WO2022082984A1 - Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage - Google Patents

Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage Download PDF

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Publication number
WO2022082984A1
WO2022082984A1 PCT/CN2020/137911 CN2020137911W WO2022082984A1 WO 2022082984 A1 WO2022082984 A1 WO 2022082984A1 CN 2020137911 W CN2020137911 W CN 2020137911W WO 2022082984 A1 WO2022082984 A1 WO 2022082984A1
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WO
WIPO (PCT)
Prior art keywords
light
emitting
substrate
layer
display panel
Prior art date
Application number
PCT/CN2020/137911
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English (en)
Chinese (zh)
Inventor
杜彦英
李金川
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2022082984A1 publication Critical patent/WO2022082984A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel, a manufacturing method thereof, and a display device.
  • AMOLED Active-Matrix
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • the hygroscopic agent will reduce the transmittance of the display screen after absorbing water, it will greatly affect the display quality of the display screen.
  • the present application provides a display panel, a method for manufacturing the same, and a display device to solve the technical problem that the transmittance of a display screen is reduced when a surface package containing a moisture absorbent is used.
  • the present application provides a display panel, which includes:
  • a substrate which is provided with a plurality of light-emitting regions and a non-light-emitting region disposed on the periphery of the light-emitting regions;
  • the plurality of light-emitting units are disposed on the substrate and located in the light-emitting area;
  • the first encapsulation structure is disposed on the light-emitting unit, the first encapsulation structure includes a plurality of colloids, and the colloids cover the light-emitting unit;
  • a second packaging structure the second packaging structure is disposed on the substrate, the second packaging structure includes an adsorption adhesive layer, and the adsorption adhesive layer is disposed between the colloids and located in the non-light-emitting area.
  • each of the light emitting units includes a first electrode, a pixel definition layer, a light emitting layer and a second electrode sequentially disposed on the substrate, and an opening is formed on the pixel definition layer.
  • the light-emitting layer is disposed in the opening, and the second electrode covers the light-emitting layer;
  • Each of the colloids covers the light-emitting layer in a one-to-one correspondence.
  • the orthographic projection of the light-emitting layer on the plane where the substrate is located is located within the orthographic projection of the colloid on the plane where the substrate is located.
  • the orthographic projection of the light-emitting layer on the plane where the substrate is located completely overlaps the orthographic projection of the colloid on the plane where the substrate is located.
  • the orthographic projection of the light-emitting unit on the plane where the substrate is located is located within the orthographic projection of the colloid on the plane where the substrate is located.
  • the adsorbent adhesive layer includes a light-transmitting adhesive layer and an adsorbent disposed inside the light-transmitting adhesive layer.
  • the material of the light-transmitting adhesive layer is UV-curable adhesive or heat-curable adhesive
  • the material of the adsorbent includes a desiccant
  • the display panel further includes an encapsulation layer, and the encapsulation layer is disposed on a side of the colloid and the adsorption adhesive layer close to the substrate, and covers the light-emitting unit.
  • the present application also provides a display device, which includes a display panel, and the display panel includes:
  • a substrate which is provided with a plurality of light-emitting regions and a non-light-emitting region disposed on the periphery of the light-emitting regions;
  • the plurality of light-emitting units are disposed on the substrate and located in the light-emitting area;
  • the first encapsulation structure is disposed on the light-emitting unit, the first encapsulation structure includes a plurality of colloids, and the colloids cover the light-emitting unit;
  • a second packaging structure the second packaging structure is disposed on the substrate, the second packaging structure includes an adsorption adhesive layer, and the adsorption adhesive layer is disposed between the colloids and located in the non-light-emitting area.
  • each of the light emitting units includes a first electrode, a pixel definition layer, a light emitting layer and a second electrode sequentially disposed on the substrate, and an opening is formed on the pixel definition layer.
  • the light-emitting layer is disposed in the opening, and the second electrode covers the light-emitting layer;
  • Each of the colloids covers the light-emitting layer in a one-to-one correspondence.
  • the orthographic projection of the light-emitting layer on the plane where the substrate is located is located within the orthographic projection of the colloid on the plane where the substrate is located.
  • the orthographic projection of the light-emitting layer on the plane where the substrate is located completely overlaps the orthographic projection of the colloid on the plane where the substrate is located.
  • the orthographic projection of the light-emitting unit on the plane where the substrate is located is located within the orthographic projection of the colloid on the plane where the substrate is located.
