent and the x-axis):
Figure PCTCN2021127065-appb-000001
Figure PCTCN2021127065-appb-000001
当θ角在θ到θ+△θ这个范围内变化时，其角度的概率分布与长度△x成正比：When the angle θ varies in the range of θ to θ+Δθ, the probability distribution of its angle is proportional to the length Δx:
Figure PCTCN2021127065-appb-000002
Figure PCTCN2021127065-appb-000002
反射光的角度α与夹角θ有关，反射角α是指反射光线与界面法线的夹角，最终我们可以得到反射光角度的分布函数：The angle α of the reflected light is related to the angle θ. The angle of reflection α refers to the angle between the reflected light and the interface normal. Finally, we can get the distribution function of the angle of the reflected light:
Figure PCTCN2021127065-appb-000003
Figure PCTCN2021127065-appb-000003
一个散射单元包含了x从-1到1这个范围。为了使α在0°附近的反射光强具有更好的聚集，我们需要dy/dx的值在0°附近相对大，而d 2y/dx 2的值在0°附近相对小。 A scattering unit contains the range of x from -1 to 1. In order to make the reflected light intensity of α around 0° have better concentration, we need the value of dy/dx to be relatively large around 0°, and the value of d 2 y/dx 2 to be relatively small around 0°.
考虑到入射光001并不是从单一方向入射，在入射光打到微结构化表面上后的反射角度会存在一个概率分布，这一概率分布与微结构化表面上圆弧005的大小有关。这里我们假设构成圆弧005的圆的大小一致，所以影响反射角度的因素为圆弧005的深度。如图5所示，当圆弧005较浅时，如第一圆弧011，反射光003的角度较小；当圆弧005深度增 加时，如第二圆弧012，在较大斜率处的反射光003的角度会随之增加。因此，这里所展示的基层上面的微结构化表面的微结构需要遵从一定的概率分布。通过某一已知的反射光强度分布我们可以推导出微结构化表面微结构的形貌分布，如图6所示，Considering that the incident light 001 is not incident from a single direction, there will be a probability distribution of the reflection angle after the incident light hits the microstructured surface, and this probability distribution is related to the size of the arc 005 on the microstructured surface. Here we assume that the circles forming the arc 005 are of the same size, so the factor affecting the reflection angle is the depth of the arc 005. As shown in FIG. 5 , when the arc 005 is shallow, such as the first arc 011, the angle of the reflected light 003 is smaller; when the depth of the arc 005 increases, such as the second arc 012, the angle at the larger slope The angle of the reflected light 003 will increase accordingly. Therefore, the microstructure of the microstructured surface above the base layer shown here needs to obey a certain probability distribution. From a certain known reflected light intensity distribution, we can deduce the topography distribution of the microstructured surface microstructure, as shown in Fig. 6,
反射光强度：G(α)＝W(α)Reflected light intensity: G(α)=W(α)
表面θ角分布：P(θ)＝W(2θ)＝H(θ)Surface θ angle distribution: P(θ)=W(2θ)=H(θ)
这里我们将圆弧005的表面宽度等分成N份，每份的宽度为1/N；同时，我们将θ角(0°～45°)等分成M份，每份的角度为45°/M。Here, we divide the surface width of the arc 005 into N equal parts, and the width of each part is 1/N; at the same time, we divide the θ angle (0°～45°) into M equal parts, and the angle of each part is 45°/M .
分布的数量：K j＝H(θ j)N Number of distributions: K j =H(θ j )N
当表面宽度在区域
Figure PCTCN2021127065-appb-000004
到
Figure PCTCN2021127065-appb-000005
内变化时，倾斜角为θ j。 When the surface width is in the area
Figure PCTCN2021127065-appb-000004
arrive
Figure PCTCN2021127065-appb-000005
When changing within, the tilt angle is θ j .
由此可知，如图7和图8所示，当σ角分别等于40°和20°时，对应的微结构化表面的圆弧005的深宽比分别为20:3和10:1，此处，所述深宽比为深度度量值和宽度度量值的比值，所述σ角是α角的二分之一。因此，通过这一方法我们可以根据最终需要得到的性能参数，制作出所需的微结构化表面。It can be seen that, as shown in Figures 7 and 8, when the σ angle is equal to 40° and 20°, respectively, the aspect ratios of the arcs 005 of the corresponding microstructured surface are 20:3 and 10:1, respectively. where the aspect ratio is the ratio of the depth metric value to the width metric value, and the σ angle is half of the α angle. Therefore, through this method, we can make the desired microstructured surface according to the final performance parameters required.
