WO2022047739A1 - 梁式压力传感器、压力传感装置以及电子设备 - Google Patents
梁式压力传感器、压力传感装置以及电子设备 Download PDFInfo
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- WO2022047739A1 WO2022047739A1 PCT/CN2020/113538 CN2020113538W WO2022047739A1 WO 2022047739 A1 WO2022047739 A1 WO 2022047739A1 CN 2020113538 W CN2020113538 W CN 2020113538W WO 2022047739 A1 WO2022047739 A1 WO 2022047739A1
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- strain
- force
- pressure sensor
- type pressure
- circuit board
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- 238000005452 bending Methods 0.000 claims abstract description 53
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 12
- 238000006073 displacement reaction Methods 0.000 abstract description 9
- 230000035945 sensitivity Effects 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004832 voltammetry Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Definitions
- the present application relates to the technical field of pressure detection, and in particular to a beam-type pressure sensor, a pressure sensing device, and an electronic device.
- This beam-type pressure sensor is a sensing device, which uses a bending beam and a strain gauge to convert the measured pressure into a corresponding electrical signal change, wherein the bending beam is a cantilever structure.
- the bending beam is a single-ended cantilever structure
- the strain generated on the bending beam is small, resulting in The detection sensitivity of the beam pressure sensor decreases.
- One of the purposes of the embodiments of the present application is to provide a beam-type pressure sensor and device, which aims to solve the problem that the strain generated on the bending beam is relatively small when the displacement of the force to be detected is small, resulting in a decrease in detection sensitivity .
- a beam-type pressure sensor including:
- a curved beam the two ends of which are fixedly arranged, and the outer side wall surface of the curved beam has two oppositely arranged force surfaces and strain surfaces;
- each of the strain gauges is electrically connected to a circuit for detecting strain
- At least one of the force-bearing surface and the strain surface is provided with at least one of the strain gauges.
- the bending beam is in the shape of a sheet, one side of which is the force-bearing surface, and the other side is the strain surface.
- the length of the curved beam is between 1 mm and 50 mm
- the thickness of the curved beam is between 0.1 mm and 10 mm
- the aspect ratio of the curved beam is between 0.1 and 500.
- the Young's modulus of the curved beam is between 0.01 GPa and 1000 GPa.
- the beam-type pressure sensor further includes a strain-side circuit board, the strain-side circuit board is attached to the strain surface, and at least one of the strain gauges is arranged on the strain-side circuit board.
- the strain-side circuit board is bonded to the strain surface through a bonding structure.
- the beam-type pressure sensor further includes a circuit board on a force-bearing side, the circuit board on the force-bearing side is attached to the force-bearing surface, and at least one of the strain gauges is arranged on the circuit board on the force-bearing side.
- the circuit board on the stressed side is bonded to the strain surface through a bonding structure.
- At least one strain gauge is provided on both the force-bearing surface and the strain surface.
- the strain gauge is a varistor or a piezoelectric ceramic.
- the beam-type pressure sensor further includes a force-transmitting structural member, and the force-transmitting structural member is disposed opposite to the force-bearing surface and abuts against the force-bearing surface.
- a pressure sensing device comprising:
- the beam-type pressure sensor includes a bending beam, a strain gauge and a force transmission structure
- the strain gauges are provided with multiple, and the bending Both ends of the beam are fixedly arranged
- the outer side wall surface of the curved beam has two oppositely arranged force-bearing surfaces and strain surfaces, and at least one of the force-bearing surfaces and the strain surfaces is provided with at least one of the strain gauges , each of the strain gauges forms at least one circuit for detecting strain
- the force transmission structure is arranged opposite to the force bearing surface, and abuts against the force bearing surface;
- each of the force-transmitting structural members is in contact with the force-receiving member, and each of the beam-type pressure sensors is located between the base and the force-receiving member.
- the pressure sensing device further includes a common connection piece, and both ends of each of the bending beams are fixed to the common connection piece.
- each of the bending beams and the common connecting member is an integral structure.
- each of the bending beams is respectively connected to the common connecting member through at least one connecting member.
- an electronic device comprising at least one beam-type pressure sensor, the beam-type pressure sensor comprising:
- a curved beam the two ends of which are fixedly arranged, and the outer side wall surface of the curved beam has two oppositely arranged force surfaces and strain surfaces;
- each of the strain gauges is electrically connected to a circuit for detecting strain
- At least one of the force-bearing surface and the strain surface is provided with at least one of the strain gauges.
- both ends of the curved beam are fixedly arranged.
- the detected force only needs to generate a small displacement, so that the curved beam can generate a larger displacement.
- the strain difference therefore, in the case where the displacement of the detected force is small, due to the bending of the beam can produce a large strain difference, which improves the detection sensitivity of the beam pressure sensor.
- FIG. 1 is a structural diagram of a beam-type pressure sensor provided by an embodiment of the present application.
- FIG. 2 is a perspective view of a stress state of a bending beam of a beam-type pressure sensor provided by an embodiment of the present application
- Fig. 3 is the side view of Fig. 2;
- FIG. 4 is a surface strain distribution diagram of the curved beam of FIG. 2;
- FIG. 5 is a cross-sectional view of a curved beam of a beam-type pressure sensor provided by an embodiment of the present application
- 6 is a bridge circuit formed by the beam-type pressure sensor provided by the embodiment of the present application and having four strain gauges;
- FIG. 8 is two RC circuits of FIG. 7 that can be selectively implemented
- Figure 9 is a Wien bridge oscillation circuit
- Figure 10 is an RLC parallel resonant circuit
- 11 is a second measurement circuit of other measurement circuits of the beam pressure sensor provided by the embodiment of the present application.
- FIG. 13 is an exploded view of the pressure sensing device provided by the embodiment of the present application.
