WO2022133853A1 - 一种移动终端设备用散热组件 - Google Patents

一种移动终端设备用散热组件 Download PDF

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Publication number
WO2022133853A1
WO2022133853A1 PCT/CN2020/138832 CN2020138832W WO2022133853A1 WO 2022133853 A1 WO2022133853 A1 WO 2022133853A1 CN 2020138832 W CN2020138832 W CN 2020138832W WO 2022133853 A1 WO2022133853 A1 WO 2022133853A1
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Prior art keywords
heat
heat dissipation
mobile terminal
pipe
evaporation
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PCT/CN2020/138832
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English (en)
French (fr)
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梅再春
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江西艾普若科技有限责任公司
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Priority to PCT/CN2020/138832 priority Critical patent/WO2022133853A1/zh
Publication of WO2022133853A1 publication Critical patent/WO2022133853A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the field of heat dissipation of mobile terminals, in particular to a heat dissipation component for mobile terminal equipment.
  • a mobile terminal As a simple communication device, a mobile terminal has been accompanying the development of mobile communication for several decades. Since 2007, intelligence has triggered genetic mutation of mobile terminals, which has fundamentally changed the traditional positioning of terminals as the end of mobile networks.
  • the mobile intelligent terminal has transformed into the key entrance and the main innovation platform of Internet business, the new media, e-commerce and information service platform, the most important hub of Internet resources, mobile network resources and environmental interaction resources in an instant.
  • the device chip has even become the strategic commanding height of the entire ICT industry today.
  • the subversive changes caused by mobile smart terminals have opened the prelude to the development of the mobile Internet industry and opened up a new technology industry cycle.
  • the problem to be solved by the present invention is to propose a heat dissipation component for a mobile terminal device, which has the function of greatly improving the internal heat dissipation of the mobile terminal, thereby avoiding the long-term length of the mobile terminal.
  • the mobile terminal is used continuously for a long time, the mobile terminal is burned out due to poor heat dissipation performance.
  • the invention provides a heat dissipation component for mobile terminal equipment, comprising:
  • the back of the casing is provided with a plurality of heat dissipation through holes, and the front surface of the casing is clamped and fixed with a touch display module;
  • main board is arranged inside the casing
  • the heat-conducting plate is arranged on the side of the main board away from the touch display module, and is used for exporting the heat generated by the operation of the main board and reducing the temperature of the main board;
  • a heat-conducting sheet structure the heat-conducting sheet structure is arranged on the side of the heat-conducting plate away from the main board, and is used to dissipate the heat absorbed by the heat-conducting plate, maintain the heat-absorbing ability of the heat-conducting plate, and then maintain the heat-conducting plate.
  • the cooling effect of the plate, the thermally conductive sheet structure includes a plurality of thermally conductive sheets;
  • the heat-dissipating plate is disposed at the end of the heat-conducting sheet structure close to the heat-dissipating through hole, and the heat-dissipating plate is used for absorbing heat in the heat-conducting sheet structure and dissipating the heat;
  • thermal insulation film is arranged on the side of the touch display module close to the main board, and the thermal insulation film is used to prevent the heat generated by the main board from being transferred to the touch display module, resulting in The touch display module heats up;
  • the evaporative heat dissipation device is arranged inside the casing, and is used to absorb and eliminate the heat emitted by the main board and float to the position of the heat insulation film, so as to improve heat dissipation and further prevent heat from being transferred to the contactor. control display module.
  • the evaporative heat dissipation device includes:
  • the evaporation and heat absorption chamber is arranged on the side of the heat insulation film close to the main board, and an easily gasified liquid is arranged inside the evaporation and heat absorption chamber.
  • an easily gasified liquid in the evaporation heat absorption chamber is vaporized and absorbs heat, thereby absorbing external heat;
  • a condenser pipe which is arranged on the inner surface of the back of the casing, the condenser pipe is communicated with one end of the evaporation heat-absorbing chamber through a pipe, and the condenser pipe is used for condensing the vaporized easily gasified liquid Re-liquefaction of the easily gasified liquid, and at the same time, the heat absorbed by the easily gasified liquid is dissipated to the outside through the heat dissipation through holes;
  • a return pipe one end of the return pipe is communicated with the condensation pipe, and the other end of the return pipe is communicated with the evaporation heat-absorbing chamber, and the return pipe is used to condense the easily vaporized liquid from the condensation pipe It is transported back to the evaporation heat-absorbing chamber again, so as to realize the purpose of circulating the easily vaporized liquid to dissipate heat.
  • the return pipe includes:
  • the outer flexible tube is made of rubber material
  • the inner layer of water-absorbing material is arranged inside the outer flexible pipe, and the inner layer of water-absorbing material is used to transport the easily vaporized liquid in the return pipe back to the inside of the evaporation heat-absorbing chamber through capillary phenomenon .
  • the end of the return pipe that communicates with the evaporation heat-absorbing chamber is provided with an atomizing hole, so that when the easily vaporized liquid is transported to the end of the return pipe through the return pipe, it passes through the atomizing hole.
  • the role of the easy-to-gas liquid can be fully diffused, and the efficiency of the easy-to-gas liquid volatilization and heat absorption is improved.
  • the pressure relief protection device is arranged in the condensation pipe, and is used to control the pressure generated by the gasification of the easily gasified liquid, so as to avoid the evaporative heat dissipation device due to excessive internal pressure. and destroyed.
  • the pressure relief protection device includes:
  • a piston block the piston block is slidably fitted in the interior of the condenser pipe, and divides the condenser pipe into two relatively independent chambers, the interior of the piston block is provided with a through hole, and the through hole is connected with the The return pipe is connected;
  • the elastic piece is arranged in the cavity of the condensation pipe close to the return pipe, one end of the elastic piece is fixed on the inner wall of the end of the condensation pipe, and the other end of the elastic piece is fixed on the piston on the block;
  • the end of the condensation pipe close to the return pipe is provided with a pressure relief hole.
  • the air pressure pushes the piston block to overcome the elastic force of the elastic member. While compressing the elastic member, it moves toward the end where the return pipe is located, and the gas in the condenser tube chamber where the elastic member is located is discharged to the outside through the pressure relief hole, so that the space of the condenser tube becomes larger, Realize the pressure relief function.
  • the tube wall of the condensation tube and the tube wall of the evaporative heat absorbing chamber are made of materials with good thermal conductivity, so that the heat dissipation efficiency of the evaporative heat dissipation device is higher.
  • the heat dissipation assembly for mobile terminal equipment further includes an automatic temperature control system
  • the automatic temperature control system includes:
  • the temperature sensor is arranged on the surface of the mainboard and is used to measure the temperature of the mainboard in real time;
  • the fan system is arranged between the condensation pipe and the heat dissipation plate, the fan system is electrically connected with the temperature sensor, and the temperature sensor controls the fan according to the measured temperature data
  • the wind output of the system, the fan system is used to improve the heat dissipation performance of the condensation pipe and the surface of the heat dissipation plate.
