WO2022077150A1 - 磁性复合材料及其制备方法、电感及其制备方法 - Google Patents
磁性复合材料及其制备方法、电感及其制备方法 Download PDFInfo
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- WO2022077150A1 WO2022077150A1 PCT/CN2020/120331 CN2020120331W WO2022077150A1 WO 2022077150 A1 WO2022077150 A1 WO 2022077150A1 CN 2020120331 W CN2020120331 W CN 2020120331W WO 2022077150 A1 WO2022077150 A1 WO 2022077150A1
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- 239000002131 composite material Substances 0.000 title claims abstract description 131
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000007769 metal material Substances 0.000 claims abstract description 87
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 57
- 239000002245 particle Substances 0.000 claims description 39
- 239000000843 powder Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 27
- 239000011230 binding agent Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 16
- 239000006247 magnetic powder Substances 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 8
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910002651 NO3 Inorganic materials 0.000 claims description 6
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical class [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 6
- 229910019142 PO4 Inorganic materials 0.000 claims description 6
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 6
- 239000010452 phosphate Substances 0.000 claims description 6
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 5
- 150000004645 aluminates Chemical class 0.000 claims description 5
- 239000004643 cyanate ester Substances 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical class [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000003595 mist Substances 0.000 claims description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 28
- 230000008569 process Effects 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910000519 Ferrosilicon Inorganic materials 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000012745 toughening agent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
Definitions
- the present application relates to the technical field of semiconductors, and more particularly to a magnetic composite material and a preparation method thereof, an inductor and a preparation method thereof.
- inductors are widely used in various intelligent hardware systems, such as smart phones, smart TVs, smart home appliances, tablet computers, notebook computers, various communication terminals and servers, etc. Its main function is electromagnetic signals. and energy conversion, storage and filtering.
- a traditional inductor includes a coil and a magnetic body covering the coil.
- the manufacturing process is generally that the coil is placed in a mold, and the empty space inside and around the coil is filled with metal soft magnetic powder and pressed into shape.
- the pressing pressure is often large, which can reach 500MPa, 600MPa, 800MPa, or even higher.
- such a high pressing pressure often damages the metal soft magnetic powder and the internal coil structure, resulting in problems such as overall deformation of the coil structure, which in turn causes problems such as attenuation of the initial voltage withstand capability of the coil, short-circuiting of the inductance, etc., reducing the reliability of the inductance.
- a magnetic composite material and a preparation method thereof, an inductor and a preparation method thereof are provided.
- a magnetic composite material comprising a soft magnetic metal material and a binder, wherein the soft magnetic metal material and the binder are mixed in a preset ratio, the soft magnetic metal material
- the relative density of the material is greater than or equal to 0.5, and the relative density is represented by the following formula:
- ⁇ ' is the relative density of the soft magnetic metal material
- ⁇ bt is the tap density of the soft magnetic metal material
- ⁇ is the true density of the soft magnetic metal material
- the weight percentage of the soft magnetic metal material in the magnetic composite material is greater than or equal to 92% and less than or equal to 97%, and the weight percentage of the adhesive in the magnetic composite material The weight percentage is greater than or equal to 3% and less than or equal to 8%.
- the soft magnetic metal material includes a mixture of several materials with different particle sizes, and the ratio of the largest particle size to the smallest particle size among the particle sizes of the several materials is less than or equal to 8.
- the soft magnetic metal material includes carbonyl iron powder, reduced iron powder, atomized iron powder, atomized Fe (100-xy) SixCry powder, atomized iron-based amorphous soft magnetic powder , A mixture of atomized iron-based amorphous nanocrystalline powder, atomized iron-silicon-aluminum alloy powder and atomized iron-nickel alloy powder, wherein 3.5 ⁇ x ⁇ 6.5, 0 ⁇ y ⁇ 6.5.
- the surface of the soft magnetic metal material has an insulating film, and the insulating film includes phosphate, silicate, borate, chromate, permanganate, nitrate and aluminum One or more complex salts of acid salts.
- the adhesive comprises any one or a mixture of two or more of epoxy resin, phenolic resin, cyanate ester resin, bismaleimide resin and silicone resin, or the above One or a mixture of two or more modified resin materials.
- the molding density of the magnetic composite material is greater than or equal to 5 g/cm 3 and less than or equal to 6.2 g/cm 3 .
- a preparation method of the above-mentioned magnetic composite material comprising:
- a soft magnetic metal material with a relative density greater than or equal to 0.5, wherein the largest particle size and the smallest particle size among the particle sizes of the several materials are different.
- the ratio is less than or equal to 8;
- the soft magnetic metal material and the binder are mixed in a preset ratio to form a magnetic composite material.
- the preparation method of the magnetic composite material before the step of mixing the soft magnetic metal material and the binder in a preset ratio to form a magnetic composite material, the preparation method of the magnetic composite material further includes:
- Surface modification treatment is performed on the soft magnetic metal material to form an insulating film on the surface of the soft magnetic metal material, and the insulating film includes phosphate, silicate, borate, chromate, high One or more complex salts of manganate, nitrate and aluminate.
- the adhesive comprises any one or a mixture of two or more of epoxy resin, phenolic resin, cyanate ester resin, bismaleimide resin and silicone resin, or the above One or a mixture of two or more modified resin materials.
- the preparation method of the magnetic composite material further includes:
- the magnetic composite material is made into a feed, and the form of the feed includes any one or more of irregular powder, cake and viscous fluid.
- an inductor comprising a coil and a magnetic body covering the coil, and the magnetic body is made of the above-mentioned magnetic composite material.
- a method for manufacturing an inductor comprising:
- the predetermined pressure being less than the plastic deformation strength of the magnetic composite and the plastic deformation of the coil strength.
- the shape of the magnetic body includes a rectangular parallelepiped or an elliptical cylinder.
- both ends of the coil are connected to electrode sheets respectively, and the connection between the two ends of the coil and the electrode sheets includes any one of welding, solder paste sintering and electroplating. .
- the preset pressure is greater than or equal to 1.0 MPa and less than or equal to 15 MPa.
- a magnetic composite material composed of a soft magnetic metal material with a relative density of 0.5 or more is used as the pressing material, so that it is not necessary to use too high pressing pressure during pressing, and the plastic deformation strength of the magnetic composite material is smaller than that of the magnetic composite material.
- the pressure of the plastic deformation strength of the coil is used to press the magnetic composite material, so as to ensure that the magnetic composite material after pressing has sufficient molding density, and at the same time avoid the deformation or stress of the magnetic composite material and the internal coil structure caused by excessive pressure. It can prevent the short circuit of the inductance and the attenuation of the initial withstand voltage of the coil, and improve the reliability of the inductance.