- FIG. 14 is a deformation diagram of the pressure sensing device provided by the embodiment of the present application and having four strain gauges;
- Figure 15 is an enlarged structural view of A in Figure 13;
- 16 is a perspective view of a partial structure of a pressure sensing device provided by an embodiment of the present application.
- 17 is a relationship diagram between the sum of electrical signals measured by each beam-type pressure sensor of the pressure sensing device provided by the embodiment of the present application and the weight of the object carried by the pressure sensing device;
- strain gauge 18 is a structural diagram of the strain gauge in the present application as a varistor
- 19 is a structural diagram of several other implementations of the beam-type pressure sensor of the present application.
- Figure 20 is a graph showing the relationship between the principal strain of the curved beam and the temperature field, wherein the temperature gradient direction of the curved beam and the principal strain gradient direction are in a vertical relationship;
- Figure 21 is a graph showing the relationship between the principal strain of the curved beam and the temperature field, wherein the direction of the temperature gradient of the curved beam and the direction of the principal strain gradient are in a parallel relationship;
- FIG. 22 is a pressure measurement flow chart of the pressure sensing device provided by the embodiment of the present application.
- 100-beam pressure sensor 110-strain gauge; 111-substrate; 112-pressure-sensitive adhesive; 113-conductive layer; 111-insulation layer; 120-bending beam; 1201-stress surface; 1202-strain surface; 130 -Strain side circuit board; 140-stress side circuit board; 150-bonded structural member; 160-force transmission structural member;
- some embodiments of the present application provide a beam-type pressure sensor 100 including a strain gauge 110 and a bending beam 120 .
- the two ends of the curved beam 120 are fixedly arranged, and the two ends of the curved beam 120 can be fixed in various ways, including but not limited to: fixing both ends with screws, fixing both ends with hard glue, and fixing both ends with welding Wait.
- the outer side wall surface of the curved beam 120 has two oppositely arranged force-bearing surfaces 1201 and strain surfaces 1202, wherein the force-bearing surface 1201 is used to receive the detected force, which can be directly received or externally detected.
- Structural members (such as the force-transmitting structural member 160 of the present application).
- a plurality of strain gauges 110 are provided, and each strain gauge 110 is electrically connected to a circuit for detecting strain.
- At least one strain gauge 110 is provided on at least one of the force bearing surface 1201 and the strain surface 1202 .
- the bending beam 120 is deformed, and the bending beam 120 transmits the detected force to each strain gauge 110, so that each strain gauge 110 generates stress and deformation, and then the piezoresistive The effect outputs an electrical signal corresponding to the intensity.
- both ends of the bending beam 120 are fixedly arranged.
- the difference in mechanical principles between them determines that the detected force only needs to generate a smaller displacement , the bending beam 120 can generate a large strain difference. Therefore, when the displacement of the detected force is small, since the bending beam 120 can generate a large strain difference, the bending beam 120 can be transmitted to different strain gauges.
- the strain difference between 110 is large, which improves the detection sensitivity of the beam-type pressure sensor 100, that is, the beam-type pressure sensor 100 improves the detection sensitivity, and the detected force only needs to generate a small displacement.
- strain gauges 110 may be arranged in different relative positional relationships and different relative angle relationships.
- FIG. 2 to FIG. 5 When in use, that is, when the force-bearing surface 1201 receives the detected force, the bending beam 120 is deformed, and the principal strain directions of the bending beam 120 at different positions and The bending beam 120 transmits the detected force to each strain gauge 110, so that each strain gauge 110 produces stress deformation, and forms a bridge circuit as shown in FIG. .
- the method for measuring the variation of the strain gauge 110 shown in FIG. 6 is only a common test method, and may also be the following measurement methods.
- the first measurement method as shown in Figure 7, use ohmmeter to measure resistance, voltammetry to measure resistance, RC circuit to measure resistance, RC oscillation circuit to measure resistance, RLC parallel resonant circuit to measure resistance, etc., which can be selected as needed.
- Ohmmeter resistance measurement and voltammetry resistance measurement are methods of direct resistance measurement, and the corresponding resistance measurement circuit belongs to the conventional technology.
- the RC circuit may be an RC series circuit as shown in FIG. 8 , or an RC parallel circuit. By charging and discharging the RC circuit, the time constant ⁇ of the RC circuit can be measured.
- the time constant of this RC circuit is:
- the resistance value R of the resistance can be inversely calculated by the measured time constant ⁇ .
- the RC oscillator circuit is a combination of an RC series-parallel frequency selection network and an amplifier, and the amplifier can use an integrated operational amplifier.
- the RC series-parallel frequency selection network is connected between the output terminal of the operational amplifier and the non-inverting input terminal to form a positive feedback
- RF and R' are connected between the output terminal of the operational amplifier and the inverting input terminal to form a negative feedback.
- the positive feedback circuit and the negative feedback circuit form a Venturi bridge oscillation circuit, and the input end and the output end of the operational amplifier are respectively connected across the two diagonal lines of the bridge.
- the output frequency of this Wien bridge oscillator circuit is:
- the frequency f 0 is very sensitive to changes in the resistance value R of the resistor. According to the above formula, if the capacitance C of the capacitor is known, the resistance value R of the resistor can be inversely calculated by the measured frequency f 0 .
- the RLC parallel resonant circuit is a circuit in which the RL series circuit and the capacitor C are connected in parallel.
- the angular frequency of this RLC parallel resonant circuit is:
- the resistance value R of the resistor can be inversely calculated through the measured angular frequency ⁇ .
- the second measurement method As shown in Figure 11, the resistors Rm and Rf in the circuit form a half-bridge circuit, a constant voltage source is used, and the input voltage VCC is applied to both ends of the circuit to detect the potential at OUTPUT, or measure the difference between OUTPUT and ground. Between the output voltage Uo, there is input and output voltage formula:
- the third measurement method as shown in Figure 12, the shunt circuit formed by the resistors Rm1 and Rf1 in the circuit in parallel.
