CN115449799B - Protective agent solution immersion structure for electroplated copper plate - Google Patents
Protective agent solution immersion structure for electroplated copper plate Download PDFInfo
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- CN115449799B CN115449799B CN202210966044.4A CN202210966044A CN115449799B CN 115449799 B CN115449799 B CN 115449799B CN 202210966044 A CN202210966044 A CN 202210966044A CN 115449799 B CN115449799 B CN 115449799B
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- copper
- side wall
- fixedly connected
- plate
- circuit board
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 85
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 79
- 239000010949 copper Substances 0.000 title claims abstract description 79
- 239000003223 protective agent Substances 0.000 title claims abstract description 28
- 238000007654 immersion Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 96
- 238000007747 plating Methods 0.000 claims abstract description 40
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 12
- 238000007790 scraping Methods 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- KPQZUUQMTUIKBP-UHFFFAOYSA-N 1-(2-methyl-5-nitro-1-imidazolyl)-2-propanol Chemical compound CC(O)CN1C(C)=NC=C1[N+]([O-])=O KPQZUUQMTUIKBP-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- IPWKIXLWTCNBKN-UHFFFAOYSA-N Madelen Chemical compound CC1=NC=C([N+]([O-])=O)N1CC(O)CCl IPWKIXLWTCNBKN-UHFFFAOYSA-N 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- HJLSLZFTEKNLFI-UHFFFAOYSA-N Tinidazole Chemical compound CCS(=O)(=O)CCN1C(C)=NC=C1[N+]([O-])=O HJLSLZFTEKNLFI-UHFFFAOYSA-N 0.000 claims description 6
- 229960000282 metronidazole Drugs 0.000 claims description 6
- VAOCPAMSLUNLGC-UHFFFAOYSA-N metronidazole Chemical compound CC1=NC=C([N+]([O-])=O)N1CCO VAOCPAMSLUNLGC-UHFFFAOYSA-N 0.000 claims description 6
- 229960002313 ornidazole Drugs 0.000 claims description 6
- 229960004076 secnidazole Drugs 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 229960005053 tinidazole Drugs 0.000 claims description 6
- ZKGVLNVASIPVAU-UHFFFAOYSA-N 1-azido-2-methylbenzene Chemical compound CC1=CC=CC=C1N=[N+]=[N-] ZKGVLNVASIPVAU-UHFFFAOYSA-N 0.000 claims description 3
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 3
- 239000005750 Copper hydroxide Substances 0.000 claims description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 3
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 claims description 3
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910001956 copper hydroxide Inorganic materials 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 3
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 claims description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
- SDIXRDNYIMOKSG-UHFFFAOYSA-L disodium methyl arsenate Chemical compound [Na+].[Na+].C[As]([O-])([O-])=O SDIXRDNYIMOKSG-UHFFFAOYSA-L 0.000 claims description 3
- CTRLRINCMYICJO-UHFFFAOYSA-N phenyl azide Chemical compound [N-]=[N+]=NC1=CC=CC=C1 CTRLRINCMYICJO-UHFFFAOYSA-N 0.000 claims description 3
- -1 phenylazo Chemical group 0.000 claims description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 abstract description 13
- 230000008859 change Effects 0.000 abstract description 6
- 239000000243 solution Substances 0.000 description 65
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000005749 Copper compound Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/11—Vats or other containers for liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a protective agent solution immersion structure for a electroplated copper plate, which relates to the technical field of circuit boards and comprises the following components: the bottom of the box body is fixedly connected with a lifting mechanism, and the lifting mechanism is used for controlling the circuit board to be immersed in the solution in the box body and extend out of the solution in the box body after copper plating; a driving mechanism; a clamping mechanism; a pushing mechanism; the invention provides a protective agent solution immersing structure for a electroplated copper plate, which enables a copper-plated circuit board to be pushed by a pushing mechanism to slide up and down on a clamping mechanism according to the buoyancy of a solution through the arrangement of the clamping mechanism and the pushing mechanism, changes the clamping position of the clamping mechanism on the copper-plated circuit board, solves the problem that the traditional clamping position cannot change the position of the circuit board when the circuit board is immersed in the copper-plated circuit board, enables the circuit board not to be completely immersed in the solution, and enables the outer surface of the circuit board to be completely immersed in the solution, so that a complete protective film can be formed on the outer surface of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a protective agent solution immersion structure for a electroplated copper plate.
