WO2022102104A1 - Dispositif de création de données et système de montage de composant - Google Patents

Dispositif de création de données et système de montage de composant Download PDF

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Publication number
WO2022102104A1
WO2022102104A1 PCT/JP2020/042527 JP2020042527W WO2022102104A1 WO 2022102104 A1 WO2022102104 A1 WO 2022102104A1 JP 2020042527 W JP2020042527 W JP 2020042527W WO 2022102104 A1 WO2022102104 A1 WO 2022102104A1
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WO
WIPO (PCT)
Prior art keywords
data
push
arrangement
pin
recommended
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PCT/JP2020/042527
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English (en)
Japanese (ja)
Inventor
恒太 伊藤
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2020/042527 priority Critical patent/WO2022102104A1/fr
Priority to JP2022561228A priority patent/JP7420969B2/ja
Publication of WO2022102104A1 publication Critical patent/WO2022102104A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a data creation device that creates data regarding an arrangement position of a push-up pin that supports a substrate on a push-up plate, and a component mounting system including the data creation device.
  • a mounting machine for mounting electronic components (hereinafter, simply referred to as "components”) on a board such as a printed wiring board has been known.
  • This type of mounting machine includes a board support device that supports the board and a head unit that mounts components on the board.
  • the board support device includes a push-up plate and a push-up pin disposed on the push-up plate.
  • the board support device supports the board from below by push-up pins arranged on the push-up plate.
  • Patent Document 1 discloses a technique for increasing the efficiency of such push-up pin arrangement change.
  • the present invention has been made in view of such circumstances, and an object thereof is a data creation device capable of efficiently changing the arrangement of push-up pins when switching board types, and a data creation device thereof. It is to provide a component mounting system equipped with.
  • the data creation device is a device for creating data regarding the arrangement position of push-up pins on a push-up plate in a board support device provided in a component mounting system for producing a board on which components are mounted. Is.
  • This data creation device is based on a storage unit that stores reference arrangement data unique to each type of the substrate, which indicates the reference arrangement of the push-up pins on the push-up plate, and a plurality of the reference arrangement data.
  • the value of the influential factor that affects the efficiency of the arrangement change of the push-up pin according to the switching of the type of the substrate is calculated, and the value of the influential factor is set on the push-up plate so as to be the recommended value.
  • It is provided with a data creation unit that creates recommended placement data indicating the recommended placement position of the push-up pin for each type of the substrate corresponding to the plurality of reference placement data.
  • FIG. 1 It is a block diagram of the component mounting system to which the data creation apparatus which concerns on one Embodiment of this invention is applied. It is a top view which shows the structure of the mounting machine provided in the component mounting system. It is a figure which shows the part of the head unit provided in the mounting machine in an enlarged manner. It is a figure which shows roughly the structure of the board support device provided in the mounting machine. It is a figure which shows the management data output from the system management apparatus provided in the component mounting system. It is a figure for demonstrating the common arrangement process executed by the data creation part of a data creation apparatus.
  • the component mounting system 1 is a system for producing a board on which components are mounted.
  • the component mounting system 1 includes a mounting machine 2, a processing machine 3, a system management device 4, and a data creating device 5.
  • the system management device 4 is connected to the mounting machine 2 and the processing machine 3 so as to be capable of data communication, and is also connected to the data creating device 5 so as to be capable of data communication.
  • a plurality of mounting machines 2 and a processing machine 3 are arranged side by side.
  • the system management device 4 manages the operations of the mounting machine 2 and the processing machine 3 by transmitting the control data CD to the mounting machine 2 and the processing machine 3.
  • the mounting machine 2 and the processing machine 3 execute a predetermined operation based on the control data CD.
  • the system management device 4 transmits the management data MD to the data creation device 5.
  • the data creation device 5 receives the management data MD
  • the data creation device 5 creates a recommended placement data RD based on the management data MD, and transmits the created recommended placement data RD to the system management device 4. .
  • the system management device 4 updates the control data CD reflecting the contents of the recommended placement data RD.
  • the processing machine 3 is a pattern forming device that performs a process of printing a solder paste pattern on a substrate.
  • the processing machine 3 prints a solder paste pattern on the substrate based on the control data CD transmitted from the system management device 4.
  • the substrate on which the solder paste pattern is printed by the processing machine 3 is conveyed to the mounting machine 2.
  • the processing machine 3 may be configured to include a board support device configured in the same manner as the board support device 28 described later included in the mounting machine 2.
  • the mounting machine 2 is a device for mounting components on a board on which a solder paste pattern is printed.
  • the mounting machine 2 executes various operations including a mounting operation of mounting components on the board based on the control data CD transmitted from the system management device 4.
  • the mounting machine 2 will be described with reference to FIGS. 2 to 4. In the following, the directional relationship will be described using XY Cartesian coordinates that are orthogonal to each other on the horizontal plane.
  • the mounting machine 2 includes a main body frame 21, a pair of conveyor rails 23, a component supply unit 24, a head unit 25, and a board support device 28.
  • the main body frame 21 is a structure in which each part constituting the mounting machine 2 is arranged, and is formed in a substantially rectangular shape in a plan view from a direction (vertical direction) orthogonal to both the X-axis direction and the Y-axis direction. ing.
  • the pair of conveyor rails 23 extend in the X-axis direction and are arranged on the main body frame 21.
  • the pair of conveyor rails 23 convey the substrate PP in the X-axis direction.
  • the board PP conveyed on the pair of conveyor rails 23 is positioned by the board support device 28 at a predetermined working position (a component mounting position on which the component is mounted on the board PP).
  • the board support device 28 includes a push-up plate 281, a push-up pin 282, and an elevating device 283.
  • the elevating device 283 mainly has a support column 2831 whose upper end moves up and down in the vertical direction by an air cylinder or the like, and a plate-shaped fixing base 2832 fixed substantially horizontally to the upper end of the support column 2831. It is installed at the position of.
  • the push-up plate 281 is a flat plate fixed to the fixing base 2832. That is, the push-up plate 281 is arranged on the main body frame 21 via the fixing base 2832.
  • a push-up pin 282 is arranged in an upright state on the upper surface of the push-up plate 281.
  • the upper surface of the push-up plate 281 may be a flat surface or may have a plurality of recesses formed therein. In the case of a flat surface, the push-up pin 282 is directly arranged on the upper surface of the push-up plate 281 in an upright state. On the other hand, when a plurality of recesses are formed, the push-up pin 282 is arranged in a state of being fitted in the recesses.