- a constant current source is used, the input current I is applied to both ends of I+ and I-, and the output current I1 on the Rm1 branch is measured.
- each strain gauge 110 is arranged at different positions of the bending beam 120, and measuring the strain difference at different positions can effectively measure the pressure.
- the temperature of the strain gage 110 at different positions may be different. Designing the position of the strain gage 110 according to the distribution of the temperature field can offset the influence of temperature.
- FIG. 7 Several implementation structures are shown in FIG. 7 , which can be selected according to requirements. , thereby improving the accurate measurement of the force by the beam pressure sensor 100 .
- Figure 21 and Figure 22 illustrate temperature compensation.
- the temperature gradient direction of the bending beam 120 in FIG. 21 is in a vertical relationship with the principal strain gradient direction, and four strain gauges 110 form a Wheatstone bridge. As shown in FIGS.
- Rm1 and Rf1 in the circuit are placed On the parallel line of the x-axis, that is, the isotherm, place Rm2 and Rf2 in the circuit on the parallel line of the x-axis, that is, the isotherm, so that the effect of temperature on the output signal of the bridge can be offset.
- the strains of the bending beams 120 corresponding to the positions of Rm1 and Rf1 are different. Therefore, when the bending beams are deformed, the bridge outputs a signal measuring the deformation of the bending beams, Rm2 and Rf2, and the same is true.
- the straight line where the four strain gauges 110 are located is parallel to the y-axis, forming a Wheatstone bridge. Since the strain sensitivity factor of the varistor in the pressure sensing device is dependent on the angle, as shown in Figure 23. Therefore, although the strains of the bending beam 120 are the same at the positions where the four varistors are located, the changes of the varistors are different at different placement angles. Therefore, when the bending beam 120 is deformed, the bridge outputs a signal measuring the deformation of the bending beam 120 . Since the straight line on which the four varistors are located is perpendicular to the direction of the temperature gradient, the temperature of the four varistors is the same, thereby offsetting the effect of temperature on the output signal of the bridge.
- the bending beam 120 is in the shape of a sheet, one side of which is the stress surface 1201 , and the other side is the strain surface 1202 .
- the structure is simple, easy to manufacture, and beneficial to reduce the manufacturing cost of the beam-type pressure sensor 100 .
- the length, width and thickness of the curved beam 120 can be set according to requirements.
- the length of the bending beam 120 is between 1 mm and 50 mm
- the thickness of the bending beam 120 is between 0.1 mm and 10 mm
- the aspect ratio of the bending beam 120 is between 0.1 and 500.
- the Young's modulus of the curved beam 120 is between 0.01GPa and 1000GPa, and can be made of stainless steel, aluminum alloy, plastic, glass, or PCB.
- the beam pressure sensor 100 further includes a strain side circuit board 130 , the strain side circuit board 130 is attached to the strain surface 1202 , and at least one strain gauge 110 is arranged on the strain side circuit board 130 .
- the assembly difficulty can be reduced.
- the device 110 may be mounted on the strain side circuit board 130, may be printed (eg, screen printing, stencil printing, inkjet, slot-die, draw-bar, roll-to-roll, etc.), or may be Lamination, welding (eg, SMT, laser welding, ACF, etc.), etc.
- printed eg, screen printing, stencil printing, inkjet, slot-die, draw-bar, roll-to-roll, etc.
- Lamination eg, SMT, laser welding, ACF, etc.
- the strain-side circuit board 130 is bonded to the strain surface 1202 through the bonding structural member 150 .
- the beam-type pressure sensor 100 further includes a circuit board 140 on the force-bearing side, the circuit board 140 on the force-bearing side is attached to the force-bearing surface 1201 , and at least one strain gauge is placed on the circuit board 140 on the force-bearing side. device 110.
- the assembly difficulty can be reduced.
- the strain gauge 110 can be mounted on the circuit board 140 on the force side and can be printed (eg, screen printing, stencil printing, inkjet, slot-die, draw-bar, roll-to-roll, etc. ), bonding, welding (eg, SMT, laser welding, ACF, etc.), etc., can also be used.
- printed eg, screen printing, stencil printing, inkjet, slot-die, draw-bar, roll-to-roll, etc.
- bonding eg, SMT, laser welding, ACF, etc.
- the circuit board 140 on the stressed side is bonded to the strain surface 1202 through the bonding structural member 150 .
- At least one strain gauge 110 is provided on both the force receiving surface 1201 and the strain surface 1202 . In this way, the detection sensitivity of the beam pressure sensor 100 can be further improved.
- the strain gauge 110 is a varistor or piezoelectric ceramic.
- the varistor can be a resistor of various materials, and the resistor has the following characteristics, that is, the resistance value of the resistor changes with the occurrence of mechanical deformation of the resistor.
- the varistor includes a substrate 111, a pressure-sensitive adhesive 112, a conductive layer 113 and an insulating layer, 114, wherein the resistance of the pressure-sensitive adhesive 112 changes with the change of its strain, and the conductive layer 113 acts as a wire , the insulating layer 114 plays the role of electrical isolation and protection.
- a high thermal conductivity thin film material or coating such as an aluminum film, a copper film, and a graphite film can also be pasted on the outer side of the insulating layer 114 .
- the beam-type pressure sensor 100 further includes a force-transmitting structural member 160 , and the force-transmitting structural member 160 is disposed opposite to the force-receiving surface 1201 and abuts against the force-receiving surface 1201 .
- the force-transmitting structural members 160 can be made to resist the same force-receiving member 200 together, so that the plurality of beam-type pressure sensors 100 can jointly detect the same force.
- the force transmission structure 160 may be made of different hardness materials, or soft, such as silicone, rubber, foam, etc., or hard, such as plastic, glass, epoxy glue, and the like.
