WO2020151048A1 - Panneau électroluminescent, son procédé de préparation et dispositif d'affichage - Google Patents

Panneau électroluminescent, son procédé de préparation et dispositif d'affichage Download PDF

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Publication number
WO2020151048A1
WO2020151048A1 PCT/CN2019/076686 CN2019076686W WO2020151048A1 WO 2020151048 A1 WO2020151048 A1 WO 2020151048A1 CN 2019076686 W CN2019076686 W CN 2019076686W WO 2020151048 A1 WO2020151048 A1 WO 2020151048A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
light
layer
water
emitting panel
Prior art date
Application number
PCT/CN2019/076686
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English (en)
Chinese (zh)
Inventor
杨中国
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2020151048A1 publication Critical patent/WO2020151048A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details

Definitions

  • This application relates to the field of display technology, in particular to a light-emitting panel, a method for manufacturing the light-emitting panel, and a display device.
  • OLED Organic Light Emitting Diode
  • the packaging material is mainly composed of a barrier film and a surface-attached packaging adhesive.
  • the surface-laminated encapsulant material used for bottom light emission contains metal oxide particles as a water-absorbing desiccant. Due to its large particle size, the plastic material has a low transmittance.
  • the embodiments of the present application provide a light-emitting panel, a method for manufacturing the light-emitting panel, and a display device, which can improve the light transmittance of the light-emitting panel.
  • an embodiment of the present application provides a light emitting panel, including:
  • the light-emitting substrate, the first adhesive layer, the second adhesive layer and the cover plate are stacked in sequence from bottom to top; wherein,
  • a water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, and the water-absorbing layer has a closed structure.
  • the outer edge of the water-absorbing layer and the outer edge of the first adhesive layer are in the same cross-section.
  • the horizontal length of the orthographic projection of the water-absorbing layer on the first adhesive layer is smaller than the horizontal width of the first adhesive layer.
  • the water-absorbing layer is doped with desiccant particles, and the desiccant particles are composed of metal oxide.
  • the first adhesive layer, the second adhesive layer, and the water-absorbing layer are made of hyposensitive adhesive material or heat-sensitive adhesive material.
  • the vertical thickness of the water-absorbing layer is less than half of the sum of the vertical thickness of the first adhesive layer and the second adhesive layer.
  • an embodiment of the present application also provides a method for manufacturing a light-emitting panel, including:
  • a second adhesive layer, a water-absorbing layer, and a first adhesive layer are sequentially formed on the cover plate, and the water-absorbing layer is a closed structure;
  • the light-emitting substrate is attached to the second adhesive layer relative to the cover plate.
  • the step of sequentially forming a second adhesive layer, a water-absorbing layer, and a first adhesive layer on the cover plate includes:
  • the encapsulation adhesive material includes a first cover plate, a first adhesive layer, a water absorption layer, a second adhesive layer, and a second cover plate;
  • the second release film is removed, and the light-emitting substrate is attached to the first adhesive layer relative to the cover plate.
  • the steps of removing the second release film and attaching the light emitting substrate to the cover plate on the first adhesive layer include :
  • An inorganic water blocking layer is formed on the light-emitting substrate, so that the inorganic water blocking layer and the first adhesive layer are bonded together.
  • an embodiment of the present application further provides a display device, including: a housing and a light-emitting panel, the light-emitting panel is disposed on the housing, and the light-emitting panel includes:
  • the light-emitting substrate, the first adhesive layer, the second adhesive layer and the cover plate are stacked in sequence from bottom to top; wherein,
  • a water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, the water-absorbing layer is a closed structure, the water-absorbing layer is doped with desiccant particles, and the desiccant particles are made of metal It is composed of oxides, and the particle size of the desiccant particles is less than 6 microns.
  • the outer edge of the water-absorbing layer and the outer edge of the first adhesive layer are in the same cross-section.