  • the push-up pin 282 is a pin-shaped member arranged upright on the upper surface of the push-up plate 281.
  • the push-up pin 282 supports the substrate PP from the lower side by the tip portion in a state of being arranged on the upper surface of the push-up plate 281.
  • a pin station 29 is arranged on the main body frame 21.
  • the pin station 29 is a portion in which the push-up pin 282, which is not used to support the substrate PP, is stored in a standing posture with the base end portion opposite to the tip end portion facing down.
  • the parts supply unit 24 is arranged with a pair of conveyor rails 23 sandwiched in each region portion on both sides of the main body frame 21 in the Y-axis direction.
  • the component supply unit 24 is an area in the main body frame 21 where a plurality of feeders 24F are mounted side by side.
  • the set position of each feeder 24F is divided for each component to be held by the mounting head 251 provided in the head unit 25 described later.
  • the feeder 24F is detachably attached to the component supply unit 24.
  • the feeder 24F is not particularly limited as long as it holds a plurality of parts and can supply the held parts to a predetermined part supply position set in the feeder, and is, for example, a tape feeder.
  • the tape feeder is a feeder configured to include a reel on which a parts storage tape for storing parts is wound at predetermined intervals, and to supply parts by sending the parts storage tape from the reel.
  • the head unit 25 is held by the moving frame 27.
  • a fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotationally driven by the Y-axis servomotor 263 are arranged on the main body frame 21.
  • the moving frame 27 is arranged on the fixed rail 261 and the nut portion 271 provided on the moving frame 27 is screwed to the ball screw shaft 262.
  • the moving frame 27 is provided with a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by the X-axis servomotor 274.
  • the head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is screwed onto the ball screw shaft 273.
  • the moving frame 27 moves in the Y-axis direction by the operation of the Y-axis servomotor 263, and the head unit 25 moves in the X-axis direction with respect to the moving frame 27 by the operation of the X-axis servomotor 274.
  • the head unit 25 can move in the Y-axis direction with the movement of the moving frame 27, and can move in the X-axis direction along the moving frame 27.
  • the head unit 25 is movable between the component supply unit 24 and the substrate PP supported by the push-up pin 282, and is also movable between the push-up plate 281 and the pin station 29.
  • the head unit 25 moves between the component supply unit 24 and the board PP to execute a component mounting operation for mounting the component on the board PP.
  • the head unit 25 moves on the push-up plate 281 by moving between the push-up plate 281 and the pin station 29.
  • a pin transfer operation for transporting the push-up pins 282 arranged in the pin station 29 to the pin station 29 is executed. That is, the head unit 25 executes two operations, a component mounting operation and a pin transfer operation. It should be noted that the head unit for component mounting operation and the head unit for pin transfer operation may be provided separately.
  • the head unit 25 includes a plurality of mounting heads 251.
  • the mounting head 251 can be moved up and down in the vertical direction with respect to the frame of the head unit 25, and can rotate around the head axis extending in the vertical direction.
  • the mounting head 251 takes out a component from the component supply unit 24 at the time of executing the component mounting operation, and mounts (mounts) the removed component on the substrate PP.
  • each mounting head 251 takes out the push-up pin 282 from the push-up plate 281 and stores the taken-out push-up pin 282 in the pin station 29.
  • the mounting head 251 is equipped with a suction nozzle 2511 at its tip (lower end).
  • the suction nozzle 2511 there are a nozzle for holding parts capable of sucking and holding parts and a nozzle for holding pins capable of holding suction of push-up pins 282.
  • the suction nozzle 2511 can communicate with any of the negative pressure generator, the positive pressure generator, and the atmosphere via the electric switching valve. That is, the negative pressure is supplied to the suction nozzle 2511 to enable the suction nozzle 2511 to suck and hold (take out) the component or the push-up pin 282, and then the positive pressure is supplied to the component or the push-up. The suction holding of the pin 282 is released.
  • the mounting machine 2 further includes a first image pickup unit 31, a second image pickup unit 32, and a third image pickup unit 33.
  • the first image pickup unit 31 is installed between the component supply unit 24 and the pair of conveyor rails 23 on the main body frame 21, and for example, an image pickup of a CMOS (Complementary metal-axis-semicon decidedr), a CCD (Could-coupled device), or the like is taken. It is an image pickup camera equipped with an element.
  • the first image pickup unit 31 sucks and holds the parts sucked and held by the suction nozzle 2511 of the mounting head 251 while the head unit 25 moves from the parts supply unit 24 toward the substrate PP supported by the push-up pin 282.
  • the first component recognition image is acquired by taking an image from the lower side.
  • the first component recognition image acquired by the first imaging unit 31 is used for determining the drop of the component from the suction nozzle 2511.
  • the second image pickup unit 32 is an image pickup camera arranged in the head unit 25 and provided with an image pickup element such as CMOS or CCD.
  • the second image pickup unit 32 takes an image of the marks from above in order to recognize various marks attached to the upper surface of the substrate PP supported by the push-up pin 282. By recognizing the mark on the substrate PP by the second imaging unit 32, the amount of misalignment with respect to the origin coordinates of the substrate PP is detected.
  • the third image pickup unit 33 is an image pickup camera arranged in the head unit 25 and equipped with an image pickup element such as CMOS or CCD. Immediately before the head unit 25 mounts the component on the substrate PP, the third imaging unit 33 captures the component sucked and held by the suction nozzle 2511 from the side to acquire the second component recognition image. The second component recognition image acquired by the third imaging unit 33 is used for determining the drop of the component from the suction nozzle 2511.
  • the arrangement position of the push-up pin 282 on the push-up plate 281 in the board support device 28 is set for each type of the board PP. Therefore, when the product type of the board PP to which the component is mounted is switched in the mounting machine 2, the arrangement of the push-up pin 282 is changed. The rearrangement of the push-up pin 282 on the push-up plate 281 is performed by the mounting head 251 of the head unit 25.
  • the data creation device 5 is connected to the system management device 4 so as to be capable of data communication, and is composed of, for example, a microcomputer.
  • the data creation device 5 is a device that creates recommended placement data RD indicating the recommended placement position of the push-up pin 282 on the push-up plate 281.
  • the recommended placement data RD created by the data creation device 5 is transmitted to the system management device 4.
  • the system management device 4 receives the recommended placement data RD
  • the system management device 4 updates the control data CD reflecting the contents of the recommended placement data RD.
