WO2021229961A1 - Chambre à vapeur - Google Patents

Chambre à vapeur Download PDF

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Publication number
WO2021229961A1
WO2021229961A1 PCT/JP2021/014797 JP2021014797W WO2021229961A1 WO 2021229961 A1 WO2021229961 A1 WO 2021229961A1 JP 2021014797 W JP2021014797 W JP 2021014797W WO 2021229961 A1 WO2021229961 A1 WO 2021229961A1
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WO
WIPO (PCT)
Prior art keywords
wick
area
microchannel
vapor chamber
chamber according
Prior art date
Application number
PCT/JP2021/014797
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English (en)
Japanese (ja)
Inventor
朗人 内藤
信人 椿
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/874,782 external-priority patent/US11473849B2/en
Priority claimed from US16/874,878 external-priority patent/US20210356214A1/en
Priority claimed from US16/874,937 external-priority patent/US11585606B2/en
Priority claimed from US16/874,898 external-priority patent/US20210356211A1/en
Priority claimed from US16/874,801 external-priority patent/US11473850B2/en
Priority claimed from US16/874,853 external-priority patent/US11013145B1/en
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN202190000458.0U priority Critical patent/CN219037720U/zh
Priority to JP2022504714A priority patent/JP7088435B2/ja
Publication of WO2021229961A1 publication Critical patent/WO2021229961A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Definitions

