WO2021223256A1 - 柔性电路板工装结构 - Google Patents

柔性电路板工装结构 Download PDF

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Publication number
WO2021223256A1
WO2021223256A1 PCT/CN2020/090300 CN2020090300W WO2021223256A1 WO 2021223256 A1 WO2021223256 A1 WO 2021223256A1 CN 2020090300 W CN2020090300 W CN 2020090300W WO 2021223256 A1 WO2021223256 A1 WO 2021223256A1
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WO
WIPO (PCT)
Prior art keywords
flexible circuit
circuit board
copper
copper plate
tooling structure
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Application number
PCT/CN2020/090300
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English (en)
French (fr)
Inventor
马长进
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2021223256A1 publication Critical patent/WO2021223256A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding

Definitions

  • the invention relates to the technical field of flexible circuit board tooling, in particular to a flexible circuit board tooling structure.
  • the related art flexible circuit board tooling system generally includes a flexible circuit board and a copper plate.
  • the flexible circuit board includes a board body and is attached and fixed to the reinforcing layer and pads, the copper disk is used to support the flexible circuit board, and the copper disk is provided with an inwardly recessed avoidance groove, the avoidance groove It is used for accommodating the compensation layer when the board body is supported on the copper plate, so that the board body can be stably supported on the copper plate.
  • the reinforcement of the flexible circuit board in the related art generally includes two reinforcement layers respectively attached to the opposite sides of the board body, and the pad includes a plurality of pads, and generally has one pad. Sandwiched between the reinforcing layers on two different sides.
  • the pad is generally used as a HOTBAR tin plate.
  • the stencil opening of HOTBAR and the copper plate cannot be closely attached to each other when tinning. The excessive drop of tin will affect the quality and yield of subsequent HOTBAR spot welding.
  • the purpose of the present invention is to overcome the above technical problems and provide a flexible circuit board tooling structure with good quality, high reliability and high yield.
  • the present invention provides a flexible circuit board tooling structure, which includes a flexible circuit board and a copper plate for the flexible circuit board tooling.
  • the reinforcing layer and the pad of the flexible circuit board body, the reinforcing layer includes a plurality of, at least two of the reinforcing layers are respectively attached and fixed to opposite sides of the flexible circuit board body, the copper plate It includes a copper disk support surface close to the side of the flexible circuit board body, a recessed groove formed by the copper disk support surface in a direction away from the flexible circuit board for accommodating the reinforcing layer, and the copper plate
  • the disk support is formed to be convex in the direction of the flexible circuit board and used to support the copper disk pad of the flexible circuit board body.
  • the pad is formed by the The orthographic projection of the flexible circuit board body toward the raised portion of the copper plate completely falls on the raised portion of the copper plate.
  • the reinforcing layer is provided with a vent hole penetrating the reinforcing layer, and the vent hole is arranged in a staggered manner with the raised portion of the copper disk.
  • the exhaust holes include a plurality of and are arranged at intervals.
  • a plurality of the vent holes are arranged at intervals in the middle position of the reinforcing layer.
  • the orthographic projection of the raised portion of the copper disk from the flexible circuit board toward the support surface of the copper disk at least partially falls on the support surface of the copper disk.
  • the orthographic projection of the raised portion of the copper disk from the flexible circuit board toward the support surface of the copper disk completely falls on the support surface of the copper disk.
  • the raised portion of the copper disk is projected by the flexible circuit board toward the support surface of the copper disk at the same time on the support surface of the copper disk and the escape groove.
  • the pads include a plurality of pads
  • the copper pads include a plurality of pads
  • each of the pads is directly opposite to a corresponding copper pad pad.
  • the flexible circuit board includes a plurality of flexible circuit boards, which are arranged at intervals and arranged in multiple rows and multiple columns; The extending direction extends.
  • the orthographic projection of the reinforcing layer from the flexible circuit board toward the supporting surface of the copper plate completely falls within the avoiding groove, and the periphery of the projection and the periphery of the avoiding groove have at least part Distance interval.
  • the flexible circuit board tooling structure of the present invention accommodates the reinforcing layer through the avoiding groove, and raises the flexible circuit board body through the raised part of the copper plate directly opposite to the pad, so that the flexible circuit board body is raised separately.
