WO2021169780A1 - 一种选择性浸出含金物料中金的金浸剂及制备方法和用途 - Google Patents
一种选择性浸出含金物料中金的金浸剂及制备方法和用途 Download PDFInfo
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- WO2021169780A1 WO2021169780A1 PCT/CN2021/075749 CN2021075749W WO2021169780A1 WO 2021169780 A1 WO2021169780 A1 WO 2021169780A1 CN 2021075749 W CN2021075749 W CN 2021075749W WO 2021169780 A1 WO2021169780 A1 WO 2021169780A1
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- Prior art keywords
- gold
- leaching
- printed circuit
- agent
- circuit board
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- 239000010931 gold Substances 0.000 title claims abstract description 355
- 238000002386 leaching Methods 0.000 title claims abstract description 336
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 327
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 320
- 239000000463 material Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 110
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 20
- 150000002367 halogens Chemical class 0.000 claims abstract description 19
- 238000011084 recovery Methods 0.000 claims abstract description 15
- 239000007864 aqueous solution Substances 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 239000005416 organic matter Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000002440 industrial waste Substances 0.000 claims description 4
- 239000010793 electronic waste Substances 0.000 claims description 3
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract description 12
- 239000002994 raw material Substances 0.000 abstract description 2
- 231100000053 low toxicity Toxicity 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 59
- 229910052751 metal Inorganic materials 0.000 description 59
- 150000002739 metals Chemical class 0.000 description 56
- 239000000243 solution Substances 0.000 description 44
- -1 halogen ion Chemical class 0.000 description 39
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 36
- 239000000843 powder Substances 0.000 description 28
- YRIZYWQGELRKNT-UHFFFAOYSA-N 1,3,5-trichloro-1,3,5-triazinane-2,4,6-trione Chemical compound ClN1C(=O)N(Cl)C(=O)N(Cl)C1=O YRIZYWQGELRKNT-UHFFFAOYSA-N 0.000 description 16
- 229950009390 symclosene Drugs 0.000 description 16
- OMJKWVKPIOIQDM-UHFFFAOYSA-N 3-bromo-1-chloroimidazolidine-2,4-dione Chemical compound ClN1CC(=O)N(Br)C1=O OMJKWVKPIOIQDM-UHFFFAOYSA-N 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 11
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 10
- 238000007654 immersion Methods 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 7
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 238000000967 suction filtration Methods 0.000 description 7
- HRADVHZVMOMEPU-UHFFFAOYSA-N 3-iodopyrrolidine-2,5-dione Chemical compound IC1CC(=O)NC1=O HRADVHZVMOMEPU-UHFFFAOYSA-N 0.000 description 6
- 229910052791 calcium Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000004064 recycling Methods 0.000 description 3
- OIISKEGFGKEKOT-UHFFFAOYSA-N C1(CCC(N1)=O)=O.[I] Chemical compound C1(CCC(N1)=O)=O.[I] OIISKEGFGKEKOT-UHFFFAOYSA-N 0.000 description 2
- 238000009854 hydrometallurgy Methods 0.000 description 2
- 244000005700 microbiome Species 0.000 description 2
- 238000009853 pyrometallurgy Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005695 dehalogenation reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003895 groundwater pollution Methods 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000003903 river water pollution Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/16—Extraction of metal compounds from ores or concentrates by wet processes by leaching in organic solutions
- C22B3/1666—Leaching with heterocyclic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Definitions
- the invention relates to a gold leaching agent and a preparation method and application, in particular to a gold leaching agent for selectively leaching gold from a gold-containing material, and a preparation method and application.
- gold As a metal with high chemical stability, high catalytic activity, good ductility, and high thermal stability, gold has always been used in important industries and scientific technologies such as currency reserves, jewelry, communication technology, chemical technology, and medical technology.
- Garbage, industrial waste, etc. the high gold content of these gold-bearing materials has brought high potential recycling value, and the huge business opportunities hidden in it have also attracted the "gold rush".