  • One embodiment of the present invention relates to a vapor chamber.
  • Japanese Patent Application Laid-Open No. 2019-20001 discloses a vapor chamber.
  • the vapor chamber disclosed in Japanese Patent Application Laid-Open No. 2019-20001 includes an upper housing sheet 6 having a pillar 3, a lower housing sheet 7 having a convex portion 5, and an upper housing sheet 6 and a lower housing sheet 7. It is arranged in a closed space and includes a wick 4 sandwiched between a convex portion 5 and a pillar 3.
  • the upper housing sheet 6 and the lower housing sheet 7 enclose a hydraulic fluid such as water in the internal space.
  • the hydraulic fluid is vaporized by the heat from the heat source, moves in the internal space, and then releases heat to the outside to return to the liquid.
  • the hydraulic fluid that has returned to the liquid moves between the columns 3 due to the capillary force of the wick 4, returns to the vicinity of the heat source again, and is vaporized again.
  • the vapor chamber can diffuse heat at high speed by utilizing the latent heat of vaporization and the latent heat of condensation of the hydraulic fluid without requiring external power.
  • the maximum heat transport amount For the characteristics of the vapor chamber, it is important to prevent a decrease in the maximum heat transport amount. For example, when the amount of heat transferred to the wick is low, the maximum heat transport amount is greatly reduced. Further, when the opening of the wick becomes small, the amount of vaporization of the hydraulic fluid is insufficient, and the maximum heat transport amount also greatly decreases.
  • one embodiment of the present invention relates to a vapor chamber characterized by preventing a decrease in the maximum heat transport amount.
  • the vapor chamber according to the embodiment of the present invention has the following configuration in order to solve the problem.
  • the vapor chamber includes a housing, a hydraulic fluid, a microchannel, and a wick.
  • the housing includes an opposite upper housing sheet and a lower housing sheet joined at an outer edge portion, and has an internal space.
  • the hydraulic fluid is sealed in the internal space.
  • the microchannel is arranged in the internal space of the lower housing sheet and constitutes a flow path of the hydraulic fluid.
  • the wick is in the form of a sheet arranged in the internal space of the housing and in contact with the microchannel. The contact area between the wick and the microchannel is 5% to 40% with respect to the plan-viewed area of the internal space.
  • FIG. 1 is a cross-sectional view of the vapor chamber 1 according to the embodiment of the present invention.
  • FIG. 2 is a plan view of the lower housing sheet 7.
  • FIG. 3 is a plan view of the wick 4. It should be noted that all the drawings shown in the present embodiment are schematically shown for the sake of ease of explanation, and are not diagrams that faithfully show the actual size.
  • the vapor chamber 1 includes a flat plate-shaped housing 10.
  • the housing 10 has an upper housing sheet 6, a lower housing sheet 7, and a joining member 8.
  • the upper housing sheet 6 and the lower housing sheet 7 are joined by a joining member 8 at the outer edge portion.
  • the joining member 8 is arranged outside the broken line shown at the outer edge of the lower housing sheet 7.
  • the joining member 8 is made of, for example, phosphor bronze wax.
  • the housing 10 has an internal space sandwiched between the upper housing sheet 6 and the lower housing sheet 7.
  • a hydraulic fluid 20 such as water is sealed in the internal space.
  • the upper housing sheet 6 has a support column 3 arranged in an internal space.
  • the lower housing sheet 7 has a microchannel 5 arranged in an internal space.
  • the upper housing sheet 6 and the lower housing sheet 7 are made of copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing these as a main component (for example, nickel-copper alloy or phosphor bronze), and have high thermal conductivity. Have a rate.
  • the upper housing sheet 6 and the lower housing sheet 7 have a rectangular shape in a plan view.
  • the upper housing sheet 6 and the lower housing sheet 7 may have a polygonal shape or a circular shape in a plan view.
  • the shape of the internal space may be any shape.
  • the microchannel 5 is an uneven portion having a plurality of prismatic convex portions.
  • the unevenness of the microchannel 5 is formed, for example, by etching the upper surface of the lower housing sheet 7.
  • the uneven shape of the microchannel 5 is not limited to the prism.
  • the uneven shape of the microchannel 5 may be, for example, a cylinder.
  • the uneven shape of the microchannel 5 is a pyramidal trapezoidal shape when it is formed by etching. Further, the uneven shape of the microchannel 5 may be arranged in a grid pattern, may be arranged in a honeycomb shape, or may be randomly arranged.
  • the pillar 3 is a pillar for keeping the vapor chamber 1 in a thin plate shape.
  • the support column 3 is also formed by etching a portion of the upper housing sheet 6 other than the support column 3.
  • the support column 3 has a prismatic shape.
  • the shape of the support column 3 is not limited to the prism.
  • the shape of the support column 3 may be, for example, a cylinder.
  • the cross-sectional area of the columns 3 is larger than the cross-sectional area of the convex portions of the microchannel 5, and the distance between the adjacent columns 3 is larger than the pitch of the convex portions of the microchannel 5.
  • the wick 4 is arranged in the internal space so as to be sandwiched between the lower housing sheet 7 and the support column 3.
  • the wick 4 is made of a metal material thinner than the upper housing sheet 6 and the lower housing sheet 7.
  • the wick 4 is adhered (diffusion bonded) to the microchannel 5 of the lower housing sheet 7.
  • the wick 4 may be made of the same material as the upper housing sheet 6 and the lower housing sheet 7, or may be made of different materials.
  • the wick 4 has a rectangular shape in a plan view. However, the wick 4 may have a polygonal shape or a circular shape in a plan view. The shape of the wick 4 is appropriately set according to the shape of the internal space.
  • the wick 4 has a plurality of fine holes 41.
  • the holes 41 are formed, for example, by etching.
  • the hole 41 has a circular shape, but may be rectangular. However, since the holes 41 have a circular shape, the gas-liquid interface becomes spherical, and the hydraulic fluid 20 can be uniformly evaporated.
  • the holes 41 are arranged in a honeycomb shape.
  • the angle ⁇ formed by two holes 41 adjacent to an arbitrary hole 41 is 60 °.
  • ⁇ may be, for example, 45 °.
  • the holes 41 may be arranged in a grid pattern.
  • the holes 41 may be arranged irregularly.
  • the hydraulic fluid 20 changes from a liquid to a gas in the holes 41 due to heat from a heat source in close contact with the lower housing sheet 7. That is, the hydraulic fluid 20 constitutes a gas-liquid interface in the hole 41.
