WO2021184189A1 - 电路板结构、电子产品和电路板结构的制备方法 - Google Patents

电路板结构、电子产品和电路板结构的制备方法 Download PDF

Info

Publication number
WO2021184189A1
WO2021184189A1 PCT/CN2020/079642 CN2020079642W WO2021184189A1 WO 2021184189 A1 WO2021184189 A1 WO 2021184189A1 CN 2020079642 W CN2020079642 W CN 2020079642W WO 2021184189 A1 WO2021184189 A1 WO 2021184189A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
circuit board
board structure
rigid
rigid connector
Prior art date
Application number
PCT/CN2020/079642
Other languages
English (en)
French (fr)
Inventor
申中国
巨涛
胡正高
程功
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/079642 priority Critical patent/WO2021184189A1/zh
Priority to CN202080005225.XA priority patent/CN112753288A/zh
Publication of WO2021184189A1 publication Critical patent/WO2021184189A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections

Definitions

  • This application relates to the technical field of electronic products, in particular to a circuit board structure, an electronic product, and a method for manufacturing the circuit board structure.
  • the present application provides a circuit board structure, an electronic product, and a manufacturing method of the circuit board structure, aiming at reducing the size of the electronic product and miniaturizing the electronic product.
  • this application provides a circuit board structure, including:
  • At least two substrates At least two of the substrates are stacked in sequence, and electronic components are provided on each of the substrates;
  • a rigid connector which has conductivity, is electrically and mechanically connected to two adjacent substrates;
  • the rigid connecting member is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.
  • the present application provides an electronic product, including: a housing; the circuit board structure as described in any one of the above, arranged on the housing.
  • the present application provides a method for manufacturing a circuit board structure, the circuit board structure includes a first substrate, a second substrate and a rigid connector, and the manufacturing method includes: connecting the first electronic component to The first substrate; the second electronic component is connected to the second substrate; the first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate is connected to the second substrate.
  • the two substrates are stacked and arranged at intervals.
  • the embodiments of the application provide a circuit board structure, an electronic product, and a preparation method of the circuit board structure, and the board area of each electronic component is smaller than the sum of the area of each electronic component, which greatly reduces the board area of each electronic component , So as to achieve high-density integration of multiple electronic components in a limited space, leaving other space inside the electronic product for the battery or other electronic components of the electronic product, thereby reducing the size of the electronic product, which is beneficial to the electronics Product miniaturization.
  • FIG. 1 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application.
  • FIG. 6 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;
  • FIG. 7 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors
  • FIG. 8 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;
  • FIG. 9 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors
  • FIG. 10 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;
  • FIG. 11 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;
  • FIG. 12 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;
  • FIG. 13 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;
  • FIG. 14 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;
  • 15 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;
  • 16 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;
  • FIG. 17 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;
  • FIG. 18 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application.
  • Figure 19 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application.
  • 20 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application.
  • Figure 21 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application.
  • Figure 22 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application.
  • Figure 23 is a schematic diagram of the internal structure of a rigid connector provided by an embodiment of the present application.
  • FIG. 24 is a schematic flowchart of a method for manufacturing a circuit board structure provided by an embodiment of the present application.
  • Rigid connector 111, first connection part; 112, spacer part; 113, second connection part; 114, first electrical conductor; 115, insulator; 116, second electrical conductor; 117, cladding;
  • the first substrate 13. The second substrate; 14. Electronic components;
  • the inventor of this application found that in order to achieve high performance of electronic products such as drones, movable vehicles, mobile terminals, sports cameras, electronic toys, etc., the flight control main board of the drone, the main control board of the movable vehicle, and the In the terminal, a number of electronic components such as chips are usually integrated in the motherboards of products such as motherboards that carry system-on-chips (SOC). As the demand for "light, thin, short, and small" electronic products continues to increase, the space occupied by the product motherboard has also been further compressed. However, when there are multiple electronic components, the multiple electronic components are usually designed side by side, and the area occupied by each electronic component is the total area of the multiple electronic components.
  • SOC system-on-chips
  • the inventor of the present application has improved the structure of the circuit board to reduce the footprint of each electronic component, thereby reducing the size of the electronic product and miniaturizing the electronic product.
  • the present application provides a circuit board structure, including: at least two substrates, at least two of the substrates are stacked in sequence, and each of the substrates is provided with electronic components; a rigid connector, which has conductivity, and is electrically conductive It is connected and mechanically connected to two adjacent substrates; wherein at least part of the rigid connecting member is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.
  • the present application also provides an electronic product, including: a housing; the circuit board structure as described above is arranged on the housing.
  • the present application also provides a method for preparing a circuit board structure, the circuit board structure includes a first substrate, a second substrate, and a rigid connector, and the preparation method includes: connecting a first electronic component to the first substrate; The second electronic component is connected to the second substrate; the first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate and the second substrate are laminated and arranged at intervals.
  • the embodiment of the present application provides an electronic product
  • the electronic product includes a circuit board structure 10 and a housing
  • the circuit board structure 10 is disposed on the housing.
  • the electronic product may include at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle, a mobile terminal, and the like.
  • the mobile terminal may include at least one of a mobile phone, a tablet computer, and the like.
  • the circuit board structure 10 includes a rigid connector 11 and at least two substrates.
  • the at least two substrates are stacked in sequence, and each substrate is provided with an electronic component 14.
  • the rigid connector 11 has conductivity, and the rigid connector 11 is electrically and mechanically connected to two adjacent substrates. Wherein, at least part of the rigid connecting member 11 is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.
  • each electronic component 14 When the electronic components 14 are arranged on the same circuit board, the area occupied by each electronic component 14 is the sum of the area of each electronic component 14. In the circuit board structure 10 of the embodiment of the present application, since each electronic component 14 is separately provided on at least two substrates, and at least two substrates are stacked, the area occupied by each electronic component 14 is smaller than the sum of the area of each electronic component 14.
  • the battery or other electronic components of the electronic product further reduce the size of the electronic product, which is conducive to the miniaturization of the electronic product, and improves the battery life of the electronic product or enriches the functions of the electronic product.
  • the area occupied by each electronic component 14 refers to that when each electronic component 14 is projected onto the same substrate along the stacking direction of at least two substrates, each electronic component 14 is located there. The area occupied on the same substrate.
  • the circuit board structure 10 of the embodiment of the present application since at least two substrates are stacked and each substrate is provided with an electronic component 14, the electronic components 14 of different subsystems can be separately arranged on at least two substrates.
  • the number of layers and orders of the substrate is not restricted by the interconnection of a certain electronic component 14.
  • the circuit board structure 10 of the embodiment of the present application can reduce the cost of a certain part of the substrate.
  • a circuit board structure made by mechanically connecting and electrically connecting at least two substrates through a frame plate has a poor heat dissipation effect on the one hand, which is not conducive to the heat dissipation of electronic components, and ultimately leads to the performance of electronic products. Decrease; on the other hand, the frame plate is prone to warpage and deformation, which makes the process more difficult.
  • the embodiment of the present application is provided with a rigid connector 11 between two adjacent substrates. Specifically, two adjacent substrates are stacked and arranged at intervals by the rigid connecting member 11, and the rigid connecting member 11 can play a supporting role, so that the two adjacent substrates are separated by a certain distance to form a space for air flow, The circulation between the space and the outside is maintained.
  • the air in the space has good fluidity, and the air flowing in the space can exchange heat with the electronic component 14 and at least one of the two adjacent substrates, thereby It is convenient for the heat on the electronic component 14 to be dissipated, which improves the heat dissipation effect of the circuit board structure 10, and prevents the electronic product from affecting the performance of the electronic product due to local heating up too fast.
  • the rigid connector 11 has rigidity and is not prone to warping deformation, thereby reducing the difficulty of the processing technology of the circuit board structure 10.
  • the circuit board structure Due to the circuit board structure made by mechanically connecting and electrically connecting at least two substrates with solder paste, once the solder paste collapses, the circuit board structure is extremely prone to short-circuit problems; in addition, the height consistency of the solder paste is poor. For this reason, the embodiment of the present application realizes the spaced stacking arrangement of two adjacent substrates through the rigid connector 11. Because the rigid connector 11 has certain rigidity, the rigid connector 11 has good height consistency, is not easy to collapse, and is not easy to appear in the circuit. The board structure 10 is short-circuited.
  • the positioning of the rigid connector 11 is accurate, and the connection position of the rigid connector 11 and the substrate is different. It is easy to deviate or roll, which is beneficial to the assembly of the rigid connector 11 and the base plate and the improvement of processing efficiency.
  • the process is simple and the processing cost is low.
  • the number of substrates can be set according to actual requirements, for example, two, three, four, five or more.
  • the substrates are stacked in sequence, and a rigid connector 11 is provided between two adjacent substrates.
  • the number of rigid connectors 11 arranged between two adjacent substrates can be set according to actual requirements.
  • the number of rigid connectors 11 includes at least four.
  • the number of rigid connectors 11 disposed between two adjacent substrates includes at least four, for example, four, five, six, seven, eight or more.
  • each substrate can be designed according to actual needs.
  • the substrate can be made of epoxy resin, ceramic, or HDI (High Density Interconnect, HDI) epoxy fiberglass cloth.
  • HDI High Density Interconnect
  • the at least two substrates include a first substrate 12 and a second substrate 13.
  • the first substrate 12 is connected to one end of the rigid connector 11.
  • the second substrate 13 is connected to the other end of the rigid connector 11.
  • the second substrate 13 is spaced apart from the first substrate 12 by the rigid connector 11 to form a gap 15.
  • the gap 15 can be used for the flow of gas or air, and the communication between the gap 15 and the outside is maintained.
