WO2022024482A1 - Frame - Google Patents

Frame Download PDF

Info

Publication number
WO2022024482A1
WO2022024482A1 PCT/JP2021/016590 JP2021016590W WO2022024482A1 WO 2022024482 A1 WO2022024482 A1 WO 2022024482A1 JP 2021016590 W JP2021016590 W JP 2021016590W WO 2022024482 A1 WO2022024482 A1 WO 2022024482A1
Authority
WO
WIPO (PCT)
Prior art keywords
ring
main body
fixing groove
frame
cross
Prior art date
Application number
PCT/JP2021/016590
Other languages
French (fr)
Japanese (ja)
Inventor
聡一 橋本
Original Assignee
株式会社アイエス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アイエス filed Critical 株式会社アイエス
Publication of WO2022024482A1 publication Critical patent/WO2022024482A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a frame in which a workpiece such as a semiconductor wafer is mounted via a tape attached to one side.
  • the metal frame is relatively heavy, the manufacturing cost is relatively high, and the frame on which the workpiece is mounted is stored in a cassette container made of, for example, an aluminum-based alloy plate. There is a problem that dust may be generated due to the contact between the metal and the cassette container.
  • the synthetic resin frame has a relatively low strength and may be damaged due to erroneous operation or the like, and the adhesive strength between one side of the frame and the tape tends to be insufficient. When the region attached to one side of the frame is cut into a required shape (usually a circle), there is a problem that one side of the frame may be damaged by the cutting tool.
  • Patent Document 1 discloses a frame in which a chrome-plated layer is applied to the entire surface of the synthetic resin frame body. Has been done.
  • the frame disclosed in Patent Document 1 is not yet fully satisfactory, and the thickness of the chrome-plated layer, which increases the manufacturing cost due to the chrome-plated layer, is high. It has the problem that it is limited to a significantly small value, and therefore the strength of the frame is not sufficient, the strength of the chrome-plated layer itself is not always sufficient, and it may be damaged by the cutting tool when cutting the tape. ..
  • the present invention has been made in view of the above facts, and its main technical problem is that it has sufficient strength even though it can be manufactured at a relatively low cost, and the required adhesive strength is applied to one side. Can be taped with, not damaged by cutting tools when cutting tape, and significantly lighter than traditional metal frames, new and improved, single-sided sticking It is to provide a frame to which the workpiece is mounted via the taped.
  • the present inventor achieves the above-mentioned main technical problem by fixing a separately formed annular metal plate ring extending at least on one side of the main body to a synthetic resin main body. I found that I could do it.
  • a frame capable of achieving the above-mentioned main technical problem, Make a frame to which the work piece is attached via the tape attached to one side. It comprises a ring-shaped synthetic resin body having a mounting opening in the center and a ring-shaped metal plate ring that is separately formed and fixed to the body and extends at least on one side of the body. , A frame characterized by that is provided.
  • an annular fixed groove extending over the entire circumference is formed on one surface of the main body, and the ring has a cross-sectional shape corresponding to the cross-sectional shape of the fixed groove. It has and is joined in the anchoring groove, and the exposed surface of the ring is flush with a portion of the main body other than the anchoring groove on the one side.
  • the ring is preferably composed of a plurality of arc-shaped plate pieces.
  • an elongated strip-shaped metal plate having a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove is subjected to coiling processing to form an annular shape with both end edges abutting or close to each other. You can mention the ring that is.
  • a ring-shaped anchoring groove extending over the entire circumference is formed on one surface of the main body, and one side surface of the anchoring groove faces the bottom surface of the anchoring groove. It is an inclined surface that inclines in a direction in which the width of the fixing groove gradually increases, and the ring has a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove.
  • a ring-shaped unilateral subsidence portion extending over the entire circumference is formed in the radial inner region on one side of the main body, and the radial inner region on the other side of the main body is formed.
  • the other side subsidence portion extending over the entire circumference is formed, and the ring extends along the one-sided annulus-shaped portion extending along the one-sided subsidence portion of the main body and along the inner peripheral surface of the main body. It is composed of a cylindrical portion to be formed and an annular shape portion on the other side extending along the subsidence portion on the other side of the main body, and the exposed surface of the annular shape portion on one side of the ring is the exposed surface on the one side of the main body. It is flush with the part other than the subsidence part. It is convenient that the main body is made of a hard synthetic resin and the ring is made of a stainless steel plate.
  • the frame of the present invention can be manufactured at a relatively low cost by fixing a metal plate ring to a synthetic resin frame without requiring an expensive process such as plating, and the whole is formed from a metal plate. It is considerably lighter than the case where it is used, and the frame is sufficiently reinforced due to the presence of the metal plate ring, and the tape can be attached to one side with the required adhesion strength, when cutting the tape. It is sure to avoid being damaged by the cutting tool.
  • FIG. 1 is a partial cross-sectional view of the frame shown in FIG.
  • FIG. 2 is a cross-sectional view showing how the frame shown in FIG. 1 is used.
  • Bottom view showing another preferred embodiment of a frame configured according to the present invention.
  • FIG. 5 is a partial cross-sectional view of the frame shown in FIG. Bottom view showing still another preferred embodiment of the frame configured according to the present invention.
  • FIG. 7 is a partial cross-sectional view of the frame shown in FIG.
  • the illustrated frame shown by No. 2 as a whole is composed of a synthetic resin main body 4 and a metal plate ring 6.
  • the body 4 which is preferably formed of a hard synthetic resin such as polycarbonate, hard polyvinyl chloride, polystyrene or polyacrylate is generally annular in shape.
  • a relatively large circular mounting opening 8 is formed in the central portion.
  • the outer diameter of the main body 4 and the inner diameter of the mounting opening 8 can be appropriately set according to the dimensions of the workpiece 18 to be mounted (see FIG. 4).
  • one side (lower surface in FIG. 2) 10 and the other side (upper surface in FIG. 2) 11 of the main body 4 are both flat surfaces. It is convenient that the thickness T1 of the main body 4 is about 1.5 to 2.5 mm.
  • a plurality of notches and linear portions used for positioning the frame 2 and the like are formed on the outer edge of the main body 4, and these notches and linear portions are well known to those skilled in the art and have the present invention. It does not constitute a new feature of the frame 2 configured according to the above, and therefore detailed description thereof will be omitted.
  • a fixing groove 12 having a shape extending the inner region in the radial direction over the entire circumference is formed on one side, that is, the back surface (lower surface in FIG. 2) 10 of the main body 4.
  • the cross-sectional shape of the fixing groove 12 is a rectangle extending in the radial direction.
  • the width W1 of the fixing groove 12 can be appropriately selected according to the overall dimensions of the frame 2, but it is generally preferably about 8.0 to 11.0 mm.
  • the depth D1 of the fixing groove 12 is preferably about 0.9 to 1.3 mm.
  • the metal plate ring 6 has an annular shape extending at least on one side 10 of the main body 4.
  • the metal plate ring 6 has a flat annular shape, and a double-sided adhesive tape or an adhesive is provided in the fixing groove 12 of the main body 4. It is joined by an appropriate joining means 14 as described above.
  • the cross-sectional shape of the ring 6 corresponds to the cross-sectional shape of the fixing groove 12. More specifically, it is desirable that the width W2 of the ring 6 corresponds to the width W1 of the fixing groove 12, and more specifically, it is substantially the same as the width W1 of the fixing groove 12.
  • the thickness T2 of the ring 6 is a value obtained by subtracting the thickness T3 of the fixing means 14, for example, 0.1 mm, from the depth of the fixing groove 12, and is preferably about 0.8 to 1.2 mm. It is convenient that the exposed surface of the ring 6 (lower surface in FIG. 2) is flush with a portion of the back surface 10 of the main body 4 other than the fixing groove 12.
