WO2022098618A1 - Substrates with improved electrostatic performance - Google Patents
Substrates with improved electrostatic performance Download PDFInfo
- Publication number
- WO2022098618A1 WO2022098618A1 PCT/US2021/057661 US2021057661W WO2022098618A1 WO 2022098618 A1 WO2022098618 A1 WO 2022098618A1 US 2021057661 W US2021057661 W US 2021057661W WO 2022098618 A1 WO2022098618 A1 WO 2022098618A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- major surface
- glass
- nanometers
- glass sheet
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 106
- 239000011521 glass Substances 0.000 claims abstract description 135
- 230000008021 deposition Effects 0.000 claims abstract description 40
- 230000003746 surface roughness Effects 0.000 claims abstract description 36
- 239000010954 inorganic particle Substances 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 30
- 239000006060 molten glass Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000006185 dispersion Substances 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- 239000003513 alkali Substances 0.000 claims description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 8
- 239000008119 colloidal silica Substances 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 7
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 description 36
- 230000008018 melting Effects 0.000 description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 238000007786 electrostatic charging Methods 0.000 description 22
- 238000012360 testing method Methods 0.000 description 20
- 238000002156 mixing Methods 0.000 description 18
- 239000002245 particle Substances 0.000 description 15
- 239000002994 raw material Substances 0.000 description 14
- 239000003599 detergent Substances 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 229910001593 boehmite Inorganic materials 0.000 description 8
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 8
- 230000005484 gravity Effects 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 230000003750 conditioning effect Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000006025 fining agent Substances 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000007600 charging Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 3
- 230000037361 pathway Effects 0.000 description 3
- -1 platinum group metals Chemical class 0.000 description 3
- 239000011214 refractory ceramic Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910000873 Beta-alumina solid electrolyte Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910001680 bayerite Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910001648 diaspore Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 229910001679 gibbsite Inorganic materials 0.000 description 2
- 238000007496 glass forming Methods 0.000 description 2
- 238000005816 glass manufacturing process Methods 0.000 description 2
- 239000000156 glass melt Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001682 nordstrandite Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000004439 roughness measurement Methods 0.000 description 2
- 238000003283 slot draw process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002156 adsorbate Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000003286 fusion draw glass process Methods 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/42—Coatings comprising at least one inhomogeneous layer consisting of particles only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/70—Properties of coatings
- C03C2217/77—Coatings having a rough surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/112—Deposition methods from solutions or suspensions by spraying
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/116—Deposition methods from solutions or suspensions by spin-coating, centrifugation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
Definitions
- the present disclosure relates generally to substrates and more particularly to substrates with improved electrostatic performance.
- Thin glass substrates are commonly utilized in flat panel display (FPD) devices such as liquid crystal display (LCD) and organic light emitting diode (OLED) displays.
- FPD flat panel display
- Substrates used in FPD devices generally have a functional A-side surface on which the thin- film transistors are fabricated and a non-functional backside or B-side surface which opposes the A-side surface.
- the B-side surface of the glass substrate may come into contact with conveyance and handling equipment of various materials, such as metals, ceramics, polymeric materials and the like.
- the interaction between the substrate and these materials often results in charging through the triboelectric effect or contact electrification.
- charge is transferred to the glass surface and can be accumulated on the substrate.
- the surface voltage of the glass substrate also changes.
- Electrostatic charging (ESC) of B-side surfaces of glass substrates used in FPD devices may degrade the performance of the glass substrate and/or damage the glass substrate.
- electrostatic charging of the B-side surface may cause gate damage to thin film transistor (TFT) devices deposited on the A-side surface of the glass substrate through dielectric breakdown or electric field induced charging.
- TFT thin film transistor
- charging of the B-side surface of the glass substrate may attract particles, such as dust or other particulate debris, which may damage the glass substrate or degrade the surface quality of the glass substrate.
- electrostatic charging of the glass substrate may decrease FPD device manufacturing yields thereby increasing the overall cost of the manufacturing process.
- Embodiments disclosed herein include a substrate.
- the substrate includes a first major surface and an opposing second major surface extending in a generally parallel direction to the first major surface.
- the substrate also includes a glass sheet and a deposition layer extending between the glass sheet and the second major surface.
- the deposition layer includes inorganic particles and imparts a surface roughness on the second major surface of the substrate ranging from about 0.4 nanometers to about 50 nanometers.
- Embodiments disclosed herein also include a method of making a substrate.
- the method includes depositing a deposition layer on a glass sheet.
- the deposition layer extends between the glass sheet and a second major surface of the substrate and the glass sheet extends between the deposition layer and a first major surface of the substrate.
