200810657 (1) 九、發明說明 【發明所屬之技術領域】 本發明，係有關於多層印刷配線板之製造方法，特別 是有關於具備有可換性纜線部之軟硬混合印刷配線板之製 造方法。 【先前技術】 # 近年來，電子機器之小型化以及高功能化係日益進步 。因此，對於印刷配線板之高密度化的要求係提高。於此 ，係藉由將印刷配線板從單面構造而提昇爲兩面或是3層 以上之多層構造的印刷配線板，而追求印刷配線板之高密 度化。 作爲其中一環，以小型電子機器爲中心，係廣泛的普 及有：將安裝各種電子構件之多層印刷配線板或是硬質印 刷配線板之間，藉由連接器等來作連接，並且具備有與其 ® 他之可撓性印刷配線板或是可撓性扁平電纜（flat cable ) 一體化的可撓性纜線部之軟硬混合印刷配線板。特別是， 在用於數位相機者之中，係被要求有4層乃至6層以上之 軟硬混合印刷配線板。 另一方面，爲了實現高密度之安裝，將軟硬混合印刷 配線板作爲核心基板，並在兩面或是單面具備有1〜2層 左右的層積層之層積型軟硬混合印刷配線板亦係被實用化 ，此事係被記載於專利文獻1中。 圖2，係爲展不具備有先前之纜線部的軟硬混合印刷 -4- 200810657 (2) 配線板之製造方法的剖面圖。在此方法中，首先，係如圖 2 ( 1 )所示，將於聚醯亞胺等之可撓性絕緣基底材31的 兩面具備有銅箔等之導電層的所謂兩面貼銅層積板作爲起 始材料，並使用通常之感光蝕刻加工（Photofabrication) 手法所致之蝕刻手法，而形成纜線等之電路圖案32、33 ，並作爲內層電路。 在此纜線等之電路圖案3 2、3 3中，經由以接著材3 5 Φ 來貼合聚醯亞胺薄膜3 4 ’而形成蓋體3 6，並形成纜線部 37。於此纜線部37中，在進行了打穿加工之添加入有玻 璃縱橫纖維（glass cross )的環氧樹脂材的單面，經由接 著材38，而層積具有銅箱層之單面貼銅層積板。 接下來，藉由NC鑽頭等來形成導通用孔。在於導通 用孔中，施加無電解電鍍或是導電化處理之後，以電性電 鍍來形成貫通孔3 9。 接下來，對於貫通孔之開口部，使用以通常之感光蝕 ^ 刻加工手法所致的蝕刻手法，形成電路圖案4 0，而得到 具備有層積型軟硬混合印刷配線板之纜線部的內層核心基 板41。 - 接下來，如圖2 ( 2 )所示，準備在添加入有玻璃縱 橫纖維（glass cross )的環氧樹脂材料等之絕緣基底材42 的單面具備有銅箔層之所謂的單面貼銅層積板。單面貼銅 層積板’係以金屬模具等來作打穿加工。在此所使用之單 面貼銅層積板的絕緣基底材42，若是以雷射加工性爲優 先，則係無法進行以縱橫玻璃纖維或是塡充物等所致的對 -5- 200810657 (3) 樹脂之熱膨脹係數等的物理特性之最適化，爲了確保之後 所形成之通孔的連接信賴性，有必要將電鍍皮膜形成爲較 而，此係不只會對生產性或是良率造成影響，在形成 細微之圖案上亦爲不利。另一方面，若是以樹脂的物理特 性爲優先，則係成爲選擇縱橫玻璃纖維或是塡充物之塡充 率爲高的樹脂，雷射加工性係爲差，因此，不只是在生產 • 性上係爲差，亦會有由於縱橫玻璃纖維之分佈的所致的加 工上之偏差會變大的問題。 而後，將在圖2 ( 1 )中所得的於內層核心基板41進 行了打穿加工之單面貼銅層積板，經由低流動型的聚酯膠 片或是接合薄片等的流出較少之接著性絕緣樹脂43來作 層積。接下來，藉由雷射等來形成導通用孔。 此時，由於係對相較而言較爲硬之加入有縱橫玻璃纖 維的環氧材料，與相較而言較爲軟之聚醯亞胺薄膜、接著 ^ 材等同時作加工，因此，由於係有必要以可對較硬之材料 作加工的條件來進行加工，故在較軟之材料，會於因熱所 , 致之加工面的劣化，或是在其後之去膠渣（desmear )處 , 理時之孔壁面後退量等產生差異，而會有無法得到良好之 加工形狀的情況。 接下來，在於導通用孔中，施加無電解電鍍或是導電 化處理之後，以電性電鍍來形成貫通孔44。在如上述一 般之無法得到良好的加工形狀時，在電鍍被膜中會容易產 生孔隙（void )，而亦會有顯著的損害貫通孔之連接信賴 -6 - 200810657 (4) 性的情況。 側導 ，而 之表 以及 行外 ί 46 硬混 對於 與相 導通 件來 的劣 面後 情況 接下來，對於包含有上述之電鍍金屬層面的最外 電層，使用通常之感光蝕刻加工手法所致的飩刻手法 形成電路圖案45。之後，因應於需要，藉由在基板 面進行光敏抗銲劑（photo s〇ider resist )層之形成、 施加銲錫電鍍、鎳電鍍、金電鍍等之表面處理，並進 形加工，而得到具備有纜線部之軟硬混合印刷配線相 〔專利文獻1〕日本特開2004-200260號公報 〔專利文獻2〕日本特開2002_111213號公報 【發明內容】 〔發明所欲解決之課題〕 如上述一般，若是使用先前之製造方法而製造軟 合印刷配線板，則會有下述一般之問題。亦即是，在 ® 相較而言較爲硬之加入有縱橫玻璃纖維的環氧材料， 較而言較爲軟之聚醯亞胺薄膜以及接著材，同時形成 _ 用孔時，由於係有必要以可對較硬之材料作加工的條 進行加工，故在較軟之材料，會於因熱所致之加工面 化，或是在其後之去膠渣（desmear )處理時之孔壁 退量等產生差異，而會有無法得到良好之加工形狀的 進而，若是以絕緣樹脂之雷射加工性爲優先，則係無 法進行以縱橫玻璃纖維或是塡充物等所致的對樹脂之熱膨 200810657 (5) 脹係數等的物理特性之最適化，爲了確保之後所形成之通 孔的連接信賴性’有必要將電鍍皮膜形成爲較厚，故不僅 是會對生產性或是良率造成影響’在細微之圖案形成上亦 爲不利。 另一方面，若是以樹脂的物理特性爲優先，則係成爲 選擇縱橫玻璃纖維或是塡充物之塡充率爲高的樹脂，雷射 加工性係爲差，因此，不只是在生產性上係爲差，亦會有 Φ 由於縱橫玻璃纖維之分佈的所致的加工上之偏差會變大的 問題。 本發明，係爲考慮有上述之點而進行者，其目的，係 在於提供一種：能合適的進行對於將雷射加工性相異之樹 脂作複數層層積的軟硬複合板（Rigid-Flex )等之多層印 刷配線板的孔加工之方法。 〔用以解決課題之手段〕 ^ 爲了達成上述之目的，在本發明中，係爲： 一種多層印刷配線板之製造方法，其特徵爲：在準備 內層核心用之基板以及外層層積層用之兩面型貼銅層積板 ，並在前述兩面型貼銅層積板中之導通用孔形成部位形成 貫通孔，而在前述兩面型貼銅層積板中之其中一面形成電 路圖案’並以使前述被形成有電路圖案之面成爲內側的面 的方式’對於前述內層核心基板挾持著接著劑層而層積前 述兩面型貼銅層積板，以形成層積電路基材，並在前述層 積電路基材之特定位置形成貫通孔，而藉由對前述貫通孔 -8- 200810657 (6) 施加導電化處理以及電鍍處理，來製造多層印刷配線板的 方法中，將前述電路圖案之銅箔作爲遮罩，並對前述特定 部位照射雷射光束，而形成從前述外層層積層起直到前述 內層核心用之基板爲止的導通用孔。 * 〔發明之效果〕 若藉由本發明，則在相較而言較爲硬之加入有縱橫玻 • 璃纖維的環氧材料，與相較而言較爲軟之聚醯亞胺薄膜以 及接著材等的雷射加工性係爲相異之樹脂中，由於係預先 使用NC鑽頭來對雷射加工性低之較硬材料進行加工，並 在層積後進行雷射加工，因此能夠無關於層積層之絕緣樹 脂的種類，而得到良好的孔形狀。藉由，藉由以NC鑽頭 所致之穿孔來形成雷射加工用之遮光遮罩，就算是不使用 可進行高精確度對位之曝光機，在將第1層、第2層以及 第3層作層間連接的導通用孔之第1層與第2層間亦不會 ^ 產生位置偏差，因此成爲可作高密度化。 其結果，若藉由本發明，則成爲能夠適當的進行：在 . 先前之製造方法中係爲困難的對於將雷射加工性相異之樹 _ 脂作複數層層積的軟硬混合印刷配線板的孔加工。其結果 ，能夠將軟硬混合印刷配線板等之多層印刷配線板低成本 且安定的作製造。 【實施方式】 以下，參考所添附之圖面，而對本發明之實施形態作 -9- 200810657200810657 (1) EMBODIMENT OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of manufacturing a multilayer printed wiring board, and more particularly to the manufacture of a hard and soft hybrid printed wiring board having a replaceable cable portion. method. [Prior Art] # In recent years, the miniaturization and high-functionalization of electronic machines have been progressing. Therefore, the demand for higher density of the printed wiring board is improved. In this case, the printed wiring board is upgraded to a printed wiring board having a multilayer structure of two or more layers from a single-sided structure, and the high density of the printed wiring board is pursued. As a part of the small-scale electronic equipment, it is widely used: a multilayer printed wiring board or a hard printed wiring board in which various electronic components are mounted, and connected