Background
The categories of circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, and the English name is (printdcicuitboard) PCB, and an FPC circuit board (the FPC circuit board is also called a flexible circuit board) which is made of polyimide or polyester film as a base material and has high reliability, and the excellent flexible printed circuit board has the characteristics of high wiring density, light weight, thin thickness and good flexibility, and a flexible-rigid-combined board (flexible) which is a new product of the flexible-rigid-combined board. Therefore, the soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related technological requirements through the procedures of pressing and the like and has FPC characteristics and PCB characteristics.
After copper plating of the whole printed wiring board, if the plated board is placed in a workshop for a long time, the plated board is corroded by acid and alkali in the workshop, so that the plated board needs to be immersed in a protective solution to form a layer of organic-copper film on the copper surface, but the conventional immersion structure cannot form a protective film due to the fact that the circuit board needs to be clamped when the plated board is immersed, and therefore, a protective agent solution immersion structure for the plated copper plate is provided to solve the problems.
Disclosure of Invention
The invention aims to solve the problems that after copper is electroplated on a printed circuit board in the prior art, if the electroplated board is placed in a workshop for a long time, the electroplated board is corroded by acid and alkali in the workshop, so that the circuit board after copper plating needs to be immersed in a protective solution to form a layer of organic matter-copper film on a copper surface, but when the circuit board after copper plating is immersed in the existing immersion structure, a protective film cannot be formed at a clamping part due to the fact that the circuit board needs to be clamped, and the protective agent solution immersion structure for the copper plate after copper plating is provided.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a protectant solution-immersed structure for a post-plated copper plate, comprising:
the copper plating device comprises a box body, wherein the four corners of the bottom of the box body are fixedly connected with supporting legs, the bottom of the box body is fixedly connected with a lifting mechanism, and the lifting mechanism is used for controlling the circuit board to be immersed into solution in the box body and extend out of the solution in the box body after copper plating;
the driving mechanism is arranged at the top of the lifting mechanism, is used for stirring the solution in the box body and can collect scattered copper of the circuit board;
the clamping mechanism is arranged on the outer side wall of the driving mechanism and is used for clamping the circuit board after copper plating;
the pushing mechanism is arranged on the driving mechanism and is used for changing the clamping position of the copper plating circuit board according to the state of the solution.
Preferably, the lifting mechanism comprises a fixed frame, an air cylinder and a telescopic rod; one end of the fixing frame is fixedly connected with the outer side wall of the air cylinder, the top output end of the air cylinder is fixedly connected with the bottom of the telescopic rod, and the fixing frame is arranged in an annular array along the central axis of the air cylinder.
Preferably, the driving mechanism comprises a driving motor, a rotating shaft, a fixed rod, a scraping plate and a collecting net; the output end of the driving motor is fixedly connected with the bottom of the rotating shaft, the outer side wall of the rotating shaft is fixedly connected with the opposite ends of the fixing rods, the top end of the scraping plate is fixedly connected with the outer side wall of the fixing rods, the collecting net is fixedly connected with the bottom of the scraping plate, and the fixing rods are arranged in an annular array along the central axis of the rotating shaft.
Preferably, the clamping mechanism comprises a fixed plate, a placing frame and balls; one end of the fixing plate is fixedly connected with the outer side wall of the placing frame, the placing frame is arranged to be concave, and the inner side wall of the placing frame is rotationally connected with the outer side wall of the ball.
Preferably, the pushing mechanism comprises a connecting rod, a sleeve, a buoyancy plate, a return spring, a pull rope and a placing plate; one end and telescopic lateral wall fixed connection of connecting rod, telescopic inside wall bottom and the lateral wall sliding connection of buoyancy board, and laminate each other, the top of buoyancy board and reset spring's bottom fixed connection, reset spring's top and telescopic inside wall top fixed connection, the one end and the top middle part position fixed connection of buoyancy board of stay cord, place the one end fixed connection of buoyancy board is kept away from to the top and the stay cord of board.
