WO2021244290A1 - 一种光模块散热组件以及通信设备 - Google Patents
一种光模块散热组件以及通信设备 Download PDFInfo
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- WO2021244290A1 WO2021244290A1 PCT/CN2021/094578 CN2021094578W WO2021244290A1 WO 2021244290 A1 WO2021244290 A1 WO 2021244290A1 CN 2021094578 W CN2021094578 W CN 2021094578W WO 2021244290 A1 WO2021244290 A1 WO 2021244290A1
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- WIPO (PCT)
- Prior art keywords
- optical module
- heat dissipation
- heat
- cage
- end portion
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- This application relates to the field of optical communications, and in particular to an optical module heat dissipation assembly and communication equipment.
- optical modules are one of the key components. With the continuous evolution of communication to high speed, large bandwidth, and large traffic, optical modules are in terms of quantity, aggregation, and heat generation of a single module. All of them are constantly developing in the direction of high density, clustering, and high heat. The heat dissipation problem of the optical module caused by this has become more and more difficult.
- the optical modules will be symmetrically arranged on the front and back sides of the PCB. If the two optical modules are symmetrically arranged on the front and back sides of the PCB When there is a large temperature difference, the optical module on the higher temperature side will become the bottleneck for heat dissipation of the entire communication device, while the optical module on the other side still has a heat dissipation margin.
- the present application provides an optical module heat dissipation assembly and a communication device, which are used to improve the heat dissipation efficiency of two optical modules arranged symmetrically on both sides of a PCB, and effectively increase the service life of the optical module heat dissipation assembly.
- the present application provides an optical module heat dissipation assembly, including a printed circuit board, and a first optical module cage and a second optical module cage located on both sides of the printed circuit board, and the first optical module cage is used for accommodating the first optical module cage.
- the optical module, the second optical module cage is used for accommodating the second optical module, and the optical module heat dissipation assembly further includes a first heat dissipation end and a second heat dissipation end that are positioned opposite to each other, the first heat dissipation end and the first light
- the module cage is attached, and the second heat dissipation end is attached to the second optical module cage.
- the first optical module is used to pass heat sequentially through the second optical module.
- a heat dissipation end and the second heat dissipation end conduct to the second optical module. If the temperature of the second optical module is higher than that of the first optical module, the second optical module is used to transfer heat sequentially through the first optical module.
- the two heat dissipation ends and the first heat dissipation end conduct conduction to the first optical module;
- the first heat dissipation end includes a plurality of first heat dissipation teeth arranged at intervals, and there are two adjacent first heat dissipation teeth
- the first gap, the first heat dissipation tooth is used to deform in the first gap under the action of the pressure of the first heat dissipation end;
- the second heat dissipation end includes a plurality of second heat dissipation teeth arranged at intervals. There is a second gap between two adjacent second heat dissipation teeth, and the second heat dissipation teeth are used to deform in the second gap under the pressure of the second heat dissipation end.
- heat can also be dissipated through the first heat dissipation end and the second heat dissipation end, so that the first optical module and the second optical module can be sufficiently dissipated, and the heat dissipation efficiency of the optical module heat dissipation assembly is improved, and Through the heat dissipation mode of the intercommunication between the first optical module and the second optical module, the heat dissipation balance of the optical module heat dissipation assembly is improved, the reliability of the optical module is improved, and the use time of the optical module is prolonged.
- the stress on the first heat dissipation end can be fully released in the first gap, effectively avoiding the possibility of stress damaging the cage of the first optical module, and the stress on the second heat dissipation end can be fully released in the second gap, effectively This avoids the possibility of stress damaging the second optical module cage, effectively improves the safety of the first optical module cage and the second optical module cage, and increases the service life of the first optical module cage and the second optical module cage.
- the use of multiple first heat dissipation teeth and multiple second heat dissipation teeth effectively avoids heat conduction between the first heat dissipation end and the second heat dissipation end through the air with relatively high thermal resistance, and effectively reduces the first heat dissipation.
- the thermal resistance between the end and the second heat dissipation end, and during the deformation process of the first heat dissipation tooth and the second heat dissipation tooth, will increase the contact area between the first heat dissipation tooth and the first heat dissipation end, and increase The contact area between the large second heat dissipation tooth and the second heat dissipation end is more conducive to the heat conduction between the first heat dissipation end and the second heat dissipation end, and the heat dissipation efficiency is improved.
- the first heat dissipation end portion and the second heat dissipation end portion are both made of a thermally conductive material, and the first optical module cage faces the printed circuit board The end face is attached to the first heat dissipation end, and the end face of the second optical module cage facing the printed circuit board is attached to the second heat dissipation end;
- the printed circuit board includes an opening, and the opening The window penetrates the printed circuit board in a direction perpendicular to the printed circuit board, the first heat dissipation end portion and the second heat dissipation end portion are both inserted into the window and set, and the first The heat dissipation end portion and the second heat dissipation end portion are positioned opposite to each other in a direction perpendicular to the printed circuit board.
- both the first heat dissipation end portion and the second heat dissipation end portion are inserted into the opening of the printed circuit board, thereby effectively realizing the position alignment between the first heat dissipation end portion and the second heat dissipation end portion and avoiding Therefore, the position between the first heat dissipation end portion and the second heat dissipation end portion is staggered, which results in a situation in which the first heat dissipation end portion and the second heat dissipation end portion cannot achieve intercommunication heat dissipation performance.
- a first elastic member made of a thermally conductive material is provided in the first optical module cage, and the first elastic member is located between the first optical module and the The first elastic member, which is in a compressed state between the first heat dissipation ends, is simultaneously attached to the first optical module and the first heat dissipation end; the second optical module cage is provided with a thermally conductive material The second elastic part is made, the second elastic part is located between the second light module and the second heat dissipation end, and the second elastic part is in a compressed state at the same time as the second light The module is attached to the second heat dissipation end.
- the first elastic member is tightly attached to the first heat dissipation end and the first optical module, and the first optical module can conduct heat to the first heat dissipation end through the first elastic member. Because the conduction process is carried out through the first elastic member made of heat-conducting material, the disadvantage that the heat of the first optical module is conducted to the first heat dissipation end through the air with high thermal resistance is avoided, thereby effectively reducing the first heat dissipation end.
- the thermal resistance of an optical module in the process of conducting heat to the first heat dissipation end please refer to the description of the first elastic member for details, and will not be repeated.
- the first elastic member includes a first fixed end and a first elastic end that are connected to each other, and the first fixed end is fixedly connected to the first heat dissipation end.
- the first elastic end extends between the first heat dissipation end and the first optical module;
- the second elastic member includes a second fixed end and The second elastic end, the second fixed end is fixedly connected to the end surface of the second heat dissipation end facing the second optical module, and the second elastic end extends between the second heat dissipation end and the first optical module.
- the first fixed end is fixedly connected to the end surface of the first heat dissipation end facing the first optical module, and the first fixed end effectively ensures that the first elastic member and the first optical module cage
- the stability of the structure prevents the first elastic member from detaching from the first optical module cage.
- the first elastic end extends between the first heat dissipation end and the first optical module, and The first elastic end can be freely deformed under the action of pressure, so that when the first elastic end is deformed, the heat of the first optical module can be conducted to the first heat dissipation end, and the conduction process has low thermal resistance .
- the beneficial effects of using the second elastic member please refer to the description of the first elastic member for details, and will not be repeated.
- the optical module heat dissipation assembly further includes a heat conduction middle piece made of a heat conduction material, and the heat conduction middle piece is located at the first heat dissipation end and the second heat dissipation end. Between the heat-dissipating end portions, and both sides of the thermally conductive intermediate piece are attached to the first heat-dissipating end portion and the second heat-dissipating end portion.
- the heat conduction between the first heat dissipation end portion and the second heat dissipation end portion is carried out through the heat conduction middle piece, which reduces the heat transfer between the first heat dissipation end portion and the second heat dissipation end portion.
- Thermal resistance prevents heat conduction between the first heat dissipation end and the second heat dissipation end through high thermal resistance air, and improves the efficiency of heat conduction between the first heat dissipation end and the second heat dissipation end.
- the first optical module cage is connected to a first heat sink
- the second optical module cage is connected to a second heat sink
- the first optical module is used to pass through the A heat dissipation path and a second heat dissipation path are used for heat dissipation.
- the first heat dissipation path is for the first optical module to dissipate heat through the first heat sink; if the temperature of the first optical module is higher than that of the second optical module, Module, the second heat dissipation path is for the first optical module to pass through the first optical module cage, the first heat dissipation end, the second heat dissipation end, and the second optical module in sequence The cage, the second optical module and the second heat sink dissipate heat.
- the heat dissipation of the first optical module through the first heat dissipation path and the second heat dissipation path can effectively use the second heat sink while effectively improving the heat dissipation efficiency of the first optical module.
- the heat dissipation margin for the first optical module to dissipate heat which realizes the balanced heat dissipation between the first optical module and the second optical module when there is a temperature difference between the temperature of the first optical module and the temperature of the second optical module .
- the first optical module cage is connected to a first heat sink
- the second optical module cage is connected to a second heat sink
- the second optical module is used to pass through the Three heat dissipation paths and a fourth heat dissipation path, where the third heat dissipation path is for the second optical module to dissipate heat through the second heat sink; if the temperature of the second optical module is higher than that of the first optical module, Then the fourth heat dissipation path is for the second optical module to pass through the second optical module cage, the second heat dissipation end, the first heat dissipation end, the first optical module cage, The first optical module and the first heat sink dissipate heat.
