WO2022011889A1 - Continuous production line using msap process - Google Patents
Continuous production line using msap process Download PDFInfo
- Publication number
- WO2022011889A1 WO2022011889A1 PCT/CN2020/125806 CN2020125806W WO2022011889A1 WO 2022011889 A1 WO2022011889 A1 WO 2022011889A1 CN 2020125806 W CN2020125806 W CN 2020125806W WO 2022011889 A1 WO2022011889 A1 WO 2022011889A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- line
- wire
- tank
- production line
- developing
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the invention relates to the technical field of circuit board manufacturing, in particular to a continuous production line for an mSAP manufacturing process.
- the mSAP process is generally produced in three lines, namely developing line, electroplating line and film stripping line.
- the steps of the three lines are:
- Development line tearing film - feeding - developing - pickling - washing - drying - discharging;
- Electroplating line feeding - cleaning - hot water washing - water washing - pickling - copper plating - blanking;
- Stripping line feeding - stripping - hot water washing - washing - anti-oxidation - washing - drying - discharging.
- the mSAP equipment connection process technology is currently in the vacuum period.
- the industry uses the mSAP process to upgrade products, it generally adopts different transmission forms for segmented production.
- the overall management and control of the incoming quality parameters cannot exclude the uncontrollable factors of personnel operations.
- the main purpose of the present invention is to provide a continuous production line for the mSAP process, which not only effectively integrates the automation of operation management and control, but also saves investment in manpower and equipment.
- a continuous production line for the mSAP process comprising a flying target for vertically transporting circuit boards and a continuous line arranged along the conveying direction of the flying target, and the continuous line includes sequentially arranged
- the developing line and VCP copper plated wire or the developing line, the VCP copper plated wire and the film stripping wire, each hanger on the flying target includes a clamping assembly and a lifting device that drives the clamping assembly to rise and fall.
- the developing line includes a developing tank, a water washing tank, a drying tank and a cooling tank which are arranged in sequence.
- the VCP copper-plated wire includes a pickling tank and a plurality of copper plating tanks arranged in sequence.
- the film stripping line includes a water washing tank, a film stripping tank, a hot water washing tank, a water washing tank and a drying tank which are arranged in sequence.
- the clamping assembly includes a hollow frame, a plurality of upper clamping claws are arranged under the upper frame of the frame, a plurality of lower clamping claws are arranged above the lower frame of the frame, and a lower part of the lower frame of the frame is arranged with
- the guide rod is provided with a guide sleeve matched with the guide rod in each groove of the developing line, the VCP copper-plated wire and the film stripping line in the assembly line.
- the inlet of the developing line is provided with an automatic feeding device and a front buffer device.
- the outlet of the stripping wire is provided with a rear buffer device and an automatic unloading device.
- This assembly line can simultaneously complete the three processes of development, vertical electroplating, and film stripping.
- the processes are directly connected, reducing the handling time, reducing the risk of handling pollution, and achieving high productivity at low cost.
- Fig. 1 is the floor plan of the continuous production line of mSAP process
- Figure 2 is a front view of a single pylon on a flying target.
- 3-film stripping line 31-water washing tank, 32-film stripping tank, 33-hot water washing tank, 34-water washing tank, 35-drying tank,
- 51-automatic feeding device 52-front buffer device
- the present invention is a continuous production line for the mSAP process, including a flying target 4 for vertically transporting the circuit board and a continuous line arranged along the conveying direction of the flying target 4.
- the continuous line includes The developing line 1, the VCP copper-coated wire 2 and the stripping wire 3 arranged in sequence, the developing line 1, the VCP copper-coated wire 2 and the stripping wire 3 are all vertically transported by the flying target 4 to the circuit board.
- Each hanger includes a clamping assembly 51 and a lifting device 42 that drives the clamping assembly 41 to ascend and descend.
- the developing wire 1 and the film stripping wire 3 also adopt the vertical feeding method, and use the flying target 4 to transfer.
