WO2022001048A1 - 灯珠、背光模组及显示装置 - Google Patents

灯珠、背光模组及显示装置 Download PDF

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Publication number
WO2022001048A1
WO2022001048A1 PCT/CN2020/140701 CN2020140701W WO2022001048A1 WO 2022001048 A1 WO2022001048 A1 WO 2022001048A1 CN 2020140701 W CN2020140701 W CN 2020140701W WO 2022001048 A1 WO2022001048 A1 WO 2022001048A1
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WO
WIPO (PCT)
Prior art keywords
light
lamp bead
encapsulation layer
layer
emitting chip
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Application number
PCT/CN2020/140701
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English (en)
French (fr)
Inventor
付文静
李泽龙
Original Assignee
惠州视维新技术有限公司
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Publication of WO2022001048A1 publication Critical patent/WO2022001048A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices

Definitions

  • the present application relates to the technical field of display devices, and in particular, to a lamp bead, a backlight module using the lamp bead, and a display device using the backlight module.
  • the side-illuminated backlight method mainly places the light source on the side. Although it can make the LCD TV thin, it cannot achieve more partition control;
  • the light-emitting angle of the LED (light-emitting diode) lamp is generally small, so the distance between two adjacent LED lamps cannot be set too large, so it is necessary to set more LED lamps to achieve better light-emitting effect and improve production. cost.
  • the main purpose of this application is to propose a lamp bead to improve the problem of small light-emitting angle.
  • the lamp bead proposed in the present application includes a bracket, a light-emitting chip, an encapsulation layer and a light adjustment layer;
  • the bracket is provided with an accommodating groove;
  • the light-emitting chip is arranged at the bottom of the accommodating groove;
  • the The encapsulation layer fills the accommodating groove and wraps the light-emitting chip;
  • the light adjustment layer is arranged on the outer surface of the encapsulation layer to reflect part of the light emitted by the light-emitting chip and transmit part of the light; the The thickness of the light modulating layer gradually decreases from the middle to the edge.
  • the light adjustment layer includes a connecting portion and a plurality of reflective particles arranged in the connecting portion, the connecting portion is connected to the outer surface of the encapsulation layer, and the thickness of the connecting portion is from the middle to The direction of the edge gradually decreases.
  • the top surface of the encapsulation layer includes a center portion and an edge portion disposed at the edge of the center portion, and the light adjustment layer covers at least the center portion.
  • the light adjustment layer covers only the central portion.
  • the light-emitting chip is disposed in the center of the bottom of the accommodating groove, and the light adjusting layer is symmetrical with respect to the central axis of the accommodating groove.
  • the bracket is a transparent bracket; and/or the encapsulation layer is a transparent encapsulation layer; and/or the top surface of the encapsulation layer is an arc surface.
  • the curved edge of the encapsulation layer is in contact with the bracket.
  • the arc surface is disposed protruding from the top of the bracket.
  • the present application also proposes a backlight module, comprising a circuit board, a reflective layer, a diffuser plate, an optical film, and the above-mentioned lamp beads, wherein the lamp beads and the reflective layer are arranged on the same side of the circuit board, and the The light-emitting chip is electrically connected to the circuit board; the diffusion plate is arranged on the side of the lamp bead away from the circuit board, and the optical film is arranged at the side of the diffusion plate away from the lamp bead.
  • the present application also provides a display device including the above-mentioned backlight module.
  • an accommodating groove is formed on the bracket, and the light-emitting chip is arranged at the bottom of the accommodating groove, and the packaging layer fills the accommodating groove and wraps the light-emitting chip, so that the light-emitting chip arranged in the accommodating groove can have better performance. Protection effect, and can also ensure that the light emitted by the light-emitting chip can be irradiated through the opening of the accommodating groove.
  • a light regulating layer is provided on the outer surface of the encapsulation layer, and the light regulating layer can reflect part of the light emitted by the light-emitting chip and transmit another part of the light emitted by the light-emitting chip, so that the light-emitting chip originally The light is also emitted from places other than the light-emitting angle of the lamp, so that the light-emitting angle of the lamp bead is larger.
  • the effect of reducing the brightness in the middle of the lamp bead and making the brightness of the lamp bead more uniform in all directions as much as possible is achieved.
  • FIG. 1 is a schematic structural diagram of an embodiment of a lamp bead of the present application
  • FIG. 2 is a schematic structural diagram of a bracket in the lamp bead of the application
  • FIG. 3 is a schematic structural diagram of an embodiment of a backlight module of the present application.
  • the present application proposes a lamp bead 100 .
  • the lamp bead 100 includes a bracket 110 , a light-emitting chip 120 , an encapsulation layer 130 and a light adjustment layer 140 ; at the bottom of the accommodating groove 111; the encapsulation layer 130 fills the accommodating groove 111 and wraps the light-emitting chip 120; the light adjustment layer 140 is disposed on the outer surface of the encapsulation layer 130 to reflect part of the light emitted by the light-emitting chip 120, and partially Transmission; the thickness of the light adjusting layer 140 gradually decreases from the middle to the edge.
  • the bracket 110 is provided with an accommodating groove 111 , the light-emitting chip 120 is disposed at the bottom of the accommodating groove 111 , and the encapsulation layer 130 fills the accommodating groove 111 and wraps the light-emitting chip 120 , so that the light-emitting chip 120 can be better protected.