本申请中，评价银幕性能常用的参数有：总反射率、视角、亮度增益、偏振对比度。其中，总反射率可以反映到视角和亮度增益上，在相同的总反射率下，亮度增益越高，视角越窄；反之，视角越大。偏振对比度越高，观影效果越好。按照上述理论依据可以制备出总反射率达到95％以上、垂直方向偏振对比度大于1000:1或最高可大于2000:1的具有不平坦的微结构化表面的高保偏金属银幕。当银幕的可视角度控制在+/-60度方向上，高保偏金属银幕的偏振对比度可以达到200:1，有效消 除了3D电影鬼影的问题；另外，我们可以通过调整微结构化表面，控制最终的视角及增益，增益可以在1.3-3.5之间进行调整，可视角度也可控制在±20°至±50°，大的可视角度范围可以满足大的影厅，带来更多的观众。In this application, the commonly used parameters for evaluating screen performance are: total reflectivity, viewing angle, brightness gain, and polarization contrast. Among them, the total reflectivity can be reflected in the viewing angle and brightness gain. Under the same total reflectivity, the higher the brightness gain, the narrower the viewing angle; otherwise, the larger the viewing angle. The higher the polarization contrast, the better the viewing effect. According to the above theoretical basis, a high polarization-maintaining metal screen with uneven microstructured surface can be prepared with a total reflectivity of more than 95% and a vertical polarization contrast ratio greater than 1000:1 or at most greater than 2000:1. When the viewing angle of the screen is controlled in the direction of +/-60 degrees, the polarization contrast ratio of the high polarization-maintaining metal screen can reach 200:1, effectively eliminating the problem of ghosting in 3D movies; in addition, we can adjust the microstructured surface, Control the final viewing angle and gain, the gain can be adjusted between 1.3-3.5, and the viewing angle can also be controlled from ±20° to ±50°. The large viewing angle range can meet the needs of large theaters, bringing more audience.
本申请中，作为优选的实施方案，所述金属层上表面022上任一点切线与所述基层下表面013平行的平面之间的夹角θ007出现的几率随夹角θ的角度连续变化。作为优选的实施方案，所述夹角θ007在0度出现的几率最大，所述夹角θ007随着角度绝对值的增大出现的几率连续变小。作为进一步优选的实施方案，所述夹角θ007出现几率的最大值与最小值之比小于10:1。作为更进一步优选的实施方案，所述夹角θ007出现几率的最大值与最小值之比小于2:1。In this application, as a preferred embodiment, the probability of occurrence of the included angle θ007 between the tangent of any point on the upper surface 022 of the metal layer and the plane parallel to the lower surface 013 of the base layer varies continuously with the angle of the included angle θ. As a preferred embodiment, the probability of occurrence of the included angle θ007 at 0 degrees is the largest, and the probability of occurrence of the included angle θ007 decreases continuously as the absolute value of the angle increases. As a further preferred embodiment, the ratio of the maximum value to the minimum value of the occurrence probability of the included angle θ007 is less than 10:1. As a further preferred embodiment, the ratio of the maximum value to the minimum value of the occurrence probability of the included angle θ007 is less than 2:1.
本申请中，作为优选的实施方案，所述不平坦的微结构化表面的剖面是弧形结构或波状结构。作为进一步优选的实施方案，如图9所示，所述金属层02的相邻波峰或相邻波谷之间的特征长度L不大于0.5mm；作为更进一步优选的实施方案，所述金属层02的相邻波峰或相邻波谷之间的特征长度L不大于0.05mm。作为进一步优选的实施方案，所述金属层上表面022的波峰和波谷之间的高度差不大于100μm。作为更进一步优选的实施方案，所述金属层上表面022的波峰和波谷之间的高度差不大于10μm。In this application, as a preferred embodiment, the cross section of the uneven microstructured surface is an arc structure or a wavy structure. As a further preferred embodiment, as shown in FIG. 9 , the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer 02 is not greater than 0.5 mm; as a further preferred embodiment, the metal layer 02 The characteristic length L between adjacent wave crests or adjacent wave troughs is not greater than 0.05mm. As a further preferred embodiment, the height difference between the peaks and valleys of the upper surface 022 of the metal layer is not greater than 100 μm. As a further preferred embodiment, the height difference between the peaks and valleys of the upper surface 022 of the metal layer is not greater than 10 μm.
本申请中，作为优选的实施方案，所述基层01为聚酯材料；作为进一步优选的实施方案，所述聚酯材料可以为但不仅仅限于PVC、PET、PC等中的至少一种。作为优选的实施方案，所述微结构化表面的制备方 式可以为但不仅仅限于转印。作为进一步优选的实施方案，所述转印可以为但不仅仅限于热转印、UV转印中的任意一种。作为优选的实施方案，制备所述微结构化表面的微结构的制作工艺可以为但不仅仅限于压印、表面切削、表面刻蚀、喷砂工艺中的任意一种。本申请中，作为优选的实施方案，所述金属银幕还包括覆盖层05，所述覆盖层05主要起保护作用，防止在运输、拼接、悬挂等过程中对膜面造成破坏。In this application, as a preferred embodiment, the base layer 01 is a polyester material; as a further preferred embodiment, the polyester material can be, but not limited to, at least one of PVC, PET, PC, and the like. As a preferred embodiment, the microstructured surface can be prepared by, but not limited to, transfer printing. As a further preferred embodiment, the transfer can be, but not limited to, any one of thermal transfer and UV transfer. As a preferred embodiment, the fabrication process for preparing the microstructure of the microstructured surface may be, but not limited to, any one of imprinting, surface cutting, surface etching, and sandblasting. In this application, as a preferred embodiment, the metal screen further includes a cover layer 05, and the cover layer 05 mainly plays a protective role to prevent damage to the film surface during transportation, splicing, and hanging.