  • the horizontal length of the orthographic projection of the water-absorbing layer on the first adhesive layer is smaller than the horizontal width of the first adhesive layer.
  • the first adhesive layer, the second adhesive layer, and the water-absorbing layer are made of a hyposensitive adhesive material or a heat-sensitive adhesive material.
  • the vertical thickness of the water-absorbing layer is less than half of the sum of the vertical thickness of the first adhesive layer and the second adhesive layer.
  • the light-emitting panel provided by the embodiment of the present application includes a light-emitting substrate, a first adhesive layer, a second adhesive layer, and a cover plate that are stacked in sequence from bottom to top; wherein, the first adhesive layer and the second adhesive layer A water-absorbing layer is arranged between the adhesive layers, and the water-absorbing layer is a closed structure, and the light transmittance of the light-emitting panel is improved by setting the water-absorbing layer in a closed structure.
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a second structure of a light-emitting panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a third structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a fourth structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a fifth structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 7 is a flowchart of a method for manufacturing a light-emitting panel provided by an embodiment of the application.
  • the main packaging methods for top-emitting large-size organic light emitting diode (Organic Light Emitting Diode, OLED) TVs mainly include Face Seal (surface mount packaging) and Dam (frame glue)/Getter (moisture absorbent)/Fill( Filling glue) package.
  • Face Seal surface mount packaging
  • Dam frame glue
  • Getter moisture absorbent
  • Fill( Filling glue) package mainly include Face Seal encapsulant for bottom light.
  • the first layer is a water-absorbing layer, which contains metal oxide particles as a water-absorbing desiccant, and its particle size is 1 to 6 microns
  • the second layer is a buffer layer, which is mainly used for bonding the substrate, absorbing impact and protecting the OLED light-emitting layer.
  • the existing Face Seal encapsulant materials cannot be used in top-emitting OLEDs, because the water-absorbing layer contains desiccant particles, and the transmittance is less than 5%, which cannot meet the top-emitting requirements for a transmittance greater than 98%.
  • the current solution is to replace the micron-sized desiccant particles with nano-sized desiccant particles, or replace the opaque desiccant particles with light-transmitting desiccant particles, although the transmittance of these two methods can be satisfied Requirement, but the package life cannot reach the mass production level during packaging.
  • An embodiment of the application provides a display device, which includes a housing and a light-emitting panel, the light-emitting panel is disposed on the housing, and the light-emitting panel includes:
  • the light-emitting substrate, the first adhesive layer, the second adhesive layer and the cover plate are stacked in sequence from bottom to top; wherein,
  • a water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, the water-absorbing layer is a closed structure, the water-absorbing layer is doped with desiccant particles, and the desiccant particles are made of metal It is composed of oxides, and the particle size of the desiccant particles is less than 6 microns.
  • the outer edge of the water-absorbing layer and the outer edge of the first adhesive layer are in the same cross-section.
  • the horizontal length of the orthographic projection of the water-absorbing layer on the first adhesive layer is smaller than the horizontal width of the first adhesive layer.
  • the first adhesive layer, the second adhesive layer, and the water-absorbing layer are made of hyposensitive adhesive material or heat-sensitive adhesive material.
  • the vertical thickness of the water-absorbing layer is less than half of the sum of the vertical thickness of the first adhesive layer and the second adhesive layer.
  • FIG. 1 is a schematic structural diagram of a display device 1000 according to an embodiment of the application.
  • the display device 100 may include a light emitting panel 100, a control circuit 200, and a housing 300. It should be noted that the display device 1000 shown in FIG. 1 is not limited to the above content, and may also include other devices, such as a camera, an antenna structure, a pattern unlocking module, and the like.
  • the light-emitting panel 100 is disposed on the housing 200.
  • the light-emitting panel 100 may be fixed to the housing 200, and the light-emitting panel 100 and the housing 300 form a closed space to accommodate devices such as the control circuit 200.
  • the housing 300 may be made of a flexible material, such as a plastic housing or a silicone housing.