  • the shape of the accommodating groove 111 may not be limited. In order to have better light extraction effect, the accommodating groove 111 may be cylindrical or truncated.
  • the width of the bottom of the accommodating groove may be smaller than the width of its opening, so that the bottom of the bracket 110 has a larger thickness, which enhances the support strength of the bracket 110, thereby ensuring that the light-emitting chip 120 and the encapsulation layer 130 are arranged in the accommodating groove. stability.
  • the encapsulation layer 130 can more fully cover the light-emitting surface of the light-emitting chip 120 and ensure that the light-emitting chip 120 passes through The light emission angle behind the encapsulation layer 130 is relatively large.
  • the light-emitting chip 120 described in this case may be a light-emitting diode chip, such as an LED chip, an OLED chip, or the like, which can emit light by being powered on.
  • the light adjustment layer 140 is disposed on the outer surface of the encapsulation layer 130 , so that the light emitted by the light emitting chip 120 first passes through the encapsulation layer 130 and then passes through the light adjustment layer 140 to adjust the light emitted.
  • the light adjustment layer 140 in the technical solution of the present application can reflect part of the light emitted by the light emitting chip 120 and transmit part of the light, so that the light emission can be increased when the light adjustment layer 140 reflects the light emitted by the light emitting chip 120 angle, thereby achieving the effect of a larger light-emitting angle.
  • the light adjustment layer 140 may have a light-transmitting layer connected to the encapsulation layer 130 and a reflective structure disposed on the light-transmitting layer, and the reflective structure may be The surface of the tiny reflective sheets or reflective particles 142, or the light adjustment layer 140 is a rough structure to achieve the effects of reflection and transmission at the same time. It should be noted that when the tiny reflective sheets or reflective particles 142 are provided on the light-transmitting layer, the light emitted by the light-emitting chip 120 that passes through the tiny reflective sheets or reflective particles 142 will emit light, but not through the tiny reflective sheets or reflective particles 142. The light from the reflective sheet or the reflective particles 142 directly penetrates the light-transmitting layer.
  • the reflective particles 142 may be SiO 2 , TiO 2 or other reflective particles 142 .
  • the light-emitting chip 120 when the light-emitting chip 120 is disposed at the bottom of the accommodating groove 111 , it is usually disposed at the center of the bottom or at a position close to the center, so the light intensity in the middle of the lamp bead 100 is generally stronger.
  • the brightness of the middle of the lamp bead 100 can be reduced, and the brightness of the lamp bead 100 in all directions can be made more uniform as much as possible.
  • the light-emitting chip 120 in the technical solution of the present application is an LED chip (light emitting diode) or other light-emitting source, wherein when the light-emitting chip 120 is an LED chip, it can be a blue LED chip, a red light LED chip, or other light LED chips.
  • the bracket 110 is provided with an accommodating groove 111 , and the light-emitting chip 120 is disposed at the bottom of the accommodating groove 111 , and the encapsulation layer 130 fills the accommodating groove 111 and wraps the light-emitting chip 120 .
  • the light-emitting chip 120 inside has a good protection effect, and can also ensure that the light emitted by the light-emitting chip 120 can be radiated out through the opening of the accommodating groove 111 .
  • the light adjusting layer 140 by disposing the light adjusting layer 140 on the outer surface of the encapsulation layer 130, and the light adjusting layer 140 can reflect part of the light emitted by the light-emitting chip 120, and transmit another part of the light emitted by the light-emitting chip 120, Then, light is emitted from places other than the original light-emitting angle of the light-emitting chip 120 , so that the light-emitting angle of the lamp bead 100 is larger. In one embodiment, by gradually decreasing the thickness of the light adjustment layer 140 from the middle to the edge, the brightness of the middle of the lamp bead 100 is reduced, and the brightness of the lamp bead 100 in all directions is as uniform as possible.
  • the light adjustment layer 140 includes a connecting portion 141 and a plurality of reflective particles 142 , the connecting portion 141 is connected to the outer surface of the encapsulation layer 130 , and the thickness of the connecting portion 141 is from the middle to the edge. Gradually decrease; a plurality of reflective particles 142 are evenly distributed in the connecting portion 141 .
  • the connecting portion 141 By arranging a plurality of evenly dispersed reflective particles 142 inside the connecting portion 141, and the connecting portion 141 is connected to the outer surface of the encapsulation layer 130, part of the light passing through the encapsulating layer 130 can directly penetrate the connecting portion 141, and the other part is reflected by The particles 142 are then reflected, so as to achieve the effect of increasing the light exit angle.
  • the plurality of reflective particles 142 are evenly dispersed, so that the reflected light when the light passes through the light adjusting layer 140 is relatively uniform, and the entire light adjusting layer 140 evenly adjusts the brightness of the light, ensuring a better light output effect.
  • the connecting portion 141 can be connected to the outer surface of the encapsulation layer 130 by means of adhesion or magnetic attraction. In the technical solution of the present application, it is only necessary to ensure that the connecting portion 141 can be connected to the outer surface of the encapsulation layer 130 .
  • the connecting parts 141 of the encapsulation layer 130 and the light adjustment layer 140 are made of light-transmitting materials, wherein the encapsulation layer 130 and the connecting parts 141 can be It is a transparent material, or the encapsulation layer 130 and/or the connecting part 141 can be a translucent material, as long as the encapsulation layer 130 and the connecting part 141 can transmit light.