  • a plurality of curved cooling fins are arranged on the surface of the cooling plate close to the fan system, the curved cooling fins are parallel to each other, and the air supply direction of the fan system is parallel to the curved cooling fins , so that the wind from the fan system acts on all the curved fins.
  • the edge of the heat dissipation plate is closely matched with the casing, so that the main board, the heat conducting plate and the heat conducting sheet structure are not connected to the outside world, thereby improving the waterproof capability of the terminal device.
  • the invention provides a heat dissipation component for mobile terminal equipment, comprising a casing, a main board, a heat conduction plate, a heat conduction sheet structure, a heat dissipation plate, a heat insulation film, and an evaporative heat dissipation device.
  • a number of heat dissipation through holes are arranged on the back of the casing, and a touch display module is clamped and fixed on the front of the casing.
  • the main board is arranged inside the casing.
  • the heat conduction is arranged on the side of the main board away from the touch display module, and is used to dissipate the heat generated by the operation of the main board and reduce the temperature of the main board.
  • the heat-conducting sheet structure is arranged on the side of the heat-conducting plate away from the main board, and is used for dissipating the heat absorbed by the heat-conducting plate, maintaining the heat-absorbing capacity of the heat-conducting plate, and further maintaining the cooling effect of the heat-conducting plate.
  • the heat-conducting sheet structure includes several heat-conducting sheets.
  • the heat-dissipating plate is arranged on the end of the heat-conducting sheet structure close to the heat-dissipating through hole, and the heat-dissipating plate is used for absorbing the heat in the heat-conducting sheet structure and dissipating the heat.
  • the heat insulation film is arranged on the side of the touch display module close to the main board, and the heat insulation film is used to prevent the heat generated by the main board from being transferred to the touch display module, causing the touch display module to heat up.
  • the evaporative heat dissipation device is arranged inside the casing, and is used for absorbing and eliminating the heat emitted by the motherboard floating to the position of the insulating film, so as to improve the heat dissipation and further prevent the heat from being transferred to the touch display module.
  • the traditional heat dissipation material is on the back of the main board (the surface without electronic components).
  • the heat on the main board can be dissipated through the heat conduction plate, thereby reducing the temperature of the main board and realizing single-sided heat dissipation.
  • the temperature of the touch display module is likely to be too high.
  • a layer of heat insulation film is set on the surface of the main board, and the heat is prevented from being further conducted to the touch display module through the heat insulation film. Therefore, an evaporative heat dissipation device is installed.
  • the heat dissipation device By setting an evaporative heat dissipation device on the surface of the main board close to the touch display module (using liquid material to absorb heat by vaporizing and absorbing heat, and using pipes to transport the vaporized material to a location with good heat dissipation performance, The heat absorbed by the substance is dissipated). Furthermore, the heat released by the surface of the motherboard close to the touch display module can also be absorbed, so that both sides of the motherboard can be dissipated, improving the heat dissipation capability of the terminal, and the heat dissipation device can further prevent the heat released by the motherboard from being transmitted to the touch display.
  • a heat dissipation component for a mobile terminal device disclosed in the present invention adopts a structure that can dissipate heat on both sides of the main board, and has the function of greatly improving the internal heat dissipation of the mobile terminal, thereby avoiding the heat dissipation performance of the mobile terminal when the mobile terminal is continuously used for a long time. poor and the mobile terminal is burned out.
  • the easily vaporized liquid (such as methanol, ethylene glycol, etc.) is condensed and liquefied by using a condensation pipe, and the condensed and liquefied easily vaporized liquid is transported back to the evaporation heat absorption chamber through a return pipe, so that the evaporation absorption
  • the vaporization of the easily vaporized liquid can continue to occur inside the hot chamber, so that the vaporization and heat absorption chamber can continue to vaporize and absorb the heat emitted by the main board, maintaining the heat dissipation function of the evaporative heat dissipation device, while allowing the easily vaporized liquid in it to circulate. use and save resources.
  • the easily vaporized liquid in the condensation pipe can not only be transported through the return pipe under the push of air pressure Into the evaporation and heat absorption chamber, the easily vaporized liquid can also be sucked into the evaporation and heat absorption chamber through the capillary phenomenon of the inner water-absorbing material. So that the easily vaporized liquid in the condensation pipe can enter into the evaporation and heat absorption chamber more easily.
  • water-absorbing material such as cotton, sponge, and other materials with a porous structure
  • the easily vaporized liquid transported back through the return pipe can be atomized into small and uniform water droplets and enter the into the evaporative heat-absorbing chamber to improve the vaporization efficiency of the easily vaporized liquid, thereby improving the heat-absorbing capacity of the evaporating heat-absorbing chamber, and further improving the heat dissipation performance of the terminal.
  • the space of the condensation pipe for accommodating the easily vaporized liquid is automatically increased, thereby reducing the air pressure inside the evaporative heat dissipation device, so as to avoid the evaporation heat dissipation device due to The internal pressure is too high and it is destroyed.
  • the evaporation heat absorption chamber can better absorb the heat released by the main board, while the condensation tube is It can better dissipate the heat in the easily vaporized liquid through its own pipe wall. Thereby, the heat dissipation performance of the terminal is improved.
  • the heat dissipation components can adjust the heat dissipation performance according to the specific heat dissipation conditions of the motherboard, and then meet the heat dissipation performance.
  • the power of the mobile terminal can be saved, and the purpose of low energy consumption and high heat dissipation performance can be achieved.
  • the fan system is used to improve the condensation effect of the condensation pipe and the heat dissipation capacity of the heat dissipation plate, and further improve the heat dissipation performance of the heat dissipation component.
  • the wind output by the fan system can act on all the curved heat sinks, and the curved heat sinks will not block each other.
  • the flow of wind further greatly improves the heat dissipation performance of the heat dissipation plate (increases the fluid flow rate on the surface of the heat sink, thereby improving the convective heat transfer effect), thereby improving the heat dissipation performance of the heat dissipation component.
  • FIG. 1 is a schematic structural diagram of a heat dissipation assembly for a mobile terminal device disclosed in the present invention
  • Fig. 2 is the partial enlarged view of A place in Fig. 1;
  • FIG. 3 is a schematic structural diagram of an evaporative heat dissipation device
  • Fig. 4 is a partial enlarged view at B in Fig. 3;
  • FIG. 5 is a schematic structural diagram of a heat dissipation plate
  • Fig. 6 is a cross-sectional view of the return pipe.