  • control circuit 200 is installed in the housing 300, the control circuit 200 may be the main board of the display device 1000, and the control circuit 200 may be integrated with a battery, an antenna structure, a microphone, a speaker, a headset interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
  • the light-emitting panel 100 is installed in the housing 300, and at the same time, the light-emitting panel 100 is electrically connected to the control circuit 200 to form the display surface of the display device 1000.
  • the light emitting panel 100 may include a display area and a non-display area.
  • the display area can be used to display the screen of the display device 1000 or for the user to perform touch manipulation.
  • This non-display area can be used to set various functional components.
  • FIG. 2 is a schematic diagram of a first structure of a light-emitting panel provided by an embodiment of the application.
  • the light-emitting panel 100 includes: a light-emitting substrate 10, a first adhesive layer 20, and a second adhesive layered in order from bottom to top. Connecting layer 30 and cover plate 40; among them,
  • a water-absorbing layer 50 is provided between the first adhesive layer 20 and the second adhesive layer 30, and the water-absorbing layer 50 has a closed structure.
  • the effective encapsulation area AA is outside the light-emitting area of the light-emitting substrate 10, so only the desiccant on the outside can absorb water, and the desiccant on the light-emitting area is not It plays a role of absorbing water. Therefore, a circle of water absorbing layer 50 can be smeared on the first adhesive layer 20.
  • the water absorbing layer 50 is arranged corresponding to the effective area AA of the package, so that the water absorbing layer 50 forms a closed structure with a hollow in the middle.
  • the light-emitting panel 100 provided by the embodiment of the present application includes a light-emitting substrate 10, a first adhesive layer 20, a second adhesive layer 30, and a cover plate 40 that are sequentially stacked from bottom to top; wherein, the first adhesive layer A water absorbing layer 50 is provided between the second adhesive layer 30 and 20.
  • the water absorbing layer 50 is a closed structure.
  • the light transmittance of the light emitting panel 100 is improved by setting the water absorbing layer 50 in a closed structure.
  • an inorganic water blocking layer 60 is further provided between the light-emitting substrate 10 and the first adhesive layer 20.
  • a color film 70 is also provided between the cover plate 40 and the second adhesive layer 30.
  • FIG. 3 is a schematic diagram of the second structure of the light-emitting panel provided by the embodiment of the application. Among them, FIG. 3 is a top view of the light emitting panel 100 shown in FIG. 2. The horizontal length of the orthographic projection of the water-absorbing layer 50 on the first adhesive layer 20 is smaller than the horizontal width of the first adhesive layer 20.
  • the water-absorbing layer 50 may be disposed inside the first adhesive layer 20 so that at least a part of the outside of the first adhesive layer 20 is exposed.
  • the inner side here refers to the side close to the central axis of the light-emitting panel 100, and the outer side refers to the side far away from the central axis of the light-emitting panel 100.
  • FIG. 4 is a schematic diagram of a third structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a fourth structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 5 is a top view of the light-emitting panel 100 in FIG. 4. The outer edge of the water-absorbing layer 50 and the outer edge of the first adhesive layer 20 are in the same cross-section.
  • the water-absorbing layer 50 may be disposed on the peripheral area of the first adhesive layer 20 to cover the peripheral area of the first adhesive layer 20.
  • the water absorption layer 50 is doped with desiccant particles, and the desiccant particles are composed of metal oxide.
  • first adhesive layer 20 and the second adhesive layer 30 are uniformly dispersed with nano-scale desiccant particles (such as nano molecular sieve) or transparent desiccant particles.
  • nano-scale desiccant particles such as nano molecular sieve
  • transparent desiccant particles such as nano molecular sieve
  • the micron-level desiccant particles can be replaced with nano-level desiccant particles, or the opaque desiccant particles can be replaced It is a light-transmitting desiccant particle, which further improves the packaging effect while ensuring the transmittance.