  • the present application provides an embodiment: after the encapsulation layer 130 is dispensed, pre-baking is performed first, and then a mold is used to inject the material of the connecting portion 141 into the The surface of the encapsulation layer 130 is finally baked to bond the encapsulation layer 130 and the connecting portion 141 .
  • the connection portion 141 in order to make the connection portion 141 better fit with the encapsulation layer 130 , in this embodiment, can be made of the same material as the encapsulation layer 130 .
  • the encapsulation layer 130 in the technical solution of the present application is a transparent encapsulation layer 130 .
  • the material of the encapsulation layer 130 may be transparent glue such as silica gel or epoxy glue.
  • the connecting portion 141 can also be a transparent connecting portion 141 , which can be made of the same material as the encapsulation layer 130 .
  • the support 110 in the technical solution of the present application can also be selected as a transparent support 110 .
  • the support 110 in this way, when the light reflected by the light adjustment layer 140 passes through the bracket 110 , it can also directly pass through the bracket 110 to emit light, thereby increasing the light emission angle.
  • the material of the transparent support 110 may be transparent PCT (poly 1,4-cyclohexane dimethanol terephthalate) material, transparent PPA (polyphosphoric acid), EMC (epoxy resin injection molding compound), SMC (sheet mold) Plastic), BT (synthesized by bismaleimide and cyanate resin) and other materials, of course, high hardness transparent materials such as glass fiber can also be added to these materials to improve the hardness of the bracket 110, so that the bracket 110 has both Better support effect, without affecting its light transmission effect.
  • the top surface of the encapsulation layer 130 includes a center portion 1301 and an edge portion 1302 disposed on the edge of the center portion 1301 .
  • the layer 140 covers at least the central portion 1301 .
  • the light adjustment layer 140 covers at least the center portion 1301 , and the light adjustment layer 140 may cover only the center portion 1301 , or the light adjustment layer 140 may cover both the center portion 1301 and the edge portion 1302 . It can be understood that the light passing through the edge of the encapsulation layer 130 is weaker than the light passing through the middle of the encapsulation layer 130 .
  • the light adjustment layer 140 can only cover the central portion 1301 without By covering the edge portion 1302 of the encapsulation layer 130 , a part of the light can directly pass through the edge portion 1302 of the encapsulation layer 130 , thereby avoiding further weakening of the light intensity passing through the edge portion 1302 of the encapsulation layer 130 , and achieving a better light extraction effect. It can be understood that if the light adjustment layer 140 covers the position of the center portion 1301 of the encapsulation layer 130, the light passing through the light adjustment layer 140 can be slightly weaker, thereby reducing the difference between the brightness of the light emitted by the center portion 1301 and the brightness of the light emitted by the edge portion 1302.
  • the gap achieves a more uniform light output effect.
  • the light adjustment layer 140 can also cover the entire outer surface of the encapsulation layer 130 .
  • the light emitting chip 120 is disposed at the center of the bottom of the accommodating groove 111 , and the light adjusting layer 140 is symmetrical with respect to the central axis of the accommodating groove 111 .
  • the light emitted by the light emitting chip 120 through the notch of the accommodating groove 111 is relatively symmetrical.
  • the light adjusting layer 140 has a symmetrical structure with respect to the central axis of the accommodating groove 111, which can further make the light emitted by the light adjusting layer 140 more symmetrical, and the thickness of the light adjusting layer 140 gradually decreases from the middle to the edge. If the solution is small, the light emitted from the light adjusting layer 140 is more uniform everywhere.
  • the top surface of the encapsulation layer 130 is an arc surface 131 .
  • the cambered surface 131 may be a spherical cambered surface or other curved surfaces.
  • the edge of the arc surface 131 of the encapsulation layer 130 is in contact with the bracket 110 .
  • the light emitted by the light-emitting chip 120 needs to be emitted through the arc surface 131 of the encapsulation layer 130 , thereby ensuring a larger light exit angle.
  • the edge of the arc surface 131 of the encapsulation layer 130 is in contact with the bracket 110 , so that the connection between the encapsulation layer 130 and the bracket 110 can improve the airtightness of the light-emitting chip 120 and have a better protection effect on the light-emitting chip 120 .
  • the arc surface 131 is disposed protruding from the top surface of the bracket 110 .
  • the encapsulation layer 130 can completely cover the opening of the accommodating groove, so that on the one hand, the light emitted by the light-emitting chip 120 is emitted through the arc surface 131 when passing through the opening of the accommodating groove, thereby increasing the exit angle; , the arc surface 131 protrudes from the top surface of the bracket 110 , so that the distance from the arc surface 131 to the light-emitting chip 120 is equivalent to the distance between the bracket 110 and the light-emitting chip 120 , so as to ensure that the light emitted everywhere is relatively uniform.
  • the arc surface 131 may also not protrude from the top surface of the bracket 110 .
  • the present application also proposes a backlight module.
  • the backlight module includes a circuit board 200 , a reflective layer, a diffuser plate 300 , an optical film 400 and a lamp bead 100 .
  • the specific structure of the lamp bead 100 can be referred to above.
  • the backlight module since the backlight module adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
  • the lamp beads 100 and the reflective layer are disposed on the same side of the circuit board 200 , the light-emitting chip 120 is electrically connected to the circuit board 200 ; the diffuser plate 300 is disposed on the side of the lamp beads 100 away from the circuit board 200 , and the optical film 400 is disposed on the diffuser The side of the board 300 facing away from the lamp bead 100 .