  • the height difference caused by the different reinforcement layers fixed on the opposite sides of the flexible circuit board body makes the stencil opening of HOTBAR and the copper plate fit as closely as possible to ensure the normal drop of tin and improve the follow-up HOTBAR The quality of spot welding, so that the flexible circuit board tooling has good quality, high reliability and high yield.
  • FIG. 1 is a schematic diagram of the structure of the flexible circuit board tooling structure of the present invention
  • FIG. 2 is a schematic diagram of the structure of the copper plate of the flexible circuit board tooling structure of the present invention.
  • FIG. 3 is a schematic diagram of the structure of the flexible circuit board of the flexible circuit board tooling structure of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the reinforcing layer of the flexible circuit board tooling structure of the present invention.
  • FIG. 5 is a schematic diagram of the tooling structure of the flexible circuit board tooling structure of the present invention.
  • FIG. 6 is a schematic diagram of the layout structure of the flexible circuit board tooling structure of the present invention during tooling.
  • the flexible circuit board tooling structure 100 includes a flexible circuit board 1 and a copper plate 2 used for the flexible circuit board 1 tooling.
  • the flexible circuit board 1 includes a flexible circuit board body 11, a reinforcing layer 12 and a bonding pad 13.
  • the flexible circuit board body 11 is a board body of a flexible circuit board.
  • the reinforcing layer 12 is attached and fixed to the flexible circuit board body 11.
  • the reinforcing layer 12 includes multiple ones. Wherein, at least two of the reinforcing layers 12 are respectively attached and fixed to the opposite sides of the flexible circuit board body 11.
  • the front side of the flexible circuit board body 11 is provided with an area for connector parts, and the back side of the flexible circuit board body 11 in this area is provided with a reinforcing layer 12, and the general material is FR4.
  • the backside of the flexible circuit board body 11 is provided with an area for inductive components, and the front side of the flexible circuit board body 11 in this area is provided with another reinforcing layer 12, which is generally made of FR4.
  • the reinforcing layer 12 is provided with an exhaust hole 120 penetrating therethrough.
  • the flexible circuit board body 11 on the back of the part is pasted with the reinforcing layer 12 of the vent 120 to enhance the support, which can not only avoid the abnormal solder joints of the parts due to the deformation of the flexible circuit board 1, but also reduce Air bubbles generated during the pressing process. Therefore, the reliability of the flexible circuit board 1 is effectively improved.
  • the exhaust holes 120 include a plurality and are arranged at intervals.
  • a plurality of the vent holes 120 are arranged at intervals in the middle position of the reinforcing layer 12. This structure is beneficial for the air in the middle area of the reinforcing layer 12 to be exhausted through the exhaust hole 120, which can effectively avoid the problem of bubbles easily generated in the middle area of the reinforcing layer 12, and improve the performance of the flexible circuit board 1. Quality and reliability.
  • the pad 13 is attached and fixed to the flexible circuit board body 11.
  • the pad 13 includes a plurality of.
  • the pads 13 include two, and one of the pads 13 is sandwiched between the two reinforcing layers 12 respectively provided on opposite sides of the flexible circuit board body 11 .
  • the pad 13 is used for brushing tin on the HOTBAR tin plate.
  • the copper plate 2 includes a copper plate supporting surface 21, an escape groove 20 and a copper plate bumper 22.
  • the copper disk supporting surface 21 is close to the side of the flexible circuit board body 11.
  • the avoiding groove 20 is formed by recessing the copper disk supporting surface 21 in a direction away from the flexible circuit board 1.
  • the avoidance groove 20 is used for receiving the reinforcing layer 12.
  • the reinforcing layer 12 is projected from the flexible circuit board 1 toward the copper disk support surface 21 completely within the avoiding groove 20, and the periphery of the projection is aligned with the avoiding groove 20.
  • the periphery has an interval of at least part of the distance.
  • the avoidance groove 20 is larger in volume than the reinforcing layer 12 and has redundancy, so that it is easier to operate during tooling and also increase reliability.
  • the length of the reinforcing layer 12 is d1
  • the width of the avoiding groove 20 is d2, d2>d1.
  • the copper disk pad 22 is formed by the copper disk supporting surface 21 protruding toward the flexible circuit board 1.
  • the copper plate bumper 22 is used to support the flexible circuit board body 11.