- heat dissipation of the second optical module through the third heat dissipation path and the fourth heat dissipation path can effectively use the first heat sink while effectively improving the heat dissipation efficiency of the second optical module.
- the heat dissipation margin for the second optical module to dissipate heat to achieve a balanced heat dissipation between the first optical module and the second optical module when there is a temperature difference between the temperature of the first optical module and the temperature of the second optical module .
- a first space and a second space exist between the first optical module cage and the second optical module cage, and the first space is used to set the Printed circuit board;
- the optical module heat dissipation assembly further includes a first intercommunication heat dissipation member made of a thermally conductive material, the first intercommunication heat dissipation member is located in the second space, and the first end of the first intercommunication heat dissipation member It is attached to the first optical module cage, and the second end of the first intercommunication heat sink is attached to the second optical module cage.
- first optical module and the second optical module can also realize the heat dissipation performance of the communication between the first optical module and the second optical module through the first intercommunication heat sink, thereby further improving the heat dissipation efficiency.
- the first optical module cage has a bottom shell and a first shell, and the first shell is buckled and connected to the bottom shell so as to be connected to the first shell
- An accommodating space for accommodating the first optical module is formed between the bottom case and the bottom case, the bottom case is disposed toward the printed circuit board
- the second optical module cage has a top case and a second outer case
- the The second housing is buckled and connected to the top housing to form an accommodating space for accommodating the second optical module between the second housing and the top housing, and the top housing faces the printed circuit board
- the optical module heat dissipation assembly further includes a second intercommunication heat dissipation member made of a thermally conductive material, the first end of the second intercommunication heat dissipation member is attached to the first housing, and the second intercommunication heat dissipation member The second end is attached to the second housing.
- first optical module and the second optical module can also realize the heat dissipation performance of the intercommunication between the first optical module and the second optical module through the second intercommunication heat sink, thereby further improving the heat dissipation efficiency.
- the present application provides a communication device, including a cabinet, and the cabinet includes at least one optical module heat dissipation assembly according to any one of the above-mentioned first aspects.
- Fig. 1 is an example diagram of a side structure of a communication device provided by the prior art
- FIG. 2 is an example diagram of a side cross-sectional structure of an embodiment of an optical module heat dissipation assembly provided by this application;
- FIG. 3 is an example diagram of an overall structure of the first optical module cage provided by this application.
- FIG. 4 is an example diagram of a partial structure of the optical module heat dissipation assembly provided by this application.
- Fig. 5 is a diagram showing another example of the overall structure of the first optical module cage provided by this application.
- Fig. 6 is an example diagram of the bottom surface structure of the first optical module cage provided by this application.
- FIG. 7 is an example diagram of a side cross-sectional structure of the first optical module cage provided by this application.
- FIG. 8 is an example diagram of a side cross-sectional structure of another embodiment of the optical module heat dissipation assembly provided by this application.
- This application provides an optical module heat dissipation assembly, which is used to dissipate heat for the optical module.
- the structure of a communication device to which the optical module heat dissipation assembly is applied is illustrated below in conjunction with FIG. 1 sexual description, where Fig. 1 is an example diagram of a side structure of a communication device provided in the prior art.
- optical modules are a kind of conversion of optical signals into electrical signals and/or An integrated module that converts electrical signals into optical signals plays an important role in the process of optical communication.
- the optical module generates a large amount of heat during operation.
- the laser used to generate or receive optical signals in the optical module has relatively strict temperature requirements.
- the heat generated by the optical module needs to be dissipated in time.
- the communication device includes a PCB100, and the communication device integrates more optical modules, then the communication device can have two optical modules symmetrically arranged on both sides of the PCB100, that is, the first optical module is arranged on the first side of the PCB100
- a second optical module cage 102 is provided on the second side of the PCB 100, so that the first optical module cage 101 and the second optical module cage 102 are symmetrical with the PCB 100 as the center.
- the first optical module cage 101 is used to accommodate the first optical module, and the first optical module cage 101 is connected to the first heat sink 104 through the flexible heat pipe 103, so that the first optical module sequentially passes through the first optical module cage 101 and The flexible heat pipe 103 conducts heat to the first radiator 104, and the first radiator 104 can dissipate the acquired heat.
- the second optical module cage 102 is used to accommodate the second optical module, and the second optical module cage 102 is connected to the second heat sink 106 through the flexible heat pipe 105, so that the second optical module sequentially passes through the second optical module cage 102 and the flexible heat pipe 105 The heat is conducted to the second radiator 106, and the second radiator 106 can dissipate the acquired heat.
- the communication device shown in FIG. 1 can effectively increase the number of optical modules installed in the communication device through the optical modules symmetrically arranged on both sides of the PCB 100, thereby realizing a high-density layout of the optical modules on the PCB 100, and improving the communication equipment Business volume.
- the heat dissipation paths of the optical modules symmetrically arranged on both sides of the PCB 100 are isolated from each other.
- the first optical module shown in FIG. The heat is dissipated by conducting to the second heat sink 106, which results in uneven heat dissipation of the optical modules located on both sides of the PCB.
- the specific description is shown in the following example:
- the disadvantage is : First of all, the heat that the first optical module needs to dissipate exceeds the heat dissipation capacity of the first radiator 104, which will cause the first radiator 104 to fail to dissipate the first optical module sufficiently, which reduces the reliability of the first optical module .
- the heat dissipated by the second optical module is lower than the heat dissipation capacity of the second heat sink 106, which will cause the second heat sink 106 to have a heat dissipation margin that is not used, which reduces the heat dissipation efficiency of the second heat sink 106.
- the present application provides an optical module heat dissipation assembly, which is used to improve the heat dissipation efficiency of the optical modules symmetrically arranged on both sides of the PCB, thereby improving the integrated
- the following first describes the structure of the optical module heat dissipation assembly provided in this embodiment with reference to FIG. 2, where FIG. 2 is one of the optical module heat dissipation assemblies provided by this application Example side view sectional structure diagram of the embodiment.
- the optical module heat dissipation assembly 200 shown in this embodiment includes an optical module heat dissipation assembly housing.
- the optical module heat dissipation assembly housing shown in FIG. 2 specifically includes an upper housing 202 and a lower housing 203, an upper housing 202 and a lower housing
- the accommodating space formed between 203 is used for accommodating PCB 201.
- a first optical module cage 210 and a second optical module cage 220 are provided on both sides of the PCB 201, and the first optical module cage 210 is located between the upper housing 202 and the PCB 201, and the second optical module cage 220 is located between the lower housing 203 and the PCB 201 .
- the first optical module cage 210 is used for accommodating a first optical module
- the second optical module cage 220 is used for accommodating a second optical module.
- FIG. 3 is an example diagram of an overall structure of the first optical module cage provided in this embodiment.
- the side of the first optical module cage 210 facing away from the PCB 201 is provided with a first opening 211. It can be seen that the first opening 211 is positioned opposite to the upper housing 202, and can pass through the first opening when the first optical module is installed. 211 places the first optical module inside the first optical module cage 210. It should be clear that in this embodiment, the first opening 211 is provided on the top surface of the first optical module cage 210 as an example for illustrative description, and it is not limited. In other scenarios, the first optical module cage may be A first opening or the like is provided on the side wall or bottom surface of 210, as long as the first opening can reduce the thermal resistance of the first optical module cage 210.
- the second optical module cage 220 shown in this embodiment is also provided with a second opening. For a specific description of the second opening, please refer to the first opening 211 for details, and will not be repeated.
- a first heat sink for dissipating heat for the first optical module is also provided between the PCB 201 and the upper housing 202 shown in this embodiment.
- the specific location of the first heat sink is not limited in this embodiment, as long as the first heat sink is The heat sink can dissipate the heat of the first optical module located in the first optical module cage 210.
- the first heat conducting member 213 is provided in the first opening 211 shown in this embodiment, and the first heat conducting member shown in this embodiment is 213 is made of a thermally conductive material, and the thermally conductive material can be a thermally conductive gel, a thermally conductive pad, a carbon fiber thermally conductive pad, a phase change thermally conductive material, a thermally conductive potting glue, a thermally conductive silicone grease, or a graphite temperature equalizing sheet, etc., which are not specifically limited.
- This embodiment does not limit the thermal conductivity of the thermally conductive material.
- the thermal conductivity is not less than 330 watts/meter ⁇ degree (W/m.K), and for example, the thermal conductivity is not less than 180 W/m.K.
- the first heat-conducting member 213 shown in this embodiment is attached to the first optical module, and the other end is connected to the first heat sink.
- the first heat-conducting member 213 may be directly connected to the first heat sink.
- the first heat-conducting member 213 can be indirectly connected to the first radiator through a flexible heat pipe, etc., which is not specifically limited in this embodiment, as long as the first heat-conducting member 213 can obtain heat from the first optical module and conduct the heat to The first radiator is enough.
- the heat dissipation assembly of the optical module shown in this embodiment further includes a second heat sink, which is used to dissipate heat from the second optical module.
- the second heat sink please refer to the first heat sink for details. The description of the module's heat dissipation will not be repeated.
- FIG. 4 is an example of a partial structure of the optical module heat dissipation assembly provided by this embodiment picture.
- an opening 204 is provided through the PCB 201, and the opening 204 extends in a direction perpendicular to the PCB 201 (the arrow direction shown in FIG. 4).
- the first optical module cage 210 shown in this embodiment is attached to the end face of the PCB 201 and is provided with a first heat dissipation end 214 made of a thermally conductive material.