  • the vaporized hydraulic fluid 20 releases heat in the internal space of the housing 10 and returns to the liquid.
  • the hydraulic fluid 20 that has returned to the liquid moves through the microchannel 5 by the capillary force of the hole 41 of the wick 4 and is carried near the heat source again.
  • the vapor chamber 1 can diffuse heat at high speed by utilizing the latent heat of vaporization and the latent heat of condensation of the hydraulic fluid 20 without requiring external power.
  • a strong capillary force is secured by the hole 41 of the wick 4 having a relatively small opening area, and the permeation cross-sectional area (operation) of the hydraulic fluid 20 is secured by the microchannel 5 having a relatively large opening area.
  • the permeation amount of the liquid 20) is secured.
  • the vapor chamber 1 of the present embodiment has the following features.
  • the area of the wick 4 in a plan view is larger than the area of the area where the microchannel 5 is arranged.
  • FIG. 4 is a plan view in which the lower housing sheet 7 and the wick 4 are overlapped with each other through a part of the wick 4.
  • the wick 4 is larger than the area of the area where the microchannel 5 is arranged in a plan view.
  • the wick 4 is sandwiched between the lower housing sheet 7 and the support column 3, but may be displaced in the plane direction.
  • the wick 4 is larger than the area of the region where the microchannel 5 is arranged in a plan view. Therefore, even if the wick 4 is displaced in the plane direction, there is a low possibility that the wick 4 will deviate from the region where the microchannel 5 is arranged.
  • the wick 4 is formed by cutting out from a mother sheet such as one copper plate.
  • burrs may be formed on the edge portion in the cutting process. Therefore, as shown in FIG. 5, the edge portion of the wick 4 may float away from the lower housing sheet 7 due to burrs.
  • the heat of the heat source is less likely to be transferred to the wick 4.
  • the wick 4 is wider than the area of the area where the microchannel 5 is arranged in a plan view, even if the edge portion floats, the lower housing is located in the area where the microchannel 5 is arranged. It is possible to suppress floating from the sheet 7. Therefore, the wick 4 can ensure proper heat conduction from the microchannel 5.
  • the length h1 from the edge portion of the microchannel 5 to the edge portion of the wick 4 is the height h2 or more of the burr. If h1 ⁇ h2, even if the edge portion of the wick 4 floats, the area floating from the lower housing sheet 7 can be sufficiently suppressed in the region where the microchannel 5 is arranged, and appropriate heat can be obtained. Conduction can be ensured.
  • the contact area between the wick 4 and the microchannel 5 is 5% to 40% with respect to the area in which the internal space is viewed in a plan view. Further, more preferably, the contact area between the wick 4 and the microchannel 5 is 10% to 20% with respect to the area in which the internal space is viewed in a plan view.
  • FIG. 4 the convex portion of the microchannel 5 that contacts the wick 4 is shown by hatching.
  • the area of the internal space in a plan view is the area of the inner region shown by the alternate long and short dash line in the figure.
  • the outside of the one-dot broken line is the portion joined by the joining member 8.
  • the vapor chamber 1 when the contact area between the wick 4 and the microchannel 5 is less than 5% with respect to the plan-viewed area of the internal space, the amount of heat transferred from the microchannel 5 to the wick 4 becomes low, and the hole 41 of the wick 4 becomes available. It becomes impossible to form a gas-liquid interface. In this case, the maximum heat transport amount is greatly reduced. Further, when the contact area between the wick 4 and the microchannel 5 exceeds 40% of the plan-viewed area of the internal space, the amount of the hydraulic fluid 20 vaporized from the hole 41 of the wick 4 is insufficient, and the maximum heat transport amount increases. It drops significantly. Therefore, when the contact area between the wick 4 and the microchannel 5 is 5% to 40% with respect to the area in which the internal space is viewed in a plan view, the vapor chamber 1 can secure a predetermined maximum heat transport amount.
  • the area of the wick 4 is larger than the area of the area where the microchannel 5 is arranged as in (1) above, the area including the area where the wick 4 contacts the lower housing sheet 7 becomes larger. It is preferably 5% to 40% with respect to the area of the internal space viewed in a plan view.
  • the opening width W1 of the microchannel 5 is 50 to 200 ⁇ m
  • the thickness D2 of the wick 4 is 5 to 35 ⁇ m
  • D2: W1 5: 200 to 30:50.
  • the thickness D2 of the wick 4 is 15 to 20 ⁇ m, and the opening width W1 of the microchannel 5 is 200 ⁇ m.
  • FIG. 6 is a partially enlarged cross-sectional view of the vapor chamber 1.
  • FIG. 6 shows the height D1 of the microchannel 5, the thickness D2 of the wick 4, the opening width W1 of the microchannel 5, the width W2 of the protrusion of the microchannel 5, the opening pitch P1 of the microchannel 5, and the opening of the wick 4.
  • the pitch P1 is shown.
  • the wick 4 sinks into the opening portion of the microchannel 5, and the gas-liquid interface of the hydraulic fluid 20 is not formed in the hole 41 of the wick 4. .. Therefore, it is necessary that the thickness D2 of the wick 4 is 5 ⁇ m or more and the opening width W1 is 500 ⁇ m or less. On the other hand, if the thickness D2 of the wick 4 is too thick, it becomes difficult for heat to be transferred from the heat source in contact with the lower housing sheet 7. Therefore, the thickness of the wick 4 needs to be 35 ⁇ m or less. Further, if the opening width W1 is too small, the permeation cross-sectional area of the hydraulic fluid 20 decreases. Therefore, the opening width W1 of the microchannel 5 needs to be 50 ⁇ m or more.
  • the area ratio of the convex portion of the microchannel 5 to the entire microchannel 5 in a plan view is 5% to 40%.
  • the hydraulic fluid 20 returns from the gas to the liquid and passes through the opening of the microchannel 5. Therefore, the smaller the number of convex portions forming the flow path of the hydraulic fluid 20, the larger the permeation cross-sectional area of the hydraulic fluid 20. However, if the area of the opening of the microchannel 5 is too large, the wick 4 sinks into the opening of the microchannel 5, and the gas-liquid interface of the hydraulic fluid 20 is not formed in the hole 41 of the wick 4. Therefore, the area ratio of the convex portion to the entire microchannel 5 in a plan view is preferably at least 5% or more.
  • the area ratio of the convex portion to the entire microchannel 5 in a plan view is preferably 40% or less at the maximum.