  • the flexible circuit board 1 When the flexible circuit board 1 is assembled on the copper plate 2, the orthographic projection of the pad 13 from the flexible circuit board body 11 toward the copper plate raised portion 22 completely falls on the copper plate pad High part 22. That is, the pad 13 is directly opposite to the raised portion 22 of the copper plate.
  • the flexible circuit board body 11 is raised by the copper plate raised portion 22 directly opposite to the pad 13, so that the two opposite sides of the flexible circuit board body 11 are attached and fixed respectively.
  • the difference in height caused by the different reinforcing layers 12 makes the stencil opening of HOTBAR and the copper plate 2 fit together as closely as possible to ensure the normal amount of tin drop and improve subsequent HOTBAR spot welding Therefore, the flexible circuit board 1 has good tooling quality, high reliability and high yield.
  • the copper disc pad 22 and the exhaust hole 120 are arranged in a staggered manner. This setting is beneficial to improve the reliability of the reinforcing layer 120.
  • the copper plate bumper 22 is positive from the flexible circuit board 1 in the direction of the copper disk support surface 21 The projection at least partially falls on the supporting surface 21 of the copper plate. That is to say, the arrangement of the copper pad raised portion 22 protruding and extending toward the flexible circuit board 1 should completely directly face the bonding pad 13. The following are divided into two settings:
  • the other is: the orthographic projection of the copper disk pad 22 from the flexible circuit board 1 toward the copper disk support surface 21 falls on the copper disk support surface 21 and the escape groove 20 respectively.
  • the copper pad raised portion 22 includes a plurality, and each of the pads 13 is directly opposite to a corresponding copper pad raised portion 22.
  • This structure is conducive to the copper plate raised portion 22 corresponding to the pad 13, and the flexible circuit board body 11 is raised to a plane, so that the stencil opening of the HOTBAR is as close as the copper plate 2 It may be closely attached together, so that the flexible circuit board 1 has good tooling quality, high reliability and high yield.