- the bonding arrangement shown in the example may refer to welding the first heat dissipation end 214 to the end surface of the first optical module cage 210 facing the PCB 201. It can be seen that the first heat dissipation end 214 and the first heat dissipation end 214 in this case are The optical module cages 210 are in a fixed connection relationship.
- the bonding arrangement shown in this embodiment may also refer to that the first heat dissipation end 214 and the first optical module cage 210 are two independent components, and the first heat dissipation end 214 is under pressure. (For example, pressure from the first optical module cage 210), to realize the adhesion between the first optical module cages 210.
- the second optical module cage 220 shown in this embodiment is attached to the end surface of the PCB 201 and is provided with a second heat dissipation end 221.
- a second heat dissipation end 2221 please refer to the description of the bonding arrangement between the first heat dissipation end 214 and the first optical module cage 210 for details, and will not be repeated.
- the first heat dissipation end portion 214 extends along a direction perpendicular to the PCB 201, and the first heat dissipation end portion 214 is inserted into the window 204.
- the second heat dissipation end portion 221 extends in a direction perpendicular to the PCB 201, and the second heat dissipation end portion 221 is inserted into the window 204. Combining the first heat dissipation end portion 214 and the second heat dissipation end portion 221, it can be seen that in the window 204, the first heat dissipation end portion 214 and the second heat dissipation end portion 221 are positioned opposite to each other in a direction perpendicular to the PCB 201.
- the position alignment between the first heat dissipation end portion 214 and the second heat dissipation end portion 221 is effectively realized. It is avoided that the position between the first heat dissipation end portion 214 and the second heat dissipation end portion 221 is misaligned, which results in a situation where the first heat dissipation end portion 214 and the second heat dissipation end portion 221 cannot achieve intercommunication heat dissipation performance.
- the first optical module can not only dissipate heat through the first radiator, but also through the second optical module, and the second optical module can not only radiate heat through the second radiator, but also through the first optical module.
- the module performs heat dissipation, that is, based on the first heat dissipation end 214 and the second heat dissipation end 221 to realize the intercommunication and heat dissipation between the first optical module and the second optical module, the intercommunication between the first optical module and the second optical module will be performed as follows The process of heat dissipation is explained:
- the first optical module shown in this embodiment has two heat dissipation paths, namely a first heat dissipation path and a second heat dissipation path.
- the first heat dissipation path is: the first optical module conducts heat through the first heat conducting member 213 To the first radiator, the first radiator can dissipate the heat of the first optical module.
- the first optical module shown in this embodiment can also dissipate heat through the second heat dissipation path.
- the prerequisites for the second heat dissipation path are described below:
- the difference between the temperature of the first optical module and the temperature of the second optical module is relatively large, and the temperature of the first optical module is higher than the temperature of the second optical module.
- the heat dissipation of the first optical module will lead to the situation that the first optical module cannot be sufficiently dissipated and the heat dissipation margin of the second heat sink cannot be fully used.
- the first optical module shown in this embodiment can not only The heat is dissipated through the first heat dissipation path, and the heat may also be dissipated through the second heat dissipation path, thereby effectively ensuring sufficient heat dissipation of the first optical module, so as to improve the heat dissipation efficiency of the heat dissipation of the optical module.
- the second heat dissipation path is: the first optical module is used to sequentially pass through the first optical module cage 210, the first heat dissipation end 214, the second heat dissipation end 221, and the second optical module cage 220 and the second optical module, conduct the heat to be dissipated by the first optical module to the second radiator, and the second radiator can dissipate the heat from the first optical module.
- the first optical module when the temperature of the first optical module is higher than the temperature of the second optical module, the first optical module can dissipate heat from the first optical module through the first heat sink, and can also use the The first heat dissipation end portion 214 and the second heat dissipation end portion 221 located opposite to each other in the window 204 conduct heat to the second heat sink for heat dissipation.
- the first heat dissipation path and the second heat dissipation path are An optical module dissipates heat. Under the condition that the heat dissipation efficiency of the first optical module is effectively improved, the heat dissipation margin of the second heat sink can also be effectively used to dissipate the first optical module. In the case that there is a temperature difference between the temperature of one optical module and the temperature of the second optical module, balanced heat dissipation between the first optical module and the second optical module.
- the second optical module shown in this embodiment has two heat dissipation paths, namely a third heat dissipation path and a fourth heat dissipation path.
- the third heat dissipation path is: the second optical module conducts heat to The second heat sink, the second heat sink can dissipate the heat of the second optical module.
- the second heat-conducting member please refer to the description of the first heat-conducting member 213 shown above for details, and the details will not be repeated. .
- the second optical module shown in this embodiment can also perform heat dissipation through the fourth heat dissipation path.
- the prerequisites of the fourth heat dissipation path are described below:
- the difference between the temperature of the first optical module and the temperature of the second optical module is relatively large, and the temperature of the second optical module is higher than the temperature of the first optical module. Dissipating heat by the second optical module will result in a situation where the second optical module cannot be sufficiently dissipated and the heat dissipation margin of the first heat sink cannot be fully used.
- the second optical module shown in this embodiment can not only Heat dissipation is conducted through the third heat dissipation path, and heat dissipation may also be conducted through the fourth heat dissipation path, thereby effectively ensuring sufficient heat dissipation of the first optical module.
- the fourth heat dissipation path includes: the second optical module is used to sequentially pass through The second optical module cage 220, the second heat dissipation end portion 221, the first heat dissipation end portion 214, the first optical module cage 210, and the first optical module dissipate the second optical module The heat is conducted to the first radiator.
- the second optical module when the temperature of the second optical module is higher than the temperature of the first optical module, the second optical module can dissipate heat from the second optical module through the second heat sink, and can also use the The first heat dissipation end portion 214 and the second heat dissipation end portion 221 located opposite to each other in the window 204 conduct heat to the first heat sink for heat dissipation through the third heat dissipation path and the fourth heat dissipation path Heat dissipation of the second optical module, while effectively improving the heat dissipation efficiency of the second optical module, can also effectively use the heat dissipation margin of the first heat sink to dissipate heat from the second optical module, thereby realizing In the case where there is a temperature difference between the temperature of the first optical module and the temperature of the second optical module, balanced heat dissipation between the first optical module and the second optical module.
- the first heat dissipation end portion 214 and the second heat dissipation end portion 221 shown in this embodiment can also fully release the stress, effectively avoiding damage to the components included in the optical module heat dissipation assembly due to the effect of stress. And it can effectively improve the heat dissipation efficiency, as follows:
- the first heat dissipation end 214 includes a plurality of first heat dissipation teeth 215 arranged at intervals, and the plurality of first heat dissipation teeth 215 shown in this embodiment extend into the opening 204 and are arranged. It can be seen that the end of each first heat dissipating tooth 215 is opposite to the second heat dissipating end 221.
- the specific shape of the first heat dissipating tooth 215 is not limited in this embodiment.
- each first heat dissipating tooth 215 may be long. Bar, cylindrical, conical, etc.
- first gap 216 between any two adjacent first heat dissipation teeth 215.
- the shape and depth are not limited.
- the function of the first gap 216 is described below:
- the first heat dissipation end portion 214 is subject to stress: specifically, the first heat dissipation end portion 214 is made of a thermally conductive material with a certain degree of elasticity.
- the first optical module cage 210 exerts a force on the first heat dissipation end portion 214 toward the PCB 201, and this force causes the first heat dissipation end portion 214 to generate stress, and the direction of the stress is far away from the PCB 201 direction.
- the first optical module cage 210 includes pins 217.
- the pins 217 need to be inserted and damaged on the PCB 201, so as to realize the fixation of the first optical module cage 210 The purpose on PCB201.
- the pin 217 will receive a force away from the PCB 201, which is very easy to damage the pin 217, resulting in the pin 217 It is damaged, thereby reducing the stability of the structure between the first optical module cage 210 and the PCB 201.
- the function of the first heat dissipation teeth 215 is described: it can be seen that in order to avoid the possibility of damage to the first optical module cage 210, the stress generated by the first heat dissipation end 214 needs to be released as much as possible, so as The avoidance application is applied to the first optical module cage 210 to avoid damage to the devices included in the first optical module cage 210. For this reason, as shown in this embodiment, the first heat dissipation end 210 is provided with a plurality of first heat dissipation teeth 215 arranged at intervals toward the end surface of the PCB 201.
- the first A heat dissipating tooth 215 is stressed by the first optical module cage 210, and the first heat dissipating tooth 215 will deform in a direction parallel to the PCB 201 under the action of the stress.
- the two adjacent first heat dissipating teeth There is a first gap 216 between 215, so that the first heat dissipating teeth 215 can be freely deformed in the first gap 216, and the first heat dissipating teeth 215 that can be freely deformed in the first gap 216 will fully stress the Release.
- the second heat dissipation end portion 221 shown in this embodiment also includes a plurality of second heat dissipation teeth arranged at intervals.
- the second heat dissipation teeth please refer to the description of the first heat dissipation teeth 215, which will not be repeated.
- the contact area between the teeth and the first heat dissipation end 214 and the increase in the contact area between the second heat dissipation teeth and the second heat dissipation end are more conducive to the difference between the first heat dissipation end 214 and the second heat dissipation end 221 The heat conduction between them improves the heat dissipation efficiency.
- FIG. 7 is an example diagram of a side cross-sectional structure of an embodiment of the first optical module cage provided by this embodiment.
- the first optical module cage 210 is provided with a first elastic member 301 made of a thermally conductive material.