  • the area ratio of the convex portion to the entire microchannel 5 in a plan view is 18 to 30%.
  • the area ratio of the convex portion of the microchannel 5 to the entire microchannel 5 in a plan view is 5% to 40%, and the height D1 of the convex portion of the microchannel 5 is 5 to 50 ⁇ m. .. However, when D1 is 50 ⁇ m, the area ratio is 40%.
  • the wick 4 sinks into the opening of the microchannel 5, and the gas-liquid interface of the hydraulic fluid 20 is not formed in the hole 41 of the wick 4.
  • the area of the opening of the microchannel 5 is too small, the permeation cross-sectional area of the hydraulic fluid 20 becomes small, and the maximum heat transport amount decreases.
  • the permeation cross-sectional area of the hydraulic fluid 20 becomes small, and the maximum heat transport amount decreases.
  • the height D1 of the convex portion of the microchannel 5 is too high, the distance from the heat source to the wick 4 becomes long, so that it becomes difficult for heat to be transferred from the heat source.
  • the vapor chamber 1 has the area of the convex portion of the microchannel 5 with respect to the entire microchannel 5 in a plan view.
  • the ratio is 5% to 40%, and the height D1 of the convex portion of the microchannel 5 is 5 to 50 ⁇ m.
  • the area ratio of the convex portion is set to about 40%, which is the highest, to ensure heat conduction.
  • the aperture ratio of the holes in the wick (the area of the holes 41 with respect to the total area of the wick 4) is 5 to 50%, the thickness D2 of the wick is 5 to 35 ⁇ m, and the convex portion of the microchannel 5 is cut off.
  • the area (D1 ⁇ W2) 150 to 25000 ⁇ m 2 , and the pitch P1 (W1 + W2) of the convex portion of the microchannel 5 is 100 to 1000 ⁇ m. More preferably, the pitch P1 is 100 to 500 ⁇ m.
  • the thickness of the wick 4 is too thick, it will be difficult for heat to be transferred from the heat source. On the other hand, if the thickness of the wick 4 is too thin, the wick 4 sinks into the opening portion of the microchannel 5. If the aperture ratio of the wick 4 is too high, it becomes difficult for heat to be transferred from the heat source. On the other hand, if the aperture ratio of the wick 4 is too low, the evaporation amount of the hydraulic fluid 20 decreases, and the maximum heat transport amount decreases. However, when D2 is 35 ⁇ m, heat is most difficult to be transferred from the heat source to the wick 4, so the aperture ratio is set to about 5%, which is the lowest, to ensure heat conduction.
  • the wick 4 sinks into the opening portion of the microchannel 5. If the cross-sectional area of the convex portion of the microchannel 5 is too large and the pitch is too small, the permeation cross-sectional area of the hydraulic fluid 20 becomes small, and the maximum heat transport amount decreases.
  • the ratio of the opening width L1 on the first surface (upper surface) side and the opening width L2 on the second surface (lower surface) side of the hole 41 of the wick 4 is 1: 3 to 1: 1.
  • FIG. 7 is an enlarged cross-sectional view of the wick 4.
  • the holes 41 of the wick 4 are formed by etching. When the etching is in an ideal state, the ratio of the upper surface side opening width L1 and the lower surface side opening width L2 of the hole 41 of the wick 4 is 1: 1.
  • the ratio of the upper surface side opening width L1 to the lower surface side opening width L2 is preferably 1: 3 or less.
  • the side having a small hole diameter is arranged on the gas-liquid interface side which is the upper surface side, and the side having a large hole diameter is arranged on the micro channel side which is the lower surface side.
  • the side with the smaller diameter of the hole may be arranged on the lower surface side, and the side with the larger diameter of the hole may be arranged on the upper surface side.
  • the ratio of the upper surface side opening width L1 to the lower surface side opening width L2 does not have to be 1: 3 to 1: 1 in all the holes 41.
  • the holes 41 satisfying the ratio may be 90% or more of the total.
  • the lower surface side of the wick 4 may also be scraped off, and a portion that does not come into contact with the microchannel 5 may occur. In this case, the heat conduction amount decreases in the non-contact portion, but the hydraulic fluid 20 permeates through the gap, so that the permeation amount of the hydraulic fluid 20 improves.
  • the difference between the thickness of the joining member 8 and the thickness of the wick 4 is 20 ⁇ m or less.
  • the difference between the thickness of the joining member 8 and the thickness of the wick 4 is 10 ⁇ m or less.
  • the thickness of the joining member 8 of the present embodiment is 25 ⁇ m, and the thickness of the wick 4 is 15 ⁇ m. This improves the smoothness of the housing 10. Therefore, the sealing performance by the joining member 8 is improved.
  • the joining member 8 has an injection port (not shown) for injecting the hydraulic fluid 20. When the vertical position of the injection port is about the same as that of the wick 4, the vapor chamber 1 can directly inject the hydraulic fluid 20 into the wick 4 from the injection port, and the hydraulic fluid can be easily injected. 20 can be injected.
  • pitch P1 350 ⁇ m
  • pitch P2 60 ⁇ m.
  • the end portion of the hole 41 and the end portion of the convex portion are unlikely to overlap in a plan view. Therefore, the wick 4 is less likely to sink into the opening of the microchannel 5.
  • the wick 4 has a region in which the hole 41 is not formed in a plan view, the width W3 of the portion constituting the region is 0.1 to 10 mm, and the area of the region in a plan view. Is 90% or less of the area of the wick 4.
  • the pitch P3 is 0.1 to 10 mm.
  • FIG. 9 is a plan view of the wick 4.
  • the number of holes 41 is displayed larger and smaller than that in FIG.
  • the non-formed region of the holes 41 consists of linear portions arranged in a grid pattern.
  • the width W3 of each straight line portion constituting the grid is 0.1 mm.
  • the pitch P3 is 0.26 mm.
  • the wick 4 has a region in which the hole 41 is not formed, and the width W3 of the narrowest portion of the portions constituting the region is 0.1 to 10 mm, and is viewed in a plan view.
  • the area of the region is 90% or less of the area of the wick 4, the adhesiveness with the microchannel 5 is improved and the adhesion is made uniform. Therefore, even if an impact such as a drop is applied to the vapor chamber 1 or stress is generated at the time of bending, the wick 4 is unlikely to rise from the microchannel 5. Therefore, the vapor chamber 1 can suppress the change in the maximum heat transport amount.
  • the portion constituting the above area is not limited to the example of FIG.
  • the portions constituting the region may be arranged diagonally. Further, the parts constituting the region do not need to be regularly arranged.
  • the portions constituting the region may have a random shape and may be randomly arranged.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