  • the adsorbent adhesive layer includes a light-transmitting adhesive layer and an adsorbent disposed inside the light-transmitting adhesive layer.
  • the material of the light-transmitting adhesive layer is UV-curable adhesive or heat-curable adhesive
  • the material of the adsorbent includes a desiccant
  • the display panel further includes an encapsulation layer, and the encapsulation layer is disposed on a side of the colloid and the adsorption adhesive layer close to the substrate, and covers the light-emitting unit.
  • the present application provides a method for preparing a display panel, which includes the following steps:
  • a substrate is provided on which a plurality of light-emitting regions and a non-light-emitting region are arranged on the periphery of the light-emitting regions;
  • the plurality of light-emitting units are disposed on the substrate and located in the light-emitting area;
  • a first encapsulation structure is formed on the light-emitting unit, the first encapsulation structure includes a plurality of colloids, and the colloids cover the light-emitting unit;
  • a second encapsulation structure is formed on the portion of the substrate located in the non-light-emitting area, and the second encapsulation structure includes an adsorption adhesive layer, and the adsorption adhesive layer is located between the colloids.
  • the step of forming the first encapsulation structure on the light-emitting unit includes:
  • the viscous liquid is cured to form a colloid correspondingly on each of the light-emitting units, and a plurality of the colloids form a first encapsulation structure.
  • the step of forming the second encapsulation structure on the part of the substrate located in the non-light-emitting area includes:
  • the viscous mixed solution comprising an adsorbent and a light-transmitting glue
  • a cover plate is attached on the viscous mixture and the colloid
  • the viscous mixed solution is cured, so that the light-transmitting glue forms a light-transmitting glue layer, and the light-transmitting glue layer and the adsorbent form an adsorption glue layer, so as to form a second packaging structure.
  • the method further includes:
  • An encapsulation layer is formed on the substrate, the encapsulation layer is disposed on the side of the colloid and the adsorption adhesive layer close to the substrate, and covers the light-emitting unit.
  • the display panel provided by the present application is provided with a first encapsulation structure and a second encapsulation structure.
  • the adsorption adhesive layer is arranged between the colloids and is located in the non-luminous area.
  • the adsorption glue layer is only arranged in the non-light-emitting area, and the light-emitting unit is individually packaged by setting the colloid in the light-emitting area.
  • the transmittance of the light-emitting area is improved, the transmittance of the entire display panel is improved, and the display quality of the display panel is improved.
  • FIG. 1 is a schematic plan view of a display panel according to an embodiment of the present application.
  • Fig. 2 is the sectional structure schematic diagram of AA' line in Fig. 1;
  • FIG. 3 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application
  • 4A to 4F are schematic structural diagrams obtained sequentially from steps S101 to S104 in the method for fabricating a display panel provided by an embodiment of the present application.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as “first”, “second” may expressly or implicitly include one or more of said features. In the description of the present application, “plurality” means two or more, unless otherwise expressly and specifically defined.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation.
  • a first feature "on” or “under” a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
  • FIG. 1 is a schematic plan view of a display panel provided by an embodiment of the application
  • FIG. 2 is a schematic cross-sectional structure view along the line AA' in FIG. 1.
  • An embodiment of the present application provides a display panel 100 , which includes a substrate 10 , a plurality of light emitting units 20 , a first packaging structure 30 , a second packaging structure 50 and a cover plate 40 .
  • the substrate 10 is provided with a plurality of light-emitting regions 10A and a non-light-emitting region 10B disposed on the periphery of the light-emitting regions 10A.
  • a plurality of light emitting units 20 are disposed on the substrate 10 and located in the light emitting area 10A.
  • the first packaging structure 30 is disposed on the light emitting unit 20 .
  • the first package structure 30 includes a plurality of gels 301 .
  • the gel 301 covers the light emitting unit 20 .
  • the second package structure 50 is disposed on the substrate 10 .
  • the second packaging structure 50 includes an adsorption glue layer 501 .
  • the adsorption glue layer 501 is disposed between the glues 301 and located in the non-light-emitting area 10B.
  • the cover plate 40 is disposed on one side of the first package structure 30 and the second package structure 50 away from the substrate 10 .
  • the display panel 100 provided by the embodiment of the present application is provided with a first encapsulation structure 30 and a second encapsulation structure 50.