by a connector or the like A flexible printed wiring board of a flexible printed wiring board or a flexible cable unit integrated with a flexible flat cable. In particular, among digital camera users, it is required to have four or more layers of soft and hard mixed printed wiring boards. On the other hand, in order to achieve high-density mounting, a soft-hard hybrid printed wiring board is used as a core substrate, and a laminated hard and soft mixed printed wiring board having a laminated layer of about 1 to 2 layers on both sides or on one side is also provided. This is a practical use, and this matter is described in Patent Document 1. Fig. 2 is a cross-sectional view showing a method of manufacturing a wiring board in which a soft and hard hybrid printing having no previous cable portion is provided. In this method, as shown in Fig. 2 (1), a so-called double-sided copper-clad laminate having a conductive layer of copper foil or the like on both surfaces of a flexible insulating base material 31 such as polyimide or the like is provided. As the starting material, the circuit patterns 32 and 33 of the cable or the like are formed using an etching method by a usual photofabrication technique, and as an inner layer circuit. In the circuit patterns 3, 3 and 3 of the cable or the like, the cover member 36 is formed by bonding the polyimide film 3 4 ' with the adhesive material 3 5 Φ to form the cable portion 37. In the cable portion 37, on one side of the epoxy resin material to which the glass cross is added, which has been subjected to the punching process, a single-sided sticker having a copper box layer is laminated via the adhesive material 38. Copper laminated board. Next, a conductive hole is formed by an NC drill or the like. After the electroless plating or the electroconductive treatment is applied to the via holes, the through holes 39 are formed by electrical plating. Next, the opening pattern of the through hole is formed by using an etching method by a usual photolithography process to form the circuit pattern 40, thereby obtaining a cable portion including the laminated soft and hard hybrid printed wiring board. Inner core substrate 41. - As shown in Fig. 2 (2), a so-called one-sided sticker having a copper foil layer on one side of an insulating base material 42 such as an epoxy resin material to which a glass cross is added is prepared. Copper laminated board. The single-sided copper-clad laminate is subjected to a punching process using a metal mold or the like. In the insulating base material 42 of the single-sided copper-clad laminate used here, if the laser processing property is prioritized, it is impossible to perform the pairing of the vertical and horizontal glass fibers or the enthalpy, etc. -5 - 200810657 ( 3) The physical properties of the thermal expansion coefficient of the resin are optimized, and in order to ensure the connection reliability of the via holes formed later, it is necessary to form the plating film to be relatively large, which not only affects productivity or yield. It is also disadvantageous in forming a subtle pattern. On the other hand, if the physical properties of the resin are prioritized, the resin having a high charge ratio of the vertical or horizontal glass fibers or the entangled material is selected, and the laser processability is poor, so that it is not only in production. The upper system is poor, and there is also a problem that the variation in processing due to the distribution of the longitudinal and transverse glass fibers becomes large. Then, the single-sided copper-clad laminate which has been subjected to the puncture processing on the inner core substrate 41 obtained in FIG. 2 (1) is less discharged through the low-flow type polyester film or the bonding sheet. The insulating resin 43 is then laminated. Next, a conductive hole is formed by laser or the like. At this time, since the epoxy material in which the cross-linked glass fiber is added is relatively hard, the relatively soft polyimide film and the subsequent material are simultaneously processed, and therefore, It is necessary to process the material which can be processed on a harder material. Therefore, in a soft