WO2021228219A1 - Oled显示基板及其制备方法、oled显示装置 - Google Patents

Oled显示基板及其制备方法、oled显示装置 Download PDF

Info

Publication number
WO2021228219A1
WO2021228219A1 PCT/CN2021/093795 CN2021093795W WO2021228219A1 WO 2021228219 A1 WO2021228219 A1 WO 2021228219A1 CN 2021093795 W CN2021093795 W CN 2021093795W WO 2021228219 A1 WO2021228219 A1 WO 2021228219A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
color
common
working
films
Prior art date
Application number
PCT/CN2021/093795
Other languages
English (en)
French (fr)
Inventor
鲍建东
高洪成
黄灿
何源
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/642,259 priority Critical patent/US20220320183A1/en
Publication of WO2021228219A1 publication Critical patent/WO2021228219A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technology, in particular to an OLED display substrate, a preparation method thereof, and an OLED display device.
  • OLED displays have many advantages such as self-luminescence, low driving voltage, high luminous efficiency, short response time, high definition and contrast, wide operating temperature range, and flexible display. It has many advantages in the fields of display, lighting, and smart wear. Widely used.
  • the present disclosure provides an OLED display substrate and a preparation method thereof, and an OLED display device.
  • the OLED display substrate includes: a substrate; an OLED device layer, which is disposed on the substrate and includes a plurality of OLED light-emitting devices; an encapsulation layer, which is disposed on the plurality of OLED light-emitting devices away from the substrate A black matrix layer arranged on the side of the encapsulation layer away from the substrate, wherein the black matrix layer includes a plurality of openings, the plurality of openings includes a plurality of working openings and at least one common opening; and arranged in the The color film layer on the side of the black matrix layer away from the substrate, the color film layer includes a plurality of color films disposed on the side of the plurality of openings away from the substrate and opposite to the plurality of OLED devices, wherein the at least The area of the orthographic projection of one of the common openings on the substrate is more than 50 times the area of the orthographic projection of any one of the plurality of working openings on the substrate.
  • the plurality of color films includes a plurality of working color films and at least one common color film
  • the orthographic projections of the plurality of working color films on the substrate respectively cover the plurality of working openings.
  • the orthographic projection on the substrate and the orthographic projection of the at least one common color film on the substrate respectively cover the orthographic projection of the at least one common opening on the substrate.
  • the area of the orthographic projection of each of the at least one common color film on the substrate is an orthographic projection of any one of the plurality of working color films on the substrate More than 100 times the area.
  • the shape of the orthographic projection of the common color film on the substrate is a circle, a rectangle or a polygon.
  • the diameter of the orthographic projection of the common color film on the substrate does not exceed 10 mm.
  • the light transmittance of each common color film in the at least one common color film is less than the light transmittance of any one of the plurality of working color films.
  • the material of the public color film is acrylic material.
  • the plurality of working color films includes color films of multiple colors, and each working color film of the plurality of working color films corresponds to an OLED light-emitting device in the OLED device layer Opposite, to filter the light emitted by the OLED light-emitting device for display.
  • the at least one common color film is located between the plurality of working color films.
  • the at least one common color film and one working color film of the plurality of working color films are made of the same material and have the same color, and the thickness of the common color film is greater than the thickness of the working color film .
  • the at least one common color film has the same thickness as a working color film of the plurality of working color films, and the light transmittance of the common color film is less than that of the working color film Rate.
  • the plurality of color films includes a plurality of working color films and a plurality of common color films; the orthographic projections of the plurality of working color films on the substrate respectively cover the plurality of working openings at all The orthographic projection on the substrate; and the orthographic projection of the plurality of common color films on the substrate covering the orthographic projection of the at least one common opening on the substrate, and each of the at least one common opening At least two public color films are provided in the public opening.
  • the plurality of working color films and the plurality of common color films are arranged in a one-to-one correspondence with the plurality of OLED devices, and the plurality of common color films and the plurality of working color films are both Including the same color film of multiple colors, and the common color film and working color film of the same color have the same material.
  • the light transmittance of the plurality of common color films in the at least one common opening is less than the light transmittance of the plurality of working color films.
  • the thickness of each common color film in the plurality of common color films is greater than the thickness of the working color film of the same color.
  • the material of the substrate is a flexible material
  • the material of the encapsulation layer is a transparent material
  • the method for preparing an OLED display substrate of the present disclosure includes: forming an OLED device layer including a plurality of OLED light-emitting devices on a substrate; forming an encapsulation layer on the side of the plurality of OLED light-emitting devices away from the substrate; A black matrix layer including a plurality of openings is formed on one side of the substrate so that the plurality of openings include a plurality of working openings and at least one common opening; A color film, the plurality of color films including a plurality of color films arranged on a side of the plurality of openings away from the substrate and opposite to the plurality of OLED devices, and a plurality of color films in the at least one common opening
  • the area of the orthographic projection of a common opening on the substrate is more than 50 times the area of the orthographic projection of any one of the plurality of working openings on the substrate.
  • forming a color film layer on the side of the black matrix layer away from the substrate includes: forming a plurality of working color films and at least one in the plurality of working openings and the at least one common opening below 95 degrees.
  • the orthographic projections respectively cover the orthographic projections of the at least one common opening on the substrate.
  • forming a color film layer on the side of the black matrix layer away from the substrate includes: forming a plurality of working color films and multiple working color films in the plurality of working openings and the at least one common opening below 95 degrees.
  • Common color films so that the plurality of working color films and the plurality of common color films are arranged in a one-to-one correspondence with the plurality of OLED devices, and the orthographic projections of the plurality of working color films on the substrate respectively cover The orthographic projection of the plurality of working openings on the substrate; and the orthographic projection of the plurality of common color films on the substrate covering the orthographic projection of the at least one common opening on the substrate, and the At least two common color films are provided in each of the at least one common opening.
  • the OLED display device of the present disclosure includes the above-mentioned OLED display substrate and at least one camera placed on the side of the base of the OLED display substrate away from the color filter layer, wherein the at least one camera is positioned directly on the base
  • the projections are respectively located within the orthographic projection range of at least one common color film in the color film layer of the OLED display substrate on the substrate.
  • FIG. 1 is a schematic cross-sectional view of the structure of an OLED display device including an under-screen camera provided by an embodiment of the disclosure
  • FIG. 2 is a plan view of an OLED display substrate provided by an embodiment of the disclosure.
  • FIG. 3 is a schematic cross-sectional view of the structure of an OLED display device including an under-screen camera provided by an embodiment of the disclosure
  • FIG. 4 is a plan view of an OLED display substrate provided by an embodiment of the disclosure.
  • FIG. 5 is a flowchart of preparing an OLED display substrate provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic diagram of the appearance of an OLED display device including an under-screen camera provided by an embodiment of the disclosure.
  • polarizers are usually provided to reduce the reflectivity of the display substrate under strong light.
  • the polarizer POL
  • the polarizer has characteristics such as large thickness and brittle material, which is not conducive to the development of flexible products.