  • the control data CD reflecting the recommended placement data RD is transmitted to the mounting machine 2.
  • the mounting head 251 when switching the product type of the substrate PP, changes the arrangement of the push-up pin 282 based on the control data CD in which the recommended arrangement data RD is reflected. That is, the mounting head 251 changes the arrangement of the push-up pins 282 based on the recommended arrangement data RD.
  • the data creation device 5 includes a data acquisition unit 51, a storage unit 52, and a data creation unit 53.
  • the data acquisition unit 51 acquires the management data MD transmitted from the system management device 4.
  • the management data MD acquired by the data acquisition unit 51 will be described with reference to FIG.
  • the management data MD is data for managing the production of the board PP in the component mounting system 1.
  • the data set DS includes a plurality of data group DGs, and a plurality of substrate product types PPT are registered in each data group DG.
  • the data set “DS1” includes a data group “1” and a data group “2”.
  • the production order PO the system operating time OT, the system preparation time ST, and the total production time TT are registered.
  • the production order PO is data indicating the production order of each substrate PP of the substrate product type PPT belonging to a plurality of data groups DG.
  • the substrate types "A”, “B”, “C”, “D”, “E”, " Production of substrate PP proceeds in the order of "F”.
  • the system operating time OT is data indicating the actual operating time of the mounting machine 2 and the processing machine 3 for each data group DG when the substrate PP is produced in the order indicated by the production order PO.
  • the actual operating time of the mounting machine 2 and the processing machine 3 when producing the board PPs of the board types “A”, “B”, and “C” belonging to the data group “1” is “TO1”. Is shown to be.
  • the actual operating time of the mounting machine 2 and the processing machine 3 when producing the board PPs of the board types “D”, “E”, and “F” belonging to the data group “2” is “TO2”. It is shown that.
  • the system operating time OT shows a different value according to the change. For example, a system corresponding to the data group “1” depending on whether the substrate types belonging to the data group “1" are “A”, “B”, “C” or “A”, “B”. The operating time OT shows different values. Similarly, when the substrate types belonging to the data group “2" are “D”, “E”, and “F”, and when they are “C”, “D”, “E”, and “F", The system operating time OT corresponding to the data group "2" shows different values.
  • the system preparation time ST is data indicating the preparation time required for the preparation process in the entire component mounting system 1 that may occur in response to the switching of the board type PPT for each board type PPT.
  • the system preparation time ST includes the mounting machine preparation time MT and the processing machine preparation time PT.
  • the processing machine preparation time PT is the preparation time required for the preparation processing of the processing machine 3.
  • the preparatory process of the processing machine 3 includes, for example, a process of preparing a screen mask to be used when printing a solder paste pattern on the substrate PP.
  • the mounting machine preparation time MT is the preparation time required for the preparation process of the mounting machine 2.
  • the preparation process of the mounting machine 2 includes, for example, a process of changing the arrangement of the push-up pin 282, a process of replacing the feeder 24F mounted on the component supply unit 24, a process of replacing the suction nozzle 2511 mounted on the mounting head 251 and the like. included.
  • the system preparation time ST is specified by the longest value among the mounting machine preparation time MT and the processing machine preparation time PT. For example, when the time required for the screen mask preparation process in the processing machine 3 is the longest among the mounting machine preparation time MT and the processing machine preparation time PT, that time is the system preparation time ST. Similarly, when the time required for the replacement process of the feeder 24F in the mounting machine 2 is the longest value among the mounting machine preparation time MT and the processing machine preparation time PT, that time is the system preparation time ST.
  • the system preparation time ST shows a different value according to the change.
  • the board types belonging to the data group "1" are “A”, “B”, and “C”
  • the system preparation time ST for each board type PPT Indicates different values.
  • the substrate types belonging to the data group "2" are “D”, “E”, and “F”
  • the system preparation time ST for each substrate type PPT shows different values.
  • the total production time TT is data indicating the total time required for the production of all the substrate PPs of the substrate product types PPT belonging to the plurality of data groups DG included in the data set DS.
  • the total production time TT is the sum of the added values of the system operating time OT and the system preparation time ST for each data group DG in the data set DS.
  • the system operating time OT and the system preparation time ST show different values according to the change when the substrate type PPT belonging to each data group DG is changed. Therefore, when the substrate type PPT belonging to each data group DG is changed, the total production time TT based on the system operating time OT and the system preparation time ST also shows different values according to the change. In view of this, the substrate type PPT belonging to each data group DG constituting the data set DS is determined so that the total production time TT is the shortest.
  • the position on the push-up plate 281 may be indicated by using XY coordinates. Specifically, the upper surface of the push-up plate 281 is divided into nine regions in the X-axis direction and six regions in the Y-axis direction, and the positions on the push-up plate 281 are indicated by a total of 54 XY coordinate positions.
  • the position of the lower left corner is expressed as coordinates (1,1)
  • the position of the lower right corner is expressed as coordinates (9,1)
  • the position of the upper left corner is expressed as coordinates. It is expressed as (1,6)
  • the position of the upper right corner is expressed as coordinates (9,6).
  • the storage unit 52 stores the reference arrangement data SD indicating the reference arrangement of the push-up pins 282 on the push-up plate 281 for each substrate type PPT.
  • the reference arrangement data SD is data unique to each substrate type PPT. As shown in FIGS. 6 to 8, the reference arrangement data SD divides the required position SD1, the prohibited position SD2, and the selectable position SD3 as the reference arrangement of the push-up pin 282 on the push-up plate 281. It is the data to show.
  • the required position SD1 is a position on the push-up plate 281 where the push-up pin 282 needs to be arranged to support the substrate PP.
  • the required position SD1 is indicated by a “black circle”.
  • the required position SD1 is different for each substrate type PPT.
  • the prohibited position SD2 is a position on the push-up plate 281 that prohibits the placement of the push-up pin 282.
  • the prohibited position SD2 is indicated by a “circle with a cross”.
  • the prohibited position SD2 is different for each substrate type PPT.
  • the selectable position SD3 is a position on the push-up plate 281 that can be appropriately selected depending on whether or not the push-up pin 282 needs to be arranged.
  • the selectable position SD3 is indicated by a "diagonal circle”.
  • the selectable position SD3 is different for each substrate type PPT.
  • the reference arrangement data SD for each board type PPT is referred to when the data creation unit 53 creates the recommended arrangement data RD.
  • the data creation unit 53 creates recommended placement data RD for each substrate type PPT corresponding to the plurality of reference placement data SDs based on the plurality of reference placement data SDs.
