WO2022052816A1 - 显示装置及显示装置的制造方法 - Google Patents

显示装置及显示装置的制造方法 Download PDF

Info

Publication number
WO2022052816A1
WO2022052816A1 PCT/CN2021/114837 CN2021114837W WO2022052816A1 WO 2022052816 A1 WO2022052816 A1 WO 2022052816A1 CN 2021114837 W CN2021114837 W CN 2021114837W WO 2022052816 A1 WO2022052816 A1 WO 2022052816A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
array substrate
substrate
polarizer
color filter
Prior art date
Application number
PCT/CN2021/114837
Other languages
English (en)
French (fr)
Inventor
杨杰
臧远生
张恒
王盛
王辉
陈俊生
曲峰
王炎
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/789,459 priority Critical patent/US11714307B2/en
Priority to CN202180002297.3A priority patent/CN114730108B/zh
Publication of WO2022052816A1 publication Critical patent/WO2022052816A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133322—Mechanical guidance or alignment of LCD panel support components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133502—Antiglare, refractive index matching layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/13356—Structural association of cells with optical devices, e.g. polarisers or reflectors characterised by the placement of the optical elements
    • G02F1/133562—Structural association of cells with optical devices, e.g. polarisers or reflectors characterised by the placement of the optical elements on the viewer side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331—Cover glasses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/38—Anti-reflection arrangements