Preferably, the top of mount and the bottom fixed connection of box, the telescopic link runs through the inside wall bottom of box and extends to the top of cylinder, the lateral wall of telescopic link and the bottom middle part position fixed connection of box.
Preferably, the outer side wall of the driving motor is fixedly connected with the inner side wall of the top of the telescopic rod, and the bottom of the scraping plate is attached to the bottom of the inner side wall of the box body.
Preferably, one side of the fixing plate far away from the placing frame is fixedly connected with the outer side wall of the rotating shaft, and the fixing plate is arranged in an annular array along the central axis of the rotating shaft.
Preferably, the connecting rod is kept away from telescopic one end and the lateral wall fixed connection of pivot, the stay cord runs through the top of pivot and extends to the top of placing the board, the lateral wall of pivot is seted up flutedly, place the inside wall sliding connection of the opposite ends of board and recess, the stay cord runs through telescopic top, the connecting rod is annular array along the axis of pivot and sets up, the standing groove has been seted up at the top of placing the board, the lateral wall and the pivot sliding connection of stay cord, the lateral wall and telescopic top sliding connection of stay cord, reset spring cover is established on the lateral wall of stay cord.
Preferably, the formulation of the solution is as follows:
the solvent content is 0.1-20g/L, the azole protective agent is 0.5-50g/L, the weight percentage is 0.01-2% of film forming accelerant, and the balance is water;
wherein the solvent is at least one of methanol, ethanol, propanol, isopropanol, butanol, N-dimethylformamide, glycol ether and ethylene glycol;
the azole protective agent is at least one of Metronidazole (MNZ), dimet imidazole (DMZ), ipZ, secnidazole (SCZ), ornidazole (ONZ), tinidazole (TNZ), lonidazole (RNZ), phenylazo (BDA), phenylazide (BTA), methylphenylazide (MBTA) and derivatives of the compounds;
the film forming promoter is at least one of copper chloride, copper bromide, copper iodide, copper acetate, copper phosphate, copper sulfate, copper nitrate and copper hydroxide;
when the formula is used for immersing the copper plate to form a film, the immersing temperature is 18-40 ℃ and the immersing time is 20-300 s.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a protective agent solution immersing structure for a electroplated copper plate, which enables a copper-plated circuit board to be pushed by a pushing mechanism to slide up and down on a clamping mechanism according to the buoyancy of a solution through the arrangement of the clamping mechanism and the pushing mechanism, changes the clamping position of the clamping mechanism on the copper-plated circuit board, solves the problem that the traditional clamping position cannot change the position of the circuit board when the circuit board is immersed in the copper-plated circuit board, enables the circuit board not to be completely immersed in the solution, and enables the outer surface of the circuit board to be completely immersed in the solution, so that a complete protective film can be formed on the outer surface of the circuit board.
2. According to the protective agent solution immersing structure for the electroplated copper plate, through the arrangement of the driving mechanism, according to the change of the rotating speed of the driving mechanism, the driving mechanism can stir the solution in the box body to a certain extent while changing the clamping positions of the copper plating circuit board and the clamping mechanism, so that the solution in the box body is in a flowing state, the solution is prevented from precipitating, the condition that the solution forms a protective film unevenly on the outer surface of the copper plating circuit board is avoided, copper powder falling from the bottom of the box body can be scraped by the driving mechanism and collected in the collecting net, and the copper powder is prevented from remaining in the box body to influence the quality of the solution in the box body.
3. The thickness of the film of the organic-copper compound is 0.1-2.0 μm by the specific proportion of the solution and the limitation of the process, so that the copper surface is protected from corrosion of acid and the like, and the film can not influence the subsequent graphic process in the formation.