material, the surface of the material may be deteriorated due to heat, or the desmear may be removed thereafter. At the time, there is a difference in the amount of backlash of the hole wall, and there is a case where a good processed shape cannot be obtained. Next, after the electroless plating or the electroconductive treatment is applied to the via hole, the through hole 44 is formed by electroplating. When a good processed shape cannot be obtained as described above, voids are easily generated in the plating film, and there is a significant problem that the connection of the through holes is impaired. -6 - 200810657 (4). Side conduction, and the external and external ί 46 hard mixing for the after-effects of the phase-conducting parts. Next, for the outermost electrical layer containing the above-mentioned electroplated metal layer, the usual photo-etching processing method is used. The circuit pattern 45 is formed by the engraving technique. Then, if necessary, a surface of a photosensitive sensitizer layer is formed on the substrate surface, a surface treatment such as solder plating, nickel plating, gold plating, or the like is applied, and the surface is processed to obtain a cable. In the soft and hard-mixed printed wiring of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the invention. The production of a soft printed wiring board by the prior manufacturing method has the following general problems. That is, in the case of a relatively hard epoxy material with longitudinal and transverse glass fibers, a softer polyimide film and a backing material, while forming a hole, due to the It is necessary to process strips that can be processed on harder materials, so in softer materials, it will be processed by heat, or in the case of desmear. There is a difference in the amount of retreat, etc., and there is a possibility that a good processed shape cannot be obtained. Further, if the laser processing property of the insulating resin is prioritized, it is impossible to perform the resin for the longitudinal or transverse glass fiber or the filling. Thermal expansion 200810657 (5) Optimum physical properties such as expansion coefficient, in order to ensure the connection reliability of the via holes formed later, it is necessary to form the plating film to be thick, so it is not only for productivity or yield. The impact "is also disadvantageous in the formation of subtle patterns. On the other hand, if the physical properties of the resin are prioritized, the resin having a high charge ratio of the vertical or horizontal glass fibers or the entangled material is selected, and the laser processability is poor, so that it is not only in productivity. If it is poor, there will be a problem that the deviation in processing due to the distribution of the longitudinal and transverse glass fibers becomes large. The present invention has been made in view of the above-described points, and an object thereof is to provide a soft and hard composite board (Rigid-Flex) in which a plurality of layers of lasers having different laser workability are laminated. A method of processing a hole in a multilayer printed wiring board. [Means for Solving the Problem] In order to achieve the above object, the present invention provides a method for producing a multilayer printed wiring board, which is characterized in that a substrate for an inner layer core and an outer layer layer are used. a two-sided copper-clad laminate, and a through-hole is formed in a common hole forming portion in the two-sided copper-clad laminate, and a circuit pattern is formed on one of the two-sided copper-clad laminate The surface on which the circuit pattern is formed is the inner surface. The two-sided copper-clad laminate is laminated on the inner core substrate by the adhesive layer to form a laminated circuit substrate, and the layer is formed. A method of manufacturing a multilayer printed wiring board by applying a conductive treatment and a plating treatment to the through hole -8-200810657 (6) at a specific position of the substrate of the circuit, and forming a copper foil of the circuit pattern As a mask, a laser beam is irradiated to the specific portion to form