  • the data creation unit 53 uses the substrate types “A”, “B”, and “ Create recommended placement data RD corresponding to each of "C”.
  • the data creation unit 53 uses the substrate types "D” and “D” and “F.” Create recommended placement data RD corresponding to each of "E” and "F”.
  • the recommended placement data RD is data indicating the recommended placement position RD1 of the push-up pin 282 on the push-up plate 281.
  • the recommended placement position RD1 is indicated by a "double circle”.
  • the data creation unit 53 calculates the value of the influential factor that affects the efficiency of the arrangement change of the push-up pin 282 according to the switching of the substrate type PPT, and recommends that the value of the influential factor becomes the recommended value. Create placement data RD.
  • the data creation unit 53 does not create the recommended layout data RD in consideration of the layout change of the push-up pin 282 at the time of switching the substrate type PPT once corresponding to one reference layout data SD.
  • the data creation unit 53 creates the recommended layout data RD in consideration of the layout change of the push-up pin 282 at the time of switching the substrate product type PPT a plurality of times corresponding to the plurality of reference layout data SDs.
  • the recommended layout data RD for each substrate type PPT corresponding to the plurality of reference arrangement data SD makes it possible to efficiently change the arrangement of the push-up pin 282 at the time of switching the substrate type PPT.
  • the data creation unit 53 executes a common layout process for creating a common recommended layout data RD for a plurality of substrate product types PPT corresponding to a plurality of reference layout data SDs.
  • the recommended placement position RD1 of the push-up pin 282 on the push-up plate 281 is common to the plurality of substrate product types PPT.
  • another board type for example, board type "B", "C”
  • the rearrangement change of the push-up pin 282 can be omitted. Therefore, it is possible to improve the efficiency of changing the arrangement of the push-up pins 282 when switching the substrate type PPT.
  • the data creation unit 53 executes a separate placement process for creating a separate recommended placement data RD for a plurality of board type PPTs corresponding to the plurality of reference placement data SDs.
  • the recommended placement position RD1 of the push-up pin 282 on the push-up plate 281 is different in each of the plurality of substrate product types PPT.
  • the placement position of the push-up pin 282 is set so that the value of the influencing factor that affects the efficiency of the placement change of the push-up pin 282 is the recommended value. It has been adjusted. Therefore, although it is necessary to change the arrangement of the push-up pins 282 every time the substrate type PPT is switched, the arrangement can be changed efficiently.
  • the data creation unit 53 is configured to calculate the number of pin movements as an influential factor in the separate placement process and create the recommended placement data RD so that the number of pin movements becomes a recommended value (for example, the minimum number of pin movements).
  • the number of pin movements indicates the total number of push-up pins 282 to be moved when the arrangement of the push-up pins 282 is changed according to the switching of the substrate type PPT.
  • the number of pin movements is an influential factor that affects the efficiency of rearranging the push-up pins 282. That is, as the number of push-up pins 282 to be moved at the time of the arrangement change decreases, the efficiency of the arrangement change increases.
  • the recommended placement data RD Since the recommended placement data RD is created so that the number of pin movements, which is an influence factor of the efficiency of the placement change, becomes the recommended value, the recommended placement data RD pushes up when switching the substrate type PPT. It is possible to efficiently change the arrangement of the pins 282.
  • the data creation unit 53 calculates the pin arrangement change time as an influential factor in the separate arrangement process, and creates the recommended arrangement data RD so that the pin arrangement change time becomes a recommended value (for example, the shortest pin arrangement change time). It may be configured to do so.
  • the pin arrangement change time indicates the total time of movement of the push-up pin 282 when the arrangement of the push-up pin 282 is changed according to the change of the substrate type PPT.
  • the pin arrangement change time is an influential factor that affects the efficiency of the arrangement change of the push-up pin 282. That is, as the pin arrangement change time, which indicates the total time of movement of the push-up pin 282 at the time of arrangement change, becomes shorter, the efficiency of the arrangement change increases.
  • the recommended placement data RD is created so that the pin placement change time, which is an influence factor of the efficiency of the placement change, becomes the recommended value, the recommended placement data RD is used to push when switching the substrate type PPT. It is possible to efficiently change the arrangement of the uppin 282.
  • the data creation unit 53 calculates the pin movement distance as an influential factor in the separate placement process, and creates the recommended placement data RD so that the pin movement distance becomes a recommended value (for example, the shortest pin movement distance). It may be configured.
  • the pin movement distance indicates the total distance of movement of the push-up pin 282 when the arrangement of the push-up pin 282 is changed according to the switching of the substrate type PPT.
  • the pin movement distance is an influential factor that affects the efficiency of the rearrangement of the push-up pin 282. That is, as the moving distance of the push-up pin 282 at the time of the arrangement change becomes shorter, the efficiency of the arrangement change increases.
  • the recommended placement data RD Since the recommended placement data RD is created so that the pin movement distance, which is an influence factor of the efficiency of the placement change, becomes the recommended value, the recommended placement data RD pushes up when switching the substrate type PPT. It is possible to efficiently change the arrangement of the pins 282.
  • the data creation unit 53 may be configured to calculate the value of the influential factor assuming the movement of the push-up pin 282 from the pin station 29 to the push-up plate 281. .. Then, the data creation unit 53 creates the recommended placement data RD so that the calculated value of the influential factor becomes the recommended value. With such recommended arrangement data RD, it is possible to efficiently change the arrangement of the push-up pin 282 at the time of switching the substrate type PPT in consideration of the existence of the pin station 29.
  • the coordinates (2, 2) and the coordinates (3, 2) are set as the recommended placement positions RD1 of the push-up pin 282 on the push-up plate 281.
  • Coordinates (4,2), Coordinates (5,2), Coordinates (6,2), Coordinates (7,2), Coordinates (8,2), Coordinates (2,5), Coordinates (3,5) , Coordinates (4,5), coordinates (5,5), coordinates (6,5), coordinates (7,5), and coordinates (8,5) are set respectively.
  • These recommended placement positions RD1 include the required position SD1 in the reference placement data SD corresponding to the substrate type “D”, and do not include the prohibited position SD2.
  • the coordinates (2,1), coordinates (8,1), and coordinates (2,) are set as the recommended placement position RD1 of the pushup pin 282 on the pushup plate 281. 2), coordinates (5,2), coordinates (8,2), coordinates (2,3), coordinates (5,3), coordinates (8,3), coordinates (2,4), coordinates (5,4) ), Coordinates (8,4), coordinates (2,5), coordinates (5,5), coordinates (8,5), coordinates (2,6), and coordinates (8,6) are set respectively.