Drawings
Fig. 1 is a schematic three-dimensional schematic diagram of a protective agent solution immersed structure for a electroplated copper plate according to the present invention;
FIG. 2 is a schematic view of a three-dimensional top structure of a protective agent solution immersed structure for electroplated copper plates according to the present invention;
fig. 3 is a schematic view of a three-dimensional front partial cut-away structure of a protective agent solution immersed structure for a electroplated copper plate according to the present invention;
fig. 4 is a schematic three-dimensional schematic diagram of a lifting mechanism and a clamping mechanism of a protective agent solution immersed structure for a electroplated copper plate according to the present invention;
fig. 5 is a schematic three-dimensional schematic diagram of a lifting mechanism and a driving mechanism of a protective agent solution immersed structure for a electroplated copper plate according to the present invention;
FIG. 6 is an enlarged schematic view of the structure of FIG. 5A showing the immersion structure of the protective agent solution for the electroplated copper plate according to the present invention;
FIG. 7 is an enlarged schematic view of the structure of FIG. 5B showing the immersion structure of the protective agent solution for the electroplated copper plate according to the present invention;
fig. 8 is an enlarged schematic view of the structure of fig. 5C of a protective agent solution immersed structure for a copper plate after electroplating according to the present invention.
In the figure: 1. a case; 2. a support leg; 3. a lifting mechanism; 31. a fixing frame; 32. a cylinder; 33. a telescopic rod; 4. a driving mechanism; 41. a driving motor; 42. a rotating shaft; 43. a fixed rod; 44. a scraper; 45. a collection net; 5. a clamping mechanism; 51. a fixing plate; 52. a placing rack; 53. a ball; 6. a pushing mechanism; 61. a connecting rod; 62. a sleeve; 63. a buoyancy plate; 64. a return spring; 65. a pull rope; 66. the plate is placed.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
Referring to fig. 1 to 8, a protectant solution immersion structure for a post-plating copper plate, comprising:
the copper plating device comprises a box body 1, wherein the four corners of the bottom of the box body 1 are fixedly connected with supporting legs 2, the bottom of the box body 1 is fixedly connected with a lifting mechanism 3, and the lifting mechanism 3 is used for controlling a circuit board to be immersed into solution in the box body 1 and extend out of the solution in the box body 1 after copper plating;
in addition, the formulation of the solution is:
the solvent content is 0.1-20g/L, the azole protective agent is 0.5-50g/L, the weight percentage is 0.01-2% of film forming accelerant, and the balance is water;
wherein the solvent is at least one of methanol, ethanol, propanol, isopropanol, butanol, N-dimethylformamide, glycol ether and ethylene glycol;
the azole protective agent is at least one of Metronidazole (MNZ), dimet imidazole (DMZ), ipZ, secnidazole (SCZ), ornidazole (ONZ), tinidazole (TNZ), lonidazole (RNZ), phenylazo (BDA), phenylazide (BTA), methylphenylazide (MBTA) and derivatives of the compounds;
the film forming promoter is at least one of copper chloride, copper bromide, copper iodide, copper acetate, copper phosphate, copper sulfate, copper nitrate and copper hydroxide;
when the formula is used for immersing the copper plate to form a film, the immersing temperature is 18-40 ℃ and the immersing time is 20-300 s, so that the film thickness of the organic-copper compound is controlled to be 0.1-2.0 mu m, the copper surface is prevented from being corroded by acid and the like, the protective effect is achieved, and the film cannot influence the subsequent pattern process in the formation.