- waste printed circuit boards in electronic waste and anode mud in industrial waste have the characteristics of large output, high gold content, and high recycling value. If they are discarded at will, they will pollute the environment and cannot use valuable resources such as gold. Therefore, it is very important to develop a safe, efficient and environmentally friendly gold extraction technology.
- Metallurgical technology mainly includes pyrometallurgy, hydrometallurgy, biometallurgy, etc.
- pyrometallurgy is a technology that decomposes gold-containing materials at high temperatures. It can separate metals from other materials and recover part of the heat energy, but it will produce two Toxic and harmful by-products such as oxin, and if you want to separate gold from various metals in the later stage, it needs to be combined with hydrometallurgical technology.
- Biometallurgy mainly uses microorganisms to recover gold from gold-containing materials, including bioleaching, biosorption and other technologies. Biometallurgy has low cost, but its recovery rate of gold is low, and it takes a long time to find suitable microorganisms. It is not possible at this stage. Wide range of applications. Hydrometallurgy is more accurate, controllable, results more predictable, and better for metal recovery. It is currently the most commonly used and most negatively promising technology.
- the object of the invention is to provide a gold leaching agent for selectively leaching gold from a gold-containing material.
- Another object of the present invention is to provide a method for preparing the gold leaching agent for selectively leaching gold from a gold-containing material.
- Another object of the present invention is to provide the use of the gold leaching agent for selectively leaching gold from gold-containing materials.
- the present invention provides a gold leaching agent for selectively leaching gold from a gold-containing material, the composition of which is a halogen-containing organic substance that is soluble in water.
- the above-mentioned water-soluble gold leaching agent has the ability to form a halogen ion with strong coordination ability with gold in an aqueous solution, which can reduce the oxidation-reduction potential of gold after being combined with the gold surface, and make the gold easier to be oxidized;
- the water-soluble gold leaching agent can also form strong oxidizing hypohalite ions, halide ions, and halogen free radicals in the aqueous solution, which can promote the continuous and rapid leaching of gold;
- the above-mentioned water-soluble gold leaching agent The organic matter formed after the dehalogenation can be combined with the gold-containing complex formed after the gold is leached to stabilize the gold-containing complex.
- the water-soluble halogen-containing organic matter includes one or a mixture of one or more of easily soluble water-soluble halogen-containing organic matter, water-soluble halogen-containing organic matter, and slightly water-soluble halogen-containing organic matter.
- halogen is a mixture of one or more of F, Cl, Br, and I.
- the water-soluble halogen-containing organic substance is added to the aqueous solution and stirred for dissolution.
- the concentration of the halogen-containing organic matter in the aqueous solution is 1-600 mmol/L, preferably 10-300 mmol/L, and more preferably 25, 300 mmol/L.
- the use of the gold leaching agent for selectively leaching gold from the gold-containing material in the selective leaching and recovery of gold from the gold-containing material in the selective leaching and recovery of gold from the gold-containing material.
- the temperature of the leaching reaction is 5-100°C, preferably 10-50°C, and more preferably 25°C.
- the gold-containing material is gold ore, gold-containing industrial waste, and gold-containing electronic waste.
- the solid-liquid ratio during leaching is 1:3-1:500, preferably 1:300.
- the non-cyanide gold leaching agent of the present invention can replace cyanide to become an efficient and inexpensive gold leaching agent, is non-toxic, does not produce secondary pollution, is environmentally friendly and efficient, and will make gold leaching a green and environmentally friendly process.
- the preparation method of the invention is simple. Its raw materials have a wide range of sources, and have low requirements for preparation equipment, and can be promoted in a wide range of industries.
- the gold leaching agent of the present invention has mild and rapid gold leaching conditions, can leaching gold with high selectivity, has a better gold leaching rate than most traditional leaching agents (including cyanide leaching agents), and can be used at a lower concentration and liquid-to-solid ratio.