- the circuit board is fixed on the clamping component 41 of the flying target 4, and then immersed in the tank body by the lifting device 42. After one operation is completed, the lifting device 42 lifts the clamping component 41, and then transports it to the top of the next tank body, and then do Immerse and lift once until the peeling process is complete.
- the anti-oxidation function of the original stripped wire will be achieved in the subsequent etching.
- This assembly line can simultaneously complete the three processes of developing, vertical electroplating and film stripping, and the processes are directly connected to reduce the handling time.
- This production line can also only have the developing line 1 and the VCP copper plating line 2, which saves the turnover process between the two processes, and also helps to improve the productivity compared with the discontinuous line.
- the developing line 1 includes a developing tank 11 , a water washing tank 12 , a drying tank 13 and a cooling tank 14 arranged in sequence
- the VCP copper plating line 2 includes a pickling tank 21 and a plurality of copper plating tanks 22 arranged in sequence
- the film stripping line 3 includes a water washing tank 31 , a film stripping tank 32 , a hot water washing tank 33 , a water washing tank 34 and a drying tank 35 , which are arranged in sequence.
- the above structure includes all the units required for the entire section of the mSAP process, which is independently controlled by the software system, manpower, environmental protection and safety, document unification, product batch control, and quality control, all of which can realize automatic screening and intelligent management.
- the production process can be completed automatically without manual operation, and the production only needs to be inspected and managed by personnel.
- the new continuous production line can significantly save manpower and reduce auxiliary equipment, which can save a lot of money every month.
- the clamping assembly 41 includes a hollow frame 411 , a plurality of upper clamping claws 412 are arranged under the upper frame of the frame 411 , a plurality of lower clamping claws 413 are arranged above the lower frame of the frame 411 , and the lower part of the lower frame of the frame 411 There are two positive guide rods 414 , and each groove of the developing line 1 , the VCP copper plated wire 2 and the film stripping line 3 in the assembly line is provided with a positive guide sleeve (not shown) matching the positive guide rod 414 .
- the clamping assembly 41 can use the upper clamping jaw 412 and the lower clamping jaw 413 to clamp and fix the upper and lower sides of the circuit board at the same time, and the guide rod 414 can be used to fix the position of the frame 411 from below to avoid the circuit board from shaking. Anti-stick, scratches and other issues.
- the inlet of the developing line 1 is provided with an automatic feeding device 51 and a front buffer device 52 .
- the automatic feeding device 51 can uniformly feed the circuit boards by means of the carrier plate jig, thereby reducing the manual feeding.
- the front buffer device 52 can make the circuit board in place first, and when the front circuit board enters the next tank body, the rear circuit board is immediately fed in, so as to ensure the continuity of feeding.
- the outlet of the stripping wire 3 is provided with a rear buffer device 61 and an automatic unloading device 62 .
- the rear buffer device 61 temporarily stores the circuit boards that have passed through the film stripping line 3, and waits for the automatic unloading device 62 to unload them, which effectively reduces the waiting time of workers.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A continuous production line using an mSAP process, the production line comprising a flying target (4) for vertically conveying a circuit board and a continuous wire provided along the conveying direction of the flying target (4). The continuous wire comprises a developing wire (1) and a VCP copper-plated wire (2) or a developing wire (1), a VCP copper-plated wire (2), and a film stripping wire (3), which are arranged in sequence. Each rack on the flying target (4) comprises a clamping assembly (41) and a lifting device (42) for driving the clamping assembly (41) to lift. The described production line can continuously complete a plurality of processes, processing is directly connected, the transport time is reduced, the risk of contamination during transport is reduced, and high productivity can be implemented at low costs.
Description
本发明涉及线路板制造技术领域，特别涉及一种mSAP制程连续化生产线。The invention relates to the technical field of circuit board manufacturing, in particular to a continuous production line for an mSAP manufacturing process.