- the first major surface extends in a generally parallel direction to the second major surface.
- the deposition layer includes inorganic particles and imparts a surface roughness on the second major surface of the substrate ranging from about 0.4 nanometers to about 50 nanometers.
- FIG. l is a schematic view of an example fusion down draw glass making apparatus and process
- FIG. 2 is a perspective view of a glass sheet
- FIG. 3 is a side cutaway view of a glass sheet with a liquid dispersed deposition layer deposited thereon;
- FIG. 4 is a side cutaway view of a glass sheet with a deposition layer deposited thereon;
- FIG. 5 is a side cutaway view of a lift testing apparatus in a first stage of operation
- FIG. 6 is a side cutaway view of a lift testing apparatus in a second stage of operation.
- FIG. 7 is a side cutaway view of a lift testing apparatus in a third stage of operation.
- Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, for example by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
- surface roughness refers to the measured roughness on a major surface of a substrate as determined by the Surface Roughness Measurement Technique as described herein.
- electrostatic charge refers to the measured charge on a major surface of a substrate as determined by the Surface Voltage Measurement Technique as described herein.
- the glass manufacturing apparatus 10 can comprise a glass melting furnace 12 that can include a melting vessel 14.
- glass melting furnace 12 can optionally include one or more additional components such as heating elements (e.g., combustion burners or electrodes) that heat raw materials and convert the raw materials into molten glass.
- heating elements e.g., combustion burners or electrodes
- glass melting furnace 12 may include thermal management devices (e.g., insulation components) that reduce heat lost from a vicinity of the melting vessel.
- glass melting furnace 12 may include electronic devices and/or electromechanical devices that facilitate melting of the raw materials into a glass melt.
- glass melting furnace 12 may include support structures (e.g., support chassis, support member, etc.) or other components.
- Glass melting vessel 14 is typically comprised of refractory material, such as a refractory ceramic material, for example a refractory ceramic material comprising alumina or zirconia. In some examples glass melting vessel 14 may be constructed from refractory ceramic bricks. Specific embodiments of glass melting vessel 14 will be described in more detail below.
- the glass melting furnace may be incorporated as a component of a glass manufacturing apparatus to fabricate a glass sheet, for example a glass ribbon of a continuous length.
- the glass melting furnace of the disclosure may be incorporated as a component of a glass manufacturing apparatus comprising a slot draw apparatus, a float bath apparatus, a down-draw apparatus such as a fusion process, an up- draw apparatus, a press-rolling apparatus, a tube drawing apparatus or any other glass manufacturing apparatus that would benefit from the aspects disclosed herein.
- FIG. 1 schematically illustrates glass melting furnace 12 as a component of a fusion down-draw glass manufacturing apparatus 10 for fusion drawing a glass ribbon for subsequent processing into individual glass sheets.
- the glass manufacturing apparatus 10 can optionally include an upstream glass manufacturing apparatus 16 that is positioned upstream relative to glass melting vessel 14. In some examples, a portion of, or the entire upstream glass manufacturing apparatus 16, may be incorporated as part of the glass melting furnace 12.
- the upstream glass manufacturing apparatus 16 can include a storage bin 18, a raw material delivery device 20 and a motor 22 connected to the raw material delivery device.
- Storage bin 18 may be configured to store a quantity of raw materials 24 that can be fed into melting vessel 14 of glass melting furnace 12, as indicated by arrow 26.
- Raw materials 24 typically comprise one or more glass forming metal oxides and one or more modifying agents.
- raw material delivery device 20 can be powered by motor 22 such that raw material delivery device 20 delivers a predetermined amount of raw materials 24 from the storage bin 18 to melting vessel 14.
- motor 22 can power raw material delivery device 20 to introduce raw materials 24 at a controlled rate based on a level of molten glass sensed downstream from melting vessel 14.
- Raw materials 24 within melting vessel 14 can thereafter be heated to form molten glass 28.
- Glass manufacturing apparatus 10 can also optionally include a downstream glass manufacturing apparatus 30 positioned downstream relative to glass melting furnace 12.
- a portion of downstream glass manufacturing apparatus 30 may be incorporated as part of glass melting furnace 12.
- first connecting conduit 32 discussed below, or other portions of the downstream glass manufacturing apparatus 30, may be incorporated as part of glass melting furnace 12.
- Elements of the downstream glass manufacturing apparatus, including first connecting conduit 32 may be formed from a precious metal. Suitable precious metals include platinum group metals selected from the group of metals consisting of platinum, iridium, rhodium, osmium, ruthenium and palladium, or alloys thereof.