  • Pol-Less non-polarizer
  • a color film layer is used to replace the polarizer, which not only reduces the thickness of the functional layer from ⁇ 100 ⁇ m to ⁇ 5 ⁇ m; Increase the light extraction rate from 42% to 60%.
  • the black matrix layer includes a plurality of openings and the color film layer usually includes red (R), green (G), and blue (B) color films filling the plurality of openings.
  • the color films of various colors in the color film layer correspond to the red, green, and blue sub-pixel units, respectively.
  • the present disclosure proposes an OLED display substrate based on Pol-less technology.
  • the OLED display substrate can be organically combined with an under-screen camera to improve the performance of the OLED display device.
  • the OLED display device of the present disclosure includes an OLED display substrate and a camera arranged under the OLED display substrate.
  • the OLED display substrate includes a color film layer and a black matrix layer instead of a polarizer. That is, the OLED display substrate of the present disclosure is a Pol-less solution.
  • OLED display substrate. The position of the corresponding camera on the OLED display substrate will not be provided with a black matrix to transmit the light of the camera. On the light-emitting side of the OLED display device, when the screen is turned off, the position where the black matrix is not provided will lose the function of reducing the reflectance, so there is a hue difference from the position where the black matrix is provided in the periphery.
  • a specific color film layer (common CF) is formed on the color film layer of the OLED display substrate corresponding to the position where the under-screen camera is to be set. , To avoid the visual hue difference between the area where the black matrix is not set and the area where the black matrix is set when the screen is off.
  • the OLED display substrate of the present disclosure includes a substrate, which may be a flexible substrate; an OLED device layer disposed on the substrate, which includes a plurality of OLED light-emitting devices; an encapsulation layer disposed on the side of the plurality of OLED light-emitting devices away from the substrate, A planarization layer may also be formed above the encapsulation layer; a black matrix layer disposed on the side of the encapsulation layer away from the substrate, the black matrix layer includes a plurality of openings, the plurality of openings include a plurality of working openings and at least one common opening, wherein Each of the at least one common opening is much larger than each of the plurality of working openings, for example, the area of the common opening is tens to hundreds of times the area of the working opening.
  • the area of the orthographic projection of each of the at least one common opening on the substrate is 50 times or more than 100 times the area of the orthographic projection of any one of the plurality of working openings on the substrate;
  • the plurality of color films in the plurality of openings wherein the color film provided in the common opening larger than the working opening is the above-mentioned public color film, and the color film provided in the working opening is the working color film.
  • the color film layer of the OLED display substrate of the present disclosure is formed with a plurality of working color films corresponding to the OLED light-emitting devices, and a common color film corresponding to the position where the under-screen camera is to be installed (also called The under-screen camera color film), whose area is significantly larger than the working color film used to filter the light emitted by the OLED light-emitting device, that is, its area should match the size of the under-screen camera to be set.
  • the under-screen camera color film also called The under-screen camera color film
  • the OLED display substrate of the present disclosure includes a substrate 10; the substrate 10 includes a plurality of OLED light-emitting devices OLED device layer, the OLED device layer includes a pixel defining layer 20 formed on the substrate 10, a separate anode 30 for each OLED light-emitting device, a light-emitting layer 40 for each OLED light-emitting device, and a shared cathode for multiple OLED light-emitting devices Layer 50; an encapsulation layer 80 formed on the cathode layer 50, the upper surface of the encapsulation layer 80 can be flat or a separate planarization layer can also be formed on the encapsulation layer 80; on the flat encapsulation layer 80 away from the substrate side
  • the black matrix layer 60 includes a plurality of openings, the plurality of openings includes at least one common opening 602 and a plurality of working openings 601
  • the color film layer can be divided into a work area 200 and an under-screen camera area 100.
  • the under-screen camera area 100 can be set in the middle or edge of the work area 200 as required.
  • a variety of color films of different colors can be set in the working area 200, such as blue color film 73, red color film 72, and green color film 71; a common color film 74 is set in the public opening 602 of the camera area 100 under the screen, as shown in Figure 1.
  • the area of the public color film 74 is much larger than the areas of the blue color film 73, the red color film 72 and the green color film 71.
  • the position and size of the public color film 74 are the same as the camera set under the OLED display substrate. 90 corresponds.
  • the orthographic projections of the plurality of working color films on the substrate respectively cover the orthographic projections of the plurality of working openings on the substrate
  • the orthographic projections of the at least one common color film on the substrate respectively cover The orthographic projection of the at least one common opening on the substrate.
  • the black matrix layer in the camera area 100 under the screen defines an opening with an area much larger than the blue color film 73, the red color film 72 and the green color film 71, that is, the entire area of the camera area 100 under the screen.
  • a whole block of common color film 74 is formed in the area, and the whole block of common color film 74 does not include any material of the black matrix layer to transmit the light of the camera 90.
  • the black matrix layer 60 defines a plurality of openings, and these openings are filled with a plurality of color films, such as a plurality of blue color films 73, a plurality of red color films 72, and a plurality of green color films shown in FIG.
  • the common opening defined by the black matrix layer 60 at the camera area 100 under the screen is much larger than that for setting a plurality of blue color films 73, a plurality of red color films 72, and a plurality of green color films 71.
  • the working opening formed For example, it can cover tens to hundreds of sub-pixel areas on the substrate. It should be noted that FIG.
  • the common color film 74 covers a plurality of OLED light emitting devices formed on the substrate 10.
  • the size and shape of the opening for the common color film 74 defined by the black matrix layer can be defined according to actual applications, for example, according to the size of the camera under the screen.
  • the area of the orthographic projection of the common color film 74 on the substrate 10 is at least 50 times the area of the orthographic projection of any one of the plurality of working color films on the substrate 10.
  • the common opening for the common color film 74 among the plurality of openings defined by the black matrix layer does not include black matrix material, so the light from the under-screen camera 90 under the substrate 10 can be directly Through without being blocked by the black matrix material.
  • the orthographic projection of the common color film 74 on the substrate 10 may be circular, and the diameter is usually not more than 10 mm.
  • the present disclosure is not limited to this, and the orthographic projection of the common color film 74 on the substrate 10 can be set to other shapes or sizes according to needs (for example, the size and shape of the camera).
  • the shape of the common color film 74 may also be a rectangle or a polygon.
  • the hue difference between the common color film 74 and the surrounding working color film can be eliminated, the light transmittance of the common color film 74 can be selected to be lower than that of the surrounding working color film.
  • the transmittance for example, is lower than the transmittance of the blue color film 73, the red color film 72, and the green color film 71, so that the color consistency of each area in the off state can be ensured.
  • the material of the common color film 74 may be an acrylic material, and its light transmittance per unit thickness (per micrometer) may be between 60% and 90%.
  • the light transmittance of the conventional blue color film 73, red color film 72 and green color film 71 per unit thickness (per micrometer) ranges from 45% to 75%, while the light transmittance of red color film is usually greater than
  • the light transmittance of the green color film, the light transmittance of the green color film is greater than the light transmittance of the blue color film. Therefore, in order to ensure that the hue of each area is consistent in the screen-off state, for example, the thickness of each color film in the color film layer can be adjusted to achieve the required light transmittance.
  • the color of the common color film may be any one of a red color film, a green color film, and a blue color film.