本申请中，为实现提高金属银幕使用寿命的目的，还提供了一种金属银幕的制备方法，所述的制备方法应用于上述所述的金属银幕，作为优选的实施方案：所述的制备方法包括如下步骤：首先，制备基层01；其次，对制作好的基层01进行激光打孔形成孔洞04；再次，对打孔后的基层01进行镀膜：在基层上表面014沉积金属层02，再在金属层02上沉积第一介质层06；最后，在所述第一介质层06表面制作覆盖层05。作为进一步优选的实施方案，在沉积所述金属层02之前，先在所述基层01上表面沉积第二介质层07。作为进一步优选的实施方案，所述基层可以为具有微结构化表面的基层01。In this application, in order to achieve the purpose of improving the service life of the metal screen, a preparation method of the metal screen is also provided. The preparation method is applied to the above-mentioned metal screen. As a preferred embodiment: the preparation method It includes the following steps: firstly, preparing the base layer 01; secondly, performing laser drilling on the fabricated base layer 01 to form holes 04; thirdly, coating the punched base layer 01: depositing a metal layer 02 on the upper surface 014 of the base layer, and then on A first dielectric layer 06 is deposited on the metal layer 02 ; finally, a cover layer 05 is formed on the surface of the first dielectric layer 06 . As a further preferred embodiment, before depositing the metal layer 02 , a second dielectric layer 07 is deposited on the upper surface of the base layer 01 . As a further preferred embodiment, the base layer may be a base layer 01 with a microstructured surface.
为验证本申请金属银幕以及由本申请提供的制备方法制备的金属银幕具有优异的使用寿命，本申请还提供了实验数据进行佐证，具体的实验数据及性能比对如下分析。In order to verify that the metal screen of the present application and the metal screen prepared by the preparation method provided by the present application have excellent service life, the present application also provides experimental data for verification. The specific experimental data and performance comparison are analyzed as follows.
实施例1Example 1
首先，在一定厚度的聚脂材料薄膜上，通过UV转印的方式在所述聚酯薄膜的表面形成不平坦的微结构化表面，带有微结构化表面的聚脂薄膜为基层01；其次，对制作好的基层01进行激光打孔形成孔洞04， 所述孔洞04的孔径为200μm，所述孔洞04的孔间距为1250μm；再次，对打孔后的基层01进行镀膜：先在基层01表面通过溅射的方式匀速沉积一层电介质层，即第一介质层06，所述第一介质层06为二氧化硅、二氧化钛、氮化硅中的至少一种，所述第一介质层06的厚度为5nm～50nm；随后在所述第一介质层06层面上进行金属层02的沉积，所述金属层02为金、银、铝中的任意一种，所述金属层02的厚度为20nm～200nm；再在金属层02层面上沉积一层电介质层，即第二介质层07，所述第二介质层07为二氧化硅、二氧化钛、氮化硅中的至少一种，所述第二介质层07的厚度与所述第一介质层06的厚度基本一致，所述第二介质层07的厚度为5nm～50nm；最后，在沉积完的第二介质层07的表面制备覆盖层05，防止在运输，拼接，悬挂等过程中对膜面造成破坏。整个制作工艺流程如图10所示。First, on a polyester film of a certain thickness, an uneven microstructured surface is formed on the surface of the polyester film by UV transfer, and the polyester film with the microstructured surface is the base layer 01; secondly , perform laser drilling on the fabricated base layer 01 to form holes 04, the hole diameter of the holes 04 is 200 μm, and the hole spacing of the holes 04 is 1250 μm; again, the base layer 01 after punching is coated: first on the base layer 01 A dielectric layer, namely the first dielectric layer 06, is uniformly deposited on the surface by sputtering. The first dielectric layer 06 is at least one of silicon dioxide, titanium dioxide and silicon nitride. The first dielectric layer 06 The thickness of the metal layer 02 is 5 nm to 50 nm; then the metal layer 02 is deposited on the first dielectric layer 06, the metal layer 02 is any one of gold, silver, and aluminum, and the thickness of the metal layer 02 is 20nm to 200nm; and then deposit a dielectric layer on the metal layer 02 level, that is, the second dielectric layer 07, the second dielectric layer 07 is at least one of silicon dioxide, titanium dioxide, silicon nitride, the first dielectric layer 07 The thickness of the second dielectric layer 07 is basically the same as the thickness of the first dielectric layer 06, and the thickness of the second dielectric layer 07 is 5 nm to 50 nm; finally, a cover layer 05 is prepared on the surface of the deposited second dielectric layer 07 , to prevent damage to the membrane surface during transportation, splicing, hanging, etc. The entire production process flow is shown in Figure 10.