- the position where the force-transmitting structure 160 is arranged on the curved beam 120 may be in the center of the curved beam 120 or not in the center, and may be offset.
- some embodiments of the present application provide a pressure sensing device, including:
- the beam-type pressure sensor 100 includes a bending beam 120, a strain gauge 110 and a force transmission structure 160, and there are multiple strain gauges 110, Both ends of the curved beam 120 are fixedly arranged, and the outer side wall surface of the curved beam 120 has two oppositely arranged force-bearing surfaces 1201 and strain surfaces 1202 , and at least one of the force-bearing surfaces 1201 and the strain surfaces 1202 is provided with at least one strain gauge 110 , each strain gauge 110 forms at least one circuit for detecting strain, and the force transmission structure 160 is disposed opposite to the force bearing surface 1201 and abuts against the force bearing surface 1201;
- each force transmission structure member 160 is in contact with the force receiving member 200
- each of the beam-type pressure sensors 100 is located between the base 400 and the force receiving member 200 .
- the force-receiving member 200 When the force-receiving member 200 is strongly pressed, the force-receiving member 200 is simultaneously supported by a plurality of beam-type pressure sensors 100, and the sum of the supporting forces and the pressing force balance each other. Therefore, at any position within the effective range of the force-receiving member 200 When a constant pressure is applied, the sum of the measured signals of the multiple beam pressure sensors 100 is a constant value. Therefore, the pressure can be accurately measured without the system providing position information, and within a certain range, the relationship between the signal and the pressure is linear. , as shown in Figure 5, so it can be used to measure the pressure value.
- the bending beams 120 may be independent of each other, or may be connected to each other; the positional relationship of the beam-type pressure sensors 100 may be in a line-shaped, triangular, rectangular, etc. layout.
- each strain gauge 110 forms an electric bridge, and the electrical signal of each strain gauge 110 is transmitted to the A/D converter through the amplifying circuit, converted into a digital signal and then inputted Microprocessor, in the microprocessor realizes different functions by designing different software algorithms.
- the pressure sensing device further includes a common connecting piece 300 , and both ends of each bending beam 120 are fixed to the common connecting piece 300 .
- the bending beams 120 and each bending beam 120 can be formed at one time through a stamping process through a sheet-like structure, so that the difficulty and cost of manufacturing can be reduced.
- each bending beam 120 may also be connected to the common connecting member 300 through at least one connecting member, so as to realize the mechanical connection between each bending beam 120 and the common connecting member 300 .