L'invention concerne une chambre à vapeur (1) qui comprend un boîtier (10), un fluide hydraulique (20), un microcanal (5) et une mèche (4). Le boîtier (10) comprend une feuille de boîtier supérieure (6) et une feuille de boîtier inférieure (7) qui se font face et qui sont jointes à une partie de bord externe, et présente un espace interne. Le fluide hydraulique (20) est scellé dans l'espace interne. Le microcanal (5) est disposé dans l'espace interne de la feuille inférieure du boîtier (7) et constitue un chemin d'écoulement du fluide hydraulique (20). La mèche (4) se présente sous la forme d'une feuille disposée dans l'espace interne du boîtier (10) et de façon à être en contact avec le microcanal (5). La surface de contact entre la mèche (4) et le microcanal (5) représente 5 à 40 % de la surface de l'espace interne vue en plan.
PCT/JP2021/014797 2020-05-15 2021-04-07 Chambre à vapeur WO2021229961A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202190000458.0U CN219037720U (zh) 2020-05-15 2021-04-07 均热板
JP2022504714A JP7088435B2 (ja) 2020-05-15 2021-04-07 ベイパーチャンバー

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US202016874749A 2020-05-15 2020-05-15
US16/874,782 US11473849B2 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,749 2020-05-15
US16/874,878 US20210356214A1 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,937 US11585606B2 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,898 US20210356211A1 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,898 2020-05-15
US16/874,801 US11473850B2 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,801 2020-05-15
US16/874,853 2020-05-15
US16/874,878 2020-05-15
US16/874,782 2020-05-15
US16/874,853 US11013145B1 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,937 2020-05-15