- Figure 1 is a graph showing the relationship between the leaching rate of gold and other major metals in the gold finger of the printed circuit board and the time of the bromochlorohydantoin gold leaching agent in Example 1;
- Example 2 is a graph showing the relationship between the leaching rate of gold and other major metals in the gold fingers of the printed circuit board and the time of the gold leaching agent of trichloroisocyanuric acid in Example 2;
- Example 3 is a graph showing the relationship between the leaching rate of gold and other main metals in the gold finger of the printed circuit board and the time of the iodine succinimide immersion gold agent in Example 3.
- Fig. 4 is a graph showing the relationship between the leaching rate of gold and other main metals in the gold fingers of the printed circuit board and the time of the bromochlorohydantoin gold leaching agent at low temperature in Example 4.
- Fig. 5 is a graph showing the relationship between the leaching rate of gold and other main metals in the gold finger of the printed circuit board and the time of the bromochlorohydantoin gold leaching agent at a low solid-to-liquid ratio in Example 5.
- Fig. 6 is a graph showing the relationship between the leaching rate of gold and other major metals in the gold fingers of the printed circuit board and the time of the gold leaching agent of trichloroisocyanuric acid at high temperature in Example 6.
- Fig. 7 is a graph showing the relationship between the leaching rate of gold and other main metals in the gold finger of the printed circuit board and the time of the N-fluorobisbenzenesulfonamide gold leaching agent in Example 7.
- bromochlorohydantoin into the aqueous solution and stir to dissolve to form a gold leaching solution with a bromochlorohydantoin concentration of 300mmol/Lol/L.
- the bromochlorohydantoin gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:100 to form an leaching system, and the leaching reaction is carried out at a rate of 200 rpm at 25°C.
- ICP-OES was used to detect the gold and other major metals in the bromochlorohydantoin leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. content.
- the leaching rate is the ratio of the gold content in the clean and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature was 25°C, and the solid-liquid ratio was 1:100. The results are shown in Figure 1.
- Figure 1 shows the curve of the leaching rate of Au and Ni, Cu, Fe, and Ca in gold fingers of printed circuit boards with bromochlorohydantoin gold leaching agent over time.
- the leaching rate of Au is also better than most traditional gold leaching agents, and under the same leaching practice, The leaching rate of Ni is 60.95%, the leaching rate of Fe is only 1.41%, the leaching rate of Ca is only 0.64%, and the leaching rate of Cu is only 18.13%. It can be seen that the leaching of Au by bromochlorohydantoin is very fast, and the leaching selectivity for Au by bromochlorohydantoin is extremely high, which can effectively separate from other metals in the gold fingers of the printed circuit board.
- Example 2 Trichloroisocyanuric acid gold leaching agent for leaching and recovery of gold in printed circuit board gold fingers
- the above trichloroisocyanuric acid gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:300 to form an leaching system, and the leaching reaction is carried out at a rate of 200 rpm at 25°C.
- ICP-OES was used to detect gold and other major metals in the trichloroisocyanuric acid leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. Content.
- the leaching rate is the ratio of the gold content in the environment-friendly and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature is 25°C, and the solid-liquid ratio is 1:300.
- the results are shown in Figure 2.
- Figure 2 shows the curve of the leaching rate of Au, Fe, Ca, Mg, Al, and Ag in gold fingers of printed circuit boards with trichloroisocyanuric acid leaching agent over time.
- the leaching rate of Au in the gold fingers of the printed circuit board reaches 76.55%, which is better than most traditional gold leaching agents.
- the leaching rate of Cu is 48.98%
- the leaching rate of Mg is only 7.11%
- the leaching rate of Ca is only 5.38%
- the leaching rate of Al is only 5.72%
- the leaching rate of Fe is only 6.14%.
- the leaching rate is only 5.48%.
- the trichloroisocyanuric acid gold leaching agent has a high selective leaching advantage for Au, which can separate gold from other metals in the gold finger of the printed circuit board.
- An environmentally-friendly high-efficiency non-cyanide gold leaching agent includes iodosuccinimide.