  • the flexible circuit board 1 is tooled through typesetting, which is beneficial to improve production efficiency.
  • the flexible circuit board 1 includes multiple ones.
  • the multiple flexible circuit boards 1 are spaced apart from each other and arranged in multiple rows and multiple columns.
  • the avoiding groove 20 and the copper plate padding portion 22 are respectively formed to extend along the extending direction of the corresponding row.
  • the flexible circuit board tooling structure of the present invention accommodates the reinforcing layer through the avoiding groove, and raises the flexible circuit board body through the raised part of the copper plate directly opposite to the pad, so that the flexible circuit board body is raised separately.
  • the height difference caused by the different reinforcement layers fixed on the opposite sides of the flexible circuit board body makes the stencil opening of HOTBAR and the copper plate fit as closely as possible to ensure the normal drop of tin and improve the follow-up HOTBAR The quality of spot welding, so that the flexible circuit board tooling has good quality, high reliability and high yield.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明公开一种柔性电路板工装结构，其包括柔性电路板和用于柔性电路板工装的铜盘，柔性电路板包括柔性电路板本体以及贴合固定于柔性电路板本体的补强层和焊盘，补强层包括多个，至少两个补强层分别贴合固定于柔性电路板本体的相对两侧，铜盘包括靠近柔性电路板本体一侧的铜盘支撑面、由铜盘支撑面向远离柔性电路板的方向凹陷且用于收容补强层的避让槽以及由铜盘支撑面向柔性电路板的方向凸起形成且用于支撑柔性电路板本体的铜盘垫高部，柔性电路板装配于所述铜盘时，焊盘由柔性电路板本体向铜盘垫高部的方向的正投影完全落在铜盘垫高部。与相关技术相比，本发明的柔性电路板工装结构的柔性电路板工装品质好、可靠性高且良率高。

Description

柔性电路板工装结构 技术领域
本发明涉及柔性电路板工装技术领域，尤其涉及一种柔性电路板工装结构。
 背景技术
随着柔性电路板的产品应用越来越多。一般柔性电路板的制作中，印刷锡膏的产品，锡膏印刷品质会影响到后续的铺锡和焊接效果。柔性电路板工装设计对后续的印刷锡膏的品质与产品的形态具有重要作用。
相关技术的柔性电路板工装***一般包括柔性电路板和铜盘。所述柔性电路板包括板体和贴合固定于补强层和焊盘，所述铜盘用于支撑所述柔性电路板，所述铜盘设有向内凹陷的避让槽，所述避让槽用于当所述板体支撑于所述铜板时***述补偿层，从而使所述板体可以稳固支撑于所述铜盘。
 技术问题
然而，相关技术的所述柔性电路板的补强一般包括分别贴合于所述板体相对两侧的两个所述补强层，所述焊盘包括多个，一般具有一个所述焊盘夹在两个不同面的所述补强层之间。所述焊盘一般用于作HOTBAR锡盘。工装时，因为所述焊盘边缘距离所述补强层的边缘较近，工装的避位范围受到限制，刷锡时HOTBAR的钢网开口与所述铜盘不能紧密的贴合在一起，存在锡量下落过多的现象，会影响后续HOTBAR点焊的品质和良率。另外，工装时，当所述补强层的尺寸较大时，所述补强层在压合固化的过程中，中间位置因排气效果不佳容易产生气泡问题，造成爆板的品质不良。
因此，实有必要提供一种新的工装***解决上述技术问题。