  • a heat dissipation component for a mobile terminal device includes a casing, a main board, a heat conduction plate, a heat conduction sheet structure, a heat dissipation plate, a heat insulation film, and an evaporative heat dissipation device.
  • a number of heat dissipation through holes are arranged on the back of the casing, and a touch display module is clamped and fixed on the front of the casing.
  • the main board is arranged inside the casing.
  • the heat conduction is arranged on the side of the main board away from the touch display module, and is used to dissipate the heat generated by the operation of the main board and reduce the temperature of the main board.
  • the heat-conducting sheet structure is arranged on the side of the heat-conducting plate away from the main board, and is used for dissipating the heat absorbed by the heat-conducting plate, maintaining the heat-absorbing capacity of the heat-conducting plate, and further maintaining the cooling effect of the heat-conducting plate.
  • the heat-conducting sheet structure includes several heat-conducting sheets.
  • the heat-dissipating plate is arranged on the end of the heat-conducting sheet structure close to the heat-dissipating through hole, and the heat-dissipating plate is used for absorbing the heat in the heat-conducting sheet structure and dissipating the heat.
  • the heat insulation film is arranged on the side of the touch display module close to the main board, and the heat insulation film is used to prevent the heat generated by the main board from being transferred to the touch display module, causing the touch display module to heat up.
  • the evaporative heat dissipation device is arranged inside the casing, and is used for absorbing and eliminating the heat emitted by the motherboard floating to the position of the insulating film, so as to improve the heat dissipation and further prevent the heat from being transferred to the touch display module.
  • the traditional heat dissipation material is on the back of the main board (the surface without electronic components).
  • the heat on the main board can be dissipated through the heat conduction plate, thereby reducing the temperature of the main board and realizing single-sided heat dissipation.
  • the temperature of the touch display module is likely to be too high.
  • a layer of heat insulation film is set on the surface of the main board, and the heat is prevented from being further conducted to the touch display module through the heat insulation film. Therefore, an evaporative heat dissipation device is installed.
  • the heat dissipation device By setting an evaporative heat dissipation device on the surface of the main board close to the touch display module (using liquid material to absorb heat by vaporizing and absorbing heat, and using pipes to transport the vaporized material to a location with good heat dissipation performance, The heat absorbed by the substance is dissipated). Furthermore, the heat released by the surface of the motherboard close to the touch display module can also be absorbed, so that both sides of the motherboard can be dissipated, improving the heat dissipation capability of the terminal, and the heat dissipation device can further prevent the heat released by the motherboard from being transmitted to the touch display.
  • the heat dissipation assembly for mobile terminal equipment disclosed in this embodiment adopts a structure that enables heat dissipation on both sides of the motherboard, and has the function of greatly improving the internal heat dissipation of the mobile terminal, thereby avoiding poor heat dissipation performance when the mobile terminal is continuously used for a long time. As a result, the mobile terminal is burned out.
  • the evaporative heat dissipation device includes a return pipe, a condenser pipe, and an evaporative heat absorption chamber.
  • the evaporation and heat-absorbing chamber is set on the side of the thermal insulation film close to the main board.
  • the inside of the evaporation and heat-absorbing chamber is provided with easily vaporized liquid (such as methanol, ethylene glycol, etc., which are volatile and absorb heat during the volatilization process).
  • easily vaporized liquid such as methanol, ethylene glycol, etc., which are volatile and absorb heat during the volatilization process.
  • the condensing pipe is arranged on the inner surface of the back of the shell, and the condensing pipe is connected with one end of the evaporation heat-absorbing chamber through a pipeline.
  • the heat absorbed by the liquid is dissipated to the outside through the heat dissipation through holes.
  • One end of the return pipe is connected with the condensation pipe, and the other end of the return pipe is connected with the evaporation heat-absorbing chamber.
  • the return pipe is used to re-transport the easily gasified liquid condensed by the condensation pipe back to the evaporation and heat-absorbing chamber, so as to realize the recycling utilization of the easily gasified liquid.
  • the purpose of the liquid to dissipate heat.
  • the main board inside the terminal heats up, generates a lot of heat, and dissipates heat to the evaporative heat-absorbing chamber.
  • the liquid vaporization process is an endothermic process, so that the evaporative heat absorption chamber further absorbs the heat emitted by the motherboard, reduces the temperature of the surrounding environment of the motherboard, makes the motherboard heat dissipation faster, and improves the heat dissipation capacity of the motherboard.
  • the vaporized easily vaporized liquid is transported into the condensation pipe through the pipeline.
  • the condensation pipe Since the condensation pipe is located in the position where the terminal machine is convenient for heat dissipation (such as the position close to the heat dissipation through hole of the casing), the gaseous easily gasified material is relatively cold when it encounters When the condensing tube is installed, heat is released and converted into liquid again. The heat released during the condensation process of gaseous easily gasified substances is dissipated to the outside through the tube wall of the condensing tube, and is dissipated to the outside through the heat dissipation through holes.
  • the easily vaporized liquid after condensation and liquefaction is re-returned to the evaporative heat-absorbing chamber through the conveying action of the return pipe (the easily vaporizable liquid in the condensing pipe is squeezed into the evaporative heat-absorbing chamber by the air pressure given by the gaseous easily-vaporizable substance itself), so that Repeated endothermic and exothermic actions.
  • the evaporation and heat absorption chamber is connected to the condensation tube.
  • the position of the pipeline is provided with a limiter, so that only when the easily vaporized liquid has a certain pressure after being vaporized, it can pass the limiter, so as to ensure that the evaporative heat dissipation device can work normally.
  • the easily vaporized liquid (such as methanol, ethylene glycol, etc.) is condensed and liquefied by using a condensation pipe, and the condensed and liquefied easily vaporized liquid is transported back to the evaporation heat absorption chamber through a return pipe, so that the evaporation absorption
  • the vaporization of the easily vaporized liquid can continue to occur inside the hot chamber, so that the vaporization and heat absorption chamber can continue to vaporize and absorb the heat emitted by the main board. use and save resources.
  • the return pipe includes an outer flexible pipe and an inner layer of water-absorbing material.
  • the outer flexible tube is made of rubber material.
  • the inner layer of water-absorbing material is arranged inside the outer flexible pipe, and the inner layer of water-absorbing material is used to transport the easily vaporized liquid in the return pipe back to the inside of the evaporation and heat-absorbing chamber through capillary phenomenon.
  • the outer flexible tube wrap the inner layer of water-absorbing material (such as cotton, sponge, etc. materials with porous structure) to make the return pipe, so that the easily gasified liquid in the condensation pipe can not only be transported through the return pipe under the push of air pressure.
  • the easily vaporized liquid can also be sucked into the evaporation and heat absorption chamber through the capillary phenomenon of the inner water-absorbing material. So that the easily vaporized liquid in the condensation pipe can enter into the evaporation and heat absorption chamber more easily.