- downstream components of the glass manufacturing apparatus may be formed from a platinum-rhodium alloy including from about 70 to about 90% by weight platinum and about 10% to about 30% by weight rhodium.
- platinum-rhodium alloy including from about 70 to about 90% by weight platinum and about 10% to about 30% by weight rhodium.
- suitable metals can include molybdenum, palladium, rhenium, tantalum, titanium, tungsten and alloys thereof.
- Downstream glass manufacturing apparatus 30 can include a first conditioning (i.e., processing) vessel, such as fining vessel 34, located downstream from melting vessel 14 and coupled to melting vessel 14 by way of the above-referenced first connecting conduit 32.
- a first conditioning (i.e., processing) vessel such as fining vessel 34
- molten glass 28 may be gravity fed from melting vessel 14 to fining vessel 34 by way of first connecting conduit 32.
- gravity may cause molten glass 28 to pass through an interior pathway of first connecting conduit 32 from melting vessel 14 to fining vessel 34.
- other conditioning vessels may be positioned downstream of melting vessel 14, for example between melting vessel 14 and fining vessel 34.
- a conditioning vessel may be employed between the melting vessel and the fining vessel wherein molten glass from a primary melting vessel is further heated to continue the melting process, or cooled to a temperature lower than the temperature of the molten glass in the melting vessel before entering the fining vessel.
- Bubbles may be removed from molten glass 28 within fining vessel 34 by various techniques.
- raw materials 24 may include multivalent compounds (i.e. fining agents) such as tin oxide that, when heated, undergo a chemical reduction reaction and release oxygen.
- fining agents include without limitation arsenic, antimony, iron and cerium.
- Fining vessel 34 is heated to a temperature greater than the melting vessel temperature, thereby heating the molten glass and the fining agent.
- Oxygen bubbles produced by the temperature-induced chemical reduction of the fining agent(s) rise through the molten glass within the fining vessel, wherein gases in the molten glass produced in the melting furnace can diffuse or coalesce into the oxygen bubbles produced by the fining agent.
- the enlarged gas bubbles can then rise to a free surface of the molten glass in the fining vessel and thereafter be vented out of the fining vessel.
- the oxygen bubbles can further induce mechanical mixing of the molten glass in the fining vessel.
- Downstream glass manufacturing apparatus 30 can further include another conditioning vessel such as a mixing vessel 36 for mixing the molten glass.
- Mixing vessel 36 may be located downstream from the fining vessel 34.
- Mixing vessel 36 can be used to provide a homogenous glass melt composition, thereby reducing cords of chemical or thermal inhomogeneity that may otherwise exist within the fined molten glass exiting the fining vessel.
- fining vessel 34 may be coupled to mixing vessel 36 by way of a second connecting conduit 38.
- molten glass 28 may be gravity fed from the fining vessel 34 to mixing vessel 36 by way of second connecting conduit 38. For instance, gravity may cause molten glass 28 to pass through an interior pathway of second connecting conduit 38 from fining vessel 34 to mixing vessel 36.
- mixing vessel 36 is shown downstream of fining vessel 34, mixing vessel 36 may be positioned upstream from fining vessel 34.
- downstream glass manufacturing apparatus 30 may include multiple mixing vessels, for example a mixing vessel upstream from fining vessel 34 and a mixing vessel downstream from fining vessel 34. These multiple mixing vessels may be of the same design, or they may be of different designs.
- Downstream glass manufacturing apparatus 30 can further include another conditioning vessel such as delivery vessel 40 that may be located downstream from mixing vessel 36.
- Delivery vessel 40 may condition molten glass 28 to be fed into a downstream forming device.
- delivery vessel 40 can act as an accumulator and/or flow controller to adjust and/or provide a consistent flow of molten glass 28 to forming body 42 by way of exit conduit 44.
- mixing vessel 36 may be coupled to delivery vessel 40 by way of third connecting conduit 46.
- molten glass 28 may be gravity fed from mixing vessel 36 to delivery vessel 40 by way of third connecting conduit 46.
- gravity may drive molten glass 28 through an interior pathway of third connecting conduit 46 from mixing vessel 36 to delivery vessel 40.
- Downstream glass manufacturing apparatus 30 can further include forming apparatus 48 comprising the above-referenced forming body 42 and inlet conduit 50.
- Exit conduit 44 can be positioned to deliver molten glass 28 from delivery vessel 40 to inlet conduit 50 of forming apparatus 48.
- exit conduit 44 may be nested within and spaced apart from an inner surface of inlet conduit 50, thereby providing a free surface of molten glass positioned between the outer surface of exit conduit 44 and the inner surface of inlet conduit 50.