The driving mechanism 4 is arranged at the top of the lifting mechanism 3, and the driving mechanism 4 is used for stirring the solution in the box body 1 and collecting scattered copper of the circuit board;
the clamping mechanism 5 is arranged on the outer side wall of the driving mechanism 4, and the clamping mechanism 5 is used for clamping the circuit board after copper plating;
the pushing mechanism 6 is arranged on the driving mechanism 4, and the pushing mechanism 6 is used for changing the clamping position of the copper plating circuit board according to the state of the solution;
through the arrangement of the clamping mechanism 5 and the pushing mechanism 6, the pushing mechanism 6 pushes the copper-plated circuit board to slide up and down on the clamping mechanism 5 according to the buoyancy of the solution, so that the clamping position of the clamping mechanism 5 on the copper-plated circuit board is changed, the problem that the position of the circuit board cannot be changed when the traditional clamping position is immersed in the copper-plated circuit board is solved, the circuit board cannot be completely immersed in the solution, the outer surface of the circuit board can be completely immersed in the solution, and a complete protective film can be formed on the outer surface of the circuit board; through the setting of actuating mechanism 4, when having realized changing copper plating circuit board and fixture 5 centre gripping position according to actuating mechanism 4 rotational speed, actuating mechanism 4 can carry out the stirring of certain degree to the solution in the box 1 for solution in the box 1 is in the flow state, prevents that solution from taking place to precipitate, and the solution appears and forms the inhomogeneous condition of protection film to copper plating circuit board surface, and actuating mechanism 4 can also scrape the copper powder that drops in box 1 bottom and collect in collecting net 45, prevents that the copper powder from remaining in box 1, influences the quality of solution in the box 1.
Wherein, the lifting mechanism 3 comprises a fixed frame 31, an air cylinder 32 and a telescopic rod 33; one end of the fixing frame 31 is fixedly connected with the outer side wall of the air cylinder 32, the top output end of the air cylinder 32 is fixedly connected with the bottom of the telescopic rod 33, and the fixing frame 31 is arranged in an annular array along the central axis of the air cylinder 32;
through the arrangement of the structure, the copper plating circuit board clamped on the clamping mechanism 5 enters and stretches out of the solution in the box body 1, so that the solution can form a complete protective film on the outer surface of the copper plating circuit board.
Wherein the driving mechanism 4 comprises a driving motor 41, a rotating shaft 42, a fixed rod 43, a scraping plate 44 and a collecting net 45; the output end of the driving motor 41 is fixedly connected with the bottom of the rotating shaft 42, the outer side wall of the rotating shaft 42 is fixedly connected with the opposite ends of the fixed rod 43, the top end of the scraping plate 44 is fixedly connected with the outer side wall of the fixed rod 43, the bottom of the scraping plate 44 is fixedly connected with the collecting net 45, and the fixed rod 43 is arranged in an annular array along the central axis of the rotating shaft 42;
through the setting of above-mentioned structure, realized the stirring to the solution in the box 1 to driving motor 41's rotational speed is not invariable rotational speed, thereby make the solution in the box 1 can produce different buoyancy effect and pushing mechanism 6 on, thereby realized through pushing mechanism 6 to the change of copper plating circuit board clamping position on fixture 5, and can also carry out the collection of certain degree to the copper powder that the copper plating circuit board dropped in the box 1 bottom, prevent that the copper powder from having the quality of solution in the solution for a long time.
Wherein the clamping mechanism 5 comprises a fixed plate 51, a placing rack 52 and balls 53; one end of the fixed plate 51 is fixedly connected with the outer side wall of the placing frame 52, the placing frame 52 is arranged to be concave, and the inner side wall of the placing frame 52 is rotationally connected with the outer side wall of the ball 53;
through the setting of above-mentioned structure, realized the centre gripping to copper-plated circuit board is stable to when copper-plated circuit board takes place the position change, through the setting of ball 53, prevent that rack 52 from causing wearing and tearing to copper-plated circuit board, influence copper-plated circuit board's follow-up use.
Wherein the pushing mechanism 6 comprises a connecting rod 61, a sleeve 62, a buoyancy plate 63, a return spring 64, a pull rope 65 and a placing plate 66; one end of the connecting rod 61 is fixedly connected with the outer side wall of the sleeve 62, the bottom of the inner side wall of the sleeve 62 is in sliding connection with the outer side wall of the buoyancy plate 63 and is mutually attached, the top of the buoyancy plate 63 is fixedly connected with the bottom of the return spring 64, the top of the return spring 64 is fixedly connected with the top of the inner side wall of the sleeve 62, one end of the pull rope 65 is fixedly connected with the middle part of the top of the buoyancy plate 63, and the top of the placing plate 66 is fixedly connected with one end of the pull rope 65 far away from the buoyancy plate 63;
through the arrangement of the structure, the position of the copper plating circuit board and the clamping mechanism 5 is changed according to the buoyancy change of the solution in the box body 1, so that the solution can be completely and fully contacted with the outer surface of the copper plating circuit board, and the quality of forming a protective film on the outer surface of the copper plating circuit board by the solution is ensured.