- Fig. 1 is a flow chart of an embodiment of a method for preparing a magnetic composite material provided in an embodiment of the present application
- Fig. 2 is a flowchart of another embodiment of the preparation method of the magnetic composite material provided by the embodiment of the application;
- FIG. 3 is a flowchart of a method for manufacturing an inductor provided by an embodiment of the present application.
- inductors such as power inductors
- various intelligent hardware systems such as smart phones, smart TVs, smart home appliances, tablet computers, notebook computers, various communication terminals and servers, etc.
- Power inductors include coil windings.
- the coil windings are preset in the mold, and the empty space inside and around the windings is filled and formed by metal soft magnetic powder, and then the inductor structure is obtained. Magnetic structure.
- a higher pressure such as 500 MPa or 600 MPa or 800 MPa, or even higher, is often used for pressing.
- a higher pressure such as 500 MPa or 600 MPa or 800 MPa, or even higher, is often used for pressing.
- a high pressure can ensure that the forming density of the metal soft magnetic powder is high enough, it is easy to cause damage to the metal soft magnetic powder itself and the coil structure inside it, so that the coil structure is deformed as a whole, and the wire cross-sectional area of the coil is formed. Deformation and scratches, which in turn lead to the attenuation of the initial voltage withstand capability of the coil and the short circuit of the inductance, reducing the reliability of the inductance.
- the present application provides a magnetic composite material and a preparation method thereof, an inductor and a preparation method thereof.
- the magnetic composite material provided in the embodiment of the present application includes a soft magnetic metal material and a binder, the soft magnetic metal material and the binder are mixed in a preset ratio, and the relative density of the soft magnetic metal material is greater than or equal to 0.5, and the relative consistency Density is expressed by the following formula:
- ⁇ ' is the relative density of the soft magnetic metal material
- ⁇ bt is the tap density of the soft magnetic metal material
- ⁇ is the true density of the soft magnetic metal material
- the mixing of the soft magnetic metal material and the binder can make the soft magnetic metal material have a certain fluidity, so that the magnetic composite material formed by mixing can be used in a pressing process.
- the tap density refers to the mass of the unit volume measured after the powder in the container is tapped under the specified conditions
- the true density refers to the actual mass of the solid substance per unit volume of the material in an absolutely dense state, that is, the removal of Density after internal voids or voids between particles.
- This application defines the ratio of tap density to true density as the relative density of the soft magnetic metal material. The higher the relative density, the higher the compaction density of the soft magnetic metal material.
- the relative density of the soft magnetic metal material in this application is greater than or equal to 0.5. In actual pressing, it is not necessary to use a large pressure, and only a small pressure can make the magnetic composite material have a high molding density, avoiding the The larger pressure causes the magnetic composite material itself to be damaged and other problems.
- the relative density of the soft magnetic metal material may be 0.5 or 0.6 or 0.7 or the like.
- the preset mixing ratio of the soft magnetic metal material and the binder is not unique.
- the mixing ratio of the two can be comprehensively considered from two aspects, one is the fluidity of the mixed magnetic composite material, and the other is the magnetic composite material after mixing. Inductive performance.
- the weight percentage of the soft magnetic metal material in the magnetic composite material is greater than or equal to 92% and less than or equal to 97%
- the weight percentage of the adhesive in the magnetic composite material is greater than or equal to 3% and less than or equal to 97%. is equal to 8%.
- the weight percentage of the soft magnetic metal material in the magnetic composite material is 92%, the weight percentage of the binder in the magnetic composite material is 8%, or the weight percentage of the soft magnetic metal material in the magnetic composite material is 8%.
- the weight percentage is 95%
- the weight percentage of the adhesive in the magnetic composite material is 5%
- the weight percentage of the soft magnetic metal material in the magnetic composite material is 97%
- the adhesive agent is in the magnetic composite material.
- the weight percentage is 3%.
- auxiliary materials such as related coupling agents or toughening agents or leveling agents can also be added to the magnetic composite material to optimize the mixing effect between the metal magnetic material and the adhesive or the flexibility of the magnetic composite material.
- the magnetic composite material also contains a toughening agent, a leveling agent, a mold release agent, etc.
- the weight percentage of the soft magnetic metal material in the magnetic composite material can be 95%, and the adhesive is in the magnetic composite material.
- the weight percentage of the material can be 3%, and the weight percentage of other adjuvants in the magnetic composite material can be 2%.
- the soft magnetic metal material includes a mixture of several materials with different particle sizes, and the ratio of the largest particle size to the smallest particle size among the particle sizes of the several materials is less than or equal to 8. That is, in the present application, the soft magnetic metal material includes a variety of materials with different particle sizes. When materials with different particle sizes are mixed, a higher tap density can be achieved, thereby increasing the relative density. Moreover, the applicant found that when the ratio of the maximum particle size to the minimum particle size in the particle sizes of several materials in the mixture is limited to 8 or less, such as 8 or 7 or 6, the tap density can be maintained at a higher value.
- the particle sizes of several mixed materials in the soft magnetic metal material are all between 10 microns and 80 microns.
- the soft magnetic metal material includes carbonyl iron powder, reduced iron powder, atomized iron powder, atomized Fe (100-xy) SixCry powder, atomized iron-based amorphous soft magnetic powder, atomized iron powder, atomized iron powder A mixture of several kinds of iron-based amorphous nanocrystalline powder, atomized iron-silicon-aluminum alloy powder and atomized iron-nickel alloy powder, wherein 3.5 ⁇ x ⁇ 6.5, 0 ⁇ y ⁇ 6.5.
- the soft magnetic metal material may include carbonyl iron powder, reduced iron powder, and a mixture of atomized iron powder, and may also include carbonyl iron powder, reduced iron powder, atomized iron powder, and atomized Fe (100-xy) Six Cr
- the surface of the soft magnetic metal material has an insulating film
- the insulating film includes one of phosphate, silicate, borate, chromate, permanganate, nitrate and aluminate. one or two or more complex salts.
- the insulating film can be directly coated on the surface of the soft magnetic metal material by physical coating, or it can be chemically reacted with the surface of the soft magnetic metal material, so as to modify the surface of the soft magnetic metal material to form an insulating film.
- the insulating film is a covalent bond or ionic bond compound, so it has good insulating properties and heat resistance. When the magnetic composite material is applied to the inductor structure, the insulating film can meet the requirements of heat aging and resistance during the use of the inductor. voltage breakdown requirements.
- the thickness of the insulating film is less than or equal to 50 nanometers.
- the adhesive includes any one or a mixture of two or more of epoxy resin, phenolic resin, cyanate ester resin, bismaleimide resin and silicone resin, or each of the above resin materials One or a mixture of two or more of the modifiers.