- the first elastic member 301 is located between the first optical module 302 and the first heat dissipation end 214 and passes The first elastic member 301 realizes a close fit between the first optical module and the first heat dissipation end 214, thereby effectively reducing the thermal resistance between the first optical module and the first heat dissipation end 214.
- this embodiment does not limit the specific shape of the first elastic member 301, as long as the first elastic member 301 has an elastic structure, for example, the first elastic member 301 may be a tongue or a spring.
- the first optical module 302 is not installed inside the first optical module cage 210 (as shown on the left side of FIG. 7), the first elastic member 301 is in a naturally extended state, and the first optical module 302 is installed in the first optical module.
- the module cage 210 is inside (as shown on the right side of FIG. 7)
- the first elastic member 301 is deformed by the pressure of the first optical module 302, so that the first elastic member 301 in a compressed state resists the first heat sink.
- the heat is conducted to the first heat dissipation end 214 through the first elastic member 301, because the conduction process is performed through the first elastic member 301 made of a thermally conductive material, thereby preventing the heat of the first optical module 302 from passing through
- the The first elastic member 301 includes a first fixed end 303 and a first elastic end 304 that are connected to each other.
- the first fixed end 303 is welded to the end surface of the first heat dissipation end 214 facing the first optical module 302 through The first fixed end 303 effectively ensures the stability of the structure between the first elastic member 301 and the first optical module cage 210, and prevents the first elastic member 301 from detaching from the first optical module cage 210.
- the first elastic end 304 extends between the first heat dissipation end portion 214 and the first optical module 302, and the first elastic end 304 can be freely deformed under the action of pressure, so that the first elastic end When the 304 is deformed, the purpose of being able to conduct the heat of the first optical module 302 to the first heat dissipation end 214.
- the second optical module cage 220 shown in this embodiment includes a second elastic member.
- the second elastic member please refer to the description of the first elastic member 301 shown above for details, and details are not repeated.
- the optical module heat dissipation assembly 200 further includes a thermally conductive middle piece 230 made of a thermally conductive material, and the thermally conductive middle piece 230 is located at the first heat dissipation end 214 and the second heat dissipation end 221 , And both surfaces of the thermally conductive middle piece 230 are attached to the first heat dissipation end portion 214 and the second heat dissipation end portion 221.
- This embodiment does not limit the specific shape of the heat-conducting middle piece 230, as long as one side of the heat-conducting middle piece 230 is attached to the first heat dissipation end 214, and the other side of the heat-conducting middle piece 230 is connected to the second heat dissipation end 214.
- the heat-dissipating end 221 can be attached to each other, so that the first heat-dissipating end 214 and the second heat-dissipating end 221 conduct heat conduction through the heat-conducting middle piece 230, which reduces the first heat-dissipating end 214 and the second heat-dissipating end 214.
- the thermal resistance during heat conduction between the two heat dissipation ends 221 prevents the heat conduction between the first heat dissipation end 214 and the second heat dissipation end 221 through high thermal resistance air, which improves the first heat dissipation end 214 and the second heat dissipation end 221.
- heat is conducted between the first optical module and the second optical module through the first heat dissipation end and the second heat dissipation end located in the PCB window, so that the temperature of the first optical module and the second
- heat can also be dissipated through the first heat dissipation end and the second heat dissipation end, so that the first and second optical modules can be sufficiently dissipated, and the light can be improved.
- the heat dissipation efficiency of the module's heat dissipation components, and the heat dissipation method that communicates between the first optical module and the second optical module improves the heat dissipation balance of the optical module's heat dissipation components, improves the reliability of the optical module, and extends the usage time.
- the difference between the temperature of the first optical module and the temperature of the second optical module is 5°C.
- the temperature of the first optical module can be lowered to T1
- the first optical module can be reduced
- the temperature of an optical module is reduced to T2, and T1 is higher than T2.
- the use of the optical module heat dissipation assembly shown in this embodiment can effectively improve the heat dissipation efficiency of the optical module, even if the single-point heat consumption of the optical module continues Enlarged, it can also effectively dissipate the heat of the optical module.
- first space 401 and a second space 402 parallel to each other between the first optical module cage 210 and the second optical module cage 220, and the first space 401 is used to set the PCB201, for the specific description of PCB201, please refer to the above-mentioned embodiment for details, and will not be repeated.
- the optical module heat dissipation assembly further includes a first intercommunication heat dissipation member 403 made of a thermally conductive material.
- the first intercommunication heat dissipation member 403 is located in the second space 402, that is, the first intercommunication heat dissipation member 403 is located in the second space 402.
- the first intercommunication heat dissipation member The second end of 403 is attached to the second optical module cage 220.
- the first optical module and the second optical module can also realize the heat dissipation performance of the intercommunication between the first optical module and the second optical module through the first intercommunication heat sink 403 shown in this manner, thereby further improving the heat dissipation efficiency.
- the first optical module can pass through the first optical module cage 210, the first intercommunication heat sink 403, and the second optical module in sequence.
- the optical module cage 220 and the second optical module conduct heat to the second heat sink.
- the second optical module can pass through the second optical module cage 220, the first intercommunication heat sink 403, and the first optical module in sequence.
- the cage 210 and the first optical module conduct heat to the first radiator.
- the first optical module cage 210 has a bottom shell 801 and a first shell 802.
- the first shell 802 is buckled and connected to the bottom shell 801, and the bottom shell 801 faces the bottom shell 801.
- the PCB 201 is arranged, and an accommodating space for accommodating the first optical module is formed between the first housing 802 and the bottom housing 801.
- the overall shape of the first optical module cage 210 formed by the bottom shell 801 and the first outer shell 802 formed by buckling with each other is not limited, as long as the first optical module cage can accommodate the first optical module. Module is fine.
- the second optical module cage 220 has a top shell 803 and a second shell.
- the second housing and the top housing 803 are buckled and connected to form an accommodating space for accommodating the second optical module between the second housing and the top housing 803, wherein the top housing 803 is arranged facing the PCB201.
- the optical module heat dissipation assembly shown in this embodiment further includes a second intercommunication heat dissipation member 800 made of a thermally conductive material.
- the first end of the second intercommunication heat dissipation member 800 is connected to the first housing 802, and the The second end of the second intercommunication heat sink 800 is connected to the second housing.
- the second intercommunicating heat sink 800 can be connected to the first housing 802 and the second housing at the same time, for example, the second intercommunicating heat sink 800 800 is a flexible heat pipe.
- the second intercommunication heat sink 800 shown in this embodiment can achieve the heat dissipation performance of the intercommunication between the first optical module and the second optical module, thereby further improving the heat dissipation efficiency.
- the first optical module can pass through the first optical module cage 210, the second intercommunication heat sink 800, the second optical module cage 220, and all the modules in sequence.
- the second optical module conducts heat to the second heat sink.
- the second optical module may pass through the second optical module cage 220, the second intercommunication heat sink 800, and the first optical module in sequence.
- the cage 210 and the first optical module conduct heat to the first radiator.