- Forming body 42 in a fusion down draw glass making apparatus can comprise a trough 52 positioned in an upper surface of the forming body and converging forming surfaces 54 that converge in a draw direction along a bottom edge 56 of the forming body.
- Molten glass delivered to the forming body trough via delivery vessel 40, exit conduit 44 and inlet conduit 50 overflows side walls of the trough and descends along the converging forming surfaces 54 as separate flows of molten glass.
- the separate flows of molten glass join below and along bottom edge 56 to produce a single ribbon of glass 58 that is drawn in a draw or flow direction 60 from bottom edge 56 by applying tension to the glass ribbon, such as by gravity, edge rolls 72 and pulling rolls 82, to control the dimensions of the glass ribbon as the glass cools and a viscosity of the glass increases. Accordingly, glass ribbon 58 goes through a visco-elastic transition and acquires mechanical properties that give the glass ribbon 58 stable dimensional characteristics.
- FIG. 2 shows a perspective view of a glass sheet 62 having a first major surface 162, an opposing second major surface 164 extending in a generally parallel direction to the first major surface 162 (on the opposite side of the glass sheet 62 as the first major surface) and an edge surface 166 extending between the first major surface 162 and the second major surface 164 and extending in a generally perpendicular direction to the first and second major surfaces 162, 164.
- FIG. 3 shows a side cutaway view of a glass sheet 62 with a liquid dispersed deposition layer 202 deposited thereon.
- liquid dispersed deposition layer 202 is deposited on second major surface 164 of glass sheet 62 making a substrate precursor 62’.
- Liquid dispersed deposition layer 202 can be deposited on glass sheet 62 via disperser 300 according to methods known to persons having ordinary skill in the art including, but not limited to, at least one of spin coating, flow coating, or spray coating.
- the deposition layer can be dispersed in water such that such that liquid dispersed deposition layer 202 comprises an aqueous dispersion.
- Deposition layer may also be dispersed in other liquids, including organic solvents, such as, for example, alcohols, aliphatic hydrocarbons, aromatic hydrocarbons, amines, esters, ethers, and/or ketones.
- the weight percent (wt%) solids in the liquid dispersed deposition layer 202 may, for example, range from about 0. lwt% to about 10wt%, such as from about 0.5wt% to about 5wt%, and further such as from about lwt% to about 3wt%.
- the liquid dispersed deposition layer 202 can comprise solid materials that comprise inorganic particles. Such particles may, for example, comprise at least one of an aluminum oxide, an aluminum hydroxide, and/or a colloidal silica.
- such particles Prior to being incorporated into the liquid dispersed deposition layer 202, such particles may, for example, comprise a Brunauer-Emmett-Teller (BET) specific surface area of at least about 100 square meters per gram, such as at least about 200 square meters per gram, and further such as at least about 300 square meters per gram, including from about 100 square meters per gram to about 500 square meters per gram, such as from about 200 square meters per gram to about 400 square meters per gram.
- BET Brunauer-Emmett-Teller
- BET specific surface area is determined by observing the physical adsorption of a gas on a surface of a solid and calculating the amount of adsorbate gas corresponding to a monomolecular layer on the surface using the Brunauer-Emmett-Teller (BET) adsorption isotherm equation as known to persons having ordinary skill in the art.
- BET Brunauer-Emmett-Teller
- the inorganic particles comprise an aluminum oxide, an aluminum hydroxide, and/or a colloidal silica
- they may be in amorphous or crystalline form.
- aluminum oxides and/or aluminum hydroxides that may be used in the liquid dispersed deposition layer 202 include, but are not limited to, amorphous aluminum oxide, alphaalumina, beta-alumina, gamma-alumina, gibbsite, bayerite, nordstrandite, boehmite, diaspore, or tohdite.
- liquid dispersed deposition layer 202 can be subjected to a drying step in order to evaporate the liquid such as, for example, by use of an air knife and/or elevated temperature drying as known to persons having ordinary skill in the art.
- elevated temperature drying may be conducted at a temperature of at least about 100°C, such as at least about 200°C, such as from about 100°C to about 500°C for a time of at least about 10 seconds, such as from about 10 seconds to about 20 minutes.
- Air knife drying may, for example, be conducted for a time of at least about 30 seconds, such as from about 30 seconds to about 30 minutes.
- FIG. 4 shows a side cutaway view of a glass sheet 62 with a deposition layer 204 deposited thereon.
- deposition layer 204 is deposited on second major surface 164 of glass sheet 62 making a substrate 62”.