Definitions

  • the present application is based on the CN application number 202010951337.6 and the filing date is September 11, 2020, and claims its priority.
  • the disclosure of the CN application is hereby incorporated into the present application as a whole.
  • the present disclosure relates to the field of display technology, and in particular, to a display device and a manufacturing method of the display device.
  • the liquid crystal display device used is mainly composed of a display module and an outer frame of the whole machine
  • the display module includes a display panel, an upper polarizer and a lower polarizer.
  • the display panel includes an array substrate and a color filter substrate bonded by a frame sealant, and the upper polarizer and the lower polarizer are respectively attached to the upper color filter substrate and the lower array substrate. Because the driver chip needs to be bound on the array substrate, so that the array substrate extends beyond the color filter substrate, the outer frame of the whole machine fixes the module unit through the edge frame.
  • the liquid crystal display device used is further added with a protective cover plate, the protective cover plate and the display module are fixed by lamination, and the protective cover plate is The size exceeds the size of the display module, and the excess part is glued and fixed with the shell of the whole machine.
  • This structure cancels the design of the overlapping part between the casing and the display module, the entire surface of the liquid crystal display device is completely flat, and the appearance is more beautiful.
  • the edge portion will not cause interference, which is more conducive to the touch operation.
  • a display device comprising: a backlight module; a display module located on a light-emitting side of the backlight module; and a casing for accommodating the backlight module and the display module
  • the display module includes: a display panel, the display panel includes an array substrate and a color filter substrate arranged oppositely, the color filter substrate is located between the array substrate and the backlight module; and a first polarized light The sheet is located on the side of the array substrate away from the color filter substrate.
  • the display panel has a display area and a non-display area surrounding the display area
  • the display device further includes: a photosensitive unit, disposed in the housing and located away from the color filter substrate. On one side of the array substrate, the photosensitive unit is located in the non-display area.
  • the display module further includes: a second light-shielding layer, which is located on a side of the photosensitive unit adjacent to the color filter substrate, and has a first hollow area, wherein the incident light of the photosensitive unit is The orthographic projection of the region on the array substrate at least partially coincides with the orthographic projection of the first hollow region of the second light shielding layer on the array substrate.
  • the second light-shielding layer includes: an ink light-shielding layer located on a side of the array substrate away from the color filter substrate; or an ink located on a surface of the color filter substrate adjacent to the photosensitive unit. a light-shielding layer; or a black matrix in the color filter substrate.
  • the first polarizer has a second hollow area or a depolarization area
  • the light incident area of the photosensitive unit is in the orthographic projection of the array substrate or the first hollow area of the second light shielding layer
  • the orthographic projection of the array substrate is located within the orthographic projection of the array substrate in the second hollow area or depolarization area of the first polarizer.
  • the display panel further includes: a liquid crystal layer located between the array substrate and the color filter substrate; and a first frame sealant located between the color filter substrate and the array substrate and enclosing the liquid crystal layer.
  • the array substrate includes: a first base substrate; a first anti-reflection layer on the first base substrate; and a first metal layer adjacent to the first anti-reflection layer One side of the backlight module, wherein the orthographic projection of the first metal layer on the first base substrate completely coincides with the orthographic projection of the first anti-reflection layer on the first base substrate , or within the orthographic projection of the first antireflection layer on the first base substrate.
  • the display panel has a display area and a non-display area surrounding the display area
  • the array substrate includes a gate driving circuit located in the non-display area
  • the display module further includes: a first a light shielding layer located on the side of the array substrate away from the backlight module, wherein the orthographic projection of the first light shielding layer on the array substrate is located in the non-display area and at least partially covers the grid pole drive circuit.
  • the first light-shielding layer includes: an ink printing layer located between the first polarizer and the array substrate, the ink printing layer and the first polarizer or the array substrate contact; or an ink printing layer located on the side of the first polarizer away from the array substrate.
  • the display panel has a display area and a non-display area surrounding the display area
  • the array substrate includes: a first base substrate; and a second anti-reflection layer located on the first base substrate a second metal layer, located on the side of the second anti-reflection layer away from the first base substrate; and a gate drive circuit, located at a side of the second metal layer away from the first base substrate side, wherein the second anti-reflection layer, the second metal layer and the gate driving circuit are all located in the non-display area, and the second anti-reflection layer and the second metal layer are located in the non-display area.
  • the portion where the orthographic projections on the first base substrate overlap with each other at least partially cover the orthographic projection of the gate driving circuit on the first base substrate.
  • the array substrate further includes: a plurality of first thin film transistors located in the display area; and a plurality of second thin film transistors located in the non-display area and connected to the plurality of first thin films Among the transistors, a row or a column of first thin film transistors located at the edge of the display area is adjacent, wherein at least one of the plurality of second thin film transistors does not include a drain metal layer or an active layer.
  • the housing includes: a back portion located on a side of the backlight module away from the color filter substrate, and a plurality of side portions connected to the back portion, the plurality of side portions and all the side portions connected to the back portion.
  • the back part forms the inner space of the housing;
  • the array substrate comprises: a first part, the orthographic projection of the first part on the back part and the orthographic projection of the color filter substrate on the back part are completely coincident or partially and the second part, the orthographic projection of the second part on the back part and the orthographic projection of the color filter substrate on the back part do not overlap each other, wherein the backlight module is in the The orthographic projection on the back part completely coincides with the orthographic projection of the array substrate on the back part or is located in the orthographic projection of the array substrate on the back part, the second part, the backlight module,
  • the color filter substrate and the side portion enclose an accommodating space;
  • the display module further includes: a flexible circuit board located on a side of the second part adjacent to the color filter
  • a method for manufacturing a display device comprising: providing a display panel having a display area and a non-display area surrounding the display area, the display panel including an array substrate and a color filter substrate arranged oppositely , the array substrate includes a gate drive circuit located in the non-display area; a first polarizer is attached to the array substrate, and a first light shield is formed on the side of the array substrate away from the color filter substrate layer, the orthographic projection of the first light-shielding layer on the array substrate is located in the non-display area, and at least partially covers the gate driving circuit; the first light-shielding layer is attached to the array substrate to which the first polarizer has been attached.
  • the driver chip is fixed, and one end of the flexible circuit board is bound to the array substrate, and the other end is connected to the driver circuit board to form a display module; a casing and a backlight module are provided, and the backlight module and all The display modules are sequentially installed in the housing, and the color filter substrate is positioned between the array substrate and the backlight module.
  • the steps of attaching a first polarizer on the array substrate and forming a first light shielding layer on the side of the array substrate away from the color filter substrate include steps a) to f). At least one of: a) printing ink on the surface of the array substrate away from the color filter substrate to form an ink printing layer as the first light-shielding layer, and printing a part of the ink on the array substrate and attaching the first polarizer on the side through an adhesive layer; b) printing ink on the surface of the first polarizer to form an ink printing layer as the first light-shielding layer, and printing the first polarizer on the surface of the first polarizer
  • the side with ink is attached to the surface of the array substrate away from the color filter substrate through an adhesive layer; c) the surface of the array substrate away from the color filter substrate is attached to the surface of the array substrate away from the color filter substrate through an adhesive layer.
  • a first polarizer and printing ink on the surface of the first polarizer away from the color filter substrate to form an ink printing layer as the first light-shielding layer, and then printing on the first polarizer
  • a functional film layer is arranged on one side of the ink; d) printing ink on the surface of the first polarizer to form an ink printing layer as the first light-shielding layer, and printing a part of the ink on the first polarizer
  • a functional film layer is arranged on the side, and then the surface of the first polarizer on the side away from the functional film layer is attached to the surface of the array substrate on the side away from the color filter substrate; e) on the first polarizer
  • the surface of the sheet is attached to the substrate containing the ink printing layer as the first light shielding layer, and the surface of the first polarizer on the side away from the ink printing layer is attached to the array substrate away from the color.
  • the manufacturing method further includes: arranging a photosensitive unit in the housing, and placing the photosensitive unit on a side of the color filter substrate away from the array substrate; wherein, forming a display module
  • the step further includes: forming a second light shielding layer on the side of the photosensitive unit adjacent to the color filter substrate, the second light shielding layer has a first hollow area, and the light incident area of the photosensitive unit is on the array substrate
  • the orthographic projection of the second light shielding layer at least partially coincides with the orthographic projection of the first hollow region of the second light shielding layer on the array substrate.
  • the step of forming the array substrate includes: providing a first base substrate; forming a first anti-reflection layer on the first base substrate; and placing the first anti-reflection layer away from the first anti-reflection layer
  • a first metal layer is formed on one side of a base substrate, and the orthographic projection of the first metal layer on the first base substrate is the same as the orthographic projection of the first antireflection layer on the first base substrate The projections are completely coincident, or are located in the orthographic projection of the first anti-reflection layer on the first base substrate.
  • the step of forming the array substrate further includes: forming a second anti-reflection layer on the first base substrate; A second metal layer is formed on the side of the second metal layer; a gate driving circuit is formed on the side of the second metal layer away from the first base substrate, wherein the second anti-reflection layer, the second metal layer and the The gate driving circuits are all located in the non-display area, and the overlapping portion of the orthographic projections of the second anti-reflection layer and the second metal layer on the first substrate at least partially covers the gate orthographic projection of the driving circuit on the first base substrate.
  • the first anti-reflection layer and the second anti-reflection layer are prepared through the same patterning process.
  • FIG. 1 is a schematic structural diagram of a liquid crystal display device of a notebook computer in the related art
  • FIG. 2 is a schematic structural diagram of a liquid crystal display device of a notebook computer in another related art
  • FIG. 3 is a schematic diagram of the overall structure of an embodiment of the display device of the present disclosure.
  • Fig. 4 is the structural representation of BB section in Fig. 3;
  • Fig. 5 is the structural representation of CC section in Fig. 3;
  • FIG. 6 is a schematic diagram of the overall structure of another embodiment of the display device of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a display module in an embodiment of the display device of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of an embodiment of the display device of the present disclosure.
  • FIG. 9 is a schematic cross-sectional view of another embodiment of the display device of the present disclosure.
  • FIG. 10 are schematic diagrams of various methods for attaching a first polarizer on an array substrate and forming a first light shielding layer in some embodiments of the display device of the present disclosure during the preparation process;
  • FIG. 11 and FIG. 12 are respectively partial structural schematic diagrams of the display area and the periphery on the array substrate in some embodiments of the display device of the present disclosure
  • FIG. 13 is a schematic diagram of a partial structure of the display device shown in FIG. 2;
  • FIG. 14 is a partial structural schematic diagram of an embodiment of the display device of the present disclosure.
  • FIG. 15 and FIG. 16 are schematic diagrams of the arrangement of the second light-shielding layer and the first sealant of the display module in some embodiments of the display device of the present disclosure, respectively;
  • 17 is a schematic cross-sectional view of still another embodiment of the display device of the present disclosure.
  • FIGS 18 and 19 are schematic diagrams of the arrangement of the second light-shielding layer, the first sealant and the second sealant of the display module in some embodiments of the display device of the present disclosure, respectively;
  • 20-22 are schematic diagrams of the relative positions of the photosensitive unit and the second light shielding layer in some embodiments of the display device of the present disclosure, respectively;
  • 23 is a schematic diagram of the arrangement of the second light-shielding layer and the second hollow area of the display module in an embodiment of the display device of the present disclosure
  • 24 is a schematic diagram of the relative positions of the light incident area, the first hollow area and the second hollow area in an embodiment of the display device of the present disclosure
  • 25 is a schematic diagram of the relative positions of the light incident area, the first hollow area and the depolarization area in an embodiment of the display device of the present disclosure
  • FIG. 26 is a schematic flowchart of an embodiment of a manufacturing method of a display device of the present disclosure.
  • first,” “second,” and similar words do not denote any order, quantity, or importance, but are merely used to distinguish the different parts.
  • “Comprising” or “comprising” and similar words mean that the element preceding the word covers the elements listed after the word, and does not exclude the possibility that other elements are also covered.
  • “Up”, “Down”, “Left”, “Right”, etc. are only used to represent the relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
  • a specific device when a specific device is described as being located between the first device and the second device, there may or may not be an intervening device between the specific device and the first device or the second device.
  • the specific device When it is described that a specific device is connected to other devices, the specific device may be directly connected to the other device without intervening devices, or may not be directly connected to the other device but have intervening devices.
  • FIG. 1 it is a schematic structural diagram of a liquid crystal display device of a notebook computer in the related art.
  • the liquid crystal display device is mainly composed of a backlight module 01 , a display module 02 and a casing 03 of the whole machine, wherein the display module 02 includes an array substrate 201 , a color filter substrate 202 , and a first polarizer attached to the array substrate 201 . 203 .
  • a second polarizer 204 attached to the color filter substrate 202 , and a first sealant 205 for bonding the array substrate 201 and the color filter substrate 202 .
  • the casing 03 of the whole machine fixes the backlight module 01 and the display module 02 through the edge frame.
  • the requirements of the assembly process require that the casing 03 and the display module 02 overlap to a certain extent, so the surrounding frame is relatively large, and there is a certain level difference around the periphery.
  • a liquid crystal display device as shown in Figure 2 has appeared.
  • a protective cover plate 04 is added.
  • the protective cover 04 and the display module 02 are fixed by bonding, and the size of the protective cover 04 exceeds the size of the display module 02 , and the excess part is glued and fixed with the casing 03 of the whole machine.
  • FIG. 1 Compared with the structure shown in FIG. 1 , a protective cover plate 04 is added.
  • the protective cover 04 and the display module 02 are fixed by bonding, and the size of the protective cover 04 exceeds the size of the display module 02 , and the excess part is glued and fixed with the casing 03 of the whole machine.
  • this structure cancels the design of the overlapping portion of the casing 03 and the display module 02 , the entire surface of the liquid crystal display device is completely flat, and the appearance is more beautiful. What is important is that the edge portion does not interfere with the touch operation, which is more conducive to the touch operation. At the same time, the frame of the entire liquid crystal display device is reduced to a certain extent due to the cancellation of the overlapping portion between the casing 03 and the display module 02 .
  • the cover plate 04 in this structure the cost of the entire liquid crystal display device increases. As the protective cover plate 04 is increased, the thickness of the entire liquid crystal display device is also increased. In the whole process, the overall process yield is decreased due to the addition of the bonding process of the protective cover 04 .
  • FIG. 3 is a schematic diagram of the overall structure of an embodiment of the display device of the present disclosure.
  • FIG. 4 is a schematic structural diagram of the BB section in FIG. 3 .
  • FIG. 5 is a schematic structural diagram of the CC section in FIG. 3 .
  • FIG. 6 is a schematic diagram of the overall structure of another embodiment of the display device of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a display module in an embodiment of the display device of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of an embodiment of the display device of the present disclosure.
  • FIG. 9 is a schematic cross-sectional view of another embodiment of the display device of the present disclosure.
  • the display device includes: a backlight module 01 , a display module 02 and a housing 03 .
  • the display device may be a notebook computer or a tablet computer or the like.
  • the backlight module 01 is used to provide the display module 02 with a backlight for display, which can be a direct type backlight module or an edge type backlight module.
  • the backlight module 01 is an edge type backlight module, which may include a side light source 11 , a light guide plate 12 , an optical film group 13 and the like.
  • the substrate of the backlight module 01 may be disposed in the casing 03 or formed by multiplexing the casing 03 .
  • the inner wall of the housing 03 not only accommodates and supports the backlight module 01 and the display module 02 , but also serves as the base substrate of the backlight module 01 to reduce the dimension in the thickness direction occupied by the backlight module.
  • the side light source 11, the light guide plate 12, the optical film group 13, etc. in the backlight module 01 can be accommodated and fixed through the groove structure provided in the housing 03.
  • a groove structure concave in the lateral direction (ie, the concave direction is parallel to the horizontal plane) can be arranged in the casing 03 to accommodate components such as the side light source 11 .
  • the protrusions 33 forming the groove structure in the casing 03 can be detachably separated from the back part 31 (A casing) of the casing 03, so that the side light source 11 can be installed first.
  • the components are mounted to the back portion 31, and then the bumps 33 are mounted, and the bumps 33 can support the display module 02 in addition to constraining the mounted side light source 11 and other components.
  • the display module 02 is located on the light-emitting side of the backlight module 01 .
  • the display module 02 includes: a display panel and a first polarizer 203 .
  • the display panel 20 includes an array substrate 201 and a color filter substrate 202 disposed opposite to each other, and the color filter substrate 202 is located between the array substrate 201 and the backlight module 01 .