The top of the fixing frame 31 is fixedly connected with the bottom of the box 1, the telescopic rod 33 penetrates through the bottom of the inner side wall of the box 1 and extends to the top of the air cylinder 32, and the outer side wall of the telescopic rod 33 is fixedly connected with the middle of the bottom of the box 1.
Wherein, the lateral wall of driving motor 41 and the top inside wall fixed connection of telescopic link 33, the bottom of scraper blade 44 is laminated with the inside wall bottom of box 1 mutually.
One side of the fixing plate 51 far away from the placement frame 52 is fixedly connected with the outer side wall of the rotating shaft 42, and the fixing plate 51 is arranged in an annular array along the central axis of the rotating shaft 42.
One end of the connecting rod 61 far away from the sleeve 62 is fixedly connected with the outer side wall of the rotating shaft 42, the pull rope 65 penetrates through the top of the rotating shaft 42 and extends to the top of the placing plate 66, the outer side wall of the rotating shaft 42 is provided with a groove, and the opposite ends of the placing plate 66 are slidably connected with the inner side walls of the groove.
Wherein, stay cord 65 runs through the top of sleeve 62, and connecting rod 61 is annular array along the axis of pivot 42 and sets up, and the standing groove has been seted up at the top of placing plate 66, and stay cord 65's lateral wall and pivot 42 sliding connection, stay cord 65's lateral wall and sleeve 62's top sliding connection, reset spring 64 cover is established on stay cord 65's lateral wall.
In the invention, when in use, firstly, a sufficient amount of mixed solution is added into the box body 1, then the air cylinder 32 is started, the air cylinder 32 pushes the driving mechanism 4, the clamping mechanism 5 and the pushing mechanism 6 out of the upper surface of the solution through the telescopic rod 33, and the air cylinder 32 can be closed;
at this time, it is necessary to insert a copper-plated wiring board between the balls 53 of the placement frame 52 so that the bottom of the copper-plated wiring board is attached to the top of the placement plate 66;
then, the cylinder 32 is started again, so that the telescopic rod 33 is retracted, the driving mechanism 4, the clamping mechanism 5, the pushing mechanism 6 and the copper plating circuit board clamped by the clamping mechanism 5 are driven to completely enter the solution, in the process that the pushing mechanism 6 enters the solution, the buoyancy of the solution pushes the buoyancy board 63 to slide upwards along the inner side wall of the sleeve 62, the reset spring 64 is compressed, the pull rope 65 is loosened, at the moment, the placing plate 66 slides downwards in the groove formed in the outer side wall of the rotating shaft 42, the copper plating circuit board slides downwards under the action of self gravity due to the downwards sliding of the placing plate 66, and in the process that the copper plating circuit board slides downwards, the ball 53 rotates, so that abrasion generated between the copper plating circuit board and the ball 53 when the copper plating circuit board slides downwards is reduced;
then, the driving motor 41 can be started, so that the driving motor 41 drives the rotating shaft 42 to rotate, and then drives the clamping mechanism 5 and the pushing mechanism 6 to rotate, so that the copper plating circuit board is fully contacted with the solution in the box body 1, and in the process, the solution around the rotating shaft 42 is pushed to move outwards due to the fact that the fixing plate 51 rotates, the rotating speed of the driving motor 41 is in a changing state, buoyancy generated by the solution on the buoyancy plate 63 is in a changing state, the buoyancy plate 63 is in a state of moving up and down, and the buoyancy plate 63 is in a process of moving up and down, and the placing plate 66 is driven to move up and down through the reset spring 64 and the pull rope 65, so that the solution can be fully contacted with the copper plating circuit board, and a complete protective film can be formed on the outer surface of the copper plating circuit board;
the rotation of the rotating shaft 42 drives the fixing rod 43 to rotate, so that the scraping plate 44 scrapes copper powder falling off from the copper plating circuit board at the bottom of the box body 1 into the collecting net 45;