  • These recommended placement positions RD1 include the required position SD1 in the reference placement data SD corresponding to the substrate type “E”.
  • the coordinates (2,2), coordinates (3,2), and coordinates (5,) are set as the recommended placement position RD1 of the pushup pin 282 on the pushup plate 281. 2), coordinates (7,2), coordinates (8,2), coordinates (2,3), coordinates (5,3), coordinates (8,3), coordinates (2,4), coordinates (5,4) ), Coordinates (8,4), coordinates (2,5), coordinates (3,5), coordinates (5,5), coordinates (7,5), coordinates (8,5), respectively.
  • These recommended placement positions RD1 include the required position SD1 in the reference placement data SD corresponding to the substrate type "F", and do not include the prohibited position SD2.
  • the push-up pin 282 at coordinates (4,5) is moved to coordinates (5,4)
  • the push-up pin 282 at coordinates (7,5) is moved to coordinates (8,4)
  • coordinates (4) 2
  • push-up pin 282 is moved to coordinate (2,3)
  • coordinate (6,2) push-up pin 282 is moved to coordinate (5,3)
  • coordinate (6,5) push-up The pin 282 is moved to the coordinates (8,3)
  • the push-up pin 282 at the coordinates (3,2) is moved to the coordinates (2,1)
  • the push-up pin 282 at the coordinates (7,2) is moved to the coordinates (8). , 1).
  • the four push-up pins 282 are moved as the arrangement change of the push-up pins 282 based on the recommended arrangement data RD. Specifically, among the push-up pins 282 arranged at the recommended arrangement position RD1 on the push-up plate 281 based on the recommended arrangement data RD corresponding to the substrate type "E", the coordinates (2, 6) are pushed. Uppin 282 is moved to coordinates (3,5). Similarly, the push-up pin 282 at coordinates (8, 6) is moved to coordinates (7, 5), the push-up pin 282 at coordinates (2, 1) is moved to coordinates (3, 2), and coordinates (8). , 1) The push-up pin 282 is moved to the coordinates (7, 2).
  • the data creation unit 53 provides all the push-up pins 282 necessary for supporting the substrate PPs of a plurality of types corresponding to the plurality of reference arrangement data SDs in the separate arrangement processing.
  • the value of the influential factor may be calculated assuming the arrangement of all the pins arranged on the push-up plate 281 with the arrangement change for each substrate type PPT.
  • the data creation unit 53 creates the recommended placement data RD so that the calculated value of the influential factor becomes the recommended value.
  • all push-up pins 282 required to support each of the plurality of types of substrate PPs are arranged on the push-up plate 281.
  • the data creation unit 53 creates the recommended layout data RD of one board PP corresponding to one reference layout data SD among the plurality of reference layout data SDs in the case where all pin layouts are assumed, the following Perform separate placement processing as in. That is, the data creation unit 53 selects the required position SD1 in one reference arrangement data SD as the arrangement position of the push-up pin 282 that supports one substrate PP. As a result, one substrate PP can be appropriately supported by the push-up pin 282 arranged at the required position SD1. Further, the data creation unit 53 selects the selectable position SD3 in one reference arrangement data SD as a temporary arrangement position of the push-up pin 282 that supports another substrate PP other than one substrate PP.
  • the push-up pins 282 for the other substrate PP are not temporarily arranged at the prohibited position SD2, but are temporarily arranged at the selectable position SD3. This allows the push-up pins 282 for the other substrate PP to be tentatively placed on the push-up plate 281 while maintaining proper support for one substrate PP.
  • the data creation unit 53 has a pair of conveyor rails 23 arranged above the push-up plate 281 when creating the recommended arrangement data RD of one substrate PP in the case where all pin arrangements are assumed.
  • the data creation unit 53 sets the push-up pin 282 supporting the other substrate PP on the push-up plate 281 in the selectable position SD3 in one reference arrangement data SD as a temporary arrangement position.
  • the one located in the inner region of the pair of conveyor rails 23 is selected. This avoids interference with the pair of conveyor rails 23 when moving the push-up pins 282 when changing the arrangement of the push-up pins 282 according to the switching of the product type from one board PP to another board PP. You don't have to move it while doing it. Therefore, the efficiency of changing the arrangement of the push-up pins 282 can be improved.
  • the data creation unit 53 is configured to sequentially create recommended arrangement data RD for each substrate type PPT according to the switching order of the substrate PP types (corresponding to the production order PO registered in the management data MD). Then, when the data creation unit 53 changes the switching order so that the value of the influential factor tends to improve the efficiency of changing the arrangement of the push-up pins 282 according to the switching of the substrate product type PPT, the data creation unit 53 said.
  • the order of creating the recommended placement data RD is changed according to the change of the switching order. In the example of FIG.
  • the switching order of the board type PPT is in the order of the board types “D”, “E”, “F”, but the switching order is The board types are changed in the order of "D”, “F”, and "E”.
  • the data creation unit 53 changes the creation order of the recommended layout data RD to the order corresponding to the board types “D”, “F”, and “E”.
  • the data creation unit 53 when the data creation unit 53 can improve the efficiency of the arrangement change of the push-up pin 282 by changing the switching order of the board type PPT, the data creation unit 53 recommends the arrangement data according to the change of the switching order. Change the creation order of RD. As a result, after changing the switching order of the substrate product type PPT, it is possible to improve the efficiency of changing the arrangement of the push-up pins 282 according to the product type switching.
  • the coordinates (2,2) and the coordinates (3,2) are set as the recommended arrangement position RD1 of the pushup pin 282 on the pushup plate 281.
  • Coordinates (4,2), Coordinates (5,2), Coordinates (7,2), Coordinates (8,2), Coordinates (2,5), Coordinates (3,5), Coordinates (4,5) , Coordinates (5,5), coordinates (7,5), and coordinates (8,5) are set respectively.
  • These recommended placement positions RD1 include the required position SD1 in the reference placement data SD corresponding to the substrate type “D”, and do not include the prohibited position SD2.
  • the coordinates (2,2), coordinates (5,2), and coordinates (8,) are set as the recommended placement position RD1 of the pushup pin 282 on the pushup plate 281. 2), coordinates (2,3), coordinates (5,3), coordinates (8,3), coordinates (2,4), coordinates (5,4), coordinates (8,4), coordinates (2,5) ), Coordinates (5,5), and coordinates (8,5) are set respectively.