  • the first polarizer 203 is located on the side of the array substrate 201 away from the color filter substrate 202 .
  • the first polarizer 203 can be reused as the protective cover 04 of the display module 02 .
  • the array substrate 201 is turned upside down for use, and the first polarizer 203 on the array substrate 201 is multiplexed into the protective cover 04, thereby avoiding the need for a separate protective cover 04 Therefore, the bonding process of the protective cover plate 04 is saved, thereby realizing the lightness and thinning of the display device, simplifying the manufacturing process, and improving the product yield.
  • the related components such as driver chips
  • the devices connected to the array substrate such as the flexible circuit board and the driver circuit board
  • the integration of the display module eliminates the step difference between the display module and the whole machine shell, and improves the appearance of the display device brain.
  • the display module 02 may further include a second polarizer 204 located between the color filter substrate 202 and the backlight module 01 .
  • the display panel may further include a liquid crystal layer 208 between the array substrate 201 and the color filter substrate 202 .
  • the light transmission axis of the second polarizer 204 and the light transmission axis of the first polarizer 203 are perpendicular to each other. Since the liquid crystal molecules in the liquid crystal layer have optical rotatory properties, the first polarizer and the second polarizer whose optical polarization directions are perpendicular to each other convert polarized light, so that the display module can display images and texts.
  • the second polarizer 204 can be formed on the surface of the color filter substrate 202 , and the orthographic projection of the second polarizer 204 on the color filter substrate 202 can be completely coincident with the color filter substrate 202 .
  • the display module 02 further includes a first sealant 205 located between the color filter substrate 202 and the array substrate 201 .
  • the first sealant 205, the color filter substrate 202 and the array substrate 201 together form a liquid crystal cell, and the liquid crystal layer 208 is formed by injecting liquid crystal into the liquid crystal cell.
  • the first polarizer 203 may be a high-hardness polarizer (eg, a thickness slightly larger than that of a conventional polarizer by 0.1 mm) or a high-hardness film to replace the toughened cover plate.
  • the hardness value of the first polarizer 203 may be greater than or equal to 6H, so that the first polarizer 203 has better scratch resistance.
  • the thickness of the protective cover 04 in the related art is generally 0.5 mm or 0.7 mm, and the thickness of the optical adhesive layer that attaches the protective cover 04 to the display module 02 is about 0.2 mm, in this embodiment, the thickness of the optical adhesive layer is about 0.2 mm.
  • the housing 03 accommodates the backlight module 01 and the display module 02 .
  • the housing 03 may include a back portion 31 located on the side of the backlight module 01 away from the color filter substrate 02 and a plurality of side portions 32 connected to the back portion 31 , the plurality of side portions 32 and the The rear portion 31 forms the inner space of the casing 03 .
  • the side portion 32 when looking at the display device from the light-emitting side of the display device, the side portion 32 surrounds the outside of the display module 02 .
  • the overall outline of the cross-section of the housing 03 presents a concave shape on the basis of a rectangle.
  • the side portion 32 can be provided as a wall structure with uniform or non-uniform thickness, and can be perpendicular to the back portion 31 . In other embodiments, the side portion 32 may form an acute angle or an obtuse angle with the back portion 31 to form a trapezoidal overall profile with a concave structure.
  • the array substrate has patterns of metal materials, such as metal layers such as the gate, source and drain of the thin film transistor TFT located in the display area in the array substrate. When the array substrate is turned upside down, these metal layers are easily reflective under the irradiation of external light.
  • the array substrate 201 includes: a first base substrate 2011 , a first antireflection layer 2012 and a first metal layer 2013 .
  • the first base substrate 2011 can be made of a transparent material such as glass.
  • the first anti-reflection layer 2012 is located on the first base substrate 2011 .
  • the first metal layer 2013 is located on a side of the first anti-reflection layer 2012 adjacent to the backlight module.
  • the pattern shape of the first anti-reflection layer 2012 is the same as the pattern shape of the first metal layer 2013 to be shielded, and the size may be the same or different.
  • the reflectivity of ambient light on the first metal layer 2013 is effectively reduced, and the display effect is improved.
  • some test results show that the reflectivity without the first anti-reflection layer 2012 is 9.2, and the reflectivity of the first anti-reflection layer 2012 is increased to 6.78, and the reflectivity is reduced by 26%.
  • the orthographic projection of the first anti-reflection layer 2012 on the first base substrate 2011 completely coincides with the orthographic projection of the first metal layer 2013 on the first base substrate 2011 .
  • the orthographic projection of the first metal layer 2013 on the first base substrate 2011 is located within the orthographic projection of the first anti-reflection layer 2021 on the first base substrate 2011, so as to obtain a better reflection reduction effect .
  • the first anti-reflection layer 2012 can be made of molybdenum (Mo) metal oxide or the like, for example, by depositing Mo metal oxide under the first metal layer 2013, and the pattern shape of the Mo metal oxide is The pattern shape is the same as that of the first metal layer 2013 , thereby effectively reducing the reflectivity of the surface of the first metal layer 2013 .
  • a composite insulating layer can also be used to achieve anti-reflection of ambient light, and the composite insulating layer can include alternately stacked single crystal Si layers and Si composition layers (eg, SiO 2 , Si 3 N 4 ) , wherein the refractive index of the single crystal Si layer is lower than the refractive index of the Si composition layer.
  • a two-layer composite structure comprising a layer of Si composition of higher refractive index and a layer of monocrystalline Si of lower refractive index, wherein the layer of Si composition is located on the side adjacent to ambient light.
  • the display panel has a display area AA and a non-display area W surrounding the display area AA.
  • the non-display area W can be divided into a lower border area W 1 , an upper border area W 2 , a left border area W 3 , and a right border area W 4 .
  • the array substrate 201 may further include a plurality of first thin film transistors located in the display area AA.
  • the array substrate 201 may further include: a first insulating layer 2014 , a planarization layer 2015 , a common electrode 2016 , a second insulating layer 2017 and a pixel electrode 2018 .
  • the first insulating layer 2014 is disposed on one side of the first base substrate 2011 adjacent to the color filter substrate 202 and covers the gate metal layer of the first thin film transistor.
  • the flat layer 2015 is disposed on one side of the first insulating layer 2014 adjacent to the color filter substrate 202 .
  • the common electrode 2016 is disposed on one side of the flat layer 2015 adjacent to the color filter substrate 202 .
  • the second insulating layer 2017 is disposed on the side of the common electrode 2016 adjacent to the color filter substrate 202 .
  • the pixel electrode 2018 is disposed on one side of the second insulating layer 2017 adjacent to the color filter substrate 202 .
  • the color filter substrate 202 may include: a second base substrate 2021 , a color resist layer 2022 and a black matrix 2023 .
  • the second base substrate 2021 can be made of a transparent material such as glass.
  • the common electrode 2016 may also be disposed on the color filter substrate 202 , for example, on the side of the color resist layer 2022 adjacent to the liquid crystal layer 208 .
  • the color resist layer 2022 may include, but is not limited to, red color resist R, green color resist G, and blue color resist B. Each color resist is defined by the black matrix 2023 .
  • the first metal layer 2013 may include the gate metal layers of the plurality of first thin film transistors, and accordingly, the first anti-reflection layer 2012 may use a gate mask for fabricating the gate metal layers. ) to form a first antireflection layer 2012 and a gate metal layer by one patterning.
  • the first metal layer 2013 may include the source and drain metal layers of the plurality of first thin film transistors, and correspondingly, the first anti-reflection layer 2012 may use a mask for forming the source and drain metal layers (SD Mask) to form the first anti-reflection layer 2012 and the source-drain metal layer by one patterning.
  • SD Mask source and drain metal layers
  • the first metal layer 2013 may include gate metal layers and source-drain metal layers of a plurality of first thin film transistors, and correspondingly, the first anti-reflection layer 2012 may further include two kinds of first anti-reflection layers layer, and use the mask for making the gate metal layer to form the first first antireflection layer and the gate metal layer at one time, and use the mask for making the source and drain metal layers to form the second kind of first antireflection layer at one time. an anti-reflection layer and a source-drain metal layer.
  • the first anti-reflection layer 2012 is a single film layer, which is first formed through a patterning process, and then the gate metal layer and the source and drain metal layers are respectively fabricated through another two masking processes, so that the first anti-reflection layer 2012 has a
  • the pattern is the same as that of the gate metal layer and the source and drain metal layers (or the orthographic projections on the first base substrate are completely coincident).
  • the array substrate 201 may include a gate driver circuit 210 (Gate Driver on Array, GOA for short) located in the non-display area W, and may also include driver chips (Driver IC) such as the source driver circuit 206. Since the gate driving circuit 210 and the traces are denser than the metal lines in the display area AA, and the array substrate 201 is turned upside down, the visual difference between the non-display area W and the display area AA is obvious.
  • GOA Gate Driver on Array
  • the display module further includes a first light shielding layer 207 .
  • the first light shielding layer 207 is located on the side of the array substrate 201 away from the backlight module 01 .
  • the orthographic projection of the first light shielding layer 207 on the array substrate 201 is located in the non-display area W, and at least partially covers the gate driving circuit 210 .
  • the shading effect of the first light shielding layer 207 on the metal lines of the gate driving circuit 210 in the non-display area W reduces the color difference between the non-display area W and the display area AA due to different metal line densities.
  • the first light shielding layer 207 can also shield the backlight light in the non-display area W, and prevent light leakage in the non-display area W.
  • the first light shielding layer 207 may include: an ink printing layer located between the first polarizer 203 and the array substrate 201 , and the ink printing layer is connected to the first polarizer 203 or all other components. contact with the array substrate 201 ; or an ink printing layer located on the side of the first polarizer 203 away from the array substrate 201 .
  • the ink print layer may be formed using black ink.
  • FIG. 10 are schematic diagrams of various methods for attaching a first polarizer on an array substrate and forming a first light shielding layer in some embodiments of the display device of the present disclosure during the manufacturing process.
  • the first light shielding layer 207 formed by ink printing is located between the first polarizer 203 and the array substrate 201 .
  • the first polarizer 203 may include a triacetate cellulose TAC layer, a polyvinyl alcohol PVA layer and a TAC layer stacked in sequence.
  • a protective film and a release film may also be attached to the upper and lower surfaces of the first polarizer 203, and the protective film and the release film may be removed during subsequent processing.
  • the array substrate 201 in order to form the first light shielding layer 207, the array substrate 201 is provided first, and then the backside of the array substrate 201 (ie, the side of the first base substrate 2011 away from the color filter substrate 202) is provided.
  • the ink 2071 is printed on the surface to form the ink printing layer as the first light shielding layer 207, and then the first polarizer 203 is attached to the side of the array substrate 201 where the ink 2071 is printed through the adhesive layer 211 (eg, pressure sensitive adhesive PSA).
  • the adhesive layer 211 eg, pressure sensitive adhesive PSA.
  • Display panel manufacturers can print ink on the first glass substrate of the array substrate after manufacturing or obtaining the array substrate, so as to obtain an ink printing layer with higher printing accuracy and reduce or avoid the non-display area of the array substrate. The problem of external reflection or backlight leakage from metal wires.
  • a first polarizer 203 is provided first, and then ink 2071 is printed on the surface of the first polarizer 203 to form ink as the first light shielding layer 207 printing layer, and then an adhesive layer 211 (for example, Pressure Sensitive Adhesive, PSA for short) is arranged on the surface of the first polarizer 203 printed with ink 2071, and then the array substrate 201 is kept away from the color filter substrate by the adhesive layer 211.
  • PSA Pressure Sensitive Adhesive
  • the polarizer manufacturer can entrust the ink printing factory to print ink on the first polarizer, and then compound the adhesive layer and the release film on the first polarizer with the printed ink to form the first polarizer product with the ink printing layer.
  • the display panel manufacturer can bond the purchased first polarizer product to the array substrate. This method eliminates the need for display panel manufacturers to purchase expensive ink printing equipment, which can effectively reduce production costs.
  • the first light shielding layer 207 formed by ink printing is located on the side of the first polarizer 203 away from the array substrate 201 .
  • the first polarizer 203 may include a TAC layer, a PVA layer and a TAC layer stacked in sequence.
  • a protective film and a release film may also be attached to the upper and lower surfaces of the first polarizer 207, and the protective film and the release film may be removed during subsequent processing.
  • a functional film layer 212 with a specific protective function can be provided on the side of the first light shielding layer 207 away from the array substrate 201, for example Surface hardening layer HC (Hard Coating), anti-reflection and anti-reflection layer AR (Anti-Reflection), anti-glare layer AG (Anti-Glare), anti-fingerprint layer AF (Anti-Fingerprint) and antibacterial layer AM (Anti-Microbe) at least one of.
  • HC Hard Coating
  • anti-reflection and anti-reflection layer AR Anti-Reflection
  • anti-glare layer AG Anti-Glare
  • anti-fingerprint layer AF Anti-Fingerprint
  • antibacterial layer AM Anti-Microbe
  • the first polarizer 203 is provided first, and then the first polarizer 203 is attached to the back side of the array substrate 201 (ie, on the first base substrate 2011 ). The surface of the side away from the color filter substrate 202), and then the ink 2071 is printed on the surface of the first polarizer 203 away from the array substrate to form the ink printing layer as the first light shielding layer 207, and then on the first polarizer 203.
  • a functional film layer 212 is provided on the side of the polarizer 203 on which the ink 2071 is printed.
  • the display panel manufacturer can obtain the first polarizer from the polarizer manufacturer, attach it to the fabricated array substrate, print ink on the first polarizer, and set the functional film layer 212 .
  • the manufacturing process of this method is simple, and has little influence on the manufacturing process of the existing display panel.
  • a first polarizer 203 is provided first, and then ink 2071 is printed on the surface of the first polarizer 203 to form ink as the first light shielding layer 207 Then, a functional film layer 212 is arranged on the surface of the first polarizer 203 on which the ink 2071 is printed, and then the surface of the first polarizer 203 away from the functional film layer 212 is attached to the array substrate 201 away from the color The surface of the film substrate 202 side.
  • Polarizer manufacturers can entrust ink printing manufacturers or print ink on the first polarizer by themselves, and then compound functional film layers on the first polarizer that has been printed with ink to form a first polarizer product with an ink printed layer.
  • the display panel manufacturer can bond the purchased first polarizer product to the array substrate. This method eliminates the need for display panel manufacturers to purchase expensive ink printing equipment, which can effectively reduce production costs.
  • a first polarizer 203 is provided first, and then a substrate 213 (eg, polyterephthalate) printed with ink 2071 is attached to the surface of the first polarizer 203 Ethylene glycol formate PET or TAC), that is, a substrate 213 containing an ink printed layer as the first light shielding layer 207 is attached to the surface of the first polarizer 203 . Then, the surface of the first polarizer 203 on the side away from the ink printing layer is attached to the surface of the array substrate 201 on the side away from the color filter substrate 202 .
  • a substrate 213 eg, polyterephthalate
  • the polarizer manufacturer can directly purchase the substrate printed with ink, and attach the substrate to the first polarizer to form the first polarizer product with the printed ink layer.
  • the display panel manufacturer can bond the purchased first polarizer product to the array substrate. This method eliminates the need for polarizer manufacturers and display panel manufacturers to purchase expensive ink printing equipment, which can effectively reduce production costs.
  • a first polarizer 203 is provided first, and then the first polarizer 203 is attached to the back side of the array substrate 201 (ie, on the first base substrate 2011 ).
  • the surface of the side away from the color filter substrate 202 ), and then the substrate 213 (such as polyethylene terephthalate PET or TAC) printed with the ink 2071 is pasted on the surface of the first polarizer 203, that is, containing as The base material of the ink printing layer of the first light shielding layer 207 .
  • the display panel manufacturer may purchase the first polarizer from the polarizer manufacturer, and purchase the substrate containing ink, so as to realize the bonding of the first polarizer, the substrate and the array substrate. In this way, the display panel manufacturer does not need to purchase expensive ink printing equipment, which can effectively reduce production costs, and does not need to customize a specific first polarizer product to the polarizer manufacturer, which is also conducive to reducing costs.
  • the array substrate further includes: a second anti-reflection layer 2071 and a second metal layer 2072, the second anti-reflection layer 2071 is located on the first base substrate 2011, and the second metal layer 2072 It is located on the side of the second anti-reflection layer 2071 away from the first base substrate 2011 .
  • the second anti-reflection layer 2071, the second metal layer 2072 and the gate driving circuit 210 are all located in the non-display area W, and the second anti-reflection layer 2071 and the second metal layer 2072 are located in the first The portion where the orthographic projections on the base substrate 2011 overlap with each other at least partially cover the orthographic projection of the gate driving circuit 210 on the first base substrate 2011 .
  • the second anti-reflection layer 2071 and the second metal layer 2072 stacked in this way constitute a light-shielding layer structure 207' that shields the gate driving circuit in the non-display area, which is equivalent to a light-shielding layer integrated in the array substrate.
  • a layer of metal oxide eg, molybdenum metal oxide
  • a layer of metal oxide can be deposited on the surface of the first base substrate 2011 , and then a layer of metal oxide can be deposited on the layer of metal oxide.
  • a metal eg, aluminum, etc.
  • the second anti-reflection layer 2071 can be prepared by the same patterning process as the first anti-reflection layer 2012 in the foregoing embodiments, so as to save the process.
  • the first insulating layer 2014 may be formed on one side of the first base substrate 2011 adjacent to the color filter substrate 202 and cover the gate metal layer and the second metal layer 2072 of the first thin film transistor.
  • FIG. 11 and FIG. 12 are partial structural schematic diagrams of the display area and the periphery on the array substrate in some embodiments of the display device of the present disclosure, respectively.
  • the array substrate 201 further includes: a plurality of first thin film transistors 2019 and a plurality of second thin film transistors 2019'.
  • a plurality of first thin film transistors 2019 are located in the display area AA.
  • a plurality of second thin film transistors 2019 ′ are located in the non-display area W (framed by dotted lines in FIG. 11 and FIG. 12 ), and along a row with the plurality of first thin film transistors 2019 located at the edge of the display area Or a row of the first thin film transistors 2019 is adjacent.
  • the first thin film transistor 2019 and the second thin film transistor 2019' both include a gate electrode 2019a, an active layer 2019b and a source electrode 2019c.
  • the difference between the two is that the first thin film transistor 2019 located in the display area AA also includes The drain electrode 2019d is electrically connected to the pixel electrode 2018, and the second thin film transistor 2019 located in the non-display area W does not include a drain electrode.