  • the end of the return pipe that communicates with the evaporation heat-absorbing chamber is provided with atomization holes, so that when the easily gasified liquid is transported to the end of the return pipe through the return pipe, the effect of the atomization holes makes the easily gasified liquid.
  • the liquid is fully diffused and the efficiency of volatilization and heat absorption of the easily vaporized liquid is improved.
  • the easily vaporized liquid transported back through the return pipe can be atomized into small and uniform water droplets and enter the into the evaporative heat-absorbing chamber to improve the vaporization efficiency of the easily vaporized liquid, thereby improving the heat-absorbing capacity of the evaporating heat-absorbing chamber, and further improving the heat dissipation performance of the terminal.
  • a pressure relief protection device is also included.
  • the pressure relief protection device is arranged in the condensation pipe and is used to control the pressure generated by the gasification of the easily gasified liquid, so as to prevent the evaporative heat dissipation device from being damaged due to excessive internal pressure.
  • the pressure relief protection device includes an elastic member and a piston block.
  • the piston block is slidably fitted in the inside of the condenser pipe, and divides the condenser pipe into two relatively independent chambers.
  • the inside of the piston block is provided with a through hole, and the through hole is communicated with the return pipe.
  • the elastic piece is arranged in the chamber of the condensation pipe close to the return pipe, one end of the elastic piece is fixed on the inner wall of the end of the condensation pipe, and the other end of the elastic piece is fixed on the piston block.
  • the end of the condensation pipe close to the return pipe is provided with a pressure relief hole.
  • the space of the condensation pipe for accommodating the easily vaporized liquid is automatically increased, thereby reducing the air pressure inside the evaporative heat dissipation device, so as to avoid the evaporation heat dissipation device due to The internal pressure is too high and it is destroyed.
  • the tube wall of the condensation tube and the tube wall of the evaporative heat absorbing chamber are made of materials with good thermal conductivity, so that the heat dissipation efficiency of the evaporative heat dissipation device is higher.
  • materials with good thermal conductivity copper, aluminum and other materials
  • the evaporation heat absorption chamber can better absorb the heat released by the main board, while the condensation tube It can better dissipate the heat in the easily vaporized liquid through its own pipe wall. Thereby, the heat dissipation performance of the terminal is improved.
  • the heat dissipation component for mobile terminal equipment also includes an automatic temperature control system
  • the automatic temperature control system includes a temperature sensor and a fan system.
  • the temperature sensor is arranged on the surface of the mainboard and is used to measure the temperature of the mainboard in real time.
  • the fan system is arranged between the condenser tube and the heat sink, and the fan system is electrically connected to the temperature sensor.