对比例1Comparative Example 1
首先，在一定厚度的聚脂材料薄膜上，通过UV转印的方式在所述聚酯薄膜的表面形成不平坦的微结构化表面，带有微结构化表面的聚脂薄膜称为基层01；其次，对基层01进行镀膜：先在基层01表面通过溅射的方式匀速沉积一层电介质层，即第一介质层06，所述第一介质层06为二氧化硅、二氧化钛、氮化硅中的至少一种，所述第一介质层06的厚度为5nm～50nm；随后在所述第一介质层06层面上进行金属层02的沉积，所述金属层02为金、银、铝中的任意一种，所述金属层02的厚度为20nm～200nm；再在金属层02层面上沉积一层电介质层，即第二介质层07，所述第二介质层07为二氧化硅、二氧化钛、氮化硅中的至少 一种，所述第二介质层07的厚度与所述第一介质层06的厚度基本一致，所述第二介质层07的厚度为5nm～50nm；最后在沉积完的第二介质层07的表面制备覆盖层05，防止在运输，拼接，悬挂等过程中对膜面造成破坏；再次，对沉积完第一介质层06、金属层02和第二介质层07的薄膜表面进行激光打孔形成孔洞04，所述孔洞04的孔径为200μm，所述孔洞04的孔间距为1250μm；最后，在薄膜表面制备覆盖层05，防止在运输，拼接，悬挂等过程中对膜面造成破坏。First, on a polyester film of a certain thickness, an uneven microstructured surface is formed on the surface of the polyester film by UV transfer printing, and the polyester film with the microstructured surface is called the base layer 01; Next, coating the base layer 01: first, a dielectric layer, namely the first dielectric layer 06, is uniformly deposited on the surface of the base layer 01 by sputtering, and the first dielectric layer 06 is made of silicon dioxide, titanium dioxide, and silicon nitride. At least one of the first dielectric layers 06 has a thickness of 5 nm to 50 nm; then a metal layer 02 is deposited on the first dielectric layer 06, and the metal layer 02 is made of gold, silver, and aluminum. In any one, the thickness of the metal layer 02 is 20nm to 200nm; and then a dielectric layer is deposited on the metal layer 02, that is, the second dielectric layer 07, and the second dielectric layer 07 is silicon dioxide, titanium dioxide, At least one of silicon nitride, the thickness of the second dielectric layer 07 is basically the same as the thickness of the first dielectric layer 06, and the thickness of the second dielectric layer 07 is 5nm-50nm; A cover layer 05 is prepared on the surface of the second dielectric layer 07 to prevent damage to the film surface during transportation, splicing, hanging, etc.; Laser drilling is performed on the surface to form holes 04, the hole diameter of the holes 04 is 200 μm, and the hole spacing of the holes 04 is 1250 μm; finally, a cover layer 05 is prepared on the surface of the film to prevent the film during transportation, splicing, hanging and other processes. surface damage.
本对比例1与实施例1的主要区别在于打孔在工艺流程中的顺序。当我们先打孔时，在制备金属层02的过程中，孔洞04截面处的金属层02表面会被第一介质层06覆盖，阻挡其直接暴露于空气中，如图11(A)所示，其孔洞截面08放大示意图如图12所示。而图11(B)则是先制备金属层02再打孔工艺形成的最终正视角图，由于打孔会将金属层02截面进行切除，所以孔洞04边缘的金属层02直接暴露于空气中，从而无法保护金属层02。The main difference between the present comparative example 1 and the embodiment 1 lies in the order of punching in the process flow. When we punch holes first, in the process of preparing the metal layer 02, the surface of the metal layer 02 at the cross-section of the hole 04 will be covered by the first dielectric layer 06, preventing it from being directly exposed to the air, as shown in Figure 11(A) , the enlarged schematic diagram of the hole section 08 is shown in FIG. 12 . 11(B) is the final front view of the metal layer 02 first prepared and then formed by the punching process. Since the punching will cut off the cross section of the metal layer 02, the metal layer 02 at the edge of the hole 04 is directly exposed to the air. Therefore, the metal layer 02 cannot be protected.