  • the ring 6 is each composed of four arcuate plate pieces 6a, 6b, 6c and 6d extending over an angular range of 90 degrees. If desired, the ring 6 may be composed of a single plate-shaped piece that extends continuously in an annular shape, or may be composed of two, three, or five or more arc-shaped pieces.
  • a preferred example of the metal plate for forming the ring 6 is a stainless steel plate.
  • FIG. 3 shows a modified example of the metal plate ring 6.
  • the ring 6 shown in the figure is an elongated strip-shaped metal plate having a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove 12, and thus a rectangular shape extending in the radial direction. Is formed into an annular shape by abutting or bringing them into close contact with each other.
  • the ring 6 having such a shape can be formed without generating a portion of the metal plate material that is wasted, in other words, with virtually no material loss of the metal plate material.
  • a preferable example of such a ring 6 is a ring sold as a "special retaining ring" by Heiwa Hajime Co., Ltd.
  • the frame 2 is considerably lighter than the frame made entirely of metal plate, and the whole is made of synthetic resin. However, it has sufficient strength because it contains a ring 6 made of a metal plate.
  • FIG. 4 shows how to use the frame 2 illustrated in FIGS. 1 and 2.
  • a tape 16 having an adhesive surface (upper surface in FIG. 4) and which may be in a well-known form itself is attached to one side (lower surface in FIG. 4) 10 of the frame 2.
  • the tape 16 is cut by a cutting tool (not shown) in the region where the ring 6 is present, and the outer peripheral edge of the tape 16 is made circular.
  • the exposed surface of the ring 6 exists in the region where the tape 16 is attached, and therefore the tape 16 is attached to one side of the frame 2 with the required attachment strength.
  • the workpiece 18 for example, a semiconductor wafer having a substantially disk shape, which is shown by a two-dot chain line in FIG. 4, is mounted on the upper surface of the tape 16 in the mounting opening 8 formed in the main body 4, and is conveyed together with the frame 2. It is carried into a required part of a processing device (not shown), and after the required processing is performed, it is carried out from the processing device together with the frame 2.
  • a processing device not shown
  • FIGS. 5 and 6 illustrate other preferred embodiments of frames configured in accordance with the present invention.
  • the frame represented by the number 102 as a whole is composed of a synthetic resin main body 104 and a metal plate ring 106.
  • a fixing groove 112 is formed on one side (lower surface in FIG. 6) 110 of the main body 104.
  • One side surface 112a of the fixing groove 112 is substantially vertical, but the other side surface (that is, the right side surface in FIG. 6) 112b gradually increases in width toward the bottom surface of the fixing groove 112, that is, is inclined to the right in FIG. It is an inclined surface.
  • the ring 106 has a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove 112, preferably substantially the same cross-sectional shape as the cross-sectional shape of the fixing groove 112, and one side surface 106a thereof is substantially vertical.
  • the other side surface (that is, the right side surface in FIG. 6) 106b is an inclined surface that gradually increases in width toward the bottom surface of the fixing groove 112 (upward in FIG. 6), that is, an inclined surface that inclines to the right in FIG. ..
  • the width W3 of the fixing groove 112 and the width W4 of the ring 106 may be about 8.0 to 11.0 mm.
  • the depth D2 of the fixing groove 112 is about 0.8 to 1.2 mm
  • the thickness T4 of the ring 106 is also about 0.8 to 1.2 mm
  • the exposed surface (lower surface in FIG. 6) of the ring 106 is. It is convenient that it is flush with a portion of the main body 104 on one side 110 other than the fixing groove 112.
  • the ring 106 is composed of a single ring-shaped piece. If desired, the ring 106 can be configured from a plurality of arcuate plate pieces.
  • the other side surface 112b located on the outer side in the radial direction of the fixing groove 112 is inclined in a direction in which the width gradually increases toward the bottom surface of the fixing groove 112, but if desired, instead of this or this
  • one side surface 112a located inward in the radial direction can be inclined in a direction in which the width gradually increases toward the bottom surface of the fixing groove 112.
  • the ring 106 is fixed to the main body 104 by insert molding the main body 104 with the ring 106 as a core. If desired, the ring 106 can also be attached to the body 104 via an appropriate bonding means (not shown) such as double-sided adhesive tape or adhesive. Except for the above-described configuration of the frame 102 illustrated in FIGS. 5 and 6, the frame 102 may be substantially the same as the frame 2 described with reference to FIGS. 1 and 2.
  • FIGS. 7 and 8 illustrate still other preferred embodiments of frames configured in accordance with the present invention.
  • the frame represented by the number 202 as a whole is composed of a synthetic resin main body 204 and a metal plate ring 206.
  • a one-sided settling portion 212a extending over the entire circumference is formed in the radial inner region of one side (lower surface in FIG. 8) 210 of the main body 204, and the radial inner side of the other surface (upper surface in FIG. 8) 211 of the main body 204.
  • the other side subsidence portion 212b extending over the entire circumference is also formed in the region.
  • the exposed surfaces of the one-side settling portion 212a and the other side 212b extend substantially parallel to the one-sided 210 and the other-side 211 of the main body 2.
  • the width W5 of the one-side settling portion 212a is relatively large, for example, about 8.0 to 11.0 mm, and the width W6 of the other side settling portion 212b is relatively small, for example, about 2.0 to 5.0 mm. It is convenient.
  • the settling depth D3 of the one-side settling portion 212a and the settling depth D4 of the other-side settling portion 212b may both be about 0.5 to 1.0 mm.
  • the ring 206 includes the other-side annular shape portion 206b extending along the other side settling portion 212b of the main body 204 and the main body. It has a cylindrical portion 206b extending along the inner peripheral surface of the 206 and connecting the one-sided annular shape portion 206a and the other side annular shape portion 206b.
  • the thickness T5 of the one-sided annular shape portion 206a, the other-side annular shape portion 206b, and the cylindrical shape portion 206c of the ring 206 is substantially the same as the settling depths D3 and D4 of the one-side settling portion 212a and the other-side settling portion 212b of the intellectual body 204. Same as above, about 0.5 to 1.0 mm, and the exposed surface (lower surface in FIG. 8) of the one-sided annular shape portion 206a of the ring 206 is flush with the portion of the one-sided 210 of the main body 204 other than the one-sided settling portion 212a. Therefore, it is convenient that the exposed surface (upper surface in FIG.
  • the ring-shaped portion 206b on the other side of the ring 206 is also flush with the subsidence portion 212b on the other side of the other surface 211 of the main body 204.
  • the ring 206 is composed of a single piece of plate. If desired, the ring 206 can be configured from a plurality of arcuate plate pieces. Also in the frame 202 shown in FIGS. 7 and 8, the ring 206 is fixed to the main body 204 by insert-molding the main body 204 with the ring 206 as a core, similarly to the frame 102 shown in FIGS. 5 and 6. It is preferable to have it.
  • the ring 206 can also be fixed to the body 204 by an appropriate bonding means (not shown) such as double-sided adhesive tape or adhesive. Except for the above-described configuration of the frame 202 illustrated in FIGS. 7 and 8, the frame 202 may be substantially the same as the frame 2 described with reference to FIGS. 1 and 2.
  • Frame 4 Main body 6: Ring 8: Mounting opening 10: One side of the main body 12: Fixing groove 14: Joining means 16: Tape 18: Work piece 102: Frame 104: Main body 106: Ring 112: Fixing groove 202: Frame 204: Main body 206: Ring 212a: One-sided sedimentation surface 212b: Other-side sedimentation surface 206a: One-sided annular shape portion 206b: Other-side annular shape portion 206c: Cylindrical portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A frame includes: a ring-shaped synthetic resin body with a mounting opening in the center; and a ring-shaped metal plate ring formed separately from and securely fixed to the body and being extending at least on one side of the body. An object to be machined is mounted on the frame via a tape sticked to one side of the frame.