- the molding density of the magnetic composite material is greater than or equal to 5 g/cm 3 and less than or equal to 6.2 g/cm 3 .
- the pressing pressure on the magnetic composite material can be further reduced, the damage and deformation of the magnetic composite material during the pressing process can be reduced, and Reduce the amount of deformation of the coil covered by the magnetic composite material.
- the preparation method of the magnetic composite material provided in the embodiment of the present application includes the following steps:
- Step S20 mixing several kinds of soft magnetic metal powder materials with different particle sizes to prepare a soft magnetic metal material with a relative density greater than or equal to 0.5, wherein the largest particle size and the smallest particle size among the particle sizes of several materials The ratio is less than or equal to 8.
- Step S22 mixing the soft magnetic metal material and the adhesive in a preset ratio to form a magnetic composite material.
- the prepared magnetic composite material since the soft magnetic metal material and the binder are mixed, the prepared magnetic composite material has certain fluidity and can be used in the pressing process.
- the relative density of the prepared soft magnetic metal material is greater than or equal to 0.5, when the magnetic composite material is used in the pressing process, only a small pressing pressure is needed to make the magnetic composite material have a higher molding capacity. Density, to avoid problems such as damage or deformation of the magnetic composite material itself due to large pressure.
- step S20 when the soft magnetic metal powder materials of different particle sizes are mixed, a higher tap density can be achieved, thereby improving the relative density.
- the ratio of the maximum particle size to the minimum particle size in the particle sizes of several soft magnetic metal powder materials in the mixture is limited to be less than or equal to 8, such as 8 or 7 or 6, the tap density can be maintained at Higher values, i.e. greater than or equal to 0.5.
- the particle sizes of several soft magnetic metal powder materials in the soft magnetic metal material are all between 10 microns and 80 microns.
- step S20 carbonyl iron powder, reduced iron powder, atomized iron powder, atomized Fe (100-xy) Si x C y powder, atomized iron-based amorphous soft magnetic powder can be mixed , atomized iron-based amorphous nanocrystalline powder, atomized iron-silicon-aluminum alloy powder and atomized iron-nickel alloy powder are mixed to prepare a soft magnetic metal material, wherein 3.5 ⁇ x ⁇ 6.5, 0 ⁇ y ⁇ 6.5.
- the ratio of the maximum particle size to the minimum particle size is less than or equal to 8.
- the weight percentage of the binder in the mixture may be greater than or equal to 3% and less than or equal to 8%, and the weight percentage of the soft magnetic metal material in the mixture may be greater than or equal to 92% and Less than or equal to 97%.
- the desired magnetic composite material can be prepared.
- the adhesive includes epoxy resin, phenolic resin, cyanate ester resin, bismaleimide resin and silicone resin, any one or a mixture of two or more, or a modified product of the above resin materials one or a mixture of two or more.
- the preparation method of the magnetic composite material provided by the present application further includes the following steps:
- Step S21 performing surface modification treatment on the soft magnetic metal material to form an insulating film on the surface of the soft magnetic metal material, the insulating film includes phosphate, silicate, borate, chromate, permanganate One or more complex salts of , nitrate and aluminate.
- the purpose of surface modification treatment of soft magnetic metal material is to form an insulating film on its surface.
- a chemical reaction occurs on the surface of the magnetic metal material, so that an insulating film is formed after the surface of the soft magnetic metal material is modified.
- the insulating film is a covalent bond or ionic bond compound, so it has good insulating properties and heat resistance.
- the insulating film can meet the requirements of heat aging and resistance during the use of the inductor. voltage breakdown requirements.
- the thickness of the insulating film is less than or equal to 50 nanometers.
- step S22 in one embodiment, after step S22, the following steps are further included:
- Step S24 making the magnetic composite material into a feed, and the form of the feed includes any one or more of irregular powder, cake and viscous fluid.
- the molding density of the magnetic composite material prepared by the above preparation method is greater than or equal to 5 g/cm 3 and less than or equal to 6.2 g/cm 3 .
- the inductor provided by the embodiment of the present application includes a coil and a magnetic body covering the coil, and the magnetic body is made of the aforementioned magnetic composite material.
- the relative density of the soft magnetic metal material in the magnetic composite material is greater than or equal to 0.5, when it presses the magnetic composite material, it is not necessary to use a large pressure, only a small pressure can make the magnetic composite material have higher It can avoid the problems such as damage or deformation of the magnetic composite material and the coil structure covered by the large pressure, thereby preventing the occurrence of short circuit of the inductance and the attenuation of the initial withstand voltage of the coil, and improving the reliability of the inductance. sex.
- the coil is an air-core coil with an iron core central column inside, that is, the coil is arranged around the iron core central column.
- the height of the central column of the iron core is greater than or equal to the height of the coil and less than or equal to 80% of the height of the magnetic body.
- the center column of the iron core is prepared by using the above-mentioned magnetic composite material, and can also be prepared by using other magnetic composite materials, which is not specifically limited here.
- the center column of the iron core is made of a soft magnetic metal material, which may be a ferrosilicon magnetic powder core, an amorphous magnetic powder core, a ferrosilicon aluminum magnetic powder core, or the like.
- the compressive fracture strength of the central column of the iron core is greater than or equal to 15MPa, and the deformation amount is between 0.1% and 1%.
- the coil is wound by enameled wire, and the outermost enameled wire of the coil is coated with hot-melt glue, and the function of the hot-melt glue is to shape the wound part of the coil when the coil is wound.
- two ends of the coil are respectively connected to corresponding external electrodes, and the external electrodes extend out of a magnetic body to serve as external connection terminals of the inductor.
- the preparation method of the inductor includes the following steps:
- Step S40 winding a wire to form a coil.
- Step S42 placing the coil in the mold.
- Step S44 filling the magnetic composite material into the mold.
- Step S46 applying a preset pressure to the mold to make the magnetic composite material flow and form a magnetic body covering the coil, the preset pressure being less than the plastic deformation strength of the magnetic composite material and the plastic deformation strength of the coil.
- the magnetic composite material composed of soft magnetic metal material with a relative density greater than or equal to 0.5 is used as the pressing material, it is not necessary to use too high pressing pressure during pressing, and the plastic deformation strength of the magnetic composite material and the plastic deformation strength of the coil are smaller than that of the magnetic composite material. Pressing the magnetic composite material at a high pressure can ensure that the magnetic composite material after compression molding has sufficient molding density, and at the same time avoid the deformation or damage of the magnetic composite material and the internal coil structure caused by excessively high pressure, and prevent inductance short circuit, The initial withstand voltage capability of the coil is attenuated, which improves the reliability of the inductor.