5G通信与物联网等应用领域对超高速率与高完整性的信号传输要求向现有印制电路板(Printed Circuit Board，PCB)制造技术提出了新的挑战，促使通信类PCB朝着线路低粗糙度、高密度互连与高信号完整性等方向发展。目前,通过开发PCB制造新材料、改进制造工艺与结构设计等途径，实现提升PCB的高频高速性能是行业研究热点。基于研究材料和mSAP技术的高频高速PCB制作技术将成为未来趋势，新动能、汽车电子、5G高频，三个维度将是往后PCB投资重点。Applications such as 5G communication and the Internet of Things require ultra-high-speed and high-integrity signal transmission, which poses new challenges to the existing Printed Circuit Board (PCB) manufacturing technology, prompting communication PCBs to move towards low-circuit lines. Roughness, high-density interconnection and high signal integrity. At present, through the development of new materials for PCB manufacturing, improvement of manufacturing process and structural design, etc., to improve the high-frequency and high-speed performance of PCBs is a research hotspot in the industry. High-frequency and high-speed PCB manufacturing technology based on research materials and mSAP technology will become the future trend. The three dimensions of new kinetic energy, automotive electronics, and 5G high frequency will be the focus of future PCB investment.
mSAP工艺一般分三条线生产，分别是显影线、电镀线和剥膜线。三条线的步骤分别为：The mSAP process is generally produced in three lines, namely developing line, electroplating line and film stripping line. The steps of the three lines are:
显影线：撕膜-入料-显影-酸洗-水洗-烘干-出料；Development line: tearing film - feeding - developing - pickling - washing - drying - discharging;
电镀线：上料-清洁-热水洗-水洗-酸洗-镀铜-下料；Electroplating line: feeding - cleaning - hot water washing - water washing - pickling - copper plating - blanking;
剥膜线：入料-剥膜-热水洗-水洗-抗氧化-水洗-烘干-出料。Stripping line: feeding - stripping - hot water washing - washing - anti-oxidation - washing - drying - discharging.
调研所知的现有板厂的mSAP制程的搭配情况如下表：The collocation of the mSAP process of the existing board factories known by the investigation is as follows:
所以mSAP设备连线工艺技术目前属于真空期，业界虽应用mSAP工艺进行 产品升级，却普遍采用不同传输形式搭配方式分段生产，无法有效整合工艺流程，无法达到产品精密生产与一体化作业所带来的品质参数整体管控，也无法排除人员作业的不可控因素等。Therefore, the mSAP equipment connection process technology is currently in the vacuum period. Although the industry uses the mSAP process to upgrade products, it generally adopts different transmission forms for segmented production. The overall management and control of the incoming quality parameters cannot exclude the uncontrollable factors of personnel operations.
因此，有必要提供一种新结构的流水线来解决上述问题。Therefore, it is necessary to provide a pipeline with a new structure to solve the above problems.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的在于提供一种mSAP制程连续化生产线，不仅在操作管控自动化方面进行有效整合，且可在人力、设备方面节约投入。The main purpose of the present invention is to provide a continuous production line for the mSAP process, which not only effectively integrates the automation of operation management and control, but also saves investment in manpower and equipment.
本发明通过如下技术方案实现上述目的：一种mSAP制程连续化生产线，包括用来对线路板进行垂直运送的飞靶以及沿着飞靶输送方向设置的连续线，所述连续线包括依序设置的显影线和VCP镀铜线或者显影线、VCP镀铜线和剥膜线，所述飞靶上的每个挂架包括夹持组件和驱动夹持组件升降的升降装置。The present invention achieves the above object through the following technical solutions: a continuous production line for the mSAP process, comprising a flying target for vertically transporting circuit boards and a continuous line arranged along the conveying direction of the flying target, and the continuous line includes sequentially arranged The developing line and VCP copper plated wire or the developing line, the VCP copper plated wire and the film stripping wire, each hanger on the flying target includes a clamping assembly and a lifting device that drives the clamping assembly to rise and fall.
具体的，所述显影线包括依次设置的显影槽、水洗槽、烘干槽和冷却槽。Specifically, the developing line includes a developing tank, a water washing tank, a drying tank and a cooling tank which are arranged in sequence.
具体的，所述VCP镀铜线包括依次设置的酸洗槽和多个镀铜槽。Specifically, the VCP copper-plated wire includes a pickling tank and a plurality of copper plating tanks arranged in sequence.