a conductive hole from the outer layer laminated layer to the substrate for the inner layer core. * [Effects of the Invention] According to the present invention, an epoxy material in which a glass fiber is added to a glass fiber is relatively hard, and a relatively soft polyimide film and a backing material are used. In the case where the laser processing properties are different from each other, the hard material having low laser workability is processed by using an NC drill in advance, and laser processing is performed after lamination, so that the laminated layer can be omitted. The type of the insulating resin gives a good hole shape. By forming a light-shielding mask for laser processing by perforation by an NC drill bit, even if the exposure machine capable of high-precision alignment is not used, the first layer, the second layer, and the third layer are used. Since the first layer and the second layer of the common hole for the interlayer connection between the layers are not misaligned, the density can be increased. As a result, according to the present invention, it is possible to appropriately perform a soft-hard hybrid printed wiring board in which a plurality of layers of lasers having different laser processing properties are difficult to be laminated in a conventional manufacturing method. Hole processing. As a result, a multilayer printed wiring board such as a soft-hard hybrid printed wiring board can be manufactured at low cost and in a stable manner. [Embodiment] Hereinafter, with reference to the attached drawings, an embodiment of the present invention is made -9-200810657
說明。 〔實施形態1〕 圖1 A、圖1B，係爲展示本發明之實施形態1的剖面 工程圖。於此，係展示軟硬混合印刷配線板等之多層印刷 配線板的製造方法。 首先，準備如圖1 A ( 1 )所示一般，在聚醯亞胺等之 可撓性絕緣基底材1的兩面，具備有電路圖案2、3，並 將層間藉由飩刻銲墊或是導電性糊等的導電性突起4而作 了連接的兩面可撓性電路基板。此電路基板，係爲成爲核 心基板者，並進行有以藉由飩刻加工所形成之金屬製的導 電性突起所致之層間連接。 在此核心基板之兩面，係被貼合有例如係在1 2 // m 厚之聚醯亞胺薄膜5上，具備有厚度15//m之丙烯、環 氧樹脂等的接著材6的所謂之覆蓋層7。在到此爲止的工 程中，係可得到具備有多層電路基板之纜線部以及成爲核 心基板之塡充導通孔（filled via)構造之兩面核心基板8 〇 如此實施形態1 一般，在具備有以導電性突起所致之 層間導通的兩面核心基板的情況時，由於並不需要將電鍍 設爲較厚，而可以使核心基板之配線層的厚度變薄，因此 配線之細微化係爲可能。 又，關於在其後之與層積層間之接著中所使用的接著 材，由於係只要以厚度爲薄者即可充分的塡充，因此其流 -10- 200810657 (8) 出量係變少。進而，由於其與層積層之間的層間連接距離 本身亦係變短，因此在相同厚度之電鍍的情況時’相對而 言亦具有提昇連接信賴性的效果。 上述之塡充導通孔構造，係可適用於各種之對象，不 僅僅是在此實施形態1中所展示之藉由飩刻加工所形成的 金屬製之導電性突起，就算是對於以電鍍法所致之金屬製 的導電性突起，將導電性糊、墨水等作印刷而形成的導電 性突起，甚至是藉由使在對通孔作電鍍時之朝向內壁的電 鍍析出變多的通孔塡充電鍍所製造的兩面核心基板’以及 包含有將此些作組合所得者，均可以適用。 更加上，藉由使核心基板具備有塡充導通孔構造，當 在之後的工程中進行層積時，係成爲可以採用在塡充導通 孔上作堆疊（stack )的構造，因此在高密度化上係爲有 利。又，亦可以期待有使高速訊號傳送時之在連接部的反 射減低的效果。 接下來，如圖1A ( 2 )所示，準備在絕緣基底材9 ( 於此，係爲厚度50 // m之添加入有玻璃縱橫纖維（glass cross)的環氧樹脂材）之兩面具備有厚度12/zm之銅箔 1 〇以及1 1之所謂的兩面貼銅層積板1 2。絕緣基底材9之 厚度或材質，係並不被限定爲厚度50 //m之添加入有玻 璃縱橫纖維（glass cross )的環氧樹脂材，而可以因應於 用途來作區分使用。 進而，作爲線熱膨脹低之材料，可以使用以包含有 3 0重量％左右之氧化矽等的塡充物之環氧樹脂材，或是在 -11 - 200810657 ⑼ 有必要降低在筒速訊號傳送時之介電質損失之類的適用例 中，可以使用以低介電正切（dielectric t tangent)之、液帛 聚合物等作爲基底的兩面貼銅層積板。 又，在基板之薄型化或是可撓性係爲必要的情況時， 可以使用以上述之液晶聚合物或是聚醯亞胺之薄膜材料作 爲基底的兩面貼銅層積板。 在此兩面貼銅層積板12之於後續工程中當層積於兩 • 面核心基板8上時的導通用孔所位置之處，形成貫通孔 13。作爲用以形成貫通孔13之手段’可以適用NC鑽頭 、金屬模具、雷射等。但是。在對包含有縱橫玻璃纖維或 是無機塡充物的環氧樹脂材進行穿孔時，若是使用雷射加 工，則在無機物與有機物間之加工性係大爲相異，而難以 得到良好的貫通孔。 在此實施形態1中，係經由NC鑽頭而形成1 5 0 μ m 的貫通孔。進而，對於其後之兩面貼銅層積板1 2，雖係 W 使用通常之感光蝕刻加工手法，來形成電路圖案等，但是 ，係以將到時候所使用之曝光用目標亦一倂進行NC鑽頭 . 加工爲理想。 因應於必要，亦可形成其他之層積用的目標、導引孔 等。此種之各種導引孔的大小，多係採用2〜5mm左右的 孔徑，而並不適合於雷射加工，因此在實施形態1中，係 使用NC鑽頭來形成。 接下來，如圖1 A ( 3 )所示，形成包含有導通用孔形 成部位之開口的內層電路圖案1 1 a，並進而將光阻層剝離 -12- 200810657 (10) 。此係爲：在兩面貼銅層積板12之銅箔11上，包含有導 通用孔形成部位之開口，而在兩面貼銅層積板1 2之兩面 形成用以形成內層電路圖案之光阻層，並使用光阻層，而 藉由感光蝕刻加工手法來形成。 在此實施形態1中，作爲光阻層，雖係適用低價之乾 ^ 薄膜光阻層，但是，係以使用對於貫通孔1 3而能夠得到 蓋孔（tenting )性以及設計上所需要的解像度之光阻爲理 9 想。又，電積（electro-deposit )光阻或是液狀光阻，係 不需要考慮其蓋孔性，而係爲適合。 進而，不僅是將乾薄膜光阻與電積光阻以及液狀光阻 作單獨使用，而亦可將此些作組合而適用之。兩面之對位 ，由於係對於塗布之材料來進行。因此不會被材料之伸縮 所影響，而能容易地確保位置之精確度。 因應於必要，亦可使用能夠進行高度之對位的曝光機 。又，銅箔1 〇以及1 1之厚度係以5〜1 2 // m爲理想，若 ® 是在此厚度範圍內，則可以形成在狹節距CSP搭載中所 必要的內層節距1 〇〇 // m以下之細微配線。而，作爲之後 的雷射加工時之雷射遮光用遮罩，亦起功用。 進而，在其後之用以設置覆蓋層的接著材，係使用厚 度爲10/zm左右之厚度較薄者，以確保基板表面之平坦 性，且能夠將電路間空間作塡充。因此，與層積層之間之 層間連接距離本身亦變短。藉由此，在相同厚度之電鍍的 情況時，相對而言亦具有提昇連接信賴性的效果。 藉由圖1A(2)所形成之貫通孔13的銅箔10，亦成 -13- 200810657 (11) 爲正形遮罩（conformaimask)。 此時，因應於必要，進行用以使其與層積接著材間之 密著性提昇的粗化處理。在到此爲止的工程中，係得到多 層電路基板之層積層14。 接下來，如圖1A(4)所示，在將用以把層積層14 層積於兩面核心基板8之上的接著材1 5預先脫模並對位 之後，經由接著材1 5而將層積層1 4以及兩面核心基板8 9 藉由真空層壓來作層積。作爲接著材1 5係可使用低流動 性之預浸漬材料或是銲錫薄片等之流出較少者爲理想。