  • the composition of the desiccant is a metal oxide, such as calcium oxide (CaO) or barium oxide (BaO), etc.
  • the particle size of the desiccant particles is less than 6 microns, which can prevent water vapor from entering the OLED from the side, thereby satisfying The requirements for the package life during packaging.
  • the average transmittance of the first adhesive layer 20 and the second adhesive layer 30 in the full wavelength range (380 ⁇ 780 nm) is greater than 98%, which meets the transmittance requirements of the top luminescence .
  • the first adhesive layer 20, the second adhesive layer 30, and the water-absorbing layer 50 are hyposensitive adhesives or heat-sensitive adhesives.
  • the vertical thickness of the water-absorbing layer 50 is less than half of the sum of the vertical thicknesses of the first adhesive layer 20 and the second adhesive layer 30.
  • the vertical thickness of the first adhesive layer 20 and the second adhesive layer 30 is 10-50 microns
  • the vertical thickness of the water-absorbing layer 50 is 10-50 microns.
  • FIG. 6 is a schematic diagram of the fifth structure of the light emitting panel provided by the embodiments of the application.
  • FIG. 6 is a specific structure diagram of the light-emitting substrate 10 in FIG. 2.
  • the light-emitting substrate 10 includes a base 101 and an OLED device 102 partially covering the base 101.
  • the light-emitting panel 100 provided by the embodiment of the present application includes a light-emitting substrate 10, a first adhesive layer 20, a second adhesive layer 30, and a cover plate 40 that are sequentially stacked from bottom to top; wherein, the first adhesive layer A water absorbing layer 50 is provided between the second adhesive layer 30 and 20.
  • the water absorbing layer 50 is a closed structure.
  • the light transmittance of the light emitting panel 100 is improved by setting the water absorbing layer 50 in a closed structure.
  • FIG. 7 is a flowchart of a method for manufacturing a light-emitting panel provided by an embodiment of the application.
  • the method for manufacturing the light-emitting panel includes:
  • a color film may be formed on the cover plate.
  • a second adhesive layer, a water-absorbing layer, and a first adhesive layer are sequentially formed on the cover plate, and the water-absorbing layer has a closed structure;
  • the color film can be attached to the second adhesive layer.
  • the step of sequentially forming a second adhesive layer, a water-absorbing layer, and a first adhesive layer on the cover plate includes:
  • the encapsulation adhesive material includes a first release film layer, a first adhesive layer, a water absorption layer, a second adhesive layer, and a second release film layer;
  • the second release film is removed, and the light-emitting substrate is attached to the first adhesive layer relative to the cover plate.
  • a circle of water-absorbing layer is coated on the first adhesive layer, where the outer edge of the water-absorbing layer formed by coating is flush with or inside the outer edge of the adhesive layer.
  • the specific coating position of the water-absorbing layer here depends on the effective area of the package during packaging.
  • the step of removing the second release film and attaching the light-emitting substrate to the first adhesive layer relative to the cover plate further includes:
  • An inorganic water blocking layer is formed on the light-emitting substrate, so that the inorganic water blocking layer and the first adhesive layer are bonded together.
  • the operation of attaching the light-emitting substrate to the first adhesive layer is performed in a vacuum environment.
  • first adhesive layer and the second adhesive layer are cured by hot pressing or heating to complete the package.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un panneau électroluminescent (100), un procédé de préparation du panneau électroluminescent (100), et un dispositif d'affichage (1000), le panneau électroluminescent (100) comprenant un substrat électroluminescent (10), une première couche de liaison (20), une seconde couche de liaison (30) et une plaque de couvercle (40), qui sont empilés séquentiellement de bas en haut ; une couche d'adsorption d'eau (50) étant disposée entre la première couche de liaison (20) et la seconde couche de liaison (30), la couche d'adsorption d'eau (50) étant d'une structure fermée. L'agencement de la couche d'adsorption d'eau (50) en tant que structure fermée améliore la transmittance de lumière du panneau électroluminescent (100).