具体的，所述剥膜线包括依次设置的水洗槽、剥膜槽、热水洗槽、水洗槽和吹干槽。Specifically, the film stripping line includes a water washing tank, a film stripping tank, a hot water washing tank, a water washing tank and a drying tank which are arranged in sequence.
进一步的，所述夹持组件包括中空的框架，所述框架的上框下方设有若干上夹爪，所述框架的下框上方设有若干下夹爪，所述框架下框的下方设有导正杆，所述流水线内的显影线、VCP镀铜线和剥膜线的各个槽内均设有配合导正杆的导正套。Further, the clamping assembly includes a hollow frame, a plurality of upper clamping claws are arranged under the upper frame of the frame, a plurality of lower clamping claws are arranged above the lower frame of the frame, and a lower part of the lower frame of the frame is arranged with The guide rod is provided with a guide sleeve matched with the guide rod in each groove of the developing line, the VCP copper-plated wire and the film stripping line in the assembly line.
具体的，所述显影线的入口设有自动上料装置和前缓冲装置。Specifically, the inlet of the developing line is provided with an automatic feeding device and a front buffer device.
具体的，所述剥膜线的出口设有后缓冲装置和自动下料装置。Specifically, the outlet of the stripping wire is provided with a rear buffer device and an automatic unloading device.
采用上述技术方案有益效果是：The beneficial effects of adopting the above technical scheme are:
本流水线能够同时完成显影、垂直电镀、剥膜三个制程，工艺直接衔接， 减少搬运时间，降低搬运污染风险，能在低成本的条件下实现高生产率。This assembly line can simultaneously complete the three processes of development, vertical electroplating, and film stripping. The processes are directly connected, reducing the handling time, reducing the risk of handling pollution, and achieving high productivity at low cost.
图1为mSAP制程连续化生产线的平面布置图；Fig. 1 is the floor plan of the continuous production line of mSAP process;
图2为飞靶上单个挂架的主视图。Figure 2 is a front view of a single pylon on a flying target.
图中数字表示：The numbers in the figure represent:
1-显影线，11-显影槽，12-水洗槽，13-烘干槽，14-冷却槽；1-Development line, 11-Development tank, 12-Water washing tank, 13-Drying tank, 14-Cooling tank;
2-VCP镀铜线，21-酸洗槽，22-镀铜槽；2-VCP copper-plated wire, 21-pickling tank, 22-copper plating tank;
3-剥膜线，31-水洗槽，32-剥膜槽，33-热水洗槽，34-水洗槽，35-吹干槽，3-film stripping line, 31-water washing tank, 32-film stripping tank, 33-hot water washing tank, 34-water washing tank, 35-drying tank,
4-飞靶，41-夹持组件，411-框架，412-上夹爪，413-下夹爪，414-导正杆，42-升降装置；4-Flying target, 41-Clamping assembly, 411-Frame, 412-Upper clamping jaw, 413-Lower clamping jaw, 414-Guiding rod, 42-Lifting device;
51-自动上料装置，52-前缓冲装置；51-automatic feeding device, 52-front buffer device;
61-后缓冲装置，62-自动下料装置。61-rear buffer device, 62-automatic unloading device.
下面结合具体实施例对本发明作进一步详细说明。The present invention will be further described in detail below in conjunction with specific embodiments.