  • a common color film can be formed when the working color film of the color is formed, thereby saving process.
  • the thickness of the common color film can be set to be greater than the thickness of the working color film of the same color, so that the light of the common color film The transmittance is less than the light transmittance of the working color film.
  • the thickness H2 of the common color film 74 is greater than the thickness H1 of the red color film 72.
  • the common color film set in a common opening is a monolithic color film material, which can ensure that the cameras in the camera area 100 under the screen can obtain uniform high quality image.
  • the material of the whole piece of public color film in each public opening can be any one of the work color films of multiple colors.
  • the public color film can be prepared while preparing the work color film of the corresponding color. Therefore, the process steps can be saved; alternatively, the material of the entire common color film in each common opening can also be other color film materials that are different from the material of the multi-color working color film, so that it can be flexible according to needs Choose the required public color film material to obtain the required light transmittance.
  • Two or more discrete color films can be provided in a common opening, as long as there is no setting in the public opening corresponding to the under-screen camera area 100 where the camera is set to block the light from the camera.
  • the black matrix material is sufficient.
  • FIG. 3 and 4 show a schematic cross-sectional view and a plan view of an OLED display substrate according to another embodiment of the present disclosure.
  • the difference from the embodiment shown in Figs. 1 and 2 is that in the embodiment shown in Figs. 3 and 4, a plurality of discrete color films are provided in a common opening. There is no black matrix material between these color films.
  • the multiple materials in a common opening may be multiple public color films that are formed by the same preparation process and are exactly the same as the multiple working color films.
  • a plurality of common color films 74 set above the camera 90 can be used for preparing the green color film 71, the red color film 72 and the blue color film 73 in the preparation work area 200. Prepared at the same time.
  • the thickness of the common color film can be set to be greater than the thickness of the working color film of the same color, so that the light of the common color film can pass through The rate is less than the light transmittance of the working color film.
  • the other structures of the OLED display substrate of the embodiment shown in FIG. 3 and FIG. 4 may be the same as the other structures of the OLED display substrate shown in FIG. 1 and FIG. 2, and will not be repeated here.
  • the substrate 10 may be a flexible substrate, on which a pixel driving circuit for driving the OLED light-emitting device to emit light can be provided.
  • the encapsulation layer 80 is, for example, a thin-film encapsulation layer with a thickness of about 4 ⁇ m-15 ⁇ m; and is made of a transparent material to ensure that the light emitted by the OLED light-emitting device is transmitted to the color film of the corresponding color in the color film layer.
  • the camera 90 may include a digital image sensor and a lens structure.
  • Step S1 forming an OLED device layer including a plurality of OLED light-emitting devices on the substrate 10;
  • Step S2 forming an encapsulation layer 80 on the side of the plurality of OLED light-emitting devices away from the substrate;
  • Step S3 forming a black matrix layer 60 including a plurality of openings on the side of the encapsulation layer 80 away from the substrate, the plurality of openings including a plurality of working openings 601 and at least one common opening 602; and
  • Step S4 forming a color filter layer on the side of the black matrix layer 60 away from the substrate, so that the color filter layer includes a plurality of color films, and the plurality of color films includes a side of the plurality of openings that is away from the substrate.
  • the plurality of color filters opposite to the plurality of OLED devices, and the area of the orthographic projection of one of the at least one common opening on the substrate is equal to that of any one of the plurality of working openings.
  • the area of the orthographic projection on the substrate is more than 50 times.
  • forming an OLED device layer including a plurality of OLED light-emitting devices on a substrate includes: forming a plurality of discrete anodes 30 of the plurality of OLED light-emitting devices on the substrate 10; forming a pixel defining layer 20, the pixel defining layer 20 includes a plurality of pixel defining openings for defining a plurality of sub-pixel regions, and a plurality of discrete anodes 30 are exposed through the plurality of pixel defining openings; a plurality of light emitting layers are formed in the plurality of pixel defining openings of the pixel defining layer 40, so that each of the multiple light-emitting layers covers one sub-pixel area; and a common cathode layer 50 is formed on the multiple light-emitting layers 40.
  • a black matrix layer 60 defining a plurality of openings is formed on the encapsulation layer 80, so that the plurality of openings includes a plurality of working openings and at least one common opening, and the common opening is on the substrate
  • the area of the orthographic projection is at least 50 times the area of the orthographic projection of any one of the plurality of working openings on the substrate; and the acrylic material is deposited in the plurality of openings below 95 degrees to form a plurality of A color film, wherein a common color film is formed in the common opening.
  • a plurality of working color films and at least one common color film 74 are respectively formed in the plurality of working openings and the at least one common opening below 95 degrees, so that the plurality of working color films are on the substrate.
  • the orthographic projections respectively cover the orthographic projections of the plurality of working openings on the substrate, and the orthographic projections of the at least one common color film on the substrate respectively cover the orthographic projections of the at least one common opening on the substrate. Projection, as shown in Figure 1 and Figure 2.
  • a plurality of working color films and a plurality of common color films may be respectively formed in the plurality of working openings and the at least one common opening below 95 degrees, so that the plurality of working color films and the plurality of The common color film is arranged in a one-to-one correspondence with the plurality of OLED devices, and the orthographic projections of the plurality of working color films on the substrate respectively cover the orthographic projections of the plurality of working openings on the substrate; and The orthographic projection of a plurality of common color films on the substrate covers the orthographic projection of the at least one common opening on the substrate, and each of the at least one common opening is provided with at least two common colors Membrane, as shown in Figure 3 and Figure 4.
  • forming a black matrix layer defining a plurality of openings on the encapsulation layer 80 may include forming a whole layer of black matrix material on the encapsulation layer 80, and then coating photoresist on the whole layer of black matrix material, pre-baking, and using The mask plate corresponding to the pattern of the black matrix layer defining multiple openings exposes, develops and bakes the photoresist to form a photoresist pattern, and then etches the entire layer of black matrix material through the photoresist pattern A black matrix layer defining a plurality of openings is formed.
  • a red color film, a green color film, a blue color film and a public color film are formed in the corresponding openings in sequence to form a red color film, a green color film, a blue color film and a public color film.
  • the order of the color film is not limited to this.
  • the color of the common color film is the same as one of the red color film, the green color film, and the blue color film, the color film of the same color can be formed at the same time. This application does not limit this.
  • the process parameters for forming the above-mentioned color film of multiple colors are adjusted according to the thickness of the color film to be formed.
  • an OLED display device which includes the above-mentioned OLED display substrate and a camera 90 placed on the side of the base of the OLED display substrate away from the color film layer, wherein the The orthographic projection of the camera 90 on the substrate 10 is within the orthographic projection range of the common color film 74 in the color filter layer of the OLED display substrate on the substrate 10.
  • the OLED display device may be an electronic device with a display function, such as a TV, a mobile phone, a display screen, a computer, a tablet computer, and a palmtop terminal.
  • a display function such as a TV, a mobile phone, a display screen, a computer, a tablet computer, and a palmtop terminal.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED显示基板，包括：基底(10)；OLED器件层，其设置在所述基底(10)上并且包括多个OLED发光器件；封装层(80)，其设置在所述多个OLED发光器件远离基底(10)的一侧；布置在所述封装层(80)远离基底(10)一侧的黑矩阵层(60)，黑矩阵层(60)包括多个开口；以及布置在所述黑矩阵层(60)远离基底(10)一侧的彩膜层，彩膜层包括多个彩膜，所述多个彩膜一一对应地设置在所述多个开口远离基底(10)的一侧，其中，所述多个彩膜包括多个工作彩膜和至少一个公共彩膜(74)，以及所述公共彩膜(74)在所述基底(10)上的正投影的面积为所述多个工作彩膜中的任意一个在所述基底(10)上的正投影的面积的50倍以上。还提供了一种OLED显示基板的制备方法及OLED显示装置。