  • the first encapsulation structure 30 includes a plurality of colloids 301, the colloids 301 cover the light-emitting unit 20, and the second encapsulation structure 50 includes adsorption
  • the adhesive layer 501, the adsorption adhesive layer 501 is disposed between the colloids 301 and located in the non-light-emitting area 10B.
  • the adsorption glue layer 501 is only disposed in the non-light-emitting area 10B, and the light-emitting unit 20 is individually packaged by disposing the colloid 301 in the light-emitting area 10A.
  • the light-emitting area 10A can be improved. Therefore, in this embodiment, by increasing the transmittance of the light-emitting region 10A, the transmittance of the entire display panel is improved, thereby improving the display quality of the display panel.
  • the adsorbate inside the adsorption adhesive layer can be adsorbed from the outside into the adsorption area.
  • the adsorbate such as water and oxygen inside the adhesive layer specifically, if the adsorbate inside the adsorbent layer and the adsorbate are physically adsorbed, if the adsorbate inhales the water entering the adhesive layer, the original transparent adhesive layer will be Discoloration occurs, which reduces the transmittance of the display panel at the discolored position; if the adsorbate inside the adhesive layer is chemically adsorbed with the adsorbate, such as the adsorbate chemically reacts with the particles entering the adhesive layer, it may be A new opaque substance is generated, which affects the transmittance of the display panel. Therefore, the transmittance of the display panel will be greatly reduced when the entire surface of the adsorption adhesive layer is used to package the display panel in an integrated manner.
  • the non-light-emitting area 10B is still encapsulated by the adsorption glue layer 501 , and an independent glue 301 is disposed in the light-emitting area 10A and covers the light-emitting unit 20 in the light-emitting area 10A.
  • the adsorption glue layer 501 can absorb impurities such as water and oxygen, and thus has a good water and oxygen barrier function
  • this embodiment can improve the display panel by improving the transmittance of the light emitting area 10A while meeting the packaging requirements of the display panel.
  • the overall transmittance improves the display quality of the display panel to meet the needs of users in terms of display brightness and color.
  • the base 10 may include a base substrate and an array substrate (not shown in the figure) arranged in sequence.
  • the base substrate may be a flexible substrate, a glass substrate or a flexible substrate.
  • the array substrate may include a buffer layer and a thin film transistor functional layer sequentially disposed on the base substrate.
  • the specific structure of the thin film transistor functional layer may refer to the prior art, which will not be repeated here.
  • Each light-emitting unit 20 includes a first electrode 201 , a pixel defining layer 202 , a light-emitting layer 203 and a second electrode 204 which are sequentially disposed on the substrate 10 .
  • An opening 202A is formed on the pixel defining layer 202 .
  • the light-emitting layer 203 is disposed in the opening 202A.
  • the second electrode 204 covers the light emitting layer 203 .
  • Each colloid 301 covers the light emitting layer 203 in a one-to-one correspondence.
  • the first electrode 201 is an anode
  • the second electrode 204 is a cathode
  • the first electrode 201 may also be a cathode
  • the second electrode 204 may be an anode
  • the light emitting unit 20 in the present application may further include film layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer (not shown in the figure), which will not be repeated here.
  • film layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer (not shown in the figure), which will not be repeated here.
  • the colloid 301 may partially cover the light-emitting layer 203 or completely cover the light-emitting layer 203.
  • the orthographic projection of the light-emitting layer 203 on the plane where the substrate 10 is located may be located in the orthographic projection of the colloid 301 on the plane where the substrate 10 is located, or, The orthographic projection of the light-emitting layer 203 on the plane of the substrate 10 completely overlaps the orthographic projection of the colloid 301 on the plane of the substrate 10 .
  • the orthographic projection of the light-emitting unit 20 on the plane where the substrate 10 is located is within the orthographic projection of the colloid 301 on the plane where the substrate 10 is located, that is, the colloid 301 completely covers the entire light-emitting unit 20 .
  • This arrangement can prevent the light emitting characteristics of the side surface of the light emitting unit 20 from being affected, and is beneficial to improve the uniformity of light emitting from the light emitting unit 20, thereby improving the display effect of the display panel.
  • the material of the colloid 301 can be UV curing glue, such as epoxy resin or acrylic resin, or can be heat curing glue, such as silicone resin or epoxy resin, and so on.
  • UV curing glue such as epoxy resin or acrylic resin
  • heat curing glue such as silicone resin or epoxy resin
  • the adsorbent adhesive layer 501 includes a light-transmitting adhesive layer 5011 and an adsorbent 5012 disposed inside the light-transmitting adhesive layer 5011 .