对比例2Comparative Example 2
首先，在一定厚度的聚脂材料薄膜上，通过UV转印的方式在所述聚酯薄膜的表面形成不平坦的微结构化表面，带有微结构化表面的聚脂薄膜称为基层01；其次，对制作好的基层01进行激光打孔形成孔洞04，所述孔洞04的孔径为200μm，所述孔洞04的孔间距为1250μm；再次，对基层01进行镀膜：在基层01表面上进行金属层02的沉积，所述金属层02为金、银、铝中的任意一种，所述金属层02的厚度为20nm～200nm；最后，在薄膜表面制备覆盖层05，防止在运输，拼接，悬挂等过程中对 膜面造成破坏。未沉积任何介质层的金属银幕结构示意图如图13所示。First, on a polyester film of a certain thickness, an uneven microstructured surface is formed on the surface of the polyester film by UV transfer printing, and the polyester film with the microstructured surface is called the base layer 01; Next, the fabricated base layer 01 is laser-drilled to form holes 04, the hole diameter of the holes 04 is 200 μm, and the hole spacing of the holes 04 is 1250 μm; thirdly, the base layer 01 is coated: metallization is carried out on the surface of the base layer 01 The deposition of layer 02, the metal layer 02 is any one of gold, silver, and aluminum, and the thickness of the metal layer 02 is 20nm-200nm; finally, a cover layer 05 is prepared on the surface of the film to prevent transportation, splicing, Damage to the membrane surface during hanging and other processes. A schematic diagram of the structure of the metal screen without any dielectric layer is shown in FIG. 13 .
对实施例1、对比例1和对比例2得到的金属银幕进行耐氧化性能的测试，测试条件为70℃，80％的湿度环境，放置50个小时。通过实验可知，未添加任何介质层的银幕样品率先出现了氧化的情况；先镀膜再打孔的且增加了第一介质层06保护的银幕样品表面氧化情况明显优于孔洞04截面处；而先打孔再镀膜的且增加了第一介质层06和第二介质层07保护的银幕样品在高温高湿环境下基本没有出现氧化的情况。原因在于：镀膜后再进行打孔，位于孔洞04边缘处的金属层02会暴露于环境中，增加与空气接触的风险，调整制作工艺流程中的打孔顺序、增加介质保护层，且在金属层02两侧都进行了介质层的沉积，有利于将孔洞截面处的金属层被介质层覆盖，对金属层起到全方位的保护作用，防止使用过程中银幕长时间暴露在空气中造成的氧化，有效提高了金属银幕的寿命。The metal screens obtained in Example 1, Comparative Example 1 and Comparative Example 2 were tested for oxidation resistance, and the test conditions were 70° C., 80% humidity environment, and placed for 50 hours. Through experiments, it can be seen that the screen sample without any dielectric layer is the first to be oxidized; the surface oxidation of the screen sample with the first dielectric layer 06 protection added after coating and then punching is obviously better than that at the cross-section of the hole 04; The screen samples that are punched and then coated and protected by the first dielectric layer 06 and the second dielectric layer 07 are basically not oxidized in a high temperature and high humidity environment. The reason is that: the hole 02 at the edge of the hole 04 will be exposed to the environment and the risk of contact with the air is increased after the hole is punched after coating. The dielectric layer is deposited on both sides of layer 02, which is beneficial to cover the metal layer at the cross-section of the hole with the dielectric layer, and has a comprehensive protective effect on the metal layer to prevent the screen from being exposed to the air for a long time during use. Oxidation effectively improves the life of the metal screen.
虽然本申请主要以基层01、金属层02、第一介质层06三层为核心结构来描述本发明的实施方案，本领域技术人员应当理解，在本发明的保护范围内，不排除在金属银幕的任何一侧还可以有除覆盖层05、第二介质层07以外的其他层，例如：结合层、粘结层、加强层、消反射层、吸收层、增透层等等，并且，本领域技术人员应当理解，这些层可以被理解为是基层01、金属层02、第一介质层06的一部分。Although this application mainly describes the embodiments of the present invention with three layers of the base layer 01, the metal layer 02, and the first dielectric layer 06 as the core structure, those skilled in the art should understand that within the scope of the present invention, the metal screen is not excluded. There may also be other layers other than the cover layer 05 and the second dielectric layer 07 on either side of the fuselage, such as: bonding layer, adhesive layer, reinforcement layer, anti-reflection layer, absorption layer, anti-reflection layer, etc., and this Those skilled in the art should understand that these layers may be understood as part of the base layer 01 , the metal layer 02 , and the first dielectric layer 06 .
另外，本领域技术人员应当理解，在本发明的保护范围内，不排除在金属银幕的层间(基层01与金属层02之间以及金属层02与第一介质层06之间)还可以有其他层，例如：结合层、粘结层、加强层、消反射 层、吸收层、增透层等等，并且，本领域技术人员应当理解，这些层可以被理解为是基层01、金属层02、第一介质层06的一部分。In addition, those skilled in the art should understand that within the scope of protection of the present invention, it is not excluded that between the layers of the metal screen (between the base layer 01 and the metal layer 02 and between the metal layer 02 and the first dielectric layer 06 ), Other layers, such as: bonding layer, adhesive layer, reinforcement layer, anti-reflection layer, absorption layer, anti-reflection layer, etc., and, those skilled in the art should understand that these layers can be understood as the base layer 01, the metal layer 02 , a part of the first dielectric layer 06 .