Description

OLED显示基板及其制备方法、OLED显示装置
相关申请的交叉引用
本公开要求于2020年5月15日提交的中国专利申请No.202010413640.0的优先权，在此将其作为引用整体并入本文。
技术领域
本公开涉及显示技术领域，具体涉及一种OLED显示基板及其制备方法和OLED显示装置。
背景技术
OLED显示器由于具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、使用温度范围宽、可实现柔性显示等诸多优点，在显示领域、照明领域及智能穿戴等领域有着广泛地应用。
发明内容
本公开提供了一种OLED显示基板及其制备方法、OLED显示装置。
在一个实施例中，所述OLED显示基板，包括：基底；OLED器件层，其设置在所述基底上并且包括多个OLED发光器件；封装层，其设置在所述多个OLED发光器件远离基底的一侧；布置在所述封装层远离基底一侧的黑矩阵层，其中，黑矩阵层包括多个开口，所述多个开口包括多个工作开口和至少一个公共开口；以及布置在所述黑矩阵层远离基底一侧的彩膜层，彩膜层包括设置在所述多个开口的远离所述基底一侧且与所述多个OLED器件对置的多个彩膜，其中所述至少一个公共开口中的一个公共开口在所述基底上的正投影的面积为所述多个工作开口中的任意一个在所述基底上的正投影的面积的50倍以上。
在一个实施例中，所述多个彩膜包括多个工作彩膜和至少一个公共彩膜，以及所述多个工作彩膜在所述基底上的正投影分别覆盖所 述多个工作开口在所述基底上的正投影，以及所述至少一个公共彩膜在所述基底上的正投影分别覆盖所述至少一个公共开口在所述基底上的正投影。
在一个实施例中，所述至少一个公共彩膜中的每个公共彩膜在所述基底上的正投影的面积为所述多个工作彩膜中的任意一个在所述基底上的正投影的面积的100倍以上。
在一个实施例中，所述公共彩膜在所述基底上的正投影的形状为圆形、矩形或多边形。
在一个实施例中，所述公共彩膜在所述基底上的正投影的直径不超过10mm。
在一个实施例中，所述至少一个公共彩膜中的每个公共彩膜的光透过率小于所述多个工作彩膜中的任意一个的光透过率。
在一个实施例中，所述公共彩膜的材料为亚克力系材料。
在一个实施例中，所述多个工作彩膜包括多种颜色的彩膜，以及所述多个工作彩膜中的每个工作彩膜均与所述OLED器件层中的对应一个OLED发光器件对置，以对该OLED发光器件发出的光进行滤光以用于进行显示。
在一个实施例中，所述至少一个公共彩膜位于所述多个工作彩膜之间。
在一个实施例中，所述至少一个公共彩膜与所述多个工作彩膜的一个工作彩膜由相同材料制备并且具有相同的颜色，以及该公共彩膜的厚度大于该工作彩膜的厚度。
在一个实施例中，所述至少一个公共彩膜与所述多个工作彩膜的一个工作彩膜具有相同的厚度，以及该公共彩膜的光透过率小于该工作彩膜的光透过率。
在一个实施例中，所述多个彩膜包括多个工作彩膜和多个公共彩膜；所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影；以及所述多个公共彩膜在所述基底上的正投影覆盖所述至少一个公共开口在所述基底上的正投影，以及所述至少一个公共开口中的每个公共开口中设置有至少两个公共彩膜。
在一个实施例中，所述多个工作彩膜和所述多个公共彩膜与所述多个OLED器件一一对应设置，以及所述多个公共彩膜与所述多个工作彩膜均包括相同的多种颜色的彩膜，并且同种颜色的公共彩膜和工作彩膜材料相同。
在一个实施例中，所述至少一个公共开口中的多个公共彩膜的光透过率小于所述多个工作彩膜的光透过率。
在一个实施例中，所述多个公共彩膜中每个公共彩膜的厚度大于同种颜色的工作彩膜的厚度。
在一个实施例中，所述基底的材料为柔性材料，以及所述封装层的材料为透明材料。
本公开的制备OLED显示基板的方法，包括：在基底上形成包括多个OLED发光器件的OLED器件层；在所述多个OLED发光器件远离基底的一侧形成封装层；在所述封装层远离基底一侧形成包括多个开口的黑矩阵层使得所述多个开口包括多个工作开口和至少一个公共开口；在所述黑矩阵层远离基底一侧形成彩膜层，使得彩膜层包括多个彩膜，所述多个彩膜包括设置在所述多个开口的远离所述基底一侧且与所述多个OLED器件对置的多个彩膜，以及所述至少一个公共开口中的一个公共开口在所述基底上的正投影的面积为所述多个工作开口中的任意一个在所述基底上的正投影的面积的50倍以上。
在一个实施例中，在所述黑矩阵层远离基底一侧形成彩膜层包括：在95度以下在所述多个工作开口和所述至少一个公共开口中分别形成多个工作彩膜和至少一个公共彩膜，使得所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影，以及所述至少一个公共彩膜在所述基底上的正投影分别覆盖所述至少一个公共开口在所述基底上的正投影。
在一个实施例中，在所述黑矩阵层远离基底一侧形成彩膜层包括：在95度以下在所述多个工作开口和所述至少一个公共开口中分别形成多个工作彩膜和多个公共彩膜，使得所述多个工作彩膜和所述多个公共彩膜与所述多个OLED器件一一对应设置，所述多个工作 彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影；以及所述多个公共彩膜在所述基底上的正投影覆盖所述至少一个公共开口在所述基底上的正投影，以及所述至少一个公共开口中的每个公共开口中设置有至少两个公共彩膜。
本公开的OLED显示装置，包括上述OLED显示基板和置于所述OLED显示基板的基底的远离所述彩膜层一侧的至少一个摄像头，其中，所述至少一个摄像头在所述基底上的正投影分别处于所述OLED显示基板的所述彩膜层中的至少一个公共彩膜在所述基底上的正投影范围内。
附图说明
为了更清楚地说明本公开的实施例，下面将对本公开各个实施例的附图作简单介绍。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，但是本公开不限于此：
图1为本公开实施例提供的包括屏下摄像头的OLED显示装置的结构的剖面示意图；
图2为本公开实施例提供的OLED显示基板的平面图；
图3为本公开实施例提供的包括屏下摄像头的OLED显示装置的结构的剖面示意图；
图4为本公开实施例提供的OLED显示基板的平面图；
图5为本公开实施例提供的制备OLED显示基板的流程图；以及
图6为本公开实施例提供的包括屏下摄像头的OLED显示装置的外观示意图。
具体实施方式
在传统的OLED显示基板中，通常会设置偏光片以降低显示基板在强光下的反射率。虽然偏光片(POL)能够有效地降低强光下显示基板的反射率，但却损失了接近58％的出光率。这对于OLED显示基板而言是极其不利的。另外，偏光片存在厚度较大、材质脆等特性， 从而不利于柔性产品的开发。