  • the material of the light-transmitting adhesive layer 5011 may be UV-curable adhesive, such as epoxy resin or acrylic resin, or heat-curable adhesive, such as silicone resin or epoxy resin, and so on.
  • UV-curable adhesive such as epoxy resin or acrylic resin
  • heat-curable adhesive such as silicone resin or epoxy resin
  • the materials of the colloid 301 and the light-transmitting adhesive layer 5011 may be the same or different.
  • the materials of the glue 301 and the light-transmitting glue layer 5011 are the same, so as to improve the bonding effect of the first packaging structure 30 and the second packaging structure 50, and avoid the phenomenon of glue layer peeling due to the difference of the two glue materials. .
  • the material of the adsorbent 5012 may include a desiccant, and the desiccant may include one or more of active alkali metal or alkaline earth metal oxide, silica gel or SAP (Super Absorbent Polymer, super absorbent resin);
  • the material of the agent 5012 may also include an oxygen absorbing agent, such as a material mainly based on an inorganic matrix, such as silver or iron-based oxygen absorbing agent, or a material mainly based on an organic matrix, and the like.
  • the specific material of the adsorbent 5012 can be selected according to the physicochemical properties of the adsorbate, so as to ensure a good adsorption effect of the adsorbent 5012 , thereby improving the packaging performance of the second packaging structure 50 .
  • the display panel 100 further includes an encapsulation layer 60 .
  • the encapsulation layer 60 is disposed on the side of the colloid 301 and the adsorption adhesive layer 501 close to the substrate 10 and covers the light emitting unit 20 .
  • the encapsulation layer 60 may be an organic layer or an inorganic layer, or may be a laminated structure formed by an organic layer and an inorganic layer.
  • the encapsulation layer 60 may include a first inorganic layer, an organic layer and a second inorganic layer arranged in sequence. layer, etc., the specific structure of the encapsulation layer 60 can be set according to actual application requirements, which is not limited in this application.
  • the colloid 301 and the adsorption adhesive layer 501 are used as the first protective barrier of the display panel.
  • the adsorption adhesive layer 501 can effectively adsorb water and oxygen, thereby blocking the external water oxygen in the adsorption adhesive layer 501 , thereby reducing the probability of water and oxygen passing through the adsorption adhesive layer 501 .
  • the encapsulation layer 60 is used as the second protective barrier of the display panel, which can further block the small amount of water and oxygen passing through the adsorption adhesive layer 501 . Therefore, through the above two protective barriers The combination of the display panel greatly improves the packaging effect of the display panel, which is beneficial to improve the service life of the display panel and enhance the market competitiveness of the product.
  • the display panel 100 provided by the embodiment of the present application is provided with a first encapsulation structure 30 and a second encapsulation structure 50.
  • the first encapsulation structure 30 includes a plurality of colloids 301, the colloids 301 cover the light-emitting unit 20, and the second encapsulation structure 50 includes adsorption
  • the adhesive layer 501, the adsorption adhesive layer 501 is disposed between the colloids 301 and located in the non-light-emitting area 10B.
  • the adsorption glue layer 501 is only disposed in the non-light-emitting area 10B, and the light-emitting unit 20 is individually packaged by disposing the colloid 301 in the light-emitting area 10A.
  • the light-emitting area 10A can be improved. Therefore, in this embodiment, by increasing the transmittance of the light-emitting region 10A, the transmittance of the entire display panel is improved, thereby improving the display quality of the display panel.
  • Embodiments of the present application further provide a display device, which includes a display panel.
  • a display panel For the structure of the display panel, reference may be made to the description of the display panel 100 in the foregoing embodiments, which will not be repeated here.
  • the display device may be a smart phone, a notebook computer, a tablet computer, a smart watch, etc., which is not limited in this application.
  • FIG. 3 is a schematic flowchart of a method for fabricating a display panel according to an embodiment of the present application.
  • An embodiment of the present application provides a method for manufacturing a display panel, which includes the following steps:
  • S101 Provide a substrate, on which a plurality of light-emitting regions and non-light-emitting regions are provided on the periphery of the light-emitting regions;
  • S102 forming a plurality of light-emitting units on the substrate, and the plurality of light-emitting units are disposed on the substrate and located in the light-emitting region;
  • S103 forming a first encapsulation structure on the light emitting unit, the first encapsulation structure includes a plurality of colloids, and the colloid covers the light emitting unit;
  • S104 forming a second encapsulation structure on a portion of the substrate located in the non-light emitting area, the second encapsulation structure includes an adsorption adhesive layer, and the adsorption adhesive layer is located between the colloids.