- iodosuccinimide to the aqueous solution and stir to dissolve to form a gold leaching solution with a concentration of iodosuccinimide of 300 mmol/Lol/L.
- the above iodosuccinimide gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:300 to form an leaching system, and the leaching reaction is carried out at a rate of 200 rpm at 25°C.
- ICP-OES was used to detect gold and other gold in the iodosuccinimide leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. The content of the main metal.
- the leaching rate is the ratio of the gold content in the environment-friendly and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature was 25°C, and the solid-liquid ratio was 1:300. The results are shown in Figure 3.
- Figure 3 shows the curve of the leaching rate of Au and Ni, Cu, Fe, and Ca in gold fingers of printed circuit board with iodosuccinimide gold leaching agent over time.
- the leaching rate of metals is lower than the leaching rate of Au.
- the leaching rate of Cu is 14.49%
- the leaching rate of Fe is only 1.95%
- the leaching rate of Ca is only 1.35%
- the leaching rate of Ni is only 30.58%.
- the iodine succinimide gold leaching agent is very fast to leaching of Au, and has a high selectivity to Au, and can effectively separate from other metals in the gold fingers of the printed circuit board.
- Example 4 Leaching and recovery of gold in printed circuit board gold fingers by low-concentration bromochlorohydantoin gold leaching agent at low temperature
- bromochlorohydantoin into the aqueous solution and stir to dissolve to form a gold leaching solution with bromochlorohydantoin concentration of 1mmol/Lol/L.
- the bromochlorohydantoin gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:500 to form an leaching system, and the leaching reaction is carried out at 5° C. and at a rate of 200 rpm.
- ICP-OES was used to detect the gold and other major metals in the bromochlorohydantoin leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. content.
- the leaching rate is the ratio of the gold content in the clean and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature is 5°C, and the solid-liquid ratio is 1:500. The results are shown in Figure 4.
- Figure 4 shows the curve of the leaching rate of Au, Ni, Cu, Fe, and Ca in gold fingers of printed circuit boards with low concentration of bromochlorohydantoin gold leaching agent at low temperature.
- bromochlorohydantoin into the aqueous solution and stir to dissolve to form a gold leaching solution with bromochlorohydantoin concentration of 600mmol/Lol/L.
- the bromochlorohydantoin gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:3 to form an leaching system, and the leaching reaction is carried out at 5° C. and at a rate of 200 rpm.
- ICP-OES was used to detect the gold and other major metals in the bromochlorohydantoin leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. content.
- the leaching rate is the ratio of the gold content in the clean and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature was 5°C, and the solid-liquid ratio was 1:3. The results are shown in Figure 5.
- Figure 5 shows the curve of the leaching rate of Au, Ni, Cu, Fe, and Ca in printed circuit board gold fingers with bromochlorohydantoin gold leaching agent under low liquid-to-solid ratio and low temperature.
- the bromochlorohydantoin gold leaching agent can extract a certain amount of Au under the reaction conditions of low temperature and low liquid-to-solid ratio, and the gold leaching agent has a good selectivity to Au.
- Example 6 The leaching and recovery of gold in printed circuit board gold fingers by trichloroisocyanuric acid gold leaching agent under high temperature conditions
- the above-mentioned trichloroisocyanuric acid gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:300 to form an leaching system, and the leaching reaction is carried out at 100° C. and at a rate of 200 rpm.
- ICP-OES was used to detect gold and other major metals in the trichloroisocyanuric acid leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. Content.
- the leaching rate is the ratio of the gold content in the environment-friendly and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature is 100°C, and the solid-liquid ratio is 1:300. The results are shown in Figure 6.
- Figure 6 shows the curve of the leaching rate of Au, Fe, Ni, Ca, and Cu in gold fingers of printed circuit boards under high temperature conditions with the gold leaching agent of trichloroisocyanuric acid.
- the leaching rate of Au in the gold fingers of the printed circuit board reaches 64.56%, which is better than most traditional gold leaching agents.