为了开发基于OLED显示技术的柔性产品，提出了Pol-Less(无偏光片)技术，例如使用彩膜层来替代偏光片，这不仅能将功能层的厚度从～100μm降低至＜5μm；而且能够将出光率从42％提高至60％。具体来讲，黑矩阵层包括多个开口而彩膜层通常包括填充多个开口的红色(R)、绿色(G)、蓝色(B)彩膜。基于OLED发光器件自发光的特点，所述彩膜层内的各种颜色的彩膜分别与红、绿和蓝子像素单元对应。
随着OLED技术的发展，OLED显示基板与摄像头结合的技术受到越来越多的重视。本公开提出了一种基于Pol-less技术的OLED显示基板，该OLED显示基板可以与屏下摄像头有机结合改善OLED显示装置的性能。
本公开的OLED显示装置包括OLED显示基板和在OLED显示基板下方设置的摄像头，OLED显示基板包括代替偏光片的彩膜层和黑矩阵层，即，本公开的OLED显示基板为Pol-less方案的OLED显示基板。OLED显示基板上对应摄像头的位置将不会设置黑矩阵，以透过摄像头的光。在OLED显示装置的发光侧，在熄屏状态下，没有设置黑矩阵的位置会失去降低反射率的功能，这样与周边设置了黑矩阵的位置存在色相差异。为了解决这一问题，在本公开中，在OLED显示基板的彩膜层上对应于要设置屏下摄像头的位置形成特定的彩膜层(在本文中可以称为公共彩膜(common CF))，以避免熄屏状态下未设置黑矩阵的区域与设置黑矩阵的区域之间肉眼可见的色相差异。
本公开的OLED显示基板包括基底，其可以为柔性基底；设置在基底上的OLED器件层，其包括多个OLED发光器件；设置在所述多个OLED发光器件远离基底的一侧的封装层，该封装层上方还可以形成平坦化层；设置在封装层远离基底一侧上的黑矩阵层，黑矩阵层包括多个开口，所述多个开口包括多个工作开口和至少一个公共开口，其中所述至少一个公共开口的每一个公共开口相对于所述多个工作开口中的每个工作开口而言大得多，例如公共开口面积为工作开 口面积的几十倍至几百倍。例如，至少一个公共开口中的每个公共开口在所述基底上的正投影的面积为多个工作开口中的任意一个在基底上的正投影的面积的50倍或100倍以上；分别设置在多个开口中的多个彩膜，其中设置在较工作开口大的公共开口中的彩膜即为上述的公共彩膜，而设置在工作开口中的彩膜为工作彩膜。即，在本公开的OLED显示基板的彩膜层中形成有用于与OLED发光器件相对应设置的多个工作彩膜，以及与要设置屏下摄像头的位置对应的公共彩膜(也可以称为屏下摄像头彩膜)，其面积显著大于用于对OLED发光器件发出的光进行滤光的工作彩膜，即其面积应当与要设置的屏下摄像头的大小相匹配。例如，在公共彩膜在基底上的正投影为圆形时，其在基底上的正投影的直径不超过10mm。
具体地，如图1所示，其为图2所示的OLED显示面板沿着线AA’的截面图，本公开的OLED显示基板包括基底10；形成在基底10上的包括多个OLED发光器件的OLED器件层，OLED器件层包括形成在基底10上的像素限定层20、每个OLED发光器件的分立的阳极30、每个OLED发光器件的发光层40、多个OLED发光器件的共享的阴极层50；形成在阴极层50上的封装层80，封装层80的上表面可以为平坦的或者还可以在封装层80上形成单独的平坦化层；在平坦的封装层80远离基底一侧的黑矩阵层60，黑矩阵层60包括多个开口，所述多个开口包括至少一个公共开口602和多个工作开口601；以及布置在所述黑矩阵层60的远离基底10一侧的彩膜层，彩膜层包括多个彩膜，所述多个彩膜一一对应地设置在所述多个开口远离基底的一侧。
彩膜层可以划分为工作区200和屏下摄像头区100，如图6所示，根据需要可以将屏下摄像头区100设置在工作区200中间或者边缘。工作区200中可以设置多种不同颜色的彩膜，例如蓝色彩膜73、红色彩膜72和绿色彩膜71；屏下摄像头区100的公共开口602中设置了公共彩膜74，从图1和图2可以看出，公共彩膜74的面积远远大于蓝色彩膜73、红色彩膜72和绿色彩膜71的面积，公共彩膜74的位置和大小与在OLED显示基板下方设置的摄像头90相对应。即， 多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影，以及所述至少一个公共彩膜在所述基底上的正投影分别覆盖所述至少一个公共开口在所述基底上的正投影。从图1可以看出，黑矩阵层在屏下摄像头区100限定出一个面积远远大于蓝色彩膜73、红色彩膜72和绿色彩膜71的开口，即，在屏下摄像头区100的整个区域中形成了整块的公共彩膜74，以及整块的公共彩膜74中不包括任何的黑矩阵层的材料，以透过摄像头90的光。
如图2所示，黑矩阵层60限定出多个开口，这些开口中填充了多个彩膜，例如图2中所示的多个蓝色彩膜73、多个红色彩膜72和多个绿色彩膜71，以及在屏下摄像头区100中的公共彩膜74。由图1和图2所示，黑矩阵层60在屏下摄像头区100处限定出的公共开口远远大于为设置多个蓝色彩膜73、多个红色彩膜72和多个绿色彩膜71而形成的工作开口。例如，其可以覆盖基板上的几十至几百个子像素区。应当注意的是，图2不是按照比例绘制的，其仅仅示意性示出了公共彩膜74覆盖了基底10上形成的多个OLED发光器件。可以根据实际应用，例如根据屏下摄像头的大小来限定由黑矩阵层限定出的针对公共彩膜74的开口的大小和形状。例如，公共彩膜74在基底10上的正投影的面积至少为多个工作彩膜中的任意一个在基底10上的正投影的面积的50倍。
如图1和图2所示，由黑矩阵层限定出的多个开口中的针对公共彩膜74的公共开口中不包括黑矩阵材料，因此在基底10下方的屏下摄像头90的光可以直接透过，而不受黑矩阵材料阻挡。
如图2所示，公共彩膜74在基底10上的正投影可以为圆形，直径通常不超过10mm。但是，本公开不限于此，公共彩膜74在基底10上的正投影可以根据需要(例如，摄像头的尺寸和形状)设置为其他形状或其他尺寸。例如，公共彩膜74的形状还可以为矩形或多边形。
另一方面，为了确保熄屏状态下，可以消除公共彩膜74与周边工作彩膜之间的色相差异，可以将公共彩膜74的光透过率选择为低于其周边工作彩膜的光透过率，例如低于蓝色彩膜73、红色彩膜72 和绿色彩膜71的透过率，这样可以确保熄屏状态下各个区域的色相一致。
例如，公共彩膜74的材料可以为亚克力系材料，其单位厚度(每微米)的光透过率可以在60％至90％之间。而单位厚度(每微米)的常规的蓝色彩膜73、红色彩膜72和绿色彩膜71的光透过率范围在45％至75％之间，而通常红色彩膜的光透过率大于绿色彩膜的光透过率，绿色彩膜的光透过率大于蓝色彩膜的光透过率。因此，为了确保熄屏状态下各个区域的色相一致，例如可以通过调节彩膜层中的各个彩膜的厚度来达到所需的光透过率。