after the copper-plated circuit board is soaked in the solution for a prescribed time, the cylinder 32 can be started to push the driving mechanism 4, the clamping mechanism 5 and the pushing mechanism 6 to extend out of the upper surface of the solution through the telescopic rod 33, then the copper-plated circuit board with the formed protective film can be taken down, copper powder in the collecting net 45 is collected, and when the copper-plated circuit board is reused, the steps are repeated.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. A protectant solution immersion structure for a post-plating copper plate, comprising:
the copper plating device comprises a box body (1), wherein the four corners of the bottom of the box body (1) are fixedly connected with supporting legs (2), the bottom of the box body (1) is fixedly connected with a lifting mechanism (3), and the lifting mechanism (3) is used for controlling a circuit board to be immersed in a solution in the box body (1) and extend out of the solution in the box body (1) after copper plating;
the driving mechanism (4) is arranged at the top of the lifting mechanism (3), and the driving mechanism (4) is used for stirring the solution in the box body (1) and can collect scattered copper of the circuit board; the driving mechanism (4) comprises a driving motor (41), a rotating shaft (42), a fixed rod (43), a scraping plate (44) and a collecting net (45);
the clamping mechanism (5) is arranged on the outer side wall of the driving mechanism (4), and the clamping mechanism (5) is used for clamping the circuit board after copper plating;
the clamping mechanism (5) comprises a fixed plate (51), a placing rack (52) and balls (53); one end of the fixing plate (51) is fixedly connected with the outer side wall of the placing frame (52), the placing frame (52) is arranged to be concave, and the inner side wall of the placing frame (52) is rotationally connected with the outer side wall of the ball (53);
the pushing mechanism (6) is arranged on the driving mechanism (4), and the pushing mechanism (6) is used for changing the clamping position of the copper plating circuit board according to the state of the solution;
the pushing mechanism (6) comprises a connecting rod (61), a sleeve (62), a buoyancy plate (63), a return spring (64), a pull rope (65) and a placing plate (66); one end of the connecting rod (61) is fixedly connected with the outer side wall of the sleeve (62), the bottom of the inner side wall of the sleeve (62) is in sliding connection with the outer side wall of the buoyancy plate (63) and is mutually attached, the top of the buoyancy plate (63) is fixedly connected with the bottom of the return spring (64), the top of the return spring (64) is fixedly connected with the top of the inner side wall of the sleeve (62), one end of the pull rope (65) is fixedly connected with the middle part of the top of the buoyancy plate (63), and the top of the placing plate (66) is fixedly connected with one end of the pull rope (65) far away from the buoyancy plate (63);
one end of the connecting rod (61) far away from the sleeve (62) is fixedly connected with the outer side wall of the rotating shaft (42), the pull rope (65) penetrates through the top of the rotating shaft (42) and extends to the top of the placing plate (66), the outer side wall of the rotating shaft (42) is provided with a groove, and the opposite end of the placing plate (66) is in sliding connection with the inner side wall of the groove.
2. A protectant solution immersion structure for electroplated copper plate according to claim 1, characterized in that said lifting mechanism (3) comprises a fixed frame (31), a cylinder (32) and a telescopic rod (33); one end of the fixing frame (31) is fixedly connected with the outer side wall of the air cylinder (32), the top output end of the air cylinder (32) is fixedly connected with the bottom of the telescopic rod (33), and the fixing frame (31) is arranged in an annular array along the central axis of the air cylinder (32).
3. The protective agent solution immersion structure for electroplated copper plate according to claim 2, wherein the output end of the driving motor (41) is fixedly connected with the bottom of the rotating shaft (42), the outer side wall of the rotating shaft (42) is fixedly connected with the opposite ends of the fixing rod (43), the top end of the scraping plate (44) is fixedly connected with the outer side wall of the fixing rod (43), the bottom of the scraping plate (44) is fixedly connected with the collecting net (45), and the fixing rod (43) is arranged in an annular array along the central axis of the rotating shaft (42).
