WO2021253468A1 - 一种超薄微型扬声器 - Google Patents

一种超薄微型扬声器 Download PDF

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Publication number
WO2021253468A1
WO2021253468A1 PCT/CN2020/097621 CN2020097621W WO2021253468A1 WO 2021253468 A1 WO2021253468 A1 WO 2021253468A1 CN 2020097621 W CN2020097621 W CN 2020097621W WO 2021253468 A1 WO2021253468 A1 WO 2021253468A1
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WO
WIPO (PCT)
Prior art keywords
ultra
voice coil
bracket
diaphragm
attached
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PCT/CN2020/097621
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English (en)
French (fr)
Inventor
袁智杰
郑雷
李园园
Original Assignee
声电电子科技(惠州)有限公司
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Application filed by 声电电子科技(惠州)有限公司 filed Critical 声电电子科技(惠州)有限公司
Publication of WO2021253468A1 publication Critical patent/WO2021253468A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the utility model relates to the technical field of loudspeakers, in particular to an ultra-thin miniature loudspeaker.
  • TWS headsets on the market require miniaturization and intelligence.
  • the headset contains electronic components such as ultra-thin micro speakers, independent back cavity, chips, batteries, microphones, and sensors. Only when the volume of these parts is small enough can the miniaturization of the headset be ensured.
  • the current ultra-thin micro speakers of the existing earphones are generally high in height, which makes the earphone design need to be larger in size. This kind of earphone is not conducive to wearing and also affects the aesthetics.
  • the technical problem to be solved by the utility model is to overcome the existing defects and provide an ultra-thin miniature loudspeaker.
  • a copper ring is pasted under the edge of the circular diaphragm, a voice coil is glued in the middle of the diaphragm, and two outside of the voice coil are provided.
  • Voice coil lead is attached to the diaphragm in an arc shape.
  • the voice coil lead passes through the notch on the side of the bracket.
  • the other end is welded to the two first pads of the circuit assembly.
  • the second pad is used for the earphone lead.
  • Welding, the circuit components are attached to the outer edge of the bracket, and the height is lower than the bottom of the bracket.
  • the inner wall of the bracket is above the circular washer.
  • the diaphragm there is a step for the diaphragm to be attached, and a cavity is formed between the diaphragm and the bracket.
  • the protective cover is attached to the top of the diaphragm, the center of the protective cover is provided with an opening, the T iron is located at the bottom of the magnet, and there is a through hole in the middle of the T iron.
  • the present utility model provides the following technical solutions:
  • the utility model provides an ultra-thin miniature speaker, which includes:
  • a stent the stent has a blocking part
  • the circuit component is arranged on the outer edge of the bracket
  • a vibrating component where the vibrating component is placed on the washer, so as to form a cavity structure between the vibrating component and the bracket;
  • a protective cover the protective cover is pasted above the vibrating component, the center of the protective cover is provided with an opening, the connection part is located at the bottom of the magnet, a through hole is opened in the middle of the connection part, and the mesh cloth is pasted on the center of the bottom of the connection part;
  • a metal ring is pasted under the edge of the vibrating part (the metal ring can also be pasted above the edge of the vibrating part), a voice coil is pasted in the middle of the vibrating part, and two voice coil leads are arranged on the outside of the voice coil, and the voice coil leads are attached to the vibrating part.
  • the voice coil lead passes through the notch on the side of the bracket, and the other end is welded to the two first pads of the circuit assembly, and the second pad is used for welding the earphone leads.
  • the voice coil lead wire is attached to the vibrating component in an arc shape.
  • the vibrating component is a diaphragm
  • the diaphragm is a dome composite material
  • the base material is PU
  • the composite dome material is polyester film, LCP, paper, fiber materials, etc., through the combination of materials and shapes The design can achieve good acoustic performance.
  • the metal ring is a copper ring or a steel ring.
  • the connecting portion is T iron.
  • the barrier portion is a step.
  • the step and the bracket are integrally formed.
  • the bracket and the notch are integrally formed.
  • the circuit assembly is attached to the outer edge of the bracket, the height is lower than the bottom of the bracket, and the inner wall of the bracket is in a circle There is a circle of steps above the ring washer for the diaphragm to be attached to.