实施例：Example:
如图1和图2所示，本发明为一种mSAP制程连续化生产线，包括用来对线路板进行垂直运送的飞靶4以及沿着飞靶4输送方向设置的连续线，连续线包括依序设置的显影线1、VCP镀铜线2和剥膜线3，显影线1、VCP镀铜线2和剥膜线3均通过飞靶4对线路板进行垂直运送，飞靶4上的每个挂架包括夹持组件51和驱动夹持组件41升降的升降装置42。因为VCP镀铜线2采用的是垂直送料，为了减少线路板的方向转换麻烦，显影线1和剥膜线3也采用垂直送料的方法，用飞靶4来进行转移。线路板固定在飞靶4的夹持组件41上，然后靠升降装置42浸入槽体，完成一个操作后，升降装置42让夹持组件41升起，然 后输送到下一个槽体上方，再做一次浸入升起动作，直到完成剥膜工序。原剥膜线的抗氧化功能会在后续的蚀刻中达成。本流水线能够同时完成显影、垂直电镀、剥膜三个制程，工艺直接衔接，减少搬运时间。整个过程也不需要工人参与，避免了手上汗液污染板材的风险。因为减少了污染风险，某些清洁工序也可以节省，能在低成本的条件下实现高生产率。本生产线也可以只有显影线1和VCP镀铜线2，节省了两个工序之间的周转过程，相比于非连续线也有助于提高生产率。As shown in FIG. 1 and FIG. 2 , the present invention is a continuous production line for the mSAP process, including a flying target 4 for vertically transporting the circuit board and a continuous line arranged along the conveying direction of the flying target 4. The continuous line includes The developing line 1, the VCP copper-coated wire 2 and the stripping wire 3 arranged in sequence, the developing line 1, the VCP copper-coated wire 2 and the stripping wire 3 are all vertically transported by the flying target 4 to the circuit board. Each hanger includes a clamping assembly 51 and a lifting device 42 that drives the clamping assembly 41 to ascend and descend. Because the VCP copper plated wire 2 adopts vertical feeding, in order to reduce the trouble of changing the direction of the circuit board, the developing wire 1 and the film stripping wire 3 also adopt the vertical feeding method, and use the flying target 4 to transfer. The circuit board is fixed on the clamping component 41 of the flying target 4, and then immersed in the tank body by the lifting device 42. After one operation is completed, the lifting device 42 lifts the clamping component 41, and then transports it to the top of the next tank body, and then do Immerse and lift once until the peeling process is complete. The anti-oxidation function of the original stripped wire will be achieved in the subsequent etching. This assembly line can simultaneously complete the three processes of developing, vertical electroplating and film stripping, and the processes are directly connected to reduce the handling time. The whole process also does not require workers to participate, avoiding the risk of contaminating the board with sweat on the hands. Certain cleaning steps can also be saved due to the reduced risk of contamination, enabling high productivity at low cost. This production line can also only have the developing line 1 and the VCP copper plating line 2, which saves the turnover process between the two processes, and also helps to improve the productivity compared with the discontinuous line.
如图1所示，显影线1包括依次设置的显影槽11、水洗槽12、烘干槽13和冷却槽14，VCP镀铜线2包括依次设置的酸洗槽21和多个镀铜槽22，剥膜线3包括依次设置的水洗槽31、剥膜槽32、热水洗槽33、水洗槽34和吹干槽35。以上结构囊括了mSAP制程整个工段所需要的所有单元，由软件***控制独立操控，人力、环保安全、文件统一化、产品批次管控、品质管控、均可实现自动化筛选与智能管理。生产过程可以自动完成，无需手动操作，生产仅需巡视与管理人员。As shown in FIG. 1 , the developing line 1 includes a developing tank 11 , a water washing tank 12 , a drying tank 13 and a cooling tank 14 arranged in sequence, and the VCP copper plating line 2 includes a pickling tank 21 and a plurality of copper plating tanks 22 arranged in sequence. The film stripping line 3 includes a water washing tank 31 , a film stripping tank 32 , a hot water washing tank 33 , a water washing tank 34 and a drying tank 35 , which are arranged in sequence. The above structure includes all the units required for the entire section of the mSAP process, which is independently controlled by the software system, manpower, environmental protection and safety, document unification, product batch control, and quality control, all of which can realize automatic screening and intelligent management. The production process can be completed automatically without manual operation, and the production only needs to be inspected and managed by personnel.
以下是本mSAP工艺连续线实施例与非连续线的状况比较情况表：The following is the situation comparison table of this mSAP process continuous line embodiment and discontinuous line:
由上表可以看出，新的连续生产线能够明显节省人力，还减少了附属设备，每个月都能节省大量开支。As can be seen from the above table, the new continuous production line can significantly save manpower and reduce auxiliary equipment, which can save a lot of money every month.