  • These recommended placement positions RD1 include the required position SD1 in the reference placement data SD corresponding to the substrate type "F", and do not include the prohibited position SD2.
  • the coordinates (2,1), coordinates (8,1), and coordinates (5,) are set as the recommended placement position RD1 of the pushup pin 282 on the pushup plate 281. 2), coordinates (2,3), coordinates (5,3), coordinates (8,3), coordinates (2,4), coordinates (5,4), coordinates (8,4), coordinates (5,5) ), Coordinates (2,6), and coordinates (8,6) are set respectively.
  • These recommended placement positions RD1 include the required position SD1 in the reference placement data SD corresponding to the substrate type “E”.
  • the six push-up pins 282 are moved as the arrangement change of the push-up pins 282 based on the recommended arrangement data RD. .. Specifically, among the push-up pins 282 arranged at the recommended arrangement position RD1 on the push-up plate 281 based on the recommended arrangement data RD corresponding to the substrate type "D", the coordinates (3, 5) are pushed. Uppin 282 is moved to coordinates (2,4). Similarly, the push-up pin 282 at coordinates (4,5) is moved to coordinates (5,4), the push-up pin 282 at coordinates (7,5) is moved to coordinates (8,4), and coordinates (3). , 2) push-up pin 282 is moved to coordinate (2,3), coordinate (4,2) push-up pin 282 is moved to coordinate (5,3), and coordinate (7,2) push-up. Pin 282 is moved to coordinates (8,3).
  • the four push-up pins 282 are moved as the arrangement change of the push-up pins 282 based on the recommended arrangement data RD. Specifically, among the push-up pins 282 arranged at the recommended arrangement position RD1 on the push-up plate 281 based on the recommended arrangement data RD corresponding to the substrate type "F", the coordinates (2, 5) are pushed. Uppin 282 is moved to coordinates (2,6). Similarly, the push-up pin 282 at coordinates (8, 5) is moved to coordinates (8, 6), the push-up pin 282 at coordinates (2, 2) is moved to coordinates (2, 1), and coordinates (8). , 2) The push-up pin 282 is moved to the coordinates (8, 1).
  • the data creation unit 53 tries the common arrangement process for all the board type PPTs in the data set DS based on the management data MD acquired by the data acquisition unit 51 (step S1).
  • the data creation unit 53 determines whether or not the common recommended allocation data RD can be created by this common allocation process (step S2).
  • the data creation unit 53 ends the data creation process.
  • the arrangement of the push-up pin 282 is changed by the mounting head 251 based on the recommended arrangement data RD common to all the substrate product types PPT in the data set DS.
  • step S3 the data creation unit 53 tries the common arrangement process for the substrate type PPT in the data group DG.
  • the data creation unit 53 determines whether or not the common recommended allocation data RD can be created by this common allocation process (step S4).
  • step S4 the data creation unit 53 calculates the number of common recommended placement data RDs to be created when the order of the data group DG is changed (step). S6), and then the process proceeds to step S7.
  • the data creation unit 53 is the production sequence PO in the data group DG.
  • the number of common recommended placement data RDs to be created at the time of change is calculated (step S5), and then the process shifts to step S7.
  • step S7 the data creation unit 53 tries the separate placement process for the substrate type PPT that is not the target of the common placement process.
  • the data creation unit 53 creates a separate recommended placement data RD for the substrate type PPT that is the target of this separate placement processing.
  • step S8 the data creation unit 53 determines whether or not the separate placement process is completed (step S8), and ends the creation process of the recommended placement data RD when the separate placement process is completed.
  • the processing machines 3 and the mounting machines 2 constituting the component mounting system 1 sequentially produce each board PP having the board types PPT belonging to the same data group DG as “A”, “B”, and “C”. The scene is illustrated.
  • the data creation unit 53 recommends it by setting the recommended value of the influential factor so that the system preparation time ST registered in the management data MD is the shortest. Create placement data RD.
  • the value of the influential factor in this case, any one of the above-mentioned "number of pin movements", “pin arrangement change time”, and "pin movement distance" is used.
  • the average value of the processing machine preparation time PT for each substrate type PPT is the mounting machine preparation time MT.
  • the data creation unit 53 sets the pin arrangement change time required for the arrangement change of the push-up pin 282 as the value of the influential factor, and sets the recommended value of the pin arrangement change time to a value close to the processing machine preparation time PT. , Create recommended placement data RD.
  • the data creation unit 53 extracts the longest value in each mounting machine preparation time MT for each board type PPT.
  • the mounting machine preparation time MT of the board type “C” shows the longest value.
  • the data creation unit 53 sets the recommended value of the pin arrangement change time at the time of changing the arrangement of the push-up pin 282 according to the switching of the board type PPT corresponding to the longest value to a value close to the processing machine preparation time PT. By doing so, the recommended placement data RD is created.
  • the system preparation time ST of the entire component mounting system 1 at the time of switching the board type PPT is processed.
  • Machine preparation time Determined by PT that is, even if the pin arrangement change time included in the mounting machine preparation time MT is set to an extremely short time, it does not contribute to the efficiency of the preparation processing of the entire component mounting system 1. In other words, it is sufficient that the pin arrangement change time is set to a value close to the processing machine preparation time PT. Such setting of the pin arrangement change time does not reduce the efficiency of the preparation process of the entire component mounting system 1.
  • the data creation device is a device for creating data regarding the arrangement position of push-up pins on a push-up plate in a board support device provided in a component mounting system for producing a board on which components are mounted. Is.
  • This data creation device is based on a storage unit that stores reference arrangement data unique to each type of the substrate, which indicates the reference arrangement of the push-up pins on the push-up plate, and a plurality of the reference arrangement data.
  • the value of the influential factor that affects the efficiency of the arrangement change of the push-up pin according to the switching of the type of the substrate is calculated, and the value of the influential factor is set on the push-up plate so as to be the recommended value.
  • It is provided with a data creation unit that creates recommended placement data indicating the recommended placement position of the push-up pin for each type of the substrate corresponding to the plurality of reference placement data.
  • the data creation unit creates recommended placement data indicating the recommended placement position of the push-up pin on the push-up plate based on a plurality of reference placement data unique to each type of substrate. That is, the data creation unit does not create the recommended placement data in consideration of the change in the placement of the push-up pins at the time of switching the board type once corresponding to one reference placement data.