 技术解决方案
本发明的目的是克服上述技术问题，提供一种柔性电路板工装品质好、可靠性高且良率高的柔性电路板工装结构。
为了实现上述目的，本发明提供一种柔性电路板工装结构，其包括柔性电路板和用于所述柔性电路板工装的铜盘，所述柔性电路板包括柔性电路板本体以及贴合固定于所述柔性电路板本体的补强层和焊盘，所述补强层包括多个，至少两个所述补强层分别贴合固定于所述柔性电路板本体的相对两侧，所述铜盘包括靠近所述柔性电路板本体一侧的铜盘支撑面、由所述铜盘支撑面向远离所述柔性电路板的方向凹陷形成的用于***述补强层的避让槽以及由所述铜盘支撑面向所述柔性电路板的方向凸起形成且用于支撑所述柔性电路板本体的铜盘垫高部，所述柔性电路板装配于所述铜盘时，所述焊盘由所述柔性电路板本体向所述铜盘垫高部的方向的正投影完全落在所述铜盘垫高部。
优选的，所述补强层设有贯穿其上的排气孔，所述排气孔与所述铜盘垫高部错位设置。
优选的，所述排气孔包括多个且相互间隔设置。
优选的，多个所述排气孔间隔设置于所述补强层的中间位置。
优选的，所述铜盘垫高部由所述柔性电路板向所述铜盘支撑面的方向的正投影至少部分落在所述铜盘支撑面。
优选的，所述铜盘垫高部由所述柔性电路板向所述铜盘支撑面的方向的正投影完全落在所述铜盘支撑面。
优选的，所述铜盘垫高部由所述柔性电路板向所述铜盘支撑面的方向的正投影同时落在所述铜盘支撑面和所述避让槽。
优选的，所述焊盘包括多个，所述铜盘垫高部包括多个，每一所述所述焊盘正对一个对应的所述铜盘垫高部。
优选的，所述柔性电路板包括多个，多个所述柔性电路板相互间隔设置且呈多行多列排布排版；所述避让槽和所述铜盘垫高部分别沿其对应行的延伸方向延伸形成。
优选的，所述补强层由所述柔性电路板向所述铜盘支撑面的方向的正投影完全落在与所述避让槽内，该投影的周缘与所述避让槽的周缘具有至少部分距离的间隔。
 有益效果
与现有技术相比，本发明的柔性电路板工装结构通过避让槽将补强层收容于其中，并通过焊盘正对的铜盘垫高部将柔性电路板本体垫高，从而使分别贴合固定于柔性电路板本体的相对两侧的不同补强层造成的的高低差，让HOTBAR的钢网开口与铜盘尽可能紧密的贴合在一起，保证正常的落锡量，提高后续HOTBAR点焊的品质，从而使柔性电路板工装品质好、可靠性高且良率高。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明的柔性电路板工装结构的结构示意图；
图2为本发明的柔性电路板工装结构的铜盘的结构示意图；
图3为本发明的柔性电路板工装结构的柔性电路板的结构示意图；
图4为本发明的柔性电路板工装结构的补强层的结构示意图；
图5为本发明的柔性电路板工装结构的工装结构示意图；
图6为本发明的柔性电路板工装结构的工装时排版结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1-6所示，本发明提供的一种柔性电路板工装结构100。所述柔性电路板工装结构100包括柔性电路板1和用于所述柔性电路板1工装的铜盘2。
所述柔性电路板1包括柔性电路板本体11、补强层12及焊盘13。
本实施方方式中，所述柔性电路板本体11为柔性电路板的板体。
所述补强层12贴合固定于所述柔性电路板本体11。
所述补强层12包括多个。其中，至少两个所述补强层12分别贴合固定于所述柔性电路板本体11的相对两侧。本实施方方式中，所述柔性电路板本体11的正面设置连接器零件的区域，该区域的所述柔性电路板本体11的背面设置一个所述补强层12，一般材料为FR4。而所述柔性电路板本体11的背面设置电感零件的区域，该区域的所述柔性电路板本体11的正面设置另一个所述补强层12，一般材料为FR4。
本实施方方式中，所述补强层12设有贯穿其上的排气孔120。零件背面所述柔性电路板本体11上贴加上所述排气孔120的所述补强层12来增强支撑，既能避免因所述柔性电路板1变形造成零件焊点异常，也能减少压合过程中产生的气泡。从而有效提高所述柔性电路板1的可靠性。
更优的，所述排气孔120包括多个且相互间隔设置。多个所述排气孔120间隔设置于所述补强层12的中间位置。该结构有利于所述补强层12中间区域的空气可以通过所述排气孔120排出，可以有效地避免所述补强层12中间区域容易产生气泡的问题，提升所述柔性电路板1的品质和可靠性。
所述焊盘13贴合固定于所述柔性电路板本体11。所述焊盘13包括多个。本实施方方式中，所述焊盘13包括两个，其中一个所述焊盘13夹设于分别设置于所述柔性电路板本体11的相对两侧的两个所述补强层12之间。所述焊盘13用于HOTBAR锡盘刷锡。
所述铜盘2包括铜盘支撑面21、避让槽20及铜盘垫高部22。
所述铜盘支撑面21靠近所述柔性电路板本体11一侧。
所述避让槽20由所述铜盘支撑面21向远离所述柔性电路板1的方向凹陷形成。所述避让槽20用于***述补强层12。其中，所述补强层12由所述柔性电路板1向所述铜盘支撑面21的方向的正投影完全落在与所述避让槽20内，该投影的周缘与所述避让槽20的周缘具有至少部分距离的间隔。该结构为所述避让槽20体积比所述补强层12大且具有冗余，从而使工装时更易于操作，也增加可靠性。其中，所述补强层12的长度为d1, 所述避让槽20的槽宽为d2，d2>d1。