- Deposition layer 204 can, for example, be deposited onto second major surface 164 of glass sheet 62 as a result of drying of liquid dispersed deposition layer 202 as described above.
- Deposition layer 204 can impart a surface roughness on the second major surface 206 of the substrate 62” ranging from about 0.4 nanometers to about 50 nanometers, such as from about 0.6 nanometers to about 20 nanometers, and further such as from about 0.8 nanometer to about 10 nanometers.
- the first major surface 162 of the substrate 62” may, for example, have a surface roughness of less than about 0.5 nanometers, such as less than about 0.25 nanometers, including from about 0.05 nanometers to about 0.5 nanometers, such as from about 0.1 nanometers to about 0.25 nanometers.
- the above-referenced surface roughness of second major surface 206 can at least in part be attributed to deposition layer 204 comprising inorganic particles.
- Such particles may, for example, comprise at least one of an aluminum oxide, an aluminum hydroxide, and/or a colloidal silica.
- such particles may, for example, comprise a Brunauer-Emmett- Teller (BET) specific surface area of at least about 100 square meters per gram, such as at least about 200 square meters per gram, and further such as at least about 300 square meters per gram, including from about 100 square meters per gram to about 500 square meters per gram, such as from about 200 square meters per gram to about 400 square meters per gram.
- BET Brunauer-Emmett- Teller
- the inorganic particles comprise an aluminum oxide, an aluminum hydroxide, and/or a colloidal silica
- they may be in amorphous or crystalline form.
- aluminum oxides and/or aluminum hydroxides that may be used in the deposition layer 204 include, but are not limited to, amorphous aluminum oxide, alpha-alumina, beta-alumina, gamma-alumina, gibbsite, bayerite, nordstrandite, boehmite, diaspore, or tohdite.
- substrate 62” may be subjected to a washing step subsequent to the drying step described above. Specifically, at least one of first major surface 162 or second major surface 206 of substrate 62” may be washed with a liquid washing solution comprising a solvent, such as water or an organic solvent, and at least one solute.
- the solute may comprise at least one detergent and/or surfactant.
- the solvent comprises water (e.g., deionized water) and the solute comprises an alkali detergent, such as a detergent comprising at least one of potassium hydroxide (KOH) or sodium hydroxide (NaOH), commercial examples of which include Semi Clean KG and PK-LCG225X.
- the solute may be present in the solution at a weight percent of at least about 0.1%, including at least about 1%, such as from about 0.1% to about 10%, and further such as from about 1% to about 5%.
- the washing solution may be applied for a time of at least about 10 seconds, such as from about 10 seconds to about 10 minutes, at a temperature of at least about 20°C, such as from about 20°C to about 80°C.
- the washing solution may be applied according to methods known to persons having ordinary skill in the art including, but not limited to, spraying, brushing, and dipping.
- substrate 62” may be subjected to a drying step subsequent to the washing step described above.
- substrate 62 may be dried by use of an air knife and/or elevated temperature drying as known to persons having ordinary skill in the art.
- elevated temperature drying may be conducted at a temperature of at least about 100°C, such as at least about 200°C, such as from about 100°C to about 500°C for a time of at least about 10 seconds, such as from about 10 seconds to about 20 minutes.
- Air knife drying may, for example, be conducted for a time of at least about 30 seconds, such as from about 30 seconds to about 30 minutes.
- substrate 62” may also be subjected to an etching step, such as an acid etching step.
- a solution comprising an acid etchant such as hydrofluoric acid (HF) may be applied to at least second major surface 206 of substrate 62” according to methods known to persons having ordinary skill in the art such as spraying, dipping, or brushing.
- the acid etchant may, for example, be present in the solution of concentrations ranging from about 0.1 wt% to about 10wt% and applied at temperatures ranging from about 20°C to about 60°C for a time ranging from about 10 seconds to about 10 minutes.
- Embodiments disclosed herein include those in which an etching step does not significantly affect the surface roughness of the second major surface 206 of substrate 62”.
- the second major surface 206 of the substrate 62 can have a surface roughness ranging from about 0.4 nanometers to about 50 nanometers, such as from about 0.6 nanometers to about 20 nanometers, and further such as from about 0.8 nanometer to about 10 nanometers.
- an absolute value of electrostatic charge (ESC) on the second major surface 206 of substrate 62” is less than about 200 volts (V), such as less than about 150 volts (V), and further such as less than 100 volts (V), and yet further such as less than about 50 volts (V), such as from about 0 volts (V) to about 200 volts (V), and further such as from about 1 volt (V) to about 150 volts (V), and yet further such as from about 2 volts (V) to about 100 volts (V), and still yet further such as from about 5 volts (V) to about 50 volts (V).