Description

フレームflame
 本発明は、片面に貼着されたテープを介して半導体ウエーハの如き被加工物が装着されるフレームに関する。 The present invention relates to a frame in which a workpiece such as a semiconductor wafer is mounted via a tape attached to one side.
 当業者には周知の如く、半導体ウエーハの如き被加工物にダイシング、表面研削又は表面研磨の如き所要加工を施す際には、中央部に装着開口が形成されたフレームの片面(通常は裏面)にテープを貼着し、テープにおける装着開口内に位置する領域に被加工物を装着する。そして、被加工物が装着されたフレームをダイシング装置、表面研削装置又は表面研磨装置に如き加工装置のチャックテーブル上に搬入し、被加工物に所要加工を施した後にフレームを加工装置から搬出している。被加工物を装着するためのフレームとしては、従来からステンレス鋼板又はアルミニューム基合金板の如き金属板から形成された金属製フレーム或いはポリカーボネートの如き硬質合成樹脂から形成されたフレームが広く実用に供されている。 As is well known to those skilled in the art, when a workpiece such as a semiconductor wafer is subjected to necessary processing such as dicing, surface grinding or surface polishing, one side (usually the back surface) of a frame having a mounting opening formed in the center thereof. The tape is attached to the tape, and the workpiece is attached to the area located within the attachment opening in the tape. Then, the frame on which the workpiece is mounted is carried onto the chuck table of the machining apparatus such as a dicing apparatus, a surface grinding apparatus or a surface polishing apparatus, and after the required machining is performed on the workpiece, the frame is carried out from the processing apparatus. ing. As a frame for mounting a work piece, a metal frame made of a metal plate such as a stainless steel plate or an aluminum-based alloy plate or a frame made of a hard synthetic resin such as polycarbonate has been widely used for practical use. Has been done.
 然るに、金属製フレームには、比較的高重量である、製造コストが比較的高価である、被加工物が装着されたフレームを例えばアルミニューム基合金板製のカセット容器内に収納する際にフレームとカセット容器との接触に起因して塵芥が生成される虞がある、という問題が存在する。一方、合成樹脂製フレームには、強度が比較的低く誤操作等に起因して破損してしまう虞がある、フレームの片面とテープとの貼着強度が不充分になってしまう傾向がある、テープにおけるフレームの片面に貼着された領域を所要形状(通常は円形)に切断する際に、切断具によってフレームの片面が損傷される虞がある、という問題がある。 However, the metal frame is relatively heavy, the manufacturing cost is relatively high, and the frame on which the workpiece is mounted is stored in a cassette container made of, for example, an aluminum-based alloy plate. There is a problem that dust may be generated due to the contact between the metal and the cassette container. On the other hand, the synthetic resin frame has a relatively low strength and may be damaged due to erroneous operation or the like, and the adhesive strength between one side of the frame and the tape tends to be insufficient. When the region attached to one side of the frame is cut into a required shape (usually a circle), there is a problem that one side of the frame may be damaged by the cutting tool.
 金属製フレームにおける上記のとおりの問題及び合成樹脂製フレームにおける上記のとおりの問題を解決せんとして、下記特許文献1には、合成樹脂製フレーム本体の全表面にクロムメッキ層を施したフレームが開示されている。 In order to solve the above-mentioned problems in the metal frame and the above-mentioned problems in the synthetic resin frame, Patent Document 1 below discloses a frame in which a chrome-plated layer is applied to the entire surface of the synthetic resin frame body. Has been done.
特開昭61-290009号公報Japanese Unexamined Patent Publication No. 61-29009
 而して、上記特許文献1に開示されているフレームも未だ充分に満足し得るものではなく、クロムメッキ層を施すことに起因して製造コストが高騰してしまう、クロムメッキ層の厚さは著しく小さい値に制限され、それ故にフレームの強度は充分ではない、クロムメッキ層自体の強度も必ずしも充分ではなく、テープを切断する際に切断具によって損傷されてしまう虞がある、という問題を有する。 Therefore, the frame disclosed in Patent Document 1 is not yet fully satisfactory, and the thickness of the chrome-plated layer, which increases the manufacturing cost due to the chrome-plated layer, is high. It has the problem that it is limited to a significantly small value, and therefore the strength of the frame is not sufficient, the strength of the chrome-plated layer itself is not always sufficient, and it may be damaged by the cutting tool when cutting the tape. ..
 本発明は、上記事実に鑑みてなされたものであり、その主たる技術的課題は、比較的安価に製造することができるにも拘わらず、充分な強度を有し、片面には所要貼着強度でテープを貼着することができ、テープを切断する際に切断具によって損傷されることがなく、更に従来の金属製フレームと比べて相当軽量である、新規且つ改良された、片面に貼着されたテープを介して被加工物が装着されるフレームを提供することである。 The present invention has been made in view of the above facts, and its main technical problem is that it has sufficient strength even though it can be manufactured at a relatively low cost, and the required adhesive strength is applied to one side. Can be taped with, not damaged by cutting tools when cutting tape, and significantly lighter than traditional metal frames, new and improved, single-sided sticking It is to provide a frame to which the workpiece is mounted via the taped.
 本発明者は、鋭意検討の結果、合成樹脂製本体に少なくとも本体の片面上を延在する別個に形成した円環形状の金属板製リングを固着することによって、上記主たる技術的課題を達成することができることを見出した。 As a result of diligent studies, the present inventor achieves the above-mentioned main technical problem by fixing a separately formed annular metal plate ring extending at least on one side of the main body to a synthetic resin main body. I found that I could do it.
 即ち、本発明によれば、上記主たる技術的課題を達成することができるフレームとして、
 片面に貼着されたテープを介して被加工物が装着されるフレームにして、
 中央部に装着開口を有する環形状である合成樹脂製本体と、別個に形成され且つ該本体に固着され、少なくとも該本体の片面上を延在する円環形状の金属板製リングとを具備する、
 ことを特徴とするフレームが提供される。
That is, according to the present invention, as a frame capable of achieving the above-mentioned main technical problem,
Make a frame to which the work piece is attached via the tape attached to one side.
It comprises a ring-shaped synthetic resin body having a mounting opening in the center and a ring-shaped metal plate ring that is separately formed and fixed to the body and extends at least on one side of the body. ,
A frame characterized by that is provided.
 好適実施形態においては、該本体の該片面には全周に渡って延在する円環形状の固着溝が形成されており、該リングは該固着溝の横断面形状に対応した横断面形状を有し且つ該固着溝内に接合されており、該リングの露呈表面は該本体の該片面における該固着溝以外の部分と面一である。該リングは複数個の円弧形状板片から構成されているのが好ましい。
好適なリングの他の形態としては、該固着溝の横断面形状に対応した横断面形状を有する細長帯状金属板にコイリング加工を加えて両端縁を当接乃至近接させて円環形状に形成されているリングを挙げることができる。他の好適実施形態においては、該本体の該片面には全周に渡って延在する円環形状の固着溝が形成されており、該固着溝の片側面は該固着溝の底面に向って該固着溝の幅が漸次増大する方向に傾斜する傾斜面であり、該リングは該固着溝の横断面形状に対応した横断面形状を有する。更に他の実施形態においては、該本体の該片面における半径方向内側領域には全周に渡って延在する円環形状の片側沈降部が形成され、該本体の他面における半径方向内側領域にも全周に渡って延在する他側沈降部が形成され、該リングは該本体の該片側沈降部に沿って延在する片側円環形状部、該本体の内周面に沿って延在する円筒形状部及び該本体の該他側沈降部に沿って延在する他側円環形状部とから構成され、該リングの該片側円環形状部の露呈表面は該本体の該片面における該沈降部以外の部分と面一である。該本体は硬質合成樹脂から形成されており、該リングはステンレス鋼板から形成されているのが好都合である。
In a preferred embodiment, an annular fixed groove extending over the entire circumference is formed on one surface of the main body, and the ring has a cross-sectional shape corresponding to the cross-sectional shape of the fixed groove. It has and is joined in the anchoring groove, and the exposed surface of the ring is flush with a portion of the main body other than the anchoring groove on the one side. The ring is preferably composed of a plurality of arc-shaped plate pieces.