  • the first thin film transistor 2019 and the second thin film transistor 2019' both include a gate electrode 2019a, a source electrode 2019c and a drain electrode 2019d.
  • the first thin film transistor 2019 located in the display area AA also includes a The drain electrode 2019d and the gate electrode 2019a are electrically connected to the active layer 2019b, while the second thin film transistor 2019' located in the non-display area W does not include the active layer 2019b.
  • FIG. 13 is a schematic diagram of a partial structure of the display device shown in FIG. 2 .
  • FIG. 14 is a partial structural schematic diagram of an embodiment of the display device of the present disclosure.
  • the array substrate 201 includes: a first part P 1 and a second part P 2 .
  • the orthographic projection of the first portion P 1 on the back portion 31 completely coincides with the orthographic projection of the color filter substrate 202 on the back portion 31
  • the orthographic projection of the second portion P 2 on the back portion 31 is the same as
  • the orthographic projections of the color filter substrate 202 on the back surface portion 31 do not overlap each other.
  • the first portion of the array substrate 201 is a portion facing the color filter substrate 202 and having the same shape and area
  • the second portion is a portion other than the first portion of the array substrate 201 .
  • the orthographic projection of the backlight module 01 on the back portion 31 and the orthographic projection of the array substrate 201 on the back portion 31 may completely coincide (eg, as shown in FIGS. 8 and 9 ).
  • the orthographic projection of the backlight module 01 on the back portion 31 may be located within the orthographic projection of the array substrate 201 on the back portion 31 to avoid other elements in the housing 03 , such as Sensors such as photosensitive units.
  • the display module 02 further includes: a flexible circuit board 05 on the side of the second portion P 2 of the array substrate 201 adjacent to the color filter substrate 202 , and a driving circuit board 06 electrically connected to the flexible circuit board 05 .
  • a flexible circuit board 05 on the side of the second portion P 2 of the array substrate 201 adjacent to the color filter substrate 202
  • a driving circuit board 06 electrically connected to the flexible circuit board 05 .
  • the second part P 2 , the backlight module 01 , the color filter substrate 202 and the side part 32 enclose an accommodating space. In this way, at least part of the flexible circuit board 05 and the driving circuit board 06 can be bent and arranged in the accommodating space.
  • the display device further includes a hollow rotating shaft 07 disposed on the casing 03 , and the hollow rotating shaft 07 may be located at an edge of one side of the casing 03 .
  • An antenna 71 can be arranged in the hollow shaft 07 . If there is a spare space in the hollow shaft 07, at least part of the flexible circuit board 05 and the driving circuit board 06 can also be installed in the space so that they can be bent.
  • the embodiment of the present disclosure by arranging the driving circuit board 06 and at least part of the flexible circuit board 05 in the accommodating space or the hollow shaft 07, the display module 02 and the housing 03 can be directly overlapped, and the protective cover is omitted.
  • the distance W 1 ′ (refer to FIG. 13 ) that the board 04 and the casing 03 overlap, the lower frame DB of the whole machine is completely constituted by the lower frame W 1 of the display module 02 (refer to FIG. 14 ).
  • the embodiment of the present disclosure can effectively reduce the size of the frame, further increase the screen ratio of the display device, and is conducive to realizing a full-screen structure.
  • the display device further includes: a photosensitive unit 08 , such as a front-facing camera.
  • the photosensitive unit 08 is disposed in the housing 03 and is located on the side of the color filter substrate 202 away from the array substrate 201 , and the photosensitive unit 08 is located in the non-display area W.
  • the front integration effect can be obtained, and other methods, such as adding decorative strips, are used to set the photosensitive unit in the process.
  • the external camera method has the problems of inconvenient portability and charging, and ID design conflicts.
  • FIG. 15 and FIG. 16 are schematic diagrams of the arrangement of the second light-shielding layer and the first sealant of the display module in some embodiments of the display device of the present disclosure, respectively.
  • FIG. 17 is a schematic cross-sectional view of still another embodiment of the display device of the present disclosure.
  • FIG. 18 and FIG. 19 are schematic diagrams of the arrangement of the second light-shielding layer, the first sealant and the second sealant of the display module in some embodiments of the display device of the present disclosure, respectively.
  • 20-22 are schematic diagrams of relative positions of the photosensitive unit and the second light shielding layer in some embodiments of the display device of the present disclosure, respectively.
  • the display module 02 further includes: a second light shielding layer 209 .
  • the second light shielding layer 209 is located on a side of the photosensitive unit 08 adjacent to the color filter substrate, and has a first hollow area 2091 .
  • the orthographic projection of the light incident area 81 of the photosensitive unit 08 on the array substrate 201 at least partially overlaps with the orthographic projection of the first hollow area 2091 of the second light shielding layer 209 on the array substrate 201 .
  • the photosensitive unit 08 can capture the image outside the display module 02 through the light incident area 81 . Referring to the inverted triangle part of the photosensitive unit 08 shown in FIG. 20-FIG. 22, this part represents the photosensitive element of the photosensitive unit 08, and the range of the light incident area 81 of the photosensitive unit 08 corresponds to the bottom surface of the inverted triangle.
  • the first hollow area 2091 can ensure the lighting of the light incident area 81 of the photosensitive unit 08 .
  • the ambient light except the first hollow area 2091 is blocked by the second light shielding layer 209 , so as to control the light receiving range of the photosensitive unit 08 .
  • the second light shielding layer 209 and the first light shielding layer 207 may be formed through a single patterning process to save processes.
  • the first hollow area 2091 may be disposed in the middle of the upper frame area W 2 of the display module 02 .
  • the upper frame area W2 can be set to be partially convex outward relative to the display area, so as to reduce the size of the frame on both sides of the photosensitive unit 08 and achieve the effect of a narrow frame.
  • the partial protrusion can be embedded in the casing 03, and the embedded part of the casing 03 can be chamfered, so as to be more coordinated on the whole of the display device.
  • the first hollow area 2091 may be disposed in the non-display area in other directions, such as the lower border area W 1 , the left border area W 3 , and the right border area W 4 , and may be disposed near the edge of the non-display area. s position.
  • the display module 02 further includes: a liquid crystal layer 208 and a first sealant 205 .
  • the liquid crystal layer 208 is located between the array substrate 201 and the color filter substrate 202 .
  • the first sealant 205 is located between the color filter substrate 202 and the array substrate 201 and encloses the liquid crystal layer 208 .
  • the orthographic projection of the light incident area 81 of the photosensitive unit 08 on the array substrate 201 or the orthographic projection of the first hollow area 2091 of the second light shielding layer 209 on the array substrate 201 is located in the The liquid crystal layer 208 is in the orthographic projection of the array substrate 201 . In this way, the external light enters the photosensitive unit 08 through the liquid crystal layer 208 .
  • the display module 02 further includes: a liquid crystal layer 208, a first sealant 205 and a second sealant 205'.
  • the liquid crystal layer 208 is located between the array substrate 201 and the color filter substrate 202 .
  • the first sealant 205 is located between the color filter substrate 202 and the array substrate 201 and encloses the liquid crystal layer 208 .
  • the second sealant 205' is located between the color filter substrate 202 and the array substrate 201, and together with the first sealant frame encloses a vacuum area 2081.
  • the orthographic projection of the light incident area 81 of the photosensitive unit 08 on the array substrate 201 or the orthographic projection of the first hollow area 2091 of the second light shielding layer 209 on the array substrate 201 is located in the vacuum area 2081 on the array substrate 201 . within the orthographic projection of the substrate 201 . In this way, external light enters the photosensitive unit 08 through the vacuum region 2081 .
  • the structure shown in FIG. 4 can reduce the coating amount of the sealant.
  • the structure shown in FIG. 4 can reduce the size of the non-display area corresponding to the photosensitive element 08, when cutting the display panel from the motherboard, it can be cut along the sealing frame, that is, the frame sealing tape is glued, so that the width of the frame sealing glue itself can be reduced. Further reduction, for example, reduction by 0.4 to 0.7 mm.
  • the thickness of the array substrate 201 and the color filter substrate 202 can be set to 0.2-0.5 mm
  • the thickness of the first polarizer 203 and the second polarizer 204 can be set to 0.08-0.15 mm
  • the cell thickness can be set to 2.5- 3.5 ⁇ m
  • the thickness of the second light shielding layer 209 can be set to 3-5 ⁇ m
  • the size of the first hollow area 2091 can be determined according to the size of the light incident area 81 of the photosensitive unit 08 on the outside of the display module (ie the side away from the backlight module).
  • the viewing angle 82 can be adjusted, for example, the aperture is set to 2 ⁇ 3 mm, and the aperture of the light incident area 81 of the photosensitive unit 08 can be set to 2.0 ⁇ 2.5 mm.
  • the air refractive index n1 1.0, the array substrate and the first
  • the angle of refraction becomes smaller. The light travels in a straight line in the glass, and will be refracted again at the interface between the color filter substrate and the second polarizer and the air interface, and finally the light enters the photosensitive unit 08, thereby realizing light collection.
  • the viewing angle 82 of the light incident area 81 of the photosensitive unit 08 outside the display module is generally 70-90° to meet the requirements.
  • the viewing angle can be adjusted by adjusting the size of the first hollow area 2091 .
  • the second light shielding layer 209 includes: an ink light shielding layer located on the side of the array substrate 201 away from the color filter substrate 202 .
  • the second light shielding layer 209 may be disposed between the first polarizer 203 and the array substrate 201 .
  • the second light shielding layer 209 may also be disposed in the first polarizer 203 or on a side of the first polarizer 203 away from the base substrate 201 . Referring to the above-mentioned embodiment of disposing the first light shielding layer 207 in (A)-(F) of FIG.
  • the second light shielding layer 209 can be formed together with the first light shielding layer 207 , for example, by forming the array substrate 201 or the first polarizer
  • the second light shielding layer 209 and the first light shielding layer 207 are formed at one time by printing ink on 203, thereby reducing the number of steps.
  • the second light shielding layer 209 includes: an ink light shielding layer located on the surface of the color filter substrate 202 adjacent to the photosensitive unit 08 side. Compared with the structure shown in FIG. 20 , this structure realizes the smaller-sized first hollow area 2091 under the condition of realizing the same viewing angle.
  • the second light shielding layer 209 includes: a black matrix in the color filter substrate 202 .
  • the black matrix in the color filter substrate is more fully utilized to realize the viewing angle 82 of the light incident area 81 of the photosensitive unit 08.
  • the ink printing process can be omitted, thereby realizing Cost reduction and process simplification.
  • the thickness of the black matrix can be set to 1-2 ⁇ m, which is not only higher in the light-shielding effect than the ink light-shielding layer with a thickness of 3-5 ⁇ m, but also has a smaller step difference relative to the base substrate to avoid ink-shielding. In order to smooth out the level difference, the layer tends to generate defects such as air bubbles.
  • FIG. 23 is a schematic diagram of the arrangement of the second light-shielding layer and the second hollow area of the display module in an embodiment of the display device of the present disclosure.
  • 24 is a schematic diagram of relative positions of the light incident area, the first hollow area and the second hollow area in an embodiment of the display device of the present disclosure.
  • the first polarizer 203 has a second hollow area 2031 .
  • the orthographic projection of the light incident area 81 of the photosensitive unit 08 on the array substrate 201 or the orthographic projection of the first hollow area 2091 of the second light shielding layer 209 on the array substrate 201 is located on the first polarizer 203 .
  • the two hollow regions 2031 are in the orthographic projection of the array substrate 201 .
  • the polarizer material corresponding to the second hollow area 2031 can be removed by cutting the polarizer in the second hollow area 2031 .
  • FIG. 25 is a schematic diagram of relative positions of the light incident area, the first hollow area and the depolarization area in an embodiment of the display device of the present disclosure.
  • the first polarizer 203 has a depolarization region 2032 .
  • the orthographic projection of the light incident area 81 of the photosensitive unit 08 on the array substrate 201 or the orthographic projection of the first hollow area 2091 of the second light shielding layer 209 on the array substrate 201 is located on the first polarizer 203 .
  • the two hollow regions 2031 or the depolarization regions 2032 are in the orthographic projection of the array substrate 201 .
  • a protective film with a hollowed-out area is attached on the PVA layer, and then the PVA layer is partially depolarized, that is, the hollowed area of the protective film is removed.
  • Corresponding polarizer material is then removed, and then other film layers, such as a PSA layer, a TAC layer and a protective film layer, are arranged on the PVA layer.
  • FIG. 26 is a schematic flowchart of an embodiment of a method for manufacturing a display device of the present disclosure.
  • the method for manufacturing the aforementioned display device includes the following steps S100 to S400:
  • Step S100 providing a display panel having a display area and a non-display area surrounding the display area, the display panel including an array substrate and a color filter substrate arranged oppositely, the array substrate including a grid located in the non-display area Drive circuit.
  • a plurality of display panels may be fabricated on a motherboard.
  • the display panel includes an array substrate 201 and a color filter substrate 202 facing each other, a liquid crystal layer 208 between the array substrate 201 and the color filter substrate 202 , and a first sealing frame 205 sealing the array substrate 201 and the color filter substrate 202 .
  • the formation process of the array substrate 201 includes:
  • a first metal layer 2013 is formed on the side of the first anti-reflection layer 2012 away from the first base substrate 2011, wherein the orthographic projection of the first metal layer 2013 on the first base substrate 2011 is the same as the The orthographic projection of the first anti-reflection layer 2012 on the first base substrate 2011 is completely coincident, or located within the orthographic projection of the first anti-reflection layer 2012 on the first base substrate 2011 .
  • the process of forming the first antireflection layer 2012 and the first metal layer 2013 can be implemented in the following two ways:
  • the first implementation method is to sequentially form an anti-reflection film and a metal film on the first base substrate 2011; and perform a mask process on the metal film and the anti-reflection film to form the first anti-reflection layer 2012 and the first anti-reflection layer 2012 and the first anti-reflection layer with the same pattern.
  • the second possible implementation is to form an anti-reflection film on the first base substrate 2011, and perform a mask process on the anti-reflection film to form a first pattern with the same pattern as the subsequent gate metal layer and source and drain metal layers.
  • a plurality of independent single-piece display panels can be cut from the motherboard by means of cutter wheel cutting.
  • a single-piece display panel can be cut into a special shape, and the rounded corners of the display panel can be cut by grinding and laser cutting.
  • Step S200 A first polarizer is attached to the array substrate, and a first light shielding layer is formed on the side of the array substrate away from the color filter substrate, and the first light shielding layer is on the positive side of the array substrate.
  • the projection is located in the non-display area and at least partially covers the gate driving circuit.
  • the first light shielding layer can be formed by screen transfer or inkjet, which can eliminate the reflection problem of GOA and metal traces in the non-display area of the array substrate.
  • the method also includes attaching a second polarizer on the color filter substrate.
  • the size of the second polarizer 204 on the color filter substrate 202 may be smaller than that of the display panel, and the size of the first polarizer 203 on the array substrate 201 may be larger than that of the array substrate 201 .
  • Cutting the first polarizer 203 beyond the array substrate 201 by scanning the peripheral track of the array substrate 201 with a carbon dioxide laser can ensure that the first polarizer 203 and the array substrate 201 are completely aligned.
  • Step S300 Bind the driver chip 206 on the array substrate to which the first polarizer has been attached, and bind one end of the flexible circuit board 05 to the array substrate 201 and the other end to the driver circuit board 06 , to form the display module 02 .
  • Step S400 Provide a casing 03 and a backlight module 01, install the backlight module 01 and the display module 02 in the casing 01 in sequence, and make the color filter substrate 202 located between the array substrate 201 and the array substrate 201. between the backlight modules 01.
  • the parts of the backlight module 01 and the display module 02 that are in contact with the housing 03 can be bonded by tape or glue to play a fixing role.
  • the driving circuit board 06 can be fixed in the hollow shaft 07 by tape, screws, etc. or bent and fixed in the hollow shaft 07. In the accommodating space enclosed by the array substrate 201 , the backlight module 01 , the color filter substrate 202 and the side part, the assembly of the whole display device is completed so far.
  • the patterning process involved in forming each layer structure may not only include deposition, photoresist coating, mask masking, exposure, development, etching, Part or all of the photoresist stripping and other process processes may also include other process processes, which are specifically subject to the desired patterning pattern formed in the actual manufacturing process, which is not limited here.
  • a post-bake process may also be included after development and before etching.
  • the deposition process can be chemical vapor deposition, plasma enhanced chemical vapor deposition or physical vapor deposition, which is not limited here;
  • the mask used in the mask process can be a half tone mask (Half Tone Mask). ), a single slit diffraction mask (Single Slit Mask) or a gray tone mask (Gray Tone Mask), which is not limited here;
  • the etching can be dry etching or wet etching, which is not limited here.
  • the manufacturing method of the display device may further include: arranging a photosensitive unit in the housing, and locating the photosensitive unit on a side of the color filter substrate away from the array substrate.
  • the step of forming the display module may further include: forming a second light shielding layer on the side of the photosensitive unit adjacent to the color filter substrate, the second light shielding layer has a first hollow area, and the photosensitive unit The orthographic projection of the light incident region on the array substrate at least partially coincides with the orthographic projection of the first hollow region of the second light shielding layer on the array substrate.
  • the forming step of the array substrate may further include: forming a second anti-reflection layer on the first base substrate; and placing the second anti-reflection layer away from the first substrate A second metal layer is formed on one side of the base substrate; a gate driving circuit is formed on the side of the second metal layer away from the first base substrate, wherein the second anti-reflection layer, the second metal layer layer and the gate driving circuit are both located in the non-display area, and the overlapping part of the orthographic projections of the second anti-reflection layer and the second metal layer on the first base substrate at least partially covers orthographic projection of the gate driving circuit on the first base substrate.
  • the first anti-reflection layer and the second anti-reflection layer may be prepared through the same patterning process.
  • the array substrate is turned upside down for use, and the first polarizer on the array substrate is multiplexed into a protective cover, which avoids the need for a separate protective cover and saves the bonding of the protective cover. Therefore, the display device can be made lighter and thinner, the manufacturing process is simplified, and the product yield is improved.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种显示装置，包括：背光模组(01)；显示模组(02)，位于背光模组(01)的出光侧；和外壳(03)，容置背光模组(01)和显示模组(02)。显示模组(02)包括：显示面板，显示面板包括相对设置的阵列基板(201)和彩膜基板(202)。彩膜基板(202)位于阵列基板(201)与背光模组(01)之间。第一偏光片(203)位于阵列基板(201)远离彩膜基板(202)的一侧。还提供了一种显示装置的制造方法。