- the wire may include a metal wire and an insulating layer (enameled wire) covering the metal wire, and the metal wire may include any one of copper wire, aluminum wire, aluminum alloy, and copper alloy.
- the cross-sectional shape of the coil may be circular, oval, rectangular, or the like.
- the iron core center post may also be prepared in advance.
- the above-mentioned magnetic composite material can be used to prepare the core column, or the soft magnetic metal material in the magnetic composite material can be used.
- the forming pressure of the iron core central column is between 400-1500 MPa, and the higher the pressure, the higher the magnetic permeability, the higher the strength and density, and the curing is performed as needed after forming. After treatment, the iron core center column is finally obtained.
- the coil can be wound around the center post of the iron core.
- the center column of the iron core is arranged inside the coil, which helps to reduce the deformation of the coil in the subsequent pressing process.
- step S40 it further includes:
- Step S41 coating hot melt adhesive on the outermost periphery of the coil formed by winding.
- the function of hot melt adhesive is to shape the wound part of the coil when winding the coil.
- the coil in step S42, can be placed in the mold, and at the same time, both ends of the coil can be connected to electrode sheets respectively, and the electrode sheets connected to the two ends are fixed in position, so as to ensure that the coil is far away from the inner wall of the mold. The distance is uniform, and then the mold is closed to form a molding cavity.
- the connection method between the two ends of the coil and the electrode sheet includes any one of a welding method, a solder paste sintering method and an electroplating method.
- the present application adopts the molding transfer molding process to prepare the inductor.
- the used mold is divided into an upper mold and an upper mold, and the lower mold has an area for placing coils and a silo for placing magnetic composite materials.
- the coil is placed in the area corresponding to the lower mold of the mold, and in step S44, the magnetic composite material is filled into the silo of the lower mold of the mold.
- step S46 a preset pressure is applied to the magnetic composite material in the silo by using the principle of pressure.
- the magnetic composite material becomes liquid and flows into the cavity formed by the upper and lower molds until it is squeezed.
- the mold cavity is filled, and the magnetic composite material completely covers the coil.
- the shape of the finally formed magnetic body may include a rectangular parallelepiped or an elliptical cylinder.
- the top corner of the cuboid may also have a chamfered shape, and the elliptical cylinder may further include a cylindrical shape.