As another suitable form of the ring, an elongated strip-shaped metal plate having a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove is subjected to coiling processing to form an annular shape with both end edges abutting or close to each other. You can mention the ring that is. In another preferred embodiment, a ring-shaped anchoring groove extending over the entire circumference is formed on one surface of the main body, and one side surface of the anchoring groove faces the bottom surface of the anchoring groove. It is an inclined surface that inclines in a direction in which the width of the fixing groove gradually increases, and the ring has a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove. In yet another embodiment, a ring-shaped unilateral subsidence portion extending over the entire circumference is formed in the radial inner region on one side of the main body, and the radial inner region on the other side of the main body is formed. The other side subsidence portion extending over the entire circumference is formed, and the ring extends along the one-sided annulus-shaped portion extending along the one-sided subsidence portion of the main body and along the inner peripheral surface of the main body. It is composed of a cylindrical portion to be formed and an annular shape portion on the other side extending along the subsidence portion on the other side of the main body, and the exposed surface of the annular shape portion on one side of the ring is the exposed surface on the one side of the main body. It is flush with the part other than the subsidence part. It is convenient that the main body is made of a hard synthetic resin and the ring is made of a stainless steel plate.
 本発明のフレームにおいては、メッキ処理の如き高価な工程を必要とすることなく、合成樹脂フレームに金属板製リングを固着することによって比較的安価に製造することができ、全体を金属板から形成した場合に比べて相当軽量であり、そして金属板製リングの存在に起因してフレームが充分に補強され、片面にはテープを所要貼着強度で貼着することができ、テープを切断する際に切断具によって損傷されることが確実に回避される。 The frame of the present invention can be manufactured at a relatively low cost by fixing a metal plate ring to a synthetic resin frame without requiring an expensive process such as plating, and the whole is formed from a metal plate. It is considerably lighter than the case where it is used, and the frame is sufficiently reinforced due to the presence of the metal plate ring, and the tape can be attached to one side with the required adhesion strength, when cutting the tape. It is sure to avoid being damaged by the cutting tool.
本発明に従って構成されたフレームの好適実施形態を示す底面図。The bottom view which shows the preferable embodiment of the frame constructed according to this invention. 図1に示すフレームの部分断面図。FIG. 1 is a partial cross-sectional view of the frame shown in FIG. 金属板製リングの変形例を示す平面図。The plan view which shows the modification of the metal plate ring. 図1に示すフレームの使用様式を示す断面図。FIG. 2 is a cross-sectional view showing how the frame shown in FIG. 1 is used. 本発明に従って構成されたフレームの他の好適実施形態を示す底面図。Bottom view showing another preferred embodiment of a frame configured according to the present invention. 図5に示すフレームの部分断面図。FIG. 5 is a partial cross-sectional view of the frame shown in FIG. 本発明に従って構成されたフレームの更に他の好適実施形態を示す底面図。Bottom view showing still another preferred embodiment of the frame configured according to the present invention. 図7に示すフレームの部分断面図。FIG. 7 is a partial cross-sectional view of the frame shown in FIG.
以下、本発明に従って構成されたフレームの好適実施形態を図示している添付図面を参照し、更に詳述する。 Hereinafter, the following will be described in more detail with reference to the accompanying drawings illustrating preferred embodiments of frames configured in accordance with the present invention.
 図1及び図2を参照して説明すると、全体を番号2で示す図示のフレームは、合成樹脂製本体4と金属板製リング6とから構成されている。 Explaining with reference to FIGS. 1 and 2, the illustrated frame shown by No. 2 as a whole is composed of a synthetic resin main body 4 and a metal plate ring 6.
 図1を参照することによって明確に理解されるとおり、ポリカーボネート、硬質ポリ塩化ビニル、ポリスチレン又はポリアクリレートの如き硬質合成樹脂から形成されているのが好都合である本体4は全体として円環形状であり、中央部には比較的大きい円形である装着開口8が形成されている。本体4の外径寸法及び装着開口8の内径は装着すべき被加工物18(図4参照)の寸法に応じて適宜に設定することができる。図示の実施形態においては、本体4の片面(図2において下面)10及び他面(図2において上面)11は共に平坦面である。本体4の厚さT1は1.5乃至2.5mm程度であるのが好都合である。本体4の外縁にはフレーム2の位置付け等に使用される複数個の切欠及び直線状部が形成されているが、これらの切欠及び直線状部は当業者には周知の形態であると共に本発明に従って構成されたフレーム2の新規な特徴を構成するものではなく、それ故にこれらについての詳細な説明は省略する。 As is clearly understood by reference to FIG. 1, the body 4 which is preferably formed of a hard synthetic resin such as polycarbonate, hard polyvinyl chloride, polystyrene or polyacrylate is generally annular in shape. A relatively large circular mounting opening 8 is formed in the central portion. The outer diameter of the main body 4 and the inner diameter of the mounting opening 8 can be appropriately set according to the dimensions of the workpiece 18 to be mounted (see FIG. 4). In the illustrated embodiment, one side (lower surface in FIG. 2) 10 and the other side (upper surface in FIG. 2) 11 of the main body 4 are both flat surfaces. It is convenient that the thickness T1 of the main body 4 is about 1.5 to 2.5 mm. A plurality of notches and linear portions used for positioning the frame 2 and the like are formed on the outer edge of the main body 4, and these notches and linear portions are well known to those skilled in the art and have the present invention. It does not constitute a new feature of the frame 2 configured according to the above, and therefore detailed description thereof will be omitted.
 図示の実施形態においては、本体4の片面即ち裏面(図2においては下面)10には半径方向内側領域を全周に渡って延在する形状の固着溝12が形成されている。固着溝12の横断面形状は半径方向に細長く延びる矩形である。固着溝12の幅W1はフレーム2の全体的寸法に応じて適宜に選定することができるが、一般的に8.0乃至11.0mm程度であるのが好都合である。固着溝12の深さD1は0.9乃至1.3mm程度であるのが好ましい。 In the illustrated embodiment, a fixing groove 12 having a shape extending the inner region in the radial direction over the entire circumference is formed on one side, that is, the back surface (lower surface in FIG. 2) 10 of the main body 4. The cross-sectional shape of the fixing groove 12 is a rectangle extending in the radial direction. The width W1 of the fixing groove 12 can be appropriately selected according to the overall dimensions of the frame 2, but it is generally preferably about 8.0 to 11.0 mm. The depth D1 of the fixing groove 12 is preferably about 0.9 to 1.3 mm.