  • the temperature sensor controls the wind output of the fan system according to the measured temperature data.
  • the fan system is used to improve the heat dissipation of the condenser tube and the surface of the heat sink. performance.
  • the heat dissipation components can adjust the heat dissipation performance according to the specific heat dissipation conditions of the motherboard, and then meet the heat dissipation performance.
  • the power of the mobile terminal can be saved, and the purpose of low energy consumption and high heat dissipation performance can be achieved.
  • the fan system is used to improve the condensation effect of the condensation pipe and the heat dissipation capacity of the heat dissipation plate, and further improve the heat dissipation performance of the heat dissipation component.
  • a number of curved heat sinks are arranged on the surface of the heat dissipation plate close to the fan system, and the curved heat sinks are parallel to each other, and the air supply direction of the fan system is parallel to the curved heat sink, so that the wind sent by the fan system acts on all parts. on the curved heat sink.
  • the flow of wind further greatly improves the heat dissipation performance of the heat dissipation plate (increases the fluid flow rate on the surface of the heat sink, thereby improving the convective heat transfer effect), thereby improving the heat dissipation performance of the heat dissipation component.
  • the edge of the heat dissipation plate is closely matched with the casing (the connection position of the two can be sealed by a gasket), so that the main board, the heat conduction plate and the heat conduction sheet structure are not connected with the outside world, and the waterproof ability of the terminal device is improved.
  • the edge of the heat dissipation plate closely fit with the casing, the external water will not directly enter and contact the motherboard through the heat dissipation through hole on the casing, so that the mobile terminal has a certain waterproof ability.

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Abstract

一种移动终端设备用散热组件，该散热组件包括外壳、主板、导热板、导热片结构、散热板、隔热膜、蒸发散热装置。外壳的背面设置有若干散热通孔，外壳的正面卡接固定有触控显示模块。主板设置于外壳内部。导热板设置于主板上远离触控显示模块的一侧。导热片结构设置于导热板上远离主板的一侧，导热片结构包括若干导热片。散热板设置于导热片结构靠近散热通孔的端部。隔热膜设置于触控显示模块上靠近主板的一面。蒸发散热装置设置于外壳内部。该散热组件可提高移动终端内部散热的性能，避免移动终端长时间持续使用时因散热性能差而导致移动终端被烧坏。

Description

一种移动终端设备用散热组件 技术领域
本发明涉及移动终端散热领域，尤其涉及一种移动终端设备用散热组件。
背景技术
移动终端作为简单通信设备伴随移动通信发展已有几十年的历史。自2007年开始，智能化引发了移动终端基因突变，从根本上改变了终端作为移动网络末梢的传统定位。移动智能终端几乎在一瞬之间转变为互联网业务的关键入口和主要创新平台，新型媒体、电子商务和信息服务平台，互联网资源、移动网络资源与环境交互资源的最重要枢纽，其操作***和处理器芯片甚至成为当今整个ICT产业的战略制高点。移动智能终端引发的颠覆性变革揭开了移动互联网产业发展的序幕，开启了一个新的技术产业周期。随着移动智能终端的持续发展，其影响力将比肩收音机、电视和互联网(PC)，成为人类历史上第4个渗透广泛、普及迅速、影响巨大、深入至人类社会生活方方面面的终端产品。由于移动终端基本体积比较小，但是其内部电路复杂，故而散热性能不佳成为现今移动终端存在的很大问题，散热不佳的终端长时间使用后机体发热严重，甚至于损伤移动终端内部的电器元件。
发明内容
为了克服现有技术中移动终端存在的散热性能不佳的缺陷，本发明所需要解决的问题在于提出一种移动终端设备用散热组件，具有可大幅提高移动终端内部散热的功能，进而避免移动终端长时间持续使用时因散热性能差而导致移动终端被烧坏。
为达此目的，本发明采用以下技术方案：
本发明提供的一种移动终端设备用散热组件，包括：
外壳，所述外壳的背面设置有若干散热通孔，所述外壳的正面卡接固定有触控显示模块；
主板，所述主板设置于所述外壳内部；
导热板，所述导热设置于所述主板上远离所述触控显示模块的一侧，用于将所述主板工作产生的热量导出，降低所述主板的温度；
导热片结构，所述导热片结构设置于所述导热板上远离所述主板的一侧，用于将所述导热板吸收的热量进行散发，保持所述导热板的吸热能力，进而保持导热板的降温效果，所述导热片结构包括若干导热片；
散热板，所述散热板设置于所述导热片结构靠近所述散热通孔的端部，所述散热板用于吸收所述导热片结构内的热量并将该热量进行发散；