如图2所示，夹持组件41包括中空的框架411，框架411的上框下方设有若干上夹爪412，框架411的下框上方设有若干下夹爪413，框架411下框的下 方设有两个导正杆414，流水线内的显影线1、VCP镀铜线2和剥膜线3的各个槽内均设有配合导正杆414的导正套(未画出)。夹持组件41能利用上夹爪412和下夹爪413同时对线路板的上下两边进行夹持固定，而导正杆414能够用来从下方让框架411位置固定，避免线路板的晃动摇摆导致反粘、刮伤等问题。As shown in FIG. 2 , the clamping assembly 41 includes a hollow frame 411 , a plurality of upper clamping claws 412 are arranged under the upper frame of the frame 411 , a plurality of lower clamping claws 413 are arranged above the lower frame of the frame 411 , and the lower part of the lower frame of the frame 411 There are two positive guide rods 414 , and each groove of the developing line 1 , the VCP copper plated wire 2 and the film stripping line 3 in the assembly line is provided with a positive guide sleeve (not shown) matching the positive guide rod 414 . The clamping assembly 41 can use the upper clamping jaw 412 and the lower clamping jaw 413 to clamp and fix the upper and lower sides of the circuit board at the same time, and the guide rod 414 can be used to fix the position of the frame 411 from below to avoid the circuit board from shaking. Anti-stick, scratches and other issues.
如图1所示，显影线1的入口设有自动上料装置51和前缓冲装置52。自动上料装置51可以靠载盘治具对线路板进行统一上料，减少上料人工。前缓冲装置52能够让线路板先就位，等到前面的线路板进入下一个槽体，后面的线路板随即送入，保证供料的连续性。As shown in FIG. 1 , the inlet of the developing line 1 is provided with an automatic feeding device 51 and a front buffer device 52 . The automatic feeding device 51 can uniformly feed the circuit boards by means of the carrier plate jig, thereby reducing the manual feeding. The front buffer device 52 can make the circuit board in place first, and when the front circuit board enters the next tank body, the rear circuit board is immediately fed in, so as to ensure the continuity of feeding.
如图1所示，剥膜线3的出口设有后缓冲装置61和自动下料装置62。后缓冲装置61会将经过剥膜线3的线路板暂存，等自动下料装置62将其下料，有效缩减了工人的等待时间。As shown in FIG. 1 , the outlet of the stripping wire 3 is provided with a rear buffer device 61 and an automatic unloading device 62 . The rear buffer device 61 temporarily stores the circuit boards that have passed through the film stripping line 3, and waits for the automatic unloading device 62 to unload them, which effectively reduces the waiting time of workers.
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。The foregoing are merely some of the embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention.
Claims (7)
- 一种mSAP制程连续化生产线，其特征在于：包括用来对线路板进行垂直运送的飞靶以及沿着飞靶输送方向设置的连续线，所述连续线包括依序设置的显影线和VCP镀铜线或者显影线、VCP镀铜线和剥膜线，所述飞靶上的每个挂架包括夹持组件和驱动夹持组件升降的升降装置。A continuous production line for mSAP manufacturing process is characterized in that: it comprises a flying target used for vertical transportation of circuit boards and a continuous line arranged along the conveying direction of the flying target, the continuous line comprising a developing line and a VCP plating line arranged in sequence Copper wire or developing wire, VCP copper plated wire and film stripping wire, each hanger on the flying target includes a clamping assembly and a lifting device that drives the clamping assembly to rise and fall.
- 根据权利要求1所述的mSAP制程连续化生产线，其特征在于：所述显影线包括依次设置的显影槽、水洗槽、烘干槽和冷却槽。The continuous production line for the mSAP process according to claim 1, wherein the developing line comprises a developing tank, a water washing tank, a drying tank and a cooling tank which are arranged in sequence.
- 根据权利要求1所述的mSAP制程连续化生产线，其特征在于：所述VCP镀铜线包括依次设置的酸洗槽和多个镀铜槽。The continuous production line for the mSAP process according to claim 1, wherein the VCP copper plating line comprises a pickling tank and a plurality of copper plating tanks arranged in sequence.