 金属板製リング6は、少なくとも本体4の片面10上を延在する円環形状であることが重要である。図1及び図2を参照して説明を続けると、図示の実施形態においては、金属板製リング6は平坦な円環形状であり、本体4の固着溝12内に両面接着テープ或いは接着剤の如き適宜の接合手段14によって接合されている。リング6の横断面形状は固着溝12の横断面形状に対応したものであるのが望ましい。更に詳しくは、リング6の幅W2は固着溝12の幅W1に対応、更に詳しくは固着溝12の幅W1と実質上同一であるのが望ましい。リング6の厚さT2は固着溝12の深さから固着手段14の厚さT3、例えば0.1mm、を引いた値であり、0.8乃至1.2mm程度であるのが好適であり、リング6の露呈表面(図2において下面)は本体4の裏面10における固着溝12以外の部分と面一をなすのが好都合である。図示の実施形態においては、リング6は、夫々、90度の角度範囲に渡って延びる4個の円弧形状板片6a、6b、6c及び6dから構成されている。所望ならば、リング6を円環形状に連続して延在する単一の板状片から構成し、或いは2個、3個或いは5個以上の弧状片から構成することもできる。リング6を形成するための金属板の好適例としては、ステンレス鋼板を挙げることができる。 It is important that the metal plate ring 6 has an annular shape extending at least on one side 10 of the main body 4. Continuing the description with reference to FIGS. 1 and 2, in the illustrated embodiment, the metal plate ring 6 has a flat annular shape, and a double-sided adhesive tape or an adhesive is provided in the fixing groove 12 of the main body 4. It is joined by an appropriate joining means 14 as described above. It is desirable that the cross-sectional shape of the ring 6 corresponds to the cross-sectional shape of the fixing groove 12. More specifically, it is desirable that the width W2 of the ring 6 corresponds to the width W1 of the fixing groove 12, and more specifically, it is substantially the same as the width W1 of the fixing groove 12. The thickness T2 of the ring 6 is a value obtained by subtracting the thickness T3 of the fixing means 14, for example, 0.1 mm, from the depth of the fixing groove 12, and is preferably about 0.8 to 1.2 mm. It is convenient that the exposed surface of the ring 6 (lower surface in FIG. 2) is flush with a portion of the back surface 10 of the main body 4 other than the fixing groove 12. In the illustrated embodiment, the ring 6 is each composed of four arcuate plate pieces 6a, 6b, 6c and 6d extending over an angular range of 90 degrees. If desired, the ring 6 may be composed of a single plate-shaped piece that extends continuously in an annular shape, or may be composed of two, three, or five or more arc-shaped pieces. A preferred example of the metal plate for forming the ring 6 is a stainless steel plate.
 図3には、金属板製リング6の変形例が図示されている。図示のリング6は、固着溝12の横断面形状に対応した横断面形状、従って半径方向に細長く延びる矩形状、を有する細長帯状金属板にコイリング加工を加えて両端縁6-1及び6-2を当接乃至近接させて円環形状に形成したものである。かような形態のリング6は、金属板素材に無駄に破棄される部分を発生することなく、換言すれば金属板素材の素材ロスを実質上皆無にして形成することができる。かようなリング6の好適例としては、平和発条株式会社から「特殊止め輪」として販売されているリングを挙げることができる。 FIG. 3 shows a modified example of the metal plate ring 6. The ring 6 shown in the figure is an elongated strip-shaped metal plate having a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove 12, and thus a rectangular shape extending in the radial direction. Is formed into an annular shape by abutting or bringing them into close contact with each other. The ring 6 having such a shape can be formed without generating a portion of the metal plate material that is wasted, in other words, with virtually no material loss of the metal plate material. A preferable example of such a ring 6 is a ring sold as a "special retaining ring" by Heiwa Hajime Co., Ltd.
 上述したとおりのフレーム2は、本体4が合成樹脂製でありリング6のみが金属板製であるので、全体が金属板から形成されているフレームと比べて相当軽量であり、全体が合成樹脂製ではなくて金属板製リング6を含んでいる故に充分な強度を有する。 As described above, since the main body 4 is made of synthetic resin and only the ring 6 is made of metal plate, the frame 2 is considerably lighter than the frame made entirely of metal plate, and the whole is made of synthetic resin. However, it has sufficient strength because it contains a ring 6 made of a metal plate.
 図4は図1及び図2に図示するフレーム2の使用様式を示している。上記のとおりのフレーム2の片面(図4において下面)10には貼着面(図4において上面)は粘着性を有するそれ自体は周知の形態でよいテープ16が貼着される。そして必要に応じて、リング6が存在する領域において、切断具(図示していない)によってテープ16が切断され、テープ16の外周縁が円形にされる。而して、本発明に従って構成されたフレーム2においては、テープ16が貼着される領域にはリング6の露呈面が存在し、それ故にフレーム2の片面に所要貼着強度でテープ16を貼着することができ、テープ16を切断する際に切断具(図示していない)によってフレーム2の片面10が損傷されることが確実に回避される。図4に二点鎖線で示す被加工物18、例えば略円板形状である半導体ウエーハ、は本体4に形成されている装着開口8内においてテープ16の上面に装着され、フレーム2と共に搬送されて加工装置(図示していない)の所要部位に搬入され、所要加工が施された後にフレーム2と共に加工装置から搬出される。 FIG. 4 shows how to use the frame 2 illustrated in FIGS. 1 and 2. As described above, a tape 16 having an adhesive surface (upper surface in FIG. 4) and which may be in a well-known form itself is attached to one side (lower surface in FIG. 4) 10 of the frame 2. Then, if necessary, the tape 16 is cut by a cutting tool (not shown) in the region where the ring 6 is present, and the outer peripheral edge of the tape 16 is made circular. Thus, in the frame 2 configured according to the present invention, the exposed surface of the ring 6 exists in the region where the tape 16 is attached, and therefore the tape 16 is attached to one side of the frame 2 with the required attachment strength. It can be worn and reliably avoids damage to one side 10 of the frame 2 by a cutting tool (not shown) when cutting the tape 16. The workpiece 18, for example, a semiconductor wafer having a substantially disk shape, which is shown by a two-dot chain line in FIG. 4, is mounted on the upper surface of the tape 16 in the mounting opening 8 formed in the main body 4, and is conveyed together with the frame 2. It is carried into a required part of a processing device (not shown), and after the required processing is performed, it is carried out from the processing device together with the frame 2.
 図5及び図6には、本発明に従って構成されたフレームの他の好適実施形態が図示されている。図5及び図6に図示する実施形態においても、全体を番号102で示すフレームは、合成樹脂製本体104と金属板製リング106とから構成されている。本体104の片面(図6において下面)110には固着溝112が形成されている。固着溝112の片側面112aは実質上鉛直であるが他側面(即ち図6において右側面)112bは、固着溝112の底面に向って幅が漸次増大する方向、即ち図6において右方に傾斜する傾斜面である。リング106は、固着溝112の横断面形状に対応した横断面形状、好適には固着溝112の横断面形状と実質上同一の横断面形状を有し、その片側面106aは実質上鉛直であるが他側面(即ち図6において右側面)106bは固着溝112の底面に向って(図6において上方に向って)幅が漸次増大する方向、即ち図6において右方に傾斜する傾斜面である。固着溝112の幅W3及びリング106の幅W4は8.0乃至11.0mm程度でよい。固着溝112の深さD2は0.8乃至1.2mm程度で、リング106の厚さT4も同様に0.8乃至1.2mm程度であり、リング106の露呈表面(図6において下面)は本体104の片面110における固着溝112以外の部分と面一であるのが好都合である。図示の実施形態においては、リング106は円環形状の単一板片から構成されている。所望ならば、複数個の円弧形状板片からリング106を構成することもできる。図示の実施形態においては固着溝112の半径方向外側に位置する他側面112bを固着溝112の底面に向って幅が漸次増大する方向に傾斜させているが、所望ならばこれに代えて或いはこれに加えて半径方向内側に位置する片側面112aを固着溝112の底面に向って幅が漸次増大する方向に傾斜させることもできる。図5及び図6に図示するフレーム102においては、リング106を中子として本体104をインサート成形することによって本体104にリング106が固着されているのが好ましい。所望ならば、本体104に両面接着テープ或いは接着剤の如き適宜の接合手段(図示していない)を介してリング106を固着することもできる。図5及び図6に図示するフレーム102の上述した構成以外は、図1及び図2を参照して説明したフレーム2と実質上同一でよい。 5 and 6 illustrate other preferred embodiments of frames configured in accordance with the present invention. Also in the embodiment shown in FIGS. 5 and 6, the frame represented by the number 102 as a whole is composed of a synthetic resin main body 104 and a metal plate ring 106. A fixing groove 112 is formed on one side (lower surface in FIG. 6) 110 of the main body 104. One side surface 112a of the fixing groove 112 is substantially vertical, but the other side surface (that is, the right side surface in FIG. 6) 112b gradually increases in width toward the bottom surface of the fixing groove 112, that is, is inclined to the right in FIG. It is an inclined surface. The ring 106 has a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove 112, preferably substantially the same cross-sectional shape as the cross-sectional shape of the fixing groove 112, and one side surface 106a thereof is substantially vertical. The other side surface (that is, the right side surface in FIG. 6) 106b is an inclined surface that gradually increases in width toward the bottom surface of the fixing groove 112 (upward in FIG. 6), that is, an inclined surface that