  • a cavity structure is formed between the diaphragm and the support.
  • the cover is attached to the top of the diaphragm.
  • the center of the cover is provided with an opening.
  • the T iron is located at the bottom of the magnet.
  • Fig. 1 is an exploded view of the ultra-thin micro speaker in the embodiment of the present invention.
  • Figure 2 is a cross-sectional view of an ultra-thin micro speaker in an embodiment of the present invention.
  • Fig. 3 is a side view of the ultra-thin micro speaker in the embodiment of the present invention.
  • Fig. 4 is a top view of an ultra-thin micro speaker in an embodiment of the present invention.
  • Fig. 5 is a schematic diagram of a conventional PCB board in an ultra-thin micro speaker in an embodiment of the present invention.
  • Fig. 6 is a schematic diagram of an open-hole PCB board in an ultra-thin micro speaker in an embodiment of the present invention.
  • Fig. 7 is a schematic diagram of another open-hole PCB board in the ultra-thin micro speaker in the embodiment of the present invention.
  • Fig. 8 is a schematic diagram of another conventional PCB board in the ultra-thin miniature speaker in the embodiment of the present invention.
  • Fig. 9 is a schematic diagram of the shrapnel in the ultra-thin micro speaker in the embodiment of the present invention.
  • Fig. 10 is a schematic diagram of a PIN pin in an ultra-thin micro speaker in an embodiment of the present invention.
  • Fig. 11 is a schematic diagram of a double-sided PCB board in an ultra-thin micro speaker in an embodiment of the present invention.
  • Fig. 12 is a schematic diagram of another PIN pin of the ultra-thin micro speaker in the embodiment of the present invention.
  • Fig. 13 is a schematic diagram of the conventional PCB board in the ultra-thin micro speaker in the embodiment of the present invention attached to the surface of the bracket.
  • Fig. 14 is a schematic diagram of the perforated PCB board of the ultra-thin micro speaker in the embodiment of the present invention being attached to the surface of the bracket, and the fiberboard through holes are assembled and fixed with the pillars on the bracket.
  • Fig. 15 is another schematic diagram of the perforated PCB board of the ultra-thin micro speaker in the embodiment of the present invention being attached to the surface of the support, and the through holes of the fiberboard are assembled and fixed with the pillars on the support.
  • Fig. 16 is a schematic diagram of the conventional PCB board in the ultra-thin micro speaker in the embodiment of the present utility model attached to the surface of the bracket, and the oblique corners on both sides are used to match the position of the bracket.
  • Fig. 17 is a schematic diagram of the shrapnel molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.
  • Fig. 18 is a schematic diagram of the PIN needle molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.
  • Fig. 19 is a schematic diagram of the double-sided PCB board molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.
  • FIG. 20 is a schematic diagram of another PIN needle molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.
  • Figure 21, Figure 22 and Figure 23 are schematic diagrams showing how the voice coil lead of the ultra-thin miniature speaker in the embodiment of the present invention is attached to the diaphragm in an arc shape.
  • Figure 24, Figure 25 and Figure 26 are schematic diagrams of the ultra-thin micro-speaker in the embodiment of the utility model, the voice coil leads are drawn out in an arc-shaped symmetrical suspension.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more than two, unless specifically defined otherwise.
  • This embodiment provides an ultra-thin micro speaker, including:
  • the washer 10 is placed under the barrier 15 which is a step, and the step and the bracket 6 are integrally formed;
  • the circuit component 7 is arranged on the outer edge of the bracket 6;
  • the vibrating component 2 is placed on the washer 10 to form a cavity structure between the vibrating component 2 and the support 6.
  • the vibrating component 2 is a diaphragm, and the diaphragm is a dome composite material ,
  • the base material is PU, and the composite dome material is polyester film, LCP, paper, fiber materials, etc., through the combination of materials and the design of the shape, good acoustic performance can be achieved;
  • the protective cover 1, the protective cover 1 is pasted above the vibrating component 2, the protective cover 1 is provided with an opening 16 in the center, the connecting portion 12 is located at the bottom of the magnet 11, and the connecting portion 12 is provided with a through hole 17 in the middle. 13 is attached to the center of the bottom of the connecting portion 12, and the connecting portion 12 is a T iron;
  • a metal ring 3 is attached below the edge of the vibrating component 2.