接 著材1 5之厚度，考慮塡充性以及平坦性，可以選擇1 5〜 20/zm之較薄者。 此時，藉由將離形性之材料等重疊並貼合於層積層 1 4之外層側，而能防止接著材1 5從層積層1 4之貫通孔3 而流出至外層側。作爲離形性之材料，係以氟素樹脂、將 氟素樹脂塗布於表面之樹脂又或是金屬材料、以及將此些 ^ 作組合之材料、在表面施加有離形處理之PET薄膜等爲 理想。在到此爲止的工程中，係得到多層電路基材1 6。 接下來，如圖1B(5)所示，形成2種類之導通用孔 1 7、1 8。於此工程中，係將在圖1 A中之預先所形成的貫 通孔13之銅箔10側作爲雷射加工時之正形遮罩而使用， 並進行雷射加工。 作爲此雷射加工之條件，係在相較而言較爲硬之加入 有縱橫玻璃纖維的環氧材料，與相較而言較爲軟之聚醯亞 胺薄膜以及接著材等的雷射加工性係爲相異之樹脂中，預 -14- 200810657 (12) 先使用N C鑽頭來對雷射加工性低之較硬材料進行加工。 因此，成爲可藉由較爲柔軟之樹脂的雷射加工條件來進行 加工，而能得到良好的孔形狀。 在形成導通用孔17時，預先所製作之電路圖案Ua 的導通用孔形成部位之開口亦係作爲雷射遮光用遮罩而使 用，並進行雷射加工。雷射，係可從UV-YAG雷射、二 氧化碳雷射、準分子雷射等中來作選擇。各導通用孔之口 # 徑，係如下述一般而設定。 導通用孔17、1 8，在實施形態1中，於6層導體層 中之第2層起到第5層爲止，由於係並不需要進行會造成 導體層之厚度增加的電鍍，因此能將導體層變薄，故而， 能夠使塡充時所需要之接著材6或是接著材15之厚度變 薄。其結果，就算是較薄的電鍍厚度，亦能確保其信賴性 〇 作爲電鍍厚度1 5〜2 0 m左右而能確保信賴性之孔 ® 徑，係將導通用孔1 7、1 8均設爲1 5 0 // m。若是爲此口徑 ，則能夠充分的對應在圖1 A ( 2 )中所進行之NC鑽頭等 所致的穿孔。特別是，由於在將第1層、第2層以及第3 層作層間連接的導通用孔17之第1層與第2層間不會產 生位置偏差，因此成爲可作高密度化。 當僅將第1層以及第3層作層間連接的情況時，係如 實施形態1之導通用孔18 —般，藉由不形成第2層之銲 墊或是藉由對導通用孔17之第2層的銲墊作切除而可作 對應。 -15- 200810657 (13) 由上述事態，在可以形成細微之配線的同時，亦能提 昇安裝密度，且由於各導通用孔均能以狹窄節距來形成， 因此例如狹節距CSP亦成爲可被搭載。同時，對應於例 如***安裝型之電子構件的搭載，亦可因應於需要而如實 ' 施形態1 一般來形成導通用孔19。進而，藉由電鍍而進 ' 行用以實行層間連接之去膠渣處理以及導電化處理。 接下來，如圖1B(6)所示，在具備有導通用孔17、 • 18、19之多層電路基材16，進行15〜20/zm左右的電解 電鍍，並進行層間導通。在到此爲止的工程中，亦即是藉 由一次的雷射加工以及電鍍工程，而形成藉由導通用孔 17所得到之將第1層、第2層及第3層作層間連接之階 段通孔20，和藉由導通用孔1 8所得到之僅將第1層及第 3層作層間連接的跳階通孔2 1，並能從外層起到內層爲止 之而得到所有的層間導通。進而，在實施形態1的情況中 ，藉由導通用孔19，而亦形成全層貫通型之貫通孔22。 ® 接下來，對於外層之圖案，亦藉由通常之感光蝕刻加 工手法而形成。此時，若是有在覆蓋薄膜5上所析出之電 鍍層，則此亦會被除去。之後，因應於需要，對基板之表 面施加銲錫電鍍、鎳電鍍、金電鍍等之表面處理，並形成 光敏抗銲劑（p h 〇 t 〇 S 〇 1 d e r I* e s i s t )層，並使用銀糊、薄膜 等來形成纜線之對外層側的保護層，並進行外形加工，而 得到於外層具備有纜線部之軟硬混合印刷配線板24。 【圖式簡單說明】 -16- 200810657 (14) 〔圖1 A〕以剖面構成來展示本發明之實施形態1中 的工程之工程圖。 〔圖1 B〕展示接著圖1 a之後的工程之工程圖。 〔圖2〕展示以先前工法所致的軟硬混合印刷配線板 等之多層印刷配線板的製造方法之工程圖。 【主要元件符號說明】 1:可撓性絕緣基底材 2 :電路圖案 3 :電路圖案 4 :導電性突起 5 :聚醯亞胺薄膜 6 :接著材 7 :覆蓋層 8 :兩面核心基板 9 :絕緣基底材 10 :銅箔 1 1 a :包含有導通用孔形成部位之開口的內層電路 11 :銅箔 1 2 :兩面貼銅層積板 13 :貫通孔 1 4 :層積層 1 5 :接著劑層 16 =多層電路基材 -17- 200810657 (15) 1 7 :導通用孔1 1 8 :導通用孔2 1 9 :導通用孔3 20 :階段通孔 2 1 :跳階通孔 22 :貫通孔 23 :電路圖案 • 24 :本發明所致之軟硬混合印刷配線板 3 1 :可撓性絕緣基底材 32 :電路圖案 3 3 :電路圖案 3 4 :聚醯亞胺薄膜 3 5 :接著劑 36 :蓋體 1 7 :纜線部 • 3 8 :接著劑 3 9 :貫通孔 , 4 0 :電路圖案 4 1 :內層核心基板 4 2 :絕緣基底材 43 :接著性絕緣樹脂 44 :通孔 4 5 :電路圖案 46 :先前工法所致之軟硬混合印刷配線板 -18-Description. [Embodiment 1] Fig. 1A and Fig. 1B are cross-sectional views showing a first embodiment of the present invention. Here, a method of manufacturing a multilayer printed wiring board such as a soft-hard hybrid printed wiring board is shown. First, as shown in FIG. 1A (1), in general, on both sides of the flexible insulating base material 1 such as polyimide, the circuit patterns 2 and 3 are provided, and the interlayer is bonded by a pad or A double-sided flexible circuit board to which the conductive bumps 4 such as a conductive paste are connected. This circuit board is a core substrate, and is provided with interlayer connection by a conductive projection made of metal formed by etch processing. On both sides of the core substrate, a polyimide material 5 having a thickness of 15/m is attached, for example, to a polyimide film 5 having a thickness of 15/m. Cover layer 7. In the above-mentioned work, the double-sided core substrate 8 including the cable portion having the multilayer circuit substrate and the filled via structure serving as the core substrate can be obtained. In the case of the double-sided core substrate in which the interlayers are electrically connected by the conductive bumps, the thickness of the wiring layer of the core substrate can be made thinner by electroplating, and thus the wiring can be made finer. Further, since the binder used in the subsequent step between the laminated layer and the laminated layer can be sufficiently filled as long as the thickness is thin, the flow is reduced to 10-200810657 (8). . Further, since the interlayer connection distance between the layer and the layer is also shortened, the effect of improving the connection reliability in the case of plating of the same thickness is relatively small. The above-described 塡-through via structure can be applied to various objects, and is not limited to the conductive protrusions made of metal formed by the etch process shown in the first embodiment, even for the plating method. The conductive protrusion