隔热膜，所述隔热膜设置于所述触控显示模块上靠近所述主板的一面，所述隔热膜用于避免所述主板产生的热量传递至所述触控显示模块，导致所述触控显示模块发热；
蒸发散热装置，所述蒸发散热装置设置于所述外壳内部，用于将由所述主板发出的漂浮至所述隔热膜位置的热量进行吸收消除，提高散热的同时进一步避免热量传递至所述触控显示模块。
优选地，所述蒸发散热装置包括：
蒸发吸热室，所述蒸发吸热室设置于所述隔热膜靠近所述主板的一面，所述蒸发吸热室内部设置有易气化液体，当所述蒸发吸热室外部的热量传递至所述蒸发吸热室时，所述蒸发吸热室内的易气化液体发生气化并吸热，进而将外部的热量进行吸收；
冷凝管，所述冷凝管设置于所述外壳背面的内表面，所述冷凝管通过管道与所述蒸发吸热室的一端相连通，所述冷凝管用于将气化的易气化液体进行冷 凝使易气化液体重新液化，同时将易气化液体吸收的热量通过所述散热通孔散发到外界；
回流管，所述回流管一端与所述冷凝管相连通，所述回流管的另一端与所述蒸发吸热室相连通，所述回流管用于将所述冷凝管冷凝后的易气化液体重新输送回所述蒸发吸热室，进而实现循环利用易气化液体进行散热的目的。
优选地，所述回流管包括：
外部柔性管，所述外部柔性管采用橡胶材料制成；
内层吸水材料，所述内层吸水材料设置于所述外部柔性管内部，所述内层吸水材料用于通过毛细现象将所述回流管内的易气化液体输送回所述蒸发吸热室内部。
优选地，所述回流管与所述蒸发吸热室相连通的端部设置有雾化小孔，使当易气化液体经过所述回流管输送至回流管端部时，通过雾化小孔的作用使得易气化液体充分的扩散开，提高易气化液体挥发吸热的效率。
优选地，还包括卸压保护装置，所述卸压保护装置设置于所述冷凝管内，用于控制所述易气化液体气化后产生的压力，避免所述蒸发散热装置因内部压力过大而被破坏。
优选地，所述卸压保护装置包括：
活塞块，所述活塞块滑动配合于所述冷凝管的内部，并且将所述冷凝管分隔成两个相对独立的腔室，所述活塞块的内部设置有通孔，所述通孔与所述回流管相连通；
弹性件，所述弹性件设置于所述冷凝管靠近所述回流管的腔室内，所述弹性件一端固定于所述冷凝管端部的内壁上，所述弹性件另一端固定于所述活塞块上；
所述冷凝管靠近所述回流管的端部设置有卸压孔，当易气化液体受热气化使得蒸发散热装置内部压力增大时，气压推动所述活塞块克服所述弹性件的弹力，压缩所述弹性件的同时朝靠近所述回流管所在端运动，所述弹性件所处的冷凝管腔室内的气体通过所述卸压孔向外排出，使得所述冷凝管的空间变大，实现卸压功能。
优选地，所述冷凝管的管壁以及所述蒸发吸热室的管壁均采用导热性能良好的材料制成，使得所述蒸发散热装置散热效率更高。
优选地，所述移动终端设备用散热组件还包括自动控温***，所述自动控温***包括：
温度感应器，所述温度感应器设置于所述主板的表面，用于实时测量所述主板的温度；
风扇***，所述风扇***设置于所述冷凝管以及所述散热板之间，所述风扇***与所述温度感应器电性连接，所述温度感应器根据测出的温度数据控制所述风扇***的风力输出，所述风扇***用于提高所述冷凝管以及所述散热板表面散热性能。
优选地，所述散热板上靠近所述风扇***的面上设置有若干弯曲散热片，所述弯曲散热片之间相互平行，且所述风扇***的送风方向与所述弯曲散热片相平行，使得所述风扇***送出的风作用于所有的弯曲散热片上。
优选地，所述散热板的边缘与所述外壳紧密配合，使得所述主板、所述导热板、以及导热片结构不与外界相连通，提高终端设备的防水能力。
本发明的有益效果为：
本发明提供的一种移动终端设备用散热组件，包括外壳、主板、导热板、导热片结构、散热板、隔热膜、蒸发散热装置。外壳的背面设置有若干散热通 孔，外壳的正面卡接固定有触控显示模块。主板设置于外壳内部。导热设置于主板上远离触控显示模块的一侧，用于将主板工作产生的热量导出，降低主板的温度。导热片结构设置于导热板上远离主板的一侧，用于将导热板吸收的热量进行散发，保持导热板的吸热能力，进而保持导热板的降温效果，导热片结构包括若干导热片。散热板设置于导热片结构靠近散热通孔的端部，散热板用于吸收导热片结构内的热量并将该热量进行发散。隔热膜设置于触控显示模块上靠近主板的一面，隔热膜用于避免主板产生的热量传递至触控显示模块，导致触控显示模块发热。蒸发散热装置设置于外壳内部，用于将由主板发出的漂浮至隔热膜位置的热量进行吸收消除，提高散热的同时进一步避免热量传递至触控显示模块。当终端进行工作时，由于终端内的主板上设置有大量的电子元件，故而，长时间工作后，主板表面产生大量的热量，传统的散热方式材料在主板的背面(未安装电子元件的面)，通过在主板的背面设置导热板，使得主板上的热量可以通过导热板的进行发散，进而降低主板的温度，实现单面散热。但是由于主板上的热量朝着触控显示模块所在位置进行扩散时，容易导致触控显示模块温度过高，为了避免主板的温度传导至触控显示模块，故而在触控显示模块的底面(靠近主板的面)上设置一层隔热膜，通过隔热膜阻止热量进一步传导至触控显示模块上，但是由于设置了隔热膜导致主板靠近触控显示模块面的热量无法良好的进行发散，故而设置蒸发散热装置，通过在主板靠近触控显示模块面上设置蒸发散热装置(采用液体物质气化吸热的方式吸收热量，并采用管道将气化后的物质输送到散热性能良好的位置，将该物质吸收的热量进行发散)。进而使得主板靠近触控显示模块的面释放的热量也可以被吸收，使得主板两面均可以进行散热，提高终端的散热能力，并且通过蒸发散热装置可以进一步的阻止主板释放的热量传递至触控显示模块，进而控制触控显示模块 温度处于适宜温度(使得用户使用终端时不会明显察觉触控显示屏温度很高)。综上，本发明公开的一种移动终端设备用散热组件，采用使主板双面均能散热的结构，具有可大幅提高移动终端内部散热的功能，进而避免移动终端长时间持续使用时因散热性能差而导致移动终端被烧坏。
通过采用冷凝管将气化的易气化液体(如甲醇、乙二醇等)进行冷凝液化，并通过回流管将冷凝液化后的易气化液体重新输送回到蒸发吸热室内，使得蒸发吸热室内部能够持续发生易气化液体气化的动作，使得蒸发吸热室可以持续发生气化并吸收主板发散的热量，保持蒸发散热装置的散热功能的同时使得其中的易气化液体可以循环使用，节约资源。
通过在采用外部柔性管包裹内层吸水材料(如棉花、海绵等具有多孔结构的材料)的结构制成回流管，使得处于冷凝管内的易气化液体不仅可以在气压的推动下经由回流管输送至蒸发吸热室内，还可以通过内层吸水材料的毛细现象将易气化液体吸入到蒸发吸热室内。使得处于冷凝管内的易气化液体可更加简单的进入到蒸发吸热室内。
通过在回流管与蒸发吸热室相连通的端部设置雾化小孔，使得经由回流管输送回的易气化液体在经过该雾化小孔时，得以雾化成细小均匀的水珠并进入到蒸发吸热室内，提高易气化液体的气化效率，进而提高蒸发吸热室的吸热能力，进而提高终端的散热性能。
通过在冷凝管内设置卸压保护装置，使得当易气化液体气化时，冷凝管用于容纳易气化液体的空间自动增大，进而降低蒸发散热装置内部的气压，避免所述蒸发散热装置因内部压力过大而被破坏。
通过采用导热性能良好的材料(铜、铝等材料)制成冷凝管的管壁以及蒸发吸热室的管壁，使得蒸发吸热室可以更好的吸收主板释放出的热量，而冷凝 管则可以更好地将易气化液体中的热量通过自身管壁向外散发。进而提高终端的散热性能。
通过设置自动控温***，采用温度感应器监控主板表面的温度，并通过监控获取的温度值控制风扇***的输出功率，使得散热组件可以根据主板具体的散热情况调节散热性能，进而在满足散热性能的同时可以节约移动终端的电能，达到低能耗高散热性能的目的。同时采用风扇***提高冷凝管的冷凝效果以及散热板的散热能力，进一步提高散热组件的散热性能。