  • the metal ring 3 is a copper ring or a steel ring.
  • a voice coil 4 is glued in the middle of the vibrating component 2.
  • the voice coil lead 5 is attached to the vibrating component 2 in an arc shape, and the voice coil lead 5 is attached to the vibrating component 2.
  • the voice coil lead 5 passes through the notch 14 on the side of the bracket 6, and the other end is welded to the circuit assembly 7 On the two first pads 8, the second pad 9 is used for welding earphone leads, and the bracket 6 and the notch 14 are integrally formed.
  • the horn is an ultra-thin speaker.
  • the contact connection of the horn can be a conventional circuit component as described above, but is not limited to a conventional circuit component. It can also be an open-hole circuit component (suitable for external Welded horn), where the through hole 19 on the fiberboard of the circuit component is used to assemble and fix the post on the bracket, and the through hole 17 on the pad of the circuit component (the inside of the hole is connected to the pad) is used to communicate with the headset through a PIN pin or FPC It can also be a double-sided circuit assembly, shrapnel, PIN pin (suitable for internal welding speakers), etc.
  • a copper ring is attached under the edge of the circular diaphragm, the voice coil 4 is attached to the middle of the diaphragm, and two voice coil leads 5 are arranged on the outside of the voice coil 4, and the voice coil leads 5 are attached in an arc shape.
  • the voice coil lead 5 passes through the side notch 14 of the bracket 6, and the other end is welded to the two first pads 8 of the circuit assembly 7.
  • the second pad 9 is used for welding the earphone leads, and the circuit assembly 7 is attached.
  • the height is lower than the bottom of the support 6, the inner wall of the support 6 is above the circular washer 10, and there is a step for the diaphragm to be attached to, and a cavity is formed between the diaphragm and the support 6.
  • the protective cover 1 is attached to the top of the diaphragm, the center of the protective cover 1 is provided with an opening 16, the T iron is located at the bottom of the magnet 11, the T iron is opened with a through hole 17 in the middle of the T iron, and the mesh 13 is attached to the center of the bottom of the T iron.
  • the utility model achieves a small size and ultra-thin miniature speaker through a compact structure design, which meets the needs of the TWS headset to reduce the size of the speaker due to too many components in the internal space, and can also achieve good acoustic performance to satisfy customers Demand.
  • the speaker is an ultra-thin speaker, and the voice coil lead wire can be drawn out on the diaphragm in an arc shape as described above, which is suitable for internal welding horns. As shown in Figure 17 to Figure 20, Figure 24 to Figure 26, the voice coil lead wire can also be drawn out in an arc-shaped symmetrical suspension, which is suitable for external welding horns.
  • the horn is an ultra-thin speaker.
  • the contact connection of the horn can be a conventional circuit component as described above, but is not limited to a conventional circuit component. It can also be an open-hole circuit component (suitable for external Welded horn), where the through hole 19 on the fiberboard of the circuit component is used to assemble and fix the post on the bracket, and the through hole 17 on the pad of the circuit component (the inside of the hole is connected to the pad) is used to communicate with the headset through a PIN pin or FPC It can also be a double-sided circuit assembly, shrapnel, PIN pin (suitable for internal welding speakers), etc.
  • a copper ring is attached under the edge of the circular diaphragm, the voice coil 4 is attached to the middle of the diaphragm, and two voice coil leads 5 are arranged on the outside of the voice coil 4, and the voice coil leads 5 are attached in an arc shape.
  • the voice coil lead 5 passes through the side notch 14 of the bracket 6, and the other end is welded to the two first pads 8 of the circuit assembly 7.
  • the second pad 9 is used for welding the earphone leads, and the circuit assembly 7 is attached.
  • the height is lower than the bottom of the support 6, the inner wall of the support 6 is above the circular washer 10, and there is a step for the diaphragm to be attached to, and a cavity is formed between the diaphragm and the support 6.
  • the protective cover 1 is attached to the top of the diaphragm, the center of the protective cover 1 is provided with an opening 16, the T iron is located at the bottom of the magnet 11, the T iron is opened with a through hole 17 in the middle of the T iron, and the mesh 13 is attached to the center of the bottom of the T iron.