Description

显示装置及显示装置的制造方法
相关申请的交叉引用
本申请是以CN申请号为202010951337.6，申请日为2020年9月11日的申请为基础，并主张其优先权，该CN申请的公开内容在此作为整体引入本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示装置及显示装置的制造方法。
背景技术
在一些相关技术的笔记本电脑中，所用的液晶显示装置主要由显示模组和整机外框构成，显示模组包括显示面板、上偏光片和下偏光片。显示面板包括通过封框胶粘合的阵列基板和彩膜基板，上偏光片和下偏光片分别贴附在在上的彩膜基板和在下的阵列基板。因为驱动芯片需要绑定在阵列基板上导致阵列基板超出彩膜基板，整机外框通过边缘的边框将模组单元进行固定。
随着笔记本电脑触控化的趋势，在另一些相关技术的笔记本电脑中，所用的液晶显示装置进一步增加了保护盖板，保护盖板和显示模组通过贴合进行固定，并且保护盖板的尺寸超出显示模组的尺寸，超出部分与整机的外壳进行粘合固定。该结构取消了外壳与显示模组搭接部分的设计，整个液晶显示装置表面是完全平整的，外观更加美观。在进行触控操作时，边缘部分不会造成干涉，更加有利于触控操作。
发明内容
根据本公开的一个方面，提供一种显示装置，包括：背光模组；显示模组，位于所述背光模组的出光侧；和外壳，容置所述背光模组和所述显示模组，其中，所述显示模组包括：显示面板，所述显示面板包括相对设置的阵列基板和彩膜基板，所述彩膜基板位于所述阵列基板与所述背光模组之间；和第一偏光片，位于所述阵列基板远离所述彩膜基板的一侧。
在一些实施例中，所述显示面板具有显示区域和环绕所述显示区域的非显示区域，所述显示装置还包括：感光单元，设置在所述外壳内，且位于所述彩膜基板远离所述阵列基板的一侧，所述感光单元位于所述非显示区域。
在一些实施例中，所述显示模组还包括：第二遮光层，位于所述感光单元邻近所述彩膜基板的一侧，且有第一镂空区域，其中，所述感光单元的入光区域在所述阵列基板的正投影与所述第二遮光层的第一镂空区域在所述阵列基板的正投影至少部分地重合。
在一些实施例中，所述第二遮光层包括：位于所述阵列基板远离所述彩膜基板一侧的油墨遮光层；或位于所述彩膜基板邻近所述感光单元一侧的表面的油墨遮光层；或位于所述彩膜基板内的黑色矩阵。
在一些实施例中，所述第一偏光片具有第二镂空区域或去偏振区域，所述感光单元的入光区域在所述阵列基板的正投影或所述第二遮光层的第一镂空区域在所述阵列基板的正投影位于所述第一偏光片的第二镂空区域或去偏振区域在所述阵列基板的正投影内。
在一些实施例中，所述显示面板还包括：液晶层，位于所述阵列基板和所述彩膜基板之间；和第一封框胶，位于所述彩膜基板和所述阵列基板之间且围封所述液晶层。
在一些实施例中，所述阵列基板包括：第一衬底基板；第一减反层，位于所述第一衬底基板上；和第一金属层，位于所述第一减反层邻近所述背光模组的一侧，其中，所述第一金属层在所述第一衬底基板上的正投影与所述第一减反层在所述第一衬底基板上的正投影完全重合，或位于所述第一减反层在所述第一衬底基板上的正投影内。
在一些实施例中，所述显示面板具有显示区域和环绕所述显示区域的非显示区域，所述阵列基板包括位于所述非显示区域的栅极驱动电路，所述显示模组还包括：第一遮光层，位于所述阵列基板远离所述背光模组的一侧，其中，所述第一遮光层在所述阵列基板的正投影位于所述非显示区域，且至少部分地覆盖所述栅极驱动电路。
在一些实施例中，所述第一遮光层包括：位于所述第一偏光片与所述阵列基板之间的油墨印刷层，所述油墨印刷层与所述第一偏光片或所述阵列基板接触；或位于所述第一偏光片远离所述阵列基板的一侧的油墨印刷层。
在一些实施例中，所述显示面板具有显示区域和环绕所述显示区域的非显示区域，所述阵列基板包括：第一衬底基板；第二减反层，位于所述第一衬底基板上；第二金属层，位于所述第二减反层远离所述第一衬底基板的一侧；和栅极驱动电路，位于所述第二金属层远离所述第一衬底基板的一侧，其中，所述第二减反层、所述第二金属层和所述栅极驱动电路均位于所述非显示区域，所述第二减反层和所述第二金属 层在所述第一衬底基板上的正投影互相重合的部分至少部分地覆盖所述栅极驱动电路在所述第一衬底基板上的正投影。
在一些实施例中，所述阵列基板还包括：多个第一薄膜晶体管，位于所述显示区域；和多个第二薄膜晶体管，位于所述非显示区域，且与所述多个第一薄膜晶体管中位于所述显示区域边缘的一行或一列第一薄膜晶体管相邻，其中，所述多个第二薄膜晶体管中的至少一个不包含漏极金属层或有源层。
在一些实施例中，所述外壳包括：位于所述背光模组远离所述彩膜基板的一侧的背面部分和与所述背面部分连接的多个侧面部分，所述多个侧面部分和所述背面部分形成所述外壳的内部空间；所述阵列基板包括：第一部分，第一部分在所述背面部分上的正投影与所述彩膜基板在所述背面部分上的正投影完全重合或部分重合；和第二部分，所述第二部分在所述背面部分上的正投影与所述彩膜基板在所述背面部分上的正投影互不交叠，其中，所述背光模组在所述背面部分上的正投影与所述阵列基板在所述背面部分的正投影完全重合或位于所述阵列基板在所述背面部分的正投影内，所述第二部分、所述背光模组、所述彩膜基板与所述侧面部分围出一容置空间；所述显示模组还包括：位于所述第二部分邻近所述彩膜基板一侧的柔性电路板和与所述柔性电路板电连接的驱动电路板，所述驱动电路板和至少部分所述柔性电路板设置在所述容置空间内。
根据本公开的一个方面，提供一种显示装置的制造方法，包括：提供具有显示区域和环绕所述显示区域的非显示区域的显示面板，所述显示面板包括相对设置的阵列基板和彩膜基板，所述阵列基板包括位于所述非显示区域的栅极驱动电路；在所述阵列基板上贴附第一偏光片，并在所述阵列基板远离所述彩膜基板的一侧形成第一遮光层，所述第一遮光层在所述阵列基板的正投影位于所述非显示区域，且至少部分地覆盖所述栅极驱动电路；在已贴附所述第一偏光片的阵列基板上绑定驱动芯片，并将柔性电路板的一端绑定在所述阵列基板上，另一端连接在驱动电路板上，以形成显示模组；提供外壳和背光模组，将所述背光模组和所述显示模组依次安装在所述外壳内，并使所述彩膜基板位于所述阵列基板与所述背光模组之间。
在一些实施例中，在所述阵列基板上贴附第一偏光片，并在所述阵列基板远离所述彩膜基板的一侧形成第一遮光层的步骤包括步骤a)-步骤f)中的至少一种：a)在所述阵列基板远离所述彩膜基板一侧的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，并在所述阵列基板印有油墨的一侧通过胶层贴附所述第一偏光片；b)在所 述第一偏光片的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，并将所述第一偏光片印有油墨的一侧通过胶层贴附在所述阵列基板远离所述彩膜基板一侧的表面；c)在所述阵列基板远离所述彩膜基板一侧的表面通过胶层贴附所述第一偏光片，并在所述第一偏光片远离所述彩膜基板一侧的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，然后在所述第一偏光片印有油墨的一侧设置功能膜层；d)在所述第一偏光片的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，并在所述第一偏光片印有油墨的一侧设置功能膜层，然后将所述第一偏光片远离所述功能膜层一侧的表面贴附在所述阵列基板远离所述彩膜基板一侧的表面；e)在所述第一偏光片的表面贴附含有作为所述第一遮光层的油墨印刷层的基材，并将所述第一偏光片远离所述油墨印刷层一侧的表面贴附在所述阵列基板远离所述彩膜基板一侧的表面；f)将所述第一偏光片贴附在所述阵列基板远离所述彩膜基板一侧的表面，并在所述第一偏光片远离所述阵列基板一侧的表面贴附含有作为所述第一遮光层的油墨印刷层的基材。
在一些实施例中，所述制造方法还包括：将感光单元设置在所述外壳内，并使所述感光单元位于所述彩膜基板远离所述阵列基板的一侧；其中，形成显示模组的步骤还包括：在所述感光单元邻近所述彩膜基板的一侧形成第二遮光层，所述第二遮光层具有第一镂空区域，所述感光单元的入光区域在所述阵列基板的正投影与所述第二遮光层的第一镂空区域在所述阵列基板的正投影至少部分地重合。
在一些实施例中，所述阵列基板的形成步骤包括：提供第一衬底基板；在所述第一衬底基板上形成第一减反层；在所述第一减反层远离所述第一衬底基板的一侧形成第一金属层，所述第一金属层在所述第一衬底基板上的正投影与所述第一减反层在所述第一衬底基板上的正投影完全重合，或位于所述第一减反层在所述第一衬底基板上的正投影内。
在一些实施例中，所述阵列基板的形成步骤还包括：在所述第一衬底基板上形成第二减反层；在所述第二减反层远离所述第一衬底基板的一侧形成第二金属层；在所述第二金属层远离所述第一衬底基板的一侧形成栅极驱动电路，其中，所述第二减反层、所述第二金属层和所述栅极驱动电路均位于所述非显示区域，所述第二减反层和所述第二金属层在所述第一衬底基板上的正投影互相重合的部分至少部分地覆盖所述栅极驱动电路在所述第一衬底基板上的正投影。
在一些实施例中，所述第一减反层和所述第二减反层通过同一次构图工艺制备。
附图说明
构成说明书的一部分的附图描述了本公开的实施例，并且连同说明书一起用于解释本公开的原理。
参照附图，根据下面的详细描述，可以更加清楚地理解本公开，其中：
图1是相关技术中笔记本电脑的液晶显示装置的结构示意图；
图2是另一种相关技术中笔记本电脑的液晶显示装置的结构示意图；
图3是本公开显示装置的一实施例的整体结构示意图；
图4是图3中BB截面的结构示意图；
图5是图3中CC截面的结构示意图；
图6是本公开显示装置的另一实施例的整体结构示意图；
图7是本公开显示装置的一实施例中显示模组的结构示意图；
图8是本公开显示装置的一实施例的截面示意图；
图9是本公开显示装置的另一实施例的截面示意图；
图10的(A)-(F)是本公开显示装置的一些实施例在制备过程中在阵列基板上贴附第一偏光片，并形成第一遮光层的多种方法的示意图；
图11和图12分别是本公开显示装置的一些实施例中阵列基板上显示区域及周边的局部结构示意图；
图13是图2所示的显示装置的局部结构示意图；
图14是本公开显示装置的一实施例的局部结构示意图；
图15和图16分别是本公开显示装置的一些实施例中显示模组的第二遮光层和第一封框胶的设置示意图；
图17是本公开显示装置的再一实施例的截面示意图；
图18和图19分别是本公开显示装置的一些实施例中显示模组的第二遮光层、第一封框胶和第二封框胶的设置示意图；
图20-图22分别是本公开显示装置的一些实施例中感光单元和第二遮光层的相对位置示意图；
图23是本公开显示装置的一实施例中显示模组的第二遮光层和第二镂空区域的设置示意图；
图24是本公开显示装置的一实施例中入光区域、第一镂空区域和第二镂空区域的相对位置示意图；
图25是本公开显示装置的一实施例中入光区域、第一镂空区域和去偏振区域的相对位置示意图；
图26是本公开显示装置的制造方法的一实施例的流程示意图。
应当明白，附图中所示出的各个部分的尺寸并不是按照实际的比例关系绘制的。此外，相同或类似的参考标号表示相同或类似的构件。
具体实施方式
现在将参照附图来详细描述本公开的各种示例性实施例。对示例性实施例的描述仅仅是说明性的，决不作为对本公开及其应用或使用的任何限制。本公开可以以许多不同的形式实现，不限于这里所述的实施例。提供这些实施例是为了使本公开透彻且完整，并且向本领域技术人员充分表达本公开的范围。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、材料的组分、数字表达式和数值应被解释为仅仅是示例性的，而不是作为限制。
本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的部分。“包括”或者“包含”等类似的词语意指在该词前的要素涵盖在该词后列举的要素，并不排除也涵盖其他要素的可能。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
在本公开中，当描述到特定器件位于第一器件和第二器件之间时，在该特定器件与第一器件或第二器件之间可以存在居间器件，也可以不存在居间器件。当描述到特定器件连接其它器件时，该特定器件可以与所述其它器件直接连接而不具有居间器件，也可以不与所述其它器件直接连接而具有居间器件。
本公开使用的所有术语(包括技术术语或者科学术语)与本公开所属领域的普通技术人员理解的含义相同，除非另外特别定义。还应当理解，在诸如通用字典中定义的术语应当被解释为具有与它们在相关技术的上下文中的含义相一致的含义，而不应用理想化或极度形式化的意义来解释，除非这里明确地这样定义。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
如图1所示，为相关技术中笔记本电脑的液晶显示装置的结构示意图。该液晶显示装置主要由背光模组01、显示模组02和整机的外壳03构成，其中显示模组02包 括阵列基板201、彩膜基板202、在阵列基板201上贴附的第一偏光片203、在彩膜基板202上贴附的第二偏光片204，以及粘合阵列基板201与彩膜基板202的第一封框胶205。因为驱动芯片206需要绑定(bonding)在阵列基板201上导致阵列基板201的尺寸超出彩膜基板202，整机的外壳03通过边缘的边框将背光模组01和显示模组02进行固定，由于组装工艺的要求，需求外壳03和显示模组02有一定交叠，因此周围边框较大，并且周边有具有一定的段差。
随着笔记本电脑触控化的趋势，上述段差会导致在触控时手指和边框发生干涉，极大的影响了客户的体验效果，为解决上述问题，出现了如图2所示的液晶显示装置的结构，其在图1所示液晶显示装置的基础上，增加了保护盖板04。保护盖板04和显示模组02通过贴合进行固定，并且保护盖板04的尺寸超出显示模组02的尺寸，超出部分与整机的外壳03进行粘合固定。该结构与图1所示的结构相比，取消了外壳03与显示模组02搭接部分的设计，整个液晶显示装置表面是完全平整的，外观更加美观。重要的是在进行触控操作时，边缘部分不会造成干涉，更加有利于触控操作。同时因为外壳03与显示模组02搭接部分的取消，整个液晶显示装置的边框得到一定程度的降低。但这种结构因保护盖板04的成本较高，导致整个液晶显示装置的成本增加。随着保护盖板04的增加，整个液晶显示装置的厚度也增加了。而整个制程也因为增加保护盖板04的贴合工序，使得总体的制程良率下降。
图3是本公开显示装置的一实施例的整体结构示意图。图4是图3中BB截面的结构示意图。图5是图3中CC截面的结构示意图。图6是本公开显示装置的另一实施例的整体结构示意图。图7是本公开显示装置的一实施例中显示模组的结构示意图。图8是本公开显示装置的一实施例的截面示意图。图9是本公开显示装置的另一实施例的截面示意图。
参考图3-图9，在一些实施例中，显示装置包括：背光模组01、显示模组02和外壳03。显示装置可以为笔记本电脑，也可以为平板电脑等。背光模组01用于向显示模组02提供显示用的背光，其可采用直下式背光模组或侧光式背光模组。例如在图4和图5中，背光模组01为侧光式背光模组，其可包括侧向光源11、导光板12和光学膜组13等。背光模组01的衬底可以设置在外壳03内，也可以由外壳03复用形成。换句话说，外壳03的内壁既容纳和支撑背光模组01和显示模组02，还作为背光模组01的衬底基板以减少背光模组所占用的厚度方向的尺寸。背光模组01中的侧向光源11、导光板12、光学膜组13等可通过外壳03内设置的凹槽结构进行容纳和固 定。
为了节省外壳03在横向上的空间占用，参考图4，外壳03内可设置横向上内凹(即凹入方向与水平面平行)的凹槽结构，以用于容纳例如侧向光源11等部件。为了方便侧向光源11的安装，可使外壳03中形成凹槽结构的凸块33相对于外壳03的背面部分31(A壳)可拆卸分离，这样在安装时可以先将侧向光源11等部件安装到背面部分31，然后再安装凸块33，而凸块33除了约束已安装的侧向光源11等部件之外，还能够对显示模组02进行支撑。
参考图4、图5、图8和图9，显示模组02位于所述背光模组01的出光侧。显示模组02包括：显示面板和第一偏光片203。显示米板20包括相对设置的阵列基板201和彩膜基板202，所述彩膜基板202位于所述阵列基板201与所述背光模组01之间。第一偏光片203位于所述阵列基板201远离所述彩膜基板202的一侧。该第一偏光片203可复用为所述显示模组02的保护盖板04。