通过在散热板上设置若干弯曲散热片，并使得风扇***的送风方向与弯曲散热片相平行，使得风扇***输出的风可作用到所有的弯曲散热片上，弯曲散热片之间不会相互阻挡风的流动，进而使得散热板的散热性能大幅提升(提高散热片表面流体流速，进而使得对流换热效果提高)，进而提高散热组件的散热性能。
通过使散热板的边缘与外壳紧密配合，使得外界的水不会通过外壳上的散热通孔直接进入并与主板接触，进而使得移动终端具有一定的防水能力。
附图说明
图1为本发明公开的移动终端设备用散热组件的结构示意图；
图2为图1中A处的局部放大视图；
图3为蒸发散热装置的结构示意图；
图4为图3中B处的局部放大视图；
图5为散热板的结构示意图；
图6为回流管的截面图。
图中：
1、外壳；2、主板；3、导热板；4、导热片结构；5、散热板；6、隔热膜；7、蒸发散热装置；8、自动控温***；9、触控显示模块；11、散热通孔；51、弯曲散热片；71、蒸发吸热室；72、冷凝管；73、回流管；74、卸压保护装置；75、限制器；81、温度感应器；82、风扇***；731、外部柔性管；732、内层吸水材料；741、活塞块；742、弹性件。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
如图1至图6所示，
本实施例中提供的一种移动终端设备用散热组件,包括外壳、主板、导热板、导热片结构、散热板、隔热膜、蒸发散热装置。外壳的背面设置有若干散热通孔，外壳的正面卡接固定有触控显示模块。主板设置于外壳内部。导热设置于主板上远离触控显示模块的一侧，用于将主板工作产生的热量导出，降低主板的温度。导热片结构设置于导热板上远离主板的一侧，用于将导热板吸收的热量进行散发，保持导热板的吸热能力，进而保持导热板的降温效果，导热片结构包括若干导热片。散热板设置于导热片结构靠近散热通孔的端部，散热板用于吸收导热片结构内的热量并将该热量进行发散。隔热膜设置于触控显示模块上靠近主板的一面，隔热膜用于避免主板产生的热量传递至触控显示模块，导致触控显示模块发热。蒸发散热装置设置于外壳内部，用于将由主板发出的漂浮至隔热膜位置的热量进行吸收消除，提高散热的同时进一步避免热量传递至触控显示模块。当终端进行工作时，由于终端内的主板上设置有大量的电子元件，故而，长时间工作后，主板表面产生大量的热量，传统的散热方式材料在主板的背面(未安装电子元件的面)，通过在主板的背面设置导热板，使得主板上的热量可以通过导热板的进行发散，进而降低主板的温度，实现单面散热。 但是由于主板上的热量朝着触控显示模块所在位置进行扩散时，容易导致触控显示模块温度过高，为了避免主板的温度传导至触控显示模块，故而在触控显示模块的底面(靠近主板的面)上设置一层隔热膜，通过隔热膜阻止热量进一步传导至触控显示模块上，但是由于设置了隔热膜导致主板靠近触控显示模块面的热量无法良好的进行发散，故而设置蒸发散热装置，通过在主板靠近触控显示模块面上设置蒸发散热装置(采用液体物质气化吸热的方式吸收热量，并采用管道将气化后的物质输送到散热性能良好的位置，将该物质吸收的热量进行发散)。进而使得主板靠近触控显示模块的面释放的热量也可以被吸收，使得主板两面均可以进行散热，提高终端的散热能力，并且通过蒸发散热装置可以进一步的阻止主板释放的热量传递至触控显示模块，进而控制触控显示模块温度处于适宜温度(使得用户使用终端时不会明显察觉触控显示屏温度很高)。综上，本实施例公开的移动终端设备用散热组件，采用使主板双面均能散热的结构，具有可大幅提高移动终端内部散热的功能，进而避免移动终端长时间持续使用时因散热性能差而导致移动终端被烧坏。
进一步地，蒸发散热装置包括回流管、冷凝管、蒸发吸热室。蒸发吸热室设置于隔热膜靠近主板的一面，蒸发吸热室内部设置有易气化液体(如甲醇、乙二醇等易挥发且挥发过程吸热的液体)，当蒸发吸热室外部的热量传递至蒸发吸热室时，蒸发吸热室内的易气化液体发生气化并吸热，进而将外部的热量进行吸收。冷凝管设置于外壳背面的内表面，冷凝管通过管道与蒸发吸热室的一端相连通，冷凝管用于将气化的易气化液体进行冷凝使易气化液体重新液化，同时将易气化液体吸收的热量通过散热通孔散发到外界。回流管一端与冷凝管相连通，回流管的另一端与蒸发吸热室相连通，回流管用于将冷凝管冷凝后的易气化液体重新输送回蒸发吸热室，进而实现循环利用易气化液体进行散热的 目的。当终端进行工作时，终端内部的主板发热，产生大量的热量，并向蒸发吸热室散发热量，蒸发吸热室吸收主板发出的热量，并导致其内部的易气化液体发生气化，该液体气化过程为吸热过程，进而使得蒸发吸热室进一步的吸收主板发出的热量，降低主板周围环境的温度，使得主板散热更加快速，提高主板的散热能力。而被气化的易气化液体通过管道被输送至冷凝管内，由于冷凝管处于终端机散热方便的位置(如靠近外壳散热通孔的位置)，使得气态的易气化物质在遇到较冷的冷凝管时，释放热量并重新转变成液体，气态的易气化物质冷凝过程中释放的热量通过冷凝管的管壁散发到外部，并通过散热通孔向外界散发。冷凝液化后的易气化液体通过回流管的输送作用从新回到蒸发吸热室内(通过气态的易气化物质自身给予的气压将冷凝管内的易气化液体挤至蒸发吸热室内)，做重复的吸热放热动作。并且为了避免处于蒸发吸热室内的易气化液体因重力而未气化时全部进入到冷凝管内，导致蒸发吸热室内无易气化液体的情况出现，故而在蒸发吸热室与冷凝管相连的管道的位置设置有限制器，使得只有当易气化液体气化后具有一定的压力时才能通过限制器，保证蒸发散热装置可以正常工作。通过采用冷凝管将气化的易气化液体(如甲醇、乙二醇等)进行冷凝液化，并通过回流管将冷凝液化后的易气化液体重新输送回到蒸发吸热室内，使得蒸发吸热室内部能够持续发生易气化液体气化的动作，使得蒸发吸热室可以持续发生气化并吸收主板发散的热量，保持蒸发散热装置的散热功能的同时使得其中的易气化液体可以循环使用，节约资源。
进一步地，回流管包括外部柔性管、内层吸水材料。外部柔性管采用橡胶材料制成。内层吸水材料设置于外部柔性管内部，内层吸水材料用于通过毛细现象将回流管内的易气化液体输送回蒸发吸热室内部。通过在采用外部柔性管包裹内层吸水材料(如棉花、海绵等具有多孔结构的材料)的结构制成回流管， 使得处于冷凝管内的易气化液体不仅可以在气压的推动下经由回流管输送至蒸发吸热室内，还可以通过内层吸水材料的毛细现象将易气化液体吸入到蒸发吸热室内。使得处于冷凝管内的易气化液体可更加简单的进入到蒸发吸热室内。
进一步地，回流管与蒸发吸热室相连通的端部设置有雾化小孔，使当易气化液体经过回流管输送至回流管端部时，通过雾化小孔的作用使得易气化液体充分的扩散开，提高易气化液体挥发吸热的效率。通过在回流管与蒸发吸热室相连通的端部设置雾化小孔，使得经由回流管输送回的易气化液体在经过该雾化小孔时，得以雾化成细小均匀的水珠并进入到蒸发吸热室内，提高易气化液体的气化效率，进而提高蒸发吸热室的吸热能力，进而提高终端的散热性能。
进一步地，还包括卸压保护装置，卸压保护装置设置于冷凝管内，用于控制易气化液体气化后产生的压力，避免蒸发散热装置因内部压力过大而被破坏。进一步地，卸压保护装置包括弹性件、活塞块。活塞块滑动配合于冷凝管的内部，并且将冷凝管分隔成两个相对独立的腔室，活塞块的内部设置有通孔，通孔与回流管相连通。弹性件设置于冷凝管靠近回流管的腔室内，弹性件一端固定于冷凝管端部的内壁上，弹性件另一端固定于活塞块上。冷凝管靠近回流管的端部设置有卸压孔，当易气化液体受热气化使得蒸发散热装置内部压力增大时，气压推动活塞块克服弹性件的弹力，压缩弹性件的同时朝靠近回流管所在端运动，弹性件所处的冷凝管腔室内的气体通过卸压孔向外排出，使得冷凝管的空间变大，实现卸压功能。通过在冷凝管内设置卸压保护装置，使得当易气化液体气化时，冷凝管用于容纳易气化液体的空间自动增大，进而降低蒸发散热装置内部的气压，避免所述蒸发散热装置因内部压力过大而被破坏。