  • the light emitting chip 120 is electrically connected to the circuit board 200 , so that the on and off of the light emitting chip 120 can be controlled by the circuit board 200 .
  • the lamp beads 100 and the reflection layer are arranged on the same side of the circuit board 200 , so that the light emitted by the lamp beads 100 can be reflected by the reflection layer, thereby improving the utilization rate of light.
  • the diffuser plate 300 is disposed on the side of the lamp beads 100 away from the circuit board 200 , so that the light emitted by the lamp beads 100 can be diffused by the diffuser plate 300 to achieve the effect of dispersing the luminous flux and making the light output more uniform.
  • the optical film 400 includes one or more of a diffusion sheet, a brightness enhancement sheet, a DBEF (brightness enhancement film), etc., so as to achieve the effect of increasing light and/or changing the polarization direction.
  • the circuit board 200 can be an aluminum substrate or a FR4 plate, and the reflective layer can be a plate-like body, which can be attached to the circuit board 200 , or the circuit board 200 can be coated with white reflective ink to form a reflective layer.
  • a quantum dot film can also be disposed between the diffusion plate 300 and the optical film 400 to improve the color gamut of the backlight module.
  • red quantum dots and green quantum dots may be provided in the quantum dot film, and both red quantum dots and green quantum dots include III-V group elements, II-VI group elements, organic- One or more of inorganic hybrid perovskite and all-inorganic perovskite cesium lead halide quantum dot materials.
  • the compound composed of group III-V elements includes any of CdSe, CaSe, SrSe, ZnSe, CdTe, MgTe, ZnTe, SrTe, MgSe, CaTe, BaSe, BaTe, ZnS, CaS, MgS, SrS, BaS and CdS One;
  • the second compound composed of group II-VI elements includes any one of GaAs, GaN, GaP, InP, InN and InAs;
  • the size of the red quantum dots may preferably be 4 nm to 10 nm, and the excited red light peak wavelengths are 610 nm to 650 nm; the green quantum dots may preferably be 2 nm to 7 nm in size, and the excited red light peak wavelengths are 510 nm to 560 nm.
  • a support column 500 may also be provided between the diffuser plate 300 and the reflective plate, and the surface of the support column 500 may be coated with reflective ink, so as to further reflect the light emitted by the lamp beads 100, so that the light emitted by the lamp beads 100 can be further reflected. Reflect as much as possible onto the diffuser plate 300 .
  • the support column 500 may be cylindrical, conical, prismatic or pyramid-shaped, etc.