made of metal, the conductive protrusion formed by printing a conductive paste, ink, or the like, or the through hole which is formed by plating the plating toward the inner wall when the through hole is plated. Both the two-sided core substrate manufactured by the charge plating and the combination of these may be used. Further, by providing the core substrate with the structure of the via hole, when stacking is performed in a subsequent process, it is possible to form a stack on the via hole, and thus the density is increased. The upper system is advantageous. Further, it is also expected to have an effect of reducing the reflection at the connection portion when the high-speed signal is transmitted. Next, as shown in Fig. 1A (2), the insulating base material 9 (here, an epoxy resin material to which a glass cross is added, having a thickness of 50 // m) is provided. A copper foil 1 〇 having a thickness of 12/zm and a so-called double-sided copper-clad laminate 1 2 having a thickness of 11. The thickness or material of the insulating base material 9 is not limited to an epoxy resin material having a thickness of 50 //m added to a glass cross, and can be used in accordance with the use. Further, as a material having a low linear thermal expansion, an epoxy resin material containing a ruthenium oxide of about 30% by weight or the like may be used, or it may be necessary to reduce the transfer of the tube speed signal at -11 - 200810657 (9). In the application example of the dielectric loss, a double-sided copper-clad laminate using a low dielectric tangent, liquid helium polymer or the like as a base can be used. Further, in the case where the thickness of the substrate is required or the flexibility is required, a double-sided copper-clad laminate using the above-mentioned liquid crystal polymer or a polyimide film material as a base can be used. The through-holes 13 are formed in the position where the two-side copper-clad laminate 12 is placed on the two-sided core substrate 8 in the subsequent process. As a means for forming the through hole 13, an NC drill, a metal mold, a laser or the like can be applied. but. When the epoxy resin material containing the glass fiber or the inorganic filler is perforated, if the laser processing is used, the processability between the inorganic material and the organic material is greatly different, and it is difficult to obtain a good through hole. . In the first embodiment, a through hole of 150 μm is formed via an NC drill. Further, the copper-clad laminate 1 2 on the other side is formed by using a usual photo-etching process to form a circuit pattern or the like, but the target for exposure used at that time is also NC. Drill. Processing is ideal. Other targets, guide holes, etc. for stratification may be formed as necessary. The size of the various types of guide holes is usually about 2 to 5 mm, and is not suitable for laser processing. Therefore, in the first embodiment, an NC drill is used. Next, as shown in Fig. 1 A (3), an inner layer circuit pattern 1 1 a including an opening of a conductive hole forming portion is formed, and the photoresist layer is further peeled off -12-200810657 (10). In this case, the copper foil 11 on both sides of the copper laminated board 12 is provided with an opening for forming a common hole, and the light for forming the inner layer circuit pattern is formed on both sides of the double-sided copper laminated board 12 The resist layer is formed using a photoresist layer by a photosensitive etching process. In the first embodiment, although a low-cost dry film thin film layer is used as the photoresist layer, it is possible to obtain a tenting property and a design required for the through hole 13 . The resolution of the resolution is the rationale. Further, an electro-deposit photoresist or a liquid photoresist is suitable irrespective of its capping property. Further, not only the dry film resist, the electrodepositor and the liquid photoresist are used alone, but these may be combined and applied. The alignment of the two sides is performed for the coated material. Therefore, it is not affected by the expansion and contraction of the material, and the accuracy of the position can be easily ensured. An exposure machine capable of performing a high degree of alignment can also be used as necessary. Further, the thicknesses of the copper foils 1 and 11 are preferably 5 to 1 2 // m, and if the thickness is within this thickness range, the inner layer pitch 1 necessary for the CSP mounting can be formed.