在一个实施例中，公共彩膜的颜色可以为红色彩膜、绿色彩膜和蓝色彩膜中的任意一种。这样可以在形成该颜色的工作彩膜时形成公共彩膜，从而节省工艺。如上所述，为了确保熄屏状态下屏下摄像头区和工作区之间的色相一致，可以将公共彩膜的厚度设置为大于与其颜色相同的工作彩膜的厚度，以使得公共彩膜的光透过率小于该工作彩膜的光透过率，例如，在公共彩膜74采用与红色彩膜72相同的材料制备时，公共彩膜74的厚度H2大于红色彩膜72的厚度H1。
如上所述的图1和图2所示的实施例中，在一个公共开口中设置的公共彩膜为一整块的彩膜材料，这可以确保屏下摄像头区100的摄像头能够获得均一高质量图像。例如，每个公共开口中的整块公共彩膜的材料可以为多种颜色的工作彩膜中的任意一种的材料，此时可以在制备对应颜色的工作彩膜的同时制备公共彩膜，从而可以节省工艺步骤；可选地，每个公共开口中的整块公共彩膜的材料也可以为不同于所述多种颜色的工作彩膜的材料的其他彩膜材料，从而可以根据需要灵活地选择所需要的公共彩膜材料，以获得所需的光透过率。
但是本公开不限于此，在一个公共开口中可以设置两个或两个以上分立的彩膜，只要在对应于设置摄像头的屏下摄像头区100的公共开口中没有设置阻挡摄像头的光透过的黑矩阵材料即可。
图3和图4示出了根据本公开的另一实施例的OLED显示基板的剖面示意图和平面图。与图1和图2所示的实施例不同的是：图3和图4所示的实施例中在一个公共开口中设置有多个分立的彩膜。这 些彩膜之间未设置黑矩阵材料。例如，一个公共开口中的多个材料可以为通过同一制备工艺形成的与多个工作彩膜完全相同的多个公共彩膜。如图3所示，在屏下摄像头区100中，对应于摄像头90上方设置的多个公共彩膜74可以在制备工作区200中的绿色彩膜71、红色彩膜72和蓝色彩膜73的同时制备。
另外，为了确保熄屏状态下屏下摄像头区和工作区之间的色相一致，可以将公共彩膜的厚度设置为大于与其颜色相同的工作彩膜的厚度，以使得公共彩膜的光透过率小于该工作彩膜的光透过率。
图3和图4所示的实施例的OLED显示基板的其他结构可以与图1和图2所示的OLED显示基板的其他结构相同，在此不再赘述。
所述基底10可以柔性基底，其上可设置用于驱动OLED发光器件发光的像素驱动电路。
封装层80例如为薄膜封装层，其厚度大约为4μm-15μm；并且由透明材料制备，以确保OLED发光器件发出的光线会传输到彩膜层中的对应颜色的彩膜。
所述摄像头90可以包括数码图像传感器和透镜结构。
根据本公开的另一方面，还提供了一种制备OLED显示基板的方法，如图5所示，其包括步骤S1至S4：
步骤S1：在基底10上形成包括多个OLED发光器件的OLED器件层；
步骤S2：在所述多个OLED发光器件远离基底的一侧形成封装层80；
步骤S3：在所述封装层80远离基底一侧形成包括多个开口的黑矩阵层60，所述多个开口包括多个工作开口601和至少一个公共开口602；以及
步骤S4：在所述黑矩阵层60远离基底一侧形成彩膜层，使得彩膜层包括多个彩膜，所述多个彩膜包括设置在所述多个开口的远离所述基底一侧且与所述多个OLED器件对置的多个彩膜，以及所述至少一个公共开口中的一个公共开口在所述基底上的正投影的面积为所述多个工作开口中的任意一个在所述基底上的正投影的面积的50 倍以上。
具体地，在基底上形成包括多个OLED发光器件的OLED器件层包括：在基底10上形成所述多个OLED发光器件的多个分立的阳极30；形成像素限定层20，所述像素限定层20包括多个用以限定出多个子像素区域的多个像素限定开口并且通过多个像素限定开口暴露出多个分立的阳极30；在像素限定层的多个像素限定开口中形成多个发光层40，以使得多个发光层的每个发光层覆盖一个子像素区域；以及在所述多个发光层40上形成公共的阴极层50。
在一个实施例中，在封装层80上形成限定出多个开口的黑矩阵层60，使得所述多个开口包括多个工作开口和至少一个公共开口，以及所述公共开口在所述基底上的正投影的面积至少为所述多个工作开口中的任意一个在所述基底上的正投影的面积的50倍；以及在95度以下在所述多个开口中沉积亚克力材料以分别形成多个彩膜，其中在所述公共开口中形成公共彩膜。
例如，在95度以下在所述多个工作开口和所述至少一个公共开口中分别形成多个工作彩膜和至少一个公共彩膜74，使得所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影，以及所述至少一个公共彩膜在所述基底上的正投影分别覆盖所述至少一个公共开口在所述基底上的正投影，如图1和图2所示。
另外，还可以在95度以下在所述多个工作开口和所述至少一个公共开口中分别形成多个工作彩膜和多个公共彩膜，使得所述多个工作彩膜和所述多个公共彩膜与所述多个OLED器件一一对应设置，所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影；以及所述多个公共彩膜在所述基底上的正投影覆盖所述至少一个公共开口在所述基底上的正投影，以及所述至少一个公共开口中的每个公共开口中设置有至少两个公共彩膜，如图3和图4所示。
例如，在封装层80上形成限定多个开口的黑矩阵层可以包括在封装层80上形成整层的黑矩阵材料，然后在整层的黑矩阵材料上涂 覆光刻胶、前烘、利用与限定多个开口的黑矩阵层的图案相对应的掩膜板对光刻胶进行曝光和显影、烘烤形成光刻胶图案，然后再通过光刻胶图案对整层的黑矩阵材料进行蚀刻形成限定出多个开口的黑矩阵层。
形成了包括多个开口的黑矩阵层后，依次在对应的开口中分别形成红色彩膜、绿色彩膜、蓝色彩膜和公共彩膜，形成红色彩膜、绿色彩膜、蓝色彩膜和公共彩膜的顺序不限于此。如上所述，在公共彩膜的颜色与红色彩膜、绿色彩膜和蓝色彩膜中的一种颜色相同时，可以同时形成颜色相同的彩膜。本申请对此不进行限定。
如上所述，为了在熄屏状态下各个区域的色相保持一致，根据要形成的彩膜的厚度来调整形成上述多种颜色的彩膜的工艺参数。
根据本公开的另一个方面，还提供了一种OLED显示装置，其包括上述OLED显示基板和置于所述OLED显示基板的基底的远离所述彩膜层一侧的摄像头90，其中，所述摄像头90在所述基底10上的正投影处于所述OLED显示基板的所述彩膜层中的公共彩膜74在所述基底10上的正投影范围内。
所述OLED显示装置可以为电视、手机、显示屏、电脑、平板电脑、掌上终端等具有显示功能的电子设备。
以上针对本公开进行了描述，但是本公开不限于此，本领域技术人员可以根据本公开的构思对上述实施例进行各种变型，这些变型也应当在本申请的保护范围内。