  • a first encapsulation structure is formed on the light emitting unit in the light emitting area, and the first encapsulation structure includes a plurality of colloids, the colloid covers the light emitting unit, and the substrate is located in the non-light emitting area.
  • a second encapsulation structure is formed on the part of the colloid, and the second encapsulation structure includes an adsorption adhesive layer, and the adsorption adhesive layer is located between the colloids.
  • FIGS. 4A to 4F are schematic structural diagrams obtained sequentially from steps S101 to S104 in the method for fabricating a display panel provided by an embodiment of the present application.
  • S101 Provide a substrate 10.
  • the substrate 10 is provided with a plurality of light-emitting regions 10A and a non-light-emitting region 10B disposed on the periphery of the light-emitting regions 10A, as shown in FIG. 4A .
  • the base 10 may include a base substrate and an array substrate (not shown in the figure) arranged in sequence.
  • the base substrate may be a flexible substrate, a glass substrate or a flexible substrate.
  • the array substrate may include a buffer layer and a thin film transistor functional layer sequentially disposed on the base substrate.
  • the specific structure of the thin film transistor functional layer may refer to the prior art, which will not be repeated here. Then it goes to step S102.
  • S102 forming a plurality of light emitting units 20 on the substrate 10 .
  • a plurality of light emitting units 20 are disposed on the substrate 10 and located in the light emitting area 10A, as shown in FIG. 4B .
  • the light-emitting unit 20 includes a first electrode 201 , a pixel defining layer 202 , a light-emitting layer 203 and a second electrode 204 which are sequentially disposed on the substrate 10 .
  • An opening 202A is formed on the pixel defining layer 202 .
  • the light-emitting layer 203 is disposed in the opening 202A.
  • the second electrode 204 covers the light emitting layer 203 .
  • the first electrode 201 is an anode
  • the second electrode 204 is a cathode
  • the first electrode 201 may also be a cathode
  • the second electrode 204 may be an anode
  • the light emitting unit 20 in the present application may further include film layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer (not shown in the figure), which will not be repeated here.
  • film layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer (not shown in the figure), which will not be repeated here.
  • the method further includes a step of: forming an encapsulation layer 60 on the substrate 10 .
  • the encapsulation layer 60 covers the light emitting unit 20, as shown in FIG. 4C.
  • the encapsulation layer 60 may be an organic layer or an inorganic layer, or may be a laminated structure formed by an organic layer and an inorganic layer.
  • the encapsulation layer 60 may include a first inorganic layer, an organic layer and a second layer arranged in sequence. Inorganic layers, etc., the specific structure of the encapsulation layer 60 can be set according to actual application requirements, which is not limited in this application. Then it goes to step S103.
  • the first package structure 30 includes a plurality of colloids 301, and the colloids 301 cover the light-emitting unit 20, as shown in FIG. 4D .
  • step S103 specifically includes the following steps:
  • Step S1031 forming viscous liquid on each light-emitting unit 20;
  • Step S1032 curing the viscous liquid to correspondingly form a colloid 301 on each light-emitting unit 20 , and a plurality of colloids 301 form the first packaging structure 30 .
  • step S1031 specifically, an inkjet printing, coating or spraying process may be used to form a viscous liquid on each light-emitting unit 20 correspondingly, and the viscous liquid may be correspondingly covered on the light-emitting unit 20 .
  • the material of the viscous liquid can be UV-curable adhesive, such as epoxy resin or acrylic resin, or heat-curable adhesive, such as silicone resin or epoxy resin, and so on.
  • step S1032 according to the material type of the viscous liquid, such as UV glue or thermal curing glue, it can be cured by a corresponding ultraviolet curing or thermal curing method, so that the viscous liquid forms the colloid 301 on the corresponding light-emitting unit 20 .
  • the orthographic projection of the light-emitting unit 20 on the plane where the substrate 10 is located is located within the orthographic projection of the colloid 301 on the plane where the substrate 10 is located. Then it goes to step S104.
  • S104 forming a second encapsulation structure 50 on the portion of the substrate 10 located in the non-light-emitting region 10B, the second encapsulation structure 50 includes an adsorption adhesive layer 501 , and the adsorption adhesive layer 501 is located between the colloids 301 .