细 / / m below the fine wiring. However, as a mask for laser shading in the subsequent laser processing, it also functions. Further, in the subsequent bonding material for providing the covering layer, a thickness of about 10/zm is used to ensure the flatness of the surface of the substrate, and the inter-circuit space can be filled. Therefore, the connection distance between the layers and the laminated layer itself is also shortened. Thereby, in the case of electroplating of the same thickness, the effect of improving the connection reliability is relatively high. The copper foil 10 of the through hole 13 formed by Fig. 1A (2) is also a conformal mask of -13-200810657 (11). At this time, the roughening treatment for improving the adhesion between the laminated and the laminated materials is performed as necessary. In the engineering up to this point, a laminated layer 14 of a plurality of circuit boards has been obtained. Next, as shown in FIG. 1A (4), after the bonding material 15 for laminating the laminated layer 14 on the both-sided core substrate 8 is previously demolded and placed, the layer is passed through the bonding material 15 The laminate 14 and the double-sided core substrate 8 are laminated by vacuum lamination. It is preferable to use a low-fluid prepreg or a solder flake or the like as the adhesive material. The thickness of the material 15 is selected, and considering the susceptibility and flatness, a thinner one of 15 to 20/zm can be selected. At this time, by laminating the bonding material or the like and bonding it to the outer layer side of the laminated layer 14, it is possible to prevent the adhesive material 15 from flowing out from the through hole 3 of the laminated layer 14 to the outer layer side. As the material for the release property, a fluorine resin, a resin coated with a fluorocarbon resin on the surface or a metal material, and a material which combines these materials and a PET film which is subjected to a release treatment on the surface are used. ideal. In the engineering up to this point, a multilayer circuit substrate 16 was obtained. Next, as shown in Fig. 1B (5), two types of conductive holes 17 and 18 are formed. In this case, the side of the copper foil 10 of the through-hole 13 formed in advance in Fig. 1A is used as a positive mask for laser processing, and laser processing is performed. As a condition for the laser processing, it is a relatively hard epoxy material to which a cross-section glass fiber is added, and a softer polyimide film and a laser material such as a laminate. Among the different resins, pre--14- 200810657 (12) First use NC drill bits to process hard materials with low laser processing properties. Therefore, it is possible to perform processing by laser processing conditions of a relatively soft resin, and a good hole shape can be obtained. When the conductive hole 17 is formed, the opening of the conductive hole forming portion of the circuit pattern Ua prepared in advance is also used as a laser light shielding mask, and laser processing is performed. Lasers can be selected from UV-YAG lasers, carbon dioxide lasers, and excimer lasers. The port # diameter of each common hole is set as follows. In the first embodiment, in the first embodiment, since the second layer of the six conductor layers is the fifth layer, it is not necessary to perform plating which causes an increase in the thickness of the conductor layer. Since the conductor layer is thinned, the thickness of the bonding material 6 or the bonding material 15 required for charging can be made thin. As a result, even if it is a thin plating thickness, it can ensure the reliability. The hole diameter of the plating is about 5 to 20 m, and the hole diameter can be ensured. The general-purpose holes 17 and 18 are provided. Is 1 5 0 // m. If it is this diameter, the perforation