- the bending beams 120 and the common connecting member 300 may also be non-integrated structures, but are connected together by mechanical means.
- Some embodiments of the present application provide an electronic device including at least one beam-type pressure sensor 100, the beam-type pressure sensor 100 including:
- the curved beam 120 is fixedly arranged at both ends, and the outer side wall surface of the curved beam 120 has two oppositely arranged force surfaces 1201 and strain surfaces 1202;
- At least one strain gauge 110 is provided on at least one of the force bearing surface 1201 and the strain surface 1202 .
- Electronic devices include but are not limited to smartphones, tablet computers, laptop computers, computer input devices, touch pads, track pads, electronic scales, and the like.
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Abstract
一种梁式压力传感器(100)、压力传感装置以及电子设备,梁式压力传感器(100)包括:弯曲梁(120),其两端固定设置,弯曲梁(120)的外侧壁面具有两个相对设置的受力面(1201)以及应变面(1202);应变器(110),设有一个或多个,各应变器(110)电连接于用于检测应变的电路;其中,受力面(1201)和应变面(1202)至少其中之一设置有至少一个应变器(110)。梁式压力传感器(100)提高了检测灵敏度,被检测的力只需产生较小的位移。
Description
本申请涉及压力检测技术领域,具体涉及一种梁式压力传感器、压力传感装置以及电子设备。
这梁式压力传感器是一种传感装置,是利用弯曲梁和应变器将被测压力转换为相应电学信号变化的压力传感器,其中,弯曲梁为悬臂结构。在实际应用过程中,基于弯曲梁为单端悬臂结构,在被检测的力的位移较小的情况,由于单端固支悬臂梁的力学结构原理限制,弯曲梁上产生的应变偏小,导致梁式压力传感器检测灵敏度下降。
本申请实施例的目的之一在于:提供一种梁式压力传感器以及设备,旨在解决在被检测的力的位移较小的情况,弯曲梁上产生的应变偏小,导致检测灵敏度下降的问题。
为解决上述技术问题,本申请实施例采用的技术方案是:
第一方面,提供了一种梁式压力传感器,包括:
弯曲梁,其两端固定设置,所述弯曲梁的外侧壁面并具有两个相对设置的受力面以及应变面;
应变器,设有多个,各所述应变器电连接于用于检测应变的电路;
其中,所述受力面和所述应变面至少其中之一设置有至少一个所述应变器。
可选地,所述弯曲梁呈片状,其一侧片面为所述受力面,而另一侧片面则为所述应变面。
可选地,所述弯曲梁的长度介于1mm至50mm之间,所述弯曲梁的厚度介于0.1mm至10mm之间,所述弯曲梁的宽厚比介于0.1至500。
可选地,所述弯曲梁的杨氏模量介于0.01GPa至1000GPa之间。
可选地,所述梁式压力传感器还包括应变侧线路板,所述应变侧线路板贴合于所述应变面,所述应变侧线路板至少安置有一个所述应变器。
可选地,所述应变侧线路板通过粘结结构件粘接于所述应变面。
可选地,所述梁式压力传感器还包括受力侧线路板,所述受力侧线路板贴合于所述受力面,所述受力侧线路板至少安置有一个所述应变器。
可选地,所述受力侧线路板通过粘结结构件粘接于所述应变面。
可选地,所述受力面和所述应变面均设置至少一个应变器。
可选地,所述应变器为压敏电阻或压电陶瓷。
可选地,所述梁式压力传感器还包括传力结构件,所述传力结构件与所述受力面相对设置,且抵接于所述受力面。
第二方面,提供了一种压力传感装置,包括:
底座;
受力件;
梁式压力传感器,至少设有两个,均安装于所述底座,其中,所述梁式压力传感器包括弯曲梁、应变器和传力结构件,所述应变器设有多个,所述弯曲梁的两端固定设置,所述弯曲梁的外侧壁面并具有两个相对设置的受力面以及应变面,所述受力面和所述应变面至少其中之一设置有至少一个所述应变器,各所述应变器至少形成一个用于检测应变的电路,所述传力结构件与所述受力面相对设置,且抵接于所述受力面;
其中,各所述传力结构件均与所述受力件抵接,各所述梁式压力传感器位于所述底座和所述受力件之间。
可选地,所述压力传感装置还包括共接件,各所述弯曲梁的两端均固定于所述共接件。
可选地,各所述弯曲梁与所述共接件为一体结构。
可选地,各所述弯曲梁分别通过至少一个连接件连接至所述共接件。
第三方面,提供一种电子设备,包括至少一个梁式压力传感器,所述梁式压力传感器包括:
弯曲梁,其两端固定设置,所述弯曲梁的外侧壁面并具有两个相对设置的受力面以及应变面;
应变器,设有多个,各所述应变器电连接于用于检测应变的电路;
其中,所述受力面和所述应变面至少其中之一设置有至少一个所述应变器。
在本申请中,弯曲梁的两端固定设置,与弯曲梁仅是一端固定(即为悬臂结构)相比,被检测的力只需产生较小的位移,就能让弯曲梁产生较大的应变差异,因此,在被检测的力的位移较小的情况,由于弯曲梁能够产生较大的应变差异,这提高了梁式压力传感器的检测灵敏度。
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例或示范性技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。
图1是本申请实施例提供的梁式压力传感器的结构图;
图2是本申请实施例提供的梁式压力传感器的弯曲梁的受力状态立体图;
图3是图2的侧视图;
图4是图2的弯曲梁的表面应变分布图;
图5是本申请实施例提供的梁式压力传感器的弯曲梁的截面图;
图6是本申请实施例提供的梁式压力传感器且在具有四个应变器时组成的电桥电路;
图7是本申请实施例提供的梁式压力传感器的其他测量电路的第一种测量电路;
图8是图7的可以选择实施的两种RC电路;