在本发明实施例提供的上述显示装置中，通过将阵列基板201翻置在上使用，搭配阵列基板201上的第一偏光片203复用为保护盖板04，避免了单独设置保护盖板04，由此节省了保护盖板04的贴合工艺，从而实现了显示装置的轻薄化、简化了制作工艺、提高了产品良率。并且，通过翻转阵列基板，可使得阵列基板上的相关元件(例如驱动芯片)以及阵列基板所连接的器件(例如柔性电路板和驱动电路板)被设置在阵列基板的内侧，从而实现整个显示屏幕的一体化，消除显示模组和整机外壳之间的段差，提升显示装置脑的外观效果。
在图4、图5、图8和图9中，显示模组02还可以包括位于彩膜基板202与背光模组01之间的第二偏光片204。显示面板还可包括位于所述阵列基板201和所述彩膜基板202之间的液晶层208。第二偏光片204的透光轴与第一偏光片203的透光轴相互垂直。由于液晶层中的液晶分子具有旋光特性，通过光学偏振方向相互垂直的第一偏光片和第二偏光片对偏振光的转化，从而实现显示模组对图像和文字的显示。
第二偏光片204可形成在彩膜基板202的表面，其在彩膜基板202上的正投影与彩膜基板202可完全重合。为了形成液晶层208，显示模组02还包括位于彩膜基板202和阵列基板201之间的第一封框胶205。第一封框胶205、彩膜基板202和阵列基板201共同围成液晶盒，通过在液晶盒内注入液晶来形成液晶层208。
在一些实施例中，第一偏光片203可选用高硬度偏光片(例如比常规偏光片厚度稍大0.1mm)或高硬度膜来代替钢化盖板。示例性地，第一偏光片203的硬度值可以 大于或等于6H，使得第一偏光片203具有较好的抗划伤能力。另外，由于相关技术中保护盖板04的厚度一般为0.5mm或0.7mm，且将保护盖板04贴合在显示模组02上的光学胶层的厚度约0.2mm，因此，在本实施例中将第一偏光片203复用为保护盖板04时，可以使得显示装置的整体厚度减小约0.6mm-0.8mm。
在图3-图6和图8-图9中，外壳03容置所述背光模组01和所述显示模组02。外壳03可包括位于所述背光模组01远离所述彩膜基板02的一侧的背面部分31和与所述背面部分31连接的多个侧面部分32，所述多个侧面部分32和所述背面部分31形成所述外壳03的内部空间。
参考图3和图6，在显示装置的出光侧看向显示装置时，侧面部分32包围在显示模组02的外侧。参考图4、图5和图8，外壳03的截面的整体轮廓呈现为在矩形的基础上内凹的形状。侧面部分32可设置成厚度均匀或不均匀的壁面结构，并可与背面部分31垂直。在另一些实施例中，侧面部分32可以与背面部分31呈锐角或钝角，以形成具有内凹结构的梯形整体轮廓。
在上述实施例中，阵列基板内具有金属材质的图案，例如阵列基板中位于显示区域的薄膜晶体管TFT的栅极、源极和漏极等金属层。当阵列基板翻置在上时，这些金属层容易在外界光线的照射下反光。参考图8和图9，在一些实施例中，阵列基板201包括：第一衬底基板2011、第一减反层2012和第一金属层2013。第一衬底基板2011可采用玻璃等透明材质。第一减反层2012位于所述第一衬底基板2011上。第一金属层2013位于所述第一减反层2012邻近所述背光模组的一侧。
第一减反层2012的图案形状与其需要遮挡的第一金属层2013的图案形状相同，尺寸可以相同或不同。通过在第一金属层2013与第一衬底基板2011之间设置遮挡金属层2013的第一减反层2012，有效降低了环境光在第一金属层2013上的反射率，提高了显示效果。具体的，由一些测试结果表明，没有第一减反层2012时的反射率为9.2，增加第一减反层2012的反射率为6.78，反射率降低了26％。
第一减反层2012在所述第一衬底基板2011上的正投影与所述第一金属层2013在所述第一衬底基板2011上的正投影完全重合。或者，所述第一金属层2013在所述第一衬底基板2011上的正投影位于第一减反层2021在第一衬底基板2011上的正投影内，以获得更好的减少反射效果。
在一些实施例中，第一减反层2012可以由钼(Mo)金属氧化物等来制作，例如通过在第一金属层2013的下方沉积Mo金属氧化物，且该Mo金属氧化物的图案形状 与第一金属层2013的图案形状相同，从而有效地降低该第一金属层2013表面的反射率。在另一些实施例中，还可以采用复合绝缘层来实现环境光的减反射，该复合绝缘层可包括交替叠置的单晶Si层和Si组合物层(例如SiO 2、Si 3N 4)，其中单晶Si层的折射率低于Si组合物层的折射率。例如包括较高折射率的Si组合物层和较低折射率的单晶Si层的双层复合结构，其中Si组合物层位于邻近环境光的一侧。
参考图3、图7-图9，在一些实施例中，显示面板具有显示区域AA和环绕所述显示区域AA的非显示区域W。按照相对于显示区域AA的方向，非显示区域W可分为下边框区域W 1、上边框区域W 2、左边框区域W 3、右边框区域W 4。阵列基板201还可包括位于所述显示区域AA的多个第一薄膜晶体管。
在图8和图9中，阵列基板201还可包括：第一绝缘层2014、平坦层2015、公共电极2016、第二绝缘层2017和像素电极2018。第一绝缘层2014设置在第一衬底基板2011邻近彩膜基板202的一侧，并覆盖第一薄膜晶体管的栅极金属层。平坦层2015设置在第一绝缘层2014邻近彩膜基板202的一侧。公共电极2016设置在平坦层2015邻近彩膜基板202的一侧。第二绝缘层2017设置在公共电极2016邻近彩膜基板202的一侧。像素电极2018设置在第二绝缘层2017邻近彩膜基板202的一侧。
彩膜基板202可包括：第二衬底基板2021、色阻层2022和黑矩阵2023。第二衬底基板2021可采用玻璃等透明材质。在一些实施例中，公共电极2016还可以设置于彩膜基板202上，例如位于色阻层2022邻近液晶层208的一侧。色阻层2022可以包括但不限于红光色阻R、绿光色阻G和蓝光色阻B。各个色阻通过黑色矩阵2023进行界定。
在上述实施例中，第一金属层2013可包括所述多个第一薄膜晶体管的栅极金属层，相应地，第一减反层2012可以采用制作栅极金属层的掩膜板(Gate Mask)来一次构图形成第一减反层2012和栅极金属层。在另一些实施例中，第一金属层2013可包括所述多个第一薄膜晶体管的源漏极金属层，相应地，第一减反层2012可以采用制作源漏极金属层的掩膜板(SD Mask)来一次构图形成第一减反层2012和源漏极金属层。
在另一些实施例中，第一金属层2013可包括多个第一薄膜晶体管的栅极金属层和源漏极金属层，相应地，第一减反层2012可进一步包括两种第一减反层，并采用制作栅极金属层的掩膜板来一次构图形成第一种第一减反层和栅极金属层，采用制作源漏极金属层的掩膜板来一次构图形成第二种第一减反层和源漏极金属层。或者，第 一减反层2012为单一膜层，其先通过一次构图工艺形成，再通过另外两次掩膜工艺分别制作栅极金属层和源漏极金属层，使得第一减反层2012的图案与栅极金属层和源漏极金属层的图案相同(或者在第一衬底基板上的正投影完全重合)。
参考图7和图9，阵列基板201可包括位于非显示区域W的栅极驱动电路210(Gate Driver on Array，简称GOA)，还可包括源极驱动电路206等驱动芯片(Driver IC)。由于栅极驱动电路210和走线比显示区域AA的金属线更加密集，加之阵列基板201翻置在上，导致非显示区域W与显示区域AA的视觉差异较明显。
为了改善这个问题，参考图4、图5、图7和图8，在一些实施例中，显示模组还包括第一遮光层207。第一遮光层207位于所述阵列基板201远离所述背光模组01的一侧。第一遮光层207在所述阵列基板201的正投影位于所述非显示区域W，且至少部分地覆盖所述栅极驱动电路210。通过第一遮光层207对非显示区域W的栅极驱动电路210等的金属线的遮光作用，减小了非显示区域W与显示区域AA之间因金属线密度不同带来的色差。并且，第一遮光层207还能够遮挡非显示区域W的背光光线，防止非显示区域W的漏光。
根据制造工艺的不同，第一遮光层207可包括：位于所述第一偏光片203与所述阵列基板201之间的油墨印刷层，所述油墨印刷层与所述第一偏光片203或所述阵列基板201接触；或位于所述第一偏光片203远离所述阵列基板201的一侧的油墨印刷层。可选地，油墨印刷层可采用黑色油墨形成。
图10的(A)-(F)是本公开显示装置的一些实施例在制备过程中在阵列基板上贴附第一偏光片，并形成第一遮光层的多种方法的示意图。
在图10的(A)和(B)中，由油墨印刷形成的第一遮光层207位于所述第一偏光片203与所述阵列基板201之间。第一偏光片203可包括依次叠设的三醋酸纤维素TAC层、聚乙烯醇PVA层和TAC层。对于可获得或购买的第一偏光片203，在其上下表面还可贴有保护膜和离型膜，该保护膜和离型膜可在后续处理时去除。
参考图10的(A)，为了形成该第一遮光层207，先提供阵列基板201，然后在阵列基板201的背侧(即在第一衬底基板2011远离彩膜基板202的一侧)的表面印刷油墨2071，以形成作为所述第一遮光层207的油墨印刷层，再在阵列基板201印有油墨2071的一侧通过胶层211(例如压敏胶PSA)贴附第一偏光片203。显示面板生产厂商可在制造或获得阵列基板后，通过在阵列基板的玻璃材质的第一衬底基板上印刷油墨，可获得更高印刷精度的油墨印刷层，减少或避免阵列基板的非显示区域的金属线 外漏反光或背光漏光的问题。
参考图10的(B)，为了形成该第一遮光层207，先提供第一偏光片203，然后在第一偏光片203的表面印刷油墨2071，以形成作为所述第一遮光层207的油墨印刷层，再在第一偏光片203印刷有油墨2071的表面设置胶层211(例如压敏胶Pressure Sensitive Adhesive，简称PSA)，然后通过该胶层211将阵列基板201远离所述彩膜基板一侧的表面与第一偏光片203印有油墨的一侧进行贴合。偏光片生产厂商可委托油墨印刷厂家在第一偏光片上印刷油墨，再在已印刷油墨的第一偏光片上复合胶层和离型膜来形成带有油墨印刷层的第一偏光片产品。显示面板生产厂商可将购买的第一偏光片产品与阵列基板进行粘合。这种方式无需显示面板生产厂商采购昂贵的油墨印刷设备，可有效地降低生产成本。
在图10的(C)-(F)中，由油墨印刷形成的第一遮光层207位于所述第一偏光片203远离所述阵列基板201的一侧。第一偏光片203可包括依次叠设的TAC层、PVA层和TAC层。对于可获得或购买的第一偏光片207，在其上下表面还可贴有保护膜和离型膜，该保护膜和离型膜可在后续处理时去除。另外，由于油墨印刷层位于第一偏光片邻近环境的一侧，为了提高屏幕的耐用性，可在第一遮光层207远离阵列基板201的一侧设置具有特定保护功能的功能膜层212，例如表面硬化层HC(Hard Coating)、抗反射增透层AR(Anti-Reflection)、抗眩光层AG(Anti-Glare)、抗指纹层AF(Anti-Fingerprint)和抗菌层AM(Anti-Microbe)中的至少一种。
参考图10的(C)，为了形成该第一遮光层207，先提供第一偏光片203，然后将第一偏光片203贴附在阵列基板201的背侧(即在第一衬底基板2011远离彩膜基板202的一侧)的表面，再在第一偏光片203远离阵列基板的一侧的表面印刷油墨2071，以形成作为所述第一遮光层207的油墨印刷层，然后在第一偏光片203印有油墨2071的一侧设置功能膜层212。显示面板生产厂商可从偏光片生产厂商获得第一偏光片，并将其与已制造的阵列基板进行贴合，再将油墨印刷到第一偏光片上，并设置功能膜层212。这种方式的制造工序简单，对已有的显示面板的制造流程影响较小。
参考图10的(D)，为了形成该第一遮光层207，先提供第一偏光片203，然后在第一偏光片203的表面印刷油墨2071，以形成作为所述第一遮光层207的油墨印刷层，再在第一偏光片203印刷有油墨2071的表面设置功能膜层212，然后将第一偏光片203远离所述功能膜层212一侧的表面贴合在阵列基板201远离所述彩膜基板202一侧的表面。偏光片生产厂商可委托油墨印刷厂家或自行地在第一偏光片上印刷油墨，再根 据需要在已印刷油墨的第一偏光片上复合功能膜层来形成带有油墨印刷层的第一偏光片产品。显示面板生产厂商可将购买的第一偏光片产品与阵列基板进行粘合。这种方式无需显示面板生产厂商采购昂贵的油墨印刷设备，可有效地降低生产成本。
参考图10的(E)，为了形成该第一遮光层207，先提供第一偏光片203，然后在第一偏光片203的表面贴合印有油墨2071的基材213(例如聚对苯二甲酸乙二醇酯PET或TAC)，也就是说，在所述第一偏光片203的表面贴附含有作为所述第一遮光层207的油墨印刷层的基材213。然后将第一偏光片203远离油墨印刷层一侧的表面贴附在阵列基板201远离彩膜基板202一侧的表面。偏光片生产厂商可直接购买印有油墨的基材，并将该基材贴合到第一偏光片上，以形成带有印刷油墨层的第一偏光片产品。显示面板生产厂商可将购买的第一偏光片产品与阵列基板进行粘合。这种方式无需偏光片生产厂商和显示面板生产厂商采购昂贵的油墨印刷设备，可有效地降低生产成本。
参考图10的(F)，为了形成该第一遮光层207，先提供第一偏光片203，然后将第一偏光片203贴附在阵列基板201的背侧(即在第一衬底基板2011远离彩膜基板202的一侧)的表面，再在第一偏光片203的表面贴合印有油墨2071的基材213(例如聚对苯二甲酸乙二醇酯PET或TAC)，即含有作为所述第一遮光层207的油墨印刷层的基材。显示面板生产厂商可通过从偏光片生产厂商购买第一偏光片，并外购含有油墨的基材，以实现第一偏光片、基材和阵列基板的贴合。在这种方式下，显示面板生产厂商无需采购昂贵的油墨印刷设备，可有效地降低生产成本，也无需向偏光片生产厂商定制特定的第一偏光片产品，也有利于降低成本。
对非显示区域的遮光除了采用印刷油墨的方式，还可以采取其他方式。参考图9，在一些实施例中，阵列基板还包括：第二减反层2071和第二金属层2072，第二减反层2071位于所述第一衬底基板2011上，第二金属层2072位于所述第二减反层2071远离所述第一衬底基板2011的一侧。第二减反层2071、第二金属层2072和所述栅极驱动电路210均位于所述非显示区域W，所述第二减反层2071和所述第二金属层2072在所述第一衬底基板2011上的正投影互相重合的部分至少部分地覆盖所述栅极驱动电路210在所述第一衬底基板2011上的正投影。这样层叠的第二减反层2071和第二金属层2072构成了遮挡非显示区域的栅极驱动电路的遮光层结构207’，相当于集成在阵列基板内的遮光层。
参考图9，为了形成上述遮光层结构207’，可在第一衬底基板2011的表面沉积 形成一层金属氧化物(例如钼金属氧化物)，然后在该层金属氧化物上沉积形成一层金属(例如铝等)，再通过一次掩膜版曝光显影和刻蚀来形成图案化的第二减反层2071和第二金属层2071。第二减反层2071可以与前述实施例中的第一减反层2012通过同一次构图工艺制备，以节省工序。第一绝缘层2014可形成在第一衬底基板2011邻近彩膜基板202的一侧，并覆盖第一薄膜晶体管的栅极金属层和第二金属层2072。
图11和图12分别是本公开显示装置的一些实施例中阵列基板上显示区域及周边的局部结构示意图。
为了避免油墨印刷层因印刷精度不够而覆盖不完全而导致的反光问题，例如在显示区域边缘靠外的位置未完全覆盖，则可能导致未覆盖的密集金属线反光，使得视觉上产生边框亮线的不良效果。为克服这个问题，参考图11和图12，可在显示区域周边增加整列的虚设像素(Dummy Pixel)，这些虚设像素处于非显示区域邻接显示区域的位置，即便油墨印刷层未覆盖这个部分，因这些虚设像素不具有密集的金属线，从而不会因反光而造成视觉上的明显影响。具体来说，在一些实施例中，阵列基板201还包括：多个第一薄膜晶体管2019和多个第二薄膜晶体管2019’。多个第一薄膜晶体管2019位于所述显示区域AA。多个第二薄膜晶体管2019’位于所述非显示区域W(在图11和图12中通过虚线框出)，且沿与所述多个第一薄膜晶体管2019中位于所述显示区域边缘的一行或一列第一薄膜晶体管2019相邻。
在图11中，第一薄膜晶体管2019和第二薄膜晶体管2019’均包括栅极2019a、有源层2019b和源极2019c，两者不同的是，位于显示区域AA的第一薄膜晶体管2019还包括与像素电极2018电连接的漏极2019d，而位于非显示区域W的第二薄膜晶体管2019不包括漏极。在图12中，第一薄膜晶体管2019和第二薄膜晶体管2019’均包括栅极2019a、源极2019c和漏极2019d，两者不同的是，位于显示区域AA的第一薄膜晶体管2019还包括与漏极2019d和栅极2019a电连接的有源层2019b，而位于非显示区域W的第二薄膜晶体管2019’不包括有源层2019b。
图13是图2所示的显示装置的局部结构示意图。图14是本公开显示装置的一实施例的局部结构示意图。