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Publication Number Publication Date
WO2021229961A1 true WO2021229961A1 (fr) 2021-11-18

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PCT/JP2021/014797 WO2021229961A1 (fr) 2020-05-15 2021-04-07 Chambre à vapeur

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JP (1) JP7088435B2 (fr)
CN (1) CN219037720U (fr)
WO (1) WO2021229961A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189773A1 (fr) * 2022-03-31 2023-10-05 住友精密工業株式会社 Procédé de fabrication de refroidisseur de type à ébullition, et refroidisseur de type à ébullition
WO2024075631A1 (fr) * 2022-10-06 2024-04-11 株式会社村田製作所 Dispositif de thermodiffusion et appareil électronique

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243035A (ja) * 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
US20150226493A1 (en) * 2009-03-06 2015-08-13 Kelvin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
WO2018003957A1 (fr) * 2016-07-01 2018-01-04 古河電気工業株式会社 Chambre à vapeur
JP2018503058A (ja) * 2015-01-22 2018-02-01 ピメムズ インコーポレイテッドＰｉＭＥＭＳ， Ｉｎｃ． 高いパフォーマンスを有する２相冷却装置
WO2018199216A1 (fr) * 2017-04-28 2018-11-01 株式会社村田製作所 Chambre à vapeur
JP2019020001A (ja) * 2017-07-12 2019-02-07 株式会社村田製作所 ベーパーチャンバー
US20200103176A1 (en) * 2018-09-28 2020-04-02 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6988170B2 (ja) * 2017-04-28 2022-01-05 株式会社村田製作所 ベーパーチャンバー
JP6702524B1 (ja) * 2018-07-31 2020-06-03 株式会社村田製作所 ベーパーチャンバー

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150226493A1 (en) * 2009-03-06 2015-08-13 Kelvin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
JP2010243035A (ja) * 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
JP2018503058A (ja) * 2015-01-22 2018-02-01 ピメムズ インコーポレイテッドＰｉＭＥＭＳ， Ｉｎｃ． 高いパフォーマンスを有する２相冷却装置
WO2018003957A1 (fr) * 2016-07-01 2018-01-04 古河電気工業株式会社 Chambre à vapeur
WO2018199216A1 (fr) * 2017-04-28 2018-11-01 株式会社村田製作所 Chambre à vapeur
JP2019020001A (ja) * 2017-07-12 2019-02-07 株式会社村田製作所 ベーパーチャンバー
US20200103176A1 (en) * 2018-09-28 2020-04-02 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189773A1 (fr) * 2022-03-31 2023-10-05 住友精密工業株式会社 Procédé de fabrication de refroidisseur de type à ébullition, et refroidisseur de type à ébullition
WO2024075631A1 (fr) * 2022-10-06 2024-04-11 株式会社村田製作所 Dispositif de thermodiffusion et appareil électronique

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