- a total light transmission per 0.5 millimeter of thickness between the first major surface 162 and the second major surface 206 of substrate 62” in wavelength range between about 400 nanometers and about 850 nanometers is at least about 90%, such as at least about 95%, including from about 90% to about 99%.
- Total light transmission as described herein, including the examples below, was determined by placing a 0.5 millimeter thick substrate sample in a Hitachi U-4000 Spectrophotometer to measure percent transmission (T%) in the wavelength range between about 400 and about 850 nanometers.
- Embodiments disclosed herein can include those in which deposition layer 204 is not sintered. Embodiments disclosed herein can further include those in which deposition layer 204 is not melted. In addition, embodiments disclosed herein can include those in which deposition layer 204 is not compressively stressed. Embodiments disclosed herein can also include those in which deposition layer 204 does not contain substantial amounts (e.g., more than lwt%) of glass, metal, and/or organic compounds (e.g., binders, etc.). Additionally, embodiments disclosed herein can include those in which no wet or dry etching step (such as a wet or dry acid etching step) is performed on the glass sheet 62 prior application of the deposition layer 204.
- no wet or dry etching step such as a wet or dry acid etching step
- a thickness of substrate 62” between the first major surface 162 and the second major surface 206 can be less than about 1 millimeter, such as less than about 0.5 millimeters, including between about 0.1 millimeters and about 1 millimeter, and further including between about 0.2 millimeters and about 0.5 millimeters.
- Embodiments disclosed herein may be used with a variety of glass compositions.
- compositions may, for example, include a glass composition, such as an alkali free glass composition, comprising 58-65 weight percent (wt%) SiCh, 14-20wt% AI2O3, 8-12wt% B2O3, l-3wt% MgO, 5-10wt% CaO, and 0.5-2wt% SrO.
- a glass composition such as an alkali free glass composition, comprising 58-65wt% SiCh, 16- 22wt% AI2O3, l-5wt% B2O3, l-4wt% MgO, 2-6wt% CaO, l-4wt% SrO, and 5-10wt% BaO.
- compositions may further include a glass composition, such as an alkali free glass composition, comprising 57-61wt% SiO2, 17-21wt% AI2O3, 5-8wt% B2O3, l-5wt% MgO, 3- 9wt% CaO, 0-6wt% SrO, and 0-7wt% BaO.
- a glass composition such as an alkali free glass composition, comprising 57-61wt% SiO2, 17-21wt% AI2O3, 5-8wt% B2O3, l-5wt% MgO, 3- 9wt% CaO, 0-6wt% SrO, and 0-7wt% BaO.
- compositions may additionally include a glass composition, such as an alkali containing glass composition, comprising 55-72wt% SiO 2 , 12-24wt% AI2O3, 10-18wt% Na 2 O, 0-10wt% B2O3, 0-5wt% K 2 O, 0-5wt% MgO, and 0- 5wt% CaO, which, in certain embodiments, may also include l-5wt% K2O and l-5wt% MgO.
- a glass composition such as an alkali containing glass composition, comprising 55-72wt% SiO 2 , 12-24wt% AI2O3, 10-18wt% Na 2 O, 0-10wt% B2O3, 0-5wt% K 2 O, 0-5wt% MgO, and 0- 5wt% CaO, which, in certain embodiments, may also include l-5wt% K2O and l-5wt% MgO.
- surface roughness refers to atomic force microscopy roughness (AFM Ra) analysis measured using a Hitachi High-Tech AFM5400L.
- AFM Ra atomic force microscopy roughness
- DFM Dynamic Force Mode
- Integral gain 0.2
- Proportional gain 0.05
- Z limit 500nm
- Scanning area lOum X lOum
- Image quality X -axis 256
- Y-axis 256
- the three lift pins, 408a, 408b, and 408c go down so that the second major surface of the substrate sample 62” contacts the table 404 and a vacuum 406 is turned on between the table 404 and substrate sample 62” for about 70 seconds.
- the vacuum 406 is turned off and the substrate sample 62” is raised by the three lift pins, 408a, 408b, and 408c, and monitored for about 30 seconds by a Hanwa electrostatic force microscometer (ESFM) 402 to determine the electrostatic charge (ESC) in volts (V).
- ESFM Hanwa electrostatic force microscometer
- the gap between the first major surface of the substrate sample 62” and the ESFM 402 is about 10 millimeters and the gap between the second major surface of the substrate sample 62” and the table 404 is about 30 millimeters.