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Abstract
一种光模块散热组件(200)以及通信设备,用于提高位于电路板(201)两面对称设置的两个光模块的散热效率。光模块散热组件(200)包括位置相对的第一散热端部(214)和第二散热端部(221),第一散热端部(214)与第一光模块笼子(210)连接,第二散热端部(221)与第二光模块笼子(220)连接,第一散热端部(214)包括间隔设置的多个散热齿(215),第二散热端部(221)包括间隔设置的多个散热齿。第一光模块和第二光模块之间通过第一散热端部(214)和第二散热端部(221)进行热量传导,提高了光模块散热组件(200)的散热效率,有效避免了应力对光模块散热组件(200)的损坏,提高了使用寿命。
Description
本申请要求于2020年6月5日提交中国国家知识产权局、申请号为202010506635.4、申请名称为“一种光模块散热组件以及通信设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请涉及光通信领域,尤其涉及一种光模块散热组件以及通信设备。
在可靠性要求很高的通信设备中,光模块作为其中的关键器件之一,随着通信向高速率、大带宽、大流量的不断演进,光模块在数量、聚集度、单模块发热量上都在不断向高密、集群、高热量方向发展,由此带来的光模块散热问题变的越来越棘手。
在光模块数量很多,无法在印刷电路板(printed circuit board,PCB)单面完全放下的场景下,光模块会有在PCB正反两面对称设置,如果PCB正反两面对称设置的两个光模块之间较大温差时,温度较高一侧的光模块会成为整个通信设备散热的瓶颈,而另一侧光模块尚存在散热余量。
可见,现有技术所提供的对光模块进行散热的方案,针对在PCB两面对称设置的两个光模块的散热效率较低。
发明内容
本申请提供了一种光模块散热组件以及通信设备,其用于提高位于PCB两面对称设置的两个光模块的散热效率,而且有效地提高光模块散热组件的使用寿命。
第一方面,本申请提供了一种光模块散热组件,包括印刷电路板,以及位于印刷电路板两面的第一光模块笼子和第二光模块笼子,该第一光模块笼子用于容纳第一光模块,该第二光模块笼子用于容纳第二光模块,该光模块散热组件还包括位置相对的第一散热端部和第二散热端部,该第一散热端部与该第一光模块笼子贴合,该第二散热端部与该第二光模块笼子贴合,若该第一光模块的温度高于该第二光模块,该第一光模块用于将热量依次经由该第一散热端部和该第二散热端部向该第二光模块进行传导,若该第二光模块的温度高于该第一光模块,则该第二光模块用于将热量依次经由该第二散热端部和该第一散热端部向该第一光模块进行传导;该第一散热端部包括间隔设置的多个第一散热齿,相邻的两个该第一散热齿之间存在第一间隙,该第一散热齿用于在该第一散热端部的压力的作用下在该第一间隙内进行形变;该第二散热端部包括间隔设置的多个第二散热齿,相邻的两个该第二散热齿之间存在第二间隙,该第二散热齿用于在该第二散热端部的压力的作用下在该第二间隙内进行形变。
可见,第一光模块和第二光模块之间,通过第一散热端部和第二散热端部进行热量的传导,从而使得在第一光模块的温度和第二光模块的温度之间存在温差的情况下,还可通过第一散热端部和第二散热端部进行散热,从而能够对第一光模块和第二光模块进行充分的散热,提高了光模块散热组件的散热效率,而且通过第一光模块和第二光模块之间进行 互通的散热方式,提高了光模块散热组件散热的均衡性,提高了光模块的可靠性,延长了光模块的使用时间。而且第一散热端部的应力能够在第一间隙内充分释放,有效地避免了应力对第一光模块笼子进行损坏的可能,第二散热端部的应力能够在第二间隙内充分释放,有效地避免了应力对第二光模块笼子进行损坏的可能,有效地提高了第一光模块笼子和第二光模块笼子的安全,提高了第一光模块笼子和第二光模块笼子的使用寿命。而且采用多个第一散热齿及多个第二散热齿,有效地避免了第一散热端部和第二散热端部之间通过热阻比较高的空气进行导热,有效地降低了第一散热端部和第二散热端部之间的热阻,而且在第一散热齿和第二散热齿在形变的过程中,会增大第一散热齿与第一散热端部的接触面积,以及增大第二散热齿与第二散热端部的接触面积,更有利于所述第一散热端部和所述第二散热端部之间热量的传导,提高了散热效率。
结合第一方面,一种可选地实现方式中,所述第一散热端部和所述第二散热端部均由导热材料制成,所述第一光模块笼子朝向所述印刷电路板的端面与所述第一散热端部贴合,所述第二光模块笼子朝向所述印刷电路板的端面与所述第二散热端部贴合;所述印刷电路板包括开窗,所述开窗沿垂直于所述印刷电路板的方向贯穿所述印刷电路板设置,所述第一散热端部以及所述第二散热端部均插设于所述开窗内设置,且所述第一散热端部和所述第二散热端部沿垂直于所述印刷电路板的方向位置相对。
可见,第一散热端部和第二散热端部均插设于印刷电路板的开窗内,从而有效地实现了第一散热端部和第二散热端部之间的位置的对准,避免了第一散热端部和第二散热端部之间位置出现相错开,从而导致第一散热端部和第二散热端部之间无法实现互通的散热性能的情况。
结合第一方面,一种可选地实现方式中,所述第一光模块笼子内设置由导热材料制成的第一弹性件,所述第一弹性件位于所述第一光模块和所述第一散热端部之间,且呈压缩状态的所述第一弹性件同时与所述第一光模块和所述第一散热端部贴合;所述第二光模块笼子内设置由导热材料制成的第二弹性件,所述第二弹性件位于所述第二光模块和所述第二散热端部之间,且呈压缩状态的所述第二弹性件同时与所述第二光模块和所述第二散热端部贴合。
可见,第一弹性件分别与所述第一散热端部和所述第一光模块紧密贴合,所述第一光模块即可通过第一弹性件将热量传导至第一散热端部上,因传导过程是通过由导热材料制成的第一弹性件进行的,从而避免了第一光模块的热量通过具有高热阻的空气向第一散热端部进行传导的弊端,进而有效地降低了第一光模块将热量向第一散热端部进行传导的过程中的热阻。对采用第二弹性件的有益效果的说明,请详见对第一弹性件的说明,不做赘述。
结合第一方面,一种可选地实现方式中,所述第一弹性件包括相互连接的第一固定端和第一弹性端,所述第一固定端固定连接于所述第一散热端部朝向所述第一光模块的端面,所述第一弹性端延伸于所述第一散热端部和所述第一光模块之间;所述第二弹性件包括相互连接的第二固定端和第二弹性端,所述第二固定端固定连接于所述第二散热端部朝向所述第二光模块的端面,所述第二弹性端延伸于所述第二散热端部和所述第二光模块之间。
可见,所述第一固定端固定连接于所述第一散热端部朝向所述第一光模块的端面,通过该第一固定端有效地保证了第一弹性件和所述第一光模块笼子之间结构的稳固,避免第一弹性件从第一光模块笼子中脱离的情况的出现,所述第一弹性端延伸于所述第一散热端部和所述第一光模块之间,且第一弹性端可在压力的作用下自由形变,以使在第一弹性端出现形变时,能够将第一光模块的热量向第一散热端部进行传导的目的,且传导过程中具有低热阻。对采用第二弹性件的有益效果的说明,请详见对第一弹性件的说明,不做赘述。
结合第一方面,一种可选地实现方式中,所述光模块散热组件还包括由导热材料制成的导热中间件,所述导热中间件位于所述第一散热端部和所述第二散热端部之间,且所述导热中间件的两面均与所述第一散热端部和所述第二散热端部贴合。
可见,所述第一散热端部和所述第二散热端部之间通过导热中间件进行热量的传导,降低了第一散热端部和所述第二散热端部之间进行热量传导时的热阻,避免第一散热端部和第二散热端部之间通过高热阻的空气进行热量的传导,提高了第一散热端部和第二散热端部之间进行热量传导的效率。
结合第一方面,一种可选地实现方式中,所述第一光模块笼子连接第一散热器,所述第二光模块笼子连接第二散热器,所述第一光模块用于通过第一散热路径和第二散热路径进行散热,所述第一散热路径为所述第一光模块通过所述第一散热器进行散热;若所述第一光模块的温度高于所述第二光模块,则所述第二散热路径为所述第一光模块用于依次经由所述第一光模块笼子、所述第一散热端部、所述第二散热端部、所述第二光模块笼子、所述第二光模块以及所述第二散热器进行散热。
可见,通过所述第一散热路径以及第二散热路径对第一光模块进行散热,在有效地提高了对第一光模块进行散热的散热效率的情况下,还能够有效地利用第二散热器的散热余量对第一光模块进行散热,实现了在第一光模块的温度和第二光模块的温度之间存在温差的情况下,第一光模块和第二光模块之间的均衡散热。
结合第一方面,一种可选地实现方式中,所述第一光模块笼子连接第一散热器,所述第二光模块笼子连接第二散热器,所述第二光模块用于通过第三散热路径和第四散热路径,所述第三散热路径为所述第二光模块通过所述第二散热器进行散热;若所述第二光模块的温度高于所述第一光模块,则所述第四散热路径为所述第二光模块用于依次经由所述第二光模块笼子、所述第二散热端部、所述第一散热端部、所述第一光模块笼子、所述第一光模块以及所述第一散热器进行散热。
可见,通过所述第三散热路径以及第四散热路径对第二光模块进行散热,在有效地提高了对第二光模块进行散热的散热效率的情况下,还能够有效地利用第一散热器的散热余量对第二光模块进行散热,实现了在第一光模块的温度和第二光模块的温度之间存在温差的情况下,第一光模块和第二光模块之间的均衡散热。
结合第一方面,一种可选地实现方式中,所述第一光模块笼子和所述第二光模块笼子之间存在第一空间和第二空间,所述第一空间用于设置所述印刷电路板;所述光模块散热组件还包括由导热材料制成的第一互通散热件,所述第一互通散热件位于所述第二空间内,所述第一互通散热件的第一端与所述第一光模块笼子贴合,所述第一互通散热件的第二端 与所述第二光模块笼子贴合。
可见,第一光模块和第二光模块还能够通过第一互通散热件实现第一光模块和第二光模块之间互通的散热性能,从而进一步地提高散热效率。