Claims (20)

  1. 一种OLED显示基板，包括：
    基底；
    OLED器件层，其设置在所述基底上并且包括多个OLED发光器件；
    封装层，其设置在所述多个OLED发光器件远离基底的一侧；
    布置在所述封装层远离基底一侧的黑矩阵层，其中，黑矩阵层包括多个开口，所述多个开口包括多个工作开口和至少一个公共开口；以及
    布置在所述黑矩阵层远离基底一侧的彩膜层，彩膜层包括设置在所述多个开口的远离所述基底一侧且与所述多个OLED器件对置的多个彩膜，其中
    所述至少一个公共开口中的每个公共开口在所述基底上的正投影的面积为所述多个工作开口中的任意一个在所述基底上的正投影的面积的50倍以上。
  2. 根据权利要求1所述的OLED显示基板，其中，所述多个彩膜包括多个工作彩膜和至少一个公共彩膜，以及
    所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影，以及所述至少一个公共彩膜在所述基底上的正投影分别覆盖所述至少一个公共开口在所述基底上的正投影。
  3. 根据权利要求2所述的OLED显示基板，其中，
    所述至少一个公共彩膜中的每个公共彩膜在所述基底上的正投影的面积为所述多个工作彩膜中的任意一个在所述基底上的正投影的面积的100倍以上。
  4. 根据权利要求2或3所述的OLED显示基板，其中，
    所述公共彩膜在所述基底上的正投影的形状为圆形、矩形或多边形。
  5. 根据权利要求4所述的OLED显示基板，其中，
    所述公共彩膜在所述基底上的正投影的直径不超过10mm。
  6. 根据权利要求2至5中任意一项所述的OLED显示基板，其中，
    所述至少一个公共彩膜中的每个公共彩膜的光透过率小于所述多个工作彩膜中的任意一个的光透过率。
  7. 根据权利要求2至6中任意一项所述的OLED显示基板，其中，所述公共彩膜的材料为亚克力系材料。
  8. 根据权利要求2至7中任意一项所述的OLED显示基板，其中，所述多个工作彩膜包括多种颜色的彩膜，以及所述多个工作彩膜中的每个工作彩膜均与所述OLED器件层中的对应一个OLED发光器件对置，以对该OLED发光器件发出的光进行滤光以用于进行显示。
  9. 根据权利要求8所述的OLED显示基板，其中，所述至少一个公共彩膜位于所述多个工作彩膜之间。
  10. 根据权利要求8所述的OLED显示基板，其中，所述至少一个公共彩膜与所述多个工作彩膜的一个工作彩膜具有相同材料并且具有相同的颜色，以及该公共彩膜的厚度大于该工作彩膜的厚度。
  11. 根据权利要求8所述的OLED显示基板，其中，所述至少一个公共彩膜与所述多个工作彩膜的一个工作彩膜具有相同的厚度，以及该公共彩膜的光透过率小于该工作彩膜的光透过率。
  12. 根据权利要求1所述的OLED显示基板，其中，
    所述多个彩膜包括多个工作彩膜和多个公共彩膜；
    所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影；以及
    所述多个公共彩膜在所述基底上的正投影覆盖所述至少一个公共开口在所述基底上的正投影，以及所述至少一个公共开口中的每个公共开口中设置有至少两个公共彩膜。
  13. 根据权利要求12所述的OLED显示基板，其中，
    所述多个工作彩膜和所述多个公共彩膜与所述多个OLED器件一一对应设置，以及
    所述多个公共彩膜与所述多个工作彩膜均包括相同的多种颜色的彩膜，并且同种颜色的公共彩膜和工作彩膜材料相同。
  14. 根据权利要求12或13所述的OLED显示基板，其中，所述至少一个公共开口中的多个公共彩膜的光透过率小于所述多个工作彩膜的光透过率。
  15. 根据权利要求14所述的OLED显示基板，其中，所述多个公共彩膜中每个公共彩膜的厚度大于同种颜色的工作彩膜的厚度。
  16. 根据权利要求1至15中任意一项所述的OLED显示基板，其中，所述基底的材料为柔性材料，以及所述封装层的材料为透明材料。
  17. 一种制备OLED显示基板的方法，包括：
    在基底上形成包括多个OLED发光器件的OLED器件层；
    在所述多个OLED发光器件远离基底的一侧形成封装层；
    在所述封装层远离基底一侧形成包括多个开口的黑矩阵层使得 所述多个开口包括多个工作开口和至少一个公共开口；
    在所述黑矩阵层远离基底一侧形成彩膜层，使得彩膜层包括多个彩膜，所述多个彩膜包括设置在所述多个开口的远离所述基底一侧且与所述多个OLED器件对置的多个彩膜，以及所述至少一个公共开口中的一个公共开口在所述基底上的正投影的面积为所述多个工作开口中的任意一个在所述基底上的正投影的面积的50倍以上。
  18. 根据权利要求17所述的方法，其中，在所述黑矩阵层远离基底一侧形成彩膜层包括：
    在95度以下在所述多个工作开口和所述至少一个公共开口中分别形成多个工作彩膜和至少一个公共彩膜，使得所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影，以及所述至少一个公共彩膜在所述基底上的正投影分别覆盖所述至少一个公共开口在所述基底上的正投影。
  19. 根据权利要求17所述的方法，其中，在所述黑矩阵层远离基底一侧形成彩膜层包括：
    在95度以下在所述多个工作开口和所述至少一个公共开口中分别形成多个工作彩膜和多个公共彩膜，使得所述多个工作彩膜和所述多个公共彩膜与所述多个OLED器件一一对应设置，所述多个工作彩膜在所述基底上的正投影分别覆盖所述多个工作开口在所述基底上的正投影；以及所述多个公共彩膜在所述基底上的正投影覆盖所述至少一个公共开口在所述基底上的正投影，以及所述至少一个公共开口中的每个公共开口中设置有至少两个公共彩膜。
  20. 一种OLED显示装置，包括权利要求1至16中任意一项所述的OLED显示基板和置于所述OLED显示基板的基底的远离所述彩膜层一侧的至少一个摄像头，其中，所述至少一个摄像头在所述基底上的正投影分别处于所述OLED显示基板的所述彩膜层中的至少一个公共彩膜在所述基底上的正投影范围内。
PCT/CN2021/093795 2020-05-15 2021-05-14 Oled显示基板及其制备方法、oled显示装置 WO2021228219A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/642,259 US20220320183A1 (en) 2020-05-15 2021-05-14 Oled display substrate, method of manufacturing the same and oled display apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010413640.0A CN111554829B (zh) 2020-05-15 2020-05-15 Oled显示基板及其制备方法、oled显示装置
CN202010413640.0 2020-05-15