- Amorphous aluminum oxide particles having a BET specific surface area of about 300 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 1,000 rpm. The surface was then dried at about 200°C for about 15 seconds. The resulting substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.4%. Surface roughness (AFM Ra) on the coated major surface was measured to be about 11.4 nanometers and the P-V value was measured to be about 209 nanometers.
- AFM Ra Surface roughness
- surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about +49 V.
- the substrate was then heated at about 590°C for about 30 minutes, after which measured ESC between the coated major surface and the lift testing apparatus was about -9 V.
- the substrate was dipped in an aqueous solution comprising about lwt% HF at about 23 °C for about 45 seconds after which measured ESC between the coated major surface and the lift testing apparatus was about +69V.
- Boehmite particles having a BET specific surface area of about 220 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 1,000 rpm. The surface was then dried at about 200°C for about 15 seconds. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 60 seconds, rinsed by deionized (DI) water at about 40°C for about 60 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.6%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 6.37 nanometers and the P-V value was measured to be about 166 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about -42 V. As a TFT process simulation, the substrate was then heated at about 590°C for about 30 minutes, after which measured ESC between the coated major surface and the lift testing apparatus was about -I V.
- the substrate was dipped in an aqueous solution comprising about lwt% HF at about 23 °C for about 45 seconds after which measured ESC between the coated major surface and the lift testing apparatus was about +114V.
- Boehmite particles having a BET specific surface area of about 220 m 2 /g were combined with water to create an aqueous dispersion of about 3 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 4,000 rpm. The surface was then dried at about 150°C for about 15 minutes. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 60 seconds, rinsed by deionized (DI) water at about 40°C for about 60 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.4%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 7.4 nanometers and the P-V value was measured to be about 99 nanometers.
- surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about -I V.
- Amorphous aluminum oxide particles having a BET specific surface area of about 300 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 2,000 rpm. The surface was then dried with an air knife at room temperature for about 10 minutes. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 90 seconds, rinsed by deionized (DI) water at about 40°C for about 90 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.3%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 11.0 nanometers and the P-V value was measured to be about 193 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about +52 V.
- Boehmite particles having a BET specific surface area of about 220 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 2,000 rpm. The surface was then dried with an air knife at room temperature for about 10 minutes. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 90 seconds, rinsed by deionized (DI) water at about 40°C for about 90 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.5%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 4.6 nanometers and the P-V value was measured to be about 166 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about +19 V.
- Amorphous aluminum oxide particles having a BET specific surface area of about 300 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a flow coater. The surface was then dried with an air knife at room temperature for about 10 minutes. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 90 seconds, rinsed by deionized (DI) water at about 40°C for about 90 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.4%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 15.9 nanometers and the P-V value was measured to be about 253 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about +106 V.
- Boehmite particles having a BET specific surface area of about 220 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a flow coater. The surface was then dried with an air knife at room temperature for about 10 minutes. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 90 seconds, rinsed by deionized (DI) water at about 40°C for about 90 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.3%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 8.1 nanometers and the P-V value was measured to be about 105 nanometers.
- surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about -26 V.
- Amorphous silicon oxide (colloidal silica) particles having a BET specific surface area of about 110 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 2,000 rpm. The surface was then dried with an air knife at room temperature for about 10 minutes. The resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 90 seconds, rinsed by deionized (DI) water at about 40°C for about 90 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.5%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 1.5 nanometers and the P-V value was measured to be about 74 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about -21 V.
- a 70:30 wt% ratio mixture of boehmite and Amorphous silicon oxide (colloidal silica) each having a BET specific surface area of about 220 m 2 /g were combined with water to create an aqueous dispersion of about 1 wt% solids and applied to a major surface of Corning LotusTM NXT glass having a thickness of about 0.5 millimeters via a spin coater rotating at about 2,000 rpm. The surface was then dried with an air knife at room temperature for about 10 minutes.
- the resulting substrate was then washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 90 seconds, rinsed by deionized (DI) water at about 40°C for about 90 seconds, and then dried in an oven at about 150°C for about 20 minutes.
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.7%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 13.6 nanometers and the P-V value was measured to be about 162 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers. Measured ESC between the coated major surface and the lift testing apparatus was about +73 V.
- Example 10 Example 10:
- Boehmite particles having a BET specific surface area of about 220 m 2 /g were combined with water to create an aqueous dispersion of about 0.2 wt% solids and applied to a major surface of Coming LotusTM NXT glass having a thickness of about 0.5 millimeters via a flow coater. After the aqueous dispersion was drained by sheet inclination for 20 seconds, the resulting substrate was then washed with an aqueous solution containing 4% Parker 225X detergent at about 50°C for about 10 minutes, rinsed by deionized (DI) water at about 40°C for about 10 minutes, and then dried in an oven at about 150°C for about 20 minutes.