  • the utility model achieves a small size and ultra-thin miniature speaker through a compact structure design, which meets the needs of the TWS headset to reduce the size of the speaker due to too many components in the internal space, and can also achieve good acoustic performance to satisfy customers Demand.
  • the speaker is an ultra-thin speaker, and the voice coil lead wire can be drawn out on the diaphragm in an arc shape as described above, which is suitable for internal welding horns. As shown in Figure 17 to Figure 20, Figure 24 to Figure 26, the voice coil lead wire can also be drawn out in an arc-shaped symmetrical suspension, which is suitable for external welding horns.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本实用新型公开了一种超薄微型扬声器，音圈的外部设置有两根音圈引线，音圈引线呈弧形状贴合于振膜上，音圈引线通过支架侧面槽口，另一端焊接于电路组件的两个第一焊盘上，第二焊盘用于耳机引线的焊接，电路组件贴合于支架外侧边缘，高度低于支架底部，支架的内壁处在圆环形华司上方有一圈用于供振膜贴合的台阶，振膜与支架之间形成一个腔体结构，护盖贴于振膜上方，护盖中央设置有开孔，T铁位于磁铁底部，T铁中间开有通孔，网布贴于T铁底部中心位置，通过紧凑的结构设计，来达到一款小体积的超薄微型扬声器，满足TWS耳机因内部空间放置太多元器件,而需要缩小喇叭体积的需求，同时也能达到良好的声学性能，满足客户的需求。

Description

一种超薄微型扬声器 技术领域
本实用新型涉及扬声器技术领域，尤其涉及一种超薄微型扬声器。
 背景技术
目前市面上的TWS耳机要求微型化和智能化，耳机里包含超薄微型扬声器，独立后腔，芯片，电池，麦克风，传感器等电子元器件。只有把这些零部件体积做到足够小后，才能保证耳机体积微型化。
目前现有的耳机超薄微型扬声器高度普遍较高，这就使耳机设计需要做到较大的体积，这种耳机不利于佩戴，也影响美观。
 技术问题
本实用新型要解决的技术问题是克服现有的缺陷，提供一种超薄微型扬声器，圆形振膜边缘下方贴有一铜环，振膜中部粘有音圈，音圈的外部设置有两根音圈引线，音圈引线呈弧形状贴合于振膜上，音圈引线通过支架侧面槽口，另一端焊接于电路组件的两个第一焊盘上，第二焊盘用于耳机引线的焊接，电路组件贴合于支架外侧边缘，高度低于支架底部，支架的内壁处在圆环形华司上方有一圈用于供振膜贴合的台阶，振膜与支架之间形成一个腔体结构，护盖贴于振膜上方，护盖中央设置有开孔，T铁位于磁铁底部，T铁中间开有通孔，网布贴于T铁底部中心位置，通过紧凑的结构设计，来达到一款小体积的超薄微型扬声器，满足TWS耳机因内部空间放置太多元器件,而需要缩小喇叭体积的需求，同时也能达到良好的声学性能，满足客户的需求，可以有效解决背景技术中的问题。
 技术解决方案
为了解决上述技术问题，本实用新型提供了如下的技术方案：
本实用新型提供一种超薄微型扬声器，包括：
支架，所述支架内具有一隔挡部；
华司，搭设于所述隔挡部下；
电路组件，设置于所述支架外侧边缘；
振动部件，所述振动部件搭设于所述华司上，以实现振动部件与支架之间形成一个腔体结构；
护盖，所述护盖贴于所述振动部件上方，所述护盖中央设置有开孔，连接部位于磁铁底部，连接部中间开有通孔，网布贴于连接部底部中心位置；