参考图4、图5、图8、图9和图14，在一些实施例中，所述阵列基板201包括：第一部分P 1和第二部分P 2。第一部分P 1在所述背面部分31上的正投影与所述彩膜基板202在所述背面部分31上的正投影完全重合，第二部分P 2在所述背面部分31上的正投影与所述彩膜基板202在所述背面部分31上的正投影互不交叠。换句话说，阵 列基板201的第一部分是与彩膜基板202正对且形状和面积相同的部分，而第二部分是阵列基板201的第一部分之外的部分。
背光模组01在所述背面部分31上的正投影与所述阵列基板201在所述背面部分31的正投影可以完全重合(例如图8和图9所示)。参考图4和图5，背光模组01在所述背面部分31上的正投影可位于所述阵列基板201在所述背面部分31的正投影内，以避开外壳03内的其他元件，例如感光单元等传感器。
显示模组02还包括：位于阵列基板201的第二部分P 2邻近所述彩膜基板202一侧的柔性电路板05和与所述柔性电路板05电连接的驱动电路板06。参考图8、图9和图14，第二部分P 2、所述背光模组01、所述彩膜基板202与所述侧面部分32围出一容置空间。这样，至少部分的柔性电路板05和驱动电路板06可以弯折地设置到该容置空间。
参考图4，在一些实施例中，显示装置还包括设置在外壳03上的空心转轴07，空心转轴07可位于外壳03的一侧的边缘位置。在空心转轴07内可设置天线71。如果空心转轴07内还有富余空间，则也可将至少部分的柔性电路板05和驱动电路板06可以弯折地设置到该空间。
在本公开实施例中，通过将驱动电路板06及至少部分柔性电路板05设置在容置空间中或空心转轴07中，可使得显示模组02和外壳03直接搭接，省去了保护盖板04和外壳03搭接的距离W 1’(参考图13)，整机的下边框DB完全由显示模组02的下边框W 1构成(参考图14)。相对于图2所示相关技术的结构，本公开实施例可有效地降低边框尺寸，进一步提升显示装置的屏占比，有利于实现全面屏结构。
参考图3-图4，在一些实施例中显示装置还包括：感光单元08，例如前置摄像头等。感光单元08设置在所述外壳03内，且位于所述彩膜基板202远离所述阵列基板201的一侧，所述感光单元08位于所述非显示区域W。通过将感光单元08与显示模组02进行集成，并使感光单元08位于显示模组02的下侧，可获得正面一体化效果，降低其他方式，例如通过增加装饰条方式来设置感光单元在工艺上的良率损失，以及外接摄像头方式在使用上存在携带和充电不方便、ID设计冲突的问题。
图15和图16分别是本公开显示装置的一些实施例中显示模组的第二遮光层和第一封框胶的设置示意图。图17是本公开显示装置的再一实施例的截面示意图。图18和图19分别是本公开显示装置的一些实施例中显示模组的第二遮光层、第一封框胶和第二封框胶的设置示意图。图20-图22分别是本公开显示装置的一些实施例中感光 单元和第二遮光层的相对位置示意图。
参考图4和图15-图19，在一些实施例中，显示模组02还包括：第二遮光层209。该第二遮光层209位于所述感光单元08邻近所述彩膜基板的一侧，且有第一镂空区域2091。感光单元08的入光区域81在所述阵列基板201的正投影与所述第二遮光层209的第一镂空区域2091在所述阵列基板201的正投影至少部分地重合。感光单元08能够通过入光区域81采集显示模组02外侧的图像。参考图20-图22所示的感光单元08的倒三角形的部分，该部分表示感光单元08实现感光作用的元件，而感光单元08的入光区域81的范围对应着该倒三角形的底面部分。
第一镂空区域2091可确保感光单元08的入光区域81的采光。通过第二遮光层209来遮挡除了第一镂空区域2091之外的环境光线，从而实现对感光单元08的收光范围的控制。在一些实施例中，第二遮光层209可以与第一遮光层207通过一次构图工艺形成，以节省工艺。
在图15、图16、图18和图19中，第一镂空区域2091可设置在显示模组02的上边框区域W 2的中部。上边框区域W 2可设置成相对于显示区域向外局部凸起的形态，以减少感光单元08两侧的边框的尺寸，实现窄边框的效果。该局部凸起可嵌入在外壳03中，并对外壳03的嵌入部位设置倒角，以便在显示装置的整体上更加协调。在另一些实施例中，第一镂空区域2091可设置在其他方向的非显示区域，例如下边框区域W 1、左边框区域W 3、右边框区域W 4，可以设置在非显示区域的靠近边缘的位置。
在图4中，显示模组02还包括：液晶层208和第一封框胶205。液晶层208位于所述阵列基板201和所述彩膜基板202之间。第一封框胶205位于所述彩膜基板202和所述阵列基板201之间且围封所述液晶层208。参考图20-图22，感光单元08的入光区域81在所述阵列基板201的正投影或所述第二遮光层209的第一镂空区域2091在所述阵列基板201的正投影位于所述液晶层208在所述阵列基板201的正投影内。在这种方式下，外界光线经过液晶层208进入感光单元08。
参考图17-图19，在一些实施例中，显示模组02还包括：液晶层208、第一封框胶205和第二封框胶205’。液晶层208位于所述阵列基板201和所述彩膜基板202之间。第一封框胶205位于所述彩膜基板202和所述阵列基板201之间且围封所述液晶层208。第二封框胶205’位于所述彩膜基板202和所述阵列基板201之间，且与所述第一封胶框共同围封出真空区域2081。感光单元08的入光区域81在所述阵列基板 201的正投影或所述第二遮光层209的第一镂空区域2091在所述阵列基板201的正投影位于所述真空区域2081在所述阵列基板201的正投影内。在这种方式下，外界光线经过真空区域2081进入感光单元08。
相比于图4中经过液晶208进入感光单元08的结构，图17中外界光线无需经过液晶，从而避免了液晶对光的折射和散射，也避免了因液晶被污染而影响感光单元的成像效果。相比于图17所示的结构，图4所示的结构可减少封框胶的涂覆量。为了减小感光元件08所对应的非显示区域的尺寸，可在从母板上切割显示面板时，沿封胶框进行切割，即对封框胶带进行胶切，从而使封框胶自身的宽度进一步减小，例如减小0.4～0.7mm。
举例来说，阵列基板201和彩膜基板202的厚度可设为0.2～0.5mm，第一偏光片203和第二偏光片204的厚度可设为0.08～0.15mm，盒厚可设为2.5～3.5μm，第二遮光层209的厚度可设为3～5μm，第一镂空区域2091的尺寸可根据感光单元08的入光区域81在显示模组外侧(即远离背光模组的一侧)的可视角度82调节，例如设置为孔径2～3mm，而感光单元08的入光区域81的孔径可设为2.0～2.5mm。
环境光在空气中通过第一偏光片和阵列基板，将发生一次折射，根据折射定律n1*Sina＝n2*Sinb，空气折射率n1＝1.0，采用玻璃材质的衬底基板的阵列基板和第一偏光片等实现的折射率基本为玻璃折射率n2，n2＝1.5，a和b分别为入射角和折射角。光通过玻璃后，折射角度将变小。在玻璃中光线沿直线传播，在采用玻璃材质的衬底基板的彩膜基板和第二偏光片和空气界面将发生再次折射，最终光线进入感光单元08，从而实现光的采集。一般情况下，感光单元08的入光区域81在显示模组外侧的可视角度82一般在70～90°即可满足需求。为了满足可视角度需求，可通过调整第一镂空区域2091的尺寸来实现可视角度的调节。
参考图20，在一些实施例中，第二遮光层209包括：位于所述阵列基板201远离所述彩膜基板202一侧的油墨遮光层。例如在图20中，第二遮光层209可设置在第一偏光片203和所述阵列基板201之间。在另一些实施例中，第二遮光层209还可以设置在第一偏光片203内或第一偏光片203远离所述衬底基板201的一侧。参考前述图10的(A)-(F)中设置第一遮光层207的实施例，可使得第二遮光层209与第一遮光层207一起形成，例如通过在阵列基板201或第一偏光片203上印刷油墨的方式来一次形成第二遮光层209和第一遮光层207，从而减少工序。
参考图21，在一些实施例中，第二遮光层209包括：位于所述彩膜基板202邻近 所述感光单元08一侧的表面的油墨遮光层。这种结构相比于图20所示的结构，在实现相同可视角度的情况下实现尺寸更小的第一镂空区域2091。
参考图22，在一些实施例中，第二遮光层209包括：位于所述彩膜基板202内的黑色矩阵。这样更充分地利用了彩膜基板中的黑色矩阵来实现感光单元08的入光区域81的可视角度82，相比于图20和图21所示的结构可省去油墨印刷工序，从而实现成本降低和工序简单化。一般来说，黑色矩阵的厚度可设为1～2μm，其相比于厚度在3～5μm的油墨遮光层不仅在遮光效果上更高，且相对于衬底基板的段差较小，避免油墨遮光层为了磨平段差容易产生气泡等不良的问题。
图23是本公开显示装置的一实施例中显示模组的第二遮光层和第二镂空区域的设置示意图。图24是本公开显示装置的一实施例中入光区域、第一镂空区域和第二镂空区域的相对位置示意图。
考虑到感光单元邻近所述彩膜基板的一侧设有第一偏光片，外界光线通过第一偏光片时存在一定的损失，影响成像效果。为了进一步克服这个问题，参考图23和图24，在一些实施例中，第一偏光片203具有第二镂空区域2031。感光单元08的入光区域81在所述阵列基板201的正投影或所述第二遮光层209的第一镂空区域2091在所述阵列基板201的正投影位于所述第一偏光片203的第二镂空区域2031在所述阵列基板201的正投影内。第二镂空区域2031可通过偏光片的异形裁切的方式来去除对应于第二镂空区域2031的偏光片材料。
图25是本公开显示装置的一实施例中入光区域、第一镂空区域和去偏振区域的相对位置示意图。
为了改善第一偏光片相对于阵列基板的一体化效果，参考图25，在一些实施例中，第一偏光片203具有去偏振区域2032。感光单元08的入光区域81在所述阵列基板201的正投影或所述第二遮光层209的第一镂空区域2091在所述阵列基板201的正投影位于所述第一偏光片203的第二镂空区域2031或去偏振区域2032在所述阵列基板201的正投影内。为了形成去偏振区域2032，可在制造第一偏光片203时，在PVA层上贴设保护膜具有镂空区域的保护膜，然后对PVA层进行局部退偏处理，即去掉保护膜的镂空区域所对应的偏振片材料。再去除PVA层上的保护膜，然后在PVA层上设置其他膜层，例如PSA层、TAC层和保护膜层等。
图26是本公开显示装置的制造方法一实施例的流程示意图。
基于上述显示装置的实施例，参考图26，在一些实施例中，前述显示装置的制造 方法包括以下步骤S100到步骤S400：
步骤S100：提供具有显示区域和环绕所述显示区域的非显示区域的显示面板，所述显示面板包括相对设置的阵列基板和彩膜基板，所述阵列基板包括位于所述非显示区域的栅极驱动电路。
为了获得上述显示面板，可在母板上制作多个显示面板。显示面板包括相对而置的阵列基板201和彩膜基板202、位于阵列基板201与彩膜基板202之间的液晶层208和密封阵列基板201与彩膜基板202的第一封胶框205。
在具体实施时，阵列基板201的形成过程包括：
提供第一衬底基板2011；
在第一衬底基板2011上形成第一减反层2012；
在述第一减反层2012远离所述第一衬底基板2011的一侧形成第一金属层2013，其中，第一金属层2013在所述第一衬底基板2011上的正投影与所述第一减反层2012在所述第一衬底基板2011上的正投影完全重合，或位于所述第一减反层2012在所述第一衬底基板2011上的正投影内。形成第一减反层2012和第一金属层2013的过程可以通过以下两种方式进行实现：
第一种实现方式为，在第一衬底基板2011上依次形成减反膜和金属膜；并对金属膜和减反膜进行一次掩膜工艺，形成图案一致的第一减反层2012和第一金属层2013。具体地，第一金属层2013为栅极金属层或源漏极金属层。
第二种可能的实现方式为，在第一衬底基板2011上形成减反膜，并对减反膜进行一次掩膜工艺，形成图案与后续栅极金属层和源漏极金属层一致的第一减反层2012；在第一减反层2012上依次进行两次掩膜工艺，分别形成栅极金属层和源漏极金属层。
对于阵列基板201所含有源层、第一绝缘层2014、平坦层2015、公共电极2016、第二绝缘层2017和像素电极2018，以及彩膜基板202所含色阻层2022和黑矩阵2023的制作方法与现有技术相同，在此不做赘述。
在母板上制作多个显示面板之后，可通过刀轮切割的方式从母板中切割出多个独立的单片的显示面板。为了匹配某些显示装置(例如笔记本电脑)的整体外形，可对单片的显示面板进行异形切割，可用研磨和激光切割的方式来实现显示面板的圆角切割。
步骤S200：在所述阵列基板上贴附第一偏光片，并在所述阵列基板远离所述彩膜 基板的一侧形成第一遮光层，所述第一遮光层在所述阵列基板的正投影位于所述非显示区域，且至少部分地覆盖所述栅极驱动电路。第一遮光层可通过网版转印或喷墨的方式形成，能够消除阵列基板在非显示区域的GOA和金属走线的反光问题。在所述阵列基板上贴附第一偏光片，并在所述阵列基板远离所述彩膜基板的一侧形成第一遮光层的步骤可参考前述对图10的(A)-(F)的说明，这里就不再赘述了。
除了贴附第一偏光片之外，还包括在彩膜基板上贴附第二偏光片。彩膜基板202上的第二偏光片204的尺寸可以比显示面板的尺寸小，阵列基板201上的第一偏光片203的尺寸可以比阵列基板201的尺寸大。通过二氧化碳激光器扫描阵列基板201周边轨迹的方式对超出阵列基板201的第一偏光片203进行切割，可保证第一偏光片203和阵列基板201完全齐边。
步骤S300：在已贴附所述第一偏光片的阵列基板上绑定驱动芯片206，并将柔性电路板05的一端绑定在所述阵列基板201上，另一端连接在驱动电路板06上，以形成显示模组02。
步骤S400：提供外壳03和背光模组01，将所述背光模组01和所述显示模组02依次安装在所述外壳01内，并使所述彩膜基板202位于所述阵列基板201与所述背光模组01之间。背光模组01和显示模组02与外壳03接触的部分可通过胶带或点胶进行粘接，起到固定作用，驱动电路板06可以通过胶带、螺丝等固定在空心转轴07中或弯曲固定于阵列基板201、背光模组01、彩膜基板202与侧面部分围成的容置空间内，至此完成了整机显示装置的组装。
需要说明的是，在本发明实施例提供的上述制造方法中，形成各层结构涉及到的构图工艺，不仅可以包括沉积、光刻胶涂覆、掩模板掩模、曝光、显影、刻蚀、光刻胶剥离等部分或全部的工艺过程，还可以包括其他工艺过程，具体以实际制作过程中形成所需构图的图形为准，在此不做限定。例如，在显影之后和刻蚀之前还可以包括后烘工艺。
其中，沉积工艺可以为化学气相沉积法、等离子体增强化学气相沉积法或物理气相沉积法，在此不做限定；掩膜工艺中所用的掩膜板可以为半色调掩膜板(Half Tone Mask)、单缝衍射掩模板(Single Slit Mask)或灰色调掩模板(Gray Tone Mask)，在此不做限定；刻蚀可以为干法刻蚀或者湿法刻蚀，在此不做限定。
在一些实施例中，显示装置的制造方法还可包括：将感光单元设置在所述外壳内，并使所述感光单元位于所述彩膜基板远离所述阵列基板的一侧。在这其中，形成显示 模组的步骤还可包括：在所述感光单元邻近所述彩膜基板的一侧形成第二遮光层，所述第二遮光层具有第一镂空区域，所述感光单元的入光区域在所述阵列基板的正投影与所述第二遮光层的第一镂空区域在所述阵列基板的正投影至少部分地重合。
在上述实施例的基础上中，所述阵列基板的形成步骤还可包括：在所述第一衬底基板上形成第二减反层；在所述第二减反层远离所述第一衬底基板的一侧形成第二金属层；在所述第二金属层远离所述第一衬底基板的一侧形成栅极驱动电路，其中，所述第二减反层、所述第二金属层和所述栅极驱动电路均位于所述非显示区域，所述第二减反层和所述第二金属层在所述第一衬底基板上的正投影互相重合的部分至少部分地覆盖所述栅极驱动电路在所述第一衬底基板上的正投影。
为了减少工序，在一些实施例中，所述第一减反层和所述第二减反层可通过同一次构图工艺制备。
在上述显示装置实施例中，通过将阵列基板翻置在上使用，搭配阵列基板上的第一偏光片复用为保护盖板，避免了单独设置保护盖板，节省了保护盖板的贴合工艺，从而实现了显示装置的轻薄化、简化了制作工艺、提高了产品良率。
本说明书中多个实施例采用递进的方式描述，各实施例的重点有所不同，而各个实施例之间相同或相似的部分相互参见即可。对于显示装置的制造方法实施例而言，由于其整体以及涉及的步骤与显示装置实施例中的内容存在对应关系，因此描述的比较简单，相关之处参见装置实施例的部分说明即可。
至此，已经详细描述了本公开的各实施例。为了避免遮蔽本公开的构思，没有描述本领域所公知的一些细节。本领域技术人员根据上面的描述，完全可以明白如何实施这里公开的技术方案。
虽然已经通过示例对本公开的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本公开的范围。本领域的技术人员应该理解，可在不脱离本公开的范围和精神的情况下，对以上实施例进行修改或者对部分技术特征进行等同替换。本公开的范围由所附权利要求来限定。