结合第一方面,一种可选地实现方式中,所述第一光模块笼子具有底壳和第一外壳,所述第一外壳与所述底壳扣合连接,以在所述第一外壳和所述底壳之间形成用于容纳所述第一光模块的容纳空间,所述底壳朝向所述印刷电路板设置,所述第二光模块笼子具有顶壳和第二外壳,所述第二外壳与所述顶壳扣合连接,以在所述第二外壳和所述顶壳之间形成用于容纳所述第二光模块的容纳空间,所述顶壳朝向所述印刷电路板设置;所述光模块散热组件还包括由导热材料制成的第二互通散热件,所述第二互通散热件的第一端与所述第一外壳贴合,所述第二互通散热件的第二端与所述第二外壳贴合。
可见,第一光模块和第二光模块还能够通过第二互通散热件实现第一光模块和第二光模块之间互通的散热性能,从而进一步地提高散热效率。
第二方面,本申请提供了一种通信设备,包括机柜,所述机柜内包括至少一个如上述第一方面任一项所述的光模块散热组件。
图1为现有技术所提供的通信设备的侧面结构示例图;
图2为本申请所提供的光模块散热组件的一种实施例侧视剖面结构示例图;
图3为本申请所提供的第一光模块笼子的一种整体结构示例图;
图4为本申请所提供的光模块散热组件的一种局部结构示例图;
图5为本申请所提供的第一光模块笼子的另一种整体结构示例图;
图6为本申请所提供的第一光模块笼子的底面结构示例图;
图7为本申请所提供的第一光模块笼子的侧视剖面结构示例图;
图8为本申请所提供的光模块散热组件的另一种实施例侧视剖面结构示例图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的部件在适当情况下可以互换,以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含。
本申请提供了一种光模块散热组件,该光模块散热组件用于对光模块进行散热,为更好的理解,以下结合图1所示对光模块散热组件所应用的通信设备的结构进行示例性说明,其中,图1为现有技术所提供的通信设备的侧面结构示例图。
为适应通信设备在向高速率、大带宽、大流量的不断演进,则需要通信设备尽可能多的集成更多的光模块,其中,光模块是一种将光信号转换成电信号和/或将电信号转换成光信号的一种集成模块,在光通信过程中起着重要作用。光模块在工作时会产生大量的热量,光模块中用于产生或接收光信号的激光器对温度要求相对严格,为了保证光通信的正常进行,需要将光模块产生的热量及时散发。
如图1所示,通信设备包括PCB100,通信设备为集成更多的光模块,则通信设备可在PCB100的两个侧面,对称设置两个光模块,即PCB100的第一侧面设置第一光模块笼子101,PCB100的第二侧面设置第二光模块笼子102,从而使得第一光模块笼子101和第二光模块笼子102以PCB100为中心进行对称。
具体地,第一光模块笼子101用于容纳第一光模块,第一光模块笼子101通过柔性热管103与第一散热器104连接,从而使得第一光模块依次经由第一光模块笼子101以及柔性热管103将热量传导至第一散热器104,所述第一散热器104即可对已获取的热量进行散热。第二光模块笼子102用于容纳第二光模块,第二光模块笼子102通过柔性热管105与第二散热器106连接,从而使得第二光模块依次经由第二光模块笼子102以及柔性热管105将热量传导至第二散热器106,所述第二散热器106即可对已获取的热量进行散热。
图1所示仅以对称设置于PCB100两面的两个光模块进行说明,对通信设备所包括的其他光模块的设置方式不做赘述。可见,图1所示的通信设备,通过对称设置于PCB100两面的光模块,能够有效地提高通信设备所设置的光模块的数量,从而实现PCB100上的光模块的高密度布局,提高了通信设备的业务量。
但是,对称设置于PCB100两面的光模块的散热路径彼此隔离,如图1所示的第一光模块仅通过将热量传导至第一散热器104的方式进行散热,第二光模块仅通过将热量传导至第二散热器106的方式进行散热,从而导致位于PCB两面的光模块的散热的不均衡,具体说明如下示例所示:
例如,在第一光模块的温度和第二光模块的温度之间的差距比较大的场景下,例如,第一光模块的温度较高,而第二光模块的温度较低,则弊端在于:首先,第一光模块所需要散发的热量超过了第一散热器104的散热能力,则会造成第一散热器104无法充分对第一光模块进行散热,降低了第一光模块的可靠性。其次,第二光模块所需要散热的热量低于第二散热器106的散热能力,则会导致第二散热器106还会有散热余量没有利用,降低了第二散热器106的散热效率。
为解决图1所示的已有通信设备在散热性能上的弊端,则本申请提供了一种光模块散热组件,其用于提高对称设置于PCB两面的光模块的散热效率,从而提高已集成多个光模块的通信设备的散热能力,以下首先结合图2所示对本实施例所提供的光模块散热组件的结构进行说明,其中,图2为本申请所提供的光模块散热组件的一种实施例侧视剖面结构示例图。
本实施例所示的光模块散热组件200包括光模块散热组件外壳,例如,图2所示的光模块散热组件外壳具体包括上壳体202和下壳体203,上壳体202和下壳体203之间所形成的容纳空间用于容纳PCB201。
位于PCB201两面设置第一光模块笼子210和第二光模块笼子220,且第一光模块笼子210位于上壳体202和PCB201之间,第二光模块笼子220位于下壳体203和PCB201之间。所述第一光模块笼子210用于容纳第一光模块,所述第二光模块笼子220用于容纳第二光模块。
以下结合图2和图3所示对第一光模块笼子210的结构进行示例性说明,其中,图3为本实施例所提供的第一光模块笼子的一种整体结构示例图。
所述第一光模块笼子210背离PCB201的侧面开设有第一开口211,可见,该第一开口211与上壳体202位置相对,在对第一光模块进行安装时,可经由该第一开口211将第一光模块放置于第一光模块笼子210内部。需明确的是,本实施例所示以第一光模块笼子210的顶面开设第一开口211为例进行示例性说明,不做限定,在其他场景中,可在所述第一光模块笼子210的侧壁或底面开设第一开口等,只要通过该第一开口能够降低第一光模块笼子210的热阻即可。本实施例所示的第二光模块笼子220也设置第二开口,对第二开口的具体说明,请详见第一开口211所示,不做赘述。
本实施例所示的PCB201和上壳体202之间还设置用于对第一光模块进行散热的第一散热器,本实施例对第一散热器的具***置不做限定,只要该第一散热器能够对位于第一光模块笼子210内的第一光模块进行散热即可。
以下对第一散热器具体是如何对第一光模块进行散热的进行示例性说明,本实施例所示的第一开口211内设置第一导热件213,本实施例所示的第一导热件213由导热材质制成,所述导热材料可为导热凝胶、导热垫、碳纤维导热垫、相变导热材料、导热灌封胶、导热硅脂、或石墨均温片等,具体不做限定。本实施例对导热材料的导热系数不做限定,例如,导热系数不小于330瓦/米·度(W/m.K),又如,导热系数不小于180W/m.K等。
本实施例所示的第一导热件213的一端与第一光模块贴合,另一端与第一散热器连接,可选地,第一导热件213可与第一散热器直接连接,又如,第一导热件213可通过柔性热管等与第一散热器间接连接,具体在本实施例中不做限定,只要第一导热件213能够从第一光模块获取热量,并将该热量传导至第一散热器即可。本实施例所示的光模块散热组件还包括第二散热器,第二散热器用于对第二光模块进行散热,对第二散热器的具体说明,请详见第一散热器对第一光模块进行散热的说明,具体不做赘述。
本实施例中,为提高对称设置于PCB201两面的光模块的散热效率,则结合图2和图4所示,其中,图4为本实施例所提供的光模块散热组件的一种局部结构示例图。本实施例所示贯穿PCB201设置开窗204,且所述开窗204沿垂直于PCB201的方向(如图4所示的箭头方向)延伸设置。
结合图2、图5和图6所示,本实施例所示的第一光模块笼子210朝向PCB201的端面贴合设置由导热材料制成的第一散热端部214,可选地,本实施例所示的贴合设置可指,将第一散热端部214焊接于所述第一光模块笼子210朝向所述PCB201的端面,可见,此种情况下的第一散热端部214和第一光模块笼子210之间为固定连接的关系。还可选地,本实施例所示的贴合设置还可指,第一散热端部214和第一光模块笼子210为独立的两个部件,所述第一散热端部214在压力作用下(例如,来自所述第一光模块笼子210的压力), 实现所述第一光模块笼子210之间的贴合。
本实施例所示的第二光模块笼子220朝向PCB201的端面贴合设置第二散热端部221,对所述第二光模块笼子220与所述第二散热端部221之间贴合设备的说明,请详见第一散热端部214和第一光模块笼子210之间贴合设置的说明,不做赘述。
所述第一散热端部214沿垂直于PCB201的方向延伸,且第一散热端部214插设于开窗204内。第二散热端部221沿垂直于PCB201的方向延伸,且第二散热端部221插设于开窗204内。结合第一散热端部214和第二散热端部221所示可知,在开窗204内,第一散热端部214和第二散热端部221沿垂直于PCB201的方向位置相对。
在第一散热端部214和第二散热端部221插设于开窗204内的情况下,有效地实现了第一散热端部214和第二散热端部221之间的位置的对准,避免了第一散热端部214和第二散热端部221之间位置出现相错开,从而导致第一散热端部214和第二散热端部221之间无法实现互通的散热性能的情况。
本实施例中,第一光模块不仅可以通过第一散热器进行散热,还可通过第二光模块进行散热,且第二光模块不仅可以通过第二散热器进行散热,还可通过第一光模块进行散热,即基于第一散热端部214和第二散热端部221实现第一光模块和第二光模块之间的互通散热,以下对第一光模块和第二光模块之间进行互通散热的过程进行说明:
首先,对第一光模块的散热路径进行说明:
本实施例所示的第一光模块具有两个散热路径,即第一散热路径和第二散热路径,其中,第一散热路径为:所述第一光模块通过第一导热件213将热量传导至第一散热器,所述第一散热器即可对第一光模块进行散热。