- 根据权利要求1所述的mSAP制程连续化生产线，其特征在于：所述剥膜线包括依次设置的水洗槽、剥膜槽、热水洗槽、水洗槽和吹干槽。The continuous production line for the mSAP process according to claim 1, wherein the film stripping line comprises a water washing tank, a film stripping tank, a hot water washing tank, a water washing tank and a drying tank which are arranged in sequence.
- 根据权利要求1至4任一所述的mSAP制程连续化生产线，其特征在于：所述夹持组件包括中空的框架，所述框架的上框下方设有若干上夹爪，所述框架的下框上方设有若干下夹爪，所述框架下框的下方设有两个导正杆，所述流水线内的显影线、VCP镀铜线和剥膜线的各个槽内均设有配合导正杆的导正套。The continuous production line for mSAP process according to any one of claims 1 to 4, wherein the clamping assembly comprises a hollow frame, a plurality of upper clamping jaws are arranged under the upper frame of the frame, and the lower part of the frame There are several lower jaws above the frame, two guide rods are arranged below the lower frame of the frame, and each groove of the developing line, the VCP copper plating wire and the film stripping line in the assembly line is equipped with a matching guide. The guide sleeve for the rod.
- 根据权利要求1所述的mSAP制程连续化生产线，其特征在于：所述显影线的入口设有自动上料装置和前缓冲装置。The continuous production line for the mSAP process according to claim 1, wherein the entrance of the developing line is provided with an automatic feeding device and a front buffer device.
- 根据权利要求1所述的mSAP制程连续化生产线，其特征在于：所述剥膜线的出口设有后缓冲装置和自动下料装置。The continuous production line for the mSAP process according to claim 1, wherein the outlet of the stripping line is provided with a rear buffer device and an automatic unloading device.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021362242.2 | 2020-07-13 | ||
| CN202010667623.X | 2020-07-13 | ||
| CN202010667623.XA CN111901978A (en) | 2020-07-13 | 2020-07-13 | mSAP process continuous production line |
| CN202021362242.2U CN213028733U (en) | 2020-07-13 | 2020-07-13 | mSAP process continuous production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022011889A1 true WO2022011889A1 (en) | 2022-01-20 |
Family
ID=79554476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2020/125806 WO2022011889A1 (en) | 2020-07-13 | 2020-11-02 | Continuous production line using msap process |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2022011889A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115449799A (en) * | 2022-08-12 | 2022-12-09 | 信丰正天伟电子科技有限公司 | Protective agent solution immersion structure for electroplated copper plate |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6132583A (en) * | 1997-05-16 | 2000-10-17 | Technic, Inc. | Shielding method and apparatus for use in electroplating process |
| JP2005289557A (en) * | 2004-03-31 | 2005-10-20 | Anritsu Corp | Substrate carrying device |
| CN103422143A (en) * | 2013-08-01 | 2013-12-04 | 黄海 | Automatic electroplating production line |
| CN103763863A (en) * | 2014-01-16 | 2014-04-30 | 东莞市宏德电子设备有限公司 | Development, etching and film removal device for flexible boards |
| US20150034590A1 (en) * | 2013-08-01 | 2015-02-05 | Mitsubishi Gas Chemical Company, Inc. | Method for producing printed-wiring board |
| CN104582332A (en) * | 2015-01-21 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Fine circuit packaging substrate and manufacturing method thereof |
| CN205062220U (en) * | 2015-09-04 | 2016-03-02 | 东莞市开美电路板设备有限公司 | Novel PCB board electroplating process presss from both sides frame |
| CN105392289A (en) * | 2015-12-09 | 2016-03-09 | 广州市巨龙印制板设备有限公司 | Flexible printed circuit board production line |
| CN110306222A (en) * | 2019-06-27 | 2019-10-08 | 惠州竞铭机械有限公司 | A kind of winged target loop structure and PTH production line |
| CN111246667A (en) * | 2020-01-16 | 2020-06-05 | 深圳市泰科思特精密工业有限公司 | Modular production line |
-
2020
- 2020-11-02 WO PCT/CN2020/125806 patent/WO2022011889A1/en active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6132583A (en) * | 1997-05-16 | 2000-10-17 | Technic, Inc. | Shielding method and apparatus for use in electroplating process |