振动部件边缘下方贴有一金属环(金属环也可以贴于振动部件边缘上方)，振动部件中部粘有音圈，所述音圈的外部设置有两根音圈引线，音圈引线贴合于振动部件上，所述音圈引线通过支架侧面槽口，另一端焊接于电路组件的两个第一焊盘上，第二焊盘用于耳机引线的焊接。
作为一种优选方案，所述音圈引线呈弧形状贴合于振动部件上。
作为一种优选方案，所述振动部件为振膜，振膜为球顶复合材料，基材为PU,复合球顶材料为聚酯薄膜、LCP、纸、纤维材料等，通过材料的组合和形状的设计能达到良好的声学性能。
作为一种优选方案，所述金属环为铜环或钢环。
作为一种优选方案，所述连接部为T铁。
作为一种优选方案，所述隔挡部为台阶。
作为一种优选方案，所述台阶与所述支架一体成型。
作为一种优选方案，所述支架与槽口一体成型。
 有益效果
本实用新型中提供的一个或多个技术方案，至少具有如下技术效果或者优点：
圆形振膜边缘下方贴有一铜环，振膜中部粘有音圈，音圈的外部设置有两根音圈引线，音圈引线呈弧形状贴合于振膜上，音圈引线通过支架侧面槽口，另一端焊接于电路组件的两个第一焊盘上，第二焊盘用于耳机引线的焊接，电路组件贴合于支架外侧边缘，高度低于支架底部，支架的内壁处在圆环形华司上方有一圈用于供振膜贴合的台阶，振膜与支架之间形成一个腔体结构，护盖贴于振膜上方，护盖中央设置有开孔，T铁位于磁铁底部，T铁中间开有通孔，网布贴于T铁底部中心位置，通过紧凑的结构设计，来达到一款小体积的超薄微型扬声器，相应耳机的体积也能缩小，同时也能达到良好的声学性能，满足客户的需求。
 附图说明
附图用来提供对本实用新型的进一步理解，并且构成说明书的一部分，与本实用新型的实施例一起用于解释本实用新型，并不构成对本实用新型的限制。
在附图中：
图1是本实用新型实施例中超薄微型扬声器***图。
图2是本实用新型实施例中超薄微型扬声器剖面图。
图3是本实用新型实施例中超薄微型扬声器侧视图。
图4是本实用新型实施例中超薄微型扬声器俯视图。
图5是本实用新型实施例中超薄微型扬声器中常规PCB板示意图。
图6是本实用新型实施例中超薄微型扬声器中开孔PCB板示意图。
图7是本实用新型实施例中超薄微型扬声器中另一开孔PCB板示意图。
图8是本实用新型实施例中超薄微型扬声器中另一常规PCB板示意图。
图9是本实用新型实施例中超薄微型扬声器中弹片示意图。
图10是本实用新型实施例中超薄微型扬声器中PIN针示意图。
图11是本实用新型实施例中超薄微型扬声器中双面PCB板示意图。
图12是本实用新型实施例中超薄微型扬声器另一PIN针示意图。
图13是本实用新型实施例中超薄微型扬声器中常规PCB板贴于支架表面示意图。
图14是本实用新型实施例中超薄微型扬声器中开孔PCB板贴于支架表面，纤维板通孔与支架上的柱子组装固定示意图。
图15是本实用新型实施例中超薄微型扬声器中开孔PCB板贴于支架表面，纤维板通孔与支架上的柱子组装固定另一示意图。
图16是本实用新型实施例中超薄微型扬声器中常规PCB板贴于支架表面，两边斜角处用于与支架档位匹配定位示意图。
图17是本实用新型实施例中超薄微型扬声器中弹片啤塑于支架中示意图。
图18是本实用新型实施例中超薄微型扬声器中PIN针啤塑于支架中示意图。
图19是本实用新型实施例中超薄微型扬声器中双面PCB板啤塑于支架中示意图。
图20是本实用新型实施例中超薄微型扬声器中另一PIN针啤塑于支架中示意图。
图21、图22和图23是本实用新型实施例中超薄微型扬声器中音圈引线成弧形贴于膜片引出示意图。
图24、图25和图26是本实用新型实施例中超薄微型扬声器中音圈引线成弧形对称悬空引出示意图。
图中标号：1、护盖；2、振动部件；3、金属环；4、音圈；5、音圈引线；6、支架；7、电路组件；8、第一焊盘；9、第二焊盘；10、华司；11、磁铁；12、连接部；13、网布；14、槽口；15、隔挡部；16、焊盘；17、弹片；18、PIN针；19、通孔；20、斜接触边。
 本发明的最佳实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本实用新型，并不用于限定本实用新型。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