- the relative density of the magnetic composite material is greater than or equal to 0.5, that is, it has a high relative density, so it is not necessary to use a high pressing pressure during molding, and the molding with a small pressure can satisfy the high density of the magnetic composite material after molding. Density and the need for no damage to magnetic composites and coils.
- the preset pressure is greater than or equal to 1 MPa and less than or equal to 15 MPa.
- 500MPa, 600MPa, 800MPa, or even higher pressing pressures are generally used to suppress the inductor, which will undoubtedly cause certain damage to the inductor structure.
- the inductor can be formed only with a pressure of less than or equal to 15MPa. It is important that the magnetic composite material and the internal coil structure are not deformed or damaged, preventing the inductor Short circuit, the initial voltage withstand capability of the coil is attenuated, which improves the reliability of the inductor.
- the DC withstand voltage of the inductor prepared by the above preparation method can reach more than 1000V/cm.
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Abstract
一种磁性复合材料及其制备方法、电感及其制备方法，涉及半导体技术领域。磁性复合材料包括软磁金属材料和粘合剂，所述软磁金属材料和所述粘合剂以预设比例混合而成，所述软磁金属材料的相对致密度大于等于0.5，所述相对致密度由如下公式表示：其中，ρ'为所述软磁金属材料的相对致密度，ρ bt为所述软磁金属材料的振实密度，ρ为所述软磁金属材料的真密度。当将该磁性复合材料置于模具中进行压制时，由于软磁金属材料的相对致密度大于等于0.5，在实际压制时，无需采用较大的压强，只需较小的压强即可使磁性复合材料具有较高的成型致密度，避免因较大的压强而使得磁性复合材料本身受到损坏等问题。
Description
本申请涉及半导体技术领域，更具体地涉及一种磁性复合材料及其制备方法、电感及其制备方法。
电感作为芯片周边的主要被动元件之一被广泛应用于各种智能硬件***，例如智能手机、智能电视、智能家电、平板电脑、笔记本电脑、各种通讯终端及服务器等，其主要功能在于电磁信号及能量的转换、存储及滤波。
传统的电感包括线圈以及包覆线圈的磁性体，其制备过程一般是将线圈放置于模具中，通过金属软磁粉末填充线圈内部以及周边的空余空间并压制成型。上述压制过程中，为了保证结构的稳固性，压制压强往往较大，可达到500MPa、600MPa、800MPa，甚至更高。但是如此高的压制压强往往会对金属软磁粉末以及内部的线圈结构造成破坏，导致线圈结构的整体变形等问题，进而造成线圈初始耐压能力衰减、电感短路等问题，降低电感的可靠性。
发明内容
这里的陈述仅提供与本申请有关的背景信息，而不必然构成现有技术。
根据本申请的各种实施例，提供一种磁性复合材料及其制备方法、电感及其制备方法。
根据本申请的一个方面，提供了一种磁性复合材料，包括软磁金属材料和粘合剂，所述软磁金属材料和所述粘合剂以预设比例混合而成，所述 软磁金属材料的相对致密度大于等于0.5，所述相对致密度由如下公式表示：
其中，ρ’为所述软磁金属材料的相对致密度，ρ
bt为所述软磁金属材料的振实密度，ρ为所述软磁金属材料的真密度。
在其中一个实施例中，所述软磁金属材料在所述磁性复合材料中所占的重量百分比大于等于92％且小于等于97％，所述粘合剂在所述磁性复合材料中所占的重量百分比大于等于3％且小于等于8％。
在其中一个实施例中，所述软磁金属材料包括粒径不全相同的若干种材料的混合物，若干种材料的粒径中的最大粒径与最小粒径的比值小于等于8。
在其中一个实施例中，所述软磁金属材料包括羰基铁粉、还原铁粉、雾化铁粉、雾化Fe
(100-x-y)Si
xCr
y粉、雾化铁基非晶软磁粉末、雾化铁基非晶纳米晶粉末、雾化铁硅铝合金粉末以及雾化铁镍合金粉末中若干种的混合物，其中，3.5≤x≤6.5,0≤y≤6.5。
在其中一个实施例中，所述软磁金属材料的表面具有绝缘性薄膜，所述绝缘性薄膜包括磷酸盐、硅酸盐、硼酸盐、铬酸盐、高锰酸盐、硝酸盐以及铝酸盐中一种或两种以上的复合盐。
在其中一个实施例中，所述粘合剂包括环氧树脂、酚醛树脂、氰酸酯树脂、双马来酰亚胺树脂以及硅树脂中的任意一种或两种以上的混合物，或者上述各树脂材料的改性物中的一种或两种以上的混合物。
在其中一个实施例中，所述磁性复合材料的成型密度大于等于5g/cm
3且小于等于6.2g/cm
3。
根据本申请的另一个方面，提供了一种上述磁性复合材料的制备方法，包括：
将粒径不全相同的若干种软磁金属粉末材料混合，以制备出相对致密度大于等于0.5的软磁金属材料，其中，所述若干种材料的粒径中的最大粒径与最小粒径的比值小于等于8；
将所述软磁金属材料和所述粘合剂以预设比例混合制成磁性复合材料。
在其中一个实施例中，在将所述软磁金属材料和所述粘合剂以预设比例混合制成磁性复合材料的步骤之前，所述磁性复合材料的制备方法还包括：
对所述软磁金属材料进行表面改性处理，以在所述软磁金属材料的表面形成绝缘性薄膜，所述绝缘性薄膜包括磷酸盐、硅酸盐、硼酸盐、铬酸盐、高锰酸盐、硝酸盐以及铝酸盐中一种或两种以上的复合盐。
在其中一个实施例中，所述粘合剂包括环氧树脂、酚醛树脂、氰酸酯树脂、双马来酰亚胺树脂以及硅树脂中的任意一种或两种以上的混合物，或者上述各树脂材料的改性物中的一种或两种以上的混合物。
在其中一个实施例中，所述将所述软磁金属材料和所述粘合剂以预设比例混合制成磁性复合材料的步骤之后，所述磁性复合材料的制备方法还包括：
将所述磁性复合材料制成喂料，所述喂料的形态包括不规则粉状、饼状以及粘稠流体状中的任意一种或多种。
根据本申请的又一个方面，提供了一种电感，包括线圈和包覆所述线圈的磁性体，所述磁性体由上述的磁性复合材料制成。
根据本申请的再一个方面，提供了一种电感的制备方法，包括：
绕制导线，形成线圈；
将所述线圈放置于模具中；
向所述模具中填入如上述的磁性复合材料；