- the leaching rate of Cu is 49.17%
- the leaching rate of Ni is only 39.59%
- the leaching rate of Ca is only 16.34%
- the leaching rate of Fe is only 16.23%.
- the trichloroisocyanuric acid gold leaching agent can leached a large amount of Au in a short time under high temperature reaction conditions, and the gold leaching agent has a high selective leaching advantage for Au.
- An environmentally-friendly high-efficiency non-cyanide gold leaching agent includes N-fluorobisbenzenesulfonamide.
- N-fluorobisbenzenesulfonamide is added to the aqueous solution and stirred to dissolve to form a gold leaching solution with a concentration of N-fluorobisbenzenesulfonamide of 10 mmol/L.
- N-fluorobisbenzenesulfonamide gold leaching agent is mixed with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1:100 to form an leaching system, and the leaching reaction is carried out at a rate of 200 rpm at 25°C.
- ICP-OES was used to detect gold and gold in the N-fluorobisbenzenesulfonamide leaching solution of printed circuit board gold fingers and the aqua regia leaching solution of printed circuit board gold fingers. The content of other major metals.
- the leaching rate is the ratio of the gold content in the environment-friendly and high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution.
- the leaching rate of other metals is the same as above.
- the leaching reaction temperature was 25°C, and the solid-liquid ratio was 1:100. The results are shown in Figure 7.
- Figure 7 is the curve of the leaching rate of Au and Ni, Cu, Fe, and Ca in gold fingers of printed circuit boards with N-fluorobisbenzenesulfonamide gold leaching agent over time.
- the N-fluorobisbenzenesulfonamide gold leaching agent can extract a certain amount of Au and has a high selectivity to Au.
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Abstract
Description
Claims (9)
- 一种选择性浸出含金物料中金的金浸剂,其特征在于:其成分为可溶于水的含卤素有机物。
- 根据权利要求1所述的选择性浸出含金物料中金的金浸剂,其特征在于:所述可溶于水的含卤素有机物包括易溶于水含卤素有机物、可溶于水含卤素有机物、微溶于水含卤素有机物中的一种或多种的混合物。
- 根据权利要求1所述的选择性浸出含金物料中金的金浸剂,其特征在于:所述卤素为F、Cl、Br、I中的一种或多种的混合物。
- 权利要求1所述的选择性浸出含金物料中金的金浸剂的制备方法,其特征在于:将可溶于水的含卤素有机物加入到水溶液中,搅拌溶解。
- 根据权利要求4所述的选择性浸出含金物料中金的金浸剂的制备方法,其特征在于:所述水溶液中含卤素有机物的浓度为1-600mmol/L。
- 权利要求1所述的选择性浸出含金物料中金的金浸剂在对含金物料中的金进行选择性浸出、回收中的用途。
- 根据权利要求6所述的用途,其特征在于:所述浸出反应的温度为5-100℃。
- 根据权利要求6所述的用途,其特征在于:所述含金物料为金矿石、含金工业废料、含金电子垃圾。
- 根据权利要求6所述的用途,其特征在于:浸出时的固液比为1:3-1:500。
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CN111100998A (zh) * | 2020-02-25 | 2020-05-05 | 东南大学 | 一种选择性浸出含金物料中金的金浸剂及制备方法和用途 |
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CN110819818A (zh) * | 2019-11-12 | 2020-02-21 | 长春黄金研究院有限公司 | 一种难处理金矿石的机械化学预处理浸出提金方法 |
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CN103114202A (zh) * | 2013-03-05 | 2013-05-22 | 吉林大学 | 环境友好型难浸金银矿多金属综合回收工艺 |
CN104388674A (zh) * | 2014-10-29 | 2015-03-04 | 昆明理工大学 | 一种从氧化铅矿中回收铅的浸出方法及其浸出剂 |
US20180187286A1 (en) * | 2017-01-05 | 2018-07-05 | Ethox Chemicals, Llc | Process for Recovering Precious Metals from Clay-Containing Ores |
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CN111100998A (zh) | 2020-05-05 |
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