进一步地，冷凝管的管壁以及蒸发吸热室的管壁均采用导热性能良好的材料制成，使得蒸发散热装置散热效率更高。通过采用导热性能良好的材料(铜、 铝等材料)制成冷凝管的管壁以及蒸发吸热室的管壁，使得蒸发吸热室可以更好的吸收主板释放出的热量，而冷凝管则可以更好地将易气化液体中的热量通过自身管壁向外散发。进而提高终端的散热性能。
进一步地，移动终端设备用散热组件还包括自动控温***，自动控温***包括温度感应器、风扇***。温度感应器设置于主板的表面，用于实时测量主板的温度。风扇***设置于冷凝管以及散热板之间，风扇***与温度感应器电性连接，温度感应器根据测出的温度数据控制风扇***的风力输出，风扇***用于提高冷凝管以及散热板表面散热性能。通过设置自动控温***，采用温度感应器监控主板表面的温度，并通过监控获取的温度值控制风扇***的输出功率，使得散热组件可以根据主板具体的散热情况调节散热性能，进而在满足散热性能的同时可以节约移动终端的电能，达到低能耗高散热性能的目的。同时采用风扇***提高冷凝管的冷凝效果以及散热板的散热能力，进一步提高散热组件的散热性能。
进一步地，散热板上靠近风扇***的面上设置有若干弯曲散热片，弯曲散热片之间相互平行，且风扇***的送风方向与弯曲散热片相平行，使得风扇***送出的风作用于所有的弯曲散热片上。通过在散热板上设置若干弯曲散热片，并使得风扇***的送风方向与弯曲散热片相平行，使得风扇***输出的风可作用到所有的弯曲散热片上，弯曲散热片之间不会相互阻挡风的流动，进而使得散热板的散热性能大幅提升(提高散热片表面流体流速，进而使得对流换热效果提高)，进而提高散热组件的散热性能。
进一步地，散热板的边缘与外壳紧密配合(二者连接位置可以采用垫圈进行密封)，使得主板、导热板、以及导热片结构不与外界相连通，提高终端设备的防水能力。通过使散热板的边缘与外壳紧密配合，使得外界的水不会通过 外壳上的散热通孔直接进入并与主板接触，进而使得移动终端具有一定的防水能力。
本发明是通过优选实施例进行描述的，本领域技术人员知悉，在不脱离本发明的精神和范围的情况下，可以对这些特征和实施例进行各种改变或等效替换。本发明不受此处所公开的具体实施例的限制，其他落入本申请的权利要求内的实施例都属于本发明保护的范围。

Claims (10)

  1. 一种移动终端设备用散热组件，其特征在于，包括：
    外壳，所述外壳的背面设置有若干散热通孔，所述外壳的正面卡接固定有触控显示模块；
    主板，所述主板设置于所述外壳内部；
    导热板，所述导热设置于所述主板上远离所述触控显示模块的一侧，用于将所述主板工作产生的热量导出，降低所述主板的温度；
    导热片结构，所述导热片结构设置于所述导热板上远离所述主板的一侧，用于将所述导热板吸收的热量进行散发，保持所述导热板的吸热能力，进而保持导热板的降温效果，所述导热片结构包括若干导热片；
    散热板，所述散热板设置于所述导热片结构靠近所述散热通孔的端部，所述散热板用于吸收所述导热片结构内的热量并将该热量进行发散；
    隔热膜，所述隔热膜设置于所述触控显示模块上靠近所述主板的一面，所述隔热膜用于避免所述主板产生的热量传递至所述触控显示模块，导致所述触控显示模块发热；
    蒸发散热装置，所述蒸发散热装置设置于所述外壳内部，用于将由所述主板发出的漂浮至所述隔热膜位置的热量进行吸收消除，提高散热的同时进一步避免热量传递至所述触控显示模块。
  2. 根据权利要求1所述的一种移动终端设备用散热组件，其特征在于，所述蒸发散热装置包括：
    蒸发吸热室，所述蒸发吸热室设置于所述隔热膜靠近所述主板的一面，所述蒸发吸热室内部设置有易气化液体，当所述蒸发吸热室外部的热量传递至所述蒸发吸热室时，所述蒸发吸热室内的易气化液体发生气化并吸热，进而将外部的热量进行吸收；
    冷凝管，所述冷凝管设置于所述外壳背面的内表面，所述冷凝管通过管道与所述蒸发吸热室的一端相连通，所述冷凝管用于将气化的易气化液体进行冷凝使易气化液体重新液化，同时将易气化液体吸收的热量通过所述散热通孔散发到外界；
    回流管，所述回流管一端与所述冷凝管相连通，所述回流管的另一端与所述蒸发吸热室相连通，所述回流管用于将所述冷凝管冷凝后的易气化液体重新输送回所述蒸发吸热室，进而实现循环利用易气化液体进行散热的目的。
  3. 根据权利要求2所述的一种移动终端设备用散热组件，其特征在于，所述回流管包括：
    外部柔性管，所述外部柔性管采用橡胶材料制成；
    内层吸水材料，所述内层吸水材料设置于所述外部柔性管内部，所述内层吸水材料用于通过毛细现象将所述回流管内的易气化液体输送回所述蒸发吸热室内部。
  4. 根据权利要求2所述的一种移动终端设备用散热组件，其特征在于：
    所述回流管与所述蒸发吸热室相连通的端部设置有雾化小孔，使当易气化液体经过所述回流管输送至回流管端部时，通过雾化小孔的作用使得易气化液体充分的扩散开，提高易气化液体挥发吸热的效率。
  5. 根据权利要求2所述的一种移动终端设备用散热组件，其特征在于：
    还包括卸压保护装置，所述卸压保护装置设置于所述冷凝管内，用于控制所述易气化液体气化后产生的压力，避免所述蒸发散热装置因内部压力过大而被破坏。
  6. 根据权利要求5所述的一种移动终端设备用散热组件，其特征在于，所述卸压保护装置包括：
    活塞块，所述活塞块滑动配合于所述冷凝管的内部，并且将所述冷凝管分隔成两个相对独立的腔室，所述活塞块的内部设置有通孔，所述通孔与所述回流管相连通；
    弹性件，所述弹性件设置于所述冷凝管靠近所述回流管的腔室内，所述弹性件一端固定于所述冷凝管端部的内壁上，所述弹性件另一端固定于所述活塞块上；
    所述冷凝管靠近所述回流管的端部设置有卸压孔，当易气化液体受热气化使得蒸发散热装置内部压力增大时，气压推动所述活塞块克服所述弹性件的弹力，压缩所述弹性件的同时朝靠近所述回流管所在端运动，所述弹性件所处的冷凝管腔室内的气体通过所述卸压孔向外排出，使得所述冷凝管的空间变大，实现卸压功能。
  7. 根据权利要求2所述的一种移动终端设备用散热组件，其特征在于：
    所述冷凝管的管壁以及所述蒸发吸热室的管壁均采用导热性能良好的材料制成，使得所述蒸发散热装置散热效率更高。
  8. 根据权利要求2所述的一种移动终端设备用散热组件，其特征在于：
    所述移动终端设备用散热组件还包括自动控温***，所述自动控温***包括：
    温度感应器，所述温度感应器设置于所述主板的表面，用于实时测量所述主板的温度；
    风扇***，所述风扇***设置于所述冷凝管以及所述散热板之间，所述风扇***与所述温度感应器电性连接，所述温度感应器根据测出的温度数据控制所述风扇***的风力输出，所述风扇***用于提高所述冷凝管以及所述散热板表面散热性能。
  9. 根据权利要求8所述的一种移动终端设备用散热组件，其特征在于：
    所述散热板上靠近所述风扇***的面上设置有若干弯曲散热片，所述弯曲散热片之间相互平行，且所述风扇***的送风方向与所述弯曲散热片相平行，使得所述风扇***送出的风作用于所有的弯曲散热片上。
  10. 根据权利要求1所述的一种移动终端设备用散热组件，其特征在于：
    所述散热板的边缘与所述外壳紧密配合，使得所述主板、所述导热板、以及导热片结构不与外界相连通，提高终端设备的防水能力。
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CN115787783A (zh) * 2022-12-08 2023-03-14 上海东方泵业(集团)有限公司 一种全自动二次供水泵房***
CN117767157A (zh) * 2023-12-28 2024-03-26 江苏红华电气设备有限公司 一种电气设备用热管型散热装置及方法

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