  • the air in the gap 15 has good fluidity, and the air flowing in the gap 15 can generate heat with the electronic components 14 located between the first substrate 12 and the second substrate 13 Exchange, the air flowing in the gap 15 can also exchange heat with the first substrate 12 and/or the second substrate 13, thereby accelerating the heat dissipation of the electronic components 14 on the first substrate 12 and/or the second substrate 13 , Improve the heat dissipation effect, avoid the electronic products from affecting the performance of the electronic products due to local heating up too fast.
  • the first substrate 12 and the second substrate 13 are opposed to each other.
  • the first substrate 12 has a front surface and a back surface opposite to the front surface.
  • the second substrate 13 has a first surface and a second surface. The first surface faces the back surface of the first substrate 12 and the second surface is opposite to the first surface.
  • Electronic components 14 are provided on the front and/or back of the first substrate 12.
  • Electronic components 14 are provided on the first surface and/or the second surface of the second substrate 13.
  • a first pad is provided on the back surface of the first substrate 12, a second pad corresponding to the first pad is provided on the first surface of the second substrate 13, and the first pad is connected to the first pad through the rigid connector 11
  • the two pads are electrically connected.
  • the rigid connecting member 11 can also play a role of structural support.
  • the number and types of electronic components 14 can be designed according to actual requirements, for example, they can include at least one of active electronic devices and passive electronic devices, which are not limited here.
  • each of the at least two substrates can be set according to actual requirements, as long as a partial overlap of the projected area between the at least two substrates is allowed.
  • the size and shape of the first substrate 12 and the second substrate 13 need not be exactly the same, as long as the projection of the first substrate 12 and the second substrate 13 on the first substrate 12 or the second substrate 13 in the direction in which they are stacked It is enough if the area overlaps partially.
  • both the first substrate 12 and the second substrate 13 can be connected to the rigid connector 11 by any suitable connection manner.
  • the rigid connector 11 is attached or inserted on the first substrate 12.
  • the rigid connector 11 is attached or inserted on the second substrate 13.
  • both the first substrate 12 and the second substrate 13 may be connected to the rigid connector 11 in a mounting manner.
  • both the first substrate 12 and the second substrate 13 can be connected to the rigid connector 11 in a plug-in manner.
  • one of the first substrate 12 and the second substrate 13 is connected to the rigid connector 11 in a plug-in manner, and the other of the first substrate 12 and the second substrate 13 One is connected to the rigid connector 11 by means of mounting.
  • the first substrate 12 is connected to the rigid connector 11 in a pasting manner
  • the second substrate 13 is connected to the rigid connector 11 in a plug-in manner.
  • the first substrate 12 is connected to the rigid connector 11 in a plug-in manner
  • the second substrate 13 is connected to the rigid connector 11 in a pasting manner.
  • part of the rigid connector 11 is inserted into the first substrate 12 and/or the second substrate 13. That is, a part of the rigid connector 11 is inserted into the first substrate 12 and/or the second substrate 13.
  • the rigid connector 11 extends along the stacking direction of the first substrate 12 and the second substrate 13, so that the rigid connector 11 can not only connect the first substrate 12 and the second substrate 13, but also connect the first substrate A gap 15 is formed between 12 and the second substrate 13 at a certain distance.
  • the number of the rigid connectors 11 provided between the first substrate 12 and the second substrate 13 includes at least four, for example, four, five, six, seven, eight or more.
  • At least four rigid connectors 11 are arranged at intervals.
  • each rigid connecting member 11 is arranged at intervals, or two adjacent rigid connecting members 11 are arranged at intervals, so that an interval space for air flow is formed between the connecting pieces, and the interval space can be
  • the supply of air or gas ensures the communication between the space and the outside, which is beneficial to speed up at least one of the first substrate 12, the second substrate 13, or the electronic components 14 on the first substrate 12 and the second substrate 13 Heat dissipation, improve the heat dissipation effect, avoid local heating up of electronic products too fast, and provide a guarantee for the normal performance of electronic products.
  • At least four rigid connectors 11 are arranged in a preset arrangement rule. Specifically, at least four rigid connectors 11 are arranged on the first substrate 12 in a preset arrangement rule. Alternatively, at least four rigid connectors 11 are arranged on the second substrate 13 according to a preset arrangement rule.
  • a preset arrangement rule an explanation will be given by taking at least four rigid connectors 11 arranged on the first substrate 12 according to a preset arrangement rule as an example.
  • the preset arrangement rule arrangement can be designed according to actual needs, as long as the first substrate 12 can be electrically and mechanically connected to the second substrate 13 through the rigid connectors 11.
  • the plurality of rigid connectors 11 are arranged in an array to facilitate the processing of the circuit board structure 10.
  • the plurality of rigid connectors 11 are arranged in an array on the first substrate 12 or the second substrate 13.
  • the arrangement pattern of each rigid connector 11 can be in the shape of " ⁇ ", “ ⁇ ", “Tian”, “L”, “two”, other regular or irregular shapes, etc., which are not used here. limited.
  • the arrangement shape of each rigid connector 11 is adapted to the contour of the first substrate 12 or the first substrate 12, and may be a regular shape or an irregular shape.
  • At least part of the rigid connecting members 11 of the plurality of rigid connecting members 11 are arranged in an array on the first substrate 12 to form a first array 16. Specifically, at least part of the rigid connectors 11 of the plurality of rigid connectors 11 are arranged in an array to form the first array 16.
  • the rigid connectors 11 of the plurality of rigid connectors 11 are arranged at intervals along the edge area of the first substrate 12 to form the first array 16, so as to improve the mechanical performance of the first substrate 12 and the second substrate 13.
  • the reliability of the connection and the reliability of the electrical connection between the first substrate 12 and the second substrate 13 are ensured.
  • the distance between the first array 16 and the side contour of the first substrate 12 can be set according to actual requirements, and is not limited here.
  • the rigid connectors 11 are spaced along the edge area of the first substrate 12 to form a first array 16 in a ring shape.
  • the first array 16 is distributed in a ring shape.
  • the rigid connectors 11 in the first array 16 are arranged around the middle of the first substrate 12.
  • a plurality of rigid connectors 11 are arranged on the first substrate 12 in an array to form a first array 16 and a second array 17. Specifically, some of the rigid connectors 11 are arranged in an array to form the first array 16. Another part of the rigid connectors 11 is arranged in an array to form a second array 17. More specifically, the first array 16 is arranged around the second array 17 to further increase the connection reliability of the first substrate 12 and the second substrate 13.
  • the second array 17 may be in the shape of a "one", a "cross”, an "X”, other regular array arrangements or irregular array arrangements, etc., which are not limited herein.
  • the first array 16 is located on at least two sides of the first substrate 12. Specifically, the first array 16 is located on at least two sides of the middle of the first substrate 12.
  • the first substrate 12 and the second substrate 13 may have regular shapes such as rectangles or any suitable irregular shapes, which are not limited herein. The explanation will be given below by taking the first substrate 12 as a rectangle.
  • the first substrate 12 has two long sides and two short sides.
  • the first array 16 is located on at least two sides of the two long sides and the two short sides of the first substrate 12.
  • a part of the rigid connectors 11 in the first array 16 is provided on one of the long sides, and another part of the rigid connectors 11 in the first array 16 is provided on the other long side.
  • a part of the rigid connectors 11 in the first array 16 is provided on one of the short sides, and another part of the rigid connectors 11 in the first array 16 is provided on the other short side.
  • the first array 16 includes a first sub-array 161 and a second sub-array 162.
  • the first sub-array 161 and the second sub-array 162 are arranged opposite to each other at intervals. Specifically, the second sub-array 162 and the first sub-array 161 are spaced and oppositely distributed on the edge area of the first substrate 12. More specifically, as shown in FIG. 12, the first sub-array 161 is provided on one long side of the first substrate 12, and the second sub-array 162 is provided on the other long side of the first substrate 12. As shown in FIG. 13, the first sub-array 161 is provided on one short side of the first substrate 12, and the second sub-array 162 is provided on the other short side of the first substrate 12.
  • the circuit board structure 10 further includes a filler 18.
  • the filler 18 fills and wraps the exterior of at least one rigid connector 11 among the plurality of rigid connectors 11.
  • the arrangement of the filler 18 can improve the reliability of the circuit board structure 10 on the one hand; on the other hand, it can prevent the rigid connector 11 from directly contacting the air, thereby providing a uniform transmission medium for signals and ensuring the stability of high-speed signal transmission.
  • the filler 18 can be made of any suitable material according to actual needs, such as a molding material or an underfill.
  • a part of the rigid connectors 11 of the plurality of rigid connectors 11 is filled with a filler 18 on the outside, and another part of the rigid connectors 11 is not provided with a filler 18 on the outside.
  • the other part of the rigid connector 11 that is not filled with the cladding filler 18 can still provide space for air convection, which facilitates the heat dissipation of the first substrate 12, the second substrate 13 or the electronic components 14, and takes into account the heat dissipation effect and stable signal transmission. And connection reliability. Please refer to FIGS.
  • the void portion 19 may be formed by the void space between two adjacent rigid connectors 11, and the void space is not filled with the filler 18, that is, there is no gap between the two adjacent rigid connectors 11 Fill the filler 18.
  • the shape of the rigid connecting member 11 can be designed in any suitable shape according to actual needs, such as a cylinder, a "T"-shaped cylinder, an "I”-shaped cylinder, other cylinders with different diameters, other regular shapes or irregular shapes, and so on.
  • the rigid connector 11 extends along the stacking direction of the first substrate 12 and the second substrate 13 with the same outline size. Specifically, in the stacking direction of the first substrate 12 and the second substrate 13, the dimensions of the rigid connectors 11 are substantially the same everywhere.
  • the rigid connector 11 with this structure can be inserted or attached to the first substrate 12, and can also be inserted or attached to the second substrate 13.
  • the rigid connection member 11 has a first connection portion 111, a spacer portion 112 and a second connection portion 113.
  • the first connection portion 111 is connected to the first substrate 12.
  • One end of the spacer 112 is connected to the first connecting part 111.
  • the spacer 112 is sandwiched between the first substrate 12 and the second substrate 13 so that the first substrate 12 and the second substrate 13 form a gap 15 for air circulation and improve The heat dissipation effect of the first substrate 12, the second substrate 13 or the electronic component 14.
  • the second connecting portion 113 is connected to the other end of the spacer 112.
  • the second connection portion 113 is connected to the second substrate 13. Specifically, the first connection portion 111, the spacer portion 112 and the second connection portion 113 are sequentially arranged along the stacking direction of the first substrate 12 and the second substrate 13.
  • the outline size of the first connecting portion 111 is greater than or equal to the outline size of the spacer portion 112.
  • the outline size of the second connecting portion 113 is greater than or equal to the outline size of the spacer 112.
  • the outline size of the first connecting portion 111 is larger than the outline size of the spacer portion 112, so as to increase the contact area between the first connecting portion 111 and the first substrate 12, and improve the placement and positioning of the first connecting portion 111. The accuracy of this facilitates the connection of the first connecting portion 111 with the first substrate 12 through mounting.
  • the outline size of the second connecting portion 113 is equal to the outline size of the spacer 112. For another example, as shown in FIG.