  • the support column 500 may preferably be a conical surface or a pyramid surface, so that on the one hand, the top of the support column 500 is The cross-sectional area is small to avoid a large dark area where the display screen of the display device corresponds to the support column 500; on the other hand, the side surface of the conical surface or the pyramid surface can better guide the light emitted by the lamp beads 100 toward the diffuser plate 300 directional reflection, thereby improving the utilization rate of light and improving the display brightness of the display screen.
  • the present application also proposes a display device, the display device includes a backlight module, and the specific structure of the backlight module refers to the above-mentioned embodiments. Since the display device adopts all the technical solutions of all the above-mentioned embodiments, it has at least the above-mentioned embodiments. All the beneficial effects brought by the technical solution will not be repeated here.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种灯珠（100）、背光模组及显示装置。其中，灯珠（100）包括支架（110）、发光芯片（120）、封装层（130）及光线调节层（140）；支架（110）开设有容置槽（111）；发光芯片（120）设于容置槽（111）的底部；封装层（130）填充容置槽（111）并包裹发光芯片（120）；光线调节层（140）设于封装层（130）的外表面，以对发光芯片（120）发出的部分光线进行反射，部分光线进行透射；光线调节层（140）的厚度由中部至边缘的方向逐渐递减。

Description

灯珠、背光模组及显示装置
本申请要求：2020年6月30日申请的、申请号为202021250371.2、名称为“灯珠、背光模组及显示装置”的中国专利申请的优先权，在此将其引入作为参考。
技术领域
本申请涉及显示装置技术领域，特别涉及一种灯珠、应用该灯珠的背光模组及应用该背光模组的显示装置。
 背景技术
液晶电视的背光方式主要为侧入式和直下式两种。侧入式背光方式主要是将灯源置于侧边，虽然能够使得液晶电视实现薄型化，但是无法实现较多的分区控制；直下式背光方式主要是将光源设于背板底部，但是由于传统的LED（发光二极管）灯的发光角度一般较小，则相邻两个LED灯之间的距离不能设置过大，从而需要设置较多的LED灯才可实现较好的出光效果，提高了生产成本。
上述内容仅用于辅助理解本申请的技术方案，并不代表承认上述内容是现有技术。
 技术解决方案
本申请的主要目的是提出一种灯珠，改善发光角度较小的问题。
为实现上述目的，本申请提出的灯珠，包括支架、发光芯片、封装层及光线调节层；所述支架开设有容置槽；所述发光芯片设于所述容置槽的底部；所述封装层填充所述容置槽并包裹所述发光芯片；所述光线调节层设于所述封装层的外表面，以对所述发光芯片发出的部分光线进行反射，部分光线进行透射；所述光线调节层的厚度由中间至边缘的方向逐渐递减。
在一实施例中，所述光线调节层包括连接部和设于所述连接部内的多个反射粒子，所述连接部连接于所述封装层的外表面，所述连接部的厚度由中部至边缘的方向逐渐递减。
在一实施例中，所述封装层的顶面包括中心部和设于所述中心部边缘的边缘部，所述光线调节层至少覆盖所述中心部。
在一实施例中，所述光线调节层仅覆盖所述中心部。
在一实施例中，所述发光芯片设于所述容置槽底部的中心，所述光线调节层相对所述容置槽的中轴线呈对称结构。
在一实施例中，所述支架为透明支架；和/或所述封装层为透明封装层；和/或所述封装层的顶面呈弧面。
在一实施例中，所述封装层的弧面边缘与所述支架抵接。
在一实施例中，所述弧面突出所述支架的顶部设置。
本申请还提出一种背光模组，包括电路板、反射层、扩散板、光学膜片及上述的灯珠，所述灯珠和所述反射层设于所述电路板的同一侧，所述发光芯片与所述电路板电连接；所述扩散板设于所述灯珠背离所述电路板的一侧，所述光学膜片设于所述扩散板背离所述灯珠的一侧。
本申请还提出一种显示装置，包括上述的背光模组。
本申请技术方案通过支架上开设有容置槽，且发光芯片设于容置槽底部、封装层填充容置槽并包裹发光芯片，则可对设于容置槽内的发光芯片具有较好的保护效果，且还能保证发光芯片发出的光线能够通过容置槽的开口照射出去。在一实施例中，通过在封装层的外表面设置光线调节层，且该光线调节层能够将发光芯片发出的部分光线进行反射，对发光芯片发出的另一部分光线进行透射，则使得发光芯片原本的出光角度以外的地方也有光线射出，从而使得灯珠的发光角度较大。在一实施例中，通过将光线调节层的厚度由中部至边缘的方向逐渐递减，则实现了降低灯珠中部的亮度、尽可能使得灯珠各个方向的光亮较为均匀的效果。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请灯珠一实施例的结构示意图；
图2为本申请灯珠中支架的结构示意图；
图3为本申请背光模组一实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 灯珠 110 支架
111 容置槽 120 发光芯片
130 封装层 131 球面
1301 中心部 1302 边缘部
140 光线调节层 141 连接部
142 反射粒子 200 电路板
300 扩散板 400 光学膜片
500 支撑柱    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种灯珠100。