综上所述，本申请提供了一种金属银幕，所述金属银幕包括基层01、位于所述基层01上的金属层02、包覆所述金属层02的第一介质层06以及经打孔后形成的贯穿所述基层01、所述金属层02和所述第一介质层06的孔洞04，所述孔洞04是在所述基层01上依次沉积所述金属层02和所述第一介质层06之前直接在所述基层01上打孔形成，使所述孔洞04截面处的所述金属层02被所述第一介质层06覆盖；所述金属银幕还包括位于所述基层上表面014和所述金属层下表面021之间的第二介质层07。本申请还提供了一种金属银幕的制备方法，通过调整制作工艺流程中的打孔顺序且在金属层两侧都进行了介质层的沉积，尤其是先在基层上打孔，再依次沉积金属层和介质层，有利于将孔洞截面处的金属层被介质层覆盖，对金属层起到全方位的保护作用，防止使用过程中银幕长时间暴露在空气中造成的氧化，有效提高了金属银幕的使用寿命。本发明的金属银幕可应用于投影***，可用作影院银幕、家庭影院用幕布等。In summary, the present application provides a metal screen. The metal screen includes a base layer 01, a metal layer 02 on the base layer 01, a first dielectric layer 06 covering the metal layer 02, and a punched hole. The holes 04 formed later through the base layer 01 , the metal layer 02 and the first dielectric layer 06 are formed by depositing the metal layer 02 and the first dielectric layer on the base layer 01 in sequence. The layer 06 is directly formed by punching holes on the base layer 01, so that the metal layer 02 at the cross-section of the hole 04 is covered by the first dielectric layer 06; the metal screen also includes an upper surface 014 on the base layer. and the second dielectric layer 07 between the lower surface 021 of the metal layer. The present application also provides a method for preparing a metal screen, by adjusting the punching sequence in the manufacturing process and depositing a dielectric layer on both sides of the metal layer, especially first punching holes on the base layer, and then depositing metal layers in sequence It is beneficial to cover the metal layer at the cross-section of the hole with the dielectric layer, which can protect the metal layer in an all-round way, prevent the screen from being exposed to the air for a long time during use, and effectively improve the metal screen. service life. The metal screen of the present invention can be applied to a projection system, and can be used as a cinema screen, a home theater screen, and the like.
虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。Although this specification is described in terms of embodiments, not every embodiment only includes an independent technical solution. This description in the specification is only for the sake of clarity. Those skilled in the art should take the specification as a whole. The technical solutions can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明 技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present invention, and they are not used to limit the protection scope of the present invention. Changes should all be included within the protection scope of the present invention.

Claims (29)

  1. 一种金属银幕，其特征在于，所述金属银幕包括基层、位于所述基层上的金属层、包覆所述金属层的第一介质层以及经打孔后形成的贯穿所述基层、所述金属层和所述第一介质层的孔洞，所述孔洞是在所述基层上依次沉积所述金属层和所述第一介质层之前直接在所述基层上打孔形成的，使所述孔洞截面处的所述金属层被所述第一介质层覆盖。A metal screen, characterized in that, the metal screen comprises a base layer, a metal layer on the base layer, a first dielectric layer covering the metal layer, and holes formed through the base layer, the The holes of the metal layer and the first dielectric layer are formed by directly punching holes on the base layer before depositing the metal layer and the first dielectric layer on the base layer in sequence, so that the holes The metal layer at the cross section is covered by the first dielectric layer.
  2. 如权利要求1所述的金属银幕，其特征在于，所述孔洞的直径为200μm～600μm。The metal screen of claim 1, wherein the diameter of the hole is 200 μm˜600 μm.
  3. 如权利要求1所述的金属银幕，其特征在于，所述孔洞间距为1000μm～1500μm。The metal screen of claim 1, wherein the hole spacing is 1000 μm˜1500 μm.
  4. 如权利要求1所述的金属银幕，其特征在于，所述金属层为金、银、铝、铜中的至少一种。The metal screen of claim 1, wherein the metal layer is at least one of gold, silver, aluminum, and copper.
  5. 如权利要求1所述的金属银幕，其特征在于，所述金属层的厚度为20nm～200nm。The metal screen of claim 1, wherein the thickness of the metal layer is 20 nm˜200 nm.
  6. 如权利要求1所述的金属银幕，其特征在于，所述金属银幕还包括位于所述基层上表面和所述金属层下表面之间的第二介质层。The metal screen of claim 1, wherein the metal screen further comprises a second dielectric layer located between the upper surface of the base layer and the lower surface of the metal layer.
  7. 如权利要求6所述的金属银幕，其特征在于，所述第一介质层和/或所述第二介质层为二氧化硅、二氧化钛、氮化硅中的至少一种。The metal screen of claim 6, wherein the first dielectric layer and/or the second dielectric layer is at least one of silicon dioxide, titanium dioxide, and silicon nitride.