  • the outline size of the first connecting portion 111 is larger than the outline size of the spacer portion 112 and the outline size of the second connecting portion 113 is larger than the outline size of the spacer portion 112, so as to increase the rigid connecting piece 11 and the second connecting portion.
  • the contact area between the first substrate 12 and the second substrate 13 improves the accuracy of the mounting and positioning of the rigid connector 11 and facilitates the mounting and processing of the rigid connector 11.
  • the outline size of the first connecting portion 111 is smaller than the outline size of the spacer portion 112.
  • the outline size of the second connecting portion 113 is smaller than the outline size of the spacer 112.
  • the outline size of the first connecting portion 111 is smaller than the outline size of the spacer portion 112 to facilitate the plug-in connection between the first connecting portion 111 and the first substrate 12.
  • the outline size of the second connecting portion 113 is equal to the outline size of the spacer 112. For another example, as shown in FIG.
  • the outline size of the first connecting portion 111 is smaller than the outline size of the spacer portion 112 and the outline size of the second connecting portion 113 is smaller than the outline size of the spacer portion 112, which facilitates the insertion of the first connecting piece.
  • the back surface of the first substrate 12 is provided with a first assembling part for connecting with the first connecting part 111.
  • the first surface of the second substrate 13 is provided with a second assembly portion for connecting with the second connecting portion 113.
  • the first assembling part and/or the second assembling part may be a flat part or a hole-like structure or the like.
  • the first connecting portion 111 is attached to the back surface of the first substrate 12.
  • the first assembly portion has a hole-shaped structure, and the first connecting portion 111 is inserted into the first assembly portion.
  • the first assembly portion penetrates the front and back of the first substrate 12, so that the connection area between the rigid connector 11 and the first substrate 12 can be increased, and the connection between the rigid connector 11 and the first substrate 12 can be improved. reliability.
  • the second connecting portion 113 is attached to the first surface of the second substrate 13.
  • the second assembly portion has a hole-shaped structure, and the second connection portion 113 is inserted into the second assembly portion.
  • the second assembly portion penetrates the first surface and the second surface of the second substrate 13, so that the connection area between the rigid connector 11 and the second substrate 13 can be increased, and the rigid connector 11 and the second substrate can be increased. The connection reliability of the substrate 13.
  • the rigid connector 11 includes a first electrical conductor 114, an insulator 115 and a second electrical conductor 116.
  • the first conductor 114 is electrically connected to two adjacent substrates.
  • the insulator 115 is sleeved outside the first conductive body 114.
  • the second conductive body 116 is electrically connected to two adjacent substrates.
  • the second conductive body 116 is sleeved on the outside of the insulator 115.
  • the second electrical conductor 116 is insulated from the first electrical conductor 114 by an insulator 115.
  • the above-mentioned rigid connector 11 adopts the first electrical conductor 114 and the second electrical conductor 116, which can improve the stability of signal transmission.
  • the rigid connector 11 further includes a covering body 117.
  • the covering body 117 is sleeved on the outside of the second conductive body 116.
  • the covering body 117 includes at least one of the covering body 117 with anti-oxidation property, the covering body 117 with insulating property, etc., so as to realize the anti-oxidation or insulation properties of the rigid connector 11 and improve the structure of the circuit board. 10 reliability.
  • the first conductive body 114, the insulator 115, the second conductive body 116, and the covering body 117 are coaxially arranged to further improve the signal transmission reliability of the circuit board structure 10.
  • the first conductive body 114 and the second conductive body 116 can use any suitable conductive material according to actual needs.
  • the first electrical conductor 114 and the second electrical conductor 116 each include a rigid connector 11 made of copper, a rigid connector 11 made of copper alloy, a rigid connector 11 made of aluminum, and a rigid connector 11 made of aluminum alloy.
  • an embodiment of the present application also provides a method for preparing a circuit board structure.
  • the preparation method is used for preparing a circuit board structure.
  • the circuit board structure may be the circuit board structure in any of the foregoing embodiments.
  • the preparation method includes step S101 to step S103.
  • Step S101 connecting a first electronic component to the first substrate.
  • Step S102 connecting a second electronic component to the second substrate.
  • Step S103 The first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate and the second substrate are laminated and arranged at intervals.
  • the first substrate is connected to the second substrate through at least four of the rigid connectors.
  • at least four of the rigid connectors can be connected to the first substrate and/or the second substrate at the same time, so as to improve the processing efficiency and reduce the relative relationship between the rigid connectors.
  • the position error of the rigid connector can be accurately positioned.
  • the position error of each rigid connector is 0-20u, for example, it can be any other suitable value among 0u, 3u, 5u, 7u, 10u, 13u, 15u, 20u, and 0-20u.
  • the rigid connector includes a first electrical conductor, an insulator, and a second electrical conductor.
  • the first conductor is electrically connected to two adjacent substrates.
  • the insulator is sheathed outside the first conductive body.
  • the second conductor is electrically connected to two adjacent substrates.
  • the second conductive body is sheathed outside the insulator.
  • the second electrical conductor is insulated from the first electrical conductor by the insulator.
  • the first electrical conductor and the second electrical conductor may use any suitable conductive material according to actual requirements.
  • the first electrical conductor and the second electrical conductor both include a rigid connector made of copper, a rigid connector made of copper alloy, a rigid connector made of aluminum, a rigid connector made of aluminum alloy, and silver At least one of a rigid connector made of material, a rigid connector made of silver alloy, a rigid connector made of gold, a rigid connector made of gold alloy, and the like.
  • the rigid connector further includes a covering body.
  • the covering body is sleeved on the outside of the second conductive body.
  • the covering body includes at least one of a covering body with anti-oxidation properties, a covering body with insulating properties, etc., so as to realize the anti-oxidation or insulation performance of the rigid connector and improve the reliability of the circuit board structure. sex.
  • the preparation method further includes: externally filling at least one of the at least two rigid connectors with a covering filler.
  • the filler is filled and covered on the outside of at least one of the plurality of rigid connectors.
  • the rigid connector can be prevented from directly contacting the air, thereby providing a uniform transmission medium for the signal and ensuring the stability of high-speed signal transmission.
  • a part of the rigid connectors of the plurality of rigid connectors is filled with a filler, and another part of the rigid connectors is not provided with a filler, and is not filled with a filler.
  • the other part of the rigid connector can still provide space for air convection, which facilitates the heat dissipation of the first substrate, the second substrate or the electronic components, and takes into account the heat dissipation effect, signal transmission stability and connection reliability.
  • the filler can be made of any suitable material according to actual needs, such as molding material or underfill rubber.
  • the electrically connecting and mechanically connecting the first substrate to the second substrate through the rigid connector includes: attaching or inserting the rigid connector on the first substrate Attach or insert the rigid connector on the second substrate.
  • the first substrate may be connected to the rigid connector in a pasting manner, and the second substrate may be connected to the rigid connector in a pasting manner.
  • the first substrate can be connected to the rigid connector in a plug-in manner, and the second substrate can be connected to the rigid connector in a plug-in manner.
  • one of the first substrate and the second substrate may be connected to the rigid connector in a plug-in manner, and the other one of the first substrate and the second substrate may be in a mounting manner Connect with rigid connector.
  • the circuit board structure produced by the preparation method of the above embodiment since the electronic components are separately arranged on the first substrate and the second substrate, and the first substrate and the second substrate are stacked, the area occupied by the electronic components is smaller than that of the electronic components. The total area of the components. Compared with the electronic components arranged on the same circuit board, the circuit board structure made by the embodiment of the present application greatly reduces the area occupied by the electronic components, thereby realizing the realization in a limited space.
  • the high-density integration of multiple electronic components improves the integration of electronic products, thereby leaving other spaces inside the electronic products for the batteries or other electronic components of the electronic products, thereby reducing the size of the electronic products, which is beneficial to the electronics Product miniaturization, and improve the battery life of electronic products or enrich the functions of electronic products.
  • each electronic component means that when each electronic component is projected onto the same substrate (first substrate or second substrate) along the stacking direction of the first substrate and the second substrate, each electronic component is The area occupied by the same substrate.
  • the circuit board structure produced by the preparation method of the embodiment of the present application since the first substrate and the second substrate are stacked, and the first substrate and the second substrate are both provided with electronic components, different subsystems can be integrated
  • the electronic components are separately arranged on the first substrate and the second substrate, and the number of layers and orders of the substrate are not restricted by the interconnection of a certain electronic component.
  • the circuit board structure manufactured by the embodiment of the present application can reduce the cost of a certain part of the substrate.
  • a circuit board structure made by mechanically connecting and electrically connecting at least two substrates through a frame plate has a poor heat dissipation effect on the one hand, which is not conducive to the heat dissipation of electronic components, and ultimately leads to the performance of electronic products. Decrease; on the other hand, the frame plate is prone to warpage and deformation, which makes the process more difficult.
  • the circuit board structure produced by the preparation method of the embodiment of the present application two adjacent substrates are stacked and arranged at intervals by the rigid connector, and the rigid connector can play a supporting role, so that the two adjacent substrates are separated by a certain distance. A space for air to flow is formed, and the communication between the space and the outside is maintained.
  • the air in the space has good fluidity, and the air flowing in the space can exchange heat with at least one of the electronic components, the first substrate, and the second substrate, thereby It facilitates the dissipation of heat from the electronic components, improves the heat dissipation effect of the circuit board structure, and prevents the electronic product from affecting the performance of the electronic product due to local heating up too fast.
  • the rigid connector has rigidity and is not prone to warping deformation, thereby reducing the difficulty of the processing technology of the circuit board structure.
  • the circuit board structure prepared in the embodiments of the present application realizes the spaced stacking arrangement of two adjacent substrates through rigid connectors. Because the rigid connectors have certain rigidity, the rigid connectors have good height consistency and are not easy to be pressed. It is not easy to cause the short circuit problem of the circuit board structure.
  • the positioning of each rigid connector is accurate, and the connection position of the rigid connector and the substrate is not easy.
  • the relative position error between the rigid connectors is small, which is beneficial to the assembly of the rigid connectors and the base plate, improves the processing efficiency, and has a simple process and low processing cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板结构(10)、电子产品和电路板结构的制备方法，该电路板结构(10)包括刚性连接件(11)和至少两个基板，每一基板上均设有电子元件(14)；刚性连接件(11)具有导电性，电连接并机械连接于相邻两个基板；至少部分刚性连接件(11)夹设于相邻两个基板之间，以使至少两个基板间隔层叠设置。