图9是文氏电桥振荡电路;
图10是RLC并联谐振电路;
图11是本申请实施例提供的梁式压力传感器的其他测量电路的第二种测量电路;
图12是本申请实施例提供的梁式压力传感器的其他测量电路的第三种测量电路;
图13是本申请实施例提供的压力传感装置的分解图;
图14是本申请实施例提供的压力传感装置且在具有四个应变器时的形变图;
图15是图13中A的放大结构图;
图16是本申请实施例提供的压力传感装置的局部结构立体图;
图17是本申请实施例提供的压力传感装置的各梁式压力传感器的测量的电信号总和与压力传感装置所承载的物件重量之间的关系图;
图18是本申请中应变器为一种压敏电阻的结构图;
图19是本申请的梁式压力传感器的其他几种实施结构图;
图20是弯曲梁主应变与温度场关系图,其中,弯曲梁的温度梯度方向和主应变梯度方向是垂直关系;
图21是弯曲梁主应变与温度场关系图,其中,弯曲梁的温度梯度方向和主应变梯度方向是平行关系;
图22是本申请实施例提供的压力传感装置的压力测量流程图;
图23是本申请的压力传感装置中压敏电阻的应变灵敏度因数与角度的关系图。
附图标记说明:
100-梁式压力传感器;110-应变器;111-基材;112-感压胶;113-导电层;111-绝缘层;120-弯曲梁;1201-受力面;1202-应变面;130-应变侧线路板;140-受力侧线路板;150-粘结结构件;160-传力结构件;
200-受力件;300-共接件;400-底座。
为了使本申请的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,并不用于限定本申请。
需说明的是,当部件被称为“固定于”或“设置于”另一个部件,它可以直接在另一个部件上或者 间接在该另一个部件上。当一个部件被称为是“连接于”另一个部件,它可以是直接或者间接连接至该另一个部件上。“多个”的含义是两个或两个以上,除非另有明确具体的限定。
为了说明本申请所提供的技术方案,以下结合具体附图及实施例进行详细说明。
请参阅图1,本申请的一些实施例提供一种梁式压力传感器100,包括应变器110和弯曲梁120。
具体地,弯曲梁120的两端固定设置,弯曲梁120的两端固定可以通过各种形式来固定,包括但不限于:两端用螺钉固定、两端用硬胶固定、两端用焊接固定等。弯曲梁120的外侧壁面并具有两个相对设置的受力面1201以及应变面1202,其中,受力面1201用于接受被检测的力,可以是直接接受被检测的力,也可以是通过外部结构件(如本申请的传力结构件160)。
应变器110设有多个,各应变器110电连接于用于检测应变的电路。
其中,受力面1201和应变面1202至少其中之一设置有至少一个应变器110。
在使用时,即受力面1201接受被检测的力时,弯曲梁120发生形变,弯曲梁120把被检测的力传递给各应变器110,让各应变器110产生应力形变,再由压阻效应输出对应强度的电信号。
在本申请中,弯曲梁120的两端固定设置,与弯曲梁120仅是一端固定(即为悬臂结构)相比,他们之间的力学原理差异决定被检测的力只需产生较小的位移,就能让弯曲梁120产生较大的应变差异,因此,在被检测的力的位移较小的情况,由于弯曲梁120能够产生较大的应变差异,使得弯曲梁120传递至不同的应变器110之间的应变差异较大,这提高了梁式压力传感器100的检测灵敏度,也即是梁式压力传感器100提高了检测灵敏度,被检测的力也只需产生较小的位移。
在此需要说明的是,应变器110之间可以以不同的相对位置关系和不同的相对角度关系布置。
关于梁式压力传感器的力学工作原理,可参阅图2至图5,在使用时,即受力面1201接受被检测的力时,弯曲梁120发生形变,弯曲梁120不同位置的主应变方向和大小不一样,弯曲梁120把被检测的力传递给各应变器110,让各应变器110产生应力形变,并组成如图6所示的电桥电路再由压阻效应输出对应强度的电信号。
图6所示的测量应变器110变化量的方法只是一种常用的测试方式,还可以是如下几种测量方式。
第一种测量方式:如图7所示,采用欧姆表测电阻、伏安法测电阻、RC电路测电阻、RC振荡电路测电阻、RLC并联谐振电路测电阻等方式,按需选用。欧姆表测电阻与伏安法测电阻为直接测量电阻的方式,相应的电阻测量电路属于常规技术。RC电路可以是如图8中的RC串联电路,还可以是RC并联电路。通过对RC电路充放电,可测量RC电路的时间常数τ。该RC电路的时间常数为:
τ=RC
依据上述公式,已知电容的电容量C,则可以通过测量到的时间常数τ反算出电阻阻值R。
如图9所示,RC振荡电路是将RC串并联选频网络和放大器结合起来,放大器可采用集成运算放大器。RC串并联选频网络接在运算放大器的输出端和同相输入端之间,构成正反馈,R
F、R’接在运算 放大器的输出端和反相输入端之间,构成负反馈。正反馈电路和负反馈电路构成一文氏电桥振荡电路,运算放大器的输入端和输出端分别跨接在电桥的两对角线上。该文氏电桥振荡电路的输出频率为:
频率f
0对电阻阻值R的变化非常敏感。依据上述公式,已知电容的电容量C,则可以通过测量到的频率f
0反算出电阻阻值R。
如图10所示,RLC并联谐振电路是将RL串联电路和电容器C并联的电路。该RLC并联谐振电路的角频率为:
依据上述公式,已知电感的电感量L和电容的电容量C,则可以通过测量出的角频率ω反算出电阻阻值R。
第二种测量方式:如图11所示,电路中的电阻Rm和Rf组成半桥电路,采用恒压源,在电路两端加以输入电压VCC,检测OUTPUT处的电势,或测量OUTPUT与地之间的输出电压Uo,有输入输出电压公式:
Uo=Vcc*Rm1/(Rm1+Rf1)
第三种测量方式:如图12所示,电路中的电阻Rm1和Rf1并联形成的分流电路。采用恒流源,在I+与I-两端加以输入电流I,测量Rm1支路上的输出电流I1,有输入输出电流公式:
I1=(Rf1/(Rm1+Rf1))*I
在此需要说明的是,在具体实施例中,各应变器110布置在弯曲梁120的不同位置,测量不同位置的应变差可以有效的测量压力。在实际应用场景中,不同位置的应变器110的温度可能会存在差异,根据温度场的分布设计应变器110的位置可以抵消温度的影响,如图7示出几种实施结构,可根据需求选择,进而提高梁式压力传感器100对力的精准测量。图21和图22对温度温度补偿进行了说明。其中图21中弯曲梁120的温度梯度方向和主应变梯度方向是垂直的关系,四个应变器110组成一个惠斯通电桥,如图2至图4所示,将电路中的Rm1和Rf1放置在x轴的平行线上,即等温线上,将电路中的Rm2和Rf2放置在x轴的平行线上,即等温线上,这样可以抵消温度对电桥输出信号的影响。同时,Rm1和Rf1所在位置对应的弯曲梁120的应变不同,故,弯曲梁变形时,电桥输出衡量弯曲梁变形的信号,Rm2和Rf2,同理。另外,图22中的弯曲梁120的温度梯度方向和主应变梯度方向是平行关系,四个应变器110所在的直线与y轴平行,组成一个惠斯通电桥。由于压力传感装置中压敏电阻的应变灵 敏度因数与角度有关,如图23。因此,虽然四个压敏电阻所在的位置处弯曲梁120的应变相同,但是放置角度不同,压敏电阻的变化不同,故,弯曲梁120变形时,电桥输出衡量弯曲梁120变形的信号。由于这四个压敏电阻所在的直线与温度梯度方向垂直,因此,这四个压敏电阻的温度相同,进而抵消温度对电桥输出信号的影响。