  8. 如权利要求7所述的金属银幕，其特征在于，所述第一介质层和/或所述第二介质层的厚度为5nm～50nm。The metal screen according to claim 7, wherein the thickness of the first dielectric layer and/or the second dielectric layer is 5 nm˜50 nm.
  9. 如权利要求6所述的金属银幕，其特征在于，所述金属层和/或所述第一介质层和/或所述第二介质层的沉积方式为蒸发镀膜或溅射镀膜。The metal screen according to claim 6, wherein the deposition method of the metal layer and/or the first dielectric layer and/or the second dielectric layer is evaporation coating or sputtering coating.
  10. 如权利要求1所述的金属银幕，其特征在于，所述基层具有基层下表面和与所述基层下表面相对的基层上表面，所述基层上表面为不平坦的微结构化表面，所述金属层具有金属层下表面和金属层上表面， 所述金属层基本上保形于所述基层上表面，使所述金属层上表面形成与所述基层上表面基本一致的微结构化表面。The metal screen of claim 1, wherein the base layer has a base layer lower surface and a base layer upper surface opposite to the base layer lower surface, the base layer upper surface is an uneven microstructured surface, the The metal layer has a lower surface of the metal layer and an upper surface of the metal layer, the metal layer is substantially conformal to the upper surface of the base layer, so that the upper surface of the metal layer forms a microstructured surface substantially consistent with the upper surface of the base layer.
  11. 如权利要求10所述的金属银幕，其特征在于，所述金属层上表面上任一点切线与所述基层下表面平行的平面之间的夹角θ控制在0度至+/-30度之间随机变化。The metal screen according to claim 10, wherein the angle θ between the tangent of any point on the upper surface of the metal layer and the plane parallel to the lower surface of the base layer is controlled between 0 degrees and +/- 30 degrees random change.
  12. 如权利要求10所述的金属银幕，其特征在于，任选一个沿平行于所述基层下表面的方向尺寸大于1mm的区域，所述金属层上表面的结构都由至少两个波峰和至少两个波谷组成，而且波峰波谷具有随机结构。The metal screen according to claim 10, characterized in that, in any region with a dimension greater than 1 mm along a direction parallel to the lower surface of the base layer, the structure of the upper surface of the metal layer is composed of at least two wave peaks and at least two It consists of troughs, and the peaks and troughs have a random structure.
  13. 如权利要求11所述的金属银幕，其特征在于，所述金属层上表面上任一点切线与所述基层下表面平行的平面之间的夹角θ出现的几率随夹角θ的角度连续变化。The metal screen of claim 11, wherein the probability of occurrence of the included angle θ between any point tangent on the upper surface of the metal layer and a plane parallel to the lower surface of the base layer varies continuously with the angle θ.
  14. 如权利要求13所述的金属银幕，其特征在于，所述夹角θ在0度出现的几率最大，所述夹角θ随着角度绝对值的增大出现的几率连续变小。The metal screen of claim 13, wherein the included angle θ has the highest probability of occurrence at 0 degrees, and the occurrence probability of the included angle θ decreases continuously as the absolute value of the angle increases.
  15. 如权利要求14所述的金属银幕，其特征在于，所述夹角θ出现几率的最大值与最小值之比小于10:1。The metal screen of claim 14, wherein the ratio of the maximum value to the minimum value of the occurrence probability of the included angle θ is less than 10:1.
  16. 如权利要求14所述的金属银幕，其特征在于，所述夹角θ出现几率的最大值与最小值之比小于2:1。The metal screen of claim 14, wherein the ratio of the maximum value to the minimum value of the occurrence probability of the included angle θ is less than 2:1.
  17. 如权利要求10至16任意一项所述的金属银幕，其特征在于，所述不平坦的微结构化表面的剖面是弧形结构或波状结构。The metal screen according to any one of claims 10 to 16, wherein the cross section of the uneven microstructured surface is an arc-shaped structure or a wave-shaped structure.
  18. 如权利要求17所述的金属银幕，其特征在于，所述金属层的相邻波峰或相邻波谷之间的特征长度L不大于0.5mm。The metal screen of claim 17, wherein the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer is not greater than 0.5 mm.
  19. 如权利要求17所述的金属银幕，其特征在于，所述金属层的相邻波峰或相邻波谷之间的特征长度L不大于0.05mm。The metal screen of claim 17, wherein the characteristic length L between adjacent wave crests or adjacent wave troughs of the metal layer is not greater than 0.05 mm.
  20. 如权利要求17所述的金属银幕，其特征在于，所述金属层上表面的波峰和波谷之间的高度差不大于100μm。The metal screen of claim 17, wherein the height difference between the wave crests and the wave troughs on the upper surface of the metal layer is not greater than 100 μm.
  21. 如权利要求17所述的金属银幕，其特征在于，所述金属层上表面的波峰和波谷之间的高度差不大于10μm。The metal screen of claim 17, wherein the height difference between the wave crests and the wave troughs on the upper surface of the metal layer is not greater than 10 μm.