| JP2005289557A (en) * | 2004-03-31 | 2005-10-20 | Anritsu Corp | Substrate carrying device |
| CN103422143A (en) * | 2013-08-01 | 2013-12-04 | 黄海 | Automatic electroplating production line |
| US20150034590A1 (en) * | 2013-08-01 | 2015-02-05 | Mitsubishi Gas Chemical Company, Inc. | Method for producing printed-wiring board |
| CN103763863A (en) * | 2014-01-16 | 2014-04-30 | 东莞市宏德电子设备有限公司 | Development, etching and film removal device for flexible boards |
| CN104582332A (en) * | 2015-01-21 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Fine circuit packaging substrate and manufacturing method thereof |
| CN205062220U (en) * | 2015-09-04 | 2016-03-02 | 东莞市开美电路板设备有限公司 | Novel PCB board electroplating process presss from both sides frame |
| CN105392289A (en) * | 2015-12-09 | 2016-03-09 | 广州市巨龙印制板设备有限公司 | Flexible printed circuit board production line |
| CN110306222A (en) * | 2019-06-27 | 2019-10-08 | 惠州竞铭机械有限公司 | A kind of winged target loop structure and PTH production line |
| CN111246667A (en) * | 2020-01-16 | 2020-06-05 | 深圳市泰科思特精密工业有限公司 | Modular production line |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115449799A (en) * | 2022-08-12 | 2022-12-09 | 信丰正天伟电子科技有限公司 | Protective agent solution immersion structure for electroplated copper plate |
| CN115449799B (en) * | 2022-08-12 | 2023-06-23 | 信丰正天伟电子科技有限公司 | Protective agent solution immersion structure for electroplated copper plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022011889A1 (en) | Continuous production line using msap process | |
| CN110510405B (en) | Material transmission method, transmission device, transmission system and readable storage medium | |
| JPS60169148A (en) | Method and apparatus for conveying substrate | |
| JPS61246372A (en) | Method and apparatus for plating article | |
| CN111586976B (en) | Overhauling equipment for repairing PCB on line and overhauling method thereof | |
| TW202243557A (en) | Film stripping, degumming and copper melting three-in-one process capable of preventing degumming pollution | |
| CN213028733U (en) | mSAP process continuous production line | |
| WO2022165615A1 (en) | Cabin system having continuous process | |
| CN109319410A (en) | The full-automatic horizontal tinuous production of wiring board | |
| CN111901978A (en) | mSAP process continuous production line | |
| CN116487966A (en) | Flexible multi-core wire automatic double-penetrating heat-shrinkable tube peeling and tin-plating device and method | |
| CN103491715A (en) | Circuit-board developing, electroplating and etching device | |
| CN108873403A (en) | A kind of Full-automatic COG bonding machine | |
| TWI782416B (en) | Cabin system with continuous process | |
| CN217626231U (en) | Automatic feeding and oiling system | |
| CN111050488B (en) | SMT automatic production system | |
| CN115942649B (en) | Automatic control process of Plasma intelligent wiring equipment for PCB production | |
| JP2011124518A (en) | Mounting substrate production apparatus, component mounting substrate carrying device, and mounting substrate production method | |
| TWI814161B (en) | Substrate loading and unloading device, loading method, and unloading method | |
| CN218851070U (en) | Automatic processing production line for circuit board | |
| CN214544956U (en) | Cabin system with continuous processing | |
| CN112558211B (en) | Polaroid attaching mechanism and method for display panel | |
| CN215499772U (en) | Automatic plate sleeving machine | |
| CN214646939U (en) | Online PCB moves automatic seal machine that spouts that carries and turn-over | |
| KR200319194Y1 (en) | Buffer apparatus for glass with conveyer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20944972 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 20944972 Country of ref document: EP Kind code of ref document: A1 |