- DI deionized
- the substrate exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.7%.
- Surface roughness (AFM Ra) on the coated major surface was measured to be about 0.50 nanometers and the P-V value was measured to be about 17 nanometers. In contrast, surface roughness on the uncoated opposing major surface was about 0.2 nanometers.
- Measured ESC between the coated major surface and the lift testing apparatus was about -94 V.
- Corning LotusTM NXT glass having a thickness of about 0.5 millimeters was washed with an aqueous solution containing 1% Parker 225X detergent at about 40°C for about 20 minutes, rinsed by deionized (DI) water at about 40°C for about 20 minutes, and then dried in an oven at about 150°C for about 20 minutes.
- the glass exhibited a total light transmission between its major surfaces in wavelength range between about 400 nanometers and about 850 nanometers of about 91.8%.
- Surface roughness (AFM Ra) on both major surfaces was measured to be about 0.2 nanometers and the P-V value was measured to be about 16 nanometers.
- Measured ESC between the glass major surface and the lift testing apparatus was about -350 V.
- Embodiments disclosed herein can result in substantial surface voltage reduction of glass substrates, which can, in turn, enable reduced gate damage to TFT devices deposited on the A-side surface of the glass substrate, reduction of particles and debris on the B-side surface of the glass substrate, increase in FPD device manufacturing yields, and increase in service life of glass substrate handling and/or conveyance equipment.
- Embodiments disclosed herein also include electronic devices comprising any of the substrates disclosed herein.
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Abstract
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020237017501A KR20230104183A (en) | 2020-11-06 | 2021-11-02 | Substrates with improved electrostatic performance |
JP2023527396A JP2023549138A (en) | 2020-11-06 | 2021-11-02 | Substrate with improved electrostatic performance |
CN202180084454.XA CN116615396A (en) | 2020-11-06 | 2021-11-02 | Substrate with improved electrostatic properties |
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US202063110548P | 2020-11-06 | 2020-11-06 | |
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JP (1) | JP2023549138A (en) |
KR (1) | KR20230104183A (en) |
CN (1) | CN116615396A (en) |
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WO (1) | WO2022098618A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017095987A1 (en) * | 2015-12-02 | 2017-06-08 | Guardian Industries Corporation | Glass article having coating with interpenetrating polymer network |
US20170253523A1 (en) * | 2013-11-08 | 2017-09-07 | Corning Incorporated | Wear-resistant liquid-based coatings for glass |
WO2017165369A1 (en) * | 2016-03-21 | 2017-09-28 | Corning Incorporated | Transparent substrates comprising three-dimensional porous conductive graphene films and methods for making the same |
US20180339938A1 (en) * | 2017-05-26 | 2018-11-29 | Corning Incorporated | Glass, glass-ceramic and ceramic articles with protective coatings having hardness and toughness |
WO2019239265A1 (en) * | 2018-06-08 | 2019-12-19 | Guardian Glass, LLC | Heat-treatable antimicrobial glass |
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2021
- 2021-11-02 CN CN202180084454.XA patent/CN116615396A/en active Pending
- 2021-11-02 JP JP2023527396A patent/JP2023549138A/en active Pending
- 2021-11-02 WO PCT/US2021/057661 patent/WO2022098618A1/en active Application Filing
- 2021-11-02 KR KR1020237017501A patent/KR20230104183A/en unknown
- 2021-11-04 TW TW110141090A patent/TW202235395A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170253523A1 (en) * | 2013-11-08 | 2017-09-07 | Corning Incorporated | Wear-resistant liquid-based coatings for glass |
WO2017095987A1 (en) * | 2015-12-02 | 2017-06-08 | Guardian Industries Corporation | Glass article having coating with interpenetrating polymer network |
WO2017165369A1 (en) * | 2016-03-21 | 2017-09-28 | Corning Incorporated | Transparent substrates comprising three-dimensional porous conductive graphene films and methods for making the same |
US20180339938A1 (en) * | 2017-05-26 | 2018-11-29 | Corning Incorporated | Glass, glass-ceramic and ceramic articles with protective coatings having hardness and toughness |
WO2019239265A1 (en) * | 2018-06-08 | 2019-12-19 | Guardian Glass, LLC | Heat-treatable antimicrobial glass |
Also Published As
Publication number | Publication date |
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JP2023549138A (en) | 2023-11-22 |
CN116615396A (en) | 2023-08-18 |
KR20230104183A (en) | 2023-07-07 |
TW202235395A (en) | 2022-09-16 |
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