本实施例所示的第一光模块还可通过第二散热路径进行散热,以下对第二散热路径的前提条件进行说明:
前提条件:第一光模块的温度和第二光模块的温度之间的差值比较大,且第一光模块的温度高于第二光模块的温度,若此时仅通过第一散热路径对第一光模块进行散热,则会导致无法对第一光模块进行充分散热的情况以及导致无法充分使用第二散热器的散热余量的情况,而本实施例所示的第一光模块不仅可以通过第一散热路径进行散热,还可通过第二散热路径进行散热,从而有效地保证了对第一光模块的充分散热,以提高对以光模块进行散热的散热效率。
其中,第二散热路径为:所述第一光模块用于依次经由所述第一光模块笼子210、所述第一散热端部214、所述第二散热端部221、第二光模块笼子220以及第二光模块,将第一光模块所要散发的热量传导至第二散热器,所述第二散热器即可对来自第一光模块的热量进行散热。
可见,本实施例中,在第一光模块的温度高于第二光模块的温度的情况下,第一光模块即可通过第一散热器对第一光模块进行散热,还能够经由在开窗204内位置相对的所述第一散热端部214以及所述第二散热端部221,将热量传导至第二散热器以进行散热,通过所述第一散热路径以及第二散热路径对第一光模块进行散热,在有效地提高了对第一光模块进行散热的散热效率的情况下,还能够有效地利用第二散热器的散热余量对第一光模 块进行散热,实现了在第一光模块的温度和第二光模块的温度之间存在温差的情况下,第一光模块和第二光模块之间的均衡散热。
其次,对第二光模块的散热路径进行说明:
本实施例所示的第二光模块具有两个散热路径,即第三散热路径和第四散热路径,其中,第三散热路径为:所述第二光模块通过第二导热件将热量传导至第二散热器,所述第二散热器即可对第二光模块进行散热,对第二导热件的具体说明,请详见上述所示的对第一导热件213的说明,具体不做赘述。
本实施例所示的第二光模块还可通过第四散热路径进行散热,以下对第四散热路径的前提条件进行说明:
前提条件:第一光模块的温度和第二光模块的温度之间的差值比较大,且第二光模块的温度高于第一光模块的温度,此时若仅通过第三散热路径对第二光模块进行散热,则会导致无法对第二光模块进行充分散热的情况以及导致无法充分使用第一散热器的散热余量的情况,而本实施例所示的第二光模块不仅可以通过第三散热路径进行散热,还可通过第四散热路径进行散热,从而有效地保证了对第一光模块的充分散热,其中,第四散热路径有:所述第二光模块用于依次经由所述第二光模块笼子220、所述第二散热端部221、所述第一散热端部214、所述第一光模块笼子210以及所述第一光模块,将第二光模块所要散发的热量传导至第一散热器。
可见,本实施例中,在第二光模块的温度高于第一光模块的温度的情况下,第二光模块即可通过第二散热器对第二光模块进行散热,还能够经由在开窗204内位置相对的所述第一散热端部214以及所述第二散热端部221,将热量传导至第一散热器以进行散热,通过所述第三散热路径以及所述第四散热路径对第二光模块进行散热,在有效地提高了对第二光模块进行散热的散热效率的情况下,还能够有效地利用第一散热器的散热余量对第二光模块进行散热,实现了在第一光模块的温度和第二光模块的温度之间存在温差的情况下,第一光模块和第二光模块之间的均衡散热。
本实施例所示的所述第一散热端部214和所述第二散热端部221还能够充分的对应力进行释放,有效地避免应力的作用导致光模块散热组件所包括的器件的损坏,并且还能够有效地提高散热效率,以下进行具体说明:
结合图2以及图5所示,第一散热端部214包括间隔设置的多个第一散热齿215,本实施例所示的多个第一散热齿215延伸至所述开窗204内设置,可见,各第一散热齿215的端部与所述第二散热端部221位置相对,本实施例对第一散热齿215的具体形状不做限定,例如,各第一散热齿215可呈长条形、圆柱形、锥形等。
具体地,所述第一散热端部214所包括的多个第一散热齿215中,任意相邻的两个第一散热齿215之间存在第一间隙216,本实施例对第一间隙216的形状和深度均不做限定。以下对所述第一间隙216的作用进行说明:
首先,所述第一散热端部214会受到应力的作用:具体地,第一散热端部214由具有一定弹性的导热材质制成,在将第一光模块笼子210安装至PCB201上的情况下,所述第一光模块笼子210会对第一散热端部214施加朝向PCB201方向的作用力,该作用力导致第一 散热端部214会产生应力,该应力的作用方向为远离所述PCB201的方向。
其次,对应力的弊端进行说明:具体地,该远离所述PCB201方向的应力作用在第一光模块笼子210上,会提高损坏第一光模块笼子210的可能性,例如,如图5所示,第一光模块笼子210包括插针217,在需要将第一光模块笼子210安装于PCB201上时,需要将所述插针217插损在PCB201上,从而实现将第一光模块笼子210固定在PCB201上的目的。但是,在第一光模块笼子210受到来自第一散热端部214的应力的作用下,插针217会受到远离PCB201方向的作用力,该作用力极容易损坏插针217,从而导致插针217被损坏,进而降低了第一光模块笼子210与PCB201之间结构的稳固。
再次,对第一散热齿215的作用进行说明:可见,为避免第一光模块笼子210损坏的可能性,则需要将第一散热端部214所产生的应力尽可能的释放掉,从而尽可能的避免应用作用在第一光模块笼子210上,以避免对第一光模块笼子210所包括的器件的损坏。为此,本实施例所示将第一散热端部210朝向PCB201的端面设置多个间隔设置的多个第一散热齿215,在将第一光模块笼子210安装在PCB201上的情况下,第一散热齿215受到第一光模块笼子210的作用产生应力,第一散热齿215在该应力的作用下会沿平行于所述PCB201的方向进行形变,但是因相邻的两个第一散热齿215之间存在第一间隙216,以使第一散热齿215会在第一间隙216内进行自由的形变,能够在第一间隙216内进行自由形变的第一散热齿215会将应力进行充分的释放,在各个第一散热齿215的应力均通过第一间隙216进行释放后,则第一散热端部214的应力不会或者极少作用在第一光模块笼子210上,从而有效地避免了第一光模块笼子210的损坏。
本实施例所示的所述第二散热端部221也包括间隔设置的多个第二散热齿,对第二散热齿的说明,请参见第一散热齿215的说明,不做赘述。
可见,采用本实施例所示的多个第一散热齿215以及多个第二散热齿,有效地避免了第一散热端部214和第二散热端部221之间通过热阻比较高的空气进行导热,有效地降低了第一散热端部214和第二散热端部221之间的热阻,而且在第一散热齿215和第二散热齿在形变的过程中,会增大第一散热齿与第一散热端部214的接触面积,以及增大第二散热齿与第二散热端部的接触面积,更有利于所述第一散热端部214和所述第二散热端部221之间热量的传导,提高了散热效率。
为提高对光模块散热组件的散热效率,则需要降低光模块散热组件的热阻,以下对本实施例所示的降低光模块散热组件的热阻的几种可选地方式进行说明:
方式1
如图2、图3以及图7所示,其中,图7为本实施例所提供的第一光模块笼子的一种实施例侧视剖面结构示例图。所述第一光模块笼子210内设置由导热材料制成的第一弹性件301,所述第一弹性件301位于所述第一光模块302和所述第一散热端部214之间,通过第一弹性件301实现第一光模块和第一散热端部214之间的紧密贴合,从而有效地降低第一光模块和第一散热端部214之间的热阻。
具体地,本实施例对第一弹性件301的具体形状不做限定,只要所述第一弹性件301呈弹性结构即可,例如,第一弹性件301可为舌簧片或弹簧等。在第一光模块302未安装 在第一光模块笼子210内部时(如图7左侧所示),第一弹性件301呈自然伸长状态,在将第一光模块302安装于第一光模块笼子210内部时(如图7右侧所示),第一弹性件301受到第一光模块302的压力而形变,从而使得呈压缩状态的第一弹性件301抵持在所述第一散热端部214和所述第一光模块302之间,以使第一弹性件301分别与所述第一散热端部214和所述第一光模块302紧密贴合,所述第一光模块302即可通过第一弹性件301将热量传导至第一散热端部214上,因传导过程是通过由导热材料制成的第一弹性件301进行的,从而避免了第一光模块302的热量通过具有高热阻的空气向第一散热端部214进行传导的弊端,进而有效地降低了第一光模块302将热量向第一散热端部214进行传导的过程中的热阻。
本实施例对第一弹性件301设置方式不做限定,只要该第一弹性件301位于第一光模块302和第一散热端部214之间即可,例如,如图7所示,所述第一弹性件301包括相互连接的第一固定端303和第一弹性端304,所述第一固定端303焊接于所述第一散热端部214朝向所述第一光模块302的端面,通过该第一固定端303有效地保证了第一弹性件301和所述第一光模块笼子210之间结构的稳固,避免第一弹性件301从第一光模块笼子210中脱离的情况的出现,所述第一弹性端304延伸于所述第一散热端部214和所述第一光模块302之间,且第一弹性端304可在压力的作用下自由形变,以使在第一弹性端304出现形变时,能够将第一光模块302的热量向第一散热端部214进行传导的目的。
本实施例所示的第二光模块笼子220包括第二弹性件,对第二弹性件的说明,请详见上述所示的对第一弹性件301的说明,具体不做赘述。
方式2
如图2所示,所述光模块散热组件200还包括由导热材料制成的导热中间件230,所述导热中间件230位于所述第一散热端部214和所述第二散热端部221之间,且所述导热中间件230的两面均与所述第一散热端部214和所述第二散热端部221贴合。