Description

电路板结构、电子产品和电路板结构的制备方法 技术领域
本申请涉及电子产品技术领域，尤其涉及一种电路板结构、电子产品和电路板结构的制备方法。
背景技术
为了实现运动相机或无人飞行器等电子产品的高性能化，该类电子产品通常需要整合不同功能的电子元件，例如集成电路芯片及/或无源元件。然而，现有的电子产品中，随着电子元件数量的增加，不同电子元件通常并排设置在产品主板上，电子元件占板面积即各电子元件占据产品主板的面积较大，致使电子产品的尺寸较大，难以适应人们对电子产品的小型化需求。
发明内容
基于此，本申请提供了一种电路板结构、电子产品和电路板结构的制备方法，旨在减小电子产品的尺寸，使得电子产品小型化。
根据本申请的第一方面，本申请提供了电路板结构，包括：
至少两个基板，至少两个所述基板依次层叠设置，每一所述基板上均设有电子元件；
刚性连接件，具有导电性，电连接并机械连接于相邻两个所述基板；
其中，至少部分所述刚性连接件夹设于相邻两个所述基板之间，以使至少两个所述基板间隔层叠设置。
根据本申请的第二方面，本申请提供了一种电子产品，包括:壳体；如上任一所述的电路板结构，设置于所述壳体上。
根据本申请的第三方面，本申请提供了电路板结构的制备方法，所述电路板结构包括第一基板、第二基板和刚性连接件，所述制备方法包括：将第一电子元件连接于所述第一基板；将第二电子元件连接于所述第二基板；将所述第一基板通过所述刚性连接件电连接并机械连接于第二基板，所述第一基板与所 述第二基板间隔层叠设置。
本申请实施例提供了一种电路板结构、电子产品和电路板结构的制备方法，而各电子元件的占板面积小于各电子元件的面积的总和，大大减小了各电子元件的占板面积，从而实现在有限的空间内实现多个电子元件的高密度集成，将电子产品内部的其他空间留给电子产品的电池或其他电子元器件等，进而减小了电子产品的尺寸，有利于电子产品小型化。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例提供的电路板结构的结构示意图；
图2是本申请一实施例提供的电路板结构的结构示意图；
图3是本申请一实施例提供的电路板结构的结构示意图；
图4是本申请一实施例提供的电路板结构的结构示意图；
图5是本申请一实施例提供的电路板结构的结构示意图；
图6是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图7是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图8是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图9是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图10是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图11是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图12是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图13是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式；
图14是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式和填充件；
图15是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式和填充件；
图16是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式和填充件；
图17是本申请一实施例提供的电路板结构的部分示意图，其中示出了刚性连接件的排列方式和填充件；
图18是本申请一实施例提供的刚性连接件的结构示意图；
图19是本申请一实施例提供的刚性连接件的结构示意图；
图20是本申请一实施例提供的刚性连接件的结构示意图；
图21是本申请一实施例提供的刚性连接件的结构示意图；
图22是本申请一实施例提供的刚性连接件的结构示意图；
图23是本申请一实施例提供的刚性连接件的内部结构示意图；
图24是本申请一实施例提供的电路板结构的制备方法的流程示意图。
附图标记说明：
10、电路板结构；
11、刚性连接件；111、第一连接部；112、间隔部；113、第二连接部；114、第一导电体；115、绝缘体；116、第二导电体；117、包覆体；
12、第一基板；13、第二基板；14、电子元件；
15、间隙；
16、第一阵列；161、第一子阵列；162、第二子阵列；
17、第二阵列；
18、填充件；
19、空隙部。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
还应当理解，在此本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
还应当进一步理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
本申请的发明人发现，为了实现无人机、可移动小车、移动终端、运动相机、电子玩具等电子产品的高性能化，无人机的飞控主板、可移动车辆的主控板、移动终端中承载***级芯片(System on Chip，SOC)的主板等产品主板中通常会集成芯片等多个电子元件。而随着电子产品“轻、薄、短、小”需求的不断增加，产品主板的所占据的空间也被进一步压缩。然而当电子元件为多个时，多个电子元件通常并排设计，各电子元件占据产品主板的面积为多个电子元件的面积的总和。电子元件的数量越多，各电子元件占据产品主板的面积就越大，如此会增加电子产品的面积，不利于电子产品的小型化。因而，如何在有限的空间内实现多个电子元件的高密度集成，是本领域技术人员亟待解决的技术问题之一。
针对该发现，本申请的发明人对电路板结构进行了改进，以使减小各电子元件的占板面积，从而减小电子产品的尺寸，使得电子产品小型化。具体地，本申请提供一种电路板结构，包括：至少两个基板，至少两个所述基板依次层叠设置，每一所述基板上均设有电子元件；刚性连接件，具有导电性，电连接并机械连接于相邻两个所述基板；其中，至少部分所述刚性连接件夹设于相邻两个所述基板之间，以使至少两个所述基板间隔层叠设置。
本申请还提供一种电子产品，包括:壳体；如上所述的电路板结构，设置于所述壳体上。
本申请还提供一种电路板结构的制备方法，所述电路板结构包括第一基板、 第二基板和刚性连接件，所述制备方法包括：将第一电子元件连接于所述第一基板；将第二电子元件连接于所述第二基板；将所述第一基板通过所述刚性连接件电连接并机械连接于第二基板，所述第一基板与所述第二基板间隔层叠设置。
下面结合附图，对本申请的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1至图5，本申请的实施例提供了一种电子产品，该电子产品包括电路板结构10和壳体，电路板结构10设置于壳体上。其中，电子产品可以包括相机、无人飞行器、电子玩具、可移动车辆、移动终端等中的至少一种。移动终端可以包括手机、平板电脑等中的至少一种。
请参阅图1至图5，在一些实施例中，该电路板结构10包括刚性连接件11和至少两个基板，至少两个基板依次层叠设置，每一个基板上均设有电子元件14。刚性连接件11具有导电性，刚性连接件11电连接并机械连接于相邻两个基板。其中，至少部分刚性连接件11夹设于相邻两个基板之间，以使至少两个基板间隔层叠设置。
当各电子元件14设于同一个电路板上时，各电子元件14的占板面积为各个电子元件14的面积的总和。而本申请实施例的电路板结构10中，由于各电子元件14分设在至少两个基板上，至少两个基板层叠设置，因而各电子元件14的占板面积小于各电子元件14的面积的总和，大大减小了各电子元件14的占板面积，从而实现在有限的空间内实现多个电子元件14的高密度集成，提高了电子产品的集成度，从而将电子产品内部的其他空间留给电子产品的电池或其他电子元器件等，进而减小了电子产品的尺寸，有利于电子产品小型化，并提高电子产品的续航或者丰富电子产品的功能。
可以理解地，在本申请一些实施例中，各电子元件14的占板面积是指，当各电子元件14沿至少两个基板的层叠方向投影至同一个基板上时，各电子元件14在该同一个基板上所占据的面积。
示例性地，本申请实施例的电路板结构10，由于至少两个基板层叠设置，每个基板上均设于电子元件14，因而可以将不同子***的电子元件14分开布置于至少两个基板上，基板的层数和阶数不受某一电子元件14互连的制约。与各电子元件14均设于同一个电路板相比，本申请实施例的电路板结构10能够 降低某一部分基板的成本。
可以理解地，通过框架板实现至少两个基板的机械连接和电性连接所制得的电路板结构，一方面散热效果较差，不利于电子元件的热量散出，最终会导致电子产品的性能下降；另一方面框架板容易发生翘曲形变致使工艺难度增大。为此，本申请实施例在相邻两个基板之间设置有刚性连接件11。具体地，相邻两个基板通过该刚性连接件11间隔层叠设置，该刚性连接件11能够起到支撑作用，使得相邻两个基板之间间隔一定距离以形成有用于供空气流动的空间，保持了该空间与外部的流通性。在自然条件或者外加风扇等条件下，该空间内的空气具有较好的流动性，该空间内流动的空气能够与电子元件14、以及相邻两个基板中的至少一者进行热量交换，从而便于电子元件14上的热量散出，提高了电路板结构10的散热效果，避免电子产品因局部升温过快而影响电子产品的性能。同时，刚性连接件11具有刚性，不易发生翘曲形变，从而降低了电路板结构10的加工工艺难度。
由于通过焊膏实现至少两个基板的机械连接和电性连接所制得的电路板结构，一旦焊膏压塌，电路板结构极容易产生短路问题；此外，焊膏的高度一致性差。为此，本申请实施例通过刚性连接件11实现相邻两个基板的间隔层叠设置，由于刚性连接件11具有一定刚性，刚性连接件11的高度一致性好，不容易压塌，不易出现电路板结构10短路的问题。