向所述模具中施加预设压强以使所述磁性复合材料流动并形成包覆所 述线圈的磁性体，所述预设压强小于所述磁性复合材料的塑性变形强度以及所述线圈的塑性变形强度。
在其中一个实施例中，所述磁性体的形状包括长方体或椭圆柱体。
在其中一个实施例中，所述线圈的两端分别连接电极片，所述线圈的两端与所述电极片之间的连接方式包括焊接方式、锡膏烧结方式以及电镀方式中的任意一种。
在其中一个实施例中，所述预设压强大于等于1.0MPa且小于等于15MPa。
上述电感的制备过程中，采用相对致密度大于等于0.5的软磁金属材料构成的磁性复合材料作为压制材料，使得在压制时无需采用太高的压制压强，而以小于磁性复合材料的塑性变形强度以及线圈的塑性变形强度的压强对磁性复合材料进行压制，即可确保压制成型后的磁性复合材料具有足够的成型致密度，同时避免压强过高而导致磁性复合材料以及内部线圈结构的变形或受损，防止电感短路、线圈初始耐压能力衰减的情况发生，提高电感的可靠性。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其他特征、目的和优点将从说明书、附图以及权利要求书变得明显。
为了更好地描述和说明这里公开的那些发明的实施例或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的发明、目前描述的实施例或示例以及目前理解的这些发明的最佳模式中的任何一者的范围的限制。
图1为本申请实施例提供的磁性复合材料的制备方法一种实施方式的流程框图；
图2为本申请实施例提供的磁性复合材料的制备方法另一种实施方式 的流程框图；
图3为本申请实施例提供的电感的制备方法的流程框图。
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
需要说明的是，当元件被称为“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
随着网络技术、计算机技术、通信技术、人工智能技术的逐步发展和相互融合，人类开始进入第四次工业革命时代；这个时代的主要特征在于人与人、物与物、人与物建立紧密的连接和信息互动，于是出现了智能手机、智能家居、智慧城市等新的生活方式，并随着相关瓶颈技术的逐渐突破会出现智能交通(包括互联网汽车、智能停车等)、AI机器人、甚至迟早出现的AI机器人社会、农业与工业的智能化及相关的物联网。这些复杂的连接都有赖于硬件***对信息的传递、通讯与处理，可以是信息的传送端，也可以是信息的接收端以及云端，智能化硬件的关键是芯片和相关的元器件。
其中，电感(例如功率电感)作为芯片周边的主要被动元件之一被广泛应用于各种智能硬件***，例如智能手机、智能电视、智能家电、平板电脑、笔记本电脑、各种通讯终端及服务器等，其主要功能在于电磁信号及能量的转换、存储及滤波。功率电感包括线圈绕组，将线圈绕组预置在模具中，通过金属软磁粉末将绕组内部及周边的空余空间填充并压制成型，进而获得电感结构，其具有优异的抗EMI干扰能力及完全封闭的磁结构。
但是，在现有的压制金属软磁粉末的过程中，为了使金属软磁粉末的成型密度提高，往往会采用较高的压强进行压制，例如500MPa或600MPa或800MPa，甚至更高。如此高的压强虽然能够确保金属软磁粉末的成型密度足够高，但是却很容易对金属软磁粉末本身以及包覆在内的线圈结构造成破坏，使线圈结构整体变形，构成线圈的导线截面积变形、划伤，进而导致线圈初始耐压能力发生衰减、电感短路等问题，降低电感的可靠性。
为了解决上述问题，本申请提供了一种磁性复合材料及其制备方法、电感及其制备方法。
本申请实施例所提供的磁性复合材料包括软磁金属材料和粘合剂，软磁金属材料和粘合剂以预设比例混合而成，软磁金属材料的相对致密度大于等于0.5，相对致密度由如下公式表示：
其中，ρ’为所述软磁金属材料的相对致密度，ρ
bt为所述软磁金属材料的振实密度，ρ为所述软磁金属材料的真密度。
软磁金属材料和粘合剂的混合能够使得软磁金属材料具有一定的流动性，从而使得混合形成的磁性复合材料可应用于压制工艺中。
振实密度指的是在规定条件下容器中的粉末经振实后所测得的单位容积的质量，真密度指的是材料在绝对密实的状态下单位体积的固体物质的实际质量，即去除内部空隙或颗粒间的空隙后的密度。本申请定义振实密 度与真密度的比值为软磁金属材料的相对致密度，相对致密度越高，软磁金属材料的压实密度也越高，相应地，当将该磁性复合材料置于模具中进行压制时，其填充率越高。本申请中的软磁金属材料的相对致密度大于等于0.5，在实际压制时，无需采用较大的压强，只需较小的压强即可使磁性复合材料具有较高的成型致密度，避免因较大的压强而使得磁性复合材料本身受到损坏等问题。
其中，软磁金属材料的相对致密度可以为0.5或0.6或0.7等。
软磁金属材料和粘合剂混合的预设比例并不唯一，可从两方面综合考虑两者混合的比例，一是混合之后的磁性复合材料的流动性，二是混合之后的磁性复合材料的电感性能。在其中一个实施例中，软磁金属材料在磁性复合材料中所占的重量百分比大于等于92％且小于等于97％，粘合剂在磁性复合材料中所占的重量百分比大于等于3％且小于等于8％。以上述混合比例进行软磁金属材料和粘合剂的混合，所制备出的磁性复合材料能够同时兼容良好的流动性和优异的电感性能。
例如，软磁金属材料在磁性复合材料中所占的重量百分比为92％，粘合剂在磁性复合材料中所占的重量百分比为8％，或者软磁金属材料在磁性复合材料中所占的重量百分比为95％，粘合剂在磁性复合材料中所占的重量百分比为5％，或者软磁金属材料在磁性复合材料中所占的重量百分比为97％，粘合剂在磁性复合材料中所占的重量百分比为3％。当然，在磁性复合材料中还可以添加相关的偶联剂或增韧剂或流平剂等辅助材料，用以优化金属磁性材料和粘合剂之间的混合效果或磁性复合材料的柔韧性等，例如在磁性复合材料中还含有增韧剂、流平剂、脱模剂等，此时，软磁金属材料在磁性复合材料中所占的重量百分比可以为95％，粘合剂在磁性复合材料中所占的重量百分比可以为3％，其它辅助剂在磁性复合材料中所占的重量百分比可以为2％。当然还有其他比例分配方式，在此不一一列举，只需满足粘合剂在磁性复合材料中的重量百分比在92％-97％之间，粘合剂在 磁性复合材料中的重量百分比在3％-8％之间即可。
在其中一个实施例中，软磁金属材料包括粒径不全相同的若干种材料的混合物，若干种材料的粒径中的最大粒径与最小粒径的比值小于等于8。即，本申请中，软磁金属材料中包含粒径大小不一的多种材料，当将不同粒径的材料混合时，能够实现较高的振实密度，进而提升相对致密度。并且，申请人发现将混合物中若干种材料的粒径中的最大粒径与最小粒径的比值限定为小于等于8时，例如8或7或6等，振实密度可以保持在较高值。
本实施例中，软磁金属材料中若干种混合材料的粒径均位于10微米至80微米之间。
在其中一个实施例中，软磁金属材料包括羰基铁粉、还原铁粉、雾化铁粉、雾化Fe
(100-x-y)Si
xCr
y粉、雾化铁基非晶软磁粉末、雾化铁基非晶纳米晶粉末、雾化铁硅铝合金粉末以及雾化铁镍合金粉末中若干种的混合物，其中，3.5≤x≤6.5,0≤y≤6.5。例如，软磁金属材料可以包括羰基铁粉、还原铁粉以及雾化铁粉的混合物，也可以包括羰基铁粉、还原铁粉、雾化铁粉以及雾化Fe