  • the data creation unit creates recommended layout data in consideration of the push-up pin layout change at the time of switching the board product a plurality of times corresponding to the plurality of reference layout data. With such recommended layout data for each type of substrate corresponding to a plurality of reference arrangement data, it is possible to efficiently change the arrangement of push-up pins when switching between substrate types.
  • the data creation unit executes a common arrangement process for creating the recommended arrangement data common to a plurality of types of the substrate corresponding to the plurality of reference arrangement data.
  • the recommended layout data common to multiple types of boards is created by the common layout processing by the data creation unit.
  • the recommended layout data common to a plurality of board types it is possible to omit the push-up pin placement change when switching to another board type after switching one board type. Therefore, it is possible to improve the efficiency of changing the arrangement of the push-up pins when switching the substrate type.
  • the data creation unit executes a separate placement process for creating separate recommended placement data for a plurality of types of the substrate corresponding to the plurality of reference placement data.
  • the separate placement process by the data creation unit creates separate recommended placement data for multiple types of boards.
  • the recommended placement data for multiple types of boards are those in which the placement position of the push-up pin is adjusted so that the value of the influential factor that affects the efficiency of the push-up pin placement change is the recommended value. Is. Therefore, although it is necessary to change the arrangement of the push-up pins every time the board type is switched, the arrangement can be changed efficiently.
  • the data creation unit determines the total number of the push-up pins to be moved when the arrangement of the push-up pins is changed according to the switching of the type of the substrate in the separate arrangement process.
  • the number of pin movements shown is calculated as the value of the influence factor, and the recommended arrangement data is created so that the number of pin movements becomes the recommended value.
  • the data creation unit creates recommended placement data so that the number of pin movements when changing the placement of push-up pins is the recommended value.
  • the number of pin movements is an influential factor that affects the efficiency of changing the arrangement of push-up pins. That is, as the number of push-up pins to be moved when changing the arrangement decreases, the efficiency of the arrangement change increases. Since the recommended placement data is created so that the number of pin movements, which is an influence factor of the efficiency of the placement change, is the recommended value, the push-up pin placement when switching the board type is based on this recommended placement data. It is possible to make changes efficiently.
  • the data creation unit determines the total time of movement of the push-up pins when the arrangement of the push-up pins is changed according to the switching of the product type of the substrate in the separate arrangement process.
  • the indicated pin arrangement change time is calculated as the value of the influence factor, and the recommended arrangement data is created so that the pin arrangement change time becomes the recommended value.
  • the data creation unit creates recommended placement data so that the pin placement change time when changing the push-up pin placement is the recommended value.
  • the pin placement change time is an influential factor that affects the efficiency of the push-up pin placement change. That is, the efficiency of the arrangement change increases as the pin arrangement change time, which indicates the total time of the push-up pin movement at the time of changing the arrangement of the push-up pins, becomes shorter. Since the recommended placement data is created so that the pin placement change time, which is an influence factor of the efficiency of the placement change, is the recommended value, the recommended placement data can be used to switch the push-up pin when switching the board type. It is possible to efficiently change the layout.
  • the data creation unit determines the total distance of movement of the push-up pins when the arrangement of the push-up pins is changed according to the switching of the product type of the substrate in the separate arrangement process.
  • the indicated pin movement distance is calculated as the value of the influential factor, and the recommended placement data is created so that the pin movement distance becomes the recommended value.
  • the data creation unit creates recommended placement data so that the pin movement distance when changing the placement of the push-up pin becomes the recommended value.
  • the pin movement distance is an influential factor that affects the efficiency of changing the position of the push-up pin. That is, as the moving distance of the push-up pin at the time of the arrangement change becomes shorter, the efficiency of the arrangement change increases. Since the recommended placement data is created so that the pin movement distance, which is an influence factor of the efficiency of the placement change, becomes the recommended value, the push-up pin placement when switching the board type is based on this recommended placement data. It is possible to make changes efficiently.
  • the data creation unit assumes the movement of the push-up pin from the pin station for storing the push-up pin to the push-up plate in the separate arrangement process, and the value of the influence factor. Is calculated, and the recommended placement data is created so that the value of the influential factor becomes the recommended value.
  • the data creation unit creates recommended placement data assuming the movement of the push-up pin from the pin station to the push-up plate. With such recommended placement data, it is possible to efficiently change the placement of push-up pins when switching board types, taking into consideration the existence of pin stations.
  • the data creation unit performs all the push-up pins necessary for supporting each of the plurality of types of substrates corresponding to the plurality of reference arrangement data in the separate arrangement process.
  • the value of the influential factor is calculated assuming all the pin arrangements to be arranged on the push-up plate with the arrangement change for each type of the substrate, and the recommended value is set to the recommended value. Create placement data.
  • the data creation unit creates recommended layout data assuming all pin layouts in which all push-up pins required to support multiple types of substrates are placed on the push-up plate.
  • all push-up pins required to support each of the plurality of types of substrates are arranged on the push-up plate.
  • the reference arrangement data is the necessary position where the push-up pin arrangement is required and the push-up as the reference arrangement for each type of the substrate of the push-up pin on the push-up plate. It is data which shows the division of the prohibition position which prohibits the arrangement of a pin, and the selectable position which can be appropriately selected about the necessity of the arrangement of a push-up pin. Then, when the data creation unit assumes the all pin arrangement and creates the recommended arrangement data of one board corresponding to one reference arrangement data among the plurality of reference arrangement data, the data creation unit may create the recommended arrangement data.
  • the placement position of the push-up pin that supports the one board As the placement position of the push-up pin that supports the one board, the required position in the reference placement data of the one is selected, and the temporary placement of the push-up pin that supports the other boards other than the one board is tentatively arranged. As the position, the selectable position in the reference arrangement data of the one is selected.
  • the data creation unit when creating the recommended arrangement data of one board, one reference arrangement data is used as the arrangement position of the push-up pins supporting one board. Select the required position in. This allows one board to be properly supported by push-up pins located at the required positions.
  • the data creation unit sets the selectable position in the reference placement data as a temporary placement position for push-up pins that support other boards other than one board. Select. That is, when supporting one board, the push-up pins for the other boards are not temporarily placed in the prohibited positions, but are temporarily placed in the selectable positions. This allows push-up pins for another board to be tentatively placed on the push-up plate while maintaining proper support for one board.
  • the data creation unit is arranged above the push-up plate when creating the recommended arrangement data of the one substrate in the case where the all pin arrangement is assumed.