by the NC drill or the like performed in Fig. 1 A ( 2 ) can be sufficiently satisfied. In particular, since the positional deviation does not occur between the first layer and the second layer of the conductive hole 17 in which the first layer, the second layer, and the third layer are connected to each other, the density can be increased. When only the first layer and the third layer are connected to each other, as in the case of the general-purpose hole 18 of the first embodiment, by not forming the pad of the second layer or by the common hole 17 The second layer of the pad can be cut off for correspondence. -15- 200810657 (13) From the above situation, the fine wiring can be formed, and the mounting density can be increased. Since the common holes can be formed with a narrow pitch, for example, the narrow pitch CSP can also be made. It is carried. At the same time, in accordance with the mounting of the electronic component such as the plug-in type, the conductive hole 19 can be formed in accordance with the requirements of the first embodiment. Further, the desmear treatment and the electroconductive treatment for performing the interlayer connection are performed by electroplating. Next, as shown in Fig. 1B (6), the multilayer circuit substrate 16 having the conductive holes 17, 18, and 19 is subjected to electrolytic plating of about 15 to 20 / zm to conduct interlayer conduction. In the engineering so far, the first layer, the second layer, and the third layer are connected to each other by the common hole 17 by the laser processing and the electroplating process. The through hole 20, and the jump hole through hole 2 which is obtained by connecting the first layer and the third layer by the common hole 18, and can be obtained from the outer layer to the inner layer to obtain all the interlayers. Turn on. Further, in the case of the first embodiment, the through hole 22 of the full-layer through type is also formed by the common hole 19. ® Next, the pattern of the outer layer is also formed by the usual photolithographic etching process. At this time, if there is an electroplated layer deposited on the cover film 5, this will also be removed. After that, the surface of the substrate is subjected to surface treatment such as solder plating, nickel plating, gold plating, etc., and a photosensitive solder resist (ph 〇t 〇S 〇1 der I* esist ) layer is formed, and a silver paste or a film is used. The protective layer on the outer layer side of the cable is formed, and the outer shape is processed to obtain a soft and hard mixed printed wiring board 24 having a cable portion on the outer layer. [Brief Description of the Drawings] -16- 200810657 (14) [Fig. 1A] A drawing of a project in the first embodiment of the present invention is shown in a cross-sectional configuration. [Fig. 1B] shows the engineering drawing of the project following Fig. 1a. Fig. 2 is a view showing a method of manufacturing a multilayer printed wiring board such as a soft-hard hybrid printed wiring board by a prior art method. [Description of main component symbols] 1: Flexible insulating base material 2: Circuit pattern 3: Circuit pattern 4: Conductive projection 5: Polyimine film 6: Substrate 7: Cover layer 8: Double-sided core substrate 9: Insulation Base material 10: Copper foil 1 1 a : Inner layer circuit 11 including openings for forming a common hole forming portion: Copper foil 1 2: Double-sided copper laminated plate 13 : Through hole 1 4 : Laminated layer 15 : Adhesive Layer 16 = multilayer circuit substrate -17- 200810657 (15) 1 7 : general purpose hole 1 1 8 : general purpose hole 2 1 9 : general purpose hole 3 20 : stage through hole 2 1 : stepped through hole 22 : through Hole 23: Circuit pattern • 24: Soft and hard hybrid printed wiring board 3 1 : Flexible insulating base material 32 : Circuit pattern 3 3 : Circuit pattern 3 4 : Polyimine film 3 5 : Adhesive 36: cover body 1 7 : cable portion • 3 8 : adhesive 3 9 : through hole, 4 0 : circuit pattern 4 1 : inner core substrate 4 2 : insulating base material 43 : adhesive insulating resin 44 : through hole 4 5 : Circuit pattern 46: Soft and hard hybrid printed wiring board -18- caused by previous method