此外，在加工或制备本申请实施例的电路板结构10时，当组装两个相邻的基板以及刚性连接件11时，刚性连接件11的定位精确，刚性连接件11与基板的连接位置不容易发生偏移或滚动，有利于刚性连接件11与基板的组装以及提高加工效率，工艺简单，加工成本低。
可以理解地，基板的数量可以根据实际需求进行设置，例如两个、三个、四个、五个或者更多。各基板依次层叠设置，相邻两个基板之间设有刚性连接件11。设置于相邻两个基板之间的刚性连接件11可以根据实际需求设置数量。示例性地，刚性连接件11的数量包括至少四个。具体地，设置于相邻两个基板之间的刚性连接件11的数量包括至少四个，例如四个、五个、六个、七个、八个或者更多。
可以理解地，各基板的材料可以根据实际需求进行设计，例如基板可以采用环氧树脂、陶瓷或高密度互联的(High Density Interconnect，HDI)环氧 玻纤布等材料制成。
请参阅图1至图5，在一些实施例中，至少两个基板包括第一基板12和第二基板13。第一基板12与刚性连接件11的一端连接。第二基板13与刚性连接件11的另一端连接。第二基板13通过刚性连接件11与第一基板12间隔设置形成间隙15。该间隙15能够用于供气体或空气流动，保持了该间隙15与外部的流通性。在自然条件或者外加风扇等条件下，该间隙15内的空气具有较好的流动性，该间隙15内流动的空气能够与位于第一基板12和第二基板13之间的电子元件14发生热交换，该间隙15内流动的空气也能够与第一基板12和/或第二基板13发生热交换，从而能够加速第一基板12和/或第二基板13上的电子元件14的热量散出，提高散热效果，避免电子产品因局部升温过快而影响电子产品的性能。
具体地，第一基板12和第二基板13相对设置。第一基板12具有正面和与正面相对的背面。第二基板13具有第一面和第二面，第一面面向第一基板12的背面，第二面与第一面相对设置。在第一基板12的正面和/或背面上设置有电子元件14。在第二基板13的第一面和/或第二面上设置有电子元件14。第一基板12的背面上设置有第一焊盘，第二基板13的第一面上设置有与第一焊盘相对应的第二焊盘，第一焊盘通过刚性连接件11实现与第二焊盘电性连接。该刚性连接件11也可以起到结构支撑作用。具体地，电子元件14的数量和种类可以根据实际需求进行设计，例如可以包括有源电子器件和无源电子器件等中的至少一种，在此不作限定。
可以理解地，至少两个基板中的各基板的尺寸形状可以根据实际需求进行设置，只要允许至少两个基板之间有部分投影面积重叠即可。示例性地，第一基板12和第二基板13的尺寸形状无需完全相同，只要第一基板12和第二基板13在二者的层叠方向上在第一基板12或第二基板13上的投影面积有部分重叠即可。
可以理解地，第一基板12和第二基板13均可以通过任意合适的连接方式与刚性连接件11连接。示例性地，请参阅图1、图4和图5，刚性连接件11贴装或插装于第一基板12上。刚性连接件11贴装或插装于第二基板13上。
在一些实施方式中，请参阅图1，第一基板12和第二基板13均可以采用贴装的方式与刚性连接件11连接。请参阅图4，在另一实施方式中，第一基板 12和第二基板13均可以采用插装的方式与刚性连接件11连接。请参阅图5，在又一实施方式中，第一基板12和第二基板13中的其中一者采用插装的方式与刚性连接件11连接，第一基板12和第二基板13中的另外一者采用贴装的方式与刚性连接件11连接。比如第一基板12采用贴装的方式与刚性连接件11连接，第二基板13采用插装的方式与刚性连接件11连接。又如，第一基板12采用插装的方式与刚性连接件11连接，第二基板13采用贴装的方式与刚性连接件11连接。
请参阅图4和图5，在一些实施例中，部分刚性连接件11插装于第一基板12和/或第二基板13。即刚性连接件11中的其中一部分插装于第一基板12和/或第二基板13中。
在一些实施例中，刚性连接件11沿第一基板12和第二基板13的层叠方向延伸，以使得刚性连接件11既能够连接第一基板12和第二基板13，又能够将第一基板12和第二基板13间隔一定距离形成间隙15。
可以理解地，设置于第一基板12和第二基板13之间的刚性连接件11的数量包括至少四个，例如四个、五个、六个、七个、八个或者更多。
在一些实施例中，至少四个刚性连接件11间隔设置。在一些实施方式中，各刚性连接件11中两两间隔设置，或相邻两个刚性连接件11间隔设置，如此在各连接件之间形成用于供空气流动的间隔空间，该间隔空间能够供空气或气体流动，保证了该间隔空间与外部的流通性，有利于加速第一基板12、第二基板13或者位于第一基板12和第二基板13上的电子元件14中的至少一者散热，提高散热效果，避免电子产品局部升温过快，为电子产品的正常性能提供了保障。
在一些实施例中，至少四个刚性连接件11以预设排列规则排列。具体地，至少四个刚性连接件11以预设排列规则排列在第一基板12上。或者，至少四个刚性连接件11以预设排列规则排列在第二基板13上。下面以至少四个刚性连接件11以预设排列规则排列在第一基板12上为例进行解释说明。预设排列规则排列可以根据实际需求进行设计，只要第一基板12能够通过各刚性连接件11与第二基板13实现电连接以及机械连接即可。在一些实施例中，多个刚性连接件11呈阵列排布，便于电路板结构10的加工。具体地，多个刚性连接件11在第一基板12或第二基板13上呈阵列排布。比如，各刚性连接件11的排 布图形可以呈“口”字形、“日”字形、“田”字形、“L”字形、“二”字形、其他规则形状或不规则形状等，在此不作限定。示例性地，各刚性连接件11的排列形状适配于第一基板12或第一基板12的轮廓，可以为规则形状，也可以为不规则形状。
请参阅图6至图13，在一些实施例中，多个刚性连接件11中的至少部分刚性连接件11呈阵列排布设置于第一基板12上形成第一阵列16。具体地，多个刚性连接件11中的至少部分刚性连接件11呈阵列排布设置形成第一阵列16。
在一些实施例中，多个刚性连接件11中的至少部分刚性连接件11沿第一基板12的边缘区域间隔设置以形成第一阵列16，以提高第一基板12与第二基板13的机械连接可靠性，并保证第一基板12与第二基板13的电连接可靠性。该第一阵列16与第一基板12的侧周轮廓的距离可以根据实际需求进行设置，在此不作限定。请参阅图6，各刚性连接件11沿第一基板12的边缘区域间隔设置形成环形的第一阵列16。
在一些实施例中，第一阵列16呈环形分布。第一阵列16中的刚性连接件11环绕第一基板12的中部设置。
请参阅图7至图11，多个刚性连接件11呈阵列排布设置于第一基板12上形成第一阵列16和第二阵列17。具体地，各刚性连接件11中的其中一部分刚性连接件11呈阵列排布形成第一阵列16。各刚性连接件11中的另一部分刚性连接件11呈阵列排布形成第二阵列17。更为具体地，第一阵列16环绕第二阵列17设置，以进一步增加第一基板12和第二基板13的连接可靠性。第二阵列17可以呈“一”字形、“十”字形、“X”字形、其他规则阵列排布或不规则阵列排布等，在此不作限定。
请参阅图12和图13，第一阵列16位于第一基板12的至少两侧。具体地，第一阵列16位于第一基板12的中部的至少两侧。第一基板12和第二基板13可以为长方形等规则形状或任意合适的不规则形状，在此不作限定。下面以第一基板12为长方形进行解释说明。第一基板12具有两个长边侧和两个短边侧。第一阵列16位于第一基板12的两个长边侧和两个短边侧中的至少两侧。比如，如图12所示，第一阵列16中的其中一部分刚性连接件11设于其中一个长边侧，第一阵列16中的另一部分刚性连接件11设于另一个长边侧。又如，如图13所示，第一阵列16中的其中一部分刚性连接件11设于其中一个短边侧，第一 阵列16中的另一部分刚性连接件11设于另一个短边侧。
在一些实施例中，第一阵列16包括第一子阵列161和第二子阵列162。第一子阵列161与第二子阵列162间隔相对设置。具体地，第二子阵列162与第一子阵列161间隔相对分布于第一基板12的边缘区域。更为具体地，如图12所示，第一子阵列161设于第一基板12的其中一个长边侧，第二子阵列162设于第一基板12的另一长边侧。如图13所示，第一子阵列161设于第一基板12的其中一个短边侧，第二子阵列162设于第一基板12的另一短边侧。
请参阅图14至图17，在一些实施例中，电路板结构10还包括填充件18。填充件18填充包覆于多个刚性连接件11中的至少一个刚性连接件11的外部。填充件18的设置，一方面能够提高电路板结构10的可靠性；另一方面能够避免刚性连接件11直接与空气接触，从而为信号提供均匀的传输介质，保证高速信号传输稳定性。填充件18可以根据实际需求选择任意合适材料制成，比如模塑材料或底充胶等。
在一些实施方式中，多个刚性连接件11中的其中一部分刚性连接件11外部填充包覆有填充件18，多个刚性连接件11中的另一部分刚性连接件11外部不设填充件18，未填充包覆填充件18的另一部分刚性连接件11，仍可提供用于供空气对流的空间，便于第一基板12、第二基板13或电子元件14的散热，兼顾散热效果、信号传输稳定性和连接可靠性。请参阅图14、图16和图17，具体地，未填充包覆填充件18的另一部分刚性连接件11形成有空隙部19，该空隙部能够提供空气对流的空间，便于第一基板12、第二基板13或电子元件14的散热，从而提高电路板结构10的散热效果。示例性地，该空隙部19可以由相邻的两个刚性连接件11之间的空隙空间形成，该空隙空间未填充填充件18，亦即该相邻的两个刚性连接件11之间未填充填充件18。
刚性连接件11的形状可以根据实际需求设计为任意合适形状，例如圆柱体、“T”形圆柱、“工”字形圆柱、其他直径不同的圆柱、其他规则形状或不规则形状等。
请参阅图18，在一些实施例中，刚性连接件11以轮廓尺寸相同的方式沿第一基板12和第二基板13的层叠方向延伸。具体地，在第一基板12和第二基板13的层叠方向上，刚性连接件11各处的尺寸大致相同。这种结构的刚性连接件11可以插装或贴装于第一基板12，也可以插装或贴装于第二基板13。
在一些实施例中，刚性连接件11具有第一连接部111、间隔部112和第二连接部113。第一连接部111与第一基板12连接。间隔部112的一端与第一连接部111连接，间隔部112夹设于第一基板12和第二基板13之间以使第一基板12和第二基板13形成间隙15，供空气流通，提高第一基板12、第二基板13或电子元件14的散热效果。第二连接部113与间隔部112的另一端连接。第二连接部113与第二基板13连接。具体地，第一连接部111、间隔部112和第二连接部113沿第一基板12和第二基板13的层叠方向依次设置。