所述铜盘垫高部22由所述铜盘支撑面21向所述柔性电路板1的方向凸起形成。所述铜盘垫高部22用于支撑所述柔性电路板本体11。
所述柔性电路板1装配于所述铜盘2时，所述焊盘13由所述柔性电路板本体11向所述铜盘垫高部22的方向的正投影完全落在所述铜盘垫高部22。也就是所述焊盘13与所述铜盘垫高部22正对。该结构通过所述焊盘13正对的所述铜盘垫高部22将所述柔性电路板本体11垫高，从而使分别贴合固定于所述柔性电路板本体11的相对两侧的两个不同的所述补强层12造成的的高低差的影响，让HOTBAR的钢网开口与所述铜盘2尽可能紧密的贴合在一起，保证正常的落锡量，提高后续HOTBAR点焊的品质，从而使所述柔性电路板1工装品质好、可靠性高且良率高。
本实施方式中，所述铜盘垫高部22与所述排气孔120错位设置。该设置有利于提高所述补强层120的可靠性。
为了个保证所述焊盘13的正投影完全落在所述铜盘垫高部22，所述铜盘垫高部22由所述柔性电路板1向所述铜盘支撑面21的方向的正投影至少部分落在所述铜盘支撑面21。也就是说，所述铜盘垫高部22向所述柔性电路板1凸出延伸的设置要完全将所述焊盘13正对。以下分两种设置情况：
一种为：所述铜盘垫高部22由所述柔性电路板1向所述铜盘支撑面21的方向的正投影完全落在所述铜盘支撑面21。
另外一种为：所述铜盘垫高部22由所述柔性电路板1向所述铜盘支撑面21的方向的正投影分别落在所述铜盘支撑面21和所述避让槽20。
以上两种情况都有助于所述铜盘垫高部22更好的正对所述焊盘13并有效支撑所述柔性电路板本体11并垫高。
在本实施方式中，所述铜盘垫高部22包括多个，每一所述所述焊盘13正对一个对应的所述铜盘垫高部22。该结构有利于所述铜盘垫高部22对应于所述焊盘13，并使所述柔性电路板本体11并垫高为一个平面，从而使HOTBAR的钢网开口与所述铜盘2尽可能紧密的贴合在一起，从而使所述柔性电路板1工装品质好、可靠性高且良率高。
为了提高效率，所述柔性电路板1通过排版进行工装，有利于提高生产效率。具体的，所述柔性电路板1包括多个。多个所述柔性电路板1相互间隔设置且呈多行多列排布排版。所述避让槽20和所述铜盘垫高部22分别沿其对应行的延伸方向延伸形成。
与现有技术相比，本发明的柔性电路板工装结构通过避让槽将补强层收容于其中，并通过焊盘正对的铜盘垫高部将柔性电路板本体垫高，从而使分别贴合固定于柔性电路板本体的相对两侧的不同补强层造成的的高低差，让HOTBAR的钢网开口与铜盘尽可能紧密的贴合在一起，保证正常的落锡量，提高后续HOTBAR点焊的品质，从而使柔性电路板工装品质好、可靠性高且良率高。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种柔性电路板工装结构，其包括柔性电路板和用于所述柔性电路板工装的铜盘，所述柔性电路板包括柔性电路板本体以及贴合固定于所述柔性电路板本体的补强层和焊盘，所述补强层包括多个，至少两个所述补强层分别贴合固定于所述柔性电路板本体的相对两侧，所述铜盘包括靠近所述柔性电路板本体一侧的铜盘支撑面和由所述铜盘支撑面向远离所述柔性电路板的方向凹陷形成的用于***述补强层的避让槽，其特征在于，所述铜盘还包括由所述铜盘支撑面向所述柔性电路板的方向凸起形成且用于支撑所述柔性电路板本体的铜盘垫高部，所述柔性电路板装配于所述铜盘时，所述焊盘由所述柔性电路板本体向所述铜盘垫高部的方向的正投影完全落在所述铜盘垫高部。
  2. 根据权利要求1所述的柔性电路板工装结构，其特征在于，所述补强层设有贯穿其上的排气孔，所述排气孔与所述铜盘垫高部错位设置。
  3. 根据权利要求2所述的柔性电路板工装结构，其特征在于，所述排气孔包括多个且相互间隔设置。
  4. 根据权利要求3所述的柔性电路板工装结构，其特征在于，多个所述排气孔间隔设置于所述补强层的中间位置。
  5. 根据权利要求1所述的柔性电路板工装结构，其特征在于，所述铜盘垫高部由所述柔性电路板向所述铜盘支撑面的方向的正投影至少部分落在所述铜盘支撑面。
  6. 根据权利要求5所述的柔性电路板工装结构，其特征在于，所述铜盘垫高部由所述柔性电路板向所述铜盘支撑面的方向的正投影完全落在所述铜盘支撑面。
  7. 根据权利要求5所述的柔性电路板工装结构，其特征在于，所述铜盘垫高部由所述柔性电路板向所述铜盘支撑面的方向的正投影同时落在所述铜盘支撑面和所述避让槽。
  8. 根据权利要求1所述的柔性电路板工装结构，其特征在于，所述焊盘包括多个，所述铜盘垫高部包括多个，每一所述所述焊盘正对一个对应的所述铜盘垫高部。
  9. 根据权利要求1所述的柔性电路板工装结构，其特征在于，所述柔性电路板包括多个，多个所述柔性电路板相互间隔设置且呈多行多列排布排版；所述避让槽和所述铜盘垫高部分别沿其对应行的延伸方向延伸形成。
  10. 根据权利要求1所述的柔性电路板工装结构，其特征在于，所述补强层由所述柔性电路板向所述铜盘支撑面的方向的正投影完全落在与所述避让槽内，该投影的周缘与所述避让槽的周缘具有至少部分距离的间隔。
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