在本申请实施例中，请结合参照图1和图2，该灯珠100包括支架110、发光芯片120、封装层130及光线调节层140；支架110开设有容置槽111；发光芯片120设于容置槽111的底部；封装层130填充容置槽111并包裹发光芯片120；光线调节层140设于封装层130的外表面，以对发光芯片120发出的部分光线进行反射，部分光线进行透射；光线调节层140的厚度由中间至边缘的方向逐渐递减。
通过在支架110上开设有容置槽111，发光芯片120设于容置槽111的底部，且封装层130填充容置槽111并包裹发光芯片120，则可对发光芯片120具有较佳的保护效果。具体地，容置槽111的形状可不作限制。为了具有较好的出光效果，容置槽111可为圆柱或者圆台形。在一实施例中，容纳槽的底部宽度可小于其开口宽度，从而支架110的底部厚度较大，增强了支架110的支撑强度，进而保证了发光芯片120和封装层130在容纳槽内设置的稳定性。另外，容纳槽的底部宽度小于开口宽度，且封装层130位于发光芯片120朝向容纳槽开口的一侧，则封装层130能够更加全面地覆盖发光芯片120的出光面，并能保证发光芯片120通过封装层130后的发光角度较大。本案所述的发光芯片120可以是发光二极管芯片，如LED芯片、OLED芯片等可通过通电发光的芯片。
在一实施例中，光线调节层140设于封装层130的外表面，则使得发光芯片120发出的光先通过封装层130后再经过光线调节层140以对出光光线进行调节。本申请技术方案中的光线调节层140可对发光芯片120发出的部分光线进行反射，部分光线进行透射，则使得光线调节层140对发光芯片120发出的光线中进行反射时可增大光线的出光角度，进而实现了较大出光角度的效果。具体地，为了能够保证光线调节层140能够实现反射和透射的效果，则该光线调节层140可具有与封装层130连接的透光层和设于透光层的反射结构，该反射结构可以为微小的反射片或者反射粒子142，或者光线调节层140的表面为粗糙结构以同时实现反射和透射的效果。需要说明的是，当微小的反射片或者反射粒子142设于透光层时，发光芯片120发出的通过该微小的反射片或反射粒子142的光线则会发生发射现象，而未通过该微小的反射片或反射粒子142的光线则直接穿透透光层。其中反射粒子142可以为SiO2、TiO2或其他反射粒子142。
可以理解的是，发光芯片120设于容置槽111的底部时，通常设于底部的中心位置或者靠近中心的位置，因此灯珠100中部的光线强度一般较强。本申请技术方案中通过将光线调节层140的厚度由中部至边缘的方向逐渐递减，则可降低灯珠100中部的亮度，尽可能使得灯珠100各个方向的光亮较为均匀。本申请技术方案中的发光芯片120为LED芯片（发光二极管）或者其他发光源，其中当发光芯片120为LED芯片时，其可以为蓝光LED芯片、红光LED芯片或者其他光LED芯片等。
本申请技术方案通过支架110上开设有容置槽111，且发光芯片120设于容置槽111底部、封装层130填充容置槽111并包裹发光芯片120，则可对设于容置槽111内的发光芯片120具有较好的保护效果，且还能保证发光芯片120发出的光线能够通过容置槽111的开口照射出去。在一实施例中，通过在封装层130的外表面设置光线调节层140，且该光线调节层140能够将发光芯片120发出的部分光线进行反射，对发光芯片120发出的另一部分光线进行透射，则使得发光芯片120原本的出光角度以外的地方也有光线射出，从而使得灯珠100的发光角度较大。在一实施例中，通过将光线调节层140的厚度由中部至边缘的方向逐渐递减，则实现了降低灯珠100中部的亮度，尽可能使得灯珠100各个方向的光亮较为均匀的效果。
在一实施例中，如图1所示，光线调节层140包括连接部141和多个反射粒子142，连接部141连接于封装层130的外表面，连接部141的厚度由中部至边缘的方向逐渐递减；多个反射粒子142均匀散布于连接部141内。
通过将多个均匀散布的反射粒子142设于连接部141内部，且连接部141连接于封装层130的外表面，则光线经过封装层130后一部分能够直接穿透连接部141，另一部分通过反射粒子142后进行反射，从而实现增大出光角度的效果。多个反射粒子142均匀散布，则使得光线经过光线调节层140时的反射光线较为均匀，且使得整个光线调节层140均匀地对光线的亮度进行均匀调节，保证较好的出光效果。具体地，连接部141可通过粘接或者磁吸等方式连接于封装层130的外表面，本申请技术方案中只要保证连接部141能够连接于封装层130的外表面即可。
可以理解的是，为了实现一部分光线可透过封装层130和光线调节层140的效果，封装层130和光线调节层140的连接部141均采用透光材质，其中封装层130和连接部141可为透明材质，或者封装层130和或连接部141可为半透明材质，只要封装层130和连接部141能够透光即可。具体地，为了实现连接部141与封装层130的贴合效果，本申请提供一种实施例：当点胶完封装层130后先进行预烘烤，然后采用模具将连接部141的材料注入至封装层130表面，最后再进行烘烤以将封装层130与连接部141进行粘合。在一实施例中，为了使得连接部141能够较好地与封装层130贴合，本实施中连接部141可选用与封装层130一样的材质制作而成。
在一实施例中，为了具有较好的亮度，本申请技术方案中封装层130为透明封装层130。具体地，封装层130材质可以为硅胶或者环氧树脂胶等透明胶水等。
当然，连接部141也可为透明连接部141，其可采用与封装层130一样的材质制成。
为了进一步提高出光角度和出光亮度，本申请技术方案中的支架110也可选用透明支架110。如此则使得由光线调节层140反射的光线通过支架110时也可直接透过支架110进行出光，进而增大了出光角度。透明支架110的材质可以为透明PCT（聚对苯二甲酸1,4-环己烷二甲醇酯）材料、透明PPA（多聚磷酸）、EMC（环氧树脂注塑化合物）、SMC（片状模塑料）、BT（由双马来酰亚胺与氰酸酯树脂合成制得）等材料，当然这些材料中还可加入玻璃纤维等高硬度透明材料来提高支架110的硬度，使得支架110既具有较好的支撑效果，又不影响其透光效果。
在一实施例中，如图1所示，为了进一步提高光线发出的均匀性，本实施例中，封装层130的顶面包括中心部1301和设于中心部1301边缘的边缘部1302，光线调节层140至少覆盖中心部1301。