在本实用新型的描述中，需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本实用新型和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本实用新型的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
为了更好地理解上述技术方案，下面将结合说明书附图以及具体实施方式对上述技术方案进行详细的说明。
实施例：
请参阅图1-26，本实施例提供一种超薄微型扬声器，包括：
支架6，所述支架6内具有一隔挡部15；
华司10，搭设于所述隔挡部15下，所述隔挡部15为台阶，所述台阶与所述支架6一体成型；
电路组件7，设置于所述支架6外侧边缘；
振动部件2，所述振动部件2搭设于所述华司10上，以实现振动部件2与支架6之间形成一个腔体结构，所述振动部件2为振膜，振膜为球顶复合材料，基材为PU,复合球顶材料为聚酯薄膜、LCP、纸、纤维材料等，通过材料的组合和形状的设计能达到良好的声学性能；
护盖1，所述护盖1贴于所述振动部件2上方，所述护盖1中央设置有开孔16，连接部12位于磁铁11底部，连接部12中间开有通孔17，网布13贴于连接部12底部中心位置，所述连接部12为T铁；
振动部件2边缘下方贴有一金属环3，所述金属环3为铜环或钢环，振动部件2中部粘有音圈4，所述音圈4的外部设置有两根音圈引线5，所述音圈引线5呈弧形状贴合于振动部件2上，音圈引线5贴合于振动部件2上，所述音圈引线5通过支架6侧面槽口14，另一端焊接于电路组件7的两个第一焊盘8上，第二焊盘9用于耳机引线的焊接，所述支架6与槽口14一体成型。
请参考图5-图20，喇叭为超薄型扬声器，喇叭的接触连接方式可以是如上所述的常规的电路组件，但不局限于常规电路组件，也可以是开孔电路组件（适用于外焊式喇叭），其中电路组件纤维板上开通孔19作用在于与支架上的柱子组装固定、电路组件焊盘上开通孔17（孔内侧与焊盘连接）的作用在于通过PIN针或者FPC与耳机相接，也可以是双面电路组件、弹片、PIN针（适用于内焊式喇叭）等。
 本发明的实施方式
在本实施例中，圆形振膜边缘下方贴有一铜环，振膜中部粘有音圈4，音圈4的外部设置有两根音圈引线5，音圈引线5呈弧形状贴合于振膜2上，音圈引线5通过支架6侧面槽口14，另一端焊接于电路组件7的两个第一焊盘8上，第二焊盘9用于耳机引线的焊接，电路组件7贴合于支架6外侧边缘，高度低于支架6底部，支架6的内壁处在圆环形华司10上方有一圈用于供振膜贴合的台阶，振膜与支架6之间形成有一个腔体结构，护盖1贴于振膜上方，护盖1中央设置有开孔16，T铁位于磁铁11底部，T铁中间开有通孔17，网布13贴于T铁底部中心位置，本实用新型通过紧凑的结构设计，来达到一款小体积的超薄微型扬声器，满足TWS耳机因内部空间放置太多元器件,而需要缩小喇叭体积的需求，同时也能达到良好的声学性能，满足客户的需求。
请参考图13至图16，图21至图23，喇叭为超薄扬声器，音圈出线可以是如上所述的音圈引线呈弧形贴于膜片上引出，适用于内焊式喇叭。如图17至图20，图24至图26，也可以是音圈引线呈弧形对称悬空引出，适用于外焊式喇叭。
 工业实用性
请参考图5-图20，喇叭为超薄型扬声器，喇叭的接触连接方式可以是如上所述的常规的电路组件，但不局限于常规电路组件，也可以是开孔电路组件（适用于外焊式喇叭），其中电路组件纤维板上开通孔19作用在于与支架上的柱子组装固定、电路组件焊盘上开通孔17（孔内侧与焊盘连接）的作用在于通过PIN针或者FPC与耳机相接，也可以是双面电路组件、弹片、PIN针（适用于内焊式喇叭）等。
在本实施例中，圆形振膜边缘下方贴有一铜环，振膜中部粘有音圈4，音圈4的外部设置有两根音圈引线5，音圈引线5呈弧形状贴合于振膜2上，音圈引线5通过支架6侧面槽口14，另一端焊接于电路组件7的两个第一焊盘8上，第二焊盘9用于耳机引线的焊接，电路组件7贴合于支架6外侧边缘，高度低于支架6底部，支架6的内壁处在圆环形华司10上方有一圈用于供振膜贴合的台阶，振膜与支架6之间形成有一个腔体结构，护盖1贴于振膜上方，护盖1中央设置有开孔16，T铁位于磁铁11底部，T铁中间开有通孔17，网布13贴于T铁底部中心位置，本实用新型通过紧凑的结构设计，来达到一款小体积的超薄微型扬声器，满足TWS耳机因内部空间放置太多元器件,而需要缩小喇叭体积的需求，同时也能达到良好的声学性能，满足客户的需求。