本实施例对导热中间件230的具体形状不做限定,只要所述导热中间件230的一侧与第一散热端部214贴合,所述导热中间件230的另一侧与所述第二散热端部221贴合即可,从而使得第一散热端部214和所述第二散热端部221之间通过导热中间件230进行热量的传导,降低了第一散热端部214和所述第二散热端部221之间进行热量传导时的热阻,避免第一散热端部214和第二散热端部221之间通过高热阻的空气进行热量的传导,提高了第一散热端部214和第二散热端部221之间进行热量传导的效率。
上述实施例以第一光模块和第二光模块之间,通过位于PCB开窗内的第一散热端部和第二散热端部进行热量的传导,从而使得在第一光模块的温度和第二光模块的温度之间存在温差的情况下,还可通过第一散热端部和第二散热端部进行散热,从而能够对第一光模块和第二光模块进行充分的散热,提高了光模块散热组件的散热效率,而且通过第一光模块和第二光模块之间进行互通的散热方式,提高了光模块散热组件散热的均衡性,提高了光模块的可靠性,延长了光模块的使用时间。
例如,以第一光模块和第二光模块的电功率均为3瓦特(w)为例,且以第一光模块的温度和第二光模块的温度之间相差5℃为例,在采用图1所示的已有方案的情况下,以第 一光模块为例,可将第一光模块的温度降低到T1,而采用本实施例所示的光模块散热组件的情况下,能够将第一光模块的温度降低到T2,且T1高于T2,可见,采用本实施例所示的光模块散热组件能够有效地提高对光模块进行散热的散热效率,即使光模块单点热耗的不断增大,还能够有效地对光模块进行散热。
为提高光模块散热组件对光模块进行散热的散热效率,以下对光模块散热组件所包括的几种可选地散热方式进行说明,
方式1
如图4所示,所述第一光模块笼子210和所述第二光模块笼子220之间存在位置并列的第一空间401和第二空间402,所述第一空间401用于设置所述PCB201,对PCB201的具体说明,请详见上述实施例所示,不做赘述。
所述光模块散热组件还包括由导热材料制成的第一互通散热件403,所述第一互通散热件403位于所述第二空间402内,即所述第一互通散热件403位于所述第一光模块笼子210和所述第二光模块笼子220之间,且所述第一互通散热件403的第一端与所述第一光模块笼子210贴合,所述第一互通散热件403的第二端与所述第二光模块笼子220贴合。
可见,第一光模块和第二光模块还能够通过本方式所示的第一互通散热件403实现第一光模块和第二光模块之间互通的散热性能,从而进一步地提高散热效率,具体地,在第一光模块的温度高于第二光模块的温度的情况下,所述第一光模块可依次通过第一光模块笼子210、所述第一互通散热件403、所述第二光模块笼子220以及所述第二光模块,将热量向第二散热器进行传导。在第二光模块的温度高于第一光模块的温度的情况下,所述第二光模块可依次通过第二光模块笼子220、所述第一互通散热件403、所述第一光模块笼子210以及所述第一光模块,将热量向第一散热器进行传导。
方式2
结合图5和图8所示,所述第一光模块笼子210具有底壳801和第一外壳802,所述第一外壳802与所述底壳801扣合连接,所述底壳801朝向所述PCB201设置,在所述第一外壳802和所述底壳801之间形成用于容纳所述第一光模块的容纳空间。本实施例对通过相互扣合以形成的所述底壳801和第一外壳802以形成的第一光模块笼子210的整体形状不做限定,只要所述第一光模块笼子能够容纳第一光模块即可。
所述第二光模块笼子220具有顶壳803和第二外壳,对所述第二外壳的说明,请参见对第一外壳802的说明,具体不做赘述。所述第二外壳与所述顶壳803扣合连接,以在所述第二外壳和所述顶壳803之间形成用于容纳所述第二光模块的容纳空间,其中,所述顶壳803朝向所述PCB201设置。
本实施例所示的所述光模块散热组件还包括由导热材料制成的第二互通散热件800,所述第二互通散热件800的第一端与所述第一外壳802连接,所述第二互通散热件800的第二端与所述第二外壳连接。
本实施例对所述第二互通散热件800的具体形状不做限定,所述第二互通散热件800同时与第一外壳802和第二外壳连接即可,例如,所述第二互通散热件800为柔性热管,采用本实施例所示的第二互通散热件800能够实现第一光模块和第二光模块之间互通的散 热性能,从而进一步地提高散热效率,具体地,在第一光模块的温度高于第二光模块的温度的情况下,所述第一光模块可依次通过第一光模块笼子210、所述第二互通散热件800、所述第二光模块笼子220以及所述第二光模块,将热量向第二散热器进行传导。在第二光模块的温度高于第一光模块的温度的情况下,所述第二光模块可依次通过第二光模块笼子220、所述第二互通散热件800、所述第一光模块笼子210以及所述第一光模块,将热量向第一散热器进行传导。
以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
Claims (10)
- 一种光模块散热组件,其特征在于,包括印刷电路板,以及位于所述印刷电路板两面的第一光模块笼子和第二光模块笼子,所述第一光模块笼子用于容纳第一光模块,所述第二光模块笼子用于容纳第二光模块,所述光模块散热组件还包括位置相对的第一散热端部和第二散热端部,所述第一散热端部与所述第一光模块笼子贴合,所述第二散热端部与所述第二光模块笼子贴合,若所述第一光模块的温度高于所述第二光模块,所述第一光模块用于将热量依次经由所述第一散热端部和所述第二散热端部向所述第二光模块进行传导,若所述第二光模块的温度高于所述第一光模块,则所述第二光模块用于将热量依次经由所述第二散热端部和所述第一散热端部向所述第一光模块进行传导;所述第一散热端部包括间隔设置的多个第一散热齿,相邻的两个所述第一散热齿之间存在第一间隙,所述第一散热齿用于在所述第一散热端部的压力的作用下在所述第一间隙内进行形变;所述第二散热端部包括间隔设置的多个第二散热齿,相邻的两个所述第二散热齿之间存在第二间隙,所述第二散热齿用于在所述第二散热端部的压力的作用下在所述第二间隙内进行形变。
- 根据权利要求1所述的光模块散热组件,其特征在于,所述第一散热端部和所述第二散热端部均由导热材料制成,所述第一光模块笼子朝向所述印刷电路板的端面与所述第一散热端部贴合,所述第二光模块笼子朝向所述印刷电路板的端面与所述第二散热端部贴合;所述印刷电路板包括开窗,所述开窗沿垂直于所述印刷电路板的方向贯穿所述印刷电路板设置,所述第一散热端部以及所述第二散热端部均插设于所述开窗内设置,且所述第一散热端部和所述第二散热端部沿垂直于所述印刷电路板的方向位置相对。
- 根据权利要求1或2所述的光模块散热组件,其特征在于,所述第一光模块笼子内设置由导热材料制成的第一弹性件,所述第一弹性件位于所述第一光模块和所述第一散热端部之间,且呈压缩状态的所述第一弹性件同时与所述第一光模块和所述第一散热端部贴合;所述第二光模块笼子内设置由导热材料制成的第二弹性件,所述第二弹性件位于所述第二光模块和所述第二散热端部之间,且呈压缩状态的所述第二弹性件同时与所述第二光模块和所述第二散热端部贴合。
- 根据权利要求3所述的光模块散热组件,其特征在于,所述第一弹性件包括相互连接的第一固定端和第一弹性端,所述第一固定端固定连接于所述第一散热端部朝向所述第一光模块的端面,所述第一弹性端延伸于所述第一散热端部和所述第一光模块之间;所述第二弹性件包括相互连接的第二固定端和第二弹性端,所述第二固定端固定连接于所述第二散热端部朝向所述第二光模块的端面,所述第二弹性端延伸于所述第二散热端部和所述第二光模块之间。
- 根据权利要求1至4任一项所述的光模块散热组件,其特征在于,所述光模块散热组件还包括由导热材料制成的导热中间件,所述导热中间件位于所述第一散热端部和所述第二散热端部之间,且所述导热中间件的两面均与所述第一散热端部和所述第二散热端部贴合。
- 根据权利要求1至5任一项所述的光模块散热组件,其特征在于,所述第一光模块笼子连接第一散热器,所述第二光模块笼子连接第二散热器,所述第一光模块用于通过第一散热路径和第二散热路径进行散热,所述第一散热路径为所述第一光模块通过所述第一散热器进行散热;若所述第一光模块的温度高于所述第二光模块,则所述第二散热路径为所述第一光模块用于依次经由所述第一光模块笼子、所述第一散热端部、所述第二散热端部、所述第二光模块笼子、所述第二光模块以及所述第二散热器进行散热。
- 根据权利要求1至5任一项所述的光模块散热组件,其特征在于,所述第一光模块笼子连接第一散热器,所述第二光模块笼子连接第二散热器,所述第二光模块用于通过第三散热路径和第四散热路径,所述第三散热路径为所述第二光模块通过所述第二散热器进行散热;若所述第二光模块的温度高于所述第一光模块,则所述第四散热路径为所述第二光模块用于依次经由所述第二光模块笼子、所述第二散热端部、所述第一散热端部、所述第一光模块笼子、所述第一光模块以及所述第一散热器进行散热。
- 根据权利要求1至7任一项所述的光模块散热组件,其特征在于,所述第一光模块笼子和所述第二光模块笼子之间存在第一空间和第二空间,所述第一空间用于设置所述印刷电路板;所述光模块散热组件还包括由导热材料制成的第一互通散热件,所述第一互通散热件位于所述第二空间内,所述第一互通散热件的第一端与所述第一光模块笼子贴合,所述第一互通散热件的第二端与所述第二光模块笼子贴合。
- 根据权利要求1至8任一项所述的光模块散热组件,其特征在于,所述第一光模块笼子具有底壳和第一外壳,所述第一外壳与所述底壳扣合连接,以在所述第一外壳和所述底壳之间形成用于容纳所述第一光模块的容纳空间,所述底壳朝向所述印刷电路板设置,所述第二光模块笼子具有顶壳和第二外壳,所述第二外壳与所述顶壳扣合连接,以在所述第二外壳和所述顶壳之间形成用于容纳所述第二光模块的容纳空间,所述顶壳朝向所述印刷电路板设置;所述光模块散热组件还包括由导热材料制成的第二互通散热件,所述第二互通散热件的第一端与所述第一外壳贴合,所述第二互通散热件的第二端与所述第二外壳贴合。
- 一种通信设备,其特征在于,包括机柜,所述机柜内包括至少一个如权利要求1至9任一项所述的光模块散热组件。
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