inclines to the right in FIG. .. The width W3 of the fixing groove 112 and the width W4 of the ring 106 may be about 8.0 to 11.0 mm. The depth D2 of the fixing groove 112 is about 0.8 to 1.2 mm, the thickness T4 of the ring 106 is also about 0.8 to 1.2 mm, and the exposed surface (lower surface in FIG. 6) of the ring 106 is. It is convenient that it is flush with a portion of the main body 104 on one side 110 other than the fixing groove 112. In the illustrated embodiment, the ring 106 is composed of a single ring-shaped piece. If desired, the ring 106 can be configured from a plurality of arcuate plate pieces. In the illustrated embodiment, the other side surface 112b located on the outer side in the radial direction of the fixing groove 112 is inclined in a direction in which the width gradually increases toward the bottom surface of the fixing groove 112, but if desired, instead of this or this In addition, one side surface 112a located inward in the radial direction can be inclined in a direction in which the width gradually increases toward the bottom surface of the fixing groove 112. In the frame 102 shown in FIGS. 5 and 6, it is preferable that the ring 106 is fixed to the main body 104 by insert molding the main body 104 with the ring 106 as a core. If desired, the ring 106 can also be attached to the body 104 via an appropriate bonding means (not shown) such as double-sided adhesive tape or adhesive. Except for the above-described configuration of the frame 102 illustrated in FIGS. 5 and 6, the frame 102 may be substantially the same as the frame 2 described with reference to FIGS. 1 and 2.
 図7及び図8には、本発明に従って構成されたフレームの更に他の好適実施形態が図示されている。図7及び図8に図示する実施形態においても、全体を番号202で示すフレームは合成樹脂製本体204と金属板製リング206とから構成されている。本体204の片面(図8において下面)210の半径方向内側領域には全周に渡って延在する片側沈降部212aが形成され、本体204の他面(図8において上面)211の半径方向内側領域にも全周に渡って延在する他側沈降部212bが形成されている。片側沈降部212a及び他側212bの露呈面は本体2の片面210及び他面211と実質上平行に延在している。片側沈降部212aの幅W5は比較的大きく、例えば8.0乃至11.0mm程度であり、他側沈降部212bの幅W6は比較的小さく、例えば2.0乃至5.0mm程度であるのが好都合である。片側沈降部212aの沈降深さD3及び他側沈降部212bの沈降深さD4は共に0.5乃至1.0mm程度でよい。リング206は、本体204の片側沈降部212aに沿って延在する片側円環形状部206aに加えて、本体204の他側沈降部212bに沿って延在する他側円環形状部206b及び本体206の内周面に沿って延在し、片側円環形状部206aと他側円環形状部206bとを連結する円筒形状部206bを有する。リング206の片側円環形状部206a、他側円環形状部206b及び円筒形状部206cの厚さT5は知本体204の片側沈降部212a及び他側沈降部212bの沈降深さD3及びD4と実質上同一で、0.5乃至1.0mm程度であり、リング206の片側円環形状部206aの露呈表面(図8において下面)は本体204の片面210における片側沈降部212a以外の部分と面一であり、リング206の他側円環形状部206bの露呈表面(図8において上面)も本体204の他面211における他側沈降部212bと面一であるのが好都合である。図示の実施形態においては、リング206は単一板片から構成されている。所望ならば、複数個の円弧形状板片からリング206を構成することもできる。図7及び図8に図示するフレーム202においても、図5及び図6に図示するフレーム102と同様に、リング206を中子として本体204をインサート成形することによって本体204にリング206が固着されているのが好ましい。所望ならば、両面接着テープ或いは接着剤の如き適宜の接合手段(図示していない)によって本体204にリング206を固着することもできる。図7及び図8に図示するフレーム202の上述した構成以外は、図1及び図2を参照して説明したフレーム2と実質上同一でよい。 7 and 8 illustrate still other preferred embodiments of frames configured in accordance with the present invention. Also in the embodiment shown in FIGS. 7 and 8, the frame represented by the number 202 as a whole is composed of a synthetic resin main body 204 and a metal plate ring 206. A one-sided settling portion 212a extending over the entire circumference is formed in the radial inner region of one side (lower surface in FIG. 8) 210 of the main body 204, and the radial inner side of the other surface (upper surface in FIG. 8) 211 of the main body 204. The other side subsidence portion 212b extending over the entire circumference is also formed in the region. The exposed surfaces of the one-side settling portion 212a and the other side 212b extend substantially parallel to the one-sided 210 and the other-side 211 of the main body 2. The width W5 of the one-side settling portion 212a is relatively large, for example, about 8.0 to 11.0 mm, and the width W6 of the other side settling portion 212b is relatively small, for example, about 2.0 to 5.0 mm. It is convenient. The settling depth D3 of the one-side settling portion 212a and the settling depth D4 of the other-side settling portion 212b may both be about 0.5 to 1.0 mm. In addition to the one-sided annular shape portion 206a extending along the one-side settling portion 212a of the main body 204, the ring 206 includes the other-side annular shape portion 206b extending along the other side settling portion 212b of the main body 204 and the main body. It has a cylindrical portion 206b extending along the inner peripheral surface of the 206 and connecting the one-sided annular shape portion 206a and the other side annular shape portion 206b. The thickness T5 of the one-sided annular shape portion 206a, the other-side annular shape portion 206b, and the cylindrical shape portion 206c of the ring 206 is substantially the same as the settling depths D3 and D4 of the one-side settling portion 212a and the other-side settling portion 212b of the intellectual body 204. Same as above, about 0.5 to 1.0 mm, and the exposed surface (lower surface in FIG. 8) of the one-sided annular shape portion 206a of the ring 206 is flush with the portion of the one-sided 210 of the main body 204 other than the one-sided settling portion 212a. Therefore, it is convenient that the exposed surface (upper surface in FIG. 8) of the ring-shaped portion 206b on the other side of the ring 206 is also flush with the subsidence portion 212b on the other side of the other surface 211 of the main body 204. In the illustrated embodiment, the ring 206 is composed of a single piece of plate. If desired, the ring 206 can be configured from a plurality of arcuate plate pieces. Also in the frame 202 shown in FIGS. 7 and 8, the ring 206 is fixed to the main body 204 by insert-molding the main body 204 with the ring 206 as a core, similarly to the frame 102 shown in FIGS. 5 and 6. It is preferable to have it. If desired, the ring 206 can also be fixed to the body 204 by an appropriate bonding means (not shown) such as double-sided adhesive tape or adhesive. Except for the above-described configuration of the frame 202 illustrated in FIGS. 7 and 8, the frame 202 may be substantially the same as the frame 2 described with reference to FIGS. 1 and 2.
    2:フレーム
    4:本体
    6:リング
    8:装着開口
   10:本体の片面
   12:固着溝
   14:接合手段
   16:テープ
   18:被加工物
  102:フレーム
  104:本体
  106:リング
  112:固着溝
  202:フレーム
  204:本体
  206:リング
 212a:片側沈降面
 212b:他側沈降面
 206a:片側円環形状部
 206b:他側円環形状部
 206c:円筒形状部
2: Frame 4: Main body 6: Ring 8: Mounting opening 10: One side of the main body 12: Fixing groove 14: Joining means 16: Tape 18: Work piece 102: Frame 104: Main body 106: Ring 112: Fixing groove 202: Frame 204: Main body 206: Ring 212a: One-sided sedimentation surface 212b: Other-side sedimentation surface 206a: One-sided annular shape portion 206b: Other-side annular shape portion 206c: Cylindrical portion