Publications (1)

Publication Number Publication Date
WO2021228219A1 true WO2021228219A1 (zh) 2021-11-18

Family

ID=72006510

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/093795 WO2021228219A1 (zh) 2020-05-15 2021-05-14 Oled显示基板及其制备方法、oled显示装置

Country Status (3)

Country Link
US (1) US20220320183A1 (zh)
CN (1) CN111554829B (zh)
WO (1) WO2021228219A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220149135A1 (en) * 2020-11-11 2022-05-12 Samsung Display Co., Ltd. Display panel and electronic apparatus including the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111554829B (zh) * 2020-05-15 2023-04-07 京东方科技集团股份有限公司 Oled显示基板及其制备方法、oled显示装置
CN111833809B (zh) * 2020-07-17 2022-06-17 云谷（固安）科技有限公司 显示屏控制方法和装置
CN111882995B (zh) 2020-08-31 2022-03-29 武汉天马微电子有限公司 显示面板及显示装置
CN113113454B (zh) * 2021-03-26 2024-06-14 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN113078202B (zh) * 2021-03-30 2022-10-28 京东方科技集团股份有限公司 一种彩膜结构、显示基板及显示装置
CN113985645A (zh) * 2021-11-15 2022-01-28 武汉华星光电技术有限公司 显示装置以及车载监控装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080042136A1 (en) * 2006-08-16 2008-02-21 Au Optronics Corporation Pixel Unit Structure of Self-Illumination Display with Low-Reflection
CN109411519A (zh) * 2018-10-23 2019-03-01 云谷（固安）科技有限公司 显示面板及其制备方法、显示装置
CN110838262A (zh) * 2019-11-15 2020-02-25 Oppo广东移动通信有限公司 盖板组件、盖板组件的制备方法及电子设备
CN110933888A (zh) * 2019-12-16 2020-03-27 Oppo广东移动通信有限公司 壳体组件、壳体组件的制备方法及电子设备
CN111081741A (zh) * 2019-12-06 2020-04-28 武汉华星光电半导体显示技术有限公司 显示装置
CN111554829A (zh) * 2020-05-15 2020-08-18 京东方科技集团股份有限公司 Oled显示基板及其制备方法、oled显示装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081752B (zh) * 2020-01-06 2023-01-10 京东方科技集团股份有限公司 显示面板和显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080042136A1 (en) * 2006-08-16 2008-02-21 Au Optronics Corporation Pixel Unit Structure of Self-Illumination Display with Low-Reflection
CN109411519A (zh) * 2018-10-23 2019-03-01 云谷（固安）科技有限公司 显示面板及其制备方法、显示装置
CN110838262A (zh) * 2019-11-15 2020-02-25 Oppo广东移动通信有限公司 盖板组件、盖板组件的制备方法及电子设备
CN111081741A (zh) * 2019-12-06 2020-04-28 武汉华星光电半导体显示技术有限公司 显示装置
CN110933888A (zh) * 2019-12-16 2020-03-27 Oppo广东移动通信有限公司 壳体组件、壳体组件的制备方法及电子设备
CN111554829A (zh) * 2020-05-15 2020-08-18 京东方科技集团股份有限公司 Oled显示基板及其制备方法、oled显示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220149135A1 (en) * 2020-11-11 2022-05-12 Samsung Display Co., Ltd. Display panel and electronic apparatus including the same

Also Published As

Publication number Publication date
CN111554829A (zh) 2020-08-18
US20220320183A1 (en) 2022-10-06
CN111554829B (zh) 2023-04-07

Similar Documents

Publication Publication Date Title
WO2021228219A1 (zh) Oled显示基板及其制备方法、oled显示装置
WO2021254315A1 (zh) 显示基板及显示装置
CN104465714B (zh) 一种像素结构及其显示方法、显示装置
US20220415981A1 (en) Array substrate and manufacturing method thereof, display panel and display device
CN103700688B (zh) 彩膜基板及其制作方法、显示装置
WO2019019604A1 (zh) 显示基板、显示装置及其显示方法、掩模板
WO2021179859A1 (zh) 显示面板及显示装置
CN102577610B (zh) 有机电致发光显示装置
CN110277434B (zh) 一种有机电致发光显示面板及显示装置
US11171180B2 (en) Array substrate, display device, and driving method thereof
CN111969024B (zh) Oled显示面板、显示装置及显示面板制备方法
US20220190073A1 (en) Display panel and display apparatus
US20160358983A1 (en) Organic light emitting diode (oled) array substrate and fabricating method thereof, display device
CN115942822B (zh) 显示面板及显示装置
US20210294007A1 (en) Color film substrate, manufacturing method of the same, display panel and display device
CN110400888B (zh) 用于oled的彩膜基板及其制备方法和oled显示装置
WO2020094068A1 (zh) 彩膜基板及其制备方法、显示器件
US20230165098A1 (en) Display substrate, manufacturing method thereof and three-dimensional display apparatus
WO2023232106A1 (zh) 阵列基板及其制备方法、显示面板、显示装置
EP4170721A1 (en) Display panel and manufacturing method therefor
US11315982B2 (en) Light emitting diode with a patterned scattering layer and fabrication method thereof, display substrate and display panel
CN218004907U (zh) 电致发光显示面板及显示装置
WO2019109682A1 (zh) 阵列基板、其制作方法及显示装置
CN113594386B (zh) 显示面板和显示装置
US20240057458A1 (en) Display panel, display device and manufacturing method for display panel

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21803534

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21803534

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205 DATED 23/06/2023)

122 Ep: pct application non-entry in european phase

Ref document number: 21803534

Country of ref document: EP

Kind code of ref document: A1