(100-x-y)Si
xCr
y粉(x＝4，y＝5)的混合物，还可以包括还原铁粉、雾化铁基非晶软磁粉末、雾化铁基非晶纳米晶粉末、雾化铁硅铝合金粉末以及雾化铁镍合金粉末的混合物等，在此不一一列举。
在其中一个实施例中，软磁金属材料的表面具有绝缘性薄膜，绝缘性薄膜包括磷酸盐、硅酸盐、硼酸盐、铬酸盐、高锰酸盐、硝酸盐以及铝酸盐中一种或两种以上的复合盐。绝缘性薄膜可以是采用物理包覆的方式直接包覆于软磁金属材料的表面，也可以是与软磁金属材料表面发生化学反应，从而对软磁金属材料表面进行改性后形成绝缘性薄膜。绝缘性薄膜是共价键或离子键化合物，因此其具有良好的绝缘特性和耐热特性，当该磁性复合材料应用于电感结构时，绝缘性薄膜能够满足电感使用过程中对耐热老化和耐电压击穿的需求。
需要说明的是，由于软磁金属材料具有较高的相对致密度，在压制过程中，只需较小的压强即可使磁性复合材料具有较高的成型致密度，除了能够防止磁性复合材料本身因较大的压强而受到损坏之外，还可以避免软磁金属材料表面的绝缘性薄膜结构受到损坏。
在其中一个实施例中，绝缘性薄膜的厚度小于等于50纳米。
在其中一个实施例中，粘合剂包括环氧树脂、酚醛树脂、氰酸酯树脂、双马来酰亚胺树脂以及硅树脂中的任意一种或两种以上的混合物，或者上述各树脂材料的改性物中的一种或两种以上的混合物。
在其中一个实施例中，磁性复合材料的成型密度大于等于5g/cm
3且小于等于6.2g/cm
3。如将磁性复合材料用于压制电感的过程中，在确保足够高的成型密度的基础上，可进一步减小对磁性复合材料的压制压强，减小压制过程中磁性复合材料的损伤和变形，以及减小被磁性复合材料包覆的线圈的变形量。
参照图1，本申请实施例提供的磁性复合材料的制备方法包括以下步骤：
步骤S20、将粒径不全相同的若干种软磁金属粉末材料混合，以制备出相对致密度大于等于0.5的软磁金属材料，其中，若干种材料的粒径中的最大粒径与最小粒径的比值小于等于8。
步骤S22、将软磁金属材料和粘合剂以预设比例混合制成磁性复合材料。
上述制备方法中，由于将软磁金属材料和粘合剂混合，因此所制得的磁性复合材料具有一定的流动性，可应用于压制工艺中。并且，由于制备出的软磁金属材料的相对致密度大于等于0.5，因此，当该磁性复合材料应用于压制工艺中时，仅需较小的压制压强即可使磁性复合材料具有较高的成型密度，避免因较大的压强而使得磁性复合材料本身受到损伤或变形等问题。
在其中一个实施例中，步骤S20中，当将不同粒径的软磁金属粉末材料混合时，能够实现较高的振实密度，进而提升相对致密度。并且，申请人发现将混合物中若干种软磁金属粉末材料的粒径中的最大粒径与最小粒径的比值限定为小于等于8时，例如8或7或6等，振实密度可以保持在较高值，即大于等于0.5。
在其中一个实施例中，软磁金属材料中若干种软磁金属粉末材料的粒径均位于10微米至80微米之间。
关于相对致密度的内容可参见前述磁性复合材料的相关描述，在此不赘述。
在其中一个实施例中，步骤S20中，可以是将羰基铁粉、还原铁粉、雾化铁粉、雾化Fe
(100-x-y)Si
xCr
y粉、雾化铁基非晶软磁粉末、雾化铁基非晶纳米晶粉末、雾化铁硅铝合金粉末以及雾化铁镍合金粉末中的任意若干种混合制备成软磁金属材料，其中，3.5≤x≤6.5,0≤y≤6.5。在选取上述材料时，需满足粒径不全相同，且最大粒径与最小粒径的比值小于等于8的要求。
在其中一个实施例中，步骤S22中，粘合剂在混合物中所占的重量百分比可以大于等于3％且小于等于8％，软磁金属材料在混合物中所占的重量百分比大于等于92％且小于等于97％。当软磁金属材料和粘合剂混合均匀后即可制得所需的磁性复合材料。
其中，粘合剂包括环氧树脂、酚醛树脂、氰酸酯树脂、双马来酰亚胺树脂以及硅树脂中的任意一种或两种以上的混合物，或者上述各树脂材料的改性物中的一种或两种以上的混合物。
参照图2，在其中一个实施例中，在步骤S20之后以及步骤S22之前，本申请所提供的磁性复合材料的制备方法还包括以下步骤：
步骤S21、对软磁金属材料进行表面改性处理，以在软磁金属材料的表面形成绝缘性薄膜，绝缘性薄膜包括磷酸盐、硅酸盐、硼酸盐、铬酸盐、 高锰酸盐、硝酸盐以及铝酸盐中一种或两种以上的复合盐。
对软磁金属材料进行表面改性处理的目的是在其表面形成一层绝缘性薄膜，绝缘性薄膜可以是采用物理包覆的方式直接包覆于软磁金属材料的表面，也可以是与软磁金属材料表面发生化学反应，从而对软磁金属材料表面进行改性后形成绝缘性薄膜。绝缘性薄膜是共价键或离子键化合物，因此其具有良好的绝缘特性和耐热特性，当该磁性复合材料应用于电感结构时，绝缘性薄膜能够满足电感使用过程中对耐热老化和耐电压击穿的需求。
在其中一个实施例中，绝缘性薄膜的厚度小于等于50纳米。
参照图2，在其中一个实施例中，步骤S22之后，还包括以下步骤：
步骤S24、将磁性复合材料制成喂料，喂料的形态包括不规则粉状、饼状以及粘稠流体状中的任意一种或多种。
通过上述制备方法所制得的磁性复合材料的成型密度大于等于5g/cm
3且小于等于6.2g/cm
3。
本申请实施例提供的电感包括线圈和包覆线圈的磁性体，磁性体由前述的磁性复合材料制成。
由于磁性复合材料中软磁金属材料的相对致密度大于等于0.5，因此，对其对磁性复合材料进行压制时，无需采用较大的压强，只需较小的压强即可使磁性复合材料具有较高的成型致密度，避免因较大的压强而使得磁性复合材料以及包覆在内的线圈结构受到损坏或变形等问题，进而防止电感短路、线圈初始耐压能力衰减的情况发生，提高电感的可靠性。
在其中一个实施例中，线圈为空心线圈，其内部具有铁芯中柱，即，线圈环绕铁芯中柱设置。优选地，铁芯中柱的高度大于等于线圈的高度且小于等于磁性体高度的80％。
在其中一个实施例中，铁芯中柱采用上述磁性复合材料制备而成，也 可以采用其他磁性复合材料制备而成，在此不做具体限制。
作为一种可替换实施方式，铁芯中柱采用软磁金属材料制备而成，可为铁硅磁粉芯、非晶磁粉芯、铁硅铝磁粉芯等。
本实施例中，铁芯中柱的压缩断裂强度大于等于15MPa,变形量在0.1％-1％之间。
在其中一个实施例中，线圈是由漆包线绕制而成，在线圈最***的漆包线上涂覆有热熔胶，该热熔胶的作用在于绕制线圈时将线圈已绕部分定型。
在其中一个实施例中，线圈的两端分别连接对应的外接电极，且外接电极延伸出磁性体，作为电感的对外连接端子。
参照图3，本申请实施例提供的电感的制备方法包括以下步骤：
步骤S40、绕制导线，形成线圈。
步骤S42、将线圈放置于模具中。
步骤S44、向模具中填入磁性复合材料。
步骤S46、向模具中施加预设压强以使磁性复合材料流动并形成包覆线圈的磁性体，预设压强小于磁性复合材料的塑性变形强度以及线圈的塑性变形强度。
由于采用相对致密度大于等于0.5的软磁金属材料构成的磁性复合材料作为压制材料，使得在压制时无需采用太高的压制压强，而以小于磁性复合材料的塑性变形强度以及线圈的塑性变形强度的压强对磁性复合材料进行压制，即可确保压制成型后的磁性复合材料具有足够的成型致密度，同时避免压强过高而导致磁性复合材料以及内部线圈结构的变形或受损，防止电感短路、线圈初始耐压能力衰减的情况发生，提高电感的可靠性。