在此需要说明的是在一个实施例中,请参阅图1,弯曲梁120呈片状,其一侧片面为受力面1201,而另一侧片面则为应变面1202。该结构简单,便于生产制造,有利于降低梁式压力传感器100的制造成本。
在具体实施中,弯曲梁120的长度、宽度和厚度根据需求设置即可。
在本实施例中,弯曲梁120的长度介于1mm至50mm之间,弯曲梁120的厚度介于0.1mm至10mm之间,弯曲梁120的宽厚比介于0.1至500。
在本实施例中,所述弯曲梁120的杨氏模量介于0.01GPa至1000GPa之间,具体可由不锈钢、铝合金、塑料、玻璃或PCB等材质制成。
在一个实施例中,请参阅图1,梁式压力传感器100还包括应变侧线路板130,应变侧线路板130贴合于应变面1202,应变侧线路板130至少安置有一个应变器110。相对于将应变器110直接地安装至应变面1202,将应变器110安装到应变侧线路板130后,再随应变侧线路板130一并安装至应变面1202,能够降低装配难度,其中,应变器110可采用安装于应变侧线路板130的方式可以采用印刷(如,丝网印、钢网印、喷墨、slot-die、draw-bar、roll-to-roll等等),也可以采用贴合、焊接(如,SMT、激光焊、ACF等等)等等。
在本实施例中,应变侧线路板130通过粘结结构件150粘接于应变面1202。
在一个实施例中,请参阅图1,梁式压力传感器100还包括受力侧线路板140,受力侧线路板140贴合于受力面1201,受力侧线路板140至少安置有一个应变器110。相对于将应变器110直接地安装至受力面1201,将应变器110安装到受力侧线路板140后,再随受力侧线路板140一并安装至受力面1201,能够降低装配难度,其中,应变器110可采用安装于受力侧线路板140的方式可以采用印刷(如,丝网印、钢网印、喷墨、slot-die、draw-bar、roll-to-roll等等),也可以采用贴合、焊接(如,SMT、激光焊、ACF等等)等等。
在本实施例中,受力侧线路板140通过粘结结构件150粘接于应变面1202。
在一个实施例中,请参阅图1,受力面1201和应变面1202均设置至少一个应变器110。如此,可进一步提高梁式压力传感器100的检测灵敏度。
在一个实施例中,应变器110为压敏电阻或压电陶瓷。其中,压敏电阻可以是各种材质的电阻,电阻具有如下特性,即,电阻阻值随电阻的机械变形的发生而改变。
如图18所示,压敏电阻包括基材111、感压胶112、导电层113和绝缘层,114其中,感压胶112 的阻值随其应变的改变而变化,导电层113起导线作用,绝缘层114起电隔离和保护的作用。此外,为了减小各个电阻的温度差异对信号的干扰,还可以在绝缘层114的外侧贴铝膜、铜膜、石墨膜等高导热率薄膜材料或涂层。
在一个实施例中,梁式压力传感器100还包括传力结构件160,传力结构件160与受力面1201相对设置,且抵接于受力面1201。如此,在多个梁式压力传感器100同时使用时,可让各传力结构件160共同抵触同一受力件200,让多个梁式压力传感器100共同检测同一个力。传力结构件160可以是由不同硬度材质制成,也可以是软的,比如,硅胶,橡胶,泡棉等,还可以是硬的,比如塑料,玻璃,环氧胶等。传力结构件160安置在弯曲梁120的位置可以是在弯曲梁120的中心,也可以不在中心,可以偏置。
请参阅图13、图15以及图16,本申请的一些实施例提供一种压力传感装置,包括:
底座400;
受力件200;
梁式压力传感器100,至少设有两个,均安装于所述底座400,其中,梁式压力传感器100包括弯曲梁120、应变器110和传力结构件160,应变器110设有多个,弯曲梁120的两端固定设置,弯曲梁120的外侧壁面并具有两个相对设置的受力面1201以及应变面1202,受力面1201和应变面1202至少其中之一设置有至少一个应变器110,各应变器110至少形成一个用于检测应变的电路,传力结构件160与受力面1201相对设置,且抵接于受力面1201;
其中,各传力结构件160均与受力件200抵接,各所述梁式压力传感器100位于所述底座400和所述受力件200之间。
当有力按压在受力件200上时,受力件200同时受到多个梁式压力传感器100的支撑力,支撑力之和与按压力相互平衡,因此,在受力件200有效范围的任意位置施加恒定压力,多个梁式压力传感器100的测量的信号总和是恒定值,因此,不需要***提供位置信息即可精确测量出压力的大小,并且在一定范围内,信号和压力的关系是线性的,如图5所示,所以可以用来测量压力值。
其中,各弯曲梁120可以相互独立,也可以是相互连接的;各梁式压力传感器100对位置关系可以是一字形、三角形、矩形等布局。
如图22所示,在本实施例中,各应变器110组成的电桥,并把各应变器110的电信号通过放大电路把电信号传递至A/D转换器,转换为数字信号后输入微处理器,在微处理器里通过设计不同的软件算法实现不同的功能。
在本实施例中,压力传感装置还包括共接件300,各弯曲梁120的两端均固定于共接件300,具体地,各弯曲梁120与共接件300一体结构,共接件300与各弯曲梁120可通过一片状结构通过冲压工艺一次成型,如此,可降低生产制造的难度以及成本。
在其他实施例中,各弯曲梁120还可分别通过至少一个连接件连接至共接件300,从而实现各弯曲梁120与共接件300之间的机械连接。
当然,在其他实施例,各弯曲梁120与共接件300也可以是非一体结构,但通过机械方式连接在一起。
本申请的一些实施例提供一种电子设备,包括至少一个梁式压力传感器100,梁式压力传感器100包括:
弯曲梁120,其两端固定设置,弯曲梁120的外侧壁面并具有两个相对设置的受力面1201以及应变面1202;
应变器110,设有一个或多个,各应变器110电连接于用于检测应变的电路;
其中,受力面1201和应变面1202至少其中之一设置有至少一个应变器110。
电子设备为包括但不限于智能手机、平板电脑、手提电脑、电脑输入设备、touch pad、track pad、电子秤等等。
以上仅为本申请的可选实施例而已,并不用于限制本申请。对于本领域的技术人员来说,本申请可以有各种更改和变化。凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的权利要求范围之内。
Claims (16)
- 梁式压力传感器,其特征在于,包括:弯曲梁,其两端固定设置,所述弯曲梁的外侧壁面并具有两个相对设置的受力面以及应变面;应变器,设有一个或多个,各所述应变器电连接于用于检测应变的电路;其中,所述受力面和所述应变面至少其中之一设置有至少一个所述应变器。
- 根据权利要求1所述的梁式压力传感器,其特征在于,所述弯曲梁呈片状,其一侧片面为所述受力面,而另一侧片面则为所述应变面。