Claims (18)

  1. 一种显示装置，包括：
    背光模组；
    显示模组，位于所述背光模组的出光侧；和
    外壳，容置所述背光模组和所述显示模组，
    其中，所述显示模组包括：
    显示面板，所述显示面板包括相对设置的阵列基板和彩膜基板，所述彩膜基板位于所述阵列基板与所述背光模组之间；和
    第一偏光片，位于所述阵列基板远离所述彩膜基板的一侧。
  2. 根据权利要求1所述的显示装置，其中，所述显示面板具有显示区域和环绕所述显示区域的非显示区域，所述显示装置还包括：
    感光单元，设置在所述外壳内，且位于所述彩膜基板远离所述阵列基板的一侧，所述感光单元位于所述非显示区域。
  3. 根据权利要求2所述的显示装置，其中，所述显示模组还包括：
    第二遮光层，位于所述感光单元邻近所述彩膜基板的一侧，且有第一镂空区域，
    其中，所述感光单元的入光区域在所述阵列基板的正投影与所述第二遮光层的第一镂空区域在所述阵列基板的正投影至少部分地重合。
  4. 根据权利要求3所述的显示装置，其中，所述第二遮光层包括：
    位于所述阵列基板远离所述彩膜基板一侧的油墨遮光层；或
    位于所述彩膜基板邻近所述感光单元一侧的表面的油墨遮光层；或
    位于所述彩膜基板内的黑色矩阵。
  5. 根据权利要求3所述的显示装置，其中，所述第一偏光片具有第二镂空区域或去偏振区域，所述感光单元的入光区域在所述阵列基板的正投影或所述第二遮光层的第一镂空区域在所述阵列基板的正投影位于所述第一偏光片的第二镂空区域或去偏振区域在所述阵列基板的正投影内。
  6. 根据权利要求3所述的显示装置，其中，所述显示面板还包括：
    液晶层，位于所述阵列基板和所述彩膜基板之间；和
    第一封框胶，位于所述彩膜基板和所述阵列基板之间且围封所述液晶层。
  7. 根据权利要求1所述的显示装置，其中，所述阵列基板包括：
    第一衬底基板；
    第一减反层，位于所述第一衬底基板上；和
    第一金属层，位于所述第一减反层邻近所述背光模组的一侧，
    其中，所述第一金属层在所述第一衬底基板上的正投影与所述第一减反层在所述第一衬底基板上的正投影完全重合，或位于所述第一减反层在所述第一衬底基板上的正投影内。
  8. 根据权利要求3所述的显示装置，其中，所述显示面板具有显示区域和环绕所述显示区域的非显示区域，所述阵列基板包括位于所述非显示区域的栅极驱动电路，所述显示模组还包括：
    第一遮光层，位于所述阵列基板远离所述背光模组的一侧，
    其中，所述第一遮光层在所述阵列基板的正投影位于所述非显示区域，且至少部分地覆盖所述栅极驱动电路。
  9. 根据权利要求8所述的显示装置，其中，所述第一遮光层包括：
    位于所述第一偏光片与所述阵列基板之间的油墨印刷层，所述油墨印刷层与所述第一偏光片或所述阵列基板接触；或
    位于所述第一偏光片远离所述阵列基板的一侧的油墨印刷层。
  10. 根据权利要求1所述的显示装置，其中，所述显示面板具有显示区域和环绕所述显示区域的非显示区域，所述阵列基板包括：
    第一衬底基板；
    第二减反层，位于所述第一衬底基板上；
    第二金属层，位于所述第二减反层远离所述第一衬底基板的一侧；和
    栅极驱动电路，位于所述第二金属层远离所述第一衬底基板的一侧，
    其中，所述第二减反层、所述第二金属层和所述栅极驱动电路均位于所述非显示区域，所述第二减反层和所述第二金属层在所述第一衬底基板上的正投影互相重合的部分至少部分地覆盖所述栅极驱动电路在所述第一衬底基板上的正投影。
  11. 根据权利要求8-10任一所述的显示装置，其中，所述阵列基板还包括：
    多个第一薄膜晶体管，位于所述显示区域；和
    多个第二薄膜晶体管，位于所述非显示区域，且与所述多个第一薄膜晶体管中位于所述显示区域边缘的一行或一列第一薄膜晶体管相邻，
    其中，所述多个第二薄膜晶体管中的至少一个不包含漏极金属层或有源层。
  12. 根据权利要求1所述的显示装置，其中，所述外壳包括：位于所述背光模组远离所述彩膜基板的一侧的背面部分和与所述背面部分连接的多个侧面部分，所述多个侧面部分和所述背面部分形成所述外壳的内部空间；
    所述阵列基板包括：
    第一部分，第一部分在所述背面部分上的正投影与所述彩膜基板在所述背面部分上的正投影完全重合或部分重合；和
    第二部分，所述第二部分在所述背面部分上的正投影与所述彩膜基板在所述背面部分上的正投影互不交叠，
    其中，所述背光模组在所述背面部分上的正投影与所述阵列基板在所述背面部分的正投影完全重合或位于所述阵列基板在所述背面部分的正投影内，所述第二部分、所述背光模组、所述彩膜基板与所述侧面部分围出一容置空间；
    所述显示模组还包括：位于所述第二部分邻近所述彩膜基板一侧的柔性电路板和与所述柔性电路板电连接的驱动电路板，所述驱动电路板和至少部分所述柔性电路板设置在所述容置空间内。
  13. 一种显示装置的制造方法，包括：
    提供具有显示区域和环绕所述显示区域的非显示区域的显示面板，所述显示面板包括相对设置的阵列基板和彩膜基板，所述阵列基板包括位于所述非显示区域的栅极驱动电路；
    在所述阵列基板上贴附第一偏光片，并在所述阵列基板远离所述彩膜基板的一侧形成第一遮光层，所述第一遮光层在所述阵列基板的正投影位于所述非显示区域，且至少部分地覆盖所述栅极驱动电路；
    在已贴附所述第一偏光片的阵列基板上绑定驱动芯片，并将柔性电路板的一端绑定在所述阵列基板上，另一端连接在驱动电路板上，以形成显示模组；
    提供外壳和背光模组，将所述背光模组和所述显示模组依次安装在所述外壳内，并使所述彩膜基板位于所述阵列基板与所述背光模组之间。
  14. 根据权利要求13所述的制造方法，其中，在所述阵列基板上贴附第一偏光片，并在所述阵列基板远离所述彩膜基板的一侧形成第一遮光层的步骤包括步骤a)-步骤f)中的至少一种：
    a)在所述阵列基板远离所述彩膜基板一侧的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，并在所述阵列基板印有油墨的一侧通过胶层贴附所述第一偏光 片；
    b)在所述第一偏光片的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，并将所述第一偏光片印有油墨的一侧通过胶层贴附在所述阵列基板远离所述彩膜基板一侧的表面；
    c)在所述阵列基板远离所述彩膜基板一侧的表面通过胶层贴附所述第一偏光片，并在所述第一偏光片远离所述彩膜基板一侧的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，然后在所述第一偏光片印有油墨的一侧设置功能膜层；
    d)在所述第一偏光片的表面印刷油墨，以形成作为所述第一遮光层的油墨印刷层，并在所述第一偏光片印有油墨的一侧设置功能膜层，然后将所述第一偏光片远离所述功能膜层一侧的表面贴附在所述阵列基板远离所述彩膜基板一侧的表面；
    e)在所述第一偏光片的表面贴附含有作为所述第一遮光层的油墨印刷层的基材，并将所述第一偏光片远离所述油墨印刷层一侧的表面贴附在所述阵列基板远离所述彩膜基板一侧的表面；
    f)将所述第一偏光片贴附在所述阵列基板远离所述彩膜基板一侧的表面，并在所述第一偏光片远离所述阵列基板一侧的表面贴附含有作为所述第一遮光层的油墨印刷层的基材。
  15. 根据权利要求13所述的制造方法，还包括：
    将感光单元设置在所述外壳内，并使所述感光单元位于所述彩膜基板远离所述阵列基板的一侧；
    其中，形成显示模组的步骤还包括：
    在所述感光单元邻近所述彩膜基板的一侧形成第二遮光层，所述第二遮光层具有第一镂空区域，所述感光单元的入光区域在所述阵列基板的正投影与所述第二遮光层的第一镂空区域在所述阵列基板的正投影至少部分地重合。
  16. 根据权利要求13所述的制造方法，其中，所述阵列基板的形成步骤包括：
    提供第一衬底基板；
    在所述第一衬底基板上形成第一减反层；
    在所述第一减反层远离所述第一衬底基板的一侧形成第一金属层，所述第一金属层在所述第一衬底基板上的正投影与所述第一减反层在所述第一衬底基板上的正投影完全重合，或位于所述第一减反层在所述第一衬底基板上的正投影内。
  17. 根据权利要求16所述的制造方法，其中，所述阵列基板的形成步骤还包括：
    在所述第一衬底基板上形成第二减反层；
    在所述第二减反层远离所述第一衬底基板的一侧形成第二金属层；
    在所述第二金属层远离所述第一衬底基板的一侧形成栅极驱动电路，
    其中，所述第二减反层、所述第二金属层和所述栅极驱动电路均位于所述非显示区域，所述第二减反层和所述第二金属层在所述第一衬底基板上的正投影互相重合的部分至少部分地覆盖所述栅极驱动电路在所述第一衬底基板上的正投影。
  18. 根据权利要求17所述的制造方法，其中，所述第一减反层和所述第二减反层通过同一次构图工艺制备。
PCT/CN2021/114837 2020-09-11 2021-08-26 显示装置及显示装置的制造方法 WO2022052816A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/789,459 US11714307B2 (en) 2020-09-11 2021-08-26 Display device and manufacturing method of display device
CN202180002297.3A CN114730108B (zh) 2020-09-11 2021-08-26 显示装置及显示装置的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010951337.6A CN114167638A (zh) 2020-09-11 2020-09-11 一种显示装置及其所含阵列基板的制作方法
CN202010951337.6 2020-09-11

Publications (1)

Publication Number Publication Date
WO2022052816A1 true WO2022052816A1 (zh) 2022-03-17

Family

ID=80476107

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/114837 WO2022052816A1 (zh) 2020-09-11 2021-08-26 显示装置及显示装置的制造方法

Country Status (3)

Country Link
US (2) US11604376B2 (zh)
CN (2) CN114167638A (zh)
WO (1) WO2022052816A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024113278A1 (zh) * 2022-11-30 2024-06-06 京东方科技集团股份有限公司 显示面板和显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157680A (ja) * 2022-04-15 2023-10-26 シャープディスプレイテクノロジー株式会社 液晶表示装置
CN116609974A (zh) * 2023-05-31 2023-08-18 重庆惠科金渝光电科技有限公司 背光源组件、双面显示模组以及双面显示装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106526943A (zh) * 2017-01-12 2017-03-22 京东方科技集团股份有限公司 一种液晶显示装置
CN106684100A (zh) * 2017-01-19 2017-05-17 京东方科技集团股份有限公司 一种阵列基板及其制作方法、显示装置
CN107728365A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 窄边框显示面板及显示装置
CN108983468A (zh) * 2018-07-27 2018-12-11 厦门天马微电子有限公司 一种显示装置
CN110112140A (zh) * 2019-04-22 2019-08-09 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制作方法
CN110471208A (zh) * 2019-08-05 2019-11-19 厦门天马微电子有限公司 显示装置及其制作方法
CN110488522A (zh) * 2019-07-29 2019-11-22 武汉华星光电技术有限公司 一种触控屏及其制备方法
CN110955356A (zh) * 2019-12-13 2020-04-03 武汉华星光电技术有限公司 显示装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3722636B2 (ja) * 1999-02-12 2005-11-30 信越ポリマー株式会社 押釦スイッチ用部材およびその製造方法
US6521539B1 (en) * 1999-05-03 2003-02-18 Chartered Semiconductor Manufacturing Ltd. Selective etch method for selectively etching a multi-layer stack layer
JP2009069720A (ja) * 2007-09-18 2009-04-02 Fujifilm Corp 画像表示装置
JP5056372B2 (ja) * 2007-11-22 2012-10-24 ソニー株式会社 バックライト装置及び液晶表示装置
JP5627071B2 (ja) * 2008-09-01 2014-11-19 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20150015826A1 (en) * 2012-01-06 2015-01-15 Sharp Kabushiki Kaisha Liquid crystal display device and method for manufacturing same
CN103885635A (zh) * 2014-03-10 2014-06-25 京东方科技集团股份有限公司 触摸显示装置及其制作方法
KR20160057047A (ko) * 2014-11-12 2016-05-23 삼성디스플레이 주식회사 표시 장치
KR102366299B1 (ko) * 2015-08-31 2022-02-21 엘지디스플레이 주식회사 플렉서블 디스플레이용 지지 프레임 및 이를 포함하는 플렉서블 디스플레이 장치
JP6556176B2 (ja) * 2016-03-30 2019-08-07 矢崎総業株式会社 文字板および自動車用メータ
CN107045221A (zh) 2016-12-28 2017-08-15 深圳市华星光电技术有限公司 液晶显示面板和液晶显示器
CN206331209U (zh) * 2016-12-28 2017-07-14 上海天马微电子有限公司 一种液晶显示装置
CN106483706A (zh) 2016-12-29 2017-03-08 惠科股份有限公司 液晶显示面板
CN106773379B (zh) * 2017-02-06 2020-02-07 京东方科技集团股份有限公司 显示面板、显示装置及其控制方法
US20190129229A1 (en) 2017-10-31 2019-05-02 Wuhan China Star Cptoelectronics Technology Co., Ltd Narrow frame display panel and display device
CN208673297U (zh) * 2018-08-29 2019-03-29 江西合力泰科技有限公司 带屏下指纹识别功能的显示屏
JP2020056943A (ja) * 2018-10-03 2020-04-09 株式会社デンソー 車両用表示装置
CN109656042A (zh) 2019-01-15 2019-04-19 苏州三星电子电脑有限公司 全面屏笔记本电脑
KR20200113984A (ko) * 2019-03-27 2020-10-07 삼성디스플레이 주식회사 표시 장치
CN110133902A (zh) 2019-04-29 2019-08-16 武汉华星光电技术有限公司 显示装置
CN110488407B (zh) 2019-08-05 2021-09-03 深圳市三利谱光电科技股份有限公司 局部具有偏振差异的偏光片及其制备方法
CN112909022B (zh) 2021-01-28 2022-09-09 Tcl华星光电技术有限公司 阵列基板、其制造方法和显示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106526943A (zh) * 2017-01-12 2017-03-22 京东方科技集团股份有限公司 一种液晶显示装置
CN106684100A (zh) * 2017-01-19 2017-05-17 京东方科技集团股份有限公司 一种阵列基板及其制作方法、显示装置
CN107728365A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 窄边框显示面板及显示装置
CN108983468A (zh) * 2018-07-27 2018-12-11 厦门天马微电子有限公司 一种显示装置
CN110112140A (zh) * 2019-04-22 2019-08-09 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制作方法
CN110488522A (zh) * 2019-07-29 2019-11-22 武汉华星光电技术有限公司 一种触控屏及其制备方法
CN110471208A (zh) * 2019-08-05 2019-11-19 厦门天马微电子有限公司 显示装置及其制作方法
CN110955356A (zh) * 2019-12-13 2020-04-03 武汉华星光电技术有限公司 显示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024113278A1 (zh) * 2022-11-30 2024-06-06 京东方科技集团股份有限公司 显示面板和显示装置

Also Published As

Publication number Publication date
US20220082882A1 (en) 2022-03-17
CN114167638A (zh) 2022-03-11
US11604376B2 (en) 2023-03-14
CN114730108A (zh) 2022-07-08
CN114730108B (zh) 2023-10-20
US20230056588A1 (en) 2023-02-23
US11714307B2 (en) 2023-08-01

Similar Documents

Publication Publication Date Title
WO2022052816A1 (zh) 显示装置及显示装置的制造方法
TWI719738B (zh) 顯示面板及顯示裝置
US11188118B2 (en) Displays with polarizer windows and opaque masking layers for electronic devices
WO2019085016A1 (zh) 窄边框显示面板及其制作方法、显示装置
US20210149089A1 (en) Display device
US9612492B2 (en) Border masking structures for liquid crystal display
US20140098332A1 (en) Displays With Logos and Alignment Marks
US20230408859A1 (en) Display module, manufacturing method thereof, and display device
US11309370B1 (en) Electronic device displays with curved surfaces
WO2020211534A1 (zh) 移动终端、盖板、显示组件
WO2018171078A1 (zh) 主动开关阵列基板及其制造方法与其应用的显示设备
US11526043B2 (en) Display device having DAM pattern with trench
TWI564154B (zh) 顯示模組
TW202305563A (zh) 電子裝置及其製造方法
CN117337107A (zh) 显示模组及电子设备
CN117460340A (zh) 显示面板、显示模组、显示模组的制作方法及显示设备
JP2008064944A (ja) 液晶表示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21865872

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21865872

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 20/11/2023)

122 Ep: pct application non-entry in european phase

Ref document number: 21865872

Country of ref document: EP

Kind code of ref document: A1