  22. 如权利要求10所述的金属银幕，其特征在于，所述基层为聚酯材料。The metal screen of claim 10, wherein the base layer is a polyester material.
  23. 如权利要求22所述的金属银幕，其特征在于，所述聚酯材料为PVC、PET、PC中的至少一种。The metal screen of claim 22, wherein the polyester material is at least one of PVC, PET, and PC.
  24. 如权利要求10所述的金属银幕，其特征在于，所述微结构化表面的制备方式为转印。The metal screen of claim 10, wherein the microstructured surface is prepared by transfer printing.
  25. 如权利要求24所述的金属银幕，其特征在于，所述转印为热转印、UV转印中的任意一种。The metal screen of claim 24, wherein the transfer printing is any one of thermal transfer printing and UV transfer printing.
  26. 如权利要求10所述的金属银幕，其特征在于，制备所述微结构化表面的微结构的制作工艺为压印、表面切削、表面刻蚀、喷砂工艺中的任意一种。11. The metal screen of claim 10, wherein the fabrication process for preparing the microstructure of the microstructured surface is any one of embossing, surface cutting, surface etching, and sandblasting.
  27. 如权利要求1所述的金属银幕，其特征在于，所述金属银幕还包括覆盖层。The metal screen of claim 1, wherein the metal screen further comprises a cover layer.
  28. 一种金属银幕的制备方法，其特征在于，所述的制备方法应用于权利要求1-27任意一项所述的金属银幕，包括如下步骤：首先，制备基层；其次，对制作好的基层进行打孔形成孔洞；再次，对打孔后的基层进行镀膜：在基层上表面依次沉积金属层和第一介质层；最后，在所述第一介质层表面制作覆盖层。A preparation method of a metal screen, characterized in that, the preparation method is applied to the metal screen according to any one of claims 1-27, comprising the following steps: first, preparing a base layer; Holes are formed by punching holes; thirdly, coating the base layer after punching: depositing a metal layer and a first dielectric layer on the upper surface of the base layer in sequence; finally, making a cover layer on the surface of the first dielectric layer.
  29. 如权利要求28所述的金属银幕的制备方法，其特征在于，在沉积所述金属层之前，先在所述基层上表面沉积第二介质层。The method for manufacturing a metal screen according to claim 28, wherein before depositing the metal layer, a second dielectric layer is deposited on the upper surface of the base layer.
PCT/CN2021/127065 2020-12-22 2021-10-28 Metal-coated silver screen and preparation method therefor WO2022134846A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112578625A (en) * 2020-12-22 2021-03-30 江苏集萃智能液晶科技有限公司 Metal screen and preparation method thereof
CN112578626A (en) * 2020-12-22 2021-03-30 江苏集萃智能液晶科技有限公司 High polarization maintaining optical film and projection screen

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117267A (en) * 2003-10-06 2005-04-28 Sony Corp Information transmission system, screen apparatus, and manufacturing method of projection screen
KR20110046717A (en) * 2009-10-29 2011-05-06 박승민 Audio screen system
CN103105721A (en) * 2011-11-14 2013-05-15 精工爱普生株式会社 Screen and method for manufacturing screen
CN105717731A (en) * 2016-04-27 2016-06-29 江苏卡罗卡国际动漫城有限公司 High-gain 3D curved curtain
CN107479316A (en) * 2017-09-06 2017-12-15 贵阳科创科技发展有限公司 A kind of entrant sound projection spherical curtain plate, plane screen plate, curve curtain board, arc curtain plate and preparation method thereof
CN109960101A (en) * 2017-12-25 2019-07-02 冯超 A kind of high definition screen
CN110554558A (en) * 2018-05-31 2019-12-10 深圳光峰科技股份有限公司 High-contrast reflecting screen
CN112578625A (en) * 2020-12-22 2021-03-30 江苏集萃智能液晶科技有限公司 Metal screen and preparation method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117267A (en) * 2003-10-06 2005-04-28 Sony Corp Information transmission system, screen apparatus, and manufacturing method of projection screen
KR20110046717A (en) * 2009-10-29 2011-05-06 박승민 Audio screen system
CN103105721A (en) * 2011-11-14 2013-05-15 精工爱普生株式会社 Screen and method for manufacturing screen
CN105717731A (en) * 2016-04-27 2016-06-29 江苏卡罗卡国际动漫城有限公司 High-gain 3D curved curtain
CN107479316A (en) * 2017-09-06 2017-12-15 贵阳科创科技发展有限公司 A kind of entrant sound projection spherical curtain plate, plane screen plate, curve curtain board, arc curtain plate and preparation method thereof
CN109960101A (en) * 2017-12-25 2019-07-02 冯超 A kind of high definition screen
CN110554558A (en) * 2018-05-31 2019-12-10 深圳光峰科技股份有限公司 High-contrast reflecting screen
CN112578625A (en) * 2020-12-22 2021-03-30 江苏集萃智能液晶科技有限公司 Metal screen and preparation method thereof

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