  • step S104 specifically includes the following steps:
  • Step S1041 coating or spraying a viscous mixed solution on the portion of the substrate 10 located in the non-light-emitting area 10B, the viscous mixed solution including the adsorbent 5012 and the light-transmitting glue, as shown in FIG. 4E ;
  • Step S1042 attaching a cover plate 40 on the viscous mixture and the colloid 301;
  • Step S1043 curing the viscous mixed solution so that the light-transmitting glue forms a light-transmitting glue layer 5011 , and the light-transmitting glue layer 5011 and the adsorbent 5012 form an adsorption glue layer 501 to form the second packaging structure 50 , as shown in FIG. 4F .
  • step S1041 a process such as screen printing, inkjet printing, slit coating or spraying can be used to form a viscous mixed solution, and the fluidity of the viscous mixed solution is used to fill the viscous mixed solution between the plurality of colloids 301. space, until the side of the viscous liquid mixture away from the substrate 10 is flush with the colloid 301 .
  • the material of the light-transmitting adhesive can be UV-curable adhesive, such as epoxy resin or acrylic resin, or heat-curable adhesive, such as silicone resin or epoxy resin, and so on.
  • the material of the adsorbent 5012 can include a desiccant, and the desiccant can include one or more of active alkali metal or alkaline earth metal oxide, silica gel or SAP; or, the material of the adsorbent 5012 can also include an oxygen absorbing agent, For example, it can include materials with inorganic matrix as the main body, such as silver or iron-based oxygen absorbing agents, and can also include materials with organic matrix as the main body, and so on.
  • the specific material of the adsorbent 5012 can be selected according to the physicochemical properties of the adsorbate, so as to ensure a good adsorption effect of the adsorbent 5012 .
  • a cover plate 40 is attached to the viscous mixture and the colloid 301 .
  • the cover plate 40 may be a glass cover plate, such as ultra-thin glass.
  • step S1043 according to the material type of the light-transmitting glue in the viscous mixed solution, if UV glue or heat-curing glue is selected, the viscous mixed solution can be cured by a corresponding ultraviolet curing or heat-curing method, so that the The light-transmitting glue forms a light-transmitting glue layer 5011 .
  • the adsorbent 5012 is located inside the light-transmitting adhesive layer 5011 , and the light-transmitting adhesive layer 5011 and the adsorbent 5012 form the adsorbing adhesive layer 501 , thereby realizing fixed bonding with the cover plate 40 .
  • the display panel provided by the present application is provided with a first encapsulation structure and a second encapsulation structure.
  • the adsorption adhesive layer is arranged between the colloids and is located in the non-luminous area.
  • the adsorption adhesive layer is only provided in the non-light-emitting area, and the light-emitting unit is individually packaged by setting the colloid in the light-emitting area. Since the setting of the colloid can improve the transmittance of the light-emitting area, this application adopts The transmittance of the light emitting area is improved, the transmittance of the entire display panel is improved, and the display quality of the display panel is improved.

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  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un panneau d'affichage (100) et son procédé de fabrication, et un dispositif d'affichage. Le panneau d'affichage (100) comprend : un substrat (10), une pluralité de régions électroluminescentes (10A) et une région non électroluminescente (10B) disposées sur les périphéries des régions électroluminescentes (10A) étant disposées sur le substrat (10) ; une pluralité d'unités électroluminescentes (20), disposées sur le substrat (10) et situées dans les régions électroluminescentes (10A) ; une première structure d'encapsulation (30), disposée sur les unités électroluminescentes (20), la première structure d'encapsulation (30) comprenant une pluralité de colloïdes (301), et les colloïdes (301) recouvrant les unités électroluminescentes (20) ; et une seconde structure d'encapsulation (50), disposée sur le substrat (10), la seconde structure d'encapsulation (50) comprenant une couche adhésive absorbante (501), et la couche adhésive absorbante (501) étant disposée entre les colloïdes (301) et située dans la région non électroluminescente (10B), ce qui permet d'améliorer la transmittance globale du panneau d'affichage (100).
PCT/CN2020/137911 2020-10-23 2020-12-21 Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage WO2022082984A1 (fr)

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CN202011148348.7A CN112310311A (zh) 2020-10-23 2020-10-23 显示面板及其制备方法、显示装置
CN202011148348.7 2020-10-23

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