请参阅图19和图20，第一连接部111的轮廓尺寸大于或等于间隔部112的轮廓尺寸。第二连接部113的轮廓尺寸大于或等于间隔部112的轮廓尺寸。例如，如图19所示，第一连接部111的轮廓尺寸大于间隔部112的轮廓尺寸，以增大第一连接部111与第一基板12的接触面积，提高第一连接部111贴装定位的准确性，有利于于第一连接部111通过贴装与第一基板12连接。第二连接部113的轮廓尺寸等于间隔部112的轮廓尺寸。又如，如图20所示，第一连接部111的轮廓尺寸大于间隔部112的轮廓尺寸，第二连接部113的轮廓尺寸大于间隔部112的轮廓尺寸，以增大刚性连接件11与第一基板12和第二基板13的接触面积，提高刚性连接件11贴装定位的准确性，有利于刚性连接件11的贴装加工。
请参阅图21和图22，在一些实施例中，第一连接部111的轮廓尺寸小于间隔部112的轮廓尺寸。第二连接部113的轮廓尺寸小于间隔部112的轮廓尺寸。例如，如图21所示，第一连接部111的轮廓尺寸小于间隔部112的轮廓尺寸，以便于第一连接部111与第一基板12的插装连接。第二连接部113的轮廓尺寸等于间隔部112的轮廓尺寸。又如，如图22所示，第一连接部111的轮廓尺寸小于间隔部112的轮廓尺寸，第二连接部113的轮廓尺寸小于间隔部112的轮廓尺寸，有利于第一连接件插装于第一基板12和第二基板13上。
在一些实施例中，第一基板12的背面设有用于与第一连接部111连接的第一装配部。第二基板13的第一面设有用于与第二连接部113连接的第二装配部。第一装配部和/或第二装配部可以为平面部或者孔状结构等。在一些实施方式中，第一连接部111贴装于第一基板12的背面。在一些实施方式中，第一装配部为孔状结构，第一连接部111插设于第一装配部内。
在一些实施方式中，第一装配部贯穿于第一基板12的正面和背面，如此可 以增大刚性连接件11与第一基板12的连接面积，提高刚性连接件11与第一基板12的连接可靠性。
同样地，在一些实施方式中，第二连接部113贴装于第二基板13的第一面。在一些实施方式中，第二装配部为孔状结构，第二连接部113插设于第二装配部内。在一些实施方式中，第二装配部贯穿于第二基板13的第一面和第二面，如此可以增大刚性连接件11与第二基板13的连接面积，提高刚性连接件11与第二基板13的连接可靠性。
请参阅图23，在一些实施例中，刚性连接件11包括第一导电体114、绝缘体115和第二导电体116。第一导电体114电连接于相邻两个基板。绝缘体115套设于第一导电体114外部。第二导电体116电连接于相邻两个基板。第二导电体116套设于绝缘体115外部。第二导电体116通过绝缘体115与第一导电体114绝缘设置。上述刚性连接件11采用第一导电体114和第二导电体116，能够提高信号传输稳定性。
请参阅图23，在一些实施例中，刚性连接件11还包括包覆体117。包覆体117套设于第二导电体116外部。具体地，包覆体117包括具有防氧化性的包覆体117、具有绝缘性的包覆体117等中的至少一种，以实现刚性连接件11的防氧化或绝缘性能，提高电路板结构10的可靠性。
在一些实施例中，第一导电体114、绝缘体115、第二导电体116和包覆体117同轴设置，进一步提高电路板结构10的信号传输可靠性。
在一些实施例中，第一导电体114和第二导电体116可以根据实际需求采用任意合适的导电材料。示例性地，第一导电体114和第二导电体116均包括铜材质的刚性连接件11、铜合金材质的刚性连接件11、铝材质的刚性连接件11、铝合金材质的刚性连接件11、银材质的刚性连接件11、银合金材质的刚性连接件11、金材质的刚性连接件11、金合金材质的刚性连接件11等中的至少一种。
请参阅图24，本申请实施例还提供一种电路板结构的制备方法，该制备方法用于制备电路板结构，所述电路板结构可以为上述任一实施例中的电路板结构。所述制备方法包括步骤S101至步骤S103。
步骤S101、将第一电子元件连接于所述第一基板。
步骤S102、将第二电子元件连接于所述第二基板。
步骤S103、将所述第一基板通过所述刚性连接件电连接并机械连接于第二基板，所述第一基板与所述第二基板间隔层叠设置。
在一些实施例中，所述第一基板通过至少四个所述刚性连接件与所述第二基板连接。具体地，在制备电路板结构的过程中，至少四个所述刚性连接件可以同时连接于第一基板和/或第二基板，以提高加工效率，并可以减小各刚性连接件之间相对的位置误差，实现刚性连接件的精准定位。
在一些实施例中，各所述刚性连接件的位置误差为0-20u，比如可以为0u、3u、5u、7u、10u、13u、15u、20u以及0-20u中其他任意合适数值等。
在一些实施例中，所述刚性连接件包括第一导电体、绝缘体和第二导电体。第一导电体电连接于相邻两个所述基板。绝缘体套设于所述第一导电体外部。第二导电体电连接于相邻两个所述基板。第二导电体套设于所述绝缘体外部。所述第二导电体通过所述绝缘体与所述第一导电体绝缘设置。上述刚性连接件采用第一导电体和第二导电体，能够提高信号传输稳定性。
在一些实施例中，所述第一导电体和所述第二导电体可以根据实际需求采用任意合适的导电材料。示例性地，所述第一导电体和所述第二导电体均包括铜材质的刚性连接件、铜合金材质的刚性连接件、铝材质的刚性连接件、铝合金材质的刚性连接件、银材质的刚性连接件、银合金材质的刚性连接件、金材质的刚性连接件、金合金材质的刚性连接件等中的至少一种。
在一些实施例中，所述刚性连接件还包括包覆体。包覆体套设于所述第二导电体外部。具体地，所述包覆体包括具有防氧化性的包覆体、具有绝缘性的包覆体等中的至少一种，以实现刚性连接件的防氧化或绝缘性能，提高电路板结构的可靠性。
在一些实施例中，所述制备方法还包括：在至少两个所述刚性连接件中的至少一个外部填充包覆填充件。
具体地，将填充件填充包覆于多个所述刚性连接件中的至少一个刚性连接件的外部。如此，一方面能够提高电路板结构的可靠性；另一方面能够避免刚性连接件直接与空气接触，从而为信号提供均匀的传输介质，保证高速信号传输稳定性。在一些实施方式中，多个刚性连接件中的其中一部分刚性连接件外部填充包覆有填充件，多个刚性连接件中的另一部分刚性连接件外部不设填充件，未填充包覆填充件的另一部分刚性连接件，仍可提供用于供空气对流的空 间，便于第一基板、第二基板或电子元件的散热，兼顾散热效果、信号传输稳定性和连接可靠性。填充件可以根据实际需求选择任意合适材料制成，比如模塑材料或底充胶等。
在一些实施例中，所述将所述第一基板通过所述刚性连接件电连接并机械连接于第二基板，包括：将所述刚性连接件贴装或插装于所述第一基板上；将所述刚性连接件贴装或插装于所述第二基板上。
具体地，在一些实施方式中，可以将第一基板采用贴装的方式与刚性连接件连接，将第二基板采用贴装的方式与刚性连接件连接。在另一实施方式中，可以将第一基板采用插装的方式与刚性连接件连接，将第二基板采用插装的方式与刚性连接件连接。在又一实施方式中，可以将第一基板和第二基板中的其中一者采用插装的方式与刚性连接件连接，将第一基板和第二基板中的另外一者采用贴装的方式与刚性连接件连接。
采用上述实施例的制备方法制得的电路板结构，由于各电子元件分设在第一基板和第二基板上，第一基板和第二基板层叠设置，因而各电子元件的占板面积小于各电子元件的面积的总和，与各电子元件设于同一个电路板上相比，本申请实施例制得的电路板结构大大减小了各电子元件的占板面积，从而实现在有限的空间内实现多个电子元件的高密度集成，提高了电子产品的集成度，从而将电子产品内部的其他空间留给电子产品的电池或其他电子元器件等，进而减小了电子产品的尺寸，有利于电子产品小型化，并提高电子产品的续航或者丰富电子产品的功能。
可以理解地，各电子元件的占板面积是指，当各电子元件沿第一基板和第二基板的层叠方向投影至同一个基板(第一基板或第二基板)上时，各电子元件在该同一个基板上所占据的面积。
示例性地，本申请实施例的制备方法所制得的电路板结构，由于第一基板和第二基板层叠设置，第一基板和第二基板上均设于电子元件，因而可以将不同子***的电子元件分开布置于第一基板和第二基板上，基板的层数和阶数不受某一电子元件互连的制约。与各电子元件均设于同一个电路板相比，本申请实施例所制得的的电路板结构能够降低某一部分基板的成本。
可以理解地，通过框架板实现至少两个基板的机械连接和电性连接所制得的电路板结构，一方面散热效果较差，不利于电子元件的热量散出，最终会导 致电子产品的性能下降；另一方面框架板容易发生翘曲形变致使工艺难度增大。本申请实施例的制备方法制得的电路板结构，相邻两个基板通过该刚性连接件间隔层叠设置，该刚性连接件能够起到支撑作用，使得相邻两个基板之间间隔一定距离以形成有用于供空气流动的空间，保持了该空间与外部的流通性。在自然条件或者外加风扇等条件下，该空间内的空气具有较好的流动性，该空间内流动的空气能够与电子元件、第一基板、第二基板中的至少一者进行热量交换，从而便于电子元件上的热量散出，提高了电路板结构的散热效果，避免电子产品因局部升温过快而影响电子产品的性能。同时，刚性连接件具有刚性，不易发生翘曲形变，从而降低了电路板结构的加工工艺难度。
由于通过焊膏实现至少两个基板的机械连接和电性连接所制得的电路板结构，一旦焊膏压塌，电路板结构极容易产生短路问题；此外，焊膏的高度一致性差。为此，本申请实施例所制得的电路板结构，通过刚性连接件实现相邻两个基板的间隔层叠设置，由于刚性连接件具有一定刚性，刚性连接件的高度一致性好，不容易压塌，不易出现电路板结构短路的问题。
此外，本申请实施例的制备方法所制得的电路板结构时，当组装两个相邻的基板以及刚性连接件时，各刚性连接件的定位精确，刚性连接件与基板的连接位置不容易发生偏移或滚动，各刚性连接件之间的相对位置误差小，有利于刚性连接件与基板的组装，提高加工效率，工艺简单，加工成本低。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (42)