请参考图13至图16，图21至图23，喇叭为超薄扬声器，音圈出线可以是如上所述的音圈引线呈弧形贴于膜片上引出，适用于内焊式喇叭。如图17至图20，图24至图26，也可以是音圈引线呈弧形对称悬空引出，适用于外焊式喇叭。

Claims (8)

  1. 一种超薄微型扬声器，其特征在于：包括：
    支架（6），所述支架（6）内具有一隔挡部（15）；
    华司（10），搭设于所述隔挡部（15）下；
    电路组件（7），设置于所述支架（6）外侧边缘；
    振动部件（2），所述振动部件（2）搭设于所述华司（10）上，以实现振动部件（2）与支架（6）之间形成一个腔体结构；
    护盖（1），所述护盖（1）贴于所述振动部件（2）上方，所述护盖（1）中央设置有开孔（16），连接部（12）位于磁铁（11）底部，连接部（12）中间开有通孔（17），网布（13）贴于连接部（12）底部中心位置；
    振动部件（2）边缘下方贴有一金属环（3），振动部件（2）中部粘有音圈（4），所述音圈（4）的外部设置有两根音圈引线（5），音圈引线（5）贴合于振动部件（2）上，所述音圈引线（5）通过支架（6）侧面的槽口（14），另一端焊接于电路组件（7）的两个第一焊盘（8）上，第二焊盘（9）用于耳机引线的焊接。
  2. 根据权利要求1所述的超薄微型扬声器，其特征在于：所述音圈引线（5）呈弧形状贴合于振动部件（2）上。
  3. 根据权利要求2所述的超薄微型扬声器，其特征在于：所述振动部件（2）为振膜。
  4. 根据权利要求1所述的超薄微型扬声器，其特征在于：所述金属环（3）为铜环或钢环。
  5. 根据权利要求1所述的超薄微型扬声器，其特征在于：所述连接部（12）为T铁。
  6. 根据权利要求5所述的超薄微型扬声器，其特征在于：所述隔挡部（15）为台阶。
  7. 根据权利要求6所述的超薄微型扬声器，其特征在于：所述台阶与所述支架（6）一体成型。
  8. 根据权利要求1所述的超薄微型扬声器，其特征在于：所述支架（6）与槽口（14）一体成型。
PCT/CN2020/097621 2020-06-18 2020-06-23 一种超薄微型扬声器 WO2021253468A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6735323B1 (en) * 2003-01-30 2004-05-11 Sun Technique Electric Co., Ltd. Speaker
CN206061117U (zh) * 2016-05-31 2017-03-29 声电电子科技(惠州)有限公司 一种微型扬声器
CN206272837U (zh) * 2016-11-21 2017-06-20 深圳市冠旭电子股份有限公司 喇叭及耳机
CN206993367U (zh) * 2017-07-14 2018-02-09 东莞市皖太电子厂 一种音响为方形状的耳机
CN209105438U (zh) * 2018-12-24 2019-07-12 广州市立伟电子有限公司 低频微型动圈式扬声器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6735323B1 (en) * 2003-01-30 2004-05-11 Sun Technique Electric Co., Ltd. Speaker
CN206061117U (zh) * 2016-05-31 2017-03-29 声电电子科技(惠州)有限公司 一种微型扬声器
CN206272837U (zh) * 2016-11-21 2017-06-20 深圳市冠旭电子股份有限公司 喇叭及耳机
CN206993367U (zh) * 2017-07-14 2018-02-09 东莞市皖太电子厂 一种音响为方形状的耳机
CN209105438U (zh) * 2018-12-24 2019-07-12 广州市立伟电子有限公司 低频微型动圈式扬声器

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