光线调节层140至少覆盖中心部1301，则光线调节层140可仅覆盖中心部1301，或者光线调节层140既可覆盖中心部1301，又可覆盖边缘部1302。可以理解的是，经过封装层130的边缘透过的光线相比于经过封装层130中部透过的光线更弱，因此在一实施例中，光线调节层140可仅覆盖中心部1301，而不覆盖封装层130的边缘部1302，则一部分光线可直接透过封装层130的边缘部1302，进而避免对经过封装层130边缘部1302的光线强度进一步削弱，实现了较好的出光效果。可以理解的是，光线调节层140覆盖封装层130的中心部1301位置，则可使得通过光线调节层140后的光线稍弱一些，进而减小了中心部1301出光亮度与边缘部1302出光亮度的差距，实现了较为均匀的出光效果。当然了，在其他实施例中，如果在调试过程中发现边缘部1302光线仍具有较高的亮度，则也可使得光线调节层140覆盖封装层130的整个外表面。
在一实施例中，如图1所示，发光芯片120设于容置槽111底部的中心，光线调节层140相对容置槽111的中轴线呈对称结构。
通过将发光芯片120设于容置槽111底部的中心，则使得发光芯片120通过容置槽111的槽***出的光线较为对称。另外光线调节层140相对容置槽111的中轴线呈对称结构，则可进一步使得由光线调节层140射出的各处光线较为对称，并且结合光线调节层140的厚度由中部至边缘的方向逐渐减小的方案，则使得由光线调节层140射出的各处光线更加均匀。
在一实施例中，如图1所示，本实施例中，封装层130的顶面呈弧面131。
通过将封装层130的顶面设置成弧面131，则一方面可以增大光线的出光角度，另一方面还可对发光芯片120发出的光线进行聚光，使得大部分的光线能够通过封装层130射出，减小了光线损失，提升了出光的亮度，如此，通过提升出光角度和出光亮度，则在背光模组中能够减少发光芯片120的使用数量，降低了生产成本。具体地，该弧面131可以为球形弧面或者其他具有弧度的面。
在一实施例中，如图1所示，封装层130的弧面131边缘与支架110抵接。
如此设置，则发光芯片120发出的光线均需要通过封装层130的弧面131射出，从而保证了较大的出光角度。另外，封装层130的弧面131边缘与支架110抵接，则使得封装层130与支架110的连接后能够提升发光芯片120良好的气密性，对发光芯片120具有较好的保护效果。
在一实施例中，如图1所示，弧面131突出支架110的顶面设置。
如此设置，则使得封装层130能够完全覆盖容纳槽的开口，从而一方面使得发光芯片120发出的光线在通过容纳槽的开口时均通过弧面131射出，从而增大了出射角度；另一方面，弧面131突出支架110的顶面，则使得弧面131至发光芯片120的距离相当于支架110与发光芯片120的距离，从而保证各处射出的光线较为均匀。
当然，在其他实施例中，为了提高中心亮度，弧面131也可不突出支架110的顶面设置。
本申请还提出一种背光模组，如图3所示，该背光模组包括电路板200、反射层、扩散板300、光学膜片400及灯珠100，该灯珠100的具体结构参照上述实施例，由于本背光模组采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。其中，灯珠100和反射层设于电路板200的同一侧，发光芯片120与电路板200电连接；扩散板300设于灯珠100背离电路板200的一侧，光学膜片400设于扩散板300背离灯珠100的一侧。
发光芯片120与电路板200电连接，则使得发光芯片120的开启与关闭可通过电路板200进行控制。灯珠100和反射层设于电路板200的同一侧，则使得灯珠100发出的光线可通过反射层进行反射，从而提高光线的利用率。扩散板300设于灯珠100背离电路板200的一侧，则灯珠100发出的光线可通过扩散板300进行扩散以实现打散光通量、出光更加均匀的效果。光学膜片400包括扩散片、增亮片、DBEF（增亮膜）等中的一种或多种，从而实现增量光线和/或改变偏振方向的效果。
具体地，电路板200可以为铝基板或者FR4板材，反射层可为板状体，其可贴附于电路板200上，或者电路板200上还可涂覆白色反光油墨以形成反射层。在一实施例中，扩散板300与光学膜片400之间还可设置量子点膜片，以提升背光模组的色域。例如当发光芯片120为蓝光LED芯片时，量子点膜片内可设有红色量子点和绿色量子点，红色量子点和绿色量子点均包括Ⅲ—Ⅴ族元素、Ⅱ—Ⅵ族元素、有机-无机杂化钙钛矿及全无机钙钛矿铯铅卤量子点材料中的一种或多种。具体地，Ⅲ—Ⅴ族元素组成的化合物包括CdSe、CaSe、SrSe、ZnSe、CdTe、MgTe、ZnTe、SrTe、MgSe、CaTe、BaSe、BaTe、ZnS、CaS、MgS、SrS、BaS和CdS中的任意一种；Ⅱ—Ⅵ族元素组成的第二化合物包括GaAs、GaN、GaP、InP、InN和InAs中的任意一种；有机-无机杂化钙钛矿包括CH3NH3PbX3，其中X=Cl，Br，I；全无机钙钛矿铯铅卤量子点包括CsPbX3，其中X=Cl，Br，I。另外，红色量子点尺寸可优选为4nm~10nm，其激发出的红光峰值波长为610nm~650nm；绿色量子点尺寸可优选为2nm~7nm，其激发出的红光峰值波长为510nm~560nm。
扩散板300与反射板之间还可设有支撑柱500，支撑柱500的表面可涂覆有反光油墨，从而可进一步对灯珠100发出的光线进行反射，以使得灯珠100发出的光线能尽可能多地反射至扩散板300上。具体地，支撑柱500可以为圆柱状、圆锥状、棱柱状或者棱锥状等，出于光学视效的考虑，支撑柱500可优选圆锥面或棱锥面，从而一方面使得支撑柱500的顶端的横截面积较小，避免显示装置的显示屏对应支撑柱500的地方出现较大的暗黑区；另一方面圆锥面或棱锥面的侧表面可较好地对灯珠100发出的光线朝扩散板300的方向反射，进而提高了光线的利用率，提高了显示屏的显示亮度。
本申请还提出一种显示装置，该显示装置包括背光模组，该背光模组的具体结构参照上述实施例，由于本显示装置采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (18)

  1. 一种灯珠，其中，包括：
    支架，所述支架开设有容置槽；
    发光芯片，所述发光芯片设于所述容置槽的底部；
    封装层，所述封装层填充于所述容置槽并包裹所述发光芯片；及
    光线调节层，所述光线调节层设于所述封装层的外表面，以对所述发光芯片发出的部分光线进行反射，部分光线进行透射；所述光线调节层的厚度由中间至边缘的方向逐渐递减。
  2. 如权利要求1所述的灯珠，其中，所述光线调节层包括连接部和设于所述连接部内的多个反射粒子，所述连接部连接于所述封装层的外表面，所述连接部的厚度由中部至边缘的方向逐渐递减。
  3. 如权利要求1所述的灯珠，其中，所述封装层的顶面包括中心部和设于所述中心部边缘的边缘部，所述光线调节层至少覆盖所述中心部。