4. The protective agent solution immersion structure for a electroplated copper plate according to claim 2, wherein the top of the fixing frame (31) is fixedly connected with the bottom of the box body (1), the telescopic rod (33) penetrates through the bottom of the inner side wall of the box body (1) and extends to the top of the air cylinder (32), and the outer side wall of the telescopic rod (33) is fixedly connected with the middle position of the bottom of the box body (1).
5. A protective agent solution immersion structure for a post-plating copper plate according to claim 3, wherein the outer side wall of the driving motor (41) is fixedly connected with the top inner side wall of the telescopic rod (33), and the bottom of the scraping plate (44) is attached to the bottom of the inner side wall of the box body (1).
6. A protective agent solution immersion structure for a electroplated copper plate according to claim 3, wherein one side of the fixing plate (51) far away from the placing frame (52) is fixedly connected with the outer side wall of the rotating shaft (42), and the fixing plate (51) is arranged in an annular array along the central axis of the rotating shaft (42).
7. A protective agent solution immersion structure for a electroplated copper plate according to claim 3, wherein the pull rope (65) penetrates through the top of the sleeve (62), the connecting rod (61) is arranged in an annular array along the central axis of the rotating shaft (42), a placement groove is formed in the top of the placement plate (66), the outer side wall of the pull rope (65) is in sliding connection with the rotating shaft (42), the outer side wall of the pull rope (65) is in sliding connection with the top of the sleeve (62), and the return spring (64) is sleeved on the outer side wall of the pull rope (65).
8. The protectant solution immersion structure for a post-plated copper plate according to claim 1, wherein the solution is formulated as follows:
the solvent content is 0.1-20g/L, the azole protective agent is 0.5-50g/L, the weight percentage is 0.01-2% of film forming accelerant, and the balance is water;
wherein the solvent is at least one of methanol, ethanol, propanol, isopropanol, butanol, N-dimethylformamide, glycol ether and ethylene glycol;
the azole protective agent is at least one of Metronidazole (MNZ), dimet imidazole (DMZ), ipZ, secnidazole (SCZ), ornidazole (ONZ), tinidazole (TNZ), lonidazole (RNZ), phenylazo (BDA), phenylazide (BTA), methylphenylazide (MBTA) and derivatives of the compounds;
the film forming promoter is at least one of copper chloride, copper bromide, copper iodide, copper acetate, copper phosphate, copper sulfate, copper nitrate and copper hydroxide;
when the formula is used for immersing the copper plate to form a film, the immersing temperature is 18-40 ℃ and the immersing time is 20-300 s.
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| CN202210966044.4A CN115449799B (en) | 2022-08-12 | 2022-08-12 | Protective agent solution immersion structure for electroplated copper plate |
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| CN115449799B true CN115449799B (en) | 2023-06-23 |
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| CN114615815A (en) * | 2022-03-29 | 2022-06-10 | 江西众达泰科技有限公司 | Multilayer flexible circuit board etching combination device and use method thereof |
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| US5335681A (en) * | 1991-06-26 | 1994-08-09 | Gebr. Schmid Gmbh & Co. | Apparatus for the treatment of board-like articles, particularly printed circuit boards |
| CN206966006U (en) * | 2017-07-05 | 2018-02-06 | 辽宁科技大学 | A kind of pulling apparatus of the controllable sol-gal process of speed |
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| CN115449799A (en) | 2022-12-09 |
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Application publication date: 20221209 Assignee: SHENZHEN FUCHANGFA CIRCUIT BOARD Co.,Ltd. Assignor: XINFENG ZHENGTIANWEI ELECTRONIC TECHNOLOGIES Co.,Ltd. Contract record no.: X2023980052216 Denomination of invention: A protective agent solution immersion structure for copper plates after electroplating Granted publication date: 20230623 License type: Common License Record date: 20231213 |