Claims (8)

  1.  片面に貼着されたテープを介して被加工物が装着されるフレームにして、
     中央部に装着開口を有する環形状である合成樹脂製本体と、別個に形成され且つ該本体に固着され、少なくとも該本体の片面上を延在する円環形状の金属板製リングとを具備する、
     ことを特徴とするフレーム。
    Make a frame to which the work piece is attached via the tape attached to one side.
    It comprises a ring-shaped synthetic resin body having a mounting opening in the center and a ring-shaped metal plate ring that is separately formed and fixed to the body and extends at least on one side of the body. ,
    A frame that features that.
  2.  該本体の該片面には全周に渡って延在する円環形状の固着溝が形成されており、該リングは該固着溝の横断面形状に対応した横断面形状を有し且つ該固着溝内に接合されており、該リングの露呈表面は該本体の片面における該固着溝以外の部分と面一である、請求項1記載のフレーム。 An annular-shaped fixing groove extending over the entire circumference is formed on one surface of the main body, and the ring has a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove and the fixing groove. The frame according to claim 1, wherein the exposed surface of the ring is joined to the inside and is flush with a portion other than the fixing groove on one side of the main body.
  3.  該リングは複数個の円弧形状板片から構成されている、請求項2記載のフレーム。 The frame according to claim 2, wherein the ring is composed of a plurality of arc-shaped plate pieces.
  4.  該リングは該固着溝の横断面形状に対応した横断面形状を有する細長帯状金属板にコイリング加工を加えて両端縁を当接乃至近接させて円環形状に形成されている、請求項2記載のフレーム。 The ring is formed in an annular shape by applying a coiling process to an elongated strip-shaped metal plate having a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove so that both end edges are in contact with each other or close to each other. Frame.
  5.  該本体の該片面には全周に渡って延在する円環形状の固着溝が形成されており、該固着溝の片側面は該固着溝の底面に向って該固着溝の幅が漸次増大する方向に傾斜する傾斜面であり、該リングは該固着溝の横断面形状に対応した横断面形状を有する、請求項1記載のフレーム。 An annular-shaped fixing groove extending over the entire circumference is formed on one side of the main body, and the width of the fixing groove gradually increases toward the bottom surface of the fixing groove on one side surface of the fixing groove. The frame according to claim 1, wherein the ring is an inclined surface inclined in the direction of an annulus, and the ring has a cross-sectional shape corresponding to the cross-sectional shape of the fixing groove.
  6.  該本体の該片面における半径方向内側領域には全周に渡って延在する円環形状の片側沈降部が形成され、該本体の他面における半径方向内側領域にも全周に渡って延在する他側沈降部が形成され、該リングは該本体の該片側沈降部に沿って延在する片側円環形状部、該本体の内周面に沿って延在する円筒形状部及び該本体の該他側沈降部に沿って延在する他側円環形状部とから構成され、該リングの該片側円環形状部の露呈表面は該本体の該片面における該沈降部以外の部分と面一である、請求項1記載のフレーム。 An annulus-shaped one-sided subsidence portion extending over the entire circumference is formed in the radial inner region on the one side of the main body, and extends over the entire circumference on the radial inner region on the other surface of the main body. The other side settling portion is formed, and the ring is a one-sided annular shape portion extending along the one-sided settling portion of the main body, a cylindrical portion extending along the inner peripheral surface of the main body, and the main body. It is composed of an annular shape portion on the other side extending along the subsidence portion on the other side, and the exposed surface of the annular shape portion on one side of the ring is flush with a portion other than the sedimentation portion on one surface of the main body. The frame according to claim 1.
  7.  該本体は硬質合成樹脂から形成されている、請求項1から6までのいずれかに記載のフレーム。 The frame according to any one of claims 1 to 6, wherein the main body is made of a hard synthetic resin.
  8.  該リングはステンレス鋼板から形成されている、請求項1から7までのいずれかに記載のフレーム。 The frame according to any one of claims 1 to 7, wherein the ring is made of a stainless steel plate.
PCT/JP2021/016590 2020-07-27 2021-04-26 Frame WO2022024482A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-126264 2020-07-27
JP2020126264A JP2022023366A (en) 2020-07-27 2020-07-27 Frame