  • the push is used as a temporary arrangement position of the push-up pin supporting the other substrate in the selectable position in the reference arrangement data. The one located in the inner region of the pair of conveyor rails on the up plate is selected.
  • the data creation unit is in a position that can be selected as a temporary placement position of push-up pins for another board when creating recommended placement data for one board in the case of assuming all pin placement. Select the one located in the inner area of the pair of conveyor rails.
  • the data creation unit is configured to sequentially create the recommended arrangement data for each type of the substrate according to the switching order of the types of the substrate. Then, when the data creation unit changes the switching order, the value of the influential factor tends to improve the efficiency of changing the arrangement of the push-up pins according to the switching of the product type of the substrate. Changes the creation order of the recommended placement data according to the change of the switching order.
  • the data creation unit creates recommended layout data according to the change in the switching order when it is possible to improve the efficiency of the push-up pin placement change by changing the switching order of the board types. Change the order. As a result, after changing the switching order of the board types, it is possible to improve the efficiency of changing the arrangement of the push-up pins according to the switching of the types.
  • the component mounting system includes a processing machine for processing the board and a mounting machine for mounting the components on the board, and the mounting machine is configured to be provided with the board support device. Is to be done.
  • the above-mentioned data creation apparatus has a data acquisition unit for acquiring data regarding the system preparation time required for the preparation process in the entire component mounting system, which may occur in response to the switching of the board type, for each board type. Further prepare. Then, the data creation unit creates the recommended placement data by setting the recommended value of the influential factor so that the system preparation time is the shortest.
  • the data creation unit creates recommended layout data so that the system preparation time required for the preparation process in the entire component mounting system according to the switching of the board type is the shortest.
  • the efficiency of the preparation process of the entire component mounting system can be improved by increasing the efficiency of changing the arrangement of the push-up pins according to the switching of the board type.
  • the system preparation time includes the processing machine preparation time required for the preparation processing of the processing machine and the mounting machine preparation time required for the preparation processing of the entire mounting machine including the rearrangement change of the push-up pin. , Including. Then, when the average value of the processing machine preparation time for each type of the substrate is longer than the average value of the mounting machine preparation time, the data creating unit arranges the pins required for changing the arrangement of the push-up pins.
  • the recommended placement data is created by setting the change time as the value of the influential factor and setting the recommended value of the pin placement change time to a value close to the processing machine preparation time.
  • the data creation unit extracts the longest value in each mounting machine preparation time for each type of the board, and responds to the switching of the type of the board corresponding to the longest value.
  • the recommended arrangement data is created by setting the recommended value of the pin arrangement change time at the time of changing the arrangement of the push-up pin to a value close to the processing machine preparation time.
  • the data creation unit sets the recommended value of the pin arrangement change time as the processing machine preparation time. Create recommended placement data by setting close values.
  • the system preparation time of the entire component mounting system at the time of switching the board type is determined by the processing machine preparation time. That is, even if the pin arrangement change time included in the mounting machine preparation time is set to an extremely short time, it does not contribute to the efficiency of the preparation processing of the entire component mounting system. In other words, it is sufficient that the pin arrangement change time is set to a value close to the processing machine preparation time. Such setting of the pin arrangement change time does not reduce the efficiency of the preparation process of the entire component mounting system.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de création de données (5) comprenant une unité de stockage (52) et une unité de création de données (53). L'unité de stockage (52) stocke des données de disposition standard (SD) uniques à chaque type de substrat (PP), les données de disposition standard indiquant une disposition standard d'une broche pushup (282) sur une plaque pushup (281). L'unité de création de données (53) calcule, sur la base d'une pluralité d'éléments de données de disposition standard (SD), une valeur pour un facteur d'impact qui frappe l'efficacité d'un changement d'agencement de broche pushup (282) correspondant à un commutateur dans le type de substrat (PP). L'unité de création de données (53) crée, pour chaque type de substrat (PP) correspondant à la pluralité d'éléments de données de disposition standard (SD), des données de disposition recommandées (RD) indiquant une position de disposition recommandée (RD1) pour la broche pushup (282) sur la plaque pushup (281), de telle sorte que la valeur du facteur d'impact atteint une valeur recommandée.
PCT/JP2020/042527 2020-11-13 2020-11-13 Dispositif de création de données et système de montage de composant WO2022102104A1 (fr)

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PCT/JP2020/042527 WO2022102104A1 (fr) 2020-11-13 2020-11-13 Dispositif de création de données et système de montage de composant
JP2022561228A JP7420969B2 (ja) 2020-11-13 2020-11-13 データ作成装置及び部品実装システム

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004228254A (ja) * 2003-01-21 2004-08-12 Yamaha Motor Co Ltd バックアップピンの配置変更方法および表面実装機
JP2005064058A (ja) * 2003-08-18 2005-03-10 Fujitsu Ltd バックアップピンの位置決定装置及びバックアップピンの位置決定方法
JP2013058509A (ja) * 2011-09-07 2013-03-28 Panasonic Corp 電子部品実装装置および下受けピンの配置方法ならびに下受けピンの返戻方法
JP2014203966A (ja) * 2013-04-04 2014-10-27 ヤマハ発動機株式会社 レイアウト変更順位決定ユニット及び表面実装機
JP2019186454A (ja) * 2018-04-13 2019-10-24 ヤマハ発動機株式会社 作業補助装置
WO2019225010A1 (fr) * 2018-05-25 2019-11-28 株式会社Ｆｕｊｉ Dispositif de détermination, dispositif de montage de composant doté de celui-ci, et procédé de détermination

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004228254A (ja) * 2003-01-21 2004-08-12 Yamaha Motor Co Ltd バックアップピンの配置変更方法および表面実装機
JP2005064058A (ja) * 2003-08-18 2005-03-10 Fujitsu Ltd バックアップピンの位置決定装置及びバックアップピンの位置決定方法
JP2013058509A (ja) * 2011-09-07 2013-03-28 Panasonic Corp 電子部品実装装置および下受けピンの配置方法ならびに下受けピンの返戻方法
JP2014203966A (ja) * 2013-04-04 2014-10-27 ヤマハ発動機株式会社 レイアウト変更順位決定ユニット及び表面実装機
JP2019186454A (ja) * 2018-04-13 2019-10-24 ヤマハ発動機株式会社 作業補助装置
WO2019225010A1 (fr) * 2018-05-25 2019-11-28 株式会社Ｆｕｊｉ Dispositif de détermination, dispositif de montage de composant doté de celui-ci, et procédé de détermination

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