  1. 一种电路板结构，其特征在于，包括：
    至少两个基板，至少两个所述基板依次层叠设置，每一所述基板上均设有电子元件；
    刚性连接件，具有导电性，电连接并机械连接于相邻两个所述基板；
    其中，至少部分所述刚性连接件夹设于相邻两个所述基板之间，以使至少两个所述基板间隔层叠设置。
  2. 根据权利要求1所述的电路板结构，其特征在于，至少两个基板包括：
    第一基板，与所述刚性连接件的一端连接；
    第二基板，与所述刚性连接件的另一端连接；所述第二基板通过所述刚性连接件与所述第一基板间隔设置形成间隙。
  3. 根据权利要求2所述的电路板结构，其特征在于，所述刚性连接件贴装或插装于所述第一基板上；和/或，所述刚性连接件贴装或插装于所述第二基板上。
  4. 根据权利要求3所述的电路板结构，其特征在于，部分所述刚性连接件插装于所述第一基板和/或所述第二基板。
  5. 根据权利要求2所述的电路板结构，其特征在于，所述刚性连接件沿所述第一基板和所述第二基板的层叠方向延伸。
  6. 根据权利要求2所述的电路板结构，其特征在于，所述刚性连接件以轮廓尺寸相同的方式沿所述第一基板和所述第二基板的层叠方向延伸。
  7. 根据权利要求2所述的电路板结构，其特征在于，所述刚性连接件的数量包括至少四个。
  8. 根据权利要求7所述的电路板结构，其特征在于，至少四个所述刚性连接件间隔设置。
  9. 根据权利要求7所述的电路板结构，其特征在于，至少四个所述刚性连接件以预设排列规则排列在所述第一基板或者所述第二基板上。
  10. 根据权利要求9所述的电路板结构，其特征在于，多个所述刚性连接件呈阵列排布。
  11. 根据权利要求10所述的电路板结构，其特征在于，多个所述刚性连接件中的至少部分刚性连接件呈阵列排布设置于所述第一基板上形成第一阵列。
  12. 根据权利要求11所述的电路板结构，其特征在于，多个所述刚性连接件中的至少部分刚性连接件沿所述第一基板的边缘区域间隔设置以形成所述第一阵列。
  13. 根据权利要求12所述的电路板结构，其特征在于，所述第一阵列位于所述第一基板的至少两侧。
  14. 根据权利要求11所述的电路板结构，其特征在于，所述第一阵列呈环形分布，所述第一阵列中的刚性连接件环绕所述电路板的中部设置。
  15. 根据权利要求11所述的电路板结构，其特征在于，所述第一阵列包括：
    第一子阵列；
    第二子阵列，与所述第一子阵列间隔相对分布于所述第一基板的边缘区域。
  16. 根据权利要求10所述的电路板结构，其特征在于，多个所述刚性连接件呈阵列排布设置于所述第一基板上形成第一阵列和第二阵列，所述第一阵列环绕所述第二阵列设置。
  17. 根据权利要求7所述的电路板结构，其特征在于，所述电路板结构还包括：
    填充件，填充包覆于多个所述刚性连接件中的至少一个刚性连接件的外部。
  18. 根据权利要求2所述的电路板结构，其特征在于，所述刚性连接件具有：
    第一连接部，与所述第一基板连接；
    间隔部，一端与所述第一连接部连接，夹设于所述第一基板和所述第二基板之间；
    第二连接部，与所述间隔部的另一端连接，并与所述第二基板连接。
  19. 根据权利要求18所述的电路板结构，其特征在于，所述第一连接部、所述间隔部和所述第二连接部沿所述第一基板和所述第二基板的层叠方向依次设置。
  20. 根据权利要求18所述的电路板结构，其特征在于，所述第一连接部的轮廓尺寸大于或等于所述间隔部的轮廓尺寸；和/或，所述第二连接部的轮廓尺寸大于或等于所述间隔部的轮廓尺寸。
  21. 根据权利要求18所述的电路板结构，其特征在于，所述第一连接部的轮廓尺寸小于所述间隔部的轮廓尺寸；和/或，所述第二连接部的轮廓尺寸小于所述间隔部的轮廓尺寸。
  22. 根据权利要求18所述的电路板结构，其特征在于，第一基板具有正面和与所述正面相对的背面；所述第二基板具有面向所述第一基板的背面的第一面和与所述第一面相对的第二面。
  23. 根据权利要求22所述的电路板结构，其特征在于，所述第一基板的背面设有用于与所述第一连接部连接的第一装配部，所述第二基板的第一面设有用于与所述第二连接部连接的第二装配部。
  24. 根据权利要求23所述的电路板结构，其特征在于，所述第一连接部贴装于所述第一基板的背面。
  25. 根据权利要求23所述的电路板结构，其特征在于，所述第一装配部为孔状结构，所述第一连接部插设于所述第一装配部内。
  26. 根据权利要求25所述的电路板结构，其特征在于，所述第一装配部贯穿于所述第一基板的正面和背面。
  27. 根据权利要求23-26任一项所述的电路板结构，其特征在于，所述第二连接部贴装于所述第二基板的第一面。
  28. 根据权利要求27所述的电路板结构，其特征在于，所述第二装配部为孔状结构，所述第二连接部插设于所述第二装配部内。
  29. 根据权利要求28所述的电路板结构，其特征在于，所述第二装配部贯穿于所述第二基板的第一面和第二面。
  30. 根据权利要求1所述的电路板结构，其特征在于，所述刚性连接件包括：
    第一导电体，电连接于相邻两个所述基板；
    绝缘体，套设于所述第一导电体外部；
    第二导电体，电连接于相邻两个所述基板；套设于所述绝缘体外部，所述第二导电体通过所述绝缘体与所述第一导电体绝缘设置。
  31. 根据权利要求30所述的电路板结构，其特征在于，所述刚性连接件还包括：
    包覆体，套设于所述第二导电体外部。
  32. 根据权利要求31所述的电路板结构，其特征在于，所述包覆体包括具有防氧化性的包覆体、具有绝缘性的包覆体中的至少一种。
  33. 根据权利要求31所述的电路板结构，其特征在于，所述第一导电体、所述绝缘体、所述第二导电体和所述包覆体同轴设置。
  34. 根据权利要求30所述的电路板结构，其特征在于，所述第一导电体和所述第二导电体均包括铜材质的刚性连接件、铜合金材质的刚性连接件、铝材质的刚性连接件、铝合金材质的刚性连接件、银材质的刚性连接件、银合金材质的刚性连接件、金材质的刚性连接件、金合金材质的刚性连接件中的至少一种。
  35. 根据权利要求1所述的电路板结构，其特征在于，所述电子元件包括有源电子器件和无源电子器件中的至少一种。
  36. 一种电子产品，其特征在于，包括:
    壳体；
    如权利要求1-35任一项所述的电路板结构，设置于所述壳体上。
  37. 根据权利要求36所述的电子产品，其特征在于，所述电子产品包括：
    相机、无人飞行器、电子玩具、可移动车辆、移动终端中的至少一种。
  38. 一种电路板结构的制备方法，其特征在于，所述电路板结构包括第一基板、第二基板和刚性连接件，所述制备方法包括：
    将第一电子元件连接于所述第一基板；
    将第二电子元件连接于所述第二基板；
    将所述第一基板通过所述刚性连接件电连接并机械连接于第二基板，所述第一基板与所述第二基板间隔层叠设置。
  39. 根据权利要求38所述的制备方法，其特征在于，所述第一基板通过至少四个所述刚性连接件与所述第二基板连接。
  40. 根据权利要求39所述的制备方法，其特征在于，各所述刚性连接件的位置误差为0-20u。
  41. 根据权利要求39所述的制备方法，其特征在于，所述制备方法还包括：
    在至少两个所述刚性连接件中的至少一个外部填充包覆填充件。
  42. 根据权利要求38所述的制备方法，其特征在于，所述将所述第一基板通过所述刚性连接件电连接并机械连接于第二基板，包括：
    将所述刚性连接件贴装或插装于所述第一基板上；
    将所述刚性连接件贴装或插装于所述第二基板上。
PCT/CN2020/079642 2020-03-17 2020-03-17 电路板结构、电子产品和电路板结构的制备方法 WO2021184189A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2020/079642 WO2021184189A1 (zh) 2020-03-17 2020-03-17 电路板结构、电子产品和电路板结构的制备方法
CN202080005225.XA CN112753288A (zh) 2020-03-17 2020-03-17 电路板结构、电子产品和电路板结构的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/079642 WO2021184189A1 (zh) 2020-03-17 2020-03-17 电路板结构、电子产品和电路板结构的制备方法