  4. 如权利要求1所述的灯珠，其中，所述光线调节层仅覆盖所述中心部。
  5. 如权利要求1至4中任意一项所述的灯珠，其中，所述发光芯片设于所述容置槽底部的中心，所述光线调节层相对所述容置槽的中轴线呈对称结构。
  6. 如权利要求1至4中任意一项所述的灯珠，其中，所述支架为透明支架；
    所述封装层为透明封装层；
    所述封装层的顶面呈弧面。
  7. 如权利要求1至4中任意一项所述的灯珠，其中，所述支架为透明支架；
    或，所述封装层为透明封装层；
    或，所述封装层的顶面呈弧面。
  8. 如权利要求6所述的灯珠，其中，所述封装层的弧面边缘与所述支架抵接。
  9. 如权利要求6所述的灯珠，其中，所述弧面突出所述支架的顶部设置。
  10. 如权利要求1所述的灯珠，其中，容置槽为圆柱或者圆台形，容纳槽的底部宽度小于其开口宽度。
  11. 如权利要求2所述的灯珠，其中，
    所述反射粒子选自SiO2和TiO2的一种或多种。
  12. 如权利要求2所述的灯珠，其中，多个反射粒子均匀散布于所述连接部内，连接部连接于封装层的外表面。
  13. 如权利要求6所述的灯珠，其中，封装层为硅胶或者环氧树脂胶，透明支架由透明聚对苯二甲酸1,4-环己烷二甲醇酯、透明多聚磷酸、环氧树脂注塑化合物、片状模塑料、由双马来酰亚胺与氰酸酯树脂合成制得的材料的至少一种制成。
  14. 如权利要求13所述的灯珠，其中，所述透明支架还包括：玻璃纤维等高硬度透明材料。
  15. 如权利要求6所述的灯珠，其中，所述弧面为球形弧面。
  16. 一种背光模组，其中，包括电路板、反射层、扩散板、光学膜片及如权利要求1至15中任意一项所述的灯珠，所述灯珠和所述反射层设于所述电路板的同一侧，所述发光芯片与所述电路板电连接；所述扩散板设于所述灯珠背离所述电路板的一侧，所述光学膜片设于所述扩散板背离所述灯珠的一侧。
  17. 如权利要求16所述的背光模组，其中，所述光学膜片包括扩散片、增亮片、增亮膜中的一种或多种，所述扩散板与所述光学膜片之间还设置量子点膜片。
  18. 一种显示装置，其中，包括如权利要求17所述的背光模组。
PCT/CN2020/140701 2020-06-30 2020-12-29 灯珠、背光模组及显示装置 WO2022001048A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114613268A (zh) * 2022-03-09 2022-06-10 深圳市南极光电子科技股份有限公司 一种背光光源、背光模组及显示器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115202098A (zh) * 2021-04-09 2022-10-18 海信视像科技股份有限公司 一种显示装置
CN113721386A (zh) * 2021-08-18 2021-11-30 安徽芯瑞达科技股份有限公司 一种增大Mini LED出光角度的背光模组及其制作方法
CN114220899A (zh) * 2021-11-01 2022-03-22 深圳市佑明光电有限公司 Mini LED灯珠、背光模组及显示装置
CN114089565B (zh) * 2021-12-06 2022-11-25 武汉创维光显电子有限公司 发光组件和背光模组
CN114942546A (zh) * 2022-05-31 2022-08-26 深圳市宏普欣电子科技有限公司 一种大出光角度的Mini LED背光模组
CN115877612B (zh) * 2022-12-26 2023-11-21 惠科股份有限公司 背光模组和显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090114938A1 (en) * 2007-11-02 2009-05-07 Innolux Display Corp. Light emitting diode with sealant having filling particles
CN204668355U (zh) * 2015-06-03 2015-09-23 东莞市驰明电子科技有限公司 Led灯珠
CN204884446U (zh) * 2015-06-30 2015-12-16 深圳雷曼光电科技股份有限公司 一种led显示屏
CN108767086A (zh) * 2018-05-04 2018-11-06 惠州市华瑞光源科技有限公司 Led灯珠及其制作方法
CN209765224U (zh) * 2019-04-17 2019-12-10 深圳Tcl新技术有限公司 一种背光模组及显示装置
CN111341765A (zh) * 2018-12-18 2020-06-26 深圳Tcl新技术有限公司 一种背光模组

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090114938A1 (en) * 2007-11-02 2009-05-07 Innolux Display Corp. Light emitting diode with sealant having filling particles
CN204668355U (zh) * 2015-06-03 2015-09-23 东莞市驰明电子科技有限公司 Led灯珠
CN204884446U (zh) * 2015-06-30 2015-12-16 深圳雷曼光电科技股份有限公司 一种led显示屏
CN108767086A (zh) * 2018-05-04 2018-11-06 惠州市华瑞光源科技有限公司 Led灯珠及其制作方法
CN111341765A (zh) * 2018-12-18 2020-06-26 深圳Tcl新技术有限公司 一种背光模组
CN209765224U (zh) * 2019-04-17 2019-12-10 深圳Tcl新技术有限公司 一种背光模组及显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114613268A (zh) * 2022-03-09 2022-06-10 深圳市南极光电子科技股份有限公司 一种背光光源、背光模组及显示器
CN114613268B (zh) * 2022-03-09 2024-01-23 深圳市南极光电子科技股份有限公司 一种背光光源、背光模组及显示器

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