- 根据权利要求2所述的梁式压力传感器,其特征在于,所述弯曲梁的长度介于1mm至50mm之间,所述弯曲梁的厚度介于0.1mm至10mm之间,所述弯曲梁的宽厚比介于0.1至500。
- 根据权利要求2所述的梁式压力传感器,其特征在于,所述弯曲梁的杨氏模量介于0.01GPa至1000GPa之间。
- 根据权利要求1所述的梁式压力传感器,其特征在于,所述梁式压力传感器还包括应变侧线路板,所述应变侧线路板贴合于所述应变面,所述应变侧线路板至少安置有一个所述应变器。
- 根据权利要求5所述的梁式压力传感器,其特征在于,所述应变侧线路板通过粘结结构件粘接于所述应变面。
- 根据权利要求1所述的梁式压力传感器,其特征在于,所述梁式压力传感器还包括受力侧线路板,所述受力侧线路板贴合于所述受力面,所述受力侧线路板至少安置有一个所述应变器。
- 根据权利要求7所述的梁式压力传感器,其特征在于,所述受力侧线路板通过粘结结构件粘接于所述应变面。
- 根据权利要求1所述的梁式压力传感器,其特征在于,所述受力面和所述应变面均设置至少一个应变器。
- 根据权利要求1所述的梁式压力传感器,其特征在于,所述应变器为压敏电阻或压电陶瓷。
- 根据权利要求1所述的梁式压力传感器,其特征在于,所述梁式压力传感器还包括传力结构件,所述传力结构件与所述受力面相对设置,且抵接于所述受力面。
- 压力传感装置,其特征在于,包括:底座;受力件;梁式压力传感器,至少设有两个,均安装于所述底座,其中,所述梁式压力传感器包括弯曲梁、应变器和传力结构件,所述应变器设有多个,所述弯曲梁的两端固定设置,所述弯曲梁的外侧壁面并具有两个相对设置的受力面以及应变面,所述受力面和所述应变面至少其中之一设置有至少一个所述应变器,各所述应变器至少形成一个用于检测应变的电路,所述传力结构件与所述受力面相对设置,且抵接于所述受力面;其中,各所述传力结构件均与所述受力件抵接,各所述梁式压力传感器位于所述底座和所述受力件之间。
- 根据权利要求12所述的压力传感装置,其特征在于,所述压力传感装置还包括共接件,各所述弯曲梁的两端均固定于所述共接件。
- 根据权利要求13所述的压力传感装置,其特征在于,各所述弯曲梁与所述共接件一体结构。
- 根据权利要求13所述的压力传感装置,其特征在于,各所述弯曲梁分别通过至少一个连接件连接至所述共接件。
- 电子设备,其特征在于,包括至少一个梁式压力传感器,所述梁式压力传感器包括:弯曲梁,其两端固定设置,所述弯曲梁的外侧壁面并具有两个相对设置的受力面以及应变面;应变器,设有多个,各所述应变器电连接于用于检测应变的电路;其中,所述受力面和所述应变面至少其中之一设置有至少一个所述应变器。
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1873386A (zh) * | 2006-06-30 | 2006-12-06 | 武汉理工大学 | 梁式光纤光栅动态称重*** |
CN201335730Y (zh) * | 2009-01-14 | 2009-10-28 | 浙江霸王衡器有限公司 | 电子秤传感器传力结构 |
CN202614433U (zh) * | 2012-05-02 | 2012-12-19 | 武汉理工大学 | 光纤光栅土压力传感器 |
CN103134625A (zh) * | 2011-11-29 | 2013-06-05 | 北京交通大学 | H型测力构架的扭转载荷测试结构 |
CN103759632A (zh) * | 2014-01-25 | 2014-04-30 | 重庆大唐科技股份有限公司 | 用于测量结构挠度的应变式传感器 |
US20140224037A1 (en) * | 2011-09-22 | 2014-08-14 | The University Of Tokyo | Tactile Sensor And Multi-Axial Tactile Sensor |
CN204652340U (zh) * | 2015-06-05 | 2015-09-16 | 深圳纽迪瑞科技开发有限公司 | 压力感应按键结构及具有该压力感应按键结构的终端设备 |
CN206330693U (zh) * | 2016-12-19 | 2017-07-14 | 深圳纽迪瑞科技开发有限公司 | 压力传感器及具有该压力传感器的电子设备 |
CN107314852A (zh) * | 2016-04-26 | 2017-11-03 | 佛山市禾才科技服务有限公司 | 一种手腕传感器 |
-
2020
- 2020-09-04 CN CN202080103578.3A patent/CN116113913A/zh active Pending
- 2020-09-04 US US18/024,456 patent/US20230332964A1/en active Pending
- 2020-09-04 WO PCT/CN2020/113538 patent/WO2022047739A1/zh active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1873386A (zh) * | 2006-06-30 | 2006-12-06 | 武汉理工大学 | 梁式光纤光栅动态称重*** |
CN201335730Y (zh) * | 2009-01-14 | 2009-10-28 | 浙江霸王衡器有限公司 | 电子秤传感器传力结构 |
US20140224037A1 (en) * | 2011-09-22 | 2014-08-14 | The University Of Tokyo | Tactile Sensor And Multi-Axial Tactile Sensor |
CN103134625A (zh) * | 2011-11-29 | 2013-06-05 | 北京交通大学 | H型测力构架的扭转载荷测试结构 |
CN202614433U (zh) * | 2012-05-02 | 2012-12-19 | 武汉理工大学 | 光纤光栅土压力传感器 |
CN103759632A (zh) * | 2014-01-25 | 2014-04-30 | 重庆大唐科技股份有限公司 | 用于测量结构挠度的应变式传感器 |
CN204652340U (zh) * | 2015-06-05 | 2015-09-16 | 深圳纽迪瑞科技开发有限公司 | 压力感应按键结构及具有该压力感应按键结构的终端设备 |
CN107314852A (zh) * | 2016-04-26 | 2017-11-03 | 佛山市禾才科技服务有限公司 | 一种手腕传感器 |
CN206330693U (zh) * | 2016-12-19 | 2017-07-14 | 深圳纽迪瑞科技开发有限公司 | 压力传感器及具有该压力传感器的电子设备 |
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