Publications (1)

Publication Number Publication Date
WO2021184189A1 true WO2021184189A1 (zh) 2021-09-23

Family

ID=75651293

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/079642 WO2021184189A1 (zh) 2020-03-17 2020-03-17 电路板结构、电子产品和电路板结构的制备方法

Country Status (2)

Country Link
CN (1) CN112753288A (zh)
WO (1) WO2021184189A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114447454A (zh) * 2022-01-26 2022-05-06 东莞新能德科技有限公司 电池保护板与电池

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113677093B (zh) * 2021-08-11 2022-07-22 维沃移动通信有限公司 电路板组件、电路板堆叠结构及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120002379A1 (en) * 2010-06-30 2012-01-05 Fih (Hong Kong) Limited Circuit board structure
CN106982540A (zh) * 2017-05-22 2017-07-25 上海热像机电科技股份有限公司 一种散热装置
CN206563864U (zh) * 2017-01-24 2017-10-17 广州美电恩智电子科技有限公司 一种具有散热结构的摄像机
CN107529303A (zh) * 2016-06-20 2017-12-29 台达电子工业股份有限公司 电子装置
CN209435538U (zh) * 2018-12-27 2019-09-24 苏州联芯威电子有限公司 电机电路板散热结构
CN210093807U (zh) * 2019-03-12 2020-02-18 重庆金山医疗机器人有限公司 一种叠层电路板的温控***及大电流无刷伺服电机驱动器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120002379A1 (en) * 2010-06-30 2012-01-05 Fih (Hong Kong) Limited Circuit board structure
CN107529303A (zh) * 2016-06-20 2017-12-29 台达电子工业股份有限公司 电子装置
CN206563864U (zh) * 2017-01-24 2017-10-17 广州美电恩智电子科技有限公司 一种具有散热结构的摄像机
CN106982540A (zh) * 2017-05-22 2017-07-25 上海热像机电科技股份有限公司 一种散热装置
CN209435538U (zh) * 2018-12-27 2019-09-24 苏州联芯威电子有限公司 电机电路板散热结构
CN210093807U (zh) * 2019-03-12 2020-02-18 重庆金山医疗机器人有限公司 一种叠层电路板的温控***及大电流无刷伺服电机驱动器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114447454A (zh) * 2022-01-26 2022-05-06 东莞新能德科技有限公司 电池保护板与电池

Also Published As

Publication number Publication date
CN112753288A (zh) 2021-05-04

Similar Documents

Publication Publication Date Title
TW452999B (en) Electrical connector assembly and method of making the same
WO2021184190A1 (zh) 电路板结构、电子产品、电路板结构的制备方法和维修方法
WO2021184189A1 (zh) 电路板结构、电子产品和电路板结构的制备方法
US8827730B2 (en) Socket and semiconductor device provided with socket
JPH0645019A (ja) フラットケーブルおよび印刷回路板のディンプル接続
JP2002151648A (ja) 半導体モジュール
US6540525B1 (en) High I/O stacked modules for integrated circuits
US9867285B2 (en) Printed circuit board components
JP2000165007A (ja) プリント配線板、電子部品及び電子部品の実装方法
JP2001189412A (ja) 半導体装置および半導体実装方法
EP4236642A1 (en) Heat dissipation apparatus and electronic device
WO2021179796A1 (zh) 一种线缆组件、信号传输结构和电子设备
JP2000031617A (ja) メモリモジュールおよびその製造方法
US20110007482A1 (en) Printed circuit board unit and electronic device
JP2003324183A (ja) 半導体装置
JP2812014B2 (ja) 半導体装置
CN211928245U (zh) 一种封装组件和光模块
JPH08195566A (ja) 多層型電子基板とその製造方法、及び演算処理用ボード
JPH04290258A (ja) マルチチップモジュール
JP4329251B2 (ja) 積層型半導体装置の製造方法
US8837163B2 (en) Integrated flex tail circuit packaging
CN215991364U (zh) 一种多个电路板的组合结构
WO2021097725A1 (zh) 封装结构、封装组件和电子产品
CN214542186U (zh) 封装芯片和移动终端
CN117393539B (zh) 一种低剖天线柔性互连结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20926002

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20926002

Country of ref document: EP

Kind code of ref document: A1