PCT/CN2019/076686 2019-01-25 2019-03-01 Panneau électroluminescent, son procédé de préparation et dispositif d'affichage WO2020151048A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910073094.8 2019-01-25
CN201910073094.8A CN109888121A (zh) 2019-01-25 2019-01-25 发光面板、发光面板的制备方法及显示装置

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WO2020151048A1 true WO2020151048A1 (fr) 2020-07-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116102987A (zh) * 2023-04-13 2023-05-12 合肥华晟光伏科技有限公司 太阳能电池组件封装胶膜及其制备方法、太阳能电池组件

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109860417A (zh) * 2019-01-28 2019-06-07 深圳市华星光电半导体显示技术有限公司 发光面板、发光面板的制备方法及显示装置
CN110176549A (zh) * 2019-06-18 2019-08-27 深圳市华星光电半导体显示技术有限公司 封装结构、显示装置及封装方法
CN110993813A (zh) * 2019-11-14 2020-04-10 深圳市华星光电半导体显示技术有限公司 Oled显示面板及其制备方法
CN112310311A (zh) * 2020-10-23 2021-02-02 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置
CN112802977A (zh) * 2021-01-07 2021-05-14 深圳市华星光电半导体显示技术有限公司 封装薄膜及其制备方法、柔性显示面板的封装方法
CN112864337A (zh) * 2021-01-12 2021-05-28 深圳市华星光电半导体显示技术有限公司 柔性显示面板及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
CN104037337A (zh) * 2014-06-09 2014-09-10 京东方科技集团股份有限公司 有机电致发光显示面板及其封装方法、显示装置
CN104505470A (zh) * 2015-01-04 2015-04-08 京东方科技集团股份有限公司 显示面板及其制作方法以及显示装置
CN105206759A (zh) * 2014-06-11 2015-12-30 群创光电股份有限公司 显示装置
CN107180922A (zh) * 2017-06-20 2017-09-19 合肥市惠科精密模具有限公司 一种高防水性amoled封装结构
CN107245305A (zh) * 2017-07-20 2017-10-13 武汉华星光电半导体显示技术有限公司 复合型光学胶的制备方法、复合型光学胶以及显示面板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325953B (zh) * 2012-03-19 2016-02-10 瀚宇彩晶股份有限公司 有机发光二极管封装及其封装方法
CN107170902B (zh) * 2017-05-26 2019-04-02 深圳市华星光电半导体显示技术有限公司 封装薄膜及其制作方法与oled面板的封装方法
CN107833977B (zh) * 2017-08-23 2019-08-09 江苏集萃有机光电技术研究所有限公司 一种有机发光显示器件及其制备方法
CN109755408B (zh) * 2018-12-26 2021-01-15 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制作方法、显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
CN104037337A (zh) * 2014-06-09 2014-09-10 京东方科技集团股份有限公司 有机电致发光显示面板及其封装方法、显示装置
CN105206759A (zh) * 2014-06-11 2015-12-30 群创光电股份有限公司 显示装置
CN104505470A (zh) * 2015-01-04 2015-04-08 京东方科技集团股份有限公司 显示面板及其制作方法以及显示装置
CN107180922A (zh) * 2017-06-20 2017-09-19 合肥市惠科精密模具有限公司 一种高防水性amoled封装结构
CN107245305A (zh) * 2017-07-20 2017-10-13 武汉华星光电半导体显示技术有限公司 复合型光学胶的制备方法、复合型光学胶以及显示面板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116102987A (zh) * 2023-04-13 2023-05-12 合肥华晟光伏科技有限公司 太阳能电池组件封装胶膜及其制备方法、太阳能电池组件
CN116102987B (zh) * 2023-04-13 2023-07-14 合肥华晟光伏科技有限公司 太阳能电池组件封装胶膜及其制备方法、太阳能电池组件

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