在步骤S40中，导线可以包括金属线和包覆金属线的绝缘层(漆包线)，金属线可以包括铜线、铝线、铝合金以及铜合金中的任意一种。另外，线 圈的横截面形状可以为圆形或椭圆形或矩形等。
在其中一个实施例中，在步骤S40之前，还可以预先制备铁芯中柱。具体地，可以采用上文所述的磁性复合材料制备铁芯中柱，也可以采用磁性复合材料中的软磁金属材料制备。当采用磁性复合材料制备铁芯中柱时，铁芯中柱的成型压强在400-1500MPa之间，且压强越大，磁导率越高，强度和密度也越高，成型后根据需要进行固化处理，最终制得铁芯中柱。
当制备形成铁芯中柱，步骤S40中，则可以将线圈环绕铁芯中柱绕制。铁芯中柱设置于线圈的内部，有助于降低后续压制过程中线圈的变形量。
在其中一个实施例中，在步骤S40之后，还包括：
步骤S41、在绕制形成的线圈的最***涂覆热熔胶。热熔胶的作用在于绕制线圈时将线圈已绕部分定型。
在其中一个实施例中，步骤S42中，可以将线圈放置于模具中，同时线圈的两端可以分别与电极片连接，并由与两端相连的电极片固定位置，以保证线圈距离模具内壁的距离均匀，随后合模形成模压型腔。线圈的两端与电极片之间的连接方式包括焊接方式、锡膏烧结方式以及电镀方式中的任意一种。
需要说明的是，本申请采用的是模塑转移成型工艺进行电感的制备。其中，所采用的模具分为上模和上模，下模具有放置线圈的区域和用于放置磁性复合材料的料仓。在步骤S42中，是将线圈放置在模具的下模对应的区域，在步骤S44中，将磁性复合材料填入模具的下模的料仓内。
在步骤S46中，利用压强原理对料仓中的磁性复合材料施加预设的压强，同时在加热作用下，磁性复合材料变成液体状，受挤压流动进入上下模构成的模腔中，直至充满模腔，进而磁性复合材料全面包覆住线圈。之后，保压30-180s以使磁性复合材料中的热固性树脂(即粘合剂)固化，进而形成包覆住线圈的磁性体，最后脱模。
在其中一个实施例中，最终形成的磁性体的形状可以包括长方体或椭 圆柱体。具体地，长方体的顶角还可以具有倒角形状，椭圆柱体可以进一步包含圆柱体状。
由于磁性复合材料的相对致密度大于等于0.5，即具有较高的相对致密度，因此成型时无需采用高的压制压强，以较小的压强进行成型即可同时满足磁性复合材料成型后的高致密度和不对磁性复合材料及线圈造成破坏的需求。
在其中一个实施例中，预设压强大于等于1MPa且小于等于15MPa。传统的方案中，一般都会采用500MPa、600MPa、800MPa，甚至更高的压制压强对电感进行压制，这无疑会对电感结构造成一定的破坏。本申请中，由于采用相对致密度较高的磁性复合材料，仅采用小于等于15MPa的压强即可使电感成型，重要的是不会导致磁性复合材料以及内部线圈结构的变形或受损，防止电感短路、线圈初始耐压能力衰减的情况发生，提高了电感的可靠性。
通过上述制备方法制备得到的电感的耐直流电压可达1000V/cm以上。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请的保护范围应以所附权利要求为准。
Claims (16)
- 一种磁性复合材料，其特征在于，包括软磁金属材料和粘合剂，所述软磁金属材料和所述粘合剂以预设比例混合而成，所述软磁金属材料的相对致密度大于等于0.5，所述相对致密度由如下公式表示：
其中，ρ’为所述软磁金属材料的相对致密度，ρ bt为所述软磁金属材料的振实密度，ρ为所述软磁金属材料的真密度。 - 根据权利要求1所述的磁性复合材料，其特征在于，所述软磁金属材料在所述磁性复合材料中所占的重量百分比大于等于92％且小于等于97％，所述粘合剂在所述磁性复合材料中所占的重量百分比大于等于3％且小于等于8％。
- 根据权利要求1所述的磁性复合材料，其特征在于，所述软磁金属材料包括粒径不全相同的若干种材料的混合物，若干种材料的粒径中的最大粒径与最小粒径的比值小于等于8。
- 根据权利要求1所述的磁性复合材料，其特征在于，所述软磁金属材料包括羰基铁粉、还原铁粉、雾化铁粉、雾化Fe (100-x-y)Si xCr y粉、雾化铁基非晶软磁粉末、雾化铁基非晶纳米晶粉末、雾化铁硅铝合金粉末以及雾化铁镍合金粉末中若干种的混合物，其中，3.5≤x≤6.5,0≤y≤6.5。
- 根据权利要求1所述的磁性复合材料，其特征在于，所述软磁金属材料的表面具有绝缘性薄膜，所述绝缘性薄膜包括磷酸盐、硅酸盐、硼酸盐、铬酸盐、高锰酸盐、硝酸盐以及铝酸盐中一种或两种以上的复合盐。
- 根据权利要求1所述的磁性复合材料，其特征在于，所述粘合剂包括环氧树脂、酚醛树脂、氰酸酯树脂、双马来酰亚胺树脂以及硅树脂中的任意一种或两种以上的混合物，或者上述各树脂材料的改性物中的一种或两种以上的混合物。
- 根据权利要求1所述的磁性复合材料，其特征在于，所述磁性复合材料的成型密度大于等于5.0g/cm 3且小于等于6.2g/cm 3。
- 一种如权利要求1-7任一项所述的磁性复合材料的制备方法，其特征在于，包括：将粒径不全相同的若干种软磁金属粉末材料混合，以制备出相对致密度大于等于0.5的软磁金属材料，其中，所述若干种材料的粒径中的最大粒径与最小粒径的比值小于等于8；将所述软磁金属材料和粘合剂以预设比例混合制成磁性复合材料。
- 根据权利要求8所述的磁性复合材料的制备方法，其特征在于，在将所述软磁金属材料和所述粘合剂以预设比例混合制成磁性复合材料的步骤之前，所述磁性复合材料的制备方法还包括：对所述软磁金属材料进行表面改性处理，以在所述软磁金属材料的表面形成绝缘性薄膜，所述绝缘性薄膜包括磷酸盐、硅酸盐、硼酸盐、铬酸盐、高锰酸盐、硝酸盐以及铝酸盐中一种或两种以上的复合盐。
- 根据权利要求8所述的磁性复合材料的制备方法，其特征在于，所述粘合剂包括环氧树脂、酚醛树脂、氰酸酯树脂、双马来酰亚胺树脂以及硅树脂中的任意一种或两种以上的混合物，或者上述各树脂材料的改性物中的一种或两种以上的混合物。
- 根据权利要求8所述的磁性复合材料的制备方法，其特征在于，在将所述软磁金属材料和粘合剂以预设比例混合制成磁性复合材料的步骤之后，所述磁性复合材料的制备方法还包括：将所述磁性复合材料制成喂料，所述喂料的形态包括不规则粉状、饼状以及粘稠流体状中的任意一种或多种。
- 一种电感，其特征在于，包括线圈和包覆所述线圈的磁性体，所述磁性体由权利要求1-7任一项所述的磁性复合材料制成。
- 一种电感的制备方法，其特征在于，包括：绕制导线，形成线圈；将所述线圈放置于模具中；向所述模具中填入如权利要求1-7任一项所述的磁性复合材料；向所述模具中施加预设压强以使所述磁性复合材料流动并形成包覆所述线圈的磁性体，所述预设压强小于所述磁性复合材料的塑性变形强度以及所述线圈的塑性变形强度。
- 根据权利要求13所述的电感的制备方法，其特征在于，所述磁性体的形状包括长方体或椭圆柱体。
- 根据权利要求13所述的电感的制备方法，其特征在于，所述线圈的两端分别连接电极片，所述线圈的两端与所述电极片之间的连接方式包括焊接方式、锡膏烧结方式以及电镀方式中的任意一种。
- 根据权利要求13所述的电感的制备方法，其特征在于，所述预设压强大于等于1.0MPa且小于等于15.0MPa。
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