Publications (1)

Publication Number Publication Date
WO2022024482A1 true WO2022024482A1 (en) 2022-02-03

Family

ID=80038005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/016590 WO2022024482A1 (en) 2020-07-27 2021-04-26 Frame

Country Status (3)

Country Link
JP (1) JP2022023366A (en)
TW (1) TW202207296A (en)
WO (1) WO2022024482A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335705A (en) * 2006-06-16 2007-12-27 Shin Etsu Polymer Co Ltd Carrier tool
JP2009065129A (en) * 2007-08-09 2009-03-26 Jfe Techno Research Corp Frame for wafer
JP2011054710A (en) * 2009-09-01 2011-03-17 Okawa Kanagata Sekkei Jimusho:Kk Wafer holder
JP2011151230A (en) * 2010-01-22 2011-08-04 Lintec Corp Support frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335705A (en) * 2006-06-16 2007-12-27 Shin Etsu Polymer Co Ltd Carrier tool
JP2009065129A (en) * 2007-08-09 2009-03-26 Jfe Techno Research Corp Frame for wafer
JP2011054710A (en) * 2009-09-01 2011-03-17 Okawa Kanagata Sekkei Jimusho:Kk Wafer holder
JP2011151230A (en) * 2010-01-22 2011-08-04 Lintec Corp Support frame

Also Published As

Publication number Publication date
JP2022023366A (en) 2022-02-08
TW202207296A (en) 2022-02-16

Similar Documents

Publication Publication Date Title
JP5114113B2 (en) Work carrier
US4393626A (en) Toolholder for supporting thin rotary tools
JPS6224964A (en) Double polishing working method of discoid type workpiece and discoid carrier
JP3933432B2 (en) Glass substrate clamping jig, glass substrate processing method, and glass substrate
JPH1199460A (en) Rotary polishing tool
JPS61230852A (en) Carrier assembly for double-side grinding work
WO2022024482A1 (en) Frame
JP4630178B2 (en) Work chuck device
JP2008093811A (en) Polishing head and polishing device
KR102079740B1 (en) Vacuum adsorption jig for manufacturing quartz products for semiconductors
KR102031741B1 (en) Grinding wheel
JP5796771B2 (en) Method for polishing peripheral surface of disk-shaped workpiece and carrier for double-side polishing machine
JP2008062329A (en) Chuck device for workpiece
TWI789496B (en) flange mechanism
JPH10128673A (en) Blade saw
US20040072520A1 (en) Support substrate for thin-sheet work
JPH09207064A (en) Carrier for double side polisher and method for polishing both faces of work using the carrier
JP2021062446A (en) Work carrier for polishing device, and method for manufacturing work carrier for polishing device
US3885548A (en) Cutting wheel assembly
JPH07156062A (en) Lapping carrier
JP2001038589A (en) Polishing device for outer peripheral part of work
JP2021185006A (en) Flat polishing body
JPS5936368Y2 (en) Carrier for surface grinding equipment
JP2000198064A (en) Polishing machine carrier
SU1214439A1 (en) Diamond tool for cutting-out disks

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21850235

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21850235

Country of ref document: EP

Kind code of ref document: A1